Light-emitting substrate, positioning device, dispensing equipment and display device

Abstract

The embodiment of the invention provides a light-emitting substrate, a positioning device, dispensing equipment and a display device. The light-emitting substrate comprises a light-emitting area and a frame area, a first metal layer, a first passivation layer, a first organic layer, a second metal layer and a second organic layer are sequentially arranged on one side of the substrate in a laminated mode, the first metal layer comprises a first metal wire located in the light-emitting area, and the second metal layer comprises a second metal wire located in the light-emitting area. The first passivation layer, the first organic layer and the second organic layer are all located in the light-emitting area and the frame area, the electronic element is coupled with the second metal wire, the second metal wire is coupled with the first metal wire, and the positioning pattern is located in the frame area and located in the first metal layer or the second metal layer. According to the scheme, the number of the stack film layers above the positioning pattern is reduced, the light interference phenomenon is improved, and recognition of the positioning pattern is facilitated.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a light-emitting substrate, a positioning device, a dispensing device, and a display device. Background Art

[0002] Light-emitting diodes (LEDs) can be submillimeter light-emitting diodes (Mini LEDs) or micro LEDs (MicroLEDs). LEDs offer advantages such as energy efficiency, lightweight design, wide color gamut, ultra-high contrast, and fine dynamic range. Therefore, light-emitting substrates equipped with LEDs are increasingly used in the display field.

[0003] In the dispensing process of LED light-emitting substrates, there is a problem that the dispensing equipment cannot accurately obtain the coordinate system of the light-emitting substrate, causing the equipment to shut down and seriously affecting the dispensing process. Summary of the Invention

[0004] The embodiments of the present disclosure provide a light-emitting substrate, a positioning device, a dispensing device, and a display device to solve or alleviate one or more technical problems in the prior art.

[0005] As a first aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a light-emitting substrate, including a light-emitting area and a frame area outside the light-emitting area, the light-emitting substrate including:

[0006] substrate;

[0007] A first metal layer, located on one side of the substrate, including a first metal trace located in the light-emitting area;

[0008] a first passivation layer, located in the light-emitting area and the frame area, and located on a side of the first metal layer facing away from the substrate;

[0009] a first organic layer, located in the light-emitting region and the frame region, and located on a side of the first passivation layer facing away from the substrate;

[0010] A second metal layer is located in the light emitting region and on a side of the first organic layer facing away from the substrate, the second metal layer includes a second metal trace coupled to the first metal trace;

[0011] a second organic layer, located in the light-emitting region and the frame region, and located on a side of the second metal layer facing away from the substrate;

[0012] An electronic component is located in the light emitting area, and the electronic component is coupled to the second metal trace;

[0013] Wherein, the light-emitting substrate further includes a positioning pattern, and the positioning pattern is located in the border area;

[0014] The positioning pattern is located in the first metal layer; or, the positioning pattern is located in the second metal layer; or, the positioning pattern is located between the second organic layer and the first organic layer; or, the positioning pattern is located on a side of the second organic layer facing away from the substrate.

[0015] In some embodiments, the light-emitting substrate further includes a light-transmitting coating located in the border area, the light-transmitting coating is located on the side of the second organic layer facing away from the substrate, the positioning pattern is located between the substrate and the light-transmitting coating, the orthographic projection of the positioning pattern on the substrate is located within the orthographic projection of the light-transmitting coating on the substrate, and the refractive index range of the light-transmitting coating is 3.5 to 4.5.

[0016] In some embodiments, the light-transmitting coating includes a transparent organic material and nanopowders distributed in the organic material, wherein the nanopowders include at least one of titanium dioxide and chromium dioxide.

[0017] In some embodiments, the light-transmitting coating includes a transparent organic material and nanopowders distributed in the organic material, and the volume ratio of the nanopowders in the light-transmitting coating is 0.2% to 0.4%.

[0018] In some embodiments, the positioning pattern is located in the first metal layer;

[0019] The light-emitting substrate also includes a second passivation layer located in the light-emitting area and the border area, and the second passivation layer is located between the first organic layer and the second metal layer; and / or, the light-emitting substrate also includes a third passivation layer located in the light-emitting area and the border area, and the third passivation layer is located between the second metal layer and the second organic layer.

[0020] In some embodiments, the positioning pattern is located in the second metal layer;

[0021] The light-emitting substrate also includes a second passivation layer located in the light-emitting area and the border area, and the second passivation layer is located between the first organic layer and the second metal layer; and / or, the light-emitting substrate also includes a third passivation layer located in the light-emitting area and the border area, and the third passivation layer is located between the second metal layer and the second organic layer.

[0022] In some embodiments, the light-emitting substrate further includes a polarizing film located on a side of the light-transmitting coating layer facing away from the substrate and located in the frame area.

[0023] In some embodiments, the positioning pattern is located in the second metal layer;

[0024] The light-emitting substrate also includes a second passivation layer located in the light-emitting area and the border area, and the second passivation layer is located between the first organic layer and the second metal layer; and / or, the light-emitting substrate also includes a third passivation layer located in the light-emitting area and the border area, and the third passivation layer is located between the second metal layer and the second organic layer.

[0025] In some embodiments, the material of the positioning pattern includes a black organic material;

[0026] The alignment pattern is located between the second organic layer and the first organic layer; or, the alignment pattern is located on a side of the second organic layer facing away from the substrate.

[0027] In some embodiments, the shape of the positioning pattern includes at least one of a cross, a polygon, a circle, and a star.

[0028] As a second aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a positioning device, including:

[0029] An image acquisition module, configured to acquire an image of a positioning pattern in the light-emitting substrate of any embodiment of the present disclosure;

[0030] a positioning module, configured to compare the captured image of the positioning pattern with a pre-stored target image, and to position the light-emitting substrate according to the captured positioning pattern when the captured image of the positioning pattern matches the pre-stored target image;

[0031] Wherein, a polarizing film is provided on the lens of the image acquisition device.

[0032] As a third aspect of the embodiments of the present disclosure, the embodiments of the present disclosure provide a dispensing device, including the positioning device in the embodiments of the present disclosure.

[0033] As a fourth aspect of the embodiments of the present disclosure, the embodiments of the present disclosure provide a display device, including the light-emitting substrate in the embodiments of the present disclosure.

[0034] Compared with the related technologies, the technical solution of the embodiment of the present disclosure reduces the number of stacked film layers above the positioning pattern, reduces the refraction of light in the stacked film layers, and improves the interference phenomenon of light. Therefore, when the image acquisition module captures the image of the positioning pattern, the rainbow pattern in the positioning pattern image can be reduced, and the accuracy of positioning pattern recognition can be improved. Therefore, the light-emitting substrate can be positioned more accurately, the coordinate system of the light-emitting substrate can be obtained, the progress of the dispensing process can be improved, equipment downtime can be avoided, and product yield can be improved.

[0035] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present disclosure will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar components or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments according to the present disclosure and should not be regarded as limiting the scope of the present disclosure.

[0037] Figure 1A is a cross-sectional schematic diagram of a light-emitting substrate;

[0038] Figure 1B for Figure 1A Schematic diagram of the light used to locate the pattern position;

[0039] Figure 2 The image captured by the camera;

[0040] Figure 3 Schematic diagram of a plan view of a light-emitting substrate according to an embodiment of the present disclosure;

[0041] Figure 4 for Figure 3 The light emitting substrate is shown as a schematic AA cross-sectional view in one embodiment;

[0042] Figure 5 for Figure 4 Schematic diagram of the light used to locate the pattern position;

[0043] Figure 6 is a schematic cross-sectional view of a border area of ​​a light-emitting substrate disclosed herein in another embodiment;

[0044] Figure 7 for Figure 6 Schematic diagram of the light used to locate the pattern position;

[0045] Figure 8 Schematic diagram of light beam passing through the light-transmitting coating;

[0046] Figure 9 is a schematic cross-sectional view of a border area of ​​a light-emitting substrate disclosed herein in another embodiment;

[0047] Figure 10 for Figure 9 Schematic diagram of the light used to locate the pattern position;

[0048] Figure 11 is a schematic cross-sectional view of a border area of ​​a light-emitting substrate disclosed herein in another embodiment;

[0049] Figure 12 FIG. 1 is a schematic diagram of a positioning pattern in a light-emitting substrate according to an embodiment of the present disclosure.

[0050] Description of reference numerals:

[0051] 11. Substrate; 12. Buffer layer; 13. First metal layer; 131. First metal trace; 132. Third metal trace; 14. First passivation layer; 15. First organic layer; 161. Second passivation layer; 17. Second metal layer; 171. Second metal trace; 162. Third passivation layer; 18. Second organic layer; 19. Oxidation protection layer; 20. Electronic component; 30. Positioning pattern; 41. Light-transmitting coating; 42. Polarizing film. DETAILED DESCRIPTION

[0052] In the following, only certain exemplary embodiments are briefly described. As will be appreciated by those skilled in the art, the described embodiments may be modified in various ways without departing from the spirit or scope of the present disclosure, and different embodiments may be combined in any manner without conflict. Therefore, the drawings and description are to be regarded as illustrative in nature and not restrictive.

[0053] In an LED light-emitting substrate, multiple electronic components 20 are disposed on the substrate. The electronic components 20 may be, for example, LEDs or microcontroller chips. To protect the electronic components 20 from corrosion by water and oxygen, a dispensing process may be performed on the electronic components 20 using a dispensing device to form a protective body covering the electronic components 20.

[0054] In the related art, the positioning of the light-emitting substrate mainly relies on the positioning algorithm in the image acquisition module (such as a camera) in the dispensing equipment. The positioning pattern is identified by scanning and acquiring an image of the positioning pattern. The external features of the positioning pattern are obtained through the image of the positioning pattern. For example, in the dispensing process, the camera of the dispensing equipment acquires an image of the positioning pattern on the light-emitting substrate. When the acquired image of the positioning pattern matches the pre-stored target image, the positioning pattern is successfully recognized. The dispensing equipment can then position the light-emitting substrate according to the identified positioning pattern, and then acquire the coordinate system of the light-emitting substrate, thereby dispensing the electronic component 20.

[0055] Research has found that the images of the positioning patterns captured by the camera have serious rainbow patterns, which increases the difficulty of the camera to recognize the positioning patterns. Even if the positioning algorithm is continuously updated, it is still impossible to accurately recognize the positioning pattern, resulting in a low positioning pattern recognition rate, causing the equipment to shut down multiple times and reducing product yield. In addition, the algorithm must be updated every time the product is replaced, wasting manpower and material resources.

[0056] Figure 1A is a cross-sectional schematic diagram of a light-emitting substrate, Figure 1B for Figure 1A Schematic diagram of the light used to locate the pattern position; Figure 2 The image captured by the camera. The light-emitting substrate may include a light-emitting area and a frame area outside the light-emitting area, and the positioning pattern 30 may be located in the frame area. Figure 1A As shown, in the border area, the light-emitting substrate may include a base 11, a buffer layer 12, a first metal layer 13, a first passivation layer 14, a first organic layer 15, a second passivation layer 161, a third passivation layer 162, and a second organic layer 18 stacked in sequence. The positioning pattern 30 is usually located in the first metal layer 13. The inventors have found that, as Figure 1B As shown, during the process of camera capturing images, when the incident light enters the stacked film layer above the positioning pattern 30 and is reflected back, an optical path difference will be generated when the light passes through the film layers with different refractive indices, for example, Figure 1B In the image, there is an optical path difference between light S1 and light S3, and light S1 and light S3 interfere with each other, forming interference fringes; there is an optical path difference between light S2 and light S4, and light S2 and light S4 interfere with each other, forming interference fringes. Interference fringes make the image captured by the camera have rainbow patterns, such as Figure 2 The rainbow pattern increases the difficulty of identifying the positioning pattern 30 , and even if the positioning algorithm is continuously updated, the accuracy of identifying the positioning pattern 30 cannot be improved.

[0057] In order to improve the accuracy of identifying the positioning pattern 30 , the present disclosure provides a light-emitting substrate.

[0058] Figure 3 Schematic diagram of a light-emitting substrate according to an embodiment of the present disclosure. Figure 4 for Figure 3 The AA cross-sectional view of the light emitting substrate in one embodiment is shown in FIG. Figure 3 and Figure 4 As shown, the light-emitting substrate may include a light-emitting area and a frame area outside the light-emitting area. The light-emitting substrate may include a base 11, a first metal layer 13, a first passivation layer 14, a first organic layer 15, a second metal layer 17, a second organic layer 18, and an electronic component 20. The electronic component 20 may include at least one of an LED and a microcontroller chip.

[0059] The first metal layer 13 is located on one side of the substrate 11 and includes a first metal trace 131 located in the light emitting area. For example, the first metal layer 13 may further include a third metal trace 132 located in the frame area. Figure 3 Only a portion of the third metal traces 132 is shown. It should be noted that the metal traces arranged in the light-emitting area of ​​the first metal layer 13 can all be referred to as first metal traces 131. Each first metal trace 131 can transmit a different signal, and the signal transmitted by the first metal trace 131 is not specifically limited here.

[0060] The first passivation layer 14 is located on the side of the first metal layer 13 away from the substrate 11, and the first passivation layer 14 is located in the light-emitting area and the frame area. The first organic layer 15 is located on the side of the first passivation layer 14 away from the substrate 11, and the first organic layer 15 is located in the light-emitting area and the frame area. The second metal layer 17 is located on the side of the first organic layer 15 away from the substrate 11, and the second metal layer 17 includes a second metal trace 171 located in the light-emitting area. The second metal trace 171 can be coupled to the first metal trace 131. It should be noted that the second metal trace 171 can be coupled to the first metal trace 131, which can be understood as at least one second metal trace 171 coupled to at least one first metal trace 131, and whether the second metal trace is connected to the first metal trace can be set according to actual needs.

[0061] The second organic layer 18 is located on a side of the second metal layer 17 facing away from the substrate 11 . The second organic layer 18 is located in the light emitting area and the frame area.

[0062] The electronic component 20 is located in the light emitting area and is coupled to the second metal trace 171 .

[0063] Exemplarily, the first organic layer 15 is provided with a first via 151 located in the light-emitting region, and the orthographic projection of the first via 151 on the substrate 11 and the orthographic projection of the first metal trace 131 on the substrate 11 have a first overlapping region. For example, the orthographic projection of the first via 151 on the substrate 11 can be located within the orthographic projection of the first metal trace 131 on the substrate 11, and thus the first overlapping region is the region where the first via 151 is located.

[0064] It should be noted that the thickness of the first organic layer 15 is relatively large. During the preparation of the light-emitting substrate, a two-coating process is usually used to form the first organic layer 15. That is, the first organic layer 15 may include a first sub-organic layer and a second sub-organic layer stacked in layers.

[0065] The light-emitting substrate may further include a second passivation layer 161, which may be located between the first organic layer 15 and the second metal layer 17. The second passivation layer 161 is located in the light-emitting region. The second passivation layer 161 is provided with a second via 163 located within the first via 151. The second via 163 extends through the second passivation layer 161 and the first passivation layer 14. The orthographic projection of the second via 163 on the substrate 11 at least partially overlaps with the first overlapping region. Thus, the second via 163 can expose at least a portion of the surface of the first metal trace 131. Specifically, at least a portion of the surface of the first metal trace 131 is exposed through the second via 163.

[0066] The second metal trace 171 is overlapped and connected to the first metal trace 131 through the second via 163 .

[0067] The light-emitting substrate may further include a third passivation layer 162, which is located between the second metal layer 17 and the second organic layer 18. The third passivation layer 162 is located in the light-emitting region. The third passivation layer 162 is provided with a third via hole. The orthographic projection of the third via hole on the substrate 11 and the orthographic projection of the second metal trace 171 on the substrate 11 have a second overlapping region. Thus, the surface of the second metal trace 171 in the second overlapping region is exposed through the third via hole.

[0068] The second organic layer 18 is provided with a fourth via hole in the light emitting area, and the orthographic projection of the fourth via hole on the substrate 11 at least partially overlaps with the second overlapping region. Thus, at least a portion of the surface of the second metal trace 171 is exposed through the fourth via hole.

[0069] The electronic component 20 is coupled to the second metal trace 171 through the fourth via. For example, a pin of the electronic component 20 is coupled to the second metal trace 171 through the fourth via.

[0070] The light-emitting substrate may further include a positioning pattern 30 located in the border region. The positioning pattern 30 may be located in the first metal layer 13. Alternatively, the positioning pattern 30 may be located in the second metal layer 17. Alternatively, the positioning pattern 30 may be located between the second organic layer 18 and the first organic layer 15. Alternatively, the positioning pattern 30 may be located on the side of the second organic layer 18 facing away from the substrate 11.

[0071] In related technologies, such as Figure 1A and Figure 1B As shown, the positioning pattern 30 is located in the first metal layer 13, and the stacked film layers above the positioning pattern 30 include a first passivation layer 14, a first organic layer 15, a composite film layer of a second passivation layer 161 + a third passivation layer 162, and a second organic layer 18 stacked in sequence. That is, the stacked film layers above the positioning pattern 30 include four film layers, and the refractive index of each two adjacent film layers is different.

[0072] In one embodiment of the present disclosure, when the positioning pattern 30 is located on the first metal layer 13, as shown in FIG. Figure 4 As shown, the stacked film layer above the positioning pattern 30 includes a composite film layer of a first passivation layer 14, a first organic layer 15 and a second organic layer 18 stacked in sequence, that is, the stacked film layer above the positioning pattern 30 includes two film layers with different refractive indices. Figure 1A and Figure 1B As shown in the related technology, the number of stacked film layers above the positioning pattern 30 in the present disclosure is reduced, which reduces the refraction of light in the stacked film layers and improves the interference phenomenon of light. Therefore, when the image acquisition module captures the image of the positioning pattern 30, the rainbow pattern in the image of the positioning pattern 30 can be reduced, thereby improving the accuracy of identifying the positioning pattern 30.

[0073] In one embodiment of the present disclosure, when the positioning pattern 30 is located on the second metal layer 17, the stacked film layer above the positioning pattern 30 may include the second organic layer 18, or the stacked film layer above the positioning pattern 30 may include the third passivation layer 162 and the second organic layer 18 in a stacked arrangement. In either case, the stacked film layer above the positioning pattern 30 may have at most two film layers with different refractive indices. Figure 1A and Figure 1B As shown in the related technology, the number of stacked film layers above the positioning pattern 30 in the present disclosure is reduced, which reduces the refraction of light in the stacked film layers and improves the interference phenomenon of light. Therefore, when the image acquisition module captures the image of the positioning pattern 30, the rainbow pattern in the image of the positioning pattern 30 can be reduced, thereby improving the accuracy of identifying the positioning pattern 30.

[0074] In one embodiment of the present disclosure, when the positioning pattern 30 is located between the second organic layer 15 and the second organic layer 18 or the positioning pattern 30 is located on the side of the second organic layer 18 facing away from the substrate 11, the stacked film layer above the positioning pattern 30 only has the second organic layer 18 or no film layer. Figure 1A and Figure 1B As shown in the related technology, the number of stacked film layers above the positioning pattern 30 in the present disclosure is reduced, which reduces the refraction of light in the stacked film layers and improves the interference phenomenon of light. Therefore, when the image acquisition module captures the image of the positioning pattern 30, the rainbow pattern in the image of the positioning pattern 30 can be reduced, thereby improving the accuracy of identifying the positioning pattern 30.

[0075] Therefore, the light-emitting substrate of the embodiment of the present disclosure is Figure 1A and Figure 1B The related technology shown in the present disclosure reduces the number of stacked film layers above the positioning pattern 30, reduces the refraction of light in the stacked film layers, and improves the interference phenomenon of light. Therefore, after the image acquisition module acquires the image of the positioning pattern 30, the rainbow pattern in the image of the positioning pattern 30 can be reduced, and the accuracy of the recognition of the positioning pattern 30 can be improved. Therefore, the light-emitting substrate can be positioned more accurately, the coordinate system of the light-emitting substrate can be obtained, the progress of the dispensing process can be improved, equipment downtime can be avoided, and the product yield can be improved.

[0076] It should be noted that Figure 3 The positional relationship between the positioning pattern 30 and the third metal trace 132 is only schematically shown. Those skilled in the art will appreciate that in the plan view of the light-emitting substrate, the positional relationship between the positioning pattern 30 and the third metal trace 132 can be set as needed and is not limited to Figure 3 shown.

[0077] exist Figure 4In the illustrated embodiment, the positioning pattern 30 is located in the first metal layer 13, that is, the first metal layer 13 includes a first metal trace 131, a third metal trace 132, and a positioning pattern 30, the first metal trace 131 is located in the light-emitting area, and the third metal trace 132 and the positioning pattern 30 are both located in the border area. For example, the third metal trace 132 can be coupled to the second power signal line GND. The second passivation layer 161 and the third passivation layer 162 are arranged in the light-emitting area, and the second passivation layer 161 and the third passivation layer 162 are not arranged in the border area. Therefore, the stacked film layer above the positioning pattern 30 includes a composite film layer of the first passivation layer 14, the first organic layer 15 + the second organic layer 18 stacked in sequence. In other words, the stacked film layer above the positioning pattern 30 has two film layers with different refractive indices.

[0078] Figure 5 for Figure 4 Schematic diagram of the light used to locate the pattern position. Figure 1A and Figure 1B , Figure 4 The stacked film layer above the middle positioning pattern 30 is no longer provided with the second passivation layer 161 + the third passivation layer 162. The number of stacked film layers above the positioning pattern 30 is reduced, which reduces the refraction of light in the stacked film layer and improves the interference phenomenon of light. Figure 5 As shown, light S2 and light S3 interfere with each other, while light S1 and light S4 do not. Consequently, when the image acquisition module captures an image of positioning pattern 30, the rainbow pattern in the image of positioning pattern 30 is significantly reduced. By improving the positioning algorithm of the image acquisition module, the accuracy of image recognition can be improved, allowing the image acquisition module to recognize images of positioning pattern 30 with slight rainbow patterns.

[0079] like Figure 4 As shown, the light-emitting substrate may further include an oxidation protection layer 19. The oxidation protection layer 19 may be coupled to the second metal trace 171 through a fourth via, and the pins of the electronic component 20 may be coupled to the oxidation protection layer 19. The oxidation protection layer may be made of nickel or gold and may also be referred to as a nickel-gold layer. After forming the second organic layer 18, a nickel-gold layer may be grown on the exposed surface of the second metal trace 171 using a nickel-gold process.

[0080] In one embodiment, Figure 2 and Figure 4As shown, the first metal trace 131 may include a first power signal line VCC and a second power signal line GND. The second metal trace 171a may be connected to the first power signal line VCC through a second via 163. The second metal trace 171b may be connected to the second power signal line GND through another second via 163. The second metal trace 171c may be a control signal line. One pin of the LED may be coupled to the second metal trace 171a through the oxidation protection layer 19, and another pin of the LED may be coupled to the second metal trace 171c through the oxidation protection layer 19. One pin of the microcontroller IC may be coupled to the second metal trace 171c through the oxidation protection layer 19, and one pin of the microcontroller IC may be coupled to the second metal trace 171b through the oxidation protection layer 19.

[0081] Figure 6 FIG. 1 is a schematic cross-sectional view of the border area of ​​the light-emitting substrate disclosed in another embodiment. Figure 7 for Figure 6 Schematic diagram of the light ray used to locate the pattern position. Figure 7 The polarizing film is arranged on the side of the light-transmitting coating 41 away from the substrate. Figure 6 As shown, the light-emitting substrate may further include a light-transmitting coating 41 located in the border region. The light-transmitting coating 41 is located on the side of the second organic layer 18 facing away from the substrate 11. The positioning pattern 30 is located between the substrate 11 and the light-transmitting coating 41. The orthographic projection of the positioning pattern 30 on the substrate 11 is located within the orthographic projection of the light-transmitting coating 41 on the substrate 11. The refractive index of the light-transmitting coating 41 ranges from 3.5 to 4.5. For example, the refractive index of the light-transmitting coating 41 may be 3.5, 4.0, or 4.5.

[0082] In this embodiment, the light-transmitting coating 41 is a film layer with high refractive index and high light transmittance. When the light beam passes through the light-transmitting coating 41, due to the high transmittance and high refractive index of the light-transmitting coating 41, light in all directions is emitted from the surface of the light-transmitting coating 41. A polarizing film 42 can be set between the light-transmitting coating 41 and the image acquisition module. The polarizing film 42 converts the isotropic light into a parallel beam, such as Figure 7 As shown. This eliminates the optical path difference between the light beams and the rainbow pattern. Consequently, the image capture module captures the positioning pattern 30 image, eliminating the rainbow pattern. This allows for accurate identification of the positioning pattern 30, enabling more precise positioning of the light-emitting substrate and acquisition of its coordinate system. This improves the dispensing process, avoids equipment downtime, and increases product yield.

[0083] For example, the polarizing film 42 may be located in the frame area, and the polarizing film 42 may be located on the side of the light-transmitting coating 41 away from the substrate, such as Figure 7 It should be noted that the polarizing film can have the same properties as the polarizer in the art, and the polarizing film and the polarizer have the same structure.

[0084] It should be noted that Figure 6 The structure of the light emitting area of ​​the light emitting substrate of the embodiment Figure 4 The structures of the light-emitting areas in the embodiments are the same and will not be described again here.

[0085] Figure 8 Schematic diagram of light when a light beam passes through a light-transmitting coating. The light-transmitting coating 41 includes a transparent organic material and nanopowders distributed in the organic material. The nanopowders may include at least one of titanium dioxide (TiO2) and chromium dioxide (CrO2). The nanopowders are evenly distributed in the organic material. By arranging nanopowders in the organic material, it can be ensured that the refractive index of the light-transmitting coating 41 satisfies 3.5 to 4.5. When the light beam passes through the light-transmitting coating 41, the reflection effect of the nanopowders will disperse the light beam passing through the light-transmitting coating 41 into light in various directions, such as Figure 8 As shown, these isotropic lights can be transformed into parallel light beams after passing through the polarizing film 42, thereby eliminating the optical path difference between the light beams and eliminating rainbow patterns.

[0086] For example, the light-emitting substrate may further include a polarizing film 42 located on the side of the light-transmitting coating 41 facing away from the substrate 11 and in the border region. Thus, light scattered by the nanopowder can directly pass through the polarizing film 42 and become parallel beams, which are then emitted from the light-emitting substrate and enter the image acquisition module, eliminating rainbow patterns in the image of the positioning pattern 30 captured by the image acquisition module.

[0087] In another embodiment, to ensure that the positioning image captured by the image acquisition module has no rainbow pattern, a polarizing film 42 can be provided on the lens of the image acquisition module. In this way, there is no need to provide the polarizing film 42 on the light-emitting substrate, which reduces the manufacturing difficulty of the light-emitting substrate.

[0088] Exemplarily, the volume ratio of the nanopowder in the light-transmitting coating 41 can be 0.2% to 0.4%. For example, the volume ratio of the nanopowder in the light-transmitting coating 41 can be 0.2%, 0.3%, or 0.4%. Setting the volume ratio of the nanopowder in the light-transmitting coating 41 to 0.2% to 0.4% can improve the light transmittance of the light-transmitting coating 41, making the light-transmitting coating 41 have high light transmittance, ensuring that light can pass through the light-transmitting coating 41 and return to the image acquisition module, thereby ensuring image acquisition.

[0089] In one embodiment, the thickness of the light-transmitting coating 41 can range from 1 μm to 3 μm (inclusive). For example, the thickness of the light-transmitting coating 41 can be set to 1 μm, 2 μm, or 3 μm. Experiments have shown that a light-transmitting coating 41 of such thickness not only eliminates rainbow streaks but also has a relatively small impact on the overall thickness of the light-emitting substrate.

[0090] The particle size of the nanopowder may be 8 nm to 10 nm. For example, the particle size of the nanopowder may be 8 nm, 8.5 nm, 9 nm, 9.5 nm or 10 nm.

[0091] like Figure 6 As shown, the positioning pattern 30 can be located in the first metal layer 13. The light-emitting substrate can also include a second passivation layer 161 located in the light-emitting area and the border area, and the second passivation layer 161 can be located between the first organic layer 15 and the second metal layer 17. And / or, the light-emitting substrate can also include a third passivation layer 162 located in the light-emitting area and the border area, and the third passivation layer 162 can be located between the second metal layer 17 and the second organic layer 18. Since the light-transmitting coating 41 is provided, the rainbow pattern in the image of the positioning pattern 30 is eliminated. Therefore, the film layer above the positioning pattern 30 can be conventionally provided. In other words, the light-emitting substrate can adopt the structure in the relevant technology, and there is no need to change the process technology of the light-emitting substrate. It is only necessary to provide the light-transmitting coating 41 in the border area after the relevant modules in the light-emitting substrate are prepared to eliminate the rainbow pattern in the image of the positioning pattern 30.

[0092] For example, the organic material in the light-transmitting coating 41 can be a photoresist material. The width of the light-transmitting coating 41 can be 8 mm to 12 mm, for example, 10 mm. The width of the light-transmitting coating 41 is the dimension of the light-transmitting coating 41 in a direction perpendicular to the edge of the light-emitting substrate. This ensures that the light-transmitting coating 41 covers the positioning pattern 30.

[0093] Exemplarily, the positioning pattern 30 may also be located in the second metal layer 17. The light-emitting substrate may further include a second passivation layer 161 located in the light-emitting area and the frame area. The second passivation layer 161 may be located between the first organic layer 15 and the second metal layer 17. And / or, the light-emitting substrate may further include a third passivation layer 162 located in the light-emitting area and the frame area. The third passivation layer 162 may be located between the second metal layer 17 and the second organic layer 18.

[0094] In one embodiment, the light-emitting substrate may further include a white ink layer 40 located in the light-emitting area. The white ink layer 40 is located on the side of the second organic layer 18 facing away from the substrate 11. The white ink layer 40 is located in the light-emitting area, and no white ink is provided in the border area. A light-transmitting coating 41 may be provided in the border area.

[0095] Figure 9 FIG. 1 is a schematic cross-sectional view of the border area of ​​the light-emitting substrate disclosed in another embodiment. Figure 10 for Figure 9 Schematic diagram of the light used to locate the pattern position. Figure 9As shown, the positioning pattern 30 can be located in the second metal layer 17, the second passivation layer 161 can also be located in the frame area, and the third passivation layer 162 can also be located in the frame area. The positioning pattern 30 is located between the second passivation layer 161 and the third passivation layer 162 in the frame area. After the positioning pattern 30 is set on the second metal layer 17, the stacked film layer above the positioning pattern 30 includes the third passivation layer 162 and the second organic layer 18. In other words, the stacked film layer above the positioning pattern 30 includes two film layers with different refractive indices. Compared to Figure 1A and Figure 1B As shown in the related technology, the number of stacked film layers above the positioning pattern 30 in the present disclosure is reduced, which reduces the refraction of light in the stacked film layers and improves the interference phenomenon of light. Therefore, when the image acquisition module captures the image of the positioning pattern 30, the rainbow pattern in the image of the positioning pattern 30 can be reduced, thereby improving the accuracy of identifying the positioning pattern 30.

[0096] like Figure 10 As shown, the number of film layers in the stacked film layer above the positioning pattern is reduced, which reduces the refraction of light in the stacked film layer and improves the interference phenomenon of light.

[0097] use Figure 9 The solution shown does not affect the manufacturing process of the light-emitting substrate. The positioning pattern 30 located on the second metal layer 17 can be formed by adopting the manufacturing process of the light-emitting substrate in the related art.

[0098] It should be noted that Figure 9 The structure of the light emitting area of ​​the light emitting substrate of the embodiment Figure 4 The structures of the light-emitting areas in the embodiments are the same and will not be described again here.

[0099] Figure 11 FIG. 1 is a cross-sectional schematic diagram of the border area of ​​the light-emitting substrate disclosed in another embodiment. Figure 11 As shown, the positioning pattern 30 can be located between the second organic layer 18 and the first organic layer 15. For example, the positioning pattern 30 is located between the third passivation layer 162 and the second organic layer 18. For example, the positioning pattern 30 is formed on the side of the third passivation layer 162 facing away from the substrate 11, and the positioning pattern 30 is located in the border area. The material of the positioning pattern 30 can be a light-shielding material, such as a black organic material.

[0100] In another embodiment, the alignment pattern 30 may be located on the side of the second organic layer 18 facing away from the substrate 11. For example, the alignment pattern 30 is formed on the side of the second organic layer 18 facing away from the substrate 11. The alignment pattern 30 may be made of a light-shielding material, such as a black organic material.

[0101] Such a light-emitting substrate includes a second organic layer 18 above the positioning pattern 30, or there is no other film layer above the positioning pattern 30, which can greatly reduce rainbow patterns in the positioning pattern 30 image captured by the image acquisition module and improve the accuracy of positioning pattern 30 recognition.

[0102] In an embodiment where the positioning pattern 30 is located between the third passivation layer 162 and the second organic layer 18 ; or, the positioning pattern 30 is located on the side of the second organic layer 18 away from the substrate 11 , the second passivation layer 161 and the third passivation layer 162 may also be located in the border area.

[0103] It should be noted that Figure 11 The structure of the light emitting area of ​​the light emitting substrate of the embodiment Figure 4 The structures of the light-emitting areas in the embodiments are the same and will not be described again here.

[0104] Figure 12 FIG. 1 is a schematic diagram of a positioning pattern in a light-emitting substrate according to an embodiment of the present disclosure. Figure 12 As shown, the shape of the positioning pattern 30 includes at least one of a circle, a cross, a polygon, and a star. Polygons may include, for example, triangles, quadrilaterals, pentagons, and hexagons. The positioning pattern 30 is configured as a cross, polygon, or star, and the positioning pattern 30 has sharp corners, making it easier to identify and improving the recognition accuracy of the image acquisition module.

[0105] like Figure 4 As shown, the light-emitting substrate may further include a buffer layer 12, which is located in the light-emitting area and the frame area. The buffer layer 12 may be located between the substrate 11 and the first metal layer 13. The buffer layer 12 is used to protect the first metal layer 13 from ion / water vapor contamination from the substrate 11 side. The first passivation layer 14 serves as a water vapor barrier to protect the first metal layer 13 from oxidation. The second passivation layer 161 and the third passivation layer 162 are used to protect the second metal layer 17 from oxidation by water vapor.

[0106] In an exemplary embodiment, the first passivation layer 14, the second passivation layer 161, the third passivation layer 162, and the buffer layer 12 can be made of any one or more of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON), and can be a single layer, multiple layers, or a composite layer. The first passivation layer 14, the second passivation layer 161, and the third passivation layer 162 can be formed using a deposition process and a patterning process. The first metal layer 13 and the second metal layer 17 can be made of metal materials, such as any one or more of silver (Ag), copper (Cu), aluminum (Al), titanium (Ti), and molybdenum (Mo), or alloys of the above metals, such as aluminum neodymium alloy (AlNd) or molybdenum niobium alloy (MoNb), and can be a single layer structure or a multilayer composite structure, such as Ti / Al / Ti. The first metal layer 13 and the second metal layer 17 can be formed using a deposition process and a patterning process. The first organic layer 15 and the second organic layer 18 can be made of organic materials, such as photoresist, polyimide (PI), etc. The first organic layer 15 and the second organic layer 18 can be formed by a coating process and a patterning process. The material of the substrate 11 can include glass. For example, the substrate 11 is a glass substrate 11.

[0107] The present disclosure also provides a positioning device. The positioning device may include an image acquisition module and a positioning module. The image acquisition module is configured to acquire an image of the positioning pattern 30 in the light-emitting substrate of the present disclosure; the positioning module is configured to compare the acquired image of the positioning pattern 30 with a pre-stored target image, and when the acquired image of the positioning pattern 30 matches the pre-stored target image, the light-emitting substrate is positioned according to the acquired positioning pattern 30. A polarizing film 42 is provided on the lens of the image acquisition module.

[0108] For example, when the similarity between the captured image of the positioning pattern 30 and the pre-stored target image is greater than or equal to 90%, it is considered that the positioning pattern 30 is successfully recognized.

[0109] In the embodiment of the present disclosure, the light emitting substrate can be Figure 6 The light-emitting substrate shown in FIG. A polarizing film 42 is placed on the lens of the image acquisition module. Light emitted from the surface of the light-transmitting coating 41 in all directions is converted into parallel beams after passing through the polarizing film 42. Therefore, the light entering the image acquisition module is a parallel beam. This eliminates optical path differences between the beams, prevents light interference, eliminates rainbow patterns in the image of the positioning pattern 30, and improves the accuracy of positioning pattern 30 recognition.

[0110] The present disclosure also provides a dispensing device comprising the positioning device of the present disclosure. During the dispensing process, the positioning device captures an image of the positioning pattern 30, compares the captured image of the positioning pattern 30 with a pre-stored target image, and, when the captured image of the positioning pattern 30 matches the pre-stored target image, positions the light-emitting substrate according to the captured positioning pattern 30. The dispensing device in the dispensing device then dispenses glue onto the electronic components 20 on the light-emitting substrate.

[0111] like Figure 2 and Figure 4 As shown, the light emitting substrate may further include a protective adhesive 50, which covers the electronic components 20. Figure 2 and Figure 4 : shows the upper surface of the protective glue 50. After the dispensing device in the dispensing equipment dispenses glue on the electronic components 20 on the light-emitting substrate, the protective glue 50 is formed.

[0112] The present disclosure also provides a display device comprising a light-emitting substrate according to the aforementioned embodiment. The display device can be any product or component with a display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigation system.

[0113] The light-emitting substrate in the embodiment of the present disclosure can be assembled in a display device as a display panel, or as a light source. The display device can be: electronic paper, mobile phones, tablet computers, televisions, monitors, laptops, digital photo frames, navigation devices, wearable display devices, and any other products or components with display functions.

[0114] The light-emitting substrate in the embodiment of the present disclosure can also be used as a light source in lighting products.

[0115] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure.

[0116] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of such features. Throughout the present disclosure, "plurality" means two or more, unless otherwise specifically defined.

[0117] In this disclosure, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be understood broadly. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections, electrical connections, or communication; direct connections or indirect connections through an intermediate medium; and internal connections between two components or interactions between two components. Those skilled in the art will understand the specific meanings of these terms in this disclosure based on specific circumstances.

[0118] In the present disclosure, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0119] The disclosure above provides many different embodiments or examples for implementing different structures of the present disclosure. In order to simplify the present disclosure, the components and settings of specific examples are described above. Of course, these are merely examples and are not intended to limit the present disclosure. In addition, the present disclosure may repeat reference numbers and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed.

[0120] The above are only specific embodiments of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any person skilled in the art can easily conceive of various changes or substitutions within the technical scope disclosed in this disclosure. Different parts of different embodiments can be combined with each other without conflict, and all of these should be included in the scope of protection of this disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A light-emitting substrate, characterized in that: The light-emitting substrate includes a light-emitting area and a frame area outside the light-emitting area, and includes: substrate; A first metal layer, located on one side of the substrate, including a first metal trace located in the light-emitting area; a first passivation layer, located in the light-emitting area and the frame area, and located on a side of the first metal layer facing away from the substrate; a first organic layer, located in the light-emitting area and the frame area, and located on a side of the first passivation layer facing away from the substrate; a second metal layer, located in the light-emitting region and on a side of the first organic layer facing away from the substrate, the second metal layer comprising a second metal trace coupled to the first metal trace; a second organic layer, located in the light-emitting area and the frame area, and located on a side of the second metal layer facing away from the substrate; an electronic component, located in the light-emitting area, wherein the electronic component is coupled to the second metal trace; Wherein, the light-emitting substrate further includes a positioning pattern, and the positioning pattern is located in the frame area; The positioning pattern is located in the first metal layer; or, the positioning pattern is located in the second metal layer; or, the positioning pattern is located between the second organic layer and the first organic layer; or, the positioning pattern is located on a side of the second organic layer away from the substrate.

2. The light-emitting substrate according to claim 1, wherein The light-emitting substrate also includes a light-transmitting coating located in the border area, the light-transmitting coating is located on the side of the second organic layer facing away from the substrate, the positioning pattern is located between the substrate and the light-transmitting coating, the orthographic projection of the positioning pattern on the substrate is located within the orthographic projection of the light-transmitting coating on the substrate, and the refractive index range of the light-transmitting coating is 3.5 to 4.

5.

3. The light-emitting substrate according to claim 2, wherein: The light-transmitting coating comprises a transparent organic material and nanometer powder distributed in the organic material, wherein the nanometer powder comprises at least one of titanium dioxide and chromium dioxide.

4. The light-emitting substrate according to claim 2, wherein The light-transmitting coating comprises a transparent organic material and nanometer powder distributed in the organic material. The volume ratio of the nanometer powder in the light-transmitting coating is 0.2% to 0.4%.

5. The light-emitting substrate according to claim 2, wherein The positioning pattern is located on the first metal layer; The light-emitting substrate further includes a second passivation layer located in the light-emitting area and the border area, and the second passivation layer is located between the first organic layer and the second metal layer; and / or, the light-emitting substrate further includes a third passivation layer located in the light-emitting area and the border area, and the third passivation layer is located between the second metal layer and the second organic layer.

6. The light-emitting substrate according to claim 2, wherein: The positioning pattern is located on the second metal layer; The light-emitting substrate further includes a second passivation layer located in the light-emitting area and the border area, and the second passivation layer is located between the first organic layer and the second metal layer; and / or, the light-emitting substrate further includes a third passivation layer located in the light-emitting area and the border area, and the third passivation layer is located between the second metal layer and the second organic layer.

7. The light-emitting substrate according to claim 2, wherein The light-emitting substrate further includes a polarizing film located on a side of the light-transmitting coating layer facing away from the base and located in the frame area.

8. The light-emitting substrate according to claim 1, wherein The positioning pattern is located on the second metal layer; The light-emitting substrate further includes a second passivation layer located in the light-emitting area and the border area, and the second passivation layer is located between the first organic layer and the second metal layer; and / or, the light-emitting substrate further includes a third passivation layer located in the light-emitting area and the border area, and the third passivation layer is located between the second metal layer and the second organic layer.

9. The light-emitting substrate according to claim 1, wherein The material of the positioning pattern includes black organic material; The positioning pattern is located between the second organic layer and the first organic layer; or, the positioning pattern is located on a side of the second organic layer facing away from the substrate.

10. The light-emitting substrate according to any one of claims 1 to 9, characterized in that: The shape of the positioning pattern includes at least one of a cross, a polygon, a circle, and a star.

11. A positioning device, characterized in that: include: An image acquisition module, configured to acquire an image of the positioning pattern in the light-emitting substrate according to any one of claims 2 to 6; a positioning module, configured to compare the captured image of the positioning pattern with a pre-stored target image, and when the captured image of the positioning pattern matches the pre-stored target image, position the light-emitting substrate according to the captured positioning pattern; Wherein, a polarizing film is provided on the lens of the image acquisition device.

12. A dispensing device, characterized in that: Includes the positioning device according to claim 11.

13. A display device, characterized in that: The light-emitting substrate comprises the light-emitting substrate according to any one of claims 1 to 10.

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