Double-sided releasable adhesive tape and curing process control system and method

Abstract

The application discloses double-sided peelable adhesive tape and a curing process control system and method thereof, and belongs to the technical field of adhesive tape curing equipment control, and comprises a UV irradiation adjusting module, a curing process continuation execution judging module, a reaction sufficiency evaluating module and a curing strategy determining module.The application can analyze the internal and external curing uniformity of the adhesive layer through a UV penetration consistency factor, realize the optimization of the energy distribution inside and outside the adhesive layer by combining internal supplemental curing with a multi-waveband irradiation process, and form a closed-loop control of physical energy regulation and chemical reaction verification by evaluating the reaction sufficiency of the bonding interface, so as to avoid problems such as tearing of the peeling surface, residual adhesive accumulation and peeling force fluctuation caused by uneven curing.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of adhesive tape curing equipment control, and particularly relates to double-sided peelable adhesive tape and a curing process control system and method thereof. BACKGROUND

[0002] In the current rapid development of the electronic information industry, the precision and efficiency of the manufacturing process of chips as core components are crucial. In the chip manufacturing process, the fixing and peeling of wafer and chip are key links, which have very high requirements for related materials and processes. Double-sided peelable adhesive tape plays an important role in this process, especially in chip polishing and chip packaging processes, providing reliable protection for the fixing and precise operation of wafer and chip.

[0003] In the chip polishing process, the wafer needs to be stably fixed on the grinding table for polishing and thinning operation. At this time, the heat-expandable peelable pressure-sensitive adhesive sheet material plays an important role as an application form of double-sided peelable adhesive tape. Specifically, the wafer is first pasted on the heat-expandable peelable pressure-sensitive adhesive sheet material and then fixed on the grinding table. Through the polishing and thinning process, the wafer reaches the specific thickness and specifications required for chip production. After polishing, the heat-expandable peelable pressure-sensitive adhesive sheet material is heated, the pressure-sensitive adhesive expands, and the wafer can be smoothly separated from the pressure-sensitive adhesive sheet material to become a wafer required for chip production. This method ensures the stable fixing of the wafer during polishing and convenient peeling after completion, avoiding damage to the wafer.

[0004] In the chip packaging process, the manufactured chip needs to be pasted on the heat-expandable peelable pressure-sensitive adhesive sheet material, and the chip is fixed on the stage through the adhesive sheet material to produce various packaged chips according to the requirements, ensuring that the chip can be accurately fixed during packaging and facilitating the packaging operation, and realizing damage-free peeling after packaging, meeting the high-precision requirements of chip packaging.

[0005] For example, the UV lamp cooling control method and device in the photoresist curing process of the invention patent announcement with announcement number: CN115799126B, the method comprises: determining the original temperature curve of each UV lamp when not cooling based on the photoresist curing process flow, determining the first type of UV lamp whose temperature exceeds the first threshold value based on the original temperature curve; based on the moment when the temperature of each first type of UV lamp reaches the second threshold value, start air cooling and update the temperature curve; based on the updated temperature curve, determine whether water cooling needs to be started, if so, start water cooling based on the updated temperature curve, close the air cooling, and update the temperature curve, based on the updated temperature curve, close the water cooling and update the temperature curve; if not, close the air cooling based on the updated temperature curve and update the temperature curve; based on the current temperature curve of each UV lamp, determine whether there is a first type of UV lamp in the subsequent process, and continue to perform the corresponding cooling operation based on the judgment result.

[0006] For example, the electrode adhesive tape manufacturing machine of the invention patent announcement with announcement number: CN103560099B, comprising: a conductive structure reel and a forming mold. The conductive structure reel is used to provide a conductive structure. The forming mold comprises an upper mold, a lower mold, a adhesive material injection port and a curing device. The upper mold and the lower mold are respectively movable up and down and engage with each other to form a space for receiving the conductive structure. The adhesive material injection port is used to inject adhesive material into the space. The curing device is used to cure the adhesive material in the space.

[0007] But in the process of implementing the technical scheme of the embodiments of the present application, it is found that the above-mentioned technology at least has the following technical problems:

[0008] The current adhesive tape curing method only focuses on the regulation of external curing conditions. In the process of UV curing or thermal curing, due to the limitation of heat transfer efficiency and light energy penetration depth, the outer adhesive material completes the crosslinking reaction first due to rapid energy absorption, while the inner adhesive material lags behind due to heat and light conduction lag, resulting in significant lag in curing reaction progress. When the internal adhesive layer is not fully cured, the peeling surface cannot occur precisely at the preset interface layer, but presents a tearing damage, causing the curing interface to be unclear and the peeling force to abnormally increase. This unstable peeling performance may cause wafer scratches, chip packaging position deviation and other problems in processes with extremely high precision requirements such as chip polishing and packaging, affecting product yield and reliability. SUMMARY

[0009] The first aspect of the present application provides a double-sided peelable adhesive tape curing process control system, comprising:

[0010] A UV irradiation adjustment module is used to record the double-sided peelable adhesive tape performing the adhesive tape curing process as a target adhesive tape, analyze the UV penetration consistency factor of the target adhesive tape, determine the internal and external curing uniformity information of the adhesive layer, and perform internal supplemental curing of the target adhesive tape.

[0011] The curing process continues to execute a determination module for evaluating the adjustment effect after the internal supplemental curing of the target adhesive tape, thereby determining the curing process continues to execute label.

[0012] A reaction sufficiency evaluation module is used to analyze the bonding interface reaction completeness score and evaluate the sufficiency of the chemical reaction of the bonding interface.

[0013] A curing strategy determination module is used to determine the curing strategy of the target adhesive tape in combination with the internal and external curing uniformity information after receiving the traceability determination signal, thereby completing the curing process of the target adhesive tape.

[0014] The second aspect of the present application provides a double-sided peelable adhesive tape curing process control method, comprising the following steps:

[0015] S1, the double-sided peelable adhesive tape executing the adhesive tape curing process is recorded as a target adhesive tape, the UV penetration consistency factor of the target adhesive tape is analyzed, thereby judging the internal and external curing uniformity information of the adhesive layer, and the internal supplemental curing of the target adhesive tape is performed.

[0016] S2, after the internal supplemental curing of the target adhesive tape, the adjustment effect is evaluated, thereby determining the curing process continues to execute label.

[0017] S3, the bonding interface reaction completeness score is analyzed, and the sufficiency of the chemical reaction of the bonding interface is evaluated.

[0018] S4, after receiving the traceability determination signal, the curing strategy of the target adhesive tape is determined in combination with the internal and external curing uniformity information of the adhesive layer, thereby completing the curing process of the target adhesive tape.

[0019] The third aspect of the present application provides a double-sided peelable adhesive tape, comprising: a pressure-sensitive adhesive is coated on a plastic film substrate and dried and cured.

[0020] The pressure-sensitive adhesive comprises resin, monomer, initiator, expanded microspheres and solvent.

[0021] One or more technical solutions provided in the present application have at least the following technical effects or advantages:

[0022] 1, the double-sided peelable adhesive tape and its curing process control system provided by the present application can analyze the internal and external curing uniformity of the adhesive layer through the UV penetration consistency factor, realize the optimization of the energy distribution inside and outside the adhesive layer by combining the internal supplemental curing of long-wavelength UV light and the multi-band irradiation process, and form a closed-loop control of physical energy regulation and chemical reaction verification by evaluating the sufficiency of the bonding interface reaction, thereby avoiding problems such as tearing of the peeling surface, residual glue accumulation and peeling force fluctuation caused by uneven curing.

[0023] 2、The present application can realize uniform curing of the adhesive layer by performing internal supplemental curing of the target adhesive tape, using long-wavelength UV light to enhance UV energy input in the deep part of the adhesive layer, avoiding excessive curing of the surface due to energy concentration, effectively improving the matching of internal transmittance and UV energy density, reducing the thermal conduction difference between the inside and outside of the adhesive layer, making the curing reaction strength and rate inside and outside the adhesive layer consistent, and realizing uniform curing of the adhesive layer.

[0024] 3、The present application can quantify the completeness of the chemical reaction between the adhesive layer and the release layer by evaluating the sufficiency of the chemical reaction at the bonding interface, identify the potential risk of insufficient interface reaction during curing, avoid problems such as tearing of the release surface and accumulation of residual adhesive in the boundary layer caused by incomplete reaction, ensure a clear release interface and stable release force, and significantly improve the interface bonding reliability of the double-sided releasable adhesive tape. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 The structure diagram of the double-sided releasable adhesive tape curing process control system provided by the embodiment of the present application is shown.

[0026] Figure 2 The flowchart of the double-sided releasable adhesive tape curing process control method provided by the embodiment of the present application is shown.

[0027] Figure 3 The target adhesive tape curing strategy execution flowchart related to the embodiment of the present application is shown.

[0028] Figure 4 The material production system home page related to the embodiment of the present application is shown.

[0029] Figure 5 The UV irradiation monitoring interface of the material production system related to the embodiment of the present application is shown.

[0030] Figure 6 The curing execution monitoring interface of the material production system related to the embodiment of the present application is shown.

[0031] Figure 7 The visualization interface of the material production system related to the embodiment of the present application is shown. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present application will be described in detail below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0033] REFERENCE Figure 4As shown, the material production system homepage related to the embodiment of the application can obtain the current system production object and historical production records.

[0034] Referring to Figure 1 As shown, the first aspect of the application provides a double-sided peelable adhesive tape curing process control system, which comprises:

[0035] Referring to Figure 5 As shown, the UV irradiation monitoring interface of the material production system related to the embodiment of the application can monitor the current UV power and exposure time, and set the required UV wavelength.

[0036] The UV irradiation adjustment module is used to mark the double-sided peelable adhesive tape performing the adhesive tape curing process as a target adhesive tape, analyze the UV penetration consistency factor of the target adhesive tape, judge the internal and external curing uniformity information of the adhesive layer, and perform internal supplemental curing of the target adhesive tape.

[0037] In this embodiment, the internal and external curing uniformity information of the adhesive layer is judged, and the specific analysis method is as follows:

[0038] Collecting photothermal curing data, including surface reflectivity, internal transmittance, UV (Ultra-Violet) energy density and temperature gradient.

[0039] It should be noted that the surface reflectivity refers to the ratio of reflected light energy to incident light energy when UV light irradiates the surface of the target adhesive tape, which can be collected by a UV reflectometer. The internal transmittance refers to the ratio of transmitted light energy to incident light energy after the UV light penetrates the adhesive layer of the adhesive tape, which is used to reflect the penetration ability of the UV light in the adhesive layer. It can be measured by a UV transmissometer. The UV energy density refers to the UV light energy received per unit area, which can be measured using a UV energy meter. The temperature gradient refers to the temperature change rate at different depths in the adhesive layer, which reflects the uniformity of heat conduction in the curing process, and can be collected by a thermocouple array.

[0040] The greater the ratio of internal transmittance to surface reflectivity, the stronger the ability of the UV light to penetrate the adhesive layer (more light enters the interior rather than being reflected by the surface), and the higher the UV energy density (sufficient cumulative energy per unit area), which can make the curing energy received by the interior and surface of the adhesive layer closer. At the same time, the smaller the temperature gradient means that the heat conduction of the adhesive layer is more uniform, avoiding the difference in reaction rate caused by overheating of the surface or insufficient temperature in the interior. When the three work together, the strength and rate of the internal and external curing reactions of the adhesive layer tend to be consistent, and the internal and external curing uniformity of the adhesive layer is high.

[0041] Extract the reference UV energy density and reference temperature gradient stored in the database.

[0042] Extract the preset UV transmittance distribution coefficient, UV energy density distribution coefficient and temperature gradient distribution coefficient in the database.

[0043] It should be noted that the UV transmittance distribution coefficient, the UV energy density distribution coefficient and the temperature gradient distribution coefficient are all in the range of 0-1, and the sum of the UV transmittance distribution coefficient, the UV energy density distribution coefficient and the temperature gradient distribution coefficient is 1. When used, the preset values can be directly extracted from the database. For example, a one-to-one mapping set is constructed by respectively matching the ratio of internal transmittance to surface reflectance, UV energy density and temperature gradient with the corresponding UV transmittance distribution coefficient, UV energy density distribution coefficient and temperature gradient distribution coefficient. When used, the obtained ratio of internal transmittance to surface reflectance, UV energy density and temperature gradient are respectively input into the corresponding mapping set, so as to extract the UV transmittance distribution coefficient, the UV energy density distribution coefficient and the temperature gradient distribution coefficient.

[0044] Based on the photothermal curing data, the UV transmittance consistency factor is analyzed.

[0045] The UV transmittance consistency factor is a quantitative index that the surface reflectance, internal transmittance, UV energy density and temperature gradient jointly affect the uniformity of the target adhesive tape adhesive layer internal and external curing. The specific analysis process is: comparing the internal transmittance and the surface reflectance, comparing the UV energy density with the corresponding reference value, comparing the reference value of the temperature gradient with the temperature gradient, and coupling the results of each comparison processing with the corresponding distribution coefficient, so as to obtain the UV transmittance consistency factor.

[0046] It should be noted that the surface reflectance, internal transmittance, UV energy density and temperature gradient are interrelated and dynamically affect each other: the surface reflectance directly determines the loss proportion of UV light incident energy, the higher the reflectivity, the lower the internal transmittance, which leads to that the UV energy density inside the adhesive layer is significantly lower than the surface, and the difference in UV energy density will cause the temperature gradient to change-the surface temperature rises rapidly due to energy concentration, and the internal temperature rises slowly due to insufficient energy, forming an internal and external temperature difference, and the temperature gradient will in turn affect the distribution and absorption of UV energy, for example, the molecular movement of the adhesive layer in the high temperature area is intensified, which may change the light absorption characteristics, further affecting the matching of the surface reflectance and the internal transmittance.

[0047] In specific embodiments, the UV transmittance consistency factor is specifically represented as follows:

[0048]

[0049] Wherein, A is the UV transmittance consistency factor, R s is the surface reflectance, T s is the internal transmittance, E is the UV energy density, is a temperature gradient, E vef is a reference UV energy density, is a reference temperature gradient, a1 is a UV penetration distribution coefficient, a2 is a UV energy density distribution coefficient, and a3 is a temperature gradient distribution coefficient.

[0050] The preset UV penetration consistency threshold in the database is extracted.

[0051] If the UV penetration consistency factor is greater than or equal to the UV penetration consistency threshold, the internal and external curing uniformity information of the adhesive layer is recorded as uniform curing.

[0052] If the UV penetration consistency factor is greater than or equal to the UV penetration consistency threshold, it indicates that the target adhesive tape adhesive layer has consistent curing reaction intensity and rate between the inside and the surface during the UV curing process, and the internal and external curing uniformity of the adhesive layer can be determined.

[0053] If the UV penetration consistency factor is less than the UV penetration consistency threshold, the internal and external curing uniformity information of the adhesive layer is recorded as non-uniform curing.

[0054] If the UV penetration consistency factor is less than the UV penetration consistency threshold, it indicates that the adhesive layer has significant differences in received curing energy between the surface and the inside during the curing process, the surface is over-cured and the inside is under-cured, which ultimately leads to non-uniform internal and external curing uniformity of the adhesive layer, and is determined as a non-uniform curing state.

[0055] In this embodiment, internal supplemental curing of the target adhesive tape is performed, and the specific analysis process is as follows:

[0056] If the internal and external curing uniformity information of the adhesive layer is non-uniform curing, the UV penetration consistency threshold and the UV penetration consistency factor are processed by difference to obtain a UV penetration consistency deviation factor.

[0057] It should be noted that the difference processing means subtracting the UV penetration consistency factor from the UV penetration consistency threshold.

[0058] Based on the UV penetration consistency deviation factor, a UV irradiation parameter adjustment set is extracted.

[0059] It should be noted that the database stores a mapping set of the UV irradiation parameter adjustment set and the UV penetration consistency deviation factor, and when used, the real-time obtained UV penetration consistency deviation factor is input into the mapping set, and the UV irradiation parameter adjustment set can be extracted.

[0060] The UV irradiation parameter adjustment set includes a UV power supplement value and an exposure time supplement value.

[0061] The internal supplemental curing of the target adhesive tape is performed based on the UV irradiation parameter adjustment set, specifically, the current UV power is extracted from the system program log, the sum of the current UV power and the UV power supplemental value is taken as the execution UV power, and the internal supplemental curing of the target adhesive tape is completed based on the execution UV power with the exposure time supplemental value.

[0062] In specific embodiments, long-wavelength UV light needs to be used for internal supplemental curing. When long-wavelength UV light propagates in the adhesive layer, it can penetrate deep into the adhesive layer due to its low photon energy and small scattering loss, while short-wavelength UV light is easily absorbed by the surface substances of the adhesive layer and has limited penetration depth. When the adhesive layer has the condition of "external curing but internal uncuring", supplemental irradiation by long-wavelength UV light can effectively deliver UV energy to the internal uncured area without significantly increasing the surface energy input, thereby improving the matching of internal transmittance and UV energy density. In addition, the heat generated by the curing reaction initiated by long-wavelength light is more uniform, which can reduce the temperature gradient of the adhesive layer.

[0063] The curing process continues to execute the determination module, which is used to evaluate the adjustment effect after the internal supplemental curing of the target adhesive tape, thereby determining the curing process continues to execute the label.

[0064] In this embodiment, the determination of the curing process continues to execute the label, and the specific process is as follows:

[0065] The UV penetration consistency factor is reacquired.

[0066] If the reacquired UV penetration consistency factor is less than or equal to the UV penetration consistency threshold, the curing process continues to execute the label is marked as stopping the curing process, and a prompt information is generated simultaneously to prompt that the internal supplemental curing is invalid.

[0067] If the reacquired UV penetration consistency factor is greater than the UV penetration consistency threshold, the internal transmittance of the target adhesive tape is continuously monitored in a preset time window, thereby obtaining the internal transmittance drop value of the target adhesive tape.

[0068] If the internal transmittance drop value of the target adhesive tape is greater than or equal to the preset internal transmittance drop threshold, the curing process continues to execute the label is marked as stopping the curing process, and a prompt information is generated simultaneously to prompt that the internal supplemental curing is invalid.

[0069] If the internal transmittance drop value of the target adhesive tape is less than the preset internal transmittance drop threshold, the curing process continues to execute the label is marked as continuing to execute the curing process.

[0070] Referring to Figure 6 As shown in the figure, the material production system curing execution monitoring interface related to the embodiments of the present application is shown, by which the current curing process of the system can be monitored, and the operation log of the system curing execution process can be acquired synchronously.

[0071] a reaction sufficiency evaluation module for analyzing the bonding interface reaction completeness score to evaluate the bonding interface chemical reaction sufficiency.

[0072] In this embodiment, the bonding interface reaction completeness score is analyzed, and the specific analysis process is as follows:

[0073] When the curing process continues to execute the label Continue to execute the curing process, continue to execute the curing process of the target adhesive tape, extract each sample adhesive tape according to the preset number of samples in the database, and collect the interface reaction integrity data of each sample adhesive tape.

[0074] The interface reaction integrity data includes surface tension, residual functional group absorption peak, interfacial layer residual adhesive thickness, and average reaction temperature.

[0075] It should be noted that the surface tension refers to the mutual attraction between surface molecules, reflecting the molecular activity and reaction sufficiency of the interface between the adhesive layer and the release layer, which can be measured using a surface tension meter. The residual functional group absorption peak refers to the characteristic absorption peak intensity of the unreacted functional group in the cured adhesive layer in the infrared spectrum, which is used to characterize the completeness of the interface chemical reaction, which can be detected by a Fourier transform infrared spectrometer. The interfacial layer residual adhesive thickness refers to the thickness of the adhesive layer remaining on the surface of the release layer after the adhesive layer and the release layer are separated, which reflects the uniformity of the adhesive layer during interface separation, which can be measured by a white light interferometer. The average reaction temperature can be measured by a thermocouple array.

[0076] It should be noted that the functional groups include but are not limited to double bonds, hydroxyl groups, etc.

[0077] It should also be noted that the smaller the surface tension, the weaker the intermolecular attraction between the interface of the adhesive layer and the release layer, the lower the cross-linking degree of the adhesive layer molecules, and the reaction active groups do not fully participate in the curing reaction. The larger the residual functional group absorption peak, the higher the characteristic peak intensity of the unreacted functional group in the infrared spectrum, which directly reflects the incompleteness of the curing reaction. The larger the interfacial layer residual adhesive thickness, the less firm the adhesive layer is attached at the interface during peeling, resulting in weak cohesive force in the adhesive layer due to insufficient curing. The more the average reaction temperature deviates from the ideal temperature, the more the curing reaction rate deviates from the optimal interval (the reaction is slow at too low temperature, and side reactions or energy loss are induced at too high temperature), resulting in insufficient chemical reaction.

[0078] Extract the reference surface tension, reference residual functional group absorption peak, reference interfacial layer residual adhesive thickness, and ideal reaction temperature stored in the database.

[0079] Extract the surface tension distribution coefficient, residual functional group absorption peak distribution coefficient, interfacial layer residual adhesive thickness distribution coefficient, and average reaction temperature distribution coefficient preset in the database.

[0080] It should be noted that the surface tension distribution coefficient, the residual functional group absorption peak distribution coefficient, the interlayer residual adhesive thickness distribution coefficient and the average reaction temperature distribution coefficient are all in the range of 0-1, the sum of the surface tension distribution coefficient, the residual functional group absorption peak distribution coefficient, the interlayer residual adhesive thickness distribution coefficient and the average reaction temperature distribution coefficient is 1, and the pre-set values can be directly extracted from the database during use. For example, a one-to-one mapping set is constructed by the surface tension, the residual functional group absorption peak, the interlayer residual adhesive thickness and the average reaction temperature, and the corresponding surface tension distribution coefficient, the residual functional group absorption peak distribution coefficient, the interlayer residual adhesive thickness distribution coefficient and the average reaction temperature distribution coefficient. During use, the obtained surface tension, residual functional group absorption peak, interlayer residual adhesive thickness and average reaction temperature are respectively input into the corresponding mapping set, so that the surface tension distribution coefficient, the residual functional group absorption peak distribution coefficient, the interlayer residual adhesive thickness distribution coefficient and the average reaction temperature distribution coefficient are extracted.

[0081] The adhesion interface reaction completeness score is based on the interface reaction integrity data analysis.

[0082] The adhesion interface reaction completeness score is a quantitative index of the influence degree of the surface tension, the residual functional group absorption peak, the interlayer residual adhesive thickness and the average reaction temperature on the completeness of the chemical reaction between the target adhesive layer and the peeling layer of the adhesive tape. The specific analysis process is as follows: the surface tension is compared with the corresponding reference value, the reference values of the residual functional group absorption peak and the interlayer residual adhesive thickness are compared with the residual functional group absorption peak and the interlayer residual adhesive thickness respectively, the average reaction temperature is deviated from the ideal reaction temperature, and the coupling processing is performed on the comparison results and the deviation results combined with the corresponding distribution coefficients, so that the adhesion interface reaction completeness score is obtained.

[0083] It should be noted that the surface tension, the residual functional group absorption peak, the interlayer residual adhesive thickness and the average reaction temperature are related to each other and influence each other during the curing process of the double-sided peelable adhesive tape. The average reaction temperature directly affects the reaction rate and completeness of the curing reaction. If the temperature deviates from the ideal range, it will lead to insufficient curing reaction or cause side reactions, increase the intensity of the residual functional group absorption peak (increase the number of unreacted functional groups), and at the same time, the cross-linking degree of the adhesive layer is reduced, the surface tension is reduced (the intermolecular attraction is weakened), and the number of residual functional groups will weaken the cohesive force of the adhesive layer, resulting in an increase in the interlayer residual adhesive thickness and uneven distribution during peeling. In addition, abnormal temperature gradient will exacerbate the curing difference between the inside and outside of the adhesive layer, making the distribution of residual functional groups inside more uneven, further affecting the consistency of the surface tension and the uniformity of the residual adhesive thickness.

[0084] In specific embodiments, the adhesion interface reaction completeness score is specifically represented as follows:

[0085]

[0086] Wherein, B is the bonding interface reaction completeness score, γ is the surface tension, AFG is the residual functional group absorption peak, D is the interfacial layer residual adhesive thickness, T is the average reaction temperature, γ vef is the reference surface tension, AFG vef is the reference residual functional group absorption peak, D vef is the reference interfacial layer residual adhesive thickness, T0 is the ideal reaction temperature, β1 is the surface tension distribution coefficient, β2 is the residual functional group absorption peak distribution coefficient, β3 is the interfacial layer residual adhesive thickness distribution coefficient, and β4 is the average reaction temperature distribution coefficient.

[0087] In this embodiment, the bonding interface chemical reaction sufficiency evaluation is carried out, and the specific analysis process is as follows:

[0088] The bonding interface reaction completeness scores of the sample adhesive tapes are sequentially traversed, counted and extracted, and the average value of the bonding interface reaction completeness scores is obtained by mean processing.

[0089] The preset bonding interface reaction completeness score threshold in the database is extracted.

[0090] If the average value of the bonding interface reaction completeness scores is greater than the bonding interface reaction completeness score threshold, the bonding interface chemical reaction sufficiency evaluation result is recorded as complete reaction of the bonding interface, and the subsequent process is continued.

[0091] If the average value of the bonding interface reaction completeness scores is greater than the bonding interface reaction completeness score threshold, it indicates that the interface chemical reaction between the target adhesive layer and the release layer reaches an ideal state, and the interface chemical reaction is sufficient and complete, so that the subsequent process can be continued.

[0092] If the average value of the bonding interface reaction completeness scores is less than or equal to the bonding interface reaction completeness score threshold, the bonding interface chemical reaction sufficiency evaluation result is recorded as incomplete reaction of the bonding interface, and a traceability judgment signal is generated synchronously.

[0093] If the average value of the bonding interface reaction completeness scores is less than or equal to the bonding interface reaction completeness score threshold, it indicates that the interface chemical reaction is obviously insufficient and needs to be adjusted.

[0094] The curing strategy determination module is used to receive the traceability judgment signal, determine the target adhesive curing strategy in combination with the internal and external curing uniformity information of the adhesive layer, and thus complete the curing process of the target adhesive.

[0095] In this embodiment, the target adhesive curing strategy is determined in combination with the internal and external curing uniformity information of the adhesive layer, and the specific analysis process is as follows:

[0096] After receiving the traceability determination signal, if the internal and external curing uniformity information of the adhesive layer is uniform curing, the target adhesive tape curing strategy is recorded as stopping the current curing process, and a warning prompt information is generated synchronously.

[0097] It should be noted that if the internal and external curing uniformity information of the adhesive layer is uniform curing, it means that the UV light has good penetration ability through the adhesive layer, the UV energy density is uniformly distributed inside and outside the adhesive layer, and the temperature gradient is within the normal range, that is, the physical conditions (energy transfer, heat conduction) required for curing have been fully met. However, the interface reaction is still incomplete, indicating that the root cause is not abnormal UV light penetration or energy distribution, but the ratio or state of the chemical reactants themselves has defects: it may be that the amount of crosslinking agent in the pressure-sensitive adhesive formula is insufficient, the ratio of the main agent to the curing agent is deviated, resulting in that the active groups cannot fully react; it may also be that the spraying surface is contaminated with dust, grease and other pollutants during the coating process, or the material is aged or volatile components are lost due to improper storage, affecting the sufficiency of the interface chemical reaction. Since such problems cannot be improved by adjusting the UV irradiation parameters or temperature field, continuing the curing process will only increase energy consumption, so the current curing needs to be stopped immediately and a warning needs to be generated.

[0098] If the internal and external curing uniformity information of the adhesive layer is non-uniform curing, the target adhesive tape curing strategy is recorded as a segmented control interface reaction adjustment process.

[0099] If the internal and external curing uniformity information of the adhesive layer is non-uniform curing, although the UV power and temperature have been adjusted, the purpose of the adjustment is to restore the energy distribution, which belongs to the physical level adjustment and may not immediately cause the chemical reaction to be completed. After the incomplete reaction at the bonding interface, it needs to be adjusted again.

[0100] In this embodiment, the segmented control interface reaction adjustment process is as follows:

[0101] Based on the UV penetration consistency factor, a bonding interface reaction completeness correction factor is extracted.

[0102] It should be noted that the mapping set of the UV penetration consistency factor and the bonding interface reaction completeness correction factor is stored in the database. When used, the real-time obtained UV penetration consistency factor is input into the mapping set, and the bonding interface reaction completeness correction factor can be extracted.

[0103] Based on the average bonding interface reaction completeness score and the bonding interface reaction completeness correction factor, a bonding interface reaction completeness correction score is analyzed.

[0104] The adhesive interface reaction completeness correction score is a quantitative index of the influence degree of the adhesive interface reaction completeness correction factor and the adhesive interface reaction completeness score mean value on the corrected adhesive interface reaction completeness, and the specific analysis process is: based on the adhesive interface reaction completeness correction factor, the adhesive interface reaction completeness score mean value is corrected to obtain the adhesive interface reaction completeness correction score, which is specifically expressed as: the product of the adhesive interface reaction completeness score mean value and the adhesive interface reaction completeness correction factor is taken as the numerical result of the adhesive interface reaction completeness correction score.

[0105] The interface reaction adjustment set is extracted based on the adhesive interface reaction completeness correction score.

[0106] It should be noted that the database stores a mapping set of the interface reaction adjustment set and the adhesive interface reaction completeness correction score, and when used, the real-time obtained adhesive interface reaction completeness correction score is input into the mapping set to extract the interface reaction adjustment set.

[0107] The interface reaction adjustment set includes a surface heating temperature supplement value and a UV irradiation time supplement value.

[0108] Referring to Figure 3 As shown in the target adhesive curing strategy execution flowchart related to the embodiments of the present application, short wave and long wave irradiation are set, and the irradiation time and the temperature rise value of the two types of wavelengths are calculated in parallel, the deep layer curing adjustment is performed through the long wave irradiation time and the temperature rise value, and then the surface rapid curing is completed by using the short wave parameters, and finally the segmented control process is ended.

[0109] The multi-waveband UV irradiation process is set based on the interface reaction adjustment set, thereby completing the segmented control interface reaction adjustment process.

[0110] In specific embodiments, the multi-waveband UV irradiation process is set based on the interface reaction adjustment set, and the specific steps are as follows:

[0111] A1, setting multi-waveband UV irradiation, including short wave irradiation and long wave irradiation.

[0112] A2, extracting the preset wavelength corresponding irradiation time allocation factor in the database, including short wave irradiation time allocation factor and long wave irradiation time allocation factor, multiplying the short wave irradiation time allocation factor by the UV irradiation time supplement value to obtain the short wave irradiation time, and multiplying the long wave irradiation time allocation factor by the UV irradiation time supplement value to obtain the long wave irradiation time.

[0113] A3, synchronously extracting the preset wavelength corresponding temperature rise allocation factor in the database, including short wave temperature rise allocation factor and long wave temperature rise allocation factor, multiplying the short wave temperature rise allocation factor by the surface heating temperature supplement value to obtain the short wave temperature rise value, and multiplying the long wave temperature rise allocation factor by the surface heating temperature supplement value to obtain the long wave temperature rise value.

[0114] A4, based on the long-wave irradiation time and long-wave temperature value, the long-wave band is adjusted, and then based on the short-wave irradiation time and short-wave temperature value, the short-wave band is adjusted.

[0115] It should be noted that the short-wave UV light is mainly used for surface rapid curing reaction due to high photon energy and strong surface absorption efficiency, and the long-wave UV light can activate deep curing reaction due to large penetration depth and low scattering loss.

[0116] Referring to Figure 2 The second aspect of the present application provides a double-sided releasable adhesive tape curing process control method, comprising the following steps:

[0117] S1, the double-sided releasable adhesive tape executing the adhesive tape curing process is recorded as a target adhesive tape, the UV penetration consistency factor of the target adhesive tape is analyzed, the internal and external curing uniformity information of the adhesive layer is judged, and the internal supplemental curing of the target adhesive tape is performed.

[0118] S2, after the internal supplemental curing of the target adhesive tape, the adjustment effect is evaluated, and the curing process is determined to continue executing the label.

[0119] S3, the adhesion interface reaction completeness score is analyzed, and the adhesion interface chemical reaction sufficiency is evaluated.

[0120] S4, after receiving the traceability judgment signal, the target adhesive tape curing strategy is determined in combination with the internal and external curing uniformity information of the adhesive layer, and the curing process of the target adhesive tape is completed.

[0121] Referring to Figure 7 The material production system visualization interface related to the embodiments of the present application can monitor the temperature and energy distribution of the current system curing object.

[0122] The third aspect of the present application provides a double-sided releasable adhesive tape, comprising: a pressure-sensitive adhesive coated on a plastic film substrate, and dried and cured.

[0123] The pressure-sensitive adhesive comprises resin, monomer, initiator, expanded microspheres and solvent.

[0124] Those skilled in the art should understand that the embodiments of the present application can be provided as a method, a system, or a computer program product. Therefore, the present application can be in the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware aspects. Moreover, the present application can be in the form of a computer program product implemented on one or more computer usable storage media containing computer usable program code (including but not limited to disk storage, CD-ROM, optical storage, etc.).

[0125] The present application is described in reference to the flowchart illustrations and / or block diagrams of methods, apparatus (systems) and computer program products according to embodiments of the application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart illustrations and / or block diagrams. Figure 1 one or more functions specified in the flowchart illustrations and / or block diagrams. Figure 1 one or more functions specified in the flowchart illustrations and / or block diagrams.

[0126] These computer program instructions can also be stored in a computer- readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instructions which implement the functions specified in the flowchart illustrations and / or block diagrams. Figure 1 one or more functions specified in the flowchart illustrations and / or block diagrams. Figure 1 one or more functions specified in the flowchart illustrations and / or block diagrams.

[0127] These computer program instructions can also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart illustrations and / or block diagrams. Figure 1 one or more functions specified in the flowchart illustrations and / or block diagrams. Figure 1 one or more functions specified in the flowchart illustrations and / or block diagrams.

[0128] While the preferred embodiments of the application have been described, additional variations and modifications can be made to the embodiments by those of skill in the art once they have the benefit of the present disclosure without departing from the spirit and scope of the application. Accordingly, the attached claims are intended to embrace all such variations and modifications as fall within the scope of the present application.

[0129] Obviously, numerous modifications and variations of the present application are possible in light of the above teachings. It is therefore to be understood that within the scope of the appended claims and their equivalents, the application can be practiced otherwise than as specifically described.

Claims

1. A dual-sided releasable tape cure process control system, characterized by, The method comprises the following steps: A UV irradiation adjustment module is used to mark a double-sided peelable adhesive tape performing a curing process as a target adhesive tape, analyze a UV penetration consistency factor of the target adhesive tape, judge internal and external curing uniformity information of the adhesive layer, and perform internal supplemental curing of the target adhesive tape; A curing process continuous execution judgment module is used to perform adjustment effect evaluation after the internal supplemental curing of the target adhesive tape, and judge a curing process continuous execution label; A reaction sufficiency evaluation module is used to analyze an adhesive interface reaction completeness score, and perform adhesive interface chemical reaction sufficiency evaluation; A curing strategy determination module is used to determine a target adhesive tape curing strategy in combination with the internal and external curing uniformity information of the adhesive layer after receiving a traceability judgment signal, and complete the curing process of the target adhesive tape; The internal and external curing uniformity information is judged by the following specific analysis method: Photo-thermal curing data is collected, including surface reflectivity, internal transmittance, UV energy density, and temperature gradient; The UV penetration consistency factor is analyzed based on the photo-thermal curing data; The UV penetration consistency factor is a quantitative index of the influence of surface reflectivity, internal transmittance, UV energy density, and temperature gradient on the internal and external curing uniformity of the adhesive layer of the target adhesive tape. The specific analysis process is as follows: the internal transmittance and the surface reflectivity are compared and processed, the UV energy density and the corresponding reference value are compared and processed, the reference value of the temperature gradient and the temperature gradient are compared and processed, and the results of each comparison and processing are coupled and processed in combination with the corresponding distribution coefficient, thereby obtaining the UV penetration consistency factor; A preset UV penetration consistency threshold value in the database is extracted; If the UV penetration consistency factor is greater than or equal to the UV penetration consistency threshold value, the internal and external curing uniformity information of the adhesive layer is recorded as uniform curing; If the UV penetration consistency factor is less than the UV penetration consistency threshold value, the internal and external curing uniformity information of the adhesive layer is recorded as non-uniform curing.

2. The dual-sided releasable adhesive tape curing process control system of claim 1, wherein: The specific analysis process of the internal supplemental curing of the target adhesive tape is as follows: If the internal and external curing uniformity information of the adhesive layer is non-uniform curing, the UV penetration consistency threshold value and the UV penetration consistency factor are processed by difference, and a UV penetration consistency deviation factor is obtained; A UV irradiation parameter adjustment set is extracted based on the UV penetration consistency deviation factor; The UV irradiation parameter adjustment set includes a UV power supplement value and an exposure time supplement value; The internal supplemental curing of the target adhesive tape is performed based on the UV irradiation parameter adjustment set.

3. The dual-sidedly strippable adhesive tape curing process control system of claim 1, wherein: The specific process of judging the curing process continuous execution label is as follows: The UV penetration consistency factor is reacquired; If the reacquired UV penetration consistency factor is less than or equal to the UV penetration consistency threshold value, the curing process continuous execution label is recorded as stopping the curing process, and prompt information is generated synchronously; If the reacquired UV penetration consistency factor is greater than the UV penetration consistency threshold value, the internal transmittance of the target adhesive tape is continuously monitored in a preset time window, and an internal transmittance drop value of the target adhesive tape is obtained; If the internal transmittance drop value of the target adhesive tape is greater than or equal to a preset internal transmittance drop threshold value, the curing process continuous execution label is recorded as stopping the curing process, and prompt information is generated synchronously; If the internal transmittance drop value of the target adhesive tape is less than the preset internal transmittance drop threshold value, the curing process continues to be executed, and the label is marked as continue to execute the curing process.

4. The dual-sidedly strippable adhesive tape curing process control system of claim 1, wherein: The analysis of the bonding interface reaction completeness score is specifically as follows: When the curing process continues to execute label is continue to execute the curing process, the curing process of the target adhesive tape is continued to be executed, and each sample adhesive tape is extracted according to the preset sample number, and the interface reaction integrity data of each sample adhesive tape is collected. The interface reaction integrity data includes surface tension, residual functional group absorption peak, interlayer residual adhesive thickness and average reaction temperature. The interface reaction integrity data is analyzed based on the interface reaction integrity data. The bonding interface reaction completeness score is a quantitative index of the influence degree of surface tension, residual functional group absorption peak, interlayer residual adhesive thickness and average reaction temperature on the interface chemical reaction completeness between the bonding layer and the peeling layer of the target adhesive tape, and the specific analysis process is as follows: the surface tension is compared with the corresponding reference value, the reference values of the residual functional group absorption peak and the interlayer residual adhesive thickness are compared with the residual functional group absorption peak and the interlayer residual adhesive thickness respectively, the average reaction temperature and the ideal reaction temperature are deviated, and the coupling processing is performed on the comparison processing results and the deviation processing results combined with the corresponding allocation coefficient, so as to obtain the bonding interface reaction completeness score.

5. The dual-sidedly strippable adhesive tape curing process control system of claim 4, wherein: The bonding interface chemical reaction sufficiency evaluation is specifically as follows: Each sample adhesive tape is sequentially traversed, the bonding interface reaction completeness score of each sample adhesive tape is counted and extracted, and the mean value processing is performed to obtain the bonding interface reaction completeness score mean value; The preset bonding interface reaction completeness score threshold value in the database is extracted; If the bonding interface reaction completeness score mean value is greater than the bonding interface reaction completeness score threshold value, the bonding interface chemical reaction sufficiency evaluation result is recorded as complete reaction of the bonding interface, and the subsequent process is continued; If the bonding interface reaction completeness score mean value is less than or equal to the bonding interface reaction completeness score threshold value, the bonding interface chemical reaction sufficiency evaluation result is recorded as incomplete reaction of the bonding interface, and a traceability judgment signal is generated synchronously.

6. The dual-sidedly strippable adhesive tape curing process control system of claim 1, wherein: The target adhesive tape curing strategy is determined based on the internal and external curing uniformity information of the bonding layer, and the specific analysis process is as follows: After receiving the traceability judgment signal, if the internal and external curing uniformity information of the bonding layer is uniform curing, the target adhesive tape curing strategy is recorded as stopping the current curing process, and a warning prompt information is generated synchronously; If the internal and external curing uniformity information of the bonding layer is non-uniform curing, the target adhesive tape curing strategy is recorded as a segmented control interface reaction adjustment process.

7. The dual-sidedly strippable adhesive tape curing process control system of claim 6, wherein: The segmented control interface reaction adjustment process is specifically as follows: The bonding interface reaction completeness correction factor is extracted based on the UV penetration consistency factor; The bonding interface reaction completeness correction score is analyzed based on the bonding interface reaction completeness score mean value and the bonding interface reaction completeness correction factor; The bonding interface reaction completeness correction score is a quantitative index of the influence degree of the bonding interface reaction completeness correction factor and the bonding interface reaction completeness score mean value on the corrected bonding interface reaction completeness, and the specific analysis process is: based on the bonding interface reaction completeness correction factor, the bonding interface reaction completeness score mean value is corrected to obtain the bonding interface reaction completeness correction score; Based on the bonding interface reaction completeness correction score, the interface reaction adjustment set is extracted; The interface reaction adjustment set includes a surface heating temperature supplement value and a UV irradiation time supplement value; Based on the interface reaction adjustment set, a multi-waveband UV irradiation process is set, thereby completing the segmented control interface reaction adjustment process.

8. The method for applying the curing process control system for the double-sided releasable adhesive tape according to any one of claims 1 to 7, characterized in that, Comprise: S1, the double-sided peelable adhesive tape performing the adhesive tape curing process is recorded as a target adhesive tape, the UV penetration consistency factor of the target adhesive tape is analyzed, thereby judging the internal and external curing uniformity information of the adhesive layer, and the internal supplement curing of the target adhesive tape is performed; S2, after the internal supplement curing of the target adhesive tape, the adjustment effect evaluation is performed, thereby determining whether to continue the curing process of the label; S3, the bonding interface reaction completeness score is analyzed, and the bonding interface chemical reaction sufficiency evaluation is performed; S4, after receiving the traceability determination signal, the target adhesive tape curing strategy is determined in combination with the internal and external curing uniformity information of the adhesive layer, thereby completing the curing process of the target adhesive tape.

9. The double-sidedly removable adhesive tape according to any one of claims 1 to 7, characterized in that Comprise: A pressure-sensitive adhesive is coated on a plastic film substrate, and dried and cured to form; The pressure-sensitive adhesive comprises a resin, a monomer, an initiator, expanded microspheres, and a solvent.

Images