Dynamic stress-based building block assembly instruction generation method and related device

Abstract

A building block assembly instruction generation method based on dynamic stress and related equipment. In the method, data is extracted based on the image of the building block component, the dynamic stress characteristics are calculated and partitioned, the stress transmission relationship is identified, the key nodes are determined, the assembly step sequence is decomposed accordingly, and finally the assembly instruction considering dynamic stress is generated. By extracting the geometric and connection information of the building block component, and further calculating and analyzing its dynamic stress characteristics and transmission relationship, the key stress nodes which are crucial to the structural stability are identified. Based on these key nodes, the assembly process is divided into step sequences considering stress balance, thereby generating an assembly instruction containing stress analysis, improving the stability of the components in the building block assembly process, providing professional assembly guidance containing dynamic stress information for users, and effectively improving the efficiency and success rate of building block assembly.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of digital cultural creativity, and in particular to a building block assembly instruction generation method based on dynamic stress and related equipment. BACKGROUND

[0002] Building block assembly can help users complete the construction of complex structures composed of multiple components in different scenarios, and is widely used in architectural models, complex mechanical devices and digital cultural creativity fields. In the process of building block assembly, not only the requirements of aesthetics and accuracy need to be met, but also the stress relationship between components needs to be considered to ensure the stability and safety of the overall structure.

[0003] In related technologies, the planning of building block assembly sequence is mainly realized by a regularized method based on component geometric information. The geometric parameters and connection point positions of components in the building block model are used to classify, number and sort the components through software tools, and the assembly sequence is deduced based on the connection relationship between the components. The assembly steps of the building block model are displayed through a static graphic instruction, and the user can complete the assembly according to the preset sequence based on the instruction.

[0004] However, since the generation method of building block assembly instruction in the prior art is mainly based on the regularized sorting of the geometric parameters and connection relationship of the components, although the basic assembly sequence can be deduced, the changes in the stress state of the building block components in the dynamic assembly process and their influence on the assembly sequence cannot be reflected, resulting in a lack of reliability of the instruction in guiding the user to assemble, especially when building complex models. The changes in dynamic stress often lead to unstable phenomena in the local structure during the assembly process, thereby increasing the risk of assembly failure. SUMMARY

[0005] The present application provides a building block assembly instruction generation method based on dynamic stress and related equipment, which solves the problem that the instruction cannot reflect the changes in dynamic stress, leading to unstable local structure of the assembled model, and improves the stability in the process of building block assembly, providing more reliable assembly guidance for users.

[0006] In a first aspect, the application provides a building block assembly instruction generation method based on dynamic stress, comprising: based on image data of a building block component to be assembled, extracting building block component data, the building block component data including geometric parameters and connection position information; based on the building block component data, calculating stress characteristic data of the building block component, the stress characteristic data including stress direction, stress magnitude and stress point position; according to the stress characteristic data, partition coding the building block component to obtain building block component partition data, the building block component partition data including regional coding, partition stress characteristic data and partition connection relationship data of the building block component; based on the building block component partition data, determining the stress transmission relationship between adjacent components, the stress transmission relationship including the direction and trend of pressure transmission; based on the stress transmission relationship, identifying key stress nodes to obtain key node position data; according to the key node position data, decomposing the assembly process into multiple assembly steps to obtain step sequence data; and based on the step sequence data, generating an assembly instruction for the building block component.

[0007] By using the above technical solution, the geometric and connection information of the building block component is extracted, and the dynamic stress characteristics and transmission relationship are further calculated and analyzed, and the key stress nodes important to the structural stability are identified. Based on these key nodes, the assembly process is decomposed into step sequences considering stress balance, thereby generating an assembly instruction containing dynamic stress analysis, improving the stability of the components in the building block assembly process, providing professional assembly guidance containing dynamic stress information for users, and effectively improving the efficiency and success rate of building block assembly.

[0008] In some embodiments in combination with the first aspect, according to the stress characteristic data, the building block component is partition coded to obtain building block component partition data, specifically including: based on the stress characteristic data, the building block component is stress level divided to obtain stress level, the stress level including stress values and distribution ranges of high stress level, medium stress level and low stress level; according to the stress level, the geometric parameters of the building block component are combined to determine the demarcation point of each stress level to obtain demarcation data, the demarcation data including demarcation point coordinate sequence and demarcation curve equation; based on the demarcation data and the stress characteristic data, the gravity center position and stress characteristics of each partition are calculated to obtain partition stress characteristic data, the partition stress characteristic data including partition gravity center position, stress direction and stress magnitude; according to the partition stress characteristic data and the stress level, regional coding and partition connection relationship are generated to obtain building block component partition data.

[0009] By adopting the technical solution, the stress levels of the building block components are divided and the boundaries are determined based on stress characteristics, and the components are subdivided into regions with different stress characteristics. The center of gravity and stress characteristics of each partition are calculated, providing detailed local stress information, laying a foundation for subsequent determination of partition connection relationships and overall stress transmission, making the understanding of the internal stress distribution of the components more in-depth and accurate.

[0010] In combination with some embodiments of the first aspect, in some embodiments, according to the partition stress characteristic data and the stress level, the region code and the partition connection relationship are generated to obtain the building block component partition data, specifically including: determining the stress transmission direction of each partition based on the partition stress characteristic data and the stress level; generating the region code of the partition according to the stress transmission direction of each partition and the partition center of gravity position, the region code including the position and stress characteristics of the partition in the overall component; based on the region code, calculating the connection relationship between adjacent partitions to obtain the partition connection relationship, the partition connection relationship including the connection point position, connection direction and connection stress characteristics between adjacent partitions; according to the region code and the partition connection relationship, generating the building block component partition data.

[0011] By adopting the technical solution, the stress transmission direction of each partition is first determined, and the region code containing the position and stress characteristics is generated, obtaining the digital information of the internal structure and stress distribution of the building block component. The connection relationship between adjacent partitions and their stress characteristics are calculated, which clarifies how the force is transmitted inside the component and between components, providing an accurate data basis for subsequent identification of key stress nodes and analysis of the stress balance of the overall structure.

[0012] In combination with some embodiments of the first aspect, in some embodiments, according to the key node position data, the assembly process is divided into multiple assembly steps to obtain step sequence data, specifically including: determining the stress balance state of each key node based on the key node position data and the partition stress characteristic data; according to the stress balance state of each key node and the stress transmission relationship, identifying the supporting components that need to be built first in the assembly process to obtain the assembly steps of the supporting components; based on the assembly steps of the supporting components and the stress transmission relationship, the assembly sequence of subsequent components is determined in turn to obtain the step sequence data.

[0013] By adopting the technical solution, the stress balance state of each key node is first determined based on the key node position and the partition stress characteristic, and the key support points that play a decisive role in the stability of the overall structure are identified. Then the assembly steps of these supporting components are determined and arranged in priority, ensuring the stability of the structure foundation and effectively avoiding early structural instability caused by insufficient support, providing reliable support for the stable construction of subsequent components.

[0014] In some embodiments in combination with the first aspect, based on the assembly steps of the support component and the force transmission relationship, the assembly sequence of subsequent components is determined in sequence to obtain step sequence data, specifically comprising: based on the assembly steps of the support component and the force transmission relationship, the assembly sequence of subsequent components is determined in sequence to obtain initial assembly steps; according to the initial assembly steps, the force change of the newly added building block component in each assembly process is simulated and calculated to obtain the overall force balance in the assembly process; according to the overall force balance, it is judged whether the initial assembly steps need to be adjusted; if yes, based on the simulation calculation result of the force change of the newly added building block component, the initial assembly steps are adjusted to obtain step sequence data; if no, the initial assembly steps are determined as step sequence data.

[0015] By adopting the above technical solution, after determining the initial assembly sequence based on the support component and the force transmission relationship, the overall force change caused by each newly added component is simulated and calculated. This dynamic balance checking mechanism can timely find potential unstable links and decide whether the steps need to be adjusted according to the simulation result, thereby ensuring that the generated assembly sequence can maintain the overall stability and safety of the structure in the entire building process.

[0016] In some embodiments in combination with the first aspect, based on the simulation calculation result of the force change of the newly added building block component, the initial assembly steps are adjusted to obtain step sequence data, specifically comprising: obtaining the simulation of the force change of the newly added building block component; according to the simulation of the force change, the main building block component causing the overall force imbalance is determined; according to the force characteristics of the main building block component, the main assembly path causing the force imbalance is determined in combination with the key node position data, the assembly path including the specific direction and range of force transmission; based on the main assembly path, the force adjustment parameter of the force imbalance region is calculated, the force adjustment parameter including the adjustment of component sequence and optimization of assembly sequence of support component; based on the force adjustment parameter, the initial assembly steps are adjusted to obtain the adjusted step sequence data.

[0017] By adopting the above technical solution, when the force imbalance is found through simulation, the electronic device obtains detailed force change information and identifies the key components and assembly paths causing the problem. Based on this, specific adjustment parameters including adjustment of component sequence or assembly sequence of support component are calculated, so that the adjustment of the initial assembly steps has a clear basis and direction, and the unstable problems found in simulation can be accurately solved, and the assembly sequence is optimized.

[0018] In some embodiments of the first aspect, based on the step sequence data, the assembly instruction of the building block component is generated, specifically comprising: generating corresponding visual guidance data for each assembly step according to the step sequence data, the visual guidance data including force arrow indication and auxiliary line marking; generating text instruction data according to the visual guidance data, the text instruction data including building block component number, installation sequence and force change instruction of key nodes of each assembly step; and generating the assembly instruction of the building block component based on the visual guidance data and the text instruction data.

[0019] By adopting the above technical solutions, based on the optimized step sequence, the visual guidance data including force arrow indication and auxiliary line marking is generated, which intuitively shows the key force direction and support point. Combined with the text instruction, the component information and installation sequence of each step are clearly described, and the force change of key nodes is particularly emphasized, so that the user can more deeply understand the mechanical principle in the assembly process, and the success rate of assembly and the stability of the structure are improved.

[0020] In a second aspect, the present application provides an electronic device, comprising: one or more processors and a memory; the memory is coupled to the one or more processors, and the memory is used to store computer program code, the computer program code comprising computer instructions, and the one or more processors invoke the computer instructions to enable the electronic device to perform the method described in the first aspect and any possible implementation manner of the first aspect.

[0021] In a third aspect, the present application provides a computer readable storage medium, comprising instructions, when the instructions run on an electronic device, enable the electronic device to perform the method described in the first aspect and any possible implementation manner of the first aspect.

[0022] In a fourth aspect, the present application provides a computer program product, when the computer program product runs on an electronic device, enables the electronic device to perform the method described in the first aspect and any possible implementation manner of the first aspect.

[0023] The one or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0024] 1. By employing the calculation and analysis of the dynamic force characteristics and transmission relationships of building block components, and based on this identification of key force nodes, the assembly process is decomposed into a sequence of steps considering force balance. Through force analysis of building block components, the dynamic force state of each component during the assembly process and the force transmission path between them are clarified. The nodes and components that play a key role in the overall stability of the structure are identified, and the optimal assembly sequence is planned based on this, ensuring that key supporting components are built first. This avoids structural collapse or deformation caused by uneven local force or insufficient support during the assembly process, thereby achieving the technical effect of improving the stability of components during the building block assembly process.

[0025] 2. By employing a technique that simulates and calculates the overall stress changes caused by each newly added component after determining the initial assembly sequence, and dynamically adjusts the assembly steps based on the simulation results, potential instabilities can be identified promptly after the initial planning of the assembly steps by simulating the impact of each newly added component on the overall structural stress balance. When the simulation results indicate that the structure may become unstable, the system can automatically adjust the subsequent assembly sequence according to the stress changes to ensure that the structure maintains stress balance and stability throughout the entire assembly process. This achieves the technical effect of ensuring that the generated assembly sequence maintains the overall stability and safety of the structure throughout the entire assembly process.

[0026] 3. By employing a technique that identifies key components and assembly paths causing stress imbalances during simulations and calculates specific stress adjustment parameters to modify assembly steps, the system can accurately pinpoint which component or force transmission path is causing the problem when simulations reveal that a particular assembly step leads to structural stress imbalance. Based on the analysis of the root cause, the system calculates optimal adjustment schemes. These schemes may include changing the installation sequence of components in unstable areas, adjusting their connection point positions, or optimizing the timing and method of constructing supporting components. By applying these precisely calculated adjustment parameters to modify the original assembly steps, instability factors can be eliminated in a targeted manner, resulting in a more stable and rational assembly sequence. This achieves the technical effect of accurately resolving instability problems discovered in simulations and optimizing the assembly sequence. Attached Figure Description

[0027] Figure 1 This is a flowchart illustrating the method for generating a block assembly instruction manual based on dynamic force in the embodiments of this application.

[0028] Figure 2 This is another flowchart illustrating the method for generating assembly instructions for building blocks based on dynamic force in the embodiments of this application;

[0029] Figure 3Fig. 1 is a schematic diagram of a hardware structure of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0030] The terminology used in the following embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. As used in the specification and the appended claims, the singular forms "a," "an" and "the" are intended to include both singular and plural forms, unless the context clearly indicates otherwise. It will be further understood that the terms "and / or," as used in the specification and in the claims, is used to mean "one or the other" or "both" unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0031] Hereinafter, the terms "first" and "second" are used only for the purpose of description and should not be understood as implying or suggesting relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first" and "second" can explicitly or implicitly include one or more of the features, and in the description of the embodiments of the present application, the meaning of "a plurality of" is two or more, unless otherwise stated.

[0032] The present application aims to solve the problem of insufficient stability of building block assembly caused by the collapse or deformation of local structures under dynamic stress, as the existing regularized sequencing method is only based on the geometric parameters and connection relationship of the components, and cannot consider dynamic stress changes.

[0033] To facilitate understanding, the building block assembly instruction generation method based on dynamic stress provided by the embodiments of the present application is described as follows: geometric parameters and connection position information of the building block components to be assembled are extracted, and stress characteristic data of the components are calculated, including stress direction, size and stress point position. According to the stress characteristic data, the components are partitioned and encoded, and building block component partition data containing regional encoding, partition stress characteristics and partition connection relationship are generated. Based on the partition data, the stress transmission relationship between adjacent components is further determined, and the key stress nodes and their position data are identified. According to the key nodes, the assembly process is reasonably decomposed into multiple steps and step sequence data is generated, and finally the assembly instruction containing the assembly sequence and dynamic stress analysis is output, realizing efficient guidance and dynamic stress optimization of the building block model assembly process.

[0034] Figure 1 Fig. 1 is a schematic diagram of a hardware structure of an electronic device according to an embodiment of the present application.

[0035] Please refer to Figure 1 The specific description of the building block assembly instruction generation method based on dynamic stress is as follows:

[0036] 101、based on the image data of the to-be-assembled building block component, extracting building block component data, the building block component data including geometric parameters and connection position information.

[0037] Firstly, the input image data of the to-be-assembled building block component is processed by using image recognition technology. After obtaining the image of the building block component, the electronic device will use an edge detection algorithm, such as the Canny edge detection algorithm, to outline the contour of the building block component by analyzing the gray scale changes in the image.

[0038] Then, by using three-dimensional reconstruction technology, a three-dimensional model of the building block component is constructed based on multi-view image information. Based on the three-dimensional model, the geometric parameters of the building block component, such as length, width, height, angle, etc., are obtained by measurement and calculation.

[0039] Finally, the connection parts on the building block component are identified by using feature matching algorithm, so as to determine the connection position information. For example, for a cuboid building block, the electronic device can accurately obtain the specific values of its length, width, height, and the positions of the convex points or concave grooves for splicing through the above technical means.

[0040] 102、based on the building block component data, calculating the force characteristic data of the building block component, the force characteristic data including force direction, force size and force point position.

[0041] Based on the extracted building block component data, the force characteristic data is calculated. For the calculation of the force direction, size and force point position of the building block component, the electronic device will use the principles of mechanics analysis and finite element analysis method. Taking a triangular building block component as an example, when it is spliced with other building blocks to form a stable structure, the electronic device will first determine its force boundary conditions in the overall structure according to its geometric parameters and connection position information, and then divide the building block component into multiple small units, and through the finite element analysis software, the mechanical calculation of each unit is carried out to simulate the situation when different directions and sizes of force act on the building block component, so as to obtain the force direction, force size and force point position of the building block component. If it is a support building block that bears a large weight, the electronic device will calculate that it mainly bears vertical downward pressure, and the specific value of the pressure and the position of the force point where the pressure is concentrated.

[0042] 103、according to the force characteristic data, the building block component is divided into zones and encoded, obtaining building block component zoning data, the building block component zoning data including the area code of the building block component, the zoning force characteristic data and the zoning connection relationship data.

[0043] The electronic device partitions and encodes the building block component according to the stress characteristic data. The electronic device first divides the building block component into different stress regions according to the stress size and direction. For example, for a building block component that bears a large pressure, its pressure-bearing surface and non-pressure-bearing surface are divided into different regions. After dividing the regions, the electronic device generates a unique region code for each region, which contains the position information of the region in the building block component and the main stress characteristics. The electronic device then calculates the stress characteristic data of each partition, including the average stress direction, average stress size, and center of gravity position.

[0044] For the acquisition of partition connection relationship data, the electronic device analyzes the connection mode between different partitions, such as whether the adjacent partitions are connected by surface contact or by line contact, and the stress characteristics of the connection part, etc. For example, two partitions are connected by a protrusion and a groove, and the electronic device records the position, shape, and connection strength of the protrusion and the groove under stress, etc. Finally, complete building block component partition data is formed.

[0045] 104. Based on the building block component partition data, determine the stress transmission relationship between adjacent components, including the direction and trend of pressure transmission.

[0046] Based on the obtained building block component partition data, the relationship between adjacent components is analyzed in depth. The electronic device traverses the partition connection relationship data of each group of adjacent components, determines the pressure transmission direction according to the connection point position, connection direction, and connection stress characteristics of the partitions, and combines the stress characteristic data of each partition. For example, when two building block components are connected by surface contact, and a certain partition of one component bears a large pressure, the electronic device determines whether the pressure is transmitted along the direction perpendicular to the connection surface or at a certain angle. After determining the pressure transmission direction, the electronic device analyzes the change of stress size of different partitions to determine the change trend of pressure transmission. For example, if the initial partition of a building block component bears a stress of 10N, the stress changes to 8N as the pressure is transmitted to the adjacent partition, and changes to 6N as the pressure is transmitted to the next partition, the electronic device can determine that the pressure gradually decreases during transmission. The electronic device establishes a detailed stress transmission relationship model for each group of adjacent components, and records the direction and trend data of pressure transmission.

[0047] 105. Based on the stress transmission relationship, identify the key stress nodes and obtain key node position data.

[0048] The electronic device identifies key stress nodes based on the stress transmission relationship. The electronic device will sort out the stress transmission path of the entire building block component system, analyze which positions have more intense stress changes or which positions bear the main stress support role in different stress transmission processes. For example, in a built building block tower structure, the building blocks at the bottom bear the gravity of all the components above them, and the connection parts with adjacent components are key stress nodes. The electronic device will filter out the key stress nodes by comparing the stress size, stress direction change degree and importance in the entire stress transmission path. For some complex building block structures, there may be multiple key stress nodes, and the electronic device will accurately locate these nodes and record their three-dimensional coordinate information in the building block components to obtain key node position data. These key node position data will be an important basis for subsequent assembly step planning.

[0049] 106. Based on the key node position data, the assembly process is divided into multiple assembly steps to obtain step sequence data.

[0050] The electronic device divides the assembly process into multiple assembly steps according to the key node position data. The electronic device gives priority to building block components related to key stress nodes to ensure that these components that play a key role in the overall structural stability are assembled first. For example, when building a building block bridge, the bridge pier, as a component where the key stress node is located, will be listed as a priority assembly step.

[0051] The electronic device determines the assembly sequence of supporting components in combination with the stress balance state and stress transmission relationship of the key nodes. After determining the assembly steps of the supporting components, the electronic device will determine the assembly sequence of subsequent components based on the stress transmission relationship. In this process, the electronic device will simulate the stress situation of the overall structure after each assembly step to determine whether the newly added component will disrupt the existing stress balance. If there is an imbalance in stress, the electronic device will adjust the assembly sequence again until a reasonable step sequence data is obtained. For example, during the assembly process, if it is found that a component causes the key node to lose balance after installation, the electronic device will adjust the assembly sequence of that component backward or adjust the assembly sequence of the associated components to ensure the stability of the overall structure during the assembly process.

[0052] 107. Based on the step sequence data, generate an assembly instruction manual for the building block components.

[0053] Based on the obtained step sequence data, the assembly instruction manual for the building block components is generated. The electronic device first extracts the key information of each assembly step from the step sequence data, including the involved building block components, assembly sequence, and corresponding stress transmission relationship and key node position.

[0054] For each assembly step, the electronic device generates a text description of the pressure transmission path based on the force transmission relationship data. For example, when describing the installation step of a certain supporting component, it will be specified that "after the component is installed, it will bear the vertical pressure from the upper area and transmit it to the lower area in a certain direction", so that the user can clearly understand the direction and trend of force transmission. Combined with the key node position data, the electronic device highlights the state change of the key force node in each step in the text description. For example, in the step of installing the key support column, it will be stated that "after this step is completed, the force direction of node K changes from a single vertical direction to a composite direction containing horizontal component, and the force increases by X%", helping the user to understand the key control points of structural stability in the assembly process. The electronic device will also generate a concise installation guide for each building block component based on the region code and partition stress characteristic data. For example, "please connect the component with region code A3 to the groove of the component with region code B2 in the direction of the convex surface facing left, and ensure that the force point P is completely aligned to ensure effective pressure transmission".

[0055] When generating the overall structure of the assembly instruction manual, the electronic device arranges the text description of each step in order according to the sequence of the step sequence data, and adds transitional instructions between adjacent steps to ensure that the user can understand the dynamic change logic of the force in the entire assembly process. For example, when transitioning from the foundation structure to the installation of the upper structure, it will be prompted that "due to the increase in weight of the subsequent components, special attention should be paid to the installation accuracy of the support structure in step N to avoid instability caused by force concentration".

[0056] Finally, the electronic device integrates the text description of all steps into a complete document to form a building block component assembly instruction manual containing detailed stress analysis and installation guide, providing comprehensive and dynamic stress-based assembly guidance for users.

[0057] The building block assembly instruction manual generation method and related device based on dynamic stress in the embodiments of the present application extract geometric parameters and connection position information based on the image data of the building blocks to be assembled, calculate stress characteristic data and perform partition coding, determine the force transmission relationship, identify the key force nodes, and then decompose the assembly steps to obtain sequence data and generate the instruction manual, which realizes precise consideration of the dynamic stress change in the building block assembly process, not only solves the problem of local structure collapse or deformation caused by uneven stress in complex models, improves the stability of the components in the building block assembly process, but also provides professional assembly guidance containing dynamic stress information for users, effectively improving the efficiency and success rate of building block assembly.

[0058] Another method provided by the embodiments of the present application is described as follows: geometric and connection information is extracted from the building block component image, stress characteristic is calculated, and then grade division and partition coding are performed, stress transmission relationship is determined, and key nodes are identified. Then, stress balance state of the key nodes is determined according to the node and partition data, support components are identified, and initial assembly steps are planned, whether adjustment is needed is judged by simulating stress change, and finally assembly instruction is generated based on the adjusted step sequence.

[0059] Figure 2 Another flowchart of using the building block assembly instruction generation method based on dynamic stress in the embodiments of the present application is shown.

[0060] Please refer to Figure 2 , another method for generating building block assembly instruction based on dynamic stress is described as follows:

[0061] 201. Extract building block component data based on image data of the building block component to be assembled, wherein the building block component data includes geometric parameters and connection position information (this step has been described in 101, and will not be repeated here).

[0062] 202. Calculate stress characteristic data of the building block component based on the building block component data, wherein the stress characteristic data includes stress direction, stress size and stress point position (this step has been described in 102, and will not be repeated here).

[0063] 203. Perform stress grade division on the building block component based on the stress characteristic data to obtain stress grade, wherein the stress grade includes stress value and distribution range of high stress grade, medium stress grade and low stress grade.

[0064] The electronic device receives force-on-block member data, which details the force direction, force magnitude, and force point location for each point or region on the block member. Based on this detailed force magnitude information, the electronic device performs a global analysis of the entire block member to determine the stress level of different regions. Specifically, the electronic device sets a series of pre-defined stress thresholds, and divides regions with stress values below a lower threshold into low stress level regions, regions with stress values between the lower threshold and an upper threshold into medium stress level regions, and regions with stress values above the upper threshold into high stress level regions. These thresholds can be set and adjusted according to the material properties of the block member, the expected load capacity, and the complexity of the overall model. The electronic device determines the stress level of each point or region by comparing its force magnitude to the set thresholds by iterating through all force points or small regions on the block member. This process effectively classifies the force state of the block member in a coarse-grained manner. For example, for a block member that serves as a support for the main span of a bridge, the regions on the top that directly bear the weight of the bridge deck can exhibit high stress levels, while some regions on the sides or bottom can belong to medium or low stress levels.

[0065] The electronic device not only determines the stress level of each region, but also records the specific stress value range corresponding to each level and the specific distribution range of these levels on the member, i.e., which geometric regions belong to high stress areas, which belong to medium stress areas, and which belong to low stress areas. These force level and distribution range data enable the electronic device to grasp the force characteristics of the member as a whole.

[0066] 204、According to the stress level, in combination with the geometric parameters of the block member, determine the demarcation point of each stress level to obtain demarcation data, including demarcation point coordinate sequence and demarcation curve equation.

[0067] After determining the high, medium, and low stress levels on the building block component and their approximate distribution range, the electronic device will further utilize these stress level information and combine the geometric parameters of the building block component to determine the precise geometric boundaries between different stress level regions. This process is to map the abstract stress level concept to the specific component geometry. The electronic device will analyze adjacent different stress level regions, such as where the high stress region is adjacent to the medium stress region, or where the medium stress region is adjacent to the low stress region. The electronic device will track the boundaries of these regions and determine their specific positions in three-dimensional space according to the three-dimensional geometric model of the component. These positions can be represented as a series of consecutive points, i.e. a sequence of boundary point coordinates. For example, if the top center region of a cuboid building block is a high stress area and the edge region is a medium stress area, the boundary between the high stress area and the medium stress area may be a rectangular boundary around the center region, and the electronic device will calculate the three-dimensional coordinates of all the vertices of this rectangle to form a sequence of boundary point coordinates.

[0068] For some building block components with complex curved surfaces, the boundaries between stress levels may not be simple straight lines or polygons, but curves. In this case, the electronic device will use mathematical methods, such as curve fitting algorithms, to calculate the mathematical equation describing the boundary curve, i.e. the boundary curve equation, according to a series of boundary point coordinates. These boundary data, whether it is a sequence of boundary point coordinates or a boundary curve equation, accurately define the geometric boundaries of different stress level regions on the building block component. This allows the electronic device to divide the entire component into distinct regions with geometric boundaries according to its stress characteristics. This step is a key link to closely integrate the stress analysis results with the actual form of the component, and to visualize the stress characteristics of the component to its geometric structure.

[0069] 205、based on the boundary data and the stress characteristic data, calculate the center of gravity position and stress characteristics of each partition to obtain partition stress characteristic data, the partition stress characteristic data including partition center of gravity position, stress direction and stress size.

[0070] After obtaining the geometric boundary data of each stress level region, the electronic device can divide the entire building block component into multiple independent geometric partitions according to these boundaries. These partitions are determined based on the stress characteristics (stress levels) and geometric shapes of the component. The electronic device will further calculate the stress characteristics of each independent partition based on the geometric shape of the partition and the original, more detailed stress characteristic data of the building block component.

[0071] First, the electronic device calculates the geometric barycenter position of each partition. This can be achieved by geometric calculation methods such as integration or discrete point averaging, and the barycenter position represents the geometric center point of the partition in space. For example, for a rectangular partition, the barycenter is the intersection of the diagonals. For partitions of complex shapes, the electronic device will use corresponding algorithms to calculate the barycenter coordinates. Second, the electronic device calculates the force characteristics of each partition, including the representative force direction and force size of the partition. Since each partition may contain multiple force points or areas inside, and the force direction and size of these points may be slightly different, the electronic device will use comprehensive calculation methods to obtain the overall force characteristics of the partition. For example, the average or resultant force vector of all force vectors in the partition can be calculated, and its direction is taken as the representative force direction of the partition, and its size is taken as the representative force size of the partition. This representative force characteristic reflects the force and force trend that the partition as a whole bears. For example, a partition may contain multiple force points, most of which bear vertical downward pressure, and a small number of points bear horizontal force. The electronic device calculates the resultant force to obtain the main force direction of the partition, which is biased at a certain angle to the vertical downward direction, and calculates the size of the resultant force. The barycenter position, force direction and force size of each partition calculated by these calculations constitute the partition force characteristic data. These data enable the electronic device to understand the force distribution and force transmission of the component from the partition level.

[0072] 206、According to the partition force characteristic data and the force level, generate region encoding and partition connection relationship to obtain the building block component partition data.

[0073] The method specifically includes steps 2061 to 2064, which are not shown in the figure.

[0074] Step 2061, based on the partition force characteristic data and the force level, determine the force transmission direction of each partition.

[0075] After obtaining the stress characteristics data and stress level of each partition, the electronic equipment further analyzes and determines the force transmission direction of each partition. This force transmission direction refers to the main trend of force transmission within or outward from the partition. The electronic equipment comprehensively considers the force direction (i.e., the direction of the resultant force) and the stress level of the partition. For example, for a partition at a high stress level, the force transmission direction is often along its main force direction towards adjacent areas or connection points that can bear or disperse these forces. If a partition mainly bears vertical downward pressure and is an important support part of the structure, then its force transmission direction is likely to be vertically downward, transmitting the force to the components or partitions below it. The electronic equipment analyzes the stress distribution details within the partition to find the direction of the maximum stress gradient, which often indicates the main force transmission path. Combined with the stress level of the partition, for example, the force transmission direction in high-stress areas is usually more critical in the overall structure. The electronic equipment determines one or more main force transmission directions for each partition; these directions can be in vector form, precisely indicating the force flow trend. This process is key to understanding how forces "flow" within a component. Electronic devices use algorithms to analyze the force direction and magnitude distribution in the force characteristic data of each partition, and combine this with the force level to determine its role in the overall structure, thereby deriving the most likely direction of force transmission. For example, a partition with a large force will preferentially transmit force towards adjacent partitions that can provide support or connection.

[0076] Step 2062: Generate a region code for each partition based on the force transmission direction and the center of gravity position of each partition. The region code includes the position and force characteristics of the partition in the overall component.

[0077] The electronic device generates a region code for each partition based on the force transmission direction of the partition and the barycenter position of the partition. The region code aims to uniquely identify a partition and contains its key information. It not only encodes the spatial position information of the partition in the overall component (e.g., based on the barycenter coordinates or the grid cell it belongs to), but also incorporates the core force characteristic of the partition - the force transmission direction. For example, a region code can consist of a position identifier and a force direction identifier, such as "P_XYZ_Dir", where XYZ represents coordinate information related to the barycenter position, and Dir represents the force transmission direction (e.g., Down, Up, Left, Right, Forward, Backward, or a combined direction). Through this encoding method, the electronic device can quickly identify and locate a specific partition in the component and understand its main mechanical behavior. For example, a partition with the code "P_0.1, 0.2, 0.05_Down" indicates that it is located at a specific position in the component and mainly transmits forces downward. This encoding facilitates subsequent analysis of the interaction between partitions.

[0078] In step 2063, based on the region codes, the connection relationship between adjacent partitions is calculated to obtain a partition connection relationship, which includes the connection point position, connection direction, and connection force characteristics between adjacent partitions.

[0079] Based on the generated region codes, the electronic device calculates the connection relationship between adjacent partitions. The electronic device iterates through all partitions and, for each partition, finds other partitions that are geometrically adjacent to it. Geometric adjacency information is obtained from the original building block component geometry data. Once the adjacent partition pairs are determined, the electronic device analyzes the connection interface between them. This analysis includes determining the connection point position (i.e., the geometric area where the two partitions contact or connect), the connection direction (e.g., the normal direction of the connection interface, indicating the main direction of force transmission), and the connection force characteristics. The connection force characteristics describe how the connection interface transmits forces, such as whether it is a rigid or flexible connection, mainly withstands pressure, tension, or shear force, and its approximate load capacity. These information can be inferred or calculated based on the connection type (such as protrusions / slots, pin holes, etc.) and material properties of the original component. For example, two partitions that are in close contact through a flat surface may have connection force characteristics that mainly transmit vertical pressure and shear force; while a partition connected by a slender pin may also be able to withstand a certain bending moment in addition to pressure and shear force. The electronic device records the connection point position, connection direction, and connection force characteristics between each pair of adjacent partitions to form partition connection relationship data.

[0080] In step 2064, based on the region codes and the partition connection relationship, building block component partition data is generated.

[0081] The electronic device integrates the region encoding of each partition, the partition force feature data of the partition, and the partition connection relationship data between the partition and all adjacent partitions together to form the building block partition data of the building block. This building block partition data is a structured data set containing detailed information of all partitions inside the block, which comprehensively describes which areas the block is divided into, the force conditions of each area, the mutual connection mode between the areas, and how the force is transmitted through the connections. Through this step, the electronic device converts the building block from a simple geometric model to a structural unit containing rich mechanical information.

[0082] 207. Based on the building block partition data, determine the force transmission relationship between adjacent blocks, including the direction and variation trend of pressure transmission (this step has been described in 104, and will not be repeated here).

[0083] 208. Based on the force transmission relationship, identify the key force nodes to obtain key node position data (this step has been described in 105, and will not be repeated here).

[0084] 209. Based on the key node position data and the partition force feature data, determine the force balance state of each key node.

[0085] After identifying the key force nodes that are crucial to the stability of the building structure, the electronic device needs to evaluate whether the forces acting on these nodes are in a balanced state under the current structure state. This process is based on the key node position data and the building block partition force feature data. The key node position data provides the precise coordinates of these important nodes in three-dimensional space. The partition force feature data provides the center of gravity position, force direction, and force size of each building block partition. The electronic device will first locate the building block partitions directly associated with or adjacent to each key node. Then, it will extract the force feature data of these associated partitions, especially the forces acting on these partitions and possibly transmitted to the key nodes. For example, a key node may be located at the connection of two building blocks, and the electronic device will analyze the force conditions of the two or more partitions connected to the node. Through vector superposition or moment calculation, etc., the electronic device can calculate the resultant force and moment acting on the key node.

[0086] The determination of the force balance state is to judge whether the resultant force on the key node is close to zero and whether the moment of the resultant force is close to zero. In actual application, due to the influence of various factors, complete zero balance is difficult to achieve, so the electronic device will judge whether the resultant force or the moment of the resultant force is within the preset allowable error range. If the resultant force or the moment of the resultant force exceeds this range, it is considered that the key node is in an unbalanced state, which may mean that the structure region where the node is located has potential instability. For example, if a key support node bears too much vertical upward pulling force (which should bear pressure) or its lateral shear force exceeds the safe range, the electronic device will determine that the node is in an unbalanced state. By evaluating the force balance state of all key nodes, the electronic device can comprehensively understand the stability of the current building block structure, and aggregate the local force analysis results to the key points to evaluate the local stability of the overall structure.

[0087] 210、According to the force balance state of each key node and the force transmission relationship, identify the support component that needs to be built first in the assembly process, and obtain the assembly steps of the support component.

[0088] After determining the force balance state of each key node, the electronic device will use this information and the force transmission relationship between adjacent components to identify which building block components are "supporting" in the assembly process, that is, their stable construction is crucial to ensure the balance of key nodes and even the stability of the entire structure, and arrange the assembly steps of these components first.

[0089] Supporting components generally refer to those components that bear the main load, maintain the stability of key nodes, or constitute the foundation of the structure. The electronic device will focus on those key nodes that are currently in an unbalanced state, or those key nodes that are expected to bear high stress in the complete structure and have a decisive influence on the overall stability. Then, it will trace back the force transmission path related to these key nodes and identify the components that directly or indirectly support these nodes. The force transmission relationship data plays a key role here, which indicates how forces are transmitted between components, helping the electronic device to determine which components must be in place first to provide the necessary support or carrying capacity for subsequent components. For example, if a key node (such as the top of a bridge pier) bears a huge vertical pressure in the final structure and is currently in an unbalanced state, the electronic device will identify the building block components that make up the pier as supporting components, because their stable construction is a prerequisite for the pier to bear the load.

[0090] The electronic device determines the interdependence between these support components based on the force transmission relationship, for example, the components at the bottom of the bridge piers must be built before the components at the top. Based on this dependence and the need for stability of key nodes, the electronic device plans the specific assembly steps of these support components, including their installation sequence and position. These steps are marked as priority assembly steps, which form the basis of the entire assembly sequence, effectively avoiding structural problems caused by unstable foundation or insufficient support.

[0091] 211、Based on the assembly steps of the support components and the force transmission relationship, the assembly sequence of the subsequent components is determined in turn to obtain the initial assembly steps.

[0092] After determining and planning the assembly steps of the support components, the electronic device will gradually determine the assembly sequence of the remaining subsequent components based on these steps and in combination with the force transmission relationship, thereby obtaining a complete initial assembly step sequence.

[0093] This process is an iterative and expanding process. The electronic device first incorporates the assembly steps of the support components into the initial sequence. Then it analyzes the components involved in the currently planned steps, especially the force transmission relationship between these components and the components that have not been planned. The force transmission relationship clearly indicates how the force is transmitted from the built components to the unbuilt components, or how the unbuilt components will be stressed by the built components. The electronic device will prioritize those subsequent components that need to rely on the planned components for support, bearing or positioning. For example, if an unplanned component needs to be placed on a planned support component and bear the transmitted pressure, the unplanned component will be scheduled after the corresponding support component. The electronic device will gradually add the remaining components to the assembly sequence along the force transmission path and the connection dependence between the components. This process takes into account the flow of force to ensure that each new component added at each step can get the necessary support and will not negatively affect the structural stability of the built part. For example, when building a wall, the bottom bricks must be placed before the top bricks, because the bottom bricks need to bear the weight of the top and transmit it to the foundation. The electronic device will use the force transmission relationship to guide the ordering of subsequent components based on this layer-by-layer support and step-by-step principle. This process will continue until all the building blocks to be assembled are arranged in the assembly sequence, forming an initial assembly step sequence based on support components and force transmission relationship. This sequence is a reasonable assembly scheme initially derived by the electronic device based on mechanical principles.

[0094] 212、According to the initial assembly steps, the stress changes of the newly added building blocks in each assembly process are simulated to obtain the overall stress balance in the assembly process.

[0095] After generating the initial assembly step sequence, the electronic device simulates the entire assembly process according to this sequence to further verify the rationality and stability of this sequence. The core of this simulation is to evaluate how the stress state of the overall structure changes when a new building block component is added at each step, and to judge the overall stress balance of the current structure.

[0096] The electronic device simulates the addition process of components step by step according to the initial assembly step sequence. When simulating the addition of each new component, the electronic device updates the geometric model and connection relationship of the current structure, and includes the weight of the new component and the external load it may be subjected to (if considered) into the calculation model. Then, the electronic device uses mechanical analysis methods such as simplified structural mechanics model or finite element analysis method to recalculate the stress of each component and key node in the current built structure, including stress direction, size and distribution. This calculation considers the influence of the newly added component on the stress state of the original structure, such as increased weight, changed force transmission path, etc. By comparing the stress changes before and after adding the new component, the electronic device can understand the specific influence of the new component on the overall structure. For example, adding a new top layer building block may cause the pressure of the lower support column to increase, or the shear force at a certain connection to increase.

[0097] After calculating the stress changes at each step, the electronic device evaluates the overall stress balance of the entire built structure. This is achieved by checking the stress balance state of key nodes, or evaluating indicators such as overall stress distribution and deformation of the structure. If a step causes a key node to be severely unbalanced, or the structure to have excessive stress concentration or deformation, the electronic device determines that the current step causes the overall stress to be unbalanced. By simulating and balancing each step in the initial assembly sequence, detailed data on the overall stress balance of the structure during the entire assembly process is obtained.

[0098] 213、According to the overall stress balance, it is determined whether the initial assembly steps need to be adjusted.

[0099] After the electronic device obtains the overall stress balance data of the structure during the entire assembly process, it needs to make a key decision based on these overall stress balance data: whether the initial assembly step sequence needs to be adjusted. This judgment process is based on pre-set stability criteria. These criteria include but are not limited to whether the resultant force or moment of the key node exceeds the allowed threshold or whether the overall or local structure has excessive stress concentration.

[0100] The electronic device will go through the overall force balance data of each step simulated to check if there is any step whose balance index does not meet the preset stability criterion. For example, if the resultant force of a key support column connected to a certain component suddenly increases after the component is added and exceeds the safety threshold, or the stress value of a certain weak area is much higher than the yield strength of the material, the electronic device will determine that there is a problem with the current initial assembly step sequence and needs to be adjusted. If the overall force balance of all steps meets the preset stability criterion, i.e. the structure remains in a stable state throughout the assembly process, the electronic device will determine that the initial assembly steps do not need to be adjusted and will directly determine them as the final step sequence data. Otherwise, if any step is found to be unbalanced or unstable, the electronic device will determine that the initial assembly steps need to be adjusted. This judgment is automated, and the electronic device makes decisions based on quantitative simulation results and preset stability rules, avoiding the subjectivity and inaccuracy that may arise from manual judgment.

[0101] 214、If yes, the force change simulation of the new component is obtained.

[0102] When the electronic device determines that the initial assembly steps need to be adjusted, it will execute this step to obtain the specific details that cause the overall force imbalance, especially the force change of the newly added component during the simulation process. The electronic device will backtrack to the simulation results to accurately extract the assembly operation that caused the imbalance and the information of the newly added component in that operation. Then it will analyze in depth how the forces of the components and key nodes directly or indirectly related to the newly added component have changed before and after the addition of this component. This includes but is not limited to: the force borne by the newly added component; how the newly added component changes the original force transmission path, causing the force in other areas to increase or decrease; and how the newly added component affects the force direction and size of the key nodes, even possibly causing the key nodes to transition from a balanced state to an unbalanced state. The electronic device will obtain these force changes in the form of detailed data, such as how much the pressure at a certain connection point increases after the addition of the component, how much the bending moment of a certain support component changes, how much the resultant force direction of a certain key node deviates, etc. Through this step, the abstract "unbalance" is concretized into analyzable mechanical change data.

[0103] If the assembly sequence is significantly adjusted later, the overall force distribution of the building block model during the assembly process and the force state of each node may change. This means that the "criticality" of the "key force nodes" identified in step 208, the specific force conditions, and which nodes should be considered "critical" may differ from the adjusted structure state.

[0104] To address this situation, the stress state of the key node should also be confirmed based on the stress condition of the key node: evaluate whether the key stress node identified in the current unbalanced state is still the main stress concentration point or force transmission hub. By analyzing the stress condition of the key node under the current assembly state, the specific stress characteristics are determined. The stress condition of the key node is dynamic, and with the adjustment of the assembly sequence and the addition of new components, the stress transmission path of the overall structure may change.

[0105] Based on whether the stress state reaches the preset instability threshold, it is determined whether the stress state of the key node has changed significantly: the instability threshold is a pre-set threshold, when the stress state of the key node reaches or approaches the instability threshold, it means that the stress it bears has increased significantly, which may threaten the stability of the overall structure. If the evaluation result shows that the stress state of the key node has changed significantly (such as stress exceeding the original design safety range or stress direction deviating significantly), the "key" of the key node needs to be re-considered.

[0106] If the key node has changed significantly, a new key node is identified: due to the change of the assembly sequence and the influence of the current new components, a new connection point in the structure may appear, which has not been identified as "key" before but now bears higher stress or has important influence on the unbalanced state.

[0107] Based on the new key node, update the key information, including the position and stress characteristics of the new key node: record the results of this dynamic evaluation (including the adjustment of the importance of the original key node, the identification of the new key node and its position and stress characteristics) as the latest basis for guiding the subsequent steps 215 and 216 to locate the problem and analyze the path.

[0108] By introducing this dynamic evaluation step, it can be ensured that when adjusting the assembly strategy, the "key node" information relied on is the latest, which can better reflect the true situation of the structure under the current specific assembly stage and stress state, so that the subsequent adjustment decision is more accurate and effective.

[0109] 215, according to the stress change simulation condition, determine the main building block component causing the overall stress imbalance.

[0110] After obtaining the simulation of detailed force changes caused by the newly added building block component, the electronic device determines the main building block component that causes the overall force imbalance from these complex force change data. Although the newly added component is the direct cause of the imbalance, the problem may be caused by the characteristics of the newly added component itself (such as being too heavy or having an unreasonable shape), or by the insufficient support or weak connection of the existing component connected to it, or by the superposition of multiple factors. The electronic device will analyze the obtained force change data to identify those building block components that have the most dramatic force changes, the highest stress levels, or the greatest impact on the balance of key nodes after the addition of the component. For example, if the newly added component causes the stress of a support column to rise sharply and approach the failure limit, then both the support column and the newly added component can be the main problem components. If the newly added component causes a connection point to bear excessive shear force, then both the newly added component and the component where the connection point is located can be identified as the main building block components.

[0111] The electronic device will consider factors such as the magnitude of force changes, the degree of stress concentration, the impact on the balance of key nodes, and the importance of components in the overall structure to determine which components are the main factors causing the imbalance. Ultimately, the electronic device will output the identifier of one or more building block components that are determined to be the main building block components causing the overall force imbalance.

[0112] 216、According to the force characteristics of the main building block components, in combination with the key node position data, determine the main assembly path that causes the force imbalance, which includes the specific direction and range of force transmission.

[0113] After determining the main building block components that cause the overall force imbalance, the electronic device will further analyze and determine the specific force transmission path that causes the imbalance to occur, in combination with the force characteristics of these main components and the key node position data. This assembly path does not refer to the geometric connection sequence of the components, but rather to the path through which the imbalance force is generated, transmitted, and ultimately affects the key nodes in the structure.

[0114] The electronic device analyzes the force characteristics of the main building block and traces how these forces are transmitted to adjacent blocks through the connection relationship. The key node position data is very important here, because the key nodes are often important collection points or turning points on the force transmission path. The electronic device will start from the main building block, follow the force transmission relationship, trace the transmission direction and intensity change of the force until it affects the key node or the area that causes the overall instability of the structure. For example, if an overweight component located at the top of the structure is the main problem component, the electronic device will trace the path of the force generated by its weight transmitted step by step through the connection components and support components below it, eventually causing the overload of a certain key support node at the bottom. This path includes the specific direction of force transmission (for example, from top to bottom) and the range of force action (for example, which intermediate components and connection points are involved). By determining this main assembly path, the electronic device can clearly understand the propagation path of the unbalanced force in the structure, and accurately point out the key link where the problem occurs.

[0115] 217、Based on the main assembly path, calculate the force adjustment parameters of the force imbalance area, including adjusting the component sequence and optimizing the assembly sequence of the supporting component.

[0116] After determining the main assembly path that causes the force imbalance, the electronic device will simulate the situation based on this path and the related force changes, and calculate the force adjustment parameters for the force imbalance area. These parameters are specific modification suggestions proposed by the electronic device to eliminate or alleviate the imbalance, aiming to optimize the initial assembly step sequence. Adjustment parameters may include a combination of multiple strategies: first, adjust the component sequence. For example, if the main assembly path shows that the installation of a certain component too early causes insufficient support below it, the electronic device will suggest delaying the installation sequence of this component or advancing the installation sequence of the supporting component related to it. Second, optimize the assembly sequence of the supporting component. If the main assembly path reveals the weak link of the support system, the electronic device may re-evaluate and optimize the assembly sequence of the supporting component to ensure that the support structure is stable enough before the key load is applied. The electronic device will use optimization algorithms to calculate these adjustment parameters based on the force characteristics and imbalance degree on the main assembly path. For example, by simulating the effects of different adjustment schemes, the scheme that can maximize the reduction of unbalanced force or stress concentration can be selected. These force adjustment parameters are specific and operational instructions that directly guide how to modify the original assembly steps to solve the instability problems found in the simulation.

[0117] 218、Based on the force adjustment parameters, adjust the initial assembly steps to obtain adjusted step sequence data.

[0118] After calculating the force adjustment parameters for the force imbalance regions, the electronic device actually applies these adjustment parameters to the initial assembly step sequence, thereby obtaining an optimized and adjusted step sequence data.

[0119] This process is to convert the theoretically calculated adjustment scheme into specific assembly instructions. The electronic device modifies the initial assembly step sequence according to the component identifiers, adjustment types (such as changing the order), and specific adjustment values or instructions specified in the force adjustment parameters. For example, if the adjustment parameter indicates that the assembly order of component A is adjusted from step 5 to step 8, the electronic device will move the record of component A to the corresponding position in the step sequence data. If the adjustment parameter indicates optimizing the assembly order of supporting components, the electronic device will rearrange the steps of related supporting components according to the new order. When applying the adjustment parameters, the electronic device will ensure the logicality and feasibility of the adjustment, such as not arranging a component that needs to rely on other components for support before the supporting components.

[0120] After a series of adjustments, the electronic device obtains a completely new step sequence data. This adjusted step sequence fully considers the dynamic force changes of the building block components during the assembly process and optimizes the imbalance problems found in the simulation, aiming to ensure that assembling according to this new sequence can maximize the avoidance of structure collapse or deformation, and improve the stability and success rate of assembly.

[0121] 219、If not, determine the initial assembly step as the step sequence data.

[0122] In step 213, the electronic device determines whether the initial assembly step needs to be adjusted according to the overall force balance data obtained from the force change simulation of the initial assembly step sequence. If the result of the judgment is "no", that is, the simulation result shows that assembling according to the initial assembly step sequence can keep the structure within the preset stability criterion range throughout the process, without the risk of causing structural imbalance or collapse, the electronic device will execute this step.

[0123] In this case, the electronic device considers that the initial assembly step sequence is already a stable and reasonable assembly plan, and no additional adjustment is needed. Therefore, the electronic device will directly determine the initial assembly step sequence generated in step 211 as the final step sequence data. This means that the subsequent generation of assembly instruction manual will directly follow this unmodified sequence. This step embodies an efficiency principle: if the preliminary plan is found to be good enough after simulation verification, unnecessary complex adjustment is not necessary, thereby saving computing resources and time.

[0124] 220、based on the step sequence data, generating an assembly instruction of the building block components.

[0125] The method specifically includes steps 2201 to 2203, all of which are not shown in the figure.

[0126] Step 2201: According to the step sequence data, generate corresponding visualization guidance data for each assembly step, which includes force arrow indication and auxiliary line marking.

[0127] The electronic device generates corresponding visualization guidance data according to the information recorded in the step sequence data, such as the building block components involved in each step, their installation order, and the force changes of key nodes in this step. These visualization data aim to intuitively show the user how to assemble and the mechanical key points in the assembly process. For example, the electronic device can highlight the building block components that need to be installed in the current step in the three-dimensional model view; according to the force transmission direction and key node position recorded in the step sequence data, superimpose force arrow indications on the components, use the direction and thickness of the arrow to represent the size and transmission direction of the force; auxiliary line markings can also be added, such as indicating the alignment position of the components, the position of the connection points, or the range of the key force area. These visualization elements can help users more clearly understand the operation points of each step and the underlying mechanics.

[0128] Step 2202: According to the visualization guidance data, generate text instruction data, which includes the building block component number, installation order, and force change explanation of key nodes for each assembly step.

[0129] The electronic device will generate text instruction data according to the step sequence data. These text instructions are a supplement and detailed explanation of the visualization guidance. The text instruction data will include the number of building block components involved in each assembly step, clearly indicating their installation order (e.g. "please install component A first, then install component B"). More importantly, the text instructions will also explain to the user why this step is done this way, or what needs to be paid special attention to when installing a certain component, in combination with the force change explanation of the key nodes contained in the step sequence data. For example, the text instructions will prompt the user to "after installing this support column, key node X will bear the main vertical load, please ensure that it is connected tightly with the underlying components", or "when installing this cantilever component, as it will generate a large bending moment, please make sure that the connection at its root is firm". These text instructions present the results of mechanical analysis in a way that is easy for users to understand, improving the professionalism and guidance of the instruction manual.

[0130] Step 2203: Based on the visualization guidance data and the text instruction data, generate an assembly instruction of the building block components.

[0131] The electronic device integrates the generated visual guidance data and textual instruction data of each step, arranges them in the order of the sequence of steps, and finally generates a complete building block assembly instruction manual. This instruction manual can be in the form of an electronic document (such as PDF) or used to generate an interactive three-dimensional assembly guide. The instruction manual generated in this way not only tells the user "how to assemble", but more importantly explains "why to assemble in this way", allowing the user to consider the stress condition of the components during assembly, thereby improving the success rate of assembly and the stability of the final structure.

[0132] The intelligent building block assembly method based on dynamic data and related technical solutions in the embodiments of the present application start from the image data of the building blocks to be assembled, extract geometric parameters and connection position information, and then calculate stress characteristic data to complete a series of operations such as stress level division and partition coding. In this process, the key nodes are identified based on the stress transmission relationship, the stress balance state of the key nodes is determined, the assembly sequence of the supporting components and the subsequent components is scientifically planned, and the initial assembly steps are dynamically optimized through simulation calculation of stress changes. This series of processes finally generates a complete building block assembly instruction manual, realizing precise control of dynamic stress during building block assembly. Not only can it effectively avoid the collapse and deformation of complex models caused by uneven stress, improve the assembly stability and success rate, but also provide scientific and professional assembly guidance for users, and improve the assembly efficiency and quality.

[0133] The building block assembly instruction manual generation method based on dynamic stress provided in the above embodiments can be executed by an electronic device. The electronic device in the embodiments of the present application is described from the perspective of hardware processing. Please refer to Figure 3 , which is a hardware structure diagram of the electronic device in the embodiments of the present application.

[0134] It should be noted that Figure 3 The structure of the electronic device shown is only an example and should not limit the functions and use range of the embodiments of the present application.

[0135] As Figure 3As shown, the electronic device includes a Central Processing Unit (CPU) 301 which can perform various appropriate actions and processes in accordance with a program stored in a Read-Only Memory (ROM) 302 or a program loaded from a storage section 308 into a Random Access Memory (RAM) 303, such as performing the methods described in the above embodiments. In the Random Access Memory (RAM) 303, various programs and data required for system operation are also stored. The Central Processing Unit (CPU) 301, the Read-Only Memory (ROM) 302, and the Random Access Memory (RAM) 303 are connected to each other through a bus 304. An Input / Output (I / O) interface 305 is also connected to the bus 304.

[0136] Connected to the Input / Output (I / O) interface 305 are an input section 306 including an audio input device, a button switch, and the like; an output section 307 including a display and an audio output device, an indicator, and the like; a storage section 308 including a hard disk and the like; and a communication section 309 including a network interface card such as a LAN (Local Area Network) card, a modem, and the like. The communication section 309 performs communication processing via a network such as the Internet. A drive 310 is also connected to the Input / Output (I / O) interface 305 as necessary. A removable medium 311 such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, and the like is mounted on the drive 310 as necessary, so that a computer program read therefrom is installed in the storage section 308 as necessary.

[0137] In particular, the processes described above with reference to the flowcharts can be implemented as a computer software program in accordance with embodiments of the present application. For example, embodiments of the present application include a computer program product comprising a computer program carried on a computer readable medium, the computer program containing a computer program for performing the methods illustrated by the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network by the communication section 309 and / or installed from the removable medium 311. When the computer program is executed by the Central Processing Unit (CPU) 301, various functions defined in the present application are performed.

[0138] Note that specific examples of computer-readable storage media can include but are not limited to an electrical connection having one or more wires, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In the present disclosure, computer-readable storage media can be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device.

[0139] The flow diagrams and the block diagrams in the drawings are illustrations of architectures, functional processes, and operational processes, according to various embodiments of the present application. It will be understood that each block of the flow diagrams and / or block diagrams, and combinations of blocks in the flow diagrams and / or the block diagrams, can be implemented by computer readable program instructions such as program code. Such computer readable program instructions can be provided to a processor of a computer, or other programmable data processing apparatus, to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions / acts specified in the flow diagrams and / or block diagrams. These computer readable program instructions can also be stored in a computer readable storage medium that can direct a computer, a programmable data processing apparatus, and the other

[0140] In particular, the electronic device of the embodiment includes a processor and a memory coupled with the one or more processors, the memory configured to store computer program code comprising computer instructions, the one or more processors configured to invoke the computer instructions to cause the electronic device to perform the method provided by the above embodiment.

[0141] As another aspect, the present application also provides a computer readable storage medium, which can be included in the electronic device described in the above embodiment, or can exist separately without being assembled into the electronic device. The storage medium carries one or more computer programs, which, when executed by a processor of the electronic device, cause the electronic device to implement the method provided in the above embodiment.

[0142] The above-described embodiments are merely intended for describing the technical solutions of the present application, but not limit the present application; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacements to some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

[0143] In the above embodiments, the term "when" can be interpreted as meaning "if" or "after" or "in response to determining" or "in response to detecting" depending on the context. Similarly, the phrase "upon determining" or "if detecting (the stated condition or event)" can be interpreted as meaning "if determining" or "in response to determining" or "upon detecting (the stated condition or event)" or "in response to detecting (the stated condition or event)" depending on the context.

[0144] In the above embodiments, all or part of the methods can be implemented by software, hardware, firmware or any combination thereof. When implemented by software, all or part of the methods can be implemented in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of the present application are generated. The computer can be a general purpose computer, a special purpose computer, a computer network, or other programmable devices. The computer instructions can be stored in a computer readable storage medium or transmitted from one computer readable storage medium to another computer readable storage medium, for example, the computer instructions can be transmitted from one website, computer, server or data center to another website, computer, server or data center through wired (such as coaxial cable, optical fiber, digital subscriber line) or wireless (such as infrared, wireless, microwave, etc.) manner. The computer readable storage medium can be any available medium that can be accessed by a computer or a data storage device such as a server, data center, etc. integrated with one or more available media. The available media can be magnetic media (such as floppy disk, hard disk, magnetic tape), optical media (such as DVD), or semiconductor media (such as solid state disk), etc.

[0145] A person of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiments can be instructed by a computer program to relevant hardware, and the program can be stored in a computer readable storage medium. When the program is executed, it can include the processes of the above-mentioned embodiments. The storage medium includes ROM or random access memory (RAM), magnetic disk or optical disk, and various media that can store program codes.

Claims

1. A method for generating assembly instructions for building blocks based on dynamic force, characterized in that, include: Based on the image data of the building block components to be assembled, the building block component data is extracted, which includes geometric parameters and connection position information; Based on the building block component data, the force characteristic data of the building block component is calculated, and the force characteristic data includes the force direction, force magnitude and force point location; The building block component is partitioned and coded according to the stress characteristic data to obtain the building block component partition data. The building block component partition data includes the region code of the building block component, the partition stress characteristic data, and the partition connection relationship data. Based on the block component partition data, the force transmission relationship between adjacent components is determined, including the direction and trend of pressure transmission. Based on the force transmission relationship, key force nodes are identified, and key node location data is obtained. Based on the key node location data and the partition force characteristic data, the force balance state of each key node is determined; Based on the force balance state of each key node and the force transmission relationship, identify the supporting components that need to be built first during the assembly process, and obtain the assembly steps of the supporting components. Based on the assembly steps of the supporting components and the force transmission relationship, the assembly sequence of subsequent components is determined sequentially to obtain step sequence data; Based on the sequence of steps, an assembly instruction manual for the building block components is generated.

2. The method according to claim 1, characterized in that, Based on the stress characteristic data, the building block component is partitioned and encoded to obtain the building block component partition data, specifically including: Based on the stress characteristic data, the building block components are classified into stress levels to obtain stress levels, which include stress values ​​and distribution ranges of high stress level, medium stress level and low stress level. Based on the stress level and the geometric parameters of the building block component, the boundary point of each stress level is determined to obtain boundary data, which includes the boundary point coordinate sequence and the boundary curve equation. Based on the boundary data and the force characteristic data, the center of gravity position and force characteristics of each partition are calculated to obtain partition force characteristic data, which includes the partition center of gravity position, force direction and force magnitude. Based on the force characteristics data of the partition and the force level, a region code and partition connection relationship are generated to obtain the partition data of the building block component.

3. The method according to claim 2, characterized in that, Based on the partition stress characteristic data and the stress level, a region code and partition connection relationship are generated to obtain the block component partition data, specifically including: Based on the force characteristic data of the partition and the force level, the force transmission direction of each partition is determined; Based on the force transmission direction and the center of gravity position of each partition, a region code for each partition is generated. The region code includes the position and force characteristics of the partition in the overall component. Based on the region coding, the connection relationship between adjacent partitions is calculated to obtain the partition connection relationship, which includes the location of the connection point, the connection direction and the connection force characteristics between adjacent partitions. Based on the region code and the partition connection relationship, the block component partition data is generated.

4. The method according to claim 1, characterized in that, Based on the assembly steps of the supporting components and the force transmission relationship, the assembly sequence of subsequent components is determined sequentially to obtain step sequence data, specifically including: Based on the assembly steps of the supporting components and the force transmission relationship, the assembly sequence of subsequent components is determined sequentially to obtain the initial assembly steps; Based on the initial assembly steps, the stress changes of the newly added building block components during each assembly step are simulated and calculated to obtain the overall stress balance during the assembly process; Based on the overall force balance, determine whether the initial assembly steps need to be adjusted; If so, the initial assembly steps are adjusted based on the simulation calculation results of the stress changes of the newly added building block components to obtain the step sequence data; If not, then the initial assembly step is determined to be step sequence data.

5. The method according to claim 4, characterized in that, Based on the simulation calculation results of the stress changes of the newly added building block components, the initial assembly steps are adjusted to obtain step sequence data, specifically including: Obtain the simulated force changes of the newly added building block component; Based on the simulated force changes, the main building block components causing the overall force imbalance were identified. Based on the stress characteristics of the main building block components and the key node position data, the main assembly path that causes the stress imbalance is determined. The assembly path includes the specific direction and range of force transmission. Based on the main assembly path, the stress adjustment parameters for the unbalanced stress area are calculated. The stress adjustment parameters include adjusting the order of components and optimizing the assembly order of supporting components. Based on the force adjustment parameters, the initial assembly steps are adjusted to obtain the adjusted step sequence data.

6. The method according to claim 1, characterized in that, Based on the step sequence data, an assembly instruction manual for the building block components is generated, specifically including: Based on the step sequence data, corresponding visual guidance data is generated for each assembly step, including force arrow indicators and auxiliary line markings; Based on the visual guidance data, textual description data is generated, which includes the block component number, installation order, and stress changes of key nodes for each assembly step. Based on the visual guidance data and textual description data, an assembly instruction manual for the building block components is generated.

7. An electronic device, characterized in that, The electronic device includes: One or more processors and memory; The memory is coupled to the one or more processors, the memory being used to store computer program code, the computer program code including computer instructions, the one or more processors invoking the computer instructions to cause the electronic device to perform the method as described in any one of claims 1-6.

8. A computer-readable storage medium comprising instructions, characterized in that, When the instructions are executed on an electronic device, the electronic device causes the electronic device to perform the method as described in any one of claims 1-6.

9. A computer program product, characterized in that, When the computer program product is run on an electronic device, it causes the electronic device to perform the method as described in any one of claims 1-6.

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