Coaxial multi-blade wafer cutting machine

Abstract

The present application relates to wafer cutting technology field, specifically to a coaxial multi-blade wafer cutting machine, the cutting mechanism includes sliding seat, cutting power assembly and self-centering cutter group; The self-centering cutter group includes first support, cutter unit and centering clamping unit; The centering clamping unit includes centering seat, rotating shaft and centrifugal block; Multiple centrifugal blocks are combined to form a variable-diameter centrifugal shaft; The two ends of the centrifugal block are provided with a first outer taper surface; The inner end of the push shaft is provided with a first inner taper surface matched with the first outer taper surface; The outer end of the push shaft is provided with a first permanent magnet; The spring is arranged between the centering head and the push shaft; The outer end of the centering head is provided with a second outer taper surface; The cutter unit includes cutting blade and positioning shaft; The cutting blade is provided with a second inner taper surface matched with the second outer taper surface on the circumference of the central hole; The outer wall of the positioning shaft is provided with a second permanent magnet in the circumferential direction; So as to facilitate the quick disassembly of a single blade, without disassembling multiple blades, saving the disassembly time of the blades.

Description

Technical Field

[0001] This invention relates to the field of wafer dicing technology, and more specifically to a coaxial multi-blade wafer dicing machine. Background Technology

[0002] In the semiconductor manufacturing and precision machining fields, multi-blade wafer dicing machines are widely used in the processing of brittle materials such as wafers due to their ability to perform efficient and batch dicing operations. The core working components of this type of equipment are multiple dicing blades, and their installation method directly affects the equipment's operating efficiency, dicing accuracy, and ease of maintenance.

[0003] Currently, in the multi-blade wafer dicing machine blade mounting structure commonly used in the industry, multiple wafer dicing blades are typically coaxially arranged and mounted via a single mounting shaft. Specifically, the mounting shaft, as a load-bearing component, is fixed to the machine frame at both ends via bearings and other connecting components. The dicing blades are sequentially mounted on the mounting shaft at preset intervals and positioned and locked using fasteners such as nuts and washers to ensure that the blades do not shift or wobble during high-speed rotational cutting.

[0004] However, this coaxial mounting method based on the mounting shaft presents significant inconveniences in actual cutting blade assembly and disassembly operations. When it is necessary to replace worn cutting blades, adjust blade spacing, or perform equipment maintenance, operators must first disassemble the fixed connectors (such as bearing seats, lock nuts, etc.) at one end of the mounting shaft, allowing the mounting shaft to move axially, before they can remove the cutting blades fitted onto it one by one along the axial direction of the mounting shaft. In this process, if there are many cutting blades (for example, in some high-precision batch processing scenarios, more than 10 cutting blades are often required to improve processing efficiency), a significant amount of time is spent on disassembling the fixing components, removing and placing the blades one by one, and reinstalling and repositioning them. This cumbersome assembly and disassembly process not only significantly extends equipment downtime and reduces production efficiency, but its impact on production schedule is even more pronounced on large-scale production lines that require frequent blade replacements. Summary of the Invention

[0005] The purpose of this invention is to overcome the above-mentioned shortcomings and provide a coaxial multi-blade wafer dicing machine, which facilitates the quick assembly and disassembly of a single blade without the need to assemble and disassemble multiple blades, saving time and improving production efficiency.

[0006] To achieve the above objectives, the specific solution of the present invention is as follows:

[0007] A coaxial multi-blade wafer dicing machine includes a dicing mechanism; the dicing mechanism includes a sliding seat and a dicing power assembly and a self-centering blade assembly disposed on the sliding seat;

[0008] The self-centering blade assembly includes a first support, multiple cutting blade units, and multiple centering clamping units; the multiple centering clamping units are arranged side by side at intervals on the bottom surface of the first support;

[0009] Each centering clamping unit includes a centering seat, a rotating shaft rotatably disposed within the centering seat, and multiple centrifugal blocks movably disposed within the rotating shaft; the multiple centrifugal blocks are combined to form a variable-diameter centrifugal shaft; the rotating shaft is connected to the cutting power assembly; both ends of the centrifugal blocks are provided with a first outer conical surface; both ends of the rotating shaft are provided with a push shaft and a centering head movably disposed along the axial direction; the inner end of the push shaft is provided with a first inner conical surface adapted to the first outer conical surface; the outer end of the push shaft is provided with a first permanent magnet; the centering head is coaxially sleeved on the outer wall of the push shaft, and a spring is provided between its inner end and the push shaft; the outer end of the centering head is provided with a second outer conical surface;

[0010] Each cutting unit includes a cutting blade and a positioning shaft located in the central hole of the cutting blade; the cutting blade has a second inner conical surface adapted to the second outer conical surface around the periphery of its central hole; the outer wall of the positioning shaft is provided with a second permanent magnet along the circumferential direction.

[0011] Furthermore, the outer end face of the push shaft is recessed with a groove; a first permanent magnet is embedded in the groove wall along the circumferential direction; both ends of the positioning shaft can be inserted into the centering head and then movably extended into the groove.

[0012] Furthermore, the groove has a polygonal cross-section; a first permanent magnet is embedded in the middle of each side of the groove; the two ends of the positioning shaft have polygonal cross-sections; and a second permanent magnet extending along a parallel axial direction is embedded in the middle of multiple sides of the outer wall of the positioning shaft.

[0013] Furthermore, one side of the outer wall of the positioning shaft is provided with a coil, and the other sides are each provided with a second permanent magnet; an RFID component electrically connected to the coil is embedded in the shaft hole of the positioning shaft.

[0014] Furthermore, the outer wall of the centrifugal block is provided with a guide rod; the guide rod movably passes through the rotating shaft.

[0015] Furthermore, the rotating shaft is provided with a guide groove; the inner end of the push shaft is provided with a guide platform; the guide platform is movably embedded in the guide groove.

[0016] Furthermore, the self-centering blade assembly of the present invention also includes a second support; the two ends of the second support are connected to the bottom surface of the first support; the two ends of the second support are respectively provided with centering holes; the second outer conical surface can penetrate the centering holes; the second support is provided with cutting holes corresponding to the position of each cutting blade, and the bottom of the cutting blade penetrates through the cutting holes.

[0017] Furthermore, the present invention provides a third outer conical surface at the middle of both sides of the cutting blade.

[0018] Furthermore, the cutting power assembly of the present invention includes a cutting motor, a first synchronous pulley, a second synchronous pulley, a first synchronous belt, and a synchronous belt shaft; the first synchronous pulley is connected to the output end of the cutting motor; the synchronous belt shaft is rotatably mounted on a sliding seat; the second synchronous pulley is sleeved on one end of the synchronous belt shaft; the first synchronous belt is wound between the first synchronous pulley and the second synchronous pulley; the rotation shaft of each centering clamping unit is connected to the synchronous belt shaft via the second synchronous belt.

[0019] Furthermore, the cutting machine of the present invention also includes a machine base, a support platform, a first slide, a second slide, and a third slide; the first slide is disposed on the horizontal arm of the machine base; the support platform is disposed on the output end of the first slide; the second slide is disposed on the vertical arm of the machine base; the third slide is disposed on the output end of the second slide; the cutting mechanism is disposed on the output end of the third slide; the support platform includes a turntable and a vacuum suction cup disposed on the turntable.

[0020] The beneficial effects of this invention are as follows: By setting multiple centering and clamping units on the cutting mechanism, the second outer conical surface of the centering head is used to cooperate with the second inner conical surface of the cutting blade for initial positioning. Then, by utilizing the centrifugal motion of the centrifugal block, the first outer conical surface of the centrifugal block cooperates with the first inner conical surface of the push shaft, causing the push shaft to slide axially. This allows the centering head to reliably clamp the cutting blade. The centering and clamping units center and clamp the conical surface of the cutting blade, which facilitates the quick assembly and disassembly of a single blade without the need to assemble and disassemble multiple blades, saving time and improving production efficiency. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the coaxial multi-blade wafer dicing machine of the present invention;

[0022] Figure 2 This is a schematic diagram of the cutting mechanism of the present invention;

[0023] Figure 3 This is a cross-sectional schematic diagram of the cutting mechanism of the present invention;

[0024] Figure 4 This is a schematic diagram of the structure of the self-centering knife assembly of the present invention;

[0025] Figure 5 This is a cross-sectional schematic diagram of the centering clamping unit of the present invention in its initial state;

[0026] Figure 6 This is a cross-sectional schematic diagram of the centering clamping unit of the present invention when centering and clamping the cutting blade;

[0027] Figure 7This is a schematic diagram of the cutting unit of the present invention;

[0028] Figure 8 This is a cross-sectional schematic diagram of the cutting unit of the present invention;

[0029] Explanation of reference numerals in the attached drawings: 100, machine base; 200, support platform; 300, first slide table; 400, second slide table; 500, third slide table; 600, cutting mechanism; 10, turntable; 20, vacuum suction cup; 30, sliding seat; 40, cutting power assembly; 50, self-centering blade assembly; 11, cutting motor; 12, first synchronous pulley; 13, second synchronous pulley; 14, first synchronous belt; 15, synchronous belt shaft; 16, second synchronous belt; 21, first bracket; 22, cutting blade unit; 221, cutting blade; 2211, second inner conical surface; 2212, Third outer conical surface; 222, Positioning shaft; 223, Second permanent magnet; 224, Coil; 225, RFID component; 23, Centering clamping unit; 231, Centering seat; 232, Rotation shaft; 233, Centrifugal block; 2331, First outer conical surface; 2332, Guide rod; 234, Push shaft; 2341, First inner conical surface; 2342, Groove; 235, Centering head; 2351, Second outer conical surface; 236, First permanent magnet; 237, Spring; 24, Second bracket; 241, Centering hole; 242, Cutting hole. Detailed Implementation

[0030] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments, but this is not to limit the scope of the invention to this.

[0031] like Figures 1 to 8 As shown in the figure, a coaxial multi-blade wafer dicing machine according to this embodiment includes a machine base 100, a support stage 200, a first slide stage 300, a second slide stage 400, a third slide stage 500, and a dicing mechanism 600; the first slide stage 300 is disposed on the horizontal arm of the machine base 100; the support stage 200 is disposed on the output end of the first slide stage 300; the second slide stage 400 is disposed on the vertical arm of the machine base 100; the third slide stage 500 is disposed on the output end of the second slide stage 400; the dicing mechanism 600 is disposed on the output end of the third slide stage 500; the support stage 200 includes a turntable 10 and a vacuum chuck 20 disposed on the turntable 10.

[0032] The cutting mechanism 600 includes a sliding seat 30 and a cutting power assembly 40 and a self-centering blade assembly 50 disposed on the sliding seat 30; the self-centering blade assembly 50 includes a first support 21, multiple cutting blade units 22 and multiple centering clamping units 23; the multiple centering clamping units 23 are arranged side by side at intervals on the bottom surface of the first support 21; for example, if the number of centering clamping units 23 is four, the corresponding number of cutting blade units 22 is three;

[0033] Each centering clamping unit 23 includes a centering seat 231, a rotating shaft 232 rotatably disposed within the centering seat 231, and multiple centrifugal blocks 233 movably disposed within the rotating shaft 232. Multiple centrifugal blocks 233 are combined to form a variable-diameter centrifugal shaft. For example, if there are three centrifugal blocks 233, the three centrifugal blocks 233 are fitted together to form the centrifugal shaft. The rotating shaft 232 is connected to the cutting power assembly 40 via a transmission. Both ends of the centrifugal blocks 233 are provided with a first outer conical surface 2331. Both ends of the rotating shaft 232 are axially movable and provided with a push shaft 234 and a centering head 235. The inner end of the push shaft 234 is provided with a first inner conical surface 2341 adapted to the first outer conical surface 2331. The outer end of the push shaft 234 is provided with a first permanent magnet 236. The centering head 235 is coaxially sleeved on the outer wall of the push shaft 234, and a spring 237 is provided between its inner end and the push shaft 234. The outer end of the centering head 235 is provided with a second outer conical surface 2351.

[0034] Each cutting unit 22 includes a cutting blade 221 and a positioning shaft 222 disposed in the central hole of the cutting blade 221; the cutting blade 221 is provided with a second inner conical surface 2211 adapted to the second outer conical surface 2351 around the periphery of its central hole; the outer wall of the positioning shaft 222 is provided with a second permanent magnet 223 along the circumferential direction.

[0035] The coaxial multi-blade wafer dicing machine described in this embodiment, initially, such as Figure 5 As shown, the centering head 235 extends out of the rotating shaft 232 under the elastic force of the spring 237; the centrifugal shaft formed by the combination of multiple centrifugal blocks 233 has the smallest diameter; when installing the cutter unit 22, each cutter unit 22 is placed between two adjacent centering clamping units 23, and then the cutter unit 22 is squeezed between the two adjacent centering clamping units 23. At this time, the two sides of the cutting blade 221 contact the second outer conical surface 2351 of the centering head 235 of the two adjacent centering clamping units 23, and squeeze the centering head 235, causing the centering head 235 to compress the spring. 237 retracts inward until the second inner conical surface 2211 on both sides of the cutting blade 221 aligns with the second outer conical surface 2351 of the centering head 235. Then, the spring 237 pushes the centering head 235 outward, so that the second outer conical surface 2351 of the centering head 235 is inserted into the second inner conical surface 2211 of the cutting blade 221 and comes into contact with the second inner conical surface 2211. At this time, the two adjacent centering heads 235, under the elastic force of the spring 237, clamp and initially position the cutting blade 221 through the cooperation of the second outer conical surface 2351 and the second inner conical surface 2211.

[0036] After initial positioning, the cutting power assembly 40 drives the rotating shafts 232 of each centering and clamping unit 23 to rotate. Each centrifugal block 233 of the centrifugal shaft moves radially under centrifugal force, increasing the diameter of the centrifugal shaft. At this time, the first outer conical surface 2331 of the centrifugal shaft engages with the first outer conical surface 2331 of the push shaft 234, causing the centrifugal blocks 233 to move radially while squeezing the push shaft 234 to slide axially. This further compresses the spring 237, causing the centering head 235 to press against the second inner conical surface 2211 of the cutting blade 221, achieving final centering and clamping, and completing the installation of the cutting blade 221. Figure 3 and Figure 6 As shown;

[0037] After centering and clamping, the wafer unit is placed on the vacuum chuck 20, which vacuum-adsorbs and fixes the wafer unit. Then, the first slide 300 moves the support stage 200 to below the cutting mechanism 600. The second slide 400 and the third slide 500 then work to move the cutting mechanism 600, using the clamped and positioned cutting blade 221 to cut the wafer unit. At the same time, the cutting power assembly 40 increases the rotation speed of the rotating shaft 232, causing the push shaft 234 to extend further, resulting in spatial overlap between the first permanent magnet 236 and the second permanent magnet 223. This causes the cutting blade 221 to rotate under the action of magnetic torque. Thus, by controlling the rotation speed of the rotating shaft 232, the spatial overlap rate between the first permanent magnet 236 and the second permanent magnet 223 can be controlled, thereby controlling the transmission torque.

[0038] When the cutting blade 221 needs to be replaced, the cutting power assembly 40 stops driving the rotating shaft 232 to rotate. At this time, the spring 237 pushes the push shaft 234 to reset, thereby reducing the positive pressure between the second outer conical surface 2351 and the second inner conical surface 2211. At this time, the cutting blade unit 22 can be pulled out from between the two adjacent centering clamping units 23.

[0039] In this embodiment, multiple centering and clamping units 23 are set on the cutting mechanism 600. The second outer conical surface 2351 of the centering head 235 cooperates with the second inner conical surface 2211 of the cutting blade 221 for initial positioning. Then, the centrifugal motion of the centrifugal block 233 is used. The first outer conical surface 2331 of the centrifugal block 233 cooperates with the first inner conical surface 2341 of the push shaft 234, causing the push shaft 234 to slide axially. This allows the centering head 235 to reliably clamp the cutting blade 221. The centering and clamping units 23 center and clamp the conical surface of the cutting blade 221, which facilitates the quick assembly and disassembly of a single blade without the need to assemble and disassemble multiple blades, saving time and improving production efficiency.

[0040] This embodiment controls the transmission torque by controlling the spatial overlap rate between the first permanent magnet 236 and the second permanent magnet 223, so as to adapt to different cutting requirements and make the structure more flexible.

[0041] like Figure 5 and Figure 6 As shown, in some embodiments of the coaxial multi-blade wafer dicing machine described in this embodiment, the two ends of the rotating shaft 232 are rotatably connected to the centering seat 231 via bearings. This arrangement achieves stable rotation of the rotating shaft 232.

[0042] like Figure 3 , Figures 5 to 8 As shown, in some embodiments of the coaxial multi-blade wafer dicing machine described in this embodiment, the outer end face of the push shaft 234 is recessed with a groove 2342; the groove wall of the groove 2342 is circumferentially embedded with a first permanent magnet 236; both ends of the positioning shaft 222 can be inserted into the centering head 235 and then extend into the groove 2342. Through the above configuration, during dicing, by controlling the rotation speed of the rotating shaft 232, the centrifugal block 233 is subjected to different centrifugal forces, thereby controlling the depth of the positioning shaft 222 inserted into the groove 2342, and thus controlling the spatial overlap rate between the first permanent magnet 236 and the second permanent magnet 223. That is, the greater the depth of the positioning shaft 222 inserted into the groove 2342, the greater the torque transmitted between the push shaft 234 and the dicing blade 221, so as to drive the dicing blade 221 to rotate more reliably at high speed to dicing the wafer unit.

[0043] like Figures 5 to 8 As shown, in some embodiments of the coaxial multi-blade wafer dicing machine described in this embodiment, the cross-section of the groove 2342 is polygonal; a first permanent magnet 236 is embedded in the middle of each side of the groove 2342; the cross-sections at both ends of the positioning shaft 222 are polygonal; and a second permanent magnet 223 extending along a parallel axial direction is embedded in the middle of multiple sides of the outer wall of the positioning shaft 222. This arrangement facilitates the positioning and installation of the first permanent magnet 236 and the second permanent magnet 223; the first permanent magnet 236 extends along the axial direction of the parallel push shaft 234. This arrangement controls the spatial overlap rate between the first permanent magnet 236 and the second permanent magnet 223, thereby controlling the magnitude of the transmission torque.

[0044] like Figure 7 and Figure 8As shown, in some embodiments of the coaxial multi-blade wafer dicing machine described in this embodiment, a coil 224 is provided on one side of the outer wall of the positioning shaft 222, and a second permanent magnet 223 is embedded on the other sides; an RFID component 225 electrically connected to the coil 224 is embedded in the shaft hole of the positioning shaft 222. With the above configuration, when the cutting blade 221 is stuck, the resistance torque on the cutting blade 221 exceeds the transmission torque, resulting in a speed difference between the cutting blade 221 and the push shaft 234. This causes the coil 224 to generate an induced current by cutting the magnetic field lines. The RFID component 225, activated by the induced current, transmits a signal to the signal receiving device of the dicing machine. By observing the presence or absence of the induced current, it can be determined whether the cutting blade 221 has experienced an excessive resistance torque. By observing the magnitude of the induced current, it can be determined whether the actual speed difference between the centering clamping unit 23 and the cutting blade 221 is known. The RFID component 225 is an existing RFID unit, such as... Figure 8 As shown, the diagram is for illustrative purposes only.

[0045] like Figure 5 and Figure 6 As shown, in some embodiments of the coaxial multi-blade wafer dicing machine described in this embodiment, the outer wall of the centrifugal block 233 is provided with a guide rod 2332; the guide rod 2332 movably passes through the rotating shaft 232. Through the above arrangement, the guide rod 2332 provides guidance and limitation for the centrifugal block 233, so that the centrifugal block 233 can reliably move radially under centrifugal force, thereby pushing the push shaft 234 to move axially.

[0046] In some embodiments of the coaxial multi-blade wafer dicing machine described in this embodiment, the rotating shaft 232 is provided with a guide groove; the inner end of the push shaft 234 is provided with a guide platform; the guide platform is movably embedded in the guide groove. Through the above arrangement, the rotational freedom of the push shaft 234 relative to the rotating shaft 232 is restricted by the cooperation of the guide groove and the guide platform, so that the push shaft 234 can only slide axially relative to the rotating shaft 232, making the structure more reliable; by using the cooperation of the guide groove and the guide platform to provide guidance and limitation for the push shaft 234, the push shaft 234 can reliably slide along the axial direction.

[0047] like Figure 2 and Figure 3As shown in this embodiment, in some implementations of the coaxial multi-blade wafer dicing machine, the self-centering blade assembly 50 further includes a second support 24; the second support 24 is U-shaped; both ends of the second support 24 are connected to the bottom surface of the first support 21; both ends of the second support 24 are respectively provided with centering holes 241; the second outer conical surface 2351 can penetrate through the centering holes 241; the second support 24 is respectively provided with cutting holes 242 corresponding to the position of each cutting blade 221, and the bottom of the cutting blade 221 penetrates through the cutting holes 242. By setting the second support 24, when the cutting blade unit 22 is installed, the centering heads 235 of the two outermost centering clamping units 23 can be inserted into the centering holes 241, thereby providing a centering support point for the entire self-centering blade assembly 50; by setting the cutting holes 242, the cutting blades 221 can penetrate through the cutting holes 242 to perform cutting operations on the wafer unit.

[0048] like Figure 7 and Figure 8 As shown, in some embodiments of the coaxial multi-blade wafer dicing machine described in this embodiment, a third outer conical surface 2212 is provided at the middle of both sides of the dicing blade 221. This arrangement allows the dicing blade 221 to be more easily embedded between the centering heads 235 of two adjacent centering clamping units 23 using the third outer conical surface 2212.

[0049] like Figure 2 and Figure 3 As shown, in some embodiments of the coaxial multi-blade wafer dicing machine described in this embodiment, the dicing power assembly 40 includes a dicing motor 11, a first synchronous pulley 12, a second synchronous pulley 13, a first synchronous belt 14, and a synchronous belt shaft 15. The first synchronous pulley 12 is connected to the output end of the dicing motor 11. The synchronous belt shaft 15 is rotatably mounted on the sliding seat 30. The second synchronous pulley 13 is sleeved on one end of the synchronous belt shaft 15. The first synchronous belt 14 is wound between the first synchronous pulley 12 and the second synchronous pulley 13. The rotating shaft 232 of each centering clamping unit 23 is connected to the synchronous belt shaft 15 via the second synchronous belt 16. Specifically, the sliding seat 30, the first bracket 21, and each centering seat 231 are provided with through holes for the second synchronous belt 16 to pass through, so that the second synchronous belt 16 is wound around the rotating shaft 232.

[0050] Specifically, after initial positioning is completed, the cutting motor 11 drives the first synchronous pulley 12 to rotate. The first synchronous pulley 12 drives the second synchronous pulley 13 to rotate via the first synchronous belt 14. The second synchronous pulley 13 drives the synchronous belt shaft 15 to rotate. The synchronous belt shaft 15 drives the rotating shaft 232 of each centering clamping unit 23 to rotate via the second synchronous belt 16. Each centrifugal block 233 of the centrifugal shaft moves radially under the action of centrifugal force, making the diameter of the centrifugal shaft larger. At this time, the first outer conical surface 2331 of the centrifugal shaft cooperates with the first outer conical surface 2331 of the push shaft 234, so that during the radial movement of the centrifugal block 233, the push shaft 234 is squeezed to slide axially, causing the spring 237 to be further compressed, thereby causing the centering head 235 to press the second inner conical surface 2211 of the cutting blade 221, achieving final centering clamping and realizing the installation of the cutting blade 221.

[0051] The above description is only a preferred embodiment of the present invention. Therefore, any equivalent changes or modifications made to the structure, features and principles described in the claims of this patent application are included within the protection scope of this patent application.

Claims

1. A coaxial multi-blade wafer dicing machine, characterized in that, Includes a cutting mechanism; the cutting mechanism includes a sliding seat and a cutting power assembly and a self-centering blade assembly disposed on the sliding seat; The self-centering blade assembly includes a first support, multiple cutting blade units, and multiple centering clamping units; the multiple centering clamping units are arranged side by side at intervals on the bottom surface of the first support; Each centering clamping unit includes a centering seat, a rotating shaft rotatably disposed within the centering seat, and multiple centrifugal blocks movably disposed within the rotating shaft; the multiple centrifugal blocks are combined to form a variable-diameter centrifugal shaft; the rotating shaft is connected to the cutting power assembly; both ends of the centrifugal blocks are provided with a first outer conical surface; both ends of the rotating shaft are provided with a push shaft and a centering head movably disposed along the axial direction; the inner end of the push shaft is provided with a first inner conical surface adapted to the first outer conical surface; the outer end of the push shaft is provided with a first permanent magnet; the centering head is coaxially sleeved on the outer wall of the push shaft, and a spring is provided between its inner end and the push shaft; the outer end of the centering head is provided with a second outer conical surface; Each cutting unit includes a cutting blade and a positioning shaft disposed in the central hole of the cutting blade; the cutting blade has a second inner conical surface adapted to the second outer conical surface at the periphery of its central hole; the outer wall of the positioning shaft is provided with a second permanent magnet along the circumferential direction; The outer end face of the push shaft is recessed with a groove; the groove wall is embedded with a first permanent magnet in the circumferential direction; both ends of the positioning shaft can be inserted into the centering head and then movably extended into the groove. The groove has a polygonal cross-section; a first permanent magnet is embedded in the middle of each side of the groove; the two ends of the positioning shaft have polygonal cross-sections; a second permanent magnet extending along a parallel axis is embedded in the middle of multiple sides of the outer wall of the positioning shaft. A coil is provided on one side of the outer wall of the positioning shaft, and a second permanent magnet is embedded on the other sides; an RFID component electrically connected to the coil is embedded in the shaft hole of the positioning shaft. The outer wall of the centrifugal block is provided with a guide rod; the guide rod movably passes through the rotating shaft. The rotating shaft is provided with a guide groove; the inner end of the push shaft is provided with a guide platform; the guide platform is movably embedded in the guide groove; The self-centering blade assembly also includes a second support; the two ends of the second support are connected to the bottom surface of the first support; the two ends of the second support are respectively provided with centering holes; the second outer conical surface can penetrate the centering holes; the second support is provided with cutting holes corresponding to the position of each cutting blade, and the bottom of the cutting blade penetrates through the cutting holes; The cutting blade has a third outer conical surface in the middle of both sides.

2. The coaxial multi-blade wafer dicing machine according to claim 1, characterized in that, The cutting power assembly includes a cutting motor, a first synchronous pulley, a second synchronous pulley, a first synchronous belt, and a synchronous belt shaft; the first synchronous pulley is connected to the output end of the cutting motor; the synchronous belt shaft is rotatably mounted on a sliding seat; the second synchronous pulley is sleeved on one end of the synchronous belt shaft; the first synchronous belt is wound between the first synchronous pulley and the second synchronous pulley; the rotation shaft of each centering clamping unit is connected to the synchronous belt shaft via the second synchronous belt.

3. A coaxial multi-blade wafer dicing machine according to any one of claims 1 to 2, characterized in that, The cutting machine further includes a machine base, a support platform, a first slide, a second slide, and a third slide; the first slide is located on the horizontal arm of the machine base; the support platform is located at the output end of the first slide; the second slide is located on the vertical arm of the machine base; the third slide is located at the output end of the second slide; the cutting mechanism is located at the output end of the third slide; the support platform includes a turntable and a vacuum suction cup located on the turntable.

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