Low-crosstalk optical module and assembling method thereof

Abstract

The invention relates to the technical field of optical modules, in particular to a low-crosstalk optical module and an assembling method thereof, and the low-crosstalk optical module comprises a housing, a circuit board, a first protection cover and a second protection cover. The circuit board is fixed in the shell, a light emitting assembly and a light receiving assembly are arranged on the circuit board, the light emitting assembly is covered with the first protective cover, and the light receiving assembly is covered with the second protective cover. The first protective cover is arranged outside the light emitting assembly in a covering mode, the second protective cover is arranged outside the light receiving assembly in a covering mode, and therefore the problems of optical crosstalk and electromagnetic wave crosstalk between the light emitting assembly and the light receiving assembly can be avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of optical modules, and in particular to a low-crosstalk optical module and an assembling method thereof. Background Art

[0002] As a core component of optical communication systems, the performance of optical modules directly impacts the stability and transmission efficiency of the entire communication network. As optical communication technology advances toward higher speeds and higher-density integration, the internal structure of optical modules is becoming increasingly compact. However, the resulting technical challenges are also becoming increasingly prominent, primarily in the following two areas.

[0003] First, there's the issue of crosstalk between the optical transmitter and receiver components within an optical module. In traditional optical module designs, these components are typically housed within the same cavity, with signal transmission achieved through optical components and circuit boards. However, as transmission rates increase (e.g., 100Gbps and above), the high-frequency electromagnetic waves generated by the optical transmitter can couple to the sensitive circuits of the receiver component through spatial radiation, causing electromagnetic crosstalk and reducing receiver sensitivity.

[0004] Secondly, there are reliability issues caused by the unsealed internal structure of optical modules. To meet heat dissipation requirements, most optical modules use open or semi-sealed designs, leaving internal optical components (such as lasers and detectors) and circuitry directly exposed to the environment. However, in complex application scenarios such as data centers and industrial sites, tiny particles such as dust, smoke, and oil in the air can easily infiltrate the module through the module interfaces or gaps in the casing. These particles can deposit on optical surfaces (such as lens end faces and fiber connectors) and cause light scattering or absorption, resulting in increased insertion loss and signal attenuation. If they adhere to circuit boards or connectors, they can also cause short circuits or poor contact, seriously threatening the long-term reliability of the module.

[0005] Therefore, existing optical modules have problems such as crosstalk between the optical transmitting component and the optical receiving component, and insufficient sealing of the optical module, which affects the reliability of the optical module.

[0006] In view of this, overcoming the defects of the prior art is an urgent problem to be solved in this technical field. Summary of the Invention

[0007] Technical Problem to be Solved by the Embodiments of the Present Invention: Existing optical modules have the problem of crosstalk between optical transmitting components and optical receiving components.

[0008] The embodiment of the present invention adopts the following technical solutions: On the one hand, a low-crosstalk optical module is provided, including: a shell 1, a circuit board 2, a first protective cover 3 and a second protective cover 4; the circuit board 2 is fixed in the shell 1, and an optical transmitting component 20 and an optical receiving component 21 are provided on the circuit board 2, the first protective cover 3 is provided on the optical transmitting component 20, and the second protective cover 4 is provided on the optical receiving component 21.

[0009] Furthermore, one or more first conductive structures 22 and one or more second conductive structures 23 are provided on the circuit board 2. The first conductive structure 22 is provided close to the optical emitting component 20, and the second conductive structure 23 is provided close to the optical receiving component 21. The first protective cover 3 is connected to the ground signal on the circuit board 2 through the first conductive structure 22, and the second protective cover 4 is connected to the ground signal on the circuit board 2 through the second conductive structure 23.

[0010] Furthermore, one or more first conductive pins 30 are provided on the first protective cover 3 , and the first conductive pins 30 are electrically connected to the first conductive structure 22 ; one or more second conductive pins 40 are provided on the second protective cover 4 , and the second conductive pins 40 are electrically connected to the second conductive structure 23 .

[0011] Furthermore, a window 24 is provided on the circuit board 2 for the optical emitting assembly 20 to pass through, and a first bayonet 241 and a second bayonet 242 are respectively provided at two corners of the window 24 corresponding to the light outlet side of the optical emitting assembly 20, and a third bayonet 243 is provided at the corner of the window 24 closest to the optical receiving assembly 21; a first clamping pin 321 and a second clamping pin 322 extend downward from the two corners of the front end of the first protective cover 3, the first clamping pin 321 is inserted into the first bayonet 241, and the second clamping pin 322 is inserted into the second bayonet 242, and a third clamping pin 323 is provided on the side of the first protective cover 3 adjacent to the optical receiving assembly 21; The third latching opening 243 is used to support the third latching pin 323 and the fourth latching pin 421 on the second protective cover 4 .

[0012] Furthermore, when the third clamping pin 323 and the fourth clamping pin 421 are simultaneously inserted into the third clamping opening 243 , the third clamping pin 323 generates abutting force on the fourth clamping pin 421 .

[0013] Furthermore, a fifth pin 422 is provided on the second protective cover 4 near the edge of the circuit board 2, wherein the fifth pin 422 and the fourth pin 421 are respectively located at opposite ends of the opposite side; wherein the edge of the circuit board 2 is made with a first locking notch 251 adapted to the fifth pin 422.

[0014] Furthermore, a sixth clamping pin 423 is provided at the other end on the same side as the fifth clamping pin 422 ; wherein a second locking notch 252 adapted to the fifth clamping pin 422 is made on the edge of the circuit board 2 .

[0015] Furthermore, the fourth clamping pin 421 and the sixth clamping pin 423 are provided with buckle edges 424 , and the buckle edges 424 enable the fourth clamping pin 421 and the sixth clamping pin 423 to partially buckle the back surface of the circuit board 2 .

[0016] Furthermore, one or more inner walls of the first bayonet 241 , the second bayonet 242 , the third bayonet 243 , the first locking notch 251 and the second locking notch 252 are provided with a conductive structure for establishing a ground signal with the first protective cover 3 and the second protective cover 4 .

[0017] Furthermore, a sealing assembly 10 is provided inside the housing 1 , and the sealing assembly 10 is used to seal gaps between structures so that a closed cavity is formed inside the housing 1 .

[0018] Furthermore, the housing 1 includes a cover plate 11 and a base 12, and the sealing assembly 10 includes one or more conductive rubber strips 100; the conductive rubber strips 100 are arranged between the cover plate 11 and the base 12, and the conductive rubber strips 100 are used to seal the gap between the cover plate 11 and the base 12; And / or, the housing 1 is provided with an adapter 5, the sealing assembly 10 includes a first rubber pad 101, the first rubber pad 101 is sleeved on the adapter 5, and the first rubber pad 101 is used to seal the gap between the adapter 5 and the housing 1; And / or, the sealing assembly 10 includes a second rubber pad 102, which is arranged near the tail of the shell 1 and the second rubber pad 102 is arranged on the surface of the circuit board 2, and the second rubber pad 102 is used to seal the gap between the circuit board 2 and the shell 1.

[0019] Furthermore, the shell 1 includes a cover 11 and a base 12, the rear portion of the cover 11 is provided with a first strip groove 112, the rear portion of the base 12 is provided with a second strip groove 122, and the first strip groove 112 and the second strip groove 122 are respectively provided with a second rubber pad 102.

[0020] Furthermore, the first protective cover 3 and the second protective cover 4 are made of metal; the first protective cover 3 and the second protective cover 4 are made by sheet metal stretching process; Alternatively, the first protective cover 3 and the second protective cover 4 are made of plastic, and the surfaces thereof are coated with a metal layer.

[0021] In a second aspect, a method for assembling a low-crosstalk optical module is provided, which is applicable to the low-crosstalk optical module and includes: Align the fifth and sixth clamping legs 422 and 423 with the first and second locking notches 251 and 252, respectively. Snap the buckled edge 424 of the fifth and sixth clamping legs 422 onto the back of the circuit board 2, and snap the buckled edge 424 of the sixth and fourth clamping legs 423 onto the back of the circuit board 2. Insert the fourth clamping leg 421 into the third clamping slot 243. Insert the first clamping pin 321 , the second clamping pin 322 , and the third clamping pin 323 into the first clamping slot 241 , the second clamping slot 242 , and the third clamping slot 243 , respectively, wherein the third clamping pin 323 generates abutting force on the fourth clamping pin 421 ; The assembled circuit board 2 is placed in the housing 1 .

[0022] Compared with the prior art, the beneficial effects of the embodiments of the present invention are as follows: by providing a first protective cover 3 on the outside of the optical emitting component 20 and a second protective cover 4 on the outside of the optical receiving component 21, the optical crosstalk and electromagnetic wave crosstalk problems between the optical emitting component 20 and the optical receiving component 21 can be avoided; at the same time, the optical elements, optical paths, bonding gold wires, etc. inside the optical emitting component 20 and the optical receiving component 21 are physically protected to prevent smoke or particulate matter from entering and then contaminating the optical end face and affecting the optical path signal. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 is a connection relationship diagram of an optical communication system provided by an embodiment of the present invention; Figure 2 This is a schematic structural diagram of an optical module provided by an embodiment of the present invention; Figure 3 Schematic diagram of the overall structure of a low-crosstalk optical module provided by an embodiment of the present invention; Figure 4 This is an exploded view of a low-crosstalk optical module provided by an embodiment of the present invention; Figure 5 This is a schematic structural diagram of a circuit board provided by an embodiment of the present invention; Figure 6This is a schematic structural diagram of a first protective cover provided by an embodiment of the present invention; Figure 7 This is a schematic structural diagram of a second protective cover provided by an embodiment of the present invention; Figure 8 This is a structural schematic diagram of a circuit board provided with a protective cover according to an embodiment of the present invention; Figure 9 1 is a schematic structural diagram of a base of a low-crosstalk optical module provided by an embodiment of the present invention; Figure 10 This is a structural diagram of a first installation position of a low-crosstalk optical module provided by an embodiment of the present invention; Figure 11 This is a schematic structural diagram of a first sink of a low-crosstalk optical module provided by an embodiment of the present invention; Figure 12 1 is a structural schematic diagram of a cover plate of a low-crosstalk optical module provided by an embodiment of the present invention; Figure 13 1 is a schematic diagram of an adapter for a low-crosstalk optical module provided by an embodiment of the present invention; Figure 14 This is a schematic structural diagram of another circuit board provided by an embodiment of the present invention; Figure 15 is a schematic structural diagram of another first protective cover provided by an embodiment of the present invention; Figure 16 is a schematic structural diagram of another second protective cover provided by an embodiment of the present invention; Figure 17 This is a schematic structural diagram of another circuit board provided with a protective cover according to an embodiment of the present invention; Figure 18 The embodiment of the present invention provides Figure 17 Schematic diagram of the cross-sectional structure along the A-A' direction; Figure 19 This is a schematic structural diagram of another second protective cover provided by an embodiment of the present invention; Figure 20 This is a schematic structural diagram of another circuit board provided by an embodiment of the present invention; Figure 21 1 is a schematic structural diagram of another second protective cover provided by an embodiment of the present invention; Figure 22 The figure is a schematic diagram of an assembly method of a low-crosstalk optical module provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0026] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as meaning open inclusion, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that the specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner, that is, although they may be carried in the embodiments or examples of the above terms due to reasons such as the order and position of appearance, it is not limited to that they can be carried in combination by one embodiment or example.

[0027] In the description of the present invention, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present disclosure.

[0028] In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "multiple" means two or more. In addition, for example, the description may also use the method of adding "A" and "B" at the end to describe the same type of nouns as two independent individuals. In this case, the corresponding features defined as "A" and "B" are only used to distinguish the description purposes of the same type of individuals, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated.

[0029] When describing some embodiments, the expressions “coupled”, “coupled” and “connected” and their derivatives may be used. For example, when describing some embodiments, the term “connected” may be used to indicate that two or more components are in direct physical or electrical contact with each other. For another example, when describing some embodiments, the term “coupled” may be used to indicate that two or more components are in direct physical or electrical contact. However, the term “connected” or “coupled” may also mean that two or more components are not in direct contact with each other, but still cooperate or interact with each other, such as “optical coupling”, “wireless connection”, etc. The embodiments disclosed herein are not necessarily limited to the contents of the present invention.

[0030] In the description of the present invention, the expression "A and / or B" (where A and B are used to formally represent specific characteristic contents) is involved, and the corresponding expressions include the following three combinations: only A, only B, and a combination of A and B.

[0031] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and errors associated with measurement of the particular quantity (i.e., limitations of the measurement system).

[0032] In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0033] Figure 1 This is a connection diagram of an optical communication system. Figure 1 As shown, the optical communication system mainly includes an optical network terminal 90, a remote server 91, a local information processing device 92, an optical module 93, an optical fiber 94 and a network cable 95.

[0034] One end of optical fiber 94 is connected to remote server 91, and the other end is connected to optical network terminal 90 via optical module 93. Optical fiber itself can support long-distance signal transmission, for example, several kilometers (6 to 8 kilometers). Furthermore, if repeaters are used, ultra-long-distance transmission is theoretically possible. Therefore, in typical optical communication systems, the distance between remote server 91 and optical network terminal 90 can typically reach thousands, tens, or even hundreds of kilometers.

[0035] One end of the network cable 95 is connected to the local information processing device 92, and the other end is connected to the optical network terminal 90. The local information processing device 92 can be any one or more of the following devices: a router, an optical network terminal, a computer, a mobile phone, a tablet computer, and a television.

[0036] The physical distance between remote server 91 and optical network terminal 90 is greater than the physical distance between local information processing device 92 and optical network terminal 90. The connection between local information processing device 92 and remote server 91 is established by optical fiber 94 and network cable 95; the connection between optical fiber 94 and network cable 95 is established by optical module 93 and optical network terminal 90.

[0037] Optical module 93 includes an optical port and an electrical port. The optical port is configured to connect to optical fiber 94, thereby establishing a bidirectional optical signal connection between optical module 93 and optical fiber 94. The electrical port is configured to connect to optical network terminal 90, thereby establishing a bidirectional electrical signal connection between optical module 93 and optical network terminal 90. Optical module 93 can convert optical signals into electrical signals, thereby establishing a connection between optical fiber 94 and optical network terminal 90. For example, optical signals from optical fiber 94 are converted into electrical signals by optical module 93 and then input into optical network terminal 90. Similarly, electrical signals from optical network terminal 90 are converted into optical signals by optical module 93 and then input into optical fiber 94.

[0038] The optical network terminal 90 includes a roughly rectangular housing, as well as a network cable interface 96 and an optical module interface 97 disposed on the housing. The optical module interface 97 is configured to connect to the optical module 93, thereby establishing a bidirectional electrical signal connection between the optical network terminal 90 and the optical module 93. The network cable interface 96 is configured to connect to the network cable 95, thereby establishing a bidirectional electrical signal connection between the optical network terminal 90 and the network cable 95. The connection between the optical module 93 and the network cable 95 is established through the optical network terminal 90. For example, the optical network terminal 90 transmits electrical signals from the optical module 93 to the network cable 95, and transmits signals from the network cable 95 to the optical module 93. Therefore, the optical network terminal 90 serves as the host computer of the optical module 93 and can monitor the operation of the optical module 93. In addition to the optical network terminal 90, the host computer of the optical module 93 may also include an optical line terminal (OLT) and the like.

[0039] A bidirectional signal transmission channel is established between the remote server 91 and the local information processing device 92 via the optical fiber 94 , the optical module 93 , the optical network terminal 90 and the network cable 95 .

[0040] The optical network terminal 90 also includes a PCB (Printed Circuit Board) mounted within the housing, a cage (not shown) mounted on the surface of the PCB, an electrical connector within the cage, and a heat sink assembly mounted on the cage surface. The electrical connector is configured to connect to the electrical port of the optical module 93. The heat sink assembly includes raised features such as fins to increase the heat dissipation area.

[0041] Optical module 93 is inserted into the cage of optical network terminal 90, which secures it. Heat generated by optical module 93 is transferred to the cage and then dissipated through the heat sink. Once inserted, the electrical port of optical module 93 connects to an electrical connector inside the cage, establishing a bidirectional electrical signal connection between optical module 93 and optical network terminal 90. Furthermore, the optical port of optical module 93 connects to optical fiber 94, establishing a bidirectional electrical signal connection between the two.

[0042] In some embodiments of the present invention, Figure 2 As shown, the optical module 93 includes a housing 1 consisting of a cover 11 and a base 12, and a circuit board 2. The cover 11 covers the base 12 to form the housing 1 having two openings. The outer contour of the housing is generally a square.

[0043] The direction of the line connecting the two openings can be aligned with or inconsistent with the length of the optical module 93. For example, one opening is located at the end of the optical module 93, and the other opening is located at the end of the optical module 93. Alternatively, one opening is located at the end of the optical module 93, and the other opening is located on the side of the optical module 93. One opening is an electrical port, from which the circuit board's gold finger extends and is inserted into a host computer (such as an optical network terminal 90); the other opening is an optical port, configured to receive an external optical fiber 94, thereby connecting the optical fiber 94 to the interior of the optical module 93.

[0044] The combined cover and base assembly method facilitates the installation of components such as circuit boards into the housing, providing encapsulation and protection for these components. Furthermore, during assembly of components such as circuit boards, the placement of positioning components, heat dissipation components, and electromagnetic shielding components facilitates automated production.

[0045] In some embodiments, the cover and the base are generally made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0046] In some embodiments, the optical module 93 further includes an unlocking component located on the outer wall of its housing, and the unlocking component is configured to achieve a fixed connection between the optical module 93 and the host computer, or to release the fixed connection between the optical module 93 and the host computer.

[0047] For example, the unlocking components are located on the outer walls of the two lower side panels of the base and include engaging components that mate with the cage of the host computer (e.g., the cage of the optical network terminal 90). When the optical module 93 is inserted into the cage of the host computer, the engaging components of the unlocking components secure the optical module 93 in the cage. When the unlocking components are pulled, the engaging components of the unlocking components move accordingly, thereby changing the connection between the engaging components and the host computer, thereby releasing the engaging relationship between the optical module 93 and the host computer, and allowing the optical module 93 to be removed from the cage of the host computer.

[0048] A circuit board includes circuit traces, electronic components, and chips. The circuit traces connect the electronic components and chips according to the circuit design to achieve functions such as power supply, electrical signal transmission, and grounding. Examples of electronic components include capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Examples of chips include microcontroller units (MCUs), limiting amplifiers (Limiting Amplifiers), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0049] The circuit board is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also perform load-bearing functions, such as stably carrying chips. The rigid circuit board can also be inserted into the electrical connector in the host computer cage.

[0050] The circuit board also includes gold fingers formed on its end surfaces. These gold fingers consist of multiple independent pins. The circuit board is inserted into the cage, where the gold fingers provide electrical connection to the electrical connector inside the cage. Gold fingers can be located on only one side of the circuit board or on both the top and bottom surfaces to accommodate applications requiring a large number of pins. The gold fingers are configured to establish an electrical connection with the host computer to facilitate power supply, grounding, I2C signal transmission, data signal transmission, and more. Of course, some optical modules also use flexible circuit boards. Flexible circuit boards are generally used in conjunction with rigid circuit boards to complement them.

[0051] In the examples presented herein, applicable packaging structures include, but are not limited to, the OSFP (Octal Small Form-factor Pluggable) and OSFP-XD (Octal Small Form-factor eXtra Dense Pluggable). Since optical module packaging is primarily designed to customize the housing to suit the specific application, the optical path and / or circuit structure theories proposed by this invention, absent explicit technical conflicts, should also be applicable to future proposed packaging formats and, therefore, should be understood to fall within the scope of this invention.

[0052] It should be noted that the above is only an example of the structure of the optical module to facilitate a systematic introduction to the optical module, and does not constitute a limitation on the structure of the optical module. In actual application scenarios, the structure of the optical module can be adaptively modified according to actual needs. For example, the shape of the unlocking mechanism, the layout of the optical transmitting and receiving components, the structure of the optical module housing, and the shape of the optical fiber connector can be changed.

[0053] The above mainly introduces the application scenarios and basic structure of optical modules. The present invention provides a low crosstalk optical module. Figure 3 and Figure 4 This low-crosstalk optical module features a first protective cover 3 on the exterior of the optical transmitter assembly 20 and a second protective cover 4 on the exterior of the optical receiver assembly 21. This prevents optical and electromagnetic crosstalk between the optical transmitter assembly 20 and the optical receiver assembly 21. Furthermore, physical protection is provided for the optical components, optical paths, and bonding wires within the optical transmitter assembly 20 and the optical receiver assembly 21, preventing smoke or particulate matter from entering and contaminating the optical end faces and affecting optical path signals. This addresses existing optical module issues such as crosstalk between the optical transmitter assembly and the optical receiver assembly, as well as issues with insufficient sealing that impacts module reliability. The specific structure of this low-crosstalk optical module is described below with reference to the accompanying figures.

[0054] In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0055] Embodiment 1: Embodiment 1 of the present invention provides a low crosstalk optical module, such as Figure 3 and Figure 4As shown, it includes: a shell 1, a circuit board 2, a first protective cover 3 and a second protective cover 4; the circuit board 2 is fixed in the shell 1, and an optical transmitting component 20 and an optical receiving component 21 are provided on the circuit board 2, the first protective cover 3 is provided on the optical transmitting component 20, and the second protective cover 4 is provided on the optical receiving component 21.

[0056] By providing a first protective cover 3 on the outside of the optical emitting component 20 and a second protective cover 4 on the outside of the optical receiving component 21, the optical crosstalk and electromagnetic crosstalk problems between the optical emitting component 20 and the optical receiving component 21 can be avoided; at the same time, physical protection is provided for the optical elements, optical paths, bonding wires, etc. inside the optical emitting component 20 and the optical receiving component 21 to prevent smoke or particulate matter from entering and contaminating the optical end face and affecting the optical path signal.

[0057] In order to ensure sealing and prevent smoke or particulate matter from entering and contaminating the optical end face and affecting the optical path signal, in one embodiment, a sealing component 10 is provided inside the shell 1. The sealing component 10 is used to seal the gaps between the structures so that a closed cavity is formed inside the shell 1.

[0058] By arranging the sealing assembly 10 inside the housing 1, a closed cavity is formed inside the housing 1, which prevents small particles such as dust and smoke from entering the module and affecting the normal operation of the optical module, thereby improving the long-term reliability of the optical module.

[0059] In addition to the above structure, in order to ensure the heat dissipation performance of the optical module, a heat sink 13 is further provided on the outside of the optical module, and the heat sink 13 is fixedly connected to the housing 1 .

[0060] In order to fully illustrate the technical solutions provided by the embodiments of the present invention, the structures mentioned in the above solutions are further elaborated below.

[0061] In the above solution, it is mentioned that the first protective cover 3 is provided on the optical emitting component 20, and the second protective cover 4 is provided on the optical receiving component 21. In order to better achieve the electromagnetic shielding effect of the first protective cover 3 and the second protective cover 4 on the optical emitting component 20 and the optical receiving component 21, as shown in FIG. Figure 5 As shown, one or more first conductive structures 22 and one or more second conductive structures 23 are provided on the circuit board 2. The first conductive structure 22 is provided close to the optical emitting component 20, and the second conductive structure 23 is provided close to the optical receiving component 21. The first protective cover 3 is connected to the ground signal on the circuit board 2 through the first conductive structure 22, and the second protective cover 4 is connected to the ground signal on the circuit board 2 through the second conductive structure 23.

[0062] like Figure 6 and Figure 7 As shown, one or more first conductive pins 30 are provided on the first protective cover 3, and the first conductive pins 30 are electrically connected to the first conductive structure 22; one or more second conductive pins 40 are provided on the second protective cover 4, and the second conductive pins 40 are electrically connected to the second conductive structure 23.

[0063] The first protective cover 3 may be provided with one first conductive pin 30, two first conductive pins 30, three first conductive pins 30, or more first conductive pins 30. The second protective cover 4 may be provided with one second conductive pin 40, two second conductive pins 40, three second conductive pins 40, or more second conductive pins 40. The number of conductive pins provided on the protective cover is not specifically limited.

[0064] In actual application scenarios, when there are more conductive pins, the integrity of the ground signal can be better guaranteed, but it will take up more space on the circuit board 2, which is not conducive to the wiring design of the circuit board 2. Therefore, a suitable number of conductive pins should be set after comprehensive consideration. Figure 6 and Figure 7 In the figure, the first protective cover 3 is provided with three first conductive pins 30 and the second protective cover 4 is provided with three second conductive pins 40 as an example.

[0065] In one embodiment, the first conductive structure 22 and the second conductive structure 23 can be metal holes. Correspondingly, the first conductive foot 30 and the second conductive foot 40 are both conductive pins led out from the protective cover. The conductive pins are welded in the metal holes to achieve electrical connection, so that the first protective cover 3 and the second protective cover 4 are connected to the ground signal on the circuit board 2, thereby ensuring the integrity of the ground signal and improving the shielding effect.

[0066] In one embodiment, the first conductive structure 22 and the second conductive structure 23 can be metal sockets welded to the circuit board 2. Correspondingly, the first conductive pin 30 and the second conductive pin 40 are conductive pins extending from the protective cover. The conductive pins are plugged into the metal sockets, forming an electrical connection. This connects the first and second protective covers 3 and 4 to the ground signal on the circuit board 2, ensuring the integrity of the ground signal and improving the shielding effect. Compared to the aforementioned metal hole welding method, this method is removable, facilitating the removal of the optical transmitter assembly 20 or the optical receiver assembly 21.

[0067] In one embodiment, the first conductive structure 22 and the second conductive structure 23 can be metal slots. Correspondingly, the first conductive pin 30 and the second conductive pin 40 are conductive clips extending from the protective cover. The conductive clips snap into the metal slots to form an electrical connection, thereby achieving a grounding effect for the first protective cover 3 and the second protective cover 4. This method allows a large area of ​​metal to be laid on the surface of the metal slots, ensuring good electrical contact between the conductive clips and the metal slots while also achieving detachability. Of course, to ensure better conductivity, the metal slots can be further welded using solder.

[0068] In actual application scenarios, the first conductive structure 22 and the second conductive structure 23 can be in other forms, and the first conductive foot 30 and the second conductive foot 40 can be in forms that can be coupled with the first conductive structure 22 and the second conductive structure 23, and no specific limitation is made here.

[0069] In this embodiment, the ground signal between the first protective cover 3 and the second protective cover 4 and the circuit board 2 is connected through the first conductive pin 30 and the second conductive pin 40, so that the first protective cover 3 and the second protective cover 4 can be well grounded. The first protective cover 3 and the second protective cover 4 form an electromagnetic shielding inner cavity, which can avoid the mutual optical crosstalk and electromagnetic wave crosstalk problems between the optical transmitting component 20 and the optical receiving component 21, and can also avoid high-frequency signals interfering with other components of the optical module.

[0070] Secondly, a first notch 31 is provided on the first protective cover 3, and a second notch 41 is provided on the second protective cover 4. The first notch 31 and the second notch 41 are arranged toward the optical port and are used for optical fibers to pass through.

[0071] In one embodiment, the first notch 31 and the second notch 41 are both provided with sealing gaskets that match the shape of the notch, and a perforation is provided in the middle of the sealing gasket. The optical fiber passes through the perforation and then enters the corresponding protective cover, thereby ensuring the sealing of the protective cover and preventing dust from entering the protective cover.

[0072] In one embodiment, a sealant may be used to seal the gap between the first notch 31 and the second notch 41 to ensure sealing.

[0073] In actual application scenarios, in order to make the first protective cover 3 and the second protective cover 4 have a good electromagnetic shielding effect, the material of the first protective cover 3 and the second protective cover 4 is metal, and the first protective cover 3 and the second protective cover 4 are made of sheet metal stretching process; specifically, the first protective cover 3 and the second protective cover 4 can be made of thin metal sheets through sheet metal process, so as to ensure that the weight of the first protective cover 3 and the second protective cover 4 will not be too heavy. This manufacturing process is simple, the material cost is lower, the wall thickness of the protective cover can be made thinner, and the space occupied is smaller.

[0074] If it is necessary to reduce the overall weight of the optical module, the first protective cover 3 and the second protective cover 4 are made of plastic, and their surfaces are coated with a metal layer. In addition, if it is necessary to simplify the processing flow of the first protective cover 3 and the second protective cover 4, the plastic parts of the first protective cover 3 and the second protective cover 4 can be first stamped out, and then the outside of the plastic parts can be metal-coated. The advantage of this is that it can not only achieve the electromagnetic shielding effect of the first protective cover 3 and the second protective cover 4, but also reduce the overall weight of the optical module. The shape of the first protective cover 3 and the second protective cover 4 can be designed according to the shape and layout of their components. When installing the first protective cover 3 and the second protective cover 4 on the circuit board 2, it is necessary to ensure that the first protective cover 3 and the second protective cover 4 avoid other components on the circuit board 2.

[0075] In the above solution, it is mentioned that a sealing assembly 10 is provided inside the housing 1 . The sealing assembly 10 is provided close to the edge of the housing 1 to form a sealed cavity inside the housing 1 .

[0076] like Figure 8 and Figure 9 As shown, the shell 1 includes a cover plate 11 and a base 12, and the sealing assembly 10 includes one or more conductive rubber strips 100; the conductive rubber strips 100 are arranged between the cover plate 11 and the base 12, and the conductive rubber strips 100 are used to seal the gap between the cover plate 11 and the base 12.

[0077] And / or, an adapter 5 is provided in the housing 1 , and the sealing assembly 10 includes a first rubber pad 101 , which is sleeved on the adapter 5 and is used to seal the gap between the adapter 5 and the housing 1 .

[0078] And / or, the sealing assembly 10 includes a second rubber pad 102, which is arranged near the tail of the shell 1 and the second rubber pad 102 is arranged on the surface of the circuit board 2, and the second rubber pad 102 is used to seal the gap between the circuit board 2 and the shell 1.

[0079] In actual application scenarios, the sealing assembly 10 may include one or more of a conductive rubber strip 100 , a first rubber pad 101 , and a second rubber pad 102 to seal gaps between structures.

[0080] Among them, since the cover plate 11 and the base 12 are generally made of metal, the purpose of setting the conductive rubber strip 100 between the cover plate 11 and the base 12 is to ensure good contact between the cover plate 11 and the base 12 through the conductive rubber strip 100 to ensure the integrity of the ground signal, which is equivalent to the cover plate 11 and the base 12 also forming a complete shielding cavity, thereby improving the anti-interference ability of the optical module.

[0081] In a specific embodiment, in order to ensure a better sealing effect, continue to refer to Figure 8 and Figure 9 The sealing assembly 10 includes a conductive rubber strip 100, a first rubber pad 101 and a second rubber pad 102. The shell 1 includes a cover plate 11 and a base 12. The conductive rubber strip 100 is used to seal the gap between the cover plate 11 and the base 12. The optical module also includes an adapter 5. The adapter 5 and the optical emitting component 20 and the optical receiving component 21 are connected through optical fibers. The first rubber pad 101 is sleeved on the tail of the adapter 5. The first rubber pad 101 is arranged near one end of the circuit board 2. The second rubber pad 102 is arranged near the tail of the shell 1, respectively arranged on the upper and lower surfaces of the circuit board 2, and the second rubber pad 102 abuts against the circuit board 2.

[0082] In conventional optical module structures, the housing 1 has seams located on both sides and the side where the adapter 5 is located. Because the circuit board 2 extends from the housing 1, the rear end of the housing 1 has poor sealing. Therefore, to create a sealed cavity within the housing 1, the seams between the two sides of the housing 1 and the side where the adapter 5 is located, as well as the area where the rear end of the circuit board 2 extends from the housing 1, need to be sealed. The specific solution is described below.

[0083] like Figure 10 and Figure 12 As shown, a first installation area 120 is provided on the base 12, a first installation position 1200 is provided on the first installation area 120, a second installation area 110 is provided on the cover 11, a second installation position 1100 is provided on the second installation area 110, and the adapter 5 is provided in the space formed by the first installation area 120 and the second installation area 110.

[0084] Specifically, such as Figure 13As shown, the adapter 5 includes a plug-in part 50, a packaging part 51 and a fiber optic connecting part 52, the first installation position 1200 includes a first accommodating groove 1201, a second accommodating groove 1202 and a third accommodating groove 1203, and the second installation position 1100 includes a fourth accommodating groove 1101, a fifth accommodating groove 1102 and a sixth accommodating groove 1103; the first accommodating groove 1201 and the fourth accommodating groove 1101 are used to accommodate the plug-in part 50, the second accommodating groove 1202 and the fifth accommodating groove 1102 are used to accommodate the packaging part 51, and the third accommodating groove 1203 and the sixth accommodating groove 1103 are used to accommodate the fiber optic connecting part 52.

[0085] like Figure 10 As shown, first bonding grooves 1204 are symmetrically provided on both sides of the second accommodating groove 1202, and second bonding grooves 1205 are symmetrically provided on both sides of the third accommodating groove 1203, and the first bonding grooves 1204 are communicated with the side walls of the second accommodating groove 1202; the second bonding grooves 1205 are symmetrically provided on both sides of the third accommodating groove 1203, and the second bonding grooves 1205 are communicated with the side walls of the third accommodating groove 1203; abutment platforms 121 are provided on both sides of the base 12, and the upper surface of the abutment platform 121 is communicated with the bottom of the first bonding groove 1204 and the second bonding groove 1205, and the abutment platform 121, the first bonding groove 1204 and the second bonding groove 1205 are used to bond the conductive adhesive strip 100; as shown Figure 12 As shown, abutting protrusions 111 are provided on both sides of the cover plate 11 . The abutting protrusions 111 are provided corresponding to the abutting platforms 121 , and the abutting protrusions 111 abut against the conductive rubber strip 100 .

[0086] Since the third receiving groove 1203 and the sixth receiving groove 1103 are in communication with the area where the circuit board 2 is placed, the first rubber pad 101 is required to seal the area where the third receiving groove 1203 and the sixth receiving groove 1103 are located. Figure 11 and Figure 12 As shown, a first sinking groove 1206 is provided on the third receiving groove 1203, that is, a portion of the bottom of the third receiving groove 1203 is further hollowed out to form the first sinking groove 1206, and a second sinking groove 1104 is provided on the sixth receiving groove 1103, and the first sinking groove 1206 and the second sinking groove 1104 are used to accommodate the first rubber pad 101.

[0087] As for the rear part of the shell 1, the part where the circuit board 2 extends out from the shell 1, the shell 1 includes a cover 11 and a base 12, the rear part of the cover 11 is provided with a first strip groove 112, and the rear part of the base 12 is provided with a second strip groove 122, and the first strip groove 112 and the second strip groove 122 are respectively provided with a second rubber pad 102.

[0088] By adhering the conductive adhesive strip 100 on the first adhesive groove 1204, the second adhesive groove 1205 and the abutment platform 121, the area where the cover plate 11 and the base 12 abut each other can be closed; by sleeved with the first adhesive pad 101 on the optical fiber connection part 52 of the adapter 5, the gap between the adapter 5 and the cover plate 11 and the base 12 is closed; by arranging the second adhesive pad 102 in the first strip groove 112 and the second strip groove 122, the gap between the tail of the circuit board 2 and the cover plate 11 and the base 12 is closed, so that a closed cavity is formed inside the optical module, thereby improving the long-term working reliability of the optical module.

[0089] Example 2: In the aforementioned embodiment 1, multiple conductive structures are required on the circuit board 2, which damages the integrity of the circuit board 2 and affects the circuit routing of the circuit board 2. In particular, when the conductive structures are conductive vias, the integrity of the ground signal is greatly affected, which in turn affects the anti-interference capability of the optical module. To address this issue, unlike the aforementioned embodiment 1, this embodiment optimizes the structure of the circuit board 2, the first protective cover 3, and the second protective cover 4. See the following description for details.

[0090] In this embodiment, if Figure 14 As shown, a window 24 is provided on the circuit board 2 for the light emitting component 20 to pass through. During actual assembly, the light emitting component 20 passes through the bottom of the circuit board 2, so a window 24 is provided, and the size of the window 24 is larger than the size of the light emitting component 20.

[0091] In this embodiment, the window 24 is provided with a first bayonet 241 and a second bayonet 242 at two corners corresponding to the light outlet side of the light emitting assembly 20, and a third bayonet 243 is provided at the corner of the window 24 closest to the light receiving assembly 21. In an alternative embodiment, the shape of the window 24 is similar to a rectangle, and the corners of the window 24 are partially expanded outward to form the bayonet.

[0092] See Figure 15, the two corners of the front end of the first protective cover 3 extend downwardly with a first clamping foot 321 and a second clamping foot 322, the first clamping foot 321 is inserted into the first bayonet 241, and the second clamping foot 322 is inserted into the second bayonet 242, and a third clamping foot 323 is provided on the side of the first protective cover 3 adjacent to the light receiving component 21; wherein, the third bayonet 243 is used to support the third clamping foot 323, and is also used to support the fourth clamping foot 421 (such as Figure 16 shown).

[0093] In this embodiment, if Figure 17 and Figure 18 As shown, when the third clamping pin 323 and the fourth clamping pin 421 are simultaneously inserted into the third clamping port 243 , the third clamping pin 323 generates abutting force on the fourth clamping pin 421 . In this way, the stability of the fixation can be ensured under the interaction of forces.

[0094] In one embodiment, the first protective cover 3 and the second protective cover 4 are arranged diagonally opposite to each other, and one corner of the first protective cover 3 is arranged adjacent to one corner of the second protective cover 4 .

[0095] In this embodiment, although a portion of the plate is cut away at the corners of the window 24 to form a notch, slightly reducing the traceable area of ​​the circuit board 2, compared to embodiment 1, the traces only need to go around the window 24, and the trace planning will not be disrupted by excessive conductive holes. This allows for a balanced trace layout, ensuring the integrity and independence of high-frequency and sensitive signal traces, and reducing signal interference.

[0096] In one embodiment, the third clamping foot 323 is drawn out from the side surface of the first protective cover 3 and extends downward, and the free end of the third clamping foot 323 protrudes further outward relative to the side surface of the first protective cover 3 to form an inclined third clamping foot 323; specifically, the third clamping foot 323 is inclined relative to the side surface of the first protective cover 3 to form a third clamping foot 323 protruding outward; or, the third clamping foot 323 is drawn out from the side surface of the first protective cover 3, extends outward in the horizontal direction for a section of structure and then bends downward to form a third clamping foot 323 protruding outward, that is, the shape of the third clamping foot 323 is similar to Figure 16 The fourth latching pin 421 has a similar shape.

[0097] And / or, the fourth clamping foot 421 is drawn out from the side surface of the second protective cover 4 and extends downward, and the free end of the fourth clamping foot 421 further protrudes outward relative to the side surface of the second protective cover 4, thereby forming an inclined fourth clamping foot 421. The fourth clamping foot 421 is inclined relative to the side surface of the second protective cover 4, or the fourth clamping foot 421 is drawn out from the side surface of the second protective cover 4, extends outward in the horizontal direction for a certain distance, and then bends downward, thereby forming the outwardly protruding fourth clamping foot 421.

[0098] When both the third and fourth clamping legs 323 and 421 are protruding outward, the contact force between them is greater and the fixation is more secure, but the installation may be more difficult. When one of the third and fourth clamping legs 323 and 421 is protruding outward, the free end of the other clamping leg can be flush with the side surface of the protective cover (that is, the shape of the clamping leg is the same as the Figure 15 This method is simple to install, but compared to the solution where both the clamping feet are protruding, the contact force between the two will be smaller. In actual scenarios, it can be determined according to actual conditions and is not specifically limited here.

[0099] In one embodiment, Figure 14 、 Figure 16 and Figure 19 As shown, a fifth pin 422 is further provided on the second protective cover 4 near the edge of the circuit board 2, wherein the fifth pin 422 and the fourth pin 421 are respectively located at opposite ends of the opposite side; wherein the edge of the circuit board 2 is made with a first locking notch 251 adapted to the fifth pin 422.

[0100] Combine Figure 16 , the fifth clamping pin 422 and the fourth clamping pin 421 are respectively located at opposite ends of opposite sides, which means: the fourth clamping pin 421 is set at the first side, the fifth clamping pin 422 is set at the second side, and the first side and the second side are a pair of opposite sides; the fourth clamping pin 421 is set at the left end of the first side, and the fifth clamping pin 422 is set at the right end of the second side, and the left end and the right end are opposite ends.

[0101] In one embodiment, a portion of the side of the circuit board 2 is cut away to form the first locking notch 251. This method does not significantly affect the routing of the circuit board 2. The fifth latching leg 422 extends from the side surface of the second protective cover 4, extends horizontally outward for a certain distance, and then bends downward. This structure allows the fifth latching leg 422 to hook onto the first locking notch 251 from the side, ensuring the stability of the structure.

[0102] In one embodiment, in order to ensure stability and uniformity of force, as Figure 19 and Figure 20 , a sixth pin 423 is provided at the other end on the same side as the fifth pin 422; wherein, the edge of the circuit board 2 is made with the second locking notch 252 adapted to the fifth pin 422, forming a structure fixed at both ends.

[0103] In one embodiment, Figure 21 The fourth and sixth clamping legs 421 and 423 are provided with buckled edges 424, which enable them to partially buckle against the back of the circuit board 2. In this way, the circuit board 2 can be clamped by the buckled edges 424 and the horizontally extending structure of the clamping legs, ensuring that the fourth and sixth clamping legs 421 and 423 are stably locked to the circuit board 2.

[0104] To ensure shielding, in one embodiment, one or more inner walls of the first bayonet 241, the second bayonet 242, the third bayonet 243, the first locking notch 251, and the second locking notch 252 are provided with a conductive structure for establishing a ground signal with the first protective cover 3 and the second protective cover 4. For example, one or more inner walls of the first bayonet 241, the second bayonet 242, the third bayonet 243, the first locking notch 251, and the second locking notch 252 are coated with a conductive material to form the conductive structure.

[0105] Example 3: Based on the aforementioned embodiment 1, an embodiment of the present invention further provides an assembly method of a low-crosstalk optical module, which is applicable to the low-crosstalk optical module described in the above solution, comprising: The assembled circuit board 2 is placed in the housing 1 .

[0106] The assembly of the circuit board 2 includes installing optical components such as the light emitting component 20 and the light receiving component 21 on the circuit board 2 .

[0107] The first protective cover 3 is placed on the optical transmitting component 20 , and the second protective cover 4 is placed on the optical receiving component 21 .

[0108] Based on the aforementioned embodiment 1, this step includes: the first conductive foot 30 of the first protective cover 3 is electrically connected to the first conductive structure 22, and the second conductive foot 40 of the second protective cover 4 is electrically connected to the second conductive structure 23, so that the first protective cover 3 and the second protective cover 4 are connected to the ground signal on the circuit board 2, thereby ensuring the integrity of the ground signal and improving the shielding effect.

[0109] Based on the aforementioned embodiment 2, this step includes: inserting the first pin 321 of the first protective cover 3 into the first slot 241, inserting the second pin 322 of the first protective cover 3 into the second slot 242 closest to it, and hooking the fifth pin 422 of the second protective cover 4 into the first locking notch 251 of the circuit board 2, thereby completing the assembly of the protective cover.

[0110] The housing 1 is closed to complete the assembly.

[0111] Specifically, before the cover 11 and the base 12 are fastened together, the conductive rubber strip 100 , the first rubber pad 101 and the second rubber pad 102 are respectively embedded in the corresponding receiving grooves to form the inner cavity of the housing 1 into a closed cavity.

[0112] based on Figure 20 and Figure 21 The structure shown, such as Figure 22 As shown, this embodiment provides another method for assembling a low-crosstalk optical module, comprising the following steps: Step 101: Align the fifth pin 422 and the sixth pin 423 with the first locking notch 251 and the second locking notch 252 respectively, and buckle the buckle edge 424 of the fifth pin 422 on the back of the circuit board 2, buckle the buckle edge 424 of the sixth pin 423 on the back of the circuit board 2, and insert the fourth pin 421 into the third bayonet 243.

[0113] The second protective cover 4 is assembled according to the aforementioned step 101 .

[0114] Step 102 : insert the first clamping pin 321 , the second clamping pin 322 and the third clamping pin 323 into the first clamping slot 241 , the second clamping slot 242 and the third clamping slot 243 respectively, wherein the third clamping pin 323 generates abutting force on the fourth clamping pin 421 .

[0115] After completing step 101, proceed to step 102. According to the above method, the first protective cover 3 and the second protective cover 4 are both fixed at three points to form a stable fixed structure.

[0116] Step 103 : placing the assembled circuit board 2 in the housing 1 .

[0117] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A low crosstalk optical module, characterized in that: include: A housing (1), a circuit board (2), a first protective cover (3), and a second protective cover (4); the circuit board (2) is fixed in the housing (1); a light emitting component (20) and a light receiving component (21) are provided on the circuit board (2); the first protective cover (3) is provided on the light emitting component (20); and the second protective cover (4) is provided on the light receiving component (21).

2. The low-crosstalk optical module according to claim 1, characterized in that: One or more first conductive structures (22) and one or more second conductive structures (23) are provided on the circuit board (2); the first conductive structure (22) is provided close to the light emitting component (20); the second conductive structure (23) is provided close to the light receiving component (21); the first protective cover (3) is connected to the ground signal on the circuit board (2) through the first conductive structure (22); and the second protective cover (4) is connected to the ground signal on the circuit board (2) through the second conductive structure (23).

3. The low-crosstalk optical module according to claim 2, wherein: One or more first conductive pins (30) are provided on the first protective cover (3), and the first conductive pins (30) are electrically connected to the first conductive structure (22); one or more second conductive pins (40) are provided on the second protective cover (4), and the second conductive pins (40) are electrically connected to the second conductive structure (23).

4. The low-crosstalk optical module according to claim 1, wherein: The circuit board (2) is provided with a window (24) for the light emitting component (20) to pass through, and the window (24) is provided with a first bayonet (241) and a second bayonet (242) at two corners corresponding to the light outlet side of the light emitting component (20), and a third bayonet (243) is provided at the corner of the window (24) closest to the light receiving component (21); the first bayonet (321) and the second bayonet (322) are extended downward from the two corners of the front end of the first protective cover (3), the first bayonet (321) is inserted into the first bayonet (241), and the second bayonet (322) is inserted into the second bayonet (242), and the third bayonet (323) is provided on the side of the first protective cover (3) adjacent to the light receiving component (21); The third bayonet (243) is used to carry the third bayonet foot (323) and is also used to carry the fourth bayonet foot (421) on the second protective cover (4).

5. The low-crosstalk optical module according to claim 4, characterized in that: When the third clamping pin (323) and the fourth clamping pin (421) are simultaneously inserted into the third clamping port (243), the third clamping pin (323) generates abutting force on the fourth clamping pin (421).

6. The low-crosstalk optical module according to claim 4, characterized in that: A fifth clamping pin (422) is also provided on the second protective cover (4) near the edge of the circuit board (2), wherein the fifth clamping pin (422) and the fourth clamping pin (421) are respectively located at opposite ends of the opposite side; wherein a first locking notch (251) adapted to the fifth clamping pin (422) is formed on the edge of the circuit board (2).

7. The low-crosstalk optical module according to claim 6, characterized in that: A sixth clamping pin (423) is provided at the other end located on the same side as the fifth clamping pin (422); wherein a second locking notch (252) adapted to the fifth clamping pin (422) is formed on the edge of the circuit board (2).

8. The low-crosstalk optical module according to claim 7, characterized in that: The fourth clamping pin (421) and the sixth clamping pin (423) are provided with buckle edges (424), and the buckle edges (424) enable the fourth clamping pin (421) and the sixth clamping pin (423) to partially buckle the back of the circuit board (2).

9. The low-crosstalk optical module according to claim 7, characterized in that: One or more inner walls of the first bayonet (241), the second bayonet (242), the third bayonet (243), the first locking notch (251), and the second locking notch (252) are provided with a conductive structure for establishing a ground signal with the first protective cover (3) and the second protective cover (4).

10. The low-crosstalk optical module according to claim 1, wherein: A sealing assembly (10) is provided inside the housing (1), and the sealing assembly (10) is used to seal gaps between structures, so that a sealed cavity is formed inside the housing (1).

11. The low-crosstalk optical module according to claim 10, characterized in that: The housing (1) comprises a cover plate (11) and a base (12); the sealing assembly (10) comprises one or more conductive adhesive strips (100); the conductive adhesive strips (100) are arranged between the cover plate (11) and the base (12); the conductive adhesive strips (100) are used to seal a gap between the cover plate (11) and the base (12); And / or, an adapter (5) is provided in the housing (1), the sealing assembly (10) comprises a first rubber pad (101), the first rubber pad (101) is sleeved on the adapter (5), and the first rubber pad (101) is used to seal a gap between the adapter (5) and the housing (1); And / or, the sealing assembly (10) includes a second rubber pad (102), the second rubber pad (102) is arranged near the rear of the shell (1), and the second rubber pad (102) is arranged on the surface of the circuit board (2), and the second rubber pad (102) is used to seal the gap between the circuit board (2) and the shell (1).

12. The low-crosstalk optical module according to claim 11, characterized in that: The housing (1) comprises a cover plate (11) and a base (12); a first strip-shaped groove (112) is provided at the rear of the cover plate (11); a second strip-shaped groove (122) is provided at the rear of the base (12); and second rubber pads (102) are respectively provided in the first strip-shaped groove (112) and the second strip-shaped groove (122).

13. The low-crosstalk optical module according to any one of claims 1 to 12, characterized in that: The first protective cover (3) and the second protective cover (4) are made of metal; the first protective cover (3) and the second protective cover (4) are manufactured using a sheet metal stretching process; Alternatively, the first protective cover (3) and the second protective cover (4) are made of plastic, and their surfaces are coated with a metal layer.

14. A method for assembling a low-crosstalk optical module, applicable to the low-crosstalk optical module according to claim 8, characterized in that: include: Align the fifth clamping pin (422) and the sixth clamping pin (423) with the first locking notch (251) and the second locking notch (252) respectively, and buckle the buckle edge (424) of the fifth clamping pin (422) on the back of the circuit board (2), buckle the buckle edge (424) of the sixth clamping pin (423) on the back of the circuit board (2), and insert the fourth clamping pin (421) into the third clamping slot (243); Inserting the first clamping pin (321), the second clamping pin (322), and the third clamping pin (323) into the first clamping port (241), the second clamping port (242), and the third clamping port (243), respectively, wherein the third clamping pin (323) generates abutting force on the fourth clamping pin (421); The assembled circuit board (2) is placed in the housing (1).

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