Chip frame punching device with material suction mechanism

Abstract

The embodiment of the invention provides a chip frame punching device with a material suction mechanism, and relates to the technical field of punching devices. A chip frame punching device with a material suction mechanism is characterized in that a rotating arm capable of rotating with a rotating frame as the axis is arranged in the area between a bottom die and an upper die, one end of the rotating frame is fixedly connected with the front face of a punching table, and the end, away from the rotating frame, of the rotating arm is coaxially connected with a material receiving table; meanwhile, a plurality of adsorption holes are formed in the upper surface of the material receiving table, a first gear arranged on the peripheral face of the rotating pipe is connected with a gear ring fixed to the surface of the punching table in a meshed mode, and after chip punching is completed, the motor drives the rotating arm to rotate through a worm and a worm gear, so that the material receiving table is moved to the position below the downward pressing piece. And then, the motor rotates reversely to drive the rotating arm and the material receiving table to rotate, and the material receiving table is turned over by a certain degree under the action of the first gear and the gear ring. And finally, the second air suction pump stops working, the chip falls into the discharging table, and automatic chip transfer is completed.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of punching devices, in particular to a chip frame punching device with a material suction mechanism. BACKGROUND

[0002] As a carrier of integrated circuit chips, the chip frame forms an electrical circuit by electrically connecting the internal circuit lead-out end of the chip with the external lead wire, and plays a role as a bridge connecting the external lead wire. The chip frame, as the basis for carrying the chip, is generally conveyed by a taping machine during production, and then punched away from the chip frame.

[0003] In the prior art (patent application with the patent name of a punching device for copper clamp plate production and the publication number CN115971326B), a lifting mechanism, an air suction mechanism, and a synchronous clamping mechanism are included, and the air suction mechanism includes a piston tube, a piston plate, a connecting plate, a stroke adjusting seat, and a conical connecting pipe. In the process of implementing this technical solution, it is found that at least the following problems exist in the prior art.

[0004] The above punching device meets the production requirements to some extent, but still has some shortcomings in actual application. When the chip needs to be punched, the chip frame is punched by the mutual movement of the upper and lower molds. After the punching is completed, the chip stays on the mold for the operator to take it out. This way not only increases the labor cost, but also may cause unstable product quality due to human factors. SUMMARY

[0005] The present application aims to at least solve one of the technical problems of chip punching and transfer in the prior art. To this end, the present application proposes a chip frame punching device with a material suction mechanism.

[0006] To achieve the above-mentioned purpose, the specific technical solution of the present application is as follows: a chip frame punching device with a material suction mechanism, comprising a base, a bottom die and an upper die on the base for punching chips, a rotating arm capable of rotating with the rotating frame as the axis is arranged in the region between the bottom die and the upper die, one end of the rotating frame is fixedly connected with the front surface of the punching table, the rotating arm at the end away from the rotating frame is coaxially connected with a material receiving table, a plurality of suction holes are arranged on the upper surface of the material receiving table, a rotating pipe extends from the end of the material receiving table towards the rotating arm, and a gear one arranged on the outer circumferential surface of the rotating pipe is meshingly connected with a tooth ring fixed on the surface of the punching table.

[0007] Preferably, a lower pressing plate is arranged on the upper surface of the bottom die in vertical displacement, guide columns at the four corners of the bottom surface of the lower pressing plate are arranged in the bottom die, springs one are sleeved on the outer circumferential surface of the guide columns for rebounding, and a material guiding table is fixed in the transverse region through which the material belt passes along the lower pressing plate.

[0008] Preferably, the rotating arm is fixed with a worm wheel on the outer circumferential surface of the rotating shaft, and a worm is engaged and connected on one side of the outer circumferential surface of the worm wheel, and the rotation of the worm is driven by a motor connected at one end, and the motor is fixed and supported by a support fixedly connected with the base, and the surface of the base is also fixed with a suction pump two, and the suction end of the suction pump two is connected with the bottom surface of the rotating arm through the air pipe two, and a discharging table is arranged in the discharging area of the rotating arm, and the discharging table is fixedly connected with the surface of the base.

[0009] Preferably, the bottom surface of the receiving table is fixed with two racks respectively, and the racks drive the gear two on the upper surface of the guide table after the rotating arm rotates.

[0010] Preferably, the surface of the guide table is connected with a pressing strip in a threaded driving manner, and the pressing strip extends a protrusion towards the threaded rod on one side of the surface, and the protrusion is threadedly connected with the threaded rod through the threaded hole penetrating the surface.

[0011] Preferably, the lifting blocks at the two ends of the pressing strip are arranged on the same side of the protrusion, the lifting blocks are arranged in the guide table in a sliding manner, and the pressing blocks for pressing the material belt are equidistantly distributed from one end of the bottom surface of the pressing strip.

[0012] Preferably, one end of the discharging table is hingedly connected with a turnover table capable of being turned over, one side of the hinge connection of the turnover table is fixedly connected with a gear three, a rotating shaft support is fixed on one side of the bottom surface of the discharging table, one end of the rotating shaft support is penetrated by a rotating shaft, one end of the rotating shaft on the same side of the gear three is fixedly connected with a gear four, and the gear four is engaged and connected with the gear three.

[0013] Preferably, the outer circumferential surface of the rotating shaft is fixed with a gear five on both sides, and a rack two for driving the rotation of the gear five is also engaged and connected above the gear five, and the other end of the rack two is fixedly connected with a push plate.

[0014] Preferably, the surface of the push plate is coaxially provided with a piston rod for driving displacement of the push plate, one end of the piston rod is coaxially sleeved with a pressurizing pipe, and the surface of the pressurizing pipe is fixedly connected with the surface of the base.

[0015] Preferably, the bottom surface of the worm wheel is fixed with a push block on one side away from the center, and the push block and the piston rod are connected through a push rod for power transmission.

[0016] The chip frame punching device with the material suction mechanism has the following advantages: 1. The chip frame punching device with a material suction mechanism, after the chip punching is completed, the motor drives the rotating arm to rotate through the worm and worm gear, so that the material receiving table moves to the lower side of the lower pressing part. At this time, the suction pump two starts to adsorb the chip, and the suction pump one stops working. Then, the motor reverses rotation, drives the rotating arm and the material receiving table to rotate, and through the action of gear one and the gear ring, the material receiving table is flipped. Finally, the suction pump two stops working, and the chip falls into the discharging table, completing the automatic chip transfer.

[0017] 2. The chip frame punching device with a material suction mechanism, after the chip punching is completed, the upper die moves up, and the rotating arm rotates around the shaft. During this process, the rack at the bottom of the material receiving table drives gear two to rotate, and in turn drives the threaded rod connected thereto to rotate synchronously. Since the threaded rod is screwed with the lower pressing strip, the rotation of the threaded rod promotes the upward movement of the lower pressing strip. This step provides space for the winding of the material belt. After the material belt is wound and fed, the rotating arm reverses rotation, causing the lower pressing strip to move downward again, thereby applying pressure to the material belt again, realizing the fixation of the material belt, and preparing for the next punching operation.

[0018] 3. The chip frame punching device with a material suction mechanism, when the material receiving table is located between the upper die and the bottom die, the material flipping table is in an inclined state, so that the chips on it can slide down to the discharging table, which guides them to the next processing area. Once the material receiving table completes the pickup of the chips and starts to rotate towards the discharging table below, the push block below the worm gear pushes the push rod. The movement of the push rod drives gear five through the rack two on it, and gear five meshes with gear four, further driving gear three. This series of actions eventually makes the originally inclined material flipping table become horizontal, facilitating the reception of the chips falling from the material receiving table. Subsequently, the material flipping table is flipped again, allowing the chips to smoothly slide down to the discharging table, completing the automatic transmission process of the chips. This mechanism effectively improves the degree of automation and efficiency of chip processing.

[0019] 4. The chip frame punching device with a material suction mechanism, when the rotating arm moves from between the upper die and the bottom die to the direction of the discharging table below, the piston rod extrudes the space in the pressurizing pipe, causing the gas in the pressurizing pipe to enter the inflation membrane through the air pipe three, making it inflate. The inflated inflation membrane acts as a buffer, which can effectively reduce the impact force of the chips adsorbed on the material receiving table when they fall on the material flipping table, protecting the chips from damage. At the same time, as the material flipping table flips upward, the rotation of gear four drives the eccentric block on its surface to vibrate. This vibration helps to accelerate the sliding of the chips from the material flipping table to the discharging table below, and promotes the rapid sliding transfer of the chips on the surface of the discharging table. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some of the embodiments of the present application, and therefore should not be considered as a limitation to the scope, and for those of ordinary skill in the art, other related drawings can also be obtained without creative labor.

[0021] Figure 1 It is a schematic diagram of the overall structure of the present application. Figure 2 It is a schematic diagram of the upper die structure of the present application. Figure 3 It is a schematic diagram of the bottom die structure of the present application. Figure 4 It is a schematic diagram of the punching mechanism top view structure of the present application. Figure 5 It is a schematic diagram of the present application along Figure 4 the A-A section. Figure 6 It is a schematic diagram of the blanking table structure of the present application. Figure 7 It is a schematic diagram of the rotating arm structure of the present application. Figure 8 It is a schematic diagram of the rotating arm top view structure of the present application. Figure 9 It is a schematic diagram of the present application along Figure 8 the B-B section. Figure 10 It is a schematic diagram of the rotating arm bottom view structure of the present application. Figure 11 It is a schematic diagram of the material guiding table structure of the present application. Figure 12 It is a schematic diagram of the material turning table structure of the present application. Figure 13 It is a schematic diagram of the material turning table bottom view structure of the present application. Figure 14 It is a schematic diagram of the material turning table top view structure of the present application. Figure 15 It is a schematic diagram of the present application along Figure 14 the C-C section. Figure 16 It is a schematic diagram of the Figure 15 B section of the present application.

[0022] Explanation of the markings in the figure: 1. Base; 11. Punching mechanism; 12. Punching table; 13. Upper die; 131. Lower pressure piece; 14. Bottom die; 141. Lower pressure plate; 142. Spring 1; 143. Material guide table; 15. Air pipe 1; 151. Suction pump 1; 16. Suction head; 161. Pneumatic telescopic member; 17. Lower pressure strip; 171. Lower pressure block; 172. Bump; 173. Lifting block; 18. Threaded rod; 181. Gear 2; 19. Gear ring; 2. Unloading table; 21. Turning table; 211. Gear 3; 212. Expansion Expanding film; 213, rotating shaft frame; 3, rotating frame; 31, rotating arm; 311, receiving platform; 312, gear one; 313, rotating tube; 314, limiting block; 315, rack; 316, adsorption hole; 32, motor; 321, worm; 322, push block; 33, worm gear; 34, air pipe two; 341, suction pump two; 4, push rod; 41, pressurizing tube; 411, air pipe three; 42, piston rod; 43, push plate; 431, rack two; 5, rotating shaft; 51, gear four; 511, eccentric block; 52, gear five. DETAILED DESCRIPTION

[0023] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0024] like Figures 1-2 As shown, a chip frame punching device with a suction mechanism of the present invention is composed of a base 1, a punching mechanism 11, a punching table 12 and a feeding table 2. A punching mechanism 11 for punching chips is fixed to one side of the top of the base 1. The punching mechanism 11 can be a hydraulic punching machine, and a punching table 12 is formed on the upper surface of the base 1 below the punching mechanism 11. The punching table 12 can provide an operating plane for punching chips, and the receiving machines on both sides of the base 1 feed and receive the chips in strip form.

[0025] like Figures 3-5 As shown, a bottom mold 14 is fixed on the upper surface of the base 1 directly below the punching mechanism 11. At the same time, a tool for punching is also provided on the bottom mold 14. An upper mold 13 is fixed at the telescopic end of the punching mechanism 11. After the upper mold 13 moves downward with the punching mechanism 11, the chips on the material strip can be punched by the tool.

[0026] A lower pressure plate 141 is relatively provided along the upper surface of the bottom mold 14 for vertical displacement in the longitudinal direction. At the same time, the guide columns at the four corners of the bottom surface of the lower pressure plate 141 are placed inside the bottom mold 14, so that the lower pressure plate 141 can be displaced up and down, and a spring 142 for rebound is provided on the outer periphery of the guide column.

[0027] The transverse area where the material tape passes along the lower pressing plate 141 is fixed with a material guide table 143, the width of the material guide table 143 is adapted to the width of the passing material tape, one end of the lower pressing piece 131 for lower positioning is fixed to the bottom of the upper die 13, the bottom of the lower pressing piece 131 is provided in an open structure to enable the cutter to punch the chip. The suction head 16 for sucking the punched chip is arranged inside the lower pressing piece 131, and the bottom of the suction head 16 is flush with the bottom of the lower pressing piece 131, and the suction head 16 moves up and down through the pneumatic telescopic piece 161 on both sides. The air pipe 15 extends to the base 1 from the top of the suction head 16, and one end of the air pipe 15 is connected to the suction end of the air pump 151 on the surface of the base 1. That is, when the chip frame material tape needs to be punched, at this time, the material tape is wound by the material collecting machine on one side of the material guide table 143 after passing through the material guide table 143, and after the punching mechanism 11 moves downward, the lower pressing piece 131 presses the material tape downward, and after the punching mechanism 11 continuously moves downward, the cutter on the bottom die 14 is lifted up, and after the suction head 16 moves upward, the chip can be punched downward, and then the air pump 151 can suck the chip, and the chip can be synchronized with the movement of the upper die 13.

[0028] As shown in Figures 5-9 The area between the bottom die 14 and the upper die 13 is provided with a rotating arm 31 which can rotate around the rotating frame 3 as the axis, and one end of the rotating frame 3 is fixedly connected to the front of the punching table 12, and after the rotating arm 31 rotates, the chip sucked by the suction head 16 can be received.

[0029] One end of the rotating arm 31 away from the rotating frame 3 is provided with a hole, and a rotatable material receiving table 311 is arranged coaxially through the hole, and one end of the rotating pipe 313 extending from the material receiving table 311 to the rotating arm 31 is inserted into the hole. The rotating arm 31 and the material receiving table 311 are in communication with the inside of the rotating arm 31. Meanwhile, a plurality of suction holes 316 are arranged on the upper surface of the material receiving table 311, and the chip dropped by the suction head 16 is sucked through the suction holes 316.

[0030] The worm gear 33 is fixed to the outer periphery of the rotating arm 31 as the rotating shaft, and the worm gear 321 is engaged and connected to one side of the outer periphery of the worm gear 33, and the rotation of the worm gear 321 is driven by the motor 32 connected at one end, and the motor 32 is fixedly supported by the bracket fixedly connected to the base 1.

[0031] The air pump 341 is also fixed to the surface of the base 1, and the suction end of the air pump 341 is connected to the bottom surface of the rotating arm 31 through the air pipe 34.

[0032] The upper end of the limiting block 314 is located in the semicircular guiding groove on the inner wall of the hole. Then the receiving table 311 can only rotate 180 degrees. The gear 312 on the outer wall of the rotating pipe 313 is connected with the tooth ring 19 fixed on the surface of the punching table 12. The unloading table 2 is arranged in the area where the rotating arm 31 rotates. The unloading table 2 is fixedly connected with the surface of the base 1. Therefore, after the chip is punched, the motor 32 is operated, and then the worm 321 at the output end of the motor 32 drives the worm wheel 33 to rotate. Under the rotation of the worm wheel 33, the rotating arm 31 rotates 90 degrees, so that the upper surface of the receiving table 311 can move to the lower side of the pressing part 131. After the suction pump 341 is operated and adsorbed, the suction pump 151 stops running, and the chip adsorbed below the suction head 16 can be adsorbed by the receiving table 311. Then the motor 32 reverses, so that the rotating arm 31 can rotate 90 degrees in the opposite direction. During the reverse rotation of the rotating arm 31, the gear 312 is driven by the tooth ring 19. Then the receiving table 311 is turned 180 degrees. After the rotating arm 31 stops rotating and the suction pump 341 stops adsorbing, the chip adsorbed by the receiving table 311 can fall to the unloading table 2 for unloading.

[0033] As shown in Figures 10-11 Two racks 315 are fixed on the bottom surface of the receiving table 311. When the rotating arm 31 rotates, the racks 315 drive the gear 181 on the upper surface of the guide table 143. The screw rod 18 extending from the bottom surface of the gear 181 to the inside of the guide table 143 can rotate. When the rotating arm 31 rotates around the shaft, the racks 315 can drive the gear 181. When the gear 181 rotates, the screw rod 18 below the gear 181 can rotate.

[0034] Meanwhile, the lower pressing strip 17 is connected to the surface of the two opposite material guiding tables 143 in a threaded driving manner, the surface of the lower pressing strip 17 extends towards the threaded rod 18 in one side, and the threaded hole is provided through the surface of the protrusion 172, and the threaded rod 18 is threaded connected with the threaded hole, so that the lower pressing strip 17 threaded connected with the threaded rod 18 can be displaced up and down after the threaded rod 18 is rotated forward or reversely. The lifting block 173 near the two side ends of the lower pressing strip 17 is arranged on the same side of the protrusion 172, and the lifting block 173 is arranged in the interior of the material guiding table 143 in a sliding manner, so that the lower pressing strip 17 can be displaced up and down, and the lower pressing block 171 for pressing the material belt is distributed equidistantly from the bottom surface of the lower pressing strip 17. Therefore, after the chip is punched and cut, the upper die 13 moves upward, the rack 315 provided on the bottom surface of the material receiving table 311 drives the gear two 181 to rotate after the rotating arm 31 rotates around the shaft, the threaded rod 18 provided below rotates after the gear two 181 rotates, the lower pressing strip 17 threaded connected with the threaded rod 18 is displaced upward, and then the material belt is wound to be supplied, and the lower pressing strip 17 is pressed downward again to punch and cut the material belt after the rotating arm 31 reversely rotates.

[0035] As shown in Figure 9 and Figures 12-16 , the material receiving table 21 is hinged to one end of the material receiving table 2, and the gear three 211 is fixed to one side of the hinge of the material receiving table 21, and the gear three 211 is rotated after the material receiving table 21 is rotated, and the gear four 51 is fixed to one end of the rotating shaft 5 on the same side of the gear three 211, and the gear four 51 is meshed and connected with the gear three 211.

[0036] The gear five 52 is fixed to both sides of the outer circumferential surface of the rotating shaft 5, and the gear five 52 is meshed and connected with the rack two 431 for driving the rotation of the gear five 52, the other end of the rack two 431 is fixed with the push plate 43, the piston rod 42 is coaxially arranged on the surface of the push plate 43, one end of the piston rod 42 is coaxially sleeved with the pressurizing pipe 41, and the surface of the pressurizing pipe 41 is fixedly connected with the surface of the base 1, so that the piston rod 42 can be extended and retracted in the interior of the pressurizing pipe 41.

[0037] When the worm gear 33 is rotated, the push block 322 below the worm gear 33 pushes the push rod 4. As the push rod 4 moves, the rack 2 431 on the push rod 4 drives the gear 5 52, and then the gear 4 51 engages and drives the gear 3 211 above. Then, the tilted turning platform 21 can be horizontal to facilitate receiving the chips dropped from the receiving platform 311. Then, the chips can slide down when the turning platform 21 is turned.

[0038] like Figure 16 As shown, after the chip is transferred by the receiving platform 311, it falls onto the turning platform 21. Due to the height difference, the chip is easily damaged after falling onto the turning platform 21. The receiving surface of the turning platform 21 is covered with an expansion membrane 212. An air pipe 3 411 is connected from one end of the pressure pipe 41 to the bottom surface of the turning platform 21. At the same time, an eccentric block 511 is fixed to the surface of the gear 4 51, away from the center of the gear 4 51. Therefore, after the rotating arm 31 moves from between the upper mold 13 and the bottom mold 14 toward the lower material platform 2, the piston rod 42 squeezes the internal space of the pressure tube 41, and then the gas inside the pressure tube 41 can expand the expansion membrane 212 through the air pipe three 411, so that the chip adsorbed by the receiving platform 311 can be buffered by the expansion membrane 212. At the same time, when the turning table 21 flips upward, as the gear four 51 rotates, the eccentric block 511 on the surface of the gear four 51 vibrates, thereby enabling the chip to slide from the turning table 21 toward the lower material platform 2 and accelerate the sliding transfer of the chip on the surface of the lower material platform 2.

[0039] Working principle of a chip frame punching device with a suction mechanism: After the chip is punched, the motor 32 is operated, and then the worm 321 at the output end of the motor 32 drives the worm gear 33 to rotate. Under the rotation of the worm gear 33, the rotating arm 31 rotates by ninety degrees, so that the upper surface of the receiving table 311 can move to the lower side of the lower pressing piece 131. After the suction pump two 341 is operated to adsorb and the suction pump one 151 stops operating, the chips adsorbed below the suction head 16 can be adsorbed by the receiving table 311. Then the motor 32 reverses rotation, so that the rotating arm 31 can rotate by ninety degrees in the reverse direction. During the reverse rotation of the rotating arm 31 by ninety degrees, the gear one 312 is driven by the gear ring 19, and then the receiving table 311 is turned by one hundred and eighty degrees. After the rotating arm 31 stops rotating and the suction pump two 341 stops adsorbing, the chips adsorbed by the receiving table 311 can fall to the discharging table 2 for discharging. After the chip is punched and the upper die 13 moves upward, the rotating arm 31 rotates after the shaft center as the shaft, and then the rack 315 provided at the bottom surface of the receiving table 311 can drive the gear two 181 to rotate. After the gear two 181 rotates, the threaded rod 18 provided below can rotate together. After the threaded rod 18 rotates, the lower pressing strip 17 connected with the threaded rod 18 can displace upward. Then the material belt is wound for feeding. After the feeding is completed, the rotating arm 31 reverses rotation, so that the lower pressing strip 17 can press downward again to punch and limit the material belt. When the receiving table 311 is located between the upper die 13 and the bottom die 14, the material turning table 21 is in a turning and tilting state, so that the chips above the material turning table 21 can slide to the discharging table 2. Then the chips slide to the next processing area through the discharging table 2. After the receiving table 311 rotates to the discharging table 2 after completing receiving, the push block 322 below the worm gear 33 pushes the push rod 4. After the push rod 4 displaces, the rack two 431 on the push rod 4 can drive the gear five 52. Then the gear four 51 engages to drive the gear three 211 above, so that the material turning table 21 in a tilting state can be horizontal to facilitate receiving the chips dropped by the receiving table 311. Then the material turning table 21 turns to make the chips slide. After the rotating arm 31 moves from between the upper die 13 and the bottom die 14 to the discharging table 2, the piston rod 42 extrudes the space inside the pressurizing pipe 41. Then the gas inside the pressurizing pipe 41 can make the inflation film 212 inflate through the air pipe three 411, so that the chips adsorbed by the receiving table 311 can be buffered by the inflation film 212. At the same time, when the material turning table 21 turns upward, the eccentric block 511 on the surface of the gear four 51 vibrates under the rotation of the gear four 51, so that the chips can slide from the material turning table 21 to the discharging table 2, and the sliding of the chips on the surface of the discharging table 2 is accelerated.

[0040] It should be noted that the specific model of the suction pump 151, the motor 32 and the suction pump 341 should be determined according to the actual specifications of the device, and the specific selection calculation method uses the existing technology in the art, so it is not described in detail.

[0041] The power supply of the suction pump 151, the motor 32 and the suction pump 341 and its principle are clear to those skilled in the art, and will not be described in detail here It can be understood that the present application is described by some embodiments, and those skilled in the art know that various changes or equivalent replacements can be made to these features and embodiments without departing from the spirit and scope of the present application. In addition, under the guidance of the present application, these features and embodiments can be modified to adapt to specific conditions and materials without departing from the spirit and scope of the present application. Therefore, the present application is not limited by the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of the present application are within the scope of the present application.

Claims

1. A chip frame punching device with a material suction mechanism, comprising a base (1), and a bottom die (14) and an upper die (13) on the base (1) for punching chips, characterized in that: A rotating arm (31) capable of rotating about the rotating frame (3) as an axis is provided in the area between the bottom mold (14) and the upper mold (13), and one end of the rotating frame (3) is fixedly connected to the front of the punching table (12). One end of the rotating arm (31) away from the rotating frame (3) is coaxially connected to the receiving table (311), and a plurality of adsorption holes (316) are provided on the upper surface of the receiving table (311). A rotating tube (313) is extended from the surface of the receiving table (311) toward one end of the rotating arm (31), and a gear (312) provided on the outer peripheral surface of the rotating tube (313) is meshed with a gear ring (19) fixed on the surface of the punching table (12).

2. The chip frame punching device with a suction mechanism according to claim 1, characterized in that: A lower pressure plate (141) is provided on the upper surface of the bottom mold (14) for vertical displacement. Guide columns at the four corners of the bottom surface of the lower pressure plate (141) are placed inside the bottom mold (14), and a spring (142) for rebound is provided on the outer circumference of the guide column. A material guide platform (143) is fixed along the transverse area where the material strip passes through the lower pressure plate (141).

3. The chip frame punching device with a material suction mechanism according to claim 2, characterized in that: A worm gear (33) is fixed on the outer peripheral surface of the rotating arm (31) with the axis as the rotation point, and a worm (321) is meshed and connected on one side of the outer peripheral surface of the worm gear (33), and the rotation of the worm (321) is driven by a motor (32) connected at one end, and the motor (32) is fixed by supporting a bracket fixedly connected to the base (1). A second suction pump (341) is also fixed on the surface of the base (1), and the suction end of the second suction pump (341) is connected to the bottom surface of the rotating arm (31) through a second air pipe (34). A material unloading platform (2) is provided in the area where the rotating arm (31) rotates and unloads, and the material unloading platform (2) is fixedly connected to the surface of the base (1).

4. The chip frame punching device with a suction mechanism according to claim 3, characterized in that: Two racks (315) are fixed to the bottom surface of the receiving platform (311). The racks (315) drive the second gear (181) on the upper surface of the material guide platform (143) as the rotating arm (31) rotates. At the same time, a rotatable threaded rod (18) extends from the bottom surface of the second gear (181) to the inside of the material guide platform (143).

5. The chip frame punching device with a material suction mechanism according to claim 4, characterized in that: The surface of the material guide platform (143) is connected to a lower pressing strip (17) in a threaded manner. A protrusion (172) extends from one side of the surface of the lower pressing strip (17) in the direction of the threaded rod (18). At the same time, a threaded hole is formed through the surface of the protrusion (172) to form a threaded connection with the threaded rod (18).

6. The chip frame punching device with a material suction mechanism according to claim 5, characterized in that: The lifting blocks (173) at both ends of the lower pressing strip (17) are arranged on the same side as the protrusions (172), and the lifting blocks (173) are placed inside the material guide table (143) in a sliding manner, and lower pressing blocks (171) for pressing the material belt are equidistantly distributed from one end of the bottom surface of the lower pressing strip (17).

7. The chip frame punching device with a material suction mechanism according to claim 6, characterized in that: One end of the unloading platform (2) is hinged with a flipping platform (21) that can be flipped, and a gear three (211) is fixed on one side of the hinged flipping position of the flipping platform (21). A rotating shaft frame (213) is fixed on one side of the bottom surface of the unloading platform (2). An opening is penetrated by the rotating shaft (5) through one end of the rotating shaft frame (213). A gear four (51) is fixed on one end of the rotating shaft (5) on the same side as the gear three (211), and the gear four (51) is meshed with the gear three (211).

8. The chip frame punching device with a material suction mechanism according to claim 7, characterized in that: Gears five (52) are fixed on both sides of the outer circumference of the rotating shaft (5), and a rack two (431) is meshed and connected above the gear five (52) for driving the gear five to rotate. A push plate (43) is fixed to the other end of the rack two (431).

9. The chip frame punching device with a material suction mechanism according to claim 8, characterized in that: The push plate (43) is coaxially provided with a piston rod (42) on its surface to drive the push plate (43) to move together. At the same time, one end of the piston rod (42) is coaxially sleeved with a pressure tube (41), and a fixed connection is formed between the surface of the pressure tube (41) and the surface of the base (1).

10. The chip frame punching device with a material suction mechanism according to claim 9, characterized in that: A push block (322) is fixed to one side of the bottom surface of the worm wheel (33) that deviates from the center of the circle, and power is transmitted between the push block (322) and the piston rod (42) via the push rod (4).

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