Semiconductor chip on-line testing device

Abstract

The invention provides a semiconductor chip on-line test device, and particularly relates to the technical field of chip performance test.The semiconductor chip on-line test device comprises a test box, a main controller is installed at the top of one side of the test box, and a vertical heat insulation plate is fixedly arranged in the middle of an inner cavity of the test box; a test space is divided into a low-temperature test area and a high-temperature test area which are independent through a vertical heat insulation plate and a horizontal heat insulation plate, an annular groove is formed in the position, corresponding to the permanent magnet ring, of the top face of the horizontal heat insulation plate, two symmetrically-arranged permanent magnet blocks are arranged in the annular groove in a sliding mode, and the positions of the two permanent magnet blocks correspond to the position of the permanent magnet ring in an up-and-down mode. The test board can enter different temperature zones at the same time for synchronous test under the driving of the circular ring plate, the problem of temperature fluctuation caused by environment exposure during environment switching in the prior art is avoided, the temperature of the temperature zones does not need to be frequently adjusted, the stability of the test environment is ensured, and the test efficiency of the semiconductor chip is improved.

Description

Technical Field

[0001] The present invention provides an online testing device for a semiconductor chip, and particularly relates to the technical field of chip performance testing. Background Art

[0002] High and low temperature testing is an integral part of semiconductor chip development, used to verify a chip's ability to operate under extreme temperature conditions. By simulating the chip's operating conditions at different temperatures, it ensures its stable operation across a wide range of environments.

[0003] After searching, the authorization announcement number CN117169699B discloses a chip high and low temperature testing equipment. Under the action of the connecting table, it drives the temperature control mechanism to move toward the chip on the placement table. With the cooperation of the temperature control mechanism, the chip is subjected to temperature linear testing. When it is necessary to switch to instantaneous temperature testing, the temperatures of the two sets of temperature control mechanisms are set relatively, and after approaching the chip on the placement table, when it moves up on the connecting table, it drives the drive rod to move upward, and under the action of the switching block one, the slider and the spiral groove three are in conflict with each other, so that the rotating table rotates, and the two sets of placement tables are exchanged, thereby achieving the effect of performing different testing methods on chips with different requirements.

[0004] The aforementioned test device achieves high and low temperature testing switching by "switching the placement table." This constitutes "time-sharing testing" (the same chip experiences high and low temperatures sequentially) rather than "synchronous testing" (multiple chips simultaneously in different temperature zones). This limits overall testing efficiency and fails to meet the needs of large-scale parallel testing. More importantly, when switching placement tables for instantaneous temperature testing, the test environment is completely exposed to the elements, directly disrupting the constant temperature of the test environment and affecting the high and low temperature testing of the semiconductor chip. Further adjustments to the test environment temperature undoubtedly increase the time and labor costs of the test process; directly testing the chip will result in distorted test data.

[0005] Therefore, the present invention proposes an online testing device for semiconductor chips to make up for the deficiencies of the prior art. Summary of the Invention

[0006] In view of the defects existing in the prior art, the present invention provides an online testing device for semiconductor chips, which can effectively solve the relevant technical problems raised in the background art.

[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions: The present invention discloses an online testing device for semiconductor chips, comprising a test box, a main controller being mounted on the top of one side of the test box, a vertical heat insulation board being fixedly mounted in the middle of the inner cavity of the test box, and two sealing holes being symmetrically arranged on one side of the vertical heat insulation board near the bottom thereof, a horizontal heat insulation board being fixedly mounted in the inner cavity of the test box and directly below the vertical heat insulation board, a test space being formed in the inner cavity of the test box and above the horizontal heat insulation board by the horizontal heat insulation board, and a low-temperature test area and a high-temperature test area being symmetrically arranged on both sides of the test space with the vertical heat insulation board as the central boundary; The testing mechanism is arranged inside the testing box and includes: a driving module, a switching testing module, and an adsorption module; The drive module is arranged at the bottom of the horizontal heat insulation board, and includes a drive motor, a transmission assembly, and a transverse plate, wherein the transmission assembly includes a gear transmission mechanism or a synchronous belt transmission mechanism, which can transmit the rotational motion of the drive motor to the transverse plate; The switching test module is arranged on the upper and lower sides of the horizontal insulation plate. It includes two test plates for loading semiconductor chips and a circular plate arranged outside the two test plates. The circular plate is sealed and inserted into the two sealing holes. The low-temperature test area and the high-temperature test area are isolated by the circular plate and the vertical insulation plate. After the semiconductor chips are loaded on the test plates, high and low temperature tests are performed simultaneously in the two test areas. The drive motor drives the transmission assembly to drive the horizontal plate to rotate half a circle, driving the switching test module to rotate synchronously; The adsorption module is arranged on one side of the vertical insulation board close to the low temperature test area and is located on the path where the driving module drives the switching test module to rotate from the high temperature test area to the low temperature test area.

[0008] Preferably, the vertical insulation panels and the horizontal insulation panels are both made of aerogel material.

[0009] Preferably, the drive motor is fixedly mounted on the bottom surface of the inner cavity of the test box, and the shaft of the drive motor is in transmission connection with the transmission assembly, and the top of the transmission assembly away from the shaft is fixedly connected to the transverse plate.

[0010] Preferably, the switching test module also includes a permanent magnet ring fixedly connected to the top of the horizontal plate, and an annular groove is provided on the top surface of the horizontal heat insulation plate at a position corresponding to the permanent magnet ring, and two symmetrically arranged permanent magnet blocks are slidably arranged in the annular groove, and the positions of the two permanent magnet blocks correspond to the positions of the permanent magnet ring up and down, and the two have opposite magnetic properties, and the top of the permanent magnet block is fixedly connected to the bottom of the test plate.

[0011] Preferably, a hollow layer is provided inside the horizontal heat insulation board at a position corresponding to the permanent magnet ring and the permanent magnet block.

[0012] Preferably, a semi-annular plate is fixed between the two permanent magnet blocks. The semi-annular plate is located in the annular groove. A gap is provided at the bottom of the vertical insulation plate for the permanent magnet blocks and the semi-annular plate to pass through. The semi-annular plate is always sealed in the gap.

[0013] Preferably, the adsorption module includes a first electric telescopic rod fixedly mounted on a side of the vertical insulation board close to the low-temperature test area, and a wiping assembly for adsorbing water droplets is connected to the telescopic end of the first electric telescopic rod.

[0014] Preferably, the wiping assembly consists of an outer shell, a plug-in plate, and an adsorption cotton strip, wherein the outer shell is fixedly connected to the telescopic end of the first electric telescopic rod, and a T-shaped ridge is provided on the top of the plug-in plate, which is inserted into the T-shaped groove on the top of the outer shell. The adsorption cotton strip is adhered to the bottom surface of the plug-in plate, and the bottom and one side of the outer shell are provided with openings, and the bottom of the adsorption cotton strip is located at the opening at the bottom.

[0015] Preferably, a processing mechanism is further provided below the wiping assembly and on the vertical heat insulation board, which includes two electric guide rails fixedly mounted on one side of the vertical heat insulation board close to the wiping assembly, electric sliders are slidably connected to the two electric guide rails, a second electric telescopic rod is fixedly mounted on the top of each electric slider, a collection box is fixedly connected to the telescopic ends of the second electric telescopic rods, a grid plate is slidably connected inside the collection box, at least four springs are evenly connected between the bottom of the grid plate and the bottom surface of the collection box, and the four springs are symmetrically arranged in pairs; Among them, when the electric slider slides and translates on the electric guide rail to form the end, the collection box is just located directly below the adsorption cotton strip in the wiping assembly, and when the telescopic end of the second electric telescopic rod extends to the end of the stroke, the collection box is covered on the outside of the adsorption cotton strip, and the grid plate is squeezed and fitted with the adsorption cotton strip.

[0016] Preferably, a drain pipe is provided at the bottom of the collecting box for connecting to an external pipe body.

[0017] Compared with the prior art, the technical solution provided by the present invention has the following beneficial effects: Compared with the existing technology, this semiconductor chip online testing device divides the test space into independent low-temperature test areas and high-temperature test areas through vertical and horizontal heat insulation plates. Driven by the circular plate, the test board can enter different temperature zones simultaneously for synchronous testing. This avoids the temperature fluctuation problem caused by exposure to the environment when switching environments in the existing technology. There is no need to frequently adjust the temperature of the temperature zones, which not only ensures the stability of the test environment but also improves the testing efficiency of semiconductor chips. The drive module uses the hollow layer of the permanent magnet ring to achieve power transmission, ensuring the sealing of the two test spaces and thus ensuring the stability of the spatial temperature of the two test areas; After the cleaning is completed by the first electric telescopic rod, the collection box is driven up by the electric guide rail. The grid plate squeezes the adsorption cotton strips and collects the waste liquid into the collection box. This not only ensures the adsorption of the adsorption cotton strips, but also prevents the waste liquid from dripping and contaminating the test space or chips. The drainage pipe at the bottom of the collection box can be connected to an external recovery system to achieve centralized treatment of the waste liquid and prevent the waste liquid from remaining in the test space and affecting the humidity of the test space. In summary, the testing device systematically solves the problems of low testing efficiency, poor environmental stability and high pollution risk in the existing technology through the coordinated design of the testing mechanism, adsorption module and processing mechanism, forming a technical closed loop of "synchronous testing, clean transmission and automatic cleaning", and providing a high-precision and highly adaptable innovative solution for the temperature resistance performance test of semiconductor chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a main perspective structural diagram of the present invention; Figure 2 This is a three-dimensional structural diagram of the test box in the present invention in a cutaway state; Figure 3 This is a three-dimensional structural diagram of the test box in the present invention in a cutaway state from another perspective; Figure 4 It is a partial three-dimensional structural diagram of the relevant components of the drive motor in the present invention; Figure 5 It is a partial three-dimensional structural diagram of the relevant components at the annular groove of the present invention; Figure 6 A partially exploded three-dimensional structural diagram of the relevant components of the switching test module in the present invention; Figure 7 A partial three-dimensional structural diagram of the relevant components of the horizontal heat insulation board in the present invention in a cutaway state; Figure 8 A partially exploded three-dimensional structural diagram of the wiping component of the present invention; Figure 9 This is a schematic diagram of the motion state of the test board and other components in the present invention; Figure 10 It is a partial three-dimensional structural diagram of the relevant components of the grid plate in the present invention; Figure 11 It is a partial bottom-up stereoscopic structural diagram of the electric guide rail in the present invention; Figure 12 It is a partial three-dimensional structural diagram of the relevant components of the collection box in the cut state in the present invention.

[0019] The numbers in the figure represent: 1. Test chamber; 11. Main controller; 12. Vertical insulation board; 121. Sealing hole; 13. Horizontal insulation board; 131. Hollow layer; Testing agency: Drive module: 21, drive motor; 22, transmission assembly; 23, cross plate; Switching test module: 24, permanent magnet ring; 25, annular groove; 26, permanent magnet block; 261, half ring plate; 27, test plate; 28, circular ring plate; Adsorption module: 29, first electric telescopic rod; 210, wiping component; Processing mechanism: 31. Electric guide rail; 32. Electric slider; 33. Second electric telescopic rod; 34. Collection box; 35. Grid plate; 36. Spring. DETAILED DESCRIPTION

[0020] The present invention will be further described below with reference to the embodiments.

[0021] Example 1: like Figures 1 to 9 As shown, a semiconductor chip online testing device includes a test box 1 and a cooling and heating device disposed on the test box 1. A main controller 11 is installed on the top of one side of the test box 1. A vertical heat insulation board 12 is fixedly installed in the middle of the inner cavity of the test box 1, and two sealing holes 121 are symmetrically provided on one side of the vertical heat insulation board 12 near its bottom. A horizontal heat insulation board 13 is fixedly installed in the inner cavity of the test box 1 and directly below the vertical heat insulation board 12. The horizontal heat insulation board 13 forms a test space in the inner cavity of the test box 1 and above the horizontal heat insulation board 13. The test space is symmetrically provided with a low-temperature test area and a high-temperature test area on both sides with the vertical heat insulation board 12 as the central boundary. The vertical heat insulation board 12 and the horizontal heat insulation board 13 are both made of aerogel material. Their function is to block heat exchange while allowing magnetic force to pass through, ensuring the stability of the temperature zone during the switching process.

[0022] Specifically, the above-mentioned refrigeration device and heating device are both existing technologies. Both are respectively arranged on the top of the test box 1, and are controlled by the main controller 11. The output ends / air supply ends of both are both arranged inside the test box 1 and correspond to the low-temperature test area and the high-temperature test area respectively.

[0023] The testing mechanism is arranged inside the testing box 1 and includes a driving module and a switching testing module.

[0024] The drive module is located at the bottom of the horizontal heat insulation board 13 and includes a drive motor 21, a transmission assembly 22, and a transverse plate 23. The transmission assembly 22 includes a gear transmission mechanism or a synchronous belt transmission mechanism, which can transmit the rotational motion of the drive motor 21 to the transverse plate 23; The drive motor 21 is fixedly mounted on the bottom surface of the inner cavity of the test box 1 , and the shaft of the drive motor 21 is in transmission connection with the transmission assembly 22 , and the top of the transmission assembly 22 away from the shaft is fixedly connected to the transverse plate 23 .

[0025] Preferably, the transmission assembly 22 is a gear transmission mechanism configured as a large and a small meshing gear set, wherein the small gear is coaxially connected to the shaft of the drive motor 21 via a coupling, and the large gear is rotatably mounted on the bottom of the horizontal heat shield 13, with its top center fixedly connected to the bottom center of the cross plate 23. Alternatively, the transmission assembly 22 may be a synchronous belt transmission mechanism, specifically consisting of two synchronous pulleys and a synchronous belt connected between the two synchronous pulleys, one of which is connected to the shaft of the drive motor 21, and the other is fixedly connected to the bottom center of the cross plate 23.

[0026] Note: Other mechanisms that can realize the synchronous rotation of the drive motor 21 shaft and the horizontal plate 23 can be adopted, and the gear transmission mechanism and the synchronous belt transmission mechanism are both conventional transmission methods in the mechanical field. Those skilled in the art can select the appropriate transmission form according to actual needs.

[0027] The switching test module is arranged on the upper and lower sides of the horizontal insulation plate 13. It includes two test plates 27 for loading semiconductor chips and a circular plate 28 arranged on the outside of the two test plates 27. The circular plate 28 is sealed and penetrates the two sealing holes 121. The circular plate 28 and the vertical insulation plate 12 isolate the low-temperature test area and the high-temperature test area. After the semiconductor chips are loaded on the test plates 27, high and low temperature tests are performed simultaneously in the two test areas. The upper surface of the test plates 27 is evenly provided with multiple loading slots for loading semiconductor chips. The switching test module also includes a permanent magnet ring 24 fixedly connected to the top of the horizontal plate 23. An annular groove 25 is provided on the top surface of the horizontal heat shield 13, corresponding to the position of the permanent magnet ring 24. Two symmetrically arranged permanent magnets 26 slide within the annular groove 25. The two permanent magnets 26 are positioned vertically corresponding to the position of the permanent magnet ring 24, have opposite magnetic properties, and are both made of neodymium iron boron. The top of the permanent magnets 26 is fixedly connected to the bottom of the test plate 27.

[0028] The drive motor 21 drives the transmission assembly 22 to drive the horizontal plate 23 to rotate half a circle, and then drives the switching test module to rotate synchronously; Furthermore, a hollow layer 131 is provided inside the horizontal heat insulation board 13 and at a position corresponding to the permanent magnet ring 24 and the permanent magnet block 26 , which serves to further reduce the influence on the magnetic attraction between the permanent magnet ring 24 and the permanent magnet block 26 .

[0029] Furthermore, a semi-annular plate 261 is fixedly provided between the two permanent magnet blocks 26. The semi-annular plate 261 is located in the annular groove 25. A gap is provided at the bottom of the vertical heat insulation plate 12 for the permanent magnet blocks 26 and the semi-annular plate 261 to pass through. The semi-annular plate 261 is always sealed in the gap. Its function is to ensure the sealing barrier properties of the vertical heat insulation plate 12 between the high and low temperature test areas.

[0030] During use, personnel first load the semiconductor chips to be tested into the loading slots of test board 27. Main controller 11 then activates the cooling and heating devices, respectively delivering cold and hot airflow to the low-temperature and high-temperature test areas within test chamber 1, separated by vertical insulation panels 12 and horizontal insulation panels 13, to create a stable testing environment. High and low-temperature tests are then performed simultaneously on the semiconductor chips in both areas.

[0031] The permanent magnet block 26 at the bottom of the test plate 27 and the permanent magnet ring 24 at the bottom of the horizontal plate 23 form a magnetic coupling through the hollow layer 131 of the horizontal heat insulation plate 13, and the semi-annular plate 261 simultaneously blocks the gap of the vertical heat insulation plate 12 to ensure the sealed isolation of the temperature zone. After the above test is completed, when an instantaneous temperature test is required, the drive motor 21 is started, and the horizontal plate 23 is driven to rotate half a circle through the transmission component 22. The horizontal plate 23 drives the permanent magnet ring 24 to rotate, and the magnetic field penetrates the horizontal heat insulation plate 13 to drive the permanent magnet block 26 to slide in the annular groove 25, so that the test plate 27 and the circular ring plate 28 rotate around the central axis of the vertical heat insulation plate 12, so that the semiconductor chip in the high-temperature test zone rotates toward the direction close to the low-temperature test zone, realizing the synchronous switching of the two parts of the semiconductor chips in the high and low temperature zones. For details, please refer to Figure 9 shown.

[0032] Example 2: like Figure 8 、 Figure 9 As shown, the above-mentioned semiconductor chip online testing device also includes an adsorption module, which is arranged on one side of the vertical insulation board 12 close to the low-temperature test area and is located on the path where the driving module drives the switching test module to rotate from the high-temperature test area to the low-temperature test area.

[0033] The adsorption module includes a first electric telescopic rod 29 fixedly mounted on one side of the vertical insulation board 12 close to the low-temperature test area, and a wiping assembly 210 for adsorbing water droplets is connected to the telescopic end of the first electric telescopic rod 29; the adsorption module also includes a detection sensor arranged on the vertical insulation board 12.

[0034] The wiping assembly 210 consists of an outer shell, a plug-in board, and an adsorption cotton strip, wherein the outer shell is fixedly connected to the telescopic end of the first electric telescopic rod 29, and a T-shaped ridge is provided on the top of the plug-in board, which is inserted into the T-shaped groove on the top of the outer shell. The adsorption cotton strip is adhered to the bottom surface of the plug-in board. The bottom and one side of the outer shell are provided with openings, and the bottom of the adsorption cotton strip is located at the opening at the bottom. Specifically, a Velcro is provided at the bottom of the plug-in board, and the adsorption cotton strip is adhered to the Velcro.

[0035] In use: When a semiconductor chip rotates from a high-temperature test zone to a low-temperature test zone, condensation may form on the chip surface due to a sudden drop in temperature. The adsorption module is located at a fixed position along this rotation path. When the main controller 11 detects the preset coordinates before the test board 27 enters the low-temperature test zone, it automatically triggers the first electric telescopic rod 29 to operate.

[0036] The telescopic end of the first electric telescopic rod 29 drives the wiping assembly 210 toward the rotating chip surface, allowing the absorbent cotton strip to contact the semiconductor chip and the top surface of the test board 27, quickly absorbing condensed water from the semiconductor chip surface. After wiping is completed, the telescopic end of the first electric telescopic rod 29 retracts, and the wiping assembly 210 returns to its initial position.

[0037] When the adsorption cotton strip is saturated or seriously contaminated, the staff can manually pull the two sides of the adsorption cotton strip and use the sliding structure of the T-shaped convex strip and the outer shell to pull the plug plate out from the top of the outer shell; tear off the old adsorption cotton strip, stick a new cotton strip and reinsert it into the outer shell to complete the replacement.

[0038] Example 3: like Figures 10 to 12 As shown, the above-mentioned semiconductor chip online testing device further includes a processing mechanism disposed below the wiping assembly 210 and located on the vertical heat insulation plate 12; It includes two electric guide rails 31 fixedly mounted on the side of the vertical heat insulation plate 12 near the wiping assembly 210. An electric slider 32 is slidably connected to each of the two electric guide rails 31. A second electric telescopic rod 33 is fixedly mounted on the top of each electric slider 32. The telescopic ends of the second electric telescopic rods 33 are commonly fixedly connected to a collection box 34. A grid plate 35 is slidably connected to the collection box 34. At least four springs 36 are evenly connected between the bottom of the grid plate 35 and the bottom surface of the collection box 34. The four springs 36 are symmetrically arranged in pairs. Among them, when the electric slider 32 slides and translates on the electric guide rail 31 to form the end, the collection box 34 is just located directly below the adsorption cotton strip in the wiping assembly 210, and when the telescopic end of the second electric telescopic rod 33 extends to the end of the stroke, the collection box 34 is covered on the outside of the adsorption cotton strip, and the grid plate 35 is squeezed and matched with the adsorption cotton strip.

[0039] Furthermore, a drain pipe is provided at the bottom of the collection box 34 for connecting to an external pipe body. Specifically, one end of the external pipe body is connected to the drain pipe through a quick connector, and the other end is connected to the suction end of the water pump through a quick connector.

[0040] During use: After the adsorption module completes wiping and adsorbing condensed water from the semiconductor chip surface, the main controller 11 confirms through detection sensors that the wiping assembly 210 has returned to its initial position, triggering the processing mechanism to operate. Two electric guide rails 31 synchronously drive the electric slider 32 to slide, causing the collection box 34 to move horizontally directly below the adsorption sliver, aligning the top opening of the collection box 34 with the bottom of the sliver. Subsequently, the telescopic end of the second electric telescopic rod 33 extends upward, causing the collection box 34 to wrap around the outside of the adsorption sliver until the grid plate 35 contacts the bottom of the adsorption sliver and begins to squeeze. During this process, the spring 36 simultaneously compresses and provides a reaction force on the adsorption sliver, forcing the water on the adsorption sliver to be squeezed out. The squeezed water flows through the mesh of the grid plate 35 into the bottom of the collection box 34, enters the external pipe body through the drainage pipe, and is connected to the water pump. The main controller 11 then synchronizes and activates the collected water to be promptly transported to the external collection device, achieving closed-loop recycling.

[0041] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A semiconductor chip online testing device, comprising a test box (1), a main controller (11) being installed on the top of one side of the test box (1), characterized in that: A vertical heat insulation board (12) is fixedly provided in the middle of the inner cavity of the test box (1), and two sealing holes (121) are symmetrically provided on one side of the vertical heat insulation board (12) near the bottom thereof. A horizontal heat insulation board (13) is fixedly provided in the inner cavity of the test box (1) and directly below the vertical heat insulation board (12). A test space is formed in the inner cavity of the test box (1) and above the horizontal heat insulation board (13) through the horizontal heat insulation board (13), and the test space is symmetrically provided with a low-temperature test area and a high-temperature test area on both sides with the vertical heat insulation board (12) as the central boundary. The testing mechanism is arranged inside the testing box (1), and comprises: a driving module, a switching testing module, and an adsorption module; A drive module is provided at the bottom of the horizontal heat insulation board (13), comprising a drive motor (21), a transmission assembly (22), and a transverse board (23), wherein the transmission assembly (22) comprises a gear transmission mechanism or a synchronous belt transmission mechanism, capable of transmitting the rotational motion of the drive motor (21) to the transverse board (23); A switching test module is provided on the upper and lower sides of the horizontal heat insulation plate (13), and includes two test plates (27) for loading semiconductor chips and an annular plate (28) provided outside the two test plates (27). The annular plate (28) is sealed and penetrates into the two sealing holes (121). The low-temperature test area and the high-temperature test area are isolated by the annular plate (28) and the vertical heat insulation plate (12). After the semiconductor chips are loaded on the test plates (27), high and low-temperature tests are respectively performed simultaneously in the two test areas. The driving motor (21) drives the transmission assembly (22) to drive the horizontal plate (23) to rotate half a circle, thereby driving the switching test module to rotate synchronously; The adsorption module is arranged on a side of the vertical heat insulation board (12) close to the low-temperature test area, and is located on a path where the driving module drives the switching test module to rotate from the high-temperature test area to the low-temperature test area.

2. The semiconductor chip online testing device according to claim 1, characterized in that: The vertical heat insulation board (12) and the horizontal heat insulation board (13) are both made of aerogel material.

3. The semiconductor chip online testing device according to claim 1, characterized in that: The drive motor (21) is fixedly mounted on the bottom surface of the inner cavity of the test box (1), and the shaft of the drive motor (21) is in transmission connection with the transmission assembly (22), and the top of the transmission assembly (22) away from the shaft is fixedly connected to the transverse plate (23).

4. The semiconductor chip online testing device according to claim 1, wherein: The switching test module also includes a permanent magnet ring (24) fixedly connected to the top of the horizontal plate (23), an annular groove (25) is provided on the top surface of the horizontal heat insulation plate (13) and at a position corresponding to the permanent magnet ring (24), and two symmetrically arranged permanent magnet blocks (26) are slidably arranged in the annular groove (25), the positions of the two permanent magnet blocks (26) correspond to the positions of the permanent magnet ring (24) up and down, and the two have opposite magnetic properties, and the top of the permanent magnet block (26) is fixedly connected to the bottom of the test plate (27).

5. The semiconductor chip online testing device according to claim 4, characterized in that: A hollow layer (131) is provided inside the horizontal heat insulation plate (13) at a position corresponding to the permanent magnetic ring (24) and the permanent magnetic block (26).

6. The semiconductor chip online testing device according to claim 4, characterized in that: A semi-annular plate (261) is fixedly provided between the two permanent magnet blocks (26), and the semi-annular plate (261) is located in the annular groove (25). A gap is provided at the bottom of the vertical heat insulation plate (12) for the permanent magnet blocks (26) and the semi-annular plate (261) to pass through, and the semi-annular plate (261) is always sealed in the gap.

7. The semiconductor chip online testing device according to claim 1, wherein: The adsorption module comprises a first electric telescopic rod (29) fixedly mounted on a side of the vertical heat insulation board (12) close to the low-temperature test area, and a wiping assembly (210) for adsorbing water droplets is connected to the telescopic end of the first electric telescopic rod (29).

8. The semiconductor chip online testing device according to claim 7, characterized in that: The wiping assembly (210) is composed of an outer shell, a plug-in board, and an adsorption cotton strip, wherein the outer shell is fixedly connected to the telescopic end of the first electric telescopic rod (29), the top of the plug-in board is provided with a T-shaped protrusion, and the T-shaped protrusion is inserted into the T-shaped groove at the top of the outer shell, the adsorption cotton strip is adhered to the bottom surface of the plug-in board, and the bottom and one side of the outer shell are provided with openings, and the bottom of the adsorption cotton strip is located at the opening at the bottom.

9. The semiconductor chip online testing device according to claim 8, characterized in that: A processing mechanism is further provided below the wiping assembly (210) and on the vertical heat insulation board (12), comprising two electric guide rails (31) fixedly mounted on a side of the vertical heat insulation board (12) close to the wiping assembly (210), electric sliders (32) being slidably connected to the two electric guide rails (31), a second electric telescopic rod (33) being fixedly mounted on the top of each electric slider (32), a collection box (34) being fixedly connected to the telescopic ends of the second electric telescopic rods (33), a grid plate (35) being slidably connected inside the collection box (34), at least four springs (36) being evenly connected between the bottom of the grid plate (35) and the inner bottom surface of the collection box (34), and the four springs (36) being symmetrically arranged in pairs; When the electric slider (32) slides and translates on the electric guide rail (31) to form an end, the collecting box (34) is located just below the adsorption cotton strip in the wiping assembly (210), and when the telescopic end of the second electric telescopic rod (33) extends to the end of the stroke, the collecting box (34) is covered on the outside of the adsorption cotton strip, and the grid plate (35) is squeezed and matched with the adsorption cotton strip.

10. The semiconductor chip online testing device according to claim 9, characterized in that: The bottom of the collecting box (34) is connected to a drain pipe for connecting to an external pipe body.

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