Welding method and device for large-size microwave multilayer board

Abstract

The invention discloses a welding method and device for a large-size microwave multilayer board. The method comprises the steps that a pre-welding assembly is placed on a hot plate of a vacuum controlled atmosphere eutectic furnace, the pre-welding assembly sequentially comprises a microwave shell, a pre-forming welding piece and a microwave multi-layer plate from bottom to top, and the microwave multi-layer plate comprises a plurality of channels; according to the size information and the channel number of the microwave multilayer board, determining at least two target pressurization positions of the microwave multilayer board and target pressure values corresponding to the target pressurization positions; respectively applying pressure matched with the target pressure value to each target pressurizing position corresponding to the microwave multilayer board; the welding procedure of the vacuum controlled atmosphere eutectic furnace is operated; and in response to the completion of the operation of the welding program, removing the pressure so as to complete the welding of the microwave multilayer board and the microwave shell. According to the embodiment of the invention, a good welding effect can be achieved, warping generated during welding is avoided, the welding void rate is reduced, and the assembly quality and consistency are improved.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of welding, and particularly relates to a welding method and device for a large-size microwave multilayer board. BACKGROUND

[0002] A microwave assembly is usually composed of components, a printed board, a connector and an assembly shell and other parts. The function of the printed board is to install components and realize electrical interconnection. The printed board and the assembly shell can be connected in a screwing, gluing or welding manner. The welding method has smaller loss and excellent transmission performance, and is widely used. With the improvement of the functionality and integration of the microwave assembly, microwave circuits, digital circuits and power supply circuits are integrated on a printed board, and multiple printed boards are integrated into a microwave multilayer board. Meanwhile, the number of channels in the microwave assembly is also increasing, and the size of the microwave multilayer board is further increased.

[0003] When the microwave multilayer board and the shell are connected by welding, the thermal expansion coefficients of the shell of the microwave assembly, which is usually made of aluminum alloy, copper alloy or kovar alloy, are inconsistent with those of the printed board. Therefore, there is a large thermal stress between the shell and the microwave multilayer board during welding, and after assembly, warping deformation occurs, which causes the sintered product to be unusable.

[0004] To solve the above problems, a common solution is to apply pressure to the assembly during welding of the microwave multilayer board and the assembly shell. However, the current pressure applying method is to apply uniform pressure to the whole board. This method is effective when welding a microwave double-sided board and a small-size microwave multilayer board. However, the large-size microwave multilayer board itself has a certain warping degree. When uniform pressure is applied to the whole board, the pressure needs to be large enough to flatten the printed board, but this will cause defects such as tin beads, tin dregs and serious tin overflow in the middle of the microwave multilayer board, resulting in a high welding cavity rate. When the pressure is small, the printed board cannot be flattened, which causes insufficient pressure at the edges of the printed board, resulting in warping of the printed board after welding and a high cavity rate. Therefore, uniform pressure applied to the whole board cannot provide a suitable pressure for the large-size microwave multilayer board, and this method will cause the microwave multilayer board and the shell to be scrapped. SUMMARY

[0005] Embodiments of the present application provide a welding method and device for a large-size microwave multilayer board, which at least solve the problem that uniform pressure applied to the whole board during welding cannot provide a suitable pressure for the large-size microwave multilayer board, resulting in scrapping of the microwave multilayer board and the shell.

[0006] In a first aspect, embodiments of the present application provide a welding method for a large-size microwave multilayer board, comprising:

[0007] Place the pre-welding assembly on the hot plate of the vacuum controllable atmosphere eutectic furnace, the pre-welding assembly sequentially includes a microwave shell, a pre-formed welding sheet and a microwave multilayer board from bottom to top, and the microwave multilayer board includes a plurality of channels;

[0008] According to the size information and the number of channels of the microwave multilayer board, at least two target pressing positions of the microwave multilayer board and a target pressure value corresponding to each target pressing position are determined;

[0009] A pressure matched with the target pressure value is respectively applied to each target pressing position of the microwave multilayer board;

[0010] Run the welding program of the vacuum controllable atmosphere eutectic furnace;

[0011] In response to the completion of the running of the welding program, remove the pressure to complete the welding of the microwave multilayer board and the microwave shell.

[0012] In the second aspect, the embodiments of the present application provide a welding device for a large-size microwave multilayer board, and the device includes:

[0013] The placing module is configured to place the pre-welding assembly on the hot plate of the vacuum controllable atmosphere eutectic furnace, the pre-welding assembly sequentially includes a microwave shell, a pre-formed welding sheet and a microwave multilayer board from bottom to top, and the microwave multilayer board includes a plurality of channels;

[0014] The determining module is configured to determine at least two target pressing positions of the microwave multilayer board and a target pressure value corresponding to each target pressing position according to the size information and the number of channels of the microwave multilayer board;

[0015] The pressing module is configured to apply a pressure matched with the target pressure value to each target pressing position of the microwave multilayer board;

[0016] The running module is configured to run the welding program of the vacuum controllable atmosphere eutectic furnace;

[0017] The removing module is configured to remove the pressure in response to the completion of the running of the welding program to complete the welding of the microwave multilayer board and the microwave shell.

[0018] The welding method and device of the large-size microwave multilayer plate provided by the embodiment of the present application can provide the pressure required when the microwave multilayer plate and the assembly shell are welded by using a distributed pressure mode, can ensure that the multilayer plate and the solder sheet and the shell are in close contact, can avoid the warping deformation of the microwave multilayer plate during welding, can reduce the porosity of the microwave multilayer plate and the assembly shell during welding, and can further significantly improve the grounding performance of the microwave multilayer plate. Different sizes of pressure are provided at different positions on the microwave multilayer plate, which can avoid the problem of the integrated pressure at the middle position and the insufficient pressure at the edge of the microwave multilayer plate caused by overall pressure, and can improve the qualified rate of assembly. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the embodiments of the present application will be briefly introduced below. Those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0020] Figure 1 is a flowchart of a welding method of a large-size microwave multilayer plate provided by the embodiment of the present application;

[0021] Figure 2 is an assembly schematic diagram of a microwave multilayer plate welding process provided by the embodiment of the present application;

[0022] Figure 3 is a schematic diagram of a target pressure position of an exemplary microwave multilayer plate provided by the embodiment of the present application;

[0023] Figure 4 is a structural schematic diagram of a welding device of a large-size microwave multilayer plate provided by the embodiment of the present application.

[0024] Reference signs:

[0025] microwave multilayer plate 10, preformed solder sheet 11, microwave shell 12, hot plate 13,

[0026] welding device 400 of a large-size microwave multilayer plate, placement module 401, determination module 402, pressure module 403, running module 404, and removal module 405. DETAILED DESCRIPTION

[0027] The features and exemplary embodiments of the various aspects of the present application will be described in detail below with reference to the drawings. To make the purposes, technical solutions and advantages of the present application more clear, the present application will be further described in detail below with reference to the drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, but not to limit the present application. The present application can be implemented without some of these specific details for those skilled in the art. The following description of the embodiments is only to provide a better understanding of the present application by showing examples of the present application.

[0028] It should be noted that, in this paper, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment. Without more limitations, the elements defined by the statement "include" do not exclude the presence of other identical elements in the process, method, article or equipment including the elements.

[0029] The microwave assembly is usually composed of components, printed boards, connectors and assembly housings and other parts, wherein the function of the printed board is to mount components and realize electrical interconnection, and the printed board and the assembly housing can be connected by screwing, gluing, welding and the like, and welding brings smaller loss and excellent transmission performance, and is widely used.

[0030] With the improvement of functionality and integration of microwave assemblies, microwave circuits, digital circuits and power supply circuits are integrated on a printed board, and multiple printed boards are integrated into a microwave multilayer board. At the same time, the number of channels in the microwave assembly is also increasing, and the size of the microwave multilayer board is further increased. The microwave multilayer board is laminated by copper foil, glass fiber and semi-cured sheet at high temperature, wherein the thermal expansion coefficients of the copper foil and the base material are inconsistent, and there is a large stress between the internal layers, which itself has a certain warping deformation.

[0031] According to the requirements in GJB 9491-2018 "General Specification for Microwave Printed Boards" 3.5.4.4 bow and twist, the bow and twist of the printed board for surface mounting should be not more than 0.75%, and the bow and twist of other printed boards should be not more than 1.5%. When the size of the printed board is large, even 0.75% deformation will produce a large gap when assembled with the housing, which affects the welding of the printed board and the housing, the solder at the gap cannot be filled, resulting in a large void rate, and a large void rate will deteriorate the microwave transmission performance.

[0032] When the microwave multilayer board is connected with the shell by welding, since the microwave assembly shell is usually made of aluminum alloy, copper alloy, or kovar alloy material, the thermal expansion coefficient thereof is inconsistent with that of the printed board, and there is a large thermal stress between the shell and the microwave multilayer board during welding, which will cause warping deformation after assembly, resulting in that the product after sintering cannot be used.

[0033] To solve the above problems, the common solution is to provide pressure on the microwave multilayer board during welding of the microwave multilayer board and the assembly shell. Patent CN113146151A uses a pressure block to provide pressure during welding of the substrate, and magnets are arranged at the bottom of the base and the top of the pressure block, respectively, and the components between the two magnets are fastened as a whole, improving the efficiency and reliability of assembly. Patent CN217193507U provides a T / R assembly substrate welding tool for welding of the circuit substrate in the T / R assembly cavity, and the welding pressure is applied by pressing the pressure block group in the T / R assembly cavity through the elastic pressure head, which has the advantages of strong universality, high clamping efficiency, adjustable welding pressure, good welding quality, etc. Patent CN110303220A provides a new double-channel TR assembly reflow soldering tool, which uses the weight of the first fixing tool to press and limit the LTCC substrate, thereby improving the production and assembly efficiency and stability and reliability, and improving the yield of the product.

[0034] The above solutions can provide pressure during welding of the microwave multilayer board and the assembly shell, and the pressure-providing device includes a pressure block, a magnet, or a spring, but the pressure-providing method is mainly to apply uniform pressure to the whole board, which is effective when welding a microwave double-sided board and a small-size microwave multilayer board.

[0035] However, a large-size microwave multilayer board itself has a certain warping degree, and uniform pressure applied to the whole board can only flatten the printed board when the pressure is large, but this will cause excessive pressure on the middle position of the microwave multilayer board, resulting in tin beads, tin slag, and serious tin overflow, and high welding cavity rate. When the pressure is small, the printed board cannot be flattened, which causes insufficient pressure at the edge of the printed board, resulting in warping of the printed board after welding and high cavity rate. Therefore, uniform pressure applied to the whole board cannot provide a suitable pressure for a large-size microwave multilayer board, and using this method will cause the microwave multilayer board and the shell to be scrapped.

[0036] To solve the problems in the related art, the embodiments of the present application provide a welding method and device for a large-size microwave multilayer board.

[0037] The welding method for a large-size microwave multilayer board provided by the embodiments of the present application will be described in detail below in combination with the drawings and specific embodiments and their application scenarios. The warping deformation problem of the microwave multilayer board and the high welding cavity rate problem of the microwave multilayer board and the microwave shell during welding of the large-size microwave multilayer board and the microwave shell are solved.

[0038] Figure 1 The figure shows a schematic flow chart of a method for welding a large-sized microwave multilayer board according to an embodiment of the present application. Figure 1 As shown, the welding method of the large-size microwave multilayer board may specifically include the following steps:

[0039] S101, placing a pre-welded assembly on a hot plate of a vacuum controlled atmosphere eutectic furnace, wherein the pre-welded assembly includes, from bottom to top, a microwave housing, a preformed solder sheet, and a microwave multilayer board, wherein the microwave multilayer board includes a plurality of channels;

[0040] S102, determining at least two target pressurization positions of the microwave multilayer board and target pressure values ​​corresponding to the target pressurization positions according to the size information and the number of channels of the microwave multilayer board;

[0041] S103, applying pressure matching the target pressure value to each target pressurizing position corresponding to the microwave multilayer board;

[0042] S104, running the welding program of the vacuum controlled atmosphere eutectic furnace;

[0043] S105 , in response to the completion of the welding procedure, removing the pressure to complete the welding of the microwave multilayer board and the microwave housing.

[0044] Therefore, a distributed pressurization method is used to provide the pressure required for welding the microwave multilayer board and the component shell, which can ensure that the multilayer board is in close contact with the solder sheet and the shell, avoid warping and deformation during welding of the microwave multilayer board, and reduce the void rate of welding between the microwave multilayer board and the component shell, thereby significantly improving the grounding performance of the microwave multilayer board; providing different pressures at different positions on the microwave multilayer board can avoid the problems of integrated pressure in the middle position of the microwave multilayer board and insufficient pressure at the edge caused by overall pressurization, thereby improving the qualified rate of assembly.

[0045] The specific implementation methods of the above steps are introduced below.

[0046] refer to Figure 2 , is the assembly diagram of the microwave multilayer board welding process in S101. Figure 2 As shown, a coated solder preform 11 is first placed in a microwave housing 12, followed by a microwave multilayer board 10, to form a pre-welded assembly. The assembly is then placed on a hot plate 13 in a vacuum-controlled atmosphere eutectic furnace. In other words, the pre-welded assembly comprises, from bottom to top, the microwave housing 12, the solder preform 11, and the microwave multilayer board 10.

[0047] Optionally, the microwave multilayer board 10 includes a plurality of channels, and the microwave multilayer board 10 includes two first edges and two second edges, the length of the first edge is less than the length of the second edge, and the second edge close to the channels is comb-shaped.

[0048] Optionally, the length of the first edge of the microwave multilayer board 10 is greater than 50 mm, and the length of the second edge of the microwave multilayer board 10 is greater than 80 mm.

[0049] In some embodiments, in S102, in the case where the microwave multilayer board 10 includes a plurality of channels, the at least two target pressurization positions include at least six target pressurization positions, specifically including: the center position of each of the two first edges of the microwave multilayer board 10, the comb-shaped edge position of each of the two channels on both sides of the center of the second edge of the microwave multilayer board 10 close to the channels, and the position of the microwave multilayer board 10 away from the second edge of the channels and symmetrical to the comb-shaped edge position.

[0050] As an optional embodiment, in the case where the number of channels of the microwave multilayer board 10 is greater than or equal to four and less than or equal to eight, the at least two target pressurization positions include eight target pressurization positions, and further specifically include: the comb-shaped edge position of each of the two channels at both ends of the second edge of the microwave multilayer board 10 close to the channels.

[0051] That is, in the case where the number of channels of the microwave multilayer board 10 is greater than or equal to four and less than or equal to eight, eight target pressurization positions are included, and in the case where the number of channels of the microwave multilayer board 10 is less than four, six target pressurization positions are included.

[0052] Taking the case where the number of channels of the microwave multilayer board 10 is eight as an example, Figure 3 A schematic diagram of the target pressurization positions of the exemplary microwave multilayer board 10 is shown. As shown in Figure 3 The target pressurization positions of the microwave multilayer board 10 include: the center positions A and B of each of the two first edges of the microwave multilayer board 10, the comb-shaped edge positions C and D of each of the two channels on both sides of the center of the second edge of the microwave multilayer board 10 close to the channels, the positions E and F of the microwave multilayer board 10 away from the second edge of the channels and symmetrical to the comb-shaped edge positions, and the comb-shaped edge positions G and H of each of the two channels at both ends of the second edge of the microwave multilayer board 10 close to the channels.

[0053] In some alternative embodiments, the target pressure value at the center of each of the two first edges of the microwave multilayer board 10 is a first pressure value; the target pressure value at the comb-shaped edge position of each of the two channels on both sides of the center of the second edge of the microwave multilayer board 10 close to the channel and the target pressure value at the position of the second edge of the microwave multilayer board 10 away from the channel and symmetrical to the comb-shaped edge position are both second pressure values; and the target pressure value at the comb-shaped edge position of each of the two channels at both ends of the second edge of the microwave multilayer board 10 close to the channel is a third pressure value.

[0054] In some alternative embodiments, the ratio of the second pressure value to the first pressure value is 1 / 5, and the ratio of the third pressure value to the first pressure value is 2 / 5.

[0055] Further, in some embodiments, according to the area of the microwave multilayer board and a preset pressure coefficient, a total pressure to be applied to the microwave multilayer board is determined; and according to the total pressure and the proportional relationship of the first pressure value, the second pressure value and the third pressure value, the first pressure value, the second pressure value and the third pressure value are determined respectively.

[0056] For example, in the microwave multilayer board 10 without channels, there are six target pressure positions, and the target pressure values corresponding to the six target pressure positions are equal, i.e., F1=F2=F3=F4=F5=F6. Figure 3 For example, in the microwave multilayer board 10 without channels, there are six target pressure positions, and the target pressure values corresponding to the six target pressure positions are equal, i.e., F1=F2=F3=F4=F5=F6.

[0057] Total pressure F=F1+F2+F3+F4+F5+F6=kS;

[0058] Wherein, S is the area of the microwave multilayer board 10; k is a preset pressure coefficient, which can be 0.06-0.16; F1=F2, F3=F4=F5=F6, F7=F8; F3=1 / 5F1, F7=2 / 5F1.

[0059] For example, in the microwave multilayer board 10 without channels, there are six target pressure positions, and the target pressure values corresponding to the six target pressure positions are equal, i.e., F1=F2=F3=F4=F5=F6.

[0060] Further, in some embodiments, in S103, a pressing tool matched with the target pressure value is arranged at each target pressing position of the microwave multilayer board 10, or an elastic tool matched with the target pressure value is arranged at each target pressing position of the microwave multilayer board 10. Optionally, the pressing tool comprises a steel pressing block.

[0061] Thus, in the welding process of the large-size microwave multilayer board 10 and the microwave shell 12, the distributed pressing method can apply different pressures to the four edges of the microwave multilayer board 10, avoid the integration of the pressure in the middle position and the shortage of the pressure at the edges of the microwave multilayer board 10, and improve the qualification rate of assembly. That is, the distributed pressing method in the embodiment breaks through the conventional pressing method, is particularly suitable for large-size microwave multilayer boards 10, and can significantly improve the reliability of assembly.

[0062] Further, the welding program of the vacuum controllable atmosphere eutectic furnace is run, and in response to the completion of the welding program, the pressure is removed to complete the welding of the microwave multilayer board 10 and the microwave shell 12, i.e., S104 and S105 are executed. As can be seen, the relationship between the pressures at different positions in the distributed pressing method can provide the welding pressure required for the welding of the microwave multilayer board 10 and the microwave shell 12, achieve good welding effect, avoid warping during welding, reduce the welding cavity rate, and improve the assembly quality and consistency.

[0063] Next, the welding method of the large-size microwave multilayer board of the present application is further described in detail through more specific embodiments.

[0064] The large-size microwave multilayer board 10 can be a microwave printed board of an eight-channel TR assembly, with an outer dimension of 110mm×60mm, a thickness of 1.2mm, and a total of 8 layers, wherein layers 1-2 are radio frequency layers, the board material is Rogers 3003a, and the thickness is 0.254mm; and layers 3-8 are ordinary epoxy boards FR4.

[0065] First, the coated preformed soldering sheet 11 is placed in the microwave shell 12, and then the microwave multilayer board 10 is loaded, and the whole is placed on the hot plate 13 of the vacuum controllable atmosphere eutectic furnace.

[0066] A pressure F1 is applied at a center position A of one wide edge of the microwave multilayer plate 10, and a pressure F2 is applied at a center position B of another wide edge of the microwave multilayer plate 10; a pressure F3 is applied at a comb-shaped position C of a long edge of the microwave multilayer plate 10; a pressure F5 is applied at a position E of another long edge of the microwave multilayer plate 10, which is symmetrical to the position C; a pressure F4 is applied at a comb-shaped position D of the long edge of the microwave multilayer plate 10; a pressure F6 is applied at a position F of another long edge of the microwave multilayer plate 10, which is symmetrical to the position D; a pressure F7 is applied at an outermost comb-shaped position G of the microwave multilayer plate 10; and a pressure F8 is applied at another outermost comb-shaped position H of the microwave multilayer plate 10.

[0067] In implementation, a 5mm×5mm aluminum block is placed at the center position A of the wide edge of the microwave multilayer plate 10, and a 125g steel pressing block is placed on the aluminum block; a 5mm×5mm aluminum block is placed at the center position B of another wide edge of the microwave multilayer plate 10, and a 125g steel pressing block is placed on the aluminum block; a 5mm×5mm aluminum block is placed at the third channel C of the eight channels of the microwave multilayer plate 10, and a 25g steel pressing block is placed on the aluminum block; a 5mm×5mm aluminum block is placed at the position E of another long edge of the microwave multilayer plate 10, which is symmetrical to the third channel position C, and a 25g steel pressing block is placed on the aluminum block; a 5mm×5mm aluminum block is placed at the fourth channel D of the eight channels of the microwave multilayer plate 10, and a 25g steel pressing block is placed on the aluminum block; a 5mm×5mm aluminum block is placed at the position F of another long edge of the microwave multilayer plate 10, which is symmetrical to the fourth channel position D, and a 25g steel pressing block is placed on the aluminum block; a 5mm×5mm aluminum block is placed at the first channel G of the microwave multilayer plate 10, and a 50g steel pressing block is placed on the aluminum block; and a 5mm×5mm aluminum block is placed at the eighth channel position H of the microwave multilayer plate 10, and a 50g steel pressing block is placed on the aluminum block.

[0068] After the pressing blocks are assembled, a welding program of the vacuum controllable atmosphere eutectic furnace is run; after the program is completed, the steel pressing blocks and the aluminum blocks are removed, and the microwave shell 12 is taken out, thereby completing the welding of the microwave multilayer plate 10 and the microwave shell 12.

[0069] Thus, the pressing method for welding the large-size microwave multilayer plate 10 breaks through the limitation of the traditional overall pressing method, and provides different sizes of pressure at different positions on the microwave multilayer plate 10 by using distributed pressing, which can provide the required pressure for the welding of the microwave multilayer plate 10 and the component shell, ensure the close contact of the multilayer plate and the solder sheet and the shell, avoid the warping deformation of the microwave multilayer plate during welding, and also reduce the porosity of the welding of the microwave multilayer plate and the component shell, thereby significantly improving the grounding performance of the microwave multilayer plate.

[0070] It should be noted that the above description is limited to some embodiments of the present application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims may be performed in an order different from that described in the above embodiments and still achieve the desired results. Furthermore, the processes depicted in the accompanying drawings do not necessarily require the specific order or sequential order shown to achieve the desired results. In certain embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0071] Based on the same technical concept, corresponding to any of the above-mentioned embodiments and methods, the present application also provides a welding device 400 for a large-size microwave multilayer board.

[0072] like Figure 4 As shown, the welding device 400 for large-sized microwave multilayer boards may include:

[0073] A placement module 401 is used to place a pre-welded assembly on a hot plate of a vacuum controlled atmosphere eutectic furnace, wherein the pre-welded assembly includes, from bottom to top, a microwave housing, a preformed solder sheet, and a microwave multilayer board, wherein the microwave multilayer board includes a plurality of channels;

[0074] A determination module 402 is configured to determine at least two target pressurization positions of the microwave multilayer board and target pressure values ​​corresponding to the target pressurization positions according to the size information and the number of channels of the microwave multilayer board;

[0075] A pressurizing module 403 is configured to apply pressure matching the target pressure value to each target pressurizing position corresponding to the microwave multilayer board;

[0076] An operation module 404 is used to operate a welding program of a vacuum controlled atmosphere eutectic furnace;

[0077] The removal module 405 is configured to remove the pressure in response to the completion of the welding procedure, so as to complete the welding of the microwave multilayer board and the microwave housing.

[0078] Optionally, the length of the first side of the microwave multilayer board is greater than 50 mm, and the length of the second side of the microwave multilayer board is greater than 80 mm.

[0079] Optionally, the microwave multilayer board includes two first sides and two second sides, the length of the first side is smaller than the second side, and the second side close to the channel is comb-shaped.

[0080] Optionally, the at least two target pressing positions include at least six target pressing positions, and specifically include: a center position of each of the two first edges of the microwave multilayer board, two comb-shaped edge positions of each of the two channels near the center of the second edge of the channels of the microwave multilayer board, and positions symmetrical to the comb-shaped edge positions away from the second edge of the channels of the microwave multilayer board.

[0081] Optionally, in the case where the number of channels of the microwave multilayer board is greater than or equal to four and less than or equal to eight, the at least two target pressing positions include eight target pressing positions, and specifically include: two comb-shaped edge positions of each of the two channels near the two ends of the second edge of the channels of the microwave multilayer board.

[0082] Optionally, the target pressure value at the center position of each of the two first edges of the microwave multilayer board is a first pressure value; the target pressure value at each of the two comb-shaped edge positions of each of the two channels near the center of the second edge of the channels of the microwave multilayer board and the target pressure value at positions symmetrical to the comb-shaped edge positions away from the second edge of the channels of the microwave multilayer board are a second pressure value; and the target pressure value at each of the two comb-shaped edge positions of each of the two channels near the two ends of the second edge of the channels of the microwave multilayer board is a third pressure value.

[0083] Optionally, the ratio of the second pressure value to the first pressure value is 1 / 5, and the ratio of the third pressure value to the first pressure value is 2 / 5.

[0084] In some optional embodiments, the determining module 402 is specifically configured to determine a total pressure to be applied to the microwave multilayer board according to the area of the microwave multilayer board and a preset pressure coefficient; and determine the first pressure value, the second pressure value and the third pressure value according to the total pressure and the proportional relationship among the first pressure value, the second pressure value and the third pressure value.

[0085] In some optional embodiments, the pressing module 403 is specifically configured to arrange a pressing block tool matched with the target pressure value at each target pressing position of the microwave multilayer board, or arrange an elastic tool matched with the target pressure value at each target pressing position of the microwave multilayer board.

[0086] Optionally, the pressing block tool includes a steel pressing block.

[0087] It should be noted that, for the convenience of description, the above apparatus is described in various modules according to functions. Of course, in the implementation of the present application, the functions of the modules can be implemented in one or more software and / or hardware.

[0088] The device of the above-mentioned embodiment is used to implement the welding method of the large-size microwave multilayer board of the corresponding embodiment of any of the above-mentioned embodiments, and has the beneficial effects of the corresponding method embodiment, which will not be repeated here.

[0089] Reference to "an embodiment" in this application means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearance of the phrase in various places in the specification does not necessarily all refer to the same embodiment, nor is it necessarily mutually exclusive of other embodiments.

[0090] In the description of the application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting", "attachment" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be direct connection, or indirect connection through an intermediate medium, or internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0091] In the embodiments of the application, the same reference signs represent the same components, and for the sake of brevity, detailed description of the same components is omitted in different embodiments. It should be understood that the thickness, length, width and other dimensions of various components in the embodiments of the application shown in the drawings, as well as the overall thickness, length, width and other dimensions of the integrated device, are only exemplary and should not constitute any limitation on the application.

[0092] "Multiple" appearing in the application means more than two (including two).

[0093] Although the application has been described with reference to the preferred embodiments, various modifications can be made to it without departing from the scope of the application, and equivalent parts can be substituted for the parts therein, especially, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any way. The application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0094] It should also be noted that the exemplary embodiments mentioned in the application describe some methods or systems based on a series of steps or devices. However, the application is not limited to the order of the above steps, that is, the steps can be performed in the order mentioned in the embodiments, or in an order different from the embodiments, or several steps can be performed simultaneously.

[0095] The above merely describes a specific implementation of the present application. Those skilled in the art can clearly understand the specific working processes of the system, modules and units described above for the convenience and brevity of description, and can refer to the corresponding processes in the foregoing method embodiments, which will not be described herein again. It should be understood that the protection scope of the present application is not limited to this, and any person skilled in the art can easily think of various equivalent modifications or replacements within the technical range disclosed by the present application, and these modifications or replacements should be covered within the protection scope of the present application.

Claims

1. A method for welding large-size microwave multilayer boards, characterized in that: include: Placing a pre-welded assembly on a hot plate of a vacuum controlled atmosphere eutectic furnace, wherein the pre-welded assembly includes, from bottom to top, a microwave housing, a preformed solder sheet, and a microwave multilayer board, wherein the microwave multilayer board includes a plurality of channels; determining, based on the size information and the number of channels of the microwave multilayer board, at least two target pressurization positions of the microwave multilayer board and target pressure values ​​corresponding to the target pressurization positions; applying pressure matching the target pressure value to the target pressurizing positions corresponding to the microwave multilayer board; Run welding procedures in vacuum controlled atmosphere eutectic furnaces; In response to the completion of the welding process, the pressure is removed to complete the welding of the microwave multilayer board and the microwave housing.

2. The method according to claim 1, characterized in that The microwave multilayer board comprises two first sides and two second sides, wherein the length of the first side is smaller than the second side, and the second side close to the channel is comb-shaped; The at least two target pressurization positions include at least six target pressurization positions, specifically including: the center position of each of the two first sides of the microwave multilayer board, the comb-tooth edge position of each of the two channels on both sides of the center of the second side of the microwave multilayer board close to the channel, and the position of the second side of the microwave multilayer board away from the channel that is symmetrical to the comb-tooth edge position.

3. The method according to claim 2, characterized in that When the number of channels of the microwave multilayer board is greater than or equal to four and less than or equal to eight, the at least two target pressurization positions include eight target pressurization positions, and specifically include: the comb-shaped edge positions of the two channels at both ends of the second side of the microwave multilayer board close to the channels.

4. The method according to claim 3, characterized in that The target pressure values ​​at the center positions of the two first sides of the microwave multilayer board are both first pressure values; The target pressure values ​​at the comb-shaped edge positions of the two channels on both sides of the center of the second side of the microwave multilayer board close to the channel and the target pressure value at the position of the second side of the microwave multilayer board away from the channel and symmetrical to the comb-shaped edge position are both second pressure values; The target pressure values ​​at the comb-shaped edge positions of the two channels of the microwave multilayer plate at both ends of the second side of the channel are both the third pressure value.

5. The method according to claim 4, characterized in that The ratio of the second pressure value to the first pressure value is 1 / 5, and the ratio of the third pressure value to the first pressure value is 2 / 5.

6. The method according to claim 5, characterized in that The determining, based on the size information and the number of channels of the microwave multilayer board, at least two target pressurizing positions of the microwave multilayer board and target pressure values ​​corresponding to the target pressurizing positions includes: determining a total pressure pre-applied to the microwave multilayer board according to the area of ​​the microwave multilayer board and a preset pressure coefficient; The first pressure value, the second pressure value, and the third pressure value are determined respectively according to the total pressure and a proportional relationship among the first pressure value, the second pressure value, and the third pressure value.

7. The method according to claim 1, characterized in that The step of applying pressure matching the target pressure value to the target pressurizing positions corresponding to the microwave multilayer board includes: A pressing block tooling matching the target pressure value is respectively set at each target pressurizing position corresponding to the microwave multilayer board, or an elastic tooling matching the target pressure value is respectively set at each target pressurizing position corresponding to the microwave multilayer board.

8. The method according to claim 7, characterized in that The briquetting tooling includes a steel briquetting.

9. The method according to any one of claims 1 to 8, characterized in that The length of the first side of the microwave multilayer board is greater than 50 mm, and the length of the second side of the microwave multilayer board is greater than 80 mm.

10. A welding device for large-sized microwave multilayer boards, characterized in that: include: A placement module is used to place a pre-welded assembly on a hot plate of a vacuum controlled atmosphere eutectic furnace, wherein the pre-welded assembly includes, from bottom to top, a microwave housing, a preformed solder sheet, and a microwave multilayer board, wherein the microwave multilayer board includes a plurality of channels; a determination module, configured to determine at least two target pressurization positions of the microwave multilayer board and target pressure values ​​corresponding to the target pressurization positions according to the size information and the number of channels of the microwave multilayer board; a pressurizing module, configured to apply pressure matching the target pressure value to each target pressurizing position corresponding to the microwave multilayer board; Operation module, used to run the welding program of vacuum controlled atmosphere eutectic furnace; The removal module is used for removing the pressure in response to the completion of the welding procedure, so as to complete the welding of the microwave multilayer board and the microwave shell.

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