Quartz semiconductor packaging device and use method

Abstract

The invention discloses a quartz semiconductor packaging device and a use method, and relates to the technical field of quartz semiconductor packaging, the quartz semiconductor packaging device comprises a workbench, one side of the workbench is provided with a telescopic cylinder, the execution end of the telescopic cylinder penetrates to the lower part of the workbench and is fixedly connected with an upper mold, the bottom of the inner side of the workbench is provided with a lower mold, and the lower mold is fixedly connected with a lower mold; the lower mold is arranged below the upper mold, a quartz semiconductor chip is arranged on the inner side of the lower mold, and an injection molding channel is formed in one side of the lower mold; and the lifting block is arranged in the upper mold. Through cooperation of parts such as the extrusion block, reciprocating pressure can be applied to an injection molding material on the periphery of the quartz semiconductor chip in a targeted manner, so that the material is more tightly attached to pins of the quartz semiconductor chip and the chip, micro gaps are reduced, the density of a packaging layer is improved, and the packaging efficiency is improved. Therefore, the packaging effect of the quartz semiconductor chip is greatly improved.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of quartz semiconductor packaging, and particularly relates to a quartz semiconductor packaging device and a use method. BACKGROUND

[0002] The quartz semiconductor refers to a key component made of quartz material in semiconductor manufacturing, and is mainly used in high-temperature diffusion, etching and other core process links of wafer processing, and has the characteristics of high-temperature resistance and low thermal expansion.

[0003] In a conventional packaging process, although the quartz semiconductor chip can be placed in a lower mold, the mold is closed, the packaging material (such as epoxy resin, silica gel, etc.) is injected, and the packaging is completed after cooling, the packaging quality is difficult to guarantee due to the excessive dependence of the packaging process on the flowability of the material itself. Due to the narrow space and complex structure of the periphery of the quartz semiconductor chip (especially the corners), the flowability of the packaging material decreases significantly in such areas, and it is difficult to completely fill the space by relying on the flowability of the material itself, and gaps or incomplete filling may occur, the chip pins and the chip body cannot be completely wrapped, and thus the protection fails. In the flow process of the material, air is easily trapped, and due to the space limitation, air is difficult to naturally discharge in the corner and other "dead angle" areas, forming air bubbles or cavities. At the same time, the pressure gradually decreases during the flow process of the material, which causes the particles of the material to not be tightly combined, further increases the micro voids, and reduces the density of the packaging layer. Therefore, the quartz semiconductor packaging device and the use method are provided to solve the above problems. SUMMARY

[0004] The application aims at solving the problem that the flowability of the packaging material itself is difficult to tightly adhere to the chip, and even if the cavity is filled, the density is not uniform due to the flow pressure attenuation, thereby reducing the packaging effect, and provides a quartz semiconductor packaging device and a use method.

[0005] To achieve the above-mentioned purpose, the application provides the following technical scheme: a quartz semiconductor packaging device, comprising: a workbench, one side of the workbench is provided with a telescopic cylinder, an execution end of the telescopic cylinder is fixedly connected to an upper mold below the workbench, a lower mold is installed at the inner bottom of the workbench, and the lower mold is arranged below the upper mold, a quartz semiconductor chip is arranged in the inner side of the lower mold, and an injection channel is formed in one side of the lower mold; a lifting block is arranged in the inner side of the upper mold; a compacting mechanism is arranged in the inner side of the lifting block, and is used for extruding the packaging material overflowing at the corners; a heating unit is arranged below the lifting block, and is used for constant temperature heating of the packaging material to improve the flow effect; and an auxiliary assembly is arranged in the inner side of the upper mold, and is used for driving the lifting block to ascend and descend.

[0006] As a further solution of the present invention: the tight mechanism includes a plurality of first air guide grooves opened on the inner side of the lifting block, and the top of the first air guide groove passes through the lifting block, and a first piston rod is slidably connected to the inside of each of the first air guide grooves, one end of the first piston rod extends to the outside of the first air guide groove and is fixedly connected to an auxiliary circular plate, a second spring is installed between the auxiliary circular plate and the lifting block, and a spherical rod is fixedly connected to the top of the auxiliary circular plate, a plurality of second air guide grooves are opened on the inner side of the lifting block, and each of the second air guide grooves is connected to a first air guide groove through a connecting air groove, a second piston rod is slidably connected to the inside of the second air guide groove, and one end of the second piston rod passes through the bottom of the lifting block and is fixedly connected to an extrusion block, and a group of second heating wires are installed inside the extrusion blocks.

[0007] As a further solution of the present invention: the tight mechanism also includes a lifting groove opened inside the upper mold, the interior of the upper mold is fixedly connected to a driving motor, the execution end of the driving motor is fixedly connected to an auxiliary rotating rod, and the auxiliary rotating rod is rotatably connected to the inner side of the upper mold, one end of the auxiliary rotating rod passes through the inner side of the lifting groove and is fixedly connected to a circular frame, the bottom of the circular frame is fixedly connected to a plurality of trapezoidal abutting blocks abutting the spherical rod, and the plurality of trapezoidal abutting blocks are distributed at equal distances around the bottom of the circular frame.

[0008] As a further solution of the present invention: the heating unit includes a heat conducting plate fixedly connected to the bottom of the lifting block, and a first heating wire is installed on the inner side of the heat conducting plate.

[0009] As a further solution of the present invention: the auxiliary component includes a screw rod fixedly connected to the bottom of the auxiliary rotating rod, the outer wall of the screw rod is threadedly connected to a sleeve, the outer wall of the sleeve is fixedly connected to two auxiliary sliders, the inner side of the lifting block is provided with a movable groove matching the auxiliary slider, the auxiliary slider is slidingly connected to the lifting block through the movable groove, and a limit slider is fixedly connected to each side of the lifting block, the inner side of the lifting groove is provided with a rectangular groove matching the limit slider, and the limit slider is slidingly connected to the lifting groove through the rectangular groove.

[0010] As a further solution of the present invention: a plurality of trapezoidal sliders are fixedly connected to the inner side of the circular frame, a plurality of trapezoidal grooves matching the trapezoidal sliders are opened on the outer wall of the auxiliary rotating rod, and the trapezoidal sliders are slidably connected to the auxiliary rotating rod through the trapezoidal grooves.

[0011] As a further scheme of the present application: the bottom of the circular frame is fixedly connected with a plurality of limiting rotating rods, the top of the lifting block is provided with a limiting circular groove matched with the limiting rotating rods, and the limiting rotating rods are arranged inside the limiting circular groove and abut against the top of the lifting block.

[0012] As a further scheme of the present application: the outer wall of the auxiliary rotating rod is fixedly connected with a fixed circular plate, the first spring is arranged between the fixed circular plate and the circular frame, and the elastic force of the first spring is greater than the elastic force of the plurality of second spring combinations.

[0013] The application further discloses a quartz semiconductor packaging method, and adopts the quartz semiconductor packaging device. S1, when the quartz semiconductor chip needs to be injection molded and packaged, the quartz semiconductor chip is first placed in the groove of the lower mold, and then the upper mold and the lower mold are closed by the telescopic cylinder, at this time, the injection molding machine is started, and injection molding material is input from the injection channel into the lower mold for packaging operation, and in this process, the injection molding material at the corner of the lower mold is reciprocally extruded by the plurality of extrusion blocks. S2, when the extrusion block reciprocally processes, the second electric heating wire in the extrusion block makes the temperature of the bottom of the extrusion block always the same as that of the injection molding material, so that the injection molding material can maintain original fluidity when being extruded, and the reciprocating thrust of the extrusion block can effectively push the material to fill the fine area. S3, when the upper mold and the lower mold are attached, the heat conduction plate heats the injected packaging material by the first electric heating wire, so that the packaging material can maintain a flowing state, thereby ensuring the temperature uniformity of the entire cavity material. S4, when the auxiliary rotating rod rotates, the sleeve is lifted by the lead screw, and the lifting block is lifted at the same time, so that the lifting block moves to a specified height, and the quartz semiconductor chip is completely packaged by the injection molding machine. S5, after the injection is completed, the driving motor drives the trapezoidal abutting block to return to the original position and stop, so that the plurality of extrusion blocks return to the initial state, at this time, the lifting block maintains the height, when the injection material cools down, the telescopic cylinder drives the upper mold to move upward to the initial position, and the driving motor is started again, so that the lifting block returns to the initial state, then the staff takes out the packaged quartz semiconductor chip, puts a new quartz semiconductor chip, and continues to injection mold and package the new quartz semiconductor chip.

[0014] Compared with the prior art, the application has the following beneficial effects: 1. By providing a combination of components such as an extrusion block, reciprocating pressure can be applied to the injection molding material around the quartz semiconductor chip, forcing the material to fit more tightly with the pins and chip of the quartz semiconductor chip. The packaging quality of quartz semiconductor chips depends largely on the complete wrapping of the injection molding material around the chip (especially in areas with complex structures such as corners). Due to the narrow space and poor fluidity in corners, the injection molding material is prone to insufficient filling and gaps. The reciprocating extrusion of the extrusion block can push the material to the gaps in the corners through continuous pressure, forcing the material to fill all tiny gaps, ensuring that the chip is completely covered by the packaging material and avoiding protection failure caused by incomplete filling. At the same time, during the injection molding process, air bubbles may be trapped during material flow, especially in "dead corners" such as corners. Bubbles are difficult to discharge naturally, resulting in voids inside the packaging layer. The continuous pressure generated by the reciprocating extrusion can push bubbles to the edge of the material or out of the mold. At the same time, through repeated compaction, the material particles are more tightly combined, reducing microscopic gaps and increasing the density of the packaging layer, thereby significantly improving the packaging effect of the quartz semiconductor chip. 2. By setting up the cooperation of components such as the second heating wire, the injection molding material maintains its original fluidity, ensuring that the reciprocating thrust of the extrusion block effectively pushes the material to fill fine areas, preventing the cold insulation material from being delaminated or incompletely filled due to cooling fracture caused by insufficient fluidity. If the temperature of the extrusion block is too low, the cooled material may adhere to the bottom of the extrusion block, resulting in the phenomenon of material carrying during reciprocating extrusion. The material is pulled up by the extrusion block, destroying the continuity of the material inside the cavity, forming local vacancies or accumulation. Consistent temperature can avoid this adhesion, ensuring that each downward pressure of the extrusion block can evenly act on the material surface, maintaining the stability of pressure transmission, thereby further ensuring filling integrity, structural uniformity and packaging reliability. 3. By setting up a heating unit, when the upper mold and the lower mold are fitted together, the heat conducting plate heats the injected packaging material through the first heating wire to keep it in a fluid state, thereby ensuring the temperature uniformity of the entire cavity material, avoiding temperature gradients caused by local material cooling, such as areas away from the extrusion block, and preventing filling gaps caused by poor flow of the injection molding material. By cooperating with the extrusion block, air can be better discharged and the injection molding material can be tightly fitted to every part of the quartz semiconductor chip, thereby improving the overall packaging effect; 4. By setting up auxiliary components, the lifting block slowly moves up with the progress of injection, and the cavity volume increases synchronously, which is equivalent to leaving time for air to escape. The air can be discharged through the mold exhaust groove in the opposite direction of the injection material flow, which can reduce the bubble generation rate, thereby improving the injection molding effect. In addition, the extrusion block continuously extrudes the injected injection material back and forth. Continuous reciprocating extrusion through uninterrupted periodic pressure ensures that the material is always constrained and compacted by external force throughout the entire process from injection to cavity shaping, which is equivalent to adding pressure insurance to each stage of dynamic filling, thereby improving the continuity of the equipment during injection molding and thus improving the packaging effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of the present invention; Figure 2 is a cross-sectional view of the lower mold of the present invention; Figure 3 Schematic diagram of the internal structure of the upper mold of the present invention; Figure 4 is a cross-sectional view of the auxiliary rotating rod of the present invention; Figure 5 Schematic diagram of the connection structure between the auxiliary rotating rod and the circular frame of the present invention; Figure 6 It is an exploded view of the circular frame of the present invention; Figure 7 This is a schematic diagram of the internal structure of the lifting block of the present invention; Figure 8 Schematic diagram of the internal structure of the first air guide groove of the present invention; Figure 9 This is a schematic diagram of the internal structure of the extrusion block of the present invention; Figure 10 This is a working state diagram of the lifting block of the present invention rising to the highest point.

[0016] In the figure: 1. workbench; 2. upper mold; 3. lower mold; 4. quartz semiconductor chip; 5. lifting block; 6. extrusion block; 7. heat conducting plate; 8. lifting slot; 9. driving motor; 10. auxiliary rotating rod; 11. fixed circular plate; 12. first spring; 13. circular frame; 14. limiting rotating rod; 15. limiting circular slot; 16. trapezoidal abutment block; 17. first piston rod; 18. auxiliary circular plate; 19. second spring; 20. spherical rod; 21. limiting slider; 22. trapezoidal slider; 23. screw rod; 24. first heating wire; 25. sleeve; 26. auxiliary slider; 27. first air guide groove; 28. second air guide groove; 29. ​​connecting air groove; 30. second piston rod; 31. second heating wire; 32. injection channel; 33. telescopic cylinder. DETAILED DESCRIPTION

[0017] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments of the present application, all the other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of the present application.

[0018] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance. In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "setting" should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those of ordinary skill in the art, the specific meaning of the above-mentioned terms in the present application can be understood according to the specific circumstances. The embodiments of the present application will be described below according to the overall structure of the present application.

[0019] Please refer to Figures 1-10The embodiment provides a quartz semiconductor packaging device, which comprises a workbench 1, a telescopic cylinder 33 is arranged on one side of the workbench 1, an upper die 2 is fixedly connected to the lower side of the workbench 1 and penetrates through the telescopic cylinder 33, a lower die 3 is arranged on the inner bottom of the workbench 1 and is arranged below the upper die 2, a quartz semiconductor chip 4 is arranged on the inner side of the lower die 3, and an injection channel 32 is arranged on one side of the lower die 3; a lifting block 5 is arranged in the upper die 2; a compact mechanism is arranged in the lifting block 5 and is used for extruding the packaging material overflowing at the corners, the compact mechanism comprises a plurality of first gas guide grooves 27 arranged on the inner side of the lifting block 5 and penetrating through the lifting block 5, one first piston rod 17 is slidably connected in each first gas guide groove 27, an auxiliary circular plate 18 is fixedly connected to one end of the first piston rod 17 and extends out of the first gas guide groove 27, a second spring 19 is arranged between the auxiliary circular plate 18 and the lifting block 5, a spherical rod 20 is fixedly connected to the top of the auxiliary circular plate 18, a plurality of second gas guide grooves 28 are arranged on the inner side of the lifting block 5, each second gas guide groove 28 is communicated with one first gas guide groove 27 through one communication groove 29, a second piston rod 30 is slidably connected in the second gas guide groove 28, and an extruding block 6 is fixedly connected to one end of the second piston rod 30 and penetrates through the bottom of the lifting block 5; the compact mechanism further comprises a lifting groove 8 arranged in the upper die 2, a driving motor 9 is fixedly connected to the inner side of the upper die 2, an auxiliary rotating rod 10 is fixedly connected to the driving motor 9 and is rotatably connected to the inner side of the upper die 2, a circular frame 13 is fixedly connected to one end of the auxiliary rotating rod 10 and penetrates through the inner side of the lifting groove 8, a plurality of trapezoidal abutting blocks 16 are fixedly connected to the bottom of the circular frame 13 and abut against the spherical rod 20, and the trapezoidal abutting blocks 16 are distributed at equal distances around the bottom of the circular frame 13. The lower die 3 is connected with an injection packaging machine through the injection channel 32, the injection packaging machine is prior art, and thus will not be described here; in the initial state of the equipment, the bottom of the lifting block 5 is flush with the bottom of the upper die 2, and the bottom of the extruding block 6 is initially flush with the bottom of the lifting block 5. The plurality of extruding blocks 6 are distributed at the four corners of the bottom of the lifting block 5. When the quartz semiconductor chip 4 needs to be injection molded and packaged, the quartz semiconductor chip 4 is first placed inside the groove of the lower mold 3, and after the placement is completed, the telescopic cylinder 33 drives the upper mold 2 to be attached to the lower mold 3, at this time the injection molding machine is started, and the injection molding material is input from the injection molding channel 32 into the inside of the lower mold 3, at this time the driving motor 9 is started to drive the auxiliary rotating rod 10 to rotate, and the circular frame 13 is driven to rotate through the auxiliary rotating rod 10, so that the trapezoidal abutment block 16 at the bottom of the circular frame 13 abuts against the spherical rod 20, when the spherical rod 20 moves from the highest point to the lowest point of the trapezoidal abutment block 16, the spherical rod 20 is pushed to move downward, thereby driving the first piston rod 17 to input air from the communication air groove 29 into the second air guide groove 28 inside the first air guide groove 27, thereby driving the second piston rod 30 to drive the extrusion block 6 to extrude the injection molding material at the corners inside the lower mold 3, when the spherical rod 20 and the trapezoidal abutment block 16 are separated, the first piston rod 17 is driven to return to the original position by the auxiliary circular plate 18 under the action of the second spring 19, thereby driving the extrusion block 6 to reciprocally extrude the injection molding material under the abutment of the plurality of trapezoidal abutment blocks 16 and the spherical rod 20, so as to apply reciprocating pressure to the injection molding material around the quartz semiconductor chip 4, so as to promote the material to be more closely attached to the pins and chips of the quartz semiconductor chip 4, and the packaging quality of the quartz semiconductor chip depends to a great extent on the complete wrapping of the injection molding material around the chip (especially in the complex structure area such as the corner), since the space at the corner is narrow and the flowability is poor, the injection molding material is prone to have the problem of insufficient filling and gap, and the reciprocating extrusion of the extrusion block can push the material to flow to the corner gap under the continuous pressure, so as to force the material to fill all the small gaps and ensure that the chip is completely covered by the packaging material, avoiding the protection failure caused by incomplete filling, and at the same time, during the injection molding process, air bubbles may be formed when the material flows, especially in the "dead angle" such as the corner, the air bubbles are difficult to be naturally discharged, which may cause the appearance of cavities in the packaging layer. The continuous pressure generated by the reciprocating extrusion can push the air bubbles to the edge of the material or extrude them out of the mold, and at the same time, the material particles are more closely combined through repeated compaction, the micro voids are reduced, and the density of the packaging layer is improved, thereby greatly improving the effect of packaging the quartz semiconductor chip 4; When the extrusion block 6 reciprocates, the second heating wire 31 inside the extrusion block 6 keeps the temperature of the bottom of the extrusion block 6 the same as that of the injection material, so that the injection material can maintain its original fluidity when being extruded, ensuring that the reciprocating thrust of the extrusion block 6 effectively pushes the material to fill the fine area, preventing the formation of delamination or incomplete filling due to insufficient fluidity and cooling of the material. If the temperature of the extrusion block 6 is too low, the cooled material may adhere to the bottom of the extrusion block 6, causing the appearance of material during reciprocating extrusion, which may damage the continuity of the material in the cavity, resulting in local vacancies or accumulation. The uniform temperature can avoid such adhesion, ensuring that the extrusion block 6 can uniformly act on the material surface every time it is pressed down, maintaining the stability of pressure transmission, thereby further ensuring the filling completeness, structural uniformity and packaging reliability.

[0020] Please refer to Figures 2-7 The heating unit is arranged below the lifting block 5 and is used for constant temperature heating of the packaging material to improve the flow effect. The heating unit includes a heat-conducting plate 7 fixedly connected to the bottom of the lifting block 5, and a first heating wire 24 mounted on the inner side of the heat-conducting plate 7. When the upper mold 2 and the lower mold 3 are attached, the heat-conducting plate 7 heats the injected packaging material through the first heating wire 24 to keep it in a flowing state, thereby ensuring the temperature uniformity of the material in the entire cavity and preventing temperature gradient caused by local material cooling, such as the area far from the extrusion block 6, and preventing filling gaps caused by poor flow of the injection material. Through cooperation with the extrusion block 6, air can be better discharged, and the injection material can be tightly attached to every part of the quartz semiconductor chip 4, thereby improving the overall packaging effect.

[0021] Please refer to Figures 3-10The auxiliary assembly is arranged in the inside of the upper mold 2 and is used for driving the lifting block 5 to lift and lower, the auxiliary assembly comprises a lead screw 23 fixedly connected at the bottom of an auxiliary rotating rod 10, the outer wall of the lead screw 23 is threadedly connected with a sleeve 25, the outer wall of the sleeve 25 is fixedly connected with two auxiliary sliding blocks 26, the inner side of the lifting block 5 is provided with moving grooves matched with the auxiliary sliding blocks 26, the auxiliary sliding blocks 26 are slidably connected with the lifting block 5 through the moving grooves, and the two sides of the lifting block 5 are respectively fixedly connected with one limiting sliding block 21, the inner side of the lifting groove 8 is provided with a rectangular groove matched with the limiting sliding block 21, the limiting sliding block 21 is slidably connected with the lifting groove 8 through the rectangular groove, the inner side of the circular frame 13 is fixedly connected with a plurality of trapezoidal sliding blocks 22, the outer wall of the auxiliary rotating rod 10 is provided with a plurality of trapezoidal grooves matched with the trapezoidal sliding blocks 22, the trapezoidal sliding blocks 22 are slidably connected with the auxiliary rotating rod 10 through the trapezoidal grooves, the bottom of the circular frame 13 is fixedly connected with a plurality of limiting rotating rods 14, the top of the lifting block 5 is provided with limiting circular grooves 15 matched with the limiting rotating rods 14, the limiting rotating rods 14 are arranged in the limiting circular grooves 15 and abut against the top of the lifting block 5, the outer wall of the auxiliary rotating rod 10 is fixedly connected with a fixed circular plate 11, the first spring 12 is arranged between the fixed circular plate 11 and the circular frame 13, and the elastic force of the first spring 12 is greater than the combined elastic force of the plurality of second springs 19; When the auxiliary rotating rod 10 rotates, the lead screw 23 is driven to rotate, at this time, the sleeve 25 of the lead screw 23 moves in the moving grooves through the auxiliary sliding blocks 26, when the auxiliary sliding blocks 26 move to the top end of the moving grooves, the injection material in the inside of the lower mold 3 is filled (the speed of filling the encapsulating material in the inside of the lower mold 3 is the same as the speed of driving the auxiliary sliding blocks 26 to move to the highest point by the driving motor 9, since this is prior art and can be controlled by a PLC controller, thus, the scheme is not described in detail), the lead screw 23 drives the lifting block 5 to move upwards through the sleeve 25, the lifting block 5 moves at the same speed as the injection material, until the lifting block 5 moves to the specified position, the straight line distance between the bottom of the lifting block 5 after moving to the specified position and the bottom of the upper mold 2 matches the height of the cavity in the inside of the lower mold 3, the lifting block 5 slowly moves upwards with the injection progress, the cavity volume synchronously increases, which is equivalent to giving air an escape time, air can flow in the opposite direction of the injection material and be discharged through the mold exhaust groove, the air bubble generation rate can be reduced, and thus the injection effect is improved; And when the lifting block 5 rises, the lifting block 5 pushes the limiting rotating rod 14 through the limiting circular groove 15, so that the circular frame 13 can move upwards in the trapezoidal groove of the auxiliary rotating rod 10 through the trapezoidal sliding block 22, and the trapezoidal abutting block 16 at the bottom of the circular frame 13 can continue to abut against the spherical rod 20 during the rising process under the action of the first spring 12, so that the extrusion block 6 continuously reciprocatingly extrudes the injected injection molding material, and the continuous reciprocating extrusion ensures that the material is always subjected to external force constraint and compaction from the whole process of injection to cavity shaping, which is equivalent to adding pressure insurance to each dynamic filling stage, thereby improving the continuity of the equipment during injection molding, and further improving the packaging effect. When the injection is completed, the driving motor 9 drives the trapezoidal abutting block 16 to return to the original position and stop, so that the plurality of extrusion blocks 6 return to the initial state, and at this time the lifting block 5 maintains the height, and when the injection material cools, the telescopic cylinder 33 drives the upper mold 2 to move upwards to the initial position, and the driving motor 9 is started again to make it rotate in reverse, so that the lifting block 5 returns to the initial state, and then the staff takes out the packaged quartz semiconductor chip 4 and puts in a new quartz semiconductor chip 4, and continues to repeat the above operation, thereby improving the applicability of the equipment.

[0022] The above-mentioned quartz semiconductor packaging device is combined to provide a quartz semiconductor packaging method, which specifically includes the following steps: S1, when the quartz semiconductor chip 4 needs to be injection molded and packaged, the quartz semiconductor chip 4 is first placed in the groove of the lower mold 3, and after the placement is completed, the telescopic cylinder 33 drives the upper mold 2 and the lower mold 3 to be closed, at this time the injection packaging machine is started, and the injection material is input from the injection channel 32 into the lower mold 3 for packaging operation, and in this process, the injection material at the corners of the lower mold 3 is reciprocatingly extruded by the plurality of extrusion blocks 6; S2, when the extrusion block 6 reciprocatingly processes, the second electric heating wire 31 in the extrusion block 6 makes the temperature at the bottom of the extrusion block 6 always the same as that of the injection material, so that the injection material can maintain the original fluidity when being extruded by the extrusion block 6, and ensure that the reciprocating thrust of the extrusion block 6 effectively pushes the material to fill the fine area; S3, when the upper mold 2 and the lower mold 3 are attached, the heat conduction plate 7 heats the injected packaging material through the first electric heating wire 24 to keep it in a flowing state, thereby ensuring the temperature uniformity of the entire cavity material; S4, when the auxiliary rotating rod 10 rotates, the sleeve 25 is driven to rise by the lead screw 23 at the same time, and the lifting block 5 is driven to rise, so that it moves to a specified height, and the quartz semiconductor chip 4 is completely packaged by the injection packaging machine; S5, when the injection molding is completed, the driving motor 9 drives the trapezoidal abutting block 16 to restore the original position and stop, so that the plurality of extrusion blocks 6 restore the initial state, at this time the lifting block 5 keeps the height, when the injection molding material cools down, the telescopic cylinder 33 drives the upper mold 2 to move upward to the initial, and starts the driving motor 9 again, so that it rotates reversely, so that the lifting block 5 restores the initial state, then the staff takes out the packaged quartz semiconductor chip 4, puts the new quartz semiconductor chip 4, and continues to injection mold and package the new quartz semiconductor chip 4.

[0023] The above merely provides the preferred embodiments of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art, according to the technical solution and the inventive concept of the present application, makes equivalent replacement or change within the technical range disclosed by the present application, should be covered within the protection scope of the present application.

Claims

1. A quartz semiconductor packaging device, characterized in that: include: A workbench (1), a telescopic cylinder (33) is installed on one side of the workbench (1), an execution end of the telescopic cylinder (33) passes through the bottom of the workbench (1) and is fixedly connected to an upper mold (2), a lower mold (3) is installed on the inner bottom of the workbench (1), and the lower mold (3) is arranged below the upper mold (2), a quartz semiconductor chip (4) is arranged on the inner side of the lower mold (3), and an injection channel (32) is opened on one side of the lower mold (3); A lifting block (5) is arranged inside the upper mold (2); A compacting mechanism is provided inside the lifting block (5) and is used for squeezing the packaging material overflowing from the corners. The compacting mechanism includes a plurality of second air guide grooves (28) provided inside the lifting block (5). A second piston rod (30) is slidably connected inside the second air guide groove (28). One end of the second piston rod (30) passes through the bottom of the lifting block (5) and is fixedly connected to the squeezing block (6). A set of second heating wires (31) is installed inside the squeezing block (6). A heating unit is provided below the lifting block (5) and is used to maintain a constant temperature of the packaging material to improve the flow effect; An auxiliary component is arranged inside the upper mold (2) and is used to drive the lifting block (5) to move up and down.

2. The quartz semiconductor packaging device according to claim 1, wherein: The tight mechanism includes a plurality of first air guide grooves (27) provided on the inner side of the lifting block (5), and the top of the first air guide groove (27) passes through the lifting block (5), and each first air guide groove (27) is slidably connected to a first piston rod (17) inside, and one end of the first piston rod (17) extends to the outside of the first air guide groove (27) and is fixedly connected to an auxiliary circular plate (18), a second spring (19) is installed between the auxiliary circular plate (18) and the lifting block (5), and a spherical rod (20) is fixedly connected to the top of the auxiliary circular plate (18), and each second air guide groove (28) is connected to a first air guide groove (27) through a connecting air groove (29).

3. The quartz semiconductor packaging device according to claim 2, characterized in that: The tight mechanism further comprises a lifting groove (8) provided inside the upper mold (2), a driving motor (9) being fixedly connected to the interior of the upper mold (2), an execution end of the driving motor (9) being fixedly connected to an auxiliary rotating rod (10), and the auxiliary rotating rod (10) being rotatably connected to the inner side of the upper mold (2), one end of the auxiliary rotating rod (10) passing through the inner side of the lifting groove (8) and being fixedly connected to a circular frame (13), a bottom of the circular frame (13) being fixedly connected to a plurality of trapezoidal abutting blocks (16) abutting against the spherical rod (20), and the plurality of trapezoidal abutting blocks (16) being distributed at equal distances around the bottom of the circular frame (13).

4. The quartz semiconductor packaging device according to claim 3, wherein: The heating unit comprises a heat conducting plate (7) fixedly connected to the bottom of the lifting block (5), and a first heating wire (24) is installed on the inner side of the heat conducting plate (7).

5. The quartz semiconductor packaging device according to claim 4, characterized in that: The auxiliary component includes a screw rod (23) fixedly connected to the bottom of the auxiliary rotating rod (10), the outer wall of the screw rod (23) is threadedly connected to a sleeve (25), the outer wall of the sleeve (25) is fixedly connected to two auxiliary sliders (26), the inner side of the lifting block (5) is provided with a movable groove matching the auxiliary slider (26), the auxiliary slider (26) is slidably connected to the lifting block (5) through the movable groove, and a limiting slider (21) is fixedly connected to each side of the lifting block (5), the inner side of the lifting groove (8) is provided with a rectangular groove matching the limiting slider (21), and the limiting slider (21) is slidably connected to the lifting groove (8) through the rectangular groove.

6. The quartz semiconductor packaging device according to claim 5, characterized in that: A plurality of trapezoidal sliders (22) are fixedly connected to the inner side of the circular frame (13), and a plurality of trapezoidal grooves matching the trapezoidal sliders (22) are formed on the outer wall of the auxiliary rotating rod (10), and the trapezoidal sliders (22) are slidably connected to the auxiliary rotating rod (10) through the trapezoidal grooves.

7. The quartz semiconductor packaging device according to claim 6, characterized in that: A plurality of limiting rotating rods (14) are fixedly connected to the bottom of the circular frame (13); a limiting circular groove (15) matching the limiting rotating rod (14) is provided on the top of the lifting block (5); and the limiting rotating rod (14) is arranged inside the limiting circular groove (15) and abuts against the top of the lifting block (5).

8. The quartz semiconductor packaging device according to claim 7, characterized in that: The outer wall of the auxiliary rotating rod (10) is fixedly connected to a fixed circular plate (11), and a first spring (12) is installed between the fixed circular plate (11) and the circular frame (13). The elastic force of the first spring (12) is greater than the elastic force of the combination of the plurality of second springs (19).

9. A quartz semiconductor packaging method, characterized in that: The quartz semiconductor packaging device according to claim 8 comprises the following steps: S1. When the quartz semiconductor chip (4) needs to be injection molded and packaged, the quartz semiconductor chip (4) is first placed inside the groove of the lower mold (3). After the placement is completed, the telescopic cylinder (33) is started to drive the upper mold (2) and the lower mold (3) to close the mold. At this time, the injection molding packaging machine is started, and the injection molding material is input from the injection molding channel (32) into the lower mold (3) for packaging. During this process, the injection molding material at the corners of the lower mold (3) is reciprocatedly squeezed by the multiple extrusion blocks (6); S2. When the extrusion block (6) is reciprocating, the temperature of the bottom of the extrusion block (6) is always the same as the temperature of the injection molding material through the second electric heating wire (31) inside the extrusion block (6), so that the injection molding material can maintain its original fluidity when the injection molding material is extruded, ensuring that the reciprocating thrust of the extrusion block (6) effectively pushes the material to fill the fine area; S3. When the upper mold (2) and the lower mold (3) are fitted together, the heat conducting plate (7) heats the injected packaging material through the first heating wire (24) to keep the material in a fluid state, thereby ensuring temperature uniformity of the entire cavity material; S4, when the auxiliary rotating rod (10) is rotating, the sleeve (25) is driven to rise by the screw rod (23), and the lifting block (5) is driven to rise at the same time, so that the lifting block (5) is moved to a specified height, and the quartz semiconductor chip (4) is completely packaged by an injection molding packaging machine; S5. After the injection molding is completed, the driving motor (9) drives the trapezoidal abutment block (16) to return to its original position and stops, so that the plurality of the extrusion blocks (6) return to their initial state. At this time, the lifting block (5) maintains its height. After the injection molding material cools, the telescopic cylinder (33) drives the upper mold (2) to move upward to its initial position, and starts the driving motor (9) again to rotate it in the opposite direction, so that the lifting block (5) returns to its initial state. Then, the staff takes out the packaged quartz semiconductor chip (4), puts in a new quartz semiconductor chip (4), and continues to perform injection molding on the new quartz semiconductor chip (4).

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