Fixing jig and machining apparatus

Abstract

This application provides a fixing fixture and processing equipment, relating to the field of material processing, and solves the technical problem that rigid clamping methods can easily damage products during machining. The fixing fixture includes: a support component having at least one receiving space and a first opening connecting the receiving space to the outside, the first opening facing upwards; shape memory alloy particles disposed in the receiving space and extending from the first opening, so that the shape memory alloy particles support the product. The shape memory alloy particles can deform at the processing temperature to conform to the shape of the product after thermal expansion, thereby reducing the pressure of the shape memory alloy particles on the deformed product and lowering the risk of coating damage and substrate deformation.

Description

Technical Field

[0001] This application relates to the field of materials processing, specifically to a fixing fixture and processing equipment. Background Technology

[0002] Currently, products with chemical vapor deposition (CVD) coatings, such as silicon carbide (SiC), silicon nitride (Si3N4), aluminum oxide (Al3O2), and tantalum carbide (TaC), are widely used in aerospace, energy equipment, and other fields due to their high hardness, high temperature resistance, and corrosion resistance.

[0003] In related technologies, traditional fixtures often use rigid clamping to fix products. Rigid clamping leads to stress concentration in the product (e.g., a stress concentration factor as high as 3.2), far exceeding the fracture strength of CVD coatings (e.g., 300 MPa), and also causes microcracks at the interface between the coating and the substrate (the crack propagation depth is measured to be approximately 5 μm to 20 μm). Furthermore, traditional fixtures have a large mismatch rate in their coefficients of thermal expansion with the coating (e.g., the coefficient of thermal expansion of steel fixtures is 12 × 10⁻⁶). / K, the coefficient of thermal expansion of the SiC coating is 4.7×10. When the processing temperature rises to 120℃ (with a mismatch rate greater than 150%), significant thermal stress (typically greater than 180 MPa) is generated between the fixture and the product, resulting in large deviations in the flatness of the product (e.g., 0.08 mm to 0.15 mm). Therefore, traditional rigid clamping methods are prone to product damage, leading to a low product yield. Rework of the product would also incur high costs. Summary of the Invention

[0004] To address the aforementioned technical problems, this application is proposed. Embodiments of this application provide a fixing fixture and processing equipment.

[0005] In a first aspect, one embodiment of this application provides a fixing fixture, comprising: a support component having at least one receiving space and a first opening communicating with the receiving space to the outside, the first opening facing upwards; shape memory alloy particles disposed in the receiving space and extending out from the first opening, such that the shape memory alloy particles support the product, the shape memory alloy particles being deformable at the process temperature to conform to the shape of the product after thermal expansion.

[0006] In some embodiments, the shape of the horizontal cross-section of the accommodating space includes: a polygon.

[0007] In some embodiments, the fixing fixture further includes: a cover plate having a central region and an edge region, the central region having a second opening and the bottom of the edge region having an induction groove, wherein the cover plate can be positioned above the product when the shape memory alloy carries the product, and the second opening is configured to expose the processing area of ​​the product; and at least one clamping assembly, which is positioned around the cover plate when the cover plate is positioned above the product, and the clamping assembly is capable of applying downward pressure to the edge region to fix the product.

[0008] In some embodiments, the clamping assembly includes: a driving unit; a clamping unit, drivenly connected to the driving unit, configured to move vertically under the drive of the driving unit to apply downward pressure to an edge region, or to move away from the edge region; wherein the fixing fixture further includes: at least one pressure sensor disposed at the bottom of the receiving space and below the shape memory alloy particles, configured to detect the current pressure applied by the clamping unit to the edge region; a controller, communicatively connected to the pressure sensor and the driving unit, configured to receive the current pressure sent by the pressure sensor, and when the current pressure does not meet a preset pressure range, send a pressure control signal to the driving unit so that the driving unit controls the movement of the clamping unit based on the pressure control signal.

[0009] In some embodiments, the support assembly includes: a base having a cavity; a support frame disposed on the upper side of the base, the support frame having at least one receiving space and a first opening communicating the receiving space with the outside; wherein, the fixing fixture further includes: a cooling pipe disposed in the cavity, the inlet and outlet of the cooling pipe being respectively connected to a cooling device, the cooling device being configured to provide cooling gas to the inlet, the cooling gas being able to pass through the cooling pipe, return to the cooling device from the outlet, be cooled by the cooling device, and then be provided to the inlet by the cooling device.

[0010] In some embodiments, the fixing fixture further includes: a temperature sensor disposed at the bottom of the receiving space and below the shape memory alloy particles, the temperature sensor being configured to detect the current temperature of the shape memory alloy particles; and a controller communicatively connected to the temperature sensor and the cooling device, configured to receive the current temperature sent by the temperature sensor and, when the current temperature does not meet a preset temperature range, send a temperature control signal to the cooling device so that the cooling device adjusts the flow rate of the cooling gas supplied to the inlet based on the temperature control signal.

[0011] In some embodiments, the fixing fixture further includes a buffer structure disposed below the support assembly and configured to absorb the vibration energy of the support assembly.

[0012] In some embodiments, the material of the buffer structure includes silica aerogel.

[0013] In a second aspect, one embodiment of this application provides a processing apparatus, comprising: a fixture according to any one of the first aspects above, wherein shape memory alloy particles of the fixture are configured to support a product; and a cutting device configured to cut the processing area of ​​the product.

[0014] In some embodiments, the cutting device includes: a drive mechanism; and a cutting tool, drivenly connected to the drive mechanism, wherein the drive mechanism is capable of driving the cutting tool to move so that the cutting tool cuts the processing area of ​​the product, and the cutting tool generates a first vibration when cutting the processing area of ​​the product; wherein the processing device further includes: a piezoelectric ceramic brake disposed on the cutting tool, the piezoelectric ceramic brake being capable of generating a second vibration to attenuate the first vibration of the cutting tool, wherein the direction of the first vibration is collinear with the direction of the second vibration, the frequency of the first vibration is the same as the frequency of the second vibration, the amplitude of the first vibration is the same as the amplitude of the second vibration, and the phase of the first vibration is opposite to the phase of the second vibration.

[0015] The fixture and processing equipment proposed in this application, by incorporating shape memory alloy particles, can support the product. Furthermore, after the product expands due to heat, the shape memory alloy particles can deform at the processing temperature to conform to the shape of the expanded product. This reduces the pressure exerted by the shape memory alloy particles on the deformed product, lowering the risk of coating damage and substrate deformation, increasing yield, reducing rework rates, and thus lowering costs. Additionally, the shape memory alloy particles can absorb processing vibration energy, improving processing quality. Attached Figure Description

[0016] The above and other objects, features, and advantages of this application will become more apparent from the more detailed description of the embodiments of this application in conjunction with the accompanying drawings. The drawings are provided to further illustrate the embodiments of this application and form part of the specification. They are used together with the embodiments of this application to explain this application and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same components or steps.

[0017] Figure 1 The diagram shown is a structural schematic of a product.

[0018] Figure 2 The diagram shown is a structural schematic of the product and fixing fixture provided in an exemplary embodiment of this application.

[0019] Figure 3 The image shown is a top view of the product and fixing fixture provided in an exemplary embodiment of this application.

[0020] Figure 4 The image shown is an exemplary embodiment of this application. Figure 3 The product and fixture shown are cross-sectional views along the BB direction.

[0021] Figure 5 The image shown is an exemplary embodiment of this application. Figure 4 The product and fixture shown are enlarged views of a portion of area A.

[0022] Figure 6 The diagram shown is a structural schematic of a support frame provided in an exemplary embodiment of this application.

[0023] Figure 7 The image shown is a bottom view of a cover plate provided in an exemplary embodiment of this application.

[0024] Figure 8 The diagram shown is a schematic diagram of the processing equipment provided in an exemplary embodiment of this application.

[0025] Figure label:

[0026] 100. Product; 101. Substrate; 102. Coating; 200. Fixture; 201. Support assembly; 2011. Accommodation space; 2012. Base; 2013. Support frame; 202. Shape memory alloy particles; 203. Cover plate; 2031. Central area; 2032. Edge area; 20321. Induction groove; 204. Clamping assembly; 2041. Drive unit; 2042. Clamping unit; 205. Cooling pipe; 2051. Inlet; 2052. Outlet; 206. Wiring of temperature sensor; 300. Processing equipment; 400. Cutting device. Detailed Implementation

[0027] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0028] Figure 1 The diagram shown is a structural schematic of a product.

[0029] like Figure 1 As shown, product 100 includes a substrate 101 and a coating 102, with the coating 102 located on both sides of the substrate 101. The coating material includes silicon carbide (SiC), silicon nitride (Si3N4), alumina (Al3O2), or tantalum carbide (TaC), and the substrate material includes graphite, C / C composite materials, sintered SiC, etc. The fixing fixture 200 provided in this embodiment is used to fix product 100 during machining.

[0030] Figure 2The diagram shown is a structural schematic of the product and fixing fixture provided in an exemplary embodiment of this application. Figure 3 The image shown is a top view of the product and fixing fixture provided in an exemplary embodiment of this application. Figure 4 The image shown is an exemplary embodiment of this application. Figure 3 The product and fixture shown are sectional views along the BB direction. Figure 5 The image shown is an exemplary embodiment of this application. Figure 4 The product and fixture shown are enlarged views in area A. Figure 6 The diagram shown is a structural schematic of a support frame provided in an exemplary embodiment of this application.

[0031] like Figures 2-6 As shown, this application embodiment provides a fixing fixture 200, which includes a support component 201 and shape memory alloy particles 202. The support component 201 has at least one receiving space 2011 and a first opening communicating with the receiving space 2011 to the outside, the first opening facing upwards. The shape memory alloy particles 202 are disposed in the receiving space 2011 and extend out of the first opening, so that the shape memory alloy particles 202 support the product. The shape memory alloy particles 202 can deform at the process temperature to conform to the shape of the product after thermal expansion.

[0032] The shape memory alloy particles 202 are slightly higher than the support component 201 so that the product 100 is completely supported by the shape memory alloy particles 202.

[0033] For example, such as Figure 6 As shown, there are multiple storage spaces 2011, arranged in m rows, where m is an integer greater than 1, and each row has at least one storage space 2011. For example, each storage space 2011 contains one or more shape memory alloy particles 202.

[0034] For example, the shape memory alloy particles 202 are nickel-titanium alloys (i.e., Ni-Ti alloys). Using this material, the stiffness of the shape memory alloy particles 202 can be reduced by 60% at 300°C, effectively absorbing processing vibration energy and reducing the amplitude of the product 100 by 72%.

[0035] In the above embodiments, by incorporating shape memory alloy particles 202, the product 100 can be supported. Furthermore, after the product 100 expands due to heat, the shape memory alloy particles 202 can deform at the process temperature to conform to the shape of the expanded product 100. This reduces the pressure exerted by the shape memory alloy particles 202 on the deformed product 100, lowering the risk of damage to the coating 102 (cracking rate reduced to ≤0.8%) and deformation of the substrate 101. This improves the yield (scrap rate reduced to ≤1.5%, compared to 12%~18% using traditional fixtures 200), reduces the proportion of rework of the product 100, and thus lowers costs. Additionally, by incorporating shape memory alloy particles 202, processing vibration energy can be absorbed, improving processing quality.

[0036] In some embodiments, such as Figure 6 As shown, the shape of the horizontal cross-section of the accommodating space 2011 includes: a polygon.

[0037] For example, the shape of the horizontal cross-section of the accommodating space 2011 is pentagonal, hexagonal, heptagonal, etc.

[0038] In the above embodiments, by making the shape of the horizontal cross section of the accommodating space 2011 polygonal, especially with five or more sides, the accommodating space 2011 can have a larger space to hold alloy particles. Furthermore, by making the shape of the horizontal cross section of the accommodating space 2011 polygonal, rather than circular, elliptical, etc., the accommodating space 2011 can have more angled areas, allowing the alloy particles 202 to have more space to extend when deformed at high temperatures.

[0039] Figure 7 The image shown is a bottom view of a cover plate provided in an exemplary embodiment of this application.

[0040] In some embodiments, such as Figures 2-4 and Figure 7 As shown, the fixing fixture 200 further includes a cover plate 203 and at least one clamping assembly 204. The cover plate 203 has a central region 2031 and an edge region 2032. The central region 2031 has a second opening, and the bottom of the edge region 2032 has an induction groove 20321. When the shape memory alloy carries the product, the cover plate 203 can be positioned above the product, and the second opening is configured to expose the processing area of ​​the product. When the cover plate 203 is positioned above the product, the clamping assembly 204 is positioned around the cover plate 203, and the clamping assembly 204 can apply downward pressure to the edge region 2032 to fix the product 100.

[0041] For example, the guide groove 20321 includes two groove walls, the bottom of the two groove walls are connected, and the distance between the two groove walls gradually increases from bottom to top. The guide groove 20321 with this structure has high strength and is not easily damaged.

[0042] For example, the depth of the induction groove 20321 is 0.15 mm.

[0043] For example, the included angle between the two tank walls is 45°±1°.

[0044] For example, there are multiple induction grooves 20321, and the distance between two adjacent induction grooves 20321 is 8 mm (calculated by finite element simulation).

[0045] For example, there are four clamping components 204.

[0046] In the above embodiments, by providing the cover plate 203, direct contact between the clamping assembly 204 and the coating 102 of the product 100 can be avoided, reducing the risk of damage to the coating 102. By providing the guiding groove 20321, the cover plate 203 can easily deform when it is pressed against the coating 102, thereby reducing the compressive force of the cover plate 203 on the coating 102 and reducing the risk of cracking due to mutual compression between the coating 102 and the cover plate 203. Actual testing shows that by providing the guiding groove 20321, the stress peak of the product 100 can be greatly reduced, thereby effectively preventing damage to the product 100.

[0047] In some embodiments, such as Figure 4 As shown, the clamping assembly 204 includes a driving unit 2041 and a clamping unit 2042. The clamping unit 2042 is drivenly connected to the driving unit 2041 and is configured to move vertically under the drive of the driving unit 2041 to apply downward pressure to the edge region 2032, or to move away from the edge region 2032. The fixing fixture 200 further includes at least one pressure sensor and a controller. The pressure sensor is disposed at the bottom of the receiving space 2011 and below the shape memory alloy particles 202, and is configured to detect the current pressure applied by the clamping unit 2042 to the edge region 2032. The controller is communicatively connected to the pressure sensor and the driving unit 2041, and is configured to receive the current pressure sent by the pressure sensor, and when the current pressure does not meet a preset pressure range, send a pressure control signal to the driving unit 2041, so that the driving unit 2041 controls the movement of the clamping unit 2042 based on the pressure control signal.

[0048] For example, the drive unit 2041 includes a hydraulic drive device, such as a hydraulic cylinder.

[0049] For example, there are multiple clamping parts 2042 and multiple pressure sensors. Each clamping part 2042 is provided in a one-to-one correspondence with a pressure sensor. Each pressure sensor is located below the corresponding clamping part 2042 and is configured to detect the current pressure applied by the corresponding clamping part 2042 to the edge region 2032.

[0050] For example, the controller can calculate a pressure compensation value based on the current pressure and a preset pressure range, and then control the drive unit 2041 based on the pressure compensation value to adjust the pressure applied by the clamping unit 2042 to the edge region 2032.

[0051] Traditional fixtures use rigid clamping to hold products, resulting in clamping force fluctuations exceeding 15% during processing, which can easily lead to product damage and deformation. In the above embodiment, this structure offers the following advantages: First, it allows for precise control of the pressure applied to the product 100 by the clamping component 204, preventing excessive pressure that could damage the coating 102 or deform the substrate 101 (reducing the deformation rate of the product 100 to 0.05% or less, whereas traditional fixtures can cause a deformation rate ≥2%). Second, it prevents insufficient pressure from causing the product 100 to be loosely fixed and move during the process. Third, because the pressure can be dynamically adjusted, even under high-temperature environments where the product 100 deforms more significantly, the pressure can be adaptively adjusted (under high-temperature environments, due to the expansion of both the fixture 200 and the product 100, without adjustment, the pressure exerted by the clamping part 2042 on the product 100 would be excessive; after adjustment, the pressure can decrease by ≥40% with the temperature rise, ensuring the current pressure meets the preset pressure range). Therefore, the product 100 can withstand a 200℃ processing environment, meeting the high-speed cutting requirements (high-speed cutting leads to higher processing temperatures). Fourth, it ensures that the pressure exerted by multiple clamping parts 2042 on the coating 102 is consistent, resulting in uniform stress on the surface of the coating 102 (error ≤±5%), reducing the risk of cracking of the coating 102. Fifth, it is compatible with processing irregularly shaped products 100 with CVD coating thicknesses ranging from 50 μm to 300 μm.

[0052] In some embodiments, such as Figures 2-6As shown, the support assembly 201 includes a base 2012 and a support frame 2013. The base 2012 has a cavity. The support frame 2013 is disposed on the upper side of the base 2012, and the support frame 2013 has at least one receiving space 2011 and a first opening connecting the receiving space 2011 to the outside. The fixing fixture 200 further includes a cooling pipe 205, which is disposed in the cavity (located below the support frame 2013). The inlet 2051 and outlet 2052 of the cooling pipe 205 are respectively connected to a cooling device. The cooling device is configured to provide cooling gas to the inlet 2051. The cooling gas can pass through the cooling pipe 205, return to the cooling device from the outlet 2052, be cooled by the cooling device, and then be supplied to the inlet 2051 by the cooling device.

[0053] For example, the support frame 2013 is made of silicon nitride ceramic. Silicon nitride ceramic has relatively stable chemical properties, will not contaminate the product, and is heat resistant up to 1600°C.

[0054] For example, the cooling gas includes nitrogen.

[0055] For example, the temperature range of the cooling gas is -20°C to 25°C.

[0056] Product 100 generates high temperatures during machining (such as cutting, grooving, grinding, drilling, etc.). Because the coating 102 and the substrate 101 expand due to heat, and their coefficients of thermal expansion differ significantly (e.g., a difference of 6.5 times), the coating 102 is prone to cracking and peeling. In the above embodiment, by providing a cooling pipe 205, the shape memory alloy particles 202 can be cooled, thereby cooling the product 100 in contact with the particles 202. This reduces the risk of damage to the product 100 due to the large difference in thermal expansion between the coating 102 and the substrate 101 (which would lead to high internal thermal stress in the product 100). Furthermore, the cooling gas is recycled, saving cooling gas and reducing costs. Tests have shown that nitrogen circulation cooling can save 60% of energy. In addition, by cooling the fixture 200, the service life of the fixture 200 can be increased, making the mold usable for ≥500,000 cycles (the usable cycle of traditional fixtures is ≤200,000 cycles), and the wear-resistant coating of the fixture 200 can be extended by 3 times.

[0057] In some embodiments, the fixing fixture 200 further includes: a temperature sensor ( Figure 3The wiring diagram (206) of the temperature sensor and the controller are shown. The temperature sensor is located at the bottom of the receiving space 2011 and below the shape memory alloy particles 202. The temperature sensor is configured to detect the current temperature of the shape memory alloy particles 202. The controller is communicatively connected to the temperature sensor and the cooling device, and is configured to receive the current temperature sent by the temperature sensor. When the current temperature does not meet a preset temperature range, the controller sends a temperature control signal to the cooling device, causing the cooling device to adjust the flow rate of the cooling gas supplied to the inlet 2051 based on the temperature control signal.

[0058] For example, when the current temperature is below a preset temperature range, the cooling device can reduce the flow rate of the cooling gas supplied to the inlet 2051, and when the current temperature is above the preset temperature range, the cooling device can increase the flow rate of the cooling gas supplied to the inlet 2051.

[0059] For example, by using a proportional-integral-derivative (PID) algorithm, the current temperature, and a preset temperature range, the optimal cooling rate (e.g., 5 ℃ / min ~ 15 ℃ / min) can be calculated, and the flow rate of the cooling gas can be calculated based on the optimal cooling rate.

[0060] For example, the temperature sensor has an accuracy range of ±0.5 °C.

[0061] In the above embodiments, by setting a temperature sensor and a controller, the flow rate of the cooling gas can be dynamically adjusted so that the current temperature of the shape memory alloy particles 202 meets the preset temperature range (the temperature difference between the current temperature and the preset temperature range can be controlled within ±1 ℃). This keeps the temperature of the product 100 within a reasonable range, avoids the product 100 from being too hot, and thus avoids damage to the product 100 due to the large difference in thermal expansion between the coating 102 and the substrate 101. It also avoids the coating 102 from failing due to excessively high local temperature.

[0062] In some embodiments, a TaC transition layer may be added between the substrate 101 and the coating 102, the coefficient of thermal expansion of the TaC transition layer being approximately 7.4 × 10⁻⁶. / ℃, by setting a TaC transition layer, the coefficient of thermal expansion of each layer in product 100 can be gradually changed, and the thermal expansion mismatch rate can be reduced from 6.5 times to 1.2 times, thereby reducing the thermal stress between adjacent layers of product 100 (experiments show that the stress can be reduced by 58%).

[0063] In some embodiments, the fixing fixture 200 further includes a buffer structure. The buffer structure is disposed below the support assembly 201 and is configured to absorb the vibration energy of the support assembly 201.

[0064] In the above embodiments, by setting a buffer structure to absorb the vibration energy of the support component 201, the vibration of the product 100 and the fixed fixture 200 can be reduced, thereby enabling the processing device (such as a grooving device, grinding device, drilling device or cutting device mentioned below) to accurately process the product 100, thereby reducing the flatness of the product 100 (making the flatness ≤0.03mm / m).

[0065] In some embodiments, the material of the buffer structure includes silica aerogel.

[0066] For example, the density of silica aerogel is 120 kg / m³, and the vibration absorption efficiency is 85%.

[0067] In the above embodiments, by setting a buffer structure of silica aerogel material, the high-frequency vibration of product 100 and fixture 200 can be effectively reduced.

[0068] In some embodiments, the fixture 200 can be modularly designed to enable it to quickly adapt to different processing scenarios (such as turning and grinding), reducing equipment modification costs by more than 40%.

[0069] During processing, the peeling rate of coating 102 reached as high as 12.7%, mainly due to insufficient adhesion between coating 102 and substrate 101 (interfacial shear strength <20 MPa) and surface porosity defects (such as vacuum adsorption causing the pores of porous coating 102 to become interconnected, increasing porosity by 3%~5%). To solve this problem, plasma activation pretreatment and nanoparticle densification technology can also be performed on product 100.

[0070] Specifically, the plasma activation pretreatment includes: bombarding the surface of coating 102 with argon (Ar) plasma (power 500 W, time 30 s) before placing the product on the fixture 200, reducing the surface roughness Ra of coating 102 from 1.2 μm to 0.4 μm and increasing the interfacial shear strength to 35 MPa. The nanoparticle densification technology includes: adding 10 wt% nanoparticles (such as nanoparticles with a particle size of 50 nm, or nano-SiC particles) when preparing coating 102 by CVD deposition on substrate 101, which can reduce the porosity of coating 102 from 8% to 1.5% and increase the compressive strength to 450 MPa. Combined with the induction groove 20321 in the aforementioned embodiment, the stress peak of product 100 can be reduced to below 40% of the substrate yield strength.

[0071] In practical applications, the following steps one through four can be performed to adjust the processing environment of product 100 in real time.

[0072] Step 1: Place product 100 on shape memory alloy particles 202.

[0073] Step 2: The controller controls the drive unit 2041 to drive the clamping unit 2042 to apply initial pressure (e.g., 0.5 MPa to 1.2 MPa) to the edge area 2032 of the cover plate.

[0074] Step 3: The pressure sensor monitors the current pressure applied by the clamping part 2042 to the edge region 2032 in real time. The controller receives the current pressure sent by the pressure sensor in real time, and when the current pressure does not meet the preset pressure range, it sends a pressure regulation signal to the drive part 2041 so that the drive part 2041 controls the movement of the clamping part 2042 based on the pressure regulation signal.

[0075] Step 4: The temperature sensor monitors the current temperature of the shape memory alloy particles 202 in real time. The controller receives the current temperature sent by the temperature sensor and sends a temperature control signal to the cooling device when the current temperature does not meet the preset temperature range, so that the cooling device adjusts the flow rate of the cooling gas supplied to the inlet 2051 based on the temperature control signal.

[0076] Steps three and four can be performed simultaneously.

[0077] Figure 8 The diagram shown is a schematic diagram of the processing equipment provided in an exemplary embodiment of this application.

[0078] Based on the same concept, such as Figure 8 As shown in the embodiments, this application also provides a processing apparatus 300, which includes a fixing fixture 200 and a cutting device 400 as described in the above embodiments. The shape memory alloy particles 202 of the fixing fixture 200 are configured to support the product 100. The cutting device 400 is configured to cut the processing area of ​​the product 100.

[0079] In some embodiments, the cutting device 400 includes a drive mechanism and a cutting tool. The cutting tool is drivenly connected to the drive mechanism, wherein the drive mechanism is capable of driving the cutting tool to move so that the cutting tool cuts the processing area of ​​the product 100, and the cutting tool generates a first vibration when cutting the processing area of ​​the product 100. The processing device 300 further includes a piezoelectric ceramic brake disposed on the cutting tool, the piezoelectric ceramic brake being capable of generating a second vibration to attenuate the first vibration of the cutting tool, wherein the direction of the first vibration is collinear with the direction of the second vibration, the frequency of the first vibration is the same as the frequency of the second vibration, the amplitude of the first vibration is the same as the amplitude of the second vibration, and the phase of the first vibration is opposite to the phase of the second vibration.

[0080] For example, the tool has a clamping end and a cutting end, a drive mechanism is connected to the clamping end, the cutting end is configured to cut the machining area of ​​the product 100, and a piezoelectric ceramic brake is mounted on the clamping end.

[0081] For example, the piezoelectric ceramic actuator has a frequency of 20 kHz and an amplitude of 2 μm.

[0082] For example, the adaptive feed rate of the cutting device 400 is 550 mm / min.

[0083] Because the high-frequency vibration (50 Hz ~ 200 Hz) of the cutting tool cannot be absorbed by the damping of traditional fixtures, the amplitude of the vibration in the edge area of ​​the product can reach 40 μm ~ 60 μm, which deteriorates the surface roughness of the coating 102, such as causing the surface roughness Ra of the coating 102 to exceed 5 μm. In the above embodiment, by setting a piezoelectric ceramic actuator, the tool vibration can be effectively reduced, and the surface roughness Ra of the coating 102 can be stabilized at 0.8 μm ~ 1.2 μm (the surface roughness Ra of the traditional process is greater than 5 μm). At the same time, combined with the buffer structure in the aforementioned embodiment, the surface roughness of the coating 102 can be reduced more effectively.

[0084] In summary, because the embodiments of this application can ensure the processing quality of product 100 from multiple aspects such as automatically adjusting temperature, automatically adjusting pressure, reducing tool size, fixing fixture 200, and controlling the amplitude of product 100 vibration, product 100 can achieve high flatness through a single cutting device 400. Traditional processing equipment, unable to control product 100 deformation and vibration during cutting, requires multiple processing adjustments (single-piece processing time exceeding 30 minutes) to produce a qualified product 100. Therefore, the efficiency of the processing equipment 300 in the embodiments of this application can be improved by 50% to 100%.

[0085] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0086] The block diagrams of devices, apparatuses, devices, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0087] It should also be noted that in the apparatus, equipment, and methods of this application, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions of this application.

[0088] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of this application. Therefore, this application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0089] The above description has been given for illustrative and descriptive purposes. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A fixing fixture, characterized in that, include: A support component having at least one receiving space and a first opening connecting the receiving space to the outside, the first opening facing upwards; Shape memory alloy particles are disposed in the receiving space and extend from the first opening to support the product. The shape memory alloy particles are deformable at the process temperature to conform to the shape of the product after thermal expansion. The shape of the horizontal cross-section of the receiving space includes polygons. A cover plate having a central region and an edge region, the central region having a second opening and the bottom of the edge region having an induction groove, wherein the cover plate can be positioned above the product when the shape memory alloy carries the product, and the second opening is configured to expose the processing area of ​​the product; At least one clamping assembly, when the cover plate is disposed above the product, the clamping assembly is disposed around the cover plate, the clamping assembly being capable of applying downward pressure to the edge region to secure the product; The clamping assembly includes: Drive unit; The clamping part, which is driven to be connected to the driving part, is configured to move in a vertical direction under the drive of the driving part to apply downward pressure to the edge region, or to move away from the edge region; The fixing fixture further includes: At least one pressure sensor, disposed at the bottom of the receiving space and below the shape memory alloy particles, is configured to detect the current pressure applied by the clamping portion to the edge region; The controller, which is communicatively connected to the pressure sensor and the drive unit, is configured to receive the current pressure sent by the pressure sensor, and when the current pressure does not meet a preset pressure range, send a pressure control signal to the drive unit so that the drive unit controls the movement of the clamping part based on the pressure control signal.

2. The fixing fixture according to claim 1, characterized in that, The support components include: The base has a cavity; A support frame is disposed on the upper side of the base, the support frame having at least one receiving space and a first opening communicating the receiving space with the outside; The fixing fixture further includes: A cooling pipe is disposed in the cavity. The inlet and outlet of the cooling pipe are respectively connected to a cooling device. The cooling device is configured to provide cooling gas to the inlet. The cooling gas can pass through the cooling pipe, return to the cooling device from the outlet, be cooled by the cooling device, and then be provided to the inlet by the cooling device.

3. The fixing fixture according to claim 2, characterized in that, The fixing fixture also includes: A temperature sensor is disposed at the bottom of the receiving space and below the shape memory alloy particles, and the temperature sensor is configured to detect the current temperature of the shape memory alloy particles; The controller, which is communicatively connected to the temperature sensor and the cooling device, is configured to receive the current temperature sent by the temperature sensor, and when the current temperature does not meet a preset temperature range, send a temperature control signal to the cooling device so that the cooling device adjusts the flow rate of the cooling gas supplied to the inlet based on the temperature control signal.

4. The fixing fixture according to any one of claims 1 to 3, characterized in that, Also includes: A buffer structure, disposed below the support assembly, is configured to absorb the vibrational energy of the support assembly.

5. The fixing fixture according to claim 4, characterized in that, The materials of the buffer structure include: Silica aerogel.

6. A processing device, characterized in that, include: The fixation fixture according to any one of claims 1 to 5, wherein the shape memory alloy particles of the fixation fixture are configured as a support product; The cutting device is configured to cut the processing area of ​​the product.

7. The processing equipment according to claim 6, characterized in that, The cutting device includes: Drive mechanism; A cutting tool is driven and connected to the drive mechanism, wherein the drive mechanism can drive the cutting tool to move so that the cutting tool cuts the processing area of ​​the product, and the cutting tool generates a first vibration when cutting the processing area of ​​the product; The processing equipment also includes: A piezoelectric ceramic brake is disposed on the cutting tool. The piezoelectric ceramic brake is capable of generating a second vibration to weaken the first vibration of the cutting tool. The direction of the first vibration is collinear with the direction of the second vibration, the frequency of the first vibration is the same as the frequency of the second vibration, the amplitude of the first vibration is the same as the amplitude of the second vibration, and the phase of the first vibration is opposite to the phase of the second vibration.

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