Chip aging test bench and test method

Abstract

The invention discloses a chip aging test seat and a test method. The chip aging test seat comprises a base assembly, a temperature control assembly, a cover body assembly and a first heat dissipation assembly. The base assembly comprises a limiting piece and a probe piece, and the chip is conducted with the test circuit board through the probe piece; the upper end face of the temperature control assembly is attached to the chip, and the probe piece can be arranged in the temperature control assembly in a penetrating mode. The cover body assembly comprises a test cover and an abutting piece, and the lower end of the abutting piece can abut against the upper end of the chip; the first heat dissipation assembly comprises a first heat dissipation piece and a second heat dissipation piece, and the lower end of the first heat dissipation piece can abut against the upper end of the chip. By driving the first heat dissipation assembly to be far away from or close to the chip, when the chip needs to be cooled, the chip is attached, and when the chip needs to be heated, the first heat dissipation assembly can be driven to be far away from the chip, so that heating of the chip is facilitated. The requirement for cyclic heating of the chip can be met by driving the first heat dissipation assembly, and the chip testing efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip testing, in particular to a chip aging test seat and a testing method. BACKGROUND

[0002] High-temperature aging test of a chip is to heat the chip to its working temperature or a state higher than the working temperature, test the resistance and reliability of the chip, and thus find the failure of the chip in an early stage, which is of great significance to product quality supervision and screening of high-quality chips.

[0003] The existing test socket mainly comprises an upper cover, a rotating ring, a base and a chip pressing block. The upper cover is hingedly connected to one side of the base, the rotating ring is rotationally arranged on the upper cover, the base is used for loading the chip, and the chip pressing block is internally provided with a heating rod for heating. The chip pressing block is in contact with the upper surface of the chip through the bottom thereof to heat test the chip.

[0004] However, there are still some deficiencies in the test of some chip aging test seats. In the long-term running state of the chip aging test seat, it is not easy to dissipate heat. When temperature cycle aging test needs to be performed on the chip, the chip needs to be cycled for heat dissipation. However, in the long-term running state of the chip aging test seat, it is not easy to dissipate heat, and the heat dissipation time is relatively long, which leads to low test efficiency when performing temperature cycle aging test. SUMMARY

[0005] The present application aims to at least solve one of the technical problems existing in the prior art. To this end, the present application provides a chip aging test seat capable of quickly dissipating heat of the chip and improving the chip aging test efficiency.

[0006] The present application also provides a chip aging test method applied to the above chip aging test seat.

[0007] According to the chip aging test seat of the first aspect of the present application, the chip aging test seat comprises: a base assembly arranged on a test circuit board through a bottom plate, the base assembly comprising a limiting piece and a probe piece, an inner side of the limiting piece being used for arranging a chip, and the chip being in conduction with the test circuit board through the probe piece; a temperature control assembly floatingly arranged in the base assembly, the temperature control assembly being located below the limiting piece, an upper end surface of the temperature control assembly being in mutual adhesion with the chip, and the probe piece being capable of being arranged in the temperature control assembly; a cover assembly capable of being arranged above the base assembly, the cover assembly comprising a test cover and an abutting piece, the abutting piece being movably arranged in the test cover, and a lower end of the abutting piece being capable of abutting on an upper end of the chip; and The first heat dissipation assembly is movably arranged in the abutting member, and comprises a first heat dissipation member and a second heat dissipation member. The first heat dissipation member is in communication with the second heat dissipation member. The lower end of the first heat dissipation member is capable of abutting the upper end of the chip. The lower end of the second heat dissipation member is in communication with the upper end of the first heat dissipation member. The upper end of the second heat dissipation member is arranged in the upper end of the cover assembly.

[0008] According to the chip aging test seat provided by the embodiment of the present application, the first heat dissipation assembly is driven to move away from or close to the chip. When the chip needs to be cooled, the first heat dissipation assembly is attached to the chip, so that the first heat dissipation member and the second heat dissipation member can quickly cool the chip. When the chip needs to be heated, the first heat dissipation member is driven to move away from the chip, so that the chip can be heated conveniently. The first heat dissipation assembly can quickly meet the requirement of the chip cycle heating, and the efficiency of the chip aging test is improved.

[0009] According to some embodiments of the present application, the first heat dissipation assembly further comprises a first driving part and a first sleeve. The first driving part is arranged at the upper end of the first sleeve. The first heat dissipation member and the second heat dissipation member are fixedly arranged in the first sleeve. The first heat dissipation member is located at the lower end of the first sleeve. The first sleeve is movably arranged in the abutting member.

[0010] According to some embodiments of the present application, a plurality of second heat dissipation members are arranged. The lower ends of the plurality of second heat dissipation members are connected to the upper end surface of the first heat dissipation member. The length direction of the plurality of second heat dissipation members extends along the axis direction of the first sleeve. The outer shell of the first heat dissipation member is connected with the outer shell of the second heat dissipation member. The interior of the first heat dissipation member and the interior of the second heat dissipation member are in communication with each other to form a heat dissipation channel.

[0011] According to some embodiments of the present application, the first heat dissipation assembly further comprises a third heat dissipation member. The third heat dissipation member is arranged in the first sleeve and connected to the inner side wall of the first sleeve. The second heat dissipation member is arranged in the third heat dissipation member and connected to the third heat dissipation member in contact.

[0012] According to some embodiments of the present application, the abutting member is connected to the test cover through threads. The abutting member comprises a second driving part, a second sleeve and an abutting part. The second driving part is connected to the abutting part through the second sleeve. The second driving part is driven to rotate, so that the abutting part is close to and abuts the upper end of the chip.

[0013] According to some embodiments of the present application, the chip aging test seat further comprises a second heat dissipation assembly, the second heat dissipation assembly is arranged at the upper end of the first heat dissipation assembly, and the lower end of the second heat dissipation assembly abuts against the upper end of the second heat dissipation member and / or the third heat dissipation member.

[0014] According to some embodiments of the present application, the temperature control assembly comprises a microcapsule PCM structure layer and a resistance wire heating layer, the resistance wire heating layer is embedded in the microcapsule PCM structure layer, the probe member is capable of penetrating the microcapsule PCM structure layer, and the upper end surface of the microcapsule PCM structure layer is attached to the lower end surface of the chip through a heat-conducting adhesive layer.

[0015] According to the chip aging test method of the second aspect of the present application, the chip aging test method is applied to the chip aging test seat of the first aspect of the present application. The chip aging test method comprises the following steps: Step one, place the chip in the base assembly, close the cover assembly, and use the abutting member to press the chip against the temperature control assembly; Step two, heat the temperature control assembly to a preset temperature, and use the temperature control assembly to heat the chip; Step three, use the first heat dissipation assembly to cool the chip, and control the temperature control assembly to reduce the temperature; Step four, use the temperature control assembly to heat the chip again, and control the first heat dissipation assembly to stop cooling the chip; Cyclic test, sequentially repeat the step three and the step four, so that the chip aging test seat cyclically tests the chip until a preset number of cyclic tests is reached.

[0016] According to the chip aging test method of the second aspect of the present application, at least has the following beneficial effects: the chip aging test method has all the beneficial effects brought by the chip aging test seat provided in the first aspect of the present application, which will not be repeated here.

[0017] According to some embodiments of the present application, the chip aging test seat further comprises a second heat dissipation assembly, the second heat dissipation assembly is arranged at the upper end of the first heat dissipation assembly, and the lower end of the second heat dissipation assembly abuts against the upper end of the second heat dissipation member and / or the third heat dissipation member. The step three further comprises the following step: using the second heat dissipation assembly to dissipate heat from the first heat dissipation assembly.

[0018] According to some embodiments of the present application, the temperature control assembly comprises a microcapsule PCM structure layer and a resistance wire heating layer, the resistance wire heating layer can be embedded in the microcapsule PCM structure layer, the probe member can be penetrated in the microcapsule PCM structure layer, the upper end surface of the microcapsule PCM structure layer is attached to the lower end surface of the chip through a heat-conducting adhesive layer, and the step four further comprises the following steps: increasing the temperature of the resistance wire heating layer so that the resistance wire heating layer heats the microcapsule PCM structure layer, and the microcapsule PCM structure layer heats the chip.

[0019] Additional aspects and advantages of the present application will be given in part in the following description, become apparent from the following description, or be learned by practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0020] The present application will be further described below in conjunction with the drawings and embodiments, wherein: Figure 1 The structural schematic diagram of the chip aging test seat according to the first aspect of the present application is shown in the figure. Figure 2 The structural schematic diagram of the chip aging test seat according to the first aspect of the present application is shown in the figure. Figure 1 The exploded structural schematic diagram of the chip aging test seat is shown in the figure. Figure 3 The structural schematic diagram of the chip aging test seat according to the first aspect of the present application is shown in the figure. Figure 2 The sectional view of the first heat dissipation assembly of the chip aging test seat is shown in the figure. Figure 4 The structural schematic diagram of the chip aging test seat according to the first aspect of the present application is shown in the figure. Figure 1 The half-sectional structural schematic diagram of the chip aging test seat is shown in the figure.

[0021] Reference numerals: Chip aging test seat 1; chip 2; test circuit board 3; Base assembly 10; limiting member 11; bottom plate 12; probe seat 13; Temperature control assembly 20; Cover assembly 30; test cover 31; abutting member 32; second driving part 321; second sleeve 322; abutting part 323; First heat dissipation assembly 40; first heat dissipation member 41; second heat dissipation member 42; first driving part 43; first sleeve 44; third heat dissipation member 45; Second heat dissipation assembly 60. DETAILED DESCRIPTION

[0022] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0023] In the description of the present invention, if there is a description of first and second, it is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0024] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0025] Reference Figures 1 to 4 According to the chip aging test seat 1 of the first embodiment of the present invention, the chip aging test seat 1 includes a base assembly 10, a temperature control assembly 20, a cover assembly 30 and a first heat dissipation assembly 40. The base assembly 10 is set on the test circuit board 3 through the bottom plate 12. The base assembly 10 includes a limiter 11 and a probe member (not shown in the figure). The inner side of the limiter 11 is used to place the chip 2. The chip 2 is connected to the test circuit board 3 through the probe member; the temperature control assembly 20 can be floated in the base assembly 10. The temperature control assembly 20 is located below the limiter 11. The upper end surface of the temperature control assembly 20 is in contact with the lower end surface of the chip 2. The probe member can be inserted into the temperature control assembly 20; the cover assembly 30 can be covered on the top of the base assembly 10. The cover assembly 30 It includes a test cover 31 and a push piece 32. The push piece 32 can be movably arranged in the test cover 31, and the lower end of the push piece 32 can push against the upper end of the chip 2; the first heat dissipation component 40 can be movably passed through the push piece 32. The first heat dissipation component 40 includes a first heat dissipation component 41 and a second heat dissipation component 42. The first heat dissipation component 41 is connected to the second heat dissipation component 42. The lower end of the first heat dissipation component 41 can push against the upper end of the chip 2, the lower end of the second heat dissipation component 42 is connected to the upper end of the first heat dissipation component 41, and the upper end of the second heat dissipation component 42 is passed through the upper end of the cover body component 30.

[0026] The chip aging test socket 1 of the embodiment of the present invention effectively solves the problems of the chip aging test socket 1 not being easy to dissipate heat during long-term operation and low efficiency of temperature cycle aging test in the prior art through the collaborative innovative design of multiple components, and brings about a significant heat dissipation effect.

[0027] In terms of chip 2 testing and heating, the limiting piece 11 of the base assembly 10 provides a stable and precise placement position for the chip 2, ensuring that the chip 2 does not displace during the testing process, ensuring the accuracy of the test. The probe piece can be provided through the temperature control assembly 20 and connected with the chip 2 and the test circuit board 3, realizing reliable electrical connection between the chip 2 and the test circuit board 3, so that the test signal can be accurately transmitted. The temperature control assembly 20 is floatingly arranged in the base assembly 10 and located below the limiting piece 11, and the upper end surface thereof is in close contact with the chip 2. This close contact design ensures that heat can be efficiently and uniformly transferred to the chip 2, thereby accurately simulating the high-temperature environment of the chip 2 in the actual working scenario, ensuring the reliability of the high-temperature aging test.

[0028] In terms of chip 2 fixation and pressure control, the test cover 31 of the cover assembly 30 is arranged above the base assembly 10 to provide closed and stable protection for the entire test environment. The abutting piece 32 is movably arranged in the test cover 31, and the lower end thereof can abut on the upper end of the chip 2. By adjusting the position and pressure of the abutting piece 32, the pressure borne by the chip 2 can be flexibly controlled to meet the testing needs of different chips 2, and ensure that the chip 2 maintains good contact with the probe piece and the temperature control assembly 20 during the testing process, while avoiding damage to the chip 2 due to excessive pressure.

[0029] In terms of improving the heat dissipation performance, the first heat dissipation assembly 40 is movably arranged in the abutting piece 32, which is one of the core innovations of the present application. The lower end of the first heat dissipation piece 41 abuts on the upper end of the chip 2, which can directly absorb the heat generated by the chip 2. The second heat dissipation piece 42 is in communication with the first heat dissipation piece 41, and the lower end thereof is connected with the upper end of the first heat dissipation piece 41, and the upper end thereof is arranged in the upper end of the cover assembly 30. When the chip 2 generates heat during the high-temperature aging test, the heat is first absorbed by the first heat dissipation piece 41, and then quickly conducted to the outside of the test seat through the first heat dissipation piece 41 and the second heat dissipation piece 42 in communication, forming an efficient heat dissipation channel. This heat dissipation method can quickly reduce the temperature of the chip 2 and its surrounding environment, greatly shortening the heat dissipation time. During the temperature cycle aging test, the heating and cooling process of the chip 2 can be quickly completed, significantly improving the test efficiency and reducing the test cost. At the same time, it also reduces the damage to the test seat itself caused by long-term high temperature, prolonging the service life of the test seat.

[0030] Specifically, the chip aging test seat 1 of the present embodiment mainly comprises a base assembly 10, a temperature control assembly 20, a cover assembly 30 and a first heat dissipation assembly 40, and each assembly cooperates with each other to complete the high-temperature aging test and temperature cycle aging test of the chip 2.

[0031] The base assembly 10 is fixedly arranged on the test circuit board 3 through the bottom plate 12, ensuring the stable connection between the whole test seat and the test circuit board 3. The base assembly 10 comprises a limiting piece 11 and a probe piece. The limiting piece 11 is a metal frame processed with high precision, whose internal shape matches the shape of the chip 2 to be tested, and can accurately limit the position of the chip 2 to prevent the chip 2 from moving during the test. The probe piece is a high-precision elastic probe, which is uniformly distributed on the inner side of the limiting piece 11. The lower end of the probe piece is connected to the pads on the test circuit board 3 by welding or pressure connection, and the upper end can pass through the temperature control assembly 20. When the chip 2 is placed in the limiting piece 11, the probe piece is in close contact with the test points on the chip 2, realizing the electrical connection between the chip 2 and the test circuit board 3, and ensuring that the test signal can be accurately transmitted.

[0032] The temperature control assembly 20 is arranged in the base assembly 10 in a floating manner. Specifically, the temperature control assembly 20 is connected to the base assembly 10 through elastic supports (such as springs), so that it can float up and down within a certain range. The temperature control assembly 20 is located below the limiting piece 11, and its upper end is made of a material with high thermal conductivity (such as copper alloy or thermal conductive glue) and is processed with high precision to ensure the surface flatness, so as to realize the close fit with the lower surface of the chip 2. The temperature control assembly 20 is internally provided with a heating element (such as a heating wire or a heating film), which can quickly heat the chip 2 to the required working temperature or a state higher than the working temperature through external power supply. The probe piece passes through the hole reserved on the side or bottom of the temperature control assembly 20, and is connected to the chip 2 and the test circuit board 3, ensuring that the electrical connection is not affected during heating.

[0033] The cover assembly 30 is arranged above the base assembly 10 and comprises a test cover 31 and a stop piece 32. The test cover 31 is made of high-strength plastic or metal material and has good sealing and insulation properties, which can provide reliable protection for the test environment. The stop piece 32 is movably arranged in the test cover 31, which can be a metal rod sleeve that can slide up and down. The lower end of the metal rod sleeve is a flat structure, and the surface is polished to reduce damage to the surface of the chip 2. The stop piece 32 and the test cover 31 are movably connected through screw connection or guide groove structure. By rotating the stop piece 32 or pushing the stop piece 32, the pressure of the lower end of the stop piece 32 on the upper end of the chip 2 can be accurately adjusted, ensuring that the chip 2 maintains good contact with the probe piece and the temperature control assembly 20 during the test, while avoiding damage to the chip 2 due to excessive pressure.

[0034] The first heat sink assembly 40 is movably inserted into the support member 32 and includes a first heat sink 41 and a second heat sink 42. The first heat sink 41 is a temperature-dissipating plate (or copper heat sink) with a flat lower end that directly contacts the upper end of the chip 2, rapidly absorbing heat generated by the chip 2. Multiple tiny heat dissipation channels are internally disposed within the first heat sink 41, increasing the heat dissipation area and improving heat dissipation efficiency. The second heat sink 42 is a hollow metal conduit that communicates with the interior of the first heat sink 41. The lower end of the second heat sink 42 is tightly connected to the upper end of the first heat sink 41 via welding or threaded connections, ensuring smooth heat conduction. The upper end of the second heat sink 42 is inserted through the upper end of the cover assembly 30 and extends to the exterior of the test socket. In actual use, when the chip 2 generates heat during high-temperature aging testing, the heat is first absorbed by the first heat sink 41, then conducted to the second heat sink 42 through the heat dissipation channels within the first heat sink 41, and finally dissipated into the air outside the test socket through the second heat sink 42. In order to further improve the heat dissipation effect, a heat dissipation fan or heat sink may be installed on the upper end of the second heat dissipation element 42 or heat dissipation fins (such as the third heat dissipation element 45 ) may be provided around the second heat dissipation element 42 to accelerate heat dissipation.

[0035] When performing a high-temperature aging test on a chip 2, first place the chip 2 to be tested in the limiting member 11 of the base assembly 10 to ensure that the chip 2 is in correct contact with the probe member. Then, place the cover assembly 30 on top of the base assembly 10, adjust the position of the abutting member 32 so that its lower end abuts against the upper end of the chip 2, and apply appropriate pressure. Next, start the temperature control assembly 20, heat the chip 2 to the required operating temperature or a state higher than the operating temperature, and perform a high-temperature aging test. During the cycle test, the heat generated by the chip 2 is quickly dissipated to the outside of the test seat through the first heat dissipation assembly 40, ensuring that the temperature of the chip 2 and its surrounding environment is stable. When a temperature cycle aging test is required, after completing the high-temperature test phase, turn off the temperature control assembly 20, and cycle the chip 2 through the first heat dissipation assembly 40 to quickly reduce the temperature of the chip 2 to the set low temperature value, and then restart the temperature control assembly 20 to heat up, and repeat this cycle to complete the temperature cycle aging test. Due to the efficient heat dissipation performance of the first heat dissipation assembly 40, the heat dissipation time is greatly shortened, and the efficiency of the temperature cycle aging test is improved.

[0036] Therefore, it can be understood that the chip aging test socket 1 according to the embodiment of the first aspect of the present invention has at least the following beneficial effects: by driving the first heat dissipation component 40 away from or close to the chip 2, the chip 2 can be attached when the chip 2 needs to be cooled, so that the first heat dissipation component 41 and the second heat dissipation component 42 can be used to quickly cool the chip 2; and when the chip 2 needs to be heated, the first heat dissipation component 41 can be driven away from the chip 2, thereby facilitating the heating of the chip 2. By driving the first heat dissipation component 40, the cyclic heating requirements of the chip 2 can be quickly met, thereby improving the efficiency of the aging test of the chip 2.

[0037] Further, refer to Figures 2 to 4 In some embodiments of the present invention, the first heat dissipation assembly 40 further includes a first driving portion 43 and a first sleeve 44. The first driving portion 43 is arranged at the upper end of the first sleeve 44. The first heat dissipation member 41 and the second heat dissipation member 42 are fixedly arranged in the first sleeve 44. The first heat dissipation member 41 is located at the lower end of the first sleeve 44. The first sleeve 44 is movably inserted into the supporting member 32.

[0038] In the chip burn-in test socket 1 of this embodiment, the first heat dissipation assembly 40 further includes a first drive unit 43 and a first sleeve 44. The first sleeve 44 is entirely made of a high-strength metal alloy with certain thermal insulation properties, such as stainless steel or aluminum alloy. This ensures structural stability while reducing interference from external heat on the heat dissipation process within the sleeve. The first sleeve 44 fits tightly and smoothly within the abutment 32, ensuring no shaking or jamming during movement, thereby maintaining the stability of the overall structure of the test socket. The second heat dissipation element 42 and the first heat dissipation element 41 are securely fixed within the first sleeve 44. Specifically, the inner wall of the first sleeve 44 is provided with a number of evenly distributed slots or protrusions (not shown), while the outer surface of the second heat dissipation element 42 is machined with matching clips or grooves at corresponding locations. During installation, the second heat dissipation element 42 is slowly pushed in along the axial direction of the first sleeve 44, so that the clips and slots, or the protrusions and grooves, precisely engage, achieving a reliable mechanical connection. This fixing method not only ensures the stable position of the first heat sink 41 and the second heat sink 42 within the first sleeve 44, preventing them from being displaced by vibration or external forces during testing, but also facilitates the removal, replacement, or maintenance of the second heat sink 42 when necessary. The second heat sink 42 is still a hollow metal conduit, preferably made of a copper alloy with excellent thermal conductivity to accelerate the transfer of heat from the first heat sink 41 to the external environment.

[0039] The first driving part 43 is arranged at the upper end of the first sleeve 44, and realizes the active adjustment of the first heat dissipation assembly 40 in the abutting piece 32. The first driving part 43 can adopt a push rod linear driving device, which is fixed on the upper end of the first sleeve 44 by welding. The driving rod of the first driving part 43 is connected with the movable part (such as a push rod or a sliding block) in the first sleeve 44, and when the first driving part 43 receives an external control signal (such as an electric signal or a gas pressure signal from a test control system), the driving rod will move linearly along the axis direction of the first sleeve 44, thereby driving the first sleeve 44 to move up and down in the abutting piece 32. It can also be understood that when the first sleeve 44 is screwed in the abutting piece 32, the first driving part 43 can also be arranged as a horizontal push rod, which is pushed to rotate around the axis of the first sleeve 44, thereby driving the first sleeve 44 to rotate in the abutting piece 32, and then moving up and down in the abutting piece 32.

[0040] In the actual application scene, when the chip 2 is in the high-temperature aging test stage, the first driving part 43 adjusts the first sleeve 44 to the appropriate position according to the preset program or the real-time monitored temperature of the chip 2, and when the chip 2 reaches the preset temperature and needs to be cooled, the lower end of the first heat dissipation piece 41 is tightly attached to the upper surface of the chip 2 to efficiently absorb the heat generated by the chip 2 and quickly dissipate to the outside of the test seat through the second heat dissipation piece 42. When the heating link in the temperature cycle aging test is needed, the first driving part 43 quickly responds to drive the first sleeve 44 to move upward by a certain distance, so that the first heat dissipation piece 41 is temporarily separated from the upper surface of the chip 2, preventing the first heat dissipation piece 41 from dissipating heat to the chip 2, and at this time, the chip 2 is pressed by the abutting piece 32 to contact the temperature control assembly 20. After the temperature of the chip 2 rises to the set value, the first driving part 43 acts again to move the first sleeve 44 downward, so that the first heat dissipation piece 41 is reattached to the upper surface of the chip 2, and the chip 2 can be cooled again.

[0041] Referring to Figures 2 to 4 In some embodiments of the present application, the second heat dissipation piece 42 is provided with a plurality of second heat dissipation pieces 42, the lower ends of the plurality of second heat dissipation pieces 42 are connected to the upper end face of the first heat dissipation piece 41, the length direction of the plurality of second heat dissipation pieces 42 extends along the axis direction of the first sleeve 44, the shell of the first heat dissipation piece 41 is connected with the shell of the second heat dissipation piece 42, and the inside of the first heat dissipation piece 41 and the inside of the second heat dissipation piece 42 are connected with each other to form a heat dissipation channel (not marked in the figure).

[0042] In the chip aging test socket 1 of the present embodiment, further, the specific implementation is as follows: the second heat dissipation members 42 are provided in plurality, which are uniformly distributed and connected to the upper end surface of the first heat dissipation member 41. For example, 3 to 6 second heat dissipation members 42 can be provided according to the actual heat dissipation requirement and space layout. The lower end of each second heat dissipation member 42 is stably connected to the upper end surface of the first heat dissipation member 41 by a suitable connection method, such as welding or threaded connection with a sealing ring, etc., to ensure good sealing at the connection to prevent leakage of the heat conducting medium. The length direction of the plurality of second heat dissipation members 42 extends along the axis direction of the first sleeve 44. This design enables the second heat dissipation members 42 to make full use of the space inside the first sleeve 44 to increase the heat dissipation length as much as possible in the limited space, thereby improving the heat dissipation efficiency. At the same time, the layout of the plurality of second heat dissipation members 42 extending along the axis direction of the first sleeve 44 is also conducive to uniform heat dissipation and avoids the occurrence of local overheating. The outer shell of the first heat dissipation member 41 and the outer shell of the second heat dissipation member 42 are connected by an integral molding process or a subsequent welding process. The integral molding process can directly manufacture the outer shells of the first heat dissipation member 41 and the second heat dissipation member 42 as one body during the manufacturing process, reducing the connection gap and improving the stability and sealing performance of the structure. The welding process can connect the outer shells of the first heat dissipation member 41 and the second heat dissipation member 42 together after they are respectively manufactured, which also ensures the firmness and sealing performance of the connection. The interior of the first heat dissipation member 41 and the interior of the second heat dissipation member 42 are in communication with each other to form a heat dissipation channel. In actual application, the heat dissipation channel is in a vacuum state and can be filled with a heat conducting medium (such as pure water, etc.) and a capillary structure. When the chip 2 generates heat, the first heat dissipation member 41 absorbs the heat of the chip 2, the pure water is vaporized and rapidly conducted to the second heat dissipation member 42 in the capillary structure, and the heat can be transferred to each second heat dissipation member 42 through the heat conducting medium. Since the second heat dissipation member 42 has a large heat dissipation area and a good heat dissipation structure (such as an internal fin, a spiral channel or an internal structure of a uniform plate, etc.), it can quickly dissipate heat to the external environment. For example, during the high-temperature aging test, the temperature of the chip 2 rises, the heat conducting medium is vaporized and circulates in the heat dissipation channel formed by the first heat dissipation member 41 and the second heat dissipation member 42, continuously taking away the heat of the chip 2, and finally condenses into pure water at the cold end of the second heat dissipation member 42 to flow back to the first heat dissipation member 41 to continue to dissipate heat for the chip 2, ensuring that the temperature of the chip 2 always remains within a suitable range, thereby improving the accuracy and reliability of the chip 2 aging test, and also ensuring the safety of the chip 2 during the test to avoid damage to the chip 2 due to overheating.

[0043] Referring to Figures 2 to 4In some embodiments of the present application, the first heat dissipation assembly 40 further comprises a third heat dissipation member 45, which is arranged in the first sleeve 44 and connected to the inner side wall of the first sleeve 44, and the second heat dissipation member 42 is arranged in the third heat dissipation member 45 and connected to the third heat dissipation member 45.

[0044] Specifically, in the chip aging test seat 1 of the present embodiment, the first heat dissipation assembly 40 further comprises a third heat dissipation member 45 in addition to the first heat dissipation member 41, the second heat dissipation member 42 and the first sleeve 44. The third heat dissipation member 45 is arranged in the first sleeve 44 and tightly connected to the inner side wall of the first sleeve 44. This connection can be achieved by interference fit, i.e. the outer diameter of the third heat dissipation member 45 is slightly larger than the inner diameter of the first sleeve 44, so that the third heat dissipation member 45 is firmly installed on the inner side wall of the first sleeve 44 by extrusion. Alternatively, the third heat dissipation member 45 can be welded to the inner side wall of the first sleeve 44 to ensure the firmness of the connection. The second heat dissipation member 42 is arranged in the third heat dissipation member 45 and connected to the third heat dissipation member 45. In the specific installation, the third heat dissipation member 45 is pre-provided with through holes matching the number and size of the second heat dissipation member 42, and the second heat dissipation member 42 passes through these through holes. In order to ensure good contact connection, the second heat dissipation member 42 and the through holes of the third heat dissipation member 45 can be tightly fitted, or a heat-conducting material such as heat-conducting silicone grease can be applied at the contact part of the second heat dissipation member 42 and the third heat dissipation member 45 to reduce the contact thermal resistance and improve the heat transfer efficiency.

[0045] The third heat dissipation member 45 can be made of a metal material with good heat conduction performance and in a sheet shape, such as a copper sheet or an aluminum sheet. The third heat dissipation member 45 can serve as a heat dissipation fin of the second heat dissipation member 42 and is arranged in the first sleeve 44 in a spaced manner to increase the heat dissipation area of the second heat dissipation member 42. In addition, the internal structure of the third heat dissipation member 45 can also be designed according to the heat dissipation requirement, for example, a plurality of heat dissipation fins (not shown in the figure) are arranged inside the third heat dissipation member 45, which can be distributed along the extension direction of the second heat dissipation member 42 to increase the heat dissipation area and improve the heat dissipation effect. When the chip 2 generates heat, the heat is first absorbed by the first heat dissipation member 41 and then transmitted to the second heat dissipation member 42 through the heat conduction medium. At the same time, since the second heat dissipation member 42 is in contact with the third heat dissipation member 45, part of the heat is also directly transmitted to the third heat dissipation member 45. The third heat dissipation member 45 further dissipates the heat to the air around the first sleeve 44 through the connection with the inner side wall of the first sleeve 44, or transmits the heat to the first sleeve 44 through the contact with the first sleeve 44, and then dissipates the heat through the first sleeve 44. The design of this multi-stage heat dissipation structure greatly enhances the heat dissipation capacity of the first heat dissipation assembly 40, can more effectively dissipate the heat generated by the chip 2, ensures that the chip 2 is always in a suitable temperature environment during the aging test, improves the stability and reliability of the chip 2 aging test, and helps to more accurately evaluate the performance and reliability of the chip 2.

[0046] Further, with reference to Figures 2 to 4 In some embodiments of the present application, the abutting member 32 is connected to the test cover 31 by screwing, and the abutting member 32 comprises a second driving part 321, a second sleeve 322 and an abutting part 323, the second driving part 321 is connected to the abutting part 323 through the second sleeve 322, and the second driving part 321 is driven to rotate to make the abutting part 323 close to and abut against the upper end of the chip 2.

[0047] Specifically, in the chip aging test seat 1 of the present embodiment, the abutting member 32 is installed in the test cover 31 by screwing, which makes the abutting member 32 be able to flexibly and accurately adjust the pressure applied to the chip 2 to meet the requirements in different chip 2 test scenarios. The specific structure, connection mode and working process of each component of the abutting member 32 are described in detail below.

[0048] The inner threaded hole of the test cover 31 is pre-processed with a specific pitch and depth at the position corresponding to the installation of the abutting piece 32. The abutting piece 32 is in the form of a sleeve structure, and the outer surface thereof is processed with external threads matching the inner threaded hole of the test cover 31. When installed, the external threaded end of the abutting piece 32 is aligned with the inner threaded hole of the test cover 31, and the abutting piece 32 is gradually screwed into the test cover 31 by rotating the abutting piece 32 until a suitable initial position is reached. This threaded connection method is not only convenient to install, but also ensures the stability of the connection between the abutting piece 32 and the test cover 31, and will not loosen due to vibration or external force during the test, ensuring the stability of the test environment.

[0049] The second driving part 321 is the power source of the abutting piece 32, which is similar in principle to the first driving part 43 in the foregoing embodiment, and can use a micro motor (not shown in the figure) or manual driving as the driving core. Taking a manually driven nut as an example, the driving nut is installed at the upper end of the second sleeve 322 and can be connected by screw fixation or integrated, ensuring that the micro motor will not shake or displace during operation. Rotating the driving nut can drive the abutting piece 32 to move up and down, thereby driving the abutting part 323 to move up and down. The second sleeve 322 is a hollow structure, and the upper end of the second sleeve 322 is fixedly connected with the second driving part 321, and the lower end is connected with the abutting part 323. When the second driving part 321 is driven to rotate, the second sleeve 322 will move linearly along its own axial direction, thereby driving the abutting part 323 to move up and down. The abutting part 323 is a component that directly contacts the chip 2, and the shape and material selection thereof are crucial to the test effect and safety of the chip 2. The abutting part 323 adopts a circular ring structure with a diameter slightly larger than the size of the chip 2, so as to ensure that pressure can be uniformly applied to the four corners of the chip 2. The material of the abutting part 323 is high-strength and low-friction coefficient engineering plastic, such as polytetrafluoroethylene (PTFE), which can not only ensure that the abutting part 323 has sufficient strength to withstand pressure, but also will not scratch or damage the surface of the chip 2. The abutting part 323 is fixedly connected with the nut by a bolt or a buckle structure, and when the nut moves up and down in the second sleeve 322, it will drive the abutting part 323 to move synchronously. The lower end surface of the abutting part 323 is finely polished to form a smooth plane, and a thin layer of thermal conductive silicone grease is coated on the surface. The thermal conductive silicone grease can fill the small gap between the abutting part 323 and the surface of the chip 2, improve the heat conduction efficiency, and also has a certain buffering effect to reduce the impact force received by the chip 2.

[0050] In the high-temperature aging test of the chip 2, first, the chip 2 is placed in the limiting member 11 of the base assembly 10 to ensure that the chip 2 is in correct contact with the probe member. Then, the second driving part 321 is started by the external control system, and the second driving part 321 starts to rotate in the forward direction to push the abutting part 323 to move downward. In the process of the abutting part 323 approaching the chip 2, the pressure value borne by the chip 2 is monitored in real time by the test system, and when the pressure value reaches a preset appropriate range, the external control system controls the micro motor to stop rotating, so that the abutting part 323 is kept at the position to apply stable pressure to the chip 2. At this time, the temperature control assembly 20 starts to work to heat the chip 2, and the first heat dissipation assembly 40 is ready to perform heat dissipation operation at any time.

[0051] When the heat dissipation link in the temperature cycle aging test needs to be performed, the external control system controls the second driving part 321 to rotate in the reverse direction to drive the abutting part 323 to move upward, so that the abutting part 323 is temporarily separated from the upper surface of the chip 2 to reduce the pressure on the chip 2 and create better conditions for heat dissipation of the chip 2. After the temperature of the chip 2 decreases to a set value, the micro motor rotates in the forward direction again to drive the abutting part 323 to move downward to apply appropriate pressure to the chip 2 again for the next temperature rising test. Through such accurate driving control, flexible adjustment of the position of the abutting part 323 is realized, the pressure borne by the chip 2 can be accurately controlled according to different test requirements, and the accuracy and reliability of the chip 2 aging test are improved.

[0052] Further, with reference to Figures 2 to 4 In some embodiments of the present application, the chip aging test seat 1 further comprises a second heat dissipation assembly 60, which is arranged at the upper end of the first heat dissipation assembly 40, and the lower end of the second heat dissipation assembly 60 abuts against the upper end of the third heat dissipation member 45 and / or the upper end of the second heat dissipation member 42.

[0053] In the chip aging test seat 1 of the present embodiment, the second heat dissipation assembly 60 is made of a metal material with high thermal conductivity and good heat dissipation area, preferably an aluminum alloy material, which is light in weight, controllable in cost and excellent in heat dissipation performance. The assembly mainly includes a heat dissipation base plate (not marked in the figure), heat dissipation fins (not marked in the figure) and a heat dissipation mechanism (not marked in the figure). The heat dissipation base plate is a rectangular metal plate with uniform thickness, and its size is customized according to the mounting space at the upper end of the first heat dissipation assembly 40 to ensure that it can fully cover the upper end of the second heat dissipation member 42 to realize good thermal contact. The surface of the heat dissipation base plate is finely polished to control the roughness at a very low level to improve the heat conduction efficiency between the heat dissipation base plate and the contacting components.

[0054] The heat dissipation fins are evenly and densely distributed on the side of the heat dissipation substrate away from the contact surface. The heat dissipation fins are thin and have a wave or sawtooth shape, which effectively increases the heat dissipation area and promotes air convection between the fins, accelerating heat dissipation. The heat dissipation fins and the heat dissipation substrate are manufactured by an integrated molding process, which is extruded by a precision mold to ensure that there is no contact interface with high thermal resistance between the two, and heat can be quickly conducted from the heat dissipation substrate to the heat dissipation fins. In addition, the heat dissipation fins are also subjected to anodizing treatment to form a dense layer of aluminum oxide protective film, which not only improves the corrosion resistance of the heat dissipation fins, but also enhances their radiation heat dissipation capacity.

[0055] The heat dissipation mechanism is installed at the upper end of the heat dissipation fins, which is used to accelerate air flow and enhance heat dissipation. The heat dissipation mechanism can use a heat dissipation fan, which is installed on the heat dissipation substrate or near the heat dissipation fins by a suitable fixing structure. The speed and air volume of the heat dissipation fan can be adjusted according to the actual heat dissipation requirements. During the chip aging test, when the chip 2 generates heat, the heat is transferred to the second heat dissipation member 42 and / or the third heat dissipation member 45 through the first heat dissipation assembly 40, and then absorbed by the lower end of the second heat dissipation assembly 60 and transferred to the heat dissipation substrate. The heat dissipation substrate conducts heat to the heat dissipation fins, and at the same time, the heat dissipation fan starts to accelerate air flow between the heat dissipation fins, quickly dissipating heat to the outside environment. The design of this multi-stage heat dissipation structure further improves the heat dissipation capacity of the chip aging test seat, ensuring that the chip 2 can maintain a stable temperature during high-temperature aging testing, improving the accuracy and reliability of the test, and also prolonging the service life of the chip. It should be emphasized that the heat dissipation mechanism can also use water cooling to quickly dissipate heat from the heat dissipation fins and the heat dissipation substrate to the outside environment, so the specific heat dissipation structure of the second heat dissipation assembly 60 is not limited in this embodiment.

[0056] Therefore, according to the actual heat dissipation requirements and the internal space layout of the test seat, the second heat dissipation assembly 60 has three installation methods.

[0057] The upper end of the third heat dissipation component 45 is mounted with the second heat dissipation assembly 60. When the second heat dissipation assembly 60 is mounted on the upper end of the third heat dissipation component 45, the lower end of the heat dissipation substrate of the second heat dissipation assembly 60 is tightly attached to the surface of the third heat dissipation component 45 through the heat-conducting silicone grease with high heat conductivity. The heat-conducting silicone grease can fill the tiny gap between the heat dissipation substrate and the third heat dissipation component 45, reduce the thermal resistance, and enable the heat of the third heat dissipation component 45 to be quickly and efficiently transferred to the heat dissipation substrate. The upper end of the second heat dissipation component 42 is mounted with the second heat dissipation assembly 60. When the second heat dissipation assembly 60 is mounted on the upper end of the first heat dissipation assembly 40, the lower end of the heat dissipation substrate of the second heat dissipation assembly 60 is in close contact with the upper end of the second heat dissipation component 42. The heat-conducting silicone grease is also used as the heat transfer medium to ensure that the heat can be smoothly transferred from the second heat dissipation component 42 to the second heat dissipation assembly 60. In terms of the fixing method, the second heat dissipation assembly 60 is accurately placed in the positioning groove by designing a special positioning groove and fixing hole in the test seat, and then it is firmly fixed by using a bolt or a buckle, which ensures that the second heat dissipation assembly 60 will not shift during the test. The upper end of the second heat dissipation component 42 and the upper end of the third heat dissipation component 45 are simultaneously mounted with the second heat dissipation assembly 60. When the second heat dissipation assembly 60 is selected to abut against the upper end of the second heat dissipation component 42 and the upper end of the third heat dissipation component 45, the second heat dissipation assembly 60 can simultaneously conduct heat through the second heat dissipation component 42 and the third heat dissipation component 45, which is more conducive to the heat dissipation of the first heat dissipation assembly 40.

[0058] During the high-temperature aging test of the chip 2, the heat generated by the chip 2 is first absorbed and partially dissipated by the first heat dissipation assembly 40. When the heat is transferred to the second heat dissipation component 42, if the second heat dissipation assembly 60 is mounted on the upper end of the first heat dissipation assembly 40, the heat on the second heat dissipation component 42 will be quickly conducted to the heat dissipation substrate. The heat dissipation fins utilize their large heat dissipation area and special shape design to accelerate the heat exchange with the surrounding air, dissipating heat to the external environment of the test seat.

[0059] Further, with reference to Figure 2 and Figure 4 In some embodiments of the present application, the base assembly 10 further comprises a probe seat 13, which is arranged on the upper end surface of the bottom plate 12. The probe seat 13 is located below the temperature control assembly 20, and a probe is arranged in the probe seat 13. The upper end of the probe is movably arranged in the temperature control assembly 20, and the temperature control assembly 20 is movably arranged on the bottom plate 12 by an elastic member (not shown in the figure).

[0060] In the present chip aging test seat 1, the cooperation design of the probe seat 13 and the floating temperature control assembly 20 ensures the precise and stable contact between the probe and the chip 2, while also considering the effective heating of the chip 2 by the temperature control assembly 20 and the adaptive adjustment during the test process. The specific structure, mounting method and working principle are described in detail below.

[0061] The probe base 13 is made of engineering plastic with high strength and good insulation performance, such as polyether ether ketone (PEEK). This material not only has excellent mechanical strength and can withstand certain pressure and vibration, but also has good electrical insulation, which can effectively avoid electrical interference between the probe pieces and between the probe pieces and other metal parts of the base assembly 10. The probe base 13 is in the shape of a cuboid or a square, and its size is customized according to the number and layout of the probe pieces to ensure that all probe pieces can be stably installed. The lower end surface of the probe base 13 is fixed to the upper end surface of the bottom plate 12 by a plurality of positioning pins and bolts. The positioning pins are inserted into the positioning holes pre-processed on the bottom plate 12 and the probe base 13 to achieve accurate positioning of the probe base 13 and ensure the positional accuracy of the probe pieces and the corresponding pads on the chip 2. The bolts further firmly fix the probe base 13 on the bottom plate 12 to prevent the probe base 13 from moving or shaking during the testing process. On the upper end surface of the probe base 13, a plurality of probe mounting holes are uniformly distributed. The diameters and depths of these mounting holes are accurately machined according to the outer dimensions of the probe pieces to ensure that the probe pieces can be accurately and stably installed in the probe base 13.

[0062] The probe pieces are metal probes with elasticity, usually made of beryllium copper alloy. This material has high elasticity, good electrical conductivity and wear resistance, and can maintain stable electrical performance during multiple insertion and extraction processes. The lower end of the probe piece is inserted into the mounting hole of the probe base 13 and fixed by interference fit or a small amount of thermal conductive glue to ensure close connection between the probe piece and the probe base 13, while ensuring good thermal conductivity to promptly conduct the heat generated by the chip 2 to the probe base 13 and the bottom plate 12. The upper end of the probe piece protrudes from the mounting hole of the probe base 13 and moves through the temperature control assembly 20. Corresponding to the position of the probe piece on the temperature control assembly 20, a through hole matching the diameter of the probe piece is processed. The upper end of the probe piece passes through these through holes, and there is a small gap between the probe piece and the through hole. This gap can not only ensure that the probe piece can freely float up and down when subjected to pressure, but also prevent the probe piece from excessive shaking in the horizontal direction, affecting the contact accuracy with the chip 2. In order to further enhance the contact stability between the probe piece and the chip 2, the upper end surface of the probe piece is gold plated. The gold plating layer can reduce the contact resistance, improve the signal transmission quality, and also prevent the surface of the probe piece from oxidizing and prolong its service life.

[0063] The temperature control assembly 20 is floatingly arranged on the bottom plate 12 by elastic members. The elastic members are selected as a plurality of evenly distributed coil springs made of stainless steel, which have good elasticity and corrosion resistance and can maintain stable elastic properties in long-term use. On the bottom plate 12, a plurality of spring mounting columns are fixed around the mounting area of the probe seat 13 and the temperature control assembly 20, and the top end of each spring mounting column is provided with a threaded hole. The corresponding position of the edge of the temperature control assembly 20 is provided with a spring mounting hole. During installation, the lower end of the coil spring is sleeved on the spring mounting column, and the lower end of the coil spring is fixed on the spring mounting column by a nut to prevent the coil spring from falling off during use. Then, the temperature control assembly 20 is placed on the upper end of the coil spring, and the upper end of the coil spring is inserted into the spring mounting hole of the temperature control assembly 20. At this time, the temperature control assembly 20 is in a suspended state under the support of the coil spring and can float up and down within a certain range relative to the bottom plate 12.

[0064] When the chip 2 is placed on the temperature control assembly 20, the gravity of the chip 2 itself and the external force that may be applied during the test will cause the temperature control assembly 20 to compress the coil spring downward, and the temperature control assembly 20 moves downward along a direction perpendicular to the bottom plate 12 by a certain distance. In this process, the probe member is movably arranged in the temperature control assembly 20 and has its lower end fixed on the probe seat 13, so that the upper end of the probe member will protrude upward relative to the temperature control assembly 20, thereby tightly contacting the pads of the chip 2. The elastic effect of the coil spring can automatically adjust the height of the temperature control assembly 20 according to the thickness and placement position of the chip 2, so as to ensure that the probe member and the chip 2 always maintain good contact pressure and avoid distortion of the test signal or test failure due to poor contact.

[0065] Meanwhile, during the test, if the chip 2 is slightly expanded or deformed due to heating, the temperature control assembly 20 can also be adaptively adjusted under the action of the coil spring, so as to always maintain stable contact between the probe member and the chip 2. The floating temperature control assembly 20 design not only improves the reliability and accuracy of the chip 2 aging test, but also effectively protects the chip 2 and the probe member from damage caused by excessive extrusion.

[0066] In actual chip 2 aging test, the cooperation of probe base 13, probe piece and floatable temperature control assembly 20 plays an important role. Probe base 13 provides a stable mounting base for probe piece, ensuring the position accuracy of probe piece; probe piece passes through the temperature control assembly 20 and can keep good contact with chip 2 when the temperature control assembly 20 floats, realizing accurate electrical connection and data transmission; the floatable design of temperature control assembly 20 can adapt to different states of chip 2 and changes in the test process, ensuring effective heating of chip 2, while avoiding damage to chip 2 caused by mechanical stress. This design makes chip aging test seat 1 meet the test requirements of different types and sizes of chips 2, improves the universality and adaptability of the test seat, and provides a strong guarantee for high-quality production and performance evaluation of chip 2.

[0067] Further, with reference to Figure 2 and Figure 4 In some embodiments of the present application, the temperature control assembly 20 includes a microcapsule PCM structure layer (not shown in the figure) and a resistance wire heating layer (not shown in the figure), the resistance wire heating layer is embedded in the microcapsule PCM structure layer, the probe piece passes through the microcapsule PCM structure layer, and the upper end surface of the microcapsule PCM structure layer is attached to the lower end surface of the chip 2 through a heat-conducting adhesive layer.

[0068] In the present chip aging test seat 1, the temperature control assembly 20 adopts an innovative design of combining microcapsule PCM structure layer and resistance wire heating layer, which realizes efficient, stable and uniform heating of chip 2 by the characteristics of microcapsule phase change material (PCM) and the precise heating of resistance wire, and cooperates with the probe piece to ensure smooth test. The specific structure, installation method of each component and working principle are described in detail below.

[0069] The microcapsule PCM structure layer is one of the core components of the temperature control assembly 20, which is prepared by encapsulating phase change material (PCM) using microcapsule encapsulation technology. The phase change material is selected as a paraffin-based organic phase change material, which has a suitable phase change temperature range (which can be selected according to the actual temperature requirements of the chip 2 aging test) and can absorb or release a large amount of latent heat during the phase change process, thereby effectively stabilizing the temperature of the temperature control assembly 20 and reducing temperature fluctuations. The shell material of the microcapsule is selected as urea-formaldehyde resin, which has good chemical stability and mechanical strength, can prevent the phase change material from leaking during the phase change process, and can also ensure the structural integrity of the microcapsule during long-term use. The microcapsule PCM structure layer is prepared by spray drying or interfacial polymerization of a mixed solution containing phase change material and shell material. The prepared microcapsule PCM structure layer has a uniform sheet structure, and the thickness can be adjusted according to the heating requirements, generally controlled at 2 to 5 mm. The structure layer is filled with a large number of small microcapsule particles, which are uniformly distributed, so that the phase change material can play a uniform role in the entire structure layer.

[0070] The resistance wire heating layer is embedded in the interlayer of the microcapsule PCM structure layer, which provides basic heating heat. The resistance wire is selected as a nickel-chromium alloy wire, which has high resistivity, good oxidation resistance and corrosion resistance, and can work stably for a long time in a high temperature environment. The diameter of the resistance wire is selected according to the heating power and the size of the structure layer, usually between 0.1 and 0.3 mm. In the preparation process, the resistance wire is first wound in a specific spiral shape to increase the length of the resistance wire, thereby obtaining greater heating power under the same voltage. Then, the wound resistance wire is uniformly embedded in the interlayer of the microcapsule PCM structure layer through a special mold and process. When embedding, ensure that the resistance wire is evenly distributed in the microcapsule PCM structure layer to avoid local overheating or uneven heating. The two ends of the resistance wire are led out from the edge of the microcapsule PCM structure layer for connection with the external power supply.

[0071] The probe member can be arranged in the microcapsule PCM structure layer. To ensure the smooth arrangement of the probe member and not to affect the performance of the microcapsule PCM structure layer, a through hole with a diameter slightly larger than that of the probe member is pre-processed on the microcapsule PCM structure layer at the position corresponding to the probe member. The through hole is processed by laser drilling process, which can ensure the size accuracy and surface quality of the through hole and reduce the damage to the internal structure of the microcapsule PCM structure layer. When the probe member is installed, it is inserted into the through hole from the lower end surface of the microcapsule PCM structure layer and is arranged out of the upper end surface of the microcapsule PCM structure layer. There is a certain gap between the probe member and the through hole, which is sealed and heat conduction enhanced by filling the thermally conductive silicone grease. The thermally conductive silicone grease can fill the small gap between the probe member and the through hole, reduce the thermal resistance, and make the heat generated by the chip 2 quickly conduct to the microcapsule PCM structure layer through the probe member, while preventing the leakage of the phase change material in the microcapsule PCM structure layer.

[0072] The upper end surface of the microcapsule PCM structure layer is attached to the lower end surface of the chip 2 through a thermally conductive adhesive layer. The thermally conductive adhesive is a silicone thermally conductive adhesive with high thermal conductivity, which can quickly conduct the heat generated by the resistance wire heating layer and the heat released or absorbed by the microcapsule PCM structure layer during the phase change to the chip 2, ensuring that the chip 2 can quickly reach and stabilize at the set aging test temperature. During the attachment process, an appropriate amount of silicone thermally conductive adhesive is evenly applied to the upper end surface of the microcapsule PCM structure layer, and the thickness of the application is controlled between 0.1 and 0.2 mm to ensure good thermal conductivity and bonding strength. Then, the chip 2 is carefully placed on the microcapsule PCM structure layer coated with thermally conductive adhesive, and appropriate pressure is applied to make the chip 2 tightly attached to the microcapsule PCM structure layer and to expel the air bubbles in the thermally conductive adhesive. Finally, the combination of the entire temperature control assembly 20 and the chip 2 is placed in a constant temperature and humidity environment to allow the silicone thermally conductive adhesive to fully cure and form a firm thermally conductive adhesive layer.

[0073] During the chip 2 aging test process, when the external power is turned on, the resistance wire heating layer begins to heat and transfers heat to the microcapsule PCM structure layer. The phase change material in the microcapsule PCM structure layer absorbs the heat generated by the resistance wire heating layer, and the temperature gradually rises. When the temperature reaches the phase change temperature of the phase change material, the phase change material begins to change phase (such as from solid to liquid), absorbing a large amount of latent heat from the resistance wire heating layer during the phase change, thereby keeping the temperature of the microcapsule PCM structure layer relatively stable and avoiding rapid temperature rise. At the same time, the microcapsule PCM structure layer uniformly conducts heat to the chip 2 through the thermally conductive adhesive layer, causing the temperature of the chip 2 to gradually rise to the set aging test temperature. During the test, if the temperature of the chip 2 fluctuates due to its own heat generation or external environmental factors, the phase change material in the microcapsule PCM structure layer will release or absorb heat through reverse phase change (such as from liquid to solid), automatically adjusting the temperature and maintaining the stability of the temperature of the chip 2.

[0074] It can be understood that the temperature control assembly 20 described above can also use a metal ceramic (MCH) technology, which prints a metal tungsten or molybdenum manganese slurry on a ceramic flow blank, and is sintered at high temperature after hot pressing lamination. This structure makes the heating sheet have good electrical conductivity and thermal conductivity, and the ceramic matrix provides good insulation performance. In addition, thermocouple heater technology can also be used. The thermocouple heater itself does not directly generate heat, but uses a thermocouple as a temperature sensor in combination with a heating element (such as a resistance wire or a ceramic heating sheet) to form a closed-loop temperature control system. The thermocouple converts the temperature signal into an electrical signal and feeds it back to the temperature controller. The temperature controller adjusts the power of the heating element according to the difference between the set temperature and the actual temperature, thereby achieving precise control of the temperature. Therefore, it should be noted that the heating form and structure of the temperature control assembly 20 in the present embodiment are not specifically limited, and the heating of the chip 2 can be achieved.

[0075] The chip aging test method according to the second aspect of the present application is applied to the chip aging test seat 1 of the first aspect of the present application. The chip aging test method comprises the following steps: Step one, place the chip 2 to be tested in the base assembly 10, cover the cover assembly 30, and use the abutting piece 32 to press the chip 2 against the temperature control assembly 20; Step two, heat the temperature control assembly 20 to a preset temperature, and use the temperature control assembly 20 to heat the chip 2; Step three, use the first heat dissipation assembly 40 to cool the chip 2, and at the same time control the temperature control assembly 20 to reduce the temperature; Step four, use the temperature control assembly 20 to heat the chip 2 again, and at the same time control the first heat dissipation assembly 40 to stop cooling the chip 2; Cyclic test, sequentially repeat steps three and four to make the chip aging test seat 1 cyclically test the chip 2 until a preset number of cyclic tests is reached.

[0076] Specifically, the chip 2 aging test method is implemented based on the chip aging test seat 1 of the first aspect of the present application. By precisely controlling the temperature change of the chip 2 during heating and cooling, the complex temperature environment that the chip 2 may experience in actual use is simulated, thereby comprehensively and efficiently completing the aging test of the chip 2. The specific implementation details of each step of the test method are described in detail below.

[0077] Step one: before the chip 2 aging test starts, the chip 2 to be tested needs to be correctly installed in the base assembly 10 of the chip aging test seat 1. First, the operator opens the cover assembly 30, which is connected with the base assembly 10 through a hinge, and can be flexibly opened and closed. After opening the cover assembly 30, the chip 2 is stably placed in the accommodating cavity on the inside of the limiting piece 11, so that it is placed above the temperature control assembly 20, and it is ensured that the pad position of the chip 2 accurately corresponds to the position of the probe piece. When placing the chip 2, attention should be paid to avoid scratching or contaminating the surface of the chip 2 to ensure the accuracy of the test. After the chip 2 is placed, the cover assembly 30 is slowly closed. During the closing process of the cover assembly 30, the abutting piece 32 arranged on the cover assembly 30 will gradually approach the chip 2. The abutting piece 32 is made of elastic rubber material, and its lower end face is a plane, which can uniformly contact the upper surface of the chip 2. When the cover assembly 30 is completely closed, the abutting piece 32 is tightly pressed against the temperature control assembly 20 under the elastic action of itself and the appropriate pressure applied by the cover assembly 30, so as to ensure that the chip 2 and the temperature control assembly 20 and the chip 2 and the probe piece maintain good thermal and electrical contact. At the same time, the abutting piece 32 made of high-temperature-resistant elastic rubber material can also play a buffering role to prevent mechanical damage to the chip 2 due to excessive pressure.

[0078] Step two: after the installation of the chip 2 is completed, the temperature control assembly 20 is started to heat the chip 2. Since the temperature control assembly 20 includes a microcapsule PCM structure layer and a resistance wire heating layer embedded therein, the test system first applies power to the resistance wire heating layer. After power is applied, the resistance wire heating layer rapidly generates heat and transfers the heat to the microcapsule PCM structure layer. The phase change material in the microcapsule PCM structure layer begins to absorb the heat generated by the resistance wire heating layer, and the temperature gradually rises. During the heating process, the temperature sensor arranged near the temperature control assembly 20 or on the chip 2 is used to monitor the temperature change in real time. The temperature sensor uses a high-precision thermocouple or platinum resistance temperature sensor, and its measurement accuracy can reach ±0.1℃, which can accurately feedback the actual temperature of the chip 2. The test system compares the preset temperature value (the preset temperature is set according to the aging test requirements of the chip 2, for example, 125℃) with the actual temperature feedback by the temperature sensor, and controls the heating speed by adjusting the heating power of the resistance wire heating layer.

[0079] Specifically, if the actual temperature is lower than the preset temperature, the test system increases the duty cycle of the PWM controller output pulse, increases the on-time of the power switch tube, and thus increases the heating power of the resistance wire heating layer and speeds up the temperature rising speed; if the actual temperature is close to the preset temperature, the test system gradually reduces the duty cycle of the PWM controller output pulse and reduces the heating power of the resistance wire heating layer to realize smooth temperature rising and avoid temperature overshoot. The specific control mode is to gradually reduce the heating power of the resistance wire heating layer until the power supply is stopped. After the power supply is stopped, the phase change material in the microcapsule PCM structure layer begins to undergo reverse phase change (such as from liquid to solid), releases the heat absorbed before, and further assists the chip 2 in heating; when the actual temperature fed back by the temperature sensor reaches the preset temperature, the resistance wire heating layer maintains the current heating power or stops the power supply, so that the reverse phase change of the phase change material is released, the latent heat of the resistance wire absorbed before is released, and the temperature control assembly 20 is maintained at the preset temperature to provide a stable aging test temperature environment for the chip 2.

[0080] Step three: when the chip 2 completes a certain time of heating aging at a preset temperature, the chip 2 needs to be cooled down, that is, the heat dissipation step. First, the first heat dissipation assembly 40 is started to cool down the chip 2. The first heat dissipation assembly 40 is usually a small-sized uniform plate heat sink or a heat pipe heat sink or a multi-dimensional heat sink combined with a uniform plate and a heat pipe (the specific structure is a multi-dimensional heat sink composed of a flat uniform plate combined with a vertically connected heat pipe and a heat dissipation fin), which is installed close to the chip 2. After the first heat dissipation assembly 40 is started, the first heat dissipation part 41 (specifically, a flat uniform plate combined with a vertically arranged heat pipe) of the first heat dissipation assembly 40 is tightly attached to the chip 2, so that the heat is first absorbed by the first heat dissipation part 41, then conducted to the second heat dissipation part 42 (that is, the vertically arranged heat pipe) through the heat dissipation channel inside the first heat dissipation part 41, and then the second heat dissipation part 42 can also transfer heat to the third heat dissipation part 45 (the heat dissipation fin), and finally the heat is dissipated to the air outside the test seat through the second heat dissipation part 42 and the third heat dissipation part 45. In order to further improve the heat dissipation effect, a heat dissipation fan, a water-cooled heat sink or a heat dissipation fin (that is, the second heat dissipation assembly 60) can be installed at the upper end of the second heat dissipation part 42 or heat dissipation fins (that is, the third heat dissipation part 45) can be arranged on the side of the second heat dissipation part 42, to accelerate the dissipation of heat and the cooling process of the chip 2. At the same time, the test system controls the temperature control assembly 20 to cooperatively cool down the chip 2. The specific control mode is that the temperature control assembly 20 stops power supply, the resistance wire stops heating, and the phase change material in the microcapsule PCM structure layer begins to undergo reverse phase change. In this process, the heat released by the phase change material previously absorbed continues to heat the chip 2, and the chip 2 enters the heat dissipation stage in cooperation with the first heat dissipation assembly 40. The continuous heating of the chip 2 can avoid the damage of thermal stress caused by the sudden drop in temperature of the chip 2 due to the heat dissipation of the first heat dissipation assembly 40. Therefore, the temperature control assembly 20 can assist the first heat dissipation assembly 40 to cool down the chip 2. The heat release of the phase change material of the temperature control assembly 20 itself combined with the forced convection heat dissipation of the first heat dissipation assembly 40 can quickly and uniformly reduce the temperature of the chip 2 and reduce the influence of temperature gradient on the performance of the chip 2.

[0081] During the heat dissipation process, the temperature sensor continuously monitors the temperature of the chip 2, and the test system dynamically adjusts the rotating speed of the heat dissipation fan at the upper end of the second heat dissipation part 42 or the power of the water-cooled heat sink (that is, the second heat dissipation assembly 60) according to the difference between the preset target temperature (for example, 85°C) and the actual temperature. For example, when the actual temperature and the target temperature differ greatly, the heat dissipation fan runs at a high speed to speed up the heat dissipation; when the actual temperature approaches the target temperature, the rotating speed of the heat dissipation fan gradually decreases to achieve stable cooling, so as to avoid the damage of thermal stress caused by the sudden drop in temperature of the chip 2.

[0082] Step four: when the temperature of the chip 2 drops to the preset target temperature for temperature drop, a secondary heating step is entered. At this time, the test system starts the temperature control assembly 20 to heat the chip 2 again, while controlling the first heat dissipation assembly 40 to stop cooling the chip 2. The heating process of the temperature control assembly 20 is similar to the aforementioned step two step, by adjusting the heating power of the resistance wire heating layer, the temperature of the temperature control assembly 20 gradually rises, and then the heat is transferred to the chip 2, so that the temperature of the chip 2 rises. In the secondary heating process, the temperature of the chip 2 is also monitored in real time by the temperature sensor, and the heating power of the resistance wire heating layer is accurately controlled according to the difference between the preset secondary heating target temperature (which can be the same as the initial preset temperature or adjusted according to the test requirements, for example, back to 125℃ again) and the actual temperature, to ensure that the chip 2 can quickly and stably reach the secondary heating target temperature.

[0083] Cyclic test: after completing the secondary heating step, the steps of step three and step four are repeated in turn to form a complete temperature cycle. In each cycle, the chip aging test seat 1 continuously tests the performance of the chip 2, including but not limited to electrical performance tests (such as leakage current, threshold voltage, output current, etc.), function tests (such as the correctness of the internal logic circuit of the chip 2, the accuracy of signal transmission, etc.). The test system will record the performance parameters of the chip 2 in each cycle and compare them with the initial test data or the preset qualified standard. At the same time, the test system will preset the number of cyclic tests, which is set according to the aging test standard of the chip 2 or the requirements of the customer, for example, 1000 cycles. When the number of repeated steps three and four steps reaches the preset number, the cyclic test is completed. After the cyclic test is completed, the test system will analyze and process all the recorded test data to generate a detailed test report. The test report contains the performance change curve of the chip 2 in each cycle, whether there is performance degradation or failure, etc. Information provides a scientific basis for quality evaluation and reliability analysis of the chip 2. Through this cyclic test method, the repeated temperature change environment that the chip 2 may experience in actual use can be fully simulated, the stability and reliability of the chip 2 in the long-term use process can be effectively detected, and the quality of the chip 2 product can be improved.

[0084] Further, in some embodiments of the second aspect of the application, the chip aging test seat 1 further comprises a second heat dissipation assembly 60, the second heat dissipation assembly 60 is arranged at the upper end of the first heat dissipation assembly 40, the lower end of the second heat dissipation assembly 60 abuts the upper end of the second heat dissipation member 42, and step three further comprises the following step: dissipating heat from the first heat dissipation assembly 40 by using the second heat dissipation assembly 60.

[0085] In some embodiments, the step three further comprises the following steps: connecting the second heat dissipation component 60 with a thermoelectric component (not shown in the figure), using the thermoelectric component to generate electricity from the heat dissipated by the second heat dissipation component 60, and storing the generated electricity in an energy storage module (not shown in the figure) after energy processing. Specifically, the thermoelectric component can be disposed in the external environment of the chip aging test seat 1, and the thermoelectric component is connected to the heat dissipation end of the second heat dissipation component 60. The heat dissipated by the second heat dissipation component 60 can be transferred to the thermoelectric component, so that the thermoelectric component can convert heat into electricity. In the step three, the heat of the chip 2 is taken away by forced convection, and the heat is dissipated to the surrounding environment. The thermoelectric component uses a thermoelectric generator based on the Seebeck effect, which is composed of a plurality of P-type and N-type semiconductor thermocouples connected in series, and has the ability to directly convert heat energy into electrical energy. In order to ensure the efficient operation of the thermoelectric component, a suitable temperature difference should be formed on both sides of the thermoelectric component. In step three, the hot air discharged by the second heat dissipation component 60 directly blows to the hot end of the thermoelectric component, so that the temperature of the hot end is increased; while the cold end of the thermoelectric component is assisted by other heat dissipation components to maintain the temperature of the cold end at a relatively low level. Generally, by reasonably designing the heat dissipation structure, a temperature difference of 50 to 100℃ can be formed between the hot end and the cold end of the thermoelectric component, which can ensure that the thermoelectric component has a high power generation efficiency. The electrical energy processed by the energy processing circuit is transmitted to the energy storage module on the test circuit board 3 through the wire for storage. The energy storage module is a super capacitor group, which can quickly absorb and release electrical energy, and store the energy recovered by the thermoelectric component. In the subsequent test process, the electrical energy stored in the energy storage module can be used to power the resistance wire heating layer, assisting the external power supply to jointly maintain the aging test temperature of the chip 2, thereby reducing the dependence on the external power supply.

[0086] Further, in some embodiments of the second aspect of the application, the temperature control assembly 20 comprises a microcapsule PCM structure layer and a resistance wire heating layer, the resistance wire heating layer can be embedded in the microcapsule PCM structure layer, the probe can pass through the microcapsule PCM structure layer, and the upper end surface of the microcapsule PCM structure layer is attached to the lower end surface of the chip 2 through a heat-conducting adhesive layer; the step of step four further comprises the following steps: increasing the temperature of the resistance wire heating layer to heat the microcapsule PCM structure layer, and the microcapsule PCM structure layer heats the chip 2.

[0087] In other embodiments, step four can also include the following steps: controlling the resistance wire heating layer to utilize the power source in the energy storage module to heat the microcapsule PCM structure layer, and heating the chip 2 through the microcapsule PCM structure layer. After the heat and electricity recovery of step three, the energy storage module (super capacitor group) has stored a certain amount of electrical energy. If the energy storage module has sufficient power, the test system sends a start signal to the power supply control circuit of the resistance wire heating layer. The power supply control circuit mainly consists of a power switch tube (such as IGBT), a driving circuit and a protection circuit. The driving circuit receives the control signal of the test system, converts it into a level signal suitable for driving the power switch tube, and makes the power switch tube conductive, so as to connect the power source in the energy storage module with the resistance wire heating layer, forming a current path. The protection circuit monitors the current and voltage in real time to prevent abnormal conditions such as overcurrent and overvoltage from causing damage to the resistance wire heating layer and the energy storage module. Once an abnormality is detected, the protection circuit will quickly cut off the circuit and send an alarm signal. When the resistance wire heating layer obtains the electrical energy provided by the energy storage module, the resistance wire starts to heat. The heat generated by the resistance wire heating layer is first transferred to the microcapsule PCM structure layer in close contact with it. Under the action of the heat of the resistance wire heating layer, the phase change material in the microcapsule PCM structure layer begins to absorb heat and the temperature gradually rises. When the temperature reaches the phase change temperature of the phase change material, the phase change material undergoes solid-liquid phase change, absorbs a large amount of heat during the phase change process, and the temperature remains basically unchanged, while the heat is uniformly stored. With the continuous input of heat, the overall temperature of the microcapsule PCM structure layer rises, and the heat is transferred to the chip 2 through heat conduction. Because the microcapsule PCM structure layer has good thermal uniformity, it can ensure that the chip 2 is evenly heated in all parts, avoiding local overheating or damage of the chip 2 due to excessive temperature gradient. In addition, the characteristics of the microcapsule PCM structure layer in absorbing and releasing heat during the phase change process can also play a certain temperature buffering role, making the temperature change of the chip 2 more stable during the heating process, which is beneficial to improve the accuracy and reliability of the chip 2 aging test.

[0088] During step four, the test system monitors the temperature changes in real time through temperature sensors arranged on the surface of the chip 2 and in the microcapsule PCM structure layer. The temperature sensors use high-precision thermistors or digital temperature sensors to accurately measure the temperature and transmit the data to the test system. According to the difference between the preset secondary heating target temperature (which is set according to the aging test requirements of the chip 2, for example, 125°C) and the actual temperature, the test system dynamically adjusts the heating power of the resistance wire heating layer. Specifically, the test system uses a PID (Proportional-Integral-Derivative) control algorithm to adjust the duty cycle of the PWM controller's output pulse in real time. When the actual temperature is lower than the target temperature, the PID controller increases the duty cycle of the PWM controller's output pulse according to the size and trend of the temperature deviation, increases the on-time of the power switch tube, and thus increases the heating power of the resistance wire heating layer and speeds up the heating rate. When the actual temperature approaches the target temperature, the PID controller gradually reduces the duty cycle of the PWM controller's output pulse, reduces the heating power of the resistance wire heating layer, and realizes smooth heating to avoid temperature overshoot. At the same time, the test system also judges the phase change state of the microcapsule PCM structure layer according to the feedback data of the temperature sensor. When the microcapsule PCM structure layer completes the phase change and the temperature starts to rise rapidly, the test system will further accurately control the heating power to ensure that the temperature of the chip 2 can accurately and stably reach the target temperature and maintain at this temperature for aging test.

[0089] By implementing thermoelectric utilization in step four, the effective utilization of recovered electrical energy in the energy storage module is realized, forming a complete energy recycling system. On the one hand, it reduces the dependence on external power supply and reduces test cost and energy consumption; on the other hand, it utilizes the phase change characteristics of the microcapsule PCM structure layer to heat the chip 2, improves the uniformity and stability of heating, and better simulates the temperature environment of the chip 2 in actual work, thereby more accurately evaluating the reliability and performance changes of the chip 2 in long-term high-temperature environment. In addition, this energy utilization method also helps to reduce heat waste during testing and reduce the impact of the test seat on the surrounding environment, in line with the concept of green and environmental protection.

[0090] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described, but as long as the combinations of the technical features do not contradict, they should be considered within the scope of the present disclosure.

[0091] Of course, the present application is not limited to the above-described embodiments, and those skilled in the art can make equivalent modifications or replacements without departing from the spirit of the present application, and these equivalent modifications or replacements are all included in the scope defined by the claims of the present application.

Claims

1. A chip aging test socket, characterized in that: include: A base assembly, the base assembly is arranged on the test circuit board through a bottom plate, the base assembly includes a limiter and a probe member, the inner side of the limiter is used to place the chip, and the chip is connected to the test circuit board through the probe member; a temperature control assembly, the temperature control assembly being capable of being floatingly disposed in the base assembly, the temperature control assembly being located below the limiting member, the upper end surface of the temperature control assembly being in contact with the lower end surface of the chip, and the probe member being capable of being inserted into the temperature control assembly; a cover assembly, the cover assembly being capable of covering the top of the base assembly, the cover assembly comprising a test cover and a push-up member, the push-up member being capable of being movably disposed in the test cover, the lower end of the push-up member being capable of pushing against the upper end of the chip; and A first heat dissipation component, the first heat dissipation component can be movably inserted into the supporting member, the first heat dissipation component includes a first heat dissipation component and a second heat dissipation component, the first heat dissipation component is connected to the second heat dissipation component, the lower end of the first heat dissipation component can be pressed against the upper end of the chip, the lower end of the second heat dissipation component is connected to the upper end of the first heat dissipation component, and the upper end of the second heat dissipation component is inserted into the upper end of the cover component.

2. The chip aging test socket according to claim 1, characterized in that: The first heat dissipation assembly also includes a first driving part and a first sleeve. The first driving part is arranged at the upper end of the first sleeve. The first heat dissipation member and the second heat dissipation member are arranged in the first sleeve. The first heat dissipation member is located at the lower end of the first sleeve. The first sleeve can be movably inserted into the supporting member.

3. The chip aging test socket according to claim 2, characterized in that: There are multiple second heat sinks, and the lower ends of the multiple second heat sinks are connected to the upper end surface of the first heat sink. The length directions of the multiple second heat sinks extend along the axial direction of the first sleeve. The outer shell of the first heat sink is connected to the outer shell of the second heat sink, and the interior of the first heat sink and the interior of the second heat sink are interconnected to form a heat dissipation channel.

4. The chip aging test socket according to claim 3, characterized in that: The first heat dissipation assembly also includes a third heat dissipation member, which is arranged in the first sleeve and connected to the inner wall of the first sleeve. The second heat dissipation member can be inserted into the third heat dissipation member and contacted and connected with the third heat dissipation member.

5. The chip aging test socket according to claim 1, characterized in that: The abutting member is connected to the test cover by a thread, and the abutting member includes a second driving part, a second sleeve and a abutting top part. The second driving part is connected to the abutting top part through the second sleeve, driving the second driving part to rotate so that the abutting top part approaches and abuts the upper end of the chip.

6. The chip aging test socket according to claim 4, characterized in that: It also includes a second heat dissipation component, which is arranged at the upper end of the first heat dissipation component, and the lower end of the second heat dissipation component abuts against the upper end of the second heat dissipation element and / or the third heat dissipation element.

7. The chip aging test socket according to claim 1, characterized in that: The temperature control component includes a microcapsule PCM structural layer and a resistance wire heating layer. The resistance wire heating layer can be embedded in the microcapsule PCM structural layer, and the probe component can be inserted into the microcapsule PCM structural layer. The upper end surface of the microcapsule PCM structural layer is bonded to the lower end surface of the chip through a thermal conductive adhesive layer.

8. A chip aging test method, characterized in that: Applicable to the chip aging test socket according to any one of claims 1 to 5, the method comprises the following steps: Step 1: Place the chip in the base assembly, close the cover assembly, and use the push piece to press the chip against the temperature control assembly; Step 2: raising the temperature of the temperature control component to a preset temperature, and heating the chip by using the temperature control component; Step 3, using the first heat dissipation component to cool the chip, while controlling the temperature control component to lower the temperature; Step 4: heating the chip again by using the temperature control component, and controlling the first heat dissipation component to stop cooling the chip; Cycle test: repeat step 3 and step 4 in sequence, so that the chip aging test seat performs cycle test on the chip until the preset number of cycle tests is reached.

9. A chip aging test method according to claim 8, characterized in that: The chip aging test seat also includes a second heat dissipation component, which is arranged at the upper end of the first heat dissipation component, and the lower end of the second heat dissipation component abuts the upper end of the second heat dissipation component. The step three also includes the following steps: using the second heat dissipation component to dissipate heat for the first heat dissipation component.

10. A chip aging test method according to claim 9, characterized in that: The temperature control component includes a microcapsule PCM structural layer and a resistance wire heating layer. The resistance wire heating layer can be embedded in the microcapsule PCM structural layer. The probe member can be inserted into the microcapsule PCM structural layer. The upper end surface of the microcapsule PCM structural layer is bonded to the lower end surface of the chip through a thermal conductive adhesive layer. The step four also includes the following steps: increasing the temperature of the resistance wire heating layer so that the resistance wire heating layer heats the microcapsule PCM structural layer, and the microcapsule PCM structural layer heats the chip.

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