Low resistance small volume patch capacitor

Abstract

The present application belongs to the technical field of patch capacitors, and discloses a low-resistance small-size patch capacitor, which comprises an epoxy resin shell, a hollow cavity is formed in the inside of the epoxy resin shell, an anode patch is arranged on one side of the epoxy resin shell, a cathode patch is arranged on the other side of the epoxy resin shell, one end of the anode patch and the cathode patch extends into the inside of the hollow cavity, and the other end of the anode patch and the cathode patch extends to the bottom of the epoxy resin shell; the rosin is filled into the storage cavity, and in the process of heating soldering of the welding pin, the induction assembly is triggered to release the rosin, so that the butt joint is more easily soldered, and the false welding is prevented; the positioning assembly is triggered to work at the same time when the induction assembly works, and the feedback assembly is opened, so that the corrosive damage caused by overload damage in the subsequent use of the capacitor is prevented.

Description

Technical Field

[0001] This invention relates to the field of surface mount capacitor technology, and in particular to a low-resistance, small-volume surface mount capacitor. Background Technology

[0002] Chip capacitors are made by stacking ceramic dielectric films with printed electrodes (internal electrodes) in a staggered manner, forming a ceramic chip through a one-time high-temperature sintering process, and then sealing the two ends of the chip with metal layers (external electrodes), thus forming a monolith-like structure, hence also known as a monolith capacitor.

[0003] Currently, in semiconductor device packaging and processing, the assembly of surface-mount electronic components usually involves printing metal solder on the carrier PCB. The metal solder is usually a high-melting-point alloy solder with tin as the main component. During the solder printing process, due to the presence of oil stains on the electrical interfaces of the PCB or the pins of the electronic components, it is easy for the solder joints to become cold solder joints, affecting the stability of the circuit connection. Summary of the Invention

[0004] In order to solve the problems existing in the prior art, the present invention provides a low-resistance, small-volume chip capacitor.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a low-resistance, small-volume chip capacitor, comprising an epoxy resin shell, wherein a hollow cavity is formed inside the epoxy resin shell, an anode chip is disposed on one side of the epoxy resin shell, and a cathode chip is disposed on the other side of the epoxy resin shell, wherein one end of the anode chip and the cathode chip extend into the hollow cavity, and the other end of the anode chip and the cathode chip extend to the bottom of the epoxy resin shell;

[0006] Both the anode and cathode patches have welding pins fixed to their bottoms. Each welding pin has a limit strip fixed near one edge of its bottom. Both welding pins have sensing components inside, and both limit strips have positioning components inside. The epoxy resin shell has two feedback components inside.

[0007] Preferably, a buffer cavity is provided in the middle of the interior of the epoxy resin shell, the buffer cavity is located directly below the hollow cavity, a conical groove is provided on the bottom surface of the interior of the hollow cavity, neutralization cavities are provided on both sides of the interior of the epoxy resin shell near the buffer cavity, and transition cavities are provided on the side of the interior of the epoxy resin shell near the two neutralization cavities respectively. The tops of the two transition cavities are connected to the tops of the two neutralization cavities respectively, and a drain groove is provided on the bottom surface of the interior of the two transition cavities, extending to the bottom of the epoxy resin shell.

[0008] Preferably, the sensing component includes an arc-shaped bimetallic strip, a storage cavity is formed inside the welding pin, a bevel is formed on one side of the welding pin near the bottom edge, a through-hole is formed on the top surface of the bevel to the inside of the storage cavity, air vents are formed on both sides of the inner wall of the storage cavity near the top edge to the outside of the welding pin, and two solder grooves are formed at the bottom of the welding pin.

[0009] Preferably, the welding pin has an adjustment groove inside, one end of the arc-shaped bimetallic strip transitions into the adjustment groove, the other end of the arc-shaped bimetallic strip is fixed with a push plate, one end of the push plate slides through into the interior of the storage cavity, the bottom surface of the interior of the storage cavity is slidably sealed with a sealing slide plate, the through-hole is located below the sealing slide plate, and one end of the push plate is fixed to one side of the sealing slide plate.

[0010] Preferably, the positioning component includes a positioning rod, the limiting strip has a driving cavity inside, the positioning rod is located inside the driving cavity, the welding pin has a cylindrical cavity directly below the adjusting groove, the limiting strip has an inner cavity in the middle, one side of the inner wall of the cylindrical cavity has a side constraint opening that extends into the inner cavity, and a contact rod is provided inside the cylindrical cavity. The top of the contact rod slides through the adjusting groove and is in contact with the bottom of the arc-shaped bimetallic sheet.

[0011] Preferably, an annular plate is fixed to the outer surface of the contact rod, the annular plate slides between the inner walls of the cylindrical cavity, a second spring is fixed between the bottom of the annular plate and the inner bottom surface of the cylindrical cavity, a conical block is slidably arranged between the inner walls of the inner cavity, a connecting plate is arranged inside the side constraint opening, one end of the connecting plate is fixed to the bottom of the contact rod, and the other end of the connecting plate is fixed to the top of the conical block.

[0012] Preferably, one end of the positioning rod slides through the interior of the inner cavity, and an arc-shaped block is fixed to one end of the positioning rod. The arc surface of the arc-shaped block and the conical surface of the conical block fit together. The other end of the positioning rod extends through to the outside of the limiting strip. A sliding plate is fixed to the outer surface of the positioning rod. The sliding plate slides between the inner walls of the driving cavity. A third spring is fixed between one side of the sliding plate and one side of the inner wall of the driving cavity.

[0013] Preferably, the feedback component includes a pull-out plate, a pull-out groove is formed on one inner wall of the buffer cavity, an adjustment channel is formed inside the epoxy resin shell, one end of the pull-out groove extends into the interior of the adjustment channel, and the pull-out groove is interconnected with the inner bottom surface of the neutralization cavity and the inner bottom surface of the transition cavity. The pull-out plate slides between the inner walls of the pull-out groove, a first slot is formed at the bottom of the pull-out plate, and a second slot is formed on one side of the bottom of the pull-out plate located at the first slot.

[0014] Preferably, the inner bottom surface of the pull-out groove is provided with a groove, and the first and second slots are both located directly above the groove. A spring clip is fixed to one inner wall of the groove, and one end of the spring clip extends and engages with the inside of the second slot. One end of the pull-out plate is inclined, and a bending channel is provided inside the pull-out plate near one edge. Both ends of the bending channel extend to the top of the pull-out plate. A connecting port extending to the bottom is provided at the top of the pull-out plate near the other edge. The connecting port is located inside the transition cavity and is opposite to the drain groove. One end of the bending channel is located inside the neutralization cavity, and the neutralization cavity and the buffer cavity are interconnected through the bending channel.

[0015] Preferably, an adjusting rod is slidably disposed inside the adjusting channel. The bottom of the adjusting rod slides through the interior of the adjusting groove, and the bottom of the adjusting rod is in contact with the top of the arc-shaped bimetallic sheet. The arc-shaped bimetallic sheet has a convex portion facing downward. A triangular groove is formed on one side of the adjusting rod, and an inclined portion of one side of the pull-out plate extends into the triangular groove. A reciprocating cavity is formed on one side of the adjusting channel near the top edge. The top side of the adjusting rod is bent and extends into the reciprocating cavity. A first spring is fixed to the bottom surface of the reciprocating cavity, and the top of the first spring is fixed to the top bend of the adjusting rod.

[0016] Compared with the prior art, the beneficial effects of the present invention are:

[0017] 1. This invention fills the storage cavity with rosin. During the soldering process of the soldering pins, the sensing component can be triggered to release rosin, making the joint easier to solder and preventing cold solder joints. At the same time as the sensing component is working, the positioning component is also triggered to work, and the feedback component is turned on to prevent the capacitor from being damaged by overload and corrosive hazards during subsequent use.

[0018] 2. When the sensing component is working in this invention, one end of the arc-shaped bimetallic sheet contracts, thereby driving the push plate and the sealing slide plate to slide towards the storage cavity. When one end of the sealing slide plate slides to the through-hole side, the through-hole is in an open state. At this time, the fluid rosin inside the storage cavity can flow out into the inside of the curved opening and be soldered with the solder wire at the soldering pin.

[0019] 3. When the positioning component of this invention is working, the arc-shaped bimetallic sheet will bend and deform due to heat during the welding process, pressing the contact rod downward. As the contact rod slides downward, it will drive the conical block to slide downward. When the conical block slides downward, it will push the arc-shaped block to both sides of the inner cavity through the conical surface, thereby causing one end of the positioning rod to slide to the outside of the limiting strip, so as to fix the welding pin and prevent shaking during welding.

[0020] 4. When the feedback component of this invention is working, when the adjusting rod slides down, the inclined surface inside the triangular groove can push the pull plate towards the buffer chamber. At this time, one end of the pull plate extends into the interior of the buffer chamber, and the buffer chamber and the neutralization chamber can be connected through the bending channel. At the same time, the connecting port on the pull plate slides to the top of the drain groove, and the drain groove and the transition chamber are connected through the connecting port. In this way, when the pressure inside the hollow cavity of the capacitor increases due to overload during subsequent use, it will break first through the conical groove. At this time, the corrosive part inside the capacitor can flow into the buffer chamber, and then enter the interior of the neutralization chamber through the bending channel to undergo a neutralization reaction with the neutralizing substance before being discharged, thus avoiding corrosive damage to the outside. Attached Figure Description

[0021] Figure 1 This invention provides a front-view three-dimensional structural diagram of a low-resistance, small-volume chip capacitor.

[0022] Figure 2 A bottom-view three-dimensional structural diagram of a low-resistance, small-volume chip capacitor is provided for this invention.

[0023] Figure 3 This invention provides a cross-sectional three-dimensional structural diagram of a low-resistance, small-volume chip capacitor.

[0024] Figure 4 This invention provides a cross-sectional three-dimensional structural diagram of the soldered leads in a low-resistance, small-volume chip capacitor.

[0025] Figure 5 For the present invention Figure 3 A magnified view of a portion of point A in the middle;

[0026] Figure 6 For the present invention Figure 3 A magnified view of a portion of point B in the middle;

[0027] Figure 7 For the present invention Figure 4 A magnified view of a portion of point C.

[0028] In the diagram: 1. Epoxy resin shell; 2. Anode patch; 3. Solder pin; 4. Air port; 5. Limiting strip; 6. Solder bath; 7. Reverse joint; 8. Through-hole; 9. Cathode patch; 10. Hollow cavity; 11. Conical groove; 12. Buffer cavity; 13. Neutralization cavity; 14. Transition cavity; 15. Storage cavity; 16. Drainage groove; 17. Pull-out groove; 18. Pull-out plate; 19. Bending channel; 20. Connection port; 21. First slot; 22. Second slot; 23. Groove; 24. Spring. 25. Spring card; 26. Reciprocating cavity; 27. Adjustment channel; 28. Adjustment rod; 29. ​​First spring; 30. Triangular groove; 31. Sealing slide plate; 32. Adjustment groove; 33. Arc-shaped bimetallic strip; 34. Push plate; 35. Cylindrical cavity; 36. Contact rod; 37. Annular plate; 38. Second spring; 39. Side constraint port; 40. Connecting plate; 41. Inner cavity; 42. Conical block; 43. Drive cavity; 44. Positioning rod; 45. Sliding plate; 46. Third spring; 47. Arc-shaped block. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] Please see Figure 1-7 The present invention provides a technical solution: a low-resistance, small-volume chip capacitor, comprising an epoxy resin shell 1, a hollow cavity 10 formed inside the epoxy resin shell 1, an anode patch 2 disposed on one side of the epoxy resin shell 1, and a cathode patch 9 disposed on the other side of the epoxy resin shell 1, one end of the anode patch 2 and the cathode patch 9 extending into the hollow cavity 10, and the other end of the anode patch 2 and the cathode patch 9 extending to the bottom of the epoxy resin shell 1;

[0031] Both the anode patch 2 and the cathode patch 9 have welding pins 3 fixed to their bottoms. Each welding pin 3 has a limit strip 5 fixed near one edge of its bottom. Both welding pins 3 have sensing components inside, and both limit strips 5 have positioning components inside. The epoxy resin shell 1 has two feedback components inside. The epoxy resin shell 1 has a buffer cavity 12 in the middle, located directly below the hollow cavity 10. The bottom surface of the hollow cavity 10 has a conical groove 11. The epoxy resin shell 1 has neutralization cavities 13 on both sides near the buffer cavity 12. The epoxy resin shell 1 has a transition cavity 14 on one side near the two neutralization cavities 13. The tops of the two transition cavities 14 are connected to the tops of the two neutralization cavities 13. The bottom surface of the two transition cavities 14 has a drain groove 16 that extends to the bottom of the epoxy resin shell 1.

[0032] The effect achieved is that by fixing the soldering pins 3 to the bottom of the anode patch 2 and the cathode patch 9, and connecting the soldering pins 3 to the epoxy resin shell 1, it is easy to solder the soldering pins 3 to the joint of the PCB board during soldering. Rosin is filled into the storage cavity 15. During the soldering process of the soldering pins 3 being heated, the sensing component can be triggered to release rosin, making the joint easier to solder and preventing cold solder joints. At the same time as the sensing component is working, the positioning component is also triggered to work, and the feedback component is turned on to prevent the capacitor from being damaged by overload and causing corrosion hazards during subsequent use.

[0033] like Figure 2 , Figure 3 and Figure 6 As shown, the sensing component includes an arc-shaped bimetallic strip 32, a storage cavity 15 is formed inside the welding pin 3, a bevel 7 is formed on one side of the welding pin 3 near the bottom edge, a through-hole 8 is formed on the top surface of the bevel 7 that penetrates into the storage cavity 15, and air vents 4 are formed on both sides of the inner wall of the storage cavity 15 near the top edge that penetrate into the outside of the welding pin 3. Two soldering grooves 6 are formed at the bottom of the welding pin 3, an adjustment groove 31 is formed inside the welding pin 3, one end of the arc-shaped bimetallic strip 32 transitions into the interior of the adjustment groove 31, and a push plate 33 is fixed to the other end of the arc-shaped bimetallic strip 32. One end of the push plate 33 slides through into the interior of the storage cavity 15, and a sealing slide plate 30 is slidably sealed to the bottom surface of the interior of the storage cavity 15. The through-hole 8 is located below the sealing slide plate 30, and one end of the push plate 33 is fixed to one side of the sealing slide plate 30.

[0034] The effect achieved is that during the soldering process, the molten solder wire heats the part where the soldering pin 3 is attached to the PCB circuit board. While being heated, the rosin inside the storage cavity 15 melts and becomes fluid. The arc-shaped bimetallic strip 32 inside the soldering pin 3 bends and deforms when heated, causing one end of the arc-shaped bimetallic strip 32 to contract, thereby driving the push plate 33 and the sealing slide plate 30 to slide towards the storage cavity 15. When one end of the sealing slide plate 30 slides to the side of the through opening 8, the through opening 8 is in the open state. At this time, the fluid rosin inside the storage cavity 15 can flow out into the inside of the bevel 7 and be soldered with the solder wire at the soldering pin 3.

[0035] like Figure 2 , Figure 3 , Figure 4 , Figure 6 and Figure 7 As shown, the positioning assembly includes a positioning rod 43, a driving cavity 42 is formed inside the limiting strip 5, the positioning rod 43 is located inside the driving cavity 42, a cylindrical cavity 34 is formed inside the welding pin 3 directly below the adjusting groove 31, an inner cavity 40 is formed inside the limiting strip 5 at the middle, a side constraint port 38 is formed on one side inner wall of the cylindrical cavity 34, penetrating into the inner cavity 40, a contact rod 35 is provided inside the cylindrical cavity 34, the top of the contact rod 35 slides through into the adjusting groove 31 and is in contact with the bottom of the arc-shaped bimetallic strip 32, an annular plate 36 is fixed on the outer surface of the contact rod 35, the annular plate 36 slides between the inner walls of the cylindrical cavity 34, and the bottom of the annular plate 36 and the inner bottom surface of the cylindrical cavity 34 are in contact with each other. A second spring 37 is fixed between the inner walls of the inner cavity 40. A conical block 41 is slidably disposed between the inner walls of the inner cavity 40. A connecting plate 39 is disposed inside the side constraint port 38. One end of the connecting plate 39 is fixed to the bottom of the contact rod 35, and the other end of the connecting plate 39 is fixed to the top of the conical block 41. One end of the positioning rod 43 slides through the inner cavity 40. An arc-shaped block 46 is fixed to one end of the positioning rod 43. The arc surface of the arc-shaped block 46 fits against the conical surface of the conical block 41. The other end of the positioning rod 43 passes through the outer side of the limiting strip 5. A sliding plate 44 is fixed to the outer surface of the positioning rod 43. The sliding plate 44 slides between the inner walls of the driving cavity 42. A third spring 45 is fixed between one side of the sliding plate 44 and one side of the inner wall of the driving cavity 42.

[0036] The effect achieved is that, since the surface mount capacitor is small in size, it is easy to wobble during soldering. Therefore, by fixing the limiting strip 5 at the bottom of the soldering pin 3, the surface mount capacitor can be pre-positioned at the soldering position on the PCB board before soldering, preventing wobble during soldering. During the soldering process, the arc-shaped bimetallic strip 32 will bend and deform due to heat, pressing the contact rod 35 downward. As the contact rod 35 slides downward, it will drive the conical block 41 to slide downward. When the conical block 41 slides downward, it will push the arc-shaped block 46 to both sides of the inner cavity 40 through the conical surface, thereby causing one end of the positioning rod 43 to slide outward of the limiting strip 5, so as to fix the soldering pin 3 and prevent wobble during soldering.

[0037] like Figure 3 , Figure 5 and Figure 6 As shown, the feedback component includes a pull-out plate 18, a pull-out groove 17 is formed on one inner wall of the buffer cavity 12, and an adjustment channel 26 is formed inside the epoxy resin shell 1. One end of the pull-out groove 17 extends into the interior of the adjustment channel 26, and the pull-out groove 17 is interconnected with the inner bottom surface of the neutralization cavity 13 and the inner bottom surface of the transition cavity 14. The pull-out plate 18 slides between the inner walls of the pull-out groove 17, and a first slot 21 is formed at the bottom of the pull-out plate 18. The bottom of the pull-out plate 18 is located in the first slot 21. A second slot 22 is provided on one side, and a groove 23 is provided on the bottom surface of the pull-out groove 17. The first slot 21 and the second slot 22 are both located directly above the groove 23. A spring clip 24 is fixed to one side of the inner wall of the groove 23. One end of the spring clip 24 extends and engages with the inside of the second slot 22. One end of the pull-out plate 18 is inclined. A bending channel 19 is provided inside the pull-out plate 18 near one side edge. Both ends of the bending channel 19 extend to the top of the pull-out plate 18. A connecting port 20 extending to the bottom is provided at the top of the 18 near the other edge. The connecting port 20 is located inside the transition cavity 14 and is opposite to the discharge groove 16. One end of the bent channel 19 is located inside the neutralization cavity 13. The neutralization cavity 13 and the buffer cavity 12 are interconnected through the bent channel 19. An adjusting rod 27 is slidably provided inside the adjusting channel 26. The bottom of the adjusting rod 27 slides through the adjusting groove 31, and the bottom of the adjusting rod 27 is connected to the arc-shaped bimetallic strip 32. The tops of the two parts fit together, the arc-shaped bimetallic strip 32 has its arc protrusion facing downwards, a triangular groove 29 is provided on one side of the adjusting rod 27, and the inclined part of one side of the pull plate 18 extends into the triangular groove 29. A reciprocating cavity 25 is provided on one side of the adjusting channel 26 near the top edge. The top side of the adjusting rod 27 is bent and extends into the reciprocating cavity 25. A first spring 28 is fixed to the bottom surface of the reciprocating cavity 25, and the top of the first spring 28 is fixed to the top bend of the adjusting rod 27.

[0038] The effect achieved is as follows: First, the neutralizing substance is filled into the neutralization cavity 13. When the arc-shaped bimetallic strip 32 is heated and bent, the constraint on the bottom of the adjusting rod 27 is released. At this time, under the elastic force of the first spring 28, the adjusting rod 27 slides downward into the adjusting channel 26. Since the pull plate 18 and the inclined surface extend into the triangular groove 29 on one side of the adjusting rod 27, when the adjusting rod 27 slides downward, the inclined surface inside the triangular groove 29 can push the pull plate 18 towards the buffer cavity 12. During the pushing process, one end of the spring clip 24 slides out from the second clip 22 and engages with the first clip 21. At this time, one end of the pull plate 18 extends into the buffer cavity 12. The other end of the bending channel 19 on the pull-out plate 18 is connected to the buffer chamber 12, and one end of the bending channel 19 is located inside the neutralization chamber 13. At this time, the buffer chamber 12 and the neutralization chamber 13 can be connected through the bending channel 19. At the same time, the connecting port 20 on the pull-out plate 18 slides above the drain groove 16, and the drain groove 16 and the transition chamber 14 are connected through the connecting port 20. In this way, when the pressure inside the hollow cavity 10 of the capacitor increases due to overload during subsequent use, it will break first through the conical groove 11. At this time, the corrosive part inside the capacitor can flow into the buffer chamber 12, and then enter the neutralization chamber 13 through the bending channel 19 to undergo a neutralization reaction with the neutralizing substance before being discharged, thus avoiding corrosive damage to the outside.

[0039] Working principle: When using this device, rosin is first filled into the storage cavity 15, and a neutralizing substance is filled into the neutralization cavity 13. During the soldering process, the molten solder wire heats the contact area between the soldering pin 3 and the PCB circuit board. Simultaneously, the rosin inside the storage cavity 15 melts, making it fluid. Furthermore, the arc-shaped bimetallic strip 32 inside the soldering pin 3 bends and deforms upon heating, causing one end of the arc-shaped bimetallic strip 32 to contract, thereby driving the push plate 33 and the sealing slide plate 30 to slide towards one side of the storage cavity 15. When one end of the sealing slide plate 30 slides to the side of the through-hole 8, the through-hole 8 is open, and the fluid rosin inside the storage cavity 15 is released. The solder can flow into the interior of the bevel 7 and be soldered with solder wire at the soldering pin 3. Because the surface mount capacitor is small, it is prone to wobbling during soldering. Therefore, by fixing a limiting strip 5 at the bottom of the soldering pin 3, the surface mount capacitor can be pre-positioned at the soldering location on the PCB board before soldering, preventing wobbling during soldering. During the soldering process, the arc-shaped bimetallic strip 32 will bend and deform due to heat, pressing the contact rod 35 downwards. As the contact rod 35 slides downwards, it will also drive the conical block 41 to slide downwards. When the conical block 41 slides downwards, it will push the arc-shaped block 46 towards both sides of the inner cavity 40 through the conical surface, thereby causing one end of the positioning rod 43 to slide outwards towards the limiting strip 5, thus fixing the soldering pin 3. To prevent wobbling during welding, when the curved bimetallic strip 32 bends and deforms due to heat, the constraint on the bottom of the adjusting rod 27 is released. At this time, under the elastic force of the first spring 28, the adjusting rod 27 slides downwards into the adjusting channel 26. Since the pull plate 18 and the inclined surface extend into the triangular groove 29 on one side of the adjusting rod 27, the pull plate 18 can be pushed towards the buffer cavity 12 by the inclined surface inside the triangular groove 29 when the adjusting rod 27 slides downwards. During the pushing process, one end of the spring clip 24 will slide out from the second clip 22 and engage with the inside of the first clip 21. At this time, one end of the pull plate 18 extends into the inside of the buffer cavity 12, and the bend on the pull plate 18... The other end of channel 19 is connected to buffer chamber 12, and one end of bent channel 19 is located inside neutralization chamber 13. At this time, buffer chamber 12 and neutralization chamber 13 can be connected through bent channel 19. At the same time, the connecting port 20 on pull plate 18 slides to the top of drain trough 16, and drain trough 16 and transition chamber 14 are connected through connecting port 20. In this way, when the pressure inside hollow cavity 10 increases due to capacitor overload during subsequent use, it will break first through conical groove 11. At this time, the corrosive part inside the capacitor can flow into buffer chamber 12, and then enter neutralization chamber 13 through bent channel 19 to neutralize the neutralizing substance before being discharged, thus avoiding corrosive damage to the outside.

[0040] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A low-resistance, small-volume surface-mount capacitor, characterized in that, The epoxy resin shell (1) includes a hollow cavity (10) inside the epoxy resin shell (1). An anode patch (2) is provided on one side of the epoxy resin shell (1), and a cathode patch (9) is provided on the other side of the epoxy resin shell (1). One end of the anode patch (2) and the cathode patch (9) extend into the hollow cavity (10), and the other end of the anode patch (2) and the cathode patch (9) extend to the bottom of the epoxy resin shell (1). The bottom of the anode patch (2) and the cathode patch (9) are both fixed with welding pins (3), and the bottom of the two welding pins (3) is fixed with a limit strip (5) near one side edge. The inside of the two welding pins (3) is provided with a sensing component, and the inside of the two limit strips (5) is provided with a positioning component. The inside of the epoxy resin shell (1) is provided with two feedback components. The sensing component includes an arc-shaped bimetallic strip (32), a storage cavity (15) is provided inside the welding pin (3), a bevel (7) is provided on one side of the welding pin (3) near the bottom edge, a through hole (8) is provided on the top surface of the bevel (7) to the inside of the storage cavity (15), and air vents (4) are provided on both sides of the inner wall of the storage cavity (15) near the top edge to the outside of the welding pin (3). Two soldering grooves (6) are provided at the bottom of the welding pin (3). The positioning component includes a positioning rod (43), a driving cavity (42) is provided inside the limiting strip (5), the positioning rod (43) is located inside the driving cavity (42), a cylindrical cavity (34) is provided inside the welding pin (3) directly below the adjustment groove (31), an inner cavity (40) is provided inside the limiting strip (5) at the middle, a side constraint port (38) is provided on one side inner wall of the cylindrical cavity (34) and extends into the inner cavity (40), a contact rod (35) is provided inside the cylindrical cavity (34), the top of the contact rod (35) slides through into the adjustment groove (31) and is in contact with the bottom of the arc-shaped bimetallic strip (32).

2. The low-resistance, small-volume surface-mount capacitor according to claim 1, characterized in that: The epoxy resin shell (1) has a buffer cavity (12) in the middle, which is located directly below the hollow cavity (10). The bottom surface of the hollow cavity (10) has a conical groove (11). The epoxy resin shell (1) has neutralization cavities (13) on both sides near the buffer cavity (12). The epoxy resin shell (1) has a transition cavity (14) on one side near the two neutralization cavities (13). The tops of the two transition cavities (14) are connected to the tops of the two neutralization cavities (13). The bottom surface of the two transition cavities (14) has a drain groove (16) that extends to the bottom of the epoxy resin shell (1).

3. A low-resistance, small-volume surface-mount capacitor according to claim 2, characterized in that: The welding pin (3) has an adjustment groove (31) inside. One end of the arc-shaped bimetallic strip (32) transitions into the interior of the adjustment groove (31). The other end of the arc-shaped bimetallic strip (32) is fixed with a push plate (33). One end of the push plate (33) slides through into the interior of the storage cavity (15). The bottom surface of the interior of the storage cavity (15) is slidably sealed with a sealing slide plate (30). The through-hole (8) is located below the sealing slide plate (30). One end of the push plate (33) is fixed to one side of the sealing slide plate (30).

4. A low-resistance, small-volume surface-mount capacitor according to claim 3, characterized in that: An annular plate (36) is fixed to the outer surface of the contact rod (35). The annular plate (36) slides between the inner walls of the cylindrical cavity (34). A second spring (37) is fixed between the bottom of the annular plate (36) and the inner bottom surface of the cylindrical cavity (34). A conical block (41) is slidably arranged between the inner walls of the inner cavity (40). A connecting plate (39) is arranged inside the side constraint port (38). One end of the connecting plate (39) is fixed to the bottom of the contact rod (35), and the other end of the connecting plate (39) is fixed to the top of the conical block (41).

5. A low-resistance, small-volume surface-mount capacitor according to claim 4, characterized in that: One end of the positioning rod (43) slides through the interior of the inner cavity (40). An arc-shaped block (46) is fixed to one end of the positioning rod (43). The arc surface of the arc-shaped block (46) and the conical surface of the conical block (41) fit together. The other end of the positioning rod (43) extends through the outside of the limiting strip (5). A sliding plate (44) is fixed to the outer surface of the positioning rod (43). The sliding plate (44) slides between the inner walls of the driving cavity (42). A third spring (45) is fixed between one side of the sliding plate (44) and one side of the inner wall of the driving cavity (42).

6. A low-resistance, small-volume surface-mount capacitor according to claim 5, characterized in that: The feedback component includes a pull plate (18), a pull groove (17) is provided on one side of the inner wall of the buffer cavity (12), an adjustment channel (26) is provided inside the epoxy resin shell (1), one end of the pull groove (17) extends into the interior of the adjustment channel (26), and the pull groove (17) is interconnected with the inner bottom surface of the neutralization cavity (13) and the inner bottom surface of the transition cavity (14). The pull plate (18) slides between the inner walls of the pull groove (17), a first slot (21) is provided at the bottom of the pull plate (18), and a second slot (22) is provided on one side of the bottom of the pull plate (18) located at the first slot (21).

7. A low-resistance, small-volume surface-mount capacitor according to claim 6, characterized in that: The inner bottom surface of the pull-out groove (17) is provided with a groove (23). The first slot (21) and the second slot (22) are both located directly above the groove (23). A spring clip (24) is fixed to one side of the inner wall of the groove (23). One end of the spring clip (24) extends and engages with the inside of the second slot (22). One end of the pull-out plate (18) is inclined. A bending channel (19) is provided inside the pull-out plate (18) near one side edge. Both ends of the bending channel (19) extend to the top of the pull plate (18). The top of the pull plate (18) near the other edge has a connecting port (20) extending to the bottom. The connecting port (20) is located inside the transition cavity (14). The connecting port (20) is opposite to the drain groove (16). One end of the bending channel (19) is located inside the neutralization cavity (13). The neutralization cavity (13) and the buffer cavity (12) are connected to each other through the bending channel (19).

8. A low-resistance, small-volume surface-mount capacitor according to claim 7, characterized in that: An adjusting rod (27) is slidably disposed inside the adjusting channel (26). The bottom of the adjusting rod (27) slides through the adjusting groove (31) and the bottom of the adjusting rod (27) is in contact with the top of the arc-shaped bimetallic sheet (32). The arc-shaped bimetallic sheet (32) has a protruding part facing downward. A triangular groove (29) is provided on one side of the adjusting rod (27). The inclined part of one side of the pull plate (18) extends into the triangular groove (29). A reciprocating cavity (25) is provided on one side of the adjusting channel (26) near the top edge. The top side of the adjusting rod (27) is bent and extends into the reciprocating cavity (25). A first spring (28) is fixed on the bottom surface of the reciprocating cavity (25). The top of the first spring (28) is fixed to the top bend of the adjusting rod (27).

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