Wafer grinding and polishing device based on automatic control system
The wafer grinding and polishing device with an automatic control system achieves simultaneous grinding of the upper and lower surfaces of the wafer and uniform force, solving the problems of low efficiency and contamination damage in the existing technology and improving the wafer grinding quality.
Patent Information
- Application Number
- CN202511178860.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-22
- Publication Date
- 2025-10-10
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
Existing wafer grinding equipment is inefficient and easily causes contamination and uneven stress distribution on the wafer when it is turned over, resulting in microcracks or damage, which affects the quality of grinding and polishing.
A wafer grinding and polishing device based on an automatic control system is used. Two electrically controlled grinding discs are used to grind multiple wafers simultaneously. The wafers are fixed by a mold ring to ensure that the upper and lower surfaces are ground simultaneously. The friction ruler and flexible ring are used to adjust the uniformity of the force on the wafer. At the same time, the spray direction of the grinding liquid and the stirring element are controlled to stir the grinding liquid to ensure the uniformity of the grinding liquid.
It improves the wafer grinding efficiency, reduces the probability of contamination during the flipping process, ensures uniform stress distribution on the wafer, reduces the probability of micro cracks and scratches, and improves the grinding quality.
Smart Images
Figure CN120755781A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of wafer grinding and polishing, and particularly relates to a wafer grinding and polishing device based on an automatic control system. BACKGROUND
[0002] A wafer is a core substrate for semiconductor manufacturing, and the flatness of the wafer surface is directly related to the performance of a chip. Therefore, when the wafer is produced, the wafer surface needs to be ground and polished. The existing wafer grinding equipment adopts an automatic control system based on integrated intelligent programming and real-time monitoring. When the wafer is ground and polished, the grinding disc is relatively rotated with the wafer, so that the single-sided surface of the wafer is ground and polished. After the single-sided surface of the wafer is ground and polished, the wafer is turned over, and the other side of the wafer is ground and polished. This grinding and polishing method is not only low in efficiency, but also easily causes the polished side of the wafer to be contaminated by the external environment after the wafer is turned over, thereby affecting the effect of wafer grinding and polishing. In addition, when the wafer is ground and polished on one side, the wafer on one side is pressed, so that the overall stress distribution of the wafer is uneven, and then micro-cracks are generated on the wafer surface during the grinding and polishing process, and even the wafer is damaged, thereby affecting the quality of the wafer after grinding and polishing. SUMMARY
[0003] In order to overcome the defect that single-sided grinding causes the wafer to be damaged due to uneven stress distribution, the present application provides a wafer grinding and polishing device based on an automatic control system.
[0004] The technical scheme is as follows: a wafer grinding and polishing device based on an automatic control system, comprising two electrically controlled grinding discs which are symmetrically distributed upward and downward and are arranged in an outer shell, and a fixed disc which is arranged in the outer shell, the fixed disc is located between the two electrically controlled grinding discs, the fixed disc is provided with placement rings which are uniformly distributed in the circumferential direction, and a mold ring is detachably connected in the placement ring.
[0005] As a preferred, the fixed disc is provided with electromagnetic sliding rails which are uniformly distributed in the circumferential direction and have the same number as the placement rings, an electromagnetic sliding block is slidably connected in the electromagnetic sliding rail, a connecting rod is fixedly connected to the electromagnetic sliding block, a sliding block which is slidably connected to the fixed disc is fixedly connected to the connecting rod, a rotating ring is fixedly connected to the connecting rod, and the rotating ring is rotationally connected with the adjacent placement ring.
[0006] As a preferred, the fixed disc is slidably connected with friction gauges which are circumferentially distributed and have the same number as the placement rings, and the outer side surface of the placement ring is a rough surface, and the friction gauge is used to drive the rotation of the placement ring.
[0007] As a preferred, the fixed disc is attached to the adjacent electrically controlled grinding disc on the lower side, and there is a distance between the lower side of the friction gauge and the adjacent electrically controlled grinding disc on the lower side.
[0008] Preferably, a flexible ring is fixedly connected inside the mold ring, and the inner side surface of the flexible ring is a rough surface.
[0009] Preferably, the height of the flexible ring is smaller than the height of the adjacent mold ring, and there is a distance between the electrically controlled grinding disc and the flexible ring.
[0010] Preferably, the placement ring is provided with a plurality of first circulation grooves which are symmetrical up and down and distributed circumferentially, and the mold ring is provided with a plurality of second circulation grooves which are symmetrical up and down and distributed circumferentially. The number of the first circulation grooves on the placement ring is the same as the number of the second circulation grooves on the mold ring, and the first circulation grooves are connected to the adjacent second circulation grooves.
[0011] Preferably, the fixed disk is fixed with transfer boxes that are distributed circumferentially and the number of which is the same as the number of the placement rings. The transfer boxes are connected to an external supply pump. The transfer boxes are connected to a spray pipe that passes through the adjacent connecting rods. The spray pipe is used to spray liquid into two adjacent first flow grooves.
[0012] Preferably, the transfer box is rotatably connected to a rotating rod, the rotating rod is provided with a limiting groove, the connecting rod is fixedly connected to a limiting frame, the limiting groove is used to guide the adjacent limiting frame, the rotating rod is fixedly connected to a first gear rotatably connected to the adjacent transfer box, the transfer box is rotatably connected to a second gear meshing with the adjacent first gear, the second gear is fixedly connected to a stirring member through a gear shaft, and the stirring member is located in the adjacent transfer box.
[0013] Preferably, the number of teeth of the first gear is greater than the number of teeth of the second gear.
[0014] Compared with the prior art, the technical effect achieved by the present invention is as follows: the present invention grinds multiple wafers at the same time by two electrically controlled grinding discs, and the mold ring fixes the wafer, thereby improving the wafer grinding efficiency and grinding the upper and lower surfaces of the wafer at the same time, so that the stress distribution of the wafer is uniform, and the probability of damage caused by pressure during single-sided grinding of the wafer is reduced, and the need to flip the wafer during single-sided grinding of the wafer is avoided, thereby reducing the probability of contamination of the wafer during the flipping process, thereby improving the quality of the wafer after grinding, and when the wafer is subjected to unilateral force due to being driven by the electrically controlled grinding disc, the edge of the wafer is continuously rotated and replaced The position where the wafer is subjected to force on one side ensures that the wafer is subjected to uniform force during the grinding process, thereby ensuring the effect of wafer grinding. By controlling the spraying direction of the grinding liquid and guiding the grinding liquid by the first flow groove and the second flow groove, the spraying accuracy of the grinding liquid is improved. The grinding liquid in the adjacent transfer box is stirred by a stirring member, and the liquid in the grinding liquid is evenly mixed with the grinding particles to reduce the amount of precipitation of the grinding particles in the grinding liquid during storage, thereby ensuring the uniform distribution of the grinding particles in the grinding liquid, reducing the probability of the wafer being scratched due to uneven distribution of grinding particles in the grinding liquid, and thus improving the quality of wafer grinding. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention; Figure 2 Schematic diagram of the three-dimensional structure of the electric-controlled grinding disc of the present invention; Figure 3 It is a schematic diagram of the three-dimensional structure of the fixed plate of the present invention; Figure 4 This is a schematic diagram of the three-dimensional structure of the placement ring of the present invention; Figure 5 Schematic diagram of the three-dimensional structure of the friction ruler of the present invention; Figure 6 Schematic diagram of the three-dimensional structure of the flexible ring of the present invention; Figure 7 It is a schematic diagram of the three-dimensional structure of the stirring element of the present invention.
[0016] The numbers in the figure are: 1-housing, 2-electrically controlled grinding disc, 3-fixed disc, 4-placing ring, 5-mold ring, 6-electromagnetic slider, 7-connecting rod, 8-sliding block, 9-rotating ring, 10-friction ruler, 11-flexible ring, 12-first circulation groove, 13-second circulation groove, 14-transfer box, 15-injection pipe, 16-rotating rod, 1601-limiting groove, 17-limiting frame, 18-first gear, 19-second gear, 20-stirring member. DETAILED DESCRIPTION
[0017] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further elaborated below.
[0018] Example 1
[0019] Wafer grinding and polishing equipment based on automatic control system, such as Figures 1-6 As shown, it includes two electrically controlled grinding discs 2 which are symmetrically distributed up and down and are both arranged on the housing 1, and a fixed disc 3 installed on the housing 1. The housing 1 is installed with a control terminal, and the electrically controlled grinding discs 2 are electrically connected to the control terminal. Initially, the lower electrically controlled grinding disc 2 is in contact with the fixed disc 3, and there is a distance between the upper electrically controlled grinding disc 2 and the fixed disc 3. When using this device, the two electrically controlled grinding discs 2 are turned on by the control terminal, and the upper electrically controlled grinding disc 2 moves downward to be in contact with the fixed disc 3, and then the two electrically controlled grinding discs 2 are turned on to rotate. The fixed disc 3 is located between the two electrically controlled grinding discs 2, and the fixed disc 3 is provided with a placement ring 4 which is evenly distributed circumferentially. A mold ring 5 is detachably connected to the placement ring 4. Before using this device, the mold ring 5 is removed from the placement ring 4, and different models of mold rings 5 are selected according to wafers of different sizes. The wafer is embedded in the corresponding mold ring 5, and then the mold ring 5 is installed on the corresponding placement ring 4. In this embodiment, the existing spray structure is used to spray the grinding liquid between the electrically controlled grinding disc 2 and the fixed disc 3.
[0020] like Figure 3-Figure 5 As shown, the fixed disk 3 is provided with electromagnetic slide rails which are evenly distributed in the circumference and the same in number as the placement rings 4. An electromagnetic slider 6 is slidably connected in the electromagnetic slide rail. The electromagnetic slide rail of the fixed disk 3 is electrically connected to the control terminal. The electromagnetic slider 6 is fixed with a connecting rod 7, which drives the connecting rod 7 to move. The connecting rod 7 is fixed with a sliding block 8 which is slidably connected to the fixed disk 3. The connecting rod 7 is fixed with a rotating ring 9 which is rotatably connected to the adjacent placement ring 4. The connecting rod 7 is used to drive the sliding block 8 and the rotating ring 9 to move so as to move the placement ring 4, adjust the position of the placement ring 4, and adjust the distance between the placement ring 4 and the axis of the fixed disk 3 to adjust the position of the wafer when grinding wafers of different sizes.
[0021] like Figure 4 and Figure 5 As shown, the fixed disk 3 is slidably connected with friction scales 10 distributed circumferentially and the same in number as the placement rings 4. The side of the friction scale 10 facing the placement ring 4 is a rough surface, and the outer side of the placement ring 4 is a rough surface. When the friction scale 10 moves away from the axis of the fixed disk 3, the friction scale 10 drives the placement ring 4 to rotate, and the fixed disk 3 is fitted with the adjacent electric-controlled grinding disk 2 on the lower side. There is a distance between the lower side of the friction scale 10 and the adjacent electric-controlled grinding disk 2 on the lower side to prevent the lower side of the friction scale 10 from being rubbed by the adjacent electric-controlled grinding disk 2.
[0022] The specific working principle is as follows: When the operator needs to use this device to grind and polish the wafer, the operator removes the mold rings 5 on all the placement rings 4, selects different models of mold rings 5 according to the different sizes of wafers, embeds the wafer into the corresponding mold ring 5, and then installs all the mold rings 5 on the corresponding placement rings 4 respectively.
[0023] After the mold ring 5 is placed on the placement ring 4, the operator turns on the electromagnetic slide rail of the fixed disk 3 through the control terminal, and the electromagnetic slider 6 drives the sliding block 8 and the rotating ring 9 to move through the connecting rod 7 to move the placement ring 4, adjust the position of the placement ring 4, and adjust the distance between the placement ring 4 and the axis of the fixed disk 3 to adjust the position of the wafer when grinding wafers of different sizes (large wafers require a long grinding time, and small wafers require a short grinding time, so that the larger wafers are further away from the axis of the fixed disk 3) to accurately grind different types of wafers.
[0024] When the position of the placement ring 4 is adjusted, the operator closes the electromagnetic slide rail of the fixed disk 3 and opens the two electrically controlled grinding disks 2 through the control terminal. The upper electrically controlled grinding disk 2 moves downward and fits the fixed disk 3 and the upper surface of the wafer, and the lower electrically controlled grinding disk 2 fits the lower surface of the wafer. Then, the two electrically controlled grinding disks 2 are controlled to rotate through the control terminal. The two electrically controlled grinding disks 2 grind multiple wafers at the same time (in the process of grinding the wafers, the existing spray structure is used to spray the grinding liquid between the electrically controlled grinding disk 2 and the fixed disk 3). While improving the wafer grinding efficiency, the upper and lower surfaces of the wafer are ground at the same time, so that the stress distribution of the wafer is uniform, the probability of damage caused by pressure during single-sided grinding is reduced, and the need to flip the wafer during single-sided grinding is avoided, thereby reducing the probability of the wafer being contaminated during the flipping process, thereby improving the quality of the wafer after grinding.
[0025] During the wafer grinding process, the operator regularly pulls the friction ruler 10 to make the friction ruler 10 move back and forth. When the friction ruler 10 moves, the friction ruler 10 drives the placement ring 4 to rotate through friction, the placement ring 4 drives the mold ring 5 to rotate, and the mold ring 5 drives the wafer to rotate. During the rotation of the electric-controlled grinding disk 2, the wafer will be driven by the electric-controlled grinding disk 2 to move, causing unilateral pressure on the wafer. By continuously rotating the wafer during the grinding process, the force on various parts of the wafer can be adjusted. When the wafer is subjected to unilateral force due to being driven by the electric-controlled grinding disk 2, the edge of the wafer is continuously rotated to change the position of the unilateral force on the wafer, so that the wafer is subjected to uniform force during the grinding process, thereby ensuring the effect of wafer grinding.
[0026] When the wafer is ground, the operator resets the friction ruler 10 and controls the two electrically controlled grinding discs 2 to stop rotating. The upper electrically controlled grinding disc 2 moves upward and resets. The operator removes the ground wafer and repeats the above steps to continuously grind the wafer.
[0027] Example 2
[0028] On the basis of Example 1, Figure 5 and Figure 6 As shown, a flexible ring 11 is fixed inside the mold ring 5, and the inner side surface of the flexible ring 11 is a rough surface. When the placement ring 4 rotates, the placement ring 4 drives the flexible ring 11 to rotate through the mold ring 5, and the flexible ring 11 drives the wafer to rotate through its rough surface. The height of the flexible ring 11 is less than the height of the adjacent mold ring 5. There is a distance between the electric-controlled grinding disk 2 and the flexible ring 11 to prevent the flexible ring 11 from being rubbed by the two electric-controlled grinding disks 2. The placement ring 4 is provided with a plurality of first flow grooves 12 that are symmetrical up and down and distributed circumferentially, and the mold ring 5 is provided with a plurality of second flow grooves 13 that are symmetrical up and down and distributed circumferentially. The first flow grooves 12 and the second flow grooves 13 are both used for circulation of grinding liquid, so that the grinding liquid flows into the position where the wafer is located. The number of first flow grooves 12 on the placement ring 4 is the same as the number of second flow grooves 13 on the mold ring 5, and the first flow grooves 12 are connected to the adjacent second flow grooves 13.
[0029] Example 3
[0030] On the basis of Example 2, Figure 4 and Figure 7 As shown, the fixed disk 3 is fixed with transfer boxes 14 distributed circumferentially and the number is the same as the number of the placement rings 4. The transfer boxes 14 are used to temporarily store the grinding liquid. The transfer box 14 is connected to an external supply pump, which is not shown in the figure. The external supply pump is electrically connected to the control terminal. The transfer box 14 is connected to a spray pipe 15. In the above embodiment, the existing spray structure is used to spray the grinding liquid between the electronically controlled grinding disk 2 and the fixed disk 3. In this embodiment, the grinding liquid is sprayed through the spray pipe 15. The spray pipe 15 passes through the adjacent connecting rod 7. The spray pipe 15 is used to spray the grinding liquid to two adjacent first flow grooves 12 distributed above and below to control the spray direction of the grinding liquid and improve the accuracy of the grinding liquid spray.
[0031] like Figure 4 、 Figure 5 and Figure 7As shown, the transfer box 14 is rotatably connected to the rotating rod 16, and the rotating rod 16 is provided with a limiting groove 1601. The connecting rod 7 is fixed to the limiting frame 17. The limiting groove 1601 is used to guide the adjacent limiting frame 17. When the limiting frame 17 moves, the limiting frame 17 squeezes the adjacent rotating rod 16 through the adjacent limiting groove 1601 to rotate the rotating rod 16. The rotating rod 16 is fixed to a first gear 18 rotatably connected to the adjacent transfer box 14. The transfer box 14 is rotatably connected to a gear meshing with the adjacent first gear 18. The second gear 19 is fixedly connected to the stirring member 20 through the gear shaft. When the rotating rod 16 rotates, the rotating rod 16 drives the stirring member 20 to rotate through the adjacent first gear 18 and the adjacent second gear 19. The stirring member 20 is located in the adjacent transfer box 14. The grinding liquid in the adjacent transfer box 14 is stirred by the stirring member 20 so that the liquid and particles in the grinding liquid are evenly mixed. The number of teeth of the first gear 18 is greater than the number of teeth of the second gear 19 to increase the rotation speed of the second gear 19.
[0032] The specific working principle is as follows: During the process of grinding the wafer, the operator turns on the external supply pump through the control terminal. The external supply pump pumps the grinding liquid in the transfer box 14 into the injection pipe 15. The grinding liquid is sprayed through the injection pipe 15 to the two adjacent first flow grooves 12 distributed above and below. The grinding liquid passes through the first flow groove 12 and the second flow groove 13 and enters the gap between the wafer and the electronically controlled grinding disk 2. By controlling the output direction of the grinding liquid, the injection accuracy of the grinding liquid is improved.
[0033] Before grinding the wafer, when the operator drives the connecting rod 7 to move through the electromagnetic slider 6, the connecting rod 7 drives the limit frame 17 to move, and the limit frame 17 squeezes the adjacent limit groove 1601 to rotate the rotating rod 16. The rotating rod 16 drives the stirring member 20 to rotate through the adjacent first gear 18 and the adjacent second gear 19. Since the number of teeth of the first gear 18 is greater than the number of teeth of the second gear 19, the second gear 19 drives the stirring member 20 to rotate rapidly. The stirring member 20 stirs the grinding liquid in the adjacent transfer box 14 to evenly mix the liquid and particles in the grinding liquid to reduce the amount of precipitation of grinding particles in the grinding liquid during storage, thereby ensuring uniform distribution of grinding particles in the grinding liquid, reducing the probability of wafer scratches due to uneven distribution of grinding particles in the grinding liquid, and thus improving the quality of wafer grinding.
[0034] In summary, the invention includes but is not limited to the above embodiments. Any equivalent replacement or partial improvement made under the spirit and principle of the present invention shall be deemed to be within the scope of protection of the present invention.
Claims
1. A wafer grinding and polishing device based on an automatic control system, characterized in that: The invention comprises two electrically controlled grinding discs (2) symmetrically distributed in the upper and lower parts and both arranged on a housing (1), and a fixed disc (3) mounted on the housing (1), wherein the fixed disc (3) is located between the two electrically controlled grinding discs (2), and the fixed disc (3) is provided with placement rings (4) uniformly distributed in the circumferential direction, wherein a mold ring (5) is detachably connected to the placement ring (4).
2. The wafer grinding and polishing device based on the automatic control system according to claim 1 is characterized in that: The fixed disk (3) is provided with electromagnetic slide rails that are evenly distributed in the circumference and the same number as the placement rings (4). An electromagnetic slider (6) is slidably connected in the electromagnetic slide rail. The electromagnetic slider (6) is fixedly connected to a connecting rod (7). The connecting rod (7) is fixedly connected to a sliding block (8) that is slidably connected to the fixed disk (3). The connecting rod (7) is fixedly connected to a rotating ring (9). The rotating ring (9) is rotatably connected to the adjacent placement ring (4).
3. The wafer grinding and polishing device based on the automatic control system according to claim 2 is characterized in that: The fixed disk (3) is slidably connected to friction rulers (10) distributed circumferentially and having the same number as the placement ring (4). The outer side surface of the placement ring (4) is a rough surface. The friction ruler (10) is used to drive the placement ring (4) to rotate.
4. The wafer grinding and polishing device based on the automatic control system according to claim 3 is characterized in that: The fixed disc (3) is in contact with the electrically controlled grinding disc (2) adjacent to the lower side, and a distance exists between the lower side of the friction ruler (10) and the electrically controlled grinding disc (2) adjacent to the lower side.
5. The wafer grinding and polishing device based on the automatic control system according to claim 4 is characterized in that: A flexible ring (11) is fixedly connected inside the mold ring (5), and the inner side surface of the flexible ring (11) is a rough surface.
6. The wafer grinding and polishing device based on the automatic control system according to claim 5 is characterized in that: The height of the flexible ring (11) is smaller than the height of the adjacent mold ring (5), and there is a distance between the electrically controlled grinding disc (2) and the flexible ring (11).
7. The wafer grinding and polishing device based on the automatic control system according to claim 6 is characterized in that: The placement ring (4) is provided with a plurality of first circulation grooves (12) that are symmetrical in the upper and lower directions and distributed circumferentially, and the mold ring (5) is provided with a plurality of second circulation grooves (13) that are symmetrical in the upper and lower directions and distributed circumferentially. The number of the first circulation grooves (12) on the placement ring (4) is the same as the number of the second circulation grooves (13) on the mold ring (5), and the first circulation grooves (12) are connected to adjacent second circulation grooves (13).
8. The wafer grinding and polishing device based on the automatic control system according to claim 7 is characterized in that: The fixed disk (3) is fixedly connected with transfer boxes (14) distributed circumferentially and the number of which is the same as the number of the placement rings (4). The transfer boxes (14) are connected to an external supply pump. The transfer boxes (14) are connected to a spray pipe (15). The spray pipe (15) passes through the adjacent connecting rods (7). The spray pipe (15) is used to spray liquid to two adjacent first flow grooves (12).
9. The wafer grinding and polishing device based on the automatic control system according to claim 8, characterized in that: The transfer box (14) is rotatably connected to a rotating rod (16), the rotating rod (16) is provided with a limiting groove (1601), the connecting rod (7) is fixedly connected to a limiting frame (17), the limiting groove (1601) is used to guide the adjacent limiting frame (17), the rotating rod (16) is fixedly connected to a first gear (18) rotatably connected to the adjacent transfer box (14), the transfer box (14) is rotatably connected to a second gear (19) meshing with the adjacent first gear (18), the second gear (19) is fixedly connected to a stirring member (20) via a gear shaft, and the stirring member (20) is located in the adjacent transfer box (14).
10. The wafer grinding and polishing device based on the automatic control system according to claim 9, characterized in that: The number of teeth of the first gear (18) is greater than the number of teeth of the second gear (19).