Embossment processing method, laser processing equipment, laser processing system, readable medium and product

Abstract

The embodiment of the invention discloses an embossment machining method, laser machining equipment, a laser machining system, a readable medium and a product, and the method is used for obtaining cleaning machining parameters for embossment cleaning when a currently machined embossment layer meets a cleaning triggering condition in the embossment machining process, and after the currently machined embossment layer is machined, the cleaning machining parameters are obtained. And embossment cleaning operation is executed, the embossment cleaning operation comprises the steps that cleaning laser is output based on the cleaning machining parameters, the embossment pattern obtained through current machining is cleaned, and cleaning comprises the step that impurities on the embossment pattern are removed through the cleaning laser. Therefore, the influence of the processing impurities on the processing fineness can be effectively reduced, so that the embossment quality is improved.

Description

Technical Field

[0001] The present application relates to the fields of computer technology and relief processing technology, and in particular to a relief processing method, laser processing equipment, system, readable medium and product. Background Art

[0002] Relief is a craft created by performing multi-layer engraving on a workpiece. During the relief process, impurities (such as material debris or related powder) may appear on the surface of the workpiece. The appearance of these impurities affects the processing precision and the relief effect. These impurities need to be removed during and after the engraving process. In related technologies, this is generally done by hand after the engraving is completed, and cleaning during the engraving process is impossible. In view of this, it is urgent to propose a new relief processing solution to effectively reduce the impact of processing impurities on processing precision, thereby improving the relief quality. Summary of the Invention

[0003] The embodiments of the present application provide a relief processing method, laser processing equipment, system, readable medium and product, which can effectively reduce the impact of processing impurities on processing fineness, thereby improving the relief quality.

[0004] On the one hand, an embodiment of the present application provides a relief processing method, comprising:

[0005] During the relief processing, if the relief layer currently being processed meets the cleaning trigger condition, the cleaning processing parameters for relief cleaning are obtained;

[0006] After the processing of the currently processed relief layer is completed, a relief cleaning operation is performed, which includes: outputting a cleaning laser based on the cleaning processing parameters to clean the currently processed relief pattern, and the cleaning includes using the cleaning laser to remove impurities on the relief pattern.

[0007] On the other hand, an embodiment of the present application provides a relief processing device, comprising:

[0008] A parameter acquisition unit is used to acquire cleaning processing parameters for relief cleaning if the relief layer currently being processed meets the cleaning triggering condition during the relief processing;

[0009] The relief cleaning unit is used to perform a relief cleaning operation after the relief layer currently being processed is processed is completed. The relief cleaning operation includes: outputting a cleaning laser based on the cleaning processing parameters to clean the relief pattern currently processed. The cleaning includes using the cleaning laser to remove impurities on the relief pattern.

[0010] On the other hand, the embodiments of the present application further provide a laser processing device, comprising:

[0011] A laser head, the laser head is used to emit laser energy, and the laser energy acts on the processing material to cause the processing material to change;

[0012] A controller is used to implement the relief processing method of the first aspect to control the laser head to perform relief processing on the processing material, and use a cleaning laser to remove impurities on the relief pattern of the processing material during the relief processing.

[0013] On the other hand, the embodiments of the present application further provide a laser processing system, comprising:

[0014] Computer equipment, the computer equipment is used to generate processing instructions;

[0015] Laser processing equipment, the laser processing equipment is communicatively connected to the computer equipment, the laser processing equipment includes a communication component, a controller and a laser head, the communication component is used to receive the processing instructions, and the controller is used to control the movement of the laser head based on the processing instructions to implement the relief processing method of the first aspect.

[0016] On the other hand, an embodiment of the present application further provides a computer-readable medium having a computer program stored thereon, and when the computer program is executed by a processor, the relief processing method of the first aspect is implemented.

[0017] On the other hand, an embodiment of the present application further provides a program product, comprising computer instructions, which, when executed by a processor, implement the relief processing method of the first aspect.

[0018] In an embodiment of the present application, the relief processing is carried out layer by layer. When it is detected that the currently processed relief layer meets the cleaning trigger condition (i.e., cleaning is required), the cleaning processing parameters of the relief cleaning are obtained, and a cleaning laser is output based on the cleaning processing parameters. The current relief layer is cleaned by laser elimination. This can embed the relief cleaning task into the relief processing process, thereby effectively suppressing the error accumulation in the relief processing process and improving the smoothness of the transition between each relief layer, so that the fineness of the relief work can be significantly improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0020] Figure 1 is a schematic diagram of a laser processing system provided in an embodiment of the present application;

[0021] Figure 2 This is a schematic flow chart of a relief processing method provided in an embodiment of the present application;

[0022] Figure 3 This is a schematic diagram of a relief pattern and a cleaning area provided in an embodiment of the present application;

[0023] Figure 4 Schematic diagram of an embodiment of relief processing provided in the present application;

[0024] Figure 5 is a schematic diagram of an editable interface provided in an embodiment of the present application;

[0025] Figure 6 This is a structural diagram of a relief processing device provided in an embodiment of the present application;

[0026] Figure 7 This is a schematic structural diagram of a laser processing device provided in an embodiment of the present application;

[0027] Figure 8 This is a structural diagram of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0028] It should be noted in advance that, in order to enable those skilled in the art to better understand the technical solutions proposed in the embodiments of this application, the embodiments of this application will be combined with one or more figures to clearly and completely describe the implementation of the technical solutions proposed in the embodiments of this application. In addition, the various figures shown in the embodiments of this application are only exemplary. For example, the execution order of the various steps in the figures can be adaptively adjusted according to the actual application scenario.

[0029] In addition, in the embodiments of the present application, the block diagrams, modules and units shown in the accompanying drawings are merely functional entities and do not necessarily correspond to physically independent entities, and each module or unit can be part of an overall module or unit that includes the function of the module or unit. That is, the term "module" or "unit" mentioned in the embodiments of the present application refers to a computer program or a part of a computer program with a predetermined function, which can work together with other related parts to achieve a predetermined goal, and can also be implemented in whole or in part by using software, hardware (such as processing circuits or memories) or a combination thereof, or implemented in different networks and / or processor devices and / or microcontroller devices. Similarly, a processor (or multiple processors or memories) can be used to implement one or more modules or units.

[0030] The present application proposes a technical solution for relief processing for relief processing scenarios, which is used to perform multiple relief processing on relief processing materials to obtain relief, and each relief processing is used to obtain a relief layer. When relief processing is performed on each relief layer, it is detected whether the current relief layer meets the cleaning trigger condition, and then when the current relief layer meets the cleaning trigger condition, the cleaning processing parameters required for relief cleaning on the relief processing material are obtained, and then after the relief processing of the current relief layer is completed, the relief pattern obtained on the relief processing material is embossed and cleaned using a cleaning laser generated based on the cleaning processing parameters, so as to use the cleaning laser to remove impurities on the relief pattern. In this way, the relief cleaning work can be embedded in the relief processing process, thereby effectively suppressing the accumulation of relief processing errors, improving the smoothness of the transition between each relief layer, and significantly improving the clarity and fineness of the relief work.

[0031] In the above technical solution, optionally, the cleaning processing parameters can be related to the material of the relief processing material. Different material information corresponds to different cleaning processing parameters, so that the relief cleaning can be achieved using a cleaning laser that matches the material of the relief processing material without the participation of liquid substances. Accordingly, the loss caused to the laser processing equipment by the relief cleaning process can be reduced or even eliminated.

[0032] The present application provides a laser processing system. In some embodiments, the structure of the laser processing system can be as follows: Figure 1 As shown. The laser processing system may include n computer devices (such as Figure 1 One or more devices marked by 101 in FIG), and at least one laser processing device (such as Figure 1 (e.g., the device 102 in the figure), where n is a positive integer, and the laser processing device can be communicatively connected to the computer device. In practical applications of this system, the computer device can serve as a host computer by running the processing program, while the laser processing device can serve as a slave computer and respond to processing instructions sent by the host computer.

[0033] In a specific embodiment of the present application, the implementation principle of the above technical solution can be integrated into a processing program and implemented by running the processing program in a computer device or a laser processing device. When the processing program is running in a computer device, the computer device has a communication connection with at least one laser processing device to send processing instructions to the laser processing device, thereby realizing relief processing and obtaining corresponding relief works. Among them, the computer device can be a terminal device or a server. When the computer device is a terminal device, an editable interface can be displayed in the terminal device, and processing parameters can be obtained based on the editable interface or the relief processing process can be displayed to the user. Optionally, the type of terminal device can specifically include but is not limited to smart phones, tablet computers, laptops, desktop computers, vehicle-mounted terminals, smart TVs, smart wearable devices (such as bracelets, watches), etc. When the computer device is a server, the server can establish a communication connection with multiple laser processing devices to simultaneously control multiple laser processing devices to perform relief processing and realize batch production of relief. Optionally, the type of server may specifically include but is not limited to an independent physical server, a server cluster or distributed system consisting of multiple physical servers, and one or more cloud servers that provide cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communications, middleware services, domain name services, security services, CDN (Content Deliver11 Network), and basic cloud services such as big data and artificial intelligence platforms, etc., and no specific restrictions are made here.

[0034] Based on the above technical principles, this application specifically provides a relief processing method, which can be performed by the above-mentioned laser processing equipment or computer equipment or laser processing system. For the convenience of description, the following is an example of laser processing equipment. Figure 2 , the method may include the following steps S201 to S202.

[0035] S201 . During a relief processing process, if a relief layer currently being processed meets a cleaning trigger condition, a cleaning processing parameter for relief cleaning is obtained.

[0036] In one embodiment, the cleaning trigger condition can be set by the user of the laser processing equipment according to the current relief processing scene, or the cleaning trigger condition can be automatically generated or selected by the laser processing equipment according to the current relief processing scene. Optionally, the cleaning trigger condition can be related to one or more factors such as the material of the relief processing material, the height of the current relief layer, the roughness of the obtained relief pattern, the current relief processing environment, the thickness of impurities or the area of ​​impurities on the relief pattern. Among them, the material of the relief processing material can be described by material information, and the material information can include one or more information items such as material hardness, thickness, composition (such as copper, aluminum, pine, beech, other metals, plastics, etc.), humidity, etc. The current relief layer refers to the relief layer currently being engraved, and the height of the relief layer can be the number of layers where the relief layer is located (such as the height of the a-th relief layer is a), or it can be the thickness of the relief obtained by the current processing (such as 1mm).

[0037] In the case where the cleaning trigger condition is related to the thickness and / or area of ​​impurities on the currently obtained relief pattern, the laser processing equipment may first obtain image data of the relief processing area when determining whether the currently processed relief layer (hereinafter referred to as the current relief layer) meets the cleaning trigger condition, and then make the determination based on the image data. The image data may be a video or an image, and may be real-time image data so that the operator can intuitively observe the processing status; the situation where the cleaning trigger condition is met may include the thickness and / or area of ​​impurities on the relief pattern in the image data exceeding a corresponding threshold.

[0038] In the case where the cleaning trigger condition is related to the material of the relief processing material and the height of the current relief layer, in one embodiment, the technician can pre-configure at least one optional total number of relief layers for each relief processing material in the laser processing equipment based on historical experience, and associate at least one cleaning trigger condition for each total number of relief layers, so that the laser processing equipment only needs to obtain the relief processing material and the total number of relief layers in the current relief processing scenario, and can determine the cleaning trigger condition currently required from the preset cleaning trigger conditions, thereby minimizing manual intervention and improving the relief processing efficiency. Among them, the total number of relief layers (assuming it is N) refers to the total number of relief layers that need to be carved to obtain a complete relief. In other words, the relief work in this application is obtained by carving N relief layers in sequence on the relief processing material.

[0039] In another embodiment, the laser processing equipment may also first obtain the number of cleaning interval layers (represented by M in this application) that matches the material information when it needs to generate a trigger cleaning condition, and then generate a cleaning trigger condition related to the height of the current relief layer based on the total number of relief layers and the number of cleaning interval layers. For example, the trigger cleaning condition may be "the current relief layer is the i-th relief layer, i is a multiple of the number of cleaning interval layers M, and i is less than or equal to the total number of relief layers". The total number of relief layers may be a targeted setting by the operator before the relief processing begins, or it may be a default value selected by the laser processing equipment from the default processing configuration information, and there is no restriction here. In addition, the number of cleaning interval layers refers to the number of relief layers between every two relief cleanings. It can be understood that when the cleaning trigger condition is "the current relief layer is the i-th relief layer, and i is an integer multiple of M", the embodiment of the present application will perform a relief cleaning operation every M relief layers during the relief processing process.

[0040] Optionally, the trigger cleaning condition may further include "the current relief layer is the i-th relief layer, i is the total number of relief layers", so that there will be a relief cleaning at the end stage of the relief processing, ensuring that the final relief work has a certain degree of cleanliness, which is convenient for observing the accurate relief processing effect. In this case, it can be understood that, assuming that the total number of relief layers is 11 and the number of cleaning interval layers is 2, then i = 2n (such as 2, 4, 6...) or 11, n is a positive integer, indicating that two relief layers are obtained per relief processing, or relief cleaning needs to be performed after the last relief layer is obtained. In other words, if the current relief layer is the 4th in the total number of relief layers, the trigger cleaning condition is met, so the relief cleaning can be performed after the current relief layer is engraved. If the current relief layer is the 11th, the trigger cleaning condition is also met, so the relief cleaning can also be performed after the current relief layer is engraved. If the current relief layer is the 5th, the trigger cleaning condition is not met, and the relief processing of the next relief layer is triggered instead.

[0041] In the case where the cleaning trigger condition is related to the relief processing environment, the laser processing equipment can set a preset environmental feature based on the relief cleaning requirement or the relief processing requirement, and then configure the feature similarity for the preset environmental feature to generate a cleaning trigger condition based on the feature similarity and the preset environmental feature. Specifically, in one embodiment, the laser processing equipment can obtain the environmental features of the relief processing environment whose cleanliness meets the relief processing requirements (preset or real-time), and use them as the first type of preset environmental features, and then configure the similarity threshold of the preset environmental features, and then generate a cleaning trigger condition indicating that "the feature similarity between the environmental features of the relief processing environment and the first type of preset environmental features is less than or equal to the similarity threshold" based on the similarity threshold and the environmental features.

[0042] In another embodiment, the laser processing equipment may also obtain environmental characteristics of a relief processing environment whose cleanliness meets relief cleaning requirements and use them as a second type of preset environmental characteristics. A similarity threshold is then configured for this type of preset environmental characteristics. Based on this similarity threshold and this type of environmental characteristics, a cleaning trigger condition is generated indicating that "the feature similarity between the environmental characteristics of the relief processing environment and the second type of preset environmental characteristics is greater than or equal to the similarity threshold." Both the environmental characteristics and the preset environmental characteristics can be expressed using feature vectors, text, images, and other content, without limitation.

[0043] It is understood that when the cleaning trigger condition is related to the relief processing environment, if the laser processing equipment needs to detect whether the current relief layer meets the cleaning trigger condition, it can first obtain image data of the relief processing area, and then perform environmental recognition of the relief processing area based on the image data to obtain the environmental characteristics of the relief processing environment corresponding to the current relief layer. Then, the feature similarity between the environmental characteristics and the preset environmental characteristics is calculated, and based on the similarity threshold associated with the feature similarity and the preset environmental characteristics, it is determined whether the current relief layer meets the cleaning trigger condition. Specifically, when the preset environmental characteristics are environmental characteristics corresponding to a processing environment with relief cleaning requirements, the laser processing equipment can determine that the current relief layer meets the cleaning trigger condition when the feature similarity between the environmental characteristics and the preset environmental characteristics is greater than or equal to the similarity threshold; when the preset environmental characteristics are environmental characteristics corresponding to a relief processing environment that meets the relief processing requirements, the laser processing equipment can determine that the current relief layer meets the cleaning trigger condition when the feature similarity between the environmental characteristics and the preset environmental characteristics is less than or equal to the similarity threshold.

[0044] Furthermore, the cleaning parameters in step S201 can be determined based on the material information of the relief material, and can also be determined automatically by the laser processing equipment or manually specified, without limitation herein. Taking the automated determination of cleaning parameters as an example, after obtaining the material information of the relief material, the laser processing equipment can estimate or identify the processing impurities currently present on the relief material, and then, based on the processing impurities and the relief material information, predict cleaning parameters suitable for removing the processing impurities through laser ablation.

[0045] As an exemplary implementation, the cleaning process parameters may include the laser power of the cleaning laser. When relief processing is achieved through laser processing, the laser processing equipment may, when predicting the cleaning process parameters, first predict the laser power based on the material information of the processing impurities and the relief processing material, obtaining at least one candidate laser power that can be used to remove the processing impurities. The laser power of the relief processing laser is then obtained, and a target laser power is selected from the at least one candidate laser power, with the target laser power being lower than the laser power of the relief processing laser. Finally, the power used by the laser that can be used to generate the target laser power is used as the laser power in the cleaning process parameters. The relief processing laser refers to the laser used in the relief processing operation, and the cleaning process parameters may further include laser movement speed, line density, scanning angle, number of scans, focal length, pulse width, frequency, etc.

[0046] By limiting the target laser power to be lower than the laser power of the relief processing laser, it is possible to avoid damage to the current relief during the relief cleaning process while ensuring that processing impurities are eliminated, thereby ensuring the quality of the relief work and directly obtaining a beautiful and clean relief when the processing is completed.

[0047] S202, after the processing of the currently processed relief layer is completed, performing a relief cleaning operation, the relief cleaning operation including: outputting a cleaning laser based on the cleaning processing parameters to clean the currently processed relief pattern, the cleaning including removing impurities on the relief pattern using the cleaning laser.

[0048] In a specific embodiment, the processing result obtained after the relief processing operation corresponding to the current relief layer is completed can be called a relief pattern. It can be understood that the currently obtained relief pattern is essentially a relief semi-finished product. Only when the current relief layer is the last relief layer, the currently obtained relief pattern is a relief finished product.

[0049] In one embodiment, when using a cleaning laser to clean the relief pattern currently obtained, the cleaning laser can be used to clean the relief within the area enclosed by the outer contour of the relief pattern on the processing material. That is, the cleaning area on the processing material can at least cover the outer contour of the relief pattern, thereby ensuring that the entire relief pattern can be cleaned. As an example, the relationship between the relief pattern and the cleaning area can be seen in Figure 3 .like Figure 3 As shown, the shape of the cleaning area can fit the outer contour of the relief pattern, or it can be a regular shape that can contain the outer contour (such as Figure 3 rectangle in the .

[0050] exist Figure 2In the illustrated embodiment, the relief processing is performed layer by layer. When it is detected that the relief layer currently being engraved during the relief processing operation needs to be cleaned, a cleaning laser that matches the material of the relief processing material is generated, and the current relief layer is cleaned using a laser elimination method. This allows the relief cleaning task to be embedded into the relief processing process, thereby effectively suppressing the accumulation of errors during the relief processing process and improving the smoothness of the transition between each relief layer, so that the fineness of the relief work can be significantly improved. Moreover, because the relief cleaning is achieved using a cleaning laser that matches the material of the relief processing material without the involvement of liquid substances, the embodiments of the present application can also reduce or even eliminate the damage caused by the relief cleaning process to the laser processing equipment, to a certain extent ensuring the efficiency of the relief processing and saving the relief processing cost.

[0051] It should be noted that in Figure 2 In the illustrated embodiment, the relief processing may be performed based on processing instruction information, and the processing instruction information may be generated by a laser processing device based on the total number of relief layers and a relief reference image, or may be manually input by an operator.

[0052] For example, if the laser processing equipment automatically generates the relief, the processing instruction information can be generated based on the total number of relief layers and the grayscale value of each pixel in the relief reference image after obtaining the total number of relief layers and the grayscale value of each pixel in the relief reference image. The relief reference image is primarily used to represent the relief to be obtained through relief processing. Each pixel in the relief reference image has a corresponding mapping position on the relief processing material. If a relief work corresponding to a certain element in the image is to be processed, the relief processing can be performed at the mapping position corresponding to each pixel constituting the element.

[0053] In one implementation, the processing instruction information can specifically indicate the pixels associated with each relief layer, so that the laser processing equipment can perform relief processing based on the pixels associated with each relief layer, thereby obtaining the corresponding relief layer. In this case, when generating the processing instruction information, the laser processing equipment can first obtain a preset maximum grayscale level for the relief reference image. Then, based on this maximum grayscale level and the total number of relief layers, it can generate a grayscale value threshold associated with each relief layer. The preset maximum grayscale level for the relief reference image generally refers to the range of distinguishable brightness levels between the darkest and brightest pixels in the grayscale image after the relief reference image is converted into a grayscale image. Pixels with grayscale values ​​within each grayscale value threshold are then designated as pixels associated with the relief layer corresponding to that grayscale value threshold, and processing instruction information is generated based on the pixels associated with each relief layer. The grayscale value threshold associated with each j-th relief layer must be less than the grayscale value threshold associated with the j+1-th relief layer.

[0054] As an example, the grayscale value threshold associated with the j-th relief layer can be calculated according to Formula 1.

[0055] sliceValue=Max_gray-[(j-1)*chunk] Formula 1

[0056] In Formula 1, sliceValue represents the grayscale threshold, Max_gray represents the preset maximum grayscale level (e.g., 256, i.e., the grayscale value range is 0-255), j represents the jth relief layer, and chunk represents the grayscale interval between adjacent relief layers. Chunk can be calculated as shown in Formula 2. In Formula 2, Max_gray represents the preset maximum grayscale level, and N represents the total number of relief layers.

[0057] chunk=(Max_gray) / N Equation 2

[0058] For example, assuming the maximum grayscale level in the relief reference image is 256 and the total number of relief layers is 4, the laser processing equipment can determine the grayscale interval between each two adjacent relief layers as 64 (256 / 4=64) based on 256 and 4, thereby obtaining the grayscale value threshold corresponding to each relief layer. In this example, the grayscale value threshold corresponding to the first relief layer is 256 (i.e., 256-0*64), the grayscale value threshold associated with the second relief layer is 192 (i.e., 256-1*64), the grayscale value threshold associated with the third relief layer is 128 (i.e., 256-2*64), and the grayscale value threshold associated with the fourth relief layer is 64 (i.e., 256-3*64). That is to say, pixels with grayscale values ​​less than 256 will be regarded as pixels associated with the first relief layer. When the first relief layer needs to be processed, each pixel associated with the relief layer will be engraved at the mapping position on the relief processing material. Similarly, the processing methods of other relief layers can be understood and will not be described in detail here.

[0059] In another implementation, the processing instruction information may also be used to indicate the number of engravings associated with each pixel. In this case, when the laser processing equipment needs to generate the processing instruction information, it may determine the number of engravings associated with each pixel based on the total number of relief layers and the grayscale value of the pixel, in accordance with the principle that the number of engravings is negatively correlated with the grayscale value of the pixel. However, the number of engravings associated with each pixel is less than or equal to the total number of relief layers (e.g., a positive integer N), to ensure that after processing N relief layers, a complete relief work that meets the desired effect is obtained.

[0060] When the processing instruction information is used to indicate the number of engraving times associated with each pixel point, the laser processing device can illustratively perform relief processing on each relief layer layer by layer according to the following process:

[0061] First, after determining the relief layer currently to be processed, the target pixel point with the least number of engravings currently associated and not equal to zero is determined from the pixels included in the relief reference image based on the processing instruction information, and then the mapping position of each target pixel point on the relief processing material is determined, and then the relief processing operation is performed on each mapping position to obtain the corresponding relief layer. After detecting that the relief processing operation is completed, the number of engravings associated with the target pixel point can be decremented by one, and the next relief layer to be processed is determined, and then the step of "determining the target pixel point with the least number of engravings currently associated and not equal to zero from the pixels included in the relief reference image based on the processing instruction information" is triggered until the relief processing operation for the last relief layer is completed.

[0062] It can be understood that after determining the relief operation that currently needs to be processed, the laser processing equipment can also trigger the operation of "detecting whether the current relief layer meets the cleaning trigger conditions" in the above step S201, thereby combining the relief cleaning work with the relief processing process to improve the fineness and cleanliness of the relief work.

[0063] In order to facilitate those skilled in the art to more clearly understand the embodiments of the present application, the present application also proposes a relief processing implementation method, the corresponding process of this method can be found in Figure 4 .like Figure 4 , when there is a need for relief processing, the user can trigger the laser processing equipment to display an editable interface for inputting relevant processing data (such as relief processing images, processing requirements, etc.), so that the laser processing equipment can refer to the processing data input by the user for relief processing. It is worth mentioning that the laser processing equipment here can be a composite device composed of a host computer and a slave computer, or it can be an integrated device of a host computer and a slave computer, and there is no restriction here. When the laser processing equipment is a composite device, it can be executed by the host computer Figure 2 The relevant data calculation and storage in Figure 2 The implementation logic generates relevant processing instructions and sends them to the lower computer to instruct the lower computer to perform engraving or cleaning.

[0064] For example, the editable interface can be found in Figure 5 .like Figure 5 , the editable interface can include the selection area of ​​​​the relief processing element (such as Figure 5 In the area marked by 501), various relief processing elements are displayed in this area. Relevant personnel can edit the relief processing drawings in the editing area (such as Figure 5 The editable interface may further include a parameter configuration area, which may specifically include a configuration area for cleaning processing parameters (such as Figure 5 ), and / or, configuration areas for other parameters (such as Figure 5 The area marked by 504 in the figure). Among them, the configuration area of ​​the cleaning processing parameters can be used to configure whether to turn on the cleaning function, the number of cleaning interval layers, the cleaning processing parameters for generating the cleaning laser, the cleaning area, the cleaning trigger conditions, and the laser power, frequency, pulse width, etc. based on which the cleaning laser is generated; the configuration area of ​​other parameters can be used to configure the processing parameters during the relief processing (such as the total number of relief layers for relief processing, relief processing material information, relief size, frequency and pulse width of the relief processing laser, etc.) and equipment configuration parameters (such as the model of the laser processing head, the performance indicators that the host computer needs to meet, etc.). Optionally, the editable interface can also include a trigger control for relief processing (such as Figure 5 The relevant personnel can trigger the embossing process by selecting the trigger control (the control marked by 505).

[0065] It should be noted that Figure 5 The editable interface shown is only an exemplary description. In actual application, it may also include other areas (such as the display area of ​​the relief processing process) or only include part of the area, which is not limited here.

[0066] In one implementation, the user can choose whether to turn on the relief cleaning function in the editable interface. If it is detected that the user has not turned on the relief cleaning function, the relief processing is performed layer by layer according to the total number of relief layers to obtain a relief work. If it is detected that the user has turned on the relief cleaning function, the user can be prompted to configure the cleaning processing parameters (in this example, it is assumed that the cleaning processing parameters include the number of relief interval layers), and then the corresponding relief cleaning conditions are determined based on the cleaning processing parameters. After detecting the relief processing instruction, the current relief layer to be processed can be determined, and the relief processing corresponding to the relief layer is performed. In the process of performing the relief processing, it can also be detected whether the current relief layer meets the relief cleaning conditions. If satisfied, the relief cleaning is performed after the relief processing corresponding to the current relief layer is detected to be completed. If not satisfied, the current relief layer to be processed is re-determined. After the relief processing of the last relief layer is completed, the relief work obtained by the processing can be displayed in the editable interface, so that the user can intuitively observe the difference between the relief effect and the expected effect, thereby adjusting the relevant parameters in time to reduce material waste.

[0067] It should be noted that in the scenario where the laser processing equipment performs relief processing layer by layer through the laser, since the effect of laser engraving is related to the focal length of the laser, the moving coordinates used for processing different relief layers are not the same. Among them, the moving coordinates refer to the coordinates on the preset laser movement route. The laser movement route corresponding to each relief layer is usually different, and is generally determined based on the mapping position corresponding to each pixel point associated with the relief layer in the relief processing image on the relief processing material. Generally, the height above the ground indicated by the Z-axis coordinate of the kth relief layer is greater than the height above the ground indicated by the Z-axis coordinate of the k+1th relief layer, and when the kth relief layer meets the relief cleaning conditions, the Z-axis coordinate in the moving coordinate of the cleaning laser is the Z-axis coordinate corresponding to the kth relief layer. Among them, the height above the ground refers to the height from the processing base plate, and the processing base plate refers to the platform used to place the relief processing material.

[0068] Based on the above method embodiments, this application also provides a corresponding device, see Figure 6 . Figure 6 This is a schematic diagram of the structure of a relief processing device provided by this application. The device can be mounted on a laser processing device or a computer device and used to achieve the above Figure 2 Some or all of the functions of the described method embodiments. Figure 6 The device may include a parameter acquisition unit 601, a relief cleaning unit 602, a display unit 603, and a relief engraving unit 604.

[0069] The parameter acquisition unit 601 is used to acquire cleaning processing parameters for relief cleaning if the relief layer currently being processed meets the cleaning triggering condition during the relief processing;

[0070] The relief cleaning unit 602 is used to perform a relief cleaning operation after the relief layer currently being processed is processed is finished. The relief cleaning operation includes: outputting a cleaning laser based on the cleaning processing parameters to clean the relief pattern currently processed. The cleaning includes using the cleaning laser to remove impurities on the relief pattern.

[0071] In one embodiment, the embossing process is triggered in response to an embossing process instruction, and the display unit 603 is configured to execute:

[0072] Displaying an editable interface, and displaying a selection control for relief cleaning in the editable interface;

[0073] In response to a triggering operation on the selection control in the editable interface, displaying a parameter configuration area;

[0074] In response to the parameter configuration operation in the parameter configuration area, an embossing instruction is generated based on the configured parameter information to perform embossing based on the embossing instruction; wherein the parameter information includes the number of cleaning interval layers and one or more of the cleaning parameters.

[0075] In another embodiment, the relief cleaning unit 602 is configured to perform the relief cleaning operation every M relief layers during the relief processing, and the cleaning triggering condition is that the current relief layer is the i-th relief layer, and i is an integer multiple of M.

[0076] In another embodiment, when the relief cleaning unit 602 outputs the cleaning laser based on the cleaning process parameters to clean the relief pattern currently processed, the following steps are specifically performed:

[0077] The cleaning laser is used to perform relief cleaning in a cleaning area on the processing material, and the cleaning area at least includes a region surrounded by an outer contour of the relief pattern.

[0078] In another embodiment, the cleaning process parameters are related to the material information of the processing material, and different material information corresponds to different cleaning process parameters.

[0079] In another embodiment, the cleaning process parameters are obtained by the following steps:

[0080] Obtain material information of processing materials;

[0081] estimating processing impurities on the relief pattern;

[0082] The cleaning process parameters are determined based on the processing impurities and the material information of the processing material.

[0083] In another embodiment, the cleaning process parameters include laser power. When the parameter acquisition unit 601 determines the cleaning process parameters based on the processing impurities and the material information of the processing material, it can be specifically configured to perform:

[0084] Predicting laser power based on the processing impurities and material information of the processing material to obtain at least one candidate laser power capable of removing the processing impurities;

[0085] acquiring a laser power of a relief processing laser, and selecting a candidate laser power from the at least one candidate laser power as the target laser power, with the target laser power being lower than the laser power of the relief processing laser;

[0086] The target laser power is determined as the laser power in the cleaning process parameters.

[0087] In yet another embodiment, the relief engraving unit 604 may be configured to perform:

[0088] Obtaining the total number of relief layers and the grayscale value of each pixel in a relief reference image, wherein the relief reference image is used to present a relief to be obtained through relief processing;

[0089] Based on the total number of the relief layers and the grayscale value of each pixel, processing instruction information is generated, so as to perform relief processing based on the processing instruction information.

[0090] In another embodiment, the processing instruction information is used to indicate the number of engraving times associated with each pixel point; when the relief engraving unit 604 generates the processing instruction information based on the total number of relief layers and the grayscale value of each pixel point, it can be specifically used to perform:

[0091] According to the principle that the number of engraving times is negatively correlated with the grayscale value of a pixel, the number of engraving times associated with each pixel is determined based on the total number of relief layers and the grayscale value of the pixel, and the number of engraving times is less than or equal to the total number of relief layers.

[0092] In another embodiment, when determining whether the currently processed relief layer meets the cleaning trigger condition, the parameter acquisition unit 601 may specifically perform:

[0093] Acquire image data of the relief processing area;

[0094] Determine whether the currently processed relief layer meets the cleaning trigger condition based on the image data; wherein, meeting the cleaning trigger condition includes that the thickness and / or area of ​​impurities on the relief pattern in the image data exceeds a threshold.

[0095] It is worth mentioning that Figure 6 The various units in the device shown can be separately or all combined into one or several other units to constitute, or a certain unit (or units) thereof can also be further split into multiple smaller units in function to constitute, which can achieve the same operation without affecting the realization of the technical effects of the embodiments of the present application. In other words, the above-mentioned units are divided based on logical functions. In actual applications, the functions of a unit can also be implemented by multiple units, or the functions of multiple units can be implemented by one unit. In other embodiments of the present application, the aforementioned device may also include other units. In actual applications, these functions can also be implemented with the assistance of other units, and can be implemented by the collaboration of multiple units.

[0096] According to another embodiment of the present application, the following can be executed by running a program on a computing device including a central processing unit (CPU), a random access memory (RAM), a read-only memory (ROM) and other processing elements and a storage element. Figure 2 A computer program (including program code) for each step involved in the corresponding method shown in Figure 6 The apparatus shown in and the method for implementing the embodiments of the present application. The computer program can be recorded on, for example, a computer-readable storage medium, and loaded into the above-mentioned apparatus through the computer-readable storage medium and run therein.

[0097] An embodiment of the present application also provides a laser processing system, including a computer device and a laser processing device, the computer device is used to generate processing instructions; the laser processing device is communicatively connected to the computer device, the laser processing device includes a communication component, a controller and a laser head, the communication component is used to receive the processing instructions, and the controller is used to control the movement of the laser head based on the processing instructions to implement the relief processing method provided in the above-mentioned embodiments.

[0098] The embodiment of the present application also provides a laser processing device, which may include a laser head and a controller. The laser head is used to emit laser energy, and the laser energy acts on the processing material to change the processing material; the controller is used to implement the relief processing method provided in each of the above embodiments, so as to control the laser head to perform relief processing on the processing material, and use a cleaning laser to remove impurities on the relief pattern of the processing material during the relief processing. The laser processing device can implement the relief processing method mentioned in any of the above embodiments during the relief processing. For example: during the relief processing, if the relief layer currently being processed meets the cleaning trigger condition, the cleaning processing parameters for relief cleaning are obtained; after the processing of the relief layer currently being processed is completed, the relief cleaning operation is performed, and the relief cleaning operation includes: outputting a cleaning laser based on the cleaning processing parameters to clean the relief pattern currently processed, and the cleaning includes using a cleaning laser to remove impurities on the relief pattern.

[0099] In a feasible implementation, the structure of the laser processing equipment can be seen in Figure 7 .like Figure 7The laser processing equipment may include a laser processing head 10, a housing 100 (including a first flat plate 140 and a shell 160), and a support assembly 40. In some embodiments, the laser processing head 10 includes a laser emitter (at least one), a reflector assembly, and a galvanometer assembly. The laser emitter is used to emit laser light; the reflector assembly is arranged corresponding to the laser emitter, and is used to receive and reflect the laser beam emitted by the laser emitter; the galvanometer assembly is arranged corresponding to the reflector assembly, and is used to receive the laser beam reflected by the reflector assembly and reflect it onto the processing material to process the processing material. The laser beam is moved on the processing material by the galvanometer assembly. It can be understood that the housing 100 is enclosed to form an accommodating space, and the laser emitter, the reflector assembly, and the galvanometer assembly are all arranged in the accommodating space. In some embodiments, the laser processing equipment may also include a motion mechanism, and the laser processing head 10 may be connected to the motion mechanism, and the motion mechanism may drive the laser processing head 10 to move. In this embodiment, the laser processing head may include a galvanometer assembly or may not include a galvanometer assembly.

[0100] This application also provides an electronic device, specifically, see Figure 8 , Figure 8 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application is shown in FIG. Figure 8 As shown, the electronic device may include a processor 801, a memory 802, and a communication interface 803, and the processor 801, the memory 802, and the communication interface 803 may be connected via a bus or other means.

[0101] The processor 801 (also called the Central Processing Unit (CPU)) is the computing core and control core of the electronic device, which can parse various instructions in the electronic device and process various data of the electronic device.

[0102] The memory 802 (Memory) is a memory module in the electronic device for storing programs and data. It is understandable that the memory 802 here can include the built-in memory of the electronic device, and of course can also include the extended memory supported by the electronic device.

[0103] The communication interface 803 may optionally include a standard wired interface, a wireless interface (such as WI-FI, a mobile communication interface, etc.), and can be used to send and receive data under the control of the processor 801; the communication interface 803 can also be used for transmission and interaction of data within the electronic device.

[0104] In a specific embodiment, the processor 801 may load and execute one or more computer programs stored in the memory 802 to implement the steps of the method described in the above embodiment.

[0105] The electronic device may be the laser processing device or computer device in the above embodiments.

[0106] The present application also provides a computer-readable medium having a computer program stored thereon, which implements the aforementioned relief processing method when executed by a processor. The computer-readable medium may be included in the laser processing device or computer device described in the above embodiments, or may exist independently and not be assembled into the laser processing device or computer device. It should be noted that the computer-readable medium shown in the embodiments of the present application may be a computer-readable signal medium or a computer-readable storage medium or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM), a flash memory, an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. The computer program contained in the computer-readable medium may be transmitted using any appropriate medium, including but not limited to: wireless, wired, etc., or any suitable combination of the above.

[0107] Another aspect of the present application further provides a program product, which includes computer instructions. When a processor reads and executes the computer instructions, the relief processing method provided in the above method embodiment is implemented.

[0108] It should be noted that the principles of the problems solved by the devices, systems, related equipment, and computer-readable media provided in the embodiments of the present application all belong to the same inventive concept as the aforementioned corresponding methods, and therefore the relevant implementation methods can continue to refer to the corresponding method embodiments. For the sake of brevity, they will not be repeated here. In addition, it should be understood that the above content is only a preferred exemplary embodiment of the present application and is not intended to limit the implementation scheme of the present application. Ordinary technicians in this field can easily make corresponding changes or modifications based on the main concept and spirit of the present application. Therefore, the scope of protection of the present application shall be based on the scope of protection required by the claims.

Claims

1. A relief processing method, characterized in that: include: During the relief processing, if the relief layer currently being processed meets the cleaning trigger condition, the cleaning processing parameters for relief cleaning are obtained; After the processing of the currently processed relief layer is completed, a relief cleaning operation is performed, which includes: outputting a cleaning laser based on the cleaning processing parameters to clean the currently processed relief pattern, and the cleaning includes using the cleaning laser to remove impurities on the relief pattern.

2. The method according to claim 1, characterized in that The embossing process is triggered in response to an embossing process instruction, and the embossing process instruction is generated in the following manner: Displaying an editable interface, and displaying a selection control for relief cleaning in the editable interface; In response to a triggering operation on the selection control in the editable interface, displaying a parameter configuration area; In response to the parameter configuration operation in the parameter configuration area, an embossing instruction is generated based on the configured parameter information to perform embossing based on the embossing instruction; wherein the parameter information includes the number of cleaning interval layers and one or more of the cleaning parameters.

3. The method according to claim 1, characterized in that During the relief processing, the relief cleaning operation is performed once every M relief layers, and the cleaning triggering condition is that the current relief layer is the i-th relief layer, and i is an integer multiple of M.

4. The method according to claim 1, wherein The step of outputting a cleaning laser based on the cleaning processing parameters to clean the currently processed relief pattern comprises: The cleaning laser is used to perform relief cleaning in a cleaning area on the processing material, and the cleaning area at least includes a region surrounded by an outer contour of the relief pattern.

5. The method according to claim 1, wherein The cleaning process parameters are related to the material information of the processing material, and different material information corresponds to different cleaning process parameters.

6. The method according to claim 1, characterized in that The cleaning process parameters are obtained by the following steps: Obtain material information of processing materials; estimating processing impurities on the relief pattern; The cleaning process parameters are determined based on the processing impurities and the material information of the processing material.

7. The method according to claim 6, characterized in that The cleaning process parameters include laser power, and determining the cleaning process parameters based on the processing impurities and the material information of the processing material includes: Predicting laser power based on the processing impurities and material information of the processing material to obtain at least one candidate laser power capable of removing the processing impurities; acquiring a laser power of a relief processing laser, and selecting a candidate laser power from the at least one candidate laser power as the target laser power, with the target laser power being lower than the laser power of the relief processing laser; The target laser power is determined as the laser power in the cleaning process parameters.

8. The method according to claim 1, characterized in that The method further comprises: Obtaining the total number of relief layers and the grayscale value of each pixel in a relief reference image, wherein the relief reference image includes a relief effect obtained by relief processing; Based on the total number of the relief layers and the grayscale value of each pixel, processing instruction information is generated, so as to perform relief processing based on the processing instruction information.

9. The method according to claim 8, characterized in that The processing instruction information is used to indicate the number of engraving times associated with each pixel point; generating the processing instruction information based on the total number of relief layers and the grayscale value of each pixel point includes: According to the principle that the number of engraving times is negatively correlated with the grayscale value of a pixel, the number of engraving times associated with each pixel is determined based on the total number of relief layers and the grayscale value of the pixel, and the number of engraving times is less than or equal to the total number of relief layers.

10. The method according to claim 1, characterized in that The method of judging whether the currently processed relief layer meets the cleaning trigger condition includes: Acquire image data of the relief processing area; Determine whether the currently processed relief layer meets the cleaning trigger condition based on the image data; wherein, meeting the cleaning trigger condition includes that the thickness and / or area of ​​impurities on the relief pattern in the image data exceeds a threshold.

11. A laser processing device, characterized in that: include: A laser head, the laser head is used to emit laser energy, and the laser energy acts on the processing material to cause the processing material to change; A controller for implementing the embossing method according to any one of claims 1 to 10, so as to control the laser head to perform embossing on the processing material, and to use a cleaning laser to remove impurities on the embossing pattern of the processing material during the embossing process.

12. A laser processing system, characterized in that: include: Computer equipment, the computer equipment is used to generate processing instructions; Laser processing equipment, the laser processing equipment is communicatively connected to the computer equipment, the laser processing equipment comprises a communication component, a controller and a laser head, the communication component is used to receive the processing instructions, and the controller is used to control the action of the laser head based on the processing instructions to implement the relief processing method described in any one of claims 1 to 10.

13. A computer-readable medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the relief processing method according to any one of claims 1 to 10 is implemented.

14. A computer program product comprising computer instructions, characterized in that When the computer instructions are executed by a processor, the relief processing method according to any one of claims 1 to 10 is implemented.

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