Spiral vacuum structure for cooling vacuum cavity and cooling system

Abstract

The invention discloses a spiral vacuum structure for cooling a vacuum cavity, which comprises an outer-layer shell, the outer-layer shell is sleeved outside the vacuum cavity in a clearance fit manner, and a vacuum interlayer independent of the inner space of the vacuum cavity is formed between the outer-layer shell and the vacuum cavity. Spiral flow guide ribs arranged around the vacuum cavity are arranged in the vacuum interlayer and divide the vacuum interlayer into a continuous spiral flow channel, and a cooling medium inlet communicated with the spiral flow channel is formed in the position, at an inlet of the spiral flow channel, of the wall of the outer layer shell. And a cooling medium outlet communicated with the spiral flow channel is formed in the wall of the outer shell at the outlet of the spiral flow channel. The cooling device has the advantages that the heat exchange efficiency can be improved, cooling is rapid and uniform, and the process vacuum degree of the vacuum cavity is not affected during cooling.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing equipment, in particular to a vacuum cooling device for semiconductor processing equipment. Background Art

[0002] A vacuum chamber is a sealed container used to create and maintain a vacuum environment and is a crucial component of semiconductor processing equipment. During semiconductor manufacturing, it provides the vacuum environment required for processes such as thin film deposition, etching, and ion implantation.

[0003] In the semiconductor manufacturing process, cooling the vacuum chamber is a crucial step. The main functions of cooling the vacuum chamber are: (1) Ensure process stability: Many semiconductor processes (such as etching, thin film deposition, and ion implantation) must operate within specific temperature windows. These processes inherently generate significant heat. Without proper vacuum chamber cooling, the chamber temperature will continue to rise, causing process parameters (such as reaction rates, etch rates, deposition rates, film stress, film composition, and structure) to drift. This can make process results unpredictable and inconsistent, severely impacting chip yield and performance. Therefore, vacuum chamber cooling is essential during semiconductor manufacturing to maintain process stability.

[0004] (2) Extend equipment life: Because vacuum chambers rely on various seals to maintain a high vacuum, these seals can age, harden, deform, or even decompose under sustained high temperatures, leading to vacuum leaks and damaging the process environment. Therefore, cooling the vacuum chamber is essential during semiconductor manufacturing to extend the life of the seals.

[0005] (3) Protect the safety of operators and equipment: When semiconductor processing equipment is in operation, the surface temperature of the vacuum chamber can reach very high temperatures (far exceeding the safe touch temperature). Cooling ensures that the outer wall temperature of the chamber remains within a safe range, preventing burns to operators. It also prevents damage to the equipment casing or surrounding components due to overheating.

[0006] There are two main traditional vacuum chamber cooling methods: (1) External water cooling: Water cooling pipes are set on the outer wall of the vacuum chamber to cool it down by circulating cooling water; however, this cooling method has problems such as low heat exchange efficiency, uneven cooling, and easy scaling of the pipes.

[0007] (2) Internal gas cooling: Inert cooling gas is introduced into the vacuum chamber. However, this cooling method may pollute the process environment and affect the vacuum degree.

[0008] Therefore, there is an urgent need to design a cooling solution with high heat exchange efficiency, fast and uniform cooling, and no impact on the vacuum degree of the vacuum chamber process during cooling. Summary of the Invention

[0009] The first object of the present invention is to provide a spiral vacuum structure for cooling a vacuum chamber, which is beneficial to improving heat exchange efficiency, cooling quickly and evenly, and does not affect the vacuum degree of the vacuum chamber process during cooling.

[0010] To achieve the above-mentioned objectives, the present invention adopts the following technical solutions: a spiral vacuum structure for cooling a vacuum cavity, comprising an outer shell, which is loosely fitted on the outside of the vacuum cavity, and a vacuum interlayer independent of the internal space of the vacuum cavity is formed between the outer shell and the vacuum cavity, wherein spiral guide ribs arranged around the vacuum cavity are provided in the vacuum interlayer, and the guide ribs divide the vacuum interlayer into continuous spiral flow channels, and a cooling medium inlet connected to the spiral flow channel is provided on the wall of the outer shell at the inlet of the spiral flow channel, and a cooling medium outlet connected to the spiral flow channel is provided on the wall of the outer shell at the outlet of the spiral flow channel.

[0011] Furthermore, the aforementioned spiral vacuum structure for cooling the vacuum cavity, wherein: an aerogel insulation layer is coated on the outside of the outer shell.

[0012] Furthermore, in the aforementioned spiral vacuum structure for cooling the vacuum chamber, an adsorption component capable of adsorbing residual gas in the vacuum interlayer is installed in the vacuum interlayer.

[0013] Furthermore, the aforementioned spiral vacuum structure for cooling the vacuum cavity, wherein: the adsorption component includes: a metal woven mesh bag arranged in the vacuum interlayer, the metal woven mesh bag is welded and fixed to the inner wall of the outer shell or the outer wall of the vacuum cavity, and the metal woven mesh bag is filled with a gas adsorbent.

[0014] A second object of the present invention is to provide a vacuum chamber cooling system that is advantageous in achieving high heat exchange efficiency, rapid and uniform cooling, and does not affect the vacuum degree of the vacuum chamber process during cooling.

[0015] To achieve the above-mentioned purpose, the present invention adopts the following technical solution: a vacuum cavity cooling system, comprising a circulation pump, a heat exchanger, and a spiral vacuum structure for cooling a vacuum cavity as described in claim 1, wherein the cooling medium outlet of the spiral vacuum structure for cooling the vacuum cavity is connected to the inlet of the circulation pump, the outlet of the circulation pump is connected to the inlet of the heat exchanger, the outlet of the heat exchanger is connected to the cooling medium inlet of the spiral vacuum structure for cooling the vacuum cavity, the circulation pump, the heat exchanger, and the spiral flow channel of the spiral vacuum structure for cooling the vacuum cavity together constitute a closed-loop cooling medium circulation circuit, and a cooling medium is provided in the cooling medium circulation circuit.

[0016] Furthermore, the aforementioned vacuum cavity cooling system, wherein: it also includes a temperature measuring component and a pressure sensor connected to the PLC control system signal, the temperature measuring component monitors the vacuum cavity temperature in real time and feeds back to the PLC control system in real time, the pressure sensor monitors the process pressure inside the vacuum cavity in real time and feeds back to the PLC control system in real time, and the PLC control system is connected to the circulation pump signal.

[0017] Furthermore, in the aforementioned vacuum chamber cooling system, an adsorption component capable of adsorbing residual gas in the vacuum interlayer is installed in the vacuum interlayer.

[0018] Furthermore, in the aforementioned vacuum cavity cooling system, the adsorption component includes a metal woven mesh bag welded and fixed to the inner wall of the outer shell in the vacuum interlayer or the outer wall of the vacuum cavity, and the metal woven mesh bag is filled with a gas adsorbent.

[0019] Furthermore, in the aforementioned vacuum cavity cooling system, an aerogel insulation layer is coated on the outside of the outer shell.

[0020] Through the implementation of the above technical solutions, the beneficial effects of the present invention are as follows: (1) the interlayer space is used as a cooling medium channel, and the cooling medium channel is designed as a spiral spiral flow channel, which enhances the disturbance of the cooling medium fluid, thereby improving the heat conduction efficiency and achieving rapid cooling; (2) the interlayer space arranged outside the vacuum cavity is used as a cooling medium channel, the heat exchange area between the spiral flow channel and the vacuum cavity is large, the cooling is more uniform, and uniform cooling is achieved; (3) the interlayer space arranged outside the vacuum cavity is used as a cooling medium channel, and an aerogel insulation layer is arranged outside the cooling medium channel, which greatly reduces the heat radiation of the vacuum cavity to the surrounding components, and the heat loss of the vacuum cavity is reduced by 90%, thereby reducing the working environment temperature of the surrounding components, making the equipment operation more stable, and reducing production energy consumption; (4) the interlayer space is used as a cooling medium channel, and the cooling medium channel is independent of the vacuum cavity, so that the process vacuum degree of the vacuum cavity will not be affected during the cooling process of the vacuum cavity by the cooling medium flowing through the cooling medium channel, thereby ensuring process stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic structural diagram of the spiral vacuum structure for cooling the vacuum cavity according to the present invention.

[0022] Figure 2 for Figure 1 Schematic diagram of the structure of the AA section shown in.

[0023] Figure 3 for Figure 2 An enlarged schematic diagram of site B is shown in FIG.

[0024] Figure 4 This is a three-dimensional diagram of the spiral vacuum structure for cooling the vacuum cavity according to the present invention.

[0025] Figure 5 This is a three-dimensional diagram of the spiral vacuum structure for cooling the vacuum cavity of the present invention, with the outer shell corresponding to the circumference of the vacuum cavity hidden.

[0026] Figure 6 This is a schematic structural diagram of a vacuum cavity cooling system according to the present invention. DETAILED DESCRIPTION

[0027] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments.

[0028] like Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 As shown, the spiral vacuum structure for vacuum cavity cooling comprises an outer shell 1, which is loosely fitted on the outside of the vacuum cavity 2, and a vacuum interlayer 3 independent of the internal space of the vacuum cavity is formed between the outer shell 1 and the vacuum cavity 2, wherein spiral guide ribs 4 arranged around the vacuum cavity 2 are provided in the vacuum interlayer 3, and the guide ribs 4 are welded and fixed to the outer wall of the vacuum cavity 2, and the guide ribs 4 separate the vacuum interlayer 3 into continuous spiral flow channels 31, and a cooling medium inlet 5 connected to the spiral flow channel 31 is provided on the wall of the outer shell 1 at the inlet of the spiral flow channel 31, and a cooling medium outlet 6 connected to the spiral flow channel is provided on the wall of the outer shell 1 at the outlet of the spiral flow channel 31, and an aerogel insulation layer 7 is coated on the outside of the outer shell 1, which can better block the cooling medium in the vacuum interlayer from The heat exchange with the external environment significantly reduces the external high temperature transmitted into the vacuum cavity, thereby improving the stability of the vacuum cavity in use; a vacuum port 8 connected to the vacuum interlayer 3 is provided on the outer shell 1, and a sealing plug 9 that can open or close the vacuum port 8 is provided on the vacuum port 8. When working, the vacuum port 8 is opened, and the air in the vacuum interlayer 3 is extracted through the vacuum port 8 to form a high vacuum process environment; in this embodiment, an adsorption component that can adsorb residual gas in the interlayer is installed in the vacuum interlayer 3; the adsorption component includes: a metal woven mesh bag 15 arranged in the vacuum interlayer 3, the metal woven mesh bag 15 is welded and fixed to the inner wall of the outer shell 1, and can also be welded and fixed to the outer wall of the vacuum cavity 2, and the metal woven mesh bag 15 is filled with a gas adsorbent, which is a 5A molecular sieve or silver molecular sieve that can be directly purchased from the market.

[0029] like Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 As shown, the present invention also protects a vacuum cavity cooling system, which can quickly cool down the vacuum cavity 1 and control the process temperature of the vacuum cavity. The cooling system includes a PLC control system 10, a temperature measuring component, a circulating pump 12, a heat exchanger 13, and an outer shell 1. The outer shell 1 is loosely fitted on the outside of the vacuum cavity 2, and a vacuum interlayer 3 independent of the internal space of the vacuum cavity is formed between the outer shell 1 and the vacuum cavity 2. Spiral guide ribs 4 arranged around the vacuum cavity 2 are provided in the vacuum interlayer 3. The guide ribs 4 are welded and fixed to the outer wall of the vacuum cavity 2. The guide ribs 4 divide the vacuum interlayer 3 into continuous spiral flow channels 31. A cooling medium inlet 5 connected to the spiral flow channel 31 is provided on the wall of the outer shell 1 at the inlet of the spiral flow channel 31, and a cooling medium outlet 6 connected to the spiral flow channel 31 is provided on the wall of the outer shell 1 at the outlet of the spiral flow channel 31; the cooling medium outlet 6 It is connected to the inlet of the circulation pump 12, the outlet of the circulation pump 12 is connected to the inlet of the heat exchanger 13, and the outlet of the heat exchanger 13 is connected to the cooling medium inlet 5. The spiral flow channel 31, the circulation pump 12 and the heat exchanger 13 together constitute a closed-loop cooling medium circulation loop. A cooling medium is provided in the cooling medium circulation loop. The cooling medium can be deionized water, liquid metal or supercritical carbon dioxide, etc.; the temperature measuring component, the circulation pump 12, and the heat exchanger 13 are all connected to the PLC control system 10 signal. The temperature measuring component includes a temperature sensor 11. The temperature sensor 11 monitors the temperature of the vacuum cavity 2 in real time and feeds back to the PLC control system 10 in real time. In actual application, the PLC control system can change the cooling medium flow rate in the spiral flow channel 31 by adjusting the speed of the circulation pump 12 according to the temperature data fed back by the temperature measuring component, thereby accelerating the heat transfer between the cooling medium and the vacuum cavity, and realizing rapid cooling of the vacuum cavity.

[0030] In this embodiment, an adsorption component that can adsorb residual gas in the interlayer is installed in the vacuum interlayer 3, and the adsorption component includes: a metal woven mesh bag 14 arranged in the vacuum interlayer 3, and the metal woven mesh bag 14 is welded and fixed to the inner wall of the outer shell 1, and can also be welded and fixed to the outer wall of the vacuum cavity 2. The metal woven mesh bag 14 is filled with a gas adsorbent, and the gas adsorbent is a 5A molecular sieve or a silver molecular sieve that can be purchased directly from the market; in this embodiment, an aerogel insulation layer 7 is coated on the outside of the outer shell 1. The aerogel insulation layer 7 can better block the heat exchange between the cooling medium in the vacuum interlayer and the external environment, significantly reduce the external high temperature transmitted into the vacuum cavity, and thereby improve the stability of the vacuum cavity.

[0031] In this embodiment, a pressure sensor 14 is further included that is signal-connected to the PLC control system 10. The pressure sensor 14 monitors the process pressure inside the vacuum chamber in real time and feeds back the pressure to the PLC control system 10 in real time. The PLC control system 10 receives the process pressure inside the vacuum chamber fed back by the pressure sensor 14 in real time, and compares and analyzes the real-time pressure with the preset safety pressure. When the real-time pressure inside the vacuum chamber is greater than the preset safety pressure, the PLC control system 10 will generate an alarm to remind the staff so that the staff can detect the abnormality and repair it in time.

[0032] During operation, the circulation pump 12 is started, and the circulation pump 12 causes the cooling medium to circulate in the cooling medium circulation loop. In the process of the cooling medium entering from the cooling medium inlet 5 and flowing through the spiral flow channel 31, the cooling medium realizes rapid cooling of the vacuum cavity 2 through heat transfer with the vacuum cavity. The temperature of the cooling medium after heat exchange with the vacuum cavity 2 rises and is output from the cooling medium outlet 6, and then re-enters the spiral flow channel 31 after being cooled by the heat exchanger 13. The spiral flow channel design arranged outside the vacuum cavity greatly enhances the fluid disturbance, improves the heat conduction efficiency, and realizes rapid cooling. On the other hand, the heat exchange area between the spiral flow channel and the vacuum cavity is large, the temperature drop is more uniform, and uniform cooling is realized. Moreover, since the spiral flow channel and the vacuum cavity are independent of each other, the process vacuum degree of the vacuum cavity will not be affected during the cooling process of the vacuum cavity by the cooling medium flowing through the spiral flow channel.

[0033] The advantages of the present invention are: (1) the interlayer space is used as a cooling medium channel, and the cooling medium channel is designed as a spiral spiral flow channel, which enhances the disturbance of the cooling medium fluid, thereby improving the heat conduction efficiency and achieving rapid cooling; (2) the interlayer space arranged outside the vacuum cavity is used as the cooling medium channel, the spiral flow channel and the vacuum cavity have a large heat exchange area, the cooling is more uniform, and uniform cooling is achieved; (3) the interlayer space arranged outside the vacuum cavity is used as the cooling medium channel, and an aerogel insulation layer is arranged outside the cooling medium channel, which greatly reduces the heat radiation of the vacuum cavity to the surrounding components, and the heat loss of the vacuum cavity is reduced by 90%, thereby reducing the working environment temperature of the surrounding components, making the equipment operation more stable, and reducing production energy consumption; (4) the interlayer space is used as the cooling medium channel, and the cooling medium channel is independent of the vacuum cavity, so that the process vacuum degree of the vacuum cavity will not be affected during the cooling process of the vacuum cavity by the cooling medium flowing through the cooling medium channel, thereby ensuring process stability.

[0034] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any other form. Any modification or equivalent change made according to the technical essence of the present invention shall still fall within the scope of protection required by the present invention.

Claims

1. A spiral vacuum structure for vacuum chamber cooling, characterized by: The vacuum chamber comprises an outer shell, which is loosely fitted on the outside of the vacuum chamber, and a vacuum interlayer independent of the internal space of the vacuum chamber is formed between the outer shell and the vacuum chamber, wherein spiral guide ribs arranged around the vacuum chamber are provided in the vacuum interlayer, and the guide ribs separate the vacuum interlayer into continuous spiral flow channels, and a cooling medium inlet connected to the spiral flow channel is provided on the wall of the outer shell at the inlet of the spiral flow channel, and a cooling medium outlet connected to the spiral flow channel is provided on the wall of the outer shell at the outlet of the spiral flow channel.

2. The spiral vacuum structure for cooling a vacuum chamber according to claim 1, characterized in that: The outer shell is coated with an aerogel insulation layer.

3. The spiral vacuum structure for cooling a vacuum chamber according to claim 1, wherein: An adsorption component capable of adsorbing residual gas in the vacuum interlayer is installed in the vacuum interlayer.

4. The spiral vacuum structure for cooling a vacuum chamber according to claim 3, characterized in that: The adsorption component includes: a metal woven mesh bag arranged in the vacuum interlayer, the metal woven mesh bag is welded and fixed to the inner wall of the outer shell or the outer wall of the vacuum cavity, and the metal woven mesh bag is filled with a gas adsorbent.

5. A vacuum chamber cooling system, characterized in that: The invention comprises a circulating pump, a heat exchanger, and a spiral vacuum structure for cooling a vacuum cavity as claimed in claim 1, wherein the cooling medium outlet of the spiral vacuum structure for cooling the vacuum cavity is connected to the inlet of the circulating pump, the outlet of the circulating pump is connected to the inlet of the heat exchanger, the outlet of the heat exchanger is connected to the cooling medium inlet of the spiral vacuum structure for cooling the vacuum cavity, the circulating pump, the heat exchanger, and the spiral flow channel of the spiral vacuum structure for cooling the vacuum cavity together constitute a closed-loop cooling medium circulation circuit, and a cooling medium is provided in the cooling medium circulation circuit.

6. The vacuum chamber cooling system according to claim 5, characterized in that: It also includes a temperature measuring component and a pressure sensor connected to the PLC control system signal. The temperature measuring component monitors the vacuum cavity temperature in real time and feeds back to the PLC control system in real time. The pressure sensor monitors the process pressure inside the vacuum cavity in real time and feeds back to the PLC control system in real time. The PLC control system is connected to the circulation pump signal.

7. The vacuum chamber cooling system according to claim 5, characterized in that: An adsorption component capable of adsorbing residual gas in the vacuum interlayer is installed in the vacuum interlayer.

8. The vacuum chamber cooling system according to claim 7, characterized in that: The adsorption component comprises: a metal woven mesh bag which is welded and fixed to the inner wall of the outer shell or the outer wall of the vacuum cavity in the vacuum interlayer, and the metal woven mesh bag is filled with a gas adsorbent.

9. The vacuum chamber cooling system according to claim 5, characterized in that: The outer shell is coated with an aerogel insulation layer.

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