High-power circuit board processing and spraying equipment and method

Abstract

The invention discloses a high-power circuit board processing and spraying device and method, and relates to the technical field of circuit board spraying, the device comprises a box body with supporting legs, annular rails which are symmetrically arranged are arranged in the box body in a penetrating mode, a plurality of frame bodies which move along the tracks of the annular rails are arranged between the two annular rails, the frame bodies are connected with the annular rails through electric sliding blocks, and the electric sliding blocks are connected with the box body. The box body is provided with a frame body, the frame body is provided with a clamping mechanism used for clamping the edges of the two sides of the circuit board body, the clamping mechanism is provided with an elastic mechanism used for clamping the top end and the bottom end of the circuit board body, the box body is internally provided with a first spraying piece, a first drying piece, a second spraying piece and a second drying piece in sequence from left to right, and the box body is further internally provided with an abutting piece. According to the spraying device, continuous spraying processing can be conveniently conducted on the high-power circuit board, synchronous spraying on the two sides can be achieved without turning over the circuit board in the processing process, and therefore the spraying processing efficiency is greatly improved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board spraying, and in particular to a high-power circuit board processing spraying device and method. Background Art

[0002] High-power onboard chargers (OBCs) and DC-DC converter (DC-DC) circuit boards are core power electronics components in modern new energy vehicles and industrial equipment. Their operating environments often face harsh challenges such as high temperature, high humidity, vibration, dust, and chemical corrosion. To ensure long-term reliability, electrical insulation, and resistance to harsh environments, protective coatings (such as spray-coating with conformal coating, thermal conductive adhesive, and potting compound) on high-power printed circuit boards (PCBAs) have become an essential and critical process. This protective coating effectively isolates moisture, salt spray, and contaminants, preventing arcing and leakage, while also enhancing heat dissipation and mechanical stability.

[0003] However, the existing mainstream spraying equipment can usually only perform automated coating operations on one side of the circuit board. When protective spraying is required on both sides of the circuit board, a flipping machine must be connected to the first coating machine. The flipping machine flips the circuit board 180 degrees and then sends it to the second coating machine that is connected later to spray the other side. This "coating machine-flipping machine-coating machine" series mode not only greatly increases the equipment footprint and purchase cost, but more importantly, the transfer, positioning, and flipping process of the board between the equipment significantly prolongs the single board processing cycle, resulting in low overall spraying efficiency. Secondly, the existing spraying lines generally adopt a discrete processing method of "feeding in boards one by one, spraying them one by one, and flowing out one by one". The circuit board needs to complete the positioning, spraying, curing and other steps at the spraying station before it can be moved out and the next board can be processed. This discontinuous operation mode greatly affects the processing efficiency of the circuit board. Summary of the Invention

[0004] The present invention provides a high-power circuit board processing spraying device and method, which can solve the problems in the prior art that the spraying equipment is inconvenient to spray both sides of the circuit board simultaneously and difficult to achieve continuous processing operations, thereby affecting processing efficiency.

[0005] The purpose of the present invention can be achieved through the following technical solutions:

[0006] A first aspect of the present invention provides a high-power circuit board processing spraying equipment, comprising a box with supporting legs, wherein a symmetrically arranged circular track is passed through the box, and a plurality of frames that move along their tracks are provided between the two circular tracks, the frames are connected to the circular track through an electric slider, and a clamping mechanism for clamping the edges of both sides of the circuit board body is installed on the frame, and an elastic mechanism for clamping the top and bottom ends of the circuit board body is installed on the clamping mechanism, a first spraying part, a first drying part, a second spraying part and a second drying part are arranged in sequence from left to right in the box, and a resistance part is also installed in the box, after the circuit board body passes through the first spraying part and the first drying part, it is squeezed down by the resistance part, and then passes through the second spraying part and the second drying part in sequence.

[0007] As a further solution of the present invention: the clamping mechanism includes a first movable shell, a second movable shell, a clamping roller, a sliding rod, a first spring and a regulating mechanism, the first movable shell and the second movable shell are both slidably arranged in the frame, and the opposite sides of the first movable shell and the second movable shell are both opened, the two clamping rollers are rotatably installed in the first movable shell and the second movable shell respectively, the regulating mechanism is installed on the frame and is used to control the first movable shell to slide along the frame, the sliding rod is installed on the side of the second movable shell away from the first movable shell, and the sliding rod slides through the end of the frame, and the first spring is installed between the sliding rod and the frame.

[0008] As a further solution of the present invention: the regulating mechanism includes a worm, a worm wheel, a rotating rod, a gear and a rack column, the end of the frame is provided with a notch groove, and the end of the frame is also provided with a through groove for the rack column to pass through, the worm is rotatably connected to the bottom of the notch groove, the rack column is connected to the first movable shell through the through groove, the two ends of the rotating rod respectively pass through the two sides of the notch groove and extend into the through groove to be connected with the gear, the gear is meshed with the rack column, the worm wheel is mounted on the rotating rod, and the worm wheel is meshed with the worm.

[0009] As a further solution of the present invention: a limiting mechanism is installed between the second movable shell and the frame, and the limiting mechanism includes a U-shaped slider, a U-shaped frame, a third movable shell, a limiting roller and a connecting rod. The two third movable shells are symmetrically arranged front and back about the circuit board body, and the facing sides of the two third movable shells are both opened. The limiting roller is rotatably installed in the third movable shell, and the U-shaped frame is installed at one end of the third movable shell close to the second movable shell. The upper and lower U-shaped sliders are respectively connected to the two ends of the U-shaped frame, and the U-shaped slider is slidably connected to the second movable shell, one end of the connecting rod is hinged to the side of the U-shaped slider away from the U-shaped frame, and the other end of the connecting rod is hinged to the inner wall of the frame.

[0010] As a further solution of the present invention: the elastic mechanism includes a telescopic part, a shell with a protrusion, an L-shaped support plate with a guide sleeve, a strip groove, a guide rod and a second spring. The telescopic part and the shell are respectively connected to the top and bottom of the second movable shell through connecting pins, and the telescopic part is used to limit the top height of the circuit board body. The protrusions are symmetrically arranged on both sides of the shell near the bottom end, and the strip groove passes through the side wall of the shell and is distributed along its length direction. The vertical part of the L-shaped support plate is slidably plugged into the shell, and the horizontal part of the L-shaped support plate is used to fit the bottom end of the circuit board body. The guide sleeve is installed at the side wall of the L-shaped support plate near the top, and the guide sleeve passes through the strip groove and is slidably connected to it. The guide rod is installed on the top of the protrusion, and the guide sleeve is slidably sleeved with the guide rod. The second spring is installed between the guide sleeve and the protrusion.

[0011] As a further solution of the present invention: the telescopic part includes an inverted L-shaped pressure column, a movable block and a square tube, the lower surface of the horizontal part of the inverted L-shaped pressure column is in contact with the top of the circuit board body, the movable block is connected to the bottom end of the inverted L-shaped pressure column, the square tube is connected to the top of the second movable shell through a connecting pin, the movable block is slidably arranged in the square tube, and the top of the movable block is in contact with the lower surface of the top of the square tube.

[0012] As a further solution of the present invention: the resistance member includes a horizontal column with an inclined surface and a connecting column, the distance between the top and the bottom of the horizontal column is equal to the height of the frame, the inclined surface is located at one end of the horizontal column close to the first drying element, and the inclined surface corresponds to the position of the inverted L-shaped pressure column, and the horizontal column is connected to the inner wall of the box through the connecting column.

[0013] As a further solution of the present invention: the first spray part includes a first spray plate, a first nozzle and a first feed pipe, the first spray plate is an inverted U-shaped hollow structure, several first nozzles are evenly installed on the opposite side walls of the first spray plate, and the first feed pipe is installed on the top of the first spray plate; the second spray part includes a second spray plate, a second nozzle and a second feed pipe, the second spray plate is a U-shaped hollow structure, several second nozzles are evenly installed on the opposite side walls of the second spray plate, and the second feed pipe is installed at the bottom of the second spray plate.

[0014] As a further solution of the present invention: the first drying part includes a first hot air plate with first hot air holes and a first hot air pipe, the first hot air plate is an inverted U-shaped hollow structure, several first hot air holes are evenly installed on the opposite side walls of the first hot air plate, and the first hot air pipe is installed on the top of the first hot air plate; the second drying part includes a second hot air plate with second hot air holes and a second hot air pipe, the second hot air plate is a U-shaped hollow structure, several second hot air holes are evenly installed on the opposite side walls of the second hot air plate, and the second hot air pipe is installed at the bottom of the second hot air plate.

[0015] A second aspect of the present invention provides a high-power circuit board processing spraying method, which is applicable to the above-mentioned high-power circuit board processing spraying equipment, and the method steps are as follows:

[0016] S1: Insert the circuit board body vertically into the frame, use the elastic mechanism to clamp and support the top and bottom ends of the circuit board body, and then adjust the clamping mechanism to clamp and limit the two side edges of the circuit board body;

[0017] S2: The frame is driven by an electric slider to move along the circular track. The frame first drives the clamped and limited circuit board body to pass through the first spraying unit, and the circuit board body part located above the frame is sprayed on both sides simultaneously. After spraying, it enters the first drying unit for drying.

[0018] S3: After the frame drives the circuit board body through the first drying element, it is squeezed by the resistance element and slides down, causing the unsprayed portion of the circuit board body previously located in the frame to slide down to the bottom of the frame;

[0019] S4: The frame drives the circuit board body to slide down and pass through the second spraying part and the second drying part in sequence, so that the circuit board body can be fully sprayed.

[0020] Beneficial effects of the present invention:

[0021] 1. In the present invention, the top and bottom ends of the circuit board body are conveniently elastically clamped by an elastic mechanism, which not only facilitates the clamping and support of the circuit board body, but also enables the circuit board body to adaptively slide down when its top is pressurized. The clamping mechanism facilitates the clamping and limiting of the two side edges of the circuit board body, and during the clamping process, the limiting mechanism can be linked to limit the front and rear directions of the circuit board body, so that the circuit board body will not tilt, thereby ensuring the stability of the clamping and limiting of the circuit board body.

[0022] 2. In the present invention, the electric slider is used to conveniently drive the frame to move along the track of the circular track, and the frame drives the circuit board body after clamping and limiting into the box for processing. During the movement, the circuit board body part located above the frame can pass through the first spraying part and the first drying part in sequence, so as to facilitate the double-sided synchronous spraying and drying of the circuit board body part above the frame; as the frame continues to move, the resistance part is used to cooperate with the elastic mechanism to facilitate the circuit board body to adaptively slide down, so that the circuit board body part previously located in the frame can slide down to the bottom of the frame, and the second spraying part and the second drying part are used to facilitate the simultaneous spraying and drying of the remaining part of the circuit board body that has not been sprayed on both sides. The entire process does not require the circuit board body to be flipped over, and double-sided synchronous spraying can be achieved, thereby greatly improving the spraying processing efficiency.

[0023] 3. In the present invention, the frame is driven to move along the circular track by an electric slider, and the movement of each frame is controlled by its corresponding electric slider. The frame enters the box and is sprayed. After the frame passes out, the processed circuit board body is removed and clamping can continue. This cycle can achieve continuous processing of the circuit board body, thereby greatly improving processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present invention will be further described below with reference to the accompanying drawings.

[0025] Figure 1 This is a three-dimensional diagram of a high-power circuit board processing spraying device of the present invention;

[0026] Figure 2 This is a three-dimensional diagram of a high-power circuit board processing spraying device of the present invention with the box removed;

[0027] Figure 3 This is a three-dimensional diagram of the connection between the frame and the clamping mechanism in a high-power circuit board processing and spraying device of the present invention;

[0028] Figure 4 This is a three-dimensional diagram of a control mechanism in a high-power circuit board processing spraying equipment of the present invention;

[0029] Figure 5 This is a three-dimensional diagram of a limiting mechanism in a high-power circuit board processing spraying device of the present invention;

[0030] Figure 6 It is a three-dimensional diagram of the connection portion between the elastic mechanism and the second movable shell in a high-power circuit board processing spraying device of the present invention;

[0031] Figure 7 This is a partial three-dimensional diagram of an elastic mechanism in a high-power circuit board processing spraying device of the present invention;

[0032] Figure 8 This is a cross-sectional view of a telescopic component in a high-power circuit board processing and spraying device according to the present invention;

[0033] Figure 9 It is a three-dimensional diagram of a first spraying unit and a first drying unit in a high-power circuit board processing spraying device of the present invention;

[0034] Figure 10 It is a three-dimensional diagram of the second spraying unit and the second drying unit in a high-power circuit board processing spraying equipment of the present invention;

[0035] Figure 11 It is a three-dimensional diagram of a resistance member in a high-power circuit board processing spraying device of the present invention.

[0036] In the figure: 100, box body; 101, supporting leg; 102, annular track; 103, electric slider; 104, circuit board body; 200, frame; 201, notch groove; 202, through groove; 300, clamping mechanism; 301, first movable shell; 302, second movable shell; 303, clamping roller; 304, slide bar; 305, first spring; 306, regulating mechanism; 3061, worm; 3062, worm gear; 3063, rotating rod; 3064, gear; 3065, rack column; 400, elastic mechanism; 401, telescopic member; 4011, inverted L-shaped pressure column; 4012, movable block; 4013, square tube; 402, protrusion; 403, shell; 404, guide sleeve; 405, L-shaped support plate; 406, strip groove; 407 , guide rod; 408, second spring; 500, first spraying part; 501, first spray plate; 502, first nozzle; 503, first feeding pipe; 600, first drying part; 601, first hot air hole; 602, first hot air plate; 603, first hot air pipe; 700, second spraying part; 701, second spray plate; 702, second nozzle; 703, second feeding pipe; 800, second drying part; 801, second hot air hole; 802, second hot air plate; 803, second hot air pipe; 900, limiting mechanism; 901, U-shaped slider; 902, U-shaped frame; 903, third movable shell; 904, limiting roller; 905, connecting rod; 1000, resistance part; 1001, inclined plane; 1002, horizontal column; 1003, connecting column. DETAILED DESCRIPTION

[0037] The specific embodiments of the present invention are described in detail below, but it should be understood that the protection scope of the present invention is not limited by the specific embodiments.

[0038] like Figures 1-11 As shown, the present invention is a high-power circuit board processing spraying equipment, including a box 100 with supporting legs 101, a symmetrically arranged circular track 102 is passed through the box 100, and a plurality of frames 200 are provided between the two circular tracks 102 to move along the track, the frames 200 are connected to the circular tracks 102 through electric sliders 103, and a clamping mechanism 300 for clamping the edges of the circuit board body 104 on both sides is installed on the frame 200, and a clamping mechanism 300 for clamping the edges of the circuit board body 104 on both sides is installed on the clamping mechanism 300. The elastic mechanism 400 clamps the top and bottom ends of the circuit board body 104. The first spraying part 500, the first drying part 600, the second spraying part 700 and the second drying part 800 are arranged in sequence from left to right in the box body 100, and a resistance part 1000 is also installed in the box body 100. After the circuit board body 104 passes through the first spraying part 500 and the first drying part 600, it is squeezed down by the resistance part 1000 and then passes through the second spraying part 700 and the second drying part 800 in sequence.

[0039] It should be noted that when in use, the circuit board body 104 is vertically inserted into the frame 200, and the top and bottom ends thereof are clamped and supported by the elastic mechanism 400. Then, the clamping mechanism 300 is adjusted to clamp and position the two side edges of the circuit board body 104. The electric slider 103 is used to drive the frame 200 to move along the track of the circular track 102. After the clamped and positioned circuit board body 104 enters the box 100, the first spraying member 500 and the first drying member 600 can be used to spray the circuit board body 104 located above the frame 200 on both sides simultaneously. and drying; as the frame 200 continues to move, the resistance member 1000 will apply pressure to the elastic mechanism 400 to make the circuit board body 104 slide downward, so that the part of the circuit board body 104 that was previously located in the frame 200 and was not sprayed is exposed to the bottom of the frame 200, and then the second spraying member 700 and the second drying member 800 can be used to simultaneously spray and dry the remaining part of the circuit board body 104 on both sides. After the full spraying is completed, the circuit board body 104 is removed from the box 100, and a new circuit board body 104 is replaced to achieve continuous processing and spraying.

[0040] like Figure 2 and Figure 3 As shown, the clamping mechanism 300 includes a first movable shell 301, a second movable shell 302, a clamping roller 303, a slide bar 304, a first spring 305 and a regulating mechanism 306. The first movable shell 301 and the second movable shell 302 are both slidably arranged in the frame 200, and the opposite sides of the first movable shell 301 and the second movable shell 302 are both opened. The two clamping rollers 303 are rotatably installed in the first movable shell 301 and the second movable shell 302 respectively. The regulating mechanism 306 is installed on the frame 200 and is used to control the first movable shell 301 to slide along the frame 200. The slide bar 304 is installed on the side of the second movable shell 302 away from the first movable shell 301, and the slide bar 304 slides through the end of the frame 200, and the first spring 305 is installed between the slide bar 304 and the frame 200.

[0041] It should be noted that one side edge of the circuit board body 104 is brought into contact with the clamping roller 303 in the second movable shell 302, and the regulating mechanism 306 is used to adjust the first movable shell 301 close to the second movable shell 302. When the clamping roller 303 in the first movable shell 301 contacts the circuit board body 104, as the first movable shell 301 continues to move, it drives the circuit board body 104, the second movable shell 302 and the sliding rod 304 to move synchronously, thereby stretching the first spring 305, and utilizing the reaction force generated by the first spring 305 to conveniently achieve the clamping and positioning of the two side edges of the circuit board body 104.

[0042] like Figure 3-Figure 4As shown, the regulating mechanism 306 comprises a worm 3061, a worm wheel 3062, a rotating rod 3063, a gear 3064 and a rack column 3065, the end of the frame 200 is provided with a notch groove 201, and the end of the frame 200 is also provided with a through groove 202 for the rack column 3065 to pass through, the worm 3061 is rotationally connected with the groove bottom of the notch groove 201, the rack column 3065 passes through the through groove 202 and is connected with the first moving shell 301, the two ends of the rotating rod 3063 respectively pass through the two sides of the notch groove 201 and extend into the through groove 202 and are connected with the gear 3064, the gear 3064 is meshed with the rack column 3065, and the worm wheel 3062 is sleeved on the rotating rod 3063 and is meshed with the worm 3061.

[0043] It should be noted that the rotating worm 3061 can drive the worm wheel 3062 to rotate the rotating rod 3063, and the gear 3064 at the end of the rotating rod 3063 is meshed with the rack column 3065, so as to facilitate the sliding of the rack column 3065 along the through groove 202, thereby realizing the movement adjustment of the first moving shell 301. Since the worm 3061 and the worm wheel 3062 can realize self-locking, the counterforce generated by the first spring 305 will not cause the first moving shell 301 to move, thereby ensuring the stability of the adjustment.

[0044] As shown in Figure 3 and Figure 5 As shown, the second moving shell 302 and the frame 200 are provided with a limiting mechanism 900, the limiting mechanism 900 comprises a U-shaped slide 901, a U-shaped frame 902, a third moving shell 903, a limiting roller 904 and a connecting rod 905, two third moving shells 903 are symmetrically arranged about the front and back of the circuit board body 104, and the opposite sides of the two third moving shells 903 are both provided with openings, the limiting roller 904 is rotationally installed in the third moving shell 903, the U-shaped frame 902 is installed at one end of the third moving shell 903 close to the second moving shell 302, the upper and lower U-shaped slides 901 are respectively connected with the two ends of the U-shaped frame 902, and the U-shaped slide 901 is slidingly connected with the second moving shell 302, one end of the connecting rod 905 is hingedly connected with one side of the U-shaped slide 901 away from the U-shaped frame 902, and the other end of the connecting rod 905 is hingedly connected with the inner side wall of the frame 200.

[0045] It should be noted that, in order to prevent the circuit board body 104 from tilting in the front-back direction after clamping and positioning, when the regulating mechanism 306 regulates the synchronous movement of the circuit board body 104, the second moving shell 302 and the slide rod 304, the articulated connecting rod 905 is used to facilitate the adaptive sliding of the U-shaped slide block 901 along the second moving shell 302, so that the two third moving shells 903 are driven to move towards each other by the U-shaped frame 902 until the limiting rollers 904 in the third moving shells 903 abut against the front and back sides of the circuit board body 104, that is, the front and back sides are limited, thereby further improving the position stability of the circuit board body 104.

[0046] As shown in Figure 2 and Figure 6-Figure 7 The elastic mechanism 400 includes a telescopic piece 401, a shell 403 with protrusions 402, an L-shaped supporting plate 405 with a guide sleeve 404, a strip-shaped slot 406, a guide rod 407 and a second spring 408. The telescopic piece 401 and the shell 403 are connected to the top and bottom of the second moving shell 302 through connecting pins, respectively, and the telescopic piece 401 is used to limit the height of the top end of the circuit board body 104. The protrusions 402 are symmetrically arranged on both sides of the shell 403 near the bottom end. The strip-shaped slot 406 penetrates through the side wall of the shell 403 and is distributed along the length direction. The vertical part of the L-shaped supporting plate 405 is slidingly inserted into the shell 403, and the horizontal part of the L-shaped supporting plate 405 is used to abut against the bottom end of the circuit board body 104. The guide sleeve 404 is installed on the side wall of the L-shaped supporting plate 405 near the top end, and the guide sleeve 404 is slidingly connected with the strip-shaped slot 406. The guide rod 407 is installed on the top of the protrusion 402, the guide sleeve 404 is slidingly sleeved with the guide rod 407, and the second spring 408 is installed between the guide sleeve 404 and the protrusion 402.

[0047] It should be noted that, in the present embodiment, when the circuit board body 104 is not loaded, the distance between the top of the telescopic piece 401 in the longest state and the horizontal part of the L-shaped supporting plate 405 is less than the height of the circuit board body 104, that is, when the circuit board body 104 is loaded between the telescopic piece 401 and the L-shaped supporting plate 405, the L-shaped supporting plate 405 will slide down along the shell 403 and drive the guide sleeve 404 to compress the second spring 408. The second spring 408 always exerts an upward pushing force on the circuit board body 104. Since the telescopic piece 401 cannot continue to elongate in the longest state, the circuit board body 104 is clamped and supported. When the top end of the telescopic piece 401 is subjected to a downward extrusion, the circuit board body 104 and the L-shaped supporting plate 405 will slide down synchronously.

[0048] As shown in Figure 6 and Figure 8As shown, the telescopic member 401 includes an inverted L-shaped pressure column 4011, a movable block 4012 and a square tube 4013. The lower surface of the horizontal part of the inverted L-shaped pressure column 4011 is in contact with the top of the circuit board body 104. The movable block 4012 is connected to the bottom end of the inverted L-shaped pressure column 4011. The square tube 4013 is connected to the top of the second movable shell 302 through a connecting pin. The movable block 4012 is slidably set in the square tube 4013, and the top of the movable block 4012 is in contact with the lower surface of the top of the square tube 4013.

[0049] It should be noted that, in this embodiment, the square tube 4013 is a hollow structure with both ends closed, and a guide opening is opened at the top of the square tube 4013 for the sliding insertion of the inverted L-shaped pressure column 4011. The cross-section of the movable block 4012 is equal to the cross-section inside the square tube 4013, and the cross-section of the movable block 4012 is larger than the cross-section of the inverted L-shaped pressure column 4011.

[0050] like Figure 2 and Figure 11 As shown, the resistance member 1000 includes a horizontal column 1002 with a slope 1001 and a connecting column 1003. The distance between the top and the bottom of the horizontal column 1002 is equal to the height of the frame 200. The slope 1001 is located at one end of the horizontal column 1002 close to the first drying member 600, and the slope 1001 corresponds to the position of the inverted L-shaped pressure column 4011. The horizontal column 1002 is connected to the inner wall of the box body 100 through the connecting column 1003.

[0051] It should be noted that in this embodiment, when the loaded circuit board body 104 moves with the frame 200, when the inverted L-shaped pressure column 4011 (such as Figure 8 When the top of the frame 200 contacts the inclined surface 1001, as the frame 200 continues to move, the inverted L-shaped pressure column 4011 is squeezed to make it slide down adaptively. When the inverted L-shaped pressure column 4011 slides down, it presses the circuit board body 104 down the same distance. In this embodiment, the sliding distance of the circuit board body 104 is equal to the height of the frame 200. That is to say, after the circuit board body 104 slides down, the part that was previously located in the frame 200 can be exposed under the frame 200, thereby facilitating subsequent spraying processing.

[0052] like Figure 2 and Figure 9-10As shown, the first spray component 500 includes a first spray plate 501, a first nozzle 502 and a first feed pipe 503. The first spray plate 501 is an inverted U-shaped hollow structure. Several first nozzles 502 are evenly installed on the opposite side walls of the first spray plate 501, and the first feed pipe 503 is installed on the top of the first spray plate 501; the second spray component 700 includes a second spray plate 701, a second nozzle 702 and a second feed pipe 703. The second spray plate 701 is a U-shaped hollow structure. Several second nozzles 702 are evenly installed on the opposite side walls of the second spray plate 701, and the second feed pipe 703 is installed at the bottom of the second spray plate 701.

[0053] It should be noted that the first spray plate 501 is used to synchronously spray the portion of the circuit board body 104 above the frame 200 on both sides. When the circuit board body 104 slides down, the second spray plate 701 is used to synchronously spray the remaining unsprayed portion of the circuit board body 104 on both sides.

[0054] like Figure 2 and Figure 9-10 As shown, the first drying component 600 includes a first hot air plate 602 with first hot air holes 601 and a first hot air pipe 603. The first hot air plate 602 is an inverted U-shaped hollow structure. Several first hot air holes 601 are evenly installed on the opposite side walls of the first hot air plate 602, and the first hot air pipe 603 is installed on the top of the first hot air plate 602; the second drying component 800 includes a second hot air plate 802 with second hot air holes 801 and a second hot air pipe 803. The second hot air plate 802 is a U-shaped hollow structure. Several second hot air holes 801 are evenly installed on the opposite side walls of the second hot air plate 802, and the second hot air pipe 803 is installed at the bottom of the second hot air plate 802.

[0055] It should be noted that after the circuit board body 104 above the frame 200 is sprayed, it is dried synchronously on both sides by the first hot air plate 602, and then the circuit board body 104 is pressed down and the second spray plate 701 completes the spraying of the remaining part, and the second hot air plate 802 dries the part of the circuit board body 104 sprayed by the second spray plate 701.

[0056] An embodiment of the present invention provides a method for processing and spraying a high-power circuit board. The method comprises the following steps:

[0057] S1: Insert the circuit board body 104 vertically into the frame 200, use the elastic mechanism 400 to clamp and support the top and bottom ends of the circuit board body 104, and then adjust the clamping mechanism 300 to clamp and limit the two side edges of the circuit board body 104;

[0058] S2: The electric slider 103 drives the frame 200 to move along the track of the circular track 102. The frame 200 first drives the clamped and limited circuit board body 104 to pass through the first spraying unit 500, and the part of the circuit board body 104 above the frame 200 is sprayed on both sides simultaneously. After spraying, it enters the first drying unit 600 for drying.

[0059] S3: After the frame 200 drives the circuit board body 104 through the first drying member 600, it is squeezed by the resisting member 1000 and slides down, causing the portion of the circuit board body 104 that was previously located in the frame 200 and not sprayed to slide down to the bottom of the frame 200;

[0060] S4: The frame 200 drives the circuit board body 104 to pass through the second spraying unit 700 and the second drying unit 800 in sequence, thereby achieving full spraying processing of the circuit board body 104.

[0061] The above disclosures are only a few specific embodiments of the present invention. However, the embodiments of the present invention are not limited thereto. Any changes that can be conceived by those skilled in the art should fall within the scope of protection of the present invention.

Claims

1. A high-power circuit board processing spraying device, comprising a box (100) with support legs (101), characterized in that: The box (100) is provided with symmetrically arranged circular tracks (102), and a plurality of frames (200) are provided between the two circular tracks (102) and are movable along the tracks. The frames (200) are connected to the circular tracks (102) via electric sliders (103), and a clamping mechanism (300) for clamping the edges of both sides of the circuit board body (104) is installed on the frames (200). The clamping mechanism (300) is provided with elastic springs for clamping the top and bottom ends of the circuit board body (104). The box body (100) is provided with a first spraying part (500), a first drying part (600), a second spraying part (700) and a second drying part (800) in sequence from left to right, and a resisting part (1000) is also installed in the box body (100); the circuit board body (104) passes through the first spraying part (500) and the first drying part (600), is squeezed down by the resisting part (1000), and then passes through the second spraying part (700) and the second drying part (800) in sequence.

2. The high-power circuit board processing spraying equipment according to claim 1, characterized in that: The clamping mechanism (300) comprises a first movable shell (301), a second movable shell (302), a clamping roller (303), a slide bar (304), a first spring (305) and a regulating mechanism (306), wherein the first movable shell (301) and the second movable shell (302) are both slidably arranged in the frame (200), and the facing sides of the first movable shell (301) and the second movable shell (302) are both opened, and the two clamping rollers (303) are respectively rotatably mounted on the first movable shell (301) and the second movable shell (302). The regulating mechanism (306) is installed in the movable shell (301) and the second movable shell (302) on the frame (200) and is used to control the first movable shell (301) to slide along the frame (200). The sliding rod (304) is installed on the side of the second movable shell (302) away from the first movable shell (301), and the sliding rod (304) slides through the end of the frame (200). The first spring (305) is installed between the sliding rod (304) and the frame (200).

3. The high-power circuit board processing spraying equipment according to claim 2, characterized in that: The regulating mechanism (306) includes a worm (3061), a worm wheel (3062), a rotating rod (3063), a gear (3064) and a rack column (3065). The end of the frame (200) is provided with a notch groove (201), and the end of the frame (200) is also provided with a through groove (202) for the rack column (3065) to pass through. The worm (3061) is rotatably connected to the bottom of the notch groove (201). The rack column (3065) passes through the through slot (202) and is connected to the first movable shell (301). The two ends of the rotating rod (3063) respectively pass through the two sides of the notch slot (201) and extend into the through slot (202) to be connected to the gear (3064). The gear (3064) is meshed with the rack column (3065). The worm gear (3062) is mounted on the rotating rod (3063), and the worm gear (3062) is meshed with the worm (3061).

4. The high-power circuit board processing spraying equipment according to claim 2, characterized in that: A limiting mechanism (900) is installed between the second movable shell (302) and the frame (200), and the limiting mechanism (900) includes a U-shaped slider (901), a U-shaped frame (902), a third movable shell (903), a limiting roller (904) and a connecting rod (905). The two third movable shells (903) are symmetrically arranged front and back with respect to the circuit board body (104), and the facing sides of the two third movable shells (903) are both opened. The limiting roller (904) is rotatably installed on the third movable shell. In the movable shell (903), the U-shaped frame (902) is installed at one end of the third movable shell (903) close to the second movable shell (302), the upper and lower U-shaped sliders (901) are respectively connected to the two ends of the U-shaped frame (902), and the U-shaped slider (901) is slidably connected to the second movable shell (302), one end of the connecting rod (905) is hinged to the side of the U-shaped slider (901) away from the U-shaped frame (902), and the other end of the connecting rod (905) is hinged to the inner wall of the frame (200).

5. The high-power circuit board processing spraying equipment according to claim 2, characterized in that: The elastic mechanism (400) comprises a telescopic member (401), a shell (403) with a protrusion (402), an L-shaped support plate (405) with a guide sleeve (404), a strip groove (406), a guide rod (407) and a second spring (408). The telescopic member (401) and the shell (403) are respectively connected to the top and bottom of the second movable shell (302) through a connecting pin, and the telescopic member (401) is used to limit the top height of the circuit board body (104). The protrusion (402) is symmetrically arranged on both sides of the shell (403) near the bottom. The strip groove (406) runs through the shell (403). ) side wall and distributed along its length direction, the vertical part of the L-shaped support plate (405) is slidably plugged into the shell (403), and the horizontal part of the L-shaped support plate (405) is used to fit the bottom end of the circuit board body (104), the guide sleeve (404) is installed on the side wall of the L-shaped support plate (405) near the top, and the guide sleeve (404) passes through the strip groove (406) and is slidably connected thereto, the guide rod (407) is installed on the top of the protrusion (402), the guide sleeve (404) is slidably connected to the guide rod (407), and the second spring (408) is installed between the guide sleeve (404) and the protrusion (402).

6. The high-power circuit board processing spraying equipment according to claim 5, characterized in that: The telescopic member (401) comprises an inverted L-shaped pressure column (4011), a movable block (4012) and a square tube (4013); the lower surface of the horizontal portion of the inverted L-shaped pressure column (4011) is in contact with the top of the circuit board body (104); the movable block (4012) is connected to the bottom end of the inverted L-shaped pressure column (4011); the square tube (4013) is connected to the top of the second movable shell (302) via a connecting pin; the movable block (4012) is slidably arranged in the square tube (4013), and the top of the movable block (4012) is in contact with the lower surface of the top of the square tube (4013).

7. The high-power circuit board processing spraying equipment according to claim 6, characterized in that: The resisting member (1000) comprises a transverse column (1002) with an inclined surface (1001) and a connecting column (1003); the distance between the top and the bottom of the transverse column (1002) is equal to the height of the frame (200); the inclined surface (1001) is located at one end of the transverse column (1002) close to the first drying member (600), and the inclined surface (1001) corresponds to the position of the inverted L-shaped pressure column (4011); the transverse column (1002) is connected to the inner wall of the box (100) through the connecting column (1003).

8. The high-power circuit board processing spraying equipment according to claim 1, characterized in that: The first spraying component (500) comprises a first spray plate (501), a first nozzle (502) and a first feed pipe (503); the first spray plate (501) is an inverted U-shaped hollow structure, a plurality of the first nozzles (502) are evenly installed on the opposite side walls of the first spray plate (501), and the first feed pipe (503) is installed on the top of the first spray plate (501); the second spraying component (700) comprises a second spray plate (701), a second nozzle (702) and a second feed pipe (703); the second spray plate (701) is a U-shaped hollow structure, a plurality of the second nozzles (702) are evenly installed on the opposite side walls of the second spray plate (701), and the second feed pipe (703) is installed at the bottom of the second spray plate (701).

9. The high-power circuit board processing spraying equipment according to claim 1, characterized in that: The first drying component (600) includes a first hot air plate (602) with a first hot air hole (601) and a first hot air pipe (603), wherein the first hot air plate (602) is an inverted U-shaped hollow structure, and a plurality of the first hot air holes (601) are evenly installed on the opposite side walls of the first hot air plate (602), and the first hot air pipe (603) is installed on the top of the first hot air plate (602); the second drying component (800) includes a second hot air plate (802) with a second hot air hole (801) and a second hot air pipe (803), wherein the second hot air plate (802) is a U-shaped hollow structure, and a plurality of the second hot air holes (801) are evenly installed on the opposite side walls of the second hot air plate (802), and the second hot air pipe (803) is installed at the bottom of the second hot air plate (802).

10. A high-power circuit board processing spraying method, the method being applicable to the high-power circuit board processing spraying equipment according to any one of claims 1 to 9, characterized in that: The steps of this method are as follows: S1: vertically inserting the circuit board body (104) into the frame (200), using the elastic mechanism (400) to clamp and support the top and bottom ends of the circuit board body (104), and then adjusting the clamping mechanism (300) to clamp and limit the two side edges of the circuit board body (104); S2: The frame (200) is driven by the electric slider (103) to move along the track of the circular track (102). The frame (200) first drives the clamped and limited circuit board body (104) to pass through the first spraying part (500), and the part of the circuit board body (104) located above the frame (200) is sprayed on both sides simultaneously. After the spraying is completed, it enters the first drying part (600) for drying. S3: After the frame (200) drives the circuit board body (104) through the first drying member (600), it is squeezed by the resisting member (1000) to slide down, so that the portion of the circuit board body (104) that was previously located in the frame (200) and was not sprayed slides down to the bottom of the frame (200); S4: The frame (200) drives the circuit board body (104) to pass through the second spraying part (700) and the second drying part (800) in sequence after sliding down, thereby achieving full spraying processing of the circuit board body (104).

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