Piezoelectric ceramic atomizing sheet

Abstract

The application discloses a piezoelectric ceramic atomizing piece, which comprises an upper piezoelectric ceramic piece, an upper metal piece, an intermediate piezoelectric ceramic piece, a lower metal piece and a lower piezoelectric ceramic piece which are sequentially stacked; wherein the Young's modulus of the upper piezoelectric ceramic piece, the Young's modulus of the intermediate piezoelectric ceramic piece and the Young's modulus of the lower piezoelectric ceramic piece are sequentially arranged in a gradient manner. Thus, compared with the piezoelectric ceramic atomizing piece in the prior art, the Young's modulus of the upper piezoelectric ceramic piece, the Young's modulus of the intermediate piezoelectric ceramic piece and the Young's modulus of the lower piezoelectric ceramic piece of the piezoelectric ceramic atomizing piece of the application change in a gradient manner, so that the difference in the Young's modulus of the adjacent two layers of piezoelectric ceramic pieces is gently transitioned, thereby effectively inhibiting the initiation and expansion of microcracks of each layer of piezoelectric ceramic pieces, improving the structural stability and fatigue resistance of the piezoelectric ceramic atomizing piece, and further making the piezoelectric ceramic atomizing piece less likely to be damaged.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of atomization, in particular to a piezoelectric ceramic atomization piece. BACKGROUND

[0002] The piezoelectric ceramic atomization piece can convert electric energy into high-frequency mechanical vibration through the inverse piezoelectric effect, so that the liquid undergoes cavitation effect and atomization. However, in the related art, the piezoelectric ceramic piece of the piezoelectric ceramic atomization piece is prone to micro-crack propagation due to stress concentration under high-frequency vibration, resulting in damage to the piezoelectric ceramic atomization piece. SUMMARY

[0003] The piezoelectric ceramic atomization piece provided by the embodiments of the present application can solve at least one of the above technical problems.

[0004] The piezoelectric ceramic atomization piece provided by the embodiments of the present application comprises an upper piezoelectric ceramic piece, an upper metal piece, an intermediate piezoelectric ceramic piece, a lower metal piece and a lower piezoelectric ceramic piece which are sequentially stacked; wherein the Young's modulus of the upper piezoelectric ceramic piece, the Young's modulus of the intermediate piezoelectric ceramic piece and the Young's modulus of the lower piezoelectric ceramic piece are sequentially set in a gradient manner.

[0005] In some embodiments, the Young's modulus of the lower piezoelectric ceramic piece, the Young's modulus of the intermediate piezoelectric ceramic piece and the Young's modulus of the upper piezoelectric ceramic piece are sequentially decreased.

[0006] In some embodiments, the Young's modulus of the upper piezoelectric ceramic piece is 50GPa-60GPa;

[0007] The Young's modulus of the intermediate piezoelectric ceramic piece is 70GPa-80GPa;

[0008] The Young's modulus of the lower piezoelectric ceramic piece is 90GPa-100GPa.

[0009] In some embodiments, the upper piezoelectric ceramic piece, the intermediate piezoelectric ceramic piece and the lower piezoelectric ceramic piece cooperatively form a containing through hole which penetrates through the upper piezoelectric ceramic piece, the intermediate piezoelectric ceramic piece and the lower piezoelectric ceramic piece;

[0010] The upper metal sheet comprises a first atomization part, a first support part and a first connecting part connected in sequence, the first atomization part and the first support part are located in the accommodating through hole, and the first connecting part is clamped between the upper piezoelectric ceramic sheet and the middle piezoelectric ceramic sheet; the lower metal sheet comprises a second atomization part, a second support part and a second connecting part connected in sequence, the second atomization part and the second support part are located in the accommodating through hole, and the second connecting part is clamped between the upper piezoelectric ceramic sheet and the middle piezoelectric ceramic sheet.

[0011] The first support part is arranged in a wave shape along the radial direction of the piezoelectric ceramic atomization sheet, and / or the second support part is arranged in a wave shape.

[0012] In some embodiments, the first atomization part is arranged in a convex shape from the middle piezoelectric ceramic sheet to the upper piezoelectric ceramic sheet.

[0013] In some embodiments, the first atomization part is provided with a plurality of first atomization through holes, each of which penetrates the first atomization part, and the aperture of each first atomization through hole gradually decreases from the middle piezoelectric ceramic sheet to the upper piezoelectric ceramic sheet.

[0014] In some embodiments, the second atomization part is arranged in a convex shape from the middle piezoelectric ceramic sheet to the lower piezoelectric ceramic sheet.

[0015] In some embodiments, the second atomization part is provided with a plurality of second atomization through holes, each of which penetrates the second atomization part, and the aperture of each second atomization through hole gradually increases from the middle piezoelectric ceramic sheet to the lower piezoelectric ceramic sheet.

[0016] In some embodiments, the second atomization part comprises an atomization subpart and a backflow subpart, the atomization subpart is arranged around the backflow subpart, and the plurality of second atomization through holes are arranged in the atomization subpart.

[0017] The backflow subpart is provided with a plurality of backflow through holes, each of which penetrates the backflow subpart, and the aperture of each backflow through hole gradually decreases from the middle piezoelectric ceramic sheet to the lower piezoelectric ceramic sheet.

[0018] In some embodiments, the upper piezoelectric ceramic sheet, the upper metal sheet, the middle piezoelectric ceramic sheet, the lower metal sheet and the lower piezoelectric ceramic sheet are sequentially bonded.

[0019] The piezoelectric ceramic atomization piece provided by the embodiment of the present application comprises an upper piezoelectric ceramic piece, an upper metal piece, an intermediate piezoelectric ceramic piece, a lower metal piece and a lower piezoelectric ceramic piece which are sequentially stacked; the Young's modulus of the upper piezoelectric ceramic piece, the Young's modulus of the intermediate piezoelectric ceramic piece and the Young's modulus of the lower piezoelectric ceramic piece are sequentially arranged in a gradient manner. Thus, compared with the piezoelectric ceramic atomization piece in the related art, the Young's modulus of the upper piezoelectric ceramic piece, the Young's modulus of the intermediate piezoelectric ceramic piece and the Young's modulus of the lower piezoelectric ceramic piece of the piezoelectric ceramic atomization piece of the present application change in a gradient manner, so that the Young's modulus of the adjacent two layers of piezoelectric ceramic pieces is smoothly transitioned, the stress concentration phenomenon caused by the sudden change of the material stiffness of the piezoelectric ceramic piece in the high-frequency vibration process is significantly reduced, the risk of generating a local high stress area at the interface or inside is reduced, the initiation and expansion of the micro-cracks of the piezoelectric ceramic pieces are effectively inhibited, the structural stability and the fatigue resistance of the piezoelectric ceramic atomization piece are improved, and thus the piezoelectric ceramic atomization piece is not easy to be damaged. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor based on the drawings shown.

[0021] Figure 1 The structural schematic diagram of the piezoelectric ceramic atomization piece provided by the embodiment of the present application.

[0022] Figure 2 The structural schematic diagram of the piezoelectric ceramic atomization piece provided by the embodiment of the present application. Figure 1 The sectional view of the piezoelectric ceramic atomization piece.

[0023] Figure 3 The structural schematic diagram of the piezoelectric ceramic atomization piece provided by the embodiment of the present application. Figure 2 The structural schematic diagram of the piezoelectric ceramic atomization piece provided by the embodiment of the present application.

[0024] Figure 4 The structural schematic diagram of the piezoelectric ceramic atomization piece provided by the embodiment of the present application. Figure 2 The enlarged schematic diagram of A in the piezoelectric ceramic atomization piece.

[0025] BRIEF DESCRIPTION OF DRAWINGS

[0026] 10, piezoelectric ceramic atomizing sheet; 100, upper piezoelectric ceramic sheet; 101, through hole; 200, upper metal sheet; 210, first atomizing part; 211, first atomizing through hole; 220, first supporting part; 230, first connecting part; 300, middle piezoelectric ceramic sheet; 400, lower metal sheet; 410, second atomizing part; 411, atomizing subpart; 411a, second atomizing through hole; 412, backflow subpart; 412a, backflow through hole; 420, second supporting part; 430, second connecting part; 500, lower piezoelectric ceramic sheet.

[0027] The object, technical solutions and advantages of the present application will be further described in conjunction with the embodiments and with reference to the drawings. DETAILED DESCRIPTION

[0028] To make the object, technical solutions and advantages of the present application clearer, the embodiments of the present application will be further described in detail below with reference to the drawings.

[0029] The following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all the embodiments consistent with the present application. Instead, they are merely examples of apparatuses and methods consistent with some aspects of the present application as detailed in the appended claims.

[0030] In the description of the present application, it should be understood that the terms "first", "second" and the like are used only for descriptive purposes, and cannot be understood as indicating or implying relative importance. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances. In addition, in the description of the present application, unless otherwise specified, "multiple" means two or more. "And / or", the association between the associated objects, means that there can be three kinds of relationships, for example, A and / or B, which can represent the existence of A alone, the existence of A and B, and the existence of B alone. The character " / " generally represents that the associated objects before and after are a kind of "or" relationship.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as understood by those skilled in the art to which the present application belongs. The terms used in the specification of the present application are only for the purpose of describing the specific embodiments, and are not intended to limit the present application. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0032] The piezoelectric ceramic atomizing piece converts electric energy into high-frequency mechanical vibration by using the inverse piezoelectric effect of the piezoelectric ceramic piece, thereby causing liquid cavitation and realizing high-efficiency atomization. However, the inventors have found that in the related art, the piezoelectric ceramic piece of the piezoelectric ceramic atomizing piece is prone to cause micro-crack propagation due to stress concentration under high-frequency vibration, resulting in that the piezoelectric ceramic atomizing piece is prone to damage.

[0033] In view of this, in the related art, Figures 1 to 4 Therefore, the piezoelectric ceramic atomizing piece 10 provided by the embodiments of the present application has the advantages that, compared with the piezoelectric ceramic atomizing piece in the related art, the Young's modulus of the upper piezoelectric ceramic piece 100, the Young's modulus of the intermediate piezoelectric ceramic piece 300 and the Young's modulus of the lower piezoelectric ceramic piece 500 of the piezoelectric ceramic atomizing piece 10 of the present application change in a gradient manner, so that the Young's modulus of the adjacent two layers of piezoelectric ceramic pieces is smoothly transitioned, the stress concentration phenomenon caused by the sudden change of material stiffness during high-frequency vibration of the piezoelectric ceramic piece is significantly reduced, the risk of generating local high-stress areas at the interface or inside is reduced, the initiation and propagation of micro-cracks of the piezoelectric ceramic pieces are effectively inhibited, the structural stability and fatigue resistance of the piezoelectric ceramic atomizing piece 10 are improved, and thus the piezoelectric ceramic atomizing piece 10 is not prone to damage.

[0034] Therefore, the piezoelectric ceramic atomizing piece 10 provided by the embodiments of the present application has the advantages that, compared with the piezoelectric ceramic atomizing piece in the related art, the Young's modulus of the upper piezoelectric ceramic piece 100, the Young's modulus of the intermediate piezoelectric ceramic piece 300 and the Young's modulus of the lower piezoelectric ceramic piece 500 of the piezoelectric ceramic atomizing piece 10 of the present application change in a gradient manner, so that the Young's modulus of the adjacent two layers of piezoelectric ceramic pieces is smoothly transitioned, the stress concentration phenomenon caused by the sudden change of material stiffness during high-frequency vibration of the piezoelectric ceramic piece is significantly reduced, the risk of generating local high-stress areas at the interface or inside is reduced, the initiation and propagation of micro-cracks of the piezoelectric ceramic pieces are effectively inhibited, the structural stability and fatigue resistance of the piezoelectric ceramic atomizing piece 10 are improved, and thus the piezoelectric ceramic atomizing piece 10 is not prone to damage.

[0035] In addition, under the condition of high-frequency alternating vibration, the mechanical impedance mismatch between different material layers is a key factor for causing energy reflection, interface peeling and structural fatigue. The embodiments of the present application reduce the stiffness difference between the adjacent two layers of piezoelectric ceramic pieces by the gradient design of the Young's modulus, improve the mechanical compatibility between the layers. The structure reduces the reflectivity of the vibration wave when propagating between the layers, improves the transmission efficiency of the mechanical vibration energy, reduces the local heating phenomenon caused by energy loss, and thus improves the overall vibration response performance and the electric-mechanical conversion efficiency of the piezoelectric ceramic atomizing piece 10.

[0036] Moreover, by setting the Young's modulus of the upper piezoelectric ceramic sheet 100, the intermediate piezoelectric ceramic sheet 300, and the lower piezoelectric ceramic sheet 500 as a gradient structure that gradually increases in turn, a mechanical support environment that gradually increases from top to bottom is constructed in the multi-layered stacked system. This gradient modulus design changes the distribution state of the traditional homogeneous piezoelectric ceramic under high-frequency vibration, in which the stress is concentrated at the interface or edge, so that the vibration stress is smoothly transmitted along the axial direction, effectively relieving the local stress peak caused by the sudden change of material stiffness, and significantly reducing the risk of initiation and propagation of micro-cracks in the piezoelectric ceramic atomization sheet 10 and at the interlayer interface.

[0037] It can be understood that the gradient distribution of the Young's modulus of the upper piezoelectric ceramic sheet 100, the intermediate piezoelectric ceramic sheet 300, and the lower piezoelectric ceramic sheet 500 can be accurately adjusted by controlling the micro-density and porosity of the ceramic body. When a potassium sodium niobate (KNN) ceramic system is used, the density of the ceramic is positively correlated with its Young's modulus: the higher the material density, the more compact the internal grain arrangement, the lower the porosity, and the larger the macroscopic Young's modulus; on the contrary, after introducing an appropriate amount of pores into the material, the overall stiffness decreases, and the Young's modulus decreases accordingly.

[0038] During the manufacturing process, by adjusting the pressing pressure of the ceramic green body, the sintering temperature, the holding time, and the addition of pore-forming agents, etc. process parameters, the porosity of each layer of ceramic can be independently controlled. For example, the lower piezoelectric ceramic sheet 500 is formed under high pressure and adopts a high-temperature full-sintering process to obtain a microstructure with low porosity and high density, thereby achieving a high Young's modulus of 90-100 GPa and providing good mechanical support. The intermediate piezoelectric ceramic sheet 300 adopts moderate sintering densification conditions to retain a small amount of uniformly distributed micro-pores, so that its Young's modulus is controlled within the range of 70-80 GPa, playing a mechanical transition role. The upper piezoelectric ceramic sheet 100 introduces controllable pores or reduces the sintering degree to form a relatively loose porous structure with high porosity and low density, and the Young's modulus is reduced to 50-60 GPa, which is beneficial to generating larger mechanical strain under electric field excitation and improving the vibration output amplitude.

[0039] Porosity control not only affects the Young's modulus, but also has a positive effect on the transmission characteristics of vibration energy. The moderately introduced micro-porous structure can play a role in local stress buffering, absorbing part of the elastic wave energy during high-frequency vibration, suppressing the concentrated reflection of stress waves, and further reducing the shear stress and peeling risk at the interface. This structural design realizes "function-structure integration" regulation, optimizes the mechanical matching of the multi-layer device without sacrificing the piezoelectric performance.

[0040] The gradient distribution of Young's modulus of the upper piezoelectric ceramic sheet 100, the intermediate piezoelectric ceramic sheet 300, and the lower piezoelectric ceramic sheet 500 can be regulated by material composition. The KNN-based ceramic can significantly change its crystal structure and mechanical properties by doping elements such as Li, Ta, and Sb. For example, appropriate Li doping can reduce the lattice constant of KNN ceramic, increase the bonding strength between grains, and thus increase the Young's modulus; while excessive doping can cause lattice distortion, introduce micro-cracks, and reduce the overall stiffness. Therefore, by precisely controlling the doping ratio, the Young's modulus of the ceramic can be adjusted within a certain range.

[0041] When a high-frequency alternating current signal is applied between the upper piezoelectric ceramic sheet 100 and the lower piezoelectric ceramic sheet 500, the upper piezoelectric ceramic sheet 100, the intermediate piezoelectric ceramic sheet 300, and the lower piezoelectric ceramic sheet 500 generate inverse piezoelectric effect under the action of the electric field, inducing high-frequency mechanical vibration. The vibration is transmitted between the layers to drive the upper metal sheet 200 and the lower metal sheet 400 to produce bending or longitudinal composite vibration modes, causing the liquid attached to the surface to undergo cavitation effect and break into micron-sized droplets. Since the Young's modulus of the upper piezoelectric ceramic sheet 100, the Young's modulus of the intermediate piezoelectric ceramic sheet 300, and the Young's modulus of the lower piezoelectric ceramic sheet 500 are set in a gradient, the mechanical stress generated during vibration is smoothly transmitted between the layers, avoiding the formation of stress concentration points at the interface due to sudden stiffness changes. In addition, the intermediate piezoelectric ceramic sheet 300 as a modulus transition layer significantly reduces the peak values of interlayer shear stress and tensile stress.

[0042] In some embodiments, during operation, the liquid first undergoes primary atomization in the lower metal sheet 400 to generate initial droplets; the initial droplets migrate upward under the action of vibration-induced airflow, enter the space between the upper metal sheet 200 and the lower metal sheet 400, and are finely broken by the upper metal sheet 200 for secondary breaking, achieving staged atomization.

[0043] In some embodiments, the Young's modulus of the lower piezoelectric ceramic sheet 500, the Young's modulus of the middle piezoelectric ceramic sheet 300, and the Young's modulus of the upper piezoelectric ceramic sheet 100 decrease in turn, forming a gradient distribution with gradually decreasing stiffness from bottom to top. Specifically, the lower piezoelectric ceramic sheet 500 has a high Young's modulus, providing good structural stiffness and load-carrying capacity, effectively resisting mechanical stress generated during high-frequency vibration, and maintaining the stability of the overall structure. The Young's modulus of the middle piezoelectric ceramic sheet 300 is between the Young's modulus of the lower piezoelectric ceramic sheet 500 and the Young's modulus of the upper piezoelectric ceramic sheet 100, serving as a mechanical transition layer that moderates the stiffness difference between the high-modulus layer and the low-modulus layer, making the stress transfer between the layers more uniform and smooth, and reducing stress concentration caused by material discontinuity. In addition, the upper piezoelectric ceramic sheet 100 has the smallest Young's modulus and is more easily deformed under the action of an electric field, having higher strain response capability and being able to produce greater vibration displacement. Since the upper piezoelectric ceramic sheet 100 is adjacent to the upper metal sheet 200, its significant deformation capability can be efficiently transferred to the upper metal sheet 200, enhancing the vibration amplitude and dynamic response of the upper metal sheet 200 during operation, thereby strengthening the disturbance and shearing action of the liquid at the edge of the micro-holes, promoting the rapid rupture of the liquid film and the generation of fine and uniform droplets, and improving the atomization efficiency and quality. In this way, the structure design with decreasing Young's modulus from bottom to top not only suppresses the initiation and propagation of micro-cracks, improves the fatigue resistance and service life of the piezoelectric ceramic atomization sheet 10, but also optimizes the deformation characteristics of the upper piezoelectric ceramic sheet 100, further enhancing the overall atomization effect of the piezoelectric ceramic atomization sheet 10.

[0044] In some embodiments, the Young's modulus of the upper piezoelectric ceramic sheet 100, the middle piezoelectric ceramic sheet 300, and the lower piezoelectric ceramic sheet 500 of the piezoelectric ceramic atomization sheet 10 decreases layer by layer from bottom to top. The Young's modulus of the upper piezoelectric ceramic sheet 100 is 50 GPa to 60 GPa, the Young's modulus of the middle piezoelectric ceramic sheet 300 is 70 GPa to 80 GPa, and the Young's modulus of the lower piezoelectric ceramic sheet 500 is 90 GPa to 100 GPa.

[0045] Specifically, the Young's modulus of the upper piezoelectric ceramic sheet 100 is 50 GPa to 60 GPa, and the Young's modulus of the upper piezoelectric ceramic sheet 100 can be, but is not limited to, 50 GPa, 52 GPa, 54 GPa, 56 GPa, 58 GPa, or 60 GPa. The upper piezoelectric ceramic sheet 100 has a lower Young's modulus, and the material exhibits good flexibility and high strain response characteristics. Under the excitation of an electric field, the upper piezoelectric ceramic sheet 100 can produce a larger mechanical deformation, effectively increasing the vibration displacement amplitude. Since the upper piezoelectric ceramic sheet 100 is directly in contact with the upper metal sheet 200, its significant deformation capability can be efficiently transmitted to the upper metal sheet 200, enhancing the dynamic vibration intensity of the upper metal sheet 200 during operation, strengthening the disturbance and shearing action of the liquid at the micro-pore structure, promoting the rupture of the liquid film, and forming fine and uniform mist droplets, thereby improving the atomization efficiency and quality.

[0046] The Young's modulus of the intermediate piezoelectric ceramic sheet 300 is between 70 GPa and 80 GPa, constituting a mechanical transition layer between the upper low-modulus material and the lower high-modulus material. The Young's modulus of the intermediate piezoelectric ceramic sheet 300 can be, but is not limited to, 70 GPa, 72 GPa, 74 GPa, 76 GPa, 78 GPa, or 80 GPa. The intermediate piezoelectric ceramic sheet 300 assumes the functions of stress transmission and distribution adjustment during vibration, mitigating the stiffness difference between the upper piezoelectric ceramic sheet 100 and the lower piezoelectric ceramic sheet 500, and avoiding stress concentration at the interface caused by sudden stiffness changes. The presence of the intermediate piezoelectric ceramic sheet 300 enables the multilayer structure to maintain good interlayer bonding stability under high-frequency alternating loads, reduces the risk of micro-crack initiation in the interface region, and improves the durability of the overall structure.

[0047] The Young's modulus of the lower piezoelectric ceramic sheet 500 is 90 GPa to 100 GPa, with high stiffness and structural strength, which can effectively support the entire multilayer structure and maintain the stability of the geometric shape in high-frequency vibration. The Young's modulus of the lower piezoelectric ceramic sheet 500 can be, but is not limited to, 90 GPa, 92 GPa, 94 GPa, 96 GPa, 98 GPa, or 100 GPa. The lower piezoelectric ceramic sheet 500 assumes the main mechanical bearing function, resisting the combined action of external constraints and internal vibration stress, and preventing the structure from failing due to excessive local deformation. The high-modulus lower layer also facilitates electrode connection and uniform electric field distribution, ensuring the stability of the electric energy-mechanical energy conversion of the piezoelectric ceramic sheet during long-term operation.

[0048] Please refer to Figures 2 to 4In some embodiments, the upper piezoelectric ceramic sheet 100, the middle piezoelectric ceramic sheet 300, and the lower piezoelectric ceramic sheet 500 of the piezoelectric ceramic atomization sheet 10 cooperatively form a through-hole 101 that extends through the center region of the upper piezoelectric ceramic sheet 100, the middle piezoelectric ceramic sheet 300, and the lower piezoelectric ceramic sheet 500 along the axial direction of the piezoelectric ceramic atomization sheet 10. The through-hole 101 provides a mounting area and a deformation avoidance space for the upper metal sheet 200 and the lower metal sheet 400, avoiding mechanical interference between the metal sheets (the upper metal sheet 200 and the lower metal sheet 400) and the ceramic layers (the upper piezoelectric ceramic sheet 100, the middle piezoelectric ceramic sheet 300, and the lower piezoelectric ceramic sheet 500) during vibration, while ensuring the geometric compatibility and movement freedom of the multi-layer structure under high-frequency working conditions.

[0049] The upper metal sheet 200 includes a first atomization portion 210, a first support portion 220, and a first connecting portion 230 connected in sequence. The first atomization portion 210 is located in the center region of the upper metal sheet 200 and is used to realize the atomization function. The surface of the first atomization portion 210 is provided with an array of micron-level through-holes 101 to support the formation of fine mist droplets under the action of vibration. The first support portion 220 is arranged around the outer peripheral edge of the first atomization portion 210, connects the first atomization portion 210 and the first connecting portion 230, and bears the functions of vibration transmission and structural support.

[0050] The first support portion 220 extends in a wave shape along the radial direction of the piezoelectric ceramic atomization sheet 10. The profile of the first support portion 220 is composed of continuous convex arc segments and concave arc segments, forming a periodically undulating elastic structure. This wave-shaped design endows the first support portion 220 with good radial flexibility and axial stiffness. When the piezoelectric ceramic sheet generates high-frequency vibration, the first support portion 220 can absorb part of the transverse shear stress and slight displacement deviation, playing a buffering and shock-absorbing role, reducing the concentration of stress at the interface between the metal and the ceramic, and inhibiting crack initiation.

[0051] The first support portion 220 adopts a ring structure that extends in a wave shape along the radial direction, so that the first support portion 220 has excellent elastic deformation capability. Under the high-frequency driving of the piezoelectric ceramic layer (such as the upper piezoelectric ceramic sheet 100, the middle piezoelectric ceramic sheet 300, or the lower piezoelectric ceramic sheet 500), the first support portion 220 can generate greater axial vibration displacement, thereby driving the first atomization portion 210 to realize greater mechanical oscillation, significantly improving the vibration intensity and liquid breaking capability of the first atomization portion 210, and improving the overall atomization efficiency.

[0052] The wavy first support part 220 effectively reduces the mechanical impedance mismatch between the upper metal sheet 200 and the piezoelectric ceramic layer. Due to the significant difference in mechanical parameters such as Young's modulus and density between metal and ceramic, the traditional planar connection structure is prone to interface reflection and energy loss during vibration. The first support part 220, through its periodic undulating geometry, forms a spring-like mechanical response characteristic, enhances the interlayer dynamic coupling capability, reduces the reflection and dissipation of vibration energy at the interface, and improves the electro-mechanical energy conversion efficiency.

[0053] In addition, the wavy first support part 220 has good stress dispersion function. Under the action of periodic expansion and contraction vibration of the piezoelectric ceramic layer, alternating stress is generated inside the multilayer structure. The wavy structure redistributes the concentrated stress along the wave crest and trough direction through local bending and tensile deformation, avoids excessive accumulation of stress in local area, effectively alleviates the shear stress and peeling force at the interface between the upper metal sheet 200 and the piezoelectric ceramic layer. This stress buffering mechanism significantly reduces the fatigue damage rate of the upper metal sheet 200, inhibits crack initiation and propagation, and prolongs the service life of the piezoelectric ceramic atomization sheet 10.

[0054] The first connecting part 230 is located at the outer edge of the first support part 220, surrounds the first support part 220, and is firmly clamped between the upper piezoelectric ceramic sheet 100 and the intermediate piezoelectric ceramic sheet 300 by interlayer pressing, which helps to realize the mechanical fixation and electrical connection of the upper metal sheet 200, ensures efficient transmission of vibration energy from the piezoelectric ceramic layer to the first atomization part 210, and at the same time maintains the integrity of the structure.

[0055] The lower metal sheet 400 includes a second atomization part 410, a second support part 420 and a second connecting part 430 connected in sequence. The second atomization part 410 is located in the central region of the lower metal sheet 400 and is used to realize the atomization function. The surface is provided with an array of micron-level through holes 101 to support the formation of fine mist droplets under the action of vibration. The second support part 420 is arranged around the outer peripheral edge of the second atomization part 410, connects the second atomization part 410 and the second connecting part 430, and bears the vibration transmission and structure support functions.

[0056] The second support part 420 extends in a wavy shape along the radial direction of the piezoelectric ceramic atomization sheet 10, and the profile of the second support part 420 is composed of continuous convex arc segments and concave arc segments, forming a periodically undulating elastic structure. This wavy design gives the second support part 420 good radial compliance and axial stiffness. When the piezoelectric ceramic sheet produces high-frequency vibration, it can absorb part of the transverse shear stress and slight displacement deviation, play a buffering and shock-absorbing role, reduce the concentration of stress at the interface between metal and ceramic, and inhibit crack initiation.

[0057] The second support portion 420 has a wave-shaped annular structure extending in the radial direction. The profile of the second support portion 420 is composed of continuous convex and concave arc segments, forming a periodically undulating elastic structure, so that the second support portion 420 has excellent elastic deformation capability. Under the high-frequency driving of the piezoelectric ceramic layer (e.g., the upper piezoelectric ceramic sheet 100, the middle piezoelectric ceramic sheet 300, or the lower piezoelectric ceramic sheet 500), the second support portion 420 can generate greater axial vibration displacement, thereby driving the second atomization portion 410 to achieve greater mechanical oscillation, significantly improving the vibration intensity and liquid breaking capability of the second atomization portion 410, and improving the overall atomization efficiency.

[0058] The wave-shaped second support portion 420 effectively reduces the mechanical impedance mismatch between the lower metal sheet 400 and the piezoelectric ceramic layer. Due to the significant difference in mechanical parameters such as Young's modulus and density between metal and ceramic, the traditional planar connection structure is prone to interface reflection and energy loss during vibration. The second support portion 420 has a periodically undulating geometry, forming a spring-like mechanical response characteristic, enhancing the interlayer dynamic coupling capability, reducing the reflection and dissipation of vibration energy at the interface, and improving the electrical-mechanical energy conversion efficiency.

[0059] In addition, the wave-shaped second support portion 420 has good stress dispersion function. Under the action of periodic expansion and contraction of the piezoelectric ceramic layer, alternating stress is generated inside the multilayer structure. The wave structure redistributes the concentrated stress along the wave crest and trough direction through local bending and tensile deformation, avoiding excessive accumulation of stress in local areas, effectively relieving the shear stress and peeling force at the interface between the lower metal sheet 400 and the piezoelectric ceramic layer. This stress buffering mechanism significantly reduces the fatigue damage rate of the lower metal sheet 400, inhibits crack initiation and propagation, and prolongs the service life of the piezoelectric ceramic atomization sheet 10.

[0060] The second connection portion 430 is located at the outer edge of the second support portion 420 and is arranged around the second support portion 420. It is firmly clamped between the lower metal sheet 400 and the middle piezoelectric ceramic sheet 300 by interlayer pressing, which helps to achieve mechanical fixation and electrical connection of the lower metal sheet 400, ensures efficient transmission of vibration energy from the piezoelectric ceramic layer to the second atomization portion 410, and maintains the integrity of the structure.

[0061] Please refer to Figure 2 In some embodiments, the first atomization portion 210 is arranged protruding from the middle piezoelectric ceramic sheet 300 to the upper piezoelectric ceramic sheet 100, forming a curved structure protruding outward, so that the geometric surface area of the first atomization portion 210 is greater than the projected area of the plane where the first support portion 220 is located. Under the same installation space, the effective surface area available for carrying liquid and atomization is significantly increased.

[0062] The protrusion of the first atomization part 210 significantly increases the actual surface area under the same projected area, thereby expanding the effective atomization area. The increased atomization area supports the arrangement of more atomized micro-holes, improving the atomization amount and output efficiency per unit time. Under high-frequency vibration driving, the liquid forms a dynamic liquid film on the curved surface of the first atomization part 210, and due to the expansion effect of the curved surface, the liquid distribution is more uniform, avoiding local liquid accumulation or dryness, and improving the atomization continuity and stability. At the same time, the curved surface of the first atomization part 210 is beneficial to the rapid separation of mist droplets after formation from the atomization surface, reducing backflow and secondary aggregation, and improving the atomization fineness and dispersibility.

[0063] During operation, the piezoelectric ceramic layer generates high-frequency vibration, and the vibration energy is transmitted to the upper metal sheet 200 and the lower metal sheet 400 through the clamping part. Since the upper metal sheet 200 is located above and the first atomization part 210 is upwardly protruding, it directly faces the user or the mist outlet channel, and undertakes the main atomization output function.

[0064] In some embodiments, the first atomization part 210 of the upper metal sheet 200 of the piezoelectric ceramic atomization sheet 10 is provided with a plurality of first atomization through-holes 211, all of which penetrate the thickness direction of the first atomization part 210, forming a channel for liquid atomization. The diameter of each first atomization through-hole 211 gradually decreases along the axial direction from the middle layer piezoelectric ceramic sheet 300 towards the upper layer piezoelectric ceramic sheet 100, forming a tapered hole structure with a tapered inner wall. The inlet end of the first atomization through-hole 211 is located on the side of the first atomization part 210 close to the middle layer piezoelectric ceramic sheet 300, and the diameter is larger; the outlet end of the first atomization through-hole 211 is located on the outer surface of the first atomization part 210 facing the upper layer piezoelectric ceramic sheet 100, and the diameter is smaller.

[0065] The tapered structure of the first atomization through-hole 211 optimizes the flow behavior of the liquid in the micro-hole and the pressure distribution in the atomization process. Under the action of vibration, the piezoelectric ceramic layer drives the upper metal sheet 200 to generate high-frequency mechanical oscillation, and the liquid moves from the large-diameter end to the small-diameter end of the hole. Due to the gradual reduction of the cross-sectional area of the hole, the flow rate of the liquid increases in the outlet area, forming a local high pressure difference, enhancing the shear force and jet kinetic energy of the liquid at the micro-hole outlet, which helps the liquid to stretch and break into fine mist droplets when it separates from the atomization surface, significantly improving the atomization efficiency and mist droplet uniformity.

[0066] In addition, the tapered design of the first atomization through-hole 211 also improves the capillary control ability of the liquid. The larger inlet aperture facilitates the rapid replenishment of liquid from the liquid storage area to the inside of the micro-pore, improving the liquid supply efficiency; the smaller outlet aperture enhances the restraining effect of surface tension on the liquid surface, preventing unatomized liquid from dripping when there is no vibration, and improving the anti-liquid leakage performance and safety of the atomizer. At the moment of vibration start, the smaller liquid bridge size at the outlet is more easily broken by high-frequency disturbance, achieving fast atomization start response.

[0067] The tapered structure of the first atomization through-hole 211 cooperates with the convex curved surface of the first atomization part 210. The convex curved surface enlarges the effective atomization area, accommodating more atomization through-holes 101; and the tapered design of each through-hole 101 further improves the single-hole atomization performance. The combination of the two achieves the unity of high-density micro-pore layout and high-quality atomization output, making the piezoelectric ceramic atomization sheet 10 more suitable for precise atomization scenarios that require high atomization volume, fine mist particles, and low residue.

[0068] In some embodiments, the second atomization part 410 of the lower metal sheet 400 of the piezoelectric ceramic atomization sheet 10 is convexly arranged towards the lower piezoelectric ceramic sheet 500 from the middle piezoelectric ceramic sheet 300, forming an arc-shaped curved surface structure extending axially downward. The convex shape makes the outer surface of the second atomization part 410 dome-shaped or parabolic, with its geometric center closer to the side of the lower piezoelectric ceramic sheet 500 relative to the peripheral connection area, constituting a primary atomization working surface facing downward.

[0069] The convex structure of the second atomization part 410 significantly increases the actual surface area under the same projection area, effectively expanding the area available for carrying liquid and conducting atomization reactions. The increased atomization area supports a higher density of atomization micro-pores, improves the amount of liquid involved in atomization per unit time, and enhances the initial atomization capacity of the atomizer. Under high-frequency vibration excitation, the liquid forms a dynamic liquid film on the convex curved surface, and the curved surface structure is beneficial to the uniform spreading of the liquid, avoiding local liquid accumulation or drying out, and improving the utilization rate of the liquid and the continuity of the atomization process.

[0070] The convex second atomization part 410 exhibits good mechanical response characteristics during vibration. Due to its elastic deformation ability, it can produce axial and radial compound vibration modes under the drive of the piezoelectric ceramic layer, enhancing the disturbance intensity of the micro-pore periphery, promoting the shearing and cavitation effect of the liquid at the pore opening, and achieving high-efficiency atomization. The curved surface shape also helps the mist droplets to quickly detach from the atomization surface after formation, reducing backflow and secondary aggregation, and improving atomization dispersity and spray uniformity.

[0071] The second atomization part 410 is provided with a plurality of second atomization through holes 411a penetrating through its thickness, which penetrate through the convex region in the axial direction and serve as channels for liquid atomization. These through holes 101 can adopt straight hole, inverted cone or normal cone structure, which is optimized according to the properties of the liquid and the target droplet size. In actual operation, the liquid is first guided to the surface of the second atomization part 410 and undergoes preliminary atomization under the action of vibration to generate an initial droplet group.

[0072] The downward convex second atomization part 410 serves as a primary atomization unit to provide preprocessing for the subsequent atomization process. The preliminarily atomized droplets migrate upward under the action of airflow or vibration-induced flow and enter the upper metal sheet 200 region above it for secondary fine atomization by the first atomization part 210. This staged atomization mechanism realizes phased optimization of the atomization process through spatial layout and structural design, improving overall atomization fineness, output stability and energy utilization efficiency.

[0073] The convex structure of the second atomization part 410 is manufactured by precision stamping, etching or electroforming process to ensure geometric precision and structural consistency. Its curvature radius, wall thickness and edge transition parameters are optimized according to vibration modes, material properties and fluid behavior, taking into account both atomization performance improvement and long-term working structural durability. This design fully utilizes the three-dimensional space to improve the functional density of atomization without increasing the planar size of the device, and is suitable for application scenarios with high requirements for atomization efficiency, miniaturization and reliability.

[0074] In some embodiments, the second atomization part 410 of the lower metal sheet 400 of the piezoelectric ceramic atomization sheet 10 is provided with a plurality of second atomization through holes 411a, all of which penetrate through the thickness direction of the second atomization part 410 and are distributed in the axial direction on the convex curved surface region of the second atomization part 410 from the intermediate piezoelectric ceramic sheet 300 towards the lower piezoelectric ceramic sheet 500. The aperture of each second atomization through hole 411a gradually increases from the side of the intermediate piezoelectric ceramic sheet 300 towards the side of the lower piezoelectric ceramic sheet 500, forming a tapered conical structure with a large inlet aperture and a small outlet aperture. The inner wall of the tapered channel is a smooth transition cohesive conical surface, avoiding flow resistance or stress concentration.

[0075] The tapered structure of the second atomization through hole 411a optimizes the flow behavior and atomization characteristics of the liquid in the primary atomization stage. Under the high-frequency vibration excitation of the piezoelectric ceramic layer, the lower metal sheet 400 generates mechanical oscillation, and the liquid enters from the large-diameter end of the through hole 101. During the movement towards the small-diameter end, the flow area gradually decreases and the fluid velocity continuously increases, forming an accelerated jet. This acceleration effect significantly enhances the shear force and jet kinetic energy of the liquid in the outlet area, causing the liquid film to stretch and break rapidly when it leaves the atomization surface, achieving efficient initial atomization and generating an initial droplet group with small particle size and uniform distribution.

[0076] The tapered hole design improves the liquid supply capacity and leak-proof performance. The larger inlet aperture reduces the flow resistance of the liquid from the supply channel into the micro-hole, which is conducive to rapid replenishment of the liquid and improves the efficiency of primary atomization; the smaller outlet aperture enhances the surface tension constraint of the liquid at the outlet of the atomization surface, effectively preventing liquid droplet leakage due to gravity or capillary pressure difference in the absence of vibration, and improving the sealing reliability of the piezoelectric ceramic atomization sheet 10 in a stationary or inclined state. At the moment of vibration start, the smaller liquid bridge size at the outlet is more easily broken by high-frequency disturbance, achieving rapid atomization response and reducing the generation of initial large droplets.

[0077] The tapered structure of the second atomization through-hole 411a cooperates with the downward protruding shape of the second atomization part 410. The protruding curved surface enlarges the effective surface area of the primary atomization area, supports a higher density of second atomization through-hole 411a layout, and improves the number of atomization points per unit area; and the tapered design of each through-hole 101 further improves the single-hole atomization performance. The combination of the two achieves the unity of high-throughput liquid processing and high-quality primary atomization, providing a stable and small initial mist droplet source for the subsequent secondary atomization process.

[0078] In actual work process, the liquid first completes the preliminary atomization in the second atomization part 410, and the generated initial mist droplets migrate upward under the action of vibration-induced airflow or capillary transmission, entering the upper metal sheet 200 area located above. The first atomization part 210 breaks the migrating mist droplets through its own structure (such as the protruding shape and tapered through-hole 101), achieving hierarchical atomization. The structure design significantly improves the overall atomization fineness, output uniformity, and energy utilization efficiency through the synergistic optimization of hole geometry and spatial layout.

[0079] In some embodiments, the second atomization part 410 of the lower metal sheet 400 of the piezoelectric ceramic atomization sheet 10 includes an atomization sub-part 411 and a backflow sub-part 412, the atomization sub-part 411 being arranged around the backflow sub-part 412, and the two together forming a composite functional area of the second atomization part 410. The atomization sub-part 411 is located in the peripheral area of the second atomization part 410 and undertakes the primary atomization function, and a plurality of second atomization through-holes 411a are distributed in the thickness direction of the atomization sub-part 411 and penetrate through the downward protruding curved surface structure. The aperture of each second atomization through-hole 411a gradually decreases from one side of the middle piezoelectric ceramic sheet 300 to the other side of the lower piezoelectric ceramic sheet 500, forming a tapered tapered channel with a large inlet end and a small outlet end, which is conducive to accelerating the ejection and breaking of the liquid into fine mist droplets at the outlet, achieving high-efficiency primary atomization.

[0080] The reflux sub-portion 412 is located in the central region of the second atomization portion 410 and surrounded by the atomization sub-portion 411, constituting a liquid circulation and dynamic adjustment functional area. The reflux sub-portion 412 is provided with a plurality of reflux through holes 412a, all of which penetrate the thickness direction of the reflux sub-portion 412 and pass through the convex structure in the axial direction. The diameter of each reflux through hole 412a gradually decreases from one side of the intermediate piezoelectric ceramic sheet 300 to the other side of the lower piezoelectric ceramic sheet 500, forming a tapered hole with a tapered inner wall. This decreasing diameter structure plays a key role in the liquid reflux process.

[0081] The tapered design of the reflux through hole 412a significantly enhances the directionality and controllability of liquid reflux. When the piezoelectric ceramic layer is not excited, the liquid tends to flow downward under the action of gravity or capillary force, but due to the smaller outlet diameter of the reflux through hole 412a, the liquid is more strongly constrained by surface tension at the outlet, forming a stable meniscus that effectively prevents uncontrolled dripping and improves the sealing performance of the piezoelectric ceramic atomization sheet 10 in standby or inclined state. During vibration, the piezoelectric ceramic sheet generates high-frequency mechanical oscillation, and the liquid overcomes the surface tension and flows from the large-diameter end to the small-diameter end under the action of inertial force and vibration acceleration, achieving directional reflux.

[0082] The structure of the gradually decreasing diameter from top to bottom also optimizes the fluid dynamics during the reflux process. After the liquid enters the large-diameter end of the reflux through hole 412a, the flow area gradually decreases and the flow velocity gradually increases, forming an accelerated flow state that helps to push the unatomized or condensed liquid droplets away from the atomization surface and into the lower liquid storage cavity or liquid supply channel, completing the recirculation. This acceleration effect prevents the liquid from stagnating inside the reflux sub-portion 412, reduces the risk of liquid accumulation and local dry burning, and improves the system's thermal management and long-term operation stability.

[0083] In addition, the tapered reflux through hole 412a and the tapered second atomization through hole 411a of the atomization sub-portion 411 form a functional synergy and structural unity. Both use a tapered design, which can be formed simultaneously in the same processing technology (such as laser micro-machining, electroforming or anisotropic etching), ensuring manufacturing consistency and process compatibility. At the same time, this design allows the reflux sub-portion 412 to have similar mechanical response characteristics to the atomization sub-portion 411 during vibration, reducing stress mismatch caused by structural differences and improving the overall vibration synchronization and structural durability of the lower metal sheet 400.

[0084] The collaborative layout of the atomization sub-portion 411 and the backflow sub-portion 412 optimizes the distribution and flow path of the liquid on the surface of the second atomization portion 410. The liquid first enters the atomization sub-portion 411 from the central area through the backflow sub-portion 412 or the edge liquid supply channel, migrates to the periphery under the action of vibration, and participates in atomization; the liquid that is not completely atomized or the condensed liquid droplets return through the central backflow through hole 412a, forming a dynamic circulation mode of "outward atomization and inward backflow". This fluid management mechanism improves the atomization response speed and continuous working ability, and is especially suitable for application scenarios with long-time operation or large liquid supply fluctuations.

[0085] In some embodiments, the upper piezoelectric ceramic sheet 100, the upper metal sheet 200, the intermediate piezoelectric ceramic sheet 300, the lower metal sheet 400, and the lower piezoelectric ceramic sheet 500 of the piezoelectric ceramic atomization sheet 10 are arranged in sequence along the axial direction, and are firmly connected by bonding between layers. The bonding process ensures the integrity and collaborative motion ability of the multi-layer structure during high-frequency vibration, prevents relative slipping or loosening between layers, and improves the transmission efficiency of vibration energy and structural stability.

[0086] The bonding adopts a high-temperature-resistant and high-elasticity microelectronic adhesive, which has good shear strength, fatigue resistance, and environmental resistance, and can maintain bonding reliability under high temperature, high humidity, and long-term alternating stress conditions. Common bonding materials include epoxy resin modified glue, silicone packaging glue, or polyimide adhesive, which are selected according to process temperature and service environment. The thickness of the bonding layer is controlled within the range of 5 μm to 20 μm, which ensures sufficient bonding strength and avoids increasing vibration damping or stress transmission lag due to excessive thickness of the glue layer.

[0087] The upper piezoelectric ceramic sheet 100 and the upper metal sheet 200 are fixed by bonding, which ensures that the connecting portion of the upper metal sheet 200 is stably clamped and mechanically coupled. The intermediate piezoelectric ceramic sheet 300 is located between the upper metal sheet 200 and the lower metal sheet 400, and is bonded with both of them, forming a symmetrical support structure of the upper and lower metal sheets. The lower piezoelectric ceramic sheet 500 and the lower metal sheet 400 are also connected by bonding, completing the packaging of the entire laminated structure.

[0088] In some embodiments, the upper piezoelectric ceramic sheet 100, the intermediate piezoelectric ceramic sheet 300, and the lower piezoelectric ceramic sheet 500 are made of lead-free piezoelectric ceramic materials. The lead-free piezoelectric ceramic material can be a potassium sodium niobate-based system or a sodium bismuth titanate-based system, etc. Lead-free design significantly reduces potential harm to the environment and human health.

[0089] In some embodiments, the upper metal sheet 200 and the lower metal sheet 400 can be made of stainless steel or titanium alloy, etc.

[0090] The same or similar reference numerals in the drawings of the embodiments correspond to the same or similar components; in the description of the present application, it is understood that if the orientations or positional relationships indicated by the terms "upper", "lower", "left", "right" and the like are based on the orientations or positional relationships shown in the drawings, they are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore the terms describing the positional relationships in the drawings are only used for exemplary illustration and cannot be understood as a limitation on the present application, for those skilled in the art, the specific meanings of the above terms can be understood according to the specific circumstances.

[0091] The above is only a preferred embodiment of the present application, and is not used to limit the present application, any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A piezoelectric ceramic atomizing sheet, characterized by, The piezoelectric ceramic atomizing piece comprises an upper piezoelectric ceramic sheet, an upper metal sheet, an intermediate piezoelectric ceramic sheet, a lower metal sheet and a lower piezoelectric ceramic sheet which are sequentially stacked; the Young's modulus of the upper piezoelectric ceramic sheet, the Young's modulus of the intermediate piezoelectric ceramic sheet and the Young's modulus of the lower piezoelectric ceramic sheet are sequentially arranged in a gradient manner; The Young's modulus of the lower piezoelectric ceramic sheet, the Young's modulus of the intermediate piezoelectric ceramic sheet and the Young's modulus of the upper piezoelectric ceramic sheet are sequentially decreased. The Young's modulus of the upper piezoelectric ceramic sheet is 50GPa-60GPa. The Young's modulus of the intermediate piezoelectric ceramic sheet is 70GPa-80GPa. The Young's modulus of the lower piezoelectric ceramic sheet is 90GPa-100GPa.

2. The piezoelectric ceramic atomizing piece according to claim 1, wherein the upper piezoelectric ceramic sheet, the intermediate piezoelectric ceramic sheet and the lower piezoelectric ceramic sheet cooperatively form a receiving through hole which penetrates through the upper piezoelectric ceramic sheet, the intermediate piezoelectric ceramic sheet and the lower piezoelectric ceramic sheet; The upper metal sheet comprises a first atomizing portion, a first supporting portion and a first connecting portion which are sequentially connected, the first atomizing portion and the first supporting portion are located in the receiving through hole, and the first connecting portion is clamped between the upper piezoelectric ceramic sheet and the intermediate piezoelectric ceramic sheet; the lower metal sheet comprises a second atomizing portion, a second supporting portion and a second connecting portion which are sequentially connected, the second atomizing portion and the second supporting portion are located in the receiving through hole, and the second connecting portion is clamped between the lower piezoelectric ceramic sheet and the intermediate piezoelectric ceramic sheet; Along the radial direction of the piezoelectric ceramic atomizing piece, the first supporting portion is arranged in a wave shape, and / or the second supporting portion is arranged in a wave shape. The first atomizing portion is protrudingly arranged from the intermediate piezoelectric ceramic sheet to the upper piezoelectric ceramic sheet.

3. The piezoelectric ceramic atomizing piece according to claim 2, characterized in that, The first atomizing portion is provided with a plurality of first atomizing through holes, each of which penetrates through the first atomizing portion, and the aperture of each of the first atomizing through holes gradually decreases from the intermediate piezoelectric ceramic sheet to the upper piezoelectric ceramic sheet.

4. The piezoelectric ceramic atomizing piece according to claim 3, characterized in that, The second atomizing portion is protrudingly arranged from the intermediate piezoelectric ceramic sheet to the lower piezoelectric ceramic sheet.

5. The piezoelectric ceramic atomizing piece according to claim 2, characterized in that, The second atomizing portion is provided with a plurality of second atomizing through holes, each of which penetrates through the second atomizing portion, and the aperture of each of the second atomizing through holes gradually increases from the intermediate piezoelectric ceramic sheet to the lower piezoelectric ceramic sheet.

6. The piezoelectric ceramic atomizing piece according to claim 5, characterized in that, The second atomizing portion comprises an atomizing sub-portion and a backflow sub-portion, the atomizing sub-portion is arranged around the backflow sub-portion, and the plurality of second atomizing through holes are arranged in the atomizing sub-portion; 7. The piezoelectric ceramic atomizing piece according to claim 6, characterized in that, The backflow sub-portion is provided with a plurality of backflow through holes, each of which penetrates through the backflow sub-portion, and the aperture of each of the backflow through holes gradually decreases from the intermediate piezoelectric ceramic sheet to the lower piezoelectric ceramic sheet. The upper piezoelectric ceramic sheet, the upper metal sheet, the intermediate piezoelectric ceramic sheet, the lower metal sheet and the lower piezoelectric ceramic sheet are sequentially bonded.

8. The piezoelectric ceramic atomizing sheet according to any one of claims 1 to 7, characterized by, ​

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