Silicon-based fluororesin composite material adaptive to large-breadth industrial printing and preparation method of silicon-based fluororesin composite material

Abstract

The invention discloses a silicon-based fluororesin composite material adaptive to large-breadth industrial printing and a preparation method of the silicon-based fluororesin composite material, and belongs to the technical field of preparation of industrial printing resin films. According to the composite material, a plurality of combination modes of the punching base material layer, the high-release fluororesin film layer and / or the polydimethylsiloxane layer are utilized, so that the technical problem that in the prior art, a breathable release composite material is prone to collapse during large-format printing can be solved; and meanwhile, industrial printing with a larger breadth can be achieved in an interlayer stacking mode, and the printing cost is greatly reduced while the mechanical property of the printing base material is improved. According to the preparation method, the high-release fluororesin film layer is specially selected to achieve a high-release effect; the punching base material is selected to play a role in mechanical supporting and enhancing, so that the requirement of large industrial breadth is met; and the polydimethylsiloxane layer is selected, so that the air permeability is good, the effects of uniform air pressure mixing, throttling and flow equalizing can be ensured, and the air flow of each hole is ensured to be the same.

Description

Technical Field

[0001] The present invention belongs to the technical field of preparation of industrial printing resin films, and specifically relates to a silicon-based fluororesin composite material suitable for large-scale industrial printing and a preparation method thereof. Background Art

[0002] In the field of modern printing technology, the application size of traditional printing films is mostly limited to (360X250mm) or smaller sizes (such as 300×210mm), and their materials are mostly polymer films such as perfluoroethylene propylene copolymer (FEP) and fusible polytetrafluoroethylene (PFA).

[0003] With the increasing demand for large-format industrial printing in fields such as intelligent industrial manufacturing, automotive design, and fast-moving consumer goods, the market's requirements for the format of printing films have gradually increased. However, the increase in format poses a severe challenge to the mechanical properties of printing films: on the one hand, large-scale film materials are prone to warping and sinking during the printing process due to their lack of rigidity, resulting in reduced page flatness, causing problems such as printing defects or failures; on the other hand, to meet the deformation resistance requirements under large sizes, existing technologies usually increase the mechanical strength by increasing the film thickness (such as from the conventional 100μm to 150μm or more), but this directly leads to a significant increase in material costs (increased thickness increases raw material consumption and increases processing difficulty). At the same time, the flexibility of thick films decreases, further limiting their applicability in large-format printing equipment.

[0004] At present, there is no breathable film material on the market that meets the requirements of industrial-grade large-format printing. The core reason is that the existing conventional breathable release materials have insufficient tensile strength in large formats, high molding process difficulty, and uneven internal stress distribution.

[0005] Therefore, how to achieve the high flatness and high mechanical strength required for large-format printing while ensuring the low cost of film materials has become a key bottleneck restricting the technological development in this field. Summary of the Invention

[0006] The first purpose of the present invention is to provide a silicon-based fluororesin composite material suitable for large-format industrial printing. The composite material is obtained by utilizing a variety of combinations of perforated substrate layers, high-release fluororesin film layers and / or polydimethylsiloxane layers to solve the technical problem of easy collapse of breathable release composite materials in large-format printing in the prior art. At the same time, it can also achieve larger-format industrial printing by stacking layers, thereby greatly reducing printing costs while improving the mechanical properties of the printing substrate.

[0007] The second purpose of the present invention is to provide a method for preparing a silicon-based fluororesin composite material suitable for large-format industrial printing. A high-release fluororesin film layer is specially selected to play a high-release role; a perforated substrate is selected to play a mechanical support and reinforcement role, so as to be more suitable for the needs of industrial large-format printing; a polydimethylsiloxane layer is selected, which has good air permeability, can ensure uniform air pressure mixing, throttling and equalizing flow, and ensure that the air flow rate of each hole is the same.

[0008] The present invention is achieved through the following technical solutions:

[0009] A silicon-based fluororesin composite material suitable for large-format industrial printing, the composite material comprising a perforated substrate layer, a high-release fluororesin film layer and / or a polydimethylsiloxane layer;

[0010] The large format refers to a size not less than 500×600mm.

[0011] Since the substrate processing pore size has a significant impact on the processing equipment and substrate, and the processed pore size is much larger than the gap between the molecular structures of the material, it is currently difficult to uniformly control the airflow rate of each pore. This application uses a polydimethylsiloxane layer (PDMS resin layer) added in the middle to control the thickness of the PDMS resin layer, the substrate processing pore size, and the gas pressure to control the airflow rate of each pore to achieve a balanced airflow. PDMS plays a role in throttling and constant pressure in the design.

[0012] Preferably, the composite material includes the following composite methods:

[0013] High release fluororesin film layer-perforated substrate layer;

[0014] Or, high release fluororesin film layer-perforated substrate layer-polydimethylsiloxane layer;

[0015] Or, high release fluororesin film layer-perforated substrate layer I-polydimethylsiloxane layer-perforated substrate layer II;

[0016] Or, high release fluororesin film layer-perforated substrate layer I-polydimethylsiloxane layer I-perforated substrate layer II-polydimethylsiloxane layer II;

[0017] Or, high-release fluororesin film layer-polydimethylsiloxane layer I-perforated substrate layer I-polydimethylsiloxane layer II-perforated substrate layer II-polydimethylsiloxane layer III.

[0018] A method for preparing a silicon-based fluororesin composite material suitable for large-format industrial printing, wherein the composite material is a double-layer composite of a high-release fluororesin film layer and a perforated substrate layer, comprising the following steps:

[0019] The substrate is selected and arranged in an array, and then the surface of the substrate is treated and coated with fluororesin, scraped flat, dried, and cooled to room temperature.

[0020] The inner diameter of the holes in the perforated substrate layer is 10 to 600 μm.

[0021] A method for preparing a silicon-based fluororesin composite material suitable for large-format industrial printing, wherein the composite method is a three-layer composite of a high-release fluororesin film layer, a perforated substrate layer, and a polydimethylsiloxane layer, comprising the following steps:

[0022] S1. Select a substrate and arrange holes in an array, then treat the surface of the substrate and apply a polydimethylsiloxane layer, dry it, and cool it to room temperature to obtain a composite material of a perforated substrate layer and a polydimethylsiloxane layer;

[0023] S2. Coat the other side of the perforated substrate layer of the composite material obtained in S1 with a high-release fluororesin, flatten it, dry it, and cool it to room temperature.

[0024] The inner diameter of the holes in the perforated substrate layer is 10 to 600 μm.

[0025] A method for preparing a silicon-based fluororesin composite material suitable for large-format industrial printing, comprising a four-layer composite of a high-release fluororesin film layer, a perforated substrate layer I, a polydimethylsiloxane layer, and a perforated substrate layer II, comprising the following steps:

[0026] S1. Select a substrate and arrange holes in an array, then treat the surface of the substrate and apply a polydimethylsiloxane layer, dry it, and cool it to room temperature to obtain a composite material of a polydimethylsiloxane layer and a perforated substrate layer II;

[0027] S2. Coating a high-release fluororesin on one side of the perforated substrate layer 1, flattening, drying, and cooling to room temperature to obtain a composite material of a high-release fluororesin film layer and a perforated substrate layer 1;

[0028] S3, compounding the high-release fluororesin film layer-perforated substrate layer II composite material of S2 and the polydimethylsiloxane layer-perforated substrate layer I composite material of S1 by resin bulk curing and bonding, and cooling to complete;

[0029] The inner diameter of the holes in the perforated substrate layer is 10 to 600 μm.

[0030] A method for preparing a silicon-based fluororesin composite material suitable for large-format industrial printing, comprising a five-layer composite of a high-release fluororesin film layer, a perforated substrate layer I, a polydimethylsiloxane layer I, a perforated substrate layer II, and a polydimethylsiloxane layer II, comprising the following steps:

[0031] S1. Select a substrate and arrange holes in an array, then treat the surface of the substrate and apply a polydimethylsiloxane layer, dry it, and cool it to room temperature to obtain a composite material of perforated substrate layer I and polydimethylsiloxane layer I;

[0032] S2. Coating a high-release fluororesin on the other side of the perforated substrate layer I of the composite material obtained in S1, flattening, drying, and cooling to room temperature to obtain a high-release fluororesin film layer-perforated substrate layer I-polydimethylsiloxane layer I composite material;

[0033] S3, selecting a substrate and arranging holes in an array, then treating the surface of the substrate and coating it with a polydimethylsiloxane layer, drying it, and cooling it to room temperature to obtain a composite material of perforated substrate layer II and polydimethylsiloxane layer II;

[0034] S4, compounding the high-release fluororesin film layer-perforated substrate layer I-polydimethylsiloxane layer I composite material of S2 and the perforated substrate layer II-polydimethylsiloxane layer II composite material of S3 by resin bulk curing and bonding, and cooling to complete;

[0035] The inner diameter of the holes in the perforated substrate layer is 10 to 600 μm.

[0036] A method for preparing a silicon-based fluororesin composite material suitable for large-format industrial printing, comprising a six-layer composite of a high-release fluororesin film layer, a polydimethylsiloxane layer I, a perforated substrate layer I, a polydimethylsiloxane layer II, a perforated substrate layer II, and a polydimethylsiloxane layer III, comprising the following steps:

[0037] S1. Select a substrate and arrange holes in an array, then treat the surface of the substrate and apply a polydimethylsiloxane layer, dry it, and cool it to room temperature to obtain a composite material of a perforated substrate layer I and a polydimethylsiloxane layer II;

[0038] S2, coating the polydimethylsiloxane layer I on the other side of the perforated substrate layer I of S1, drying, and cooling to room temperature to obtain polydimethylsiloxane layer I-perforated substrate layer I-polydimethylsiloxane layer II;

[0039] S3, coating a high-release fluororesin on the side of the polydimethylsiloxane layer I of S2, flattening, drying, and cooling to room temperature to obtain a high-release fluororesin film layer-polydimethylsiloxane layer I-perforated substrate layer I-polydimethylsiloxane layer II composite material;

[0040] S4. Select a substrate and arrange holes in an array, then treat the surface of the substrate and apply a polydimethylsiloxane layer, dry it, and cool it to room temperature to obtain a composite material of a perforated substrate layer II and a polydimethylsiloxane layer III;

[0041] S5, compounding the high-release fluororesin film layer-polydimethylsiloxane layer I-perforated substrate layer I-polydimethylsiloxane layer II composite material of S3 with the perforated substrate layer II-polydimethylsiloxane layer III composite material of S4 by resin bulk curing and bonding, and cooling to complete;

[0042] The inner diameter of the holes in the perforated substrate layer is 10 to 600 μm.

[0043] Preferably, the perforated substrate is a glass or transparent film substrate;

[0044] The transparent film substrate includes any one of polycarbonate, polymethyl methacrylate, acrylic, polypropylene, and tetrafluoroethylene-hexafluoropropylene copolymer;

[0045] The thickness of the perforated substrate is 1 to 5 mm.

[0046] Preferably, the specific process of treating the substrate surface is: treating by physical method or chemical method;

[0047] The physical method includes using high-energy particles generated by plasma to bombard the surface of the substrate to complete the etching of the substrate surface;

[0048] The chemical treatment includes using a strong oxidant to oxidize the surface of the substrate to activate the surface of the substrate.

[0049] Compared with the prior art, the present invention has at least the following technical effects:

[0050] The present invention provides a silicon-based fluororesin composite material suitable for large-format industrial printing. The composite material is obtained by utilizing a plurality of combinations of a perforated substrate layer, a high-release fluororesin film layer and / or a polydimethylsiloxane layer to solve the technical problem of easy collapse of breathable release composite materials in the prior art during large-format printing. At the same time, it can also achieve even larger-format industrial printing by stacking layers, thereby greatly reducing printing costs while improving the mechanical properties of the printed substrate.

[0051] This method for preparing a silicon-based fluororesin composite material suitable for large-format industrial printing specifically selects a high-release fluororesin film layer to achieve a high-release effect; selects a perforated substrate to provide mechanical support and reinforcement to better meet the needs of industrial large-format printing; and selects a polydimethylsiloxane layer, which has good air permeability, can ensure uniform air pressure mixing, throttling and equalizing flow, and ensure that the air flow rate of each hole is the same. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] Figure 1 Schematic diagram of the interlayer structure of Example 1;

[0053] Figure 2 Schematic diagram of the interlayer structure of Example 2;

[0054] Figure 3 Schematic diagram of the interlayer structure of Example 3;

[0055] Figure 4 Schematic diagram of the interlayer structure of Example 4;

[0056] Figure 5 Schematic diagram of the interlayer structure of Example 5.

[0057] In the figure, 1-high release fluororesin film layer; 2-perforated substrate layer; 3-polydimethylsiloxane layer. DETAILED DESCRIPTION

[0058] The embodiments of the present invention will be described in detail below with reference to the examples. However, those skilled in the art will understand that the following examples are only used to illustrate the present invention and should not be construed as limiting the scope of the present invention. Specific conditions not specified in the examples are carried out according to conventional conditions or conditions recommended by the manufacturer. Reagents or instruments used without indicating the manufacturer are all conventional products that can be purchased commercially.

[0059] Example 1: Figure 1 As shown, it is a schematic diagram of the double-layer composite interlayer structure:

[0060] A method for preparing a silicon-based fluororesin composite material suitable for large-format industrial printing, wherein the composite material is a double-layer composite of a high-release fluororesin film layer and a perforated substrate layer, comprising the following steps:

[0061] The substrate is selected and arranged in an array, and then the surface of the substrate is treated and coated with fluororesin, scraped flat, dried, and cooled to room temperature.

[0062] The inner diameter of the holes in the perforated substrate layer is 10 to 600 μm.

[0063] Example 2: Figure 2 As shown, this is a schematic diagram of the three-layer composite interlayer structure:

[0064] A method for preparing a silicon-based fluororesin composite material suitable for large-format industrial printing, wherein the composite method is a three-layer composite of a high-release fluororesin film layer, a perforated substrate layer, and a polydimethylsiloxane layer, comprising the following steps:

[0065] S1. Select a substrate and arrange holes in an array, then treat the surface of the substrate and apply a polydimethylsiloxane layer, dry it, and cool it to room temperature to obtain a composite material of a perforated substrate layer and a polydimethylsiloxane layer;

[0066] S2. Coat the other side of the perforated substrate layer of the composite material obtained in S1 with a high-release fluororesin, flatten it, dry it, and cool it to room temperature.

[0067] The inner diameter of the holes in the perforated substrate layer is 10 to 600 μm.

[0068] Example 3: Figure 3 As shown, this is a schematic diagram of the four-layer composite interlayer structure:

[0069] A method for preparing a silicon-based fluororesin composite material suitable for large-format industrial printing, comprising a four-layer composite of a high-release fluororesin film layer, a perforated substrate layer I, a polydimethylsiloxane layer, and a perforated substrate layer II, comprising the following steps:

[0070] S1. Select a substrate and arrange holes in an array, then treat the surface of the substrate and apply a polydimethylsiloxane layer, dry it, and cool it to room temperature to obtain a composite material of a polydimethylsiloxane layer and a perforated substrate layer II;

[0071] S2. Coating a high-release fluororesin on one side of the perforated substrate layer 1, flattening, drying, and cooling to room temperature to obtain a composite material of a high-release fluororesin film layer and a perforated substrate layer 1;

[0072] S3, compounding the high-release fluororesin film layer-perforated substrate layer II composite material of S2 and the polydimethylsiloxane layer-perforated substrate layer I composite material of S1 by resin bulk curing and bonding, and cooling to complete;

[0073] The inner diameter of the holes in the perforated substrate layer is 10 to 600 μm.

[0074] Example 4: Figure 4 As shown, this is a schematic diagram of the five-layer composite interlayer structure:

[0075] A method for preparing a silicon-based fluororesin composite material suitable for large-format industrial printing, comprising a five-layer composite of a high-release fluororesin film layer, a perforated substrate layer I, a polydimethylsiloxane layer I, a perforated substrate layer II, and a polydimethylsiloxane layer II, comprising the following steps:

[0076] S1. Select a substrate and arrange holes in an array, then treat the surface of the substrate and apply a polydimethylsiloxane layer, dry it, and cool it to room temperature to obtain a composite material of perforated substrate layer I and polydimethylsiloxane layer I;

[0077] S2. Coating a high-release fluororesin on the other side of the perforated substrate layer I of the composite material obtained in S1, flattening, drying, and cooling to room temperature to obtain a high-release fluororesin film layer-perforated substrate layer I-polydimethylsiloxane layer I composite material;

[0078] S3, selecting a substrate and arranging holes in an array, then treating the surface of the substrate and coating it with a polydimethylsiloxane layer, drying it, and cooling it to room temperature to obtain a composite material of perforated substrate layer II and polydimethylsiloxane layer II;

[0079] S4, compounding the high-release fluororesin film layer-perforated substrate layer I-polydimethylsiloxane layer I composite material of S2 and the perforated substrate layer II-polydimethylsiloxane layer II composite material of S3 by resin bulk curing and bonding, and cooling to complete;

[0080] The inner diameter of the holes in the perforated substrate layer is 10 to 600 μm.

[0081] Example 5: Figure 5 As shown, this is a schematic diagram of the six-layer composite interlayer structure:

[0082] A method for preparing a silicon-based fluororesin composite material suitable for large-format industrial printing, comprising a six-layer composite of a high-release fluororesin film layer, a polydimethylsiloxane layer I, a perforated substrate layer I, a polydimethylsiloxane layer II, a perforated substrate layer II, and a polydimethylsiloxane layer III, comprising the following steps:

[0083] S1. Select a substrate and arrange holes in an array, then treat the surface of the substrate and apply a polydimethylsiloxane layer, dry it, and cool it to room temperature to obtain a composite material of a perforated substrate layer I and a polydimethylsiloxane layer II;

[0084] S2, coating the polydimethylsiloxane layer I on the other side of the perforated substrate layer I of S1, drying, and cooling to room temperature to obtain polydimethylsiloxane layer I-perforated substrate layer I-polydimethylsiloxane layer II;

[0085] S3, coating a high-release fluororesin on the side of the polydimethylsiloxane layer I of S2, flattening, drying, and cooling to room temperature to obtain a high-release fluororesin film layer-polydimethylsiloxane layer I-perforated substrate layer I-polydimethylsiloxane layer II composite material;

[0086] S4. Select a substrate and arrange holes in an array, then treat the surface of the substrate and apply a polydimethylsiloxane layer, dry it, and cool it to room temperature to obtain a composite material of a perforated substrate layer II and a polydimethylsiloxane layer III;

[0087] S5, compounding the high-release fluororesin film layer-polydimethylsiloxane layer I-perforated substrate layer I-polydimethylsiloxane layer II composite material of S3 with the perforated substrate layer II-polydimethylsiloxane layer III composite material of S4 by resin bulk curing and bonding, and cooling to complete;

[0088] The inner diameter of the holes in the perforated substrate layer is 10 to 600 μm.

[0089] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the scope of protection of the present invention.

Claims

1. A silicon-based fluororesin composite material suitable for large-format industrial printing, characterized in that: The composite material is composed of a perforated substrate layer, a high-release fluororesin film layer and / or a polydimethylsiloxane layer; The large format refers to a size not less than 500×600mm.

2. The silicon-based fluororesin composite material suitable for large-format industrial printing according to claim 1, characterized in that: The composite material includes the following composite methods: High release fluororesin film layer-perforated substrate layer; Or, high release fluororesin film layer-perforated substrate layer-polydimethylsiloxane layer; Or, high release fluororesin film layer-perforated substrate layer I-polydimethylsiloxane layer-perforated substrate layer II; Or, high release fluororesin film layer-perforated substrate layer I-polydimethylsiloxane layer I-perforated substrate layer II-polydimethylsiloxane layer II; Or, high-release fluororesin film layer-polydimethylsiloxane layer I-perforated substrate layer I-polydimethylsiloxane layer II-perforated substrate layer II-polydimethylsiloxane layer III.

3. A method for preparing a silicon-based fluororesin composite material suitable for large-format industrial printing as claimed in claim 2, characterized in that: The composite method is a double-layer composite of a high-release fluororesin film layer and a perforated substrate layer, including the following steps: The substrate is selected and arranged in an array, and then the surface of the substrate is treated and coated with fluororesin, scraped flat, dried, and cooled to room temperature. The inner diameter of the holes in the perforated substrate layer is 10 to 600 μm.

4. A method for preparing a silicon-based fluororesin composite material suitable for large-format industrial printing as claimed in claim 2, characterized in that: When the lamination method is a three-layer lamination of a high-release fluororesin film layer, a perforated substrate layer, and a polydimethylsiloxane layer, the following steps are included: S1. Select a substrate and arrange holes in an array, then treat the surface of the substrate and apply a polydimethylsiloxane layer, dry it, and cool it to room temperature to obtain a composite material of a perforated substrate layer and a polydimethylsiloxane layer; S2. Coat the other side of the perforated substrate layer of the composite material obtained in S1 with a high-release fluororesin, flatten it, dry it, and cool it to room temperature. The inner diameter of the holes in the perforated substrate layer is 10 to 600 μm.

5. A method for preparing a silicon-based fluororesin composite material suitable for large-format industrial printing as claimed in claim 2, characterized in that: The composite method is a four-layer composite of a high-release fluororesin film layer, a perforated substrate layer I, a polydimethylsiloxane layer, and a perforated substrate layer II, including the following steps: S1. Select a substrate and arrange holes in an array, then treat the surface of the substrate and apply a polydimethylsiloxane layer, dry it, and cool it to room temperature to obtain a composite material of a polydimethylsiloxane layer and a perforated substrate layer II; S2. Coating a high-release fluororesin on one side of the perforated substrate layer 1, flattening, drying, and cooling to room temperature to obtain a composite material of a high-release fluororesin film layer and a perforated substrate layer 1; S3, compounding the high-release fluororesin film layer-perforated substrate layer II composite material of S2 and the polydimethylsiloxane layer-perforated substrate layer I composite material of S1 by resin bulk curing and bonding, and cooling to complete; The inner diameter of the holes in the perforated substrate layer is 10 to 600 μm.

6. A method for preparing a silicon-based fluororesin composite material suitable for large-format industrial printing as claimed in claim 2, characterized in that: The composite method is a five-layer composite of a high-release fluororesin film layer-perforated substrate layer I-polydimethylsiloxane layer I-perforated substrate layer II-polydimethylsiloxane layer II, including the following steps: S1. Select a substrate and arrange holes in an array, then treat the surface of the substrate and apply a polydimethylsiloxane layer, dry it, and cool it to room temperature to obtain a composite material of perforated substrate layer I and polydimethylsiloxane layer I; S2. Coating a high-release fluororesin on the other side of the perforated substrate layer I of the composite material obtained in S1, flattening, drying, and cooling to room temperature to obtain a high-release fluororesin film layer-perforated substrate layer I-polydimethylsiloxane layer I composite material; S3, selecting a substrate and arranging holes in an array, then treating the surface of the substrate and coating it with a polydimethylsiloxane layer, drying it, and cooling it to room temperature to obtain a composite material of perforated substrate layer II and polydimethylsiloxane layer II; S4, compounding the high-release fluororesin film layer-perforated substrate layer I-polydimethylsiloxane layer I composite material of S2 and the perforated substrate layer II-polydimethylsiloxane layer II composite material of S3 by resin bulk curing and bonding, and cooling to complete; The inner diameter of the holes in the perforated substrate layer is 10 to 600 μm.

7. A method for preparing a silicon-based fluororesin composite material suitable for large-format industrial printing as claimed in claim 2, characterized in that: The composite method is a six-layer composite of high-release fluororesin film layer-polydimethylsiloxane layer I-perforated substrate layer I-polydimethylsiloxane layer II-perforated substrate layer II-polydimethylsiloxane layer III, including the following steps: S1. Select a substrate and arrange holes in an array, then treat the surface of the substrate and apply a polydimethylsiloxane layer, dry it, and cool it to room temperature to obtain a composite material of a perforated substrate layer I and a polydimethylsiloxane layer II; S2, coating the polydimethylsiloxane layer I on the other side of the perforated substrate layer I of S1, drying, and cooling to room temperature to obtain polydimethylsiloxane layer I-perforated substrate layer I-polydimethylsiloxane layer II; S3, coating a high-release fluororesin on the side of the polydimethylsiloxane layer I of S2, flattening, drying, and cooling to room temperature to obtain a high-release fluororesin film layer-polydimethylsiloxane layer I-perforated substrate layer I-polydimethylsiloxane layer II composite material; S4. Select a substrate and arrange holes in an array, then treat the surface of the substrate and apply a polydimethylsiloxane layer, dry it, and cool it to room temperature to obtain a composite material of a perforated substrate layer II and a polydimethylsiloxane layer III; S5, compounding the high-release fluororesin film layer-polydimethylsiloxane layer I-perforated substrate layer I-polydimethylsiloxane layer II composite material of S3 with the perforated substrate layer II-polydimethylsiloxane layer III composite material of S4 by resin bulk curing and bonding, and cooling to complete; The inner diameter of the holes in the perforated substrate layer is 10 to 600 μm.

8. The method for preparing a silicon-based fluororesin composite material suitable for large-format industrial printing according to claim 3, characterized in that: The perforated substrate is a glass or transparent film substrate; The transparent film substrate includes any one of polycarbonate, polymethyl methacrylate, acrylic, polypropylene, and tetrafluoroethylene-hexafluoropropylene copolymer; The thickness of the perforated substrate is 1 to 5 mm.

9. The method for preparing a silicon-based fluororesin composite material suitable for large-format industrial printing according to claim 3, characterized in that: The specific process of treating the surface of the substrate is: treating by physical method or chemical method; The physical method includes using high-energy particles generated by plasma to bombard the surface of the substrate to complete the etching of the substrate surface; The chemical treatment includes using a strong oxidant to oxidize the surface of the substrate to activate the surface of the substrate.

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