Pump-driven two-phase flow system for cooling large data center machine room

Abstract

The invention relates to a pump-driven two-phase flow system for cooling a large data center machine room, which comprises a two-phase flow refrigerant supply and transmission device, a refrigeration cycle refrigerant supply and transmission device, a cooling water supply and transmission device, a fan coil and a plate heat exchanger, the refrigeration cycle refrigerant supply and transmission device is provided with a conveying flow channel, and the cooling water supply and transmission device is provided with a water conveying pipeline. The water conveying pipeline and the conveying runner exchange heat through the evaporator; the fan coil is communicated with the water conveying pipeline; the conveying pipeline and the water conveying pipeline exchange heat through the plate heat exchanger. Therefore, not only can higher heat dissipation capability be provided, but also energy consumption caused by heat dissipation can be reduced as much as possible.

Description

Technical Field

[0001] The present invention relates to the field of pump-driven two-phase flow heat transfer equipment, and in particular to a pump-driven two-phase flow system for cooling a large data center computer room. Background Art

[0002] With the continuous advancement of electronic technology, electronic devices are moving towards high power and high energy efficiency. While increasing integration effectively reduces their footprint, heat dissipation is becoming increasingly important. Most electronic device failures are caused by high temperatures. Furthermore, for components sensitive to thermal stress, heat dissipation also requires ensuring that temperature uniformity and temperature fluctuations meet requirements.

[0003] In order to meet the heat dissipation needs of these places, the existing research direction has been transitioned from air cooling and liquid cooling to pump-driven two-phase flow cooling systems with higher heat dissipation potential. At the same time, in order to reduce the energy consumption of pump-driven two-phase flow cooling systems.

[0004] Therefore, there is a need for a system that can provide higher heat dissipation capacity and reduce the energy consumption caused by heat dissipation as much as possible, and meet the existing environmental requirements through a pump-driven two-phase flow cooling system with a phase change energy storage heat exchanger. Summary of the Invention

[0005] In light of the aforementioned prior art, in order to meet the heat dissipation requirements of these locations, current research has shifted from air cooling and liquid cooling to pump-driven two-phase flow cooling systems with higher heat dissipation potential. Furthermore, to more efficiently utilize cooling water, the present invention was proposed. Therefore, the purpose of this invention is to provide a pump-driven two-phase flow system for cooling large data center computer rooms.

[0006] In order to solve the above technical problems, the present invention provides a pump-driven two-phase flow system for cooling a computer room in a large data center, comprising a two-phase flow refrigerant supply and delivery device, a refrigeration cycle refrigerant supply and delivery device, a cooling water supply and delivery device, a plurality of fan coil units and a plate heat exchanger. The two-phase flow refrigerant supply and delivery device is used to deliver a two-phase flow refrigerant and comprises a liquid storage tank, a filter, a circulation pump, a plurality of electric valves, a plurality of data processing modules and a delivery pipeline. The liquid storage tank, the filter, the circulation pump, each of the electric valves and each of the data processing modules are connected through the delivery pipeline. Each of the data processing modules comprises a chassis, a plurality of evaporative cold plates, a plurality of heat sources and a manifold. Each of the evaporative cold plates, each of the heat sources and the manifold is arranged in the chassis. Each of the evaporative cold plates and the manifold is connected through each of the electric valves. Through the delivery pipeline, each heat source is in thermal contact with each evaporative cold plate; the refrigeration cycle refrigerant supply equipment is used to transport a refrigeration cycle refrigerant and includes an evaporator, a vapor-liquid separator, a compressor, a vapor phase condenser, an electronic expansion valve, a liquid phase cooler, a ball valve, a one-way valve and a delivery channel, and the evaporator, the vapor-liquid separator, the compressor, the vapor phase condenser, the electronic expansion valve, the liquid phase cooler, the ball valve and the one-way valve are connected through the delivery channel; the cooling water supply equipment is used to transport cooling water and includes an underground pipe, a cooling tower and a water delivery pipe connecting the underground pipe and the cooling tower, and the water delivery pipe and the delivery channel exchange heat through the evaporator; each fan coil unit is respectively connected to the water delivery pipe; the delivery pipe and the water delivery pipe exchange heat through the plate heat exchanger.

[0007] In one embodiment, when the ambient temperature is below 10°C, the buried pipe mainly supplies cooling water, the cooling tower backfills the surface water, and the cooling water of the cooling tower passes through a first three-way valve, enters a heat exchanger and then returns to the cooling tower.

[0008] In one embodiment, when the ambient temperature is below 10°C, the buried pipe mainly supplies cooling water, and the cooling tower backfills the surface water. The fluid in the buried pipe branch is driven by a buried pipe water pump, enters a heat exchanger for heat exchange, and then returns to achieve ground source water backfill.

[0009] In one embodiment, during operation, the two-phase refrigerant is stored in the liquid storage tank and brought out by the circulating pump.

[0010] In one embodiment, after the two-phase refrigerant passes through the circulation pump, the flow rate is adjusted by each of the electric valves and distributed to each of the data processing modules.

[0011] In one embodiment, the two-phase refrigerant is divided into a plurality of branches through the manifold and connected to the corresponding evaporative cold plates.

[0012] In one embodiment, each of the heat sources is located on an upper portion of each of the evaporative cooling plates, and an effective heat exchange area of ​​the evaporative cooling plates is greater than or equal to a size of the heat source.

[0013] In one embodiment, the two-phase refrigerant is collected by the manifold after passing through each of the evaporative cold plates.

[0014] In one embodiment, the collected two-phase refrigerant is cooled by the plate heat exchanger and then returns to the liquid storage tank.

[0015] In one embodiment, in a series connection, the cooling water in the cooling tower passes through a cooling tower water pump and the cooling water in the buried pipe passes through a water pump, and is then further cooled by the refrigeration cycle refrigerant in the evaporator.

[0016] In one embodiment, each fan coil unit is connected to the water supply pipeline via a fan electric valve, and the cooling water is further cooled by adjusting the flow rate through each fan electric valve and distributed to each fan coil unit.

[0017] In one embodiment, the cooling water in each fan coil cools the air in the machine room so that the temperature in the machine room is within a required range.

[0018] In one embodiment, the cooling water flowing out of each of the fan coil units is merged, flows into the plate heat exchanger to cool the two-phase refrigerant, and then returns to the cooling tower and the buried pipe.

[0019] In one embodiment, in parallel, the cooling water in the cooling tower passes through a cooling tower water pump and the cooling water in the buried pipe passes through a water pump, and then passes through a second three-way valve to flow to the evaporator and the plate heat exchanger respectively.

[0020] In one embodiment, each fan coil unit is connected to the water supply pipeline through a fan electric valve. The cooling water flowing into the evaporator is further cooled by the refrigeration cycle refrigerant, and the flow is adjusted by each fan electric valve and distributed to each fan coil unit to cool the air in the machine room so that the temperature in the machine room is within the required range, and then returns to the cooling tower and the buried pipe.

[0021] In one embodiment, the cooling water collected by the fan coil units flows into the plate heat exchanger to cool the two-phase refrigerant, and then returns to the cooling tower and the buried pipe.

[0022] In one embodiment, the refrigerant in the refrigeration cycle is evaporated by the evaporator and becomes a vapor-liquid two-phase state, and is separated into a vapor-phase refrigerant and a liquid-phase refrigerant after passing through a vapor-liquid separator.

[0023] In one embodiment, the vapor-phase refrigerant is compressed by the compressor and becomes a high-temperature, high-pressure gas, which flows through the vapor-phase condenser for condensation, and passes through the electronic expansion valve to form the low-temperature, low-pressure refrigeration cycle refrigerant and merges with the liquid-phase refrigerant.

[0024] In one embodiment, the liquid-phase refrigerant is cooled by the liquid-phase cooler and flows through the ball valve and the one-way valve in sequence, and then merges with the refrigeration cycle refrigerant that has passed through the electronic expansion valve to start a new cycle. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The preferred embodiment will be described below in a clear and understandable manner with reference to the accompanying drawings to further illustrate the above-mentioned characteristics, technical features, advantages and implementation methods of a pump-driven two-phase flow system for cooling a large data center computer room.

[0026] Figure 1 This is a diagram of a pump-driven two-phase flow cooling system according to the first embodiment of the present invention.

[0027] Figure 2 This is a diagram of a pump-driven two-phase flow cooling system according to a second embodiment of the present invention.

[0028] Description of Figure Numbers:

[0029] 1: Liquid storage tank, 2: Filter, 3: Circulation pump, 4: Electric valve, 5: Chassis, 51: Evaporative cooling plate, 52: Heat source, 6: Liquid distributor, 7: Fan coil unit, 71: Fan electric valve, 8: Plate heat exchanger, 9: Cooling tower, 91: Cooling tower water pump, 92: First three-way valve, 93: Second three-way valve, 94: Third three-way valve, 95: Heat exchanger, 10: Underground pipe, 101: Water pump, 102: Underground pipe water pump, 11: Evaporator, 12: Vapor-liquid separator, 13: Compressor, 14: Vapor-phase condenser, 15: Electronic expansion valve, 16: Liquid-phase cooler, 17: Ball valve, 18: Check valve, 19: Two-phase flow refrigerant, 20: Refrigeration cycle refrigerant, 21: Cooling water, 23: Vapor-phase refrigerant, 24: Liquid-phase refrigerant, A: Two-phase flow refrigerant supply equipment, A1: Data processing module, A2: Delivery pipeline, B: Refrigeration cycle refrigerant supply equipment, B1: Delivery channel, C: Cooling water supply equipment, C1: Water supply pipeline, H: Machine room. DETAILED DESCRIPTION

[0030] In the description of the present invention, it should be understood that the terms "front side", "rear side", "left side", "right side", "front end", "rear end", "end", "longitudinal", "lateral", "vertical", "top", "bottom", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0031] As used herein, terms such as "first," "second," "third," "fourth," and "fifth" describe various elements, components, regions, layers, and / or sections, which should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, or section from another. Unless the context clearly indicates otherwise, the use of terms such as "first," "second," "third," "fourth," and "fifth" herein does not imply a sequence or order.

[0032] As used herein and not otherwise defined, the terms "substantially" and "approximately" are used to describe and describe small variations. When applied to an event or circumstance, the terms may include the exact moment the event or circumstance occurred, as well as the point at which the event or circumstance occurred to a close approximation. For example, when applied to a numerical value, the terms may include a range of variation less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%.

[0033] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0034] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0035] Secondly, the term "one embodiment" or "embodiment" herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in various places throughout this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive of other embodiments.

[0036] See Figure 1As shown, the first embodiment of the present invention provides a pump-driven two-phase flow system for cooling a large data center computer room, which is mainly used to cool the interior of a computer room H. This pump-driven two-phase flow system mainly includes a two-phase flow refrigerant supply device A, a refrigeration cycle refrigerant supply device B, a cooling water supply device C, a plurality of fan coil units 7 and a plate heat exchanger 8.

[0037] Two-phase refrigerant supply and delivery equipment A is primarily used to deliver two-phase refrigerant 19. It comprises a liquid storage tank 1, a filter 2, a circulating pump 3, multiple electric valves 4, multiple data processing modules A1, and a delivery pipeline A2. The liquid storage tank 1, filter 2, circulating pump 3, each electric valve 4, and each data processing module A1 are primarily connected via the delivery pipeline A2. Each data processing module A1 comprises a chassis 5, multiple evaporative cooling plates 51, multiple heat sources 52, and a manifold 6. Each evaporative cooling plate 51, each heat source 52, and the manifold 6 are disposed within the chassis 5. Each evaporative cooling plate 51 and the manifold 6 are connected to the delivery pipeline A2 via a respective electric valve 4. Each heat source 52 is in thermal contact with each evaporative cooling plate 51. The data processing modules A1 and the electric valves 4 are located within the machine room H.

[0038] The refrigeration cycle refrigerant supply and delivery equipment B is mainly used to deliver a refrigeration cycle refrigerant 20. This refrigeration cycle refrigerant supply and delivery equipment B mainly includes an evaporator 11, a vapor-liquid separator 12, a compressor 13, a vapor phase condenser 14, an electronic expansion valve 15, a liquid phase cooler 16, a ball valve 17, a one-way valve 18 and a delivery channel B1. The evaporator 11, the vapor-liquid separator 12, the compressor 13, the vapor phase condenser 14, the electronic expansion valve 15, the liquid phase cooler 16, the ball valve 17 and the one-way valve 18 are connected through the delivery channel B1.

[0039] The cooling water supply equipment C is primarily used to transport cooling water 21. It comprises an underground pipe 10, a cooling tower 9, and a water pipeline C1 connecting the underground pipe 10 and the cooling tower 9. The water pipeline C1 and the delivery channel B1 exchange heat through the evaporator 11. The underground pipe 10 delivers cooling water 21 via a water pump 101, while the cooling tower 9 delivers cooling water 21 via a cooling tower water pump 91. The cooling water is connected to the water pipeline C1 via a first three-way valve 92. The cooling water 21, which has undergone heat exchange in the plate heat exchanger 8, is then connected to the cooling tower 9 via a third three-way valve 94. This third three-way valve 94 flows through a heat exchanger 95.

[0040] Each fan coil unit 7 is arranged inside the machine room H and is connected to the water supply pipeline C1 through a fan electric valve 71.

[0041] The aforementioned delivery pipeline A2 and water delivery pipeline C1 exchange heat through the plate heat exchanger 8 .

[0042] In this embodiment, when the ambient temperature is below 10°C, the buried pipe 10 mainly supplies cooling water 21, and the cooling tower 9 backfills the surface water; when the ambient temperature is between 10°C and 25°C, the buried pipe 10 and the cooling tower 9 jointly provide cooling water 21; when the ambient temperature is above 25°C, the buried pipe 10 mainly supplies cooling water 21, and the cooling tower 9 plays an auxiliary role in providing cooling water 21.

[0043] During initial operation, the two-phase refrigerant 19 stored in the liquid storage tank 1 is brought out by the circulating pump 3. The flow rate is regulated by the electric valves 4 and distributed to each data processing module A1. Then, it is divided into several branches by the manifold 6 and connected to the corresponding evaporative cooling plates 51. The heat source 52 is located above the evaporative cooling plate 51. The effective heat exchange area of ​​the evaporative cooling plate 51 should be greater than or equal to the size of the heat source 52. Therefore, the two-phase refrigerant 19 absorbs heat from the heat source 52 within the evaporative cooling plate 51, and then passes through several evaporative cooling plates 51 and is collected by the manifold 6 and returned to the liquid storage tank 1.

[0044] In a series arrangement, cooling water 21 in cooling tower 9 passes through a cooling tower water pump 91 and in underground pipe 10 through a water pump 101. After being further cooled by the refrigerated circulating refrigerant 20 in evaporator 11, the cooling water 21 is distributed to each fan coil unit 7 through flow control by the fan motor valves 71. Within the fan coil units 7, the cooling water 21 cools the air in the machine room H, maintaining the temperature within the machine room H within the required range. The cooling water 21 flowing out of the fan coil units 7 then merges and flows into plate heat exchanger 8 to cool the two-phase refrigerant 19 before returning to the cooling tower 9 and underground pipe 10.

[0045] After evaporating in the evaporator 11, the refrigeration cycle refrigerant 20 becomes a vapor-liquid two-phase state. After passing through the vapor-liquid separator 12, it is separated into vapor-phase refrigerant 23 and liquid-phase refrigerant 24. After being compressed by the compressor 13, the vapor-phase refrigerant 23 becomes a high-temperature, high-pressure vapor. It then flows through the vapor-phase condenser 14 and condenses. It then passes through the electronic expansion valve 15 to form the low-temperature, low-pressure refrigeration cycle refrigerant 20, which then merges with the liquid-phase refrigerant 24. The liquid-phase refrigerant 24 is cooled by the liquid-phase cooler 16, then flows through the ball valve 17 and the check valve 18, joining the refrigeration cycle refrigerant 20 that has passed through the electronic expansion valve 15, and begins a new cycle.

[0046] When the ambient temperature is below 10°C, underground pipe 10 primarily supplies cooling water 21, and cooling tower 9 backfills the cooling capacity with surface water. Cooling water 21 from cooling tower 9 then passes through first three-way valve 92, enters plate heat exchanger 8, and then returns to cooling tower 9. Simultaneously, the fluid in the branch of underground pipe 10, driven by underground pipe water pump 102, enters heat exchanger 95 for heat exchange, and then returns, thus backfilling the groundwater cooling capacity.

[0047] Continue reading Figure 2As shown, this is a second embodiment of the present invention. When the ambient temperature is below 10°C, the buried pipe 10 mainly supplies cooling water 21, and the cooling tower 9 backfills the surface water; when the ambient temperature is between 10°C and 25°C, the buried pipe 10 and the cooling tower 9 jointly provide cooling water 21; when the ambient temperature is above 25°C, the buried pipe 10 mainly supplies cooling water 21, and the cooling tower 9 plays an auxiliary role in providing cooling water 21.

[0048] During initial operation, the two-phase refrigerant 19 stored in the liquid storage tank 1 is brought out by the circulating pump 3. The flow rate is regulated by the electric valves 4 and distributed to each data processing module A1. Then, it is divided into several branches by the manifold 6 and connected to the corresponding evaporative cooling plates 51. The heat source 52 is located on the upper part of the evaporative cooling plate 51. The effective heat exchange area of ​​the evaporative cooling plate 51 should be greater than or equal to the size of the heat source 52. Therefore, the two-phase refrigerant 19 absorbs heat from the heat source 52 within the evaporative cooling plate 51, and then passes through several evaporative cooling plates 51 and is collected by the manifold 6 and returned to the liquid storage tank 1.

[0049] In parallel operation, cooling water 21 in cooling tower 9 flows through a cooling tower water pump 91 and in underground pipe 10, through a water pump 101, and then through a second three-way valve 93 before flowing to evaporator 11 and plate heat exchanger 8, respectively. Cooling water 21 flowing into evaporator 11 is further cooled by two-phase refrigerant 19. The cooling water 21 is then regulated by electric valves 71 on each fan unit and distributed to each fan coil unit 7, cooling the air in machine room H to maintain the required temperature. The water then returns to cooling tower 9 and underground pipe 10, flows into plate heat exchanger 8, cools the two-phase refrigerant 19, and then returns to cooling tower 9 and underground pipe 10.

[0050] After evaporating in the evaporator 11, the refrigeration cycle refrigerant 20 becomes a vapor-liquid two-phase state. After passing through the vapor-liquid separator 12, it is separated into vapor-phase refrigerant 23 and liquid-phase refrigerant 24. After being compressed by the compressor 13, the vapor-phase refrigerant 23 becomes a high-temperature, high-pressure gas. It then flows through the vapor-phase condenser 14 and condenses. It then passes through the electronic expansion valve 15 to form the low-temperature, low-pressure refrigeration cycle refrigerant 20, which then merges with the liquid-phase refrigerant 24. The liquid-phase refrigerant 24 is cooled by the liquid-phase cooler 16, then flows through the ball valve 17 and the check valve 18 in sequence, merging with the refrigeration cycle refrigerant 20 that has passed through the electronic expansion valve 15 to begin a new cycle of circulation.

[0051] When the ambient temperature is below 10°C, underground pipe 10 primarily supplies cooling water 21, and cooling tower 9 backfills the cooling capacity with surface water. Cooling water 21 from cooling tower 9 then passes through first three-way valve 92, enters plate heat exchanger 8, and then returns to cooling tower 9. Simultaneously, the fluid in the branch of underground pipe 10 is driven by an underground pipe water pump 102, enters heat exchanger 95 for heat exchange, and then returns, thus backfilling the groundwater cooling capacity.

[0052] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of the present invention. Other equivalent variations that utilize the spirit of the present invention should also fall within the scope of the present invention. In addition, the present invention may also have other embodiments not listed here. Without departing from the spirit and essence of the present invention, those skilled in the art should be able to develop various corresponding changes and modifications based on the present invention. Such corresponding changes and modifications should also fall within the scope of protection of the patent of the present invention.

Claims

1. A pump-driven two-phase flow system for cooling a large data center room, characterized in that: include: A two-phase refrigerant supply and delivery device (A) is used to deliver a two-phase refrigerant (19). The two-phase refrigerant supply and delivery device (A) comprises a liquid storage tank (1), a filter (2), a circulating pump (3), a plurality of electric valves (4), a plurality of data processing modules (A1) and a delivery pipeline (A2). The liquid storage tank (1), the filter (2), the circulating pump (3), each of the electric valves (4) and each of the data processing modules (A1) Each data processing module (A1) is connected via the delivery pipe (A2), and includes a chassis (5), a plurality of evaporative cooling plates (51), a plurality of heat sources (52), and a liquid collector (6). Each evaporative cooling plate (51), each heat source (52), and the liquid collector (6) are arranged in the chassis (5). Each evaporative cooling plate (51) and the liquid collector (6) are connected to the delivery pipe (A2) via each electric valve (4). Each heat source (52) is in thermal contact with each evaporative cooling plate (51). A refrigeration cycle refrigerant supply and delivery device (B) is used to deliver a refrigeration cycle refrigerant (20). The refrigeration cycle refrigerant supply and delivery device (B) comprises an evaporator (11), a vapor-liquid separator (12), a compressor (13), a vapor phase condenser (14), an electronic expansion valve (15), a liquid phase cooler (16), a ball valve (17), a one-way valve (18) and a delivery channel (B1). The evaporator (11), the vapor-liquid separator (12), the compressor (13), the vapor phase condenser (14), the electronic expansion valve (15), the liquid phase cooler (16), the ball valve (17) and the one-way valve (18) are connected through the delivery channel (B1). A cooling water supply device (C) for conveying cooling water (21), the cooling water supply device (C) comprising a buried pipe (10), a cooling tower (9), and a water delivery pipe (C1) connecting the buried pipe (10) and the cooling tower (9), the water delivery pipe (C1) and the delivery channel (B1) exchanging heat through the evaporator (11); A plurality of fan coil units (7) are respectively connected to the water supply pipe (C1); and A plate heat exchanger (8) is provided, through which the delivery pipe (A2) and the water delivery pipe (C1) exchange heat.

2. The pump-driven two-phase flow system for cooling a large data center room according to claim 1, wherein: When the ambient temperature is below 10° C., the buried pipe (10) mainly supplies cooling water (21), and the cooling tower (9) backfills the surface water with cold energy. The cooling water (21) of the cooling tower (9) passes through a first three-way valve (92) and enters a heat exchanger (95) and then returns to the cooling tower (9).

3. The pump-driven two-phase flow system for cooling a large data center room according to claim 1, wherein: When the ambient temperature is below 10°C, the buried pipe (10) mainly supplies cooling water (21), and the cooling tower (9) backfills the surface water. The fluid in the branch of the buried pipe (10) is driven by a buried pipe water pump (102), enters a heat exchanger (95) for heat exchange, and then returns to achieve ground source water backfill.

4. The pump-driven two-phase flow system for cooling a large data center room according to claim 1, wherein: During operation, the two-phase refrigerant (19) is stored in the liquid storage tank (1) and is brought out by the circulating pump (3).

5. The pump-driven two-phase flow system for cooling a large data center room according to claim 1, wherein: After the two-phase refrigerant (19) passes through the circulation pump (3), the flow rate is adjusted by each electric valve (4) and distributed to each data processing module (A1).

6. The pump-driven two-phase flow system for cooling a large data center room according to claim 1, wherein: The two-phase flow refrigerant (19) is divided into a plurality of branches through the liquid distributor (6) and connected to the corresponding evaporative cold plates (51).

7. The pump-driven two-phase flow system for cooling a large data center room according to claim 1, wherein: Each heat source (52) is located on the upper part of each evaporative cooling plate (51), and the effective heat exchange area of ​​the evaporative cooling plate (51) is greater than or equal to the size of the heat source (52).

8. The pump-driven two-phase flow system for cooling a large data center computer room according to claim 1, wherein: The two-phase flow refrigerant (19) passes through each of the evaporative cold plates (51) and is collected by the liquid collector (6).

9. The pump-driven two-phase flow system for cooling a large data center room according to claim 8, wherein: The collected two-phase refrigerant (19) is cooled by the plate heat exchanger (8) and then returns to the liquid storage tank (1).

10. The pump-driven two-phase flow system for cooling a large data center room according to claim 1, wherein: In the case of series connection, the cooling water (21) in the cooling tower (9) passes through a cooling tower water pump (91) and the cooling water (21) in the buried pipe (10) passes through a water pump (101), and is further cooled by the refrigeration cycle refrigerant (20) in the evaporator (11).

11. The pump-driven two-phase flow system for cooling a large data center computer room according to claim 1, wherein: Each fan coil unit (7) is connected to the water supply pipeline (C1) through a fan electric valve (71), and the cooling water (21) is further cooled by adjusting the flow rate through each fan electric valve (71) and distributed to each fan coil unit (7).

12. The pump-driven two-phase flow system for cooling a large data center room according to claim 1, wherein: The cooling water (21) cools the air in the machine room (H) in each fan coil unit (7), so that the temperature in the machine room (H) is within a required range.

13. The pump-driven two-phase flow system for cooling a large data center room according to claim 1, wherein: The cooling water (21) flowing out of each fan coil unit (7) is merged and flows into the plate heat exchanger (8) to cool the two-phase flow refrigerant (19), and then returns to the cooling tower (9) and the buried pipe (10).

14. The pump-driven two-phase flow system for cooling a large data center computer room according to claim 1, wherein: In the parallel connection state, the cooling water (21) in the cooling tower (9) passes through a cooling tower water pump (91) and the cooling water (21) in the buried pipe (10) passes through a water pump (101), and then passes through a second three-way valve (93) to flow to the evaporator (11) and the plate heat exchanger (8) respectively.

15. The pump-driven two-phase flow system for cooling a large data center room according to claim 1, wherein: Each fan coil unit (7) is connected to the water supply pipeline (C1) through a fan electric valve (71). The cooling water (21) flowing into the evaporator (11) is further cooled by the refrigeration cycle refrigerant (20). The flow rate is adjusted by each fan electric valve (71) and distributed to each fan coil unit (7), cooling the air in the machine room (H) so that the temperature in the machine room (H) is within the required range, and then returns to the cooling tower (9) and the buried pipe (10).

16. The pump-driven two-phase flow system for cooling a large data center room according to claim 1, wherein The cooling water (21) collected by each fan coil unit (7) flows into the plate heat exchanger (8) to cool the two-phase flow refrigerant (19), and then returns to the cooling tower (9) and the buried pipe (10).

17. The pump-driven two-phase flow system for cooling a large data center room according to claim 1, wherein: The refrigeration cycle refrigerant (20) evaporates through the evaporator (11) and changes into a vapor-liquid two-phase state. After passing through a vapor-liquid separator (12), it is separated into a vapor-phase refrigerant (23) and a liquid-phase refrigerant (24).

18. The pump-driven two-phase flow system for cooling a large data center room according to claim 17, wherein: The vapor phase refrigerant (23) is compressed by the compressor (13) and becomes a high-temperature and high-pressure gas, which flows through the vapor phase condenser (14) for condensation, and forms the low-temperature and low-pressure refrigeration cycle refrigerant (20) through the electronic expansion valve (15) and merges with the liquid phase refrigerant (24).

19. The pump-driven two-phase flow system for cooling a large data center room according to claim 18, wherein: The liquid refrigerant (24) is cooled by the liquid cooler (16), and flows through the ball valve (17) and the one-way valve (18) in sequence, and then merges with the refrigeration cycle refrigerant (20) that has passed through the electronic expansion valve (15) to start a new cycle.

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