Image sensor and related high-speed chip mounter

Abstract

The invention relates to the field of image interaction instruments, in particular to an image sensor and a related high-speed chip mounter. The high-speed chip mounter comprises a chip mounting main shaft, the chip mounting main shaft is rotationally connected to a hoisting mechanism, the hoisting mechanism is rotationally connected with the chip mounting main shaft, and a plurality of servo cylinders are fixedly installed on the side face of the chip mounting main shaft; a ventilation rod pushed by the servo air cylinder is slidably arranged in the servo air cylinder, a cooling water channel is formed in the servo air cylinder, an adsorption rotating disc is fixedly installed at the lower end of the ventilation rod, a heat dissipation mechanism is further installed on the chip mounting main shaft, and the heat dissipation mechanism is communicated with the second cooling water channel. Therefore, the problem that the heat dissipation efficiency is reduced due to the fact that the image sensor cannot be well matched with external heat dissipation equipment in the prior art can be solved.

Description

Technical Field

[0001] The present invention relates to the field of image interaction equipment, and in particular to an image sensor and a related high-speed placement machine. Background Art

[0002] An image sensor is a device that uses the photoelectric conversion function of a photoelectric device to convert the light image on the photosensitive surface into an electrical signal that is proportional to the light image. It is also called a photosensitive element.

[0003] Existing image sensors do not have the ability to dissipate heat on their own and require external equipment to assist in dissipating heat. However, the models of external heat dissipation equipment are often difficult to adapt to image sensors, resulting in reduced heat dissipation efficiency.

[0004] The placement machine is an automated equipment widely used in electronic manufacturing. Its main function is to place components accurately at the specified position on the printed circuit board. During use, a cylinder is often used to push the placement head to move for placement. However, the placement machine often moves at a fast speed, and a high-frequency friction is generated between the cylinder body of the servo cylinder and the rod of the push rod, thereby generating more heat. However, the heat generation is easy to cause deformation, which in turn affects the placement position of the placement head. At the same time, since the electronic components placed by the placement machine are often small in size, even slight deformation will still cause the electronic components to fail when they are installed. The traditional heat dissipation method is often to directly install an exhaust fan for heat dissipation, but the heat inside the servo cylinder is often difficult to be released immediately, and it is difficult to achieve a good heat dissipation effect. Summary of the Invention

[0005] The present invention provides an image sensor, which can solve the problem in the prior art that the image sensor and external heat dissipation equipment cannot be well adapted to each other, resulting in reduced heat dissipation efficiency.

[0006] An image processor includes an imaging film, which is embedded in a cooling plate. A first cooling water channel is provided in the cooling plate. The first cooling water channel includes a first liquid inlet, a water diversion channel, a heat dissipation channel, and a first liquid outlet. The first liquid inlet and the first liquid outlet are symmetrically arranged on both sides of the cooling plate. The first liquid inlet and the first liquid outlet are respectively connected to a water diversion channel, and a heat dissipation channel is connected between the two water diversion channels.

[0007] In a further solution, a plurality of water diversion channels are distributed side by side.

[0008] The above technical solution can effectively increase the heat dissipation area, thereby improving the heat dissipation efficiency.

[0009] A further embodiment of the high-speed placement machine is suitable for use with the image processor of claim 1 or 2, comprising:

[0010] Lifting mechanism and feeding mechanism;

[0011] A patch spindle, the patch spindle is rotatably connected to a hoisting mechanism, the hoisting mechanism is rotatably connected to the patch spindle, a plurality of servo cylinders are fixedly installed on the side of the patch spindle, a ventilation rod pushed by the servo cylinder is slidably provided in the servo cylinder, and a cooling water channel is opened in the servo cylinder;

[0012] The patch adsorption mechanism includes an adsorption seat, which is fixedly mounted on the lower end of the ventilation rod and has an adsorption turntable;

[0013] The heat dissipation mechanism is fixedly mounted on the patch spindle and is communicated with the second cooling water channel.

[0014] A detection device, which is used to detect components, is installed on the lifting mechanism.

[0015] During the rotation of the patch spindle, the servo cylinder will be driven to rotate, so that different adsorption seats will be moved to the position where the components to be patched are placed. The servo cylinder will then push the ventilation rod to move in the vertical direction, so that the components to be picked up can be picked up. At the same time, the ventilation rod can be connected to the external air pump, and the adsorption seat and the ventilation pipe are connected, so that the adsorption seat generates suction to pick up the material. The liquid flows through the water channel in the heat dissipation mechanism and the servo cylinder, so that the heat is taken out of the servo cylinder, and the heat will not accumulate in the servo cylinder, so that the accuracy of patch picking will not be affected by heat problems.

[0016] A further solution: the heat dissipation mechanism includes a heat dissipation fixed ring cover, the heat dissipation fixed ring cover is fixedly mounted on the side of the patch main shaft, a liquid inlet groove is provided in the heat dissipation fixed ring cover, the liquid inlet groove is communicated with the water channel in the servo cylinder, a liquid storage cavity is provided in the heat dissipation fixed ring cover, and a plurality of micro liquid pumps are fixedly installed on the heat dissipation fixed ring cover between the liquid inlet groove and the liquid storage cavity, a first auxiliary heat dissipation device is provided on the heat dissipation fixed ring cover, and the first auxiliary heat dissipation device is communicated with the water channel in the servo cylinder.

[0017] The heat dissipating liquid is extracted from the liquid storage chamber into the liquid inlet tank through a micro liquid pump, and then the heat dissipating liquid enters the water channel of the servo cylinder, and flows from the water channel of the servo cylinder to the first auxiliary heat dissipation device, where the heat is dissipated, and finally the heat dissipating liquid re-enters the liquid storage chamber. In the above technical solution, the heat generated in the servo motor is mainly generated by the repeated friction between the ventilation rod and the side wall of the servo motor. The water channel in the servo motor is closer to the heat generation position, so that the heat is directly taken away from the cylinder body. Compared with the traditional heat dissipation method of directly using a fan, the heat dissipation effect is more direct and efficient.

[0018] According to a further solution, the first auxiliary heat dissipation device includes an inclined heat dissipation plate, which is in a circular ring shape and is fixedly mounted on the heat dissipation fixing ring cover. The inclined heat dissipation plate and the heat dissipation fixing ring cover are inclined at a certain angle, the inclined heat dissipation plate is in communication with the liquid storage chamber, and the outer side of the inclined heat dissipation plate is in communication with the water channel in the servo cylinder through a pipeline.

[0019] In a further solution, a plurality of ventilation slots communicating with each other from top to bottom are processed on the inclined heat dissipation plate.

[0020] In a further solution, an upper end of the inclined heat dissipation plate is fixedly provided with inclined ventilation blades, and a plurality of the ventilation blades are evenly distributed along the circumference of the main axis of the patch.

[0021] In a further solution, the ventilation blades are hollow, and the interior of the ventilation blades is communicated with the upper end of the inclined heat dissipation plate.

[0022] According to a further solution, the detection device includes a detection fixing plate, which is arc-shaped, and has several image processors embedded circumferentially on the detection fixing plate. The detection fixing plate is processed with the liquid inlet and liquid outlet, the liquid inlet is connected to the first liquid inlet, and the liquid outlet is connected to the first liquid outlet.

[0023] In the process of inspecting components, in the process of collecting images of components through image processors and thus inspecting components, cooling liquid is injected and received from the image processor through the liquid inlet and outlet channels, thereby dissipating the heat of the image processor, thereby improving the working stability of the image processor. At the same time, when one of the image processors is damaged, the system will promptly replace it with another image processor to work, and transmit the information of the damaged image processor to the operator, which can effectively reduce the failure rate of the placement machine.

[0024] In a further solution, the adsorption turntable is rotatably connected to the lower end of the adsorption seat, and a plurality of adsorption nozzles of different specifications are circumferentially installed on the adsorption seat.

[0025] The servo motor drives the rotation of the adsorption seat, and different adsorption nozzles are used to adsorb the components of the patch, so it has a wider applicability.

[0026] Beneficial effects:

[0027] 1. The present invention allows liquid to flow through the water channels in the heat dissipation mechanism and the servo cylinder, thereby removing heat from the servo cylinder. This prevents heat from accumulating in the servo cylinder, and prevents the accuracy of patch picking from being affected by heat problems. At the same time, during the inspection process, the servo cylinder drives the components to pass through the inspection device, so that each component can be inspected to check whether there are defects.

[0028] 2. In the present invention, when the liquid enters the first auxiliary heat dissipation device, after the liquid absorbs heat, when it enters the inclined heat dissipation plate, the heat dissipation liquid will be spread over a larger area, and at the same time, the flow time of the cooling liquid is slowed down, thereby improving the heat dissipation effect.

[0029] 3. The present invention makes the liquid involved in heat dissipation a volatile liquid. After the heat dissipation liquid absorbs heat in the cylinder body of the servo cylinder, part of the liquid will evaporate to produce gas. When flowing through the inclined heat dissipation plate, this part of the gas will enter the ventilation blades. At the same time, since the ventilation blades will interact with more airflow, the gas will be liquefied and more heat will be released during the liquefaction process, thereby effectively improving the heat dissipation efficiency.

[0030] 4. The present invention injects and receives cooling liquid from the image processor through the liquid inlet and outlet channels during the process of detecting components and collecting images of the components through the image processor, thereby dissipating the heat of the image processor and improving the working stability of the image processor. At the same time, when one of the image processors is damaged, the system will promptly replace it with another image processor to work, and transmit the information of the damaged image processor to the operator, thereby effectively reducing the failure rate of the placement machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 Schematic diagram of the structure of the image sensor in the present invention;

[0032] Figure 2 It is a structural diagram of the high-speed placement machine in the present invention;

[0033] Figure 3 It is a structural schematic diagram of the high-speed placement machine of the present invention from another perspective;

[0034] Figure 4 Schematic diagram of the structure of the detection fixing plate in the present invention;

[0035] Figure 5 Schematic diagram of the structure of the imaging film in the present invention;

[0036] Figure 6 Schematic diagram of the structure of the heat dissipation mechanism of the present invention;

[0037] Figure 7 For the present invention Figure 6 Schematic diagram of the local structure at point A;

[0038] Figure 8 Schematic diagram of the structure of the detection device in the present invention.

[0039] Description of reference numerals:

[0040] 1. Imaging film; 11. Cooling plate; 12. First cooling water channel; 121. First liquid inlet; 122. Water distribution channel; 123. Heat dissipation channel; 124. First liquid outlet; 5. Patch spindle; 51. Servo cylinder; 52. Ventilation rod; 6. Patch adsorption mechanism; 61. Adsorption seat; 62. Adsorption turntable; 7. Heat dissipation mechanism; 71. Fixed ring cover; 711. Liquid inlet tank; 73. Micro liquid pump; 74. First auxiliary heat dissipation device; 741. Inclined heat dissipation plate; 7411. Ventilation slot; 742. Ventilation blades; 8. Detection device; 81. Detection fixing plate; 811. Liquid inlet channel; 812. Liquid outlet channel. DETAILED DESCRIPTION

[0041] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0042] like Figure 1 and Figure 5 As shown, the present invention provides an image processor, including an imaging film 1, characterized in that the imaging film 1 is embedded in a cooling plate 11, and a first cooling water channel 12 is opened in the cooling plate 11, and the first cooling water channel 12 includes a first liquid inlet 121, a water diversion channel 122, a heat dissipation channel 123 and a first liquid outlet 124, and the first liquid inlet 121 and the first liquid outlet 124 are symmetrically opened at positions on both sides of the cooling plate 11, and the first liquid inlet 121 and the first liquid outlet 124 are respectively connected to a water diversion channel 122, and a heat dissipation channel 123 is connected between the two water diversion channels 122.

[0043] It should be noted that during the operation of the image processor, heat dissipation liquid can be injected into the first liquid inlet 121, the heat dissipation liquid will enter the water diversion channel 122, and then the liquid will enter the heat dissipation channel 123, and absorb the heat generated by the imaging film 1 during the operation in the heat dissipation channel 123. Finally, the liquid that absorbs the heat will flow back into another water diversion channel 122 and flow out from the first liquid outlet 124.

[0044] The water diversion channels 122 are arranged in parallel in a plurality.

[0045] The above technical solution can effectively increase the heat dissipation area, thereby improving the heat dissipation efficiency.

[0046] like Figures 2 to 8 As shown, a high-speed chip mounter, which is suitable for the image processor of claim 1 or 2, comprises:

[0047] Lifting mechanism and feeding mechanism;

[0048] The patch spindle 5 is rotatably connected to the hoisting mechanism, and the patch spindle 5 is rotatably connected to the hoisting mechanism. A plurality of servo cylinders 51 are fixedly installed on the side of the patch spindle 5. A ventilation rod 52 is slidably provided in the servo cylinder 51 and is pushed by the servo cylinder 51. A cooling water channel is opened in the servo cylinder 51;

[0049] The patch adsorption mechanism 6 includes an adsorption seat 61 , which is fixedly mounted on the lower end of the ventilation rod 52 , and an adsorption turntable 62 is provided in the adsorption seat 61 ;

[0050] The heat dissipation mechanism 7 is fixedly mounted on the patch spindle 5 and is communicated with the second cooling water path.

[0051] The detection device 8 is used to detect components and is installed on the lifting mechanism.

[0052] It should be noted that, in the process of patching by a high-speed patch machine, the hoisting mechanism and the feeding mechanism are both existing technologies. The patch spindle 5 can be freely moved in the X-axis and Y-axis directions through the hoisting mechanism, and the patch spindle 5 can be driven to rotate by a motor. During the rotation, the patch spindle 5 will drive the servo cylinder 51 to rotate, so that different adsorption seats 61 are moved to the position where the components to be patched are placed. Then, the servo cylinder 51 pushes the ventilation rod 52 to move in the vertical direction, so as to pick up the components to be picked up. At the same time, the ventilation rod 52 can communicate with the external air pump. The adsorption seat 61 and the vent pipe are connected, so that the adsorption seat 61 generates suction to pick up the material. The liquid flows through the water channel in the heat dissipation mechanism 7 and the servo cylinder 51, so that the heat is taken out of the servo cylinder 51, and the heat is not accumulated in the servo cylinder 51, so that the accuracy of the patch picking is not affected by the heat problem. At the same time, during the detection process, the servo cylinder 51 drives the components to pass through the detection device 8, so that each component can be detected to check whether the component has defects.

[0053] like Figures 2 to 8 As shown, the heat dissipation mechanism 7 includes a heat dissipation fixed ring cover 71, which is fixedly mounted on the side of the patch main shaft 5, and a liquid inlet groove 711 is provided in the heat dissipation fixed ring cover 71, and the liquid inlet groove 711 is communicated with the water path in the servo cylinder 51. A liquid storage cavity 711 is provided in the heat dissipation fixed ring cover 71, and a plurality of micro liquid pumps 73 are fixedly installed between the liquid inlet groove 711 and the liquid storage cavity 711. A first auxiliary heat dissipation device 74 is provided on the heat dissipation fixed ring cover 71, and the first auxiliary heat dissipation device 74 is communicated with the water path in the servo cylinder 51.

[0054] It should be noted that, in the process of heat dissipation, the heat dissipation liquid is extracted from the liquid storage chamber 711 into the liquid inlet tank 711 through the micro liquid pump 73, and then the heat dissipation liquid enters the water channel of the servo cylinder 51, and flows from the water channel of the servo cylinder 51 to the first auxiliary heat dissipation device 74, where the heat is dissipated, and finally the heat dissipating liquid re-enters the liquid storage chamber 711. In the above technical solution, the heat generated in the servo motor is mainly generated by the repeated friction between the ventilation rod 52 and the side wall of the servo motor. The water channel in the servo motor is closer to the heat generation position, so that the heat is directly taken away from the cylinder body. Compared with the traditional heat dissipation method of directly using a fan, the heat dissipation effect is more direct and efficient.

[0055] like Figures 2 to 8As shown, the first auxiliary heat dissipation device 74 includes an inclined heat dissipation plate 741, which is in a circular ring shape. The inclined heat dissipation plate 741 is fixedly mounted on the heat dissipation fixing ring cover 71. The inclined heat dissipation plate 741 and the heat dissipation fixing ring cover 71 are inclined at a certain angle. The inclined heat dissipation plate 741 is communicated with the liquid storage chamber 711, and the outer side of the inclined heat dissipation plate 741 is communicated with the water channel in the servo cylinder 51 through a pipeline.

[0056] It should be noted that during the heat dissipation process, when the liquid enters the first auxiliary heat dissipation device 74, after the liquid absorbs heat, when it enters the inclined heat dissipation plate 741, the heat dissipation liquid will be spread over a larger area, and at the same time, the flow time of the cooling liquid will be slowed down, thereby improving the heat dissipation effect.

[0057] The inclined heat dissipation plate 741 is processed with a plurality of ventilation slots 7411 communicating with each other from top to bottom.

[0058] In this way, the heat dissipation area can be effectively increased, and at the same time, the external gas can effectively interact with the inclined heat dissipation plate 741, thereby effectively improving the heat dissipation efficiency.

[0059] like Figures 2 to 8 As shown, an inclined ventilation blade 742 is fixedly mounted on the upper end of the inclined heat dissipation plate 741 , and a plurality of the ventilation blades 742 are evenly distributed along the circumference of the patch main axis 5 .

[0060] It should be noted that during the rotation of the patch main shaft 5, the patch main shaft 5 will drive the rotation of the heat dissipation fixing ring cover 71, and the heat dissipation fixing ring cover 71 will drive the rotation of the ventilation blades 742 during the rotation. After the ventilation blades 742 rotate, an airflow in the vertical direction will be generated, and the airflow will be blown onto the inclined heat dissipation plate 741, thereby increasing the probability of contact between the airflow and the inclined heat dissipation plate 741 within unit time, thereby improving the heat dissipation efficiency.

[0061] like Figures 2 to 8 As shown, the ventilation blade 742 is hollow, and the interior of the ventilation blade 742 is communicated with the upper end of the inclined heat dissipation plate 741.

[0062] It should be noted that the liquid involved in heat dissipation is a volatile liquid. After the heat dissipation liquid absorbs heat in the cylinder body of the servo cylinder 51, part of the liquid will evaporate to produce gas. When flowing through the inclined heat dissipation plate 741, this part of the gas will enter the ventilation blades 742. At the same time, since the ventilation blades 742 will interact with more airflow, the gas will be liquefied and more heat will be released during the liquefaction process, thereby effectively improving the heat dissipation efficiency.

[0063] like Figure 4 and Figure 5 As shown, the detection device 8 includes a detection fixing plate 81, which is arc-shaped, and a plurality of image processors are embedded circumferentially on the detection fixing plate 81. The detection fixing plate 81 is processed with the liquid inlet 811 and the liquid outlet 812. The liquid inlet 811 is connected to the first liquid inlet 121, and the liquid outlet 812 is connected to the first liquid outlet 124.

[0064] It should be noted that in the process of inspecting components, in the process of collecting images of components through the image processor and thus inspecting the components, the cooling liquid is injected and received from the image processor through the liquid inlet channel 811 and the liquid outlet channel 812, thereby dissipating the heat of the image processor, thereby improving the working stability of the image processor. At the same time, when one of the image processors is damaged, the system will promptly replace it with another image processor to work, and transmit the information that the image processor is damaged to the operator, so that the failure rate of the placement machine can be effectively reduced.

[0065] like Figures 2 to 8 As shown, the adsorption turntable 62 is rotatably connected to the lower end of the adsorption seat 61. A plurality of adsorption nozzles of different specifications are circumferentially installed on the adsorption seat 61. The adsorption seat 61 is connected to the ventilation rod 52 through a hose.

[0066] It should be noted that, when picking up components of different specifications through the above technical solution, the servo motor can be used to drive the rotation of the adsorption seat 61, and different adsorption nozzles can be used to adsorb the patch components, thereby having a wider applicability.

[0067] In the description of the present invention, it should be understood that the terms "up", "down", "left", "right", etc., which indicate orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation and a specific orientation structure and operation. Therefore, they cannot be understood as limitations on the present invention. In addition, "first" and "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0068] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0069] The above is a detailed description of an embodiment of the present invention. However, the content described is only a preferred embodiment of the present invention and should not be considered to limit the scope of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. An image processor comprising an imaging film (1), characterized in that The imaging film (1) is embedded in a cooling plate (11). A first cooling water channel (12) is provided in the cooling plate (11). The first cooling water channel (12) comprises a first liquid inlet (121), a water diversion channel (122), a heat dissipation channel (123) and a first liquid outlet (124). The first liquid inlet (121) and the first liquid outlet (124) are symmetrically arranged on both sides of the cooling plate (11). The first liquid inlet (121) and the first liquid outlet (124) are respectively connected to a water diversion channel (122). A plurality of heat dissipation channels (123) are connected between the two water diversion channels (122).

2. The image processor according to claim 1, wherein: The water diversion channel (122) is bent and reciprocating.

3. A high-speed placement machine, characterized in that: The high-speed placement machine is applicable to the image processor of claim 1 or 2, comprising: Lifting mechanism and feeding mechanism; A patch spindle (5), the patch spindle (5) is rotatably connected to a hoisting mechanism, the hoisting mechanism is rotatably connected to the patch spindle (5), a plurality of servo cylinders (51) are fixedly installed on the side of the patch spindle (5), a ventilation rod (52) pushed by the servo cylinder (51) is slidably provided in the servo cylinder (51), and a cooling water channel is opened in the servo cylinder (51); a patch adsorption mechanism (6), the patch adsorption mechanism (6) comprising an adsorption seat (61), the adsorption seat (61) being fixedly mounted on the lower end of the ventilation rod (52), and an adsorption turntable (62) being provided in the adsorption seat (61); A heat dissipation mechanism (7), the heat dissipation mechanism (7) is fixedly mounted on the patch spindle (5), and the heat dissipation mechanism (7) is in communication with a second cooling water path; A detection device (8) for detecting components is installed on the hoisting mechanism.

4. A high-speed placement machine according to claim 3, characterized in that: The heat dissipation mechanism (7) comprises a heat dissipation fixed ring cover (71), the heat dissipation fixed ring cover (71) is fixedly mounted on the side of the patch main shaft (5), a liquid inlet groove (711) is provided in the heat dissipation fixed ring cover (71), the liquid inlet groove (711) is communicated with the water path in the servo cylinder (51), a liquid storage cavity (711) is provided in the heat dissipation fixed ring cover (71), a plurality of micro liquid pumps (73) are fixedly installed between the liquid inlet groove (711) and the liquid storage cavity (711), and a first auxiliary heat dissipation device (74) is provided on the heat dissipation fixed ring cover (71), and the first auxiliary heat dissipation device (74) is communicated with the water path in the servo cylinder (51).

5. A high-speed placement machine according to claim 4, characterized in that: The first auxiliary heat dissipation device (74) comprises an inclined heat dissipation plate (741), the inclined heat dissipation plate (741) is in the shape of a circular ring, the inclined heat dissipation plate (741) is fixedly mounted on the heat dissipation fixed ring cover (71), the inclined heat dissipation plate (741) and the heat dissipation fixed ring cover (71) are inclined at a certain angle, the inclined heat dissipation plate (741) is in communication with the liquid storage chamber (711), and the outer side of the inclined heat dissipation plate (741) is in communication with the water channel in the servo cylinder (51) through a pipeline.

6. A high-speed placement machine according to claim 5, characterized in that: The inclined heat dissipation plate (741) is processed with a plurality of ventilation slots (7411) communicating with each other from top to bottom.

7. A high-speed placement machine according to claim 5 or 6, characterized in that: The upper end of the inclined heat dissipation plate (741) is fixedly provided with inclined ventilation blades (742), and a plurality of the ventilation blades (742) are evenly distributed along the circumference of the patch main axis (5).

8. A high-speed placement machine according to claim 7, characterized in that: The ventilation blade (742) is hollow, and the interior of the ventilation blade (742) is communicated with the upper end of the inclined heat dissipation plate (741).

9. A high-speed placement machine according to claim 3, wherein the detection device (8) includes a detection fixing plate (81), the detection fixing plate (81) is arc-shaped, and a plurality of image processors are circumferentially embedded on the detection fixing plate (81), and the detection fixing plate (81) is processed with the liquid inlet (811) and the liquid outlet (812), the liquid inlet (811) is communicated with the first liquid inlet (121), and the liquid outlet (812) is communicated with the first liquid outlet (124).

10. A high-speed placement machine according to claim 3, characterized in that: The adsorption turntable (62) is rotatably connected to the lower end of the adsorption seat (61), and a plurality of adsorption nozzles of different specifications are circumferentially mounted on the adsorption seat (61).

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