Chip transformer and power supply module

Abstract

The invention relates to the technical field of transformers, in particular to a chip transformer and a power module. The ceramic substrate comprises a plurality of stacked ceramic diaphragms; a conductive column is arranged on the ceramic diaphragm, and the extension direction of the conductive column is perpendicular to the ceramic diaphragm; spiral coils are arranged on the surfaces of the ceramic diaphragms, and the end parts of the adjacent spiral coils are connected through the conductive columns; the at least two spiral coils are connected through the conductive columns to form a coil winding. According to the embodiment of the invention, the number of turns of the winding can be greatly increased through the planar spiral coil, the inductance value is effectively improved, the coupling coefficient of the primary coil and the secondary coil is enhanced, and meanwhile, small-sized integrated design is realized.

Description

Technical Field

[0001] The present application relates to the technical field of transformers, and in particular to a chip-type transformer and a power supply module. Background Art

[0002] As electronic devices evolve towards miniaturization, lightweighting, and higher frequencies, higher requirements are placed on the size, performance, and integration of electronic components. Traditional transformers, which often use enameled wire for windings, are bulky, tall, and difficult to surface mount (SMT) on, limiting their application on high-density circuit boards.

[0003] To address these issues, planar transformer structures based on printed circuit board (PCB) or thin-film processes have emerged in recent years. These transformers typically use etched copper foil to form a planar coil, with dielectric substrates providing interlayer insulation. However, existing planar transformers still suffer from issues such as a limited number of turns, low coupling coefficients between the primary and secondary coils, and complex winding connections. Summary of the Invention

[0004] The purpose of this application is to provide a chip transformer and power supply module, which can significantly increase the number of winding turns through a planar spiral coil, effectively improving the inductance value and enhancing the coupling coefficient between the primary coil and the secondary coil while realizing a small integrated design.

[0005] The embodiment of the present application is implemented as follows:

[0006] In a first aspect, an embodiment of the present application provides a chip transformer, comprising a ceramic substrate; the ceramic substrate comprises a plurality of stacked ceramic diaphragms; a conductive column is provided on the ceramic diaphragm, and the extension direction of the conductive column is perpendicular to the ceramic diaphragm; a spiral coil is provided on the surface of the ceramic diaphragm, and the ends of adjacent spiral coils are connected by the conductive column; at least two of the spiral coils are connected by the conductive column to form a coil winding.

[0007] As an optional embodiment, the spiral coil includes a first spiral coil and a second spiral coil; the first spiral coil surrounds the second spiral coil; at least two stacked first spiral coils are connected through the conductive column to form a primary winding; at least two stacked second spiral coils are connected through the conductive column to form a first secondary winding; the primary winding surrounds the first secondary winding.

[0008] As an optional embodiment, the spiral coil also includes a third spiral coil surrounding the first spiral coil; at least two stacked third spiral coils are connected through the conductive column to form a second secondary winding; the second secondary winding surrounds the primary winding.

[0009] As an optional embodiment, the two ends of the spiral coil are respectively provided with coil joints, the ceramic diaphragm is provided with a through hole at a position corresponding to the coil joint, and the conductive column is arranged in the through hole; the coil joint covers the through hole and is connected to the conductive column.

[0010] As an optional implementation manner, each of the coil joints covers at least two conductive posts.

[0011] As an optional implementation, a portion of the surface of the ceramic diaphragm is provided with a transfer joint portion connected to the conductive column; the projection of the transfer joint portion on the ceramic diaphragm is larger than the projection of the conductive column.

[0012] As an optional embodiment, an input / output wiring structure for electrically connecting to a circuit board is provided on the surface of the ceramic diaphragm; the input / output wiring structure is connected to the transfer connector.

[0013] As an optional embodiment, it also includes two magnetic core assemblies; a center hole is provided on the ceramic substrate; the magnetic core assembly includes a base plate, a middle column provided on the base plate, and side columns provided on both sides of the base plate; the two magnetic core assemblies are located on both sides of the ceramic substrate, and the two middle columns are inserted into the center hole and abutted; the side columns of the two magnetic core assemblies abut.

[0014] As an optional embodiment, the ceramic substrate is provided with a first recessed portion on two opposite sides, and the two bottom plates are embedded in the first recessed portion so that the bottom plates are flush with the surface of the ceramic substrate; the ceramic substrate is also provided with a second recessed portion, and the side columns are embedded in the second recessed portion so that the surfaces of the side columns facing away from the center column are flush with the surface of the ceramic substrate.

[0015] In a second aspect, an embodiment of the present application provides a power module, comprising a circuit board and the above-mentioned chip transformer, wherein at least one side surface of the ceramic substrate is provided with a soldering pad electrically connected to the winding, and the circuit board is attached to the surface of the ceramic substrate and electrically connected to the soldering pad.

[0016] The beneficial effects of the embodiments of the present application include:

[0017] Due to the spiral coil design, the embodiments of the present application can achieve a higher number of turns within the same area, which directly increases the inductance of the transformer and can adjust the turns ratio according to actual needs to optimize the transformer performance. The embodiments of the present application can enhance coupling efficiency. The spiral coil design helps to improve the magnetic field distribution and reduce magnetic leakage, thereby increasing the coupling efficiency between the two windings and facilitating the efficient transmission of energy. The embodiments of the present application can promote miniaturization and integration. By utilizing the spiral coil and integrating it into a multi-layer ceramic substrate, a highly compact design of the component is achieved, which is conducive to SMT mounting and is particularly suitable for the application requirements of high-density circuit boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 This is one of the structural diagrams of the chip transformer according to the embodiment of the present application;

[0020] Figure 2 This is the second structural diagram of the chip transformer according to the embodiment of the present application;

[0021] Figure 3 This is the third structural diagram of the chip transformer according to the embodiment of the present application;

[0022] Figure 4 This is the fourth structural diagram of the chip transformer according to the embodiment of the present application;

[0023] Figure 5 This is the fifth structural diagram of the chip transformer according to the embodiment of the present application;

[0024] Figure 6 This is the sixth structural diagram of the chip transformer according to the embodiment of the present application.

[0025] Icons: 100-ceramic substrate; 101-ceramic diaphragm; 102-conductive column; 103-spiral coil; 104-first spiral coil; 105-second spiral coil; 106-third spiral coil; 107-coil joint; 108-transfer joint; 109-magnetic core assembly; 110-center hole; 111-bottom plate; 112-middle column; 113-side column; 114-first recess; 115-second recess; 116-circuit board; 117-soldering pad. DETAILED DESCRIPTION

[0026] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0027] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without creative work are within the scope of protection of the present application.

[0028] It should be noted that similar reference numerals and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings. In addition, the terms "first," "second," "third," etc. are used only to distinguish the descriptions and are not to be understood as indicating or implying relative importance.

[0029] It should also be noted that, in the description of this application, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0030] As electronic devices evolve towards miniaturization, lightweighting, and higher frequencies, higher requirements are placed on the size, performance, and integration of electronic components. Traditional transformers, which often use enameled wire for windings, are bulky, tall, and difficult to surface mount (SMT) on, limiting their application on high-density circuit boards.

[0031] To address these issues, planar transformer structures based on printed circuit board (PCB) or thin-film processes have emerged in recent years. These transformers typically use etched copper foil to form a planar coil, with dielectric substrates providing interlayer insulation. However, existing planar transformers still suffer from issues such as a limited number of turns, low coupling coefficients between the primary and secondary coils, and complex winding connections.

[0032] To solve the above technical problems, an embodiment of the present application provides a chip transformer and a power supply module.

[0033] Reference Figure 1 、 Figure 2 As shown, the chip transformer provided in the embodiment of the present application includes a ceramic substrate 100; the ceramic substrate 100 includes a plurality of stacked ceramic diaphragms 101; a conductive column 102 is provided on the ceramic diaphragm 101, and the extension direction of the conductive column 102 is perpendicular to the ceramic diaphragm 101; a spiral coil 103 is provided on the surface of the ceramic diaphragm 101, and the ends of adjacent spiral coils 103 are connected by the conductive column 102; at least two spiral coils 103 are connected by the conductive column 102 to form a coil winding.

[0034] It should be noted that the embodiment of the present application uses ceramic as a base material, and the ceramic substrate 100 is constructed by stacking multiple layers of ceramic diaphragms 101. Ceramic materials have excellent electrical insulation, thermal stability and mechanical strength.

[0035] The main material of the ceramic diaphragm 101 is non-magnetic aluminum oxide, which can be modified by doping with other materials as needed. This choice not only provides good electrical insulation and thermal stability, but also minimizes the self-coupling of the spiral coil 103 because its magnetic permeability is close to that of air.

[0036] In this embodiment, vertically extending conductive pillars 102 are provided on a ceramic diaphragm 101. Each surface of the ceramic diaphragm 101 is provided with a spiral coil. This design allows for increasing the number of coil turns within a limited space, improving inductance and coupling efficiency. In this embodiment, vertically extending conductive pillars 102 are used to connect spiral coils 103 on different levels in series, forming a continuous winding path and simplifying the connection between windings.

[0037] In the embodiment of the present application, at least two spiral coils 103 are connected through the conductive column 102 to form a coil winding, which means that different turn ratios can be flexibly designed according to needs to meet the requirements of various application scenarios.

[0038] It should be noted that the ceramic substrate 100 can be manufactured by sintering, and then the location for mounting the high-permeability core can be prepared by punching or CNC machining. After drilling holes in the ceramic substrate 100 and placing the high-permeability core, the majority of the magnetic flux is confined within the core, significantly reducing the self-coupling effect between the coils and improving the coupling coefficient between the primary and secondary coils.

[0039] The technical effects that can be produced by the embodiments of this application are:

[0040] Since the embodiment of the present application adopts the spiral coil 103 design, a higher number of turns can be achieved under the same area, which directly improves the inductance value of the transformer and can adjust the turns ratio according to actual needs to optimize the transformation performance.

[0041] The embodiments of the present application can enhance coupling efficiency. The design of the spiral coil 103 helps to improve the magnetic field distribution, reduce magnetic leakage, and thus improve the coupling efficiency between the two windings, which is conducive to the efficient transmission of energy. In addition, due to the use of a non-magnetic ceramic substrate 100 with a magnetic permeability close to that of air, the self-coupling effect of the spiral coil 103 is significantly reduced, far less than that in existing LTCF (low-temperature co-fired ceramic) chip transformers. This directly overcomes the problem of difficulty in increasing the coupling coefficient of the primary and secondary coils due to self-coupling in current LTCF transformers, and greatly improves the coupling efficiency.

[0042] The embodiment of the present application can promote miniaturization and integration, and utilizes PCB or thin film technology to manufacture the spiral coil 103 and integrate it into the multi-layer ceramic substrate 100, thereby achieving a highly compact design of the component, facilitating SMT mounting, and being particularly suitable for the application requirements of high-density circuit boards 116.

[0043] The embodiment of the present application can simplify the manufacturing process and improve reliability. The windings are connected through the conductive pillars 102, which not only simplifies the manufacturing process, but also improves the reliability and consistency of the product and reduces the errors that may be introduced by manual operation.

[0044] Reference Figure 1 、 Figure 2 As shown, as an optional embodiment, the spiral coil 103 includes a first spiral coil 104 and a second spiral coil 105; the first spiral coil 104 surrounds the second spiral coil 105; at least two stacked first spiral coils 104 are connected through a conductive column 102 to form a primary winding; at least two stacked second spiral coils 105 are connected through a conductive column 102 to form a first secondary winding; the primary winding surrounds the first secondary winding.

[0045] It should be noted that, as required, the central axis of the primary winding and the first secondary winding may be arranged to coincide with each other.

[0046] It should be noted that, since the primary winding completely surrounds the first secondary winding and the two share the same central axis, the magnetic flux path is more direct and effective, which greatly enhances the magnetic coupling efficiency between the two windings.

[0047] It should be noted that the embodiments of the present application can improve energy transmission efficiency, the tighter winding layout reduces magnetic leakage, improves energy transmission efficiency from the primary side to the secondary side, and reduces energy loss.

[0048] The embodiment of the present application adopts a concentric cylindrical spiral coil 103 layout, which achieves more turns in a limited space, helps to reduce the overall size of the transformer while maintaining or even improving its electrical performance, meeting the requirements of modern electronic equipment for miniaturization and lightweight.

[0049] In summary, this implementation not only improves the electrical performance of the transformer through a specific winding layout design, but also takes into account miniaturization and manufacturing feasibility, providing an ideal power conversion solution for high-performance electronic devices.

[0050] Reference Figure 1 、 Figure 2 As shown, as an optional embodiment, the spiral coil 103 further includes a third spiral coil 106 surrounding the first spiral coil 104; at least two stacked third spiral coils 106 are connected through the conductive column 102 to form a second secondary winding; the second secondary winding surrounds the primary winding.

[0051] This embodiment of the present application introduces a third spiral coil 106, forming a three-layer structure consisting, from the inside out, of a first secondary winding, a primary winding, and a second secondary winding. All windings share a common central axis. Each layer of spiral coils 103 (including the first, second, and third spiral coils 106) is electrically connected between layers via conductive posts 102, forming a continuous winding path. The first spiral coil 104, the second spiral coil 105, and the third spiral coil 106 each comprise multiple turns.

[0052] Specifically, at least two stacked first spiral coils 104 are connected by a conductive column 102 to form a primary winding, at least two stacked second spiral coils 105 constitute a first secondary winding, and at least two stacked third spiral coils 106 constitute a second secondary winding surrounding the primary winding. This design not only ensures that the magnetic flux can be efficiently transferred between the windings, reduces magnetic leakage, and improves the overall coupling efficiency, but also supports the needs of multi-channel output, achieving higher integration and performance improvement without significantly increasing the volume. In addition, the structure allows the turns ratio of each winding to be flexibly adjusted according to actual needs to meet the transformation ratio requirements in different application scenarios. Through standardized multi-layer ceramic substrate 100 technology and conductive column 102 connection method, the entire manufacturing process maintains a high level of automation and product consistency, which is conducive to large-scale production.

[0053] Reference Figure 3 As shown, as an optional embodiment, the two ends of the spiral coil 103 are respectively provided with coil joints 107, the ceramic diaphragm 101 is provided with a through hole at a position corresponding to the coil joint 107, and the conductive column 102 is arranged in the through hole; the coil joint 107 covers the through hole and is connected to the conductive column 102.

[0054] Reference Figure 3 As shown, the ends of two adjacent spiral coils 103 are provided with coil joints 107, and the two coil joints 107 are connected by a conductive column 102. Figure 2As shown, the first end of the middle spiral coil 103 is conductively connected to the end of the upper spiral coil 103 through a group of conductive pillars 102, and the second end of the middle spiral coil 103 is conductively connected to the end of the lower spiral coil 103 through another group of conductive pillars 102, so that the three layers of spiral coils 103 are connected in series.

[0055] It should be noted that the coil connector 107 covers the through hole, which not only realizes effective conduction between the spiral coil 103 and the conductive column 102, but also forms a certain packaging and positioning effect on the conductive column 102 by covering, thereby enhancing the stability and reliability of the connection.

[0056] The embodiment of the present application improves connection reliability through the provision of coil connector 107, effectively preventing electrical short circuits caused by misalignment, poor contact, or weak soldering of conductive pillar 102, thereby enhancing the stability of interlayer interconnections. The coil connector covers the through-hole design, preventing unintended contact between the top of conductive pillar 102 and other metal layers or the coil, thereby reducing the risk of short circuits and improving the overall safety of the device.

[0057] Reference Figure 3 As shown, as an optional embodiment, each coil connector 107 covers at least two conductive pillars 102 .

[0058] The above-described configuration improves the current carrying capacity of the embodiment of the present application. Since a single coil connector 107 connects multiple conductive pillars 102, it provides multiple parallel current paths between layers, effectively reducing the current density per conductive pillar 102 and improving the overall current carrying capacity, making it suitable for high-current applications.

[0059] In the embodiment of the present application, multiple conductive pillars 102 are connected in parallel. Even if an individual conductive pillar 102 has abnormal conditions such as poor contact or breakage, the remaining conductive pillars 102 can still maintain normal conduction, significantly improving the reliability of the connection and the fault tolerance of the device.

[0060] In addition, the multi-point connection method helps to reduce the contact resistance between the conductive column 102 and the coil connector 107, thereby reducing power loss and local heating, and improving the stability and life of the transformer under high-power working conditions.

[0061] This embodiment achieves a multi-point redundant structure for the interlayer connections of spiral coils 103 by ensuring that each coil connector 107 covers and connects at least two conductive pillars 102. This technical solution not only significantly improves connection reliability and current-carrying capacity, but also reduces contact resistance and thermal resistance, optimizes high-frequency performance, and enhances adaptability to manufacturing errors.

[0062] It should be noted that the ceramic diaphragm 101 may be filled with conductive paste to form the conductive pillars 102 . The conductive paste may be conductive silver paste or other types of paste. Those skilled in the art may select the paste according to their needs.

[0063] Reference Figure 3 As shown, as an optional embodiment, a portion of the surface of the ceramic diaphragm 101 is provided with a transfer joint portion 108 connected to the conductive column 102; the projection of the transfer joint portion 108 on the ceramic diaphragm 101 is larger than the projection of the conductive column 102.

[0064] The intermediate joint portion 108 is added as an intermediate transition structure to provide additional anchoring support for the conductive pillar 102 , thereby enhancing its stability and reliability in the ceramic substrate 100 .

[0065] Specifically, the transfer joint 108 not only connects the conductive pillars 102, but also provides stronger mechanical support and electrical stability through its larger contact area, preventing the conductive pillars 102 from displacement, falling off or other forms of failure during the manufacturing process or long-term use.

[0066] By strengthening the fixing effect of the conductive pillar 102, the service life of the entire assembly can be effectively extended, especially in the face of harsh working conditions such as temperature cycling and vibration. The presence of the transfer joint 108 makes the overall structure more able to withstand long-term workloads without being easily damaged.

[0067] As an optional embodiment, an input / output wiring structure for electrically connecting to the circuit board 116 is provided on the surface of the ceramic diaphragm 101 ; the input / output wiring structure is connected to the transfer connector 108 .

[0068] It should be noted that the surface of the ceramic diaphragm 101 where the transfer connector 108 is provided is not provided with the spiral coil 103, but rather with an input / output wiring structure. Multiple ceramic diaphragms 101 with the input / output wiring structure can be provided, and as needed, ceramic diaphragms 101 with the input / output wiring structure and ceramic diaphragms 101 with the spiral coil 103 can be alternately stacked.

[0069] The above-described design of the embodiment of the present application not only achieves efficient electrical connections between the layers within the transformer and between the external circuit board 116, but also, by flexibly combining ceramic diaphragms 101 with different functions (i.e., including spiral coils 103 and including input and output wiring structures), the number of coil turns of the winding can be conveniently adjusted according to specific needs, thereby optimizing transformer performance parameters such as transformation ratio and inductance. In addition, this modular design not only enhances flexibility and adaptability in the manufacturing process, but also facilitates customized production and improves the integration and reliability of the overall equipment.

[0070] Reference Figure 4 、 Figure 5 As shown, as an optional embodiment, it also includes two magnetic core components 109; a central hole 110 is provided on the ceramic substrate 100; the magnetic core component 109 includes a base plate 111, a center column 112 provided on the base plate 111, and side columns 113 provided on both sides of the base plate 111; the two magnetic core components 109 are located on both sides of the ceramic substrate 100, and the two center columns 112 are inserted into the central hole 110 and abutted; the side columns 113 of the two magnetic core components 109 abut.

[0071] In an embodiment of the present application, two symmetrical magnetic core components 109 are arranged on both sides of a ceramic substrate 100. Each magnetic core component 109 includes a base plate 111, a middle column 112, and side columns 113. The middle column 112 is inserted into the center hole 110 on the ceramic substrate 100 and abuts against each other, and the side columns 113 also abut against each other, thereby forming a closed and complete magnetic circuit.

[0072] It should be noted that the above-mentioned structure of the embodiment of the present application can effectively concentrate the magnetic flux path, reduce magnetic flux leakage, and significantly improve the magnetic coupling efficiency between the primary winding and the secondary winding, thereby improving energy transmission efficiency and reducing leakage inductance; at the same time, the closed magnetic circuit design optimizes the electrical performance of the transformer, giving it a higher inductance value, better frequency response characteristics, and better high-frequency working performance, making it suitable for high power density and high-frequency application scenarios. In addition, the symmetrical structure of the magnetic core assembly 109 not only enhances the mechanical stability and vibration resistance of the entire device, but also facilitates assembly, improving production efficiency and product consistency.

[0073] Reference Figure 5 As shown, as an optional embodiment, the ceramic substrate 100 has first recesses 114 on opposite sides, into which both bottom plates 111 are embedded, so that the bottom plates 111 are flush with the surface of the ceramic substrate 100. The ceramic substrate 100 also has second recesses 115, into which the side columns 113 are embedded, so that the surfaces of the side columns 113 facing away from the center column 112 are flush with the surface of the ceramic substrate 100. This embodiment of the present application can effectively reduce the size of the entire chip transformer.

[0074] The ceramic substrate 100 of the present embodiment is provided with first recesses 114 on opposite sides for accommodating the base plate 111 of the magnetic core assembly 109, so that the base plate 111 is flush with the surface of the ceramic substrate 100 after being inserted. Furthermore, the ceramic substrate 100 is provided with second recesses 115 for accommodating the side posts 113 of the magnetic core assembly 109, so that the surfaces of the side posts 113 facing away from the center post 112 are also flush with the surface of the ceramic substrate 100 after being inserted. This structural design allows the portion of the magnetic core assembly 109 (including the base plate 111 and side posts 113) that originally protruded from the substrate surface to be completely or partially "sunk" into the ceramic substrate 100, effectively reducing the overall device size in the vertical and lateral directions.

[0075] This design significantly reduces the overall size of the chip transformer, improving its space utilization and enabling a thinner, more compact structure, meeting the growing demand for miniaturized and lightweight components in modern electronic devices. Furthermore, the flushness of the magnetic core assembly 109 with the surface of the ceramic substrate 100 improves product flatness and assembly consistency, enhancing its compatibility and reliability in automated placement processes.

[0076] Reference Figure 6 As shown, the embodiment of the present application provides a power supply module, including a circuit board 116 and the above-mentioned chip transformer, referring to Figure 4 As shown, a soldering pad 117 electrically connected to the winding is provided on at least one side surface of the ceramic substrate 100 , and a circuit board 116 is attached to the surface of the ceramic substrate 100 and electrically connected to the soldering pad 117 .

[0077] It should be noted that the circuit board 116 may be a printed circuit board 116 (PCB), which carries other necessary electronic components and circuits, such as a control circuit, a filter, etc. The circuit board 116 is fixed to the ceramic substrate 100 through a mounting process (e.g., SMT technology) and is electrically connected to the chip transformer through the pads 117.

[0078] The embodiment of the present application integrates the chip transformer directly onto the circuit board 116 , eliminating the need for additional wiring or connectors in traditional transformers, simplifying assembly steps, and improving production efficiency.

[0079] In addition, since the circuit board 116 can be directly mounted on the chip transformer and its thickness is effectively controlled, this helps to reduce the height of the entire power module, making the module more compact and suitable for application scenarios with limited space.

[0080] The size of the circuit board 116 can be adjusted as needed. For example, the circuit board 116 overlaps with the projection of the sheet transformer.

[0081] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A chip transformer, characterized in that: The invention comprises a ceramic substrate (100); the ceramic substrate (100) comprises a plurality of stacked ceramic diaphragms (101); a conductive column (102) is provided on the ceramic diaphragm (101), and the extending direction of the conductive column (102) is perpendicular to the ceramic diaphragm (101); a spiral coil (103) is provided on the surface of the ceramic diaphragm (101), and the ends of adjacent spiral coils (103) are connected through the conductive column (102); at least two spiral coils (103) are connected through the conductive column (102) to form a coil winding.

2. The chip transformer according to claim 1, characterized in that: The spiral coil (103) comprises a first spiral coil (104) and a second spiral coil (105); the first spiral coil (104) surrounds the second spiral coil (105); at least two stacked first spiral coils (104) are connected via the conductive column (102) to form a primary winding; at least two stacked second spiral coils (105) are connected via the conductive column (102) to form a first secondary winding; the primary winding surrounds the first secondary winding.

3. The chip transformer according to claim 2, characterized in that: The spiral coil (103) further includes a third spiral coil (106) surrounding the first spiral coil (104); at least two stacked third spiral coils (106) are connected via the conductive column (102) to form a second secondary winding; the second secondary winding surrounds the primary winding.

4. The chip transformer according to any one of claims 1 to 3, characterized in that: The two ends of the spiral coil (103) are respectively provided with coil joints (107); the ceramic diaphragm (101) is provided with a through hole at a position corresponding to the coil joint (107); the conductive column (102) is arranged in the through hole; the coil joint (107) covers the through hole and is connected to the conductive column (102).

5. The chip transformer according to claim 4, characterized in that: Each coil connector (107) covers at least two conductive pillars (102).

6. The chip transformer according to claim 4, characterized in that: A transfer joint portion (108) connected to the conductive column (102) is provided on a portion of the surface of the ceramic diaphragm (101); the projection of the transfer joint portion (108) on the ceramic diaphragm (101) is larger than the projection of the conductive column (102).

7. The chip transformer according to claim 6, characterized in that: An input / output wiring structure for electrical connection to a circuit board (116) is provided on the surface of the ceramic diaphragm (101); the input / output wiring structure is connected to the transfer connector (108).

8. The chip transformer according to any one of claims 1 to 3 and claims 5 to 7, characterized in that: The invention also includes two magnetic core components (109); a central hole (110) is provided on the ceramic substrate (100); the magnetic core component (109) includes a bottom plate (111), a center column (112) provided on the bottom plate (111), and side columns (113) provided on both sides of the bottom plate (111); the two magnetic core components (109) are located on both sides of the ceramic substrate (100), and the two center columns (112) are inserted into the central hole (110) and abut against each other; the side columns (113) of the two magnetic core components (109) abut against each other.

9. The chip transformer according to claim 8, characterized in that: The ceramic substrate (100) is provided with first recessed portions (114) on two opposite sides, and the two bottom plates (111) are both embedded in the first recessed portions (114), so that the bottom plates (111) are flush with the surface of the ceramic substrate (100); the ceramic substrate (100) is also provided with a second recessed portion (115), and the side columns (113) are embedded in the second recessed portion (115), so that the surfaces of the side columns (113) facing away from the center column (112) are flush with the surface of the ceramic substrate (100).

10. A power module, characterized in that: The invention comprises a circuit board (116) and a chip transformer according to any one of claims 1 to 9, wherein at least one surface of the ceramic substrate (100) is provided with a soldering pad (117) electrically connected to the winding, and the circuit board (116) is attached to the surface of the ceramic substrate (100) and electrically connected to the soldering pad (117).

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