Manufacturing method of liquid crystal display assembly and wall structure used for forming pixel area of liquid crystal display assembly

Abstract

The invention relates to a manufacturing method of a liquid crystal display assembly and a wall structure for forming a pixel area. The manufacturing method of the liquid crystal display assembly comprises the following steps: providing a first conductive substrate; forming a plurality of cross-shaped walls with different heights on the first conductive substrate so as to define a plurality of pixel areas together by the plurality of cross-shaped walls; forming a sealing material on the periphery of the plurality of cross-shaped walls; liquid crystal is dropped into at least one pixel area, and the liquid crystal flows to other pixel areas through the cross-shaped walls with different heights; and pressing the second conductive substrate on the sealing material to seal the liquid crystal. Compared with the prior art, the manufacturing method of the liquid crystal display component has the advantages that the plurality of cross-shaped walls with different heights are formed to jointly define the plurality of pixel areas, the speed of liquid crystal flowing to each pixel area can be increased, the liquid crystal dripping or injecting time interval can be shortened, and the liquid crystal can be uniformly distributed in the liquid crystal dripping or injecting process, so that the manufacturing efficiency of the liquid crystal display component is improved. The manufacturing efficiency and the yield of the liquid crystal display assembly can be improved.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and more particularly to a method for manufacturing a liquid crystal display component and a wall structure for forming a pixel area thereof. Background Art

[0002] In response to the demand for high display quality and low power consumption in display products such as e-paper and e-books, liquid crystal display components with bi-stable (i.e., no power consumption when the image remains unchanged, and power consumption only when the image changes), non-backlight, and low power consumption characteristics have been proposed and widely used in such display products.

[0003] Liquid crystal injection is a crucial step in the manufacturing of existing liquid crystal display (LCD) components. However, due to the poor design of the wall structure used to form the pixel area in existing technologies, the liquid crystal's fluidity is significantly hindered by the wall structure during the injection process, resulting in a decrease in the liquid crystal's fluidity. This not only results in a prolonged injection time but also leads to uneven liquid crystal distribution, reducing the manufacturing efficiency and yield of the LCD component.

[0004] Therefore, it is necessary to improve the manufacturing method of the liquid crystal display assembly in the prior art to solve the above-mentioned problems. Summary of the Invention

[0005] The purpose of the present invention is to provide a method for manufacturing a liquid crystal display component and a wall structure for forming a pixel area thereof, so as to solve the technical problems of the prior art liquid crystal display component manufacturing method such as decreased liquid crystal fluidity, excessively long liquid crystal injection time and uneven liquid crystal distribution.

[0006] According to one embodiment of the present application, the present application provides a method for manufacturing a liquid crystal display component, which includes: providing a first conductive substrate; forming a plurality of cross walls of different heights on the first conductive substrate to define a plurality of pixel areas by the plurality of cross walls; forming a sealing material around the plurality of cross walls; dripping liquid crystal into at least one pixel area, and the liquid crystal flows to the remaining pixel areas through the plurality of cross walls of different heights; and pressing a second conductive substrate onto the sealing material to seal the liquid crystal.

[0007] According to another embodiment of the present application, the present application provides a wall structure for forming pixel areas, comprising: a first cross wall; and a second cross wall, which is spaced apart from the first cross wall, and the second cross wall and the first cross wall together define a plurality of pixel areas, wherein a second height of the second cross wall is different from the first height of the first cross wall.

[0008] Compared with the prior art, the present invention has at least the following technical effects:

[0009] The present application provides a method for manufacturing a liquid crystal display component, which forms multiple cross walls of different heights to collectively define multiple pixel areas. During the liquid crystal dripping or injection process, the rate at which the liquid crystal flows to each pixel area can be increased, the liquid crystal dripping or injection time can be shortened, and the liquid crystal distribution can be uniform, thereby improving the manufacturing efficiency and yield of the liquid crystal display component. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The following briefly describes the drawings necessary to describe the embodiments of the present invention or the prior art. Obviously, the drawings described below only represent some embodiments of the present invention. Those skilled in the art can, without requiring creative effort, derive drawings for other embodiments based on the illustrations in these drawings.

[0011] Figure 1 One or more stages of some embodiments of the method for manufacturing a liquid crystal display device of the present application are shown.

[0012] Figure 2 One or more stages of some embodiments of the method for manufacturing a liquid crystal display device of the present application are shown.

[0013] Figure 3A This is a schematic structural diagram of a first cross wall provided in an embodiment of the present application.

[0014] Figure 3B This is a schematic structural diagram of a second cross wall provided in an embodiment of the present application.

[0015] Figure 4A A schematic structural diagram of another first cross wall provided in an embodiment of the present application.

[0016] Figure 4B A schematic structural diagram of another second cross wall provided in an embodiment of the present application.

[0017] Figure 5A This is a schematic structural diagram of another first cross wall provided in an embodiment of the present application.

[0018] Figure 5B This is a schematic structural diagram of another second cross wall provided in an embodiment of the present application.

[0019] Figure 6A This is a schematic structural diagram of another first cross wall provided in an embodiment of the present application.

[0020] Figure 6B This is a schematic structural diagram of another second cross wall provided in an embodiment of the present application.

[0021] Figure 7One or more stages of some embodiments of the method for manufacturing a liquid crystal display device of the present application are shown.

[0022] Figure 8 One or more stages of some embodiments of the method for manufacturing a liquid crystal display device of the present application are shown.

[0023] Figure 9 One or more stages of some embodiments of the method for manufacturing a liquid crystal display device of the present application are shown.

[0024] Figure 10 One or more stages of some embodiments of the method for manufacturing a liquid crystal display device of the present application are shown.

[0025] Figure 11 One or more stages of some embodiments of the method for manufacturing a liquid crystal display device of the present application are shown.

[0026] Figure 12 One or more stages of some embodiments of the method for manufacturing a liquid crystal display device of the present application are shown.

[0027] Figure 13 One or more stages of some embodiments of the method for manufacturing a liquid crystal display device of the present application are shown.

[0028] Figure 14 One or more stages of some embodiments of the method for manufacturing a liquid crystal display device of the present application are shown.

[0029] Explanation of symbols:

[0030] 1: Liquid crystal display component; 10: First cross wall; 10a: First cross wall; 10b: First cross wall; 10c: First cross wall; 11: First wall portion; 12: Second wall portion; 12a: Second wall portion; 12c: Second wall portion; 13: Third wall portion; 13b: Third wall portion; 13c: Third wall portion; 14: Fourth wall portion; 14b: Fourth wall portion; 14c: Fourth wall portion; 20: Second cross wall; 20a: Second cross wall; 20b: Second cross wall; 20c: Second cross wall; 21: First wall portion; 2 1a: First wall; 21c: First wall; 22: Second wall; 23: Third wall; 23b: Third wall; 23c: Third wall; 24: Fourth wall; 24b: Fourth wall; 24c: Fourth wall; 30: Liquid crystal; 40: First conductive substrate; 41: First base material; 42: First electrode layer; 43: First alignment film; 50: Sealing material; 50a: Sealing material; 52: Injection port; 60: Second conductive substrate; 61: Second base material; 62: Second electrode layer; 63: Second alignment film; F: Pressure; H 11 : First height; H 12 : Second height; H 12a: Second height; H 12c : Second height; H 13 : The third height; H 13b : The third height; H 13c : The third height; H 14 : Fourth height H 14b : The fourth height; H 14c : The fourth height; H 21 : First height; H 21a : First height; H 21c : First height; H 22 : Second height; H 23 : The third height; H 23b : The third height; H 23c : The third height; H 24 : The fourth height; H 24b : The fourth height; H 24c : fourth height; P: pixel area. DETAILED DESCRIPTION

[0031] In order to better understand the spirit of this application, it is further described below in conjunction with some preferred embodiments of this application.

[0032] Various embodiments of the present application are discussed in detail below. Although specific implementations have been discussed, it should be understood that these embodiments are for illustrative purposes only. Those skilled in the relevant art will recognize that other components and configurations may be used without departing from the spirit and scope of the present application.

[0033] Figure 1 、 Figure 2 and Figures 7 to 13 One or more stages of some embodiments of the method for manufacturing a liquid crystal display device of the present application are shown.

[0034] See Figure 1 , providing a first conductive substrate 40. In some embodiments of the present application, the first conductive substrate 40 may include a first substrate 41, a first electrode layer 42 and a first alignment film 43. In some embodiments of the present application, the first substrate 41 may be a transparent glass substrate or a transparent flexible substrate. The first electrode layer 42 may be formed on the first substrate 41 (for example, the upper surface). In some embodiments of the present application, the first electrode layer 42 may include but is not limited to an indium tin oxide (ITO) electrode. In some embodiments of the present application, the first electrode layer 42 may be a scanning electrode. The first alignment film 43 may be formed on the first electrode layer 42 (for example, the upper surface).

[0035] Figure 3A This is a schematic structural diagram of a first cross wall 10 provided in an embodiment of the present application. Figure 3BThis is a schematic structural diagram of a second cross wall 20 provided in an embodiment of the present application. Figure 2 、 Figure 3A and Figure 3B A plurality of cross walls (including, for example, a first cross wall 10 and a second cross wall 20) of different heights are formed on a first conductive substrate 40 (for example, a first alignment film 43), so that the plurality of cross walls (including, for example, the first cross wall 10 and the second cross wall 20) collectively define a plurality of pixel regions P. In some embodiments of the present application, the plurality of cross walls (including, for example, the first cross wall 10 and the second cross wall 20) of different heights may constitute a wall structure.

[0036] In some embodiments of the present application, forming a plurality of cross walls of different heights may include: forming a cross wall having a first height H 11 The first cross wall 10 (such as Figure 2 and Figure 3A and forming a second height H 22 The second cross wall 20 (such as Figure 2 and Figure 3B As shown). The second cross wall 20 is spaced apart from the first cross wall 10. In some embodiments of the present application, as shown Figure 3A and Figure 3B As shown, the second height H of the second cross wall 20 22 It may be lower than the first height H of the first cross wall 10 11 In some embodiments of the present application, Figure 2 As shown, the number of second cross walls 20 may be greater than the number of first cross walls 10. In some embodiments of the present application, the distribution density of the second cross walls 20 may be greater than the distribution density of the first cross walls 10. In some embodiments of the present application, the material of the first cross walls 10 and the second cross walls 20 may include, but is not limited to, acrylic photoresist.

[0037] In some embodiments of the present application, Figure 3A As shown, the first cross wall 10 may include a plurality of wall portions (including, for example, a first wall portion 11, a second wall portion 12, a third wall portion 13, and a fourth wall portion 14). The first wall portion 11 has a first height H 11 The second wall portion 12 has a second height H 12 The third wall portion 13 has a third height H 13 The fourth wall portion 14 has a fourth height H 14 In some embodiments of the present application, the first height H of the first wall portion 11 is 11 , the second height H of the second wall portion 12 12 , the third height H of the third wall portion 13 13 and the fourth height H of the fourth wall portion 14 14Therefore, the first height H of the first wall portion 11 is 11 It can also be considered as the overall height or maximum height of the first cross wall 10 .

[0038] In some embodiments of the present application, Figure 3B As shown, the second cross wall 20 may include a plurality of wall portions (including, for example, a first wall portion 21, a second wall portion 22, a third wall portion 23, and a fourth wall portion 24). The first wall portion 21 has a first height H 21 The second wall portion 22 has a second height H 22 The third wall portion 23 has a third height H 23 The fourth wall portion 24 has a fourth height H 24 In some embodiments of the present application, the first height H of the first wall portion 21 is 21 , the second height H of the second wall portion 22 22 , the third height H of the third wall portion 23 23 and the fourth height H of the fourth wall portion 24 24 Therefore, the second height H of the second wall portion 22 is 22 It can also be regarded as the entire height or maximum height of the second cross wall 20. As described above, the second height H of the second cross wall 20 (eg, the second wall portion 22) is 22 It may be lower than the first height H of the first cross wall 10 (eg, the first wall portion 11). 11 Therefore, the first height H of the first wall portion 21 of the second cross wall 20 is 21 , the third height H of the third wall portion 23 of the second cross wall 20 23 and the fourth height H of the fourth wall portion 24 of the second cross wall 20 24 It may also be lower than the first height H of the first cross wall 10 (eg, the first wall portion 11). 11 That is, the overall height or the maximum height of the second cross wall 20 may be lower than the overall height or the maximum height of the first cross wall 10 .

[0039] Figure 4A This is a schematic structural diagram of another first cross wall 10a provided in an embodiment of the present application. Figure 4A The first cross wall 10a has and Figure 3A The structure of the first cross wall 10 is similar, except that: Figure 4A In some embodiments of the present application, the height of the second wall portion 12a of the first cross wall 10a is as follows: Figure 4A As shown, the second height H of the second wall portion 12a is 12a It may be different from the first height H of the first wall portion 11 11 , the third height H of the third wall portion 13 13 and the fourth height H of the fourth wall portion 1414 That is, at least two wall portions (e.g., the first wall portion 11 and the second wall portion 12a) of the plurality of wall portions (e.g., the first wall portion 11, the second wall portion 12a, the third wall portion 13, and the fourth wall portion 14) of the first cross wall 10a have different heights. In some embodiments of the present application, the second height H of the second wall portion 12a is 12a It may be lower than the first height H of the first wall portion 11 11 , the third height H of the third wall portion 13 13 and the fourth height H of the fourth wall portion 14 14 .

[0040] Figure 4B This is a schematic structural diagram of another second cross wall 20a provided in an embodiment of the present application. Figure 4B The second cross wall 20a has Figure 3B The second cross wall 20 has a similar structure, except that: Figure 4B In some embodiments of the present application, the height of the first wall portion 21a of the second cross wall 20a is as follows: Figure 4B As shown, the first height H of the first wall portion 21a is 21a The second height H of the second wall portion 22 may be different from 22 , the third height H of the third wall portion 23 23 and the fourth height H of the fourth wall portion 24 24 That is, at least two wall portions (e.g., the first wall portion 21a and the second wall portion 22) of the plurality of wall portions (e.g., the first wall portion 21a, the second wall portion 22, the third wall portion 23, and the fourth wall portion 24) of the second cross wall 20a have different heights. In some embodiments of the present application, the first height H of the first wall portion 21a is 21a The second height H may be lower than the second wall portion 22 22 , the third height H of the third wall portion 23 23 and the fourth height H of the fourth wall portion 24 24 .

[0041] Figure 5A This is a schematic structural diagram of another first cross wall 10b provided in an embodiment of the present application. Figure 5A The first cross wall 10b has and Figure 3A The structure of the first cross wall 10 is similar, except that: Figure 5A The height of the third wall portion 13b and the height of the fourth wall portion 14b of the first cross wall 10b. In some embodiments of the present application, Figure 5A As shown, the third height H of the third wall portion 13b is 13b and the fourth height H of the fourth wall portion 14b 14b It may be different from the first height H of the first wall portion 11 11or the second height H of the second wall portion 12 12 In some embodiments of the present application, the third height H of the third wall portion 13b is 13b and the fourth height H of the fourth wall portion 14b 14b It may be lower than the first height H of the first wall portion 11 11 or the second height H of the second wall portion 12 12 In some embodiments of the present application, the fourth height H of the fourth wall portion 14b is 14b The third height H may be the same as the third wall portion 13b. 13b .

[0042] Figure 5B This is a schematic structural diagram of another second cross wall 20b provided in an embodiment of the present application. Figure 5B The second cross wall 20b has Figure 3B The second cross wall 20 has a similar structure, except that: Figure 5B The height of the third wall portion 23b and the height of the fourth wall portion 24b of the second cross wall 20b. In some embodiments of the present application, Figure 5B As shown, the third height H of the third wall portion 23b is 23b and the fourth height H of the fourth wall portion 24b 24b It may be different from the first height H of the first wall portion 21 21 or the second height H of the second wall portion 22 22 In some embodiments of the present application, the third height H of the third wall portion 23b is 23b and the fourth height H of the fourth wall portion 24b 24b It may be lower than the first height H of the first wall portion 21 21 or the second height H of the second wall portion 22 22 In some embodiments of the present application, the fourth height H of the fourth wall portion 24b is 24b The third height H may be the same as the third wall portion 23b. 23b .

[0043] Figure 6A This is a schematic structural diagram of another first cross wall 10c provided in an embodiment of the present application. Figure 6A The first cross wall 10c has and Figure 3A The structure of the first cross wall 10 is similar, except that: Figure 6A The height of the second wall portion 12c, the height of the third wall portion 13c and the height of the fourth wall portion 14c of the first cross wall 10c. In some embodiments of the present application, Figure 6A As shown, the second height H of the second wall portion 12c is 12c , the third height H of the third wall portion 13c 13c and the fourth height H of the fourth wall portion 14c 14cIt may be different from the first height H of the first wall portion 11 11 In some embodiments of the present application, the second height H of the second wall portion 12c is 12c , the third height H of the third wall portion 13c 13c and the fourth height H of the fourth wall portion 14c 14c It may be lower than the first height H of the first wall portion 11 11 In some embodiments of the present application, the second height H of the second wall portion 12c is 12c , the third height H of the third wall portion 13c 13c and the fourth height H of the fourth wall portion 14c 14c Can be the same (ie, of equal height).

[0044] Figure 6B This is a schematic structural diagram of another second cross wall 20c provided in an embodiment of the present application. Figure 6B The second cross wall 20c has Figure 3B The second cross wall 20 has a similar structure, except that: Figure 6B The height of the first wall portion 21c, the height of the third wall portion 23c and the height of the fourth wall portion 24c of the second cross wall 20c. In some embodiments of the present application, Figure 6B As shown, the first height H of the first wall portion 21c is 21c , the third height H of the third wall portion 23c 23c and the fourth height H of the fourth wall portion 24c 24c The second height H of the second wall portion 22 may be different from 22 In some embodiments of the present application, the first height H of the first wall portion 21c is 21c , the third height H of the third wall portion 23c 23c and the fourth height H of the fourth wall portion 24c 24c The second height H may be lower than the second wall portion 22 22 In some embodiments of the present application, the first height H of the first wall portion 21c is 21c , the third height H of the third wall portion 23c 23c and the fourth height H of the fourth wall portion 24c 24c Can be the same (ie, of equal height).

[0045] See Figure 7 , forming a sealing material 50 around the periphery of the plurality of cross walls (e.g., the first cross wall 10 and the second cross wall 20). In this step, the height of at least one of the plurality of cross walls (e.g., the second cross wall 20) can be less than the thickness of the sealing material 50. In some embodiments of the present application, the material of the sealing material 50 may include, but is not limited to, acrylic photoresist.

[0046] See Figure 8 and Figure 9 Liquid crystal 30 is dripped into at least one pixel region P, and the liquid crystal 30 can flow to the remaining pixel regions P through multiple cross-walls of different heights (e.g., the first cross-wall 10 and the second cross-wall 20). In this step, the contact area between the liquid crystal 30 and the second cross-wall 20 can be different from the contact area between the liquid crystal 30 and the first cross-wall 10. In some embodiments of the present application, the contact area between the liquid crystal 30 and the second cross-wall 20 can be smaller than the contact area between the liquid crystal 30 and the first cross-wall 10. In some embodiments of the present application, the liquid crystal 30 can include, but is not limited to, cholesteric liquid crystal.

[0047] In some embodiments of the present application, a second cross-wall 20 may be formed in an area where the flow rate of the liquid crystal 30 is relatively low to reduce the flow resistance of the liquid crystal 30. Furthermore, a first cross-wall 10 may be formed in an area where the flow rate of the liquid crystal 30 is relatively high. Through the above configuration, the flow rate of the liquid crystal 30 to each pixel region P can be made relatively consistent, and the liquid crystal 30 can be evenly distributed.

[0048] See Figure 10 and Figure 11 ( Figure 10 ), the second conductive substrate 60 is pressed onto the sealing material 50 to seal the liquid crystal 30. In some embodiments of the present application, the second conductive substrate 60 may include a second substrate 61, a second electrode layer 62 and a second alignment film 63. In some embodiments of the present application, the second substrate 61 may be a transparent glass substrate or a transparent flexible substrate. The second electrode layer 62 may be formed on the second substrate 61 (e.g., the lower surface). In some embodiments of the present application, the second electrode layer 62 may include but is not limited to an indium tin oxide (ITO) electrode. In some embodiments of the present application, the second electrode layer 62 may be a data electrode. The second alignment film 63 may be formed on the second electrode layer 62 (e.g., the lower surface).

[0049] See Figure 12 and Figure 13 ( Figure 12 A cross-sectional view of FIG. 1 is provided, and a pressure F is applied to the second conductive substrate 60 (eg, the second substrate 61 ) to increase the first height H of the first cross wall 10 by the second conductive substrate 60. 11 The thickness of the sealing material 50 is pressed down to the second height H of the second cross wall 20. 22 After the sealant 50 is cured, the liquid crystal display assembly 1 is obtained.

[0050] exist Figures 1 to 13In the illustrated embodiment, a plurality of cross-shaped walls (including, for example, a first cross-shaped wall 10 and a second cross-shaped wall 20 ) of different heights are formed to collectively define a plurality of pixel regions P. This can increase the rate at which the liquid crystal 30 flows to each pixel region P during the process of dripping or injecting the liquid crystal 30 , shorten the dripping or injecting time of the liquid crystal 30 , and ensure a uniform distribution of the liquid crystal 30 . Consequently, the manufacturing efficiency and yield of the liquid crystal display device 1 can be improved.

[0051] Figure 14 One or more stages of some embodiments of the method for manufacturing a liquid crystal display device of the present application are shown. Figure 14 The stages depicted are Figure 7 The stages depicted are similar, except that: Figure 14 The sealing material 50a further forms an injection port 52. In some embodiments of the present application, Figure 10 and Figure 11 The stages depicted can be continued Figure 14 The stages depicted are different in that the liquid crystal 30 is completed Figure 10 and Figure 11 After the stage described (for example, pressing the second conductive substrate 60 onto the sealing material 50a), Figure 14 The sealing material 50 a is injected through the injection port 52 and flows to each pixel region P through a plurality of cross walls (eg, the first cross wall 10 and the second cross wall 20 ) of different heights.

[0052] While the technical content and features of the present invention have been disclosed above, those skilled in the art may still make various substitutions and modifications based on the teachings and disclosures of the present invention without departing from the spirit of the present invention. Therefore, the scope of protection of the present invention should not be limited to the contents disclosed in the embodiments, but should include various substitutions and modifications that do not depart from the present invention, and should be covered by the claims of this patent application.

Claims

1. A method for manufacturing a liquid crystal display assembly, comprising: providing a first conductive substrate; forming a plurality of cross walls of different heights on the first conductive substrate, so as to define a plurality of pixel areas by the plurality of cross walls; forming a sealing material on the periphery of the plurality of cross walls; Dropping liquid crystal into at least one of the pixel regions, and allowing the liquid crystal to flow to the remaining pixel regions through the multiple cross walls of different heights; and The second conductive substrate is pressed onto the sealing material to seal the liquid crystal.

2. The manufacturing method according to claim 1, wherein forming the plurality of cross walls of different heights comprises: forming a first cross wall having a first height; and A second cross wall having a second height is formed. 3 . The manufacturing method according to claim 2 , wherein the second height of the second cross wall is lower than the first height of the first cross wall. The manufacturing method according to claim 3 , wherein the number of the second cross walls is greater than the number of the first cross walls. 5 . The manufacturing method according to claim 2 , wherein the first cross wall comprises a first wall portion and a second wall portion, the first wall portion has the first height, the second wall portion has a second height, and the second height of the second wall portion is different from the first height of the first wall portion. 6 . The manufacturing method according to claim 5 , wherein the first cross wall further comprises a third wall portion having a third height, and the third height of the third wall portion is different from the first height of the first wall portion or the second height of the second wall portion. 7 . The manufacturing method according to claim 6 , wherein the first cross wall further comprises a fourth wall portion having a fourth height, and the fourth height of the fourth wall portion is different from the first height of the first wall portion or the second height of the second wall portion. 8 . The manufacturing method according to claim 7 , wherein the fourth height of the fourth wall portion is the same as the third height of the third wall portion.

9. The manufacturing method according to claim 2, wherein the second cross wall comprises a first wall portion and a second wall portion, the first wall portion has a first height, the second wall portion has the second height, and the first height of the first wall portion is different from the second height of the second wall portion. 10 . The manufacturing method according to claim 9 , wherein the second cross wall further comprises a third wall portion having a third height, and the third height of the third wall portion is different from the first height of the first wall portion or the second height of the second wall portion. 11 . The manufacturing method according to claim 10 , wherein the second cross wall further comprises a fourth wall portion having a fourth height, and the fourth height of the fourth wall portion is different from the first height of the first wall portion or the second height of the second wall portion. 12 . The manufacturing method according to claim 11 , wherein the fourth height of the fourth wall portion is the same as the third height of the third wall portion. 13 . The manufacturing method according to claim 2 , wherein in the step of flowing the liquid crystal to the remaining pixel regions, a contact area between the liquid crystal and the second cross-wall is different from a contact area between the liquid crystal and the first cross-wall.

14. The manufacturing method according to claim 3, further comprising: Applying pressure on the second conductive substrate to press the first height of the first cross wall down to the same height as the second height of the second cross wall through the second conductive substrate. 15 . The manufacturing method according to claim 1 , wherein in the step of forming the sealing material on peripheries of the plurality of cross walls, a height of at least one of the plurality of cross walls is smaller than a thickness of the sealing material.

16. A wall structure for forming a pixel region, comprising: First Cross Wall; and A second cross wall is spaced apart from the first cross wall, and the second cross wall and the first cross wall jointly define a plurality of pixel areas, wherein a second height of the second cross wall is different from a first height of the first cross wall.

17. The wall structure of claim 16, wherein the second height of the second cross-wall is lower than the first height of the first cross-wall.

18. The wall structure of claim 17, wherein a distribution density of the second cross walls is greater than a distribution density of the first cross walls.

19. The wall structure of claim 16, wherein the first cross wall comprises a plurality of wall portions, and at least two of the plurality of wall portions have different heights.

20. The wall structure of claim 16, wherein the second cross wall comprises a plurality of wall portions, and at least two of the plurality of wall portions have different heights.

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