Magnetic heat dissipation module and electronic device

Abstract

The invention provides a magnetic heat dissipation module and an electronic device. The magnetic heat dissipation module comprises a magnetic seat and a radiator. The magnetic attraction seat comprises a base and a first magnet, the base comprises a fixing portion, an extending portion erected from the fixing portion, a positioning eave extending from the extending portion in a bent mode and a groove located between the positioning eave and the fixing portion, and the first magnet is located on the fixing portion. The radiator comprises a butt joint part, a radiating part connected to the butt joint part and a second magnet arranged on the butt joint part, the butt joint part comprises a pivoting end and an extending end which are adjacent to each other, and the first magnet and the second magnet are different in magnetism. When the radiator is assembled to the magnetic attraction seat, the extending-in end of the radiator is obliquely inserted into the groove, and the pivoting end pivots in the direction from the positioning eave to the fixing part, so that the second magnet is magnetically attracted to the first magnet, and the butt joint part is positioned on the fixing part.

Description

Technical Field

[0001] The present invention relates to a heat dissipation module and an electronic device, and in particular to a magnetic heat dissipation module and an electronic device. Background Art

[0002] Currently, most heat sinks installed on motherboards are fixed with screws, which requires manual alignment and is quite inconvenient during assembly. Summary of the Invention

[0003] One of the purposes of the present invention is to provide a magnetic heat dissipation module that can be quickly aligned, assembled, and disassembled and can be well and firmly fixed.

[0004] Another object of the present invention is to provide an electronic device having the above-mentioned magnetic heat dissipation module.

[0005] A magnetic heat dissipation module of the present invention includes a magnetic seat and a heat sink detachably mounted on the magnetic seat. The magnetic seat includes a base and a first magnet, wherein the base includes a fixed portion, an extension portion rising from the fixed portion, a positioning eaves extending in a bent manner from the extension portion, and a groove located between the positioning eaves and the fixed portion, and the first magnet is located in the fixed portion. The heat sink includes a docking portion, a heat dissipation portion connected to the docking portion, and a second magnet arranged in the docking portion, wherein the docking portion includes an adjacent pivot end and an insertion end, and the magnetic properties of the first magnet and the second magnet are different. When the heat sink is assembled to the magnetic seat, the insertion end of the heat sink is obliquely inserted into the groove, and the pivot end is pivoted along the positioning eaves toward the fixed portion, so that the second magnet is magnetically attracted to the first magnet, and the docking portion is positioned on the fixed portion.

[0006] In one embodiment of the present invention, the positioning eaves are in an outward convex arc shape, and the pivot end is in an inward concave arc shape corresponding to the positioning eaves.

[0007] In one embodiment of the present invention, the positioning eaves includes a recess away from the fixing portion to avoid interference with the pivot end.

[0008] In one embodiment of the present invention, the base further includes a positioning rib located in the groove and connected to the fixing portion and the positioning eaves, and the docking portion further includes a positioning recess corresponding to the positioning rib.

[0009] In one embodiment of the present invention, the fixing portion includes a plate and a raised support structure protruding from a lower surface of the plate.

[0010] In one embodiment of the present invention, the plate includes a notch recessed from an edge.

[0011] An electronic device according to the present invention includes a motherboard and the aforementioned magnetic heat dissipation module. The motherboard includes a heat source. The fixing portion is disposed on the motherboard and located adjacent to the heat source. When the heat sink is assembled to the magnetic base, the heat dissipation portion is thermally coupled to the heat source.

[0012] In one embodiment of the present invention, the fixing portion includes a plate and a raised support structure protruding from the lower surface of the plate. The motherboard includes a first electronic component. The raised support structure abuts against the motherboard. The plate is separated from the motherboard, and the first electronic component is located between the plate and the motherboard.

[0013] In one embodiment of the present invention, the mainboard includes a second electronic component, the board includes a notch recessed from an edge, and the second electronic component is located in the notch.

[0014] In one embodiment of the present invention, the electronic device further includes a locking member, and the base further includes a positioning rib. The locking member passes through the mainboard and partially extends into the positioning rib, so that the magnetic base is fixed to the mainboard.

[0015] Based on the above, the first magnet of the magnetic base of the magnetic heat sink module of the present invention is located on the fixed portion of the base, and the second magnet of the heat sink is located on the docking portion. The base also includes a positioning eave and a groove between the positioning eave and the fixed portion. When the heat sink is assembled to the magnetic base, the extended end of the heat sink is inserted obliquely into the groove of the magnetic base, and the pivot end of the heat sink is pivoted along the positioning eave of the magnetic base toward the fixed portion, so that the second magnet is magnetically attracted to the first magnet and the docking portion is positioned on the fixed portion. Therefore, when assembling or disassembling the heat sink from the magnetic base, the outer contour of the positioning eave is well guided, making it easy to complete assembly and disassembly, reducing the chance of damaging components on the motherboard during assembly. In addition, because the positioning eave provides a specific assembly and disassembly path for the heat sink, for example, a path that is different from the magnetic attraction direction of the first and second magnets, it effectively reduces the chance of the heat sink being easily separated from the magnetic base due to vibration during transportation of the electronic device. Furthermore, the mutual attraction between the first and second magnets enables rapid alignment and fixation. The first magnet and the second magnet have different magnetic properties and provide a stronger suction force, so that the heat sink can be well and firmly fixed on the magnetic base. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic diagram of an electronic device according to an embodiment of the present invention.

[0017] Figure 2 yes Figure 1 A partial three-dimensional schematic diagram of the radiator being lifted up.

[0018] Figure 3 yes Figure 1Another perspective diagram of the heat sink being detached from the magnetic mount.

[0019] Figure 4 yes Figure 1 Schematic diagram of the back of the radiator.

[0020] Figure 5 and Figure 6 yes Figure 1 Schematic cross-section of the heat sink lifting process.

[0021] Figure 7 yes Figure 1 Schematic diagram of the back of the magnetic mount.

[0022] Figure 8 yes Figure 1 A diagram showing the magnetic mount on the motherboard in perspective.

[0023] Figure 9 yes Figure 1 Cross-sectional view of the magnetic mount on the motherboard.

[0024] The reference numerals are as follows:

[0025] 10: Electronic devices

[0026] 20: Motherboard

[0027] 22: Heat Source

[0028] 24: First Electronic Components

[0029] 26: Second electronic component

[0030] 30: Locking hardware

[0031] 100: Magnetic heat dissipation module

[0032] 110: Magnetic seat

[0033] 112: First Magnet

[0034] 120: Base

[0035] 121: Positioning rib

[0036] 122: Fixed part

[0037] 123: Plate body

[0038] 124: Gap

[0039] 125: Raise the support structure

[0040] 126: Extension

[0041] 127: Positioning the eaves

[0042] 128: Give way to depression

[0043] 129: Groove

[0044] 130: Radiator

[0045] 131: Docking

[0046] 132: Pivot end

[0047] 133: Insertion end

[0048] 134: Heat dissipation

[0049] 135: Second magnet

[0050] 136: Positioning recess DETAILED DESCRIPTION

[0051] Figure 1 is a schematic diagram of an electronic device according to an embodiment of the present invention. Figure 2 yes Figure 1 A partial three-dimensional schematic diagram of the radiator being lifted up. Figure 3 yes Figure 1 Another perspective diagram of the heat sink being detached from the magnetic mount.

[0052] See also Figures 1 to 3 The electronic device 10 of this embodiment includes a motherboard 20 and a magnetic heat dissipation module 100. The motherboard 20 includes a heat source 22. The heat source 22 is, for example, a solid state drive (SSD), but the type of the heat source 22 is not limited thereto.

[0053] The magnetic heat dissipation module 100 of this embodiment includes a magnetic base 110 and a heat sink 130 detachably mounted on the magnetic base 110. The magnetic base 110 includes a base 120 and a first magnet 112 ( Figure 3 ). The first magnet 112 is located at the fixing portion 122. Figure 1 As shown, in this embodiment, the fixing portion 122 is disposed on the mainboard 20 and is located next to the heat source 22 .

[0054] like Figure 3 As shown, the base 120 includes a fixing portion 122, an extension portion 126 rising from the fixing portion 122, a positioning eave 127 extending in a bent manner from the extension portion 126, and a groove 129 ( Figure 5 ).

[0055] Figure 4 yes Figure 1 See the back of the heat sink. Figure 4The heat sink 130 includes a docking portion 131, a heat dissipation portion 134 connected to the docking portion 131, and a second magnet 135 disposed on the docking portion 131. In this embodiment, there is a height difference between the docking portion 131 and the heat dissipation portion 134, but the positional relationship between the docking portion 131 and the heat dissipation portion 134 is not limited to this.

[0056] Figure 5 and Figure 6 yes Figure 1 See the cross-sectional diagram of the heat sink lifting process. Figure 5 and Figure 6 In this embodiment, the positioning eaves 127 of the base 120 of the magnetic mount 110 are convexly curved. The docking portion 131 includes a pivot end 132 and an extending end 133. The pivot end 132 of the docking portion 131 of the heat sink 130 is concavely curved, corresponding to the positioning eaves 127. The shapes of the positioning eaves 127 and the pivot end 132 match, allowing the positioning eaves 127 to provide guidance for the pivot end 132 during rotation.

[0057] Therefore, when the heat sink 130 is assembled to the magnetic base 110, the user only needs to insert the insertion end 133 of the heat sink 130 into the groove 129 at an angle, and the pivot end 132 of the heat sink 130 abuts against the positioning eaves 127 of the magnetic base 110, and the pivot end 132 is pivoted (rotated downward) along the positioning eaves 127 toward the fixing portion 122. The heat sink 130 can then be smoothly rotated downward along the outer contour of the positioning eaves 127 to the position, so that the second magnet 135 ( Figure 4 ) is magnetically attracted to the first magnet 112 ( Figure 3 ), and the docking portion 131 is positioned on the fixing portion 122, so that the heat dissipation portion 134 ( Figure 1 ) is thermally coupled to the heat source 22 ( Figure 1 ).

[0058] In this embodiment, the first magnet 112 and the second magnet 135 have different magnetic properties, thereby providing a greater magnetic attraction force, so that the heat sink 130 can be well and firmly fixed to the magnetic base 110 .

[0059] In addition, since the heat sink 130 is rotated downward along the positioning eaves 127 during the assembly process, the heat sink 130 can be prevented from damaging the electronic components on the motherboard 20 during installation, thereby increasing safety.

[0060] It should be noted that in this embodiment, the magnetic force direction of the first magnet 112 and the second magnet 135 (the normal direction of the motherboard 20) is different from the rotation trajectory of the heat sink 130 when it is removed. Since the positioning eaves 127 restrict the heat sink 130 from being removed, it must be rotated along the positioning eaves 127 and then moved out of the groove 129. This design can prevent the heat sink 130 from easily falling off the magnetic base 110 due to vibration during transportation of the electronic device 10.

[0061] In addition, by Figure 6 It can be seen that in this embodiment, the positioning eaves 127 includes a recess 128 away from the fixing portion 122 to avoid interference with the pivot end, so that the radiator 130 can rotate smoothly.

[0062] Figure 7 yes Figure 1 See the back of the magnetic mount. Figure 7 In this embodiment, the fixing portion 122 of the base 120 of the magnetic base 110 includes a plate 123 and a raised support structure 125 protruding from the lower surface of the plate 123. The raised support structure 125 is located at multiple edges of the plate 123, but is not limited thereto. The raised support structure 125 is used to abut against the motherboard 20 ( Figure 9 ), so that the board body 123 is separated from the main board 20.

[0063] Figure 8 yes Figure 1 A diagram showing the magnetic mount on the motherboard in perspective. Figure 9 yes Figure 1 Cross-sectional view of the magnetic base on the motherboard. Figure 8 and Figure 9 , motherboard 20( Figure 9 ) includes a first electronic component 24. In this embodiment, the height of the first electronic component 24 is less than the distance between the plate body 123 and the main board 20. Therefore, the first electronic component 24 can be disposed at a portion of the main board 20 below the plate body 123.

[0064] In other words, the elevated support structure 125 is used to raise the board 123, thereby preventing interference between the first electronic component 24 on the motherboard 20 and the board 123. Therefore, the first electronic component 24 can still be installed in the area covered by the board 123 on the motherboard 20, thereby increasing the flexibility of the circuit layout of the motherboard 20.

[0065] Furthermore, the plate 123 includes a recessed notch 124 recessed from the edge. The motherboard 20 includes a second electronic component 26, which is located within the recessed notch 124 recessed from the edge of the plate 123. In this embodiment, the height of the second electronic component 26 is greater than the distance between the plate 123 and the motherboard 20. Therefore, the provision of the notch 124 on the plate 123 frees the second electronic component 26 on the motherboard 20 from being restricted by the height of the plate 123, thereby increasing the flexibility of the motherboard 20's circuit layout.

[0066] Furthermore, if Figure 9 As shown, the base 120 further includes a positioning rib 121 located in the groove 129 ( Figure 6 ) and connected to the fixing portion 122 and the positioning eaves 127. Figure 3 As shown, the docking portion 131 of the heat sink 130 further includes a positioning recess 136 corresponding to the positioning rib 121 .

[0067] When the heat sink 130 is assembled to the magnetic base 110, the positioning recess 136 of the heat sink 130 engages the positioning rib 121 of the base 120, securing it horizontally. The extended end 133 of the heat sink 130 is located within the groove 129 of the base 120, securing it vertically. The first magnet 112 and the second magnet 135 have opposite polarities, resulting in a greater magnetic attraction. Therefore, the heat sink 130 can be precisely aligned and securely secured to the magnetic base 110 without the need for tools.

[0068] In addition, the electronic device 10 further includes a locking member 30 ( Figure 8 ), in this embodiment, the magnetic base 110 is fixed to the motherboard 20 by a locking member 30. The locking member 30 passes through the motherboard 20 and partially extends into the positioning rib 121, so that the magnetic base 110 is fixed to the motherboard 20.

[0069] It should be noted that in this embodiment, in addition to the outer surface of the positioning rib 121 having the function of positioning the heat sink 130, the inner portion of the positioning rib 121 also provides a space for the locking member 30 to be locked. Therefore, both the outer surface and the inner space of the positioning rib 121 are well utilized.

[0070] Specifically, in this embodiment, since the positioning ribs 121 are integrated into the elevated support structure 125 that abuts the motherboard 20, the motherboard 20 does not have protruding components at the locations corresponding to the positioning ribs 121 to prevent damage. Therefore, this embodiment takes advantage of the fact that the motherboard 20 does not have components at the locations corresponding to the positioning ribs 121 and further provides through-holes in the locations corresponding to the positioning ribs 121 for the locking member 30 to pass through. This eliminates the need for designers to provide through-holes for the locking member 30 elsewhere in the motherboard 20. This design saves space on the motherboard 20 and increases the flexibility of the motherboard 20 in circuit layout.

[0071] In summary, the magnetic base of the magnetic heat sink module of the present invention has its first magnet located in the fixed portion of the base, and the heat sink's second magnet is located in the docking portion. The base also includes a positioning eave and a groove between the positioning eave and the fixed portion. When the heat sink is assembled to the magnetic base, the heat sink's extended end is inserted obliquely into the magnetic base's groove, and the heat sink's pivot end is rotated downward along the magnetic base's positioning eave to magnetically attract the second magnet to the first magnet. Therefore, when assembling or disassembling the heat sink from the magnetic base, the outer contour of the positioning eave is well guided, allowing for easy assembly and disassembly, reducing the chance of damaging components on the motherboard during assembly. Furthermore, because the positioning eave provides a specific assembly and disassembly path for the heat sink—for example, one that differs from the magnetic attraction direction of the first and second magnets—this effectively reduces the chance of the heat sink being easily detached from the magnetic base due to vibration during transportation of the electronic device. Furthermore, the mutual attraction between the first and second magnets allows for rapid alignment and securement. The first magnet and the second magnet have different magnetic properties and provide a stronger suction force, so that the heat sink can be well and firmly fixed on the magnetic base.

Claims

1. A magnetic heat dissipation module, characterized in that: include: A magnetic base comprising a base and a first magnet, wherein the base comprises a fixed portion, an extension portion extending from the fixed portion, a positioning eave extending in a bent manner from the extension portion, and a groove located between the positioning eave and the fixed portion, and the first magnet is located in the fixed portion; and A heat sink is detachably mounted on the magnetic base. The heat sink includes a docking portion, a heat dissipation portion connected to the docking portion, and a second magnet disposed on the docking portion. The docking portion includes a pivot end and an insertion end adjacent to each other. The first magnet and the second magnet have different magnetic properties. When the radiator is assembled to the magnetic base, the extending end of the radiator is inserted into the groove at an angle, and the pivot end is pivoted along the positioning eaves toward the fixing portion, so that the second magnet is magnetically attracted to the first magnet, and the docking portion is positioned on the fixing portion.

2. The magnetic heat dissipation module according to claim 1, wherein: The positioning eaves is in an outward convex arc shape, and the pivot end is in an inward concave arc shape corresponding to the positioning eaves.

3. The magnetic heat dissipation module according to claim 1, wherein: The positioning eave comprises a recess away from the fixing portion to avoid interference with the pivot end.

4. The magnetic heat dissipation module according to claim 1, wherein: The base further includes a positioning rib located in the groove and connected to the fixing portion and the positioning eaves. The docking portion further includes a positioning recess corresponding to the positioning rib.

5. The magnetic heat dissipation module according to claim 1, wherein: The fixing portion includes a plate body and a padding support structure protruding from the lower surface of the plate body.

6. The magnetic heat dissipation module according to claim 5, characterized in that: The plate body includes a notch recessed from an edge.

7. An electronic device, characterized in that: include: a motherboard including a heat source; and A magnetic heat dissipation module as claimed in any one of claims 1 to 3, wherein the fixing portion is disposed on the motherboard and is located next to the heat source, and when the heat sink is assembled to the magnetic base, the heat dissipation portion is thermally coupled to the heat source.

8. The electronic device according to claim 7, wherein: The fixing portion includes a plate and a raised support structure protruding from the lower surface of the plate. The motherboard includes a first electronic component. The raised support structure abuts against the motherboard. The plate is separated from the motherboard, and the first electronic component is located between the plate and the motherboard.

9. The electronic device according to claim 8, wherein: The main board includes a second electronic component. The board body includes a notch recessed from an edge. The second electronic component is located in the notch.

10. The electronic device according to claim 7, wherein: A locking piece is also included, wherein the base further includes a positioning rib. The locking piece passes through the mainboard and partially extends into the positioning rib, so that the magnetic seat is fixed to the mainboard.

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