Display panel and display device

By setting a conductive charge accumulation structure and an encapsulation layer in the transition area of ​​the display panel, the problem of poor display function caused by the opening area is solved, and better encapsulation effect and higher pixel density are achieved.

CN120824291APending Publication Date: 2025-10-21HEFEI VISIONOX TECH CO LTD +1
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Patent Information

Application Number
CN202410446702.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-04-12
Publication Date
2025-10-21

AI Technical Summary

Technical Problem

The setting of the opening area in the display panel leads to poor display function, and the charge is transferred to other areas through the substrate, affecting the display effect.

Method used

A conductive charge accumulation structure is set around the opening area in the transition area of ​​the display panel to gather and guide the charge to prevent it from being transferred to other areas. Combined with the encapsulation layer and isolation structure, the encapsulation effect is improved. The isolation and charge accumulation structure are prepared simultaneously to reduce the manufacturing process.

Benefits of technology

This effectively avoids charge transfer on the substrate, improves the packaging effect and charge accumulation capability of the display panel, reduces manufacturing costs, and increases pixel density.

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Abstract

The invention provides a display panel and a display device. The display panel comprises a display area, an opening area and at least one transition area located between the display area and the opening area. The display panel further comprises a substrate and a charge gathering structure located on the substrate, the charge gathering structure is located on the substrate and located in the transition area, the charge gathering structure surrounds at least part of the opening area, and at least part of the charge gathering structure is a conductive structure. In the display panel, the charge gathering structure with the conductive function surrounds at least part of the opening area to gather the charges guided in from the opening area, so that the problems of poor display function and the like of the display panel due to the fact that the charges are transmitted to other areas through the substrate are avoided.
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Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular, to a display panel and a display device. Background Art

[0002] Organic Light-Emitting Diode (OLED) is an organic thin-film electroluminescent unit. It has attracted great attention and is widely used in electronic display products due to its advantages such as simple preparation process, low cost, low power consumption, high brightness, wide viewing angle, high contrast and flexible display. Summary of the Invention

[0003] In a first aspect, the present disclosure provides a display panel comprising a display area, an aperture area, and at least one transition area between the display area and the aperture area. The display panel also comprises a substrate and a charge collection structure located on the substrate, the charge collection structure being located in the transition area, surrounding at least a portion of the aperture area and being at least partially conductive.

[0004] In the above scheme, the charge collection structure with conductive function surrounds at least part of the opening area, so that the charges introduced from the opening area can be collected in an environment such as electrostatic field testing to avoid the charges being transferred to other areas through the substrate and causing problems such as poor display function of the display panel.

[0005] In a specific embodiment of the first aspect of the present disclosure, the substrate includes a substrate and a driving circuit layer located on the substrate, at least a portion of the driving circuit layer is located in the display area, and the charge accumulation structure is located on the substrate.

[0006] In the above scheme, there is no film layer related to the driving circuit between the charge collection structure and the substrate, thereby reducing the distance between the charge collection structure and the substrate, so that the charge collection structure can directly collect charges close to the substrate, thereby further reducing the risk of charges entering the substrate and being conducted along the substrate to other areas.

[0007] In one embodiment of the first aspect of the present disclosure, the charge accumulation surrounds the open area.

[0008] In one embodiment of the first aspect of the present disclosure, the charge collection structure includes a plurality of sub-charge collection sections, which are spaced apart from each other and sequentially surround the open area in a direction away from the open area. This increases the design area of ​​the charge collection structure, thereby improving the charge collection capability of the charge collection structure. Furthermore, the spaced-apart sub-charge collection sections reduce stress transfer between them, thereby alleviating the risk of stress concentration in the charge collection structure.

[0009] In a specific embodiment of the first aspect of the present disclosure, the charge accumulation structure further includes at least one conductive connecting portion, which is located between adjacent sub-charge accumulation portions and connected to adjacent sub-charge accumulation portions. In this way, the sub-charge accumulation portions can be electrically connected to each other, thereby further improving the charge accumulation capability of the charge accumulation structure and avoiding problems such as electrostatic breakdown caused by excessive charge concentration in local areas of the charge accumulation structure.

[0010] In a specific embodiment of the first aspect of the present disclosure, the sub-charge accumulation portion includes a grid-like structure. This approach can further facilitate stress release, thereby reducing the risk of stress concentration in the charge accumulation structure.

[0011] In a specific embodiment of the first aspect of the present disclosure, the number of the sub-charge accumulation portions is 2-5.

[0012] In a specific embodiment of the first aspect of the present disclosure, the display panel further includes a first encapsulation layer, a second encapsulation layer, and a third encapsulation layer sequentially stacked on the substrate. The first and third encapsulation layers include inorganic layers, the second encapsulation layer includes an organic layer, the first and second encapsulation layers are located in the display region and the transition region, the third encapsulation layer is located in the display region and the transition region, and the third encapsulation layer covers a side of the charge accumulation structure away from the substrate and covers gaps between the sub-charge accumulation sections.

[0013] In the above solution, the third encapsulation layer can be deposited at the gaps between the sub-charge accumulation portions, so that the third encapsulation layer can be better fixed (including directly or indirectly) on the substrate to improve the encapsulation effect of the display panel.

[0014] In a specific embodiment of the first aspect of the present disclosure, the second encapsulation layer is located in an edge area of ​​the transition region.

[0015] In one specific embodiment of the first aspect of the present disclosure, the first encapsulation layer covers at least a portion of a side of the charge accumulation structure facing away from the substrate. This allows the first encapsulation layer to conform to the charge accumulation structure, and when a third encapsulation layer is subsequently formed, the third encapsulation layer can be secured to the charge accumulation structure via the first encapsulation layer, thereby further improving the encapsulation effect of the display panel.

[0016] In a specific embodiment of the first aspect of the present disclosure, the display panel may further include a pixel defining layer, the pixel defining layer being located in the display region and the transition region. In the transition region, the pixel defining layer is located between the charge accumulation structure and the substrate, and the pixel defining layer includes an inorganic layer.

[0017] In one specific embodiment of the first aspect of the present disclosure, the third encapsulation layer contacts the pixel defining layer at the gap between adjacent sub-charge accumulation sections. This allows the third encapsulation layer to be secured to the substrate via the pixel defining layer. Since both the pixel defining layer and the third encapsulation layer are inorganic film layers, the bonding strength between them is strong, thereby reducing the risk of the third encapsulation layer peeling off and further improving the encapsulation effect of the display panel.

[0018] In a specific embodiment of the first aspect of the present disclosure, the display panel may further include at least one barrier dam, the barrier dam being located between the display area and the charge collection structure, and between the substrate and the pixel defining layer. The charge collection structure may function as a barrier dam to prevent fluid from flowing over the barrier dam (for preparing the second encapsulation layer) during the display panel manufacturing process, thereby reducing the number of barrier dams required.

[0019] In a specific embodiment of the first aspect of the present disclosure, the display panel further includes a display function layer and an isolation structure located on the substrate. The display function layer includes a light-emitting unit located in a display area, and the isolation structure is located in the display area and encloses a plurality of isolation openings, with at least a portion of the light-emitting unit located within the isolation openings.

[0020] In a specific embodiment of the first aspect of the present disclosure, at least a portion of the charge accumulation structure is in the same layer and made of the same material as the isolation structure.

[0021] In the above scheme, at least part of the charge collection structure can be prepared simultaneously with the preparation of the isolation structure, thereby reducing or avoiding the increase in the display panel preparation process due to the provision of the charge collection structure, thereby reducing the preparation cost of the display panel.

[0022] In a specific embodiment of the first aspect of the present disclosure, the orthographic projection of the end portion of the isolation structure facing the substrate on the substrate is located within the orthographic projection of the end portion of the isolation structure facing away from the substrate on the substrate.

[0023] In the above scheme, the isolation structure is roughly wide at the top and narrow at the bottom, so that during the preparation process of the light-emitting unit, the evaporation range of the relevant evaporated film layer can be limited to ensure the electrical performance of the light-emitting unit (such as the connection of the second electrode described below) while having an isolation effect on some film layers in the light-emitting unit (such as the first light-emitting functional layer described below).

[0024] In a specific embodiment of the first aspect of the present disclosure, the orthographic projection of the end of the charge accumulation structure facing the substrate on the substrate is located within the orthographic projection of the end of the charge accumulation structure facing away from the substrate on the substrate.

[0025] In a specific embodiment of the first aspect of the present disclosure, the isolation structure includes a first support portion and a first crown portion, the first support portion is located between the first crown portion and the substrate, and the orthographic projection of the first support portion on the substrate is located within the orthographic projection of the first crown portion on the substrate; the charge accumulation structure includes a second support portion and a second crown portion, the second support portion is located between the second crown portion and the substrate, and the orthographic projection of the second support portion on the substrate is located within the orthographic projection of the second crown portion on the substrate.

[0026] In a specific embodiment of the first aspect of the present disclosure, at least a portion of the first supporting portion and the second supporting portion is a conductive structure.

[0027] In a specific embodiment of the first aspect of the present disclosure, the first support portion and the second support portion are in the same layer and made of the same material; and / or the first crown portion and the second crown portion are in the same layer and made of the same material.

[0028] In a specific embodiment of the first aspect of the present disclosure, the light-emitting unit includes a first electrode, a first light-emitting functional layer, and a second electrode stacked in sequence on a substrate, the first light-emitting functional layer and the second electrode are located in the isolation opening, and the second electrode is connected to the first support portion.

[0029] In a specific embodiment of the first aspect of the present disclosure, the charge collection structure includes a plurality of sub-charge collection portions, the sub-charge collection portions being spaced apart from each other and sequentially surrounding the aperture region in a direction away from the aperture region, the sub-charge collection portions comprising a grid-like structure, the second light-emitting functional layer and the third electrode being disposed within the meshes of the grid structure of the sub-charge collection portions, and the third electrode being connected to the second support portion. Thus, each mesh of the sub-charge collection portion is also covered by the third electrode, and the sub-charge collection portion is connected to the third electrode, thereby enabling the third electrode to participate in collecting charges, thereby further improving the charge collection capability around the aperture region.

[0030] In a specific embodiment of the first aspect of the present disclosure, the charge accumulation structure further includes at least one conductive connecting portion, which is located between adjacent sub-charge accumulation portions and connected to the adjacent sub-charge accumulation portions.

[0031] In a specific embodiment of the first aspect of the present disclosure, the connecting portion is in the same layer and made of the same material as the first supporting portion and / or the second electrode.

[0032] In a specific embodiment of the first aspect of the present disclosure, the display panel also includes a first encapsulation layer covering the isolation structure and the charge accumulation structure, the first encapsulation layer includes a plurality of encapsulation units spaced apart from each other, the encapsulation units correspond to the isolation openings and mesh holes, respectively, and cover the corresponding isolation openings and mesh holes.

[0033] In a specific embodiment of the first aspect of the present disclosure, two adjacent packaging units located on the same isolation structure are arranged at an interval.

[0034] In a specific embodiment of the first aspect of the present disclosure, the first support portion includes a first sub-support layer and a second sub-support layer, the first sub-support layer is located between the second sub-support layer and the substrate, the second sub-support layer is located between the first sub-support layer and the first crown portion, and the orthographic projection of the second sub-support layer on the substrate is located within the orthographic projection of the first sub-support layer on the substrate.

[0035] In a specific embodiment of the first aspect of the present disclosure, the second supporting portion includes a third sub-support layer and a fourth sub-support layer, the third sub-support layer is located between the fourth sub-support layer and the substrate, the fourth sub-support layer is located between the third sub-support layer and the second crown portion, and the orthographic projection of the fourth sub-support layer on the substrate is located within the orthographic projection of the third sub-support layer on the substrate.

[0036] In the above scheme, the portion of the surface of the first sub-support layer facing away from the substrate that is not covered by the second sub-support layer can be used to contact the second electrode, and the second electrode can be deposited with a larger thickness on the first sub-support layer to reduce the impedance at the connection between the second electrode and the first support portion; correspondingly, the portion of the surface of the third sub-support layer facing away from the substrate that is not covered by the fourth sub-support layer can be used to contact the third electrode, and the third electrode can be deposited with a larger thickness on the third sub-support layer to reduce the impedance at the connection between the third electrode and the third sub-support layer.

[0037] In a specific embodiment of the first aspect of the present disclosure, the display panel may further include a pixel defining layer, the pixel defining layer being located in the display area and the transition area, and being located between the isolation structure and the substrate, and between the charge accumulation structure and the substrate. In the display area, the pixel defining layer encloses a plurality of pixel openings, at least some of which define the light-emitting units, and the pixel openings and isolation openings defining the same light-emitting unit are connected to each other.

[0038] In a specific embodiment of the first aspect of the present disclosure, the pixel defining layer includes an inorganic layer.

[0039] In the above solution, the pixel defining layer can enable the first electrode to have a larger design area, thereby increasing the light-emitting area of ​​the light-emitting unit.

[0040] A second aspect of the present disclosure provides a display panel, which includes a display area, an opening area, and at least one transition area between the display area and the opening area, wherein the display panel includes: a substrate, a charge accumulation structure, a display function layer, and an isolation structure, wherein the charge accumulation structure is located on the substrate and in the transition area, wherein the charge accumulation structure surrounds at least part of the opening area and is at least partly a conductive structure; the display function layer is located on the substrate and includes a light-emitting unit located in the display area; the isolation structure is located in the display area and on the substrate, the isolation structure encloses a plurality of isolation openings, and at least part of the light-emitting unit is located within the isolation opening. A third aspect of the present disclosure provides a display device, which may include the display panel according to any one of the embodiments of the first and second aspects above. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 A schematic diagram of the planar structure of a display panel provided in one embodiment of the present disclosure.

[0042] Figure 2A for Figure 1 An enlarged view of the S1 region of the display panel is shown.

[0043] Figure 2B for Figure 1 The figure shows an enlarged view of the transition area and the opening area of ​​the display panel under one design.

[0044] Figure 3A for Figure 2A The cross-section of the display panel along line M1 - N1 in one design is shown.

[0045] Figure 3B for Figure 2B The cross-section of the display panel along line M2 - N2 in one design is shown.

[0046] Figure 4A for Figure 3A The structure diagram of the further design of the display panel is shown.

[0047] Figure 4B for Figure 3B The structure diagram of the further design of the display panel is shown.

[0048] Figure 5A for Figure 1 The figure shows an enlarged view of the transition area and the opening area of ​​the display panel under another design.

[0049] Figure 5B for Figure 5A The display panel is shown in a cross-sectional view along line M3-N3.

[0050] Figure 6A for Figure 2AThe cross-section of the display panel along line M1 - N1 in one design is shown.

[0051] Figure 6B for Figure 2B The cross-section of the display panel along line M2 - N2 in another design is shown.

[0052] Figures 7 to 10 An embodiment of the present disclosure provides a method for forming Figure 3A and Figure 3B A process diagram of a method for preparing a display panel is shown.

[0053] Description of reference numerals:

[0054] 10-display panel; 11a-display area; 11b-opening area; 11c-transition area; 12-frame area; 100-substrate; 110-substrate; 200-light-emitting unit; 210-first electrode; 220-first light-emitting functional layer; 221-first functional layer; 222-light-emitting layer; 223-second functional layer; 230-second electrode; 220a-second light-emitting functional layer; 230a-third electrode; 300-isolation structure; 300a-charge accumulation structure; 31a, 31b-sub-charge accumulation unit; 301 -isolation opening; 301a-isolation opening; 302-pixel opening; 310-first supporting portion; 311-first sub-support layer; 312-second sub-support layer; 320-first crown; 310a-second supporting portion; 311a-third sub-support layer; 312a-fourth sub-support layer; 320a-second crown; 330-pixel defining layer; 510-first encapsulation layer; 510a-first encapsulation film; 511-encapsulation unit; 520-second encapsulation layer; 530-third encapsulation layer; 600-photoresist pattern. DETAILED DESCRIPTION

[0055] The following will be combined with the drawings in the embodiments of this specification to clearly and completely describe the technical solutions in the embodiments of this specification. Obviously, the embodiments described are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this specification.

[0056] During the implementation of the present invention, the inventors discovered the following problems in the related art: an opening area is provided in the display panel to take into account functions such as camera, but the provision of the opening area may result in poor display function of the display panel.

[0057] At least one embodiment of the present disclosure provides a display panel and a display device to at least solve the above-mentioned technical problems. The display panel includes a display area, an aperture area, and at least one transition area between the display area and the aperture area. The display panel also includes a substrate and a charge collection structure located on the substrate, the charge collection structure is located on the substrate and in the transition area, the charge collection structure surrounds at least part of the aperture area and is at least partly a conductive structure. In the display panel, the charge collection structure with a conductive function surrounds at least part of the aperture area, so that even if charges enter the aperture area in an environment such as an electrostatic field test, these charges will be guided by the charge collection structure, so that the charges can be introduced from the aperture area, so that the charge collection structure collects the charges, thereby avoiding the charges from being transferred to other areas through the substrate (such as a charge-conducting structure such as a substrate included therein) and causing the display panel to have problems such as poor display function.

[0058] The composition, preparation and other contents of the isolation structure are further described in patents PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202310707209.0, 202311346196.5, 202310771071.0, 202311117143.6, 202310692671.8, 202410110015.7, and 202310773656.6 for reference.

[0059] The structure of the display panel according to at least one embodiment of the present disclosure is described in detail below with reference to the accompanying drawings. Furthermore, in these drawings, a spatial rectangular coordinate system is established with the substrate as a reference to more intuitively present the positional relationships of the relevant structures in the display panel. In this spatial rectangular coordinate system, the X-axis and Y-axis are parallel to the surface of the substrate, and the Z-axis is perpendicular to the surface of the substrate.

[0060] like Figure 1 、 Figure 2B 、 Figure 3A and Figure 3B As shown, the planar area of ​​the display panel 10 can be divided into a display area 11a and a frame area 12 surrounding the display area 11a. An opening area 11b and a transition area 11c are provided inside the display area 11a. The transition area 11c is located between the display area 11a and the opening area 11b, and the transition area 11c surrounds the opening area 11b. Sub-pixels (also known as sub-pixels, etc.) can be arranged in the display area 11a, such as R, G, and B sub-pixels. The physical structure of the sub-pixels can be a light-emitting unit. Adjacent sub-pixels with different colors of emitted light constitute a pixel (also known as a pixel unit, large pixel, etc.). The arrangement density of the pixels in the display area 11a represents the pixel density PPI.

[0061] It should be noted that the border area 12 is not limited to completely surrounding the display area 11a. In some embodiments of the present disclosure, some of the wiring in the border area 12 can be arranged in the display area 11a, so that the border area 12 can be designed as a single-sided border.

[0062] It should be noted that in the embodiments of the present disclosure, the position of the opening area is not limited and can be designed according to the specific planar structure of the display panel. For example, the opening area can also be set to one side of the display area, that is, the opening area can not be completely surrounded by the display area.

[0063] The physical structure of the display panel 10 may include a substrate 100 and a charge collection structure 300a located on the substrate 100. The charge collection structure 300a is located on the substrate 100 and in the transition region 11c. The charge collection structure 300a surrounds at least a portion of the opening region 11b and is at least partially conductive. As a result, when charges are conducted downward from the opening region 11b, they are preferentially collected by the conductive charge collection structure 300a.

[0064] In at least one embodiment of the present disclosure, the charge accumulation structure 300 a surrounds the opening area 11 b .

[0065] In at least one embodiment of the present disclosure, Figure 3A and Figure 3B As shown, the substrate 100 includes a substrate 110 and a driving circuit layer located on the substrate 110, at least a portion of the driving circuit layer is located in the display area 11a, and the charge collection structure 300a is located on the substrate 110. As such, there is no film layer related to the driving circuit between the charge collection structure 300a and the substrate 110, thereby reducing the distance between the charge collection structure 300a and the substrate 110. This allows the charge collection structure 300a to directly collect charges near the substrate 110, thereby further reducing the risk of charges entering the substrate 110 and being conducted along the substrate 110 to other areas.

[0066] For example, the driving circuit layer includes multiple pixel driving circuits located in the display area 11a, and the display function layer is located on the driving circuit layer. The display function layer includes light-emitting units. For example, the pixel driving circuit may include multiple transistors (TFTs), capacitors, etc., and may be formed in various forms such as 2T1C (i.e., two transistors (TFTs) and one capacitor (C)), 3T1C, or 7T1C. The pixel driving circuit is connected to the light-emitting units in the display area 11a to control the switching state and light brightness of the light-emitting units.

[0067] The driving circuit layer may include a buffer layer, an interlayer dielectric layer, a gate insulating layer, a planar layer, and multiple metal layers, wherein the interlayer dielectric layer, the gate insulating layer, and the planar layer may be provided as one or more layers. These film layers may be located in the display area and extend to the transition area, but these film layers may not be provided in the area of ​​the transition area near the opening area. In this way, during the process of forming an opening in the opening area (e.g., by cutting), cracks may be avoided in these film layers and the cracks may extend toward the display area 11a under the cutting stress, thereby damaging the film layers in the display panel. It should be noted that the above-mentioned metal layers may be used to prepare structures such as capacitors, signal lines, and gate electrodes, source and drain electrodes in transistors (TFTs).

[0068] It should be noted that in the embodiment of the present disclosure, the charge collection structure 300a only needs to surround the opening area to collect the charges there. Its specific structure and shape can be designed according to the actual process requirements. Below, several design methods of the charge collection structure 300a are exemplified.

[0069] In some embodiments of the present disclosure, the charge accumulation structure 300a can be configured as an independent continuous structure (integrated structure). Figure 2B and Figure 3B As shown, the orthographic projection of the charge accumulation structure 300a on the substrate 110 is a closed ring. For example, the shape of the orthographic projection of the charge accumulation structure 300a on the substrate 110 is conformal to the shape of the orthographic projection of the transition region on the surface of the substrate 110. For example, both are circular rings.

[0070] In some embodiments of the present disclosure, Figure 5A and Figure 5B As shown, the charge accumulation structure 300a includes a plurality of sub-charge accumulation portions ( Figure 5A Two sub-charge collection sections 31a and 31b are shown. The sub-charge collection sections 31a and 31b are spaced apart from each other and surround the aperture area 11b from the inside outward (from the aperture area to the direction away from the aperture area). This increases the design area of ​​the charge collection structure 300a, thereby improving the charge collection capability of the charge collection structure 300a. Furthermore, the spaced sub-charge collection sections 31a and 31b reduce stress transfer between them, thereby alleviating the risk of stress concentration in the charge collection structure 300a. For example, the orthographic projections of the sub-charge collection sections 31a and 31b on the surface of the substrate 110 can be in the form of concentric rings.

[0071] In at least one embodiment of the present disclosure, Figure 5AAs shown, the charge accumulation structure 300a also includes at least one conductive connecting portion 312, which is located between the adjacent sub-charge accumulation portion 31a and the sub-charge accumulation portion 31b, and is connected to the adjacent sub-charge accumulation portion 31a and the sub-charge accumulation portion 31b. In this way, the sub-charge accumulation portion 31a and the sub-charge accumulation portion 31b can be made conductive with each other to further improve the charge accumulation ability of the charge accumulation structure 300a, and avoid problems such as electrostatic breakdown caused by excessive charge concentration in local areas of the charge accumulation structure 300a. For example, a portion of the charges accumulated on the sub-charge accumulation portion 31a will be introduced into the sub-charge accumulation portion 31b to reduce the voltage on the sub-charge accumulation portion 31a, thereby reducing the risk of electrostatic breakdown caused by excessive voltage on the sub-charge accumulation portion 31a.

[0072] In some embodiments of the present disclosure, Figures 3A to 5B As shown, the charge accumulation structure 300a can be designed to include a grid structure, thereby facilitating stress release and reducing the risk of stress concentration in the charge accumulation structure 300a. Figure 5A and Figure 5B As shown, the sub-charge accumulation portions 31 a and 31 b include a grid-like structure.

[0073] In other embodiments of the present disclosure, the charge accumulation structure or the sub-charge accumulation portion can be set as a continuous film layer structure (without vias, meshes, etc.).

[0074] In at least one embodiment of the present disclosure, Figure 4A 、 Figure 4B and Figure 5B In the embodiment, the display panel further includes a first encapsulation layer 510, a second encapsulation layer 520, and a third encapsulation layer 530 stacked sequentially on the substrate 100. The first encapsulation layer 510 and the third encapsulation layer 530 include inorganic layers, and the second encapsulation layer 520 includes an organic layer. The first encapsulation layer 510 and the second encapsulation layer 520 are located in the display area 11a (e.g., covering the display area 11a) and the transition area 11c, and the third encapsulation layer 530 is located in the display area 11a and the transition area 11c. The encapsulation layer 500 composed of the first encapsulation layer 510, the second encapsulation layer 520, and the third encapsulation layer 530 can encapsulate the display area and the transition area to avoid the need to set an opening in the opening area while maintaining the encapsulation effect of the display panel.

[0075] In at least one embodiment of the present disclosure, the second encapsulation layer 520 is located at the edge of the transition region 11c, specifically at the edge of the transition region 11c on the side close to the display region 11a. Specifically, the size of the edge can be set according to actual conditions.

[0076] In at least one embodiment of the present disclosure, Figure 5BIn the embodiment of the present invention, the third encapsulation layer 530 covers the side of the charge accumulation structure 300a away from the substrate 100 and covers the gap between the sub-charge accumulation sections 31a and 31b (the area shown in S2). In this way, the third encapsulation layer 530 can be deposited at the gap between the sub-charge accumulation sections 31a and 31b, so that the third encapsulation layer 530 can be better fixed (including directly or indirectly) on the substrate 100, avoiding separation from the substrate 100, thereby improving the encapsulation effect of the display panel; in addition, in the event that a crack appears in the third encapsulation layer 530, the gap between the sub-charge accumulation sections 31a and 31b can block the crack to prevent the extension of the crack. The principle of this is at least as follows: at the gap, the sub-charge accumulation sections 31a and 31b form a groove space, and within the groove space, the extension direction of the crack can be changed to increase the difficulty of crack extension, increase the path of crack extension, etc., thereby blocking the crack.

[0077] It should be noted that in the embodiments of the present disclosure, there is no limit on the number of sub-charge accumulation sections and the design can be based on actual needs. For example, in some embodiments of the present disclosure, the number of sub-charge accumulation sections can be 2 to 5, and further can be 2, 3, 4, or 5, so as to reduce the area occupied by the charge accumulation structure while maintaining the charge accumulation effect of the charge accumulation structure, thereby allowing the transition region to have a relatively small design area.

[0078] In some embodiments of the present disclosure, the charge accumulation structure may be directly disposed on the substrate of the base plate, that is, the charge accumulation structure is in direct contact with the substrate. In this way, the third encapsulation layer may be in contact with the substrate at the gaps between the sub-charge accumulation portions.

[0079] It should be noted that, in at least one embodiment of the present disclosure, the substrate may include an organic material to have a certain degree of flexibility. Accordingly, the insulating capacity of the substrate is limited, and charges accumulated on the substrate may be conducted through the substrate.

[0080] In other embodiments of the present disclosure, the first encapsulation layer 510 covers at least a portion of the side of the charge accumulation structure 300a away from the substrate 100. In this way, the first encapsulation layer 510 can fit the charge accumulation structure 300a together. When the third encapsulation layer 530 is subsequently formed, the third encapsulation layer 530 can be fixed to the charge accumulation structure 300a through the first encapsulation layer 510, thereby further improving the encapsulation effect of the display panel.

[0081] In at least one embodiment of the present disclosure, Figure 5A and Figure 5BAs shown, the display panel may further include a pixel defining layer 330 located in the display region 11a and the transition region 11c. In the transition region 11c, the pixel defining layer 330 is located between the charge accumulation structure 300a and the substrate 110, and the pixel defining layer 330 includes an inorganic layer.

[0082] It should be noted that "the pixel defining layer includes an inorganic layer" means that the pixel defining layer includes at least two film layers, at least one of which is an inorganic layer; or, the pixel defining layer is an inorganic layer, which can be a single film layer structure, or a stacked structure composed of multiple film layers.

[0083] In at least one embodiment of the present disclosure, Figure 5A and Figure 5B As shown, the third encapsulation layer 530 contacts the pixel defining layer 330 at the gap between adjacent sub-charge accumulation portions 31a and 31b. In this way, the third encapsulation layer 530 can be fixed to the substrate 100 via the pixel defining layer 330. Since both the pixel defining layer 330 and the third encapsulation layer 530 are inorganic film layers, the bonding strength between the two is strong, thereby reducing the risk of the third encapsulation layer 530 peeling off, thereby further improving the encapsulation effect of the display panel. It should be noted that in the transition zone, the pixel defining layer 330 can be formed on the substrate 110 before the charge accumulation structure 300a is formed. Therefore, there will be a large bonding strength between the pixel defining layer 330 and the substrate 110. In this way, after the charge accumulation structure 300a is formed, the third encapsulation layer 530 is combined with the pixel defining layer 330. Since the two are made of the same inorganic material, there is a large bonding strength. Therefore, even if there is a charge accumulation structure 300a between the third encapsulation layer 530 and the substrate 110, which makes the bonding area limited, the third encapsulation layer 530 can also be firmly fixed on the substrate through the pixel defining layer 330.

[0084] In at least one embodiment of the present disclosure, Figure 5BAs shown, the display panel may further include at least one barrier dam 350, located between the charge accumulation structure 300a in the display area 11a and the transition area 11c, and between the substrate 100 and the pixel defining layer 330. The barrier dam 350 increases the extension length of the pixel defining layer 330, thereby preventing the extension of cracks in the pixel defining layer 330, thereby protecting the structure of the display area. Furthermore, when forming the second encapsulation layer 520, the barrier dam 350 can block the fluid used to form the second encapsulation layer 520 (e.g., formed by inkjet printing or other methods), preventing the subsequently formed second encapsulation layer 520 from extending into the aperture area. This allows the second encapsulation layer 520 to be completely covered by the third encapsulation layer 530, thereby improving the encapsulation effect of the encapsulation layer 500. The charge accumulation structure 300a can also function as a barrier dam 350, preventing the fluid (used to form the second encapsulation layer) from passing over the barrier dam 350 during the display panel manufacturing process, thereby reducing the number of barrier dams 350 required.

[0085] It should be noted that, in the embodiment of the present disclosure, there is no limit on the number of barrier dams 350, and the number can be designed according to the actual process requirements. For example, the barrier dams 350 can be two or more. Figure 5B The one shown in FIG. 1 , thereby reducing the area occupied by the barrier dam so that the transition zone has a relatively small design area.

[0086] In at least one embodiment of the present disclosure, the barrier dam 350 can be prepared separately, or, as Figure 5B As shown, during the process of preparing the driving circuit layer, at least a portion of the barrier dam 350 is simultaneously prepared. For example, the driving circuit layer may include a buffer layer, an interlayer dielectric layer, a gate insulating layer, and a planar layer. The barrier dam 350 is formed in the same layer and material as the buffer layer, the interlayer dielectric layer, the gate insulating layer, and the planar layer. That is, during the process of preparing the buffer layer, the interlayer dielectric layer, the gate insulating layer, and the planar layer, the barrier dam 350 is simultaneously formed.

[0087] It can be understood that in the embodiment of the present disclosure, in the area between the charge accumulation structure 300a and the edge of the display area 11a, no organic film layer or metal film layer extends from the transition area 11c into the display area 11a, which can effectively ensure the packaging effect of the display panel and effectively improve the performance of the display panel.

[0088] In the application scenario of display panels, the display panels may face requirements such as high PPI. To address this situation, isolation structures are provided in the display area, and the light-emitting units in the display area are prepared based on these isolation structures. This process method enables the preparation of the light-emitting units with high precision, thereby achieving a very high PPI. Based on this application scenario, in at least one embodiment of the present disclosure, at least part of the charge accumulation structure can be prepared simultaneously during the preparation of the isolation structure, thereby reducing the production process flow of the display panel and thus controlling production costs.

[0089] Below, the application requirements, specific setting methods, auxiliary preparation process methods of the light-emitting unit, and the principle of improving pixel PPI of the isolation structure are explained, so as to simultaneously describe the specific setting method of the charge collection structure under the scheme of being prepared together with the isolation structure.

[0090] In a display panel, some functional film layers in the light-emitting unit are formed by evaporation. There are multiple types of functional film layers in the light-emitting unit, and the materials of some functional film layers (such as the light-emitting layer) in the light-emitting units that emit different light are different. Therefore, when these functional film layers are evaporated through a mask plate (such as a fine mask plate), multiple alignments are required. In order to solve the position offset problem caused by the alignment accuracy error, sufficient space (and a safety margin related to the alignment error) needs to be reserved between different light-emitting units to ensure that the position of the actual light-emitting area of ​​the light-emitting unit can have a certain overlap rate with the designed position (design area), which is equivalent to compressing the design area of ​​the light-emitting area of ​​the light-emitting unit, which not only limits the light-emitting area of ​​the light-emitting unit, but also prevents the arrangement density of the light-emitting unit from being further increased, making it difficult to further improve the PPI (pixel density) of the display panel.

[0091] In the embodiment of the present disclosure, an isolation structure is provided at the gap between the light-emitting units to separate the functional film layers of adjacent light-emitting units. In this way, in the evaporation process of the functional film layer, it is only necessary to perform evaporation on the entire surface of the display panel without using a fine mask to prepare the functional film layer of the light-emitting unit separately. This process does not need to consider the alignment accuracy during evaporation, so that the gap between the light-emitting units can be designed to be smaller to increase the PPI (the principle of which can be seen in the following and Figures 7 to 10 (See the relevant description in the relevant embodiments).

[0092] In at least one embodiment of the present disclosure, Figure 3A and Figure 3BAs shown, the display function layer includes a light-emitting unit 200 located in the display area 11a. The light-emitting unit 200 is the physical light-emitting structure of the sub-pixels R, G, and B mentioned above. The isolation structure 300 is located in the display area 11a and encloses a plurality of isolation openings 301. That is, the planar shape of the isolation structure 300 presents a grid pattern, and at least a portion of the light-emitting unit 200 is located within the isolation opening 301. At least a portion of the isolation structure 300 and the charge accumulation structure 300a can be in the same layer and the same material. In this way, the charge accumulation structure 300a can be prepared at the same time as the isolation structure 300 is prepared.

[0093] It should be noted that, in the embodiments of the present disclosure, “same layer and same material” means that both are prepared using the same at least one film layer in the same preparation process.

[0094] In at least one embodiment of the present disclosure, Figure 3A As shown, the orthographic projection of the end of the isolation structure 300 facing the substrate 100 on the substrate 100 is located within the orthographic projection of the end of the isolation structure 300 facing away from the substrate 100 on the substrate 100. In this way, the isolation structure 300 is roughly wide at the top and narrow at the bottom, so that during the preparation process of the light-emitting unit 200, the evaporation range of the relevant evaporated film layer can be limited to ensure the electrical performance of the light-emitting unit 200 (such as the connection of the second electrode 230 described below) while having a partition effect on part of the film layer in the light-emitting unit 200 (such as the first light-emitting functional layer 220 described below). For example, the charge collection structure 300a can also be set to be roughly wide at the top and narrow at the bottom, that is, the orthographic projection of the end of the charge collection structure 300a facing the substrate 100 on the substrate 100 is located within the orthographic projection of the end of the charge collection structure 300a facing away from the substrate 100 on the substrate 100.

[0095] In at least one embodiment of the present disclosure, Figure 3A and Figure 3B As shown, the end of the isolation structure 300 facing the substrate 100 includes a first conductive portion (e.g., the first supporting portion mentioned in the following embodiments), the light-emitting unit 200 includes a first electrode 210 and a first light-emitting functional layer 220 and a second electrode 230 sequentially stacked on the first electrode 210, the first light-emitting functional layer 220 and the second electrode 230 are located in the isolation opening 301, and in the display area 11a, the second electrode 230 is connected to the first conductive portion. For example, the end of the charge accumulation structure 300a facing the substrate 100 includes a second conductive portion (e.g., the second supporting portion mentioned in the following embodiments), and the first conductive portion and the second conductive portion can be in the same layer and made of the same material.

[0096] In at least one embodiment of the present disclosure, Figure 3A and Figure 3BAs shown, the display panel also includes a second light-emitting functional layer 220a and a third electrode 230a sequentially stacked on the substrate 100. In the transition region 11c, the second light-emitting functional layer 220a and the third electrode 230a are located in the mesh of the charge collection structure 300a, and the third electrode 230a is connected to the second conductive portion. In this way, the third electrode 230a can cover the mesh of the charge collection structure 300a to improve the charge collection ability at the location of the charge collection structure 300a. The second light-emitting functional layer 220a can be in the same layer and made of the same material as the first light-emitting functional layer 220 described above, and the third electrode 230a can be in the same layer and made of the same material as the second electrode 230 described above. In this way, the second light-emitting functional layer 220a and the third electrode 230a can be prepared simultaneously during the preparation of the light-emitting unit 200.

[0097] In at least one embodiment of the present disclosure, the first light-emitting functional layer 220 may further include a first functional layer 221, a light-emitting layer 222, and a second functional layer 223, and the first functional layer 221, the light-emitting layer 222, and the second functional layer 223 are sequentially stacked on the first electrode 210. The first functional layer 221 may include at least one layer of a hole injection layer, a hole transport layer, and an electron blocking layer. The second functional layer 223 may include at least one layer of an electron injection layer, an electron transport layer, and a hole blocking layer. It should be noted that since carriers (holes, electrons) mainly crosstalk between adjacent light-emitting units 200 through the first functional layer 221, the setting of the isolation structure 300 needs to make the first functional layers 221 of each light-emitting unit 200 electrically disconnected from each other. Because the isolation structure 300 is wide at the top and narrow at the bottom, the first functional layer 221 is disconnected at the edge of the crown 320 during the evaporation process. That is, the first functional layer 221 does not connect to the conductive portion of the isolation structure 300 (e.g., the support portion 310), thereby preventing crosstalk between adjacent light-emitting units 200. For example, the second light-emitting functional layer 220a may also include the aforementioned film layers included in the first light-emitting functional layer 220.

[0098] In at least one embodiment of the present disclosure, in the mesh of the charge accumulation structure 300a, the light-emitting layer 222 and / or the second functional layer 223 can be connected to the second conductive portion, thereby further improving the charge accumulation capability at the location of the charge accumulation structure 300a.

[0099] In the embodiments of the present disclosure, as long as the isolation structure is wide at the top and narrow at the bottom, no further restrictions are imposed on the specific structure of the isolation structure.

[0100] In some embodiments of the present disclosure, Figure 3A and Figure 3BAs shown, the isolation structure 300 includes a first support portion 310 and a first crown portion 320. The first support portion 310 is located between the first crown portion 320 and the substrate 100, and the orthographic projection of the first support portion 310 on the substrate 100 is located within the orthographic projection of the first crown portion 320 on the substrate 100. The charge accumulation structure 300a includes a second support portion 310a and a second crown portion 320a. The second support portion 310a is located between the second crown portion 320a and the substrate 100, and the orthographic projection of the second support portion 310a on the substrate 100 is located within the orthographic projection of the second crown portion 320a on the substrate 100. Optionally, at least a portion of the first support portion 310 and the second support portion 310a is a conductive structure.

[0101] For example, the first support portion 310 and the second support portion 310a are made of the same layer and the same material; and / or the first crown portion 320 and the second crown portion 320a are made of the same layer and the same material. Optionally, the first support portion 310 is a first conductive portion, and the second support portion 310a is a second conductive portion.

[0102] For example, in Figure 3A and Figure 3B In the display panel shown, the first support portion 310 is made of a conductive material such as metal. On this basis, the first crown portion 320 can be made of a conductive material such as metal, or the first crown portion 320 can be made of an insulating material.

[0103] For example, Figure 3A and Figure 3B As shown, in a cross section perpendicular to the substrate 100, the cross-sectional shape of the portion of the first support portion 310 located between adjacent isolation openings 301 is a regular trapezoid. The first support portion 310 is configured as a conductive structure, and the second electrode 230 is connected to the sidewall of the first support portion 310. In this way, the width difference requirement between the first crown portion 320 and the first support portion 310 can be reduced, thereby reducing the design width of the portion of the isolation structure 300 between the two isolation openings, thereby improving the pixel density (PPI) of the display panel. Accordingly, when the isolation structure 300 and the charge accumulation structure 300a are fabricated on the same layer, in a cross section perpendicular to the substrate 100, the cross-sectional shape of the second support portion 310a is a regular trapezoid. The second support portion 310a is configured as a conductive structure, and the third electrode 230a is connected to the sidewall of the second support portion 310a.

[0104] In at least one embodiment of the present disclosure, the above-mentioned connecting portion can be set independently, or can be set to the same layer and the same material as at least part of the first support portion 310, and / or can be set to the same layer and the same material as the second electrode 230, thereby simplifying the preparation process of the display panel to control costs.

[0105] In at least one embodiment of the present disclosure, Figure 6A and Figure 6B As shown, the first support portion 310 may further include a first sub-support layer 311 and a second sub-support layer 312, the first sub-support layer 311 being located between the second sub-support layer 312 and the substrate 100, the second sub-support layer 312 being located between the first sub-support layer 311 and the first crown portion 320, and the orthographic projection of the second sub-support layer 312 on the substrate 100 being located within the orthographic projection of the first sub-support layer 311 on the substrate 100; the second support portion 310a may further include a third sub-support layer 311a and a fourth sub-support layer 312a, the third sub-support layer 311a being located between the fourth sub-support layer 312a and the substrate 100, the fourth sub-support layer 312a being located between the third sub-support layer 311a and the second crown portion 320a, and the orthographic projection of the fourth sub-support layer 312a on the substrate 100 being located within the orthographic projection of the third sub-support layer 311a on the substrate 100. In this way, the portion of the surface of the first sub-support layer 311 facing away from the substrate 100 that is not covered by the second sub-support layer 312 can be used to contact the second electrode 230, and the second electrode 230 can be deposited with a larger thickness on the first sub-support layer 311 to reduce the impedance at the connection between the second electrode 230 and the first support portion 310; accordingly, the portion of the surface of the third sub-support layer 311a facing away from the substrate 100 that is not covered by the fourth sub-support layer 312a can be used to contact the third electrode 230a, and the third electrode 230a can be deposited with a larger thickness on the third sub-support layer 311a to reduce the impedance at the connection between the third electrode 230a and the third sub-support layer 311a.

[0106] It should be noted that, when the connecting portion is set to be in the same layer and the same material as at least part of the first support portion 310, the connecting portion can be set to be in the same layer and the same material as one of the first sub-support layer 311 and the second sub-support layer 312, or the connecting portion can be set to be in the same layer and the same material as the first sub-support layer 311 and the second sub-support layer 312.

[0107] For example, the materials of the first sub-support layer 311, the second sub-support layer 312 and the first crown portion 320 are all different. For example, the first sub-support layer 311, the second sub-support layer 312 and the first crown portion 320 can be molybdenum, aluminum, and titanium respectively. The corrosion resistance of aluminum, molybdenum, and titanium increases in sequence. When etching, the film layers formed by these materials can form the following Figure 6A and Figure 6B The isolation structure 300 is shown. Accordingly, the materials of the third sub-support layer 311a, the fourth sub-support layer 312a, and the second crown 320a are all different. For example, the third sub-support layer 311a, the fourth sub-support layer 312a, and the second crown 320a can be molybdenum, aluminum, and titanium, respectively. The corrosion resistance of aluminum, molybdenum, and titanium increases in sequence. When etching, the film formed by these materials can form a film as shown in FIG. Figure 6A and Figure 6B Charge accumulation structure 300a is shown.

[0108] In at least one embodiment of the present disclosure, Figure 3A and Figure 3B As shown, when the display panel is provided with a pixel defining layer 330, in the display area, the pixel defining layer 330 is located between the isolation structure 300 and the substrate 100, and in the transition area 11c, the pixel defining layer 330 is located between the charge accumulation structure 300a and the substrate 100. In the display area 11a, the pixel defining layer 330 encloses a plurality of pixel openings 302, which define the light-emitting units 200. The pixel openings 302 and the isolation openings 301 that define the same light-emitting unit 200 are connected to each other. For example, the orthographic projection of the pixel opening 302 on the substrate 100 is located within the orthographic projection of the corresponding isolation opening 301 on the substrate 100. The first light-emitting functional layer 220 and the second electrode 230 fill the pixel openings 302 and extend to the surface of the pixel defining layer 330 facing away from the substrate 100.

[0109] It should be noted that in the transition region 11c, it is not necessary to set the pixel opening 302 in the pixel defining layer 330 so as to maintain a continuous planar structure, that is, the orthographic projection of the mesh in the charge collection structure 300a on the surface where the substrate 110 is located is located within the orthographic projection of the pixel defining layer 330 on the surface where the substrate 110 is located.

[0110] In at least one embodiment of the present disclosure, the pixel defining layer 330 includes an inorganic layer. The inorganic layer has high density and strong resistance, thereby reducing the design thickness of the display panel. In addition, a smaller thickness of the pixel defining layer 330 is beneficial to the continuity of the second electrode 230 and the third electrode 230a. For example, the first light-emitting functional layer 220 and the second electrode 230 of the light-emitting unit 200 can be formed by evaporation based on the isolation structure 300, and the isolation structure 300 can limit the first light-emitting functional layer 220 and the second electrode 230. Therefore, the pixel defining layer 330 does not need to be too thick to accommodate the first light-emitting functional layer 220, that is, the pixel defining layer 330 does not need to be made of a thick organic material. In addition, if the pixel defining layer 330 is an inorganic layer, it can have a smaller thickness, thereby reducing the step difference at the edge of the pixel opening 302, thereby improving the film continuity of the second electrode 230 at this location, thereby reducing the impedance at the connection between the second electrode 230 and the isolation structure 300.

[0111] In at least one embodiment of the present disclosure, Figure 3A and Figure 3BAs shown, the pixel defining layer 330 covers the edge of the first electrode 210. In this way, the pixel defining layer 330 can enable the first electrode 210 to have a larger design area to increase the light-emitting area of ​​the light-emitting unit 200. For example, when a pixel defining layer 330 is provided in the display panel, the first electrode 210 of the light-emitting unit 200 can be designed to have a larger area to avoid positional offset (error caused by process accuracy) between the first electrode 210 and the isolation structure 300 in the actual process, which makes it difficult to ensure the actual light-emitting area of ​​the light-emitting unit, thereby improving the aperture ratio (related to the light-emitting area of ​​the light-emitting unit) and brightness of the display image of the display panel. For example, when the pixel defining layer 330 is not provided, in order to avoid the first electrode 210 from being connected to the isolation structure 300, the design area of ​​the first electrode 210 is limited. If the position of the first electrode 210 is offset, the light-emitting area of ​​the light-emitting unit may be smaller than the design area, thereby reducing the brightness of the light-emitting unit.

[0112] In at least one embodiment of the present disclosure, it is possible to refer again to Figure 4A and Figure 4B When the display panel includes the first encapsulation layer 510 , the first encapsulation layer 510 is located on the side of the display function layer away from the substrate 100 and covers the light emitting unit 200 to encapsulate and protect the light emitting unit 200 .

[0113] In at least one embodiment of the present disclosure, Figure 4A and Figure 4B As shown, the first encapsulation layer 510 includes a plurality of encapsulation units 511 spaced apart from each other, and the encapsulation units 511 cover the mesh of the isolation opening 301 and the charge collection structure 300a. The light-emitting units 200 are prepared in batches. During the preparation of each batch, the encapsulation units 511 can protect the prepared light-emitting units 200. Accordingly, during these preparation processes, the first encapsulation layer 510 will be formed into a plurality of encapsulation units 511 spaced apart from each other. The encapsulation units 511 correspond to the mesh of the isolation opening 301 and the charge collection structure 300a, respectively, to cover the light-emitting units 200 confined in the isolation opening 301 and the third electrode located in the mesh for protection. Optionally, two adjacent encapsulation units 511 located on the same isolation structure 300 are spaced apart.

[0114] In at least one embodiment of the present disclosure, Figure 3A and Figure 3B As shown, at least based on the consideration of improving the packaging effect, the packaging unit 511 can extend to the side of the crown (including the first crown and the second crown) away from the substrate 100. The principle can be seen in the following description of Figures 7 to 10 In this case, the portion of the packaging unit 511 that overlaps with the crown portion forms an overhang portion 411 a to be spaced apart from the crown portion.

[0115] For example, the light-emitting unit 200 is classified into light-emitting units that emit red light (R), green light (G) and blue light (B), respectively. During the preparation process, the light-emitting units R, G, and B are prepared in sequence. When preparing the light-emitting unit R, a light-emitting unit R is formed in each isolation opening 301. A first encapsulation layer 510 is prepared on the display panel to cover the light-emitting unit R. Then, the first encapsulation layer 510 as well as the second electrode and the first light-emitting functional layer in some isolation openings 301 (used to form light-emitting units G and B in the final product) are removed. During this process, the first encapsulation layer 510 is used to protect the light-emitting units R in other isolation openings 301. Based on this method, the light-emitting units G and B are prepared in sequence to finally form the first encapsulation layer 510. That is, the first encapsulation layer 510 on the entire display panel is obtained by multiple processes, and the first encapsulation layer 510 is also formed to include multiple encapsulation units 511 spaced apart from each other. In this process, the second light-emitting functional layer and the third electrode can be prepared in the mesh of the charge accumulation structure 300a during the preparation of any one of the light-emitting units R, G, and B, or, when preparing each of the light-emitting units R, G, and B, the second light-emitting functional layer and the third electrode can be prepared respectively in different meshes of the charge accumulation structure 300a.

[0116] In at least one embodiment of the present disclosure, Figure 4A and Figure 4B As shown, when the display panel includes a second encapsulation layer 520 and a third encapsulation layer 530, in the display area, the second encapsulation layer 520 is located between the first encapsulation layer 510 and the third encapsulation layer 530 to encapsulate and protect the light-emitting unit 200. The second encapsulation layer 520 is a planarization layer to facilitate the placement of other components on the encapsulation layer 500. For example, the second encapsulation layer 520 is an organic layer to provide a certain degree of flexibility and relieve stress on the first encapsulation layer 510 and the third encapsulation layer 530, thereby improving the reliability of the display panel and further facilitating its application in the field of flexible displays. In addition, the first encapsulation layer 510 and the third encapsulation layer 530, as inorganic layers, are highly dense and provide a strong barrier to water, oxygen, and other substances.

[0117] The above briefly describes the structure of some components in the display panel. Figure 3A and Figure 3B Taking the display panel shown as an example, the method for preparing the display panel is exemplarily described.

[0118] like Figure 7 and Figure 3BAs shown, a substrate 100 is provided and first electrodes 210 arranged in an array are formed on the substrate 100, and the first electrodes 210 are formed in the display area; an insulating material film layer (for example, an inorganic material film layer) is deposited on the substrate 100 on which the first electrodes 210 are formed; a first supporting portion 310, a first crown portion 320, a second supporting portion 310a and a second crown portion 320a are formed on the display panel to obtain an isolation structure 300 enclosing an isolation opening and a charge collection structure 300a having a mesh; a composition process is performed on the insulating material film layer to form a pixel defining layer 330 (the plane shape in the display area is a grid shape), and the pixel defining layer 330 covers the gaps between adjacent first electrodes 210.

[0119] In an embodiment of the present disclosure, the patterning process may be a photolithography patterning process, which may include, for example, coating a photoresist on a structural layer to be patterned, exposing the photoresist using a mask, developing the exposed photoresist to obtain a photoresist pattern, etching the structural layer using the photoresist pattern (optionally wet etching or dry etching), and then optionally removing the photoresist pattern. It should be noted that when the material of the structural layer (e.g., the photoresist pattern 600 described below) includes photoresist, the structural layer may be directly exposed through a mask to form the desired pattern.

[0120] like Figure 8 and Figure 3B As shown, a first light-emitting functional layer 220 and a second electrode 230 are evaporated on the substrate 100 to form a light-emitting unit 200 (assuming a light-emitting unit R emitting red light) in each isolation opening 301 of the isolation structure 300. During this stage, a second light-emitting functional layer 220a and a third electrode 230a are also formed in the mesh. No mask is used in this evaporation process, so the evaporated material is also deposited on the crown 320. It should be noted that in actual processes, the evaporated material is deposited on the upper surface and sidewalls (not shown) of the first and second crowns 320 and 320a facing away from the substrate 100. A first encapsulation film 510a is then deposited to cover the light-emitting unit 200, the isolation structure 300, and the charge accumulation structure 300a. For example, the light-emitting layer in the evaporated first light-emitting functional layer 220 can emit red light.

[0121] like Figure 9 and Figure 3BAs shown, a photoresist is formed (e.g., coated) on the substrate 100 having the first encapsulation film 510a formed thereon, and then patterned to form a photoresist pattern 600. The photoresist pattern 600 only covers a portion of the isolation opening 301 of the isolation structure 300. It should be noted that if the third electrode 230a formed in the previous step is retained, the photoresist pattern 600 can be selected to cover the mesh holes. Correspondingly, if the third electrode 230a is selected to be formed in a subsequent process, the photoresist pattern 600 does not cover the mesh holes in this step.

[0122] It should be noted that, for the display panel to be finally prepared, if the light emitting colors of the light emitting units formed in adjacent isolation openings are the same, then the above-mentioned photoresist pattern 600 must cover the two adjacent isolation openings and cover the portion of the isolation structure located between the two adjacent isolation openings.

[0123] like Figure 10 and Figure 3B As shown, in the display area, the surface of the display panel is etched using the photoresist pattern 600 as a mask to remove the first encapsulation film 510a, the second electrode 230, and the first light-emitting functional layer 220 that are not covered by the photoresist pattern 500. The remaining portions of the first encapsulation film 510a form the first encapsulation layer 510 (including the encapsulation unit 511). The remaining photoresist pattern 600 is then removed. It should be noted that in this process, if the third electrode in the mesh is removed and the photoresist pattern 600 does not cover the third electrode, the second light-emitting functional layer and the third electrode will also be removed during this etching process.

[0124] Repeat the above process steps to form a light emitting unit 200 emitting green light and a light emitting unit 200 emitting blue light in other isolation openings 301, thereby forming Figure 3A and Figure 3B The display panel shown.

[0125] In some embodiments of the present disclosure, a charge collection structure can be independently configured to collect only charge and disperse its distribution, thereby avoiding the risk of static electricity concentration and electrostatic breakdown. In this case, there is no need to drain the accumulated static charge. In addition, this design can reduce or eliminate the need for wiring arrangements (such as the wires described below) in the transition region, thereby improving the packaging effect in the transition region.

[0126] In other embodiments of the present disclosure, the display panel may be provided with an additional conductive line extending into the transition region to connect to the charge accumulation structure, thereby conducting away the charge accumulated by the charge accumulation structure. For example, the display panel may be provided with a ground line, and the conductive line may be connected to the ground line.

[0127] In some further embodiments of the present disclosure, an electrostatic shielding layer and / or a structure for conducting static electricity (such as a support frame (or shell) provided on the outside of the display panel to fix it) may be provided in the display panel, and the charge accumulation structure may be electrically connected to the electrostatic shielding layer and / or the structure for conducting static electricity to conduct the accumulated charges.

[0128] In at least one embodiment of the present disclosure, the display panel may further include a touch structure located on the light-emitting side, an optical film (such as a microlens, a polarizer), a color film, a cover plate, and other structures.

[0129] For example, in the case where the display panel includes the above-mentioned third encapsulation layer, the touch structure can be located on the side of the third encapsulation layer facing away from the substrate and in the display area. For example, the touch structure can be formed directly on the third encapsulation layer, or a buffer layer can be formed on the third encapsulation layer, and then the touch structure can be formed on the buffer layer.

[0130] For example, the optical film may include a microlens located in the display area. The microlens may be located on a side of the third encapsulation layer facing away from the substrate, or between the first encapsulation layer and the third encapsulation layer.

[0131] For example, the color filter located in the display area may be located on the side of the third encapsulation layer facing away from the substrate, or between the first encapsulation layer and the third encapsulation layer.

[0132] At least one embodiment of the present disclosure provides another display panel. Figure 1 Figure 6. Display panel 10 includes a display area 11a, an aperture area 11b, and at least one transition area 11c located between display area 11a and aperture area 11b. Display panel 10 comprises: a substrate 100, a charge accumulation structure 300a, a display function layer, and an isolation structure 300. The charge accumulation structure 300a is located on substrate 100 and in transition area 11c. The charge accumulation structure 300a surrounds at least a portion of aperture area 11b and is at least partially conductive. The display function layer is located on substrate 100 and includes light-emitting units 200 located in display area 11a. The isolation structure 300 is located in display area 11a and on substrate 100. The isolation structure 300 encloses a plurality of isolation openings 301, with at least a portion of the light-emitting units 200 located within the isolation openings 301.

[0133] Optionally, the isolation structure 300 includes a first support portion 310 and a first crown portion 320, the first support portion 310 is located between the first crown portion 320 and the substrate 100, and the orthographic projection of the first support portion 310 on the substrate 100 is located within the orthographic projection of the first crown portion 320 on the substrate 100, and the charge accumulation structure 300a includes a second support portion 310a and a second crown portion 320a, the second support portion 310a is located between the second crown portion 320a and the substrate 100, and the orthographic projection of the second support portion 310a on the substrate 100 is located within the orthographic projection of the second crown portion 320a on the substrate 100.

[0134] Preferably, the first support portion 310 and the second support portion 310a are formed in the same layer and made of the same material; and / or the first crown portion 320 and the second crown portion 320a are formed in the same layer and made of the same material.

[0135] At least one embodiment of the present disclosure provides a display device, which may include the display panel of the above-mentioned embodiment. For example, the display device may be any product or component with a display function, such as a television, a digital camera, a mobile phone, a watch, a tablet computer, a laptop computer, a navigation system, or the like.

[0136] The above description is only a preferred embodiment of this specification and is not intended to limit this specification. Any modifications, equivalent replacements, etc. made within the spirit and principles of this specification should be included in the scope of protection of this specification.

Claims

1. A display panel, characterized in that: The display panel comprises a display area, an opening area, and at least one transition area between the display area and the opening area, wherein the display panel comprises: substrate; A charge collection structure is located on the substrate and in the transition region, wherein the charge collection structure surrounds at least a portion of the open area and is at least partially a conductive structure.

2. The display panel according to claim 1, wherein: The substrate comprises a substrate and a driving circuit layer located on the substrate, at least a portion of the driving circuit layer is located in the display area, and the charge accumulation structure is located on the substrate; Preferably, the charge accumulation surrounds the open area.

3. The display panel according to claim 1 or 2, wherein: The charge accumulation structure includes a plurality of sub-charge accumulation portions, which are spaced apart from each other and sequentially surround the open area in a direction away from the open area.

4. The display panel according to claim 3, wherein: The charge accumulation structure further includes at least one conductive connecting portion, wherein the connecting portion is located between adjacent sub-charge accumulation portions and is connected to the adjacent sub-charge accumulation portions.

5. The display panel according to claim 3, wherein: The sub-charge accumulation portion includes a grid-like structure; Preferably, the number of the sub-charge accumulation portions is 2 to 5.

6. The display panel according to claim 3, wherein: It also includes a first encapsulation layer, a second encapsulation layer and a third encapsulation layer stacked in sequence on the substrate, The first encapsulation layer and the third encapsulation layer include inorganic layers, the second encapsulation layer includes an organic layer, the first encapsulation layer and the second encapsulation layer are located in the display area and the transition area, and the third encapsulation layer is located in the display area and the transition area. The third encapsulation layer covers the side of the charge accumulation structure away from the substrate and covers the gaps between the sub-charge accumulation parts; Preferably, the second encapsulation layer is located in the edge area of ​​the transition region; Preferably, the first encapsulation layer covers at least a portion of a side of the charge accumulation structure away from the substrate.

7. The display panel according to claim 6, wherein: Also includes: a pixel defining layer, located in the display area and the transition area; wherein, in the transition region, the pixel defining layer is located between the charge accumulation structure and the substrate, and the pixel defining layer comprises an inorganic layer; Preferably, the third encapsulation layer contacts the pixel defining layer at a gap between adjacent sub-charge accumulation portions.

8. The display panel according to claim 7, wherein: The system further includes at least one blocking dam, wherein the blocking dam is located between the display area and the charge accumulation structure, and between the substrate and the pixel defining layer.

9. The display panel according to claim 1 or 2, characterized in that: Also includes: A display function layer, located on the substrate and comprising a light-emitting unit located in the display area; An isolation structure is located in the display area and on the substrate. The isolation structure encloses a plurality of isolation openings, and at least a portion of the light-emitting unit is located in the isolation openings.

10. The display panel according to claim 9, wherein: At least a portion of the charge accumulation structure is in the same layer and made of the same material as the isolation structure.

11. The display panel according to claim 10, wherein: The orthographic projection of the end portion of the isolation structure facing the substrate on the substrate is located within the orthographic projection of the end portion of the isolation structure facing away from the substrate on the substrate; and / or, An orthographic projection of an end portion of the charge concentrating structure facing the substrate on the substrate is located within an orthographic projection of an end portion of the charge concentrating structure facing away from the substrate on the substrate.

12. The display panel according to claim 11, wherein: The isolation structure includes a first support portion and a first crown portion, wherein the first support portion is located between the first crown portion and the base plate, and an orthographic projection of the first support portion on the base plate is located within an orthographic projection of the first crown portion on the base plate; The charge accumulation structure includes a second support portion and a second crown portion, wherein the second support portion is located between the second crown portion and the substrate, and an orthographic projection of the second support portion on the substrate is located within an orthographic projection of the second crown portion on the substrate; Preferably, at least a portion of the first supporting portion and the second supporting portion is a conductive structure; Preferably, the first supporting portion and the second supporting portion are formed in the same layer and made of the same material; and / or the first crown portion and the second crown portion are formed in the same layer and made of the same material.

13. The display panel according to claim 12, wherein: The light-emitting unit includes a first electrode, a first light-emitting functional layer, and a second electrode sequentially stacked on the substrate, wherein the first light-emitting functional layer and the second electrode are located in the isolation opening, and The second electrode is connected to the first supporting portion.

14. The display panel according to claim 13, wherein: The charge accumulation structure includes a plurality of sub-charge accumulation portions, the sub-charge accumulation portions are spaced apart from each other and sequentially surround the opening area in a direction away from the opening area, and the sub-charge accumulation portions include a grid structure, and A second light-emitting functional layer and a third electrode are provided in the meshes of the grid-like structure of the sub-charge accumulation portion, and the third electrode is connected to the second supporting portion.

15. The display panel according to claim 14, wherein: The charge accumulation structure further includes at least one conductive connecting portion, wherein the connecting portion is located between adjacent sub-charge accumulation portions and is connected to adjacent sub-charge accumulation portions; Preferably, the connecting portion is in the same layer and made of the same material as the first supporting portion and / or the second electrode.

16. The display panel according to claim 14, wherein: The display panel further includes a first encapsulation layer covering the isolation structure and the charge accumulation structure, wherein the first encapsulation layer includes a plurality of encapsulation units spaced apart from each other, the encapsulation units corresponding to the isolation openings and the mesh holes, respectively, and covering the corresponding isolation openings and the mesh holes; Preferably, two adjacent packaging units located on the same isolation structure are arranged at intervals.

17. The display panel according to claim 12, wherein: The first supporting portion includes a first sub-support layer and a second sub-support layer, the first sub-support layer is located between the second sub-support layer and the substrate, the second sub-support layer is located between the first sub-support layer and the first crown portion, and the orthographic projection of the second sub-support layer on the substrate is located within the orthographic projection of the first sub-support layer on the substrate; Preferably, the second supporting portion includes a third sub-support layer and a fourth sub-support layer, the third sub-support layer is located between the fourth sub-support layer and the substrate, the fourth sub-support layer is located between the third sub-support layer and the second crown portion, and the orthographic projection of the fourth sub-support layer on the substrate is located within the orthographic projection of the third sub-support layer on the substrate.

18. The display panel according to claim 11, wherein: Also includes: a pixel defining layer, located in the display area and the transition area, between the isolation structure and the substrate, and between the charge accumulation structure and the substrate; Wherein, in the display area, the pixel definition layer encloses a plurality of pixel openings, at least some of the pixel openings limit the light-emitting units, and the pixel openings and the isolation openings of the same light-emitting unit are limited to communicate with each other; Preferably, the pixel defining layer comprises an inorganic layer.

19. A display panel, characterized in that: The display panel comprises a display area, an opening area, and at least one transition area between the display area and the opening area, wherein the display panel comprises: substrate; a charge accumulation structure located on the substrate and in the transition region, wherein the charge accumulation structure surrounds at least a portion of the open area and is at least partially a conductive structure; A display function layer, located on the substrate and comprising a light-emitting unit located in the display area; An isolation structure is located in the display area and on the substrate. The isolation structure encloses a plurality of isolation openings, and at least a portion of the light-emitting unit is located in the isolation openings.

20. A display device, characterized in that: A display panel comprising the display panel according to any one of claims 1 to 19.

Citation Information

Patent Citations

  • Display panel and display device

    CN118742138A

  • Display panel, display device and preparation method of display panel

    CN118785764A

  • Display panel and display device

    CN118785765A

  • Display panel and preparation method thereof

    CN119110610A

  • Display panel and display device

    CN119136583A