Display panel, manufacturing method of display panel and electronic equipment

Abstract

The invention provides a display panel, a manufacturing method of the display panel and electronic equipment. The display panel comprises a substrate; the wiring layer is positioned on one side of the substrate and comprises a first wire; the organic layer is positioned on one side, far away from the substrate, of the wiring layer and comprises a lap joint hole for exposing at least part of the first wiring; the pixel defining layer is located on the side, away from the substrate, of the organic layer, the pixel defining layer extends into the lap joint hole and covers the side, facing the lap joint hole, of the organic layer, and at least part of the first wire is exposed out of the part, located in the lap joint hole, of the pixel defining layer. The pixel defining layer at the position of the lap joint hole is arranged to cover the side face, facing the lap joint hole, of the organic layer, the organic layer is prevented from being exposed at the position of the lap joint hole, the risk that the organic layer is invaded by water vapor at the position of the lap joint hole can be reduced, and the yield of subsequent film layer manufacturing is guaranteed.

Description

Technical Field

[0001] The present application relates to display technology, and more specifically, to a display panel, a method for manufacturing a display panel, and an electronic device. Background Art

[0002] With the continuous development of display technology, the application range of display panels is becoming wider and wider, and people's requirements for display panels are also becoming higher and higher. However, the quality of existing display panels still needs to be improved. Summary of the Invention

[0003] In order to overcome the above-mentioned deficiencies in the prior art, the present application aims to provide a display panel, comprising:

[0004] substrate;

[0005] A routing layer located on one side of the substrate, the routing layer including a first routing line;

[0006] an organic layer located on a side of the wiring layer away from the substrate, the organic layer comprising a bonding hole exposing at least a portion of the first wiring;

[0007] A pixel defining layer is located on a side of the organic layer away from the substrate, the pixel defining layer extends into the overlap hole and covers a side of the organic layer facing the overlap hole, and the portion of the pixel defining layer located in the overlap hole exposes at least a portion of the first trace.

[0008] In some possible implementations, the material of the pixel defining layer includes an inorganic material.

[0009] In some possible implementations, the display panel further includes an isolation structure located on a side of the organic layer away from the substrate, and the isolation structure extends into the bonding hole and contacts the first trace.

[0010] In some possible implementations, the display panel includes a display area, the pixel defining layer located in the display area includes a pixel opening, the isolation structure is arranged on a side of the pixel defining layer away from the substrate, the isolation structure located in the display area includes an isolation opening, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation opening on the substrate.

[0011] In some possible implementations, the organic layer includes a planarization layer;

[0012] Preferably, the display area of ​​the display panel further includes:

[0013] a first electrode located on a side of the planarization layer away from the substrate, wherein at least a portion of the first electrode is located within the pixel opening;

[0014] a light-emitting unit at least partially located within the pixel opening and located on a side of the first electrode away from the substrate, the light-emitting unit being in contact with the first electrode;

[0015] A second electrode is at least partially located in the pixel opening and located on a side of the light emitting unit away from the substrate, and the second electrode is in contact with the light emitting unit.

[0016] In some possible implementations, the second electrode contacts the isolation structure.

[0017] The present application also provides a display panel, comprising:

[0018] substrate;

[0019] A routing layer located on one side of the substrate, the routing layer including a first routing line;

[0020] an organic layer located on a side of the wiring layer away from the substrate, the organic layer comprising a bonding hole exposing at least a portion of the first wiring;

[0021] a first material layer covering a side of the organic layer facing the bonding hole and exposing the first trace; the first material layer has lower water absorption than the organic layer;

[0022] The auxiliary electrode is located on a side of the first material layer away from the substrate and extends into the bonding hole to contact the first trace.

[0023] In some possible implementations, the display panel includes a display area and an overlapping area located on one side of the display area, and the overlapping hole is located in the overlapping area.

[0024] In some possible implementations, the material of the first material layer includes an inorganic material.

[0025] In some possible implementations, the method further includes a pixel defining layer located on a side of the organic layer away from the substrate, and the first material layer and the pixel defining layer are disposed on the same layer.

[0026] In some possible implementations, the first material layer and the pixel defining layer are an integrated structure.

[0027] In some possible implementations, the display panel further includes an isolation structure and a light-emitting unit, the isolation structure is located on a side of the first material layer away from the substrate and is provided with an isolation opening; the light-emitting unit is located in the isolation opening; the isolation structure is reused as the auxiliary electrode.

[0028] In some possible implementations, in some possible implementations, the isolation structure includes a first layer, a second layer, and a third layer stacked in a direction away from the substrate; or, the isolation structure includes a second layer and a third layer stacked in a direction away from the substrate.

[0029] In some possible implementations, the material of the second layer includes aluminum, and the material of the third layer includes titanium;

[0030] Preferably, the material of the first layer includes molybdenum.

[0031] The present application also provides a method for manufacturing a display panel, the method comprising:

[0032] providing a substrate;

[0033] A routing layer is provided on one side of the substrate, wherein the routing layer includes a first routing line;

[0034] Disposing an organic layer on a side of the wiring layer away from the substrate, and etching the organic layer to form a bonding hole exposing at least a portion of the first wiring;

[0035] A pixel defining layer is disposed on a side of the organic layer away from the substrate. The pixel defining layer extends into the overlap hole and covers a side of the organic layer facing the overlap hole. The pixel defining layer exposes at least a portion of the first trace in the overlap hole.

[0036] In some possible implementations, the routing layer further includes a second routing line; and the step of forming the bonding hole on the organic layer includes:

[0037] Etching the organic layer to form an electrode connection hole exposing at least a portion of the second wiring and the overlapping hole exposing at least a portion of the first wiring;

[0038] Preferably, before the step of providing a pixel defining layer on a side of the organic layer away from the substrate, the method further comprises:

[0039] A first electrode is formed on a side of the organic layer away from the substrate, and the first electrode extends into the electrode connection hole and is electrically connected to the second wiring.

[0040] In some possible implementations, after the step of providing a pixel defining layer on a side of the organic layer away from the substrate, the method further includes:

[0041] An isolation structure is provided on a side of the organic layer away from the substrate, and the isolation structure extends into the bonding hole and contacts the first wiring.

[0042] The present application also provides a method for manufacturing a display panel, the method comprising:

[0043] providing a substrate;

[0044] A routing layer is provided on one side of the substrate, wherein the routing layer includes a first routing line;

[0045] Disposing an organic layer on a side of the wiring layer away from the substrate, and etching the organic layer to form a bonding hole exposing at least a portion of the first wiring;

[0046] A first material layer is provided on a side of the organic layer away from the substrate, the first material layer covers a side of the organic layer facing the bonding hole and exposes the first trace; the water absorption of the first material layer is lower than that of the organic layer;

[0047] An auxiliary electrode is provided on a side of the first material layer away from the substrate, and the auxiliary electrode extends into the bonding hole and contacts the first trace.

[0048] In some possible implementations, the step of providing an auxiliary electrode on a side of the first material layer away from the substrate includes:

[0049] An isolation structure is provided on a side of the first material layer away from the substrate; the isolation structure includes an isolation opening; and the isolation structure is reused as the auxiliary electrode.

[0050] Another object of the present application is to provide an electronic device, which includes the display panel provided in the present application.

[0051] Compared with the prior art, this application has the following beneficial effects:

[0052] The display panel, display panel manufacturing method and electronic device provided by the present application, in a display panel with an isolation structure, avoids the organic layer from being exposed at the overlap hole by setting the pixel defining layer at the overlap hole to cover the side of the organic layer facing the overlap hole, thereby reducing the risk of water vapor intrusion into the organic layer at the overlap hole and ensuring the yield of subsequent film layer manufacturing. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0054] Figure 1This is one of the cross-sectional schematic diagrams of a display panel in the prior art;

[0055] Figure 2 This is a second cross-sectional schematic diagram of a display panel in the prior art;

[0056] Figure 3 This is a schematic cross-sectional view of a display panel provided in this embodiment;

[0057] Figure 4 The second cross-sectional schematic diagram of the display panel provided in this embodiment;

[0058] Figure 5 A schematic diagram of the display panel area provided in this embodiment;

[0059] Figure 6 The third cross-sectional schematic diagram of the display panel provided in this embodiment;

[0060] Figure 7 One of the schematic diagrams of the isolation structure provided in this embodiment;

[0061] Figure 8 This is a fourth cross-sectional schematic diagram of the display panel provided in this embodiment;

[0062] Figure 9 The fifth cross-sectional schematic diagram of the display panel provided in this embodiment;

[0063] Figure 10 The sixth cross-sectional schematic diagram of the display panel provided in this embodiment;

[0064] Figure 11 The seventh cross-sectional schematic diagram of the display panel provided in this embodiment;

[0065] Figure 12 The second schematic diagram of the isolation structure provided in this embodiment;

[0066] Figure 13 The eighth cross-sectional schematic diagram of the display panel provided in this embodiment;

[0067] Figure 14 A ninth cross-sectional schematic diagram of a display panel provided in this embodiment;

[0068] Figure 15 This is a schematic diagram of a step flow of the method for manufacturing a display panel provided in this embodiment;

[0069] Figure 16 This is a second schematic flow chart of the steps of the method for manufacturing a display panel provided in this embodiment.

[0070] Icons: 111, 211 - substrate; 112, 212 - array functional film layer; 113, 213 - routing layer; 1131, 2131 - first routing; 1132, 2132 - second routing; 114, 214 - organic layer; 120, 220 - pixel definition layer; 221 - first material layer; 130, 230 - first electrode; 140, 240 - isolation structure; 1400, 2400 - Isolation opening; 150, 250 - light-emitting unit; 160, 260 - second electrode; 170, 270 - first encapsulation layer; 180, 280 - second encapsulation layer; 190, 290 - third encapsulation layer; 141, 241 - first layer; 142, 242 - second layer; 143, 243 - third layer; 310 - auxiliary electrode; 10 - display area; 20 - overlapping area; 901, 902 - overlapping holes. DETAILED DESCRIPTION

[0071] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0072] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without making any creative efforts shall fall within the scope of protection of the present application.

[0073] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0074] In the description of this application, it should be noted that the terms "center," "upper," "lower," "vertical," "horizontal," "inner," "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the inventive product is typically placed when in use. These terms are intended solely to facilitate the description of this application and simplify the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," "third," etc., are used solely to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0075] It should be noted that, in the absence of conflict, different features in the embodiments of the present application can be combined with each other.

[0076] See Figure 1 In some existing display panels using an isolation structure 140, the display panel typically includes a substrate 111', multiple array functional film layers 112' located on one side of the substrate 111', a routing layer 113' located on the side of the array functional film layer 112' away from the substrate 111', a planarization layer 114' located on the side of the routing layer 113' away from the substrate 111', a pixel definition layer 120' located on the side of the planarization layer 114' away from the substrate 111', and an isolation structure 140' located on the side of the pixel definition layer 120' away from the substrate 111'. The isolation structure 140' needs to extend through a bonding hole that penetrates the pixel definition layer 120' and the planarization layer 114' to electrically connect to the routing layer 113'.

[0077] In this case, see Figure 2 During the manufacturing process of the display panel, part of the planarization layer 114' is not covered by the pixel definition layer 120' at the overlap hole, causing the organic material forming the planarization layer 114' to be easily invaded by water vapor. The water vapor released in the subsequent manufacturing process will affect the formation effect of other film layers.

[0078] In view of this, this embodiment provides a solution that can reduce water vapor intrusion during the display panel manufacturing process. The solution provided by this embodiment is described in detail below.

[0079] See Figure 3 , Figure 3 This is a schematic diagram of a display panel provided in this embodiment. The display panel may include a substrate 111 , a wiring layer 113 , an organic layer 114 and a pixel defining layer 120 .

[0080] In this embodiment, the first routing layer 113 is located on one side of the substrate 111, and one or more array functional film layers 112 may be further included between the first routing layer 113 and the substrate 111, for example, it may also include a buffer layer, a semiconductor layer, one or more other routing layers 113 and one or more insulating layers.

[0081] The routing layer 113 includes a first routing line 1131. In addition to the first routing line 1131, the routing layer 113 may further include other routing lines, which will not be described in detail in this embodiment.

[0082] The organic layer 114 is located on a side of the wiring layer 113 away from the substrate 111. The organic layer 114 includes a bonding hole exposing at least a portion of the first wiring 1131. Optionally, in this embodiment, the organic layer 114 has a certain fluidity during the manufacturing process.

[0083] The pixel defining layer 120 is located on a side of the organic layer 114 away from the substrate 111. The pixel defining layer 120 extends into the overlap hole and covers the side of the organic layer 114 facing the overlap hole. The portion of the pixel defining layer 120 located within the overlap hole exposes at least a portion of the first trace 1131. In other words, at the overlap hole, the pixel defining layer 120 can cover the exposed portion of the organic layer 114, while still exposing the first trace 1131.

[0084] Based on the above design, in this embodiment, by setting the pixel defining layer 120 at the overlapping hole to cover the side of the organic layer 114 facing the overlapping hole, the organic layer 114 is prevented from being exposed at the overlapping hole, thereby reducing the risk of water vapor intrusion into the organic layer 114 at the overlapping hole, thereby ensuring the yield of subsequent film layer manufacturing.

[0085] In some possible implementations, the material of the pixel defining layer 120 includes an inorganic material. In this way, the pixel defining layer 120 has a better barrier effect against water vapor and can better protect the organic layer 114 from being invaded by water vapor.

[0086] For some possible implementations, see Figure 4 The display panel further includes an isolation structure 140 located on a side of the pixel defining layer 120 away from the substrate 111. The isolation structure 140 extends into the overlap hole and contacts the first trace 1131. Thus, the isolation structure 140 can overlap the first trace 1131 through the overlap hole to achieve electrical connection.

[0087] By setting the pixel defining layer 120 at the overlapping hole to cover the side of the organic layer 114 facing the overlapping hole, the organic layer 114 can be prevented from directly contacting the isolation structure 140 extending into the overlapping hole, thereby preventing the water vapor absorbed by the organic layer 114 from affecting the manufacturing of the isolation structure 140 during the coating forming process of the isolation structure 140, thereby reducing the risk of film abnormalities in the isolation structure 140.

[0088] For some possible implementations, see Figure 5 The display panel includes a display area 10 and a bonding area 20 located on one side of the display area 10, and the bonding hole is located in the bonding area 20. The display panel also includes a binding area, and the bonding area 20 is located between the display area 10 and the bonding area 20. The binding area is used to bind the chip.

[0089] For some possible implementations, see Figure 6The pixel defining layer 120 located in the display area 10 includes a pixel opening, and the isolation structure 140 located in the display area 10 includes an isolation opening. The orthographic projection of the pixel opening on the substrate 111 is located within the orthographic projection of the isolation opening on the substrate 111. Patent applications PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202310707209.0, and 202311346196.5 describe related technical solutions for the isolation structure 140 located in the display area 10, and their contents are incorporated into this application by reference for reference.

[0090] Alternatively, in some possible implementations, in the display area 10, the isolation structure 140 may include a support portion and a blocking portion located on a side of the support portion away from the substrate 111, with the orthographic projection of the support portion on the substrate 111 located within the orthographic projection of the blocking portion on the substrate 111. In other words, the isolation structure 140 located in the display area 10 has an undercut structure, thereby better disconnecting the organic film layers between adjacent pixel openings when other organic film layers are subsequently formed by evaporation.

[0091] For some possible implementations, see Figure 7 The isolation structure 140 includes a first layer 141, a second layer 142, and a third layer 143 stacked in a direction away from the substrate 111. For example, the material of the first layer 141 includes molybdenum, the material of the second layer 142 includes aluminum, and the material of the third layer 143 includes titanium. The support portion may be formed by the first layer 141 and the second layer 142, and the barrier portion may be formed by the third layer 143. In other embodiments, the isolation structure 140 includes the second layer 142 and the third layer 143 stacked in a direction away from the substrate 111.

[0092] Please refer to Figure 8 At the overlapping hole, after the isolation structure 140 extends into the overlapping hole, the first layer 141 contacts the first trace 1131 to achieve electrical connection.

[0093] For some possible implementations, see again Figure 6 The display area 10 of the display panel further includes a first electrode 130 , a light emitting unit 150 and a second electrode 160 .

[0094] The first electrode 130 is located on a side of the organic layer 114 away from the substrate 111 . A plurality of first electrodes 130 may be spaced apart. At least a portion of the first electrode 130 is located within the pixel opening. For example, a pixel opening exposes at least a portion of a first electrode 130 .

[0095] At least a portion of the light emitting unit 150 is located within the pixel opening and on a side of the first electrode 130 away from the substrate 111 , and the light emitting unit 150 is in contact with the first electrode 130 .

[0096] At least a portion of the second electrode 160 is located within the pixel opening and on a side of the light emitting unit 150 away from the substrate 111 , and the second electrode 160 is in contact with the light emitting unit 150 .

[0097] When there is a potential difference between the first electrode 130 and the second electrode 160 , the light emitting unit 150 located between the first electrode 130 and the second electrode 160 is driven to emit light.

[0098] For some possible implementations, see again Figure 6 At least a portion of the second electrode 160 extends from the pixel opening to a side of the pixel defining layer 120 away from the substrate 111 and contacts the isolation structure 140 .

[0099] In this way, the second electrodes 160 corresponding to adjacent pixel openings can be electrically connected through the isolation structure 140 and connected to the common voltage (Vss) providing circuit, or the isolation structure 140 can connect each second electrode 160 relatively independently to the common voltage providing circuit.

[0100] For some possible implementations, see Figure 9 The display panel further includes a first encapsulation layer 170 located on a side of the second electrode 160 away from the substrate 111 .

[0101] Optionally, the first encapsulation layer 170 may extend from the pixel opening to the side of the isolation structure 140 away from the substrate 111. The first encapsulation layers 170 corresponding to adjacent pixel openings may be disconnected at the side of the isolation structure 140 away from the substrate 111.

[0102] Furthermore, in some possible implementations, the display panel further includes a second encapsulation layer 180 and a third encapsulation layer 190 stacked and located on a side of the first encapsulation layer 170 away from the substrate 111 .

[0103] Optionally, the materials of the first encapsulation layer 170 and the third encapsulation layer 190 include inorganic materials, and the material of the second encapsulation layer 180 includes organic materials. For example, the first encapsulation layer 170 and the third encapsulation layer 190 can be formed by chemical vapor deposition (CVD), and the second encapsulation layer 180 can be formed by inkjet printing (IJP).

[0104] Optionally, a gap may exist between a portion of the first encapsulation layer 170 located on a side of the isolation structure 140 away from the substrate 111 and the isolation structure 140. The second encapsulation layer 180 may fill the gap.

[0105] See Figure 10 , Figure 10 This is a schematic diagram of a display panel provided in this embodiment. The display panel may include a substrate 211 , a wiring layer 213 , an organic layer 214 , a first material layer 221 and an auxiliary electrode 310 .

[0106] In this embodiment, the first routing layer 213 is located on one side of the substrate 211, and one or more array functional film layers 212 may be further included between the first routing layer 213 and the substrate 211, for example, it may also include a buffer layer, a semiconductor layer, one or more other routing layers 213 and one or more insulating layers.

[0107] The routing layer 213 includes a first routing line 2131. In addition to the first routing line 2131, the routing layer 213 may further include other routing lines, which will not be described in detail in this embodiment.

[0108] The organic layer 214 is located on a side of the wiring layer 213 away from the substrate 211 . The organic layer 214 includes a bonding hole exposing at least a portion of the first wiring 2131 .

[0109] The first material layer 221 is located on a side of the organic layer 214 away from the substrate 211 and exposes at least a portion of the first trace 2131. That is, at the overlap hole, the first material layer 221 can cover the exposed portion of the organic layer 214, while still exposing the first trace 2131. The first material layer 221 has a lower water absorption than the organic layer 214.

[0110] Based on the above design, in this embodiment, by setting the first material layer 221 at the overlap hole to cover the side of the organic layer 214 facing the overlap hole, the organic layer 214 is prevented from being exposed at the overlap hole, thereby reducing the risk of water vapor intrusion into the organic layer 214 at the overlap hole, thereby ensuring the yield of subsequent film layer manufacturing.

[0111] In some possible implementations, the first material layer 221 includes an inorganic material. In this way, the first material layer 221 has a better barrier effect against water vapor and can better protect the organic layer 214 from being invaded by water vapor.

[0112] The auxiliary electrode 310 is located on a side of the first material layer 221 away from the substrate 211. The auxiliary electrode 310 extends into the overlap hole and contacts the first trace 2131. In this way, the auxiliary electrode 310 can overlap the first trace 2131 through the overlap hole to achieve electrical connection.

[0113] By setting the first material layer 221 at the overlapping hole to cover the side of the organic layer 214 facing the overlapping hole, the organic layer 214 can be prevented from directly contacting the auxiliary electrode 310 extending into the overlapping hole, thereby preventing the water vapor absorbed by the organic layer 214 from affecting the formation of the auxiliary electrode 310 during the coating process of the auxiliary electrode 310, thereby reducing the risk of film abnormalities in the auxiliary electrode 310.

[0114] For some possible implementations, see again Figure 5 The display panel includes a display area 10 and an overlapping area 20 located on one side of the display area 10 , and the overlapping hole is located in the overlapping area 20 .

[0115] For some possible implementations, see Figure 11 The display panel provided in this embodiment further includes a pixel defining layer 220, which is located on a side of the organic layer 214 away from the substrate 211. The pixel defining layer 220 is disposed on the same layer as the first material layer 221. The pixel defining layer 220 and the first material layer 221 are integrally formed, that is, the pixel defining layer 220 and the first material layer 221 are integrally formed and in contact with each other.

[0116] For some possible implementations, see again Figure 11 The display panel provided in this embodiment may further include an isolation structure 240 and a light-emitting unit 250 .

[0117] The isolation structure 240 is located on a side of the first material layer 221 away from the substrate 221 , and includes an isolation opening. The light emitting unit 250 is located in the isolation opening. The isolation structure 240 is reused as an auxiliary electrode 310 .

[0118] Among them, patent applications PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202310707209.0, and 202311346196.5 record relevant technical solutions of the isolation structure 240 located in the display area 10, and their contents are incorporated into this application by reference for reference.

[0119] Optionally, in some possible implementations, the isolation structure 240 may include a support portion and a blocking portion located on a side of the support portion away from the substrate 211, with the orthographic projection of the support portion on the substrate 211 located within the orthographic projection of the blocking portion on the substrate 211. In other words, the isolation structure 240 located in the display area 10 has an undercut structure, thereby better disconnecting the organic film layers between adjacent pixel openings when other organic film layers are subsequently formed by evaporation.

[0120] For some possible implementations, see Figure 12The isolation structure 240 includes a first layer 241, a second layer 242, and a third layer 243 stacked in a direction away from the substrate 211. For example, the material of the first layer 241 includes molybdenum, the material of the second layer 242 includes aluminum, and the material of the third layer 243 includes titanium. The support portion can be formed by the first layer 241 and the second layer 242, and the barrier portion can be formed by the third layer 243. Figure 13 The auxiliary electrode 310 may also include a first layer 241 , a second layer 242 , and a third layer 243 stacked in a direction away from the substrate 211 .

[0121] In some other possible implementations, the isolation structure 240 includes a second layer 242 and a third layer 243 stacked in a direction away from the substrate 211. For example, the second layer 242 may be made of aluminum, and the third layer 243 may be made of titanium. The support portion may be formed by the second layer 242, and the barrier portion may be formed by the third layer 243. Accordingly, the auxiliary electrode 310 may also include a second layer 242 and a third layer 243 stacked in a direction away from the substrate 211.

[0122] For some possible implementations, see Figure 11 The display panel further includes a first electrode 230 and a second electrode 260 .

[0123] The first electrode 230 is located on a side of the organic layer 214 away from the substrate 211 . A plurality of first electrodes 230 may be spaced apart. At least a portion of the first electrode 230 is located within the pixel opening. For example, a pixel opening exposes at least a portion of a first electrode 230 .

[0124] At least a portion of the light emitting unit 250 is located within the pixel opening and on a side of the first electrode 230 away from the substrate 211 , and the light emitting unit 250 is in contact with the first electrode 230 .

[0125] At least a portion of the second electrode 260 is located within the pixel opening and on a side of the light emitting unit 250 away from the substrate 211 , and the second electrode 260 is in contact with the light emitting unit 250 .

[0126] When there is a potential difference between the first electrode 230 and the second electrode 260 , the light emitting unit 250 located between the first electrode 230 and the second electrode 260 is driven to emit light.

[0127] For some possible implementations, see again Figure 11 At least a portion of the second electrode 260 extends from the pixel opening to a side of the pixel defining layer 220 away from the substrate 211 and contacts the isolation structure 240 .

[0128] In this way, the second electrodes 260 corresponding to adjacent pixel openings can be electrically connected through the isolation structure 240 and connected to the common voltage (Vss) providing circuit, or the isolation structure 240 can connect each second electrode 260 to the common voltage providing circuit relatively independently.

[0129] For some possible implementations, see Figure 14 The display panel further includes a first encapsulation layer 270 located on a side of the second electrode 260 away from the substrate 211 .

[0130] Optionally, the first encapsulation layer 270 may extend from the pixel opening to the side of the isolation structure 240 away from the substrate 211 . The first encapsulation layers 270 corresponding to adjacent pixel openings may be disconnected at the side of the isolation structure 240 away from the substrate 211 .

[0131] Furthermore, in some possible implementations, the display panel further includes a second encapsulation layer 280 and a third encapsulation layer 290 stacked and located on a side of the first encapsulation layer 270 away from the substrate 211 .

[0132] Optionally, the materials of the first encapsulation layer 270 and the third encapsulation layer 290 include inorganic materials, and the material of the second encapsulation layer 280 includes organic materials. For example, the first encapsulation layer 270 and the third encapsulation layer 290 can be formed by chemical vapor deposition (CVD), and the second encapsulation layer 280 can be formed by inkjet printing (IJP).

[0133] Optionally, a gap may exist between a portion of the first encapsulation layer 270 located on a side of the isolation structure 240 away from the substrate 211 and the isolation structure 240. The second encapsulation layer 280 may fill the gap.

[0134] See Figure 15 This embodiment also provides a method for manufacturing a display panel, which may include the following steps.

[0135] In step S110 , a substrate 111 is provided.

[0136] In step S120 , a wiring layer 113 is provided on one side of the substrate 111 , wherein the wiring layer 113 includes a first wiring 1131 .

[0137] In step S130 , an organic layer 114 is disposed on a side of the wiring layer 113 away from the substrate 111 . The organic layer 114 includes a bonding hole exposing at least a portion of the first wiring 1131 .

[0138] In step S140 , a pixel defining layer 120 is disposed on a side of the organic layer 114 away from the substrate 111 . The pixel defining layer 120 extends into the overlap hole and covers the side of the organic layer 114 facing the overlap hole. The pixel defining layer 120 exposes at least a portion of the first trace 1131 in the overlap hole.

[0139] In some possible implementations, the wiring layer 113 further includes a second wiring 1132 . The second wiring 1132 can be used to provide a driving voltage to the first electrode 130 .

[0140] In step S130, the organic layer 114 may be etched to form an electrode connection hole exposing at least a portion of the second wiring 1132 and a landing hole exposing at least a portion of the first wiring 1131. That is, the landing hole is formed while the organic layer 114 is etched to form the electrode connection hole.

[0141] Optionally, after step S130 , a first electrode 130 may be formed on a side of the organic layer 114 away from the substrate 111 , and the first electrode 130 extends into the electrode connection hole and is electrically connected to the second trace 1132 .

[0142] In some possible implementations, a pixel defining layer 120 may be provided on a side of the organic layer 114 away from the substrate 111 in step S140 , and the pixel defining layer 120 may be etched to expose at least a portion of the first trace 1131 in the pixel defining layer 120 within the overlap hole.

[0143] Then, an isolation structure 140 is provided on the side of the pixel definition layer 120 away from the substrate 111. The isolation structure 140 extends into the overlap hole and contacts the first trace 1131. That is, the pixel definition layer is etched to expose the first trace 1131, and then the isolation structure 140 is provided.

[0144] In some possible implementations, after the isolation structure 140 is provided on a side of the pixel defining layer 120 away from the substrate 111 , the isolation layer may be etched to form an isolation opening.

[0145] The pixel defining layer 120 may then be etched to form a pixel opening connected to the isolation opening. That is, the pixel defining layer 120 may be etched using the isolation structure 140 as a mask to form the pixel opening.

[0146] See Figure 16 This embodiment also provides a method for manufacturing a display panel, which may include the following steps.

[0147] In step S210 , a substrate 211 is provided.

[0148] In step S220 , a wiring layer 213 is provided on one side of the substrate 211 , wherein the wiring layer 213 includes a first wiring 2131 .

[0149] In step S230 , an organic layer 214 is disposed on a side of the wiring layer 213 away from the substrate 211 , and the organic layer 214 is etched to form a bonding hole exposing at least a portion of the first wiring 2131 .

[0150] In step S240 , a first material layer 221 is formed on the side of the organic layer 214 away from the substrate 211 . The first material layer 221 covers the side of the organic layer 214 facing the bonding hole and exposes at least a portion of the first trace 2131 . The first material layer 221 has a lower water absorption than the organic layer 214 .

[0151] In step S250 , an auxiliary electrode 310 is provided on a side of the first material layer 221 away from the substrate 211 , and the auxiliary electrode 310 extends into the bonding hole and the first trace 2131 .

[0152] In some possible implementations, the wiring layer 213 further includes a second wiring 2132 . The second wiring 2132 can be used to provide a driving voltage to the first electrode 230 .

[0153] In step S230, the organic layer 214 may be etched to form an electrode connection hole exposing at least a portion of the second trace 2132 and a bonding hole exposing at least a portion of the first trace 2131. That is, the bonding hole is formed while the organic layer 214 is etched to form the electrode connection hole.

[0154] In some possible implementations, a first material layer 221 may be provided on a side of the organic layer 214 away from the substrate 211 in step S240 , and the first material layer 221 may be etched to expose at least a portion of the first trace 2131 in the first material layer 221 within the overlap hole.

[0155] In some possible implementations, in step S250 , an isolation structure 240 may be provided on a side of the first material layer 221 away from the substrate 211 , wherein at least a portion of the isolation structure 240 extends into the overlapping hole and is reused as an auxiliary electrode 310 .

[0156] The present application also provides an electronic device, which includes the display panel provided by the present application. The electronic device may include a mobile phone, a tablet computer, a smart wearable device, a television, a laptop computer, a monitor, and other devices with display functions.

[0157] To summarize, the display panel, display panel manufacturing method, and electronic device provided by the present application, in a display panel with an isolation structure, avoids the organic layer from being exposed at the overlapping hole by setting the pixel defining layer at the overlapping hole to cover the side of the organic layer facing the overlapping hole, thereby reducing the risk of water vapor intrusion into the organic layer at the overlapping hole and ensuring the yield of subsequent film layer manufacturing.

[0158] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0159] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A display panel, characterized in that: The display panel includes: substrate; A routing layer located on one side of the substrate, the routing layer including a first routing line; an organic layer located on a side of the wiring layer away from the substrate, the organic layer comprising a bonding hole exposing at least a portion of the first wiring; A pixel defining layer is located on a side of the organic layer away from the substrate, the pixel defining layer extends into the overlap hole and covers a side of the organic layer facing the overlap hole, and the portion of the pixel defining layer located in the overlap hole exposes at least a portion of the first trace.

2. The display panel according to claim 1, wherein: The material of the pixel definition layer includes an inorganic material.

3. The display panel according to claim 1, wherein: The display panel further includes an isolation structure located on a side of the organic layer away from the substrate, and the isolation structure extends into the bonding hole and contacts the first wiring.

4. The display panel according to claim 3, wherein: The display panel includes a display area, the pixel defining layer located in the display area includes a pixel opening, the isolation structure is arranged on the side of the pixel defining layer away from the substrate, the isolation structure located in the display area includes an isolation opening, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation opening on the substrate.

5. The display panel according to claim 1 or 4, wherein: The organic layer includes a planarization layer; Preferably, the display area of ​​the display panel further includes: a first electrode located on a side of the planarization layer away from the substrate, wherein at least a portion of the first electrode is located within the pixel opening; a light-emitting unit at least partially located within the pixel opening and located on a side of the first electrode away from the substrate, the light-emitting unit being in contact with the first electrode; A second electrode is at least partially located in the pixel opening and located on a side of the light emitting unit away from the substrate, and the second electrode is in contact with the light emitting unit.

6. The display panel according to claim 5, wherein: The second electrode contacts the isolation structure.

7. A display panel, characterized in that: The display panel includes: substrate; A routing layer located on one side of the substrate, the routing layer including a first routing line; an organic layer located on a side of the wiring layer away from the substrate, the organic layer comprising a bonding hole exposing at least a portion of the first wiring; a first material layer covering a side of the organic layer facing the bonding hole and exposing the first trace; the first material layer has lower water absorption than the organic layer; The auxiliary electrode is located on a side of the first material layer away from the substrate and extends into the bonding hole to contact the first trace.

8. The display panel according to claim 7, wherein: The display panel includes a display area and a lap area located on one side of the display area, and the lap hole is located in the lap area; Preferably, the display panel further includes a binding area, and the overlapping area is located between the display area and the binding area.

9. The display panel according to claim 7, wherein: The material of the first material layer includes an inorganic material.

10. The display panel according to claim 7 or 9, characterized in that: It also includes a pixel defining layer located on a side of the organic layer away from the substrate, and the first material layer is arranged on the same layer as the pixel defining layer.

11. The display panel according to claim 10, wherein: The first material layer and the pixel defining layer are an integrated structure.

12. The display panel according to claim 7, wherein: The display panel further includes an isolation structure and a light-emitting unit, wherein the isolation structure is located on a side of the first material layer away from the substrate and is provided with an isolation opening; the light-emitting unit is located in the isolation opening; The isolation structure is reused as the auxiliary electrode.

13. The display panel according to claim 12, wherein: The isolation structure includes a first layer, a second layer, and a third layer stacked in a direction away from the substrate; or the isolation structure includes a second layer and a third layer stacked in a direction away from the substrate.

14. The display panel according to claim 13, wherein: The material of the second layer includes aluminum, and the material of the third layer includes titanium; Preferably, the material of the first layer includes molybdenum.

15. A method for manufacturing a display panel, characterized in that: The method comprises: providing a substrate; A routing layer is provided on one side of the substrate, wherein the routing layer includes a first routing line; Disposing an organic layer on a side of the wiring layer away from the substrate, and etching the organic layer to form a bonding hole exposing at least a portion of the first wiring; A pixel defining layer is disposed on a side of the organic layer away from the substrate. The pixel defining layer extends into the overlap hole and covers a side of the organic layer facing the overlap hole. The pixel defining layer exposes at least a portion of the first trace in the overlap hole.

16. The method according to claim 15, characterized in that The wiring layer further includes a second wiring; and the step of forming the overlapping hole on the organic layer includes: Etching the organic layer to form an electrode connection hole exposing at least a portion of the second wiring and the overlapping hole exposing at least a portion of the first wiring; Preferably, before the step of providing a pixel defining layer on a side of the organic layer away from the substrate, the method further comprises: A first electrode is formed on a side of the organic layer away from the substrate, and the first electrode extends into the electrode connection hole and is electrically connected to the second wiring.

17. The method according to claim 15, characterized in that: After the step of providing a pixel defining layer on a side of the organic layer away from the substrate, the method further includes: An isolation structure is provided on a side of the organic layer away from the substrate, and the isolation structure extends into the bonding hole and contacts the first wiring.

18. A method for manufacturing a display panel, characterized in that: The method comprises: providing a substrate; A routing layer is provided on one side of the substrate, wherein the routing layer includes a first routing line; Disposing an organic layer on a side of the wiring layer away from the substrate, and etching the organic layer to form a bonding hole exposing at least a portion of the first wiring; A first material layer is provided on a side of the organic layer away from the substrate, the first material layer covers a side of the organic layer facing the bonding hole and exposes the first trace; the water absorption of the first material layer is lower than that of the organic layer; An auxiliary electrode is provided on a side of the first material layer away from the substrate, and the auxiliary electrode extends into the bonding hole and contacts the first trace.

19. The method according to claim 18, characterized in that The step of providing an auxiliary electrode on a side of the first material layer away from the substrate includes: An isolation structure is provided on a side of the first material layer away from the substrate; the isolation structure includes an isolation opening; and the isolation structure is reused as the auxiliary electrode.

20. An electronic device, characterized in that: The electronic device comprises the display panel according to any one of claims 1 to 19.

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