Waveguide antenna unit and array

Abstract

The invention provides a waveguide antenna unit and an array. The waveguide antenna unit at least comprises a top metal layer and a bottom metal layer. The upper surface of the top metal layer is provided with a radiation unit layer, the radiation unit layer comprises a plurality of radiation grooves which are linearly or non-linearly arranged at the wide edge of the cavity, the lower surface of the top metal layer is provided with a cavity mode suppressor, and the cavity mode suppressor comprises a plurality of opening hole-shaped structures which are linearly or non-linearly arranged; the cavity mode suppressor is loaded, a low-order or high-order cavity mode which is useless for antenna radiation is removed, a plurality of cavity modes required by antenna radiation are reserved, and by combining the cavity mode and the groove mode, the antenna matching level can be effectively improved, and the bandwidth can be effectively expanded. The upper surface of the bottom metal layer is a cavity transmission line layer, and the lower surface is a waveguide packaging layer; the wide edge or the narrow edge of the cavity transmission line layer is provided with a narrow slit, and the narrow slit is used for accommodating SMT welding overflow tin. While the performance is maintained, the problems of tin overflow and tin leakage are reduced, the product yield is improved, and the method is suitable for large-scale mass production.

Description

Technical Field

[0001] The present application relates to the field of microwave communication technology, and more specifically to waveguide antenna units and arrays. Background Art

[0002] In recent years, the rapid development of autonomous driving has driven innovation in automotive sensing technology. Millimeter-wave radar, with its cost-effective and all-weather detection capabilities, has significantly improved its pitch and azimuth resolution, driven by advancements in manufacturing processes and algorithm optimization. It is becoming a core component of intelligent vehicle environmental perception systems. Compared to cameras and lidar, which rely on optical imaging, millimeter-wave systems offer robust detection performance in adverse weather conditions such as rain, fog, and dust, making them a strategically important component in the automotive industry's evolution toward advanced autonomous driving.

[0003] Millimeter-wave radar antenna technology has undergone significant evolution. Early solutions, such as printed circuit board-based microstrip array antennas or substrate-integrated waveguide (SIW) slot antennas, were limited by the high loss characteristics of dielectric substrates at millimeter-wave frequencies, resulting in inherent drawbacks such as low radiation efficiency and limited power handling. To overcome this performance bottleneck, waveguide antennas, with their near-ideal conductor-like low-loss transmission characteristics and excellent power-carrying capacity, have become the preferred solution for radar systems operating in the high-frequency bands of 77 GHz and above.

[0004] However, during the critical transition to large-scale production, the traditional waveguide antenna's multi-layer metal structure manufacturing process has exposed significant technical bottlenecks. This is particularly true during the process of achieving interlayer sealing and electrical interconnection through high-precision surface mount technology (SMT). Microscopic defects such as solder penetration deviation and assembly misalignment can easily lead to degraded antenna performance. Especially in the 77GHz high-frequency band, these millimeter-level processing errors can cause significant signal reflections, resulting in antenna performance degradation such as frequency deviation, impedance mismatch, and pattern distortion, seriously affecting radar detection accuracy and range. Summary of the Invention

[0005] In order to solve the above-mentioned multi-layer metal structure manufacturing process of traditional waveguide antennas, high-precision surface mount technology (SMT) is required to achieve interlayer sealing and electrical interconnection. Due to microscopic defects such as solder penetration deviation and assembly misalignment, it is very easy to cause problems such as deterioration of antenna performance.

[0006] A first aspect of the present application provides a waveguide antenna unit comprising at least two metal layers, the two metal layers being: a top metal layer and a bottom metal layer;

[0007] A radiation unit layer is provided on the upper surface of the top metal layer, wherein the radiation unit layer comprises a plurality of radiation slots arranged linearly or nonlinearly at the wide side or narrow side of the waveguide cavity;

[0008] A cavity mode suppressor is provided on the lower surface of the top metal layer, wherein the cavity mode suppressor comprises a plurality of linearly or nonlinearly arranged open hole structures;

[0009] The bottom metal layer is located below the top metal layer, the upper surface of the bottom metal layer is the cavity transmission line layer, and the lower surface is the waveguide packaging layer;

[0010] in:

[0011] The two metal layers are connected by welding through the SMT process;

[0012] A narrow slot is provided on the wide side or narrow side of the cavity transmission line layer. The cross section of the narrow slot is rectangular or polygonal. The cross section of the narrow slot is much smaller than that of the waveguide cavity. The narrow slot is used to accommodate SMT soldering overflow.

[0013] In a feasible implementation, it further includes: an intermediate metal layer;

[0014] The middle metal layer is located between the top metal layer and the bottom metal layer;

[0015] The upper surface of the intermediate metal layer is a cavity layer, and the lower surface is a cavity coupling slot, and the cavity coupling slot is one of rectangular, square or polygonal;

[0016] The top metal layer, the middle metal layer and the bottom metal layer are connected by welding through the SMT process.

[0017] In a feasible implementation, the cavity mode of the waveguide cavity includes: TE 110 TE 120 TE 130 TE 140 TE 150 TE 160 module and other high-order modes;

[0018] When the cavity mode suppressor is arranged at the wide side of the waveguide cavity, the TE 110 TE 120 TE 130 Mould and TE 160 mode and other high-order modes, retaining the TE 140 Mould and TE 150 mold;

[0019] When the cavity mode suppressor is arranged at the narrow side of the waveguide cavity, the TE 110 TE 120 TE 130 Mould and TE 140 mode and other high-order modes, retaining the TE 150 Die and the TE160 mold;

[0020] The radiation slot adopts a convex or concave structure;

[0021] When the radiation slot is a convex structure, it protrudes toward the outside of the waveguide cavity;

[0022] When the radiation slot is a concave structure, it is concave toward the inner side of the waveguide cavity.

[0023] A second aspect of the present application provides a PCB waveguide antenna unit, which is implemented using a PCB solution and includes: a top metal layer and a copper-clad PCB board;

[0024] The top metal layer is provided with a radiation slot and a cavity mode suppressor, the cavity mode suppressor includes a hole structure, and the hole structure is surrounded by grounding metallized through holes;

[0025] The copper-clad PCB serves as the lower surface of the waveguide cavity and is welded to the top metal layer through the SMT process. A narrow slot is integrated on the upper surface of the top metal layer to accommodate tin overflow from SMT welding.

[0026] In a feasible implementation, the cavity mode suppressor is arranged on the upper surface of the copper-clad PCB board, and the hole-shaped structure and the grounding metallized through-hole are integrated on the copper-clad PCB board.

[0027] A third aspect of the present application provides a gap waveguide antenna unit, comprising: a top metal layer and a PCB multilayer board;

[0028] The top metal layer is provided with a radiation slot, and the top metal layer is also provided with or integrated with a cavity mode suppressor;

[0029] The PCB multilayer board includes: a copper-clad PCB board and a thin plate, wherein the copper-clad PCB board and the thin plate are formed into a whole through a PP layer;

[0030] The copper-clad PCB is connected to the top metal layer by welding through the SMT process, and a narrow slit is integrated on the upper surface of the top metal layer to accommodate tin overflow from SMT welding;

[0031] The PCB multilayer board is also provided with multiple electromagnetic bandgap pins, and the multiple electromagnetic bandgap pins are fixed to the thin board and the PP layer by screws;

[0032] The multi-electromagnetic bandgap pins are physically isolated from the copper-clad PCB board by the thin plate and the PP layer.

[0033] A fourth aspect of the present application provides a waveguide antenna array, comprising a plurality of waveguide antenna units as described in any one of the above items;

[0034] The plurality of radiating units are arranged in two rows and four columns to form a 4T4R transceiver array;

[0035] The layout of the 4T4R transceiver array is optimized by a genetic algorithm, and a multi-objective fitness function is used to control the sidelobe level and mainlobe width.

[0036] In a feasible implementation, the method further includes: a microstrip coupling feeding structure, wherein the microstrip patch is placed below the waveguide feeding slot;

[0037] The microstrip coupling feeding structure comprises: a microstrip patch, a grounded coplanar waveguide transmission line and a chip, wherein the grounded coplanar waveguide transmission line connects the microstrip patch and the chip;

[0038] The grounding metallized through-hole is provided around the transmission line of the microstrip coupling feeding structure.

[0039] In a feasible implementation, a perturbation structure is provided at the diagonal corners of the microstrip patch, and the grounding metallized through hole is provided at the center of the microstrip patch.

[0040] In a feasible implementation, the metal layer is processed by using an aluminum CNC processing technology;

[0041] Or it can be made by CNCing the PEI or PPS plastic substrate and then metallizing the surface through PVD / electroplating process.

[0042] As can be seen from the above content, the present application provides a waveguide antenna unit and array, which removes low-order or high-order cavity modes that are not beneficial to antenna radiation by loading cavity mode suppressors on the wide or narrow sides of the cavity, retains the cavity modes required for multiple antenna radiation, and effectively improves the antenna matching level and expands the bandwidth by combining the cavity mode and the slot mode. At the same time, by setting the layout of the radiation slot, such as convex or concave, the antenna gain is optimized. In addition, by loading narrow slits on the side walls of the cavity transmission line, while improving performance, it reduces the problems of tin overflow and tin leakage caused by the SMT process, improves product yield, and is suitable for large-scale mass production. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] The accompanying drawings are incorporated into and constitute a part of this specification, illustrate embodiments consistent with the implementation of the present invention, and together with the description, serve to explain the principles of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the implementation of the present invention. For those skilled in the art, other drawings can be derived from these drawings without inventive effort.

[0044] Figure 1 Schematic diagram of the three-metal layer structure of the waveguide antenna unit shown in the embodiment of the present application;

[0045] Figure 2 Schematic diagram of the radiation slot opening structure shown in an embodiment of the present application;

[0046] Figure 3 Schematic diagram of the opening structure of the hole structure shown in the embodiment of the present application;

[0047] Figure 4 1 is a broadside loaded cross-sectional view of a cavity transmission line loaded with a narrow slot shown in an embodiment of the present application;

[0048] Figure 5 1 is a narrow side loaded cross-sectional view of a cavity transmission line loaded with a narrow slot shown in an embodiment of the present application;

[0049] Figure 6 1 is a cavity model and an eigenmode simulation setup diagram of an unloaded cavity mode suppressor shown in an embodiment of the present application;

[0050] Figure 7 The cavity TE shown in the embodiment of this application 110 (left) and TE 120 (right) Eigensimulation simulation results;

[0051] Figure 8 The cavity TE shown in the embodiment of this application 130 (left) and TE 140 (right) Eigensimulation simulation results;

[0052] Figure 9 The cavity TE shown in the embodiment of this application 150 (left) and TE 160 (right) Eigensimulation simulation results;

[0053] Figure 10 1 is a waveguide model and an eigenmode simulation setup diagram after a broadside-loaded cavity mode suppressor is shown in an embodiment of the present application;

[0054] Figure 11 This is the rear cavity TE of the broadside loaded cavity mode suppressor shown in the embodiment of the present application. 140 (left) and TE 150 (right) Eigensimulation simulation results;

[0055] Figure 12 1 is a waveguide model and an eigenmode simulation setup diagram after a narrow-side loaded cavity mode suppressor is shown in an embodiment of the present application;

[0056] Figure 13 This is the rear cavity TE of the narrow side loaded cavity mode suppressor shown in the embodiment of the present application. 150 (left) and TE 160 (right) Eigensimulation simulation results;

[0057] Figure 141 is a layout diagram of the opening and hole structure of the radiation slot shown in an embodiment of the present application;

[0058] Figure 15 is the directional diagram of the wide beam solution shown in the embodiment of the present application;

[0059] Figure 16 is the directional diagram of the narrow beam solution shown in the embodiment of the present application;

[0060] Figure 17 Schematic diagram of the structure of the radiation slot protrusion arrangement shown in an embodiment of the present application;

[0061] Figure 18 Schematic diagram of the concave arrangement structure of the radiation slot shown in an embodiment of the present application;

[0062] Figure 19 This is a 3D-View structural diagram of a waveguide antenna with a first cavity broadside loaded cavity mode suppressor shown in an embodiment of the present application;

[0063] Figure 20 1 is a side view schematic diagram of a waveguide antenna with a first cavity broadside loaded cavity mode suppressor shown in an embodiment of the present application;

[0064] Figure 21 1 is a schematic diagram of the antenna unit structure of a first type of waveguide antenna with a cavity broadside loaded cavity mode suppressor shown in an embodiment of the present application;

[0065] Figure 22 This is a 3D-View structural diagram of a second type of waveguide antenna with a cavity broadside loaded cavity mode suppressor shown in an embodiment of the present application;

[0066] Figure 23 1 is a side view schematic diagram of a second type of waveguide antenna with a cavity broadside loaded cavity mode suppressor shown in an embodiment of the present application;

[0067] Figure 24 1 is a schematic diagram of the antenna unit structure of a second type of waveguide antenna with a cavity broadside loaded cavity mode suppressor shown in an embodiment of the present application;

[0068] Figure 25 This is a 3D-View structural diagram of a waveguide antenna with a cavity narrow side loaded cavity mode suppressor shown in an embodiment of the present application;

[0069] Figure 26 1 is a side view schematic diagram of a waveguide antenna with a cavity narrow side loaded cavity mode suppressor shown in an embodiment of the present application;

[0070] Figure 27 1 is a schematic diagram of the antenna unit structure of a waveguide antenna with a cavity narrow side loaded cavity mode suppressor shown in an embodiment of the present application;

[0071] Figure 28 This is a 3D-View structural diagram of a third type of waveguide antenna with a cavity broadside loaded cavity mode suppressor shown in an embodiment of the present application;

[0072] Figure 29 1 is a side view schematic diagram of a third type of waveguide antenna with a cavity broadside loaded cavity mode suppressor shown in an embodiment of the present application;

[0073] Figure 30 1 is a schematic diagram of the antenna unit structure of a third type of waveguide antenna with a cavity broadside loaded cavity mode suppressor shown in an embodiment of the present application;

[0074] Figure 31 1 is a layout diagram of a cavity mode suppressor loaded on the wide side or narrow side of a cavity shown in an embodiment of the present application;

[0075] Figure 32 This is a 3D-View structural diagram of a PCB-based loaded cavity mode suppressor waveguide antenna structure shown in an embodiment of the present application;

[0076] Figure 33 1 is a schematic diagram of the antenna unit structure of a PCB-based loaded cavity mode suppressor waveguide antenna according to an embodiment of the present application;

[0077] Figure 34 This is a 3D-View structural diagram of a waveguide antenna loaded with a cavity mode suppressor based on a PCB solution shown in an embodiment of the present application;

[0078] Figure 35 1 is a schematic structural diagram of a cavity mode suppressor of a waveguide antenna loaded with a cavity mode suppressor based on a PCB solution shown in an embodiment of the present application;

[0079] Figure 36 1 is a schematic diagram of the antenna unit structure of a waveguide antenna loaded with a cavity mode suppressor based on a PCB solution shown in an embodiment of the present application;

[0080] Figure 37 Schematic diagram of the lower surface of the metal layer of the gap waveguide antenna structure based on the PCB solution shown in an embodiment of the present application;

[0081] Figure 38 This is a schematic diagram of the 3D-View structure of the gap waveguide antenna based on the PCB solution shown in an embodiment of the present application;

[0082] Figure 39 1 is a side view schematic diagram of a gap waveguide antenna unit structure based on a PCB solution shown in an embodiment of the present application;

[0083] Figure 40 Schematic diagram of the upper surface structure of the waveguide antenna array according to an embodiment of the present application;

[0084] Figure 41 Schematic diagram of the bottom surface structure of the waveguide antenna array shown in an embodiment of the present application;

[0085] Figure 42 Schematic diagram of the waveguide antenna feeding structure shown in an embodiment of the present application;

[0086] Figure 43 1 is a reflection coefficient simulation result diagram of a waveguide antenna design case shown in an embodiment of the present application;

[0087] Figure 44 1 is a diagram showing the antenna sidelobe level simulation results of a waveguide antenna design case shown in an embodiment of the present application;

[0088] Figure 45 This is a diagram of antenna gain simulation results for a waveguide antenna design case shown in an embodiment of the present application.

[0089] Figure annotation:

[0090] 1-Radiation slot; 2-Cavity mode suppressor; 3-Hole-shaped structure; 4-Cavity layer; 5-Cavity coupling slot; 6-Cavity transmission line layer; 7-Waveguide packaging layer; 8-Narrow slot; 9-Horizontal cavity transmission line; 10-Radiation unit; 11-Mode converter; 12-Vertical cavity transmission line; 13-Waveguide packaging port; 14-Stepped structure; 15-Top metal layer; 16-Middle metal layer; 17-Bottom metal layer; 18-Copper-clad PCB board; 19-PCB multilayer board; 20-Multi-electromagnetic bandgap pins; 21-Thin plate; 22-PP layer; 23-Waveguide packaging port; 24-Grounded metalized through hole; 25-Perturbation structure; 26-Microstrip patch; 27-Grounded coplanar waveguide transmission line; 28-Chip. DETAILED DESCRIPTION

[0091] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that the present invention will be more comprehensive and complete and to fully convey the concepts of the example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to provide a thorough understanding of the implementation of the example embodiments of the present invention.

[0092] Early millimeter-wave radar antenna technology was based on microstrip array antennas on printed circuit boards (PCBs) or substrate-integrated waveguide (SIW) slot antennas. Limited by the high loss characteristics of dielectric substrates at millimeter-wave frequencies, these solutions suffer from inherent drawbacks such as low radiation efficiency and limited power handling. To overcome these performance bottlenecks, waveguide antennas, with their near-ideal conductor-like low-loss transmission characteristics and excellent power-carrying capacity, have become the preferred solution for radar systems operating in the 77 GHz and higher frequency bands. However, during the critical transition to large-scale production, the multi-layer metal structure manufacturing process for traditional waveguide antennas has exposed significant technical bottlenecks. This is particularly true during the process of high-precision surface mount technology (SMT) required to achieve interlayer sealing and electrical interconnection. Microscopic defects such as solder penetration deviation and assembly misalignment can easily degrade antenna performance. Particularly at 77 GHz, these millimeter-level manufacturing errors can cause significant signal reflections, resulting in antenna performance degradation such as frequency deviation, impedance mismatch, and pattern distortion, severely impacting radar detection accuracy and range.

[0093] In order to solve the above problems, the first aspect of the present application provides a waveguide antenna unit, specifically, referring to Figure 1 As shown, Figure 1 Schematic diagram of the layered structure of the three metal layers of the waveguide antenna unit. In the figure, (a) is the upper surface of the top metal layer 15; (b) is the lower surface of the top metal layer 15; (c) is the upper surface of the middle metal layer 16; (d) is the lower surface of the middle metal layer 16; (e) is the upper surface of the bottom metal layer 17; and (f) is the lower surface of the bottom metal layer 17.

[0094] The waveguide antenna unit generally consists of three metal layers, which are a top metal layer 15 , a middle metal layer 16 and a bottom metal layer 17 from top to bottom.

[0095] The top surface of the top metal layer 15 is provided with a radiation unit layer, which includes four or more radiation slots 1 arranged linearly or nonlinearly along the wide side of the cavity. The radiation slots 1 are arranged periodically or aperiodically to achieve electromagnetic wave radiation and ensure good radiation performance.

[0096] A cavity mode suppressor 2 is provided on the lower surface of the top metal layer 15. This suppressor comprises multiple open pore structures 3 arranged linearly or nonlinearly. These pore structures 3 are also arranged periodically and are used to suppress unnecessary cavity modes. Furthermore, the cavity mode suppressor 2, through its pore structures 3, suppresses unnecessary cavity modes while retaining cavity modes that are beneficial to antenna radiation, thereby improving antenna matching and expanding bandwidth.

[0097] It is understandable that if Figure 2 and Figure 3As shown, the shapes of the radiation slot 1 and the open hole structure 3 include but are not limited to rectangle, circle, ellipse, pentagon or any regular / irregular polygonal structure; the sizes of the radiation slot 1 and the open hole structure 3 can be the same or different.

[0098] Intermediate metal layer 16 is located below top metal layer 15. Its upper surface is cavity layer 4, which serves as the primary channel for electromagnetic wave propagation. Its lower surface is cavity coupling slot 5, which is rectangular, square, or polygonal in shape and is used to couple electromagnetic energy to cavity layer 4.

[0099] The bottom metal layer 17 is located below the middle metal layer 16. Its upper surface is the cavity transmission line layer 6, which is used to transmit electromagnetic energy. The lower surface is the waveguide packaging layer 7, which serves as the packaging structure of the entire waveguide antenna unit, protecting the entire waveguide antenna unit from external influences and ensuring its stability and reliability.

[0100] The three metal layers are connected via SMT soldering, ensuring good electrical connectivity and mechanical stability. Furthermore, a narrow slit 8 is provided along the wide side of the cavity transmission line layer 6. This rectangular slit 8, with dimensions significantly smaller than those of the waveguide cavity, is used to accommodate any tin spillage generated during the SMT soldering process. Its dimensions are designed to minimize impact on antenna performance.

[0101] Specifically, the above metal layers are welded by SMT process. During welding, tin is brushed onto the surface of the metal layer using a steel mesh, and then the multi-layer metal welding is completed by pressing and heating. In this process, if the amount of tin brushed is uneven, it will cause the tin to overflow into the cavity, thereby affecting the performance of the waveguide antenna. This embodiment can optimize this problem by loading the narrow gap 8, such as Figure 4 and Figure 5 As shown, the narrow slot 8 can be located on the wide side or narrow side of the cavity transmission line layer 6, and its cross-section is a rectangular, square or other arbitrary polygonal structure. During the pressing operation, the narrow slot 8 structure allows the overflowed tin to flow into the narrow slot, thereby reducing the impact of tin overflow and leakage on the performance of the waveguide antenna. It should be added that the cross-sectional size of the narrow slot 8 needs to be much smaller than the cross-sectional size of the waveguide cavity. Taking the rectangular slot as an example, when the cavity mode operates at 77GHz, by optimizing the length and width dimensions and ratio of the narrow slot 8, the resonance point of the intracavity mode can be located in the THz frequency band, thereby suppressing the outward escape of the electric field in the cavity transmission line layer 6. While improving the product processing yield, its impact on the performance of the waveguide antenna is reduced.

[0102] This embodiment effectively suppresses cavity modes that are not beneficial to antenna radiation by adding a cavity mode suppressor 2, retaining multiple cavity modes required for antenna radiation, thereby improving antenna matching and expanding bandwidth. The provision of a narrow slit 8 in the cavity transmission line layer 6 optimizes the SMT soldering process and reduces the impact of tin spillage on antenna performance. Specifically, the narrow slit 8 accommodates tin spillage generated during the SMT soldering process, preventing it from affecting antenna performance.

[0103] This embodiment improves the matching level and radiation performance of the waveguide antenna, increases the antenna's gain and efficiency, effectively reduces the impact of tin overflow during the welding process on antenna performance, and improves production yield. By adopting a three-layer metal layer structure and SMT welding process, this solution ensures good electrical connection and mechanical stability between the layers of the waveguide antenna unit, enhancing the structural stability of the entire antenna. This embodiment is applicable to application scenarios such as large-scale mass production of automotive millimeter-wave radar, expanding the application range of waveguide antennas.

[0104] In some embodiments of the present application, when the cavity mode suppressor 2 is arranged at the wide side of the waveguide cavity, the TE 110 Mold, TE 120 Mold, TE 130 Mould and TE 160 mode and other high-order modes, while retaining TE 140 Mould and TE 150 These retained cavity modes are beneficial to antenna radiation and help improve the antenna matching level and expand the bandwidth.

[0105] When the cavity mode suppressor 2 is set at the narrow side of the waveguide cavity, it can effectively suppress the TE 110 Mold, TE 120 Mold, TE 130 Mould and TE 140 mode and other high-order modes, while retaining TE 150 Mould and TE 160 Likewise, these retained cavity modes are beneficial to antenna radiation.

[0106] Specifically, electromagnetic energy is fed into the cavity layer 4 through the cavity coupling slot 5, thereby exciting the TE in the cavity. 110 ,TE 120 ,TE 130 ,TE 140 ,TE 150 ,TE 160 And other high-order modes. By loading the cavity mode suppressor 2, the low-order and high-order cavity modes that are not beneficial to the radiation of the waveguide antenna are eliminated, so that it can work in the required mode. The working principle of the cavity mode suppressor is as follows Figure 6 shown. Figure 6 The simulation settings of the cavity model and eigenmode without cavity mode suppressor are shown. Figure 7 、 Figure 8 and Figure 9 As a result of the simulation, there are multiple resonant modes inside the cavity, namely TE 110 Mode@60.9GHz, TE 120 Mode@63.7GHz, TE 130 Mode@68GHz, TE 140 Mode@73.7GHz, TE 150 Mode@80.4GHz, TE 160 mode@87.9GHz and multiple higher-order modes, including TE 140 Mold, TE 150 The mode resonance frequency is close to the 76-81GHz band.

[0107] After loading the cavity mode suppressor, the eigenmode simulation results are as follows: Figure 10 shown. Figure 10 This is the waveguide model after the broadside is loaded with a cavity mode suppressor. Figure 11 The simulation results are shown in TE. 140 Mold, TE 150 The mode is retained, and its resonant frequency can be optimized to the 76-81 GHz band. On this basis, a slot is made on the top of the hole structure 3 in the corresponding cavity mode suppressor to achieve radiation. It should be noted that the cavity mode suppressor 2 can also be set on the narrow side of the waveguide cavity, such as Figure 12 and Figure 13 As shown, TE 150 Mold, TE 160 The model is preserved.

[0108] This embodiment can introduce specific electromagnetic scattering and reflection by designing the shape, arrangement and size of the hole structure 3 on the cavity mode suppressor 2, thereby changing the electromagnetic field distribution in the cavity. This change can make certain specific cavity modes (such as TE 110 Mold, TE 120 mode) are effectively suppressed, while other cavity modes that are beneficial to antenna radiation (such as TE 140 Mold, TE 150 This selective cavity mode suppression helps improve the antenna matching level and expand the bandwidth.

[0109] In some embodiments of the present application, the radiation slot 1 may adopt a convex or concave structure to achieve different radiation characteristics, thereby solving the problem of low radiation efficiency of traditional waveguide antennas.

[0110] Specifically, when the radiation slot 1 adopts a convex structure, it protrudes outward from the waveguide cavity, helping to concentrate the electric field near the radiation slot, reducing horizontal energy dissipation, and thus improving the antenna gain. When the radiation slot 1 adopts a concave structure, it is recessed toward the inside of the waveguide cavity, which can also achieve electric field concentration and reduce energy dissipation, thereby improving the antenna gain.

[0111] It should be added that the field distribution inside the corresponding hole structure 3 should also be considered when setting the position of the radiation slot 1. Figure 14 As shown, it can be located in the center or side of the hole-like structure 3. In the figure, (a) is the left vertical groove; (b) is the right vertical groove; (c) is the central vertical groove; (d) is the left inclined vertical groove; (e) is the right inclined vertical groove; (f) is the upper horizontal groove; (g) is the lower horizontal groove; (h) is the central horizontal groove; (i) is the upper inclined horizontal groove; and (j) is the lower inclined horizontal groove.

[0112] At the same time, by flexibly adjusting the shape, arrangement and quantity variables of the hole structure 3, and combining the shape, arrangement and quantity variables of the radiation slot 1, a variety of radiation modes can be achieved to meet the requirements of different products for antenna patterns, such as Figure 15 and Figure 16 As shown. It should be added that the size of the radiation slot 1 can be consistent with the size of the hole structure 3, or can be larger or smaller than the size of the hole structure 3; the shape can be the same or different. In order to improve the antenna gain, the radiation slot 1 can be set to be convex or concave, as shown in FIG. Figure 17 and Figure 18 This solution can concentrate the electric field near the radiation slot 1, reduce the horizontal dissipation of energy, and improve the antenna gain.

[0113] In this embodiment, the waveguide antenna's gain is improved by optimizing the structure of the radiation slots 1. The raised or recessed structure of the radiation slots 1 helps reduce horizontal energy dissipation, thereby increasing the antenna's gain. This also further enhances the antenna's directivity, allowing it to more accurately point in the target direction for communication.

[0114] Furthermore, in combination with the structural design of the above embodiment, the following is an example of a waveguide antenna loaded with a cavity mode suppressor 2. The number of the radiation slots 1 and the hole-shaped structures 3 can be four or more.

[0115] Reference Figure 19-21 As shown, Figure 19This is a schematic diagram of the waveguide antenna structure with the first cavity wide side loaded with a cavity mode suppressor, which consists of a top metal layer 15, an intermediate metal layer 16 and a bottom metal layer 17. Its radiation slots 1 are located at the wide side of the cavity, and there are four of them, distributed on the top of the cavity mode suppressor 2 containing four periodically arranged hole structures 3. The cavity coupling slot 5 is connected to the horizontal cavity transmission line 9 through the mode converter 11, and the stepped structure 14 is used to adjust the impedance matching of the waveguide antenna. The horizontal cavity transmission line 9 is connected to the vertical cavity transmission line 12 via the mode converter 11. Similarly, the stepped structure is also loaded in the mode converter and is used to alleviate the problem of impedance mismatch. The end of the vertical cavity transmission line 12 is connected to the waveguide packaging port 13.

[0116] Reference Figure 22-24 As shown, Figure 22 This is a schematic diagram of the waveguide antenna structure with a second type of cavity wide side loaded with a cavity mode suppressor, which consists of a top metal layer 15, an intermediate metal layer 16 and a bottom metal layer 17. Its radiation slots 1 are located at the wide side of the cavity, and there are four of them. A cavity mode suppressor 2 comprising four periodically arranged hole structures 3 is arranged on the wide side of the cavity layer 4 and opposite to the radiation slot 1. The cavity coupling slot 5 is connected to the horizontal cavity transmission line 9 through a mode converter 11, and the stepped structure 14 is used to adjust the impedance matching level of the waveguide antenna. The horizontal cavity transmission line 9 is connected to the vertical cavity transmission line 12 via the mode converter 11. Similarly, the stepped structure 14 is also loaded in the mode converter 11 and is used to alleviate the problem of impedance mismatch. The end of the vertical cavity transmission line 12 is connected to the waveguide packaging port 13.

[0117] Reference Figure 25-27 As shown, Figure 25 This is a schematic diagram of a waveguide antenna structure with a cavity mode suppressor loaded on the narrow side of the cavity, which consists of a top metal layer 15, an intermediate metal layer 16 and a bottom metal layer 17. Its radiation slots 1 are located at the wide side of the cavity, and there are four of them. A cavity mode suppressor 2 comprising four periodically arranged hole structures 3 is arranged on the narrow side of the cavity layer 4, and the radiation slots 1 are arranged vertically. The cavity coupling slot 5 is connected to the horizontal cavity transmission line 9 through a mode converter 11, and the stepped structure 14 is used to adjust the impedance matching level of the waveguide antenna. The horizontal cavity transmission line 9 is connected to the vertical cavity transmission line 12 via the mode converter 11. Similarly, the stepped structure 14 is also loaded in the mode converter 11 and is used to alleviate the problem of impedance mismatch. The end of the vertical cavity transmission line 12 is connected to the waveguide packaging port 13.

[0118] Reference Figures 28-30 As shown, Figure 28This is a schematic diagram of the waveguide antenna structure with a third type of cavity wide side loaded cavity mode suppressor, which consists of a top metal layer 15 and a bottom metal layer 17. Its radiation slots 1 are located at the narrow side of the cavity layer 4, and there are four of them. The cavity mode suppressor 2, which includes four periodically arranged hole structures 3, is arranged on the wide side of the cavity layer 4 and is placed perpendicular to the radiation slots 1. The vertical cavity transmission line 12 is connected to the vertical cavity transmission line 12 via the mode converter 11. Similarly, the stepped structure 14 is also loaded in the mode converter 11 and is used to alleviate the problem of impedance mismatch. The end of the vertical cavity transmission line 12 is connected to the waveguide packaging port 13.

[0119] It is understandable that, referring to Figure 31 As shown, the cavity mode suppressors 2 are not necessarily on the same side of the waveguide cavity. The number of cavity mode suppressors 2 can be adjusted by the number of hole structures 3. Furthermore, the sizes of the hole structures 3 can also be different. The number of cavity mode suppressors 2 loaded on both sides of the waveguide cavity can be the same or different. Figure 31 Schematic diagram of the layout of six types of porous structures 3 on the cavity layer 4.

[0120] In a second aspect of an embodiment of the present application, a PCB waveguide antenna unit is provided. The PCB waveguide antenna unit is implemented using a PCB solution and includes a top metal layer 15 and a copper-clad PCB board 18 .

[0121] The top metal layer 15 is provided with a radiation slot 1 and a cavity mode suppressor 2. The radiation slot 1 is used to radiate electromagnetic waves; the cavity mode suppressor 2 includes a hole structure 3 to suppress unnecessary cavity modes. Furthermore, the hole structure 3 is surrounded by grounded metallized vias 24 to enhance cavity mode suppression.

[0122] The copper-clad PCB 18 serves as the lower surface of the waveguide cavity and is soldered to the top metal layer 15 through the SMT process. A narrow slot 8 is integrated on the upper surface of the top metal layer 15 to accommodate tin overflow from SMT soldering.

[0123] The PCB manufacturing process has the advantages of being mature, stable, and low-cost. In this embodiment, by adopting a PCB solution to implement the waveguide antenna unit, the advantages of the PCB manufacturing process can be fully utilized and the manufacturing process can be simplified.

[0124] This embodiment utilizes a PCB solution to implement the waveguide antenna unit, simplifying the manufacturing process. By optimizing the SMT soldering process and providing a narrow gap 8, the impact of solder overflow on antenna performance is effectively reduced, improving production yield. The use of a cavity mode suppressor 2 and grounded plated vias 24 further enhance the matching and radiation performance of the waveguide antenna, increasing both gain and efficiency.

[0125] In some embodiments of the present application, in a PCB waveguide antenna unit, a cavity mode suppressor 2 is disposed on the top surface of a copper-clad PCB 18, and a hole-shaped structure 3 is integrated with a ground metallized via 24. The provision of cavity mode suppressor 2 can effectively suppress high-order and low-order modes within the cavity that are detrimental to the antenna's radiation pattern.

[0126] In a third aspect of an embodiment of the present application, a gap waveguide antenna unit is provided. The gap waveguide antenna unit includes a top metal layer 15 and a PCB multilayer board 19 .

[0127] The multilayer PCB 19 includes a copper-clad PCB 18 and a thin plate 21, which are integrated into a single unit via a polypropylene layer 22. The copper-clad PCB 18 is soldered to the top metal layer 15 via a SMT process. Similarly, a narrow slit 8 is integrated into the top metal layer 15 to accommodate solder overflow from SMT soldering.

[0128] The multilayer PCB 19 is also equipped with multiple electromagnetic bandgap pins 20, which are secured to the thin plate 21 and the PP layer 22 with screws. The PP layer 22 and the thin plate 21 provide electromagnetic isolation. The multiple electromagnetic bandgap pins 20 are physically isolated from the copper-clad PCB 18 by the PP layer 22 and the thin plate 21. The multiple electromagnetic bandgap pins 20 are used to suppress the propagation of electromagnetic waves in specific directions.

[0129] Furthermore, in combination with the structural design of the above embodiments, the following are some examples of a cavity mode suppressor loaded waveguide antenna based on a PCB solution.

[0130] Reference Figure 32 and Figure 33 As shown, Figure 32 and Figure 33 This is a schematic diagram of a waveguide antenna structure loaded with a cavity mode suppressor based on a PCB solution, consisting of a top metal layer 15 and a copper-clad PCB board 18. The cavity mode suppressor 2, which includes four periodically arranged hole structures 3, is set on the top metal layer 15. The copper-clad surface of the copper-clad PCB board 18 serves as the lower surface of the waveguide cavity and is connected to the single-layer metal layer through the SMT process. Its radiation slots 1 are located at the wide side of the cavity layer 4, and there are four of them, distributed on the top of the cavity mode suppressor 2, which includes four periodically arranged hole structures 3. Similarly, the stepped structure 14 is also loaded in the mode converter 11 and is used to alleviate the problem of impedance mismatch. The mode converter 11 connects the cavity coupling slot 5 to the cavity layer 4.

[0131] Reference Figure 34-36 As shown, Figure 34-36This is a schematic diagram of a waveguide antenna structure loaded with a cavity mode suppressor based on a PCB solution, which consists of a top metal layer 15 and a copper-clad PCB board 18. The cavity mode suppressor 2 is arranged on the upper surface of the copper-clad PCB board 18, and consists of a hole structure 3 and a ground metallized through-hole 24, which is connected to the single metal layer through the SMT process. The radiation slots 1 are located at the wide side of the cavity, and there are four of them, distributed on the opposite side of the cavity mode suppressor 2 containing four periodically arranged hole structures 3. Similarly, the stepped structure 14 is also loaded in the mode converter 11 and is used to alleviate the problem of impedance mismatch. The mode converter 11 connects the cavity coupling slot 5 to the cavity layer 4.

[0132] The cavity mode suppressor in the above waveguide antenna can also be applied to the gap waveguide antenna. With this solution, it can be fixed with screws to work normally. Figure 37-Figure 39 As shown, Figure 37-Figure 39 Schematic diagram of the gap waveguide antenna structure based on PCB solution, schematic diagram of the gap waveguide antenna structure with loaded cavity mode suppressor based on PCB solution, consisting of top metal layer 15 and PCB multilayer board 19. Figure 17 As shown, the PCB multilayer board 19 is a multilayer board, which is composed of a copper-clad PCB board 18, a PP layer 22 and a thin plate 21. The thin plate 21 is used to achieve physical isolation between the multi-electromagnetic bandgap pins 20 and the copper-clad PCB board 18, thereby achieving the electromagnetic bandgap and confining the electric field inside the cavity layer 4. The radiation slots 1 are located at the wide side of the cavity, and there are four of them, distributed on the opposite side of the cavity mode suppressor 2 containing four periodically arranged hole structures 3. Similarly, the stepped structure 14 is also loaded in the mode converter 11 and is used to alleviate the problem of impedance mismatch. The mode converter 11 connects the cavity coupling slot 5 to the cavity layer 4.

[0133] A fourth aspect of the present application provides a waveguide antenna array, the waveguide antenna array comprising a plurality of waveguide antenna units as described in the above embodiment. In this embodiment, the waveguide antenna unit described in embodiment 1 is used as an example for description.

[0134] Multiple waveguide antenna units are arranged in two rows and four columns, forming a 4T4R transceiver array. Each waveguide antenna unit comprises three metal layers: a top metal layer 15, a middle metal layer 16, and a bottom metal layer 17. The top metal layer 15 has a radiating element layer on its upper surface, comprising four radiating slots 1 arranged linearly along the wide edge of the cavity; the bottom surface has a cavity mode suppressor 2. The top surface of the middle metal layer 16 forms the cavity layer 4, while the bottom surface contains the cavity coupling slot 5. The top surface of the bottom metal layer 17 forms the cavity transmission line layer 6, while the bottom surface forms the waveguide packaging layer 7.

[0135] Waveguide antenna units, the basic components of antenna arrays, enable both electromagnetic wave radiation and reception. The 4T4R transceiver array achieves multi-channel simultaneous transmission and reception through the rational arrangement of multiple waveguide antenna units.

[0136] This embodiment optimizes the layout of the 4T4R transceiver array by using a genetic algorithm.

[0137] A genetic algorithm is an optimization algorithm that simulates natural selection and heredity. Through continuous iteration and optimization, it can find the optimal solution that meets multiple objectives. In this solution, a genetic algorithm is used to optimize the layout of the 4T4R transceiver array, comprehensively considering multiple objectives such as the sidelobe level and mainlobe width of the radiation pattern to achieve optimal antenna array performance.

[0138] An antenna array is composed of multiple antenna elements. By properly arranging and energizing each antenna element, a specific radiation pattern can be achieved. In this embodiment, by adopting a 4T4R transceiver array layout, multi-channel simultaneous transceiver functionality can be achieved, improving the overall performance of the antenna.

[0139] In some embodiments of the present application, the waveguide antenna array has a microstrip coupled feed structure, which includes a microstrip patch 26, a grounded coplanar waveguide transmission line 27, and a chip 39. The microstrip patch 26 is placed below the cavity coupling slot 5; the grounded coplanar waveguide transmission line 27 connects the microstrip patch 26 and the chip 39; and grounded metallized vias 24 are provided around the transmission line.

[0140] Microstrip patch 26 is used to couple and transmit electromagnetic waves. A grounded coplanar waveguide transmission line 27 connects microstrip patch 26 and chip 39, enabling electromagnetic wave transmission, ensuring low-loss, high-efficiency transmission performance. Chip 39 is the terminal portion of the microstrip coupled feed structure, enabling electromagnetic wave transmission and reception. Grounded metallized vias 24 enhance electromagnetic wave confinement.

[0141] This embodiment implements the feeding function of the waveguide antenna array by employing a microstrip coupled feed structure. Specifically, the use of microstrip patches 26 and grounded coplanar waveguide transmission lines 27 achieves efficient coupling and transmission of electromagnetic waves. Furthermore, the provision of grounded metallized vias 24 around the transmission lines enhances electromagnetic wave confinement, further reducing transmission losses.

[0142] In some embodiments of the present application, a perturbation structure 25 is provided at the diagonal corners of the microstrip patch 26; a grounding metallized through hole 24 is provided in the center of the microstrip patch 26, which can be used to improve the matching level of the microstrip coupling structure.

[0143] Furthermore, in combination with the present application, a structural design of an embodiment of a waveguide antenna array is provided, and the following is an implementation form of an example array.

[0144] Reference Figure 40 and Figure 41 As shown, Figure 40 and Figure 41 It is an implementation form of a waveguide antenna array, with eight groups of radiating elements 100 arranged in two rows and four columns, serving as transmitting antennas and receiving antennas (4T4R) respectively. Under the constraints of a fixed number of array elements and limited physical layout, a multi-objective fitness function is adopted, taking into account the sidelobe level and mainlobe width of the radiation pattern, and a genetic algorithm is used to design the position layout of the eight groups of radiating elements, where the relative positions of the elements within each group of radiating elements are fixed. In addition, in order for the example array to work, corresponding feed needs to be designed. In the millimeter wave frequency band, traditional discrete connections (such as SMA connectors) will introduce parasitic effects and losses, so coupling is generally used.

[0145] like Figure 42 As shown, a microstrip patch 26 is placed below the cavity coupling slot 5 and connected to the chip 39 via a grounded coplanar waveguide transmission line 27. Grounded metallized vias 24 are provided around the transmission line to confine electromagnetic energy. Perturbation structures 25 are provided at the diagonals of the microstrip patch 26, and a grounded metallized via 24 is provided in the center to increase the bandwidth of the transmission structure. Electromagnetic energy can be coupled to the waveguide package port 23 through the chip's external microstrip patch or the chip's internal microstrip structure. This shortens the transmission distance between the chip and the antenna and reduces the attenuation of electromagnetic waves in the transmission line.

[0146] In the above embodiments of the present application, the metal layer can be processed and formed by aluminum CNC processing technology, or it can be formed by CNCing a PEI or PPS plastic substrate and then metallizing the surface through PVD or electroplating technology.

[0147] Among them, aluminum CNC machining is a high-precision, high-efficiency manufacturing process. By using computer numerical control (CNC) machine tools to perform cutting, drilling, and other processing operations on aluminum, high-precision machining and manufacturing of metal layers can be achieved. This aluminum CNC machining process enables high-precision machining and manufacturing of metal layers, making it suitable for applications requiring high precision. Using aluminum CNC machining or plastic substrate surface metallization can improve the manufacturing efficiency of waveguide antenna units and shorten production cycles.

[0148] Furthermore, after the PEI or PPS plastic substrate is CNCed, the surface is metalized by PVD (physical vapor deposition) or electroplating process, which is a low-cost and high-efficiency manufacturing process. By using these processes to deposit a metal layer on the surface of the plastic substrate, low-cost and high-efficiency manufacturing of the metal layer can be achieved. In addition, the plastic metallization solution has more advantages in terms of cost and weight, can significantly reduce the weight of the product, is more cost-effective in large-scale production, and is suitable for application scenarios with higher cost requirements. After the PEI or PPS plastic substrate is CNCed, the surface is metalized by PVD or electroplating process, which can reduce the manufacturing cost of the waveguide antenna unit.

[0149] Based on the above embodiments, this application provides a waveguide antenna design case, which can be applied to vehicle-borne waveguide antennas. Figure 1 As shown. And the simulated reflection coefficient Figure 43 As shown, its -20dB matching bandwidth can cover 76GHz-81GHz. Figure 44 The following is the simulation result of the sidelobe level of the waveguide antenna. The sidelobe level within the working bandwidth is less than -24dB, and the gain fluctuation within the band is small. Figure 45 This is the gain simulation result of the waveguide antenna. The antenna gain in the working frequency band is 13.8-14.6dBi.

[0150] In combination with the contents of the above embodiments, it can be seen that the present application can achieve low-order and high-order cavity mode suppression by loading a cavity mode suppressor on the side wall of the cavity and adjusting the shape, arrangement and size of the hole-like structure, thereby retaining the cavity modes required for multiple antenna radiation. Radiation can be achieved by making grooves on the wide or narrow side of the cavity. By combining the cavity mold and the slot mold, the antenna matching level can be further optimized and the bandwidth can be expanded. The cavity mode suppressor can also be loaded on the PCB board, and low-order and high-order cavity mode suppression can be achieved by adjusting the shape, arrangement and size of the hole-like structure, thereby retaining the cavity mode that is beneficial to antenna radiation. The grounded metallized through-holes around the hole-like structure can reduce the escape of electromagnetic energy and concentrate it inside the cavity.

[0151] By making the radiation slot convex or concave, the electric field around it can be confined to the slot, reducing the vertical side lobes while increasing the antenna gain. By adding narrow slits on the wide or narrow sides of the cavity mode transmission structure, the impact of tin overflow and leakage in the SMT process on antenna performance can be improved, thereby improving product yield. By adding a perturbation structure at the diagonal corners of the metal patch, the surface electric field has a phase difference in the horizontal direction, which in turn causes rotation and stimulates the quasi-TM of the metal patch. 21 and quasi TM 12 The transmission structure's bandwidth is further optimized by adding a grounded perturbation structure at the center of the metal patch.

[0152] Other embodiments of the present disclosure will readily occur to those skilled in the art after considering the specification and practicing the disclosure herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the following claims.

Claims

1. A waveguide antenna unit, characterized in that: At least two metal layers are included, wherein the two metal layers are: a top metal layer (15) and a bottom metal layer (17); A radiation unit layer is provided on the upper surface of the top metal layer (15), wherein the radiation unit layer comprises a plurality of radiation slots (1) arranged linearly or nonlinearly at the wide side or narrow side of the waveguide cavity; A cavity mode suppressor (2) is provided on the lower surface of the top metal layer (15), and the cavity mode suppressor (2) comprises a plurality of linearly or nonlinearly arranged open hole structures (3); The bottom metal layer (17) is located below the top metal layer (15), the upper surface of the bottom metal layer (17) is the cavity transmission line layer (6), and the lower surface is the waveguide packaging layer (7); in: The two metal layers are connected by welding through the SMT process; A narrow slit (8) is provided on the wide side or the narrow side of the cavity transmission line layer (6); the cross section of the narrow slit (8) is rectangular or polygonal; the cross-sectional size of the narrow slit (8) is much smaller than the cross-sectional size of the waveguide cavity; and the narrow slit (8) is used to accommodate SMT soldering overflow.

2. The waveguide antenna unit according to claim 1, wherein: Also includes: an intermediate metal layer (16); The intermediate metal layer (16) is located between the top metal layer (15) and the bottom metal layer (17); The upper surface of the intermediate metal layer (16) is a cavity layer (4), and the lower surface is a cavity coupling slot (5), and the cavity coupling slot (5) is one of rectangular, square or polygonal; The top metal layer (15), the middle metal layer (16) and the bottom metal layer (17) are connected by welding through an SMT process.

3. The waveguide antenna unit according to claim 1, wherein: The cavity modes of the waveguide cavity include: TE 110 TE 120 TE 130 TE 140 TE 150 TE 160 module and other high-order modes; When the cavity mode suppressor is arranged at the wide side of the waveguide cavity, the TE 110 TE 120 TE 130 Mould and TE 160 mode and other high-order modes, retaining the TE 140 Mould and TE 150 mold; When the cavity mode suppressor is arranged at the narrow side of the waveguide cavity, the TE 110 TE 120 TE 130 Mould and TE 140 mode and other high-order modes, retaining the TE 150 Die and the TE 160 mold; The radiation slot (1) adopts a convex or concave structure; When the radiation slot (1) is a convex structure, it protrudes toward the outside of the waveguide cavity; When the radiation slot (1) is a recessed structure, it is recessed toward the inner side of the waveguide cavity.

4. A PCB waveguide antenna unit, implemented using a PCB solution, characterized in that: include: Top metal layer (15) and copper clad PCB (18); The top metal layer (15) is provided with a radiation slot (1) and a cavity mode suppressor (2), the cavity mode suppressor (2) includes a hole structure (3), and the hole structure (3) is provided with grounding metallized through holes (24) around it; The copper-clad PCB (18) serves as the lower surface of the waveguide cavity and is welded to the top metal layer (15) through an SMT process. A narrow slit (8) is integrated on the upper surface of the top metal layer (15) for accommodating SMT soldering tin overflow.

5. The PCB waveguide antenna unit according to claim 4, characterized in that: The cavity mode suppressor (2) is arranged on the upper surface of the copper-clad PCB (18), and the hole-shaped structure (3) and the grounding metallized through-hole (24) are integrated on the copper-clad PCB (18).

6. A gap waveguide antenna unit, characterized in that: include: Top metal layer (15) and PCB multilayer board (19); The top metal layer (15) is provided with a radiation slot (1), and the top metal layer (15) is also provided with or integrated with a cavity mode suppressor (2); The PCB multilayer board (19) comprises: a copper-clad PCB board (18) and a thin board (21), wherein the copper-clad PCB board (18) and the thin board (21) are formed into a whole through a PP layer (22); The copper-clad PCB board (18) is welded to the top metal layer (15) through the SMT process, and a narrow slit (8) is integrated on the upper surface of the top metal layer (15) for accommodating tin overflow from SMT welding; The PCB multilayer board (19) is further provided with multiple electromagnetic bandgap pins (20), and the multiple electromagnetic bandgap pins (20) are fixed to the thin board (21) and the PP layer (22) by screws; The multi-electromagnetic bandgap pin (20) is physically isolated from the copper-clad PCB board (18) by the thin plate (21) and the PP layer (22).

7. A waveguide antenna array, characterized in that: comprising a plurality of waveguide antenna units according to any one of claims 1 to 6; The plurality of radiation units (1) are arranged in two rows and four columns to form a 4T4R transceiver array; The layout of the 4T4R transceiver array is optimized by a genetic algorithm, and a multi-objective fitness function is used to control the sidelobe level and mainlobe width.

8. The waveguide antenna array according to claim 7, wherein: Also includes: A microstrip coupled feeding structure, wherein the microstrip patch (26) is placed below the waveguide feeding slot (5); The microstrip coupling feeding structure comprises: a microstrip patch (26), a grounded coplanar waveguide transmission line (27) and a chip (28), wherein the grounded coplanar waveguide transmission line (27) connects the microstrip patch (26) and the chip (28); The grounding metallized through hole (24) is provided around the transmission line of the microstrip coupling feeding structure.

9. The waveguide antenna array according to claim 8, characterized in that: A perturbation structure (25) is provided at the diagonal corners of the microstrip patch (26), and the grounding metallized through hole (24) is provided at the center of the microstrip patch (26).

10. The waveguide antenna unit according to any one of claims 1, 4 or 6, characterized in that: The metal layer is processed by aluminum CNC processing technology; Or it can be made by CNCing the PEI or PPS plastic substrate and then metallizing the surface through PVD / electroplating process.

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