Infrared detector and cold optical assembly integrated packaging structure

By using thin-walled structural insulation support with high heat transfer resistance and high rigidity, combined with flexible bellows and thin-film heater temperature control circuits, the problem of integrated packaging of infrared detectors and complex optical systems is solved, achieving high stability and high-efficiency optical performance, suitable for long-term operation in space orbits and atmospheric environments.

CN120692971APending Publication Date: 2025-09-23SHANGHAI INSTITUTE OF TECHNICAL PHYSICS CHINESE ACADEMY OF SCIENCES
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202510834850.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-06-20
Publication Date
2025-09-23

AI Technical Summary

Technical Problem

When the infrared detector is packaged as a whole with a complex optical system, there are problems such as difficulty in thermal isolation, optical path position offset, and changes in the mirror surface leading to deterioration in image quality, making it difficult to achieve efficient integration.

Method used

By adopting a thin-walled structure with high heat transfer resistance, high strength and high rigidity for thermal insulation support, designing a flexible bellows and thin film heater temperature control circuit, and constructing a three-level temperature zone platform, combined with a low-temperature cold screen with gold-plated polishing and nano-particle coating, effective thermal insulation and temperature control and pollution prevention of optical components are achieved.

Benefits of technology

It achieves high-stability integrated packaging of infrared detectors and cold optical components, reduces cold loss, maintains the mechanical stability of the optomechanical structure, improves the performance and test efficiency of the optical system, and meets the requirements of long-term operation in high vacuum and atmospheric environments in space orbit environments.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN120692971A_ABST
    Figure CN120692971A_ABST
Patent Text Reader

Abstract

The invention discloses an infrared detector and cold optical component integrated packaging structure, which integrates an infrared detector and a cold optical component in a vacuum packaging shell, adopts a thin-wall structure with high thermal resistance, high strength and high rigidity to insulate heat and support, and constructs a three-stage temperature zone platform. And the working requirements of the infrared detector and the cold optical assembly on cross-temperature zone, low heat leakage and high structural stability at low temperature are met. In order to reduce heat leakage of a cold optical assembly caused by a thermal environment and suppress stray radiation, a low-temperature cold shield with the outer surface plated with gold and polished and the inner surface provided with a high-emissivity nano-particle coating is designed. The position adjustment of the optical lens can be realized by controlling the compression amount of the flexible corrugated pipe, and the optical path position correction is realized. The temperature control heating loops on the window flange and the cold optical substrate not only have the dual functions of adjusting the working temperature of the window lens and the cold optical assembly and baking, decontaminating and heating when low-temperature pollution occurs, but also can realize quick temperature returning after the test is finished, so that the time cost is remarkably saved.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present invention relates to the field of space infrared low-temperature optical detection, and in particular to an integrated packaging structure of an infrared detector and a cold optical component. Background Art

[0002] With the demand for low-background, high-sensitivity infrared detection systems, the use of cold optics technology to cool optical components and reduce instrument background thermal noise has become an inevitable choice. While vacuum packaging of a single infrared detector or a detector with one or two lenses is common, packaging an infrared detector within a complex optical system is far more challenging. This is primarily due to the different operating temperature ranges of the detector and the optical system, sometimes exceeding 180°C. The primary challenges lie in the difficulty of thermally isolating the optical components from the infrared detector due to their parallel operation across temperature ranges, as well as the optical path position shifts caused by thermal deformation of the complex optomechanical structure and the resulting changes in the mirror surface profile, which can degrade image quality. The key to addressing this challenge lies in a system integration approach, employing a multidisciplinary design approach combining structural, thermal, and optical disciplines. Through effective thermal insulation between the optomechanical system and the surrounding thermal environment, optimized support structure strength and stiffness, flexible heat transfer, optical stray radiation suppression, and low-temperature contamination control of the optical mirror surface, the goal is to reduce cooling losses in the cold optical components, maintain the mechanical stability and structural strength of the optomechanical structure at low temperatures, and eliminate the adverse effects of thermal stress on the optical component surface profile.

[0003] Therefore, in view of the above problems, there is an urgent need in the field of infrared low-temperature optical detection to provide a solution for integrated packaging of infrared detectors and cold optical components. Summary of the Invention

[0004] To address the prominent problems currently facing infrared and low-temperature optical testing systems, the present invention provides an integrated packaging structure for an infrared detector and a cold optical component. The infrared detector and the cold optical component are integrated into a vacuum packaging shell, and a thin-walled structure with high heat transfer resistance, high strength, and high rigidity is used as an insulation support to construct a three-level temperature zone platform. This addresses the requirements for the infrared detector and the cold optical component to operate across temperature zones, with low heat leakage, high structural stability at low temperatures, and high strength. By designing a low-temperature cold shield with a gold-plated and polished outer surface and a high-emissivity nanoparticle spray-coated inner surface, the package shell reduces radiation heat leakage to the infrared detector and cold optical components and effectively suppresses stray radiation entering the optical path from the outside. A package shell structure with adjustable optical window lens position based on a flexible bellows and thin-film heater temperature control circuit is designed, meeting both temperature control and anti-pollution requirements. A low-outgassing temperature control heating circuit based on a ceramic-based packaging process heater is designed to achieve rapid temperature recovery of the cold optical component, effectively saving testing time and also realizing a baking and decontamination heating function when the optical component is contaminated at low temperatures.

[0005] It should be noted that the various features of the integrated packaging structure of the infrared detector and cold optical component involved in the present invention form an organic whole, and each link is indispensable. It not only has the structural and technological characteristics of a single item, but also embodies an integrated innovation.

[0006] To achieve the above object, the present invention adopts the following technical solutions:

[0007] An integrated packaging structure for an infrared detector and a cold optical component includes: an infrared detector component, a cold optical component, a packaging shell, a cold optical refrigerator, a detector refrigerator, a thermal insulation support, and a flexible cold chain. The infrared detector component and the cold optical component are connected via the thermal insulation support, the cold optical component and the packaging shell are connected via the thermal insulation support, the cold optical refrigerator and the cold optical component are connected via the flexible cold chain, the cold optical refrigerator and the packaging shell are flexibly sealed via a metal bellows, the detector refrigerator and the infrared detector component are connected via the flexible cold chain, and the detector refrigerator and the packaging shell are flexibly sealed via the metal bellows.

[0008] Furthermore, by constructing cold platforms in different temperature zones and using thermal insulation supports to connect each cold platform, a three-level temperature zone distribution pattern of 253K packaging shell, 80~220K cold optical components, and 40~50K infrared detector components is achieved.

[0009] Furthermore, the package shell consists of a cavity shell, a window flange, a window lens, a window bellows, a limit support column, a locking screw, a signal lead tray, and a vacuum port. The cavity shell is made of 55% aluminum-based silicon carbide, which has high thermal conductivity, low expansion coefficient, and high rigidity. The window lens position can be adjusted by controlling the compression of the window bellows, and the window lens temperature can be adjusted by a temperature control circuit consisting of a thin film heater and a temperature sensor on the window flange.

[0010] Furthermore, the operating temperature of the infrared detector assembly is 40~50K, and it consists of an infrared detector and a detector mounting plate. The infrared detection signal is transmitted to the signal lead plate on the packaging shell through a low-temperature flexible cable.

[0011] The thermal insulation support preferably has a wall thickness of only 0.5 mm (but is not limited to this thickness, as it depends on the operating environment). Made of epoxy fiberglass cloth using a dedicated mold, it boasts a high thermal resistance of 2500-3000°C / W and a measured bending strength of 2000N (equivalent to a static shear force of 200kg) without breaking. Both the inner and outer surfaces of the thermal insulation support are coated with a gold-plated film with an infrared emissivity of ≤0.03 and a low-temperature resistance of 80K.

[0012] Furthermore, the cold optical assembly is composed of a low-temperature cold shield, a cold optical substrate, cold optical elements, and a temperature-controlled heating circuit. The cold optical assembly can adapt to an operating temperature range of 80-220K.

[0013] Preferably, the low-temperature cold screen adopts a double-sided differentiated surface treatment process, the outer surface adopts a gold-plated polishing process to achieve an infrared emissivity of ≤0.03, and the inner surface is a nano-particle graphene coating with an infrared emissivity of 0.98.

[0014] Preferably, a partitioned surface treatment design scheme for the optical substrate is designed, where the side facing the cold optical element is plated with black nickel, with an infrared emissivity of 0.9, and the remaining surfaces are gold-plated and polished, with an infrared emissivity of ≤0.03.

[0015] Preferably, the heater in the temperature control heating circuit adopts a ceramic packaging process with high resistance density and low outgassing rate, which can work reliably in an 80K environment. A single heater can achieve a resistance of up to 14000Ω / cm 2 High impedance can achieve low-power heating in a limited space, and the maximum heat flux density of a single heater reaches 694W / cm 2 (The allowable heat flux density of conventional aerospace-grade thin film heaters is 1~1.5W / cm 2 ) can achieve large heat flow heating requirements under low outgassing conditions within the effective space. The heater has two mounting holes and is fixed with screws.

[0016] Preferably, the metal bellows is a welded bellows made of titanium alloy material that can achieve high vacuum sealing, and the leakage rate is less than 1×10 -12 Pa·m 3 / s.

[0017] Preferably, the flexible cold chain is a multi-layer graphene film with metallized mounting parts at both ends, and the measured comprehensive thermal conductivity reaches 900W / mk, which is 2.26 times the thermal conductivity of pure copper of the same size.

[0018] Beneficial effects:

[0019] 1. Designed with a wall thickness of only 0.5mm (not limited to this thickness, depending on the operating environment), the high-thermal-resistance, high-strength thermal insulation support is fabricated using epoxy glass fiber cloth through a dedicated mold. This achieves a single support with a heat transfer resistance of 2500-3000°C / W and a measured bending strength of 2000N (equivalent to 200kg of static shear force) without breaking. This not only effectively reduces heat leakage from the package housing to the cold optical components, and from the cold optical components to the infrared detector components, but also ensures the stability of the light machine structure when the infrared detector and cold optical components operate at low temperatures. The high-strength thermal insulation support improves the optical system's adaptability to the complex mechanical environment of rocket launch.

[0020] 2. The cryogenic cold shield is designed with a combination of a gold-plated polished exterior and a nano-particle graphene coating on the interior, achieving an infrared emissivity of ≤0.03 on the exterior and 0.98 on the interior. This effectively reduces radiative heat leakage from the housing (maximum temperature 300K) to the infrared detector (minimum temperature 40K) and the cold optical components (minimum temperature 80K), minimizing the thermal load on the infrared detector and cold optical components. The high-emissivity coating on the interior of the cryogenic cold shield effectively absorbs stray radiation entering the optical path and improves the temperature uniformity of the cold optical components through radiative heat exchange, achieving the dual benefits of reducing cooling resource requirements while ensuring optical system performance.

[0021] 3. It can realize the dual functions of temperature control and pollution prevention for window lenses and cold optical components. Compared with conventional optical heating solutions, this invention adopts aerospace-grade ceramic package heaters that can achieve impedance density, high heat flux density, low outgassing rate and can work reliably in an 80K environment. The single heater is up to 14000Ω / cm 2 High impedance can achieve low-power heating in a limited space. This type of heater also has high heat flux characteristics, with the highest heat flux density reaching 694W / cm 2 (The allowable heat flux density of conventional aerospace-grade thin film heaters is 1~1.5W / cm 2 ), which can meet high heat flux heating requirements within the available space and with low outgassing rates. This design allows for degassing of the cold optical components by heating them at elevated temperatures (typically 40°C) in the event of low-level contamination (conventional thin-film heaters require adhesive fixation, which releases high-molecular-weight condensable volatiles when heated, potentially contaminating optical surfaces at low temperatures). Furthermore, the high heat flux heating circuit within the cold optical components accelerates temperature recovery after optical system testing, improving testing efficiency and saving time and costs. A temperature control circuit, comprised of a thin-film heater and a temperature sensor on the window flange, controls the operating temperature of the window lens and facilitates decontamination baking and heating. While the window temperature is normally maintained at a constant 20°C, if contamination occurs, baking and degassing can be performed by raising the temperature control point (typically 40°C) to remove condensable volatiles deposited on the window lens, eliminating the risk of contamination.

[0022] 4. The integrated packaging structure of the infrared detector and cold optical components involved in the present invention adopts a full metal sealing process, which can achieve 1×10 -6The high vacuum environment within the Pa can operate in both space orbit and atmospheric environments. Specifically, the window lens can be adjusted by adjusting the compression rate of the window bellows, facilitating optical path position correction from the light entrance during testing. This effectively meets the urgent needs of current infrared low-temperature optical detection systems for integrated packaging of infrared detectors and cold optical components, long-term vacuum maintenance in atmospheric environments, high-efficiency cooling, and optical position correction. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a structural diagram of an integrated packaging structure of an infrared detector and a cold optical component of the present invention;

[0024] Figure 2 is a structural diagram of an optical window assembly;

[0025] Figure 3 This is a diagram of the cold optical substrate structure;

[0026] In the figure, the reference numerals are: 1, window flange; 1-1, 1st thin film heater; 1-2, 2nd thin film heater; 1-3, 3rd thin film heater; 1-4, 4th thin film heater; 1-5, locking screw limit hole; 1-6, window temperature sensor; 2, window lens; 3, locking screw; 4, window bellows; 5, limit support column; 6, cavity shell; 7, package shell insulation support; 8, mounting base; 9, cold optical refrigerator bellows; 10, cold optical refrigerator; 11, cold optical refrigerator cold head; 12, cold optical flexible cold chain; 13, cold optical insulation support; 14, low-temperature cold screen; 15, cold optical substrate; 15-1, Class 1A ceramic package heater; 15-2, Class 2A ceramic package heater; 15-3, 3 Class A ceramic package heater; 15-4, Class 4A ceramic package heater; 15-5, Class 5A ceramic package heater; 15-6, Class 1B ceramic package heater; 15-7, Class 2B ceramic package heater; 15-8, Class 3B ceramic package heater; 15-9, Class 4B ceramic package heater; 15-10, Class 5B ceramic package heater; 15-11, Cold optical substrate temperature sensor A; 15-12, Cold optical substrate temperature sensor B; 15-13 Elastic metal sheet; 15-14, Cold optical substrate thermal insulation support mounting interface; 16, Infrared detector assembly thermal insulation support; 17, Detector base; 18, Infrared detector; 19, Infrared detector assembly flexible cold chain; 20, Detector refrigerator cold head; 21, Detector refrigerator; 22, Detector refrigerator bellows; 23, Low-temperature flexible cable; 24, Signal lead tray; 25, Cold optical lens; 26, Vacuum extraction port. DETAILED DESCRIPTION

[0027] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only intended to illustrate the present invention and are not intended to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

[0028] like Figure 1-Figure 3 As shown, this embodiment provides an integrated packaging structure of an infrared detector and a cold optical component, comprising: a packaging shell, a cold optical component, an infrared detector assembly, a cold optical refrigerator, a detector refrigerator, a thermal insulation support, and a flexible cold chain. The infrared detector assembly and the cold optical component are connected via a thermal insulation support, the cold optical component and the packaging shell are connected via a thermal insulation support, the cold optical refrigerator and the cold optical component are connected via a flexible cold chain, the cold optical refrigerator and the packaging shell are flexibly sealed via a metal bellows, the detector refrigerator and the infrared detector assembly are connected via a flexible cold chain, and the detector refrigerator and the packaging shell are flexibly sealed via a metal bellows.

[0029] The package housing includes a window flange 1, a thin film heater, four locking screw limit holes 1-5, window temperature sensors 1-6, a window lens 2, a locking screw 3, a window bellows 4, a limit support column 5, a cavity shell 6, and a vacuum port 26. The window lens 2 is made of ZnSe material and metallized at the edge. The metallized portion is sealed to the window flange 1 using a welding process.

[0030] like Figure 2 As shown, the temperature control and contamination prevention functions of window lens 2 are implemented as follows: the first to fourth thin-film heaters 1-1 to 1-4 are attached to window flange 1 using low-outgassing epoxy adhesive. Since window flange 1 is located outside the package housing, it poses no contamination risk to the low-temperature optical components within. Window temperature sensors 1-6 are also attached to window flange 1 using low-outgassing epoxy adhesive. The second to fourth thin-film heaters 1-2 to 1-4 and window temperature sensors 1-6 together form a temperature control and heating circuit for window lens 2, which functions as both operating temperature control and decontamination baking and heating. The circuit's temperature control point is normally maintained at a constant 20°C. If contamination occurs on window lens 2, the temperature control point can be raised (typically to 40°C) for baking and degassing, removing condensable volatiles deposited on window lens 2 and eliminating the contamination risk. The heating and temperature measurement circuit leads on window flange 1 are both led to the exterior of the package housing via a signal lead tray 24.

[0031] The position adjustment function of the window lens 2 is achieved by inserting four locking screws 3 through four locking screw limiting holes 1-5 and a hollow limiting support column 5, and then threading them into the cavity housing 6. By adjusting the height of the limiting support column 5, the compression of the window bellows 4 can be adjusted, thereby achieving the position adjustment of the window lens and realizing the function of optical path correction during testing.

[0032] There are three sets of thermal insulation supports: enclosure insulation supports 7, cold optics insulation supports 13, and infrared detector assembly insulation supports 16. The enclosure insulation supports 7 are 1mm thick (not limited to this thickness, depending on the operating environment), while the cold optics insulation supports 13 and the infrared detector assembly insulation supports 16 have a wall thickness of only 0.5mm (not limited to this thickness, depending on the operating environment). Each support is made of epoxy fiberglass cloth using a dedicated mold to provide high thermal resistance and strength. This allows for a single support to achieve a thermal resistance of 2500-3000°C / W. Flexural strength of 0.5mm thick supports reaches 2000-2500N (i.e., 200-250kg static shear force) without breaking, and 1mm thick supports reach 3500-4000N (i.e., 350-400kg static shear force) without breaking. It not only effectively reduces the heat leakage from the packaging shell to the cold optical components and from the cold optical components to the infrared detector components, but also ensures the stability of the light machine structure when the infrared detector and the cold optical components work at low temperatures. The high-strength thermal insulation support improves the adaptability of the optical system to the complex mechanical environment during rocket launch.

[0033] There are two flexible cold chains: a cold optical flexible cold chain 12 and an infrared detector assembly flexible cold chain 19. The flexible cold chains consist of multi-layer graphene films with metalized mounting points at both ends. Their measured combined thermal conductivity reaches 900W / mk, which is 2.26 times the thermal conductivity of pure copper of the same size.

[0034] The cold optical assembly comprises a cryogenic cold shield 14, a cold optical substrate 15, and a cold optical lens 25. The cryogenic cold shield 14 and the cold optical substrate 15 are thermally connected via M3 screws (with a 0.1mm thick indium sheet as a pad). The cold optical substrate 15 cools the cryogenic cold shield 14. The cryogenic cold shield 14 utilizes a gold-plated polished exterior surface and a nanoparticle graphene coating on the interior surface, achieving an infrared emissivity of ≤0.03 on the exterior and 0.98 on the interior. This effectively reduces radiative heat leakage from the housing (maximum temperature 300K) to the infrared detector (minimum temperature 40K) and the cold optical assembly (minimum temperature 80K), minimizing the thermal load on the infrared detector and the cold optical assembly. The high-emissivity coating on the interior surface of the cryogenic cold shield effectively absorbs stray radiation entering the optical path and improves the temperature uniformity of the cold optical assembly through radiative heat exchange, achieving the dual benefits of reducing cooling resource requirements while ensuring optical system performance.

[0035] like Figure 3 As shown, the temperature control and contamination prevention functions of the cold optical component are achieved by placing two types of ceramic packaged heaters, A and B, on the cold optical substrate 15. The first through fifth types of ceramic packaged heaters, 15-1 to 15-5, are high-impedance density heaters. The heating circuit formed by the Type A ceramic heaters uses cold optical substrate temperature sensor A (Pt1000 platinum resistance resistor) 15-11 for closed-loop temperature feedback, enabling low-power temperature control of the cold optical component. The first through fifth types of ceramic packaged heaters, 15-6 to 15-10, use cold optical substrate temperature sensor B 15-12 for closed-loop temperature feedback, enabling high heat flux heating during cold optical reheating or baking and degassing. All ceramic packaged heaters are connected to the cold optical substrate 15 with screws, and a 0.1 mm thick indium sheet is placed on the contact surface to enhance heat transfer. Cold optical substrate temperature sensors A and B are installed in recesses reserved on cold optical substrate 15 and secured with elastic metal sheets 15-13. The heating and temperature measurement circuit leads on the cold optical assembly are led out of the enclosure via signal lead tray 24.

[0036] The cold optical substrate 15 has four cold optical substrate thermal insulation support mounting interfaces 15-14 (the number of thermal insulation supports is not limited to this number and depends on the specific usage). The cold optical substrate 15 is connected to the cold optical thermal insulation support 13 using screws, and the cold optical thermal insulation support 13 is connected to the cavity housing 6 using screws.

[0037] The cold optical refrigerator bellows 9 is sealed to the cold optical refrigerator 10 via welding. Silver wire is used to form a metal seal between the cold optical refrigerator bellows 9 and the cavity housing 6, facilitating the long-term vacuum maintenance of the package housing. A 0.1mm thick indium sheet is placed between the cold optical refrigerator cold head 11 and the cold optical flexible cold chain 12, which are then screwed together. A 0.1mm thick indium sheet is placed between the cold optical flexible cold chain 12 and the cold optical substrate 15, which are then screwed together. The 0.1mm thick indium sheet is used to reduce the contact thermal resistance between the contact surfaces, thereby reducing the heat transfer temperature difference within the heat transfer link. The overall configuration of the cold optical flexible cold chain 12 is approximately U-shaped. Measured micro-vibration suppression effects of this cold chain on the cold optical refrigerator cold head can reduce vibration excitation to 1 / 25-1 / 30. Therefore, the cold optical flexible cold chain 12 combines high-efficiency heat transfer with micro-vibration suppression.

[0038] The infrared detector assembly includes a detector base 17, an infrared detector 18, and a cryogenic flexible cable 23. The infrared detector 18 is connected to the detector base 17 with screws, the cryogenic flexible cable 23 is connected to the signal line interface of the detector base 17 with welding, and the other end of the cryogenic flexible cable 23 is connected to the signal lead plate 24 with welding, which transmits the signals collected by the infrared detector to the outside of the package housing.

[0039] The detector refrigerator 21 and the detector refrigerator bellows 22 are sealed by welding, and the detector refrigerator bellows 22 and the cavity shell 6 are connected by screws. A silver wire sealing ring is placed between the contact surfaces. This process can effectively reduce the leakage rate of the package shell and maintain the vacuum for a long time. The detector refrigerator cold head 20 is connected to the infrared detector assembly flexible cold chain 19 by screws, and a 0.1mm thick indium sheet is placed between the contact surfaces to reduce the contact thermal resistance. The infrared detector assembly flexible cold chain 19 is connected to the detector base 17 by screws, and a 0.1mm thick indium sheet is placed between the contact surfaces to reduce the contact thermal resistance. The overall configuration of the infrared detector assembly flexible cold chain 19 is U-shaped. The micro-vibration suppression effect of this cold chain on the cold optical refrigerator cold head can be reduced to 1 / 25~1 / 30. Therefore, the infrared detector assembly flexible cold chain 19 also has the functions of high-efficiency heat transfer and micro-vibration suppression.

[0040] The vacuum is achieved by using a metal sealing process at all connection points of the packaging structure. By connecting the vacuum port 26 to the vacuum unit, the entire packaging structure is evacuated. At the same time, the high heat flux heating circuit on the cold optical substrate 15 is used to heat and bake the cold optical components for degassing, accelerating the degassing of the materials inside the packaging structure, thereby further facilitating the achievement of high vacuum. After the vacuum baking and degassing work is completed, the high vacuum metal sealing valve on the vacuum port is closed, and the vacuum unit is separated from the packaging structure. This allows the packaging structure to operate under a dead vacuum state for a long time. When operating at low temperatures, the vacuum degree can still be maintained at 5×10 -4 Pa high vacuum. Similarly, the packaging structure of the present invention has more obvious advantages in working under active vacuum conditions, and the lowest actual measurement can achieve 1×10 -6 Pa high vacuum environment.

[0041] It will be easily understood by those skilled in the art that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An integrated packaging structure of an infrared detector and a cold optical component, characterized in that: It includes an infrared detector assembly, a cold optical assembly, a packaging shell, a cold optical refrigerator, a detector refrigerator, a thermal insulation support, and a flexible cold chain; the infrared detector assembly and the cold optical assembly are connected through a thermal insulation support, the cold optical assembly and the packaging shell are connected through a thermal insulation support, the cold optical refrigerator and the cold optical assembly are connected through a flexible cold chain, the cold optical refrigerator and the packaging shell are connected through a flexible sealing connection of a metal bellows, the detector refrigerator and the infrared detector assembly are connected through a flexible cold chain, and the detector refrigerator and the packaging shell are connected through a flexible sealing connection of a metal bellows.

2. The integrated packaging structure of infrared detector and cold optical component according to claim 1, characterized in that: It has three working temperature zones, and different temperature zones are connected by thermal insulation supports, realizing parallel operation of three temperature zones: 253K packaging shell, 80~220K cold optical components, and 40~50K infrared detector components.

3. The integrated packaging structure of infrared detector and cold optical component according to claim 1, characterized in that: The packaging shell includes a cavity shell, a window flange, a window lens, a window bellows, a limit support column, a locking screw, a signal lead tray, and a vacuum extraction port; the cavity shell is made of 55% aluminum-based silicon carbide with high thermal conductivity, low expansion coefficient, and high rigidity. The position of the window lens is adjusted by controlling the compression amount of the window bellows, and the temperature of the window lens is adjusted by a temperature control circuit composed of a thin film heater and a temperature sensor on the window flange.

4. The integrated packaging structure of infrared detector and cold optical component according to claim 1, characterized in that: The infrared detector assembly comprises an infrared detector and a detector mounting plate, and the infrared detection signal is transmitted to the signal lead plate on the packaging shell through a low-temperature flexible cable.

5. The integrated packaging structure of infrared detector and cold optical component according to claim 1, characterized in that: The wall thickness of the thermal insulation support is 0.5 mm, but is not limited to this thickness, such as 0.5~2 mm, which is determined by the use environment. It is made of epoxy glass fiber cloth through a special mold, with a heat transfer resistance of up to 2500~3000℃ / W, and the measured bending strength reaches 2000N, that is, 200kg static shear force without being destroyed; the inner and outer surfaces of the thermal insulation support are both pasted with a gold-plated film with an infrared emissivity of ≤0.03 and a low temperature resistance of 80K.

6. The integrated packaging structure of infrared detector and cold optical component according to claim 1, characterized in that: The cold optical assembly includes a low-temperature cold screen, a cold optical substrate, a cold optical element and a temperature-controlled heating circuit; the cold optical assembly is adapted to an operating temperature range of 80~220K.

7. The integrated packaging structure of infrared detector and cold optical component according to claim 6, characterized in that: The low-temperature cold screen adopts a double-sided differentiated surface treatment process, the outer surface adopts a gold-plated polishing process to achieve an infrared emissivity of ≤0.03, and the inner surface is a nano-particle graphene coating with an infrared emissivity of 0.

98.

8. An integrated packaging structure of an infrared detector and a cold optical component according to claim 6, characterized in that: The cold optical substrate adopts a zoned differentiated surface treatment process, with the side facing the cold optical element plated with black nickel, with an infrared emissivity of 0.9, and the remaining surfaces plated with gold and polished, with an infrared emissivity of ≤0.

03.

9. An integrated packaging structure of an infrared detector and a cold optical component according to claim 6, characterized in that: The heater in the temperature control heating circuit adopts a ceramic packaging process with high resistance density and low outgassing rate. It can work reliably in an 80K environment. A single heater can achieve up to 14000Ω / cm 2 High impedance enables low-power heating in a limited space, and the maximum heat flux density of a single heater reaches 694W / cm 2 , achieving large heat flow heating under low outgassing conditions, meeting the system's temperature recovery and baking, decontamination and degassing requirements. The heater has two mounting holes and is fixed with screws.

10. The integrated packaging structure of infrared detector and cold optical component according to claim 5, characterized in that: The flexible cold chain is a multi-layer graphene film structure with metallized mounting parts at both ends, and the measured comprehensive thermal conductivity reaches 900W / mk.