Power module with low inductance structure and packaging structure

By adopting a copper-clad ceramic substrate and busbar terminal design in the power module and using induced current to reduce parasitic inductance, the problem of insufficient space utilization between the busbar terminals and the heat dissipation substrate is solved, the miniaturization and high integration of the power module are achieved, and the heat dissipation efficiency and overall performance are improved.

CN120690756APending Publication Date: 2025-09-23SHANGHAI HEIMCIC SEMICON CO LTD
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Patent Information

Application Number
CN202510809189.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-06-17
Publication Date
2025-09-23

AI Technical Summary

Technical Problem

Existing power modules ignore the use of space between the busbar terminals and the heat sink substrate in their designs, resulting in large size, low integration, limited heat dissipation and inductance reduction effects, and easy damage to external capacitors at high power or high current.

Method used

A copper-clad ceramic substrate and busbar terminal design is adopted. One end of the busbar terminal is connected to the copper-clad ceramic substrate, and the other end extends upward to form a connection portion. It is spaced a specified distance from the second heat dissipation section of the heat dissipation substrate to generate opposite induced currents and reduce parasitic inductance. At the same time, the external capacitor is connected through laser to shorten the length of the busbar terminal.

Benefits of technology

The miniaturization and high integration of power modules are achieved, the heat dissipation efficiency is improved, the possibility of damage at high power or high current is reduced, and the overall performance is improved.

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Abstract

The invention provides a power module with a low-inductance structure and a packaging structure. The power module comprises a heat dissipation substrate and a power module main body, the heat dissipation substrate is divided into a first heat dissipation section and a second heat dissipation section from left to right; the power module body comprises a copper-clad ceramic substrate and at least two busbar terminals, the copper-clad ceramic substrate is arranged on the first heat dissipation section, one end of each busbar terminal in the at least two busbar terminals is connected to the copper-clad ceramic substrate, and the other end of each busbar terminal extends towards the upper portion of the second heat dissipation section and forms a connecting part used for being connected with an external capacitor. A specified distance is arranged between the connecting part and the second heat dissipation section. According to the power module, the problems that an existing power module neglects space utilization between the busbar terminal and the heat dissipation substrate, the size of the power module is large, the integration degree is low, the heat dissipation and inductance reduction effects are limited, and an external capacitor is prone to being damaged in the case of large power or large current can be solved.
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Citation Information

Patent Citations

  • Optimized structure of positive and negative busbars of power module

    CN115513163A