Circuit board detection system

Abstract

The invention discloses a circuit board detection system, which comprises a main control device and at least one detection device in communication connection with the main control device, the detection device is used for detecting a plurality of detection items of a plurality of board cards, different board cards correspond to different detection boards, and the main control device is used for performing data interaction with the detection device through a specified communication mode. The server is further used for analyzing a switching instruction when receiving the board card switching instruction and sending a switching signal for replacing the detection board based on the switching instruction, and the switching signal comprises at least one of a communication mode, a name of a to-be-detected board card, an identification code of the to-be-detected board card and a detection parameter corresponding to the to-be-detected board card; the detection equipment is used for receiving the switching signal and switching a current board into a detection board based on the switching signal so as to detect the board card to be detected by using the detection board, and the detection equipment comprises at least one of a solder paste detector, an automatic optical detector, a coating detector, a semiconductor detector and a substrate detector; the switching efficiency and the switching accuracy of the detection plate type are improved.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board detection, and in particular to a circuit board detection system. Background Art

[0002] Circuit boards are the carriers of electrical connections for electronic components and are widely used in various electrical fields. After installing various components on the circuit board, it is necessary to inspect it to determine whether there are any missing components, incorrect component installation positions, or installation defects.

[0003] During the existing circuit board inspection process, when it is necessary to switch boards for inspection, the operator needs to manually switch the different inspection board types corresponding to different boards before inspection can be carried out, and the operator needs to pause each inspection device before switching the inspection board type. This board type switching method has low switching efficiency and low board type switching accuracy. Summary of the Invention

[0004] The present application proposes a circuit board detection system, which can improve the switching efficiency and switching accuracy of the detection board type.

[0005] In order to solve the above technical problems, a technical solution adopted in the present application is: to provide a circuit board detection system, which includes a main control device and at least one detection device communicatively connected to the main control device, the detection device is used to detect multiple detection items of multiple boards and cards, and different boards and cards correspond to different detection board types, wherein: the main control device is used to interact with the detection device through a specified communication method, and is also used to parse the switching instruction when receiving the board switching instruction, and send a switching signal to change the detection board type based on the switching instruction, the switching signal includes at least one of the communication method, the name of the board to be tested, the identification code of the board to be tested, and the detection parameters corresponding to the board to be tested; the detection device is used to receive the switching signal, and switch the current board type to the detection board type based on the switching signal, so as to use the detection board type to detect the board to be tested, and the detection equipment includes at least one of a solder paste detector, an automatic optical detector, a coating detector, a semiconductor detector, and a substrate detector.

[0006] Among them, the above-mentioned data interaction with the detection equipment through the specified communication method includes: obtaining the data communication method of the circuit board production equipment, setting the data communication method to the target communication method, the data communication method includes any one of network communication, DDS communication, and serial communication; and interacting with the detection equipment through the target communication method.

[0007] Among them, the detection equipment also includes: a transport mechanism, which is arranged inside the detection equipment and is used to determine the transmission parameters based on the switching signal, and the transmission parameters include at least one of the track width and the transmission speed; an imaging mechanism, which is arranged inside the detection equipment and is used to determine the imaging parameters based on the switching signal, and the imaging parameters include at least one of the trigger timing and the moving path.

[0008] Among them, the detection equipment includes a solder paste detector, which is equipped with multiple detection plates. When the solder paste detector receives a switching signal, it switches the current plate type to the detection plate type corresponding to the board to be tested, so as to switch the solder printing detection algorithm, and use the switched solder printing detection algorithm to perform solder printing quality inspection on the board to be tested.

[0009] Among them, the detection equipment includes an automatic optical detector, which is equipped with multiple detection plate types. The automatic optical detector receives a switching signal to switch the current plate type to the detection plate type corresponding to the board to be tested, so as to switch the misassembly and defect detection algorithm, and use the switched misassembly and defect detection algorithm to detect misassembly and welding defects in the board to be tested.

[0010] There are multiple detection devices, and the multiple detection devices receive a switching signal and synchronously switch their respective detection board types.

[0011] Among them, multiple detection devices are different types of detection devices located on the same production line, and multiple detection devices receive switching signals and synchronously switch their respective detection plate types to respectively detect different process results of the boards to be tested; and / or multiple detection devices are the same type of detection devices located on different production lines; multiple detection devices receive switching signals and synchronously switch their respective detection plate types to respectively detect the boards to be tested on different production lines.

[0012] The switching signal is transmitted in Json data format.

[0013] Before sending a switching signal for changing the detection board type based on the switching instruction, the method further includes: extracting encryption information of the detection board type, parsing verification information in the encryption information, and confirming the detection board type to be switched according to the verification information.

[0014] Among them, the detection system also includes: an abnormality monitoring device, which is communicatively connected to the main control device. When the main control device sends a switching signal to the detection device, it sends a monitoring start signal to the abnormality monitoring device. The abnormality monitoring device monitors the detection device based on the monitoring start signal, and when it determines that the detection device has no response within the preset monitoring time, it generates information indicating that the detection device is abnormal.

[0015] The beneficial effects of the present application are as follows: different from the prior art, the circuit board detection system proposed in the present application includes a main control device and at least one detection device connected to the main control device for communication, the detection device is used to detect multiple detection items of multiple boards, which can expand the detection capability of the detection device for circuit boards, i.e., boards, and improve the detection efficiency and detection accuracy of boards. Furthermore, different boards correspond to different detection board types, and the main control device is used to exchange data with the detection device through a specified communication method to improve the reliability of data exchange between the two and improve the efficiency and accuracy of board detection; and the main control device is also used to parse the switching instruction when receiving the board switching instruction, and send a switching signal for changing the detection board type based on the switching instruction, wherein the switching signal at least includes at least one of the communication method, the name of the board to be tested, the identification code of the board to be tested, and the detection parameters corresponding to the board to be tested, so that the detection device can accurately switch the detection board type of the board to be tested based on the switching instruction, thereby improving the accuracy of board detection. Furthermore, the inspection equipment includes at least one of a solder paste tester, an automated optical tester, a coating tester, a semiconductor tester, and a substrate tester, enabling the utilization of these inspection equipment to meet a variety of different board inspection requirements. Furthermore, the present application enables automatic switching of inspection board types. Therefore, the present application can improve the switching efficiency and accuracy of inspection board types. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a structural diagram of an embodiment of a circuit board detection system of the present application;

[0017] Figure 2 This is a flow chart of an embodiment of a circuit board detection system of the present application;

[0018] Figure 3 It is a structural diagram of an embodiment of a production system for a circuit board of the present application. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0020] This application first proposes a circuit board detection system, such as Figure 1 As shown, Figure 1The diagram is a schematic diagram of an embodiment of a circuit board detection system according to the present application. The detection system in this embodiment specifically includes a master control device 10 and at least one detection device 20 communicatively connected to the master control device 10. The detection device 20 is configured to detect multiple test items on various circuit boards, with different circuit boards corresponding to different test patterns.

[0021] For example, in this embodiment, the main control device 10 is in communication connection with three detection devices 20. Of course, in other embodiments, the number of detection devices 20 can be 1, 2, or 3 or more.

[0022] Optionally, the detection parameters may include at least one of a component to be tested, an area to be tested, a detection algorithm, and a detection model.

[0023] Among them, the main control device is used to interact with the detection device through a specified communication method to exchange data, and is also used to parse the switching instruction when receiving the board switching instruction, and send a switching signal to change the detection board type based on the switching instruction. The switching signal includes at least one of the communication method, the name of the board to be tested, the identification code of the board to be tested, and the detection parameters corresponding to the board to be tested; the detection device is used to receive the switching signal, and switch the current board type to the detection board type based on the switching signal, so as to use the detection board type to detect the board to be tested. The detection equipment includes at least one of a solder paste detector, an automatic optical detector, a coating detector, a semiconductor detector, and a substrate detector.

[0024] In this embodiment, the detection device 20 is used to detect multiple detection items of multiple boards and cards, which can expand the detection capability of the detection device 20 for circuit boards, i.e., boards and cards, and improve the detection efficiency and detection accuracy of boards and cards. Furthermore, different boards and cards correspond to different detection board types, and the main control device 10 is used to exchange data with the detection device 20 through a specified communication method to improve the reliability of data exchange between the two and improve the efficiency and accuracy of board and card detection. The main control device 10 is also used to parse the switching instruction when receiving a board and card switching instruction, and send a switching signal to change the detection board type based on the switching instruction, wherein the switching signal includes at least one of the communication method, the name of the board to be tested, the identification code of the board to be tested, and the detection parameters corresponding to the board to be tested, so that the detection device 20 can accurately switch the detection board type of the board to be tested based on the switching instruction, thereby improving the accuracy of board and card detection. Furthermore, the detection device 20 includes at least one of a solder paste detector, an automatic optical detector, a coating detector, a semiconductor detector, and a substrate detector, so that the detection device 20 can meet the various different detection requirements of boards and cards. Furthermore, this embodiment can realize automatic switching of the detection plate type. Therefore, this embodiment can improve the switching efficiency and switching accuracy of the detection plate type and reduce the labor time cost.

[0025] Among them, the main control device 10 may include a microcontroller, a communication unit, and an input unit (display touch module, button selection or voice input unit, etc.). The input unit and the communication unit are connected to the microcontroller, and the communication unit is also connected to the detection device for communication; the communication unit is used to interact with the detection device for data through a specified communication method, and the input unit is used to obtain board switching instructions; the microcontroller unit is used to parse the switching instructions and generate a switching signal for changing the detection board type based on the switching instructions; the communication unit is used to send the switching instructions to the detection device 20.

[0026] In other embodiments, the main control device 10 may not be provided with an input unit, and the communication unit may be connected to other terminals to obtain the board switching instruction from the terminals.

[0027] Furthermore, the circuit board inspection system proposed in this application can be applied to image defect detection for printed circuit board assembly (PCBA), MiniLED, MicroLED, or semiconductors. In one application scenario, while the inspection device 20 is inspecting the circuit board using the inspection board type, when the main control device 10 of the production line switches the board, the inspection device 20 can automatically switch the inspection board type, eliminating the step of manually switching the board type across the production line. This can improve the efficiency and accuracy of board type switching, thereby improving production efficiency.

[0028] In one application scenario, the test board type of the board to be tested can be pre-programmed and stored in a list of the master device 10 and the test device 20 for automatic switching of the test board type. When the test board type needs to be switched, the master device 10 only needs to send a switching signal to the test device 20, and the test device 20 will automatically switch the test board type to test the board to be tested, reducing the time consumed by manual switching and making the entire production line easier to operate, thus avoiding the problem of manually switching between different test board types to continue production.

[0029] Alternatively, as Figure 1 As shown, the detection system also includes a transport mechanism 30, which is communicatively connected to the main control device 10; the detection device 20 includes a shell and a detection mechanism, and a detection window is provided on the shell. The detection end of the detection mechanism is aligned with the detection window, and the transport mechanism 30 is partially arranged below the detection window to transport the board to be tested to the detection window.

[0030] Optionally, different parts of the transport mechanism 30 can be respectively arranged inside a plurality of different testing devices 20, and the transport speed and / or track width of the board to be tested can be adjusted under the control of a switching signal from the main control device 10. For example, different testing devices 20 may have different detection items for the board to be tested and may have different transmission parameter requirements for the transport mechanism 30. The transport mechanism 30 can determine the transmission parameters of each testing device 20 for the board to be tested based on the switching signal, and control the transport mechanism 30 to transport the board to be tested to each testing device 20 based on the transmission parameters, so that the transmission parameters of the board to be tested match the detection of the board to be tested by the testing device 20, thereby improving the accuracy of the board detection.

[0031] In one application scenario, the detection system can be an SMT production line. The SMT production line includes a conveying mechanism 30, which can be a track for transporting boards to be tested. The SMT production line, also known as the Surface Mount Technology (SMT) production line, has evolved from using hybrid integrated circuit technology to using electronic assembly technology. Components are assembled using surface mounting technology and reflow soldering technology. The main control device 10 in the SMT production line is connected to the conveying mechanism 30 and can adjust the transmission speed and / or track width of the conveying mechanism 30 based on a switching signal.

[0032] Optionally, the detection system also includes an imaging mechanism, which is communicatively connected to the main control device 10. The imaging mechanism is arranged inside the detection device 20 and aligned with the detection window. The imaging mechanism is used to determine imaging parameters based on the switching signal. The imaging parameters include at least one of trigger timing and moving path.

[0033] The trigger timing includes at least one of: a shooting timing of a camera, a projection timing of a projector, an exposure timing of a light source, and the like.

[0034] In some embodiments, the detection device 20 further includes a transport mechanism 30 , which is disposed inside the detection device 20 and configured to determine a transmission parameter based on the switching signal, wherein the transmission parameter includes at least one of a track width and a transmission speed.

[0035] The transport mechanism 30 is disposed within the housing of the testing device 20 and can be communicatively connected to the control unit of the testing device 20. The control unit is communicatively connected to the main control device 10. The control unit receives a switching signal from the main control device 10 and, based on the switching signal, switches the current board type to the testing board type, thereby using the testing board type to test the board to be tested. The transport mechanism 30 receives the switching signal from the control unit and adjusts the transmission parameters of the testing device 20 for the board to be tested so that the transmission parameters of the board to be tested match the detection of the board to be tested by the testing device 20, thereby improving the accuracy of the board detection. Alternatively, the control unit controls the transport mechanism 30 to adjust its transmission parameters based on the switching signal.

[0036] In some embodiments, the detection device 20 further includes an imaging mechanism disposed within the detection device for determining imaging parameters based on the switching signal. The imaging parameters include at least one of a trigger timing and a movement path. The trigger timing includes at least one of a camera capture timing, a projection timing, and a light source exposure timing.

[0037] The imaging mechanism is disposed in the housing of the detection device 20 and can be communicatively connected to the control unit of the detection device 20. The control unit is communicatively connected to the main control device 10. The control unit receives a switching signal from the main control device 10 and switches the current board type to the detection board type based on the switching signal, so as to use the detection board type to detect the board to be tested. The imaging mechanism receives a switching signal from the control unit and adjusts the imaging parameters of the detection device 20 on the board to be tested so that the imaging parameters of the board to be tested match the detection of the board to be tested by the detection device 20, thereby improving the accuracy of the board detection. Alternatively, the control unit controls the imaging mechanism to adjust its imaging parameters based on the switching signal.

[0038] Optionally, the main control device 10 interacts with the detection device 20 through a specified communication method, including: the main control device 10 obtains the data communication method of the circuit board, that is, the board production equipment, and sets the communication method to the target communication method, the data communication method includes network communication, data-centric distributed communication protocol (Data Distribution Service, DDS) communication, and serial port communication; the main control device 10 interacts with the detection device through the target communication method.

[0039] As a client, the main control device 10 can use a variety of communication methods (such as network communication, DDS communication, serial communication, etc.) to send an agreed data protocol, that is, a switching signal, wherein the data protocol includes a wealth of information fields, such as the communication method, the name of the board to be tested, the identification code of the board to be tested, the detection parameters corresponding to the board to be tested, etc. This information can accurately meet the testing requirements of different boards. Each detection device 20 acts as a server, receiving and parsing the switching signal sent by the main control device 10. By reading the required board information, etc., the detection device 20 can automatically switch the board type and adjust the transmission parameters of the conveying mechanism 30 and the imaging parameters of the imaging mechanism accordingly. This process does not require any customer perception or operation at all, can achieve interference-free board switching, can improve the production efficiency and quality stability of the production line, and bring customers a better product experience. Furthermore, this embodiment uses multiple communication methods and protocols, can adapt to various types of production lines, and has good robustness; and identifies the communication method used on the circuit board production line, and switches the communication method between the main control device 10 and the detection device 20 to the same communication method, which can improve the reliability and real-time performance of data transmission.

[0040] Optionally, the above-mentioned production equipment includes solder paste printers, placement machines, coating machines, reflow machines and other equipment.

[0041] Optionally, before the master control device 10 sends a switching signal to change the detection board type based on the switching instruction, the master control device 10 further includes: extracting the encrypted information of the detection board type, parsing verification information in the encrypted information, and confirming the detection board type to be switched based on the verification information. This embodiment can improve the accuracy and precision of board type switching by encrypting and decrypting the detection board type and verifying the information.

[0042] Optionally, the main control device 10 and the detection device 20 can transmit signals through the TCP protocol; wherein the switching signal includes a switching instruction and at least one of the communication mode, the name of the board to be tested, the identification code of the board to be tested, and the detection parameters corresponding to the board to be tested. The detection device 20 switches the current board type to a detection board type corresponding to at least one of the communication mode, the name of the board to be tested, the identification code of the board to be tested, and the detection parameters corresponding to the board to be tested based on the switching instruction.

[0043] Among them, the Transmission Control Protocol (TCP) is a connection-oriented, reliable, byte-stream-based transport layer communication protocol. TCP can support the layered protocol hierarchy of multiple network applications. The communication connection between the main control device 10 and the detection device 20 relies on the TCP protocol to provide reliable communication services. The TCP protocol can operate on various communication systems from hard-wired connections to packet-switched networks or circuit-switched networks. The main control device 10 sends a switching signal to the detection device 20, and the detection device 20 parses the switching instruction and the above information in the switching signal.

[0044] Furthermore, the main control device 10 can also be connected to the transport mechanism 30 through the TCP protocol, and the main control device 10 sends a switching signal to the transport mechanism 30.

[0045] Alternatively, as Figure 2 As shown, Figure 2 The figure is a flow chart of an embodiment of the circuit board inspection system of the present application. Inspection equipment 20 includes a solder paste tester 21, which is equipped with multiple inspection plates. Upon receiving a switching signal, solder paste tester 21 switches the current plate type to the inspection plate type corresponding to the board under test, thereby switching the solder print inspection algorithm. The switched solder print inspection algorithm is then used to perform a solder print quality inspection on the board under test.

[0046] The solder paste detector 21 pre-stores multiple different detection plate types for detecting multiple different boards and cards; different detection plate types have different solder printing detection algorithms (models); the solder paste detector 21 receives a switching signal to switch the current plate type to the detection plate type corresponding to the board and card to be tested, specifically, to switch the current detection algorithm to the solder printing detection algorithm corresponding to the detection plate type of the board and card to be tested.

[0047] A solder paste printer can be used to print solder on the product, applying solder paste to the pads of the board under test. The solder paste printing quality of the board under test can then be inspected using a solder paste tester 21. The tester 21 performs a quality check on the board under test after solder printing, using a test pattern corresponding to the board under test. The tester 21 can automatically inspect the quality of the solder paste printing, checking whether the solder paste is printed smoothly and evenly, and whether the printed solder paste has shifted, thereby reducing the defective soldering rate.

[0048] Alternatively, as Figure 2 As shown, the detection equipment 20 includes an automatic optical detector 22, which is provided with a plurality of automatic optical detection plates. The automatic optical detector 22 receives a switching signal to switch the current plate type to a detection plate type corresponding to the board to be tested, so as to switch the misassembly and defect detection algorithm, and use the switched misassembly and defect detection algorithm to detect misassembly and welding defects in the board to be tested.

[0049] The automatic optical inspection instrument 22 pre-stores multiple different inspection plate types for inspecting multiple different boards and cards; different inspection plate types have different misassembly and defect detection algorithms (models); the automatic optical inspection instrument 22 receives a switching signal and switches the current plate type to the inspection plate type corresponding to the board and card to be tested, specifically, switches the current detection algorithm to the misassembly and defect detection algorithm corresponding to the inspection plate type of the board and card to be tested.

[0050] The AOI 22 is capable of detecting quality issues during assembly and welding, including common welding quality issues such as bridging, tombstone formation, excess soldering, and empty solder joints. The AOI 22 includes lighting, a machine vision camera (industrial camera), and image processing software. The AOI 22 utilizes a stable, highly illuminated light source. By selecting an appropriate light source, different types of defects can be more easily projected for automated optical inspection. The machine vision camera includes an image capture system that captures images of the board under inspection and feeds these images back to a processing program within the AOI 22 for analysis. The imaging resolution of the AOI 22 determines the amount of detail that can be identified and captured on the board under inspection, and this imaging resolution impacts both inspection accuracy and speed. The image processing software enables the AOI 22 to check the pass rate of the board under inspection. The image processing software incorporates product information about the board under inspection. Using a comparison method, a good board under inspection is first used as a reference target for the AOI 22. When the good board under inspection is scanned, the AOI 22 analyzes the board under inspection and stores the first product information. When inspecting the product to be inspected, the automatic optical inspection device 22 checks and records the details of the product to be inspected that are different from the first product information. By comparing the information to be inspected with the first product information, defective products can be identified.

[0051] Alternatively, as Figure 2 As shown, the detection plate type is provided with a patch detection algorithm (model), a reflow soldering detection algorithm (model) and a coating detection algorithm (model), and the detection equipment includes three automatic optical detectors 22; wherein, each automatic optical detector 22 is provided with multiple detection plate types, one automatic optical detector 22 switches the detection plate type based on a switching signal to switch the patch detection algorithm, so as to use the patch detection algorithm to detect the patch results of the test board; another automatic optical detector 22 switches the detection plate type based on a switching signal to switch the reflow soldering detection algorithm, so as to use the reflow soldering detection algorithm to detect the reflow soldering results of the test board; another automatic optical detector 22 switches the detection plate type based on a switching signal to switch the coating detection algorithm, so as to use the coating algorithm to detect the coating results of the test board.

[0052] Multiple AOIs 22 store multiple test patterns. When a board to be tested is transported to an AOI 22, the AOI 22 uses the corresponding patch detection algorithm, reflow detection algorithm, and coating detection algorithm to test the board, automatically switching between detection patterns. Based on the completed patch, reflow, and coating results, the AOI 22 can detect defects in the patch, reflow, and coating of the board to be tested.

[0053] Optionally, the detection system includes multiple detection devices 20, and the multiple detection devices 20 receive a switching signal and synchronously switch their respective detection modes. In this way, the efficiency and accuracy of mode switching can be improved.

[0054] In one application scenario, multiple inspection devices 20 of different types are located on the same production line. Upon receiving a switching signal, each of the inspection devices 20 synchronously switches between different inspection formats to inspect different process results of the boards under test. This allows for synchronous switching of inspection formats among the inspection devices 20 on the same production line, improving inspection efficiency and format switching accuracy for the boards under test.

[0055] For example, the multiple inspection devices 20 may include multiple automatic optical inspection (AOIs) 22 and solder paste inspection (STIs) 21. AOIs 22 may be added before and after the conveyor mechanism 30 to inspect the boards under test. When the same production line needs to switch the inspection board type of the boards under test, the master control device 10 simply sends a switching signal to the multiple inspection devices 20 on the production line to synchronize the inspection boards. This prevents the use of the wrong inspection board type and improves board type switching efficiency.

[0056] In another application scenario, multiple testing devices 20 are of the same type and located on different production lines. Upon receiving a switching signal, the multiple testing devices 20 synchronously switch their respective test board types to test the boards under test on the different production lines. This allows for synchronous switching of the test board types of the same type of testing devices 20 on different production lines, improving both the efficiency of testing the boards under test and the accuracy of the board type switching.

[0057] For example, multiple detection devices 20 may include multiple solder paste detectors 21 located on different production lines. When the solder paste detectors 21 on these production lines need to switch the detection board type of the board to be tested, the main control device 10 only needs to send a switching signal to the multiple solder paste detectors 21 on these production lines to achieve the synchronous switching of the detection boards by the multiple solder paste detectors 21, which can improve the board type switching efficiency and switching accuracy.

[0058] In other application scenarios, a large number of boards of the same type are tested on multiple production lines. The above method can be used to achieve synchronous switching of the boards by all the testing devices 20 on the multiple production lines of the boards of the same type.

[0059] Optionally, the switching signal is transmitted in a Json data format.

[0060] Among them, JavaScript Object Notation (JSON) is a lightweight data exchange format. The JSON data format uses a text format that is completely independent of the programming language to store and represent data. The JSON data format has a concise and clear hierarchical structure, making it easy to read and write, as well as easy for machines to parse and generate. It enables better data exchange and can effectively improve transmission efficiency. Therefore, transmitting switching signals in the JSON data format can improve transmission efficiency.

[0061] In one embodiment, the detection system further includes an abnormality monitoring device that is communicatively connected to the master control device 10. When the master control device 10 sends a switching signal to the detection device 20, it sends a monitoring activation signal to the abnormality monitoring device. The abnormality monitoring device monitors the detection device 20 based on the monitoring activation signal and, upon determining that the detection device 20 has not responded within a preset monitoring time, generates information indicating an abnormality in the detection device 20. This embodiment utilizes the abnormality monitoring device to monitor abnormalities in the detection device 20, enabling timely monitoring and handling of abnormal operating conditions of the detection device 20, thereby improving the reliability of the detection system.

[0062] For example, the abnormality monitoring device may include a processing unit and a communication unit connected to the processing unit, an information acquisition unit (e.g., an image acquisition unit), and an information output unit. The processing unit generates a control signal to the information acquisition unit based on the monitoring start signal obtained by the communication unit from the main control device 10, controls the information acquisition unit to obtain monitoring information from the detection device 20, processes the monitoring information to determine whether the detection device 20 is abnormal, and generates abnormality information if it is determined that the detection device 20 is abnormal, and outputs the abnormality information through the signal output unit. The information output unit may include a buzzer, a display, a voice player, etc.

[0063] Alternatively, the information output unit may not be set up, and the abnormal information can be transmitted back to the main control device 10 through the communication unit, so that the abnormal signal can be output through the main control device 10; or the abnormal monitoring device only has an information collection function. After the main control device 10 sends a switching signal to the detection device 20, it sends a monitoring start signal to the abnormal monitoring device, directly controls the abnormal monitoring device to obtain monitoring information, and processes the monitoring information to determine whether the detection device 20 is abnormal. If it is determined that the detection device 20 is abnormal, abnormal information is generated.

[0064] In another embodiment, the master device 10 and the detection device 20 can implement an information exchange mechanism to enable the master device 10 to monitor the detection device 20 for abnormalities. For example, under normal operating conditions, the detection device 20 will return a feedback signal to the master device 10 within a preset time period after receiving the switching signal. If the master device 10 does not receive the feedback signal within the preset time period (without considering data transmission delay), it determines that the detection device 20 is abnormal and generates and outputs an abnormality signal.

[0065] This application further proposes a circuit board production system, such as Figure 3 As shown, Figure 3 FIG1 is a schematic structural diagram of an embodiment of a circuit board production system of the present application. The circuit board production system in this embodiment includes the above-mentioned detection system.

[0066] Among them, the production system uses the detection system to detect the boards to be tested. The detection system can automatically switch to the detection board type that matches the circuit board to be tested, which can improve the efficiency and accuracy of board detection.

[0067] Alternatively, as Figure 3 As shown, the production system also includes production equipment, including a printing mechanism, a patch mechanism, a reflow mechanism, and a coating mechanism. The printing mechanism is used to print solder paste on the boards to be tested; the patch mechanism is used to place solder paste on the boards to be tested after printing; the reflow mechanism is used to solder the boards to be tested after placement; and the coating mechanism is used to coat the boards to be tested after soldering.

[0068] The placement mechanism is responsible for placing components onto the designated pads of the board. These include high-speed placement machines and multi-function placement machines. High-speed placement machines place small components onto the pads, while multi-function placement machines place large components and special-shaped parts onto the pads. The reflow mechanism melts the solder paste printed on the board's pads, allowing the electronic materials to tin and secure to the pads. The coating mechanism can coat the product with adhesive to secure components to the board. The coating quality affects process efficiency, quality, and component reliability. Automated optical inspection devices connected to the placement mechanism, reflow mechanism, and coating mechanism are used to inspect the boards under test located on the placement mechanism, reflow mechanism, and coating mechanism to determine if the boards are qualified. Figure 3The middle dotted line indicates the flow direction of the boards to be tested. After the printing mechanism prints solder paste on the boards to be tested, the boards are transported to the mounting mechanism through the conveying mechanism 30 after being inspected by the solder paste detector 21. The mounting mechanism mounts the boards to be tested after the solder paste is printed, and then they are transported to the reflow soldering mechanism after being inspected by an automatic optical detector 22 through the conveying mechanism 30. The reflow soldering mechanism solders the boards to be tested after the soldering, and then they are transported to the coating mechanism after being inspected by another automatic optical detector 22. The coating mechanism coats the soldered boards to be tested, and then they are inspected by another automatic optical detector 22 to complete the inspection of the boards to be tested, thereby improving the accuracy of the inspection of the boards to be tested.

[0069] The above description is merely an embodiment of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A circuit board detection system, characterized in that: include: A main control device and at least one detection device in communication with the main control device, wherein the detection device is used to detect multiple detection items of multiple boards, and different boards correspond to different detection board types, wherein: The main control device is used to exchange data with the detection device through a specified communication method, and is also used to parse the switching instruction when receiving the board switching instruction, and send a switching signal for changing the detection board type based on the switching instruction, wherein the switching signal includes at least one of the communication method, the name of the board to be tested, the identification code of the board to be tested, and the detection parameters corresponding to the board to be tested; The detection equipment is used to receive the switching signal and switch the current board type to the detection board type based on the switching signal, so as to use the detection board type to detect the board to be tested. The detection equipment includes at least one of a solder paste detector, an automatic optical detector, a coating detector, a semiconductor detector, and a substrate detector.

2. The detection system according to claim 1, characterized in that The data interaction with the detection device through a specified communication method includes: Obtaining a data communication mode of a circuit board production device, and setting the data communication mode as a target communication mode, wherein the data communication mode includes any one of network communication, DDS communication, and serial communication; Data is exchanged with the detection device via the target communication method.

3. The detection system according to claim 2, characterized in that The detection device also includes: a transport mechanism, the transport mechanism being disposed inside the detection device and configured to determine a transport parameter based on the switching signal, the transport parameter comprising at least one of a track width and a transport speed; An imaging mechanism is provided inside the detection device and is used to determine imaging parameters based on the switching signal, wherein the imaging parameters include at least one of a triggering timing and a moving path.

4. The detection system according to claim 1, characterized in that The detection equipment includes the solder paste detector, which is provided with a plurality of the detection plate types. The solder paste detector receives the switching signal and switches the current plate type to the detection plate type corresponding to the board to be tested, so as to switch the solder printing detection algorithm, and uses the switched solder printing detection algorithm to perform solder printing quality inspection on the board to be tested.

5. The detection system according to claim 1, characterized in that The detection equipment includes the automatic optical detector, which is provided with a plurality of the detection plate types. The automatic optical detector receives the switching signal and switches the current plate type to the detection plate type corresponding to the board to be tested, so as to switch the misassembly and defect detection algorithm, and uses the switched misassembly and defect detection algorithm to detect misassembly and welding defects in the board to be tested.

6. The detection system according to claim 1, characterized in that There are multiple detection devices, and the multiple detection devices receive the switching signal and synchronously switch their respective detection board types.

7. The detection system according to claim 6, characterized in that The multiple detection devices are different types of detection devices located on the same production line. The multiple detection devices receive the switching signal and synchronously switch their respective detection modes to respectively detect different process results of the boards to be tested. and / or The plurality of detection devices are of the same type and located on different production lines; Upon receiving the switching signal, the plurality of detection devices synchronously switch their respective detection modes to respectively detect the boards to be tested on different production lines.

8. The detection system according to claim 1, characterized in that The switching signal is transmitted in Json data format.

9. The detection system according to claim 1, characterized in that: Before sending a switching signal for replacing the detection board type based on the switching instruction, the method further includes: Extract the encryption information of the detection board type, parse the verification information in the encryption information, and confirm the detection board type to be switched according to the verification information.

10. The detection system according to any one of claims 1 to 9, characterized in that: The detection system also includes: An abnormality monitoring device is communicatively connected to the main control device. When the main control device sends the switching signal to the detection device, it sends a monitoring start signal to the abnormality monitoring device. The abnormality monitoring device monitors the detection device based on the monitoring start signal, and when it is determined that the detection device has no response within a preset monitoring time, it generates information indicating that the detection device is abnormal.

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