Semiconductor refrigeration sheet and refrigeration system

Abstract

The invention relates to a semiconductor refrigeration sheet and a refrigeration system. The semiconductor chilling plate comprises a cold plate, a hot plate, a plurality of PN type semiconductor units, a plurality of lead-out pole groups and a heating assembly. In the actual use process of the semiconductor chilling plate, firstly, the power supply is connected with the heating assembly and the flow deflectors, then, the semiconductor chilling plate is installed at a position to be heated or refrigerated, and multiple groups of TEC units are formed through the cold plate, the hot plate, the multiple groups of flow deflectors, the multiple groups of lead-out pole groups and the multiple groups of PN type semiconductor units. The power source is communicated with the multiple lead-out pole sets, cold plate refrigeration of the multiple TEC units is achieved, temperature control and temperature control rate control can be achieved by supplying power to part of the TEC units, the cold plate is provided with the heating assembly, and therefore in the temperature control process of the cold plate, auxiliary heating is achieved, the conversion power between the cold plate and the hot plate is reduced, the temperature control precision is improved, and the service life of the TEC units is prolonged. Heat conduction is improved.

Description

Technical Field

[0001] The present application relates to the technical field of thermoelectric modules, and in particular to semiconductor refrigeration sheets and refrigeration systems. Background Art

[0002] Semiconductor cooler (TEC), also known as thermoelectric cooler, is a type of heat pump. Its advantage is that it has no sliding parts and is used in situations where space is limited, reliability is high, and there is no refrigerant pollution. It utilizes the Peltier effect of semiconductor materials. When direct current passes through a galvanic couple made of two different semiconductor materials connected in series, heat is absorbed and released at both ends of the galvanic couple, achieving the purpose of cooling. It is a refrigeration technology that produces negative thermal resistance, characterized by no moving parts and relatively high reliability.

[0003] In the prior art, the structure of semiconductor refrigeration plates is basically a single group of TEC, without any auxiliary heating function, resulting in high power consumption during the conversion between hot and cold surfaces, low heat conduction of the substrate, and poor temperature control accuracy. Summary of the Invention

[0004] Based on this, it is necessary to provide a semiconductor refrigeration plate and refrigeration system to address the problems that the structure of the semiconductor refrigeration plate in the existing technology is basically a single group TEC, without any auxiliary heating function, resulting in high power consumption during the conversion between hot and cold surfaces, poor temperature control accuracy, and low thermal conductivity of the substrate.

[0005] A semiconductor refrigeration chip, comprising:

[0006] A cold plate and a hot plate are arranged opposite to each other, wherein the cold plate is provided with multiple groups of guide vanes;

[0007] A plurality of groups of PN-type semiconductor units are disposed on the plurality of groups of guide plates in a one-to-one correspondence and connected to the heat plate;

[0008] The plurality of lead-out electrode groups are connected to the plurality of PN-type semiconductor units in a one-to-one correspondence;

[0009] The heating component is arranged on the cold plate.

[0010] During actual use of the above-mentioned semiconductor refrigeration plate, the power supply is first connected to the heating component and the guide plate, and then the semiconductor refrigeration plate is installed at the position to be heated or cooled, through the cold plate, the hot plate, multiple groups of guide plates, multiple groups of lead-out electrode groups and multiple groups of PN-type semiconductor units, and the multiple groups of PN-type semiconductor units are arranged one-to-one on the multiple groups of guide plates and connected to the hot plate, and the multiple groups of lead-out electrode groups are connected one-to-one to the multiple groups of PN-type semiconductor units, thereby forming multiple groups of TEC units. The power supply is connected to the multiple groups of lead-out electrode groups to realize cold plate cooling of the multiple groups of TEC units, and the temperature control and temperature control rate can be controlled by powering part of the multiple groups of TEC units. A heating component is provided on the cold plate, so that auxiliary heating is realized during the temperature control process of the cold plate, reducing the conversion power between the cold plate and the hot plate, improving the temperature control accuracy, and improving heat conduction.

[0011] In one embodiment, the heating assembly includes multiple heating parts, which are arranged on the cold plate and located between the cold plate and the hot plate. The specific heating part can be a heating part or heating plate composed of multiple groups of connected wires, or it can be a mature heating tool in the prior art. The specific form will not be elaborated here.

[0012] In one embodiment, the heating component further includes multiple groups of connecting wires, which are connected to multiple heating parts one by one. The connecting wires are connected to the heating parts and led out, so that the power supply can be connected to the connecting wires to realize power supply.

[0013] In one embodiment, the heating component further includes multiple groups of heating electrode groups, multiple groups of the heating electrode groups, multiple groups of the connecting wires, and multiple heating parts corresponding one to one, one end of the connecting wire is connected to the heating electrode group, and the other end is connected to the heating part, and is led out through the connecting wire and connected to the heating electrode group, so that the power supply can be connected to the heating electrode group to realize power supply to the heating part.

[0014] In one embodiment, each group of connecting wires includes a first positive wire and a first negative wire, and the heating electrode group includes a first electrode piece and a second electrode piece;

[0015] One end of the first positive electrode wire is connected to the heating unit, and the other end is connected to the first electrode piece;

[0016] One end of the first negative electrode line is connected to the heating unit, and the other end is connected to the second electrode piece.

[0017] In this embodiment, the positive electrode of the power supply is connected to the first electrode piece, the negative electrode of the power supply is connected to the second electrode piece, one end of the first positive wire is connected to the heating unit, and the other end is connected to the first electrode piece. One end of the first negative wire is connected to the heating unit, and the other end is connected to the second electrode piece, so that a loop is formed between the power supply and the heating unit, thereby enabling power supply to the heating unit.

[0018] Specifically, the power supply can be controlled to supply power to some of the multiple heating parts, thereby achieving multi-level temperature control.

[0019] In one embodiment, the semiconductor refrigeration plate further includes multiple groups of lead wires, which correspond one to one with multiple groups of lead wires, multiple groups of PN-type semiconductor units, multiple groups of lead-out electrode groups and multiple groups of guide plates. One end of a group of the lead wires is connected to a corresponding group of the guide plates, and the other end is connected to a corresponding group of the lead-out electrode groups, so that the power supply can form a current loop through the lead wires, guide plates, PN-type semiconductor units, cold plates and hot plates, thereby realizing cold plate cooling and temperature control through the PN-type semiconductor units.

[0020] In one embodiment, each group of lead wires includes a second positive line and a second negative line, and the lead electrode group includes a third electrode piece and a fourth electrode piece;

[0021] One end of the second positive line is connected to the corresponding guide plate, and the other end is connected to the third electrode;

[0022] One end of the second negative electrode line is connected to the guide plate, and the other end is connected to the fourth electrode plate.

[0023] In this embodiment, the positive electrode of the power supply is connected to the third electrode piece, and the negative electrode of the power supply is connected to the fourth electrode piece, so that a current loop is formed among the third electrode piece, the fourth electrode piece, the second positive line, the second negative line, the guide plate, the PN-type semiconductor unit, the cold plate, and the hot plate, so that the PN-type semiconductor is powered by the power supply to realize cold plate cooling and temperature control through the PN-type semiconductor.

[0024] In one embodiment, the third electrode in one of the lead-out electrode groups is connected to the positive power supply, and the fourth electrode is connected to the negative power supply. In this embodiment, the positive power supply is connected to the second positive line, and the negative power supply is connected to the second negative line, thereby achieving cold plate cooling and temperature control.

[0025] In another embodiment, the third electrode in a group of the lead-out electrode groups is connected to the negative electrode of the power supply, and the fourth electrode is connected to the positive electrode of the power supply. In this embodiment, the positive electrode of the power supply is connected to the second negative electrode line, and the negative electrode of the power supply is connected to the second electrode line, thereby enabling heating and temperature control of a cold plate of a group of PN-type semiconductor units. That is, the positive and negative electrodes of the group of PN-type semiconductor units are reversed to achieve local heating of the cold plate corresponding to the group of PN-type semiconductor units. This allows the heating of the cold plate to be adjusted according to actual needs, thereby achieving precise temperature control.

[0026] In one embodiment, the cold plate is a silicon substrate, and the guide plate is etched on the cold plate.

[0027] This application enables the auxiliary heating circuit to be energized, allowing the TEC to achieve the required temperature rise with minimal power consumption. The cold plate in this application is made of silicon-based material, and multiple groups of guide plates connected in sequence by multiple PN-type semiconductor units are etched onto the cold plate. This high thermal conductivity improves the TEC's heat conversion efficiency, and etching can reduce the device's volume and increase heat generation per unit cold plate area.

[0028] An embodiment of the present application further provides a semiconductor refrigeration system, the semiconductor refrigeration system comprising: a power supply and the semiconductor refrigeration plate;

[0029] The power supply is connected to the lead-out electrode group and the heating component at the same time.

[0030] During actual use of the above-mentioned semiconductor refrigeration system, the power supply is first connected to the heating component and the guide plate, and then the semiconductor refrigeration plate is installed at the position to be heated or cooled. Through the cold plate, hot plate, multiple groups of guide plates, multiple groups of lead-out electrode groups and multiple groups of PN-type semiconductor units, and the multiple groups of PN-type semiconductor units are arranged one-to-one on the multiple groups of guide plates and connected to the hot plate, and the multiple groups of lead-out electrode groups are connected one-to-one to the multiple groups of PN-type semiconductor units, thereby forming multiple groups of TEC units. The power supply is connected to the multiple groups of lead-out electrode groups to realize cold plate cooling of the multiple groups of TEC units, and the temperature control and temperature control rate can be controlled by powering part of the multiple groups of TEC units. A heating component is provided on the cold plate, so that auxiliary heating is realized during the temperature control process of the cold plate, reducing the conversion power between the cold plate and the hot plate, improving the temperature control accuracy, and improving heat conduction. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a schematic structural diagram of a semiconductor refrigeration plate according to an embodiment.

[0032] Figure 2 for Figure 1 sectional view.

[0033] Figure 3 for Figure 1 Exploded diagram.

[0034] Description of Figure Numbers:

[0035] 10- semiconductor refrigeration chip;

[0036] 100-cold plate;

[0037] 200-hot plate;

[0038] 300-guide vane;

[0039] 400-PN type semiconductor unit; 410-P type semiconductor; 420-N type semiconductor;

[0040] 500-lead electrode group; 501-third electrode piece; 502-fourth electrode piece; 510-lead wire; 511-second positive electrode line; 512-second negative electrode line;

[0041] 600 - heating assembly; 610 - heating unit; 620 - connecting line; 621 - first positive line; 622 - first negative line; 630 - heating electrode group; 631 - first electrode piece; 632 - second electrode piece;

[0042] 700-Solder paste;

[0043] OX-first direction; OY-second direction. DETAILED DESCRIPTION

[0044] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0045] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0046] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0047] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0048] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0049] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0050] See Figure 1 , Figure 1 A structural schematic diagram of a semiconductor refrigeration plate 10 in an embodiment of the present application is shown. The semiconductor refrigeration plate 10 provided in an embodiment of the present application includes: a cold plate 100, a hot plate 200, multiple groups of PN-type semiconductor units 400, multiple groups of lead-out electrode groups 500 and a heating component 600.

[0051] See Figure 1 and Figure 2 In the semiconductor refrigeration unit 10, a cold plate 100 and a hot plate 200 are disposed opposite each other. The cold plate 100 is provided with multiple sets of guide vanes 300. Multiple sets of PN-type semiconductor units 400 are disposed one-to-one with the multiple sets of guide vanes 300 and connected to the hot plate 200. Multiple sets of lead-out electrode assemblies 500 are connected one-to-one with the multiple sets of PN-type semiconductor units 400. A heating assembly 600 is disposed on the cold plate 100.

[0052] In actual use of the semiconductor refrigeration sheet 10, first connect the power supply to the heating component 600 and the guide plate 300, then install the semiconductor refrigeration sheet 10 at the position to be heated or cooled, and then connect the power supply to the heating component 600 and the guide plate 300. Then, connect the power supply to the heating component 600 and the guide plate 300, and then install the semiconductor refrigeration sheet 10 at the position to be heated or cooled. Then, connect the power supply to the heating component 600 and the guide plate 300, and then install the semiconductor refrigeration sheet 10 at the position to be heated or cooled, and then connect the power supply to the heating component 600 and the guide plate 300. Then, connect the power supply to the heating component 600 and the guide plate 300, and then install the semiconductor refrigeration sheet 10 at the position to be heated or cooled ... The ground is connected to multiple groups of PN-type semiconductor units 400 to form multiple groups of TEC units. The power supply is connected to multiple groups of lead-out electrode groups 500 to realize cooling of the cold plate 100 of the multiple groups of TEC units. The temperature control and the temperature control rate can be controlled by supplying power to part of the multiple groups of TEC units. A heating component 600 is provided on the cold plate 100 to realize auxiliary heating during the temperature control process of the cold plate 100, thereby reducing the conversion power between the cold plate 100 and the hot plate 200, improving the temperature control accuracy, and improving heat conduction.

[0053] See Figure 1 and Figure 2 In one embodiment, the heating assembly 600 includes a plurality of heating parts 610. The heating parts 610 are arranged on the cold plate 100 and located between the cold plate 100 and the hot plate 200. The specific heating parts 610 can be a heating part 610 or a heating plate composed of multiple groups of connected wires, or a mature heating tool in the prior art. The specific form will not be repeated here.

[0054] See Figure 1 and Figure 2 In one embodiment, the heating component 600 further includes a plurality of connecting wires 620, which are connected to the plurality of heating parts 610 one by one. The connecting wires 620 are connected to the heating parts 610 and led out, so that the power supply can be connected to the connecting wires 620 to realize power supply.

[0055] See Figure 1 and Figure 2In one embodiment, the heating component 600 further includes a plurality of heating electrode groups 630, which correspond one to one with the plurality of heating electrode groups 630, the plurality of connecting wires 620, and the plurality of heating parts 610. One end of the connecting wire 620 is connected to the heating electrode group 630, and the other end is connected to the heating part 610. The connecting wire 620 is led out and connected to the heating electrode group 630, so that the power supply can be connected to the heating electrode group 630 to realize power supply to the heating part 610.

[0056] See Figure 1 and Figure 2 In one embodiment, each set of connecting wires 620 includes a first positive wire 621 and a first negative wire 622, and the heating electrode set 630 includes a first electrode piece 631 and a second electrode piece 632. One end of the first positive wire 621 is connected to the heating unit 610, and the other end is connected to the first electrode piece 631. One end of the first negative wire 622 is connected to the heating unit 610, and the other end is connected to the second electrode piece 632.

[0057] In this embodiment, the positive electrode of the power supply is connected to the first electrode piece 631, the negative electrode of the power supply is connected to the second electrode piece 632, one end of the first positive line 621 is connected to the heating unit 610, and the other end is connected to the first electrode piece 631. One end of the first negative line 622 is connected to the heating unit 610, and the other end is connected to the second electrode piece 632, thereby forming a loop between the power supply and the heating unit 610, thereby enabling power supply to the heating unit 610.

[0058] Specifically, the power supply may be controlled to supply power to some of the heating parts 610 among the plurality of heating parts 610 , thereby achieving multi-stage temperature control.

[0059] See Figure 1 and Figure 2 In one embodiment, the semiconductor refrigeration plate 10 further includes a plurality of groups of lead wires 510, and the plurality of groups of lead wires 510, the plurality of groups of PN-type semiconductor units 400, the plurality of groups of lead-out electrode groups 500, and the plurality of groups of guide plates 300 correspond one to one. One end of a group of lead wires 510 is connected to a corresponding group of guide plates 300, and the other end is connected to a corresponding group of lead-out electrode groups 500, so that the power supply can form a current loop among the lead wires 510, the guide plates 300, the PN-type semiconductor units 400, the cold plate 100, and the hot plate 200, thereby realizing cooling and temperature control of the cold plate 100 through the PN-type semiconductor units 400.

[0060] See Figure 1 and Figure 2In one embodiment, each set of lead wires 510 includes a second positive line 511 and a second negative line 512, and the lead electrode group 500 includes a third electrode piece 501 and a fourth electrode piece 502. One end of the second positive line 511 is connected to the corresponding guide plate 300, and the other end is connected to the third electrode piece 501. One end of the second negative line 512 is connected to the guide plate 300, and the other end is connected to the fourth electrode piece 502.

[0061] In this embodiment, the positive electrode of the power supply is connected to the third electrode 501, and the negative electrode of the power supply is connected to the fourth electrode 502, so that a current loop is formed among the third electrode 501, the fourth electrode 502, the second positive line 511, the second negative line 512, the guide plate 300, the PN-type semiconductor unit 400, the cold plate 100, and the hot plate 200, so that the PN-type semiconductor 420 is powered by the power supply to achieve cooling and temperature control of the cold plate 100 through the PN-type semiconductor 420.

[0062] See Figure 1 and Figure 2 In one embodiment, the third electrode 501 of a lead electrode assembly 500 is connected to the positive power supply, and the fourth electrode 502 is connected to the negative power supply. In this embodiment, the positive power supply is connected to the second positive line 511, and the negative power supply is connected to the second negative line 512, thereby achieving cooling and temperature control of the cold plate 100.

[0063] In another embodiment, the third electrode 501 in a group of lead-out electrode groups 500 is connected to the negative electrode of the power supply, and the fourth electrode 502 is connected to the positive electrode of the power supply. In this embodiment, the positive electrode of the power supply is connected to the second negative electrode line 512, and the negative electrode of the power supply is connected to the second electrode line, thereby enabling heating and temperature control of the cold plate 100 of a group of PN-type semiconductor units 400. That is, the positive and negative electrodes of the group of PN-type semiconductor units 400 are reversed to achieve heating of the local area of ​​the cold plate 100 corresponding to the group of PN-type semiconductor units 400. This allows the heating of the cold plate 100 to be adjusted according to actual needs, thereby achieving precise temperature control.

[0064] Specifically, a guide plate 300 is etched on one side of the cold plate 100 close to the hot plate 200, one end of a P-type semiconductor 410 is connected to one end of the guide plate 300, and the other end of the P-type semiconductor 410 is connected to the hot surface, one end of an N-type semiconductor 420 is connected to the other end of the guide plate 300, and the other end of the N-type semiconductor 420 is connected to the hot surface, and then multiple guide plates 300 are arranged in a certain direction in sequence, so that multiple PN-type semiconductors 420 are connected in series, and the guide plate 300 at one end of the multiple guide plates 300 is connected to the anode of the power supply, and the guide plate 300 at the other end is connected to the cathode of the power supply.

[0065] Specifically, in another embodiment, one guide plate 300 is etched on one side of the cold plate 100 close to the hot plate 200, and another guide plate 300 is etched on one side of the hot plate 200 close to the cold plate 100. A P-type semiconductor 410 and an N-type semiconductor 420 are connected between the two guide plates 300. Subsequently, multiple guide plates 300 are arranged in sequence along a certain direction, so that multiple N-type semiconductors 420 and multiple P-type semiconductors 410 are connected in series. The guide plate 300 at one end of the multiple guide plates 300 is connected to the anode of the power supply, and the guide plate 300 at the other end is connected to the cathode of the power supply. The guide plate 300 can also be a whole piece.

[0066] In one embodiment, the cold plate 100 is a silicon substrate, and the guide plate 300 is etched on the cold plate 100 .

[0067] See Figure 1 and Figure 3 Specifically, in another embodiment, a guide plate 300 is also etched on a side of the hot plate 200 close to the cold plate 100. The guide plate 300 is connected to the N-type semiconductor 420 via solder paste 700, and the guide plate 300 is connected to the P-type semiconductor 410 via solder paste 700.

[0068] This application enables the auxiliary heating circuit to be energized, allowing the TEC to achieve the required temperature rise with minimal power consumption. The cold plate 100 in this application is made of silicon-based material, and multiple groups of guide plates 300, each connected to multiple groups of PN-type semiconductor units 400, are etched onto the cold plate 100. This high thermal conductivity improves the TEC's heat conversion efficiency, and etching can reduce the device's size, increasing heat generation per unit area of ​​the cold plate 100.

[0069] In the present application, the cold plate 100 and the hot plate 200 are both square. In other embodiments, the cold plate 100 and the hot plate 200 may also be rectangular or circular, and the specific form is not limited.

[0070] In the present application, two heating electrode groups 630 are respectively provided on both sides of the hot plate 200 along the first direction OX, one heating electrode group 630 is respectively provided on both sides along the second direction OY, and two lead electrode groups 500 are respectively provided on both sides along the second direction OY, with one heating electrode group 630 on the same side being located between the two lead electrode groups 500. Alternatively, one heating electrode group 630 may be provided between the third electrode piece 501 and the fourth electrode piece 502. Specifically, the arrangement is not limited herein.

[0071] An embodiment of the present application further provides a semiconductor refrigeration system, which includes a power supply (not shown) and a semiconductor refrigeration sheet 10. The power supply is connected to both the lead-out electrode group 500 and the heating assembly 600.

[0072] In actual use of the semiconductor refrigeration system, the power supply is first connected to the heating component 600 and the guide plate 300, and then the semiconductor refrigeration plate 10 is installed at the position to be heated or cooled, and the plurality of PN-type semiconductor units 400 are arranged on the plurality of guide plates 300 and connected to the hot plate 200, and the plurality of lead-out electrode groups 500 are arranged on the plurality of guide plates 300 and connected to the hot plate 200. The ground is connected to multiple groups of PN-type semiconductor units 400 to form multiple groups of TEC units. The power supply is connected to multiple groups of lead-out electrode groups 500 to realize cooling of the cold plate 100 of the multiple groups of TEC units. The temperature control and the temperature control rate can be controlled by supplying power to part of the multiple groups of TEC units. A heating component 600 is provided on the cold plate 100 to realize auxiliary heating during the temperature control process of the cold plate 100, thereby reducing the conversion power between the cold plate 100 and the hot plate 200, improving the temperature control accuracy, and improving heat conduction.

[0073] Specifically, the semiconductor refrigeration system can also include multiple semiconductor refrigeration plates 10 and a control unit. The control unit is connected to the power supply to control the power supply to selectively supply power to the heating component 600 and the guide plate 300 in the semiconductor refrigeration plate 10, thereby achieving systematic temperature control.

[0074] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0075] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A semiconductor refrigeration sheet, characterized in that: The semiconductor refrigeration sheet comprises: A cold plate and a hot plate are arranged opposite to each other, and a plurality of guide plates are arranged on the cold plate; A plurality of groups of PN-type semiconductor units are disposed on the plurality of groups of guide plates in a one-to-one correspondence and connected to the heat plate; The plurality of lead-out electrode groups are connected to the plurality of PN-type semiconductor units in a one-to-one correspondence; The heating component is arranged on the cold plate.

2. The semiconductor refrigeration sheet according to claim 1, characterized in that: The heating assembly includes a plurality of heating parts, and the heating parts are arranged on the cold plate and located between the cold plate and the hot plate.

3. The semiconductor refrigeration sheet according to claim 2, characterized in that: The heating assembly further includes a plurality of groups of connecting wires, which are connected to the plurality of heating parts in a one-to-one correspondence.

4. The semiconductor refrigeration sheet according to claim 3, characterized in that: The heating assembly also includes multiple groups of heating electrode groups, which correspond to each other one by one. One end of the connecting wire is connected to the heating electrode group, and the other end is connected to the heating part.

5. The semiconductor refrigeration sheet according to claim 4, characterized in that: Each group of connecting wires includes a first positive wire and a first negative wire, and the heating electrode group includes a first electrode piece and a second electrode piece; One end of the first positive electrode wire is connected to the heating unit, and the other end is connected to the first electrode piece; One end of the first negative electrode line is connected to the heating unit, and the other end is connected to the second electrode piece.

6. The semiconductor refrigeration sheet according to claim 1, characterized in that: The semiconductor refrigeration plate also includes multiple groups of lead wires, which correspond one to one with multiple groups of PN-type semiconductor units, multiple groups of lead pole groups and multiple groups of guide plates. One end of a group of lead wires is connected to a corresponding group of guide plates, and the other end is connected to a corresponding group of lead pole groups.

7. The semiconductor refrigeration sheet according to claim 6, characterized in that: Each group of lead wires includes a second positive electrode line and a second negative electrode line, and the lead electrode group includes a third electrode piece and a fourth electrode piece; One end of the second positive line is connected to the corresponding guide plate, and the other end is connected to the third electrode; One end of the second negative electrode line is connected to the guide plate, and the other end is connected to the fourth electrode plate.

8. The semiconductor refrigeration sheet according to claim 7, characterized in that: The third electrode in one set of the lead-out electrode groups is connected to the positive electrode of the power supply, and the fourth electrode is connected to the negative electrode of the power supply; or The third electrode in one group of the lead-out electrode groups is connected to the negative electrode of the power supply, and the fourth electrode is connected to the positive electrode of the power supply.

9. The semiconductor refrigeration sheet according to claim 1, characterized in that: The cold plate is a silicon substrate, and the guide plate is etched on the cold plate.

10. A semiconductor refrigeration system, characterized in that: The semiconductor refrigeration system comprises: a power supply and a plurality of semiconductor refrigeration sheets according to any one of claims 1 to 9; The power supply is connected to the lead-out electrode group and the heating component at the same time.

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