Substrate processing apparatus, substrate processing method, storage medium, and computer program product

Abstract

The invention provides a substrate processing apparatus, a substrate processing method, a storage medium, and a computer program product. The substrate processing apparatus is provided with: first loading ports (2A, 2B) and second loading ports (2C, 2D), which are provided on one side and the other side in the left-right direction, respectively, in such a manner that a transfer container for accommodating a substrate is placed on the first loading ports (2A, 2B) and the second loading ports (2C, 2D); a processing unit (D2) that processes the substrate; an inspection unit (4) for inspecting the substrate before or after processing by the processing unit (D2); and a substrate transfer mechanism for transferring the substrate to the processing unit (D2), the transfer container placed on the loading port, and the inspection assembly (4).

Description

[0001] This application is a divisional application of an application No. 201810632233.1, filed on June 19, 2018, entitled "Substrate processing apparatus, substrate processing method, and storage medium". TECHNICAL FIELD

[0002] The present application relates to a technology in a substrate processing apparatus provided with an inspection assembly that inspects a substrate. BACKGROUND

[0003] In photolithography in a manufacturing process of a semiconductor device, a resist film is formed by applying a resist on a surface of a semiconductor wafer (hereinafter referred to as a wafer) as a substrate, and a resist pattern is formed by performing a development process after the resist film is exposed. In a coating and developing apparatus in which such formation of a resist film and development process are performed, an inspection assembly for inspecting a surface state of a wafer before or after each process in the coating and developing apparatus is sometimes provided.

[0004] However, since the inspection assembly is provided, there is a risk that a space in the apparatus in which an assembly for processing a wafer can be provided is reduced. That is, due to the space, it is sometimes difficult to provide or add the inspection assembly in the coating and developing apparatus. Also, for example, the inspection assembly is sometimes subjected to periodic maintenance so that the inspection assembly performs high-precision inspection, and thus it is sometimes necessary to provide the inspection assembly in a manner that the maintenance can be easily performed. Thus, a technology in which the inspection assembly can be provided in the apparatus in a manner that solves these problems is sought.

[0005] In addition, in Patent Literature 1, a coating and developing apparatus is described, which is provided with a carrier block provided with a loading port that places a carrier for housing a wafer, a processing block provided with a plurality of processing assemblies that process a wafer, and an interface assembly that connects the processing block with an exposure apparatus, in which an inspection assembly is provided in a lateral direction of the above-described carrier block. However, according to the structure of the apparatus, the package of the apparatus becomes large due to the inspection assembly, a wafer is carried to each processing block and the inspection assembly by a wafer carrying mechanism provided in the carrier block, and thus the load of the wafer carrying mechanism becomes large, which can cause the productivity of the apparatus to be low. Thus, a decrease in productivity and an increase in package of the apparatus due to the provision of the above-described inspection assembly apparatus are also sought to be prevented.

[0006] Patent Literature 1: Japanese Patent Application Laid-Open No. 2003-151878 SUMMARY

[0007] PROBLEMS TO BE SOLVED BY THE INVENTION

[0008] The present application has been achieved in view of such circumstances, and aims to provide a technology for achieving high productivity in a substrate processing apparatus equipped with an inspection assembly that inspects a substrate.

[0009] Solution to the problem

[0010] The substrate processing apparatus of the present application is characterized by comprising: a first loading port and a second loading port disposed on one side and the other side in a left-right direction, respectively, in a manner that each loads a transfer container for housing a substrate; a processing section that processes the substrate; an inspection assembly that inspects the substrate before or after processing by the processing section; and a substrate transfer mechanism that transfers the substrate to and from the processing section, the transfer container loaded on the loading port, and the inspection assembly.

[0011] Also, in the substrate processing apparatus described above, the inspection assembly can be disposed between the first loading port and the second loading port in the left-right direction, and the substrate transfer mechanism can include: a first substrate transfer mechanism disposed on one side of the inspection assembly in the left-right direction, for transferring the substrate to and from the processing section and the transfer container loaded on the first loading port, respectively; a second substrate transfer mechanism disposed on the other side of the inspection assembly in the left-right direction, for transferring the substrate to and from the inspection assembly and the transfer container loaded on the second loading port, respectively; and a transfer section for transferring the substrate between the first substrate transfer mechanism and the second substrate transfer mechanism.

[0012] The substrate processing method of the present application is characterized by comprising the steps of: loading a transfer container for housing a substrate on a first loading port and a second loading port disposed on one side and the other side in a left-right direction, respectively; processing the substrate by a processing section; inspecting the substrate by an inspection assembly disposed between the first loading port and the second loading port in the left-right direction, before or after processing by the processing section; transferring the substrate to and from the processing section and the transfer container loaded on the first loading port by a first substrate transfer mechanism disposed on one side of the inspection assembly in the left-right direction, respectively; transferring the substrate to and from the inspection assembly and the transfer container loaded on the second loading port by a second substrate transfer mechanism disposed on the other side of the inspection assembly in the left-right direction, respectively; and transferring the substrate between the first substrate transfer mechanism and the second substrate transfer mechanism by a transfer section.

[0013] A storage medium storing a computer program for a substrate processing apparatus, the storage medium characterized in that the program is programmed to execute the substrate processing method of the present application.

[0014] The substrate processing apparatus of the present application is characterized by comprising: first and second load ports disposed on one side and the other side in a left-right direction, respectively, in a manner that each loads a transfer container for housing a substrate; a processing section that processes the substrate; an inspection assembly that inspects the substrate before or after processing by the processing section; and a substrate transfer mechanism that transfers the substrate to and from the processing section, the transfer container loaded on the load port, and the inspection assembly, wherein the substrate transfer mechanism comprises: a first substrate transfer mechanism disposed on one side in a left-right direction of the inspection assembly, which transfers the substrate to and from the processing section and the transfer container loaded on the first load port, respectively; and a second substrate transfer mechanism disposed on the other side in a left-right direction of the inspection assembly, which transfers the substrate to and from the inspection assembly and the transfer container loaded on the second load port, respectively.

[0015] The substrate processing method of the present application is characterized by comprising: loading a transfer container for housing a substrate on first and second load ports disposed on one side and the other side in a left-right direction, respectively; processing the substrate by a processing section; inspecting the substrate by an inspection assembly before or after processing by the processing section; transferring the substrate to and from the processing section and the transfer container loaded on the first load port by a first substrate transfer mechanism disposed on one side in a left-right direction of the inspection assembly, respectively; transferring the substrate to and from the inspection assembly and the transfer container loaded on the second load port by a second substrate transfer mechanism disposed on the other side in a left-right direction of the inspection assembly, respectively; and transferring the substrate between the first and second substrate transfer mechanisms by a standby section.

[0016] Effects of the Invention

[0017] In the present application, an inspection assembly is disposed between first and second load ports disposed in a left-right direction. Further, a first substrate transfer mechanism that transfers the substrate to and from the processing section and the transfer container of the first load port is disposed on one side in a left-right direction of the inspection assembly, and a second substrate transfer mechanism that transfers the substrate to and from the inspection assembly and the transfer container loaded on the second load port is disposed on the other side in a left-right direction of the inspection assembly, and the substrate is transferred between the substrate transfer mechanisms by a transfer section. According to such a configuration, it is possible to prevent the load of one substrate transfer mechanism from becoming large, and thus it is possible to suppress a decrease in the productivity of the apparatus. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is a cross-sectional plan view of a coating and developing apparatus as one embodiment of the substrate processing apparatus of the present application.

[0019] Figure 2 is a longitudinal sectional side view of the coating developing device.

[0020] Figure 3 is a front view of a carrier block constituting the coating developing device.

[0021] Figure 4 is a perspective view of the carrier block.

[0022] Figure 5 is a perspective view of a door of a loading port provided in the carrier block.

[0023] Figure 6 is a longitudinal sectional side view of an inspection assembly provided in the carrier block.

[0024] Figure 7 is a schematic plan view of the inspection assembly.

[0025] Figure 8 is a longitudinal main view of the carrier block.

[0026] Figure 9 is an explanatory view showing a conveyance path of a wafer in the carrier block.

[0027] Figure 10 is an explanatory view showing a conveyance path of a wafer in the carrier block.

[0028] Figure 11 is an explanatory view showing a conveyance path of a wafer in the carrier block.

[0029] Figure 12 is an explanatory view showing a conveyance path of a wafer in the carrier block.

[0030] Figure 13 is a front view showing other structures of the carrier block.

[0031] Figure 14 is a front view showing other structures of the carrier block.

[0032] Figure 15 is a front view showing other structures of the carrier block.

[0033] Figure 16 is a longitudinal sectional side view showing other structures of the carrier block.

[0034] Figure 17 is a front view showing other structures of the carrier block.

[0035] BRIEF DESCRIPTION OF THE DRAWINGS

[0036] C: carrier; D1: carrier block; D2: processing unit; 1: coating and developing device; 2A~2D: loading port; 21: conveying port; 23: movable loading platform; 24: lifting door; 25: revolving door; 4: inspection component; 5A, 5B: conveying mechanism; 5: buffer component. DETAILED DESCRIPTION

[0037] [First embodiment]

[0038] Refer to Figure 1 Cross-sectional top view, Figure 2 A coating and developing apparatus 1 according to a first embodiment of a substrate processing apparatus of the present invention is described with reference to a longitudinal sectional side view of FIG. The coating and developing apparatus 1 is comprised of a carrier block D1, a processing block D2, and an interface block D3 connected linearly in the order described. The interface block D3 is connected to an exposure unit D4.

[0039] To briefly explain each block D1 to D3, a carrier C containing a circular substrate, i.e., a wafer W, with a diameter of, for example, 300 mm is transported to the carrier block D1, and the carrier block D1 transports the wafer W in the carrier C into the device. The carrier C is, for example, a transport container for wafer W called a FOUP (Front Opening Unified Pod), and includes a container body and a cover provided on the front surface of the container body. In addition, the above-mentioned processing block D2 supplies various chemical solutions to the wafer W to form an anti-reflective film and a resist film, and forms a resist pattern by developing the resist film. The exposure machine D4 exposes the wafer W so that a resist pattern is formed by the above-mentioned development, and the interface block D3 transfers the wafer W between the processing block D2 and the exposure machine D4.

[0040] The wafer W is transported and processed in the order of carrier C → carrier block D1 → processing block D2 → interface block D3 → exposure machine D4 → interface block D3 → processing block D2 → carrier block D1 → carrier C. During this transport, the wafer W is transported to the inspection component 4 provided in the carrier block D1 before being moved into the processing block D2 or after being moved out of the processing block D2, so as to inspect the surface condition of the wafer W. Specifically, for example, it is inspected for the presence of foreign matter and for any abnormalities in the size of the pattern. Hereafter, the inspection performed before being moved into the processing block D2 will be recorded as the pre-processing inspection, and the inspection performed after being moved out of the processing block D2 will be recorded as the post-processing inspection.

[0041] Next, refer to Figure 3 Main view, Figure 4 In addition, in order to illustrate the three-dimensional view of the carrier block D1. Figure 4The front surface of the carrier block Dl is indicated in two parts, and the carrier block Dl is divided into two parts. In the following description, the front side of the carrier block Dl is described as the front side, and the rear side of the interface block D3 is described as the rear side, and the left side and the right side in the description are the left side and the right side when viewed from the front to the rear, unless otherwise specified.

[0042] The carrier block Dl has a rectangular housing 11, and each side wall of the housing 11 is formed vertically. Three shelves are formed by protruding three parts separated from each other in the vertical direction from the front side of the front surface wall 12, which is one of the side walls. The lower shelf of the three shelves is provided as a support table 13, the middle shelf is provided as a support table 14, and the upper shelf is provided as a support table 15. In addition, the lower end of the support table 13 further protrudes to the front to form a support table 16. These support tables 13 to 16 are horizontally formed to support the carrier C on the table.

[0043] In the front surface wall 12 of the housing 11, between the support table 13 and the support table 14, the wafer W conveying port 21, the wafer W conveying port 21, the opening portion 22 for the inspection assembly, and the wafer W conveying port 21 are provided separately from each other, and are arranged in order from the left to the right. The above-mentioned opening portion 22 is a flat rectangular shape, and two are provided separately from each other in the vertical direction. In the support table 13, a movable placement table 23 for placing the carrier C is provided in front of each conveying port 21. The movable placement table 23 is movable between a front position where the carrier C is handed over with respect to the movable placement table 23 and a rear position where the wafer W is handed over between the carrier C and the inside of the housing 11 via the conveying port 21.

[0044] A lifting door 24 is provided in each of the above-mentioned conveying ports 21. A not-shown holding mechanism for holding the lid of the carrier C is provided on the front surface of the lifting door 24, and is configured to be capable of handing over the lid with respect to the container body of the carrier C on the movable placement table 23 in the rear position. In addition, the lifting door 24 is movable between a closed position that closes the conveying port 21 and an open position that opens the conveying port 21 after retreating and lowering from the closed position. Thus, the lifting door 24 opens and closes the conveying port 21 and the lid of the carrier C. Furthermore, in Figure 2 Figure 3 The above-mentioned open position is indicated by a single-dot chain line in the drawing. Thus, if a device having a placement table for placing a conveying container for housing a wafer W, a conveying port for conveying a wafer W with respect to the conveying container placed on the placement table, and a door for opening and closing the conveying port and the lid of the conveying container is provided as a load port, three load ports are provided on the support table 13. In each drawing, in order to distinguish the three load ports from each other, they are indicated as 2A, 2B, and 2C from the left to the right. ​

[0045] In the front wall 12 and between the support tables 14 and 15, an opening of the conveyance port 21 of a wafer W is formed vertically above the conveyance port 21 of the above-described load port 2C. In the support table 14, the above-described moving placement table 23 is provided in front of the conveyance port 21 provided between the support tables 14 and 15 as such, and a swing door 25 is provided in the conveyance port 21. Figure 5 is a perspective view of the swing door 25, Figure 5 26 is an arm, one end of which is connected to a rim portion of the swing door 25. Figure 5 27 is a rotation mechanism connected to the other end of the arm 26. The rotation mechanism 27 rotates the swing door 25 about a horizontal rotation axis Rl located below the conveyance port 21 and in the front-rear direction when viewed in the front-rear direction. In addition, Figure 5 28 is a front-rear movement mechanism for moving the swing door 25 together with the rotation mechanism 27 and the arm 26 in the front-rear direction.

[0046] The swing door 25 is moved by the front-rear movement mechanism 28 and the rotation mechanism 27 between a closed position that closes the conveyance port 21 and a position that is retreated from the closed position and rotated by 90°, i.e., an open position that opens the conveyance port 21. In Figure 2 , Figure 3 The open position is indicated by a single-dot chain line in Figure 3 , the swing door 25 in the open position is offset laterally with respect to the conveyance port 21 and is located above the opening portion 22 when viewed in the front-rear direction. In addition, a holding mechanism for holding a lid of a carrier C, which is not shown, is provided in a front surface of the swing door 25 as in the front surface of the lift door 24, and the lid is exchanged with respect to a container body placed on the moving placement table 23 in the position behind the support table 14. That is, the swing door 25 also performs opening and closing of the conveyance port 21 and the lid of the carrier C. Thus, the swing door 25, the conveyance port 21 opened and closed by the swing door 25, and the moving placement table 23 on the support table 14 also constitute a load port, which is indicated as 2D in the figure.

[0047] Further, on the left side of the support table 14 and the above-described loading port 2D, three standby placement tables 29 for placing the carrier C are provided at intervals and in a row in the left-right direction. When viewed in the front-rear direction, the standby placement tables 29 of the support table 14 are provided vertically above the opening portion 22, the movable placement table 23 of the loading port 2A, and the movable placement table 23 of the loading port 2B, respectively. Next, the support tables 15 and 16 will be described. On the support table 15, a carry-in placement table 31, standby placement tables 29, standby placement tables 29, and a carry-out placement table 32 for placing the carrier C are provided at intervals and in a row in the order described from left to right. When viewed in the front-rear direction, the carry-out placement table 31 and the standby placement tables 29 of the support table 15 are vertically above the standby placement tables 29 of the support table 14, respectively, and the carry-in placement table 31 is vertically above the movable placement table 23 of the support table 14. On the support table 16, for example, two standby placement tables 29 are provided in a row in the left-right direction at a position to the right of the center in the left-right direction. However, the standby placement tables 29 can also be provided at a position to the left of the center in the left-right direction.

[0048] The carrier C is carried between the carry-in placement table 31, the carry-out placement table 32, and the standby placement tables 29 by a carrier carrying mechanism 3 described later. The carry-in placement table 31 is a placement table for placing the carrier C so that the carrier C is carried into the carrier block Dl by an external carrying mechanism not shown. The external carrying mechanism receives the carrier C placed on the carry-out placement table 32 and carries the carrier C out of the carrier block Dl. Further, each of the standby placement tables 29 is a placement table for standing by the carrier C before the wafer W is carried into the apparatus and for standing by the empty carrier C after the wafer W is carried into the apparatus. Thus, the carrier C is carried in the order of the carry-in placement table 31 → the standby placement table 29 → the movable placement table 23 of any one of the loading ports 2A to 2D, and the wafer W is delivered onto the movable placement table 23, after which the carrier C is carried in the order of the standby placement table 29 → the movable placement table 23 of any one of the loading ports 2A to 2D, and the wafer W is received from the movable placement table 23. Thereafter, the carrier C is carried in the order of the standby placement table 29 → the carry-out placement table 32.

[0049] Furthermore, regarding the standby stages 29, as described above, the load port 2D is provided at the right end of the support table 14, so the number of standby stages 29 that can be installed on the support table 14 is limited. However, in addition to the standby stages 29 provided on the support tables 14 and 15, a standby stage 29 is also provided on the support table 16 below the load ports 2A to 2D. This allows a sufficient number of carriers C to be loaded into the carrier block D1. Consequently, high productivity can be ensured.

[0050] The carrier transport mechanism 3 is described below. The carrier transport mechanism 3 is located in front of the front wall 12 of the carrier block D1 and includes a multi-jointed arm 33 capable of holding a held portion provided on the upper portion of the carrier C, a lifting mechanism 34 for raising and lowering the multi-jointed arm 33, and a left-right movement mechanism 35 for moving the lifting mechanism 34 left-right. The mechanism transports the carrier C along the path described above.

[0051] Two inspection components 4 for inspecting wafers W are provided on the carrier block D1. Figure 6 The inspection assembly 4 is described with reference to a longitudinal sectional side view of FIG. The inspection assembly 4 includes, for example, a rectangular, flat housing 41 that is long in the front-to-back direction. The housing 41 is inserted from the outside of the housing 11 into the housing 11 through the aforementioned opening 22, thereby being disposed on the carrier block D1. The openings 22 are arranged vertically in the vertical direction, so the inspection assembly 4 is also arranged vertically in the vertical direction. A transfer port 42 for the wafer W is formed on the left and right side walls of the rear portion of the housing 41, and the transfer port 42 opens into the housing 11. The front side of the housing 41 protrudes from the front wall 12 of the housing 11.

[0052] A placement unit 43 is provided in the housing 41. The placement unit 43 adsorbs the center portion of the back side of the wafer W and holds the wafer W horizontally. In the housing 41, the placement unit 43 can move between a standby position on the rear side and a shooting end position on the front side. Figure 6 In FIG, the solid line indicates the standby position, and the dashed line indicates the end position of the shooting. Figure 1 The figure shows the placement section 43 in its standby position. The standby position faces the transfer port 42 described above. The forks 56 of the transfer mechanisms 5A and 5B, described later, which enter the housing 41 through the transfer port 42, are raised and lowered, thereby transferring wafers W between the transfer mechanisms 5A and 5B and the placement section 43. Alternatively, instead of raising and lowering the forks 56, freely movable pins may be provided within the housing 41 to transfer wafers W between the transfer mechanisms 5A and 5B and the placement section 43 in the standby position. Reference numeral 44 in the figure denotes a moving mechanism for moving the placement section 43 back and forth.

[0053] A transversely long semi-transparent mirror 45 extending in the left-right direction within the housing 41 is provided above the movement path of the wafer W based on the loading portion 43. When viewed from the side, the semi-transparent mirror 45 is provided at an angle relative to the movement direction of the wafer W. In addition, an illumination 46 for irradiating light downward through the semi-transparent mirror 45 is provided above the semi-transparent mirror 45. A camera 47 is provided on the far side of the semi-transparent mirror 45. The illumination light from the illumination 46 passes through the semi-transparent mirror 45 and reaches the irradiation area below the semi-transparent mirror 45. Moreover, the reflected light of the object in the irradiation area is reflected by the semi-transparent mirror 45 and then captured by the camera 47. That is, the camera 47 can capture the object in the imaging area below the semi-transparent mirror 45.

[0054] While the placement unit 43, which has received the wafer W from the transport mechanism 5A or 5B at the standby position, moves toward the imaging end position, the camera 47 intermittently captures images, thereby capturing the entire surface of the wafer W and acquiring image data. This image data is transmitted from the camera 47 to the control unit 10, described later, which inspects the surface of the wafer W based on this image data. Furthermore, the placement unit 43, having moved to the imaging end position, returns to the standby position to receive the wafer W from the transport mechanism 5A or 5B.

[0055] In addition, the inspection unit 4 is configured to be detachable relative to the carrier block D1. Figure 7 As shown, a guide rail 48 is provided at the edge of the opening 22 of the carrier block D1, extending in the direction of the opening 22 toward the inside of the housing 11, as an engaging portion. On the other hand, a groove 49 is provided in the housing 41 of the inspection unit 4, extending from the rear end toward the front, as an engaged portion. When the rear portion of the housing 41 of the inspection unit 4 is inserted into the housing 11 of the carrier block D1 as described above and the inspection unit 4 is mounted on the carrier block D1, as shown in FIG. Figure 7 As shown in the upper part of , the groove 49 is engaged with the guide rail 48.

[0056] For example, the operator pulls the front portion of the inspection assembly 4 protruding from the opening 22 forward, thereby pulling the rear portion of the housing 41 outward from the housing 11 along the guide rail 48. Figure 7 As shown in the lower part of the , the groove 49 is disengaged from the guide rail 48, and the inspection unit 4 is removed from the carrier block D1. When the inspection unit 4 is installed in the housing 41, the operation is performed in the opposite direction of the removal operation. By making the inspection unit 4 freely attachable and detachable relative to the carrier block D1, for example, the maintenance of the inspection unit 4, such as replacement of the lighting 46, can be easily performed. In addition, Figure 7 In other figures, the guide rails 48 and the grooves 49 are omitted.

[0057] Next, refer to Figure 8The structure inside the housing 11 is explained with reference to a longitudinal sectional front view of the carrier block D1. A buffer assembly 51 is provided in the housing 11. The buffer assembly 51 is configured to place a plurality of wafers W at intervals in the vertical direction. For example, a plurality of groups of three pins for supporting the back of the wafer W are provided in the vertical direction, thereby constituting the buffer assembly 51. In addition, the buffer assembly 51 is not limited to such a structure with pins. For example, it can also be configured to support the peripheral edge of the wafer W in a bowl shape to guide the peripheral edge of the wafer W so that the wafer W falls into a predetermined position. The buffer assembly 51 is provided above the inspection assembly 4 in such a manner that it overlaps with the standby position of the loading portion 43 of the inspection assembly 4 when viewed from above. The buffer assembly 51 constitutes a standby portion for placing a subsequent wafer W so that the wafer W can stand by before the inspection assembly 4 is vacated (i.e., the wafer W previously inspected by the inspection assembly 4 is unloaded) and the subsequent wafer W can be loaded into the inspection assembly 4.

[0058] A transport mechanism 5A is provided on the left side of the buffer assembly 51 and the inspection assembly 4, and a transport mechanism 5B is provided on the right side. The transport mechanism 5A comprises an upright frame 52, a horizontal movement mechanism 53 for moving the frame 52 left and right, a lifting platform 54 mounted on the frame 52 so as to be vertically movable, a base 55 rotatable about a vertical axis on the lifting platform 54, and a fork 56 that supports the back surface of the wafer W by moving forward and backward on the base 55. The range within which the frame 52 can be moved by the horizontal movement mechanism 53 is limited to the left side of the buffer assembly 51 and the inspection assembly 4.

[0059] The transport mechanism 5A, which serves as the first substrate transport mechanism, can deliver wafers W between the carriers C placed on the load ports 2A and 2B, which serve as the first load ports, the placement unit 43 in the standby position of the inspection module 4, the buffer module 51, and the delivery module of the tower T1 described later, by cooperating with the aforementioned components of the transport mechanism 5A. Figure 1 Reference numeral 57 denotes a conveying path for wafer W provided on the rear side of the housing 11 so as to deliver the wafer W to the tower T1. The conveying mechanism 5B, serving as the second substrate conveying mechanism, is constructed in the same manner as the conveying mechanism 5A, except that the left-right moving mechanism 53 is not provided. The conveying mechanism 5B, through the cooperation of the various components constituting the conveying mechanism 5B, is capable of delivering wafers W between the respective carriers C placed on the load ports 2C and 2D serving as the second load ports, the loading section 43 in the standby position of the inspection module 4, and the buffer module 51. Thus, both the conveying mechanisms 5A and 5B are capable of delivering wafers W to the buffer module 51 and the loading section 43 of the inspection module 4. The buffer module 51 and the loading section 43 also serve as a delivery section for loading the wafer W so as to deliver the wafer W between these conveying mechanisms 5A and 5B.

[0060] Next, use Figure 1 、 Figure 2 The processing block D2 is described. The processing block D2 is composed of the first unit block E1 to the sixth unit block E6 stacked in order from bottom to top for liquid processing of wafer W. E1 and E2 are the same unit blocks, E3 and E4 are the same unit blocks, and E5 and E6 are the same unit blocks. Wafer W is transported to one of the two same unit blocks. Here, Figure 1 Unit block E3 is shown as a representative unit block for explanation. A transport area 61 for wafers W is formed, extending in the front-to-back direction. On the right side of transport area 61, two resist film forming units 62 are arranged in the front-to-back direction to apply a resist, a chemical solution, to the surface of wafers W to form a resist film. On the left side of transport area 61, multiple heating units 63 are arranged in the front-to-back direction along transport area 61 to heat wafers W. Furthermore, transport area 61 is provided with a transport mechanism F3 for transporting wafers W within unit block E3.

[0061] The differences between the unit blocks E1, E2, E5, and E6 and the unit blocks E3 and E4 are described. The unit blocks E1 and E2 include an anti-reflection film forming component instead of the resist film forming component 62. The anti-reflection film forming component applies a chemical solution for anti-reflection film formation instead of applying a resist to form an anti-reflection film, thereby forming an anti-reflection film on the wafer W. The unit blocks E5 and E6 include a developing component instead of the resist film forming component 62. The developing component supplies a developer as a chemical solution to the wafer W. As described above, the types of chemical solutions in the components that supply the chemical solutions are different, and other than that, the unit blocks E1 to E6 are constructed identically. In addition, in Figure 2 In FIG. 1 , as for the transport mechanisms corresponding to the transport mechanism F3 of the unit blocks E1 , E2 , and E4 to E6 , F1 , F2 , and F4 to F6 are shown.

[0062] On the carrier block D1 side of processing block D2, a tower T1 is provided. The tower T1 includes a plurality of stacked transfer assemblies extending vertically across the unit blocks E1 to E6, and a transfer mechanism 64 for transferring wafers W between the various assemblies comprising tower T1. In tower T1, transfer assemblies TRS1 to TRS6 for placing wafers W are provided at respective height positions where unit blocks E1 to E6 are provided. Furthermore, in order to transfer wafers W to and from transfer mechanism 5A as described above, transfer assemblies for placing wafers W are provided in tower T1. These transfer assemblies are designated as TRS0 and TRS10.

[0063] Interface block D3 includes towers T2, T3, and T4, which extend vertically across unit blocks E1 to E6. The interface block D3 is equipped with a transfer mechanism 65 for transferring wafers W between towers T2 and T3, a transfer mechanism 66 for transferring wafers W between towers T2 and T4, and a transfer mechanism 67 for transferring wafers W between tower T2 and exposure unit D4. Tower T2 is stacked with transfer modules TRS for transferring wafers W to and from each unit block. Modules are also installed in towers T3 and T4, but their description is omitted.

[0064] like Figure 1 As shown, the coating and developing apparatus 1 is provided with a control unit 10 including a computer. The control unit 10 includes a program storage unit (not shown) containing a program. The control unit 10 outputs control signals to various components of the coating and developing apparatus 1 to control the transport of wafers W by the various transport mechanisms, the transport of carriers C by the carrier transport mechanism 3, and the processing of wafers in various components. The aforementioned program includes commands for forming and inspecting resist patterns on the wafers W, as described below. The program is stored in the program storage unit, for example, in a storage medium such as a hard disk, optical disk, DVD, or memory card.

[0065] Next, refer to Figure 9 、 Figure 10 The following describes the transport path of the wafer W in the carrier block D1 when the above-mentioned resist pattern formation and pre-processing inspection are performed. Figure 9 、 Figure 10 and the following Figure 11 、 Figure 12 In FIG. 1 , for convenience of illustration, the load ports 2C and 2D are shown aligned in the horizontal direction, and the inspection assembly 4 and the buffer assembly 51 are shown offset from each other.

[0066] When performing pre-processing inspection, for example, the load ports 2C and 2D are used as loading ports for loading wafers W into the apparatus, and the load ports 2A and 2B are used as unloading ports for unloading wafers W from the apparatus. First, the wafers W are transferred from the carriers C placed on the load ports 2C and 2D to the buffer assembly 51 by the transfer mechanism 5B ( Figure 9 Arrow A1 in the figure).

[0067] Next, when the wafer W can be transported to the inspection module 4, the wafer W is loaded into the inspection module 4 by the transport mechanism 5B ( Figure 9 Then, the wafer W is unloaded from the inspection module 4 by the transport mechanism 5A and transported to the transfer module TRS0 ( Figure 9The wafer W transferred to the transfer module TRS0 is transferred to the processing block D2, the interface block D3, and the exposure unit D4 as described above to form a resist pattern, and then transferred to the transfer module TRS10 of the tower T1. The wafer W is then transferred to the carrier C ( Figure 10 Arrow A4 in the figure).

[0068] Next, refer to Figure 11 、 Figure 12 The following describes the transport path of the wafer W in the carrier block D1 when the above-mentioned resist pattern formation and post-processing inspection are performed. In the case of post-processing inspection, for example, the load ports 2A and 2B are used as load ports for loading, and the load ports 2C and 2D are used as load ports for unloading. First, the wafer W is transported from the carriers C placed on the load ports 2A and 2B to the transfer assembly TRS0 (of the tower T1) by the transport mechanism 5A. Figure 11 As indicated by arrow B1 in FIG. 1 , the wafer W is transported to the processing block D2, the interface block D3, and the exposure unit D4 to form a resist pattern, and then transported to the transfer assembly TRS10 of the tower T1.

[0069] Next, the wafer W is transferred from the transfer module TRS10 to the buffer module 51 ( Figure 12 When the wafer W can be transported to the inspection assembly 4, the wafer W is transported to the inspection assembly 4 by the transport mechanism 5B ( Figure 12 Then, the wafer W is unloaded from the inspection assembly 4 by the transport mechanism 5B and transported to the carrier C (of the load port 2C or 2D) of the load port 2C or 2D. Figure 12 Arrow B4).

[0070] Through the above-mentioned various transports of the wafer W, the transport path of the wafer W from the delivery assembly TRS0 to the delivery assembly TRS10 is described. The wafer W transported to the delivery assembly TRS0 is distributed and transported to the unit blocks E1 and E2 using the transport mechanism 64. For example, when the wafer W is delivered to the unit block E1, the delivery assembly TRS1 corresponding to the unit block E1 in the delivery assembly TRS of the tower T1 (the delivery assembly that can deliver the wafer W using the transport mechanism F1) delivers the wafer W. In addition, when the wafer W is delivered to the unit block E2, the delivery assembly TRS2 corresponding to the unit block E2 in the delivery assembly TRS of the tower T1 delivers the wafer W.

[0071] The wafer W thus allocated is carried by the conveyance mechanism Fl (F2) in the order of TRSl (TRS2) → anti-reflection film forming assembly → heating assembly 63 → TRSl (TRS2), and allocated to the transfer assembly TRS3 corresponding to the unit block E3 and the transfer assembly TRS4 corresponding to the unit block E4 by the conveyance mechanism 64. The wafer W thus allocated to TRS3, TRS4 is carried by the conveyance mechanism F3 (F4) in the order of TRS3 (TRS4) → resist film forming assembly 62 → heating assembly 63 → transfer assembly TRS31 (TRS41) of the tower T2. Then, the wafer W is carried to the exposure machine D4 by the conveyance mechanisms 65, 67, and the resist film formed on the surface of the wafer W is exposed along a prescribed pattern.

[0072] The exposed wafer W is carried between the towers T2, T4 by the conveyance mechanisms 66, 67, and carried to the transfer assemblies TRS51, TRS61 of the towers T2 corresponding to the unit blocks E5, E6, respectively. Then, the wafer W is carried in the order of heating assembly 63 → developing assembly by the conveyance mechanisms F5, F6, and the resist film is dissolved along the pattern resulting from exposure by the exposure machine D4 to form a resist pattern, after which the wafer W is carried to the transfer assembly TRS10.

[0073] According to the coating and developing apparatus 1 described above, the inspection assembly 4 is provided between the loading ports 2A, 2B disposed on the left side of the carrier block Dl and the loading ports 2C, 2D disposed on the right side of the carrier block Dl. Further, the conveyance mechanism 5A disposed on the left side of the inspection assembly 4 is in communication with the carrier C and the processing block D2 placed in the loading ports 2A, 2B, respectively, the conveyance mechanism 5B disposed on the right side of the inspection assembly 4 is in communication with the carrier C placed in the loading ports 2C, 2D, respectively, and the wafer W is transferred between the conveyance mechanisms 5A, 5B via the inspection assembly 4 or the buffer assembly 51. According to such a structure, the inspection assembly 4 can be disposed in the vicinity of the loading ports 2A to 2D, and thus the wafer W just carried into the coating and developing apparatus 1 and the wafer W about to be carried out of the coating and developing apparatus 1 can be inspected, respectively. Thus, in the case where an abnormality occurs in the wafer W before being carried into the coating and developing apparatus 1, the abnormality can be identified with high accuracy as an abnormality occurring outside the coating and developing apparatus 1, and in the case where an abnormality occurs in the processing and conveyance within the coating and developing apparatus 1, the abnormality can be detected reliably.

[0074] On the basis of being able to perform such an inspection, according to the structure of the carrier block Dl described above, the number of load ports accessed by each of the conveyance mechanisms 5A, 5B can be suppressed, and the conveyance of the wafer W with respect to the processing block D2 by the conveyance mechanism 5A, on the other hand, the conveyance of the wafer W to the inspection assembly 4 by the conveyance mechanism 5B which does not convey to the processing block D2 can be performed. That is, the task is shared by the conveyance mechanisms 5A, 5B, so the wafer W can be conveyed between the carrier C and the processing block D2 and the inspection can be performed during the conveyance, so the number of times of handover of the wafer W by each of the conveyance mechanisms 5A, 5B can be suppressed. That is, the load of each of the conveyance mechanisms 5A, 5B can be suppressed from becoming large, so the productivity of the apparatus can be improved.

[0075] Further, as described above, the inspection assembly 4 provided between the load ports in the left-right direction is provided at the same height position as the conveyance port 21 of the load ports 2A to 2C. That is, the inspection assembly 4 and the load ports 2A to 2C are provided in a row in the left-right direction. Thereby, the distance between the carrier C of the load ports 2A to 2C and the inspection assembly 4 can be made short, the wafer W can be rapidly conveyed between these load ports 2A to 2C and the carrier C, so the productivity of the apparatus can be more reliably improved. Further, in the case where the conveyance between the carrier C and the inspection assembly 4 is performed via the buffer assembly 51 as described above, if the inspection assembly 4 and the load ports 2A to 2C are arranged in a row, the moving distance of the conveyance mechanisms 5A, 5B can be suppressed from becoming long by arranging the buffer assembly 51 in the vicinity of the inspection assembly 4, so the conveyance of the wafer W can be rapidly performed.

[0076] Further, by providing the load ports 2A to 2C as described above and providing the load port 2D, the decrease in the productivity due to the shortage of the number of load ports is avoided, but by arranging this load port 2D above the load port 2C, the increase in the package of the carrier block Dl due to the provision of the inspection assembly 4 at the position described above and the provision of four load ports can be prevented. Further, with respect to the load ports 2A to 2C, the conveyance ports 21 are respectively opened and closed by the lift doors 24, so the space in the left-right direction required for opening and closing the conveyance ports 21 can be suppressed, and the interval between the inspection assembly 4 and the load ports can be prevented from becoming large, so the width of the carrier block Dl in the left-right direction can be prevented from becoming large. On the other hand, with respect to the load port 2D, the conveyance port 21 is opened and closed by the rotary door 25, so the space in the up-down direction required for opening and closing the conveyance port 21 is suppressed, so the distance between the load ports 2C, 2D becomes short. That is, even if the load ports 2C, 2D are arranged in the up-down direction, the distance of the lift of the conveyance mechanism 5B for accessing each of the load ports 2C, 2D respectively can be suppressed, so the productivity can be more reliably improved.

[0077] Further, two inspection assemblies 4 are provided in order to prevent a decrease in productivity, but only one inspection assembly 4 can be provided. Also, three or more inspection assemblies 4 can be provided, in which case, it is preferable to provide the inspection assemblies 4 in a stacked manner with respect to each other in order to enable the respective conveyance mechanisms 5A, 5B to hand over the wafers W while suppressing the package of the device.

[0078] Further, the inspection assembly 4 is not limited to being provided at the same height position as the conveyance ports 21 of the load ports 2A to 2C, and for example, a buffer assembly 51 can be provided at the same height position as the conveyance ports 21 of the load ports 2A to 2C, and the inspection assembly 4 can be provided at a position higher than the buffer assembly 51. However, in order to avoid interference between the rotating door 25 of the load port 2D and the inspection assembly 4, the height of the load port 2D is made greater with respect to the load port 2C, whereby there is a risk that the distance that the conveyance mechanism 5B needs to travel in order to ascend and descend in order to access the load ports 2C, 2D, respectively, becomes greater, and from the viewpoint of rapidly performing conveyance between the carriers C of the load ports 2A to 2C and the inspection assembly 4 as described above, it is also preferable to provide the inspection assembly 4 at the same height position as the conveyance ports 21 of the load ports 2A to 2C.

[0079] Further, the buffer assembly 51 is provided so as to overlap the placement portion 43 of the standby position of the inspection assembly 4 when viewed in plan, and therefore the base 55 provided with the fork 56 does not need to move in the left-right direction in the conveyance mechanisms 5A, 5B, and the wafer W standing by at the buffer assembly 51 can be conveyed to the inspection assembly 4 by only the lifting action. Thus, the time required for conveyance of the wafer W between the buffer assembly 51 and the inspection assembly 4 can be suppressed, and productivity can be more reliably improved. Further, the buffer assembly 51 can not be provided in the carrier block Dl, and conveyance of the wafer W between the conveyance mechanisms 5A, 5B can be performed via the inspection assembly 4 only, and for example, when the wafer W is conveyed to the inspection assembly 4, the conveyance mechanisms 5A, 5B hold the wafer W and stand by until the inspection assembly 4 is empty. However, during the period in which the wafer W is being held like this, the conveyance mechanisms 5A, 5B cannot perform conveyance of other wafers W, and therefore in order to prevent a decrease in productivity, it is effective to provide the buffer assembly 51.

[0080] Further, in the above-described carrier block Dl, the placement portion 43 of the inspection assembly 4 and the buffer assembly 51 constitute a handover portion that places the wafer W in order to perform handover of the wafer W between the conveyance mechanisms 5A, 5B, but a handover portion can be separately provided with respect to the inspection assembly 4 and the buffer assembly 51. However, by the inspection assembly 4 serving as the handover portion, as Figure 9 As shown, the conveyance mechanism 5A can directly receive the wafer W that has completed inspection, and convey it to the tower Tl. Further, by the buffer assembly 51 serving as the handover portion, as Figure 12As shown, wafers W in tower T1 can be directly transferred to and placed on standby in buffer module 51. That is, inspection module 4 and buffer module 51 each serve as a transfer unit, thereby reducing the load on transfer mechanisms 5A and 5B and improving productivity.

[0081] In addition, it is not limited to performing only one of the above-mentioned pre-processing inspection and post-processing inspection before the wafer W unloaded from the carrier C is placed back on the carrier C. As an example of transporting the wafer W with pre-processing inspection and post-processing inspection, first, as shown in FIG. Figure 9 As shown by arrows A1 to A3, the wafer W unloaded from the load ports 2C and 2D is transported in the order of the buffer module 51, the inspection module 4, and the transfer module TRS0, thereby undergoing pre-processing inspection on the wafer W and then transporting it to the processing block D2. Then, the wafer W formed with the resist pattern and transported to the transfer module TRS10 is processed as follows. Figure 12 As shown by arrows B2 to B3, the wafers W are transported in the order of the buffer assembly 51 and the inspection assembly 4, and after the post-processing inspection, they are transported to the carriers C of the load ports 2A and 2B. By performing pre-processing inspection and post-processing inspection in this manner, when an abnormality is detected in the wafer W, it is possible to more reliably determine whether the abnormality is caused by the coating and developing apparatus 1 or by something external to the coating and developing apparatus 1.

[0082] Another example of transporting wafers for pre-processing inspection is described below. Figure 9 As indicated by arrows A1 to A3, wafers W are transported in the order of buffer module 51, inspection module 4, and transfer module TRS0. Furthermore, wafers W, having been formed with a resist pattern and transferred to transfer module TRS10, are transported to buffer module 51 by transport mechanism 5A, and then to carriers C of load ports 2C and 2D by transport mechanism 5B. In other words, if this series of transports is considered the first loading and unloading operation, load ports 2C and 2D constitute the loading and unloading load ports in the first loading and unloading operation.

[0083] Other examples of transport that require post-processing inspection are explained below. Figure 11 As described above, the wafer W is transferred from the carrier C of the load port 2A, 2B to the transfer module TRS0, after which the resist pattern is formed and then transferred to the transfer module TRS10. Figure 12As shown by arrows B2 and B3, the wafer W is transported in the order of the buffer module 51 and the inspection module 4. The wafer W is then transported from the inspection module 4 to the carrier C of the load ports 2A and 2B by the transport mechanism 5A. In other words, if this series of transports is considered the second loading and unloading transport, the load ports 2A and 2B serve as the loading and unloading load ports in the second loading and unloading transport.

[0084] For example, it can also be controlled in the following way: Figures 9-12 The wafer W is transported as described above. When both the load ports 2A and 2B cannot be used, the first loading and unloading operation is performed. When both the load ports 2C and 2D cannot be used, the second loading and unloading operation is performed. Alternatively, for example, one of the two inspection modules 4 may be used exclusively for the first loading and unloading operation, and the other may be used exclusively for the second loading and unloading operation, so that the first loading and unloading operation and the second loading and unloading operation are performed in parallel. In other words, it is not limited to the following. Figures 9-12 As shown in the example, the operations of the transport mechanisms 5A and 5B are controlled so that one of the transport mechanisms 5A and 5B only receives wafers W from the carrier C and the other transport mechanism 5A and 5B only transports wafers W to the carrier C.

[0085] [First Modification of the First Embodiment]

[0086] Next, refer to Figure 13 , the carrier block D11 involved in the first variant of the first embodiment is described with the differences from the carrier block D1 as the center. In the carrier block D11, the loading port 2A is set at the same height position as the loading port 2D, and the position of the loading port 2A in the left-right direction is aligned with the position of the loading port 2B in the left-right direction. As a door for opening and closing the transfer port 21 of the loading port 2A, a rotating door 25 is provided in the same manner as the loading port 2D to avoid interference with the loading port 2B. In addition, in the carrier block D11 and on the left side of the loading port 2B, two inspection components 4 are provided in the upper and lower directions in the same manner as on the right side. For the sake of convenience, the two inspection components on the right side of the loading port 2B are set as 4A, and the two inspection components on the left side are set as 4B. The conveying mechanism 5A is located on the left side of the inspection component 4A corresponding to the inspection component 4B and the loading port 2A, so that the conveying mechanism 5A performs the transfer of the wafer W.

[0087] An example of transport in the carrier block D11 is shown. Figure 9The wafer W taken out from the carrier C of the load port 2C, 2D and carried to the buffer assembly 51 is carried to the inspection assembly 4A by the carrying mechanism 5B or to the inspection assembly 4B by the carrying mechanism 5A to receive pre-process inspection. Each wafer W after inspection is carried to the handoff assembly TRS0 of the tower Tl by the carrying mechanism 5A. Also, as another carrying example, the wafer W carried from the handoff assembly TRS10 to the buffer assembly 51 can be carried to the inspection assembly 4A, 4B after post-process inspection to be returned to the carrier C of the prescribed load port. According to this carrier block Dl l, the number of inspection assemblies 4 is larger than that of the first embodiment, so that the time for which the wafer W stands by in the buffer assembly 51 can be suppressed. However, since the carrying mechanisms 5A, 5B are loaded more heavily by accessing a larger number of inspection assemblies 4 than the number of the carrier block Dl, it is preferable to provide the structure of the carrier block Dl to achieve higher productivity.

[0088] [Second Modification of the First Embodiment]

[0089] Next, the carrier block D12 involved in the second modification will be described focusing on the differences from the carrier block Dl. Figure 14 The load port 2E is provided at the same height position as the load port 2D, and its position in the left-right direction is aligned with that of the load port 2A. The load port 2E is provided with a swing door 25 as with the load port 2D to avoid interference with the load port 2A. However, in contrast to the swing door 25 of the load port 2D, the swing door 25 of the load port 2E is rotated clockwise from the closed position to avoid interference with the side wall of the housing 11 of the carrier block Dl. The load port 2E is located on the left side of the inspection assembly 4, so the carrying mechanism 5B hands over the wafer W with respect to the carrier C placed in the load port 2E.

[0090] In this carrier block D12, for example Figures 9-12 The carrying of the wafer W is performed as described, and when the load ports 2A, 2B become load-in load ports, for example, the load port 2E also becomes a load-in load port, and when the load ports 2A, 2B become load-out load ports, for example, the load port 2E also becomes a load-out load port.

[0091] As shown in the first embodiment and each modification example above, according to the present application, two conveyance mechanisms 5A, 5B are provided, and the inspection assemblies 4 and the load ports can be provided in a region in which conveyance of the wafer W can be performed by either of the conveyance mechanisms. Thus, there is an advantage that the degree of freedom of arrangement of the inspection assemblies 4 and the load ports 2 is high, and the design of the apparatus can be easily performed in accordance with the required throughput, the time required for inspection in the inspection assemblies 4, and the like.

[0092] [Second Embodiment]

[0093] The coating and developing apparatus of the second embodiment will be described focusing on the difference from the first embodiment. Figure 15 、 Figure 16 FIGS. 13A and 13B respectively show a front view and a cross-sectional top view of the carrier block D5 of the coating and developing apparatus of the second embodiment. In the carrier block D5, the load ports 2A to 2C and two inspection assemblies 4 are provided, but the load ports 2A to 2C are located on the left side of each of the inspection assemblies 4. In addition, the support stages 15, 16, 17 are not provided in the carrier block D5, and the external conveyance mechanism that hands over the carriers C with respect to the carrier block D5 hands over the carriers C to the movement placement stages 23 of the load ports 2A to 2C. Further, conveyance between the standby placement stage 29, the conveyance-in placement stage 31, and the conveyance-out placement stage 32 of the carriers C is not performed. In addition, only the conveyance mechanism 5A of the conveyance mechanisms 5A, 5B is provided in the housing 11, and the frame 52 of the conveyance mechanism 5A moves in the left-right direction so that handover of the wafer W with respect to each of the carriers C placed in the load ports 2A to 2C can be performed.

[0094] The conveyance mechanism 5A takes out the wafer W from the carriers C of the load ports 2A to 2C and conveys it to the handover assembly TRS0 of the tower Tl, and conveys the wafer W on which the resist pattern has been formed, which is conveyed to the handover assembly TRS10 of the tower Tl, to the carriers C of the load ports 2A to 2C. In the case of pre-process inspection, the wafer W is conveyed to the inspection assembly 4 before being conveyed to the handover assembly TRS0 to perform inspection. In the case of post-process inspection, the wafer W is conveyed to the inspection assembly 4 before being returned to the carriers C to perform inspection.

[0095] Figure 17 As a modification example of the above-described carrier block D5, an example in which two inspection assemblies 4 are provided at intervals in the up-down direction in a region in which the conveyance port 21 in which the load port 2D is formed in the first embodiment is formed when viewed in the front-rear direction is shown. Thus, in the carrier block D5 shown in FIG. 14, four inspection assemblies 4 are provided in the up-down direction. In the second embodiment described above, as in the first embodiment, the inspection assemblies 4 are configured to be detachable with respect to the housing 11 of the carrier block D5, and thus maintenance can be easily performed. Figure 17 In the carrier block D5 shown in FIG. 14, four inspection assemblies 4 are provided in the up-down direction. In the second embodiment described above, as in the first embodiment, the inspection assemblies 4 are configured to be detachable with respect to the housing 11 of the carrier block D5, and thus maintenance can be easily performed.

[0096] Further, the inspection assembly 4 is structured so as to be inserted into the opening portion 22 of the housing 41 from the outside of the housing 41 as such, and therefore the inspection assembly 4 can be provided so that a part thereof protrudes from the housing 41 of the carrier block. That is, the occupied space of the inspection assembly 4 within the apparatus can be suppressed, and therefore it is possible to prevent the inspection assembly 4 from being unable to be provided due to other assemblies being provided within the apparatus. Further, since the occupied space is small and detachable with respect to the housing 41 as such, there is an advantage that the inspection assembly 4 can be easily added without interfering with the operation of the substrate conveyance mechanism or the arrangement of other assemblies. Furthermore, as is clear from the first embodiment and the second embodiment, when structured so as to be detachable with respect to the housing 41, with respect to the loading port and the inspection assembly 4 that are in a row in the left-right direction, the inspection assembly 4 can be positioned at either the end portion of the row or the central portion of the row.

[0097] Further, the processing assembly that conveys the wafer W from the carrier block D1 and processes the wafer W is not limited to the above-described examples. For example, it can be an assembly that applies a liquid medicine for forming an insulating film to the wafer W, a cleaning assembly that supplies a cleaning liquid to the wafer W, or an assembly that supplies an adhesive for adhering wafers W to each other. Further, for example, a processing assembly that forms a vacuum atmosphere via a load interlock vacuum assembly that can be switched between a normal pressure atmosphere and a vacuum atmosphere can be provided, in which case, processing such as CVD, ALD, or etching can be performed by supplying a processing gas to the wafer W. Furthermore, the present application is not limited to the above-described examples, and the examples can be appropriately changed or combined with each other.

Claims

1. A substrate processing device, characterized in that: have: a first load port and a second load port, the first load port and the second load port being respectively provided on one side and the other side in a left-right direction so as to respectively place a transfer container for accommodating substrates thereon; a processing unit for processing the substrate; an inspection component, configured to inspect the substrate before or after processing by the processing unit; as well as a substrate transport mechanism for delivering the substrate to the processing unit, a transport container placed on a load port, and the inspection assembly; Wherein, the substrate transport mechanism comprises: a first substrate transport mechanism, which is disposed on one side of the inspection assembly in the left-right direction and is used to deliver the substrate to the processing unit and the transport container placed on the first loading port respectively; as well as The second substrate transport mechanism is provided on the other side of the inspection assembly in the left-right direction, and is used for delivering substrates to the inspection assembly and the transport container placed on the second loading port respectively.

2. The substrate processing apparatus according to claim 1, wherein: The substrate processing apparatus further comprises: the transport container for accommodating the substrate; The substrate transport mechanism further includes a standby portion for transferring the substrate between the first substrate transport mechanism and the second substrate transport mechanism.

3. The substrate processing apparatus according to claim 1 or 2, wherein: The inspection module also serves as the standby unit.

4. The substrate processing apparatus according to claim 2, wherein: The substrate processing apparatus is provided with a first housing, the first housing accommodating the first substrate transport mechanism, the second substrate transport mechanism, and a standby unit, and having openings formed on a side wall thereof for transporting substrates constituting the first load port and the second load port, respectively. The inspection assembly includes a second housing for accommodating the substrate to inspect the substrate.

5. The substrate processing apparatus according to claim 2, wherein: The inspection unit includes a placement portion on which the substrate transported by the second substrate transport mechanism is placed. The standby portion and the placement portion are provided so as to overlap with each other in the vertical direction.

6. The substrate processing apparatus according to claim 1 or 2, wherein: A plurality of the inspection components are provided, and the plurality of inspection components are respectively located on the left and right of the first loading port or the second loading port.

7. The substrate processing apparatus according to claim 1 or 2, wherein: The substrate processing device is provided with: a loading portion for a transport container, provided below the first load port and the second load port, for placing the transport container on standby; and A container transfer mechanism transfers the container between the first loading port and the container placement portion, or between the second loading port and the container placement portion.

8. A substrate processing method, characterized in that: Including the following processes: placing a transport container for accommodating substrates on a first loading port and a second loading port respectively provided on one side and the other side in the left-right direction; processing the substrate using a processing unit; Before or after processing by the processing unit, inspecting the substrate using an inspection component; Using a first substrate transport mechanism provided on one side of the inspection assembly in the left-right direction, the substrate is delivered to the processing unit and the transport container placed on the first load port respectively; Using a second substrate transport mechanism provided on the other side of the inspection assembly in the left-right direction, the substrate is delivered to the inspection assembly and the transport container placed on the second load port respectively; as well as The substrate is transferred between the first substrate transport mechanism and the second substrate transport mechanism via a standby unit.

9. A storage medium storing a computer program for use in a substrate processing apparatus, wherein: The program includes steps for executing the substrate processing method according to claim 8 .

10. A computer program product comprising a computer program for use in a substrate processing apparatus, wherein the computer program product is characterized in that: The program includes steps for executing the substrate processing method according to claim 8 .

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