Photoelectric conversion device

By adopting a combined structure of a photoelectric conversion module, a device carrier, a rubber material and a coating film in the photoelectric conversion device, a sealed subspace is formed, which solves the problem of heat dissipation liquid infiltration, improves the operating efficiency and life of the device, and ensures the stability of signal transmission.

CN120821028APending Publication Date: 2025-10-21FORMERICA OPTOELECTRONICS
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Patent Information

Application Number
CN202510457850.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2024-04-12
Filing Date
2025-04-11
Publication Date
2025-10-21

AI Technical Summary

Technical Problem

Existing photoelectric conversion devices are easily infiltrated by heat dissipation liquids, affecting signal transmission, resulting in reduced device performance and shortened lifespan.

Method used

A combined structure of a photoelectric conversion module, a device carrier, a rubber compound and a coating film is used to form a sealed subspace to prevent heat dissipation liquid from penetrating into the photoelectric conversion module processing part, and heat management is performed through a cooling component.

Benefits of technology

It effectively prevents the infiltration of heat dissipation liquid, improves the operating efficiency and life of the photoelectric conversion equipment, and ensures the stability and reliability of signal transmission.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The invention provides photoelectric conversion equipment, which comprises a photoelectric conversion module and a coating film, the photoelectric conversion module comprises a photoelectric conversion module processing part, and the coating film coats the photoelectric conversion module processing part so as to provide a sealed execution environment for the photoelectric conversion module processing part. Therefore, when the photoelectric conversion equipment operates in heat dissipation liquid, the coating film can prevent the heat dissipation liquid from permeating into the photoelectric conversion equipment to influence the photoelectric conversion of the photoelectric conversion module, so that the operation efficiency of the photoelectric conversion equipment is effectively improved, and the service life of the photoelectric conversion equipment is effectively prolonged.
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Description

Technical Field

[0001] The present application relates to an optical fiber communication device, and more specifically, to a photoelectric conversion device capable of preventing heat dissipation liquid from penetrating and affecting operation. Background Art

[0002] With the rapid development of network technology, fiber-optic communication has gradually replaced conventional electrical communication technologies due to its numerous advantages, including high transmission speeds, long transmission distances, immunity to electromagnetic interference, and high security. Consequently, fiber-optic communication has become a major modern communication technology, widely used for information communication between various fiber-optic network devices.

[0003] In the fiber-optic communications industry, fiber-optic network equipment often incorporates optoelectronic conversion devices. These devices perform optoelectronic conversion on transmitted signals, converting electrical signals into optical signals and vice versa, enabling high-capacity and high-speed signal transmission. It should be noted that common optoelectronic conversion devices include the SFP series (Small Form-Factor Pluggable), the QSFP series (Quad Small Form-Factor Pluggable), the QSFP-DD series (Quad Small Form-Factor Pluggable Double Density), and the OSFP series (Octal Small Form-Factor Pluggable).

[0004] In addition, since fiber optic network equipment usually operates continuously for a long period of time, the operating temperature of the fiber optic network equipment is easily increased and needs to be cooled. In order to dissipate the heat of the fiber optic network equipment, the fiber optic network equipment is usually immersed in a high thermal conductivity cooling liquid. The fiber optic network equipment is allowed to operate in a liquid cooling environment. The heat generated by the operation of the fiber optic network equipment is quickly dissipated through the cooling liquid, thereby improving the performance and life of the fiber optic network equipment.

[0005] However, if the optical fiber network device is immersed in the heat dissipation liquid, the optoelectronic conversion device used with the optical fiber network device also needs to be immersed in the heat dissipation liquid. Therefore, if the optoelectronic conversion device has poor waterproof performance, the heat dissipation liquid can easily penetrate into the optoelectronic conversion device and affect signal transmission.

[0006] In view of this, how to improve the waterproofness of the photoelectric conversion device and prevent the heat dissipation liquid from seeping into the photoelectric conversion device has become an urgent problem to be solved by those skilled in the art. Summary of the Invention

[0007] In view of the various problems of the prior art described above, the main purpose of the present application is to provide a photoelectric conversion device that can dissipate heat through a heat dissipation liquid while preventing the heat dissipation liquid from seeping into the photoelectric conversion device.

[0008] To achieve the above-mentioned purpose and other purposes, the present application provides a photoelectric conversion device that can be used to transmit a signal, and the photoelectric conversion device includes: a photoelectric conversion module, the photoelectric conversion module includes a photoelectric conversion module processing part, and the photoelectric conversion module processing part can perform photoelectric conversion processing on the signal; a device carrier, the device carrier includes a carrier internal space, the device carrier provides support for the photoelectric conversion module, and allows the photoelectric conversion module processing part to be accommodated in the carrier internal space; a glue, the glue is filled into the carrier internal space to form a sealed subspace in the carrier internal space, and the photoelectric conversion module processing part is located in the sealed subspace, and the sealed subspace provides a sealed execution environment for the photoelectric conversion module processing part; and a covering film, the covering film covers the photoelectric conversion module processing part in the carrier internal space to separate the glue and the photoelectric conversion module processing part.

[0009] Preferably, the photoelectric conversion device of the present application further includes a first cooling component, which is located in the sealed sub-space and contacts the photoelectric conversion module processing part to absorb heat and cool the photoelectric conversion module processing part; and the covering film also covers the first cooling component to separate the glue and the first cooling component.

[0010] Preferably, in the photoelectric conversion device of the present application, the first cooling component is a water block and includes a first cooling component water channel, and the first cooling component water channel can provide a flow of cooling liquid to cool the photoelectric conversion module processing part.

[0011] Preferably, in the photoelectric conversion device of the present application, the device carrier includes a frame-shaped or U-shaped cross-section.

[0012] Preferably, in the photoelectric conversion device of the present application, the first cooling component is a heat-conducting metal component.

[0013] Preferably, the photoelectric conversion device of the present application further includes a device cover, wherein the device cover covers the device carrier so that the adhesive is located in the inner space of the signal carrier.

[0014] Preferably, the photoelectric conversion device of the present application further includes a second cooling component, which is located in the internal space of the carrier. One end of the second cooling component passes through the covering film and contacts the photoelectric conversion module processing part to absorb heat from the photoelectric conversion module processing part, and the other end of the second cooling component passes through the glue and contacts the device cover to conduct the absorbed heat to the outside through the device cover, thereby achieving cooling of the photoelectric conversion module processing part.

[0015] Preferably, in the photoelectric conversion device of the present application, the device carrier contacts the device cover to absorb heat and cool the device cover.

[0016] Preferably, in the photoelectric conversion device of the present application, the device carrier is a heat-conducting metal carrier; the second cooling member is a heat-conducting metal member; and the device cover is a heat-conducting metal cover.

[0017] Preferably, the photoelectric conversion device of the present application further includes a signal optical cable, which passes through the adhesive and the covering film and is connected to the photoelectric conversion module processing part to transmit the signal.

[0018] Preferably, the optoelectronic conversion device of the present application can be used in conjunction with an optical fiber network device, wherein the optoelectronic conversion module also includes a optoelectronic conversion module docking portion, the device carrier includes a carrier docking port, the optoelectronic conversion module docking portion is located at the carrier docking port to provide docking with the optical fiber network device, and the optoelectronic conversion device also includes a stopper, the stopper is located between the internal space of the carrier and the carrier docking port to stop the rubber from entering the carrier docking port from the internal space of the carrier.

[0019] Preferably, in the photoelectric conversion device of the present application, the stopper and the device carrier are formed as one body.

[0020] In addition, the present application also provides a photoelectric conversion device that can be used to transmit a signal. The photoelectric conversion device includes: a photoelectric conversion module, the photoelectric conversion module includes a photoelectric conversion module processing part, and the photoelectric conversion module processing part can perform photoelectric conversion processing on the signal; and a covering film, the covering film covers the photoelectric conversion module processing part to form a sealed subspace, and the photoelectric conversion module processing part is located in the sealed subspace, and the sealed subspace provides a sealed execution environment for the photoelectric conversion module processing part.

[0021] Compared with the previous technology, the photoelectric conversion device of the present application includes a photoelectric conversion module and a covering film. The photoelectric conversion module includes a photoelectric conversion module processing part. The covering film covers the photoelectric conversion module processing part to provide a sealed execution environment for the photoelectric conversion module processing part. In this way, when the photoelectric conversion device is operated in a heat dissipation liquid, the covering film can prevent the heat dissipation liquid from penetrating into the photoelectric conversion module processing part and affecting the photoelectric conversion of the photoelectric conversion module, thereby effectively improving the operating efficiency and life of the photoelectric conversion device. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The drawings of this application will be combined with the description of the following embodiments to make the features and other advantages of this application more clearly understood.

[0023] Figure 1 A schematic diagram showing the state of the photoelectric conversion device of the present application immersed in a heat dissipation liquid;

[0024] Figure 2 A perspective schematic diagram showing some components of the photoelectric conversion device of the present application at a first viewing angle in one embodiment;

[0025] Figure 3 A perspective schematic diagram showing some components of the photoelectric conversion device of the present application at a second viewing angle in one embodiment;

[0026] Figure 4 A schematic diagram showing a state where some components of the photoelectric conversion device of the present application are immersed in a heat dissipation liquid;

[0027] Figure 5 A schematic diagram showing a state where some components of the photoelectric conversion device of the present application are immersed in a heat dissipation liquid;

[0028] Figure 6 A schematic diagram showing a state where some components of the photoelectric conversion device of the present application are immersed in a heat dissipation liquid;

[0029] Figure 7 A cross-sectional schematic diagram showing some components of the photoelectric conversion device of the present application in one embodiment.

[0030] Figure 8 A cross-sectional schematic diagram showing some components of the photoelectric conversion device of the present application in one embodiment.

[0031] Component number description

[0032] 1 Photoelectric conversion equipment

[0033] 11 Photoelectric conversion module

[0034] 111 Photoelectric conversion module processing part

[0035] 112 Photoelectric conversion module docking position

[0036] 12 Equipment carriers

[0037] S12 Carrier Internal Space

[0038] S121 Sealed Subspace

[0039] P121 Carrier Docking Port

[0040] 13 Rubber

[0041] 14 Coating film

[0042] 15. First cooling member

[0043] 151 First cooling component water channel

[0044] 16 Equipment cover

[0045] 17 Second cooling member

[0046] 18 signal optical cable

[0047] 19 stop body

[0048] 2 Fiber optic network equipment

[0049] L Cooling liquid DETAILED DESCRIPTION

[0050] The following content will be accompanied by drawings and illustrate the technical content of this application through specific embodiments. Those familiar with this technology can easily understand the other advantages and functions of this application from the content disclosed in this specification. This application can be implemented or applied through other different specific embodiments. The details in this specification can be modified and changed in various ways based on different viewpoints and applications without departing from the spirit of this application. In particular, the proportional relationships and relative positions of the various components in the drawings are for illustrative purposes only and do not represent the actual situation of the implementation of this application.

[0051] In addition, it should be noted that in order to make the disclosed content more concise and easier to understand, the components with the same or similar functions in the following embodiments will be described using the same symbols, and the description of the same or equivalent features will be omitted.

[0052] The present application provides a photoelectric conversion device, which can be set in a fiber optic network device and can operate in a heat dissipation liquid with the fiber optic network device. The photoelectric conversion device includes a photoelectric conversion module and a covering film, wherein the photoelectric conversion module includes a photoelectric conversion module processing part, and the covering film covers the photoelectric conversion module processing part to provide a sealed execution environment for the photoelectric conversion module processing part. In this way, when the photoelectric conversion device operates in a heat dissipation liquid, the heat dissipation liquid can be prevented from penetrating the photoelectric conversion module processing part and affecting the operation of the photoelectric conversion module.

[0053] For the description of the embodiments disclosed in this application, please refer to Figures 1 to 8 .

[0054] At Figures 1 to 8 In the embodiment shown, a photoelectric conversion device 1 is provided, which can be used to transmit a signal, and the photoelectric conversion device 1 can be used with an optical fiber network device 2. The photoelectric conversion device 1 includes: a photoelectric conversion module 11, a device carrier 12, a glue 13, a covering film 14, a device cover 16 and a signal optical cable 18.

[0055] It should be noted that the optical fiber network device 2 can be immersed in a heat dissipation liquid L with high thermal conductivity, allowing the optical fiber network device 2 to operate in a liquid heat dissipation environment. Heat generated by the operation of the optical fiber network device 2 can be quickly dissipated through the heat dissipation liquid, thereby improving the performance and lifespan of the optical fiber network device 2. Accordingly, the photoelectric conversion device 1 can be immersed in the heat dissipation liquid L along with the optical fiber network device 2.

[0056] The photoelectric conversion module 11 includes a photoelectric conversion module processing portion 111 and a photoelectric conversion module interface portion 112. The photoelectric conversion module processing portion 111 is capable of performing photoelectric conversion processing on the signal, where photoelectric conversion processing refers to converting an electrical signal into an optical signal, or vice versa. The photoelectric conversion module interface portion 112 is capable of interfacing with the optical network device 2 to transmit the signal to the optical network device 2.

[0057] Regarding the equipment carrier 12, the equipment carrier 12 includes a carrier internal space S12 and a carrier docking port P121. The equipment carrier 12 is provided to carry the photoelectric conversion module 11, so that the photoelectric conversion module processing part 111 is accommodated in the carrier internal space S12, and the photoelectric conversion module docking part 112 is located at the carrier docking port P121 to provide docking with the optical fiber network device 2. Figure 5As shown, the device carrier 12 includes a frame-shaped cross section that can form the carrier internal space S12. However, this is not limited to this. For example, Figure 4 As shown, the device carrier 12 includes a U-shaped cross-section capable of forming the carrier internal space S12.

[0058] The adhesive 13 fills the carrier's internal space S12 to form a sealed subspace S121 within the carrier's internal space S12. The photoelectric conversion module processing unit 111 is located within the sealed subspace S121, providing a sealed operating environment for the photoelectric conversion module processing unit 111. Therefore, if the photoelectric conversion device 1 along with the optical fiber network device 2 is immersed in the heat dissipation liquid L, the adhesive 13 prevents the heat dissipation liquid L from seeping into the sealed subspace S121, thereby improving the waterproof performance of the photoelectric conversion device 1.

[0059] It should be noted that in the above embodiment, the adhesive 13 can be, but is not limited to, epoxy resin (EPOXY). Furthermore, the photoelectric conversion module 11 can perform photoelectric conversion processing within the sealed subspace S121. Thus, when the photoelectric conversion device 1 is immersed in the heat dissipation liquid L and operates, the heat dissipation liquid L is prevented from seeping in and affecting the photoelectric conversion processing of the photoelectric conversion module 11, thereby effectively improving the operating efficiency and lifespan of the photoelectric conversion device 1.

[0060] At Figures 2 to 3 In the illustrated embodiment, the photoelectric conversion device 1 further includes a stopper 19 located between the carrier interior space S12 and the carrier docking port P121 to prevent the adhesive 13 from entering the carrier docking port P121 from the carrier interior space S12. It should be noted that the stopper 19 and the device carrier 12 can be formed integrally or separately.

[0061] Regarding the covering film 14, the covering film 14 covers the photoelectric conversion module processing part 111 in the internal space S12 of the carrier to separate the adhesive 13 from the photoelectric conversion module processing part 111. Therefore, the covering film 14 can prevent the adhesive 13 from adhering to the photoelectric conversion module processing part 111, thereby preventing the adhesive 13 from affecting the photoelectric conversion module processing part 111.

[0062] It should be noted that Figure 6In the illustrated embodiment, the adhesive 13 can be omitted, and the coating 14 can alternatively cover the photoelectric conversion module processing portion 111 to form a sealed subspace S121. The photoelectric conversion module processing portion 111 is located within the sealed subspace S121, which provides a sealed operating environment for the photoelectric conversion module processing portion 111. Therefore, if the photoelectric conversion device 1 along with the optical fiber network device 2 is immersed in the heat dissipation liquid L, the coating 14 can prevent the heat dissipation liquid L from seeping into the sealed subspace S121, thereby improving the waterproof performance of the photoelectric conversion device 1.

[0063] Regarding the device cover 16, the device cover 16 covers the device carrier 12. In the above embodiment, the device cover 16 can limit the position of the adhesive 13 to shield the internal space S12 of the signal carrier, and allow the adhesive 13 to be located in the internal space S12 of the signal carrier to meet the aesthetic requirements.

[0064] Regarding the signal optical cable 18, it can pass through the adhesive 13 and the coating 14 and connect to the photoelectric conversion module processing portion 111 to transmit the signal. It should be noted that the signal optical cable 18 includes a signal optical fiber (fiber core), which can be made of glass or plastic to transmit the signal.

[0065] At Figure 8 In the illustrated embodiment, the photoelectric conversion device 1 further includes a first cooling member 15. The first cooling member 15 is located in the sealed subspace S121 and contacts the photoelectric conversion module processing portion 111 to absorb heat from the photoelectric conversion module processing portion 111, thereby cooling the photoelectric conversion module processing portion 111. Accordingly, the covering film 14 can also cover the first cooling member 15 to separate the adhesive 13 from the first cooling member 15, thereby preventing the adhesive 13 from adhering to the first cooling member 15.

[0066] Preferably, the first cooling member 15 can be a heat-conducting metal member to conduct heat away from the photoelectric conversion module processing portion 111. Furthermore, the first cooling member 15 can be a water block including a first cooling member water channel 151. The first cooling member water channel 151 can provide a coolant flow to conduct heat away from the photoelectric conversion module processing portion 111, thereby cooling the photoelectric conversion module processing portion 111.

[0067] At Figure 7In the embodiment shown, the photoelectric conversion device 1 also includes a second cooling member 17, which is located in the internal space S12 of the carrier. One end of the second cooling member 17 passes through the coating film 14 and contacts the photoelectric conversion module processing part 111 to absorb heat from the photoelectric conversion module processing part 111, and the other end of the second cooling member 17 passes through the adhesive 13 and contacts the device cover 16 to conduct the heat absorbed from the photoelectric conversion module processing part 111 to the outside through the device cover 16, thereby achieving cooling of the photoelectric conversion module processing part 111.

[0068] Preferably, the device carrier 12 can be a heat-conducting metal carrier capable of conducting heat. The second cooling member 17 can be a heat-conducting metal member capable of conducting heat. The device cover 16 can be a heat-conducting metal cover capable of conducting heat. The device carrier 12 can optionally contact the device cover 16 to absorb heat from the photoelectric conversion module processing portion 111, thereby cooling the device cover 16 and accelerating the cooling of the photoelectric conversion module processing portion 111.

[0069] It should be noted that the photoelectric conversion device of the present application can also omit some components or structures and is not limited to the above embodiments.

[0070] For example, the photoelectric conversion device of the present application may optionally include: a photoelectric conversion module, a device carrier, a plastic material, and a coating film. The photoelectric conversion module includes a photoelectric conversion module processing portion, which is capable of performing photoelectric conversion processing on a signal; the device carrier includes an internal space for the carrier, which supports the photoelectric conversion module and accommodates the photoelectric conversion module processing portion within the internal space; the plastic material is filled into the internal space of the carrier to form a sealed subspace within the internal space of the carrier, and the photoelectric conversion module processing portion is located within the sealed subspace, which provides a sealed execution environment for the photoelectric conversion module processing portion; the coating film covers the photoelectric conversion module processing portion within the internal space of the carrier to separate the plastic material from the photoelectric conversion module processing portion.

[0071] In addition, the photoelectric conversion device of the present application can optionally include a photoelectric conversion module and a covering film. The photoelectric conversion module includes a photoelectric conversion module processing portion, which is capable of performing photoelectric conversion processing on signals. The covering film covers the photoelectric conversion module processing portion to form a sealed subspace, and the photoelectric conversion module processing portion is located in the sealed subspace, providing a sealed execution environment for the photoelectric conversion module processing portion.

[0072] In summary, the present application provides a photoelectric conversion device, which can operate in a heat dissipation liquid. The photoelectric conversion device includes: a photoelectric conversion module and a covering film, wherein the photoelectric conversion module includes a photoelectric conversion module processing part, and the covering film covers the photoelectric conversion module processing part to provide a sealed execution environment for the photoelectric conversion module processing part. In this way, when the photoelectric conversion device operates in the liquid heat dissipation environment, it can prevent the heat dissipation liquid from penetrating into the photoelectric conversion module processing part and affecting the operation of the photoelectric conversion module, thereby improving the performance and life of the photoelectric conversion device.

[0073] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Anyone skilled in the art will be able to modify and alter the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application shall be as set forth in the claims of this application.

Claims

1. A photoelectric conversion device, characterized in that: Capable of transmitting a signal, the photoelectric conversion device comprises: a photoelectric conversion module, the photoelectric conversion module including a photoelectric conversion module processing portion, the photoelectric conversion module processing portion being capable of performing photoelectric conversion processing on the signal; An equipment carrier, the equipment carrier comprising an internal space, the equipment carrier being provided to carry the photoelectric conversion module, and the photoelectric conversion module processing portion being accommodated in the internal space; a glue material, wherein the glue material is filled into the inner space of the carrier to form a sealed subspace in the inner space of the carrier, and the photoelectric conversion module processing part is located in the sealed subspace, and the sealed subspace provides a sealed execution environment for the photoelectric conversion module processing part; and A covering film covers the photoelectric conversion module processing portion in the inner space of the carrier to separate the adhesive from the photoelectric conversion module processing portion.

2. The photoelectric conversion device according to claim 1, wherein: It also includes a first cooling component, which is located in the sealed subspace and contacts the photoelectric conversion module processing part to absorb heat and cool the photoelectric conversion module processing part; and the covering film also covers the first cooling component to separate the glue and the first cooling component.

3. The photoelectric conversion device according to claim 2, wherein: The first cooling member is a water-cooled head and includes a first cooling member water channel. The first cooling member water channel can provide cooling liquid flow to cool the photoelectric conversion module processing part.

4. The photoelectric conversion device according to claim 2, wherein: The equipment carrier includes a frame-shaped or U-shaped cross section.

5. The photoelectric conversion device according to claim 2, wherein: The first cooling member is a heat-conducting metal member.

6. The photoelectric conversion device according to claim 1, wherein: The device further comprises a device cover, which covers the device carrier so that the adhesive is located in the inner space of the signal carrier.

7. The photoelectric conversion device according to claim 6, wherein: It also includes a second cooling component, which is located in the internal space of the carrier. One end of the second cooling component passes through the covering film and contacts the photoelectric conversion module processing part to absorb heat from the photoelectric conversion module processing part, and the other end of the second cooling component passes through the glue and contacts the equipment cover to conduct the absorbed heat to the outside through the equipment cover, thereby achieving cooling of the photoelectric conversion module processing part.

8. The photoelectric conversion device according to claim 7, wherein: The device carrier contacts the device cover to absorb heat and cool the device cover.

9. The photoelectric conversion device according to claim 7, wherein: The device carrier is a heat-conducting metal carrier; the second cooling member is a heat-conducting metal member; and the device cover is a heat-conducting metal cover.

10. The photoelectric conversion device according to claim 1, wherein: It also includes a signal optical cable, which passes through the adhesive and the covering film and is connected to the photoelectric conversion module processing part to transmit the signal.

11. The photoelectric conversion device according to claim 1, wherein: It can be used with an optical fiber network device. The photoelectric conversion module also includes a photoelectric conversion module docking part. The equipment carrier includes a carrier docking port. The photoelectric conversion module docking part is located at the carrier docking port to provide docking with the optical fiber network device. The photoelectric conversion device also includes a stopper. The stopper is located between the internal space of the carrier and the carrier docking port to stop the rubber from entering the carrier docking port from the internal space of the carrier.

12. The photoelectric conversion device according to claim 11, wherein: The stopper and the equipment carrier are formed as one body.

13. A photoelectric conversion device, characterized in that: Capable of transmitting a signal, the photoelectric conversion device comprises: a photoelectric conversion module, the photoelectric conversion module including a photoelectric conversion module processing portion, the photoelectric conversion module processing portion being capable of performing photoelectric conversion processing on the signal; and A covering film covers the photoelectric conversion module processing part to form a sealed subspace, and the photoelectric conversion module processing part is located in the sealed subspace, and the sealed subspace provides a sealed execution environment for the photoelectric conversion module processing part.