A liquid metal contact thermal resistance measuring device

By designing a liquid metal contact thermal resistance measuring device that includes heat dissipation end components and motion control components, stepless adjustment and precise measurement of liquid metal film thickness are realized. This solves the problem of insufficient film thickness adjustment accuracy in existing devices, improves the accuracy and reliability of measurement, and supports the optimized design of thermal interface materials and the improvement of heat dissipation efficiency.

CN120801415BActive Publication Date: 2025-11-25ANHUI CHUANGPU INSTR TECH CO LTD
View PDF 2 Cites 0 Cited by

Patent Information

Application Number
CN202511249908.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-09-03
Publication Date
2025-11-25
Estimated Expiration
2045-09-03

AI Technical Summary

Technical Problem

Existing liquid metal contact thermal resistance measurement devices are difficult to achieve stepless adjustment of film thickness and have insufficient measurement accuracy, failing to provide reliable thermal resistance data and thus failing to meet the needs of scientific research and industrial production.

Method used

A device comprising a heat dissipation end component, a motion control component, a grating component, an active end component, a transmission component, a support and guide component, and a temperature sensor is designed. The thickness of the liquid metal film is adjusted by controlling the pressure between the heat dissipation end component and the active end component, and closed-loop control is achieved by using feedback from the grating component and the pressure sensor to accurately measure the contact thermal resistance under different film thicknesses.

Benefits of technology

This technology enables stepless adjustment and precise measurement of liquid metal film thickness, reduces film thickness error, improves measurement accuracy and reliability, and provides data support for optimizing the design of thermal interface materials and improving heat dissipation efficiency.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN120801415B_ABST
    Figure CN120801415B_ABST
Patent Text Reader

Abstract

The application relates to the technical field of thermal resistance measurement, and particularly discloses a liquid metal contact thermal resistance measuring device, which comprises a heat dissipation end assembly, a motion control assembly, a grating assembly, a driving end assembly, a transmission assembly, a support guide assembly and a temperature sensor. The heat dissipation end assembly and the driving end assembly are provided with a relative contact surface, the relative contact surface is used for clamping liquid metal coated between the relative contact surfaces, the heat dissipation end assembly is used for measuring the heat conduction performance of the liquid metal in the relative contact surface, the heat dissipation end assembly is connected to one end of the support guide assembly, the driving end assembly is slidably arranged relative to the heat dissipation end assembly, the heat dissipation end assembly and the driving end assembly are both connected with the temperature sensor on the side close to the relative contact surface, and the grating assembly is connected with the driving end assembly. The contact thermal resistance measuring device can steplessly adjust the film thickness of the liquid metal to be measured, and the contact thermal resistance of different film thicknesses can be measured, so as to provide data support for the film thickness selection of the liquid metal.
Need to check novelty before this filing date? Find Prior Art

Citation Information

Patent Citations

  • Heat conductivity tester

    CN103543173A

  • Test piece clamping force detection mechanism of flat plate heat conductivity coefficient measuring device

    CN117434105A