Display device and manufacturing method thereof

Abstract

The invention discloses a display device and a manufacturing method thereof. The display component is positioned on one side of the cover plate; the display assembly comprises a display panel, a heat dissipation plate located on the side, away from the cover plate, of the display panel and a flexible circuit board bound with the display panel, the heat dissipation plate comprises a first edge and a second edge, the two ends of the first edge and the two ends of the second edge are connected, and the flexible circuit board is arranged close to the first edge and attached to the side, away from the display panel, of the heat dissipation plate after being bent; the edge sealing structure at least covers the edge of the first edge of the heat dissipation plate and extends to be close to the edge of the cover plate; the edge sealing structure comprises a first fence, a second fence and a filling layer. The first enclosure is located on the side, close to the display panel, of the cover plate and at least arranged along the edge, corresponding to the first edge, of the cover plate. The second fence is located on the side, away from the cover plate, of the heat dissipation plate and at least arranged along the first edge of the heat dissipation plate. The filling layer is filled in a first groove defined by the first enclosure, the second enclosure, the display assembly and the cover plate, and the bending area of the flexible circuit board is located in the first groove.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, and in particular, to a display device and a manufacturing method thereof. BACKGROUND

[0002] In a conventional mobile phone product, the bonding precision of the cover plate 1', the bending precision of the flexible printed circuit (FPC) 2', the thickness precision of the metal cover layer (MCL) adhesive layer 3' on the surface of the flexible printed circuit 2', the minimum overlap space required by the middle frame 4' of the whole machine (for example, as shown in the overlap diagram of the middle frame and the cover plate in the conventional mobile phone), the assembly precision deviation of the middle frame 4', and the clearance required to ensure that the middle frame 4' and the FPC do not contact each other, so that the distance d' between the edge of the cover plate 1' and the vertex of the bending area of the flexible printed circuit 2' is affected by multiple factors, and the value of d' is large. Figure 1 As shown in the overlap diagram of the middle frame and the cover plate in the conventional mobile phone), the assembly precision deviation of the middle frame 4', and the clearance required to ensure that the middle frame 4' and the FPC do not contact each other, so that the distance d' between the edge of the cover plate 1' and the vertex of the bending area of the flexible printed circuit 2' is affected by multiple factors, and the value of d' is large.

[0003] Therefore, how to reduce the distance between the edge of the cover plate and the vertex of the bending area of the flexible printed circuit, and realize narrow frame design, has become a technical problem to be solved. SUMMARY

[0004] The display device and the manufacturing method thereof provided by the embodiments of the present disclosure solve the above technical problems in the prior art.

[0005] In a first aspect, to solve the above technical problems, the embodiments of the present disclosure provide a display device, comprising:

[0006] a cover plate;

[0007] a display assembly located on one side of the cover plate; the display assembly comprises a display panel, a heat dissipation plate located on a side of the display panel away from the cover plate, and a flexible printed circuit bonded with the display panel, an edge of the heat dissipation plate is recessed relative to an edge of the display panel, the heat dissipation plate comprises a first edge and a second edge, two ends of the first edge and two ends of the second edge are connected, the flexible printed circuit is arranged close to the first edge, and the flexible printed circuit is attached to a side of the heat dissipation plate away from the display panel after being bent;

[0008] An edge sealing structure covering at least an edge of the first side of the heat dissipation plate and extending to an edge of the cover plate; the edge sealing structure comprises a first enclosure, a second enclosure and a filling layer; the first enclosure is located on a side of the cover plate close to the display panel and is arranged at least along an edge of the cover plate corresponding to the first side; the second enclosure is located on a side of the heat dissipation plate away from the cover plate and is arranged at least along the first side of the heat dissipation plate; the filling layer is filled in a first recess formed by the first enclosure, the second enclosure, the display assembly and the cover plate; and the bending area of the flexible circuit board is located in the first recess.

[0009] In a possible implementation, the edge sealing structure surrounds and covers the edge of the heat dissipation plate and extends to the edge of the cover plate.

[0010] The first enclosure surrounds the edge of the cover plate, and a side of the first enclosure away from the second enclosure is close to the edge of the cover plate; and the second enclosure surrounds the edge of the heat dissipation plate, and a side of the second enclosure close to the first enclosure is arranged in recess relative to the edge of the heat dissipation plate.

[0011] In a possible implementation, the first enclosure comprises a plurality of layers of first sub-enclosures arranged in a stack, and the first sub-enclosures surround the edge of the cover plate; and the second enclosure comprises a plurality of layers of second sub-enclosures arranged in a stack, and the second sub-enclosures surround the edge of the heat dissipation plate.

[0012] The longitudinal section area of the second sub-enclosure corresponding to the first side is less than the longitudinal section area of the second sub-enclosure corresponding to the second side.

[0013] In a possible implementation, the first sub-enclosure does not overlap the projection of the display assembly on the cover plate in the projection of the cover plate.

[0014] In a possible implementation, the display device further comprises:

[0015] An ink layer located on a side of the cover plate close to the display panel; an edge of the ink layer has a ring-shaped recess arranged around the edge of the cover plate; and the projection of the first sub-enclosure on the cover plate is located in the projection of the ring-shaped recess on the cover plate.

[0016] In a possible implementation, at least a first layer of the first sub-enclosures in the first enclosure is black, and the first layer of the first sub-enclosures is a layer of the first sub-enclosures closest to the cover plate among the plurality of layers of the first sub-enclosures.

[0017] In a possible implementation, the first sub-enclosure comprises:

[0018] The first baffle wall and the second baffle wall are connected at the head and tail and have the same height; the first baffle wall is located on the side of the first edge away from the second enclosure, the second baffle wall is located on the side of the second edge away from the second enclosure, and the longitudinal section area of the first baffle wall is smaller than that of the second baffle wall; the first baffle wall does not overlap the display assembly in the orthographic projection of the cover plate, and the second baffle wall overlaps the display assembly in the orthographic projection of the cover plate.

[0019] In a possible implementation, the first enclosure comprises a plurality of layers of the first baffle wall arranged in a stacked manner.

[0020] In the direction away from the cover plate, the plurality of layers of the second baffle wall included in the first enclosure are arranged in a stepped manner.

[0021] In a possible implementation, the first enclosure comprises two layers of the second baffle wall arranged in a stacked manner.

[0022] The first layer of the second baffle wall is located on the side of the cover plate close to the display panel, the side of the first layer of the second baffle wall close to the second enclosure abuts against the edge of the heat dissipation plate, and the side of the first layer of the second baffle wall away from the second enclosure is close to the edge of the cover plate.

[0023] The second layer of the second baffle wall is located on the side of the first layer of the second baffle wall away from the cover plate, the end of the second layer of the second baffle wall away from the second enclosure is stepped relative to the end of the first layer of the second baffle wall away from the second enclosure, and the end of the second layer of the second baffle wall close to the second enclosure is stepped relative to the second edge of the heat dissipation plate.

[0024] In a possible implementation, the height of the second sub-enclosure at the corresponding position of the first edge is smaller than the height of the second sub-enclosure at the corresponding position of the second edge.

[0025] In a possible implementation, the filling layer has the same material as the second baffle wall corresponding to the second edge.

[0026] In a possible implementation, the filling layer fills the first groove.

[0027] In a possible implementation, the filling layer comprises:

[0028] The inner filling layer is located in the bending space formed after the flexible circuit board is bent.

[0029] The outer filling layer is located in the space enclosed by the flexible circuit board, the cover plate, the first enclosure, and the second enclosure.

[0030] In a possible implementation, the bending area of the flexible circuit board has two through holes penetrating through the flexible circuit board, and the two through holes are respectively close to two open ends of the bending space.

[0031] In a possible implementation, the display assembly further includes:

[0032] A back film is located between the heat dissipation plate and the display panel and covers part of the flexible circuit board; the back film has a second groove exposing the bending area of the flexible circuit board, and the inner filling layer is filled in the second groove.

[0033] In a possible implementation, the first enclosure has a first spacing with the edge of the cover plate, and the first spacing ranges from 0.02 mm to 0.08 mm.

[0034] In a possible implementation, the display device further includes:

[0035] The middle frame includes a first part and a second part; the first part is located on a side of the edge sealing structure away from the cover plate, and the second part extends from an edge of the first part to the edge of the cover plate and overlaps the cover plate;

[0036] The middle frame adhesive is located between the edge sealing structure and the first part.

[0037] One end of the second part close to the cover plate has an overlapping groove overlapping the edge of the cover plate, one side of the overlapping groove abuts against the edge of the cover plate close to the display panel, and the other side of the overlapping groove abuts against the side of the cover plate.

[0038] In a possible implementation, the second part abuts against multiple layers of the second barrier wall in the first enclosure, and the surface of the second part abutting against the multiple layers of the second barrier wall is a bevel surface.

[0039] In a possible implementation, the display assembly further includes:

[0040] The at least one first accommodating hole is located in the display assembly at a position corresponding to the second side, the first enclosure is arranged along the edge of the first accommodating hole, the first accommodating hole is used for accommodating a receiver, and the part of the first enclosure arranged along the edge of the first accommodating hole is a bevel surface.

[0041] In a possible implementation, the display assembly further includes:

[0042] The second accommodating hole is located in the area surrounded by the edge sealing structure, and the second enclosure extends to the second accommodating hole and surrounds outside the second accommodating hole.

[0043] The edge sealing structure further comprises a third enclosing barrier surrounding the second accommodating hole and located in the area enclosed by the second enclosing barrier, the third enclosing barrier being located on the side surface of the cover plate close to the display panel; the filling layer further fills the space enclosed by the third enclosing barrier and the second enclosing barrier.

[0044] In a possible implementation, the flexible circuit board further comprises:

[0045] A driving chip is located on the side of the flexible circuit board away from the heat dissipation plate, and the flexible circuit board is attached to the side of the heat dissipation plate away from the cover plate.

[0046] The second enclosing barrier at least semi-surrounds the driving chip along the periphery of the driving chip, and the filling layer further fills the area corresponding to the driving chip.

[0047] In a second aspect, the embodiments of the present disclosure provide a manufacturing method of a display device, comprising:

[0048] A display assembly and a cover plate are provided; the cover plate is located on the light exit surface of the display assembly, the display assembly comprises a display panel, a heat dissipation plate located on the side of the display panel away from the cover plate, and a flexible circuit board bonded with the display panel, the edge of the heat dissipation plate is recessed relative to the edge of the display panel, the heat dissipation plate comprises a first edge and a second edge, the two ends of the first edge and the two ends of the second edge are connected, the flexible circuit board is arranged close to the first edge, and the flexible circuit board is attached to the side of the heat dissipation plate away from the display panel after being bent.

[0049] An edge sealing structure is formed on the side of the cover plate close to the display assembly, covering at least the edge of the first edge of the heat dissipation plate and extending to the edge close to the cover plate; the edge sealing structure comprises a first enclosing barrier, a second enclosing barrier and a filling layer; the first enclosing barrier is located on the side of the cover plate close to the display panel and is arranged at least along the edge of the cover plate corresponding to the first edge; the second enclosing barrier is located on the side of the heat dissipation plate away from the cover plate and is arranged at least along the first edge; the filling layer fills the first recess formed by the first enclosing barrier, the second enclosing barrier, the display assembly and the cover plate, and the bent area of the flexible circuit board is located in the first recess.

[0050] In a possible implementation, the edge sealing structure formed on the side of the cover plate close to the display assembly, covering at least the edge of the first edge of the heat dissipation plate and extending to the edge close to the cover plate, comprises:

[0051] On the side of the cover plate close to the display assembly, a plurality of layers of first sub-enclosures are printed along the edge of the cover plate to form the first enclosure, wherein the side of the first enclosure away from the second enclosure is close to the edge of the cover plate;

[0052] On the side of the display assembly away from the cover plate, a plurality of layers of second sub-enclosures are printed along the edge of the heat dissipation plate to form the second enclosure, wherein the printing speed of the second sub-enclosure at the first edge corresponding position is lower than the printing speed at the second edge corresponding position; the side of the second enclosure close to the first enclosure is recessed relative to the heat dissipation plate;

[0053] The first groove is filled with a filler to form the filling layer.

[0054] In a possible implementation, on the side of the cover plate close to the display assembly, a plurality of layers of first sub-enclosures are printed along the edge of the cover plate to form the first enclosure, comprising:

[0055] On the side of the cover plate close to the display assembly, a first layer of second walls corresponding to the second edge is printed; the side of the first layer of second walls away from the second enclosure is close to the edge of the cover plate, and the side of the first layer of second walls close to the second enclosure abuts the edge of the second edge;

[0056] On the side of the first layer of second walls away from the cover plate, a second layer of second walls corresponding to the second edge is printed; the side of the second layer of second walls away from the second enclosure is recessed relative to the side of the first layer of second walls away from the second enclosure, and the side of the second layer of second walls close to the second enclosure is recessed relative to the edge of the second edge;

[0057] On the side of the cover plate close to the display assembly, a plurality of layers of first walls corresponding to the first edge are printed, and the first walls do not overlap the display assembly; wherein the second enclosure is printed before the plurality of layers of first walls are printed, the longitudinal sectional area of the second enclosure is greater than the longitudinal sectional area of the first walls, and the plurality of layers of first walls and the plurality of layers of second walls are connected end to end.

[0058] In a possible implementation, the first groove is filled with a filler to form the filling layer, comprising:

[0059] After the second enclosure is formed, a plurality of layers of first adhesives are printed in the space of the first groove corresponding to the second wall before the plurality of layers of first walls are formed, to form a part of the filling layer corresponding to the second wall in the filling layer; and the first enclosure, the second enclosure, and the part of the filling layer are solidified.

[0060] After forming the first retaining wall, filling and curing a filling material in the space of the first groove corresponding to the first retaining wall to form another portion of the filling layer corresponding to the first retaining wall; wherein the filler includes the first adhesive and the filling material;

[0061] Partial milling is performed on the junction of the first retaining wall and the second retaining wall in the edge sealing structure, so that the side of the edge sealing structure away from the cover plate is flush.

[0062] In one possible implementation, before forming an edge sealing structure on a side of the cover plate close to the display assembly, the edge of the edge sealing structure at least covering the first side of the heat sink and extending close to the edge of the cover plate, the method further includes:

[0063] forming an ink layer on a side of the cover plate close to the display component;

[0064] On a side of the ink layer away from the cover plate, an annular groove is formed surrounding an edge of the ink layer;

[0065] On a side of the cover plate close to the display assembly, a multi-layer first sub-enclosure is printed along the edge of the cover plate, surrounding and close to the edge of the cover plate, to form the first enclosure, including:

[0066] Multiple layers of the first sub-enclosure are printed in the annular groove to form the first enclosure.

[0067] In a possible implementation manner, before bending the flexible printed circuit board, the method further includes:

[0068] Filling and curing the second adhesive in the second groove of the backing film so that the curing rate of the second adhesive reaches a preset ratio; wherein the backing film is located between the display panel and the heat dissipation plate and covers a portion of the flexible circuit board; the second groove exposes the bending area of ​​the flexible circuit board;

[0069] The flexible circuit board is bent so that the cured second adhesive fills the bending space formed after the flexible circuit board is bent, forming an inner filling layer of the filling layer.

[0070] In a possible implementation manner, after bending the flexible printed circuit board, the method further includes:

[0071] injecting a second adhesive into one open end of a bending space formed after the flexible circuit board is bent, and using a fan to absorb the second adhesive at the other open end so that the second adhesive fills the bending space;

[0072] curing the second adhesive filled in the bending space to form an inner filling layer of the filling layer.

[0073] In a possible implementation, after the flexible circuit board is bent, the method further includes:

[0074] blocking two open ends of a bending space formed after the flexible circuit board is bent; wherein the bending area of the flexible circuit board has two through holes, and the two through holes are respectively close to the two open ends;

[0075] injecting a second adhesive into the blocked bending space through one of the through holes until the second adhesive overflows from the other through hole, so that the second adhesive is filled in the bending space;

[0076] curing the second adhesive filled in the bending space to form an inner filling layer of the filling layer. BRIEF DESCRIPTION OF DRAWINGS

[0077] Figure 1 An overlapping schematic diagram of a middle frame and a cover plate in a conventional mobile phone is shown.

[0078] Figure 2 A top view of a back of a display device provided by an embodiment of the present disclosure is shown.

[0079] Figure 3 A structure schematic diagram of a display device provided by an embodiment of the present disclosure is shown. Figure 2 A sectional view in AA' direction is shown.

[0080] Figure 4 A top view of another display device provided by an embodiment of the present disclosure is shown.

[0081] Figure 5 A structure schematic diagram of a display device provided by an embodiment of the present disclosure is shown. Figure 4 A sectional view in BB' direction is shown.

[0082] Figure 6 A sectional view of an edge sealing structure provided by an embodiment of the present disclosure on a side where a flexible circuit board is located is shown.

[0083] Figure 7 A sectional view of an edge sealing structure provided by an embodiment of the present disclosure on a position other than a side where a flexible circuit board is located is shown.

[0084] Figure 8 And Figure 9 A structure schematic diagram of another display device provided by an embodiment of the present disclosure is shown.

[0085] Figure 10 A top view of a back of another display device provided by an embodiment of the present disclosure is shown.

[0086] Figure 11A structure schematic diagram of a display device provided by an embodiment of the present disclosure Figure 9 A cross-sectional view in the direction of CC' of the display device provided by an embodiment of the present disclosure

[0087] Figure 12 A structure schematic diagram of a display device provided by an embodiment of the present disclosure Figure 9 A cross-sectional view in the direction of DD' of the display device provided by an embodiment of the present disclosure

[0088] Figure 13 A cross-sectional view in the direction of EE' of the display device provided by an embodiment of the present disclosure

[0089] Figure 14 A structure schematic diagram of a display device provided by an embodiment of the present disclosure

[0090] Figure 15 A partial top view of a display device provided by an embodiment of the present disclosure

[0091] Figure 16 A schematic diagram of a flexible circuit board before bending provided by an embodiment of the present disclosure

[0092] Figure 17 A schematic diagram of a flexible circuit board after bending provided by an embodiment of the present disclosure

[0093] Figure 18 A structure schematic diagram of a display device provided by an embodiment of the present disclosure Figure 19

[0094] A structure schematic diagram of a display device provided by an embodiment of the present disclosure Figure 20

[0095] A top view of a display device provided by an embodiment of the present disclosure Figure 21

[0096] A cross-sectional view in the direction of FF' of the display device provided by an embodiment of the present disclosure Figure 22 Figure 21 A cross-sectional view in the direction of GG' of the display device provided by an embodiment of the present disclosure

[0097] Figure 23 Figure 21 A top view of a display device provided by an embodiment of the present disclosure

[0098] Figure 24 A cross-sectional view in the direction of HH' of the display device provided by an embodiment of the present disclosure Figure 25

[0099] A top view of a display device provided by an embodiment of the present disclosure Figure 26 Figure 24 A cross-sectional view in the direction of II' of the display device provided by an embodiment of the present disclosure

[0100] Figures 27-28 A top view of a display device provided by an embodiment of the present disclosure​​​

[0101] Figure 29 A method for manufacturing a display device is provided for the embodiments of the present disclosure Figure 27 A cross-sectional view in the direction of MM' is provided for the embodiments of the present disclosure

[0102] Figure 30 A flow chart of a method for manufacturing a display device is provided for the embodiments of the present disclosure

[0103] Figure 31 A manufacturing schematic of an edge sealing structure is provided for the embodiments of the present disclosure

[0104] Figure 32 A schematic of forming an edge sealing structure is provided for the embodiments of the present disclosure

[0105] Figure 33 A schematic of a direct writing air pressure valve printing principle is provided for the embodiments of the present disclosure

[0106] Figure 34 A schematic of a solenoid valve printing principle is provided for the embodiments of the present disclosure

[0107] Figure 35 A position schematic of a glue valve and a cover plate is provided for the embodiments of the present disclosure

[0108] Figure 36 A production process schematic of forming an edge sealing structure is provided for the embodiments of the present disclosure

[0109] Figure 37 A schematic of forming an annular groove is provided for the embodiments of the present disclosure

[0110] Figure 38 A schematic of forming another edge sealing structure is provided for the embodiments of the present disclosure

[0111] Figure 39 A size schematic of a first layer of a second barrier wall is provided for the embodiments of the present disclosure

[0112] Figure 40 A size schematic of a second layer of a second barrier wall is provided for the embodiments of the present disclosure

[0113] Figure 41 Another smearing schematic is provided for the embodiments of the present disclosure

[0114] Figure 42 A schematic of a milling process is provided for the embodiments of the present disclosure

[0115] Figure 43 A schematic of a milling structure is provided for the embodiments of the present disclosure

[0116] Figure 44 A slope angle schematic of a partial first barrier formed by a multi-layer second barrier wall is provided for the embodiments of the present disclosure

[0117] Figure 45 A manufacturing process diagram of another edge sealing structure provided by the embodiments of the present disclosure is shown in FIG. 6.

[0118] Figure 46 A diagram of filling the second adhesive into the bending space provided by the embodiments of the present disclosure is shown in FIG. 7.

[0119] Figure 47 A diagram of filling the second adhesive into the bending space provided by another embodiment of the present disclosure is shown in FIG. 8.

[0120] Reference signs:

[0121] Cover plate 1, display assembly 2, display panel 21, heat dissipation plate 22, flexible circuit board 23, edge sealing structure 3, first enclosure 31, second enclosure 32, filling layer 33, first groove a1, bending area C, first sub-enclosure 311, second sub-enclosure 321, first edge a, second edge b, first barrier wall 311a, second barrier wall 311b, ink layer 4, annular groove 4a, inner filling layer 331, outer filling layer 332, through hole H1, back film 24, second groove 24a, middle frame 5, middle frame adhesive 6, first part 51, second part 52, lapping groove 52a, first accommodating hole H2, third enclosure 34, driving chip 231, second accommodating hole H3. DETAILED DESCRIPTION

[0122] The embodiments of the present disclosure provide a display device and a manufacturing method thereof.

[0123] It should be understood that the specific structures and functional details disclosed in the embodiments of the present disclosure are merely representative, and are for the purpose of describing the exemplary embodiments of the present disclosure. However, the present disclosure can be embodied in many alternative forms, and should not be interpreted as being limited to only the embodiments set forth herein.

[0124] In the description of the disclosure, it needs to be understood that the terms "center", "transverse", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the disclosure and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the disclosure. In addition, the terms "first", "second" are only for description purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second" can be explicitly or implicitly included one or more of the features. In the description of the disclosure, unless otherwise specified, the meaning of "a plurality of" is two or more. In addition, the term "includes" and any variations thereof are intended to cover non-exclusive inclusion.

[0125] In the description of the disclosure, it needs to be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium, or internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the disclosure can be understood according to the specific circumstances.

[0126] The terms used in the disclosure are only for describing specific embodiments and are not intended to limit the exemplary embodiments. Unless the context clearly indicates otherwise, the singular form "a", "an" used herein is also intended to include the plural. It should also be understood that the terms "include" and / or "contain" used herein specify the existence of the stated features, integers, steps, operations, units and / or components, without excluding the existence or addition of one or more other features, integers, steps, operations, units, components and / or combinations thereof.

[0127] The term "and / or" in the embodiments of the disclosure is only to describe the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B can mean that A exists alone, A and B exist together, and B exists alone. In addition, the character " / " in this paper generally represents that the front and rear associated objects have an "or" relationship.

[0128] In order to make the above objectives, characteristics and advantages of the present disclosure more apparent, comprehensible and easier to understand, the present disclosure will be further described below in conjunction with the accompanying drawings and embodiments. However, the example embodiments can be implemented in various forms, and should not be understood as being limited to the embodiments set forth herein; on the contrary, these embodiments are provided so as to make the present disclosure more comprehensive and complete, and to fully convey the ideas of the example embodiments to those skilled in the art. The same reference signs in the drawings represent the same or similar structures, and thus repeated descriptions thereof will be omitted. The words expressing position and direction described in the present disclosure are described with reference to the drawings, but can be changed as needed, and the changes made are included in the protection scope of the present disclosure. The drawings of the present disclosure are only used to illustrate the relative positional relationship and do not represent the true proportions.

[0129] It should be noted that specific details are set forth in the following description in order to provide a thorough understanding of the present disclosure. However, the present disclosure can be practiced in a variety of ways other than those described herein, and those skilled in the art can make similar substitutions without departing from the scope of the present disclosure. Therefore, the present disclosure is not limited to the specific embodiments disclosed below. The subsequent description of the specification is a preferred embodiment for implementing the present disclosure, and is intended to illustrate the general principles of the present disclosure, rather than to limit the scope of the present disclosure. The protection scope of the present disclosure is defined by the appended claims.

[0130] The display device and the manufacturing method thereof provided by the embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings.

[0131] Please refer to Figures 2-3 , Figure 2 A top view of the back of a display device provided by the embodiments of the present disclosure, Figure 3 A display device provided by the embodiments of the present disclosure, Figure 2 A sectional view in the AA' direction, the display device comprising:

[0132] A cover plate 1;

[0133] A display assembly 2 located on the back of the cover plate 1; the display assembly 2 comprises a display panel 21, a heat dissipation plate 22 located on the side of the display panel 21 away from the cover plate 1, and a flexible circuit board 23 bound with the display panel 21, the edge of the heat dissipation plate 22 is recessed relative to the edge of the display panel 21, the heat dissipation plate 22 comprises a first edge a and a second edge b, the two ends of the first edge a and the two ends of the second edge b are connected, the flexible circuit board 23 is arranged close to the first edge a, and the flexible circuit board 23 is attached to the side of the heat dissipation plate 22 away from the display panel 21 after being bent; the second edge b is the remaining edge of the heat dissipation plate 22 other than the first edge a, for example, the heat dissipation plate 22 is rectangular, comprising four edges of upper, lower, left and right, assuming that the "lower" edge is the first edge a, then the remaining three edges (upper, left and right) are collectively referred to as the second edge b.

[0134] The edge sealing structure 3 at least covers the edge of the first side a of the heat sink 22 and extends to the edge close to the cover plate 1; the edge sealing structure 3 includes a first enclosure 31, a second enclosure 32 and a filling layer 33; the first enclosure 31 is located on the side of the cover plate 1 close to the display panel 21, and is arranged at least along the edge of the cover plate 1 corresponding to the first side a; the second enclosure 32 is located on the side of the heat sink 22 away from the cover plate 1, and is arranged at least along the first side a of the heat sink 22, and is indented relative to the edge of the heat sink 22; the filling layer 33 is filled in the first groove a1 jointly enclosed by the first enclosure 31, the second enclosure 32, the display component 2 and the cover plate 1, and the bending area C of the flexible circuit board 23 is located in the first groove a1.

[0135] The first enclosure 31 , the second enclosure 32 and the filling layer 33 may be made of an adhesive, which may be, for example, a colloid. The first enclosure 31 and the second enclosure 32 may use adhesives with the same viscosity, such as an adhesive with a viscosity greater than or equal to 300w.

[0136] In some embodiments, the filling layer 33 is filled in the first groove a1, so that the side of the edge sealing structure 3 away from the cover plate 1 is a plane, that is, the first enclosure 31, the second enclosure 32 and the filling layer 33 are in the same plane away from the cover plate 1. This makes it easy to use the edge sealing structure 3 to protect at least the edge of the side where the flexible circuit board 23 in the display device is located to prevent damage to the flexible circuit board 23.

[0137] like Figure 2 As shown, the first enclosure 31 is arranged around the edge of the cover plate 1 on the side of the cover plate 1 close to the display assembly 2; the second enclosure 32 is arranged around the edge of the heat sink 2 on the side of the heat sink 22 away from the cover plate, and is retracted relative to the edge of the heat sink 22 (that is, the second enclosure 32 is arranged close to the first side a of the heat sink 22, and the orthographic projection of the second enclosure 32 on the cover plate is located within the orthographic projection of the heat sink 22 on the cover plate); as shown Figure 3 As shown, the filling layer 33 is filled in the first groove a1 enclosed by the first enclosure 31 and the second enclosure 32, and the bending area C of the flexible circuit board 23 is located in the first groove a1; therefore, in the display device, the edge sealing structure 3 at least covers the first side a of the heat sink 22 and extends to the edge close to the cover plate 1, so that the bending area C of the flexible circuit board 23 is located in the packaging structure. In this way, the inside and outside of the bending area C of the flexible circuit board 23 are filled as a whole. In the assembly of the whole display device, Figure 1 The middle frame 4' is directly connected to the edge sealing structure 3, which saves at least Figure 1 The minimum overlap space required by the whole middle frame 4 ′ in the prior art is shown, thereby effectively reducing the distance from the vertex of the bending area C of the flexible circuit board 23 to the edge of the cover 1 to achieve a narrow frame design.

[0138] See Figure 4 andFigure 5 , Figure 4 A top view of a display device provided by an embodiment of the present disclosure, Figure 5 A cross-sectional view of the display device provided by an embodiment of the present disclosure, Figure 4 A cross-sectional view of the display device provided by an embodiment of the present disclosure.

[0139] The edge sealing structure 3 surrounds and covers the edge of the heat dissipation plate 22 and extends to the edge close to the cover plate 1;

[0140] The first enclosure 31 surrounds the edge of the cover plate 1, and the side of the first enclosure 31 away from the second enclosure 32 is close to the edge of the cover plate 1; the second enclosure 32 surrounds the edge of the heat dissipation plate 22, and the side of the second enclosure 32 close to the first enclosure 31 is set back relative to the edge of the heat dissipation plate 22.

[0141] In the Figure 4 , the first recess a1 surrounded by the first enclosure 31, the second enclosure 32, the display assembly 2 and the cover plate 1 is annular, and the corresponding filling layer 33 is also annular, and the first enclosure 31 is located outside the annular, and the second enclosure 32 is located inside the annular. Figure 4 The cross-sectional view of the edge sealing structure 3 on the side where the flexible circuit board 23 is located can refer to Figure 3 , and the cross-sectional view of the edge sealing structure 3 at a position other than the side where the flexible circuit board 23 is located can refer to Figure 5 .

[0142] In the embodiments provided by the present disclosure, by letting the edge sealing structure 3 surround and cover the edge of the heat dissipation plate 22 and extend to the edge close to the cover plate 1; and letting the first enclosure 31 surround the edge of the cover plate 1, and the side of the first enclosure 31 away from the second enclosure 32 is close to the edge of the cover plate 1; the second enclosure 32 surrounds the edge of the heat dissipation plate 22, and the side of the second enclosure 32 close to the first enclosure 31 is set back relative to the edge of the heat dissipation plate 22, the edge sealing structure 3 can be integrally protected to the edge of the entire display device, and the characteristics of the display device that is easy to be damaged by falling from the edge are improved.

[0143] Please refer to Figure 6 and Figure 7 , Figure 6 A cross-sectional view of the edge sealing structure provided by an embodiment of the present disclosure on the side where the flexible circuit board is located, Figure 7 A cross-sectional view of the edge sealing structure provided by an embodiment of the present disclosure at a position other than the side where the flexible circuit board is located.

[0144] The first enclosure 31 includes a plurality of first sub-enclosures 311 arranged in layers, and the first sub-enclosure 311 surrounds the edge of the cover plate 1; the second enclosure 32 includes a plurality of second sub-enclosures 321 arranged in layers, and the second sub-enclosure 321 surrounds the edge of the heat dissipation plate 22 (the corresponding top view can refer to Figure 4 );

[0145] AsFigure 6 and Figure 7 The sectional area S1 of the second sub-enclosure 321 corresponding to the first edge a is smaller than the sectional area S2 of the second sub-enclosure 321 corresponding to the second edge b. The sectional area S1 of the second sub-enclosure 321 corresponding to the first edge a is the sectional area in the thickness direction of the second sub-enclosure 321 at any position corresponding to the first edge a in the direction in which the second sub-enclosure 321 points to the first sub-enclosure 311. The sectional area S2 of the second sub-enclosure 321 corresponding to the second edge b is the sectional area in the thickness direction of the second sub-enclosure 321 at any position corresponding to the second edge b in the direction in which the second sub-enclosure 321 points to the first sub-enclosure 311.

[0146] As shown in Figure 6 and Figure 7 The first enclosure 31 includes 6 layers of first sub-enclosures 311, and the second enclosure 32 includes 2 layers of second sub-enclosures 321. However, the sectional area S1 of the second sub-enclosure 321 corresponding to the first edge a (i.e., the side where the flexible circuit board 23 is located) is smaller than the sectional area S2 of the second sub-enclosure 321 corresponding to the second edge b (i.e., the side other than the side where the flexible circuit board 23 is located). Due to the thickness of the flexible circuit board 23 after being bent and the film material between the heat dissipation plate 22 and the bent flexible circuit board 23 at the position of the first edge a, the thickness of the display assembly 2 at the position corresponding to the first edge a is higher than the thickness at the position corresponding to the second edge b. The present disclosure sets the sectional area S1 of the second sub-enclosure 321 corresponding to the first edge a to be smaller than the sectional area S2 of the second sub-enclosure 321 corresponding to the second edge b, so as to adapt to the different thicknesses of the display assembly 2 at the positions of the first edge a and the second edge b, and keep the side of the edge sealing structure 3 away from the cover plate 1 flat.

[0147] It should be understood that, Figure 6 and Figure 7 The actual sectional area of the first edge a and the sectional area of the second edge b are shown in Figure 2 .

[0148] Please continue to refer to Figure 6 and Figure 7 The height h1 of the second sub-enclosure 321 at the position corresponding to the first edge a is smaller than the height h2 at the position corresponding to the second edge b, so as to ensure that the height of the second enclosure 32 at the position of the first edge a is smaller than the height at the position of the second edge b, thereby adapting to the feature that the display module is relatively thick at the position of the first edge a, and keeping the side of the edge sealing structure 3 away from the cover plate 1 flat.

[0149] Please continue to refer to Figure 6 and Figure 7The first sub-enclosure 311 is in the orthographic projection of the cover plate 1 and does not overlap the orthographic projection of the display assembly 2 on the cover plate 1. In this way, the same printing head can be used to print each layer of the first sub-enclosure 311, and there is no need to replace the printing head or adjust the printing parameters during the printing process, thereby improving the printing efficiency.

[0150] Please continue to see Figure 6 and Figure 7 The first sub-enclosure 311 has a first distance d1 from the edge of the cover plate 1, and the first distance d1 is in the range of 0.02mm to 0.08mm. The first distance d1 can be the printing accuracy of the equipment used to print the first sub-enclosure 311. For example, if the printing accuracy of the equipment used to print the first sub-enclosure 311 is 0.05mm, the first distance d1 is set to 0.05mm. In this way, when printing the first sub-enclosure 311, the adhesive used by the first sub-enclosure 311 can be prevented from flowing to the outer edge of the cover plate 1 and causing the shape to collapse.

[0151] As Figure 8 and Figure 9 Another structural schematic diagram of a display device provided by the embodiment of the present disclosure is provided, and the display device further comprises:

[0152] An ink layer 4 is located on the side of the cover plate 1 close to the display panel 21. The edge of the ink layer 4 has a ring-shaped groove 4a arranged around the edge of the cover plate 1. The orthographic projection of the first sub-enclosure 311 on the cover plate 1 is located within the orthographic projection of the ring-shaped groove 4a on the cover plate 1.

[0153] In the display device, the ink layer 4 is arranged on the side of the cover plate 1 facing the display panel 21. If the first enclosure 31 is directly arranged on the ink layer 4 (for example, refer to the arrangement shown in Figure 6 and Figure 7 The first sub-enclosure 311 needs to have at least the first distance d1 from the edge of the cover plate 1 as shown in Figure 6 and Figure 7 to prevent the adhesive from overflowing to the outer edge of the cover plate 1. Compared with the prior art shown in Figure 1 , the distance d' from the edge of the cover plate 1' to the vertex of the bending area of the flexible circuit board 2' does not need to consider the minimum lap space required by the whole machine frame 4' and the first distance d1 shown in Figure 6 and Figure 7 .

[0154] To further reduce the first distance d1 from the first sub-enclosure 311 to the edge of the cover plate 1, the ink layer 4 is provided with a ring-shaped groove 4a around the edge of the ink layer 4. The ring-shaped groove 4a can be arranged close to the edge of the cover plate 1. When the first sub-enclosure 311 is formed, the adhesive used to print the first sub-enclosure 311 is retained in the ring-shaped groove 4a and will not overflow to the outer edge of the cover plate 1. Therefore, it is not necessary toFigure 6 and Figure 7 In this way, at least a first distance d1 corresponding to the printing accuracy of the printing device is retained between the first sub-enclosure 311 and the outer edge of the cover 1, thereby further reducing the distance from the first sub-enclosure 311 to the edge of the cover 1.

[0155] See Figure 8 and Figure 9 In the scheme of setting an annular groove 4a at the edge of the ink layer 4, the color of at least the first layer of the first sub-enclosure 311 in the first enclosure 31 is black, and the first layer of the first sub-enclosure 311 is the layer of the first sub-enclosure 311 closest to the cover plate 1 among the multiple layers of the first sub-enclosure 311, which can prevent light leakage near the annular groove 4a.

[0156] Please continue to see Figure 9 The width w3 of the annular groove 4a can be consistent with the width w1 of the first sub-enclosure 311, and the height h3 of the annular groove 4a is less than or equal to the thickness m of the ink layer 4. If the width w1 of the first sub-enclosure 311 is 2c, the width w3 of the annular groove 4a is also 2c. If the thickness of the ink layer 4 is m, the height h3 of the annular groove 4a can be set to m, and the value range of m is 12.6um to 23.4um.

[0157] See Figures 10-12 , Figure 10 A top view of the back of another display device provided in an embodiment of the present disclosure, Figure 11 An embodiment of the present disclosure provides a Figure 10 Cross-section view in CC' direction, Figure 12 An embodiment of the present disclosure provides a Figure 10 The cross-sectional view in the DD' direction shows the first enclosure 31, including:

[0158] A first retaining wall 311a and a second retaining wall 311b are connected end to end and have the same height; wherein, the first retaining wall 311a is located on the side of the first side a away from the second enclosure 32, and the second retaining wall 311b is located on the side of the second side b away from the second enclosure 32, and the longitudinal section area S3 of the first retaining wall 311a is smaller than the longitudinal section area S4 of the second retaining wall 311b; the orthographic projection of the first retaining wall 311a on the cover plate 1 does not overlap with the orthographic projection of the display component 2 on the cover plate 1, and the orthographic projection of the second retaining wall 311b on the cover plate 1 overlaps with the orthographic projection of the display component 2 on the cover plate 1. The longitudinal section area S3 of the first retaining wall 311a is the cross-sectional area of ​​the first retaining wall 311a at any position in the thickness direction along the direction from the second enclosure 32 to the first enclosure 31; the longitudinal section area S4 of the second retaining wall 311b is the cross-sectional area of ​​the second retaining wall 311b at any position in the thickness direction along the direction from the second enclosure 32 to the first enclosure 31.

[0159] It should be noted that Figure 10 The display assembly 2 includes a display panel 21, a heat sink 22, and a flexible circuit board 23. Figure 10 The middle display surface 21 is blocked and therefore not shown.

[0160] like Figure 11 and Figure 12 As shown, the second retaining wall 311b is set on the side of the second side b away from the second enclosure 32, and the longitudinal section area S3 of the first retaining wall 311a is smaller than the longitudinal section area S4 of the second retaining wall 311b. This can reduce the number of layers of the second retaining wall 311b required to form the first enclosure 31, reduce the formation time of the longest multi-layer second retaining walls 311b of the first enclosure 31, and improve production efficiency. For example, assuming that the total length of the first enclosure 31 is 6l, the length of the first retaining wall 311a is 1, and the length of the second retaining wall 311b is 5l, it is obvious that the length of the second retaining wall 311b accounts for the highest proportion of the total length of the first enclosure 31. Therefore, the fewer the number of layers of the second retaining wall 311b, the less time is consumed in printing, and correspondingly, the less time is spent on forming the first enclosure 31, and the production efficiency can be improved accordingly.

[0161] Since the edge sealing structure 3 needs to cover the bending area C of the flexible circuit board 23 at the position of the first side a, and the orthographic projection of the first retaining wall 311a on the cover plate 1 is set to have no overlap with the orthographic projection of the display component 2 on the cover plate 1, the bending area C of the flexible circuit board 23 can be avoided when printing the first retaining wall 311a, thereby preventing the formation of an uneven first retaining wall 311a in the bending area C. Moreover, since the edge sealing structure 3 covers the bending area C of the flexible circuit board 3, at least there is no need to Figure 1 As shown in the prior art, the minimum overlap space required by the middle frame 4' of the entire machine is taken into consideration, thereby reducing the width of the edge sealing structure 3 at the location of the first side a; and due to the existence of the bending area C, the distance between the first side a of the heat dissipation plate 22 and the edge of the cover plate 1 is greater than the distance between the second side b of the heat dissipation plate 22 and the edge of the cover plate 1. Therefore, the width of the edge sealing structure 3 at the location of the first side a is wider than the width of the edge sealing structure 3 at the location of the second side b. The orthographic projection of the second retaining wall 311b on the cover plate 1 is set to overlap with the orthographic projection of the display component 2 on the cover plate, which can ensure that the edge of the display component 2 corresponding to the second side b is covered by the edge sealing structure 3, and can reduce the width of the edge sealing structure 3 at the location of the second side b.

[0162] like Figure 12 As shown, the first enclosure 31 includes multiple layers of first retaining walls 311a arranged in an overlapping manner;

[0163] See Figure 13Another display device provided by the embodiments of the present disclosure is a cross-sectional view of the second edge b corresponding position. In the direction Y away from the cover plate 1, the first surrounding barrier 31 includes multiple layers of second barriers 311b which are arranged in sequence with a step-by-step manner. As shown in Figure 13 , the second layer of second barriers 311b farthest from the cover plate 1 is recessed by d2 relative to the first layer of second barriers 311b closest to the cover plate 1. If Figure 13 there is a third layer of second barriers 311b on the side of the second layer of second barriers 311b away from the cover plate 1, the third layer of second barriers 311b is also recessed by d2 relative to the second layer of second barriers 311b.

[0164] As shown in Figure 11 and Figure 12 , since the longitudinal cross-sectional area S3 of the first barrier 311a is smaller than the longitudinal cross-sectional area S4 of the second barrier 311b, and the first barrier 311a does not overlap with the display assembly 2 on one side, when printing the first barrier 311a, the adhesive used by the first barrier 311a has less flowability, and can maintain a better shape, so that multiple layers of first barriers 311a can be arranged in an overlapping manner. Since the edge of the heat dissipation plate 22 is recessed relative to the edge of the display panel 21 on the side of the second edge b, the topography covered by the second barrier 311b is in a stepped shape, which causes the adhesive used by the second barrier 311b to flow in the direction away from the edge of the cover plate 1 on the side of the second edge b, so that the inclination of the surface of the second barrier 311b on the side close to the cover plate 1 is greater. When printing the upper layer of second barriers 311b on the side away from the cover plate 1 of the first layer of second barriers 311b closest to the cover plate 1, the upper layer of second barriers 311b is prone to flow in the direction away from the cover plate 1 on the side of the second edge b, so that the topography of the upper layer of second barriers 311b is prone to change. As shown in Figure 13 , in the direction Y away from the cover plate of the second barrier 311b, the multiple layers of second barriers 311b are arranged in sequence with a step-by-step manner, which can reduce the change of the topography of the upper layer of second barriers 311b.

[0165] It should be understood that Figure 13 the cross-sectional view of the second edge b is actually a cross-sectional view of a point on the second edge b.

[0166] Please continue to refer to Figure 13 , the first surrounding barrier 31 includes two layers of second barriers 311b arranged in a stacked manner; the first layer of second barriers 311b is located on the side of the cover plate 1 close to the display panel 21, the side of the first layer of second barriers 311b close to the second surrounding barrier 32 abuts against the edge of the heat dissipation plate 22, and the side of the first layer of second barriers 311b away from the second surrounding barrier 32 is close to the edge of the cover plate 1;

[0167] The second layer of the second barrier wall 311b is located on the side of the first layer of the second barrier wall 311b away from the cover plate 1. The side of the second layer of the second barrier wall 311b away from the second enclosure 32 is recessed relative to the side of the first layer of the second barrier wall 311b away from the second enclosure 32. The side of the first layer of the second barrier wall 311b close to the second enclosure 32 is recessed relative to the second edge b of the heat dissipation plate 22.

[0168] By setting the part of the first enclosure 31 at the position of the second edge b as two layers of the second barrier wall 311b, and making the first layer of the second barrier wall 311b closest to the cover plate 1 abut the edge of the second edge b of the heat dissipation plate 22 and extend to the edge close to the cover plate 1, and making the side of the second layer of the second barrier wall 311b away from the second edge b recessed relative to the side of the first layer of the second barrier wall 311b away from the first edge b, and making the second layer of the second barrier wall 311b extend from the side of the second edge b of the heat dissipation plate 22 away from the edge of the cover plate 1 to the edge close to the first layer of the second barrier wall 311b close to the cover plate 1, the second layer of the second barrier wall 311b can be placed in a relatively flat area, and the appearance of the second layer of the second barrier wall 311b can be changed.

[0169] In some embodiments, the filling layer 33 can be formed of one material.

[0170] In other embodiments, the filling layer 33 can be formed of multiple materials.

[0171] In some embodiments, the filling layer 33 at the position corresponding to the second edge b is formed of the same material as the second barrier wall 311b.

[0172] If the second barrier wall 311b is formed of glue with a viscosity greater than or equal to 300w, the part of the filling layer 33 corresponding to the second edge b is also formed of the glue.

[0173] In the embodiments provided in the present disclosure, by making the filling layer 33 at the position corresponding to the second edge b and the second barrier wall 311b adopt the same material, the part of the filling layer 33 at the position corresponding to the second edge b can be printed after the second barrier wall 311b and the second enclosure 32 are printed, so that the material does not need to be replaced, and the printing efficiency is improved.

[0174] Please refer to Figure 14 A structure diagram of a filling layer provided in an embodiment of the present disclosure. The filling layer 33 comprises:

[0175] The inner filling layer 331 is located in the bending space formed after the flexible circuit board 23 is bent.

[0176] The outer filling layer 332 is located outside the inner filling layer 331.

[0177] After the flexible circuit board 23 is bent, the width direction of the flexible circuit board 23 isFigure 14 The bending space has two open ends, and the bending space can be filled with the adhesive in a manner that the adhesive is injected into one open end and sucked from the other open end, so as to form the inner filling layer 331. The outer filling layer 332 can be printed into the first groove a1 between the first enclosure 31 and the second enclosure 32 after the first enclosure 31 and the second enclosure 32 are formed.

[0178] In the embodiments provided in the present disclosure, by filling the bending space formed after the flexible circuit board 23 is bent with different materials, the inner filling layer 331 in the bending space and the outer filling layer 332 outside the bending space can be formed by using different processes, so as to improve the filling rate of the inner filling layer 33 in the bending space, thereby improving the stability of the bending area C of the flexible circuit board 23 and protecting the bending area C of the flexible circuit from being damaged.

[0179] Please refer to Figure 15 A partial top view of a display device provided in the embodiments of the present disclosure is shown.

[0180] The bending area C of the flexible circuit board 23 has two through holes H1 penetrating through the flexible circuit board 23, and the two through holes H1 are respectively close to the two open ends of the bending space.

[0181] When the inner filling layer 33 is formed, the two open ends of the bending space formed after the flexible circuit board 23 is bent can be blocked, and then the adhesive can be injected into one of the two through holes H1 opened in the bending area C of the flexible circuit board 23 until the adhesive overflows from the other through hole H1, which indicates that the adhesive in the bending space is full. Then, the adhesive in the bending space is solidified to form the inner filling layer 331. Then, the first enclosure 31 and the second enclosure 32 and the outer filling layer 332 can be formed.

[0182] In the embodiments provided in the present disclosure, by arranging two through holes H1 in the bending area C of the flexible circuit board 23 and arranging the two through holes H1 to be respectively close to the two open ends of the bending space formed after the flexible circuit board 23 is bent, the inner filling layer 331 can be formed by injecting the adhesive into one of the two through holes H1 after the two open ends of the bending space are blocked and observing whether the adhesive overflows from the other through hole H1, so that the inner filling layer 331 can fill the bending space.

[0183] Please refer to Figure 16 and Figure 17 , Figure 16 A schematic diagram of a flexible circuit board before being bent provided in the embodiments of the present disclosure is shown. Figure 17 A schematic diagram of a flexible circuit board after being bent provided in the embodiments of the present disclosure is shown.

[0184] The display device further comprises:

[0185] The back film 24 is located between the heat dissipation plate 22 and the display panel 21 and covers the flexible circuit board 23; the back film 24 has a second groove 24a exposing the bending area C of the flexible circuit board 23, and the inner layer filling layer 331 is filled in the second groove 24a.

[0186] As shown in Figure 16 , before the flexible circuit board 23 is bent, an adhesive can be filled in the second groove 24a of the back film 24, and after pre-curing (such as curing rate reaching a preset proportion), the flexible circuit board 23 is bent to form the inner layer filling layer 331 as shown in Figure 17 .

[0187] In the embodiments provided in the present disclosure, by filling the inner layer filling layer 331 in the second groove 24a of the back film 24 exposing the flexible circuit board 23, the inner layer filling layer 331 can be formed before the flexible circuit board 23 is bent, thereby improving the filling rate of the inner layer filling layer 331 in the bending area C.

[0188] Please refer to Figure 18 and Figure 19 for another structural schematic diagram of a display device provided in the embodiments of the present disclosure. The display device further comprises:

[0189] The middle frame 5 comprises a first part 51 and a second part 52; the first part 51 is located on the side of the edge sealing structure 3 away from the cover plate 1, and the second part 52 extends from the edge of the first part 51 to the edge of the cover plate 1 and overlaps with the cover plate 1;

[0190] The middle frame glue 6 is located between the edge sealing structure 3 and the first part 51;

[0191] The end of the second part 52 close to the cover plate 1 has an overlapping groove 52a overlapping with the edge of the cover plate 1, one side of the overlapping groove 52a abuts against the edge of the cover plate 1 close to the display panel 21, and the other side of the overlapping groove 52a overlaps with the side of the cover plate 1.

[0192] The width w4 of the overlapping groove 52a ranges from 35 to 65 um.

[0193] As shown in Figure 18 and Figure 19 , for the scheme that the first enclosure 31 does not overlap with the display assembly 2 (including the scheme that the annular groove 4a is arranged in the ink layer 4 and the scheme that the annular groove 4a is not arranged), the second part 52 of the middle frame 5 close to the first enclosure 31 is perpendicular to the cover plate 1 and is provided with the overlapping groove 52a abutting against the edge of the cover plate 1 close to the display panel 21 on the side close to the cover plate 1, so that the middle frame 5 can be overlapped on the side of the cover plate 1 close to the display panel 21, thereby sharing part of the stress and preventing the edge of the display assembly 2 from being damaged.

[0194] Please refer to Figure 20This is a schematic structural diagram of another display device provided by an embodiment of the present disclosure. The second portion 52 abuts against the multi-layer second retaining wall 311b in the first enclosure 31, and the surface of the second portion 52 abutting against the multi-layer second retaining wall 311b is an inclined surface.

[0195] In the direction from the cover plate 1 to the display panel 21, the solution of the multiple layers of second retaining walls 311b being retracted in sequence can be as follows: Figure 20 As in the above, a slope matching the indentation of the second retaining wall 311b is provided on the side of the second part 52 of the middle frame 5 that abuts against the multi-layer second retaining wall 311b. This makes it easier to abut the slope of the second part 52 against the second retaining wall 311b. At the same time, a lap groove 52a is provided at one end of the slope close to the cover plate 1, so that the middle frame 5 can overlap the back of the cover plate 1 to share the stress and protect the edge of the display component 2.

[0196] See Figure 21 This is a top view of another display device provided by an embodiment of the present disclosure. The display assembly 2 also includes:

[0197] At least one first accommodating hole H2 is located in the display component 2 at a position corresponding to the second side b. The first enclosure 31 is arranged along the edge of the first accommodating hole H2. The first accommodating hole H2 can be used to accommodate the earpiece. The portion of the first enclosure 31 arranged along the edge of the first accommodating hole H2 is a slope.

[0198] See Figure 22 Provided for the embodiments of the present disclosure Figure 21 The portion of the first enclosure 31 disposed along the edge of the first accommodating hole H2 is an inclined surface.

[0199] like Figure 23 The embodiment of the present disclosure provides Figure 21 The first receiving hole H2 can also be used to accommodate buttons (such as a power button, a volume button, etc.), and in this case, the portion of the first enclosure 31 disposed along the edge of the first receiving hole H2 is perpendicular to the cover plate 1.

[0200] In the embodiments provided herein, by positioning the first enclosure 31 along the edge of the first receiving hole H2, components housed therein can be completely avoided. Furthermore, by configuring the first enclosure 31 at the edge of the first receiving hole H2, which houses the earpiece, as an inclined surface, not only completely avoids the earpiece but also facilitates sound diffusion and reduces echo.

[0201] See Figure 24 and Figure 25 A top view of another display device provided in an embodiment of the present disclosure, Figure 26 Provided for the embodiments of the present disclosure Figure 24 The cross-sectional view in the GG' direction shows that the component 2 also includes:

[0202] The second accommodating hole H3 is located in the area surrounded by the edge sealing structure 3, the second enclosing wall 32 extends to the second accommodating hole H3 and surrounds the second accommodating hole H3; the second accommodating hole H3 can be used to accommodate the camera;

[0203] The edge sealing structure 3 further comprises a third enclosing wall 34, the third enclosing wall 34 surrounds the second accommodating hole H3 and is located in the area surrounded by the second enclosing wall 32, and the third enclosing wall 34 is located on the side surface of the cover plate 1 close to the display panel 21; the filling layer 33 also fills the space surrounded by the third enclosing wall 34 and the second enclosing wall 32.

[0204] The second enclosing wall 32 can extend to the second accommodating hole H3 by a straight line and be arranged along the edge of the second accommodating hole H3 to surround the second accommodating hole H3; the second enclosing wall 32 can also extend to the second accommodating hole H3 by two straight lines and be arranged along the edge of the second accommodating hole H3 to surround the second accommodating hole H3; no matter which extension mode is adopted by the second enclosing wall 32, the third enclosing wall 34 is arranged on the side surface of the cover plate 1 close to the display panel 21, and the filling layer 33 also fills the space surrounded by the third enclosing wall 34 and the second enclosing wall 32. Figure 24 Figure 25 The second enclosing wall 32 can extend to the second accommodating hole H3 by a straight line and be arranged along the edge of the second accommodating hole H3 to surround the second accommodating hole H3; the second enclosing wall 32 can also extend to the second accommodating hole H3 by two straight lines and be arranged along the edge of the second accommodating hole H3 to surround the second accommodating hole H3; no matter which extension mode is adopted by the second enclosing wall 32, the third enclosing wall 34 is arranged on the side surface of the cover plate 1 close to the display panel 21, and the filling layer 33 also fills the space surrounded by the third enclosing wall 34 and the second enclosing wall 32.

[0205] In the embodiments provided in the present disclosure, by extending the second enclosing wall 32 to the direction of the second accommodating hole H3 and arranging it along the edge of the second accommodating hole H3 to surround the second accommodating hole H3, and arranging the third enclosing wall 34 on the side surface of the cover plate 1 close to the display panel and filling the filling layer 33 between the second enclosing wall 32 and the third enclosing wall 34, the edge of the second accommodating hole H3 and the edge of the display device can be integrally edge sealed, and the second accommodating hole H3 can be effectively protected.

[0206] Please refer to Figures 27-28 , Figures 27-28 the top view of another display device provided in the embodiments of the present disclosure, Figure 29 the cross-sectional view of the display device provided in the embodiments of the present disclosure in the direction of MM’. Figure 27 The flexible circuit board 23 further comprises:

[0207] The driving chip 231 is attached to the side of the heat dissipation plate 22 away from the cover plate 1, and the driving chip 231 is located on the side of the flexible circuit board 23 away from the heat dissipation plate 22;

[0208] The second enclosing wall 32 at least semi-surrounds the driving chip 231 along the periphery of the driving chip 231, and the filling layer 33 further fills the area corresponding to the driving chip 231.

[0209] As shown in Figure 27 , the second enclosing wall 32 can extend to the direction of the driving chip 231 and be arranged along the edge of the driving chip 231 to semi-surround the driving chip 231; as shown in​Figure 28 As shown, the second enclosing barrier 32 can also extend towards the driving chip 231 and be arranged to fully enclose the driving chip 231, and the filling layer 33 also fills the space enclosed by the second enclosing barrier 32.

[0210] In the embodiments provided in the present disclosure, by extending the second enclosing barrier 32 towards the driving chip 231 and at least semi-enclosing the driving chip 231, and by letting the filling layer 33 fill the area at least semi-enclosed by the second enclosing barrier 32, the protection of the driving chip 231 can be strengthened by the edge sealing structure 3.

[0211] The display device can be an Organic Light-Emitting Diode (OLED) display, an OLED display screen, an OLED television, or the like, and can also be a mobile device such as a mobile phone, a tablet computer, a notebook computer, or the like.

[0212] Based on the same inventive concept, the present disclosure provides a manufacturing method of a display device, please refer to Figure 30 , which comprises the following steps:

[0213] Step S11: providing a display assembly 2 and a cover plate 1; the cover plate 1 is located on the light-out surface of the display assembly 2, the display assembly 2 comprises a display panel 21, a heat dissipation plate 22 located on the side of the display panel 21 away from the cover plate 1, and a flexible circuit board 23 bound to the display panel 21, the edge of the heat dissipation plate 22 is recessed relative to the edge of the display panel 21, the heat dissipation plate 22 comprises a first edge a and a second edge b, the two ends of the first edge a and the two ends of the second edge b are connected, the flexible circuit board 23 is arranged close to the first edge a, and the flexible circuit board 23 is adhered to the side of the heat dissipation plate 22 away from the display panel 21 after being bent;

[0214] Step S12: forming an edge sealing structure 3 on the side of the cover plate 1 close to the display assembly 2, the edge sealing structure 3 at least covers the edge of the first edge a of the heat dissipation plate 22 and extends to the edge of the cover plate 1 close to the edge; the edge sealing structure 3 comprises a first enclosing barrier 31, a second enclosing barrier 32, and a filling layer 33; the first enclosing barrier 31 is located on the side of the cover plate 1 close to the display panel 21 and is arranged at least close to the edge of the cover plate 1 corresponding to the first edge a; the second enclosing barrier 32 is located on the side of the heat dissipation plate 22 away from the cover plate 1 and is arranged at least along the first edge a; the filling layer 33 fills a first recess a1 formed by the first enclosing barrier 31, the second enclosing barrier 32, the display assembly 2, and the cover plate 1, and the bent area C of the flexible circuit board 23 is located in the first recess a1.

[0215] When the edge sealing structure 3 covers the edge of the first edge a of the heat dissipation plate 22 and extends to the edge of the cover plate 1 close to the edge, please refer to Figure 31A manufacturing schematic diagram of the edge sealing structure provided by the embodiment of the present disclosure can be implemented in the following manner:

[0216] S21: On the side of the heat dissipation plate 22 away from the cover plate 1, a second enclosure 32 is formed along the first edge a close to the heat dissipation plate 22.

[0217] The second enclosure 32 can be formed by printing, for example, a layer of adhesive is printed on the side of the heat dissipation plate 22 away from the cover plate 1 along the first edge a close to the heat dissipation plate 22 to form the second enclosure 32; or multiple layers of second sub-enclosures 321 (see Figure 6 ) are reciprocally printed along the first edge a close to the heat dissipation plate 22 to form the second enclosure 32.

[0218] S22: On the side of the cover plate 1 close to the display assembly 2, a first enclosure 31 is printed along the edge of the cover plate 1, and the two ends of the first enclosure 31 are connected to the two ends of the second enclosure 32, so that the first enclosure 31, the second enclosure 32, the display assembly 2 and the cover plate 1 jointly form a first recess a1.

[0219] When printing the first enclosure 31, it can also be implemented by printing, for example, the position where the printing of the second enclosure 32 ends is taken as the starting position of printing, and a U-shaped first enclosure 31 is printed, the horizontal line in the U shape is parallel to the first edge a of the heat dissipation plate 22, and the two ends of the second enclosure 32 on the same side of the flexible circuit board 23 are connected by a vertical line in the U shape, so that the first enclosure 31, the second enclosure 32, the display assembly 2 and the cover plate 1 jointly form the first recess a1.

[0220] The first enclosure 32 can also be composed of multiple layers of first sub-enclosures 311 (see Figure 6 ), and each layer of the first sub-enclosure 311 has the same shape, for example, all are U-shaped.

[0221] S23: The first recess a1 is filled with a filling layer 33.

[0222] The filling layer 33 can also be formed by printing or other methods, which are not limited herein. Then the entire edge sealing structure 3 can be solidified as a whole.

[0223] It needs to be understood that the printing of the second sub-enclosure 321 containing multiple layers is by reciprocating printing. Taking the example of the printing of the second sub-enclosure 321 containing two layers, after the printing of the first layer of the second sub-enclosure 321 closest to the cover plate 1 is completed, the second layer of the second sub-enclosure 321 is printed on the side of the first layer of the second sub-enclosure 321 away from the cover plate 1, and the printing start position of the second layer of the second sub-enclosure 321 is the printing end position of the first layer of the second sub-enclosure 321. When the second sub-enclosure 321 contains more layers, such as a third layer of the second sub-enclosure 321 located on the side of the second layer of the second sub-enclosure 321 away from the cover plate 1, the printing start position of the third layer of the second sub-enclosure 321 is the printing end position of the second layer of the second sub-enclosure 321. In this way, the printing is to avoid long-distance movement of the glue valve and improve the printing efficiency. In fact, the glue valve can also be moved to the printing start position of the first layer of the second sub-enclosure 321 after the printing of the first layer of the second sub-enclosure 321 is completed to start printing the second layer of the second sub-enclosure 321. Similarly, when the first enclosure 31 is started to be printed, the printing start position of the second enclosure 32 can also be used as the printing start position of the first enclosure 31. However, the printing glue valve needs to be moved, and the printing efficiency is slightly lower.

[0224] In the embodiments provided in the present disclosure, an edge sealing structure 3 is formed on the side of the cover plate 1 close to the display assembly 2, covering at least the edge of the first side a of the heat dissipation plate 22 and extending to the edge of the cover plate 1; and the edge sealing structure 3 comprises a first enclosure 31, a second enclosure 32, and a filling layer 33. The first enclosure 31 is located on the side of the cover plate 1 close to the display panel 21 and is arranged at least close to the edge of the cover plate 1 corresponding to the first side a. The second enclosure 32 is located on the side of the heat dissipation plate 22 away from the cover plate 1 and is arranged at least along the first side a. The filling layer 33 fills the first recess a1 formed by the first enclosure 31, the second enclosure 32, the display assembly 2, and the cover plate 1. The flexible circuit board 23 is located on the side of the first side a of the heat dissipation plate 22, and the bending area C of the flexible circuit board 23 is located in the first recess a1, so that the inside and outside of the bending area C of the flexible circuit board 23 form an integral whole. In the overall assembly of the display device, the middle frame 4' in the Figure 1 can be directly overlapped on the edge sealing structure 3, at least the minimum overlapping space required by the middle frame 4' in the prior art shown in Figure 1 can be effectively reduced, and the narrow-frame design can be achieved.

[0225] In some embodiments, the edge sealing structure 3 formed on the side of the cover plate 1 close to the display assembly 2, covering at least the edge of the first side a of the heat dissipation plate 22 and extending to the edge of the cover plate 1 can be realized by the following ways:

[0226] On the side of the cover plate 1 close to the display assembly 2, a plurality of layers of first sub-enclosures 311 are printed along the edge of the cover plate 1 to form a first enclosure 31 around the edge of the cover plate 1; wherein the side of the first enclosure 31 away from the second enclosure 32 is close to the edge of the cover plate 1;

[0227] On the side of the display assembly 2 away from the cover plate 1, a plurality of layers of second sub-enclosures 321 are printed along the edge of the heat dissipation plate 22 to form a second enclosure 32 around the edge of the heat dissipation plate 22; wherein the printing speed of the second sub-enclosures 321 at the position corresponding to the first edge a is lower than the printing speed of the second sub-enclosures 321 at the position corresponding to the second edge b; the side of the second enclosure 32 close to the first enclosure 31 is recessed relative to the heat dissipation plate 22;

[0228] The first groove a1 is filled with a filler to form a filling layer 33.

[0229] See Figure 32 A schematic diagram of forming an edge sealing structure is provided for the embodiments of the present disclosure.

[0230] S31: Forming a first enclosure 31.

[0231] On the side of the cover plate 1 close to the display panel 21, a plurality of layers of first sub-enclosures 311 are printed around the edge of the cover plate 1. For example, 6 layers of first sub-enclosures 311 are printed. When printing the first layer of first sub-enclosures 311 closest to the cover plate 1, a first layer of first sub-enclosures 311 can be formed by printing a circle along the edge of the cover plate 1 in the counterclockwise direction. When printing the second layer of first sub-enclosures 311 away from the cover plate 1, the printing start position of the second layer of first sub-enclosures 311 can be the position where the printing of the first layer of first sub-enclosures 311 ends, and a second layer of first sub-enclosures 311 can be formed by printing a circle along the edge of the cover plate 1 in the clockwise direction. This process is repeated until the printing of the sixth layer of first sub-enclosures 311 is completed, and the printing of the first enclosure 31 is completed. By using the printing end position of the first sub-enclosure 311 of the previous layer as the printing start position of the first sub-enclosure 311 of the next layer, the printing head does not need to be moved when changing the printing layer, thereby effectively improving the printing efficiency.

[0232] The material used for the first sub-enclosure 311 can be an adhesive, such as glue. A direct writing air pressure valve can be used for printing, such as Figure 33The figure shows a direct writing air pressure valve printing principle diagram provided by an embodiment of the present disclosure. For example, a direct writing air pressure valve with a valve head diameter of 2c can be selected to print at a preset printing pressure and a speed of 2v; wherein, c represents a diameter of a reference valve head, and v represents a moving speed of the reference valve head (subsequent examples will continue to use this c and v representation and will not be described separately), the preset printing pressure is 445 to 845 psi, and the valve head diameter ranges from 0.05 to 0.5 mm. Each time the first sub-enclosure 311 is printed, the width is 2c and the height is 2c. After repeated printing 6 times, a first enclosure 31 of a total of 12c is formed. If the printing position accuracy is ±50um, a first spacing needs to be set between the first enclosure 31 and the edge of the cover plate 1 to avoid overflow to the outer edge of the cover plate 1 when printing the first sub-enclosure 311. The first spacing is greater than or equal to the printing accuracy, so the first spacing is set to at least 0.05mm. The cross-sectional view of the first enclosure 31 corresponding to the first side a of the flexible circuit board 23 can be seen in Figure 6 The cross-sectional view of the first enclosure 31 at the second side b can be seen in Figure 7 .

[0233] S32: forming a second enclosure 32.

[0234] After printing the first enclosure 31, multiple layers of second sub-enclosures 321 are printed along the edge of the heat sink 22 on the side away from the cover plate 1. For example, if two layers of second sub-enclosures 321 are printed, the first layer of second sub-enclosures 321 closest to the cover plate 1 can be printed counterclockwise around the edge of the heat sink 22, starting from either end of the edge of the heat sink 22. The second layer of second sub-enclosures 321, located on the side of the first layer of second sub-enclosures 321 away from the cover plate 1, can be printed clockwise around the edge of the heat sink 22, starting from the end position of the first layer of second sub-enclosures 321, to complete the printing of the second enclosure 32. The longitudinal cross-sectional area S1 of the second sub-enclosure 321 on the first side a is smaller than the longitudinal cross-sectional area S2 of the second sub-enclosure 321 printed on the second side b. When printing the second sub-enclosure 321, you can still use the direct writing air pressure valve. You can still choose a direct writing air pressure valve with a valve head diameter of 2c and print at the preset printing pressure and speed of 2v. However, you need to reduce the speed when printing the part of the second sub-enclosure 321 corresponding to the first side a, such as reducing the speed from 2v to v. This will ensure that the side of the second enclosure 32 away from the cover plate 1 is on the same plane as the side of the first enclosure 31 away from the cover plate 1 to maintain overall height uniformity. Please refer to Figure 6 and Figure 7 Of course, if the portion of the second sub-enclosure 321 corresponding to the first side a is printed first, then when printing the portion of the second sub-enclosure 321 corresponding to the second side b, the speed is increased.

[0235] Since the same specification of direct writing air pressure valve is used for printing the first enclosure 31 and the second enclosure 32, there is no need to replace the nozzle, thereby improving the printing efficiency.

[0236] In some embodiments, the first sub-enclosure 311 and the second sub-enclosure 321 may be made of the same material.

[0237] S33: forming a filling layer 33.

[0238] After printing the first enclosure 31 and the second enclosure 32, the first enclosure 31 and the second enclosure 32 need to be cured for the first time. For example, an ultraviolet lamp can be used for full-surface curing. The curing wavelength ranges from 256 to 475 nm, and the curing time ranges from 14 to 26 seconds.

[0239] Afterwards, a filling layer can be printed in the first groove a1 enclosed by the first enclosure 31, the second enclosure 32, the display assembly 2 and the cover plate 1. For example, a solenoid valve can be used to fill and compact a surface. Figure 34 The figure shows a printing principle diagram of a solenoid valve provided by an embodiment of the present disclosure. For example, the diameter of the solenoid valve corresponding to the glue valve is c, and it is reciprocated 50 times at a speed of 7v to form a filling layer 33 with the same height as the first enclosure 31. Each time printing is performed, the distance between the glue valve and the cover plate 1 remains unchanged. For example, the distance between the glue valve and the cover plate 1 is always the height of the first enclosure 31. The first sub-enclosure 311 printed later overlaps the first sub-enclosure 311 printed previously until the last layer of the first sub-enclosure 311 is printed. When printing the last layer of the first sub-enclosure 311, the glue valve is printed close to the glue so that the side of the last layer of the first sub-enclosure 311 away from the cover plate 1 is smoothed by the glue valve, completing the printing of the first enclosure 31. The surface morphology of the side of the last layer of the first sub-enclosure 311 away from the cover plate 1 smoothed by the glue valve is as shown in FIG. Figure 33 As shown, Figure 35 A schematic diagram of the positions of the glue valve and cover plate provided in an embodiment of the present disclosure.

[0240] The printing of the edge sealing structure 3 is completed through the above steps S31-S33, and then the entire edge sealing structure 3 is cured for the second time, such as using a UV lamp to cure the entire surface. The corresponding production process is as follows Figure 34 As shown, Figure 36 A schematic diagram of a production process for forming an edge-sealing structure according to an embodiment of the present disclosure. In the production process of edge-sealing structure 3, in addition to the printing and curing processes described above, prior to printing the first layer of first sub-enclosure 311, material cleaning, such as plasma cleaning, is also required. After the second curing step, product testing is also required, such as overall inspection of the display device according to shipping standards.

[0241] In some embodiments, on the side of the cover plate 1 close to the display assembly 2, an edge extending to the edge sealing structure 3 close to the edge of the cover plate 1 is formed to cover at least the first edge a of the heat dissipation plate 22.

[0242] An ink layer 4 is formed on the side of the cover plate 1 close to the display assembly 2.

[0243] A ring-shaped groove 4a is formed around the edge of the ink layer 4 on the side of the ink layer 4 away from the cover plate 1.

[0244] A first enclosure 31 is formed by printing a plurality of first sub-enclosures 311 around and close to the edge of the cover plate 1 on the side of the cover plate 1 close to the display assembly 2.

[0245] The first enclosure 31 is formed by printing the plurality of first sub-enclosures 311 in the ring-shaped groove 4a.

[0246] Please refer to Figure 37 A schematic diagram of forming a ring-shaped groove provided by an embodiment of the present disclosure.

[0247] As Figure 37 As shown, after the pad printing of the ink layer 4 is completed, an additional adhesion is performed at the edge position of the ink layer 4 (i.e. the edge position of the cover plate 1) using a small pressure head with a width W' (e.g. the value range of W' is 0.14-2.6 mm), so as to remove the ink layer 4 at the corresponding position which is not completely solidified, to form a small groove with a width W' and a height less than or equal to the thickness of the ink layer 4. The small pressure head moves around the edge of the ink layer 4 for one round to obtain the ring-shaped groove 4a. Then, the plurality of first sub-enclosures 311 are printed in the ring-shaped groove 4a.

[0248] In some embodiments, a plurality of first sub-enclosures 311 are printed around the edge of the cover plate 1 on the side of the cover plate 1 close to the display assembly 2 to form the first enclosure 31, which can also be realized by the following manner:

[0249] A first layer of second walls 311b corresponding to the second edge b is printed on the side of the cover plate 1 close to the display assembly 2; the side of the first layer of second walls 311b away from the second enclosure 32 is close to the edge of the cover plate 1, and the side of the first layer of second walls 311b close to the second enclosure 32 abuts against the edge of the second edge b;

[0250] A second layer of second walls 311b corresponding to the second edge b is printed on the side of the first layer of second walls 311b away from the cover plate 1; the side of the second layer of second walls 311b away from the second enclosure 32 is recessed relative to the side of the first layer of second walls 311b away from the second enclosure 32, and the side of the second layer of second walls 311b close to the second enclosure 32 is recessed relative to the edge of the second edge b.

[0251] On the side of the cover plate 1 close to the display assembly 2, a plurality of layers of first barriers 311a corresponding to the first edge a are printed, and the first barriers 311a do not overlap the display assembly 2; wherein the second barriers 32 are printed before the plurality of layers of first barriers 311a are printed, and the longitudinal sectional area of the second barriers 311b is greater than that of the first barriers 311a, and the plurality of layers of first barriers 311a and the plurality of layers of second barriers 311b are connected end to end. The number of layers of the plurality of layers of first barriers 311a and the plurality of layers of second barriers 311b can be different.

[0252] The first groove 4a is filled with a filler to form a filling layer 33, which can be achieved by the following methods:

[0253] After the second barriers 32 are formed, a plurality of layers of first adhesives are printed in the space of the first groove 4a corresponding to the second barriers 32 before the plurality of layers of first barriers 311a are formed, to form a part 33b of the filling layer 33 corresponding to the second barriers 311b; and the first barriers 31 and the second barriers 32 and the part 33b of the filling layer 33 are solidified;

[0254] After the first barriers 311a are formed, the filling material is filled and solidified in the space of the first groove 4a corresponding to the first barriers 311a to form another part 33a of the filling layer 33 corresponding to the first barriers 311a; wherein the filler includes the first adhesive and the filling material;

[0255] The position where the plurality of layers of first barriers 311a and the plurality of layers of second barriers 311b of the edge sealing structure 3 meet is locally milled to make the side of the edge sealing structure 3 away from the cover plate flush.

[0256] Please refer to Figure 38 The schematic diagram of forming another edge sealing structure provided by the embodiments of the present disclosure.

[0257] S41: Form a first layer of second barriers 311b.

[0258] From Figure 38 the right end of the flexible circuit board 23 shown in FIG. 5, on the side of the cover plate 1 close to the display panel, the edge of the cover plate 1 is printed in the counterclockwise direction to the position shown in FIG. 6. Figure 38The left end of the flexible circuit board 23 shown in the middle forms a first layer of the second retaining wall 311b corresponding to the second edge b. The first layer of the second retaining wall 311b also covers the edge of the display panel 21 to the part of the edge of the heat dissipation plate 22 exposed, so that the side of the first layer of the second retaining wall 311b close to the second edge b of the heat dissipation plate 22 abuts against the second edge b of the heat dissipation plate 22, and the surface of the heat dissipation plate 22 and the side of the first layer of the second retaining wall 311b away from the cover plate 1 form an approximately planar state, facilitating printing of the second layer of the second retaining wall 311b on the side of the first layer of the second retaining wall 311b away from the cover plate 1. At the same time, the side of the first layer of the second retaining wall 311b away from the second edge b needs to be reserved with a first interval d1 (as shown in Figure 7 ) from the edge of the cover plate 1 to avoid overflow of the material (such as glue) used for printing the second retaining wall 311b to the outside of the edge of the cover plate 1.

[0259] S42: Forming the second layer of the second retaining wall 311b.

[0260] After printing the first layer of the second retaining wall 311b, the second layer of the second retaining wall 311b is printed along the first layer of the second retaining wall 311b from the end position of the first layer of the second retaining wall 311b in the counterclockwise direction, so that the side of the second layer of the second retaining wall 311b close to the edge of the cover plate 1 is recessed relative to the side of the first layer of the second retaining wall 311b close to the edge of the cover plate 1, and the side of the second layer of the second retaining wall 311b away from the edge of the cover plate 1 is located at the side of the second edge b away from the edge of the cover plate 1.

[0261] The longitudinal section area of the first layer of the second retaining wall 311b and the second layer of the second retaining wall 311b can be the same, and if so, the second layer of the second retaining wall 311b can be set in recess relative to the first layer of the second retaining wall 311b when printing the second layer of the second retaining wall 311b; the longitudinal section area of the first layer of the second retaining wall 311b and the second layer of the second retaining wall 311b can also be different, and the width of the second layer of the second retaining wall 311b can be greater than the width of the first layer of the second retaining wall 311b, as shown in Figure 13 . Figure 39 Figure 40 . Figure 39 The size diagram of the first layer of the second retaining wall provided by the embodiments of the present disclosure, Figure 40 The size diagram of the second layer of the second retaining wall provided by the embodiments of the present disclosure can print the first layer of the second retaining wall 311b with a printing width w'5 of 7c and a height h5 of 6c, and the second layer of the second retaining wall 311b with a printing width w5 of 9c and a height h5 of 6c, so that the side of the first layer of the second retaining wall 311b close to the edge of the cover plate 1 is aligned with the side of the second layer of the second retaining wall 311b close to the edge of the cover plate 1, thus forming a part of the first enclosing retaining wall 31 with a height of 12c corresponding to the second edge.

[0262] S43: Forming the second enclosing retaining wall 32; ​

[0263] After printing the second layer of the second barrier wall 311b, the second surrounding barrier 32 is printed around the edge of the heat dissipation plate 22, starting from the position corresponding to the edge of the heat dissipation plate 22 on the side of the heat dissipation plate 22 away from the cover plate 1 where the printing of the second layer of the second barrier wall 311b ends. The second surrounding barrier 32 can be composed of a first layer of the second surrounding barrier 321, wherein the longitudinal sectional area S1 of the portion of the second surrounding barrier 321 corresponding to the first side a is smaller than the longitudinal sectional area S2 of the portion of the second surrounding barrier 321 corresponding to the second side b. For example, it is assumed that the film thickness of the display assembly 2 at the first side a increases due to the bending of the flexible circuit board 23, and thus the height of the portion of the second surrounding barrier 321 at the first side a is smaller than the height of the portion of the second surrounding barrier 322 at the second side b. If the width of the portion of the second surrounding barrier 321 at the second side b is 9c and the height is 6c, the width of the portion of the second surrounding barrier 321 at the first side a is 6c and the height is 2c. In the case where the height of the glue valve during printing of the second surrounding barrier 321 is unchanged, the printing speed v can be used when printing the portion of the second surrounding barrier 321 at the second side b, and the printing speed 0.3v can be used when printing the portion of the second surrounding barrier 321 at the first side a. The above printing process can use a direct writing air pressure valve, and the diameter of the glue valve is 8cmm, and the air pressure is in the range of 56-104psi.

[0264] S44: forming a portion of the filling layer 33b;

[0265] After printing the second surrounding barrier 32, the first adhesive can be printed in the space corresponding to the second barrier wall 311b in the first groove a1, to form a portion of the filling layer 33b corresponding to the second side b. For example, the position where the printing of the second surrounding barrier 32 ends is taken as the starting position of the portion of the filling layer 33b, and the distance between the printing head (i.e., the glue valve) and the cover plate 1 can remain unchanged during printing, such as being close to the side of the second surrounding barrier 32 away from the cover plate 1 and the multiple layers of the second barrier wall 311b, and the portion of the filling layer 33b can be smoothed, such as Figure 41 Another smoothing diagram provided by the embodiment of the present disclosure is shown. The materials of the first surrounding barrier 31 and the second surrounding barrier 32 can both be the first adhesive.

[0266] S45: forming a plurality of layers of the first barrier wall 311a.

[0267] On the side of the cover plate 1 close to the display panel 21, reciprocating printing of a plurality of layers of the first barrier wall 311a is performed along the edge of the cover plate 1 corresponding to the first edge a, to form the part of the first enclosure 31 corresponding to the first edge a. If a direct writing air pressure valve is used, the glue valve diameter is 2c, the preset printing air pressure and speed 2v are used for printing, the printing width of the first barrier wall 311a is 2c and the height is 2c, and reciprocating printing is performed 6 times to form 6 layers of the first barrier wall 311a. Thus, the part of the first enclosure 31 corresponding to the first edge a is printed, which can be referred to as Figure 14 .

[0268] S46: Form another part of the filling layer 33a.

[0269] After the plurality of layers of the first barrier wall 311a are printed, the filling agent can be filled in the space of the first groove a1 corresponding to the part of the first barrier wall 311a to obtain another part of the filling layer 33a corresponding to the first edge a. An electromagnetic valve can be used for printing. For example, low-viscosity glue (filling agent) with a viscosity less than 200cps is selected, the glue valve diameter is c, the printing speed is 7v, and reciprocating printing is performed 50 times. The distance between the glue valve and the cover plate 1 remains unchanged during printing, and at the end of the printing process, the glue valve also closely contacts the glue printing and is wiped flat in a manner similar to Figure 41 , which will not be described here again.

[0270] The printing of the edge sealing structure 3 can be completed through steps S41-S46. The area of the longitudinal section of the second barrier wall 311b and the second sub-enclosure 321 in the above-described edge sealing structure 3 is larger than the area of the longitudinal section of the first sub-enclosure 311 and the second sub-enclosure 321 printed in steps S21-S23. Therefore, the total number of printing is less, which can effectively improve the printing efficiency. The edge sealing structure 3 obtained through steps S31-S33 does not have the problem of the lead angle as the edge sealing structure 3 obtained through steps S31-S36, does not need to use the milling process, does not have the risk of particles, and can save a milling process. In the above process, after the printing of the part of the filling layer 33b is completed, the ultraviolet lamp can be used for the first curing of the part of the edge sealing structure 3 corresponding to the second edge b. After the printing of the other part of the filling layer 33a is completed, the ultraviolet lamp can be used for the second curing of the part of the edge sealing structure 3 corresponding to the first edge a.

[0271] Since the first barrier wall 311a and the second barrier wall 311b intersecting position is used as the starting printing end or the terminal printing end during printing, there is obvious glue accumulation in the area where the first barrier wall 311a and the second barrier wall 311b intersect. After the product is completely cured, local milling can be used for local milling of the area where the first barrier wall 311a and the second barrier wall 311b intersect, so that the area where the plurality of layers of the first barrier wall 311a and the plurality of layers of the second barrier wall 311b intersect is away from the side of the cover plate 1 and keeps flat with the whole edge sealing structure 3. For example, Figure 42A milling process provided by the embodiment of the present disclosure is shown in the schematic diagram, the milling process can use a milling head with a diameter of 2 mm, and the rotation speed reaches a preset rotation speed, the preset rotation speed is in a range of 700-1300 rpm, and the surface flatness is within ±100 μm after milling. Local particulate foreign matter is generated during the milling process, and the present disclosure removes the surface foreign matter through the blowing+air suction device to improve the cleanliness of the surface, such as Figure 43 A milling structure provided by the embodiment of the present disclosure is shown in the schematic diagram, and the milling mechanism includes a milling head, a blowing port and an air suction port.

[0272] Based on the above process conditions, the part of the first enclosure 31 formed by the multi-layer second retaining wall 311b will form a slope angle θ of 10.5°-19.5° (local concave 35-65 μm), and the lower edge has no slope angle (local concave 3.5-6.5 μm), such as Figure 44 A slope angle of the part of the first enclosure formed by the multi-layer second retaining wall provided by the embodiment of the present disclosure is shown in the schematic diagram. As Figure 45 A manufacturing process of another edge sealing structure provided by the embodiment of the present disclosure is shown in the schematic diagram.

[0273] In the above process, if the flowability of the printing material used for the filling layer 33 is poor, the printing material cannot flow into the bending space formed after the flexible circuit board 23 is bent, and the filling layer 33 cannot fill the bending area C of the flexible circuit board 23 well. Therefore, the present disclosure provides the following methods to improve the filling rate of the bending area C to protect the bending area C of the flexible circuit board 23.

[0274] In other embodiments, before the flexible circuit board 23 is bent, the inner filling layer 331 can be formed by the following methods:

[0275] The second adhesive is filled and solidified in the second groove 24a of the back film 24, so that the solidification rate of the second adhesive reaches a preset proportion; wherein the back film 24 is located between the display panel 21 and the heat dissipation plate 22 and covers part of the flexible circuit board 23; the second groove 24a exposes the bending area C of the flexible circuit board 23;

[0276] The flexible circuit board 23 is bent, so that the solidified second adhesive is filled in the bending space formed after the flexible circuit board 23 is bent, and the inner filling layer 331 of the filling layer 33 is formed; for convenience of distinction, the filling layer 33 formed by the printing method in the foregoing embodiments can be referred to as the outer filling layer 332.

[0277] For example, as Figure 16As shown, the second adhesive is filled and cured in the second groove 24a of the back film 24, so that the curing rate of the second adhesive reaches a preset ratio, and the preset ratio ranges from 80% to 98%; then the flexible circuit board 23 is bent, so that the cured second adhesive fills the bending space formed after the flexible circuit board 23 is bent, forming the inner filling layer 331 of the filling layer 33, as shown. Figure 17 shown.

[0278] In other embodiments, after the flexible circuit board 23 is bent, the inner filling layer 331 may be formed by the following methods:

[0279] Injecting a second adhesive into one open end of the space formed by bending the flexible circuit board 23, and using a blower to absorb the second adhesive at the other open end, so that the second adhesive fills the bending space formed by bending the flexible circuit board;

[0280] The second adhesive filled in the bending space is solidified to form an inner filling layer of the filling layer.

[0281] Please refer to Figure 46 A schematic diagram of filling a second adhesive into a bending space is provided in an embodiment of the present disclosure. The bending space formed after the flexible circuit board 23 is bent has two open ends. The second adhesive (such as glue) can be applied to the edge of one open end using the glue outlet to ensure that the entire area is covered without leaving any gaps. A high-power fan is used to hold the outlet against the other open end to evenly adsorb the second adhesive. The second adhesive on the left side is evenly adsorbed and filled into the bending space to form an internal filling layer.

[0282] In other embodiments, after the flexible circuit board 23 is bent, the inner filling layer 331 may be formed by the following methods:

[0283] Blocking the two open ends of the bending space formed after the flexible circuit board 23 is bent; wherein the bending area C of the flexible circuit board 23 has two through holes H1, and the two through holes H1 are respectively close to the two open ends;

[0284] Injecting a second adhesive into the blocked bending space through one of the through holes H1 until the second adhesive overflows from the other through hole H1, so that the second adhesive fills the bending space formed after the flexible circuit board 23 is bent;

[0285] The second adhesive filled in the bending space is cured to form the inner filling layer 331 of the filling layer 33 .

[0286] like Figure 15 As shown, two through holes H1 penetrating the flexible circuit board 23 may be provided in the bending region C of the flexible circuit board 23 , and the diameter of the through holes H1 ranges from 0.35 to 0.65 mm.

[0287] See Figure 47 Another schematic diagram for filling the bending space with the second adhesive is provided for the embodiments of the present disclosure. After the flexible circuit board 23 is bent, the two open ends of the bending space formed after the flexible circuit board 23 is bent are blocked with the second adhesive (such as glue) so that glue overflow does not occur in the subsequent glue injection process. Then, a glue valve with the same size as the two through holes H1 on the bending area C of the flexible circuit board 23 is inserted into one of the through holes H1, and glue is uniformly injected at a speed v so as to sufficiently fill the bending space. When the glue overflows at the other through hole H1, it is determined that the bending space is filled, and an inner filling layer 331 is formed.

[0288] Although the preferred embodiments of the present disclosure have been described, those skilled in the art who have the basic inventive concept can make further changes and modifications to the embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present disclosure.

[0289] Obviously, those skilled in the art can make various modifications and variations to the present disclosure without departing from the spirit and scope of the present disclosure. Thus, if these modifications and variations of the present disclosure fall within the scope of the claims of the present disclosure and their equivalent technologies, the present disclosure also intends to include these modifications and variations.

Claims

1. A display device, wherein: include: cover; a display assembly located on one side of the cover plate; the display assembly includes a display panel, a heat sink located on a side of the display panel away from the cover plate, and a flexible circuit board bonded to the display panel, wherein an edge of the heat sink is indented relative to an edge of the display panel, the heat sink includes a first side and a second side, with two ends of the first side connected to two ends of the second side, the flexible circuit board is disposed near the first side, and is bent and attached to the side of the heat sink away from the display panel; An edge sealing structure covers at least the edge of the first side of the heat sink and extends to the edge close to the cover plate; the edge sealing structure includes a first enclosure, a second enclosure and a filling layer; the first enclosure is located on a side of the cover plate close to the display panel and is arranged at least along the edge of the cover plate corresponding to the first side; the second enclosure is located on a side of the heat sink away from the cover plate and is arranged at least along the first side of the heat sink; the filling layer is filled in a first groove jointly enclosed by the first enclosure, the second enclosure, the display assembly and the cover plate, and the bending area of ​​the flexible circuit board is located in the first groove.

2. The display device according to claim 1, wherein The edge sealing structure surrounds and covers the edge of the heat dissipation plate and extends to the edge close to the cover plate; The first enclosure surrounds the edge of the cover plate, and the side of the first enclosure away from the second enclosure is close to the edge of the cover plate; the second enclosure surrounds the edge of the heat sink, and the side of the second enclosure close to the first enclosure is indented relative to the edge of the heat sink.

3. The display device according to claim 2, wherein: The first enclosure includes multiple layers of stacked first sub-enclosures, and the first sub-enclosures are arranged around the edge of the cover plate; the second enclosure includes multiple layers of stacked second sub-enclosures, and the second sub-enclosures are arranged around the edge of the heat dissipation plate; The longitudinal section area of ​​the second sub-enclosure corresponding to the first side is smaller than the longitudinal section area of ​​the second sub-enclosure corresponding to the second side.

4. The display device according to claim 3, wherein: The orthographic projection of the first sub-enclosure on the cover plate does not overlap with the orthographic projection of the display assembly on the cover plate.

5. The display device according to claim 4, wherein: The display device further includes: An ink layer is located on a side of the cover plate close to the display panel; the edge of the ink layer has an annular groove arranged around the edge of the cover plate; the orthographic projection of the first sub-enclosure on the cover plate is located within the orthographic projection of the annular groove on the cover plate.

6. The display device according to claim 5, wherein: At least the first layer of the first sub-enclosure in the first enclosure is black in color, and the first layer of the first sub-enclosure is the layer of the first sub-enclosure closest to the cover plate among the multiple layers of the first sub-enclosure.

7. The display device according to claim 3, wherein: The first sub-enclosure includes: A first retaining wall and a second retaining wall connected end to end and having the same height; wherein the first retaining wall is located on the side of the first side away from the second enclosure, the second retaining wall is located on the side of the second side away from the second enclosure, and the longitudinal section area of ​​the first retaining wall is smaller than the longitudinal section area of ​​the second retaining wall; the orthographic projection of the first retaining wall on the cover plate does not overlap with the orthographic projection of the display component on the cover plate, and the orthographic projection of the second retaining wall on the cover plate overlaps with the orthographic projection of the display component on the cover plate.

8. The display device according to claim 7, wherein: The first enclosure includes multiple layers of the first retaining walls arranged in an overlapping manner; In the direction in which the second retaining wall is away from the cover plate, the multiple layers of the second retaining walls included in the first enclosure are sequentially retracted.

9. The display device according to claim 8, wherein: The first enclosure includes two layers of the second retaining wall stacked together; The second retaining wall of the first layer is located on a side of the cover plate close to the display panel, the side of the second retaining wall of the first layer close to the second enclosure abuts against the edge of the heat sink, and the side of the second retaining wall of the first layer away from the second enclosure is close to the edge of the cover plate; The second retaining wall of the second layer is located on the side of the second retaining wall of the first layer away from the cover plate, the end of the second retaining wall of the second layer away from the second enclosure is indented relative to the end of the second retaining wall of the first layer away from the second enclosure, and the end of the second retaining wall of the second layer close to the second enclosure is indented relative to the second side of the heat sink.

10. The display device according to any one of claims 3 to 9, wherein: A height of the second sub-enclosure at a position corresponding to the first side is smaller than a height of the second sub-enclosure at a position corresponding to the second side.

11. The display device according to any one of claims 7 to 9, wherein: The filling layer is made of the same material as the second retaining wall corresponding to the second side.

12. The display device according to any one of claims 1 to 9, wherein: The filling layer fills the first groove.

13. The display device according to any one of claims 1 to 9, wherein: The filling layer comprises: An inner filling layer is located in a bending space formed after the flexible circuit board is bent; The outer filling layer is located in the space enclosed by the flexible circuit board, the cover plate, the first enclosure and the second enclosure.

14. The display device according to claim 13, wherein: The bending area of ​​the flexible circuit board has two through holes penetrating the flexible circuit board, and the two through holes are respectively close to two opening ends of the bending space.

15. The display device according to claim 13, wherein: The display assembly further includes: A back film is located between the heat dissipation plate and the display panel and covers a portion of the flexible circuit board; the back film has a second groove exposing the bending area of ​​the flexible circuit board, and the inner filling layer is filled in the second groove.

16. The display device according to any one of claims 2 to 5, wherein: There is a first distance between the first enclosure and the edge of the cover plate, and the value range of the first distance is 0.02mm to 0.08mm.

17. The display device according to claim 16, wherein: The display device further includes: a middle frame, the middle frame comprising a first portion and a second portion; the first portion is located on a side of the edge sealing structure away from the cover plate, and the second portion extends from an edge of the first portion toward an edge of the cover plate and overlaps the cover plate; a middle frame glue, located between the edge sealing structure and the first part; The second portion has an end near the cover plate with a lap groove overlapping the edge of the cover plate, one side of the lap groove abuts the edge of the cover plate near the display panel, and the other side of the lap groove abuts the side of the cover plate.

18. The display device according to claim 17, wherein: The second portion abuts against the multiple layers of the second retaining walls in the first enclosure, and the surface of the second portion abutting against the multiple layers of the second retaining walls is an inclined surface.

19. The display device according to any one of claims 1 to 8, wherein: The display assembly further includes: At least one first accommodating hole is located at a position in the display component corresponding to the second side, the first enclosure is set along the edge of the first accommodating hole, the first accommodating hole is used to accommodate the earpiece, and the part of the first enclosure set along the edge of the first accommodating hole is a slope.

20. The display device according to any one of claims 1 to 8, wherein: The display assembly further includes: A second accommodating hole is located in the area surrounded by the edge sealing structure, and the second enclosure extends toward the second accommodating hole and surrounds the second accommodating hole; The edge sealing structure also includes a third enclosure, which surrounds the second accommodating hole and is located in the area enclosed by the second enclosure. The third enclosure is located on the side surface of the cover plate close to the display panel; the filling layer also fills the space enclosed by the third enclosure and the second enclosure.

21. The display device according to any one of claims 1 to 8, wherein: The flexible circuit board also includes: a driving chip, located on a side of the flexible circuit board away from the heat sink, and the flexible circuit board is attached to a side of the heat sink away from the cover; The second enclosure at least half surrounds the driver chip along the periphery of the driver chip, and the filling layer also fills the area corresponding to the driver chip.

22. A method for manufacturing a display device, wherein: include: A display assembly and a cover plate are provided; the cover plate is located on a light-emitting surface of the display assembly; the display assembly includes a display panel, a heat sink located on a side of the display panel away from the cover plate, and a flexible circuit board bonded to the display panel; the edge of the heat sink is indented relative to the edge of the display panel; the heat sink includes a first side and a second side, with two ends of the first side connected to two ends of the second side; the flexible circuit board is disposed near the first side and is bent and attached to the side of the heat sink away from the display panel; On the side of the cover plate close to the display assembly, a sealing structure is formed, which covers at least the edge of the first side of the heat sink and extends to the edge close to the cover plate; the sealing structure includes a first enclosure, a second enclosure and a filling layer; the first enclosure is located on the side of the cover plate close to the display panel, and is arranged at least along the edge of the cover plate corresponding to the first side; the second enclosure is located on the side of the heat sink away from the cover plate, and is arranged at least along the first side; the filling layer is filled in a first groove surrounded by the first enclosure, the second enclosure, the display assembly and the cover plate, and the bending area of ​​the flexible circuit board is located in the first groove.

23. The production method according to claim 22, wherein: On a side of the cover plate close to the display assembly, a sealing edge structure is formed, which covers at least the edge of the first side of the heat dissipation plate and extends to a side close to the edge of the cover plate, including: On a side of the cover plate close to the display assembly, a multi-layer first sub-enclosure is printed along the edge of the cover plate, surrounding the edge of the cover plate, to form the first enclosure; wherein a side of the first enclosure away from the second enclosure is close to the edge of the cover plate; On a side of the display assembly away from the cover plate, multiple layers of second sub-enclosures are printed along the edge of the heat sink, surrounding the edge of the heat sink, to form the second enclosure; wherein a printing speed of the second sub-enclosure at a position corresponding to the first side is lower than a printing speed at a position corresponding to the second side; and a side of the second enclosure close to the first enclosure is retracted relative to the heat sink; The first groove is filled with a filler to form the filling layer.

24. The production method according to claim 23, wherein: On a side of the cover plate close to the display assembly, a multi-layer first sub-enclosure is printed along the edge of the cover plate to surround the edge of the cover plate, forming the first enclosure, including: On a side of the cover plate close to the display assembly, a first layer of second retaining walls corresponding to the second side is printed; a side of the first layer of the second retaining walls away from the second enclosure is close to the edge of the cover plate, and a side of the first layer of the second retaining walls close to the second enclosure is in contact with the edge of the second side; On the side of the first layer of the second retaining wall away from the cover plate, print the second layer of the second retaining wall corresponding to the second edge; the side of the second layer of the second retaining wall away from the second enclosure is indented relative to the side of the first layer of the second retaining wall away from the second enclosure, and the side of the second layer of the second retaining wall close to the second enclosure is indented relative to the edge of the second edge; On one side of the cover plate close to the display component, multiple layers of first retaining walls corresponding to the first side are printed, and the first retaining walls do not overlap with the display component; wherein, the second enclosure is printed after printing multiple layers of the second retaining walls and before printing multiple layers of the first retaining walls, the longitudinal section area of ​​the second retaining wall is larger than the longitudinal section area of ​​the first retaining wall, and the multiple layers of the first retaining walls are connected end to end with the multiple layers of the second retaining walls.

25. The production method according to claim 24, wherein: Filling the first groove with a filler to form the filling layer comprises: After forming the second enclosure and before forming the multiple layers of the first retaining wall, printing multiple layers of the first adhesive in the space of the first groove corresponding to the second retaining wall to form a portion of the filling layer corresponding to the second retaining wall; and curing the first enclosure, the second enclosure, and the portion of the filling layer; After forming the first retaining wall, filling and curing a filling material in the space of the first groove corresponding to the first retaining wall to form another portion of the filling layer corresponding to the first retaining wall; wherein the filler includes the first adhesive and the filling material; Partial milling is performed on the junction of the first retaining wall and the second retaining wall in the edge sealing structure, so that the side of the edge sealing structure away from the cover plate is flush.

26. The production method according to claim 23, wherein: Before forming an edge sealing structure on a side of the cover plate close to the display assembly, which covers at least the edge of the first side of the heat dissipation plate and extends close to the edge of the cover plate, the method further includes: forming an ink layer on a side of the cover plate close to the display component; On a side of the ink layer away from the cover plate, an annular groove is formed surrounding an edge of the ink layer; On a side of the cover plate close to the display assembly, a multi-layer first sub-enclosure is printed along the edge of the cover plate, surrounding and close to the edge of the cover plate, to form the first enclosure, including: Multiple layers of the first sub-enclosure are printed in the annular groove to form the first enclosure.

27. The production method according to any one of claims 23 to 26, wherein: Before bending the flexible circuit board, the method further includes: Filling and curing the second adhesive in the second groove of the backing film so that the curing rate of the second adhesive reaches a preset ratio; wherein the backing film is located between the display panel and the heat dissipation plate and covers a portion of the flexible circuit board; the second groove exposes the bending area of ​​the flexible circuit board; The flexible circuit board is bent so that the cured second adhesive fills the bending space formed after the flexible circuit board is bent, forming an inner filling layer of the filling layer.

28. The production method according to any one of claims 23 to 26, wherein: After bending the flexible circuit board, the method further comprises: injecting a second adhesive into one open end of a bending space formed after the flexible circuit board is bent, and using a fan to absorb the second adhesive at the other open end so that the second adhesive fills the bending space; The second adhesive filled in the bending space is solidified to form an inner filling layer of the filling layer.

29. The production method according to any one of claims 23 to 26, wherein: After bending the flexible circuit board, the method further comprises: Blocking the two open ends of the bending space formed after the flexible circuit board is bent; wherein the bending area of ​​the flexible circuit board has two through holes, and the two through holes are respectively close to the two open ends; injecting a second adhesive into the blocked bending space through one of the through holes until the second adhesive overflows from the other through hole, so that the second adhesive fills the bending space; The second adhesive filled in the bending space is solidified to form an inner filling layer of the filling layer.

Images