Multi-bin vacuum laminating equipment and method for embedded core-embedded circuit board

Abstract

The invention discloses a multi-bin vacuum press-fit device and method for an embedded core-embedded circuit board, and belongs to the technical field of PCB machining. The multi-bin vacuum press-fit device for the embedded core-embedded circuit board comprises a bin body, a heating mechanism and a vacuumizing mechanism, and a preheating bin, a press-fit bin and a buffering bin are arranged in the bin body; a first air-tight door is arranged between the preheating bin and the pressing bin for isolation, a second air-tight door is arranged between the pressing bin and the buffering bin, and the heating mechanism and the vacuumizing mechanism control the temperature and the vacuum degree of each bin respectively; the transferring mechanism is used for transferring materials, and the driving mechanism controls opening and closing of the feeding bin door, the discharging bin door, the first airtight door and the second airtight door. The control mechanism coordinates all the units to work cooperatively, and closed-loop control is achieved by monitoring technological parameters in real time. Through multi-chamber physical isolation and independent environment control, the problems of thermal crosstalk, pressure fluctuation and the like existing in traditional single-chamber equipment are solved, and the process stability and the production efficiency of PCB embedded chip pressing are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB board processing, and in particular to a multi-chamber vacuum pressing device and method for an embedded core buried circuit board. Background Art

[0002] The PCB vacuum lamination process is a precision manufacturing process that combines multi-layer PCBs and prepregs through hot pressing under high-temperature and high-pressure conditions. The lamination process involves tightly bonding the multilayer PCB materials under controlled conditions of temperature, pressure, and time. The resin in the prepreg melts and flows under heat, filling the gaps between the layers. Curing then forms an insulating layer. Pressure ensures that the layers are bubble-free and maintain a predetermined thickness, ultimately achieving reliable bonding and electrical interconnection of the multilayer circuit structure. However, during the lamination process, a significant temperature gradient forms between the embedded chip area and the general area. This uneven temperature distribution directly affects the resin's flow behavior and curing process, making it difficult to fully expel the air trapped within the resin. This leads to the expansion of residual air during the subsequent high-temperature lamination process, resulting in bubble defects. Furthermore, the chip area heats up rapidly due to the metal's rapid thermal conductivity, causing the resin to cure prematurely. Thermal hysteresis in the general substrate area reduces the resin's fluidity, ultimately resulting in incomplete filling and quality defects such as microvoids.

[0003] To precisely control temperature for optimal resin fluidity, maintain appropriate pressure for interlayer contact, and maintain stable thermodynamic conditions during the curing phase to ensure interfacial bonding strength, the industry generally uses single-chamber laminating equipment to simulate a multi-stage process using programmed temperature control. However, because preheating, laminating, and cooling processes are performed sequentially within the same physical space, preheating and laminating must be paused when the equipment enters the cooling phase. This inevitably results in significant thermal inertia delays during process transitions, which not only directly prolongs the overall production cycle but also makes it more susceptible to temperature fluctuations outside the process window, leading to reduced product consistency. Furthermore, the pressure fluctuations generated during the vacuum environment transition can disrupt the stability of resin flow, particularly in fine-pitch interconnect structures, which can easily cause microbubble defects, directly impacting package reliability. These process defects not only significantly reduce product quality and yield, but also weaken the bond between the chip and the PCB, seriously impacting the reliability of the electrical connection. Summary of the Invention

[0004] The present invention aims to address at least one of the technical problems existing in the prior art. To this end, it proposes a multi-chamber vacuum pressing device for embedded core circuit boards. This device reduces temperature fluctuations and pressure oscillations, thereby preventing defects such as bubbles and voids, enhancing interfacial bonding strength and electrical connection reliability, and ensuring consistent pressing quality.

[0005] The present invention also provides a multi-chamber vacuum pressing method for an embedded core-buried circuit board.

[0006] According to the first embodiment of the present invention, the multi-chamber vacuum pressing equipment for embedded core circuit boards includes: a chamber body, which is divided into a preheating chamber, a pressing chamber and a buffer chamber in sequence along the material transmission direction, the preheating chamber is provided with a feed chamber door, the buffer chamber is provided with a discharge chamber door, a first airtight door is provided between the preheating chamber and the pressing chamber, and a second airtight door is provided between the pressing chamber and the buffer chamber; a heating mechanism includes a first heating unit provided on the preheating chamber, a second heating unit provided on the pressing chamber and a third heating unit provided on the buffer chamber, the first heating unit The second heating unit is configured to perform gradient temperature control on the preheating chamber and the pressing chamber, so that the temperatures of the preheating chamber and the pressing chamber increase successively; the vacuum pumping mechanism includes a first vacuum pumping unit arranged on the preheating chamber, a second vacuum pumping unit arranged on the pressing chamber, and a third vacuum pumping unit arranged on the buffer chamber. When the first airtight door is opened, the preheating chamber and the pressing chamber are connected and isolated from the outside of the cabin. When the second airtight door is opened, the pressing chamber and the buffer chamber are connected and isolated from the outside of the cabin; the transfer mechanism is arranged on the cabin, and the transfer mechanism is used to transfer materials in the cabin.

[0007] The invention has at least the following beneficial effects: the preheating chamber, pressing chamber, and buffer chamber are independent of each other, and the temperature and vacuum environment can be matched to the requirements of different process stages. In the preheating chamber, the PCB board fully softens the resin and discharges the internal gas in the vacuum environment at the preheating temperature. In the pressing chamber, the preheated resin can flow evenly and completely fill the chip gap. The gradient temperature increase between the preheating chamber and the pressing chamber ensures that the semi-cured sheet resin reaches the optimal flow state. The vacuum environment of the preheating chamber and the pressing chamber effectively suppresses the formation of bubbles and micro-voids. The buffer cooling of the buffer chamber avoids quality defects caused by temperature fluctuations or pressure changes during the curing process of the resin, thereby improving the reliability and consistency of the product. On the other hand, each process stage is carried out simultaneously in an independent chamber, ensuring that the vacuum environment is not interrupted while achieving uninterrupted and continuous operation of the pressing process, making the production rhythm more compact, which is conducive to improving production efficiency and reducing production cycle time.

[0008] According to some embodiments of the present invention, materials are transmitted from back to front, and the transfer mechanism includes: a first conveyor belt, the first conveyor belt is arranged in the preheating bin, and the rear end of the first conveyor belt is telescopically provided with a first telescopic end, and the first telescopic end is used to connect with an external feeding system; a second conveyor belt, the second conveyor belt is arranged in the pressing bin, the rear end of the second conveyor belt is telescopically provided with a second telescopic end, and the front end of the second conveyor belt is telescopically provided with a third telescopic end, and the second telescopic end is used to connect with the first conveyor belt; a third conveyor belt, the third conveyor belt is arranged in the buffer bin, the third telescopic end is used to connect with the third conveyor belt, and the front end of the third conveyor belt is telescopically provided with a fourth telescopic end, and the fourth telescopic end is used to connect with the external feeding system.

[0009] According to some embodiments of the present invention, multiple first conveyor belts, multiple second conveyor belts and multiple third conveyor belts are provided, multiple first conveyor belts are parallel to each other and spaced apart, multiple second conveyor belts are parallel to each other and spaced apart, multiple third conveyor belts are parallel to each other and spaced apart, the second conveyor belts and the first conveyor belts are staggered in the left-right direction so that the second telescopic end can pass through between adjacent first conveyor belts, and the second conveyor belts and the third conveyor belts are staggered in the left-right direction so that the third telescopic end can pass through between adjacent third conveyor belts.

[0010] According to some embodiments of the present invention, the second conveyor belt includes a first conveyor unit and a second conveyor unit, both of which extend in the front-to-back direction, the second telescopic end is arranged at an end of the first conveyor unit close to the first conveyor belt, the second conveyor unit is located at an end of the first conveyor unit close to the third conveyor belt, and the third telescopic end is arranged at an end of the second conveyor unit close to the third conveyor belt.

[0011] According to some embodiments of the present invention, a storage mechanism is further included. The storage mechanism is disposed in the cabin and is used to stack multiple groups of materials in sequence along a vertical direction.

[0012] According to some embodiments of the present invention, the storage mechanism includes: a first storage component, which is liftably arranged in the preheating bin, the first storage component is located on one side of the first conveyor belt, and the first storage component is used to lift the material on the first conveyor belt to a preset height or lower the material at a preset height to the first conveyor belt; a second storage component, which is liftably arranged in the pressing bin, the second storage component is located on one side of the second conveyor belt, and the second storage component is used to lift the material on the second conveyor belt to a preset height or lower the material at a preset height to the second conveyor belt; a third storage component, which is liftably arranged in the buffer bin, the third storage component is located on one side of the third conveyor belt, and the third storage component is used to lift the material on the third conveyor belt to a preset height or lower the material at a preset height to the third conveyor belt.

[0013] According to some embodiments of the present invention, the first storage component includes two first pallets arranged in parallel, and the two first pallets can be synchronously raised and lowered and arranged on opposite sides of the first conveyor belt, and each first pallet is correspondingly provided with a first correcting plate, and the first correcting plate is connected to the corresponding first pallet through an elastic reset member, and the first correcting plate is rotatably connected to the top of the corresponding first pallet, and the two first correcting plates are inclined toward each other to form a guide channel, and the first correcting plate is used to correct the position deviation of the material; the second storage component includes two second pallets arranged in parallel, and the two second pallets can be synchronously raised and lowered and arranged on opposite sides of the second conveyor belt, and each second pallet is correspondingly provided with a second correcting plate. The second correcting plate is connected to the corresponding second support plate through an elastic reset member, and the second correcting plate is rotatably connected to the top of the corresponding second support plate. The two second correcting plates are inclined toward each other to form a guide channel, and the second correcting plate is used to correct the position deviation of the material; the third storage assembly includes two third support plates arranged in parallel, and the two third support plates can be synchronously lifted and lowered on opposite sides of the third conveyor belt, and each third support plate is correspondingly provided with a third correcting plate, and the third correcting plate is connected to the corresponding third support plate through an elastic reset member, and the third correcting plate is rotatably connected to the top of the corresponding third support plate, and the two third correcting plates are inclined toward each other to form a guide channel, and the third correcting plate is used to correct the position deviation of the material.

[0014] According to some embodiments of the present invention, a first anti-slip layer is provided on the top of the first pallet, a second anti-slip layer is provided on the top of the second pallet, and a third anti-slip layer is provided on the top of the third pallet. The first anti-slip layer, the second anti-slip layer and the third anti-slip layer are used to prevent the material from being displaced during the lifting process.

[0015] According to the second embodiment of the present invention, the multi-chamber vacuum pressing method for embedded core circuit boards adopts the multi-chamber vacuum pressing device for embedded core circuit boards according to the first embodiment of the present invention, and the device further includes: A driving mechanism is provided on the cabin body, and the driving mechanism is respectively connected to the feed bin door, the discharge bin door, the first airtight door and the second airtight door; A control mechanism electrically connected to the heating mechanism, the vacuuming mechanism, the transfer mechanism, and the driving mechanism; Methods include: Obtain the PCB board's plate parameters and pressing process parameters based on the configuration interface; Based on the pressing process parameters, the first heating unit controls the preheating chamber to heat up to a first target temperature, the second heating unit controls the pressing chamber to heat up to a second target temperature, and the second vacuum unit controls the pressing chamber to reach a target vacuum degree; When the preheating chamber reaches the first target temperature, the drive mechanism opens the feed chamber door, the transfer mechanism transfers the PCB board to the first preset station in the preheating chamber, and then closes the feed chamber door. The first vacuum unit controls the preheating chamber to reach the target vacuum degree. When the preheating chamber reaches the target vacuum level, the drive mechanism opens the first airtight door, and the transfer mechanism transfers the PCB to the second preset station in the pressing chamber and then closes the first airtight door. The third vacuum unit controls the buffer chamber to reach the target vacuum level, the drive mechanism opens the second airtight door, and the transfer mechanism transfers the PCB to the third preset station in the buffer chamber and then closes the second airtight door. The third vacuum unit controls the buffer bin to restore normal pressure, the driving mechanism opens the discharge bin door, and the transfer mechanism closes the discharge bin door after outputting the pressed PCB board.

[0016] It has at least the following beneficial effects: the multi-chamber vacuum pressing method for embedded core circuit boards has all the beneficial effects brought by the above-mentioned multi-chamber vacuum pressing equipment for embedded core circuit boards, which will not be repeated here.

[0017] According to some embodiments of the present invention, after closing the first airtight door, the preheating chamber is controlled to return to normal pressure, the feed chamber door is opened, and the next PCB board is fed into the preheating chamber. Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of the embodiments with reference to the accompanying drawings, in which: Figure 1 This is a schematic structural diagram of a multi-chamber vacuum pressing device for embedded core circuit boards according to this specific embodiment; Figure 2 for Figure 1 Schematic cross-section diagram in ; Figure 3 for Figure 1 Structural diagram of feeding into the middle preheating bin; Figure 4 for Figure 1 Schematic diagram of the structure of the PCB board being transported from the preheating chamber to the pressing chamber; Figure 5 for Figure 3 A top view of Figure 6 for Figure 4 A top view of Figure 7 for Figure 2 Schematic diagram of the structure of the storage mechanism and the transfer mechanism; Figure 8 for Figure 7 A schematic structural diagram of the first supporting plate and the first correcting plate; Figure 9This is a flow chart of the multi-chamber vacuum pressing method for the embedded core circuit board according to this specific embodiment.

[0019] Reference numerals: Cabin body 100, preheating chamber 110, feed chamber door 111, pressing chamber 120, first airtight door 121, second airtight door 122, buffer chamber 130, discharge chamber door 131; Transfer mechanism 200, first conveyor belt 210, first telescopic end 211, second conveyor belt 220, first conveyor unit 221, second telescopic end 2211, second conveyor unit 222, third telescopic end 2221, third conveyor belt 230, fourth telescopic end 231, fourth conveyor belt 240, fifth conveyor belt 250, sixth conveyor belt 260; Storage mechanism 300, first storage assembly 310, first support plate 311, first deflection-correcting plate 312, second storage assembly 320, second support plate 321, third storage assembly 330, third support plate 331, first circulating conveyor 340, second circulating conveyor 350, third circulating conveyor 360; PCB board 10, external feeding system 20. DETAILED DESCRIPTION

[0020] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, left, right, front, and back, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0021] In the description of the present invention, "several" means one or more, "multiple" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, and "above," "below," and "within" are understood to include the number itself. The use of terms such as "first" and "second" is solely for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0022] In the description of the present invention, unless otherwise clearly defined, words such as “setting”, “installation” and “connection” should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above words in the present invention based on the specific content of the technical solution.

[0023] Please refer to Figure 1 and Figure 2The present embodiment discloses a multi-chamber vacuum pressing device for an embedded core circuit board, comprising a chamber 100, a heating mechanism, a vacuum pumping mechanism and a transfer mechanism 200, wherein the chamber 100 is sequentially divided into a preheating chamber 110, a pressing chamber 120 and a buffer chamber 130 along the material transmission direction, the preheating chamber 110 is provided with a feed chamber door 111, the buffer chamber 130 is provided with a discharge chamber door 131, a first airtight door 121 is provided between the preheating chamber 110 and the pressing chamber 120, and a second airtight door 122 is provided between the pressing chamber 120 and the buffer chamber 130. The heating mechanism is provided on the cabin 100 and includes a first heating unit provided on the preheating chamber 110, a second heating unit provided on the pressing chamber 120, and a third heating unit provided on the buffer chamber 130. The first heating unit and the second heating unit are configured to perform gradient temperature control on the preheating chamber 110 and the pressing chamber 120, so that the temperatures of the preheating chamber 110 and the pressing chamber 120 increase sequentially. The vacuuming mechanism is provided on the cabin 100 and includes a first vacuuming unit provided on the preheating chamber 110, a second vacuuming unit provided on the pressing chamber 120, and a third vacuuming unit provided on the buffer chamber 130. When the first airtight door 121 is opened, the preheating chamber 110 and the pressing chamber 120 are connected and isolated from the outside of the cabin 100. When the second airtight door 122 is opened, the pressing chamber 120 and the buffer chamber 130 are connected and isolated from the outside of the cabin 100. The transfer mechanism 200 is provided on the cabin 100 and is used to transfer materials within the cabin 100.

[0024] like Figure 2 As shown, the interior of the cabin 100 is divided into a preheating bin 110, a pressing bin 120 and a buffer bin 130 in sequence along the material transmission direction. The preheating bin 110 and the pressing bin 120 are separated by a first airtight door 121, and the pressing bin 120 and the buffer bin 130 are separated by a second airtight door 122. The preheating bin 110 is located at the feed end and is provided with a feed bin door 111, and the buffer bin 130 is located at the discharge end and is provided with a discharge bin door 131. The heating mechanism includes a first heating unit, a second heating unit, and a third heating unit, wherein the first heating unit is connected to the preheating chamber 110, the second heating unit is connected to the pressing chamber 120, and the third heating unit is connected to the buffer chamber 130; the vacuuming mechanism includes a first vacuuming unit, a second vacuuming unit, and a third vacuuming unit, wherein the first vacuuming unit is connected to the preheating chamber 110, the second vacuuming unit is connected to the pressing chamber 120, and the third vacuuming unit is connected to the buffer chamber 130. Therefore, the preheating chamber 110, the pressing chamber 120, and the buffer chamber 130 all have independent temperature control and vacuum adjustment capabilities, and each chamber can set and maintain a specific temperature and vacuum environment at different process stages. The transfer mechanism 200 is set in the cabin 100, which is used to achieve precise positioning and transfer of materials.

[0025] Based on the configuration interface, the board type parameters and pressing process parameters of the PCB board 10 with embedded chips are obtained. Based on the pressing process parameters, the first heating unit controls the preheating chamber 110 to heat up to a first target temperature, the second heating unit controls the pressing chamber 120 to heat up to a second target temperature, and the second vacuum unit controls the pressing chamber 120 to reach a target vacuum level. When the preheating chamber 110 reaches the first target temperature, the drive mechanism opens the feed chamber door 111, the transfer mechanism 200 transfers the PCB board 10 to a first preset station in the preheating chamber 110, and then closes the feed chamber door 111. The first vacuum unit controls the preheating chamber 110 to reach a target vacuum level. When the preheating chamber 110 reaches the target vacuum level, the drive mechanism opens the first airtight door 121, the transfer mechanism 200 transfers the PCB board 10 to a second preset station in the pressing chamber 120, and then closes the first airtight door 121. The third vacuum unit controls the buffer bin 130 to reach the target vacuum level. The drive mechanism opens the second airtight door 122. The transfer mechanism 200 transfers the PCB board 10 to the third preset station in the buffer bin 130 and then closes the second airtight door 122. The third vacuum unit controls the buffer bin 130 to return to normal pressure. The drive mechanism opens the discharge bin door 131. The transfer mechanism 200 removes the pressed PCB board 10 and then closes the discharge bin door 131.

[0026] It should be noted that the chambers are independent of each other, and the temperature and vacuum environment can be matched to the requirements of different process stages. In the preheating chamber 110, the PCB board 10 is in a vacuum environment at the preheating temperature to fully soften the resin and expel internal gases. In the pressing chamber 120, the preheated resin can flow evenly and completely fill the chip gap. The gradient heating between the preheating chamber 110 and the pressing chamber 120 ensures that the semi-cured sheet resin reaches an optimal flow state. The vacuum environment of the preheating chamber 110 and the pressing chamber 120 effectively suppresses the formation of bubbles and micro-voids, while the gradient cooling of the buffer chamber 130 avoids quality defects caused by temperature fluctuations or pressure changes during the curing process of the resin, thereby improving product reliability and consistency. On the other hand, each process stage is carried out simultaneously in an independent chamber, ensuring that the vacuum environment is not interrupted while achieving uninterrupted and continuous operation of the pressing process, making the production rhythm more compact, which is conducive to improving production efficiency and reducing production cycle time.

[0027] It should be noted that if a slide rail mechanism that penetrates adjacent chambers is used to transport the PCB board 10, a complex through-section must be created between the chambers to accommodate the guide rails and transmission components. This through-section structure can damage the integrity of the chamber walls, resulting in discontinuous areas at the sealing interface. Because the vacuum lamination process places extremely high demands on the airtightness of the chambers, the presence of these through-sections can create micro-leakage channels during the vacuuming process. This can lead to aging of the sealing strips or expansion of structural gaps due to thermal deformation. Even with compensating measures such as sealing strips, the risk of seal failure still exists under high-temperature lamination conditions due to thermal deformation of the material. This can lead to further deterioration of the sealing performance after long-term use, further affecting the lamination quality of the PCB board 10 and causing defects such as delamination and bubbles in the product.

[0028] In some specific embodiments of the present invention, the transfer mechanism 200 includes a first conveyor belt 210, a second conveyor belt 220 and a third conveyor belt 230. The first conveyor belt 210 is arranged in the preheating chamber 110, and the first conveyor belt 210 is telescopically provided with a first telescopic end 211, and the first telescopic end 211 is used to connect with the external feeding system 20; the second conveyor belt 220 is arranged in the pressing chamber 120, and the second conveyor belt 220 is telescopically provided with a second telescopic end 2211 and a third telescopic end 2221, the second telescopic end 2211 is used to connect with the first conveyor belt 210, and the third telescopic end 2221 is used to connect with the third conveyor belt 230; the third conveyor belt 230 is arranged in the buffer chamber 130, and its front end is telescopically provided with a fourth telescopic end 231, the third telescopic end 2221 of the second conveyor belt 220 is used to connect with the third conveyor belt 230, and the fourth telescopic end 231 is used to connect with the external feeding system 20.

[0029] like Figure 1 、 Figure 3 and Figure 5 As shown, a first conveyor belt 210 is provided in the preheating chamber 110. The first conveyor belt 210 can be extended outward through a first telescopic end 211 and docked with the external feeding system 20; Figure 2 、 Figure 4 and Figure 6As shown, a second conveyor belt 220 is provided within the pressing chamber 120. The second conveyor belt 220 has a bidirectional telescopic function and can be connected to the preheating chamber 110 via a second telescopic end 2211 and to the buffer chamber 130 via a third telescopic end 2221. A third conveyor belt 230 is provided within the buffer chamber 130 and can be extended outwardly via a fourth telescopic end 231 to connect to the external feeding system 20. According to the technical solution of an embodiment of the present invention, to meet the requirements of precise control of different process stages, three independently controllable chambers are provided in the sealed box. Specifically, the sealed box adopts a completely built-in transfer mechanism 200 to replace the traditional slide rail mechanism that penetrates the chamber wall. The retractable conveyor belt achieves seamless conveyance of the PCB board 10. Since there is no transfer component passing through two adjacent chambers, the risk of sealing failure caused by thermal deformation of traditional slide rails is avoided under high-temperature pressing conditions. While maintaining efficient and continuous production, a more stable vacuum environment is achieved, which is conducive to improving equipment utilization and production efficiency.

[0030] It is worth noting that a fully built-in retractable conveyor belt replaces the traditional slide rail mechanism that penetrates the chamber wall within the sealed box. When the first airtight door 121 switches from a closed state to an open state, the second conveyor belt 220 extends from the pressing chamber 120 into the preheating chamber 110 via the second retractable end 2211. When the second airtight door 122 switches from a closed state to an open state, the second conveyor belt 220 extends from the pressing chamber 120 into the buffer chamber 130 via the third retractable end 2221. This allows for the transfer of PCB boards 10 without requiring any through-holes in the chamber partition walls. When either the first airtight door 121 or the second airtight door 122 switches from an open state to a closed state, the second retractable end 2211 of the second conveyor belt 220 and the third retractable end 2221 of the second conveyor belt 220 retract, and each chamber returns to an independent sealed space, ensuring the integrity of the vacuum environment.

[0031] It should be noted that the external feeding system 20 includes a feeding conveyor belt, the end of which forms a dockable material transmission interface with the feed end of the first conveyor belt 210, and the discharge end of the third conveyor belt 230 and the feeding conveyor belt connected to the downstream equipment form a continuous transmission path.

[0032] In some specific embodiments of the present invention, a plurality of the first conveyor belt 210, the second conveyor belt 220 and the third conveyor belt 230 are provided, the plurality of first conveyor belts 210 are parallel to each other and spaced apart, the plurality of second conveyor belts 220 are parallel to each other and spaced apart, the plurality of third conveyor belts 230 are parallel to each other and spaced apart, the second conveyor belts 220 and the first conveyor belts 210 are staggered in the left-right direction so that the second telescopic end 2211 penetrates between adjacent first conveyor belts 210, and the second conveyor belts 220 and the third conveyor belts 230 are staggered in the left-right direction so that the third telescopic end 2221 penetrates between adjacent third conveyor belts 230.

[0033] like Figure 2 As shown, multiple first conveyor belts 210 are arranged in the left-right direction in the preheating bin 110, multiple second conveyor belts 220 are arranged in the left-right direction in the pressing bin 120, and multiple third conveyor belts 230 are arranged in the left-right direction in the buffer bin 130. There is a gap between two adjacent first conveyor belts 210 to accommodate the passage of the second conveyor belts 220, and there is a gap between two adjacent third conveyor belts 230 to accommodate the passage of the second conveyor belts 220. It should be noted that when the transfer mechanism 200 transfers materials from the preheating bin 110 to the pressing bin 120, or from the pressing bin 120 to the buffer bin 130, if the conveyor belts between adjacent bins are completely aligned, there may be a risk of the materials shifting, getting stuck, or even falling during the transfer process due to mechanical positioning errors or thermal deformation. Therefore, the multiple first conveyor belts 210 arranged in parallel in the preheating bin 110 and the corresponding second conveyor belts 220 in the pressing bin 120 form a complementary conveying structure, and the multiple third conveyor belts 230 arranged in parallel in the buffer bin 130 and the corresponding second conveyor belts 220 in the pressing bin 120 form a complementary conveying structure. When the conveying operation is performed, the conveyor belts of adjacent chambers achieve staggered interlocking docking by controlling the corresponding telescopic ends, thereby forming a continuous transmission channel.

[0034] Specifically, the second conveyor belt 220 employs a second telescopic end 2211, staggered with the first conveyor belt 210, to ensure adequate support for the PCB board 10 during transfer between the preheating chamber 110 and the pressing chamber 120. Similarly, the staggered arrangement of the third telescopic end 2221 of the second conveyor belt 220 and the third conveyor belt 230 also ensures smooth transport of the PCB board 10 during the output phase. It should be noted that all conveyor belts are fully retracted into their respective chambers when not in operation, and the independent, sealed environment of each chamber can be maintained by closing the corresponding access door.

[0035] In some specific embodiments of the present invention, the second conveyor belt 220 includes a first conveyor unit 221 and a second conveyor unit 222, both of which extend in the front-to-back direction, and the second telescopic end 2211 is arranged at an end of the first conveyor unit 221 close to the first conveyor belt 210, and the second conveyor unit 222 is located at an end of the first conveyor unit 221 close to the third conveyor belt 230, and the third telescopic end 2221 is arranged at an end of the second conveyor unit 222 close to the third conveyor belt 230.

[0036] like Figure 4 and Figure 6 As shown, the first conveyor unit 221 is located at the front of the laminating chamber 120, and the second conveyor unit 222 is located at the rear of the laminating chamber 120, and the two are located on the same straight line. The rear end of the first conveyor unit 221 is a retractable second telescopic end 2211, which extends backward to form a seamless connection with the first conveyor belt 210 when conveying is required; the front end of the second conveyor unit 222 is a retractable third telescopic end 2221, which can extend forward to connect with the third conveyor belt 230. It should be noted that the first conveyor unit 221 and the second conveyor unit 222 are controlled by independent drive systems, and their operating directions are synchronized. Specifically, when conveying from the preheating chamber 110 to the pressing chamber 120, the second telescopic end 2211 of the first conveying unit 221 extends to seamlessly connect with the first conveyor belt 210. After the first conveyor belt 210 and the first conveying unit 221 cooperate to convey the PCB board 10 to the second preset position on the first conveying unit 221 and the second conveying unit 222, the first conveying unit 221 and the second conveying unit 222 stop conveying. When conveying from the pressing chamber 120 to the buffer chamber 130, the third telescopic end 2221 of the second conveying unit 222 extends out to form a continuous conveying path with the third conveyor belt 230. Its conveying process is the same as the conveying process between the preheating chamber 110 and the pressing chamber 120 mentioned above, and will not be further elaborated here.

[0037] It is worth noting that the first conveying unit 221 is specifically responsible for conveying the PCB board 10 in the preheating chamber 110 to the high-temperature zone of the pressing chamber 120, while the second conveying unit 222 is specifically responsible for transferring the pressed PCB board 10 to the low-temperature zone of the buffer chamber 130. This partitioned conveying design allows each conveyor belt assembly to only withstand the heat load of two temperature zones, thereby significantly reducing the risk of thermal deformation.

[0038] Specifically, the first conveyor belt 210 includes a fixed base, a drive shaft, a first shaft, a second shaft, a third shaft, a fourth shaft, a belt, a cylinder, and a limit frame. The first shaft and the second shaft are fixedly mounted on the fixed base in a vertical direction, with the first shaft located directly above the second shaft. The third shaft and the drive shaft are arranged horizontally on the same side of the first and second shafts, with the third shaft horizontally aligned with the first shaft and the drive shaft horizontally aligned with the second shaft. The fourth shaft is slidably connected to the limit groove of the fixed base via the limit frame and is driven by the cylinder to move in a direction perpendicular to the axial direction. The belt is sequentially wound around the first shaft, the second shaft, the third shaft, the fourth shaft, and the drive shaft to form a closed loop. When the cylinder is extended, it pushes the fourth shaft outward, extending the belt path and extending the first conveyor belt 210. When the cylinder is retracted, the fourth shaft returns inward, tightening the belt and shortening the first conveyor belt 210. It should be noted that the drive shaft is driven by a motor, driving the belt to circulate and realize material transportation, while the limit groove constrains the motion trajectory of the fourth shaft to ensure stable operation of the belt. The structures of the first conveying unit 221 , the second conveying unit 222 and the third conveying belt 230 are the same as those of the first conveying belt 210 , and are not described again here.

[0039] Some specific embodiments of the present invention further include a storage mechanism 300 disposed within the chamber 100 and configured to stack multiple groups of materials vertically. Specifically, the storage mechanism 300 is configured to vertically stack multiple groups of PCB boards 10 within the preheating chamber 110, the pressing chamber 120, and the buffer chamber 130, thereby enabling simultaneous processing of multiple layers of materials. This three-dimensional layout allows the equipment to simultaneously complete the preheating, pressing, and cooling processes for multiple PCB boards 10 within a single process cycle, thereby increasing production capacity per unit time.

[0040] In some specific embodiments of the present invention, the storage mechanism 300 includes: a first storage assembly 310, a second storage assembly 320 and a third storage assembly 330, wherein the first storage assembly 310 can be lifted and lowered in the preheating chamber 110, the first storage assembly 310 is located on one side of the first conveyor belt 210, and the first storage assembly 310 is used to lift the material on the first conveyor belt 210 to a preset height or to lower the material at a preset height to the first conveyor belt 210; the second storage assembly 320 can be lifted and lowered in the pressing chamber 12 0, the second storage component 320 is located on one side of the second conveyor belt 220, and the second storage component 320 is used to lift the material on the second conveyor belt 220 to a preset height or lower the material at a preset height to the second conveyor belt 220; the third storage component 330 is arranged in a liftable manner in the buffer bin 130, and the third storage component 330 is located on one side of the third conveyor belt 230, and the third storage component 330 is used to lift the material on the third conveyor belt 230 to a preset height or lower the material at a preset height to the third conveyor belt 230.

[0041] like Figure 7 As shown, a first storage assembly 310 is provided in the preheating chamber 110, a second storage assembly 320 is provided in the pressing chamber 120, and a third storage assembly 330 is provided in the buffer chamber 130. The first storage assembly 310, the second storage assembly 320 and the third storage assembly 330 can all be raised and lowered on the inner wall of the cabin body 100, wherein the first storage assembly 310 is located on one side of the first conveyor belt 210, and its lifting trajectory passes through the first conveyor belt 210 up and down, that is, under a certain working condition, the first storage assembly 310 will rise from the bottom of the first conveyor belt 210 to the top of the first conveyor belt 210. It should be noted that the first conveyor belt 210 located inside the preheating chamber 110 is equipped with a first receiving assembly 310, the second conveyor belt 220 located inside the pressing chamber 120 is equipped with a second receiving assembly 320, and the third conveyor belt 230 located inside the buffer chamber 130 is equipped with a third receiving assembly 330. The receiving assemblies in each chamber are raised and lowered to control the handover process of the PCB board 10. Specifically, Figure 4 and Figure 6 As shown, when the PCB board 10 needs to be transported from the preheating chamber 110 to the pressing chamber 120, the second telescopic end 2211 of the second conveyor belt 220 extends into the preheating chamber 110 and docks with the first conveyor belt 210. The first storage assembly 310 descends to place the PCB board 10 on the first conveyor belt 210. The first conveyor belt 210 and the second conveyor belt 220 cooperate to transport the PCB board 10 from the preheating chamber 110 to the pressing chamber 120. The corresponding second storage assembly 320 in the pressing chamber 120 rises and lifts the PCB board 10 to be stacked and stored in a vertical direction. After transportation is completed, the second telescopic end 2211 is fully retracted. Similarly, when the PCB board 10 needs to be transported from the pressing chamber 120 to the buffer chamber 130, the third telescopic end 2221 of the second conveyor belt 220 extends into the buffer chamber 130 and docks with the third conveyor belt 230. The second storage assembly 320 descends, placing the PCB board 10 on the second conveyor belt 220. The second and third conveyor belts 220 and 230 then work together to transport the PCB board 10 from the pressing chamber 120 to the buffer chamber 130. The corresponding third storage assembly 330 in the buffer chamber 130 rises and lifts the PCB board 10 for vertical stacking and storage. After transport is complete, the third telescopic end 2221 fully retracts. Throughout this process, all conveyor belts perform transport operations between adjacent chambers without disrupting the sealing continuity of the chamber walls.

[0042] In some specific embodiments of the present invention, the first storage component 310 includes two first support plates 311 arranged in parallel, and the two first support plates 311 can be synchronously raised and lowered and arranged on opposite sides of the first conveyor belt 210, and each first support plate 311 is correspondingly provided with a first correcting plate 312, and the first correcting plate 312 is connected to the corresponding first support plate 311 through an elastic reset member, and the first correcting plate 312 is rotatably connected to the top of the corresponding first support plate 311, and the two first correcting plates 312 are inclined toward each other to form a guide channel, and the first correcting plate 312 is used to correct the position deviation of the material; the second storage component 320 includes two second support plates 321 arranged in parallel, and the two second support plates 321 can be synchronously raised and lowered and arranged on opposite sides of the second conveyor belt 220, and each second support plate 321 is Each of them is provided with a corresponding second correcting plate, which is connected to the corresponding second support plate 321 through an elastic reset member, and the second correcting plate is rotatably connected to the top of the corresponding second support plate 321, and the two second correcting plates are inclined toward each other to form a guide channel, and the second correcting plate is used to correct the position deviation of the material; the third storage component 330 includes two third support plates 331 arranged in parallel, and the two third support plates 331 can be synchronously lifted and lowered on opposite sides of the third conveyor belt 230, and each third support plate 331 is correspondingly provided with a third correcting plate, which is connected to the corresponding third support plate 331 through an elastic reset member, and the third correcting plate is rotatably connected to the top of the corresponding third support plate 331, and the two third correcting plates are inclined toward each other to form a guide channel, and the third correcting plate is used to correct the position deviation of the material.

[0043] like Figure 7 and Figure 8 As shown, Figure 8 for Figure 7 The structural diagram of the first supporting plate and the first correcting plate in FIG. 1 is as follows: Figure 7The structural schematic diagram in can also represent the structure of the second support plate and the second correcting plate, and the third support plate and the third correcting plate. In some specific embodiments of the present invention, two first circulating transmission members are provided in the preheating chamber 110, the two first circulating transmission members are vertically arranged and arranged relative to each other, a plurality of first support plates 311 are provided on the first circulating transmission member, the plurality of first support plates 311 are equidistantly arranged in the vertical direction, a first correcting plate 312 is provided between two vertically adjacent first support plates 311, two horizontally adjacent first correcting plates 312 form a guide channel with an upper flared opening, and two horizontally adjacent first support plates 311 form a supporting platform for lifting the PCB board 10, and the first circulating transmission member is used to drive the first storage assembly 310 to rise and fall; two second circulating transmission members are provided in the pressing chamber 120, the two second circulating transmission members are vertically arranged and arranged relative to each other, a plurality of second support plates 321 are provided on the second circulating transmission member, the plurality of second support plates 321 are equidistantly arranged in the vertical direction, and the plurality of second support plates 321 are equidistantly arranged in the vertical direction. A second correcting plate is provided between two adjacent second support plates 321, and two horizontally adjacent second correcting plates form a guide channel with an upper flared opening. Two horizontally adjacent second support plates 321 form a supporting platform for lifting the PCB board 10, and the second circulating transmission member is used to drive the second storage assembly 320 to rise and fall; two third circulating transmission members are provided in the buffer bin 130, and the two third circulating transmission members are vertically arranged and arranged opposite to each other. A plurality of third support plates 331 are provided on the third circulating transmission member, and the plurality of third support plates 331 are equidistantly arranged in the vertical direction. A third correcting plate is provided between two vertically adjacent third support plates 331, and two horizontally adjacent third correcting plates form a guide channel with an upper flared opening. Two horizontally adjacent third support plates 331 form a supporting platform for lifting the PCB board 10, and the third circulating transmission member is used to drive the third storage assembly 330 to rise and fall. According to the technical solution of the embodiment of the present invention, taking the preheating chamber 110 as an example, when the PCB board 10 is fed into the preheating chamber 110 by the first conveyor belt 210, the first pallet 311 located below the first conveyor belt 210 rises to a preset height and completes the reception of the PCB board 10. Before contacting the first pallet 311, the PCB board 10 will contact the first correcting plate 312 before the first pallet 311. Under the guidance of the first correcting plate 312, the direction of the PCB board 10 is corrected to ensure that it is subsequently placed smoothly.

[0044] When the PCB board 10 enters the preheating chamber 110 via the first conveyor belt 210, the first pallet 311 rises from its initial position to a preset height, ready to receive the PCB board 10. Before the PCB board 10 contacts the first pallet 311, its edge first contacts the first deflection-correcting plate 312 positioned at the receiving position. When the PCB board 10 contacts the first deflection-correcting plate 312, it automatically adjusts its position due to friction and guidance to eliminate offset errors generated during transportation, allowing the PCB board 10 to accurately align with the predetermined position. After deflection correction is completed, as the first pallet 311 continues to rise, the PCB board 10 completely detaches from the first conveyor belt 210. The precisely corrected PCB board 10 now lands smoothly on the raised first pallet 311. The pressing chamber 120 and the buffer chamber 130 are configured in the same manner as the preheating chamber 110 and will not be further described here.

[0045] It should be noted that if Figure 7 As shown, the first, second, and third circulating transmission members can utilize a synchronous belt drive system. Specifically, taking the preheating chamber 110 as an example, a pair of synchronous belt drive mechanisms are vertically mounted on the inner wall of the sealed box, extending left and right within the preheating chamber 110. These synchronous belt drive mechanisms include synchronous pulleys mounted on the top and bottom of the preheating chamber 110, a synchronous belt that loops around the pulleys, and a servo motor that drives one of the pulleys. On the outer sides of the synchronous belts, multiple first support plates 311 are fixedly mounted at equal intervals along their length. The spacing between adjacent first support plates 311 is determined based on the thickness of the PCB 10 and process requirements. It should be noted that the synchronous belts in the two sets of synchronous belt drive mechanisms rotate in opposite directions, resulting in a one-to-one horizontal alignment of the first support plates 311 on each set, forming a first storage assembly 310 for supporting the PCBs 10. The corresponding circulating transmission members in the pressing chamber 120 and the buffer chamber 130 are configured in the same manner as in the preheating chamber 110 and will not be further described here. When the PCB boards 10 are delivered to the preheating chamber 110 by the first conveyor belt 210, the control system controls the servo motor to drive the two synchronous belts to operate synchronously, causing the first storage assembly 310 to rise until its top contacts the bottom of the PCB board 10 and smoothly lift the PCB board 10 off the surface of the first conveyor belt 210, while ensuring that the PCB board 10 remains horizontal. This cycle is repeated to achieve the layer-by-layer stacking of the PCB boards 10. When the PCB boards 10 need to be transferred, the servo motor drives the synchronous belts to operate in the reverse direction, causing the first storage assembly 310 to descend to a position below the first conveyor belt 210, and the corresponding PCB board 10 is lowered onto the surface of the first conveyor belt 210. This cycle is repeated to achieve the individual output of the PCB boards 10.

[0046] In some specific embodiments of the present invention, the transfer mechanism 200 also includes a fourth conveyor belt 240, a fifth conveyor belt 250 and a sixth conveyor belt 260. The fourth conveyor belt 240 is arranged in the preheating chamber 110, and the fourth conveyor belt 240 is arranged parallel to one side of the first conveyor belt 210. The fifth conveyor belt 250 is arranged in the pressing chamber 120, and the fifth conveyor belt 250 is arranged parallel to one side of the second conveyor belt 220. The sixth conveyor belt 260 is arranged in the buffer chamber 130, and the sixth conveyor belt 260 is arranged parallel to one side of the third conveyor belt 230. The fourth conveyor belt 240, the fifth conveyor belt 250 and the sixth conveyor belt 260 are all used to support and assist in transporting the PCB board 10.

[0047] like Figure 2 As shown, a fourth conveyor belt 240 is arranged parallel to the side of the first conveyor belt 210, a fifth conveyor belt 250 is arranged parallel to the side of the second conveyor belt 220, and a sixth conveyor belt 260 is arranged parallel to the side of the third conveyor belt 230. In some specific embodiments of the present invention, two fourth conveyor belts 240 are provided, and the first conveyor belt 210 is arranged between the two fourth conveyor belts 240. The fifth conveyor belt 250 and the sixth conveyor belt 260 are arranged in the same manner as the fourth conveyor belt 240, and will not be further described here. It should be noted that, taking the fourth conveyor belt 240 as an example, the fourth conveyor belt 240 serves as an auxiliary conveying structure for the first conveyor belt 210 and operates synchronously with the first conveyor belt 210. That is, when the PCB board 10 is transported from the preheating chamber 110 to the pressing chamber 120, the first conveyor belt 210 and the fourth conveyor belt 240 are activated simultaneously, forming a composite support surface adapted to the width of the PCB board 10, thereby improving the stability of PCB boards 10 of different specifications during transportation.

[0048] In some specific embodiments of the present invention, a temporary storage mechanism is further included, wherein the output end of the temporary storage mechanism is connected to the input end of the preheating chamber 110, wherein the temporary storage mechanism includes a frame, and two fourth circulation transmission members arranged on the frame and a temporary storage conveying member horizontally arranged below the two fourth circulation transmission members, the two fourth circulation transmission members are vertically arranged and arranged opposite to each other, and a plurality of fourth pallets are provided on the fourth circulation transmission member, and the plurality of fourth pallets are equidistantly arranged in the vertical direction, and two horizontally adjacent fourth pallets form a fourth storage platform for supporting the PCB board 10.

[0049] It should be noted that if the upstream production line continuously conveys PCB boards 10 at a high rate, while the laminating equipment laminates the PCB boards 10 at a relatively long cycle, the speed mismatch between the two will lead to a significant processing delay, which in turn causes the PCB boards 10 to pile up and become congested at the inlet of the preheating chamber 110, reducing overall equipment utilization. Therefore, based on this operating condition, a temporary storage mechanism is provided at the input end of the preheating chamber 110. Specifically, the temporary storage conveyor comprises a plurality of parallel temporary storage conveyor belts, with a gap between adjacent temporary storage conveyor belts allowing the first conveyor belt 210 to pass through. In other words, the plurality of temporary storage conveyor belts and the first conveyor belt 210 form an interlaced conveying structure. When the temporarily stored PCB boards 10 are fed into the preheating chamber 110, the first conveyor belt 210 of the preheating chamber 110 controls the first telescopic end 211 to extend outward to achieve docking with the temporary storage conveyor belt, thereby forming a continuous transmission channel.

[0050] It should be noted that the fourth circulating transmission element adopts a synchronous belt transmission mechanism. Specifically, the synchronous belt transmission mechanism includes synchronous pulleys respectively mounted on the top and bottom of the frame, a synchronous belt that runs closed around the pulleys, and a servo motor that drives one of the pulleys to rotate. On the outer surface of the synchronous belt, a plurality of fourth pallets are fixedly mounted at equal intervals along the length direction. The fourth pallets on the two sets of synchronous belt transmission mechanisms correspond one to one in the horizontal direction, forming a fourth storage platform for supporting the PCB board 10. When the PCB board 10 is output from the upstream process, the control system activates the synchronous belt transmission mechanism, and the servo motor drives the synchronous belt to operate, causing the fourth pallet to rise until its top contacts the bottom of the PCB board 10 and smoothly lift the PCB board 10 off the surface of the temporary storage conveyor belt. This cycle is repeated to stack the PCB boards 10 layer by layer in the vertical direction, achieving the purpose of caching the PCB boards 10. When the PCB boards 10 in the pressing chamber 120 complete the pressing process, the PCB boards 10 in the preheating chamber 110 are transferred to the pressing chamber 120. At this time, the PCB boards 10 temporarily stored in the temporary storage mechanism are ready to be transferred to the preheating chamber 110. When the preheating chamber 110 is depressurized and the chamber door is opened, the servo motor drives the synchronous belt to operate, causing the fourth pallet to descend to a position below the temporary storage conveyor belt, so as to smoothly lower the PCB boards 10 onto the surface of the temporary storage conveyor belt. This cycle is repeated, and the PCB boards 10 are output to the preheating chamber 110 one by one.

[0051] In addition, multiple temporary storage mechanisms can be provided, and the multiple temporary storage mechanisms are arranged in sequence along the conveying direction of the external feeding system 20. Thus, the PCB boards 10 output by the upstream production line can be dynamically allocated to the optimal temporary storage mechanism according to the real-time working conditions. That is, when the pressing process rhythm lags behind, the temporary storage mechanism stores excess panels output by the upstream production line. After the pressing chamber 120 is ready, the PCB boards 10 in the temporary storage mechanism are called in sequence for subsequent processing.

[0052] It is worth noting that after the upstream process inputs the PCB boards 10 into the temporary storage mechanism in forward order, the reverse order is adopted between the temporary storage mechanism and the preheating chamber 110. The forward order is restored between the preheating chamber 110 and the pressing chamber 120. The reverse order is adopted again between the pressing chamber 120 and the buffer chamber 130. Finally, the buffer chamber 130 outputs the PCB boards 10 in the original forward order. The original arrangement order of the PCB boards 10 is maintained during the execution of the entire pressing process. Therefore, the output sequence of the PCB boards 10 after multi-chamber transportation and two hours of pressing is completely consistent with the initial input, which is conducive to PCB production traceability.

[0053] In some specific embodiments of the present invention, a first anti-slip layer is provided on the top of the first pallet 311, a second anti-slip layer is provided on the top of the second pallet 321, and a third anti-slip layer is provided on the top of the third pallet 331. The first, second, and third anti-slip layers are used to prevent material displacement during the lifting process. Specifically, to prevent relative slippage between the PCB board 10 and each supporting platform during the vacuum pressing process, an anti-slip structure is provided on each pallet. When the PCB board 10 is received by the corresponding pallet in the chamber, the anti-slip layer on the pallet surface interlocks with the PCB board 10, thereby preventing interlayer misalignment and bubble defects caused by board displacement during the PCB pressing process.

[0054] Specifically, the anti-slip layer adopts silicone rubber modified epoxy resin.

[0055] Please refer to Figure 2 and Figure 9 This embodiment discloses a multi-chamber vacuum pressing method for embedded core circuit boards, which is applied to the aforementioned multi-chamber vacuum pressing device for embedded core circuit boards, and the device also includes: The driving mechanism is provided on the cabin body and is respectively connected to the feed bin door 111, the discharge bin door 131, the first airtight door 121 and the second airtight door 122 to ensure the synchronous opening and closing of each door body; The control mechanism is electrically connected to the heating mechanism, the vacuuming mechanism, the transfer mechanism 200 and the driving mechanism. The control mechanism serves as the center of the system, receives feedback signals from each mechanism in real time, and adjusts the operating status of each mechanism accordingly; Methods include: Obtaining the board type parameters and pressing process parameters of the PCB board 10 based on the configuration interface; Based on the pressing process parameters, the first heating unit controls the preheating chamber 110 to heat up to a first target temperature, the second heating unit controls the pressing chamber 120 to heat up to a second target temperature, and the second vacuum unit controls the pressing chamber 120 to reach a target vacuum degree; When the preheating chamber 110 reaches the first target temperature, the driving mechanism opens the feed chamber door 111, the transfer mechanism 200 transfers the PCB board 10 to the first preset station in the preheating chamber 110, and then closes the feed chamber door 111. The first vacuum unit controls the preheating chamber 110 to reach the target vacuum level. When the preheating chamber 110 reaches the target vacuum level, the driving mechanism opens the first airtight door 121, and the transfer mechanism 200 transfers the PCB board 10 to the second preset station in the pressing chamber 120 and then closes the first airtight door 121; The third vacuum unit controls the buffer chamber 130 to reach the target vacuum level, the driving mechanism opens the second airtight door 122, and the transfer mechanism 200 transfers the PCB board 10 to the third preset station in the buffer chamber 130 and then closes the second airtight door 122; The third vacuum unit controls the buffer bin 130 to return to normal pressure, the driving mechanism opens the discharge bin door 131 , and the transfer mechanism 200 outputs the pressed PCB board 10 and then closes the discharge bin door 131 .

[0056] In some specific embodiments of the present invention, after closing the first airtight door 121 , the preheating chamber 110 is controlled to return to normal pressure, the feed chamber door 111 is opened, and the next PCB board 10 is fed into the preheating chamber 110 .

[0057] In some specific embodiments of the present invention, after closing the second airtight door 122 , the first airtight door 121 is opened, and the transfer mechanism 200 is controlled to transfer the preheated PCB board 10 in the preheating chamber 110 into the pressing chamber 120 .

[0058] The following is a specific embodiment to illustrate the multi-chamber vacuum pressing method of the embedded core circuit board.

[0059] Obtaining the board type parameters and pressing process parameters of the PCB board 10 based on the configuration interface; Based on the lamination process parameters, the first heating unit controls the preheating chamber 110 to heat up to a first target temperature, the second heating unit controls the lamination chamber 120 to heat up to a second target temperature, and the second vacuum unit controls the lamination chamber 120 to reach a target vacuum level, wherein the first target temperature is 80°C, the second target temperature is 160°C, and the target vacuum level is 0.01 bar. When the preheating chamber 110 reaches the first target temperature, the driving mechanism opens the feed chamber door 111 and controls the first telescopic end 211 of the first conveyor belt 210 to extend outward, so that the first conveyor belt 210 and the external feeding system 20 form a continuous conveying path. The PCB boards 10 are conveyed one by one to the first preset position directly below the first storage assembly 310 by the first conveyor belt 210. The first circulating transmission member is controlled to drive the first storage assembly 310 to rise to a preset height. The conveying action of the first conveyor belt 210 and the rising action of the first storage assembly 310 are repeated to stack the PCB boards 10 layer by layer in the vertical direction. When the number of stacked layers reaches the preset number, the first telescopic end 211 is controlled to smoothly retract to the initial position, the feed chamber door 111 is closed, and the first vacuum unit controls the preheating chamber 110 to reach the target vacuum degree. When the preheating chamber 110 reaches the target vacuum degree, the driving mechanism opens the first airtight door 121, controls the second telescopic end 2211 of the first conveying unit 221 to extend outward, so that the first conveying unit 221 and the first conveyor belt 210 form a continuous conveying path, controls the first circulating transmission member to drive the first storage assembly 310 to descend to a preset height, so that the PCB boards 10 stacked on the bottom layer are smoothly lowered to the first conveyor belt 210, and controls the first conveyor belt 210 and the second conveyor belt 220 to operate in coordination, and continuously transports the lowered PCB boards 10 to the second preset position corresponding to the second storage assembly 320. , control the second circulating transmission member to drive the second storage assembly 320 to rise to a preset height, so that the top of the second storage assembly 320 contacts the lower end surface of the PCB board 10 to achieve stable lifting, repeat the conveying action of the first conveyor belt 210 and the second conveyor belt 220 and the rising action of the second storage assembly 320, and stack the PCB boards 10 layer by layer in the vertical direction. After all the PCB boards 10 in the preheating chamber 110 are conveyed, control the second telescopic end 2211 to smoothly retract to the initial position, close the first airtight door 121, and control the mechanism to adjust the pressing pressure in the pressing chamber 120 to 27kg / cm 2 The pressing chamber 120 performs the pressing process according to the preset pressing time of 2 hours, and the preheating chamber 110 releases the pressure and receives the next batch of PCB boards 10; After the third vacuum unit controls the buffer bin 130 to reach the target vacuum degree, the driving mechanism opens the second airtight door 122, controls the third telescopic end 2221 of the second conveying unit 222 to extend outward, so that the third conveyor belt 230 and the second conveyor unit 222 form a continuous conveying path, controls the second circulating transmission member to drive the second storage assembly 320 to descend to a preset height, so that the PCB board 10 stacked on the bottom layer is smoothly lowered to the second conveyor belt 220, controls the second conveyor belt 220 and the third conveyor belt 230 to operate in coordination, and continuously conveys the lowered PCB board 10 to the second conveyor belt 220. The third storage assembly 330 is positioned at a third preset position corresponding to the third storage assembly 330; the third circulating transmission member is controlled to drive the third storage assembly 330 to rise to a preset height, so that the top of the third storage assembly 330 contacts the lower end surface of the PCB board 10 to achieve stable support, and the conveying action of the second conveyor belt 220 and the third conveyor belt 230 and the rising action of the third storage assembly 330 are repeated to stack the PCB boards 10 layer by layer in the vertical direction. After all the PCB boards 10 in the preheating chamber 110 are conveyed, the third telescopic end 2221 is controlled to smoothly retract to the initial position, and the second airtight door 122 is closed; The third vacuum unit controls the buffer chamber 130 to restore normal pressure, drives the mechanism to open the discharge chamber door 131, and controls the fourth telescopic end 231 of the third conveyor belt 230 to extend outward, so that the third conveyor belt 230 and the external feeding system 20 form a continuous conveying path. The third circulating transmission member controls the third storage assembly 330 to descend to a preset height, so that the PCB boards 10 stacked on the bottom layer are smoothly lowered to the third conveyor belt 230. The third conveyor belt 230 and the external feeding system 20 are controlled to operate in coordination, continuously conveying the lowered PCB boards 10 to the external feeding system 20, and closing the discharge chamber door 131. At the same time, the first airtight door 121 is opened to transfer the PCB boards 10 in the preheating chamber 110 to the pressing chamber 120. This cycle repeats to ensure continuous production.

[0060] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the scope of the present invention.

Claims

1. A multi-chamber vacuum pressing device for embedded core circuit boards, characterized in that: include: The cabin (100) is sequentially divided into a preheating bin (110), a pressing bin (120), and a buffer bin (130) along a material transmission direction; the preheating bin (110) is provided with a feed bin door (111); the buffer bin (130) is provided with a discharge bin door (131); a first airtight door (121) is provided between the preheating bin (110) and the pressing bin (120); and a second airtight door (122) is provided between the pressing bin (120) and the buffer bin (130); The heating mechanism comprises a first heating unit provided on the preheating chamber (110), a second heating unit provided on the pressing chamber (120), and a third heating unit provided on the buffer chamber (130), wherein the first heating unit and the second heating unit are configured to perform gradient temperature control on the preheating chamber (110) and the pressing chamber (120), so that the temperatures of the preheating chamber (110) and the pressing chamber (120) increase in sequence; A vacuum pumping mechanism comprises a first vacuum pumping unit provided on the preheating chamber (110), a second vacuum pumping unit provided on the pressing chamber (120), and a third vacuum pumping unit provided on the buffer chamber (130); when the first airtight door (121) is opened, the preheating chamber (110) and the pressing chamber (120) are connected and isolated from the outside of the chamber body (100); when the second airtight door (122) is opened, the pressing chamber (120) and the buffer chamber (130) are connected and isolated from the outside of the chamber body (100); A transfer mechanism (200) is provided on the cabin (100), and the transfer mechanism (200) is used to transfer materials in the cabin (100).

2. The multi-chamber vacuum pressing equipment for embedded core circuit boards according to claim 1, characterized in that: The material is transferred from the back to the front, and the transfer mechanism (200) includes: a first conveyor belt (210), the first conveyor belt (210) being arranged in the preheating chamber (110), the rear end of the first conveyor belt (210) being telescopically provided with a first telescopic end (211), the first telescopic end (211) being used for connecting with an external feeding system (20); a second conveyor belt (220), the second conveyor belt (220) being arranged in the pressing chamber (120), the rear end of the second conveyor belt (220) being telescopically provided with a second telescopic end (2211), the front end of the second conveyor belt (220) being telescopically provided with a third telescopic end (2221), the second telescopic end (2211) being used for connecting with the first conveyor belt (210); A third conveyor belt (230), the third conveyor belt (230) is arranged in the buffer bin (130), the third telescopic end (2221) is used to connect with the third conveyor belt (230), and the front end of the third conveyor belt (230) is telescopically provided with a fourth telescopic end (231), and the fourth telescopic end (231) is used to connect with the external feeding system (20).

3. The multi-chamber vacuum pressing equipment for embedded core circuit boards according to claim 2, characterized in that: The first conveyor belt (210), the second conveyor belt (220) and the third conveyor belt (230) are each provided in plurality, the plurality of the first conveyor belts (210) are arranged in parallel and at intervals, the plurality of the second conveyor belts (220) are arranged in parallel and at intervals, the plurality of the third conveyor belts (230) are arranged in parallel and at intervals, the second conveyor belts (220) and the first conveyor belt (210) are staggered in the left-right direction so that the second telescopic end (2211) passes between adjacent first conveyor belts (210), and the second conveyor belts (220) and the third conveyor belt (230) are staggered in the left-right direction so that the third telescopic end (2221) passes between adjacent third conveyor belts (230).

4. The multi-chamber vacuum pressing equipment for embedded core circuit boards according to claim 3, characterized in that: The second conveyor belt (220) includes a first conveyor unit (221) and a second conveyor unit (222), the first conveyor unit (221) and the second conveyor unit (222) both extending in the front-to-back direction, the second telescopic end (2211) being arranged at an end of the first conveyor unit (221) close to the first conveyor belt (210), the second conveyor unit (222) being located at an end of the first conveyor unit (221) close to the third conveyor belt (230), and the third telescopic end (2221) being arranged at an end of the second conveyor unit (222) close to the third conveyor belt (230).

5. The multi-chamber vacuum pressing equipment for embedded core circuit boards according to claim 2, characterized in that: It also includes a storage mechanism (300), which is arranged in the cabin (100) and is used to stack multiple groups of materials in sequence along a vertical direction.

6. The multi-chamber vacuum pressing equipment for embedded core circuit boards according to claim 5, characterized in that: The storage mechanism (300) comprises: a first receiving assembly (310), the first receiving assembly (310) being movably disposed in the preheating chamber (110), the first receiving assembly (310) being located on one side of the first conveyor belt (210), and the first receiving assembly (310) being used to lift materials on the first conveyor belt (210) to a preset height or to lower materials at a preset height onto the first conveyor belt (210); a second receiving assembly (320), the second receiving assembly (320) being movably disposed in the pressing chamber (120), the second receiving assembly (320) being located on one side of the second conveyor belt (220), and the second receiving assembly (320) being used to lift the material on the second conveyor belt (220) to a preset height or to lower the material at the preset height to the second conveyor belt (220); A third receiving assembly (330) is provided in the buffer bin (130) in a liftable manner. The third receiving assembly (330) is located on one side of the third conveyor belt (230). The third receiving assembly (330) is used to lift the material on the third conveyor belt (230) to a preset height or to lower the material at the preset height to the third conveyor belt (230).

7. The multi-chamber vacuum pressing equipment for embedded core circuit boards according to claim 6, characterized in that: The first storage assembly (310) includes two first support plates (311) arranged in parallel, the two first support plates (311) can be synchronously raised and lowered and arranged on opposite sides of the first conveyor belt (210), each first support plate (311) is correspondingly provided with a first deviation correcting plate (312), the first deviation correcting plate (312) is connected to the corresponding first support plate (311) through an elastic reset member, the first deviation correcting plate (312) is rotatably connected to the upper side of the corresponding first support plate (311), the two first deviation correcting plates (312) are inclined toward each other to form a guide channel, and the first deviation correcting plate (312) is used to correct the position deviation of the material; The second storage assembly (320) includes two second support plates (321) arranged in parallel, the two second support plates (321) can be synchronously raised and lowered and arranged on opposite sides of the second conveyor belt (220), each second support plate (321) is correspondingly provided with a second correcting plate, the second correcting plate is connected to the corresponding second support plate (321) through an elastic reset member, the second correcting plate is rotatably connected to the upper side of the corresponding second support plate (321), the two second correcting plates are inclined towards each other to form a guide channel, and the second correcting plate is used to correct the position deviation of the material; The third storage assembly (330) includes two third support plates (331) arranged in parallel. The two third support plates (331) can be synchronously raised and lowered on opposite sides of the third conveyor belt (230). Each of the third support plates (331) is correspondingly provided with a third correcting plate. The third correcting plate is connected to the corresponding third support plate (331) through an elastic reset member. The third correcting plate is rotatably connected to the top of the corresponding third support plate (331). The two third correcting plates are inclined toward each other to form a guide channel. The third correcting plate is used to correct the position deviation of the material.

8. The multi-chamber vacuum pressing equipment for embedded core circuit boards according to claim 7, characterized in that: A first anti-slip layer is provided on the top of the first support plate (311), a second anti-slip layer is provided on the top of the second support plate (321), and a third anti-slip layer is provided on the top of the third support plate (331). The first anti-slip layer, the second anti-slip layer and the third anti-slip layer are used to prevent displacement of materials during the lifting process.

9. A multi-chamber vacuum pressing method for embedded core circuit boards, characterized in that: The multi-chamber vacuum pressing device for embedded core circuit boards according to any one of claims 1 to 8, further comprising: a driving mechanism, arranged on the cabin body (100), the driving mechanism being connected to the feed bin door (111), the discharge bin door (131), the first airtight door (121), and the second airtight door (122), respectively; a control mechanism, the control mechanism being electrically connected to the heating mechanism, the vacuuming mechanism, the transfer mechanism (200), and the driving mechanism; The method comprises: Obtaining the plate type parameters and pressing process parameters of the PCB board (10) based on the configuration interface; Based on the pressing process parameters, the first heating unit controls the preheating chamber (110) to heat up to a first target temperature, the second heating unit controls the pressing chamber (120) to heat up to a second target temperature, and the second vacuuming unit controls the pressing chamber (120) to reach a target vacuum degree; When the preheating bin (110) reaches the first target temperature, the driving mechanism opens the feed bin door (111), the transfer mechanism (200) transfers the PCB board (10) to a first preset station in the preheating bin (110) and then closes the feed bin door (111), and the first vacuum unit controls the preheating bin (110) to reach a target vacuum degree; When the preheating chamber (110) reaches a target vacuum degree, the driving mechanism opens the first airtight door (121), and the transfer mechanism (200) transfers the PCB board (10) to a second preset station in the pressing chamber (120) and then closes the first airtight door (121); The third vacuum pumping unit controls the buffer bin (130) to reach a target vacuum degree, the driving mechanism opens the second airtight door (122), and the transfer mechanism (200) transfers the PCB board (10) to a third preset station in the buffer bin (130) and then closes the second airtight door (122); The third vacuum unit controls the buffer bin (130) to restore normal pressure, the drive mechanism opens the discharge bin door (131), and the transfer mechanism (200) closes the discharge bin door (131) after outputting the pressed PCB board (10).

10. The multi-chamber vacuum pressing method for embedded core circuit board according to claim 9, characterized in that: After closing the first airtight door (121), the preheating chamber (110) is controlled to return to normal pressure, the feeding chamber door (111) is opened, and the next PCB board (10) is fed into the preheating chamber (110).

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