Adhesive tape pasting end face processing device and adhesive tape pasting end face processing method

Abstract

The invention provides an adhesive tape pasting end face processing device and an adhesive tape pasting end face processing method, which have a simple structure and can suppress the occurrence of poor adhesion such as wrinkles or rolling of an adhesive tape even under the condition that the end face processing of a blank is performed at a high speed. The adhesive tape pasting end surface processing device (100) is used for pasting a long adhesive tape to a pasting end part of a blank (B) and covering an end surface (E) of the blank, and is provided with a conveying mechanism (101) for conveying the blank. From the upstream side along the conveying path, the following are arranged: a blank heating mechanism (110) for heating the adhesive end part of the blank and supplying the adhesive tape which is cut into a length corresponding to the adhesive end part of the blank in a manner that the length direction of the adhesive tape is consistent with the conveying direction of the blank; an adhesive tape bonding mechanism (120) for bonding the material to one surface of the material while conveying the material; an adhesive tape folding mechanism (140) for folding back the protruding portion of the adhesive tape bonded to the material; and a welding mechanism for bonding the folded adhesive tape to the other surface of the material.

Description

Technical Field

[0001] The present invention relates to a technology for performing water-resistant processing on the end surface of a blank for forming a paper container such as a paper cup, and more particularly to a tape-bonding end surface treatment device for coating the end surface of the blank with tape, and a tape-bonding end surface treatment method. Background Art

[0002] Conventionally, paper containers such as paper cups have poor water resistance and gas barrier properties if made solely of base paper. Therefore, a paper laminate has been used. This paper laminate is made by laminating a resin layer, serving as a water barrier, onto the surface of the base paper (paper substrate) that serves as the inner surface of the container.

[0003] As is known to all, the inverted frustum-shaped main body of a paper cup is formed by winding a blank punched into a fan shape and overlapping and bonding them liquid-tightly with one side end (bonding end) as the inner surface side and the other side end as the outer surface side. However, the end surface of the side end of one side of the blank serving as the inner surface side is end-treated in such a way as to ensure water resistance without exposing the base paper.

[0004] As end treatments, the following treatments can be listed: for example, a thinning and curling process in which the outer surface of the side end of the blank is cut to approximately half the thickness, and the remaining portion of the approximately half thickness is folded back toward the outer surface, thereby overlapping and bonding the cut portion in a gapless manner (for example, see patent document 1); a covering process in which a film of length in the longitudinal direction is prepared, cut short so that it is adsorbed on upper and lower sealing plates, and the blank is inserted into the narrow gap to perform heat sealing from the top and bottom directions; and a covering process in which a resin film is laminated on the surface of the base paper as a water-blocking layer, the resin film is cut while protruding from the side end edge of the base paper, and the film is folded back and pasted on the back side (for example, see patent documents 2 and 3).

[0005] However, when thinning and curling are performed, new hygiene issues may arise, such as the generation of paper dust or paste contamination. Furthermore, in the coating process where a film is adsorbed onto upper and lower sealing plates to sandwich the blank and heat-seal it, the following problems arise: different film widths are required for each size of the blank being processed, and the complex mechanism makes it difficult to process at high speeds. Furthermore, in the coating process where a resin film laminated on a base paper is folded back, the following problems arise: the resin film needs to be cut larger than the size of the base paper, resulting in an additional punching process that reduces productivity, and the need for dedicated processing steps and blanks, which reduces versatility.

[0006] On the other hand, other end treatments that do not cause these problems include: sticking a separately prepared strip of water-resistant tape to the side ends of the blank in a manner that covers the front and back surfaces to cover the end surfaces (for example, see Patent Documents 4 to 6).

[0007] Prior art literature

[0008] Patent Literature

[0009] Patent Document 1: Japanese Patent Application Laid-Open No. 2003-312636

[0010] Patent Document 2: Japanese Patent Application Laid-Open No. 2012-020769

[0011] Patent Document 3: Japanese Patent Application Laid-Open No. 52-138280

[0012] Patent Document 4: Japanese Patent Application Laid-Open No. 57-063241

[0013] Patent Document 5: Japanese Patent Application Laid-Open No. 11-157526

[0014] Patent Document 6: Japanese Patent No. 5211849 Summary of the Invention

[0015] However, when performing end surface treatment by attaching a strip of adhesive tape to the side end of a blank, as disclosed in Patent Documents 4 to 6, it is difficult to adhere the strip of adhesive tape to the side end surface of the blank at high speed and with high precision, and poor adhesion, such as wrinkling or curling of the tape, may sometimes occur. Furthermore, even if the adhesive tape can be adhered to the side end surface of the blank, folding it back to the back side so as to cover the end surface of the blank requires a complex mechanism and considerable time. Therefore, in reality, it is difficult to fully achieve simplification of the device structure or shortening of production.

[0016] The present invention is completed to solve the above-mentioned problems. Its purpose is to provide a tape-sticking end face processing device and a tape-sticking end face processing method with a simple structure, which can suppress the occurrence of poor adhesion such as wrinkling or curling of the tape even when the end face of the blank is processed at high speed. Moreover, the tape can be automatically folded back to the back side of the blank while the blank is transported. As a result, the end face processing using the tape can be carried out in a short time and with a high yield, thereby achieving high production efficiency.

[0017] The tape-pasting end-face processing device of the present invention is a device for pasting a long strip of tape on the bonding end of a blank to cover the end face of the bonding end of the blank, and is characterized in that the tape-pasting end-face processing device has: a conveying mechanism for conveying the blank along a conveying path, and a blank heating mechanism, a tape bonding mechanism, a tape folding mechanism and a welding mechanism are arranged from the upstream side along the conveying path, the blank heating mechanism is configured to heat the bonding end of the blank, and the tape bonding mechanism is configured to heat the cut end of the blank. The tape having a length corresponding to the bonding end portion of the blank is supplied in a manner such that the length direction of the tape is consistent with the blank conveying direction, and is pasted on the bonding end area on one side of the blank in a state of protruding from the bonding end edge of the blank while the blank is conveyed. The tape folding mechanism is configured to fold back the protruding portion of the tape pasted on the blank protruding from the blank along the bonding end edge of the blank, and the welding mechanism is configured to paste the folded tape on the bonding end area on the other side of the blank.

[0018] In the tape-adhered end surface processing device of the present invention, the tape bonding mechanism preferably feeds out the tape in synchronization with a conveyance speed of the blank conveyed by the conveyance mechanism.

[0019] In addition, in the tape pasting end face processing device of the present invention, the tape folding mechanism has an insertion passage open on one side, which conveys the blank while allowing the bonding end of the blank to pass through. The insertion passage can be constructed as: a folding wall whose angle relative to the blank plane continuously decreases as the blank moves along the blank conveying direction.

[0020] Furthermore, in the tape-adhering end surface processing device of the present invention, the tape folding mechanism is preferably configured such that the tape folded back by the tape folding mechanism forms a space between the end surface of the bonding end portion of the blank and the tape.

[0021] In addition, in the tape pasting end face processing device of the present invention, it can be constructed so that there is a tape temporary fixing mechanism between the tape bonding mechanism and the tape folding mechanism, which melts the tape to at least a part of the upstream side of the blank conveying direction in the bonding end area of ​​one side of the blank.

[0022] In addition, in the tape pasting end face processing device of the present invention, the welding mechanism can be constructed as: a first welding part, which welds the folded tape to a part of the bonding end area on the other side of the blank; and a second welding part, which welds approximately the entire surface of the tape while temporarily fixing a part of the tape by the first welding part.

[0023] In addition, in the tape pasting end surface processing device of the present invention, the first welding part can be constructed as: having: a tape correction guide part that maintains the folded state of the tape forcibly close to the other side of the blank by the tape folding mechanism.

[0024] The tape end surface processing method of the present invention is a tape end surface processing method for pasting a long strip of tape to the bonding end of a blank to cover the end surface of the bonding end of the blank, and is characterized in that it includes the following processes: a blank heating process for heating the bonding end of the blank conveyed along a conveying path; a tape bonding process in which the tape cut into a length corresponding to the bonding end of the blank is supplied in a manner that the length direction of the tape is consistent with the blank conveying direction, and the blank is conveyed while being pasted to the bonding end area on one side of the blank in a state protruding from the bonding end edge of the blank; a tape folding process in which the protruding portion of the tape pasted on the blank protruding from the blank is folded back along the bonding end edge of the blank; and a welding process in which the folded back tape is pasted to the bonding end area on the other side of the blank.

[0025] Effects of the Invention

[0026] The tape-applied end surface treatment device and tape-applied end surface treatment method of the present invention include a web heating mechanism for preheating the bonded end of a web, a tape bonding mechanism for applying the tape to one side of the web with the tape protruding from the bonded end edge, a tape folding mechanism for folding the protruding portion of the tape back to the other side, and a welding mechanism for applying the folded-back tape to the web. Basically, the tape is applied to the bonded end of the web over both sides, thereby covering the end surface. This prevents exposure of the base paper at the end surface, thereby ensuring desired water resistance. Furthermore, the device has a simple structure, and even when performing web end surface treatment at high speed, it can continuously and automatically perform the process with high precision. Therefore, it is possible to suppress the occurrence of adhesive defects such as wrinkles or folding of the tape. Furthermore, the tape can be folded back to the back side of the web while the web is being conveyed. Consequently, web end surface treatment using tape can be performed in a short time with a high yield, thereby achieving high production efficiency.

[0027] In addition, in the tape bonding mechanism, since the tape is cut into a length corresponding to the bonding end of the blank, when the specifications of the blank are changed, tape of a length corresponding to the blank can be supplied. When the specifications of the blank are changed, there is no need to change the width size of the tape, etc., thereby achieving higher versatility.

[0028] In addition, according to the tape bonding end surface processing device configured as a tape bonding mechanism to synchronize the conveying speed of the tape and the blank, since the blank is conveyed in a preheated state on one side and the tape is supplied synchronously therewith, the blank and the tape move and contact at the same speed, so that the tape T is bonded to the blank B. Therefore, even under high-speed operation, the tape can be bonded with high precision without wrinkles.

[0029] In addition, according to the tape pasting end surface processing device having a folding wall whose angle relative to the blank plane continuously decreases as the blank moves along the conveying direction, and having a tape folding mechanism with an insertion path open on one side, as long as the tape passes through the insertion path in a state where the tape is pasted to the bonding end area on one side of the blank during the conveying of the blank, the tape can be folded back to the other side of the blank at a manner close to 180 degrees. Therefore, the tape can be reliably folded back with a simple structure. As a result, the tape can be pasted to the bonding end area on the other side of the blank with higher precision, thereby further improving production efficiency.

[0030] Furthermore, the tape folding mechanism includes a tape end surface treatment device configured to fold the tape back to create a space between the end surface of the blank's bonded end and the tape. This space between the blank's end surface and the tape allows for variations in the blank's end surface position and the tape's folding accuracy. Furthermore, when heat-sealing the blanks to form the final product, any remaining tape is melted and used as a resin material to fill the gaps that inevitably form between the blanks.

[0031] In addition, according to the tape sticking end surface processing device having a tape temporary fixing mechanism for melting the tape to at least a portion of the upstream side of the blank conveying direction in the bonding end area of ​​one side of the blank, at least the front end of the supplied tape in the blank conveying direction can be reliably temporarily fixed to one side of the blank, so that when the tape is folded back in the tape folding mechanism, the occurrence of wrinkles or deviations of the tape can be reliably suppressed, so that the end surface processing of the blank using the tape can be performed with higher precision.

[0032] In addition, according to the tape pasting end surface processing device which is constructed to have a first welding portion which welds a portion of the tape to the bonding end area on the other side of the blank, and a second welding portion which welds substantially the entire surface of the tape, since the tape can be welded to substantially the entire surface of the tape by using the second welding portion while the tape is reliably temporarily fixed to the other side of the blank by the first welding portion, the occurrence of wrinkles or deviations can be reliably suppressed when the entire surface of the tape is welded, so that the end surface processing of the blank using the tape can be performed with higher precision.

[0033] In addition, according to the tape pasting end face processing device configured as a first welding portion having a tape correction guide portion, since the tape can be welded to the bonding end area on the other side of the blank while reliably maintaining the folded state of the tape by the tape correction guide portion, the tape can be reliably temporarily fixed at the desired position without displacement, so the end face processing of the blank using the tape can be performed with higher precision.

[0034] In addition, when the folded state of the tape is maintained by external force such as a tape correction guide and no correction component is provided, the tape may return to its original state or an angle around the middle due to its elasticity after being discharged from the tape folding mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1A This is a schematic diagram (top view) showing an example of the configuration of a blank and a tape to be subjected to end surface treatment by the tape-applying end surface treatment apparatus of the present invention.

[0036] Figure 1BThis is a schematic diagram (X-ray cross-sectional view) showing an example of the configuration of a blank and a tape to be subjected to end surface treatment by the tape-applying end surface treatment device of the present invention.

[0037] Figure 2 It is a perspective view showing an example of the configuration of a tape-adhering end surface processing device according to one embodiment of the present invention.

[0038] Figure 3A Yes Figure 2 A three-dimensional diagram of the blank heating mechanism of the tape sticking end surface processing device.

[0039] Figure 3B Yes Figure 2 A cross-sectional view of a blank heating mechanism of a tape-pasting end surface processing device.

[0040] Figure 4A This is a simulation diagram (top view) showing a state where a tape is bonded to the front surface of a blank by a tape bonding mechanism.

[0041] Figure 4B This is a simulation diagram (cross-sectional view taken along line Y) showing a state in which a tape is bonded to the front surface of a blank by a tape bonding mechanism.

[0042] Figure 5A Yes Figure 2 A three-dimensional diagram of the tape bonding mechanism of the tape bonding end surface processing device.

[0043] Figure 5B Yes Figure 2 A side view of the tape bonding mechanism of the tape bonding end surface processing device.

[0044] Figure 5C Yes Figure 2 A partially enlarged side view of the tape bonding mechanism of the tape bonding end face processing device.

[0045] Figure 6A Yes Figure 2 A three-dimensional diagram of a temporary tape fixing mechanism of a tape sticking end surface processing device.

[0046] Figure 6B Yes Figure 2 A side view of a tape temporary fixing mechanism of a tape sticking end surface processing device.

[0047] Figure 7 It is a schematic plan view showing a state in which the tape is temporarily fixed to the front surface side of the blank by the tape temporary fixing mechanism.

[0048] Figure 8 Yes Figure 2 A side view of a tape folding mechanism of a tape sticking end surface processing device.

[0049] Figure 9 Yes Figure 2 Cross-sectional views of various sections in the tape folding mechanism of the tape sticking end surface processing device.

[0050] Figure 10A Yes Figure 2 A three-dimensional view of the first welding section of the tape sticking end surface processing device.

[0051] Figure 10B Yes Figure 2 A cross-sectional view of the first welding portion of the tape sticking end surface processing device.

[0052] Figure 11A Yes Figure 2 A three-dimensional view of the second welding section of the tape sticking end surface processing device.

[0053] Figure 11B Yes Figure 2 A cross-sectional view of the second welding portion of the tape sticking end surface processing device. DETAILED DESCRIPTION

[0054] Hereinafter, the present invention will be described in detail using the accompanying drawings.

[0055] The tape-applying end surface treatment device of the present invention continuously and automatically performs end surface treatment. This end surface treatment involves coating the end surface of a paper container, such as a paper cup, with a long strip of tape. This end surface treatment is intended to prevent the base paper from being exposed at the end surface of the blank, where it is bonded, located on the inner surface of the container. This prevents liquid from penetrating the end surface, thereby ensuring high water resistance for the container.

[0056] The blank B to be processed by the tape sticking end surface processing device of the present invention is used to form the main body of a paper cup, for example. Figure 1A As shown, it has a fan-shaped shape when viewed from above. The so-called fan-shaped shape is a shape obtained by cutting a circular ring from the center point (the fan axis) using two straight lines extending radially and at an acute angle to each other. In the tape-sticking end surface treatment device 100 of this embodiment, a strip of tape T is attached to the side end portion (adhesive end portion) formed by the straight line.

[0057] 〔Blank〕

[0058] The blank B can be formed by punching out the paper laminate 1 into a predetermined shape. The punching method is not particularly limited, and for example, various known punching devices can be used.

[0059] like Figure 1BAs shown, paper laminate 1 is formed by forming resin layers 3, 3, serving as water-blocking layers, on both surfaces of base paper 2, the primary material. To ensure that the paper container produced by assembling blank B is water-resistant, it suffices that the resin layers 3 be formed at least on the surface that will serve as the inner surface of the container. Furthermore, paper laminate 1 may have a laminated structure of three or more layers, and each resin layer 3 may be composed of a different resin material. Furthermore, barrier layers such as metallized layers, printed layers, and adhesive layers may also be provided.

[0060] The thickness of the blank B (the thickness of the paper laminate 1 ) is, for example, 150 to 450 μm.

[0061] The thickness of the resin layer 3 can be such that heat sealing properties can be achieved when the blanks B are bonded together by thermal bonding to assemble a paper container, for example, it can be in the range of 10 to 80 μm, and the thickness can be set according to the target area to be bonded.

[0062] As the base paper 2 , various known base papers can be used depending on the shape of the paper container, desired strength, and the like.

[0063] The base paper 2 can preferably be used in a grammage of 150 to 330 g / m 2 range of base paper.

[0064] As the resin material forming the resin layer 3, various known water-resistant resin materials can be used. Preferred materials include polyolefin resins such as polyethylene and polypropylene, polyvinyl alcohol resins, acrylic resins, methacrylic resins, vinyl chloride resins, polyvinylidene chloride resins, vinyl acetate resins, polyurethane resins, polyester fiber resins such as polyethylene terephthalate, polyamide resins such as nylon 6 and nylon 6,6, polystyrene resins, phenol resins, or mixtures thereof, which have both water resistance and heat sealability. Among these, polyethylene resin is preferably used from the perspectives of water resistance, heat sealability, and glass transition temperature.

[0065] 〔adhesive tape〕

[0066] The tape T attached to the side end of the blank B is formed of a film having a surface layer of a heat-sealable resin capable of being welded to the blank B. The tape T may have a single-layer structure or a multi-layer structure.

[0067] Taking the foldability and durability into consideration, the thickness of the tape T is preferably 50 to 100 μm, for example.

[0068] An example of the layer structure of the tape T is: polyethylene resin layer (thickness 20 μm) / polyethylene terephthalate resin layer (thickness 12 μm) / polyethylene resin layer (thickness 20 μm).

[0069] The tape T is provided to the tape bonding mechanism 120 described in detail later as a tape roll obtained by winding an uncut long narrow tape.

[0070] The width of the tape T is, for example, 5 to 20 mm, preferably 10 mm. If the width of the tape T is too large, the tape folding mechanism will inevitably be enlarged. If the width of the tape T is too small, it may not be reliably welded to the surface and back of the side end of the blank B.

[0071] [Tape sticking end surface treatment device]

[0072] The tape end surface treatment device 100 according to one embodiment of the present invention is a device for performing end surface treatment, wherein, in the end surface treatment, a long tape T is attached to the side end portion (bonding end portion) of the blank B to cover the end surface E of the side end portion, as shown in FIG. Figure 2 As shown, the tape pasting end surface processing device 100 comprises: a conveying mechanism 101 for conveying the blank B along the conveying path, and further comprises: a blank heating mechanism 110, which performs a blank heating process for heating the side end portion of the blank B; a tape bonding mechanism 120, which performs a tape bonding process for bonding a half body (hereinafter referred to as the "left half body") T1 consisting of approximately half of the width direction of the tape T that has been cut in advance to the bonding end area A1 of the side end portion in the surface (one side) of the blank B; a tape temporary fixing mechanism 130, which performs a tape bonding process for melting the tape T to the bonding end area A1. A process for temporarily fixing the tape on a portion of the upstream side in the conveying direction of the blank; a tape folding mechanism 140, which performs a tape folding process of folding the remaining half (hereinafter referred to as the "right half") T2 of the tape T protruding from the side end edge F on the surface side of the blank B back to the back side (the other side) along the side end edge (adhesive end edge) F of the blank B; a first welding part 150, which performs a first welding process of temporarily fixing the folded-back tape T to the adhesive end area A2 on the other side of the blank B; and a second welding part 160, which performs a second welding process of welding the entire surface of the folded-back tape T.

[0073] The blank heating mechanism 110, tape bonding mechanism 120, tape temporary fixing mechanism 130, tape folding mechanism 140, first welding section 150, and second welding section 160 are arranged along a linear conveying path from the upstream side, and perform the various steps of the taping end surface treatment method at various locations as the blank B is conveyed. Furthermore, the blank heating mechanism 110, tape bonding mechanism 120, tape temporary fixing mechanism 130, tape folding mechanism 140, first welding section 150, and second welding section 160 are controlled so as to operate in conjunction with one another during intermittent conveyance by the conveying mechanism 101. Thus, the taping end surface treatment apparatus 100 can continuously perform end surface treatment in which the end surface E of the side end portion of the blank B is coated with tape T.

[0074] The end surface treatment speed of the blank B performed by the tape-adhered end surface treatment apparatus 100 of the present invention is 120 to 180 sheets / min, and preferably 150 sheets / min or more, for example.

[0075] 〔Transportation Agency〕

[0076] The conveying mechanism 101 conveys the blank B intermittently and continuously in one direction. Specifically, the blank B is conveyed in a straight line in such a manner that the longitudinal direction of the end surface E of the side end portion to be processed (the direction in which the side end edge F extends) is consistent with the conveying direction. In addition, the conveying mechanism 101 preferably includes a conveying line 102 so that the side end portion to be processed is in a floating state (see FIG. Figure 3B ), for example, the central portion of the blank B is supported and conveyed in a state where 35 to 50 mm from the end surface E of the blank B protrudes outward from the conveying line 102.

[0077] Although the conveying mechanism 101 of the tape-attaching end surface processing device 100 of this embodiment employs a conveying method utilizing a vacuum suction conveyor, any method capable of achieving the intermittent conveying required by the present invention is not particularly limited, and various known configurations may be employed. For example, a conveying method utilizing a clamping member for gripping may also be employed.

[0078] 〔Blank heating mechanism〕

[0079] The blank heating mechanism 110 heats the front and back surfaces of the side end portions of the blank B to increase the temperature of the entire blank B and melt the resin layers 3 on the front and back surfaces of the side end portions of the blank B.

[0080] Specifically, if Figure 3A as well as Figure 3BAs shown, the blank heating mechanism 110 is configured to include a heating unit 111, which is provided on the conveying path of the side end portion of the blank B and heats the front side of the side end portion of the blank B; and a heating unit 116, which heats the back side of the side end portion of the blank B. By heating both the front and back sides of the side end portion of the blank B simultaneously, sufficient heat can be applied to the side end portion of the blank B even when the end face of the blank B is processed at high speed, thereby reliably raising the temperature of the blank B. This allows the tape T to be reliably bonded to the blank B in the subsequent tape bonding mechanism 120.

[0081] The heating units 111 and 116 are arranged on the conveying path at the side end of the blank B in a non-contact state with the blank B. Thus, the blank B can be heated as long as it is conveyed along the conveying direction and stops at a predetermined position.

[0082] Specifically, the heating units 111 and 116 are composed of hot air heaters, and the hot air outlets 112 and 117 for blowing hot air are arranged 3 to 8 mm (5 mm in this embodiment) away from the front and back surfaces of the side ends of the blank B. Although the hot air outlets 112 and 117 in this embodiment are formed by a plurality of micropores arranged along the same length as the longitudinal direction of the side ends of the blank B, the shape of the hot air outlets is not limited as long as the side ends of the blank B can be heated.

[0083] In the blank heating mechanism 110, it is sufficient to heat the areas on the front and back sides of the side ends of the blank B, including the adhesive end areas A1 and A2 for pasting the tape T, to a specified temperature, for example, heating the area 10 mm inside from the side end edge F.

[0084] In this embodiment, the temperature of the hot air from the heating unit 111 facing the surface of the blank B can be, for example, 440°C, and the temperature of the hot air from the heating unit 116 facing the back surface of the blank B can be, for example, 300°C. The temperatures of the heating units 111 and 116 on the surface and back surface of the blank B can be the same. However, in the tape bonding mechanism 120 described later, since the tape T is bonded to the surface of the side end of the blank B, the temperature of the heating unit 111 facing the surface of the blank B is preferably set higher. If the temperatures of the heating units 111 and 116 are too high, the moisture in the base paper 2 of the blank B may cause the resin forming the resin layer 3 to foam.

[0085] The specific heating method of the blank B by the blank heating mechanism 110 is not limited to the method using hot air as long as the front and back surfaces of the side ends of the blank B can be heated to a predetermined temperature, and various known structures can be adopted. For example, a heating method using a direct fire plate can also be adopted.

[0086] 〔Tape bonding mechanism〕

[0087] like Figure 4A 、 Figure 4B As shown, the tape bonding mechanism 120 cuts the tape T into a length corresponding to the side end of the blank B and bonds it to the bonding point P (refer to FIG. Figure 5B 、 Figure 5C ) is supplied in such a manner that the length direction of the tape T is consistent with the conveying direction of the blank, and while conveying the blank B, the left half T1 of the tape T is adhered to the bonding end area A1 on the surface side of the blank B, and the right half T2 of the tape T is positioned from the side edge F of the blank B toward the outside ( Figure 4A 、 Figure 4B The protruding extended state (center right).

[0088] The width of the tape T in this example is 10 mm, the width of the left half T1 of the tape T is 4.7 mm, and the width of the remaining right half T2 is 5.3 mm.

[0089] Specifically, if Figure 5A 、 Figure 5B 、 Figure 5C As shown, the tape bonding mechanism 120 includes: a tape conveying unit 121, which guides the uncut tape T from the tape material roll (not shown), and conveys it along the tape conveying path while applying tension through a tension roller, etc. as needed; a tape cutting unit 122, which cuts the tape T in the tape width direction perpendicular to the tape conveying direction on the tape conveying path; and a bonding unit 123, which is arranged on the downstream side of the tape conveying path of the tape cutting unit 122, and bonds the cut tape T to the bonding end area A1 on the surface side of the blank B.

[0090] The tape conveying unit 121 is not limited to a specific structure as long as it can convey an extremely thin tape T in a non-corrugated manner. For example, it can be configured such that the tape T is conveyed by a tape conveyor belt 125 that can absorb the tape T. Alternatively, it can be configured such that it has a groove and conveys the tape while being embedded in the groove. The tape conveyor belt 125 is stretched across a plurality of tension rollers and is driven by a driving roller in one direction ( Figure 5B In addition, the conveying path of the adhesive tape T conveyed by the adhesive tape conveying unit 121 has a section in which the adhesive tape T is conveyed vertically downward.

[0091] The tape conveying unit 121 draws out the tape T in synchronization with the conveying speed of the blank B conveyed by the conveying mechanism 101 and conveys it to the bonding point P. Therefore, at the bonding point P of the bonding unit 123, the conveying speed of the tape T is the same as the conveying speed of the blank B, and the conveying amount of the blank B and the tape T is the same. Therefore, the occurrence of wrinkles or deviations in the tape T is suppressed, and bonding can be performed.

[0092] The tape cutting unit 122 is preferably configured to cut the tape T conveyed by the tape transport unit 121 in a vertically downward section of the conveyance path. Because tension in the longitudinal direction (vertically downward) of the vertically positioned tape T is applied by its own weight, the rigidity of the tape T is increased, and the conveyance stability of the tape T is improved, thereby ensuring stable cutting of the tape T. The cut tape T is conveyed by the tape transport unit 121, held by suction on the tape conveyor belt 125, until it reaches the bonding unit 123.

[0093] Cut the tape T at the position shown in the following example: Figure 5B Indicated by the black arrow.

[0094] The tape T is cut in the tape width direction by the tape cutting unit 122 , so the tape width of the tape roll corresponds to the width of the tape T.

[0095] The bonding unit 123 includes a driving roller 126 which is also a tension roller for the tape conveyor belt 125 of the tape conveyor unit 121 and a bonding roller 127 which is arranged opposite to the driving roller 126 and rotates synchronously with the driving roller 126 so as to move in the same direction at the bonding point.

[0096] In the tape bonding mechanism 120, the uncut tape T is conveyed in the longitudinal direction and cut in the width direction. The cut tape T is then fed along the side edge F of the blank B while also being conveyed in the longitudinal direction. Since the conveying speed of the tape T is synchronized with the conveying speed of the blank B, the blank B heated by the blank heating mechanism 110 and the tape T overlap and are sandwiched between the drive roller 126 and the pressing roller 127. As a result, at the bonding point P, the left half T1 of the tape T contacts the bonding end region A1 on the surface side of the heated blank B. This pressure contact melts the resin layer 3 of the blank B into a bondable state, allowing the tape T to be bonded to the bonding end region A1.

[0097] Here, the configuration position relationship of the driving roller 126 and the pressing roller 127 relative to the thickness of the blank B or the tape T is explained. The thickness of the blank B is approximately 0.4 mm, the thickness of the tape T is approximately 0.05 mm, and the gap between the driving roller 126 and the pressing roller 127 is approximately 0.45 mm.

[0098] In addition, in this embodiment, although the positional relationship is configured such that there is a gap of a size corresponding to the thickness of the tape T, it can also be configured such that the pressing roller 127 is configured to press the driving roller 126 in a manner that applies an appropriate pressing pressure.

[0099] The area where the tape T is applied to the blank B by the tape bonding mechanism 120 is the central area after the upstream and downstream ends of the blank B in the conveying direction remain. The end area where the tape T is not applied is, for example, an area with a length t1 in the conveying direction of approximately 5 mm ± 1 mm. In other words, the length h of the tape T cut by the tape cutting unit 122 is shorter than the length of the end of the blank B (e.g., 110 mm) and is the length after subtracting the length of the end area where the tape T is not applied (e.g., 100 mm).

[0100] If the positional accuracy of bonding is low, the end surface covering effect may not be adequately achieved, or the curling process may be hindered when assembling the blank B, or the appearance may be deteriorated.

[0101] Furthermore, the end region becomes an open curled portion or a bottom portion due to assembly of the blank B, and therefore is not a portion exposed to the inside of the container.

[0102] The specific amount of protrusion of the tape T in the state of protruding outward relative to the bonding end area A1 on the surface side of the blank B will vary somewhat depending on the width of the tape T, but as long as it is reliably adhered to the surface and back sides of the side end portions of the blank B so that the end surface E is covered, it is sufficient. For example, it is preferably 20 to 80% of the width of the tape T after removing the length of the end surface E, and more preferably 50%.

[0103] The specific bonding method for bonding the tape T to the blank B in the bonding unit 123 is not limited to the method of pressing with two rollers, and various known configurations may be employed. For example, a method using a sealing plate (heat press plate) or a method utilizing ultrasonic waves may also be employed. Furthermore, the bonding method may be configured so that bonding occurs while the blank B is stationary, rather than while the blank B is being transported.

[0104] [Temporary fixing mechanism with adhesive tape]

[0105] like Figure 6A As shown, the tape temporary fixing mechanism 130 is arranged between the tape bonding mechanism 120 and the tape folding mechanism 140, and temporarily fixes the tape T to the surface side of the blank B. This is to prevent the tape T from being peeled off from the blank B in the tape folding mechanism 140 described later, or to improve the folding accuracy of the tape T.

[0106] The temporary fixation of the adhesive tape T is only required to weld the left half T1 of the adhesive tape T to at least a portion of the upstream side (front end side) of the blank conveying direction in the bonding end area A1 on the surface side of the blank B. In other words, it is only required to weld at least the front end side of the left half T1 of the adhesive tape T in the blank conveying direction to the front end side of the blank in the bonding end area A1 on the surface side of the blank B. Specifically, for example, the front end ( Figure 7 An area of ​​63 mm in the length direction (measured from the upper end) and the entire width (5 mm) of the left half T1 of the tape T in the width direction is welded to the blank B.

[0107] The temporary fixing of the tape T may be performed on the entire adhesive end region A1 , that is, on the entire left half T1 of the tape T.

[0108] Specifically, if Figure 6B As shown, the tape temporary fixing mechanism 130 is constructed to include: an upper sealing plate 131 that is arranged on the conveying path of the side end of the blank B and is movable up and down for heating the surface side of the side end of the blank B, and a fixed lower sealing plate 136 that heats the back side of the side end of the blank B.

[0109] like Figure 7 As shown, the upper sealing plate 131 and the lower sealing plate 136 each have a size corresponding to the area where the left half T1 of the tape T is to be temporarily fixed (5 mm in width and 63 mm in length t2 in the blank conveying direction).

[0110] By lowering the upper sealing plate 131 while the blank B is held at a predetermined position, the predetermined area where the tape T is to be temporarily secured to the side ends of the blank B is sandwiched between the upper sealing plate 131 and the lower sealing plate 136, thereby enabling temporary securing. When the upper sealing plate 131 is in the raised position, the space between the upper sealing plate 131 and the lower sealing plate 136 serves as a conveyance path for the side ends of the blank B, allowing the blank B to pass through.

[0111] In this embodiment, the temperature of the upper sealing plate 131 can be, for example, 130°C, and the temperature of the lower sealing plate 136 can be, for example, 60°C. Because the tape T is temporarily attached to the surface of the side end of the blank B, the temperatures of the upper sealing plate 131 and the lower sealing plate 136 are preferably set higher. If the temperature of the lower sealing plate 136 is too high, the blank B may stick to the lower sealing plate 136. Alternatively, the temperatures of the upper sealing plate 131 and the lower sealing plate 136 may be set higher as long as there is no risk of the tape T or the blank B sticking to them.

[0112] From the perspective of preventing the resin layer of the blank B or the tape T from adhering to the above-mentioned sealing plates 131 and 136, in addition to temperature control, the surfaces of the upper sealing plate 131 and the lower sealing plate 136 involved in this embodiment that are in contact with the blank B or the tape T can also be subjected to coating surface treatments such as fluororesin processing.

[0113] The specific method for welding the tape T to the blank B in the temporary tape fixing mechanism 130 is not limited to methods using a sealing plate (heat press plate), and various known configurations may be employed, as long as the tape T can be temporarily fixed to the blank B. For example, a pressure-bonding method using a fixed roller or a method utilizing ultrasonic waves may also be employed. Furthermore, the configuration may be such that the welding method employed allows the welding to be performed during the transport of the blank B, rather than during periods of stagnation in the transport of the blank B.

[0114] 〔Tape folding mechanism〕

[0115] like Figure 8 As shown, the tape folding mechanism 140 includes an insertion path 141 extending in the blank conveying direction and allowing the side end portion of the blank B to pass therethrough while conveying the blank B.

[0116] Along the direction of blank conveying, one side of the insertion passage 141 is ( Figure 8 The insertion passage 141 has a surface side of the blank B (which is located on the front side of the blank) that is connected to the plane extending from the blank being conveyed (hereinafter referred to as the "blank plane") and is opened so that the side end of the blank B can pass through. Figure 8 The top wall 142 is arranged so as to be opposed to the top wall 142 (in the upper and middle sides), the folded wall 143 whose angle with respect to the blank plane continuously decreases as the blank B is conveyed along the blank conveying direction, and the inner wall 144 connecting the top wall 142 and the folded wall 143. In other words, the folded wall 143 has a different inclination depending on the position along the blank conveying direction, and the inclination of the wall surface changes continuously or in stages as the blank moves along the blank conveying direction.

[0117] The inner surface of the insertion passage 141 of the tape folding mechanism 140 involved in this embodiment, that is, the surface in contact with the blank B or tape T, is subjected to a coating surface treatment such as fluororesin processing from the perspective of non-adhesion and low friction between the blank B or tape T.

[0118] The blank B with the left half T1 of the tape T adhered to its surface and the right half T2 protruding from the side edge F passes through the insertion path 141, whereby the tape T interferes with the inner wall 144 and the folding wall 143, and the right half T2 of the tape T automatically bends toward the back side of the blank B, eventually becoming a state of being bent 180° and close to the back side of the blank B and facing each other.

[0119] If specified, Figure 9 (a) is a cross-section showing a position 2 mm away from the entrance A of the insertion passage 141 along the direction of blank conveying. At this position, the top wall 142 is not close to the setting, and the folding wall 143 and the inner side wall 144 are formed as a flat plate as a whole and are formed to have an angle with the top wall 142. However, the folding wall 143 and the inner side wall 144 are separated to the extent that they do not contact the tape T, so the tape T will not bend.

[0120] Figure 9 (b) shows a cross-section taken 10 mm from the inlet A of the insertion passage 141 in the direction of blank transport. At this location, the top wall 142 is positioned, for example, 1.05 mm away from the blank plane. Furthermore, the folded wall 143 at this location is integrally formed with the inner wall 144 as a flat plate. The horizontal distance from the end face E of the blank B is 0.68 mm, and the angle relative to the blank plane is 114°. The tape T is bent slightly along the inner wall 144 and the folded wall 143.

[0121] Figure 9 (c) shows a cross-section taken 20 mm away from the inlet A of the insertion passage 141 in the direction of blank transport. At this position, the top wall 142 is positioned very close to the blank plane (distance d1 = 0.05 mm). The folded wall 143 at this position is integrally formed with the inner side wall 144 as a flat plate. The horizontal distance from the end face E of the blank B is 0.2 mm, and the angle relative to the blank plane is 104°. The tape T is bent along the inner side wall 144 and the folded wall 143.

[0122] Figure 9 (d) is a cross-section showing a position 30 mm away from the inlet A of the insertion passage 141 along the blank conveying direction. At this position, the top wall 142 is provided at the same position as the top wall 142. Figure 9 At the same position (c), the folded wall 143 is integrally formed with the inner wall 144 into a flat plate. The horizontal distance d2 between the folded wall 143 and the end surface E of the blank B is 0.2 mm, and the folded wall has a 90° angle relative to the plane of the blank. The tape T is further bent along the inner wall 144 and the folded wall 143.

[0123] Figure 9(e) is a cross-section showing a position 40 mm away from the inlet A of the insertion passage 141 along the blank conveying direction. At this position, the top wall 142 is provided at the same position as the top wall 142. Figure 9 (c) The same position, the horizontal distance between the inner side wall 144 and the end face E of the blank B is 0.2 mm, the angle relative to the blank plane is 90°, and the longitudinal length ( Figure 9 The vertical length of the tape T is 0.6 mm. The folded wall 143 is continuous with the inner side wall 144 and has an inclination of 68° relative to the plane of the blank. The tape T is bent along the inner side wall 144 for a portion and along the folded wall 143 for another portion.

[0124] Figure 9 (f) is a cross-section showing a position 50 mm away from the inlet A of the insertion passage 141 along the blank conveying direction. At this position, the top wall 142 is provided at the same position as the top wall 142. Figure 9 (c) The same position, in addition, the inner side wall 144 is set at the same Figure 9 (e) At the same position, the folded wall 143 is continuous with the inner wall 144 and has an inclination of 37° relative to the plane of the blank. The tape T is bent along the folded wall 143 .

[0125] Figure 9 (g) is a cross-section showing a position 60 mm away from the inlet A of the insertion passage 141 along the blank conveying direction. At this position, the top wall 142 is provided at the same position as the top wall 142. Figure 9 (c) The same position, in addition, the inner side wall 144 is set at the same Figure 9 (e) At the same position, the folded wall 143 is continuous with the inner wall 144 and has an inclination of 9.5° relative to the plane of the blank. The tape T is bent along the folded wall 143 .

[0126] Figure 9 (h) is a cross-section showing a position 68 mm away from the inlet A of the insertion passage 141 along the blank conveying direction. At this position, the top wall 142 is provided at the same position as the top wall 142. Figure 9 (c) The same position, in addition, the inner side wall 144 is set at the same Figure 9 (e) At the same position, the folding wall 143 is continuous with the inner wall 144 and has a slope of 0° relative to the plane of the blank. The tape T is further bent along the folding wall 143, so that the left half T1 of the tape T pasted on the surface side of the blank B is bent nearly 180°.

[0127] In the tape folding mechanism 140, since the right half T2 of the tape T to be folded back is bent along the inner side wall 144 and the folding wall 143, the tape T folded back along the inner side wall 144 slightly away from the end face E of the blank B is folded back without contacting the end face E of the side end portion of the blank B.

[0128] Since the tape T is welded in this state, the blank B with the processed end surface obtained has a small space between the end surface E of the blank B and the tape T. Here, "not in contact with the end surface E of the blank B" means that a space is formed between the end surface E and the folded-back tape T. This means that the length of the tape T from the side edge on the front side of the blank B to the side edge on the back side is greater than the length in the thickness direction of the end surface E (i.e., the thickness of the blank B), including the case where a portion of the floating tape T contacts the end surface E.

[0129] For the blank B after the end face processing is completed in the tape pasting end face processing device 100 involved in this embodiment, the width of the left half T1 of the tape T that is welded in the bonding end area A1 on the surface side of the side end portion of the blank B is 4.7 mm, and in the remaining right half T2, the width of the bonding end area A2 on the back side that is welded is 4.7 mm, and the width of the non-welded part opposite to the end face E is 0.6 mm.

[0130] Although the space formed between the end face E of the blank B after the end face treatment is completed and the tape T in the tape sticking end face treatment device 100 of this embodiment is a small space as described above, this is not essential and a larger space may be formed.

[0131] In the tape folding mechanism 140 involved in this embodiment, although the folding of the tape T is achieved by an insertion passage 141 whose internal wall structure continuously changes, the specific structure of the tape folding mechanism 140 is not limited to the above-mentioned embodiment, and can also be constructed so that the folding is gradually performed using multiple points. In addition, it can also be constructed so that the folding is performed during the conveying stop process rather than during the conveying process of the blank B.

[0132] 〔First welding section〕

[0133] The tape pasting end face processing device 100 of this embodiment has: a welding mechanism for pasting the folded tape T to the bonding end area A2 on the back side of the blank B, the welding mechanism is composed of a first welding part 150 for temporarily fixing the folded tape T to the bonding end area A2 on the back side of the blank B, and a second welding part 160 for welding the entire surface of the folded tape T to the bonding end area A2 on the back side of the blank B.

[0134] The first welding section 150 is arranged near the exit of the insertion passage 141 of the tape folding mechanism 140 , and is used to temporarily fix the tape T folded back to the back side of the blank B to maintain the folded state of the tape T and provide it to the second welding section 160 .

[0135] The temporary fixation of the tape T to the back side of the blank B is as long as a portion of the right half T2 of the tape T is welded to the bonding end area A2 on the back side of the blank B in the width direction perpendicular to the blank conveying direction ( Figure 10B For example, the area with a width of 2.2 mm, measured from the free end of the tape T folded back to the back side of the blank B (the right end before folding back), and extending from the front end to the rear end in the blank conveying direction, can be welded to the bonding end area A2 on the back side of the blank B.

[0136] Specifically, if Figure 10A as well as Figure 10B As shown, the first welding section 150 is constructed as follows: it is equipped with a tape correction guide section 155, which supports the area other than the temporary fixing area of ​​the tape T to the back side of the blank B, and maintains the folded state of the tape T that has been folded back by the tape folding mechanism 140 to be forced to approach the other side of the blank B. In addition, it is equipped with a fixed upper sealing plate 151 that is arranged on the conveying path of the side end portion of the blank B and heats the surface side of the side end portion of the blank B, and a lower sealing plate 156 that can move up and down and heats the back side of the side end portion of the blank B.

[0137] The tape straightening guide 155 is composed of a non-heating plate that supports the tape T in a state of being pushed upward from below while facing the upper sealing plate 151. The lower sealing plate 156 is arranged adjacent to the tape straightening guide 155 and facing the upper sealing plate 151. The tape straightening guide 155 and the lower sealing plate 156 are separated in the horizontal direction by, for example, approximately 0.5 mm.

[0138] exist Figure 10B In the figure, the area indicated by thin oblique lines in the upper sealing plate 151 represents the portion opposite to the left half T1 of the tape T (dimensions: 4.7 mm in length in the width direction, 100 mm in length in the blank conveying direction), and the area indicated by thin oblique lines in the lower sealing plate 156 represents the portion opposite to the area to be temporarily fixed of the right half T2 of the tape T (dimensions: 2.2 mm in length in the width direction, 100 mm in length in the blank conveying direction).

[0139] The tape correction guide 155 is fixedly arranged, and the outlet of the insertion passage 141 of the tape folding mechanism 140 and the space between the upper sealing plate 151 in the first welding part 150 and the tape correction guide 155 are substantially continuous. Thus, the blank B can be transported to the specified heating position while maintaining the folded state of the tape T unchanged.

[0140] Since the tape correction guide 155 is formed of a non-heating plate, the tape T is prevented from being in contact with the sealing plate for a long time, and thermal shrinkage of the tape T can be suppressed.

[0141] From the perspective of preventing the resin layer of the blank B or the tape T from adhering to the tape correction guide 155, the surface of the tape correction guide 155 involved in this embodiment that contacts the blank B or the tape T is subjected to a coating surface treatment such as fluororesin processing.

[0142] By raising the lower sealing plate 156 while the blank B is held in a predetermined position, the side ends of the blank B are sandwiched between the upper sealing plate 151 and the lower sealing plate 156, thereby temporarily securing the blank B. After the temporary securing process, the free end of the right half T2 of the tape T is welded to the back of the blank B, while the remaining portion of the right half T2 of the tape T is not welded to the blank B and floats. Meanwhile, when the lower sealing plate 156 is in the lowered position, the space between the upper and lower sealing plates 151, 156, and the tape straightening guide 155 serves as a conveyance path for the side ends of the blank B, allowing the blank B to pass through.

[0143] In this embodiment, the temperature of the upper sealing plate 151 can be, for example, 115°C, and the temperature of the lower sealing plate 156 can be, for example, 135°C. Because time passes between the temporary attachment of the tape T to the back side of the side end of the blank B and the heating of the blank B by the blank heating mechanism 110, the temperatures of the upper and lower sealing plates 151 and 156 are preferably set higher than the temperature of the lower sealing plate 156. On the other hand, because the heat applied by the temporary tape attachment mechanism 130 remains, the temperature of the upper sealing plate 151 does not need to be raised to the same level as that of the lower sealing plate 156. If the temperatures of the upper and lower sealing plates 151 and 156 are too high, the tape T may stick to the upper and lower sealing plates 151 and 156. Alternatively, the set temperatures of the upper and lower sealing plates 151 and 156 may be increased if the temperatures are such that the tape T or the like does not stick to them.

[0144] From the perspective of preventing the resin layer of the blank B or the tape T from adhering to the above-mentioned sealing plates 151 and 156, in addition to temperature control, the surfaces of the upper sealing plate 151 and the lower sealing plate 156 involved in this embodiment that are in contact with the blank B or the tape T are also subjected to coating surface treatments such as fluororesin processing.

[0145] The specific welding method for welding the tape T to the blank B in the first welding section 150 is not limited to methods using a sealing plate (heat press plate), as long as the tape T can be temporarily fixed to the blank B. Various known configurations may be employed. For example, a pressure-bonding method using a fixed roller or a method utilizing ultrasonic waves may also be employed. Furthermore, a configuration may be employed in which the welding method employed allows welding to be performed while the blank B is being transported, rather than while the blank B is stagnant.

[0146] 〔Second welding section〕

[0147] The second welding section 160 welds substantially the entire surface of the folded-back tape T to the bonding end region A2 on the back surface of the blank B. Because a portion of the right half T2 of the tape is temporarily fixed to the back surface of the blank B in the first welding section 150, the folded-back state of the tape T can be maintained even without correction by the tape correction guide.

[0148] In this embodiment, although the welding of the tape T in the second welding portion 160 is performed on the entire surface of the right half T2 of the tape T opposite to the back side of the blank B, it is not limited to this. As long as the floating area of ​​the tape T that has not been welded to the back side of the blank B in the first welding portion 150 is re-welded, in addition, as long as it is melted in the heat sealing process when the blank B is assembled to form a paper container, some floating parts may remain.

[0149] Specifically, if Figure 11A as well as Figure 11B As shown, the second welding part 160 is composed of: a fixed upper sealing plate 161 arranged on the conveying path of the side end of the blank B and heating the surface side of the side end of the blank B, and a lower sealing plate 166 that can move up and down and heat the back side of the side end of the blank B.

[0150] exist Figure 11B In the figure, the area indicated by thin oblique lines within the upper sealing plate 161 and the lower sealing plate 166 represents the portion of the tape T that is opposite to the portion to be welded of the left half T1 and the right half T2 (dimensions: 4.7 mm in width direction and 100 mm in blank conveying direction).

[0151] By raising the lower sealing plate 166 while the blank B is held in a predetermined position, the side ends of the blank B are sandwiched between the upper sealing plate 161 and the lower sealing plate 166, thereby enabling full-surface welding. After full-surface welding, the left half T1 of the tape T is welded to the surface of the blank B, while the majority of the right half T2 is welded to the back of the blank B. As a result, the tape T is applied across the entire surface of the blank B, covering the end surface E. The end surface E of the blank B can be directly welded with the tape T, or it can be covered with the tape T through a gap.

[0152] When the lower sealing plate 166 is in the lowered position, the space between the upper sealing plate 161 and the lower sealing plate 166 becomes a conveyance path for the side end portion of the billet B, allowing the billet B to pass therethrough.

[0153] In this embodiment, the temperature of the upper sealing plate 161 can be, for example, 40°C, and the temperature of the lower sealing plate 166 can be, for example, 130°C. Because the adhesive tape T is welded to the unwelded portion of the bonding end region A2 on the back side of the blank B, the temperatures of the upper and lower sealing plates 161 and 166 are preferably set higher, with the lower sealing plate 166 having a higher temperature. On the other hand, since the heat applied by the mechanism in the previous step remains, the temperature of the upper sealing plate 161 does not need to be raised to the same level as that of the lower sealing plate 166. If the temperatures of the upper and lower sealing plates 161 and 166 are too high, the adhesive tape T may stick to the upper and lower sealing plates 161 and 166. Alternatively, the set temperatures of the upper and lower sealing plates 161 and 166 may be increased if the temperatures are such that the adhesive tape T does not stick to them.

[0154] From the perspective of preventing the resin layer of the blank B or the tape T from adhering to the above-mentioned sealing plates 161 and 166, in addition to temperature control, the surfaces of the upper sealing plate 161 and the lower sealing plate 166 involved in this embodiment that are in contact with the blank B or the tape T are also subjected to coating surface treatments such as fluororesin processing.

[0155] The specific method for welding the tape T of the second welding section 160 to the blank B is not limited to methods using a sealing plate (heat press plate), and various known configurations can be employed, as long as the tape T can be temporarily secured to the blank B. For example, a pressure-bonding method using a fixed roller or a method utilizing ultrasonic waves can also be employed. Furthermore, the welding method employed can be configured so that welding occurs during the transport of the blank B, rather than during periods of stagnation.

[0156] The above describes a tape-attached end surface processing device and a tape-attached end surface processing method according to one embodiment of the present invention. However, the present invention is not limited to the above embodiment, and various modifications can be made without changing the spirit of the present invention.

[0157] For example, in the above embodiment, the end surface of the side end of a fan-shaped blank is covered. However, the shape of the blank is not limited to this. In addition, any portion of the end can be treated similarly as long as it is a straight end. In addition, some corrugation or arc-shaped bulge or defect can also be allowed at the end.

[0158] In addition, for example, although the tape-sticking end face treatment device of the above-mentioned embodiment is described as performing end face treatment in order to ensure that the paper container finally obtained from the blank has high water resistance, it can also be applied to various purposes of covering the end face by sticking a strip of tape to the (straight) end of a sheet-shaped blank over the surface and back.

[0159] Description of Reference Numerals

[0160] 1--Paper stack, 2--Base paper, 3--Resin layer, 100--Tape end surface treatment device, 101--Conveying mechanism, 102--Conveying line, 110--Blank heating mechanism, 111, 116 Heating unit, 112, 117--Hot air outlet, 120--Tape bonding mechanism, 121--Tape conveying unit, 122--Tape cutting unit, 123--Bonding unit, 125--Tape conveying belt, 126--Driving roller, 127--Pressure roller, 130--Tape temporary fixing mechanism, 131--Upper sealing plate, 136--Lower Sealing plate, 140--tape folding mechanism, 141--insertion path, 142--top wall, 143--folding wall, 144--inner side wall, 150--first welding part, 151--upper sealing plate, 155--tape correction guide, 156--lower sealing plate, 160--second welding part, 161--upper sealing plate, 166--lower sealing plate, B--blank, E--end face, T--tape, T1--left half, T2--right half, A1--bonding end area, A2--bonding end area, F--side end edge, P--bonding point.

Claims

1. A tape-pasting end surface treatment device, which covers the end surface of the bonding end of the blank by pasting a long strip of tape on the bonding end of the blank, characterized in that: The tape-attached end surface processing device comprises: a conveying mechanism for conveying the blank along a conveying path; A blank heating mechanism, a tape bonding mechanism, a tape folding mechanism, and a welding mechanism are arranged along the conveying path from the upstream side. The blank heating mechanism is configured to heat the bonding end portion of the blank. The tape bonding mechanism is configured to supply the tape cut into a length corresponding to the bonding end of the blank so that the length direction of the tape is consistent with the blank conveying direction, and to adhere the tape to the bonding end area on one side of the blank in a state of protruding from the bonding end edge of the blank while conveying the blank. The tape folding mechanism is configured to fold back a portion of the tape attached to the blank that protrudes from the blank along the bonding edge of the blank. The welding mechanism is configured to attach the folded-back tape to the bonding end region of the other surface of the blank.

2. The tape-adhesive end surface processing device according to claim 1, characterized in that: The tape bonding mechanism feeds out the tape in synchronization with a conveyance speed of the blank conveyed by the conveyance mechanism.

3. The tape-adhesive end surface processing device according to claim 1, characterized in that: The tape folding mechanism has an insertion passage open on one side, through which the bonding end of the blank passes while conveying the blank. The insertion passage includes a folded wall whose angle with respect to the blank plane continuously decreases as the blank advances in the blank conveying direction.

4. The tape-adhesive end surface processing device according to claim 1, characterized in that: The tape folding mechanism folds the tape folded by the tape folding mechanism back into a state where a space is formed between the end surface of the bonding end portion of the blank and the tape.

5. The tape-adhesive end surface processing device according to claim 1, characterized in that: A tape temporary fixing mechanism is provided between the tape bonding mechanism and the tape folding mechanism. The tape temporary fixing mechanism welds the tape to at least a portion of the upstream side in the material conveying direction in the bonding end region of one surface of the material.

6. The tape sticking end surface processing device according to claim 1, characterized in that: The welding mechanism includes: a first welding portion that welds the folded-back adhesive tape to a portion of the bonding end region on the other side of the blank; and a second welding portion that welds substantially the entire surface of the adhesive tape while a portion of the adhesive tape is temporarily fixed by the first welding portion.

7. The tape-adhesive end surface processing device according to claim 6, characterized in that: The first welding portion includes a tape correcting guide portion that maintains a folded-back state in which the tape folded back by the tape folding-back mechanism is forcibly brought close to the other surface of the blank.

8. A method for treating an end surface by applying a tape, for covering the end surface of a blank by applying a long tape to the end surface of the blank, characterized in that: The tape-adhesive end surface processing method comprises: a blank heating step of heating the bonding end portion of the blank conveyed along the conveying path; A tape bonding step comprising supplying the adhesive tape cut into a length corresponding to the bonding end portion of the blank so that the longitudinal direction of the adhesive tape is aligned with the blank conveying direction, and affixing the adhesive tape to the bonding end region on one side of the blank in a state protruding from the bonding end edge of the blank while the blank is conveyed; a tape folding step of folding back a portion of the tape attached to the blank, the portion protruding from the blank, along an adhesive end edge of the blank; and A welding step of attaching the folded-back tape to the bonding end region on the other side of the blank.

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