Thickness measuring device and thickness measuring method

Abstract

The invention provides a thickness measuring device and a thickness measuring method. The thickness measuring device comprises a carrying platform, a first measuring mechanism, a second measuring mechanism, an adjusting mechanism and a control module. The first measuring mechanism is used for performing distance measurement on a target position of a to-be-measured object on the object carrying platform to obtain a target distance between the target position and the first measuring mechanism; the control module is used for determining pose adjustment parameters based on the target distance; the adjusting mechanism is used for adjusting the pose of the second measuring mechanism based on the pose adjusting parameters; and the second measuring mechanism is used for measuring the thickness of the target position of the to-be-measured object on the object carrying platform after the pose adjustment is completed. The pose of the second measurement mechanism is adjusted according to the distance measurement result of the first measurement mechanism, so that the distance between the second measurement mechanism and the target position reaches the measurement pose, the measurement error of the second measurement mechanism can be reduced, and the thickness measurement precision of the target position is improved.

Description

Technical Field

[0001] The present application relates to the field of thickness measurement, and in particular to a thickness measurement device and a thickness measurement method. Background Art

[0002] Currently, measuring devices, such as sensors, are commonly used to measure the thickness of objects under test, such as wafers. When the surface of the object is level, the thickness measurement is relatively accurate. However, when the object is warped, the surface bends, resulting in inaccurate thickness measurements. Therefore, providing a thickness measurement device with high measurement accuracy is an urgent technical challenge. Summary of the Invention

[0003] In view of this, the purpose of this application is to provide a thickness measurement device and thickness measurement method to improve the thickness measurement accuracy at the target position of the object to be measured, and to make the thickness measurement more accurate. The specific scheme is as follows:

[0004] In one aspect, the present application provides a thickness measuring device, which includes a loading platform, a first measuring mechanism, a second measuring mechanism, an adjustment mechanism, and a control module;

[0005] The loading platform is used to carry the object to be measured, and the first measuring mechanism is used to measure the distance of the target position of the object to be measured on the loading platform to obtain the target distance between the target position and the first measuring mechanism;

[0006] The control module is used to determine the posture adjustment parameters based on the target distance; the adjustment mechanism is used to adjust the posture of the second measuring mechanism based on the posture adjustment parameters; the second measuring mechanism is used to measure the thickness of the target position of the object to be measured located on the loading platform after the posture adjustment is completed.

[0007] Optionally, the posture adjustment parameter includes adjusting the height;

[0008] The control module is configured to determine the adjustment height based on a difference between the target distance and a reference distance; the reference distance being the distance between a reference position of a reference object having a flat surface and the first measuring mechanism;

[0009] The adjustment mechanism includes a height adjustment mechanism, and the height adjustment mechanism is used to adjust the height of the second measuring mechanism based on the adjustment height.

[0010] Optionally, the posture adjustment parameter includes tilt;

[0011] The first measuring mechanism is used to measure the distance of the target area of ​​the object to be measured located on the object loading platform to obtain a measurement result; the target position is located in the target area; the measurement result includes the distance between each position in the target area and the first measuring structure;

[0012] The control module is configured to determine an inclination at the target position based on the measurement result;

[0013] The adjustment mechanism includes a tilt adjustment mechanism, and the tilt adjustment mechanism is used to adjust the tilt degree of the second measuring mechanism based on the tilt.

[0014] Optionally, the thickness measuring device further comprises a horizontal movement mechanism;

[0015] The horizontal moving mechanism is used to move the first measuring mechanism in a horizontal direction so that the first measuring mechanism performs distance measurement on various positions within the target area.

[0016] Optionally, the measurement accuracy of the first measuring mechanism is less than the measurement accuracy of the second measuring mechanism.

[0017] Optionally, the first measuring mechanism or the second measuring mechanism is one of a dual-channel distance sensor, a laser displacement sensor or an electrostatic capacitance displacement sensor.

[0018] Optionally, when the second measuring mechanism is the dual-channel distance sensor, the dual-channel distance sensor includes a first sensor located on one side of the object to be measured, and a second sensor located on the other side of the object to be measured; the object to be measured is located between the first sensor and the second sensor;

[0019] The adjustment mechanism is connected to both the first sensor and the second sensor, and is used to adjust the postures of the first sensor and the second sensor based on the posture adjustment parameters.

[0020] Optionally, the loading platform includes a first platform and a second platform, and the thickness measuring device further includes a gripping mechanism;

[0021] The first platform and the second platform are both used to carry the object to be tested; the gripping mechanism is used to move the object to be tested from the first platform to the second platform;

[0022] The first measuring mechanism is used to measure the distance of the target position of the object to be measured on the first platform to obtain the target distance between the target position and the first measuring mechanism;

[0023] The second measuring mechanism is used to measure the thickness of the target position of the object to be measured on the second platform after the posture adjustment is completed.

[0024] Optionally, the first platform carrying the object to be tested is further used to perform a pre-alignment process on the object to be tested.

[0025] Optionally, the first platform can drive the object to be measured to rotate.

[0026] Optionally, the second platform includes a first supporting component and a second supporting component, the first supporting component is used to support the central area of ​​the object to be measured, and the second supporting component is used to support the peripheral area of ​​the object to be measured; the target position is located between the central area and the peripheral area.

[0027] In another aspect, an embodiment of the present application further provides a thickness measurement method, characterized in that it is applied to the thickness measurement device, and the method includes:

[0028] Placing the object to be measured on the object loading platform; measuring the distance of the target position of the object to be measured by the first measuring mechanism to obtain the target distance between the target position and the first measuring mechanism;

[0029] determining a posture adjustment parameter based on the target distance;

[0030] Based on the posture adjustment parameter, adjusting the posture of the second measuring mechanism by the adjustment mechanism;

[0031] The thickness of the object to be measured is measured by the second measuring mechanism.

[0032] Optionally, the posture adjustment parameter includes adjusting the height; the adjustment mechanism includes a height adjustment mechanism;

[0033] Determining a posture adjustment parameter based on the target distance includes:

[0034] Determining a reference distance; the reference distance is the distance between a reference position of a reference object having a flat surface and the first measuring mechanism;

[0035] determining the adjustment height based on a difference between the target distance and the reference distance;

[0036] Based on the posture adjustment parameter, adjusting the posture of the second measuring mechanism by the adjustment mechanism includes:

[0037] Based on the adjusted height, the height of the second measuring mechanism is adjusted by the height adjustment mechanism.

[0038] Optionally, determining a reference distance includes:

[0039] The reference distance is obtained by measuring the distance of the reference position of the reference object having a flat surface by the first measuring mechanism.

[0040] Optionally, the posture adjustment parameter includes an inclination; the adjustment mechanism includes an inclination adjustment mechanism;

[0041] Measuring the distance of the target position of the object to be measured by the first measuring mechanism to obtain the target distance between the target position and the first measuring mechanism includes:

[0042] The first measuring mechanism performs distance measurement on a target area of ​​the object to be measured to obtain a measurement result; the target position is located within the target area; the measurement result includes the distance between each position within the target area and the first measuring structure;

[0043] Determining a posture adjustment parameter based on the target distance includes:

[0044] determining an inclination at the target location based on the measurement result;

[0045] Based on the posture adjustment parameter, adjusting the posture of the second measuring mechanism by the adjustment mechanism includes:

[0046] The tilt degree of the second measuring mechanism is adjusted by the tilt adjustment mechanism based on the tilt.

[0047] Optionally, the thickness measuring device further comprises a horizontal movement mechanism;

[0048] Performing distance measurement on a target area of ​​the object to be measured by the first measuring mechanism to obtain a measurement result includes:

[0049] During the horizontal movement of the horizontal moving mechanism, the first measuring mechanism performs distance measurement on the target area of ​​the object to be measured to obtain the measurement result.

[0050] Optionally, during the horizontal movement of the horizontal moving mechanism, performing distance measurement on a target area of ​​the object to be measured by the first measuring mechanism to obtain the measurement result includes:

[0051] The first platform carrying the object to be tested drives the object to be tested to rotate;

[0052] The horizontal moving mechanism is moved in the horizontal direction while the object to be measured is rotated, and the distance of the target area of ​​the object to be measured is measured by the first measuring mechanism to obtain the measurement result.

[0053] The embodiment of the present application provides a thickness measuring device and a thickness measuring method, wherein the thickness measuring device includes a first measuring mechanism, a second measuring mechanism, an adjustment mechanism, and a control module; the first measuring mechanism is used to measure the distance of the target position of the object to be measured to obtain the target distance between the target position and the first measuring mechanism; the size of the target distance can reflect the warping of the object to be measured. Since the loading platform is initially located in the optimal measurement area of ​​the second measuring mechanism, if the surface of the object to be measured warps and deviates from the optimal measurement area of ​​the second measuring mechanism, the target distance can be used to guide the second measuring mechanism to adjust the posture so that the object to be measured is relocated to the optimal measurement area of ​​the second measuring mechanism, so the control module is used to determine the posture adjustment parameters based on the target distance; the adjustment mechanism is used to adjust the posture of the second measuring mechanism based on the posture adjustment parameters; the second measuring mechanism is used to measure the thickness of the target position of the object to be measured after the posture adjustment is completed. That is, the present application first measures the distance of the object to be measured by the first measuring mechanism, and then adjusts the posture of the second measuring mechanism according to the distance measurement result, so that the object to be measured is located in the optimal measurement area of ​​the second measuring mechanism, thereby reducing the measurement error of the second measuring mechanism, improving the thickness measurement accuracy at the target position of the object to be measured, and making the thickness measurement more accurate. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0055] Figure 1 A schematic structural diagram of a thickness measuring device provided in an embodiment of the present application is shown;

[0056] Figure 2 A schematic structural diagram of another thickness measuring device provided in an embodiment of the present application is shown;

[0057] Figure 3 A schematic cross-sectional view of an object to be tested provided in an embodiment of the present application is shown;

[0058] Figure 4 A schematic diagram of the surface of an object to be tested provided in an embodiment of the present application is shown;

[0059] Figure 5 A schematic diagram of normal thickness measurement of a dual-channel distance sensor provided in an embodiment of the present application is shown;

[0060] Figure 6 A schematic diagram of abnormal thickness measurement of a dual-channel distance sensor provided in an embodiment of the present application is shown;

[0061] Figure 7 A schematic diagram of a laser displacement sensor provided in an embodiment of the present application is shown;

[0062] Figure 8 A schematic diagram of a capacitance displacement sensor provided in an embodiment of the present application is shown;

[0063] Figure 9 A schematic flow chart of a thickness measurement method provided in an embodiment of the present application. DETAILED DESCRIPTION

[0064] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below with reference to the accompanying drawings.

[0065] In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application may also be implemented in other ways different from those described herein. Those skilled in the art may make similar generalizations without violating the connotation of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0066] Secondly, this application is described in detail with reference to schematic diagrams. When describing the embodiments of this application, for ease of explanation, cross-sectional views of device structures may be partially enlarged and not to scale. Furthermore, these schematic diagrams are merely illustrative and should not limit the scope of protection of this application. Furthermore, in actual production, three-dimensional dimensions, including length, width, and depth, should be included.

[0067] As described in the related art, when the object under test is warped, the surface of the object under test will bend, resulting in inaccurate thickness measurements. Typically, the optimal sensor measurement position is when the surface of the object under test is parallel to the sensor probe, and the distance between the surface of the object under test and the sensor probe should be within the sensor's optimal measurement distance range. However, if the surface of the object under test is tilted, or the distance between the surface of the object under test and the sensor probe deviates from this range, the measurement error will increase, resulting in inaccurate measurements.

[0068] An embodiment of the present application provides a thickness measuring device and a thickness measuring method. The present application first measures the distance to the object to be measured by a first measuring mechanism, and then adjusts the posture of the second measuring mechanism according to the distance measurement result, so that the object to be measured is located in the optimal measurement area of ​​the second measuring mechanism, thereby reducing the measurement error of the second measuring mechanism, improving the thickness measurement accuracy at the target position of the object to be measured, and making the thickness measurement more accurate.

[0069] For ease of understanding, a thickness measuring device and a thickness measuring method provided in an embodiment of the present application are described in detail below with reference to the accompanying drawings.

[0070] refer to Figure 1 FIG. 1 is a schematic diagram of a thickness measuring device according to an embodiment of the present invention. The thickness measuring device may include a loading platform 100, a first measuring mechanism 102, a second measuring mechanism 104, an adjusting mechanism 105, and a control module. Figure 1 Shown.

[0071] The loading platform 100 is used to carry the object to be measured 106. When the thickness of the object to be measured 106 is measured, the object to be measured 106 can be placed on the loading platform 100. As an example, the loading platform 100 can contact the middle area of ​​the object to be measured 106 to achieve a carrying function. The object to be measured 106 is an object that needs to be measured in thickness, such as a wafer. In the semiconductor manufacturing process, the wafer to be measured 106 inevitably undergoes shape changes due to residual internal stress, such as changing from a plane to a parabola, or other more complex shapes. Such wafers with large deformations are generally referred to as high-warpage wafers. When measuring such wafers, especially when wafers with different warpage amounts are measured successively, an increase in error will inevitably occur. When the object to be measured 106 is warped, the surface of the object to be measured 106 will be higher or lower than the flat surface, which makes it easy to exceed the range of the optimal measurement distance of the measuring mechanism, resulting in inaccurate thickness measurement. In addition, the warped object 106 may be non-parallel to the surface of the measuring mechanism, making it impossible to detect the true thickness of the warped portion of the object. For example, the measurement result may be greater than the true thickness, and the thickness measurement may be inaccurate.

[0072] refer to Figure 3 1 is a schematic cross-sectional view of an object to be tested 106 provided in an embodiment of the present application. The figure shows three cross-sectional views of the object to be tested 106. The horizontal axis represents the value in the horizontal direction, and the vertical axis represents the value in the vertical direction. The blue line and the red line are cross-sectional views of the object to be tested 106 that has warped, and the green line is a cross-sectional view of the object to be tested 106 that has not warped, and the cross-sectional view is horizontal.

[0073] The first measuring mechanism 102 is used to measure the distance of a target position 108 of an object to be measured 106 located on the loading platform 100, thereby obtaining a target distance between the target position 108 and the first measuring mechanism 102. The object to be measured 106 can be placed on the loading platform 100 for the measuring mechanism to perform measurements. The measuring mechanism is used to measure the object to be measured 106. The measuring mechanism can be, for example, a sensor. The first measuring mechanism 102 and the second measuring mechanism 104 can be two separate measuring mechanisms, such as two sensors, thereby improving measurement efficiency and accuracy. Of course, the first measuring mechanism 102 and the second measuring mechanism 104 can also be the same measuring mechanism to reduce device costs.

[0074] The target position 108 is a position on the object to be measured 106, which can be understood as a position where thickness measurement is required. The target position 108 can also be called a thickness measurement point. Figure 4 FIG. 1 is a schematic diagram of a surface of an object under test 106 according to an embodiment of the present application, wherein a target position 108 is located in a peripheral area of ​​the surface of the object under test 106 . The target position 108 is a point. The object under test 106 may include one or more target positions 108 .

[0075] The first measurement mechanism 102 can measure the distance to the target position 108 to obtain a target distance. The target distance can be understood as the vertical distance between the target position 108 and the first measurement mechanism 102. The target distance can reflect the distance between the target position 108 and the first measurement mechanism 102. For example, the target distance can be the distance between the target position 108 and the sensor probe. The warpage of the object under test 106 can be reflected by the size of one or more target distances, thereby adjusting the measurement posture of the second measurement mechanism.

[0076] The measurement pose can be understood as the pose of the measuring mechanism when the measurement result meets the accuracy requirements, and the object to be measured is located in the optimal measurement area of ​​the second measuring mechanism. As an example, the measurement pose can include an angle range. When the angle between the measuring mechanism plane and the object to be measured 106 plane is within the angle range, it indicates that the measurement pose has been achieved. The measurement pose can also include the range of the optimal measurement distance. The optimal measurement distance can be understood as the distance between the measuring mechanism and the object to be measured when the measurement result has the highest accuracy, for example, it can be 5 cm. The range of the optimal measurement distance is the range interval of the optimal measurement distance, for example, it can be [4 cm, 6 cm].

[0077] In short, when the posture of the measuring mechanism includes the tilt angle of the measuring mechanism and the distance between it and the object to be measured 106, the optimal measurement area can be understood as the second measuring mechanism 104 accurately measuring the object to be measured 106, the angle between the second measuring mechanism 104 and the object to be measured 106 meets the requirements of the angle range, and the distance between the second measuring mechanism 102 and the object to be measured 106 is within the range of the optimal measurement distance.

[0078] Since the loading platform 100 is initially located within the optimal measurement area of ​​the second measuring mechanism 104, for example, the error between the distance between the second measuring mechanism 104 and the second platform 103 and the optimal measurement distance is tolerable, or the angle between the second measuring mechanism 104 and the second platform 103 meets the angle requirement, if the surface of the object to be measured 106 warps, causing it to deviate from the optimal measurement area of ​​the second measuring mechanism, and since the height of the second measuring mechanism 104 is initially designed for accurate measurement of flat objects 106, if the surface of the object to be measured 106 warps, the height or tilt of the second measuring mechanism 104 is no longer suitable for thickness measurement of the warped object to be measured 106, and therefore the position of the second measuring mechanism 104 needs to be adjusted. The target distance can be used to guide the second measuring mechanism 104 to adjust its posture so that it can reach the measurement posture again, that is, the object to be measured 106 can be re-located in the optimal measurement area of ​​the second measuring mechanism 104, for example, it is located within the range of the optimal measurement distance, or the angle between it and the second measuring mechanism 104 meets the angle requirements.

[0079] Therefore, the control module is configured to determine the posture adjustment parameters based on the target distance. In other words, the target distance measured by the first measurement mechanism 102 can, to a certain extent, reflect the degree of surface warping deformation of the object under test 106. Based on this degree of deformation, the posture adjustment parameters of the second measurement mechanism 104 can be determined. The posture adjustment parameters can be understood as the posture of the second measurement mechanism 104, and may include, for example, height, tilt, etc.

[0080] The adjustment mechanism 105 is configured to adjust the position of the second measurement mechanism 104 based on the position adjustment parameter. The adjustment mechanism 105 is connected to the second measurement mechanism 104 and is configured to adjust the position of the second measurement mechanism 104 based on the position adjustment parameter to restore the optimal measurement position. For example, if the target distance is 5 cm and the position adjustment parameter determined based on the target distance is a height difference of 1 cm, the height of the second measurement mechanism 104 can be adjusted by 1 cm.

[0081] After the posture adjustment is completed, the second measuring mechanism 104 is used to measure the thickness of the target position 108 of the object to be measured 106 located on the loading platform 100. In other words, after the posture adjustment of the second measuring mechanism 104 is completed, it indicates that the distance between the second measuring mechanism 104 and the object to be measured 106 has reached the measurement posture. Therefore, the thickness of the target position 108 can be measured, thereby obtaining the thickness of the object to be measured 106 at the target position 108.

[0082] In summary, the present application first measures the distance of the object to be measured 106 through the first measuring mechanism 102, and then adjusts the position of the second measuring mechanism 104 based on the measurement results, so that the object to be measured 106 is located in the optimal measurement area of ​​the second measuring mechanism 104. This can reduce the measurement error of the second measuring mechanism 104, improve the thickness measurement accuracy at the target position 108 of the object to be measured 106, and make the thickness measurement more accurate. In addition, the rough topography (i.e., distance measurement) and the high-precision thickness measurement can be performed in parallel, enabling simultaneous processing of two objects to be measured 106, thereby improving the efficiency of thickness measurement.

[0083] In a possible implementation, the object carrying platform 100 is a single platform. When the object to be measured 106 is placed on the object carrying platform 100, the distance measurement and the thickness measurement can be performed successively. Figure 1 In the figure, the dotted line indicates the replacement of the measuring mechanism. The first measuring mechanism 102 can be moved to the target position 108 to measure the distance, and then the second measuring mechanism 104 can be moved to the target position 108 to measure the thickness. In this way, only one platform is used to support the object to be measured 106, which can reduce the cost of the device and the internal space of the device, thereby achieving a smaller device.

[0084] It should be noted that when measuring the distance to the target position 108, while the loading platform 100 is stationary, the first measuring mechanism 102 can be moved to a position directly below the target position 108, thereby achieving distance measurement to the target position 108. The first measuring mechanism 102 can be controlled by the adjustment mechanism 105 to move circumferentially and radially relative to the object to be measured 106. Other mechanisms can also be provided to achieve circumferential and radial movement of the first measuring mechanism 102 relative to the object to be measured 106. While the first measuring mechanism 102 is stationary, the loading platform 100 can be used to move the object to be measured 106 to a suitable position so that the target position 108 of the object to be measured 106 is directly above the first measuring mechanism 102, facilitating distance measurement.

[0085] When measuring the thickness of the target position 108, the second measuring mechanism 104 can be moved to a position directly above and / or directly below the target position 108 while the loading platform 100 is stationary, thereby achieving distance measurement of the target position 108. The second measuring mechanism 104 can be moved circumferentially and radially relative to the object to be measured 106 under the control of the adjustment mechanism 105. In other words, the first measuring mechanism 102 and the second measuring mechanism 104 can both be moved using the adjustment mechanism 105, or they can be moved using different mechanisms. When the second measuring mechanism 104 is stationary, the loading platform 100 can be used to move the object to be measured 106 to a suitable position so that the target position 108 of the object to be measured 106 is directly above and / or directly below the second measuring mechanism 104 for thickness measurement.

[0086] In addition, when the first measuring mechanism 102 and the second measuring mechanism 104 are located at different positions below the object to be measured 106, if their positions remain unchanged, then when performing distance measurement, the object to be measured 106 can be first translated and rotated by the loading platform 100, so that the first measuring mechanism 102 can perform distance measurement on the target position 108. Then, the loading platform 100 can continue to translate and rotate the object to be measured 106, so that the target position 108 is near the second measuring mechanism 104, and the second measuring mechanism 104 can be used to measure the thickness of the target position 108. In one possible implementation, the loading platform 100 includes a first platform and a second platform, and the thickness measuring device further includes a gripping mechanism. Figure 2 , which is a structural schematic diagram of another thickness measuring device provided in an embodiment of the present application. Figure 2 In the figure, dotted lines are used to distinguish the structures involved in the two measurement parts. In practice, the distance measurement-related structures and the thickness measurement-related structures are both located at appropriate positions in the equipment cavity, and the two parts are not limited to being arranged up and down.

[0087] Both the first platform 101 and the second platform 103 are used to support an object to be tested 106. The first platform 101 and the second platform 103 can be, for example, a loading platform or other supporting platforms. A gripping mechanism (not shown) is used to move the object to be tested from the first platform 101 to the second platform 103. The gripping mechanism is used to transfer the object to be tested 106 and can be, for example, a robotic arm.

[0088] The first measuring mechanism 102 is used to measure the distance of the target position of the object under test 106 located on the first platform 101, obtaining the target distance between the target position and the first measuring mechanism 102. The second measuring mechanism 104 is used to measure the thickness of the target position of the object under test 106 located on the second platform 103 after the posture adjustment is completed. By providing two platforms, namely the first platform 101 and the second platform 102, the measurement process of two objects under test can be carried out simultaneously. That is, the first measuring mechanism 102 is used to measure the distance of the first object under test located on the first platform 101, and the second measuring mechanism 104 is used to measure the thickness of the second object under test located on the second platform 102, thereby improving measurement efficiency.

[0089] That is to say, the object to be measured 106 can be placed on the first platform 101 by the gripping mechanism, and the distance can be measured by the first measuring mechanism 102. Then, the object to be measured 106 can be placed on the second platform 102 by the gripping mechanism, and the thickness can be measured by the second measuring mechanism 104. That is, in this application, the object to be measured 106 can be measured once on the first platform 101, and then measured a second time on the second platform 103. Therefore, a gripping mechanism needs to be provided in the thickness measuring device to realize the movement of the object to be measured 106 on the two platforms. When the object to be measured 106 is located on the first platform 101, the first measuring mechanism 102 can be located on one side of the object to be measured 106, for example, below the object to be measured 106, such as Figure 2 shown.

[0090] For the convenience of description, the following explanation is given by taking an example in which the thickness measuring device has two platforms.

[0091] In one possible implementation, the posture adjustment parameter may include adjusting the height. The control module is configured to determine the adjusted height based on a difference between the target distance and a reference distance; the reference distance is the distance between a reference position of a reference object having a flat surface and the first measuring mechanism 102. The adjustment mechanism 105 includes a height adjustment mechanism 1051 configured to adjust the height of the second measuring mechanism 104 based on the adjusted height.

[0092] Specifically, height adjustment can be understood as adjusting the height of second measuring mechanism 104. The control module can determine the height adjustment based on the difference between the target distance and the reference distance. The reference object is an object with a flat surface, such as a flat, unwarped wafer, or other flat surface structure. The reference position is a location on the reference object. The specific location of the reference position on the reference object can be the same as the specific location of target position 108 on object under test 106.

[0093] The reference distance is used to reflect the distance between the reference position and the first measuring mechanism 102. The difference between this distance and the optimal measurement distance of the first measuring mechanism 102 is small, that is, it can be considered that the reference object is located within the range of the optimal measurement distance of the first measuring mechanism 102.

[0094] The control module can calculate the deviation value Δh between the target distance and the reference distance and use it as the adjustment height. The larger the deviation value Δh is, the further the object to be measured 106 deviates from the optimal measurement distance of the first measurement mechanism 102.

[0095] The adjustment mechanism 105 may specifically include a height adjustment mechanism 1051, which can adjust the height between the second measuring mechanism 104 and the object to be measured 106 according to the adjustment height, so that the object to be measured 106 reaches the optimal measurement distance of the second measuring mechanism 104 again. Figure 2 As shown, the adjustment mechanism 105 includes a height adjustment mechanism 1051, which can adjust the position of the second measuring mechanism 104 in the vertical direction.

[0096] In summary, by adjusting the height of the second measuring mechanism 104 , the distance between the warped object to be measured 106 and the second measuring mechanism 104 reaches the optimal measuring distance, that is, it is relocated within the appropriate measuring distance range, so that the second measuring mechanism 104 can perform thickness measurement more accurately.

[0097] In one possible implementation, the posture adjustment parameters may include inclination; the first measuring mechanism 102 is used to measure the distance of the target area of ​​the object to be measured 106 located on the loading platform 100 to obtain a measurement result; the target position 108 is located in the target area; the measurement result includes the distance between multiple positions in the target area and the first measuring structure; the control module is used to determine the inclination at the target position 108 based on the measurement result; the adjustment mechanism 105 includes a inclination adjustment mechanism 1052, and the inclination adjustment mechanism 1052 is used to adjust the inclination degree of the second measuring mechanism 104 based on the inclination.

[0098] Specifically, the inclination represents the degree of inclination of the second measuring mechanism 104 relative to the horizontal plane. The target area can be understood as a portion of the surface of the object to be measured 106, with the target position 108 located within the target area. The first measuring mechanism 102 can perform distance measurements not only on the target position 108 but also on other locations surrounding the target position 108, i.e., perform distance measurements on each location within the target area to obtain a measurement result.

[0099] The measurement result may reflect the distance between each position in the target area and the first measurement mechanism 102. As an example, the measurement result may be a surface topography measurement result of the object 106, that is, the x-coordinate, y-coordinate, and z-coordinate corresponding to each position in the target area.

[0100] In this way, based on the three-dimensional coordinates of the target position 108 and the three-dimensional coordinates of other positions around it, the slope k of the tangent line at the target position 108 can be determined, thereby determining the inclination that needs to be adjusted for the second measurement mechanism. For example, when the object 106 is warped, the closer the target position 108 is to the edge of the object 106, the greater its inclination will be, and the closer the target position 108 is to the center of the object 106, the smaller its inclination will be.

[0101] The tilt adjustment mechanism 1052 can adjust the tilt of the second measuring mechanism 104 according to the tilt, so that the tilt of the second measuring mechanism 104 is consistent with the tilt of the object 106 at the target position 108. That is, the second measuring mechanism 104 can be substantially parallel to the area where the target position 108 is located, so that the light beam can be vertically incident on the target position 108 for thickness measurement, thereby avoiding the occurrence of inaccurate thickness measurement due to the non-parallelism between the surface of the object 106 and the second measuring mechanism 104. Figure 2 As shown, the tilt adjustment mechanism 1052 can make the second measuring mechanism 104 deviate from the vertical direction, so that it has a certain tilt.

[0102] In one possible implementation, the thickness measuring device may further include a horizontal moving mechanism 107 ; the horizontal moving mechanism 107 is used to move the first measuring mechanism 102 in the horizontal direction so that the first measuring mechanism 102 performs distance measurement on various positions within the target area, thereby obtaining a surface topography measurement result of the object to be measured 106 .

[0103] Specifically, the horizontal moving mechanism 107 can be used to carry the first measuring mechanism 102, and to enable the first measuring mechanism 102 to move in the horizontal direction, so that the first measuring mechanism 102 can measure the distance of different positions in the target area. Figure 2 As shown, the first measuring mechanism 102 is placed on a horizontal moving mechanism 107 to achieve lateral movement.

[0104] In summary, the present application provides a horizontal movement mechanism 107 to drive the first measuring mechanism 102 to move radially along the object 106 to achieve distance measurement at various locations. Compared to fixing the first measuring mechanism 102 and moving the object 106, the present application can prevent the object 106 from falling and being damaged during movement. The movement of the first measuring mechanism 102 is also more convenient and simple, improving the operational convenience of thickness measurement.

[0105] In a possible implementation, the first platform 101 carrying the object to be measured 106 is further used to perform a pre-alignment process on the object to be measured 106 .

[0106] Specifically, when the object under test 106 is positioned on the first platform, the first platform 101 can also perform pre-alignment processing on the object under test 106. That is, the first platform 101 can serve as a pre-alignment module for performing pre-alignment processing. The pre-alignment processing can include adjusting the center position error and horizontal rotation error of the object under test 106 to zero, thereby positioning the center of the object under test 106 at the appropriate position and placing the object under test 106 horizontally. In addition, the pre-alignment processing can also include rotating the object under test 106 to align the notch of the object under test 106 in the appropriate direction.

[0107] In this way, during the pre-alignment process of the object to be measured 106 , a rough distance measurement can be performed on the object to be measured 106 , thereby improving the overall measurement efficiency without spending extra time on distance measurement.

[0108] In a possible implementation, the first platform 101 can drive the object to be measured 106 to rotate.

[0109] During rotation, it is possible to detect the warping of the target position at various circumferential angles, that is, to perform distance detection on adjacent positions of the target position in various directions, thereby obtaining multiple inclinations of multiple tangents at the target position, clarifying the degree of warping in various directions, so as to improve the accuracy of determining the inclination at the target position.

[0110] That is, while the first platform 101 rotates the object to be measured 106, distance measurement processing can be performed, that is, the second measuring mechanism 104 starts to collect data, and accompanied by translation in the radial direction controlled by the horizontal adjustment mechanism 105, a scanning measurement is performed on the peripheral area of ​​the surface of the object to be measured 106, thereby obtaining a measurement result.

[0111] In a possible implementation, the measurement accuracy of the first measuring mechanism 102 is less than the measurement accuracy of the second measuring mechanism 104 .

[0112] Among them, measurement accuracy is used to indicate the error between the measurement result and the true result. The greater the measurement accuracy, the smaller the error. The measurement accuracy of a measuring mechanism is generally related to the range of the measuring mechanism's optimal measurement distance and / or maximum measurement angle. The larger the range of the optimal measurement distance and measurement angle, the greater the measurement mechanism's ability to measure objects 106 that are farther or closer, or at larger angles, and thus adapt to more relaxed testing requirements. In other words, a measuring mechanism with lower measurement accuracy is generally more suitable for measuring objects 106 that are farther away or more inclined. As measurement accuracy increases, the measuring mechanism becomes more stringent in its requirements for the distance between the object 106 and itself and the angle between the object 106 and itself.

[0113] Since the first measuring mechanism 102 is mainly used to achieve rough distance measurement and does not need to have very high accuracy, the first measuring mechanism 102 needs to be able to measure objects 106 with various degrees of warping. Therefore, by setting the first measuring mechanism 102 to have a lower measurement accuracy, that is, a larger optimal measurement distance range, it can be made possible to roughly measure the target distance even if the degree of warping of the object 106 is large, thereby achieving comprehensive coverage of various types of objects 106.

[0114] The second measuring mechanism 104 is mainly used to accurately measure the thickness of the object to be measured 106, so it needs to be set to have a larger measurement accuracy and a smaller optimal measurement distance range, so that the second measuring mechanism 104 can achieve accurate measurement within a small distance range to ensure the accuracy of thickness measurement.

[0115] In a possible implementation, the first measuring mechanism 102 or the second measuring mechanism 104 is one of a dual-channel distance sensor, a laser displacement sensor, or a static capacitance displacement sensor.

[0116] That is to say, the first measuring mechanism 102 can be any one of a dual-channel distance sensor, a laser displacement sensor and an electrostatic capacitance displacement sensor, and the second measuring mechanism 104 can also be any one of a dual-channel distance sensor, a laser displacement sensor and an electrostatic capacitance displacement sensor. The types of these two measuring mechanisms can be the same or different.

[0117] The following describes the three types of sensors. For a dual-channel distance sensor, it mainly includes two sensors, which are located on both sides of the surface of the object to be measured 106. Figure 5 FIG. 1 is a schematic diagram of a normal thickness measurement of a dual-channel distance sensor provided in an embodiment of the present application. Sensor A and sensor B are located on both sides of the object to be measured 106, respectively. Sensor A can measure the distance d between itself and the upper surface of the object to be measured 106. upper , sensor B can measure the distance d between it and the lower surface of the object to be measured 106 lower Since the distance D between the two sensors is known, the thickness t of the object 106 can be determined, t = D - (d upper +d lower ).

[0118] In one possible implementation, when the second measuring mechanism 104 is a dual-channel distance sensor, the dual-channel distance sensor includes a first sensor located on one side of the object to be measured 106, and a second sensor located on the other side of the object to be measured 106; the object to be measured 106 is located between the first sensor and the second sensor; the adjustment mechanism 105 is connected to both the first sensor and the second sensor, and the adjustment mechanism 105 is used to adjust the posture of the first sensor and the second sensor based on the posture adjustment parameter.

[0119] refer to Figure 2 As shown, a first sensor is positioned above the object under test 106, and a second sensor is positioned below the object under test 106. One end of an adjustment mechanism 105 is connected to the first sensor, and the other end is connected to the second sensor. Adjustment mechanism 105 can adjust the position of the first sensor and the second sensor based on height or tilt adjustment.

[0120] In this way, by using a dual-channel distance sensor as a precise measurement sensor, the thickness measurement will be more accurate.

[0121] refer to Figure 6 , which is a schematic diagram of abnormal thickness measurement of a dual-channel distance sensor provided in an embodiment of the present application. Figure 6 (a) shows a schematic diagram of thickness measurement when the object to be measured 106 is tilted. The thickness of the object to be measured 106 is not accurate.

[0122] On the one hand, if Figure 6 As shown in (a), when the object to be measured 106 is tilted, the sensor measures not the vertical length perpendicular to the surface of the object to be measured, but the hypotenuse that passes through the upper and lower surfaces of the object to be measured. That is, it will introduce cosθ into the thickness test, that is, t'=t / cosθ, where t' is the hypotenuse length, t is the vertical length, and θ is the angle between the normal line of the object to be measured and the vertical direction.

[0123] On the other hand, the tilt of the object to be measured 106 will introduce additional errors to the measurement, that is, the measurement of t' will also have a large error. Specifically, taking the measurement mechanism as a laser displacement sensor as an example, Figure 7 A schematic diagram of a laser displacement sensor provided in an embodiment of the present application, (a) is a schematic diagram during normal measurement, and (b) is a schematic diagram during abnormal measurement. When the measured surface of the object to be measured 106 is not tilted, the measured surface of the object to be measured 106 is parallel to the reference plane, and the normal direction of the measured surface is parallel to the normal direction of the reference plane. At this time, the distance between the sensor and the surface of the object to be measured can be determined based on the position difference of the reflected light of the laser through the measured surface and the reference plane incident on the receiver, and the direct measurement result obtained at this time is accurate. When the measured surface of the object to be measured 106 is tilted, the measured surface of the object to be measured 106 is at an angle to the reference plane, causing the position of the reflected light incident on the receiver of the measuring mechanism to move horizontally. At this time, if the light source is not adjusted accordingly, the reference plane will still be horizontal, and the position of the light reflected by the reference plane in the receiver will not change. That is, after the two beams of light are reflected by the non-parallel reference plane and the surface to be measured, the propagation paths of the beams differ significantly, resulting in incomparable light spot positions in the receiver. The positional difference between the two light spot positions cannot accurately represent the distance between the object to be measured 106 and the measuring mechanism, resulting in inaccurate direct measurement results. This error cannot be simply eliminated through data processing. Accurate measurement can only be achieved by adjusting the reference plane to be parallel to the tilted surface to be measured. The reference plane changes with the light source of the measuring mechanism, and adjusting the reference plane requires adjusting the tilt of the light source of the measuring mechanism. Therefore, the error can be eliminated by adjusting the position of the measuring mechanism.

[0124] Taking the measuring mechanism as an electrostatic capacitance displacement sensor as an example, Figure 8Schematic diagram of a static capacitance displacement sensor provided in an embodiment of the present application, (a) is a schematic diagram during normal measurement, and (b) is a schematic diagram during abnormal measurement. The simple expression of capacitance is C = εA / D, where C is the capacitance, ε is the dielectric constant of the medium between the capacitor plates, A is the area covered by the two parallel capacitor plates, and D is the distance between the two parallel capacitor plates. When ε and A remain unchanged, C and D are inversely proportional, so the distance between the fixed plate (sensor) and the moving plate (measured object) can be converted into a measured capacitance. Reference Figure 7 (a) When the measured surface of the object to be measured 106 is not tilted, it is parallel to the fixed electrode, and the distance between the two can be accurately measured. Figure 7 (b) When the measured surface is tilted, it is no longer parallel to the fixed electrode. At this point, not only is the value of the area A covered by the capacitor plates no longer accurate, but the capacitance also transforms from a simple parallel plate problem to a more complex non-parallel plate problem, requiring a significantly different calculation method, resulting in additional error. This error is also difficult to eliminate simply through data processing. Accurate measurement can only be achieved by adjusting the capacitance displacement sensor's capacitor plates to be parallel to the tilted measured surface. Therefore, the error can be eliminated by adjusting the position of the measuring mechanism.

[0125] In addition, when the surface of the object being measured is warped, the distance between different areas of the object being measured and the sensor will also change accordingly. Figure 6 (b) shows a schematic diagram of thickness measurement when a local area of ​​the object to be measured 106 is too close and / or too far from a single sensor. Since the object to be measured 106 is too close to sensor A and too far from sensor B, the object to be measured is not within the working distance of the sensor and the measurement result is inaccurate.

[0126] In one possible implementation, the second platform 103 may include a first supporting component and a second supporting component, wherein the first supporting component is used to support the central area of ​​the object to be measured 106, and the second supporting component is used to support the peripheral area of ​​the object to be measured 106; the target position 108 is located between the central area and the peripheral area.

[0127] refer to Figure 2 As shown, the second platform 103 can be composed of two parts: a first support member and a second support member. A certain gap is defined between the first support member and the second support member, allowing the second measurement mechanism 104 to measure the thickness of the target location 108 located within the gap. The peripheral area of ​​the object under test 106 can be placed on the second support member, while the central area of ​​the object under test 106 can be placed on the first support member, thereby improving support stability and facilitating measurement of the target location 108.

[0128] refer to Figure 91 is a flow chart of a thickness measurement method provided in an embodiment of the present application. The method is applied to a thickness measurement device and may include the following steps.

[0129] S101 , placing the object to be measured 106 on the object loading platform 100 ; and measuring the distance of the target position 108 of the object to be measured 106 by the first measuring mechanism 102 to obtain the target distance between the target position 108 and the first measuring mechanism 102 .

[0130] The first measuring mechanism 102 may be located below the object to be measured 106 . When the object to be measured 106 is located above the loading platform 100 , the first measuring mechanism 102 may be used to measure the distance to a target position 108 of the object to be measured 106 , thereby obtaining a target distance.

[0131] S102: Determine posture adjustment parameters based on the target distance.

[0132] S103 , based on the posture adjustment parameters, the second measuring mechanism 104 is adjusted in posture by the adjustment mechanism 105 .

[0133] S104 , measuring the thickness of the object to be measured 106 by the second measuring mechanism 104 .

[0134] After the second measuring mechanism 104 completes the posture adjustment, the second measuring mechanism 104 can be used to measure the thickness of the object to be measured 106 .

[0135] In one possible implementation, the posture adjustment parameter may include adjusting the height; the adjustment mechanism 105 includes a height adjustment mechanism 1051; S102 determines the posture adjustment parameter based on the target distance, which may include S1021-S1022. S103 adjusts the posture of the second measurement mechanism 104 via the adjustment mechanism 105 based on the posture adjustment parameter, which may include S1031.

[0136] S1021 , determining a reference distance; the reference distance is the distance between a reference position of a reference object having a flat surface and the first measuring mechanism 102 .

[0137] Specifically, a reference distance can be determined, and the reference distance can be used repeatedly after being measured once. In actual operation, before performing a rough position measurement of the object to be measured 106 using the first measurement mechanism 102, the first measurement mechanism 102 can be calibrated using a reference object with a flat surface, that is, a reference distance between the first measurement mechanism 102 and the reference position can be determined.

[0138] S1022: Determine an adjustment height based on a difference between the target distance and the reference distance.

[0139] Specifically, the control module can calculate the deviation value Δh between the target distance and the reference distance and use it as the adjustment height. The larger the deviation value Δh is, the further the object to be measured 106 deviates from the optimal measurement distance of the first measurement mechanism 102.

[0140] S1031 , based on the height adjustment, adjust the height of the second measuring mechanism 104 through the height adjustment mechanism 1051 .

[0141] The height adjustment mechanism 1051 can adjust the height between the second measuring mechanism 104 and the object to be measured 106 accordingly according to the adjustment height, so that the object to be measured 106 reaches the optimal measurement distance of the second measuring mechanism 104 again.

[0142] In summary, by adjusting the height of the second measuring mechanism 104 , the distance between the warped object to be measured 106 and the second measuring mechanism 104 reaches the optimal measuring distance, that is, it is relocated within the appropriate measuring distance range, so that the second measuring mechanism 104 can perform thickness measurement more accurately.

[0143] In a possible implementation, S1021 determines the reference distance, which may specifically include S10211.

[0144] S10211 , using the first measuring mechanism 102 to measure the distance of a reference position of a reference object having a flat surface to obtain a reference distance.

[0145] Specifically, a reference object with a flat surface can be placed on the first platform 101 by a manipulator. The first measuring mechanism 102 measures the reference position of the reference object to obtain a reference distance, thereby improving the accuracy of the reference distance.

[0146] In one possible implementation, the posture adjustment parameter includes tilt; the adjustment mechanism 105 includes a tilt adjustment mechanism 1052; S101 measures the distance of the target position 108 of the object to be measured 106 by the first measuring mechanism 102 to obtain a target distance between the target position 108 and the first measuring mechanism 102, which may include S1011. S102 determines the posture adjustment parameter based on the target distance, which may include S1023. S103 adjusts the posture of the second measuring mechanism 104 by the adjustment mechanism 105 based on the posture adjustment parameter, which may include S1032.

[0147] S1011 , the first measuring mechanism 102 performs distance measurement on the target area of ​​the object to be measured 106 to obtain a measurement result; the target position 108 is located in the target area; the measurement result includes the distance between each position in the target area and the first measuring structure.

[0148] Specifically, the target area can be understood as a portion of the surface of the object to be measured 106, and the target position 108 is located in the target area. The first measurement mechanism 102 can not only measure the distance of the target position 108, but also measure the distance of other positions around the target position 108, that is, measure the distance of each position in the target area to obtain a measurement result.

[0149] The measurement result may reflect the distance between each position in the target area and the first measurement mechanism 102. As an example, the measurement result may be a surface topography measurement result of the object 106, that is, the x-coordinate, y-coordinate, and z-coordinate corresponding to each position in the target area.

[0150] S1023 : Determine the inclination at the target position 108 based on the measurement result.

[0151] Based on the three-dimensional coordinates of target position 108 and the three-dimensional coordinates of other locations around it, the slope k at target position 108 can be determined to determine the inclination that needs to be adjusted for the second measurement mechanism. For example, when object 106 is warped, the closer target position 108 is to the edge of object 106, the greater its inclination will be, and the closer target position 108 is to the center of object 106, the smaller its inclination will be.

[0152] S1032 , adjusting the tilt of the second measuring mechanism 104 through the tilt adjustment mechanism 1052 based on the tilt.

[0153] The tilt adjustment mechanism 1052 can adjust the tilt of the second measuring mechanism 104 according to the inclination, so that the tilt of the second measuring mechanism 104 is consistent with the tilt of the object to be measured 106 at the target position 108, that is, the second measuring mechanism 104 can be basically parallel to the area where the target position 108 is located, so that the light beam can be vertically incident on the target position 108 for thickness measurement, avoiding inaccurate thickness measurement due to the non-parallelism between the surface of the object to be measured 106 and the second measuring mechanism 104.

[0154] In a possible implementation, the thickness measuring device may further include a horizontal movement mechanism 107 ; S101 performs distance measurement on a target area of ​​the object to be measured 106 by the first measurement mechanism 102 to obtain a measurement result, which may include S1012 .

[0155] S1012 , while the horizontal moving mechanism 107 is moving in the horizontal direction, the first measuring mechanism 102 performs distance measurement on the target area of ​​the object to be measured 106 to obtain a measurement result.

[0156] Specifically, the horizontal moving mechanism 107 can be used to carry the first measuring mechanism 102 and enable the first measuring mechanism 102 to move in the lateral direction, so that the first measuring mechanism 102 can measure the distance of different positions in the target area.

[0157] The target area can be understood as a portion of the surface of the object under test 106, specifically the area where the target position is located. The target area can be determined based on the target position. If the target position is at the edge of the object under test 106, the target area is also located at the edge. If the target position is in the center of the object under test 106, the target area is also located in the center. The size of the target area can be selected based on actual measurement requirements, for example, it can be within a 3 cm range centered on the target position.

[0158] In summary, the present application provides a horizontal movement mechanism 107 to drive the first measuring mechanism 102 to move radially along the object 106 to achieve distance measurement at various locations. Compared to fixing the first measuring mechanism 102 and moving the object 106, the present application can prevent the object 106 from falling and being damaged during movement. The movement of the first measuring mechanism 102 is also more convenient and simple, improving the operational convenience of thickness measurement.

[0159] In a possible implementation, S1012 , during the horizontal movement of the horizontal moving mechanism 107 , the first measuring mechanism 102 performs distance measurement on a target area of ​​the object to be measured 106 to obtain a measurement result, which may include S10121 - S10122 .

[0160] S10121 , causing the first platform 101 carrying the object to be tested to drive the object to be tested 106 to rotate.

[0161] S10122 , while the object to be measured 106 is rotating, the horizontal moving mechanism 107 is moved in the horizontal direction, and the first measuring mechanism 102 is used to measure the distance of the target area of ​​the object to be measured 106 to obtain a measurement result.

[0162] Specifically, during the pre-alignment process of the object to be measured 106 by the first platform 101, the first platform 101 will drive the object to be measured 106 to rotate so that the notch of the object to be measured 106 is oriented in the appropriate direction. During the rotation, the warping detection at various circumferential angles of the target position can be realized, that is, the distance detection of the adjacent positions of the target position in various directions is performed, thereby obtaining multiple inclinations of multiple tangents at the target position, clarifying the degree of warping in various directions, so as to improve the accuracy of determining the inclination at the target position. While the first platform 101 rotates the object to be measured 106, the distance measurement process can be performed, that is, the second measuring mechanism 104 starts to collect data, and accompanied by the translation in the radial direction controlled by the horizontal adjustment mechanism 105, a scanning measurement is performed on the peripheral area of ​​the surface of the object to be measured 106, thereby obtaining the measurement result.

[0163] In this way, during the pre-alignment process of the object to be measured 106 , a rough distance measurement can be performed on the object to be measured 106 , thereby improving the overall measurement efficiency without spending extra time on distance measurement.

[0164] The various embodiments in this specification are described in a progressive manner. Similar portions between the various embodiments can be referenced to each other. Each embodiment focuses on the differences from the other embodiments. In particular, the method embodiments are described briefly because they are generally similar to the apparatus embodiments. For relevant portions, refer to the description of the apparatus embodiments.

[0165] The above is only a preferred embodiment of the present application. Although the present application has been disclosed as a preferred embodiment, it is not intended to limit the present application. Any technician familiar with the art can use the above-disclosed methods and technical contents to make many possible changes and modifications to the technical solution of the present application without departing from the scope of the technical solution of the present application, or modify it into an equivalent embodiment with equivalent changes. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are still within the scope of protection of the technical solution of the present application.

Claims

1. A thickness measuring device, characterized in that: The thickness measuring device includes a loading platform, a first measuring mechanism, a second measuring mechanism, an adjusting mechanism and a control module; The loading platform is used to carry the object to be measured, and the first measuring mechanism is used to measure the distance of the target position of the object to be measured on the loading platform to obtain the target distance between the target position and the first measuring mechanism; The control module is used to determine the posture adjustment parameters based on the target distance; the adjustment mechanism is used to adjust the posture of the second measuring mechanism based on the posture adjustment parameters; the second measuring mechanism is used to measure the thickness of the target position of the object to be measured located on the loading platform after the posture adjustment is completed.

2. The thickness measuring device according to claim 1, characterized in that The posture adjustment parameters include adjusting the height; The control module is configured to determine the adjustment height based on a difference between the target distance and a reference distance; the reference distance being the distance between a reference position of a reference object having a flat surface and the first measuring mechanism; The adjustment mechanism includes a height adjustment mechanism, and the height adjustment mechanism is used to adjust the height of the second measuring mechanism based on the adjustment height.

3. The thickness measuring device according to claim 1, characterized in that The posture adjustment parameters include tilt; The first measuring mechanism is used to measure the distance of the target area of ​​the object to be measured located on the object loading platform to obtain a measurement result; the target position is located in the target area; the measurement result includes the distance between each position in the target area and the first measuring structure; The control module is configured to determine an inclination at the target position based on the measurement result; The adjustment mechanism includes a tilt adjustment mechanism, and the tilt adjustment mechanism is used to adjust the tilt degree of the second measuring mechanism based on the tilt.

4. The thickness measuring device according to claim 3, characterized in that: The thickness measuring device further includes a horizontal movement mechanism; The horizontal moving mechanism is used to move the first measuring mechanism in a horizontal direction so that the first measuring mechanism performs distance measurement on various positions within the target area.

5. The thickness measuring device according to claim 1, wherein: The measurement accuracy of the first measuring mechanism is lower than the measurement accuracy of the second measuring mechanism.

6. The thickness measuring device according to claim 1, characterized in that: The first measuring mechanism or the second measuring mechanism is one of a dual-channel distance sensor, a laser displacement sensor or an electrostatic capacitance displacement sensor.

7. The thickness measuring device according to claim 6, characterized in that: When the second measuring mechanism is the dual-channel distance sensor, the dual-channel distance sensor includes a first sensor located on one side of the object to be measured, and a second sensor located on the other side of the object to be measured; the object to be measured is located between the first sensor and the second sensor; The adjustment mechanism is connected to both the first sensor and the second sensor, and is used to adjust the postures of the first sensor and the second sensor based on the posture adjustment parameters.

8. The thickness measuring device according to claim 1, wherein: The loading platform includes a first platform and a second platform, and the thickness measuring device also includes a gripping mechanism; The first platform and the second platform are both used to carry the object to be tested; the gripping mechanism is used to move the object to be tested from the first platform to the second platform; The first measuring mechanism is used to measure the distance of the target position of the object to be measured on the first platform to obtain the target distance between the target position and the first measuring mechanism; The second measuring mechanism is used to measure the thickness of the target position of the object to be measured on the second platform after the posture adjustment is completed.

9. The thickness measuring device according to claim 8, characterized in that: The first platform carrying the object to be tested is also used to perform a pre-alignment process on the object to be tested.

10. The thickness measuring device according to claim 8, characterized in that: The first platform can drive the object to be measured to rotate.

11. The thickness measuring device according to claim 8, characterized in that: The second platform includes a first supporting component and a second supporting component, the first supporting component is used to support the central area of ​​the object to be measured, and the second supporting component is used to support the peripheral area of ​​the object to be measured; the target position is located between the central area and the peripheral area.

12. A thickness measurement method, characterized in that: Applied to the thickness measuring device according to any one of claims 1 to 11, the method comprises: Placing the object to be measured on the object loading platform; measuring the distance of the target position of the object to be measured by the first measuring mechanism to obtain the target distance between the target position and the first measuring mechanism; determining a posture adjustment parameter based on the target distance; Based on the posture adjustment parameter, adjusting the posture of the second measuring mechanism by the adjustment mechanism; The thickness of the object to be measured is measured by the second measuring mechanism.

13. The thickness measurement method according to claim 12, characterized in that: The posture adjustment parameter includes adjusting the height; the adjustment mechanism includes a height adjustment mechanism; Determining a posture adjustment parameter based on the target distance includes: Determining a reference distance; the reference distance is the distance between a reference position of a reference object having a flat surface and the first measuring mechanism; determining the adjustment height based on a difference between the target distance and the reference distance; Based on the posture adjustment parameter, adjusting the posture of the second measuring mechanism by the adjustment mechanism includes: Based on the adjusted height, the height of the second measuring mechanism is adjusted by the height adjustment mechanism.

14. The thickness measurement method according to claim 13, characterized in that: Determine the benchmark distance, including: The reference distance is obtained by measuring the distance of the reference position of the reference object having a flat surface by the first measuring mechanism.

15. The thickness measurement method according to claim 12, characterized in that: The posture adjustment parameter includes an inclination; the adjustment mechanism includes an inclination adjustment mechanism; Measuring the distance of the target position of the object to be measured by the first measuring mechanism to obtain the target distance between the target position and the first measuring mechanism includes: The first measuring mechanism performs distance measurement on a target area of ​​the object to be measured to obtain a measurement result; the target position is located within the target area; the measurement result includes the distance between each position within the target area and the first measuring structure; Determining a posture adjustment parameter based on the target distance includes: determining an inclination at the target location based on the measurement result; Based on the posture adjustment parameter, adjusting the posture of the second measuring mechanism by the adjustment mechanism includes: The tilt degree of the second measuring mechanism is adjusted by the tilt adjustment mechanism based on the tilt.

16. The thickness measurement method according to claim 15, characterized in that: The thickness measuring device further includes a horizontal movement mechanism; Performing distance measurement on a target area of ​​the object to be measured by the first measuring mechanism to obtain a measurement result includes: During the horizontal movement of the horizontal moving mechanism, the first measuring mechanism performs distance measurement on the target area of ​​the object to be measured to obtain the measurement result.

17. The thickness measurement method according to claim 16, characterized in that: During the horizontal movement of the horizontal moving mechanism, the first measuring mechanism performs distance measurement on the target area of ​​the object to be measured to obtain the measurement result, including: The first platform carrying the object to be tested drives the object to be tested to rotate; The horizontal moving mechanism is moved in the horizontal direction while the object to be measured is rotated, and the distance of the target area of ​​the object to be measured is measured by the first measuring mechanism to obtain the measurement result.

Images