Array substrate, display panel, preparation method of display panel and electronic equipment

Abstract

The embodiment of the invention provides an array substrate, a display panel, a preparation method of the display panel and electronic equipment, and relates to the technical field of display, and the display panel comprises a substrate, an isolation structure, a light-emitting element and a first packaging layer; the isolation structure is located on one side of the substrate, the isolation structure is provided with an isolation opening, and the orthographic projection of the side, away from the substrate, of the isolation structure on the substrate is located in the orthographic projection of the side, close to the substrate, of the isolation structure on the substrate; at least part of the light-emitting element is located in the isolation opening; the first packaging layer is located on the side, away from the substrate, of the light-emitting element. The first packaging layer comprises a plurality of packaging units arranged at intervals. The display effect of the display panel can be improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to an array substrate, a display panel, a method for manufacturing a display panel, and an electronic device. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display panels.

[0003] However, there are still some problems with display panels that need to be solved urgently. Summary of the Invention

[0004] In order to overcome the technical problems mentioned in the above technical background, an embodiment of the present application provides a display panel, wherein the display panel includes:

[0005] substrate;

[0006] an isolation structure located on one side of the substrate, the isolation structure being provided with an isolation opening, the orthographic projection of a side of the isolation structure away from the substrate on the substrate being located within the orthographic projection of a side of the isolation structure close to the substrate on the substrate;

[0007] a light emitting element at least partially located within the isolation opening;

[0008] A first packaging layer is located on a side of the light emitting element away from the substrate, the first packaging layer comprising a plurality of packaging units arranged at intervals, the packaging units being arranged in the isolation opening and extending to a side of the isolation structure facing the isolation opening.

[0009] In some possible implementations, the display panel further includes a second encapsulation layer located on a side of the first encapsulation layer away from the substrate;

[0010] Preferably, the material of the first encapsulation layer includes an inorganic material;

[0011] Preferably, the material of the second encapsulation layer includes organic material.

[0012] In some possible implementations, the second encapsulation layer is in direct contact with a side of the isolation structure away from the substrate.

[0013] In some possible implementations, a transition film layer is provided on a side of the isolation structure away from the substrate, and the transition film layer includes a main material and a foaming material doped with the main material;

[0014] Preferably, the host material comprises photoresist;

[0015] Preferably, the foaming material comprises at least one of ammonium carbonate, ammonium bicarbonate, sodium bicarbonate, ammonium nitrite, sodium borohydride, trichloromonofluoromethane and dichloromonofluoromethane;

[0016] Preferably, the transition film layer is provided between the isolation structure and the second encapsulation layer.

[0017] In some possible embodiments, the light-emitting element includes a first electrode layer, a hole transport layer, a light-emitting functional layer, an electron transport layer and a second electrode layer stacked in sequence in a direction away from the substrate; the hole transport layers of different light-emitting elements are disconnected, and / or the electron transport layers of different light-emitting elements are disconnected.

[0018] In some possible implementations, the isolation structure includes a first layer;

[0019] Alternatively, the isolation structure includes a second layer and a first layer sequentially stacked in a direction away from the substrate;

[0020] Alternatively, the isolation structure includes a second layer, a first layer, and a third layer stacked in sequence in a direction away from the substrate;

[0021] Preferably, the material of the first layer comprises aluminum;

[0022] Preferably, the material of the second layer includes titanium or molybdenum;

[0023] Preferably, the material of the third layer includes titanium or molybdenum.

[0024] In some possible implementations, the isolation opening exposes at least a portion of the first electrode layer, the isolation structure includes a conductive material, and the second electrode layer is electrically connected to the isolation structure.

[0025] In some possible embodiments, the display panel further includes a pixel defining layer located on a side of the first electrode layer away from the substrate, and the isolation structure is located on a side of the pixel defining layer away from the substrate; the pixel defining layer includes a pixel opening exposing at least a portion of the first electrode layer, and the orthographic projection of the isolation structure on the substrate is located within the orthographic projection of the pixel defining layer on the substrate; the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation opening on the substrate.

[0026] In some possible implementations, the present application further provides a display panel, comprising:

[0027] substrate;

[0028] an isolation structure located on one side of the substrate, the isolation structure being provided with an isolation opening; an orthographic projection of a side of the isolation structure away from the substrate on the substrate being located within an orthographic projection of a side of the isolation structure close to the substrate on the substrate;

[0029] A light-emitting element is located in the isolation opening; the light-emitting element includes a first electrode layer, a light-emitting functional layer and a second electrode layer stacked in sequence in a direction away from the substrate; the isolation structure includes a conductive material, and the second electrode layer is electrically connected to the isolation structure.

[0030] In some possible embodiments, the light-emitting element further includes a hole transport layer and an electron transport layer, the hole transport layer is located between the first electrode layer and the light-emitting functional layer, and the electron transport layer is located between the light-emitting functional layer and the second electrode layer; the hole transport layers of different light-emitting elements are disconnected, and / or the electron transport layers of different light-emitting elements are disconnected.

[0031] In some possible implementations, the present application further provides an array substrate, which is used for a display panel and includes:

[0032] substrate;

[0033] an isolator located on one side of the substrate, the isolator comprising an isolation structure, a transition film layer, and a sacrificial structure stacked in sequence in a direction away from the substrate, the isolator having a through opening that sequentially penetrates the isolation structure, the transition film layer, and the sacrificial structure, and the orthographic projection of the side of the isolation structure away from the substrate on the substrate being within the orthographic projection of the sacrificial structure on the substrate;

[0034] The thermal expansion coefficient of the transition film layer is different from the thermal expansion coefficient of the isolation structure, and the absolute value of the difference between the thermal expansion coefficient of the transition film layer and the thermal expansion coefficient of the isolation structure is greater than a first preset value; and / or, the thermal expansion coefficient of the transition film layer is different from the thermal expansion coefficient of the sacrificial structure, and the absolute value of the difference between the thermal expansion coefficient of the transition film layer and the thermal expansion coefficient of the sacrificial structure is greater than a second preset value.

[0035] In some possible implementations, the thermal expansion coefficient of the transition film layer is greater than the thermal expansion coefficient of the isolation structure and / or the thermal expansion coefficient of the transition film layer is greater than the thermal expansion coefficient of the sacrificial structure.

[0036] In some possible implementations, the transition film layer includes a main body material and a foaming material doped with the main body material;

[0037] Preferably, the host material comprises photoresist;

[0038] Preferably, the foaming material comprises at least one of ammonium carbonate, ammonium bicarbonate, sodium bicarbonate, ammonium nitrite, sodium borohydride, trichloromonofluoromethane and dichloromonofluoromethane;

[0039] Preferably, the foaming temperature of the foaming material or the foaming temperature of the transition film layer is greater than 100°C.

[0040] In some possible implementations, the sacrificial structure is a light-transmitting structure;

[0041] Preferably, the light transmittance of the sacrificial structure is greater than 10%@700nm-1mm@1um.

[0042] In some possible implementations, the sacrificial structure includes an organic material or an inorganic material;

[0043] Preferably, the sacrificial structure comprises an organic material, and the organic material comprises a photoresist;

[0044] Preferably, the sacrificial structure comprises an inorganic material, and the inorganic material comprises silicon oxide.

[0045] In some possible implementations, the present application further provides a method for preparing a display panel, the method comprising:

[0046] providing a substrate;

[0047] An isolation body is formed on one side of the substrate, the isolation body comprising an isolation structure and a sacrificial structure sequentially stacked in a direction away from the substrate, the isolation body being provided with a through opening sequentially penetrating the isolation structure and the sacrificial structure, the orthographic projection of the side of the isolation structure away from the substrate on the substrate being located within the orthographic projection of the sacrificial structure on the substrate, and the portion of the through opening corresponding to the isolation structure being the isolation opening; the orthographic projection of the side of the isolation structure away from the substrate on the substrate being located within the orthographic projection of the side of the isolation structure close to the substrate on the substrate;

[0048] forming at least a portion of the light emitting element within the through opening;

[0049] forming a first encapsulation layer on a side of the light-emitting element away from the substrate;

[0050] The sacrificial structure is removed.

[0051] In some possible embodiments, a transition film layer is provided between the isolation structure and the sacrificial structure, the thermal expansion coefficient of the transition film layer is different from that of the isolation structure, and the absolute value of the difference between the thermal expansion coefficients of the transition film layer and the isolation structure is greater than a first preset value; and / or the thermal expansion coefficient of the transition film layer is different from that of the sacrificial structure, and the absolute value of the difference between the thermal expansion coefficients of the transition film layer and the sacrificial structure is greater than a second preset value;

[0052] The step of removing the sacrificial structure comprises:

[0053] The transition film layer and the sacrificial structure are heated to expand the transition film layer, so that the sacrificial structure is separated from the transition film layer.

[0054] In some possible implementations, the step of heating the transition film layer and the sacrificial structure includes:

[0055] The display panel is illuminated by a preset light.

[0056] In some possible implementations, before the step of irradiating the display panel with a preset light, the method further includes:

[0057] forming a protective layer on a side of the light-emitting element away from the substrate, wherein the orthographic projection of the protective layer on the substrate covers at least a portion of the orthographic projection of the light-emitting element on the substrate; the protective layer comprises a light-shielding material;

[0058] Preferably, the material of the protective layer includes vinyl.

[0059] In some possible implementations, the present application further provides an electronic device, which includes the display panel described in the present application, or includes a display panel prepared by the method for preparing the display panel described in the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0060] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0061] Figure 1 A schematic cross-sectional view of a display panel in the related art provided in an embodiment of the present application;

[0062] Figure 2 This is one of the cross-sectional schematic diagrams of a display panel provided in an embodiment of the present application;

[0063] Figure 3 A cross-sectional schematic diagram of a display panel provided in an embodiment of the present application including a second encapsulation layer;

[0064] Figure 4 A cross-sectional schematic diagram of a display panel provided in an embodiment of the present application including a third encapsulation layer;

[0065] Figure 5 The second cross-sectional schematic diagram of the display panel provided in the embodiment of the present application;

[0066] Figure 6 A schematic flow chart of a method for manufacturing a display panel provided in an embodiment of the present application;

[0067] Figure 7 A cross-sectional schematic diagram of forming a first electrode layer on one side of a substrate provided in an embodiment of the present application;

[0068] Figure 8 A cross-sectional schematic diagram of forming a pixel defining layer on a side of the first electrode layer away from the substrate provided in an embodiment of the present application;

[0069] Figure 9 A cross-sectional schematic diagram of an isolation structure formed on a side of a pixel defining layer away from a substrate according to an embodiment of the present application;

[0070] Figure 10 A schematic cross-sectional view of forming a transition film layer on a side of an isolation structure away from a substrate according to an embodiment of the present application;

[0071] Figure 11 One of the cross-sectional schematic diagrams of forming a sacrificial structure on a side of the transition film layer away from the substrate provided in an embodiment of the present application;

[0072] Figure 12 A second cross-sectional schematic diagram of a sacrificial structure formed on a side of the transition film layer away from the substrate provided in an embodiment of the present application;

[0073] Figure 13 One of the cross-sectional schematic diagrams of forming a light-emitting functional layer on a side of an isolator away from a substrate provided in an embodiment of the present application;

[0074] Figure 14 The second cross-sectional schematic diagram of forming a light-emitting functional layer on a side of an isolator away from a substrate according to an embodiment of the present application;

[0075] Figure 15 One of the cross-sectional schematic diagrams of forming a second electrode layer on a side of the light-emitting functional layer away from the substrate provided in an embodiment of the present application;

[0076] Figure 16The second cross-sectional schematic diagram of forming a second electrode layer on a side of the light-emitting functional layer away from the substrate provided in an embodiment of the present application;

[0077] Figure 17 One of the cross-sectional schematic diagrams of forming a first encapsulation layer on a side of the second electrode layer away from the substrate provided in an embodiment of the present application;

[0078] Figure 18 A second cross-sectional schematic diagram of forming a first encapsulation layer on a side of the second electrode layer away from the substrate provided in an embodiment of the present application;

[0079] Figure 19 One of the cross-sectional schematic diagrams of forming a protective layer on a side of a light-emitting element away from a substrate provided in an embodiment of the present application;

[0080] Figure 20 The second cross-sectional schematic diagram of forming a protective layer on a side of a light-emitting element away from a substrate according to an embodiment of the present application;

[0081] Figure 21 One of the cross-sectional schematic diagrams of heating the transition film layer to expand the transition film layer so as to separate the sacrificial structure from the transition film layer, provided in an embodiment of the present application;

[0082] Figure 22 The second cross-sectional schematic diagram of heating the transition film layer to expand the transition film layer so as to separate the sacrificial structure from the transition film layer is provided in an embodiment of the present application.

[0083] Figure numerals: 1. substrate; 2. first electrode layer; 3. pixel defining layer; 31. pixel opening; 4. light-emitting functional layer; 5. second electrode layer; 6. first encapsulation layer; 61. encapsulation unit; 7. isolation opening; 8. isolation unit; 9. second encapsulation layer; 10. light-emitting element; 11. pit; 12. isolation structure; 13. third encapsulation layer; 14. transition film layer; 15. sacrificial structure; 16. insulator; 17. protective layer. DETAILED DESCRIPTION

[0084] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0085] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without making any creative efforts shall fall within the scope of protection of the present application.

[0086] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0087] In the description of this application, it should be noted that the terms "center," "upper," "lower," "vertical," "horizontal," "inner," "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the inventive product is typically placed when in use. These terms are intended solely to facilitate the description of this application and simplify the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," "third," etc., are used solely to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0088] It should be noted that, in the absence of conflict, different features in the embodiments of the present application can be combined with each other.

[0089] See Figure 1 The display panel in the related art includes a substrate 1, an isolation unit 8 located on one side of the substrate 1, and an isolation opening 7 defined in the isolation unit 8. The display panel also includes a light-emitting element 10 at least partially located within the isolation opening 7, a first encapsulation layer 6 located on the side of the light-emitting element 10 away from the substrate 1, and a second encapsulation layer 9 located on the side of the first encapsulation layer 6 away from the substrate 1. The first encapsulation layer 6 includes a plurality of spaced-apart encapsulation units 61. The orthographic projection of the side of the isolation unit 8 close to the substrate 1 on the substrate 1 is within the orthographic projection of the side of the isolation unit 8 away from the substrate 1 on the substrate 1. The side of the isolation unit 8 away from the substrate 1 blocks the material of the second encapsulation layer 9, thereby reducing the fluidity of the material of the second encapsulation layer 9. This makes it easier for pits 11 to form on the side of the second encapsulation layer 9 away from the substrate 1, ultimately affecting the display effect of the display panel.

[0090] The packaging unit 61 extends from the side of the isolation unit 8 toward the isolation opening 7 to the side of the isolation unit 8 away from the substrate 1. The light emitted by the light emitting element 10 (eg Figure 1The light (as indicated by the arrow in the figure) irradiates the encapsulation unit 61 on the isolation unit 8 and refracts, ultimately affecting the image quality of the display panel. Furthermore, a portion of the film layer of the light-emitting element 10 remains between the encapsulation unit 61 and the isolation unit 8 on the side of the isolation unit 8 away from the substrate 1. The film layer of some of the light-emitting elements 10 is an organic layer, and the encapsulation unit 61 contacts the side of the isolation unit 8 away from the substrate 1 through the organic layer, making it easy for the encapsulation unit 61 to fall off the isolation unit 8, thereby affecting the encapsulation and display effects of the display panel.

[0091] In view of this, this embodiment provides a solution that can improve the display effect and packaging effect of the display panel. The solution provided by this embodiment is described in detail below.

[0092] See Figure 2 This embodiment provides a display panel, which includes a substrate 1, an isolation structure 12, a light-emitting element 10 and a first encapsulation layer 6.

[0093] The isolation structure 12 is located on one side of the substrate 1 and is provided with an isolation opening 7 . The orthographic projection of the side of the isolation structure 12 away from the substrate 1 on the substrate 1 is located within the orthographic projection of the side of the isolation structure 12 close to the substrate 1 on the substrate 1 .

[0094] The composition, preparation, etc. of the isolation structure 12 are further described in patents PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202310707209.0, and 202311346196.5 for reference.

[0095] At least part of the light emitting elements 10 is located in the isolation opening 7 , and the light emitting elements 10 include a red light emitting element, a blue light emitting element, and a green light emitting element.

[0096] The first packaging layer 6 is located on a side of the light emitting element 10 away from the substrate 1 . The first packaging layer 6 includes a plurality of spaced packaging units 61 . The packaging units 61 are disposed in the isolation opening 7 and extend to the side of the isolation structure 12 facing the isolation opening 7 .

[0097] During the patterning process of the light emitting element 10 , the first encapsulation layer 6 is disconnected to form a plurality of spaced encapsulation units 61 . The encapsulation units 61 can independently encapsulate the light emitting element 10 , thereby improving the display characteristics of the display panel.

[0098] Because the orthographic projection of the side of the isolation structure 12 away from the substrate 1 is within the orthographic projection of the side of the isolation structure 12 closer to the substrate 1, the side of the isolation structure 12 away from the substrate 1 is less likely to block the light emitted by the light-emitting element 10, thereby improving the image quality of the display panel and ultimately improving the display quality of the display panel. The encapsulation unit 61 can also be more firmly attached to the isolation structure 12, thereby better encapsulating the light-emitting element 10, ultimately improving the encapsulation effect and display effect of the display panel.

[0099] Based on the above design, this embodiment can improve the display effect of the display panel by setting the orthographic projection of the side of the isolation structure 12 away from the substrate 1 on the substrate 1 to be located within the orthographic projection of the side of the isolation structure 12 close to the substrate 1 on the substrate 1.

[0100] For some possible implementations, see Figure 3 The display panel further includes a second encapsulation layer 9 located on a side of the first encapsulation layer 6 away from the substrate 1. The first encapsulation layer 6 is made of an inorganic material, and the second encapsulation layer 9 is made of an organic material. In one embodiment, the second encapsulation layer 9 may be in direct contact with the side of the isolation structure 12 away from the substrate 1.

[0101] Since the orthographic projection of the side of the isolation structure 12 away from the substrate 1 on the substrate 1 is located within the orthographic projection of the side of the isolation structure 12 close to the substrate 1 on the substrate 1, the side of the isolation structure 12 away from the substrate 1 is not easy to block the material of the second encapsulation layer 9, thereby making the material of the second encapsulation layer 9 more fluid, and it is not easy to form pits 11 on the side of the second encapsulation layer 9 away from the substrate 1, so that the side of the second encapsulation layer 9 away from the substrate 1 is flat, which ultimately affects the display effect of the display panel.

[0102] For some possible implementations, see Figure 4 The display panel further includes a third encapsulation layer 13 located on a side of the second encapsulation layer 9 away from the substrate 1. The third encapsulation layer 13 is made of inorganic materials. The third encapsulation layer 13 can provide a better encapsulation effect on the display panel.

[0103] For some possible implementations, see again Figure 4The light-emitting element 10 includes a first electrode layer 2, a hole transport layer, a light-emitting functional layer 4, an electron transport layer, and a second electrode layer 5, which are stacked in sequence along a direction away from the substrate 1. The hole transport layers of different light-emitting elements 10 are disconnected, and / or the electron transport layers of different light-emitting elements 10 are disconnected. The first electrode layer 2 serves as an anode, and the second electrode layer 5 serves as a cathode. An isolation opening 7 exposes at least a portion of the first electrode layer 2. The light-emitting functional layer 4 is located within the isolation opening 7. The isolation structure 12 comprises a conductive material, and the second electrode layer 5 is electrically connected to the isolation structure 12.

[0104] The display panel also includes a pixel defining layer 3 located on the side of the first electrode layer away from the substrate 1, and the isolation structure 12 is located on the side of the pixel defining layer 3 away from the substrate 1; the pixel defining layer 3 includes a pixel opening 31 exposing at least part of the first electrode layer 2, the orthographic projection of the isolation structure 12 on the substrate 1 is located within the orthographic projection of the pixel defining layer 3 on the substrate 1, and the orthographic projection of the pixel opening 31 on the substrate 1 is located within the orthographic projection of the isolation opening 7 on the substrate 1.

[0105] The isolation structure 12 includes a conductive material, the isolation structure 12 includes a first layer, and the second electrode layer 5 is electrically connected to the first layer; or, the isolation structure 12 includes a second layer and a first layer stacked in sequence in a direction away from the substrate, and the second electrode layer 5 is electrically connected to the second layer or the first layer; or, the isolation structure 12 includes a second layer, a first layer and a third layer stacked in sequence in a direction away from the substrate 1, and the second electrode layer 5 is electrically connected to the first layer or the second layer; the material of the first layer includes aluminum; the material of the second layer includes titanium or molybdenum; the material of the third layer includes titanium or molybdenum.

[0106] For some possible implementations, see Figure 5 A transition film layer 14 is provided on the side of the isolation structure 12 away from the substrate 1, wherein the transition film layer 14 is provided between the isolation structure 12 and the second encapsulation layer 9, and the transition film layer 14 includes a main material and a foaming material doped in the main material, wherein the main material includes photoresist; the foaming material includes at least one of ammonium carbonate, ammonium bicarbonate, sodium bicarbonate, ammonium nitrite, sodium borohydride, trichloromonofluoromethane and dichloromonofluoromethane.

[0107] In summary, the present application can improve the display effect of the display panel by setting the orthographic projection of the side of the isolation structure 12 away from the substrate 1 on the substrate 1 to be located within the orthographic projection of the side of the isolation structure 12 close to the substrate 1 on the substrate 1.

[0108] In some possible implementations, the present application further provides a display panel, such as Figure 4 As shown, the display panel includes a substrate 1 , an isolation structure 12 and a light emitting element 10 .

[0109] The isolation structure 12 is located on one side of the substrate 1. The isolation structure 12 is provided with an isolation opening 7. The orthographic projection of the side of the isolation structure 12 away from the substrate 1 on the substrate 1 is located within the orthographic projection of the side of the isolation structure 12 close to the substrate 1 on the substrate 1.

[0110] At least a portion of the light-emitting element 10 is located within the isolation opening 7. The light-emitting element includes a first electrode layer 2, a light-emitting functional layer 4, and a second electrode layer 5, which are stacked in sequence in a direction away from the substrate. The isolation structure 12 comprises a conductive material, and the second electrode layer 5 is electrically connected to the isolation structure 12. The light-emitting element also includes a hole transport layer and an electron transport layer. The hole transport layer is located between the first electrode layer 2 and the light-emitting functional layer 4, and the electron transport layer is located between the light-emitting functional layer 4 and the second electrode layer 5. The hole transport layers of different light-emitting elements 10 are disconnected, and / or the electron transport layers of different light-emitting elements 10 are disconnected.

[0111] Since the orthographic projection of the side of the isolation structure 12 away from the substrate 1 on the substrate 1 is located within the orthographic projection of the side of the isolation structure 12 close to the substrate 1 on the substrate 1, the side of the isolation structure 12 away from the substrate 1 is not easy to block the light emitted by the light-emitting element 10, thereby improving the image quality of the display panel and ultimately improving the display quality of the display panel.

[0112] For some possible implementations, see Figure 11 and Figure 12 The present application also provides an array substrate, which is used for a display panel. The array substrate includes a substrate 1 and an insulator 16.

[0113] The isolation body 16 substrate 1 is located on one side of the substrate 1, and the isolation body 16 includes an isolation structure 12, a transition film layer 14 and a sacrificial structure 15 stacked in sequence in a direction away from the substrate 1. The isolation body 16 is provided with a through opening that passes through the isolation structure 12, the transition film layer 14 and the sacrificial structure 15 in sequence. The orthographic projection of the side of the isolation structure 12 away from the substrate 1 on the substrate 1 is located within the orthographic projection of the sacrificial structure 15 on the substrate 1.

[0114] The thermal expansion coefficient of the transition film layer 14 is different from the thermal expansion coefficient of the isolation structure 12, and the absolute value of the difference between the thermal expansion coefficient of the transition film layer 14 and the thermal expansion coefficient of the isolation structure 12 is greater than the first preset value; and / or, the thermal expansion coefficient of the transition film layer 14 is different from the thermal expansion coefficient of the sacrificial structure 15, and the absolute value of the difference between the thermal expansion coefficient of the transition film layer 14 and the thermal expansion coefficient of the sacrificial structure 15 is greater than the second preset value.

[0115] Since the thermal expansion coefficient of the transition film layer 14 is different from the thermal expansion coefficient of the isolation structure 12, and / or the thermal expansion coefficient of the transition film layer 14 is different from the thermal expansion coefficient of the sacrificial structure 15, when the insulator 16 is heated, the transition film layer 14 will separate from the isolation structure 12, and / or the transition film layer 14 will separate from the sacrificial structure 15, so that the array substrate does not include the sacrificial structure 15 and retains the isolation structure 12.

[0116] In some possible embodiments, the thermal expansion coefficient of the transition film layer 14 is greater than that of the isolation structure 12 and / or the thermal expansion coefficient of the transition film layer 14 is greater than that of the sacrificial structure 15. The transition film layer 14 includes a main material and a foaming material doped with the main material; the main material includes photoresist, and the foaming material includes at least one of ammonium carbonate, ammonium bicarbonate, sodium bicarbonate, ammonium nitrite, sodium borohydride, trichloromonofluoromethane, and dichloromonofluoromethane; the foaming temperature of the foaming material or the foaming temperature of the transition film layer 14 is greater than 100°C, and the sacrificial structure 15 is a light-transmitting structure; the light transmittance of the sacrificial structure 15 is greater than 10% @ 700nm-1mm @ 1um. The sacrificial structure 15 includes an organic material or an inorganic material. In one embodiment, the sacrificial structure 15 includes an organic material, and the organic material includes photoresist; in another embodiment, the sacrificial structure 15 includes an inorganic material, and the inorganic material includes silicon oxide.

[0117] Here, 10%@700nm-1mm@1um means that the transmittance of the sacrificial structure 15 with a thickness of 1um is 10% within the wavelength range of 700nm-1mm. The isolator 16 can be illuminated by a predetermined optical fiber. The predetermined light passes through the sacrificial structure 15 and heats the transition film 14. This makes it easier to heat the transition film 14 and cause it to expand thermally.

[0118] For some possible implementations, see Figure 6 , the present application also provides a method for preparing a display panel, the method comprising:

[0119] S10: providing a substrate 1.

[0120] S11: An isolation body 16 is formed on one side of the substrate 1. The isolation body 16 includes an isolation structure 12 and a sacrificial structure 15 which are stacked in sequence in a direction away from the substrate. The isolation body 16 is provided with a through opening which passes through the isolation structure 12 and the sacrificial structure 15 in sequence. The orthographic projection of the side of the isolation structure 12 away from the substrate on the substrate 1 is located within the orthographic projection of the sacrificial structure 15 on the substrate 1. The part of the through opening corresponding to the isolation structure 12 is the isolation opening 7; the orthographic projection of the side of the isolation structure 12 away from the substrate 1 on the substrate 1 is located within the orthographic projection of the side of the isolation structure 12 close to the substrate 1 on the substrate 1.

[0121] See Figure 7 In step S11, before forming the isolator 16, a first electrode layer 2 may be formed on one side of the substrate 1; see Figure 8 Then, a pixel defining layer 3 is formed on the side of the first electrode layer 2 away from the substrate 1. The pixel defining layer 3 includes a pixel opening 31; see Figure 9 Then, an isolation structure 12 is formed on a side of the pixel defining layer 3 away from the substrate 1 .

[0122] See Figure 10 After forming the isolation structure 12, a transition film layer 14 may be formed on the side of the isolation structure 12 away from the substrate 1. The transition film layer 14 expands upon heating. The transition film layer 14 comprises a main material and a foaming material doped with the main material. The main material comprises a photoresist having a foaming temperature greater than 100°C. The additive material of the foaming material may be an inorganic substance such as ammonium carbonate, ammonium bicarbonate, sodium bicarbonate, ammonium nitrite, sodium borohydride, various azides, or an organic substance such as chlorofluoroalkanes such as trichloromonofluoromethane and dichloromonofluoromethane.

[0123] See Figure 11 and Figure 12 A sacrificial structure 15 is formed on the side of the transition film layer 14 away from the substrate 1 , and the orthographic projection of the isolation structure 12 on the substrate 1 is located within the orthographic projection of the sacrificial structure 15 on the substrate 1 .

[0124] Figure 11 The sacrificial structure 15 can be formed by a negative photoresist, and the light transmittance of the sacrificial structure 15 is greater than 10%@700nm-1mm@1um. Specifically, a sacrificial structure material layer is formed on the side of the transition film layer 14 away from the substrate 1; the sacrificial structure material layer is exposed, developed and baked to form the sacrificial structure 15.

[0125] In another embodiment, Figure 12 As shown in FIG, the sacrificial structure 15 may be formed of silicon oxide, and the sacrificial structure 15 is a transparent structure.

[0126] The isolation structure 12 , the transition film layer 14 and the sacrificial structure 15 form an isolation body 16 .

[0127] After step S11, the method further includes:

[0128] S12: forming at least a portion of the light emitting element 10 in the through opening.

[0129] See Figure 13-14 A light-emitting functional layer 4 is formed on the side of the insulator 16 away from the substrate 1 . By controlling the evaporation angle, the light-emitting functional layer 4 can be prevented from contacting the isolation structure 12 .

[0130] See Figure 15-16 A second electrode layer 5 is formed on the side of the light-emitting functional layer 4 away from the substrate 1. By controlling the evaporation angle, the second electrode layer 5 can be extended from the isolation opening 7 to electrically contact the isolation structure 12, thereby connecting adjacent second electrode layers 5 or connecting the second electrode layer 5 to other circuits. This can reduce the difficulty of manufacturing the display panel.

[0131] S13 : forming a first encapsulation layer 6 on a side of the light emitting element 10 away from the substrate 1 .

[0132] See Figure 17-18 A first encapsulation layer 6 is formed on the side of the second electrode layer 5 away from the substrate 1. The first encapsulation layer 6 is disconnected at the isolating body 16 to form a plurality of encapsulation units 61 arranged at intervals. The encapsulation units 61 extend from the side of the isolating body 16 toward the isolation opening 7 to the side of the isolating body 16 away from the substrate 1. The encapsulation units 61 serve as independent encapsulation for the light-emitting element 10.

[0133] S14: removing the sacrificial structure 15.

[0134] After removing the sacrificial structure 15, the isolation structure 12 is retained. The orthographic projection of the side of the isolation structure 12 away from the substrate 1 on the substrate 1 is located within the orthographic projection of the side of the isolation structure 12 close to the substrate 1 on the substrate 1. The first packaging layer 6 includes a plurality of packaging units 61 arranged at intervals. The packaging units 61 are arranged in the isolation opening 7. The packaging units 61 extend to the side of the isolation structure 12 facing the isolation opening 7.

[0135] See Figure 19-20 Before removing the sacrificial structure 15 , the present disclosure may form a protective layer 17 on the side of the light emitting element 10 away from the substrate 1 , and the orthographic projection of the protective layer 17 on the substrate 1 covers at least part of the orthographic projection of the light emitting element 10 on the substrate 1 .

[0136] The protective layer 17 includes a light-shielding material. The material of the protective layer 17 includes black glue. The light transmittance of the black glue is less than 1%@700nm-1mm@1um, where 1%@700nm-1mm@1um means that the transmittance of black glue with a thickness of 1um is 1% in the light wavelength range of 700nm-1mm. The black glue is applied on the side of the light-emitting element 10 away from the substrate 1, and the black glue can protect the light-emitting element 10.

[0137] See Figure 21-22 , the transition film layer 14 is heated to expand the transition film layer 14 so that the sacrificial structure 15 is separated from the transition film layer 14 .

[0138] The thermal expansion coefficient of the transition film layer 14 is different from the thermal expansion coefficient of the isolation structure 12, and the absolute value of the difference between the thermal expansion coefficient of the transition film layer 14 and the thermal expansion coefficient of the isolation structure 12 is greater than the first preset value; and / or, the thermal expansion coefficient of the transition film layer 14 is different from the thermal expansion coefficient of the sacrificial structure 15, and the absolute value of the difference between the thermal expansion coefficient of the transition film layer 14 and the thermal expansion coefficient of the sacrificial structure 15 is greater than the second preset value.

[0139] Specifically, the present disclosure can illuminate the display panel with a predetermined light beam, allowing the predetermined light beam to pass through the sacrificial structure 15, thereby heating the transition film layer 14 and causing the transition film layer 14 to expand, thereby separating the sacrificial structure 15 from the transition film layer 14. The thermal effect of the predetermined light beam causes the transition film layer 14 to foam and expand, thereby completely separating the sacrificial structure 15. Since the light-emitting element 10 is protected by the protective layer 17, it is rarely heated by the laser beam, thereby reducing the risk of damage to the light-emitting element 10. The predetermined light beam may include infrared light, which may be an infrared laser.

[0140] Please see again Figure 2 After peeling off the sacrificial structure 15 , the present disclosure can remove the transition film layer 14 and / or the protective layer 17 .

[0141] In this way, the isolation structure 12 of the display panel prepared by the above process is not easy to block the light emitted by the light-emitting element 10, the packaging unit 61 is not easy to fall off the isolation structure 12, and the material of the second packaging layer 9 is also easier to level, thereby improving the display effect and packaging effect of the display panel.

[0142] In some possible implementations, the present application further provides an electronic device comprising the display panel of the present application, or comprising a display panel produced by the method for producing a display panel of the present application. The electronic device may include a device with image processing capabilities, such as a server, a personal computer, or a laptop computer. Because the electronic device includes the display panel of the present application, the display and packaging effects of the electronic device are improved.

[0143] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0144] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A display panel, characterized in that: The display panel includes: substrate; an isolation structure located on one side of the substrate, the isolation structure being provided with an isolation opening, the orthographic projection of a side of the isolation structure away from the substrate on the substrate being located within the orthographic projection of a side of the isolation structure close to the substrate on the substrate; a light emitting element at least partially located within the isolation opening; A first packaging layer is located on a side of the light emitting element away from the substrate, the first packaging layer comprising a plurality of packaging units arranged at intervals, the packaging units being arranged in the isolation opening and extending to a side of the isolation structure facing the isolation opening.

2. The display panel according to claim 1, wherein: The display panel further includes a second encapsulation layer located on a side of the first encapsulation layer away from the substrate; Preferably, the material of the first encapsulation layer includes an inorganic material; Preferably, the material of the second encapsulation layer includes organic material.

3. The display panel according to claim 2, wherein: The second encapsulation layer is in direct contact with a side of the isolation structure away from the substrate.

4. The display panel according to claim 1 or 2, wherein: A transition film layer is provided on a side of the isolation structure away from the substrate, wherein the transition film layer comprises a main body material and a foaming material doped with the main body material; Preferably, the host material comprises photoresist; Preferably, the foaming material comprises at least one of ammonium carbonate, ammonium bicarbonate, sodium bicarbonate, ammonium nitrite, sodium borohydride, trichloromonofluoromethane and dichloromonofluoromethane; Preferably, the transition film layer is provided between the isolation structure and the second encapsulation layer.

5. The display panel according to claim 1, wherein: The light-emitting element includes a first electrode layer, a hole transport layer, a light-emitting functional layer, an electron transport layer and a second electrode layer, which are stacked in sequence in a direction away from the substrate; the hole transport layers of different light-emitting elements are disconnected, and / or the electron transport layers of different light-emitting elements are disconnected.

6. The display panel according to claim 1 or 3, characterized in that: The isolation structure includes a first layer; Alternatively, the isolation structure includes a second layer and a first layer sequentially stacked in a direction away from the substrate; Alternatively, the isolation structure includes a second layer, a first layer, and a third layer stacked in sequence in a direction away from the substrate; Preferably, the material of the first layer comprises aluminum; Preferably, the material of the second layer includes titanium or molybdenum; Preferably, the material of the third layer includes titanium or molybdenum.

7. The display panel according to claim 5, wherein: The isolation structure includes a conductive material, and the second electrode layer is electrically connected to the isolation structure.

8. The display panel according to claim 7, wherein: The display panel also includes a pixel defining layer located on the side of the first electrode layer away from the substrate, and the isolation structure is located on the side of the pixel defining layer away from the substrate; the pixel defining layer includes a pixel opening exposing at least a portion of the first electrode layer, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation opening on the substrate.

9. A display panel, characterized in that: The display panel includes: substrate; an isolation structure located on one side of the substrate, the isolation structure being provided with an isolation opening; an orthographic projection of a side of the isolation structure away from the substrate on the substrate being located within an orthographic projection of a side of the isolation structure close to the substrate on the substrate; A light-emitting element is located in the isolation opening; the light-emitting element includes a first electrode layer, a light-emitting functional layer and a second electrode layer stacked in sequence in a direction away from the substrate; the isolation structure includes a conductive material, and the second electrode layer is electrically connected to the isolation structure.

10. The display panel according to claim 9, wherein: The light-emitting element further includes a hole transport layer and an electron transport layer, the hole transport layer is located between the first electrode layer and the light-emitting functional layer, and the electron transport layer is located between the light-emitting functional layer and the second electrode layer; the hole transport layers of different light-emitting elements are disconnected, and / or the electron transport layers of different light-emitting elements are disconnected.

11. An array substrate, used for a display panel, characterized in that: The array substrate includes: substrate; an isolator located on one side of the substrate, the isolator comprising an isolation structure, a transition film layer, and a sacrificial structure stacked in sequence in a direction away from the substrate, the isolator having a through opening that sequentially penetrates the isolation structure, the transition film layer, and the sacrificial structure, and the orthographic projection of the side of the isolation structure away from the substrate on the substrate being within the orthographic projection of the sacrificial structure on the substrate; The thermal expansion coefficient of the transition film layer is different from the thermal expansion coefficient of the isolation structure, and the absolute value of the difference between the thermal expansion coefficient of the transition film layer and the thermal expansion coefficient of the isolation structure is greater than a first preset value; and / or, the thermal expansion coefficient of the transition film layer is different from the thermal expansion coefficient of the sacrificial structure, and the absolute value of the difference between the thermal expansion coefficient of the transition film layer and the thermal expansion coefficient of the sacrificial structure is greater than a second preset value.

12. The array substrate according to claim 11, wherein: The thermal expansion coefficient of the transition film layer is greater than the thermal expansion coefficient of the isolation structure and / or the thermal expansion coefficient of the transition film layer is greater than the thermal expansion coefficient of the sacrificial structure.

13. The array substrate according to claim 12, wherein: The transition film layer includes a main body material and a foaming material doped with the main body material; Preferably, the host material comprises photoresist; Preferably, the foaming material comprises at least one of ammonium carbonate, ammonium bicarbonate, sodium bicarbonate, ammonium nitrite, sodium borohydride, trichloromonofluoromethane and dichloromonofluoromethane; Preferably, the foaming temperature of the foaming material or the foaming temperature of the transition film layer is greater than 100°C.

14. The array substrate according to claim 11, wherein: The sacrificial structure is a light-transmitting structure; Preferably, the light transmittance of the sacrificial structure is greater than 10%@700nm-1mm@1um.

15. The array substrate according to claim 11, wherein: The sacrificial structure comprises an organic material or an inorganic material; Preferably, the sacrificial structure comprises an organic material, and the organic material comprises a photoresist; Preferably, the sacrificial structure comprises an inorganic material, and the inorganic material comprises silicon oxide.

16. A method for preparing a display panel, characterized in that: The method comprises: providing a substrate; An isolation body is formed on one side of the substrate, the isolation body comprising an isolation structure and a sacrificial structure sequentially stacked in a direction away from the substrate, the isolation body being provided with a through opening sequentially penetrating the isolation structure and the sacrificial structure, the orthographic projection of the side of the isolation structure away from the substrate on the substrate being located within the orthographic projection of the sacrificial structure on the substrate, and the portion of the through opening corresponding to the isolation structure being the isolation opening; the orthographic projection of the side of the isolation structure away from the substrate on the substrate being located within the orthographic projection of the side of the isolation structure close to the substrate on the substrate; forming at least a portion of the light emitting element within the through opening; forming a first encapsulation layer on a side of the light-emitting element away from the substrate; The sacrificial structure is removed.

17. The method for manufacturing a display panel according to claim 16, wherein: A transition film layer is provided between the isolation structure and the sacrificial structure, wherein the thermal expansion coefficient of the transition film layer is different from the thermal expansion coefficient of the isolation structure, and the absolute value of the difference between the thermal expansion coefficients of the transition film layer and the thermal expansion coefficients of the isolation structure is greater than a first preset value; and / or, the thermal expansion coefficients of the transition film layer are different from the thermal expansion coefficients of the sacrificial structure, and the absolute value of the difference between the thermal expansion coefficients of the transition film layer and the thermal expansion coefficients of the sacrificial structure is greater than a second preset value; The step of removing the sacrificial structure comprises: The transition film layer and the sacrificial structure are heated to expand the transition film layer, so that the sacrificial structure is separated from the transition film layer.

18. The method for manufacturing a display panel according to claim 17, wherein: The step of heating the transition film layer and the sacrificial structure comprises: irradiating the display panel with a preset light; Preferably, the preset light includes infrared light.

19. The method for manufacturing a display panel according to claim 18, wherein: Before the step of irradiating the display panel with the preset light, the method further includes: forming a protective layer on a side of the light-emitting element away from the substrate, wherein the orthographic projection of the protective layer on the substrate covers at least a portion of the orthographic projection of the light-emitting element on the substrate; the protective layer comprises a light-shielding material; Preferably, the material of the protective layer includes vinyl.

20. An electronic device, characterized in that: The electronic device comprises the display panel according to any one of claims 1 to 10, or comprises a display panel prepared by the method for preparing a display panel according to any one of claims 16 to 19.

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