All-channel measurement system based on analog chip test equipment
By using a full-channel measurement system, combined with a variable temperature chamber and high-temperature resistant wires, the problems of signal accuracy and channel utilization in analog chip testing equipment across the entire temperature range were solved. Stable testing and signal transmission were achieved in extreme temperature environments, improving the adaptability and accuracy of the testing equipment.
Patent Information
- Application Number
- CN202510910300.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-02
- Publication Date
- 2025-10-17
AI Technical Summary
Existing analog chip testing equipment cannot perform tests across the entire temperature range, thus failing to reflect the chip's true performance under extreme temperature conditions. Furthermore, some channels are not involved in the test, leading to inaccurate signal output.
A full-channel measurement system based on analog chip testing equipment was designed, including a full-channel measurement device, a nitrogen purging device, a heating device, a cooling device, a ventilation device, an analyzer, chip testing equipment, and a resistive load board. Through the combination of a variable temperature chamber, a through-chamber connector, and a heat-resistant wire, stable testing and signal transmission over a wide temperature range are achieved.
Stable testing over a wide temperature range was achieved, ensuring the accuracy of signal output and the participation of all channels, improving test quality, and adapting to the operating conditions of extreme environments such as automotive electronics.
Smart Images
Figure CN120801996A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of chip testing equipment, in particular to a full-channel measurement system based on analog chip testing equipment. BACKGROUND
[0002] Chip testing is an important link for verifying and evaluating the performance of chips in the production process. Generally, after manufacturing, a final test is performed, and through the cooperation of a handler and a tester, the functions and electrical parameters of each chip after packaging are tested to determine the good or bad chips or their grades.
[0003] With the vigorous development of the semiconductor chip market, more and more customers pay attention to the detection means and quality improvement of semiconductor chips, and the accuracy of the signal source in the production process is most concerned. Therefore, regular MSA (Measurement System Analysis) of the tester can effectively ensure the stability and accuracy of the output signal of the tester.
[0004] Currently, the general measurement system analysis on the market is based on chips, then the corresponding tester is used for measurement, and finally the measurement system analysis is performed according to the output test results. This method has the following two disadvantages:
[0005] 1) Most of the analog chips on the market are power management chips such as Buck and Boost chips. These chips will rectify the input voltage / current and finally output a stable voltage / current. For example, a Buck chip with an input of 5 to 12V will reduce all voltages in this range to 3.3V. In this case, the input of the tester is either 6V or 7V, and the output is 3.3V, which cannot effectively identify the accuracy of the input signal.
[0006] 2) In order to adapt to the testing needs of most products on the market, the number of voltage / current channels of the analog tester is usually fixed and large, and multiple sites are usually developed for parallel testing. Taking the CTA8280F analog tester as an example, the commonly used Mega configuration has 112 channels, and the Super configuration has 56 channels, which can simultaneously test 8 or fewer chips. When doing measurement system analysis, only one chip is usually used, so the channels of other sites are idle, and only a few channels are used when testing a chip. In this case, the measurement system analysis is essentially only done on the channels needed for product testing, and the channels not used are not actually involved in the measurement system analysis.
[0007] In view of the above problems, the prior art uses a resistance to replace the chip, which can identify different signal inputs and corresponding output values; and a new software and hardware scheme is designed, which can be compatible with all configurations, measure all channels and output corresponding test values, and finally participate in the measurement system analysis, effectively solving the problem that the input signal difference cannot be identified and all channels cannot participate, greatly improving the product test quality;
[0008] However, actual application scenarios require that the chip may face extreme temperature environments in terminal products (such as automotive electronics that need to adapt to -40℃ to 150℃), and the existing test equipment introduces a resistance to replace the chip for testing, which can only test the constant temperature state and cannot reflect the performance under real working conditions; at the same time, the carrier mobility and dielectric constant of semiconductor materials (such as silicon-based devices) have significant temperature dependence, and the electrical characteristics need to be verified under the full temperature range;
[0009] Therefore, it is necessary to develop a full-channel measurement system based on a simulation chip test device to solve the above problems. SUMMARY
[0010] In view of the deficiencies of the prior art, the present application provides a full-channel measurement system based on a simulation chip test device, which solves the problem that the prior art full-channel measurement system based on a simulation chip test device cannot be tested under the full temperature range.
[0011] To achieve the above purpose, the present application realizes the following technical scheme: a full-channel measurement system based on a simulation chip test device, comprising a full-channel measurement device, a nitrogen purging device, a heating device, a cooling device, an air extraction device, an analysis machine, a chip test device and a resistance load board, the full-channel measurement device comprising a base plate and a control box, the control box being fixedly connected to the upper wall of the base plate and close to the right end of the base plate, the lower wall of the base plate being provided with a damping structure, the upper wall of the base plate and being located on the left side of the control box being fixedly connected with a temperature changing box, the temperature changing box being provided with four groups of test cavities distributed left and right inside, the inside wall of the test cavity being provided with a heat insulation layer, the inside of the test cavity being provided with a temperature detection structure, the inside front wall of the test cavity being provided with an opening penetrating through the front wall of the temperature changing box, the inside upper wall and the inside lower wall of the opening being slidably connected with a closing door, the closing door being driven to open and close by an opening door driving structure, the upper wall of the base plate and being located in front of the temperature changing box being provided with a sliding table through a first translation structure, the upper wall of the sliding table and being close to the rear end position being fixedly connected with a second fixed plate, the rear side of the second fixed plate being provided with a push plate through a second translation structure, the side away from the second fixed plate of the push plate being fixedly connected with a supporting plate through a connecting pipe, the supporting plate being fixedly connected with a plug-in module on the upper wall, and the resistance load board being plugged into the plug-in module on the upper wall.
[0012] Preferably, the inner upper wall and the inner lower wall of the opening are both provided with a sliding cavity, the two groups of closed doors are respectively slidably connected to the inner wall of one group of sliding cavities, the two groups of closed doors are both provided with semicircular covers on the opposite sides, the inner walls of the two groups of semicircular covers are both provided with sealing gaskets, and when the two groups of closed doors abut against each other, the opposite sides are sealed by a sealing member, and the door opening drive structure is arranged inside the sliding cavity.
[0013] Preferably, a pipe cover is fixedly connected to the rear wall of the temperature-changing box, and four groups of pipes are arranged in the pipe cover. The nitrogen purge device, heating device, cooling device and exhaust device are respectively connected to the interior of the temperature-changing box through a group of pipes.
[0014] Preferably, a through-bay connector is provided on the outer wall of the connecting tube, and a first wire is provided inside the connecting tube. The front end of the first wire passes through the inner wall of the connecting tube and is connected to the through-bay connector. The end of the first wire away from the through-bay connector passes through the inner wall of the support plate and is connected to the plug-in module. The through-bay connector is connected to the plug-in end of the chip testing equipment through the second wire. The plug-in module and the plug-in end of the chip testing equipment are electrically connected through the first wire and the second wire. The first wire and the second wire are both polyimide-coated silver-plated copper core wires.
[0015] Preferably, the shock-absorbing structure includes multiple groups of shock-absorbing pads, the lower wall of the base plate is fixedly connected to multiple groups of supporting feet, and the multiple groups of shock-absorbing pads are respectively fixedly connected to the lower end of one group of feet.
[0016] Preferably, the door opening drive structure includes two groups of electric telescopic rods, which are respectively fixedly connected to the opposite sides of the two groups of sliding cavities, and the opposite ends of the two groups of electric telescopic rods are respectively fixedly connected to a group of closed doors. The two groups of closed doors are driven to close or open by extending and retracting the extension shafts of the electric telescopic rods.
[0017] Preferably, the first translation structure includes a slide rail, a screw and a servo motor, the servo motor is fixedly connected to the upper wall of the base plate through a first fixed plate, the screw is rotatably connected to the upper wall of the base plate through two sets of rotating seats, the slide rail is fixedly connected to the upper wall of the base plate and is located at the rear side of the screw, the screw and the servo motor output shaft are connected by a synchronous belt and two sets of synchronous wheels, the outer wall of the screw is threadedly connected to the first sliding seat, the upper wall of the slide rail is slidably connected to the second sliding seat, and the upper walls of the first sliding seat and the second sliding seat are jointly fixedly connected to the lower wall of the slide.
[0018] Preferably, the second translation structure comprises a cylinder, two groups of guide columns and two groups of guide bases, the cylinder is fixedly connected to the upper wall of the sliding table and located at the front side of the second fixed plate, the cylinder extends through the inner wall of the second fixed plate and is fixedly connected to the front wall of the push plate, the two groups of guide bases are fixedly connected to the front wall of the second fixed plate and located at the left and right sides of the cylinder respectively, and the two groups of guide columns are fixedly connected to the front wall of the push plate, one end of the guide column away from the push plate penetrates through the second fixed plate and is slidingly connected to the inner side wall of the guide base.
[0019] Preferably, the temperature detection structure comprises a plurality of temperature sensors, and the plurality of temperature sensors are fixedly connected to the inner side wall of the test cavity.
[0020] The application provides a full-channel measurement system based on an analog chip test device, which has the following beneficial effects:
[0021] 1. Compared with the prior art, the full-channel measurement system based on the analog chip test device realizes stable testing of the resistance load board in an extreme temperature environment in a wide temperature range through the collaborative design of the multi-cavity independent temperature control structure of the temperature changing box and the nitrogen purging device, solves the problem that the traditional constant temperature test cannot simulate the wide temperature range performance verification in actual working conditions such as automobile electronics, and significantly improves the matching degree of the test environment and the terminal application scene.
[0022] 2. Compared with the prior art, the full-channel measurement system based on the analog chip test device ensures the transmission fidelity of the high-frequency test signal in the wide temperature range condition while ensuring the mobility of the resistance load board through the combined transmission scheme of the cabin connector and the temperature-resistant wire, overcomes the signal distortion problem caused by temperature change in the traditional test, and makes the analysis result of the full-channel measurement system truly reflect the signal output quality of each channel of the test machine. BRIEF DESCRIPTION OF DRAWINGS
[0023] Figure 1 It is a structural schematic view of the application;
[0024] Figure 2 It is a partial enlarged view of A in the application; Figure 1
[0025] Figure 3 It is a partial enlarged view of B in the application; Figure 1
[0026] Figure 4 It is a partial enlarged view of C in the application; Figure 1
[0027] Figure 5 It is a schematic view of the connecting pipe, the supporting plate, the plug-in module and the resistance load board connecting structure of the application;
[0028] Figure 6 It is a local structure schematic diagram of the temperature changing box of the present application.
[0029] Figure 7 It is a local sectional view of the internal structure side of the temperature changing box of the present application.
[0030] Wherein, 1, bottom plate; 101, bottom foot; 102, shock pad; 2, temperature changing box; 201, opening; 202, pipeline cover; 3, control box; 4, first fixing plate; 5, servo motor; 6, screw rod; 7, sliding rail; 8, first sliding seat; 9, second sliding seat; 10, sliding table; 11, second fixing plate; 12, push plate; 13, guide seat; 14, guide column; 15, air cylinder; 16, connecting pipe; 17, supporting plate; 18, plug-in module; 19, resistance load board; 20, closing door; 21, semicircular cover; 22, sealing pad; 23, electric telescopic rod; 24, temperature sensor; 25, cabin connector; 26, heat insulation layer. DETAILED DESCRIPTION
[0031] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.
[0032] As shown in the drawings, Figures 1 to 7 The embodiment of the present application provides a full-channel measurement system based on an analog chip test device, which comprises a full-channel measurement device, a nitrogen purging device, a heating device, a cooling device, an air extraction device, an analysis machine, a chip test device and a resistance load board 19. The full-channel measurement device comprises a bottom plate 1 and a control box 3. The control box 3 is fixedly connected to the upper wall of the bottom plate 1 and close to the right end of the bottom plate 1.
[0033] In order to reduce the interference of vibration in the operation and transportation process of the equipment on the measurement system, a shock absorption structure is arranged on the lower wall of the bottom plate 1. The shock absorption structure comprises a plurality of shock pads 102. A plurality of bottom feet 101 for supporting are fixedly connected to the lower wall of the bottom plate 1. The plurality of shock pads 102 are fixedly connected to the lower end of one group of bottom feet 101 respectively.
[0034] When the equipment is running or moving, the shock pad 102 absorbs vibration energy, effectively isolates the transmission of external vibration to the bottom plate 1, protects the precise electronic components on the bottom plate 1 from vibration interference, and ensures the stability of the measurement signal.
[0035] In order to realize the extreme environment simulation test of the resistance load board 19 in a wide temperature range (-40℃ to 150℃), and guarantee the independence, efficiency and stability of temperature control, the upper wall of the bottom plate 1 is fixedly connected with a variable temperature box 2 on the left side of the control box 3, four groups of test cavities are arranged inside the variable temperature box 2, a heat insulation layer 26 is arranged on the inner side wall of the test cavity, a pipeline cover 202 is fixedly connected to the rear wall of the variable temperature box 2, four groups of pipelines are arranged in the pipeline cover 202, and the nitrogen blowing device, the heating device, the cooling device and the air exhaust device are respectively connected with the inside of the variable temperature box 2 through a group of pipelines.
[0036] The four independent test cavities allow different temperature conditions to be tested respectively, and the heat insulation layer 26 reduces heat transfer between the cavities; the nitrogen blowing device introduces inert gas to prevent the internal components of the test cavity from oxidizing or frosting at extreme temperatures; the heating device and the cooling device precisely control the temperature in each test cavity through independent pipelines; the air exhaust device quickly replaces the gas in the cavity to realize temperature step change; this design solves the problem that the constant temperature test in the background technology cannot simulate the real extreme working condition environment.
[0037] In order to monitor and control the temperature distribution of the four test cavities in the variable temperature box 2 in real time and accurately, and ensure that the test environment temperature meets the set requirements, a temperature detection structure is arranged inside the test cavity, which includes a plurality of temperature sensors 24, and the plurality of temperature sensors 24 are fixedly connected to the inner side wall of the test cavity.
[0038] When the test cavity is in temperature rising, temperature falling or constant temperature control, the plurality of temperature sensors 24 distributed on the inner side wall of the cavity body collect temperature data of different positions in the cavity body in real time, and feed back to the control system, realizing multi-point temperature monitoring, avoiding measurement error caused by temperature gradient or local overheating / overcooling, and guaranteeing the accuracy of full-temperature test data.
[0039] In order to realize the rapid and reliable sealing and opening of the test cavity opening 201, to adapt to the frequent resistance load board 19 replacement operation, and to ensure the sealing reliability in a wide temperature range (especially at low temperature or temperature cycle), the inside front wall of the test cavity is provided with an opening 201 penetrating the front wall of the variable temperature box 2, the upper inside wall and the lower inside wall of the opening 201 are both slidingly connected with a closing door 20, the closing door 20 is driven to open and close by an opening door driving structure, the upper inside wall and the lower inside wall of the opening 201 are both provided with a sliding cavity, two groups of closing doors 20 are respectively slidingly connected with the inside wall of one group of sliding cavities, the opposite side of the two groups of closing doors 20 is respectively provided with a semicircular cover 21, the inside wall of the two groups of semicircular covers 21 is respectively provided with a sealing gasket 22, the opposite side between the two groups of closing doors 20 is sealed by a sealing element when the two groups of closing doors 20 abut, the opening door driving structure is arranged inside the sliding cavity, and the opening door driving structure comprises two groups of electric telescopic rods 23, the two groups of electric telescopic rods 23 are respectively fixedly connected with the opposite side of the two groups of sliding cavities, the opposite end of the two groups of electric telescopic rods 23 is respectively fixedly connected with one group of closing doors 20, and the two groups of closing doors 20 are driven to close or open by the electric telescopic rods 23 extending out of the shaft and retracting.
[0040] When the resistance load board 19 needs to be put in or taken out, the electric telescopic rods 23 are retracted, the two groups of closing doors 20 are pulled to separate upward and downward along the sliding cavities, and the opening 201 is opened; during testing, the electric telescopic rods 23 are extended, the two groups of closing doors 20 are pushed to close, the semicircular cover 21 is covered on the outer wall of the connecting pipe 16 to form a complete sealing surface, and the sealing gasket 22 is deformed under pressure and forms a tight seal with the sealing element.
[0041] In order to realize the precise positioning and movement of the sliding table 10 carrying the resistance load board 19 in the horizontal direction of the front side of the variable temperature box 2, so as to accurately send the resistance load board 19 into any one of the four independent test cavities, the upper wall of the bottom plate 1 and located at the front side of the variable temperature box 2 is provided with the sliding table 10 through a first translation structure, the first translation structure comprises a sliding rail 7, a screw rod 6 and a servo motor 5, the servo motor 5 is fixedly connected with the upper wall of the bottom plate 1 through a first fixed plate 4, the screw rod 6 is rotatably connected with the upper wall of the bottom plate 1 through two groups of rotating seats, the sliding rail 7 is fixedly connected with the upper wall of the bottom plate 1 and located at the rear side of the screw rod 6, the screw rod 6 and the output shaft of the servo motor 5 are connected through a synchronous belt and two groups of synchronous wheels, the outer wall of the screw rod 6 is threadedly connected with a first sliding seat 8, the upper wall of the sliding rail 7 is slidingly connected with a second sliding seat 9, and the upper walls of the first sliding seat 8 and the second sliding seat 9 are fixedly connected with the lower wall of the sliding table 10.
[0042] When the servo motor 5 is started, the screw rod 6 is driven to rotate through the synchronous belt and the synchronous wheel, the first sliding seat 8 connected with the screw rod 6 is driven to move axially along the screw rod 6, and the second sliding seat 9 slides on the sliding rail 7 to provide guiding support, so as to realize the precise linear motion of the sliding table 10 on the bottom plate 1, and ensure that the resistance load board 19 can be aligned with any test cavity opening 201, and support the multi-cavity parallel testing demand.
[0043] In order to realize the slight and smooth pushing of the resistance load board 19 when it is inserted into the test cavity opening 201, a second fixed plate 11 is fixedly connected to the upper wall of the sliding table 10 and close to the rear end position. A push plate 12 is arranged on the rear side of the second fixed plate 11 through a second translation structure. The second translation structure includes a gas cylinder 15, two groups of guide columns 14 and two groups of guide seats 13. The gas cylinder 15 is fixedly connected to the upper wall of the sliding table 10 and located on the front side of the second fixed plate 11. The gas cylinder 15 extends through the inner wall of the second fixed plate 11 and is fixedly connected to the front wall of the push plate 12. The two groups of guide seats 13 are fixedly connected to the front wall of the second fixed plate 11 and respectively located on the left and right sides of the gas cylinder 15. The two groups of guide columns 14 are fixedly connected to the front wall of the push plate 12. The guide columns 14 penetrate through the second fixed plate 11 and are slidingly connected to the inner side wall of the guide seat 13.
[0044] When the sliding table 10 transports the resistance load board 19 to the front of the specified test cavity opening 201, the gas cylinder 15 extends the shaft and smoothly pushes the push plate 12 to move backward. The guide columns 14 slide in the guide seats 13 to ensure that the push plate 12 and the connected support plate 17, plug-in module 18 and resistance load board 19 are linearly and slightly and smoothly pushed into the test cavity until the resistance load board 19 reaches the predetermined test position, avoiding the inaccuracy of manual operation.
[0045] In order to solve the problem of reliable electrical connection and signal fidelity transmission between the resistance load board 19 and the external chip test equipment under the condition of wide temperature range and high frequency signal, and adapt to the movement demand of the connecting pipe 16 when it is pushed into / drawn out of the variable temperature box 2, the push plate 12 is fixedly connected with the support plate 17 through the connecting pipe 16 on the side away from the second fixed plate 11. The support plate 17 is fixedly connected with the plug-in module 18 on the upper wall. The resistance load board 19 is plugged into the upper wall of the plug-in module 18. The connecting pipe 16 is provided with a cabin connector 25 on the outer peripheral wall. The connecting pipe 16 is provided with a first wire inside. The front end of the first wire penetrates through the inner wall of the connecting pipe 16 and is connected with the cabin connector 25. The end of the first wire away from the cabin connector 25 penetrates through the inner wall of the support plate 17 and is connected with the plug-in module 18. The cabin connector 25 is connected with the plug-in end of the chip test equipment through a second wire. The plug-in module 18 and the plug-in end of the chip test equipment are electrically connected through the first wire and the second wire. The first wire and the second wire are both silver-plated copper core wires coated with polyimide.
[0046] The plug-in module 18 provides its electrical interface when the resistance load board 19 is tested in the test cavity; the input / output of the test signal is transmitted to the through-cabin connector 25 through the first wire (located inside the connecting pipe 16); the through-cabin connector 25 serves as an electrical penetration interface fixed to the outer wall of the connecting pipe 16 and is connected to the external chip testing device through the second wire; the polyimide-coated silver-plated copper core wire has excellent high and low temperature resistance, bending resistance, high frequency and low loss characteristics; the structure ensures that the test signal (especially the high frequency signal) can be stably and low-loss transmitted to the external testing device through the fixed path (the wire inside the connecting pipe 16 and the through-cabin connector 25) when the resistance load board 19 moves in a wide temperature range environment, realizing reliable acquisition and analysis of full-channel signals.
[0047] Working principle: When the equipment is running or moving, the shock-absorbing pad 102 absorbs vibration energy, effectively isolates the external vibration from being transmitted to the bottom plate 1, protects the precision electronic components on the bottom plate 1 from vibration interference, and ensures the stability of the measurement signal; the four independent test chambers allow for tests under different temperature conditions, and the thermal insulation layer 26 reduces heat transfer between chambers; the nitrogen purge device introduces inert gas to prevent the components inside the test chamber from oxidizing or frosting at extreme temperatures; the heating device and the cooling device accurately control the temperature in each test chamber through independent pipelines; the exhaust device quickly replaces the gas in the chamber to achieve a step change in temperature; this design solves the problem in the background technology that constant temperature testing cannot simulate real extreme working conditions; when the test chamber is heated, cooled or kept at a constant temperature, the distribution The multiple groups of temperature sensors 24 on the inner wall of the cavity collect temperature data at different positions in the cavity in real time, and feed it back to the control system to realize multi-point temperature monitoring, avoid measurement inaccuracies caused by temperature gradients or local overheating / undercooling, and ensure the accuracy of full-temperature test data; when the resistance load plate 19 needs to be placed in or taken out, the electric telescopic rod 23 retracts, pulling the two groups of closed doors 20 to separate upward and downward along the sliding cavity, and opening the opening 201; during testing, the electric telescopic rod 23 extends, pushing the two groups of closed doors 20 to close, and the semicircular cover 21 covers the outer wall of the connecting pipe 16 to form a complete sealing surface, and the sealing gasket 22 is deformed under pressure and cooperates with the seal to form a tight seal; when the servo motor 5 is started, the screw 6 is driven to rotate through the synchronous belt and the synchronous wheel, driving the threaded connection The first sliding seat 8 connected to it moves axially along the screw rod 6, and the second sliding seat 9 slides on the slide rail 7 to provide guide support, thereby realizing the precise linear motion of the slide 10 on the base plate 1, ensuring that the resistance load plate 19 can be aligned with any test cavity opening 201, and supporting the requirements of multi-chamber parallel testing; when the slide 10 transports the resistance load plate 19 to the front of the designated test cavity opening 201, the cylinder 15 extends the shaft and pushes it out smoothly, pushing the push plate 12 to move backward, and the guide column 14 slides in the guide seat 13, ensuring that the push plate 12 and the connected supporting plate 17, plug-in module 18, and resistance load plate 19 are pushed into the test cavity slightly and smoothly along a straight line until the resistance load plate 19 reaches the predetermined test position, avoiding the inaccuracy of manual operation; the resistance load plate 19 is moved to the test cavity 201, and ... When the carrier board 19 is tested in the test cavity, the plug-in module 18 provides its electrical interface; the input / output of the test signal is transmitted to the through-cabin connector 25 through the first wire (located inside the connecting tube 16); the through-cabin connector 25 serves as an electrical penetration interface fixed to the outer wall of the connecting tube 16, and is connected to the external chip testing equipment through the second wire; the polyimide-coated silver-plated copper core wire has excellent high and low temperature resistance, bending resistance, high frequency and low loss characteristics; this structure ensures that when the resistive load board 19 moves in a wide temperature range environment, the test signal (especially the high-frequency signal) can be transmitted to the external test equipment stably and with low loss through a fixed path (the wire inside the connecting tube 16 and the through-cabin connector 25), thereby realizing reliable collection and analysis of full-channel signals.
[0048] While embodiments of the application have been shown and described, it is to be understood that the embodiments described are merely exemplary of the principles and application of the present application. Numerous modifications and adaptions can be effected without departing from the spirit and scope of the present application, which is not limited to the exact construction and arrangement described. It is intended, therefore, to cover all modifications and adaptions that fall within the scope of the claims and their equivalents.
Claims
1. A full-channel measurement system based on analog chip test equipment, characterized by: The invention comprises a full-channel measuring device, a nitrogen purge device, a heating device, a cooling device, an exhaust device, an analyzer, a chip testing device and a resistance load plate (19), wherein the full-channel measuring device comprises a base plate (1) and a control box (3), wherein the control box (3) is fixedly connected to the upper wall of the base plate (1) and close to the right end of the base plate (1), the lower wall of the base plate (1) is provided with a shock absorbing structure, the upper wall of the base plate (1) and the left side of the control box (3) are fixedly connected to a variable temperature box (2), the variable temperature box (2) is provided with four groups of test cavities distributed left and right, the inner side wall of the test cavity is provided with a heat insulation layer (26), the inner side wall of the test cavity is provided with a temperature detection structure, and the inner front wall of the test cavity is provided with an opening (201) that penetrates the front wall of the variable temperature box (2). The upper inner wall and the lower inner wall of the opening (201) are both slidably connected to a closed door (20), and the closed door (20) is driven to open and close by a door opening drive structure. The upper wall of the bottom plate (1) is provided with a slide (10) located at the front side of the temperature change box (2) through a first translation structure. The upper wall of the slide (10) is fixedly connected to a second fixed plate (11) near the rear end. The rear side of the second fixed plate (11) is provided with a push plate (12) through a second translation structure. The side of the push plate (12) away from the second fixed plate (11) is fixedly connected to a support plate (17) through a connecting pipe (16). The upper wall of the support plate (17) is fixedly connected to a plug-in module (18), and the resistance load plate (19) is plugged into the upper wall of the plug-in module (18).
2. The full-channel measurement system based on analog chip testing equipment according to claim 1, characterized in that: The inner upper wall and the inner lower wall of the opening (201) are both provided with a sliding cavity, and the two groups of closed doors (20) are respectively slidably connected to the inner wall of one group of sliding cavities. The two groups of closed doors (20) are both provided with a semicircular cover (21) on the opposite side, and the inner wall of the two groups of semicircular covers (21) are both provided with a sealing gasket (22). When the two groups of closed doors (20) are in contact, the opposite sides are sealed by a sealing member, and the door opening drive structure is arranged inside the sliding cavity.
3. The full-channel measurement system based on analog chip testing equipment according to claim 2, characterized in that: The rear wall of the temperature-changing box (2) is fixedly connected to a pipe cover (202), and four groups of pipes are arranged in the pipe cover (202). The nitrogen purge device, the heating device, the cooling device and the exhaust device are respectively connected to the interior of the temperature-changing box (2) through a group of pipes.
4. The full-channel measurement system based on analog chip testing equipment according to claim 3, characterized in that: The outer wall of the connecting tube (16) is provided with a through-cabin connector (25), and a first wire is provided inside the connecting tube (16). The front end of the first wire passes through the inner wall of the connecting tube (16) and is connected to the through-cabin connector (25). The end of the first wire away from the through-cabin connector (25) passes through the inner wall of the supporting plate (17) and is connected to the plug-in module (18). The through-cabin connector (25) is connected to the plug-in end of the chip testing equipment through the second wire. The plug-in module (18) and the plug-in end of the chip testing equipment are electrically connected through the first wire and the second wire. The first wire and the second wire are both polyimide-coated silver-plated copper core wires.
5. The full-channel measurement system based on analog chip testing equipment according to claim 4, characterized in that: The shock-absorbing structure comprises a plurality of groups of shock-absorbing pads (102); a plurality of groups of supporting feet (101) are fixedly connected to the lower wall of the base plate (1); and the plurality of groups of shock-absorbing pads (102) are respectively fixedly connected to the lower end of a group of feet (101).
6. The full-channel measurement system based on analog chip testing equipment according to claim 5, characterized in that: The door opening drive structure comprises two groups of electric telescopic rods (23), the two groups of electric telescopic rods (23) are respectively fixedly connected to opposite sides of the two groups of sliding cavities, and opposite ends of the two groups of electric telescopic rods (23) are respectively fixedly connected to a group of closed doors (20), and the two groups of closed doors (20) are driven to close or open by extending and retracting the extension shafts of the electric telescopic rods (23).
7. The full-channel measurement system based on analog chip testing equipment according to claim 6, characterized in that: The first translation structure comprises a slide rail (7), a screw rod (6) and a servo motor (5); the servo motor (5) is fixedly connected to the upper wall of the base plate (1) through a first fixed plate (4); the screw rod (6) is rotatably connected to the upper wall of the base plate (1) through two sets of rotating seats; the slide rail (7) is fixedly connected to the upper wall of the base plate (1) and is located at the rear side of the screw rod (6); the screw rod (6) and the output shaft of the servo motor (5) are connected through a synchronous belt and two sets of synchronous wheels; the outer wall of the screw rod (6) is threadedly connected to a first sliding seat (8); the upper wall of the slide rail (7) is slidably connected to a second sliding seat (9); the upper walls of the first sliding seat (8) and the second sliding seat (9) are fixedly connected to the lower wall of the slide (10) together.
8. The full-channel measurement system based on analog chip testing equipment according to claim 7, characterized in that: The second translation structure includes a cylinder (15), two groups of guide columns (14) and two groups of guide seats (13), the cylinder (15) is fixedly connected to the upper wall of the slide (10) and is located on the front side of the second fixed plate (11), the extended shaft end of the cylinder (15) passes through the inner wall of the second fixed plate (11) and is fixedly connected to the front wall of the push plate (12), the two groups of guide seats (13) are fixedly connected to the front wall of the second fixed plate (11) and are respectively located on the left and right sides of the cylinder (15), the two groups of guide columns (14) are fixedly connected to the front wall of the push plate (12), and the end of the guide column (14) away from the push plate (12) passes through the second fixed plate (11) and is slidably connected to the inner wall of the guide seat (13).
9. The full-channel measurement system based on analog chip testing equipment according to claim 8, characterized in that: The temperature detection structure comprises multiple groups of temperature sensors (24), and the multiple groups of temperature sensors (24) are all fixedly connected to the inner side wall of the test cavity.