System for low inductance full bridge power module for inverter

Abstract

The invention relates to a system for a low inductance full bridge power module for an inverter. The system comprises: a first switch for receiving a positive direct current to generate an alternating current; a positive direct current rail for providing a positive direct current to the first switch; a positive direct current tab connected to the positive direct current rail; the second switch is used for receiving the negative direct current to generate alternating current; the negative direct current rail is used for providing negative direct current for the second switch; a negative direct current tab connected to the negative direct current rail; and an alternating current tab for receiving alternating current from the first switch and the second switch, in which the positive direct current rail is disposed in a first plane on a first side of the first switch and the second switch and the negative direct current rail is disposed in a second plane on a second side of the first switch and the second switch opposite the first side.

Description

Technical Field

[0001] Various embodiments of the present disclosure relate generally to systems and methods for low-inductance phase switching for an inverter of an electric vehicle, and more particularly to systems and methods for a power module including low-inductance phase switching for an inverter of an electric vehicle. Background Art

[0002] For example, an inverter, such as one used to drive a motor in an electric vehicle, is responsible for converting direct current (DC) into alternating current (AC) to drive the motor. In an inverter, loop inductance associated with a phase switch can affect the switching losses of the switch.

[0003] The present disclosure is directed to overcoming one or more of these aforementioned challenges. Summary of the Invention

[0004] In some aspects, the technology described herein relates to a system comprising: an inverter for converting direct current (DC) power from a battery into alternating current (AC) power to drive a motor, wherein the inverter comprises: a power module comprising: one or more first switches for receiving positive DC power to generate the AC power; a positive DC rail for providing the positive DC power to the one or more first switches; one or more positive DC lugs connected to the positive DC rail; one or more second switches for receiving negative DC power to generate the AC power; and a negative DC rail for providing the positive DC power to the one or more first switches. a positive DC rail for providing the negative DC power to the one or more second switches; one or more negative DC lugs connected to the negative DC rail; and one or more AC lugs for receiving the AC power from the one or more first switches and the one or more second switches, wherein the positive DC rail is provided in a first plane on a first side of the one or more first switches and the one or more second switches, and the negative DC rail is provided in a second plane on a second side of the one or more first switches and the one or more second switches opposite to the first side.

[0005] In some aspects, the technology described herein relates to a system wherein the one or more AC lugs include: a first AC lug for connecting to a first phase of the motor; a second AC lug for connecting to a second phase of the motor; and a third AC lug for connecting to a third phase of the motor.

[0006] In some aspects, the technology described herein relates to a system wherein the one or more first switches include a first transistor and a second transistor configured to generate a single phase of the alternating current.

[0007] In some aspects, the technology described herein relates to a system wherein the one or more positive DC tabs include: a first positive DC tab connected to the positive DC rail; and a second positive DC tab connected to the positive DC rail, and wherein the one or more negative DC tabs include: a first negative DC tab connected to the negative DC rail and disposed between the first positive DC tab and the second positive DC tab.

[0008] In some aspects, the technology described herein relates to a system wherein the one or more negative DC tabs include: a first negative DC tab connected to the negative DC rail; and a second negative DC tab connected to the negative DC rail, and wherein the one or more positive DC tabs include: a first positive DC tab connected to the positive DC rail and disposed between the first negative DC tab and the second negative DC tab.

[0009] In some aspects, the technology described herein relates to a system wherein the power module further includes a high side gate pin and a low side gate pin.

[0010] In some aspects, the technology described herein relates to a system wherein the one or more positive DC tabs and the one or more negative DC tabs are disposed on an opposite side of the power module from the one or more AC tabs.

[0011] In some aspects, the technology described herein relates to a system wherein the inverter further includes one or more heat sinks for the power modules.

[0012] In some aspects, the technology described herein relates to a system, further comprising: the battery configured to supply the DC power to the inverter; and the motor configured to receive the AC power from the inverter to drive the motor, wherein the system is configured as a vehicle including the inverter, the battery, and the motor.

[0013] In some aspects, the technology described herein relates to a system including a power module for an inverter, the power module including: a positive DC rail for providing positive DC power, the positive DC rail including an inner layer and an outer layer; a negative DC rail for providing negative DC power, the negative DC rail including an inner layer and an outer layer, wherein the inner layer of the negative DC rail faces the inner layer of the positive DC rail such that at least a portion of the negative DC rail overlaps the positive DC rail; a first switch connected to the inner layer of the positive DC rail to receive the positive DC power; a second switch connected to the inner layer of the negative DC rail to receive the negative DC power; and one or more AC lugs for receiving AC power from the first and second switches.

[0014] In some aspects, the technology described herein relates to a system, the power module further comprising: a first substrate, the first substrate comprising an inner layer and an outer layer, wherein the inner layer of the first substrate is connected to the outer layer of the positive DC rail; a second substrate, the second substrate comprising an inner layer and an outer layer, wherein the inner layer of the second substrate is connected to the outer layer of the negative DC rail; a first AC rail, the first AC rail connected to the inner layer of the first substrate, a first side of the first switch, and the one or more AC lugs; and a second AC rail, the second AC rail connected to the inner layer of the second substrate, a second side of the second switch, and the one or more AC lugs.

[0015] In some aspects, the technology described herein relates to a system, wherein the power module further comprises: a third switch connected to the inner layer of the positive DC rail to receive positive DC power; and a fourth switch connected to the inner layer of the negative DC rail to receive negative DC power, wherein a die plane orientation of the third switch is the same as a die plane orientation of the first switch, and a die plane orientation of the fourth switch is the same as a die plane orientation of the second switch.

[0016] In some aspects, the technology described herein relates to a system, wherein the power module further comprises: a fifth switch connected to the inner layer of the positive DC rail to receive positive DC power; and a sixth switch connected to the inner layer of the negative DC rail to receive negative DC power, wherein a die plane orientation of the fifth switch is the same as the die plane orientation of the first switch, and a die plane orientation of the sixth switch is the same as the die plane orientation of the second switch.

[0017] In some aspects, the technology described herein relates to a system wherein: the first switch and the second switch generate a first phase of the alternating current; the third switch and the fourth switch generate a second phase of the alternating current; and the fifth switch and the sixth switch generate a third phase of the alternating current.

[0018] In some aspects, the technology described herein relates to a system wherein the one or more AC power lugs include: a first AC power lug for receiving the first phase of the AC power and for connecting to a first phase of a motor; a second AC power lug for receiving the second phase of the AC power and for connecting to a second phase of the motor; and a third AC power lug for receiving the third phase of the AC power and for connecting to a third phase of the motor.

[0019] In some aspects, the technology described herein relates to a system wherein the power module further comprises a high-side gate pin and a low-side gate pin.

[0020] In some aspects, the technology described herein relates to a system wherein the first switch includes a first transistor and a second transistor configured to generate a single phase of the alternating current.

[0021] In some aspects, the technology described herein relates to a system including a power module comprising: one or more first switches configured to receive positive direct current (DC) power to generate alternating current (AC); a positive DC rail configured to provide the positive DC power to the one or more first switches; one or more positive DC lugs connected to the positive DC rail; one or more second switches configured to receive negative DC power to generate the AC power; a negative DC rail configured to provide the negative DC power to the one or more second switches; one or more negative DC lugs connected to the negative DC rail; and one or more AC lugs configured to receive the AC power from the one or more first switches and the one or more second switches, wherein the positive DC rail is disposed in a first plane on a first side of the one or more first switches and the one or more second switches, and the negative DC rail is disposed in a second plane on a second side of the one or more first switches and the one or more second switches, opposite the first side.

[0022] In some aspects, the technology described herein relates to a system, further comprising: a battery configured to supply the positive direct current and the negative direct current to the power module; and a motor configured to receive the alternating current from the power module to drive the motor, wherein the system is configured as a vehicle including the power module, the battery, and the motor.

[0023] In some aspects, the technology described herein relates to a system wherein the alternating current is provided in one or more phases.

[0024] Additional objects and advantages of the disclosed embodiments will be set forth in part in the following description and in part will be obvious from the description, or may be learned by practicing the disclosed embodiments. The objects and advantages of the disclosed embodiments will be realized and obtained by means of the elements and combinations particularly pointed out herein.

[0025] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosed embodiments, as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate various exemplary embodiments and, together with the description, serve to explain the principles of the disclosed embodiments.

[0027] Figure 1 Depicted is an exemplary system infrastructure for a vehicle including a combined inverter and converter, according to one or more embodiments.

[0028] Figure 2 Depicted is an electrical power schematic diagram connecting three-phase inverter modules in a system according to one or more embodiments.

[0029] Figure 3 Depicted are implementations of computer systems that can perform the techniques presented herein, in accordance with one or more embodiments.

[0030] Figure 4 Depicted is a top view of an exemplary power module according to one or more embodiments.

[0031] Figure 5 Depicted are top and bottom views and associated cross-sectional views of an exemplary power module according to one or more embodiments.

[0032] Figure 6A 、 Figure 6B and Figure 6C Depicted are top and bottom views of an exemplary power module according to one or more embodiments.

[0033] Figure 7A 、 Figure 7B 、 Figure 7C and Figure 7D Depicted are top and bottom views of an exemplary power module according to one or more embodiments.

[0034] Figure 8A 、 Figure 8B 、 Figure 8C and Figure 8D Depicted are top and bottom views of an exemplary power module according to one or more embodiments. DETAILED DESCRIPTION

[0035] The foregoing general description and the following detailed description are exemplary and illustrative only and are not limitations on the claimed features. As used herein, the terms "comprises," "includes," "has," or other variations of these terms are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but may also include other elements not expressly listed or inherent to such process, method, article, or apparatus. In this disclosure, unless otherwise stated, terms such as "about," "substantially," and "approximately" are used to indicate a possible variation of ±10% of the stated value. In this disclosure, unless otherwise stated, any numerical value may include a possible variation of ±10% of the stated value.

[0036] The terms used below are to be interpreted in their broadest reasonable manner, even when used in conjunction with the detailed description of certain specific examples of the present disclosure. Indeed, certain terms may be emphasized below; however, any term that is intended to be interpreted in any restricted manner will be clearly and specifically so defined in this detailed description. For example, in the context of the present disclosure, a switching device may be described as a switch or device, but may refer to any device used to control the flow of power in a circuit. For example, a switch may be, for example, a metal oxide semiconductor field effect transistor (MOSFET), a bipolar junction transistor (BJT), an insulated gate bipolar transistor (IGBT), or a relay, or any combination thereof, but is not limited thereto.

[0037] Various embodiments of the present disclosure generally relate to systems and methods for low-inductance phase switching for inverters for electric vehicles, and more specifically to systems and methods for power modules including low-inductance phase switching for inverters for electric vehicles. An inverter, such as an inverter for driving a motor in an electric vehicle, is responsible for converting direct current (DC) into alternating current (AC) to drive the motor. A three-phase inverter may include a bridge having six power device switches (e.g., power transistors such as IGBTs or MOSFETs) that are controlled by pulse width modulation (PWM) signals generated by a controller.

[0038] Some power modules include six power switches placed between two heat sinks (e.g., double-sided cooling), forming a three-phase two-level inverter. Each power switch has the function of a power switch of a full-bridge inverter. The number of embedded power silicon (e.g., Si or SiC) can vary in size (e.g., 4 to 8 SiC dies per power switch), and the size of the dies can vary (e.g., from about 25 mm for SiC). 2 To about 28mm 2 ). Therefore, the requirements for power module configurations may include a wide range (e.g., from about 275 Arms (ampere root mean square value) to about 530 Arms (800V system) and from about 146 kW to about 282 kW, and from about 325 Arms to about 600 Arms (400V system) and from about 87 kW to about 160 kW). For power electronics cooling performance, the current density may be less than about 3 A / mm 2 Increased to greater than about 4A / mm 2 , resulting in a potential increase of approximately 25% in the power delivered by the power module.

[0039] With the advent of electric vehicles, driving three-phase motors more efficiently may become increasingly important. A three-phase motor can be driven with three half-H or phase switches that switch the motor phase connection between a positive high-voltage DC voltage source (HVDC+) and a negative high-voltage DC voltage source (HVDC-). The loop inductance associated with the phase switches can be significant, and may become even more important as silicon carbide (SiC) devices become more prevalent. Lower loop inductance may be especially important for fast SiC devices, as lower loop inductance can allow faster switching times while maintaining appropriate voltages and appropriate current overshoot and ringing.

[0040] As technology advances, internal combustion engine (ICE) vehicles will be phased out and replaced by more vehicles with electric powertrains, including vehicles in segments A to C. Some solutions can provide a "minimum" 800V power module with 4 dies per power switch, which can have a capacity of (146+25%) approximately 180kW (e.g., not suitable for vehicles in segments A, B, and C that require 50kW to 150kW), and some solutions can provide a "minimum" 400V power module with 4 dies per power switch, which can have a capacity of (87+25%) approximately 109kW (e.g., not suitable for vehicles in segments A and B that require 50kW to 100kW).

[0041] The phase switch can consist of two separate power switches in separate packages (e.g., two power modules) or two separate power switches in a single integrated package (e.g., a single power module). In a single-sided cooling system, the power switches can be mounted side by side so that each power switch has a good thermal path to the heat sink of the cooling system. This side-by-side arrangement can limit the reduction of the loop area that produces the loop inductance. In a double-sided cooling system, the power switches can be mounted side by side to maximize the effectiveness of the dual heat sinks of the cooling system. This side-by-side arrangement can also limit the reduction of the loop area that produces the loop inductance. With the use of higher cost SiC devices together with increasingly higher switching frequencies, switching losses can become a significant portion of the overall losses of the power module.

[0042] One or more embodiments may include high capacity, high power density, reduced stray inductance for improved efficiency, and a low-cost, scalable solution for low-power applications (e.g., Class A to C vehicles). Some solutions may include six power switches (e.g., 4 to 8 dies) and six AC terminals to provide connections between pairs of power switches on the AC terminal side, and six DC terminals to provide three DC+ connections and three DC- connections. One or more embodiments may include a power module with a die structure placed between dual direct bond material (DBM) plates while reducing the number of terminal connections relative to some solutions. One or more embodiments may include electrical terminals corresponding to two high-voltage terminals for DC-side connections (e.g., DC+ and DC-), three high-voltage terminals for AC-side connections (e.g., phases U, V, and W), five high-voltage terminals (e.g., Kelvin pins) for AC-side electrical voltage measurement, six low-voltage terminals (e.g., three high-side and three low-side) for gate signals, and two terminals for temperature sensing (e.g., optionally, the number of terminals may be less than or greater than two).

[0043] One or more embodiments may include a package (e.g., 6 to 12 dies), internal connections for the half-bridges of the AC phases, and single DC+ and DC- connections to the bulk capacitors. One or more embodiments may be suitable for currents from about 72 Arms to about 252 Arms per module (with about 4A / mm 2 One or more embodiments may include forming one or more dies for switches Q1, Q3, and Q5 with drains connected to DC+ and one or more dies for switches Q4, Q6, and Q2 with drains connected to phase leads U, V, and W. One or more embodiments may include six gate leads with the same geometry for all phases, which may enhance the balance of current distribution to provide better electrical behavior.

[0044] One or more embodiments may include soldered dies. One or more embodiments may include a configuration with four dies per phase (e.g., or other number of dies, such as two or three). One or more embodiments may include four dies with the same distance between the AC lugs and the DC lugs. One or more embodiments may include direct bonding material (DBM) connected to both the DC side terminals and the AC side terminals. One or more embodiments may include an overlap of the DC+ terminal and the DC- terminal to reduce parasitic inductance. One or more embodiments may include a structure with the same internal geometry of the bridge and connections, which may reduce the risk of impedance imbalance and overstress of one bridge compared to another bridge.

[0045] One or more embodiments may include an internal arrangement of the DC+ and DC- leads that overlap over a portion of their respective areas. The overlapping portion may result in a reduced stray inductance of the electrical connection, which may be conducive to higher switching speeds and higher efficiency. One or more embodiments may include a 12-die configuration (e.g., two dies per phase). If higher current capacity is required, one or more embodiments may include 6 dies per power module (e.g., a minimum of one die per phase) or 18 dies per power module (e.g., three dies per phase) or more.

[0046] One or more embodiments may include an area per die that may be reduced (e.g., from approximately 28 mm 2 Reduced to about 15mm 2 ) to fine-tune the current capacity based on vehicle requirements. One or more embodiments may include a design compatible with embedded decoupling capacitors mounted between the DC+ and DC- leads within the inter-DBM volume (e.g., closest to the die) to achieve higher switching speeds and improve efficiency.

[0047] One or more embodiments may provide advantages including high compactness, high power density, reduced stray inductance for improved efficiency, and a low-cost and scalable solution for low power applications (e.g., Class A to C vehicles). One or more embodiments may provide improvements including reduced cost of the complete power module compared to some power module designs with six power switches, and reduced efficiency of power module switching losses due to the high switching speed capability allowed by low stray inductance (and optional embedded decoupling capacitors). One or more embodiments may include a current density of approximately 4 Arms / mm 2A design in which the pressure drop allocated to the power module can be concentrated on a smaller heat sink, and thus a higher heat transfer coefficient can be achieved. One or more embodiments may include a 3D printed heat sink (e.g., removing the thermal interface material layer on both sides) and a double-sided sintered die. One or more embodiments may provide a power module with high power density that is compatible with A to C class vehicles.

[0048] Figure 1 An exemplary system infrastructure for a vehicle including a combined inverter and converter according to one or more embodiments is depicted. Alternatively, the inverter may be an inverter without a converter. In the context of this disclosure, an inverter without a converter or a combined inverter and converter may be referred to as an inverter. Figure 1 As shown, the electric vehicle 100 may include an inverter 110, a motor 190, and a battery 195. The inverter 110 may include a component that receives power from an external source and outputs power to charge the battery 195 of the electric vehicle 100. The inverter 110 may convert direct current from the battery 195 in the electric vehicle 100 into alternating current, for example to drive (e.g., rotate) the motor 190 of the electric vehicle 100, but the embodiment is not limited thereto. The inverter 110 may be bidirectional and may convert direct current into alternating current, or convert alternating current into direct current (e.g., during regenerative braking). The inverter 110 may be a three-phase inverter, a single-phase inverter, or a multi-phase inverter.

[0049] Figure 2 A power schematic diagram of a three-phase inverter module according to one or more embodiments is depicted. Figure 1 and Figure 2 As shown, the inverter 110 can be connected to the battery 195 and the motor 190. The battery 195 can be any power source, and the motor 190 can be any load. The inverter 110 can include a first three-phase switch group 210 and a second three-phase switch group 220. The first phase U can be associated with ΦA including switches Q1 and Q4, the second phase V can be associated with ΦB including switches Q3 and Q6, and the third phase W can be associated with ΦC including switches Q5 and Q2, as shown in FIG. Figure 2 As shown. The first three-phase switch group 210 may include a first-phase switch Q1, a second-phase switch Q3, and a third-phase switch Q5. The second three-phase switch group 220 may include a first-phase switch Q4, a second-phase switch Q6, and a third-phase switch Q2. Switches Q1 to Q6 may be, for example, metal oxide semiconductor field effect transistors (MOSFETs), but are not limited thereto.

[0050] The first three-phase switch group 210 and the second three-phase switch group 220 may be controlled by the inverter controller 300 ( Figure 3) is driven by a PWM signal generated to convert the DC power delivered via the input terminal group 285 at the capacitor 230 into three-phase AC power at the outputs U, V and W of the motor 190 via the output terminal group 295. In addition, although Figure 1 and Figure 2 A three-phase inverter is shown, but the present disclosure is not limited thereto and may include a single-phase or multi-phase inverter.

[0051] Figure 3 Depicted is a method for Figure 2 FIG. 3 is an exemplary system architecture of an inverter controller 300 . The inverter controller 300 may include one or more controllers.

[0052] The inverter controller 300 may include a set of instructions that can be executed to cause the inverter controller 300 to perform any one or more of the methods or computer-based functions disclosed herein. The inverter controller 300 can operate as a standalone device or can be connected to other computer systems or peripheral devices, for example using a network.

[0053] In a networked deployment, the inverter controller 300 can operate in the capacity of a server, or as a client in a server-client user network environment, or as a peer computer system in a peer-to-peer (or distributed) network environment. The inverter controller 300 can also be implemented as or incorporated into various devices, such as a personal computer (PC), a tablet PC, a set-top box (STB), a personal digital assistant (PDA), a mobile device, a palmtop computer, a laptop computer, a desktop computer, a communication device, a wireless phone, a landline phone, a control system, a camera, a scanner, a fax machine, a printer, a pager, a personal trusted device, a network device, a network router, a switch or a bridge, or any other machine (which is capable of executing a set of instructions (sequential or otherwise) specifying an action to be taken by the machine). In a specific implementation, the inverter controller 300 can be implemented using an electronic device that provides voice, video or data communication. In addition, although the inverter controller 300 is shown as a single system, the term "system" should also be considered to include any collection of systems or subsystems that execute a set of instructions or multiple sets of instructions to perform one or more computer functions, either individually or in combination.

[0054] like Figure 3As shown, the inverter controller 300 may include a processor 302, such as a central processing unit (CPU), a graphics processing unit (GPU), or both. The processor 302 may be a component in various systems. For example, the processor 302 may be part of a standard inverter. The processor 302 may be one or more general-purpose processors, digital signal processors, application-specific integrated circuits, field programmable gate arrays, servers, networks, digital circuits, analog circuits, combinations thereof, or other now known or later developed devices for analyzing and processing data. The processor 302 may implement a software program, such as manually generated (i.e., programmed) code.

[0055] The inverter controller 300 may include a memory 304 that can communicate via a bus 308. The memory 304 may be main memory, static memory, or dynamic memory. The memory 304 may include, but is not limited to, computer-readable storage media, such as various types of volatile and non-volatile storage media, including, but not limited to, random access memory, read-only memory, programmable read-only memory, electrically programmable read-only memory, electrically erasable read-only memory, flash memory, magnetic tape or disk, optical media, and the like. In one implementation, the memory 304 includes a cache or random access memory for the processor 302. In alternative implementations, the memory 304 is separate from the processor 302 (e.g., the processor's cache memory, system memory, or other memory). The memory 304 may be an external storage device or database for storing data. Examples include a hard drive, a compact disc ("CD"), a digital video disc ("DVD"), a memory card, a memory stick, a floppy disk, a universal serial bus ("USB") memory device, or any other device operable to store data. The memory 304 is operable to store instructions that can be executed by the processor 302. The functions, actions, or tasks shown in the figures or described herein may be performed by the processor 302 executing instructions stored in the memory 304. The functions, actions, or tasks are independent of the particular type of instruction set, storage medium, processor, or processing strategy, and may be performed by software, hardware, integrated circuits, firmware, microcode, etc., operating alone or in combination. Likewise, processing strategies may include multi-processing, multi-tasking, parallel processing, etc.

[0056] As shown, the inverter controller 300 may further include a display 310, such as a liquid crystal display (LCD), an organic light emitting diode (OLED), a flat panel display, a solid state display, a cathode ray tube (CRT), a projector, a printer, or other display devices now known or later developed for outputting determined information. The display 310 may serve as an interface for a user to see the functions of the processor 302, or specifically serve as an interface with software stored in the memory 304 or the drive unit 306.

[0057] Additionally or alternatively, the inverter controller 300 may include an input device 312 configured to allow a user to interact with any component of the inverter controller 300. The input device 312 may be a numeric keypad, a keyboard, or a cursor control device (such as a mouse or joystick), a touch screen display, a remote control, or any other device operable to interact with the inverter controller 300.

[0058] The inverter controller 300 may also or alternatively include a drive unit 306 implemented as a disk or optical drive. The drive unit 306 may include a computer-readable medium 322 in which instructions 324 (e.g., one or more sets of instructions), such as software, may be embedded. In addition, the instructions 324 may implement one or more of the methods or logic described herein. The instructions 324 may reside entirely or partially within the memory 304 and / or within the processor 302 during execution by the inverter controller 300. The memory 304 and the processor 302 may also include computer-readable media as described above.

[0059] In some systems, computer-readable medium 322 includes instructions 324, or receives and executes instructions 324 in response to a propagated signal, enabling devices connected to network 370 to transmit voice, video, audio, images, or any other data over network 370. Furthermore, instructions 324 may be sent or received over network 370 via communication port or interface 320 and / or using bus 308. Communication port or interface 320 may be part of processor 302 or a separate component. Communication port or interface 320 may be created in software or may be a physical connection in hardware. Communication port or interface 320 may be configured to connect to network 370, external media, display 310, or any other component in inverter controller 300, or a combination thereof. The connection to network 370 may be a physical connection, such as a wired Ethernet connection, or may be established wirelessly as described below. Similarly, additional connections to other components of inverter controller 300 may be physical connections or may be established wirelessly. Network 370 may alternatively be directly connected to bus 308.

[0060] Although the computer-readable medium 322 is shown as a single medium, the term "computer-readable medium" may include a single medium or multiple media, such as a centralized or distributed database, and / or associated caches and servers that store one or more instruction sets. The term "computer-readable medium" may also include any medium that can store, encode, or carry an instruction set for execution by a processor or causing a computer system to perform any one or more of the methods or operations disclosed herein. The computer-readable medium 322 may be non-transitory and may be tangible.

[0061] The computer-readable medium 322 may include solid-state memory, such as a memory card or other package containing one or more non-volatile read-only memories. The computer-readable medium 322 may be random access memory or other volatile rewritable memory. Additionally or alternatively, the computer-readable medium 322 may include magneto-optical or optical media, such as a disk or tape or other storage device to capture carrier signals, such as signals transmitted via a transmission medium. Digital file attachments to emails or other self-contained information archives or archives may be considered distribution media as tangible storage media. Therefore, the present disclosure is considered to include any one or more of a computer-readable medium or distribution media and other equivalents and successor media in which data or instructions may be stored.

[0062] In alternative implementations, dedicated hardware implementations (e.g., application specific integrated circuits, programmable logic arrays, and other hardware devices) can be constructed to implement one or more of the methods described herein. Applications that may include the apparatus and systems of various implementations may broadly include various electronic and computer systems. One or more implementations described herein may use two or more specific interconnected hardware modules or devices to implement functionality, wherein related control and data signals may be transmitted between and through the modules, or one or more implementations may implement functionality as part of an application specific integrated circuit. Therefore, the present system encompasses software, firmware, and hardware implementations.

[0063] The inverter controller 300 can be connected to a network 370. The network 370 can define one or more networks, including wired or wireless networks. The wireless network can be a cellular telephone network, an 802.11, 802.16, 802.20, or WiMAX network. In addition, such a network can include a public network (such as the Internet), a private network (such as an intranet), or a combination thereof, and can utilize various network protocols currently available or later developed, including but not limited to TCP / IP-based network protocols. The network 370 can include a wide area network (WAN) such as the Internet, a local area network (LAN), a campus area network, a metropolitan area network, a direct connection such as via a universal serial bus (USB) port, or any other network that can allow data communication. The network 370 can be configured to couple one computing device to another computing device to enable data communication between the devices. The network 370 is generally capable of using any form of machine-readable media to transmit information from one device to another. The network 370 can include communication methods by which information can be transmitted between computing devices. The network 370 can be divided into subnets. A subnetwork may allow access to all other components connected thereto, or a subnetwork may restrict access between components. Network 370 may be considered a public or private network connection and may include, for example, a virtual private network or encryption or other security mechanisms employed over the public Internet.

[0064] According to various implementations of the present disclosure, the methods described herein may be implemented by a software program executable by a computer system. Furthermore, in exemplary, non-limiting implementations, the implementation may include distributed processing, component or object distributed processing, and parallel processing. Alternatively, a virtual computer system process may be configured to implement one or more of the methods or functions described herein.

[0065] Although this specification describes components and functions that can be implemented in a specific implementation with reference to specific standards and protocols, the present disclosure is not limited to such standards and protocols. For example, the standards used for Internet and other packet-switched network transmissions (e.g., TCP / IP, UDP / IP, HTML, HTTP) represent examples of the prior art. Such standards are periodically replaced by faster or more efficient equivalents having substantially the same functionality. Therefore, replacement standards and protocols having functionality identical or similar to that disclosed herein are considered equivalents thereof.

[0066] It will be appreciated that, in one embodiment, the operations of the methods discussed are performed by one or more suitable processors of a processing (i.e., computer) system executing instructions (computer-readable code) stored in a storage device. It will also be appreciated that the present disclosure is not limited to any particular implementation or programming technique, and that the present disclosure may be implemented using any suitable technique for implementing the functionality described herein. The present disclosure is not limited to any particular programming language or operating system.

[0067] Figure 4 A top view of an exemplary power module according to one or more embodiments is depicted. Power module 400 may include a first temperature pin 401 and a second temperature pin 402. First temperature pin 401 and second temperature pin 402 may be optional and / or may include any number of temperature pins. Power module 400 may include a DC tab group 410. DC tab group 410 may include one or more tabs connected to a power rail (e.g., positive DC rail 530) and / or one or more tabs integrally formed as a single component with the power rail. DC tab group 410 may include a negative DC tab 411 and a positive DC tab 412. Negative DC tab 411 may include a Kelvin pin 437. Positive DC tab 412 may include a Kelvin pin 438. Power module 400 may include an AC tab group 420. AC tab group 420 may include a first AC tab 421, a second AC tab 422, and a third AC tab 423. The first AC tab 421 may include a Kelvin pin 431 , the second AC tab 422 may include a Kelvin pin 432 , and the third AC tab 423 may include a Kelvin pin 433 .

[0068] The power module 400 may include a low-side gate pin 441 and a high-side gate pin 442 associated with the first AC tab 421. The power module 400 may include a low-side gate pin 443 and a high-side gate pin 444 associated with the second AC tab 422. The power module 400 may include a low-side gate pin 445 and a high-side gate pin 446 associated with the third AC tab 423. The power module 400 may include a negative DC tab 411 and a positive DC tab 412 on a side of the power module 400 opposite the first AC tab 421, the second AC tab 422, and the third AC tab 423.

[0069] The power module 400 may include a first switch 450, a second switch 455, a third switch 460, a fourth switch 465, a fifth switch 470, and a sixth switch 475. For example, referring to Figure 2, the first switch 450 may be associated with switch Q4, the second switch 455 may be associated with switch Q1, the third switch 460 may be associated with switch Q6, the fourth switch 465 may be associated with switch Q3, the fifth switch 470 may be associated with switch Q2, and the sixth switch 475 may be associated with switch Q5.

[0070] The first switch 450 may include a transistor 451 and a transistor 452. The second switch 455 may include a transistor 456 and a transistor 457. The third switch 460 may include a transistor 461 and a transistor 462. The fourth switch 465 may include a transistor 466 and a transistor 467. The fifth switch 470 may include a transistor 471 and a transistor 472. The sixth switch 475 may include a transistor 476 and a transistor 477.

[0071] The power module 400 may include a positive DC rail 530 (see Figure 5 ) to provide positive DC power to the second switch 455, the fourth switch 465, and the sixth switch 475. The power module 400 may include a positive DC lug 412 connected to a positive DC rail 530. The power module 400 may include a negative DC rail 540 (see Figure 5 ) to provide negative DC power to the first switch 450, the third switch 460, and the fifth switch 470. The power module 400 may include a circuit connected to a negative DC rail 540 (see Figure 5 ). The first AC tab 421 can receive first-phase AC power from the first switch 450 and the second switch 455. The second AC tab 422 can receive second-phase AC power from the third switch 460 and the fourth switch 465. The third AC tab 423 can receive third-phase AC power from the fifth switch 470 and the sixth switch 475.

[0072] The first switch 450, the third switch 460, and the fifth switch 470 can have the same die plane orientation (e.g., the gate of each switch can be located at the same position on the die). The transistor 451, the transistor 461, and the transistor 471 can have the same die plane orientation. The transistor 452, the transistor 462, and the transistor 472 can have the same die plane orientation. The second switch 455, the fourth switch 465, and the sixth switch 475 can have the same die plane orientation. The transistor 456, the transistor 466, and the transistor 476 can have the same die plane orientation. The transistor 457, the transistor 467, and the transistor 477 can have the same die plane orientation. The power module 400 can be a three-phase inverter module (see Figure 2). The first AC lug 421 may be configured to be connected to a first phase of the motor 190. The second AC lug 422 may be configured to be connected to a second phase of the motor 190. The third AC lug 423 may be configured to be connected to a third phase of the motor 190.

[0073] Figure 5 Depicted are top and bottom views and associated cross-sectional views of an exemplary power module according to one or more embodiments. Figure 5 A cross-sectional view AA of the negative DC power tab 411 , the third switch 460 including transistor 461 and transistor 462 , and the second AC power tab 422 is depicted. Figure 5 A cross-sectional view BB is depicted of the positive DC tab 412, the fourth switch 465 including transistors 466 and 467, and the second AC tab 422. Figure 5 As shown, negative DC lug 411 can be connected to (or integrated with) negative DC rail 540. Positive DC lug 412 can be connected to (or integrated with) positive DC rail 530.

[0074] Positive DC rail 530 may include an inner layer facing the switch and an outer layer facing away from the switch. Negative DC rail 540 may include an inner layer facing the switch and an outer layer facing away from the switch. The inner layer of negative DC rail 540 may face the inner layer of positive DC rail 530. At least a portion of negative DC rail 540 overlaps with positive DC rail 530 (e.g., the portion of positive DC rail 530 between positive DC tab 412 and second switch 455, fourth switch 465, and sixth switch 475 overlaps with the portion of negative DC rail 540 between positive DC tab 412 and second switch 455, fourth switch 465, and sixth switch 475).

[0075] Third switch 460 can be connected to the inner layer of negative DC rail 540 to receive negative DC power. Second AC tab 422 can receive AC power from third switch 460. Power module 400 can include a first substrate 515, which includes an inner layer and an outer layer. The inner layer of first substrate 515 can be connected to the outer layer of positive DC rail 530, the outer layer of negative DC rail 540, and the outer layer of first AC rail 560. The outer layer of first substrate 515 can be connected to heat transfer layer 505. Power module 400 can include a second substrate 520, which includes an inner layer and an outer layer. The inner layer of second substrate 520 can be connected to the outer layer of negative DC rail 540, the outer layer of positive DC rail 530, and the outer layer of second AC rail 570. The outer layer of second substrate 520 can be connected to heat transfer layer 510.

[0076] The power module may include a first AC rail 560 connected to an inner layer of the first substrate 515, a first side of the transistor 461 of the third switch 460, a first side of the transistor 462 of the third switch 460, and the second AC tab 422. The power module 400 may include a second AC rail 570 connected to an inner layer of the second substrate 520, a second side of the transistor 461 of the third switch 460, a second side of the transistor 462 of the third switch 460, and the second AC tab 422. The positive DC rail 530 may be provided in a first plane on the first side of the third switch 460, and the negative DC rail 540 may be provided in a second plane on a second side of the third switch 460 opposite the first side.

[0077] The fourth switch 465 can be connected to an inner layer of the positive DC rail 530 to receive positive DC power. The second AC tab 422 can receive AC power from the fourth switch 465. The power module can include a first AC rail 560 connected to an inner layer of the first substrate 515 and the second AC tab 422. The power module 400 can include a second AC rail 570 connected to an inner layer of the second substrate 520, a first side of the fourth switch 465, a second side of the third switch 460, and the second AC tab 422.

[0078] Figure 6A 、 Figure 6B and Figure 6C Depicted are top and bottom views of an exemplary power module according to one or more embodiments. Figure 6A A top view of the power module 600 is depicted with the first substrate 515 removed. For simplicity, the power module 400 (see Figure 4 ) and the power module 600 may contain many similarities that will not be discussed. The power module 600 may include a DC terminal group 610, which may be similar to Figure 4 The DC tab group 410 in the power module 600 may include a negative DC tab 611 and a positive DC tab 612. The positive DC tab 612 may be connected to (or integrated with) a positive DC rail 630.

[0079] The power module 600 may include a first switch 651, which includes a transistor. The power module 600 may include a second switch 652, which includes a transistor. The power module 600 may include a third switch 653, which includes a transistor. The power module 600 may include a fourth switch 654, which includes a transistor. The power module 600 may include a fifth switch 655, which includes a transistor. The power module 600 may include a sixth switch 656, which includes a transistor.

[0080] The power module 600 may include an AC lug group 620. The AC lug group 620 may include a first AC lug 621, a second AC lug 622, and a third AC lug 623. The first AC lug 621 may receive first-phase AC power from a first switch 651 and a second switch 652. The second AC lug 622 may receive second-phase AC power from a third switch 653 and a fourth switch 654. The third AC lug 623 may receive third-phase AC power from a fifth switch 655 and a sixth switch 656.

[0081] Figure 6B A top view of a power module 600 is depicted. Figure 5 , the power module 600 may include a first substrate 515 and a second substrate 520 . Figure 6C A bottom view of the power module 600 is depicted with the second substrate 520 and switches (e.g., the first switch 651, the second switch 652, the third switch 653, the fourth switch 654, the fifth switch 655, and the sixth switch 656) removed. The negative DC tab 611 can be connected to (or integrated with) the negative DC rail 640.

[0082] Figure 7A 、 Figure 7B 、 Figure 7C and Figure 7D Depicted are top and bottom views of an exemplary power module according to one or more embodiments. Figure 7A A top view of the power module 700 is depicted. Figure 5 , the power module 700 may include a first substrate 515 and a second substrate 520 . Figure 7B A top view of the power module 700 is depicted with the first substrate 515 removed. For simplicity, the power module 400 (see Figure 4 ) and power module 700 may contain many similarities that will not be discussed.

[0083] The power module 700 may include a DC tab group 710, which may be similar to Figure 4 The DC tab group 410 in the power module 700 is shown. The DC tab group 710 of the power module 700 may include a negative DC tab 711, a first positive DC tab 712, and a second positive DC tab 713. The negative DC tab 711 may include a Kelvin pin 737. The first positive DC tab 712 may include a Kelvin pin 738. The second positive DC tab 713 may include a Kelvin pin 736. The first positive DC tab 712 and the second positive DC tab 713 may be connected to the positive DC rail 730.

[0084] Figure 7C A bottom view of the power module 700 is depicted with the second baseplate 520 removed. The negative DC tab 711 may be connected to (or integrated with) the negative DC rail 740 . Figure 7D A bottom view of the power module 700 is depicted with the second substrate 520 and switches (eg, the first switch 450 , the second switch 455 , the third switch 460 , the fourth switch 465 , the fifth switch 470 , and the sixth switch 475 ) removed.

[0085] Figure 8A 、 Figure 8B 、 Figure 8C and Figure 8D Depicted are top and bottom views of an exemplary power module according to one or more embodiments. Figure 8A A top view of a power module 800 is depicted. Figure 5 , the power module 800 may include a first substrate 515 and a second substrate 520 . Figure 8B A top view of the power module 800 is depicted with the first substrate 515 removed. For simplicity, the power module 400 (see Figure 4 ) and the power module 800 may contain many similarities that will not be discussed. The power module 800 may include a DC terminal group 810, which may be similar to Figure 4 The DC tab group 410 in the power module 800 can include a first negative DC tab 811, a positive DC tab 812, and a second negative DC tab 813. The first negative DC tab 811 can include a Kelvin pin 836. The positive DC tab 812 can include a Kelvin pin 837. The second negative DC tab 813 can include a Kelvin pin 838. The positive DC tab 812 can be connected to (or integrated with) the positive DC rail 830.

[0086] Figure 8C A bottom view of the power module 800 is depicted with the second base plate 520 removed. A first negative DC tab 811 and a second negative DC tab 813 may be connected to a negative DC rail 840 . Figure 8D A bottom view of the power module 800 is depicted with the second substrate 520 and switches (eg, the first switch 450 , the second switch 455 , the third switch 460 , the fourth switch 465 , the fifth switch 470 , and the sixth switch 475 ) removed.

[0087] One or more embodiments may include an internal arrangement of DC+ and DC- leads that overlap over a portion of their respective areas. The overlapping portion may result in a reduced stray inductance of the electrical connection, which may be advantageous for higher switching speeds and higher efficiency. One or more embodiments may include a 12-die configuration (e.g., two dies per phase). If higher current capacity is required, one or more embodiments may include 6 dies per power module (e.g., a minimum of one die per phase) or 18 dies per power module (e.g., three dies per phase) or more.

[0088] One or more embodiments may include an area per die that may be reduced (e.g., from approximately 28 mm 2 Reduced to about 15mm 2 ) to fine-tune the current capacity based on vehicle requirements. One or more embodiments may include a design compatible with embedded decoupling capacitors mounted between the DC+ and DC- leads within the inter-DBM volume (e.g., closest to the die) to achieve higher switching speeds and improve efficiency.

[0089] One or more embodiments may provide advantages including high compactness, high power density, reduced stray inductance for improved efficiency, and a low-cost and scalable solution for low power applications (e.g., Class A to C vehicles). One or more embodiments may provide improvements including reduced cost of the complete power module compared to some power module designs with six power switches, and reduced efficiency of power module switching losses due to the high switching speed capability allowed by low stray inductance (and optional embedded decoupling capacitors). One or more embodiments may include a current density of approximately 4 Arms / mm 2 A design in which the pressure drop allocated to the power module can be concentrated on a smaller heat sink, and thus a higher heat transfer coefficient can be achieved. One or more embodiments may include a 3D printed heat sink (e.g., removing the thermal interface material layer on both sides) and a double-sided sintered die. One or more embodiments may provide a power module with high power density that is compatible with A to C class vehicles.

[0090] Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. It is intended that the specification and examples be considered exemplary only, with the true scope and spirit of the invention being indicated by the following claims.

Claims

1. A system, comprising: An inverter, configured to convert direct current from a battery into alternating current to drive a motor, wherein the inverter comprises: A power module, comprising: one or more first switches, the one or more first switches being configured to receive positive direct current to generate the alternating current; a positive DC rail, configured to provide the positive DC power to the one or more first switches; one or more positive DC lugs connected to the positive DC rail; one or more second switches, the one or more second switches being configured to receive negative direct current to generate the alternating current; a negative DC rail, configured to provide the negative DC power to the one or more second switches; one or more negative DC lugs connected to the negative DC rail; and one or more AC power lugs, the one or more AC power lugs configured to receive the AC power from the one or more first switches and the one or more second switches, The positive DC rail is provided in a first plane on a first side of the one or more first switches and the one or more second switches, and the negative DC rail is provided in a second plane on a second side of the one or more first switches and the one or more second switches opposite to the first side.

2. The system according to claim 1, wherein: The one or more AC lugs include: a first AC lug for connecting to a first phase of the motor; a second AC lug for connecting to a second phase of the motor; and A third AC terminal lug is used to connect to a third phase of the motor.

3. The system according to claim 1, wherein: The one or more first switches include a first transistor and a second transistor configured to generate a single phase of the alternating current.

4. The system according to claim 1, wherein: The one or more positive DC lugs include: a first positive DC power lug connected to the positive DC rail; and a second positive DC lug connected to the positive DC rail; and Wherein, the one or more negative DC terminals include: A first negative DC tab is connected to the negative DC rail and is disposed between the first positive DC tab and the second positive DC tab.

5. The system according to claim 1, wherein: The one or more negative DC lugs include: a first negative DC lug connected to the negative DC rail; and a second negative DC lug connected to the negative DC rail; and Wherein, the one or more positive DC terminals include: A first positive DC tab is connected to the positive DC rail and is disposed between the first negative DC tab and the second negative DC tab.

6. The system according to claim 1, wherein: The power module further includes a high-side gate pin and a low-side gate pin.

7. The system according to claim 1, wherein: The one or more positive DC tabs and the one or more negative DC tabs are disposed on a side of the power module opposite to the one or more AC tabs.

8. The system according to claim 1, wherein: The inverter also includes one or more heat sinks for the power modules.

9. The system according to claim 1, further comprising: the battery, the battery being configured to supply the DC power to the inverter; as well as The motor is configured to receive the AC power from the inverter to drive the motor, wherein the system is provided as a vehicle including the inverter, the battery, and the motor.

10. A system comprising a power module for an inverter, the power module comprising: a positive DC rail for providing positive DC power, the positive DC rail comprising an inner layer and an outer layer; A negative DC rail for providing negative DC power, the negative DC rail comprising an inner layer and an outer layer, wherein: The inner layer of the negative DC rail faces the inner layer of the positive DC rail, such that at least a portion of the negative DC rail overlaps the positive DC rail; a first switch connected to the inner layer of the positive DC rail to receive the positive DC power; a second switch connected to the inner layer of the negative DC rail to receive the negative DC power; and One or more AC power lugs for receiving AC power from the first switch and the second switch.

11. The system according to claim 10, wherein: The power module further includes: a first substrate, the first substrate comprising an inner layer and an outer layer, wherein the inner layer of the first substrate is connected to the outer layer of the positive DC rail; a second substrate, the second substrate comprising an inner layer and an outer layer, wherein the inner layer of the second substrate is connected to the outer layer of the negative DC rail; a first AC rail connected to the inner layer of the first substrate, a first side of the first switch, and the one or more AC lugs; and A second AC rail is connected to the inner layer of the second substrate, a second side of the second switch, and the one or more AC lugs.

12. The system according to claim 10, wherein: The power module further includes: a third switch connected to the inner layer of the positive DC rail to receive positive DC power; and a fourth switch connected to the inner layer of the negative DC rail to receive negative DC power, The die plane orientation of the third switch is the same as the die plane orientation of the first switch, and the die plane orientation of the fourth switch is the same as the die plane orientation of the second switch.

13. The system according to claim 12, wherein: The power module further includes: a fifth switch connected to the inner layer of the positive DC rail to receive positive DC power; and a sixth switch connected to the inner layer of the negative DC rail to receive negative DC power, The die plane orientation of the fifth switch is the same as the die plane orientation of the first switch, and the die plane orientation of the sixth switch is the same as the die plane orientation of the second switch.

14. The system of claim 13, wherein: The first switch and the second switch generate a first phase of the alternating current; The third switch and the fourth switch generate a second phase of the alternating current; and The fifth switch and the sixth switch generate a third phase of the alternating current.

15. The system according to claim 14, wherein: The one or more AC lugs include: a first AC power lug for receiving the first phase of the AC power and for connecting to a first phase of a motor; a second AC power lug for receiving the second phase of the AC power and for connecting to a second phase of the motor; and A third AC power lug is configured to receive the third phase of the AC power and to be connected to a third phase of the motor.

16. The system according to claim 10, wherein: The power module further includes a high-side gate pin and a low-side gate pin.

17. The system according to claim 10, wherein: The first switch includes a first transistor and a second transistor configured to generate a single phase of the alternating current.

18. A system comprising a power module, the power module comprising: one or more first switches configured to receive positive direct current to generate alternating current; a positive DC rail, the positive DC rail being used to provide positive DC power to the one or more first switches; one or more positive DC lugs connected to the positive DC rail; one or more second switches, the one or more second switches being configured to receive negative direct current to generate the alternating current; a negative DC rail, configured to provide negative DC power to the one or more second switches; one or more negative DC lugs connected to the negative DC rail; and one or more AC power lugs, the one or more AC power lugs configured to receive the AC power from the one or more first switches and the one or more second switches, The positive DC rail is provided in a first plane on a first side of the one or more first switches and the one or more second switches, and the negative DC rail is provided in a second plane on a second side of the one or more first switches and the one or more second switches opposite to the first side.

19. The system of claim 18, further comprising: a battery configured to supply the positive direct current and the negative direct current to the power module; a motor configured to receive the alternating current from the power module to drive the motor, The system is configured as a vehicle including the power module, the battery, and the motor.

20. The system of claim 18, wherein: The alternating current is provided in one or more phases.

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