Dispensing device for electronic component production

Abstract

The invention discloses a dispensing device for electronic component production, and the dispensing device comprises a processing table, a processing support, a carrying mechanical arm, a longitudinal and transverse lead screw module, two pairs of lifting hydraulic push rods, a raw material box, a dispensing structure and a temperature control structure.The invention relates to the technical field of electronic component production. The double shafts are driven to rotate through the angle driving machine, the positions of the telescopic circular rings are adjusted in cooperation with electromagnetic adsorption, the diameter of a glue point can be dynamically adjusted at the 0.3 mm level, the positioning precision reaches + / -0.02 mm, and the micron-level manufacturing requirement is met.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of electronic component production, in particular to a dispensing device for electronic component production. BACKGROUND

[0002] In the field of electronic component manufacturing, dispensing process is a key link affecting product quality and production efficiency. The traditional dispensing device has long been faced with multiple technical bottlenecks: the existing equipment lacks self-adaptive ability to the characteristics of glue, high-viscosity glue is prone to glue breakage due to inaccurate pressure control, low-viscosity glue is prone to spread to cause uneven glue amount; the fluctuation range of glue temperature is usually above ±5 DEG C, which affects the curing consistency; the cleaning process needs manual intervention, residual glue is easy to block the nozzle, increasing the equipment downtime. In addition, the equipment stability is poor in high-temperature and high-humidity environment, and the maintenance cost is high. In view of the above problems, the present application is produced. SUMMARY

[0003] The technical scheme of the present application for achieving the above-mentioned purpose is as follows: a dispensing device for electronic component production, comprising: a processing table, a processing support, a carrying mechanical arm, a longitudinal and transverse screw module, two pairs of lifting hydraulic push rods, a raw material box, a dispensing structure and a temperature control structure, the processing support is installed on the processing table, the carrying mechanical arm, the longitudinal and transverse screw module and the raw material box are installed on the processing support, two pairs of the lifting hydraulic push rods are installed on the moving end of the longitudinal and transverse screw module, the dispensing structure is connected to the pushing end of the raw material box and the two pairs of lifting hydraulic push rods, the temperature control structure is installed on the dispensing structure, the dispensing structure comprises: a concave lifting support block, a dispensing drainage glue pipe, a Z-shaped sleeving glue pipe, a pair of angle shafts, a Z-shaped sleeving pipe, an angle driving machine, an angle shaft pipe, a pair of limiting dispensing rings, an extension ring, a pair of adsorption ring electromagnets, an adsorption ring magnet, a cleaning and replacing assembly and a pressure adjusting assembly.

[0004] The concave lifting support block is installed on the pushing end of the two pairs of lifting hydraulic push rods, a pair of angle shafts are inserted into the concave lifting support block through bearings, the Z-shaped sleeving pipe is installed on the pair of angle shafts, the angle driving machine is connected to the angle shafts, a pair of limiting dispensing rings are installed on the inner side of the Z-shaped sleeving pipe, the extension ring is installed on the angle shaft pipe and movably inserted between the pair of limiting dispensing rings, a pair of adsorption ring electromagnets are respectively installed on the pair of limiting dispensing rings, the adsorption ring magnet is installed on the extension ring, the cleaning and replacing assembly is installed on the processing table, the pressure adjusting assembly is connected to the raw material box, the dispensing drainage glue pipe is connected to the pressure adjusting assembly and the angle shaft pipe, and the Z-shaped sleeving glue pipe is sleeved on the dispensing drainage glue pipe.

[0005] Preferably, the cleaning and replacing assembly comprises a cleaning concave cylindrical box, a horizontal rotating disc, a lifting cleaning hydraulic push rod, a cleaning drive machine, a cleaning sleeved cylindrical tube, a cleaning concave cylindrical tube, a cleaning convex cylindrical rod, a cleaning ultrasonic vibrator, a high-pressure air pump, a pair of high-pressure hydraulic push rods, a high-pressure lifting plate, a high-pressure nozzle, and a high-pressure drainage pipe.

[0006] The cleaning concave cylindrical box is mounted on the processing table, the cleaning sleeved cylindrical tube is mounted inside the cleaning concave cylindrical box, the lifting cleaning hydraulic push rod is mounted inside the cleaning sleeved cylindrical tube, the cleaning concave cylindrical tube is mounted on the pushing end of the lifting hydraulic push rod and movably inserted inside the cleaning sleeved cylindrical tube, the cleaning drive machine is mounted inside the cleaning concave cylindrical tube, the cleaning convex cylindrical rod is movably inserted inside the cleaning concave cylindrical tube and connected to the driving end of the cleaning drive machine, the cleaning ultrasonic vibrator is mounted inside the cleaning concave cylindrical box, a pair of the high-pressure hydraulic push rods are mounted on the processing support, the high-pressure lifting plate is mounted on the pushing end of the pair of high-pressure hydraulic push rods, the high-pressure drainage pipe is inserted into the high-pressure lifting plate, the high-pressure air pump is mounted on the high-pressure lifting plate and connected to the high-pressure drainage pipe, and the high-pressure nozzle is mounted on the high-pressure drainage pipe.

[0007] Preferably, the pressure adjusting assembly comprises a bidirectional plunger pump, a pressure transmitter, a pressure sensor, and a flow sensor.

[0008] The bidirectional plunger pump is connected to the raw material box, the pressure transmitter is connected to the bidirectional plunger pump and the glue dispensing drainage tube, and the pressure sensor and the flow sensor are mounted inside the glue dispensing drainage tube.

[0009] Preferably, the temperature control structure comprises a cooling box, a heating box, an electric heater, a cooler, a radiator, a pair of extrusion hydraulic push rods, a pair of extrusion hydraulic plates, a pair of three-way valves, two pairs of control shunt valves, and two pairs of glue drainage tubes.

[0010] The cooling box and the heating box are mounted on the processing table, the electric heater is mounted on the heating box, the cooler is mounted inside the cooling box, the radiator is mounted outside the cooling box, a pair of the extrusion hydraulic push rods are respectively mounted inside the heating box and the cooling box, a pair of the extrusion hydraulic plates are respectively mounted on the pushing ends of the pair of the extrusion hydraulic push rods, and a pair of the three-way valves are respectively mounted on the cooling box and the heating box.

[0011] Preferably, the processing support is provided with a plurality of scanning cameras.

[0012] Preferably, sealed bearings are provided between the cleaning set cylindrical tube, the cleaning concave cylindrical tube and the cleaning convex cylindrical rod.

[0013] Preferably, a lifting screw module is provided on the processing bracket, and the scanning camera is installed on the lifting screw module.

[0014] Preferably, a component detector is provided on the clean concave cylindrical box.

[0015] Preferably, the cleaning concave cylindrical box is provided with a replenishing liquid tank and a replenishing valve.

[0016] Preferably, a temperature sensor is provided on the Z-shaped sleeve pipe.

[0017] A glue dispensing device for the production of electronic components is manufactured using the technical solution of the present invention. It adopts a combined design of a concave lifting support block and a Z-shaped sleeve tube. The dual-axis rotation is driven by an angle driver, and the position of the telescopic ring is adjusted with electromagnetic adsorption to achieve dynamic adjustment of the glue dot diameter at the level of 0.3mm. The positioning accuracy reaches ±0.02mm, meeting the micron-level manufacturing requirements; the temperature control system constructs a double-layer circulation channel, drives the medium to circulate at high speed by squeezing the hydraulic plate, and combines the PID algorithm to achieve precise control of the glue temperature by ±1°C, effectively avoiding curing abnormalities; the pressure regulating component adopts a bidirectional plunger pump and pressure-flow dual closed-loop control, and the pressure fluctuation is controlled within ±0.01MPa, supporting the stable output of glue with a viscosity of 1-100Pa·s; the cleaning module integrates ultrasonic oscillation and high-pressure air blowing functions, and completes multi-nozzle batch cleaning within 30 seconds, shortening the line change time to 15 minutes. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic front view of a dispensing device for producing electronic components according to the present invention.

[0019] Figure 2 The figure is a side cross-sectional schematic diagram of a dispensing device for producing electronic components according to the present invention.

[0020] Figure 3 This is a schematic front and cross-sectional view of a dispensing device for producing electronic components according to the present invention.

[0021] Figure 4 This is a three-dimensional schematic diagram of a dispensing device for electronic component production according to the present invention.

[0022] Figure 5 The figure is a three-dimensional cross-sectional schematic diagram of a dispensing device for producing electronic components according to the present invention.

[0023] Figure 6 This is a three-dimensional rear cross-sectional schematic diagram of a dispensing device for electronic component production according to the present invention.

[0024] In the figure: 1, processing table; 2, processing support; 3, longitudinal and transverse screw module; 4, lifting hydraulic push rod; 5, raw material box; 101, concave lifting support block; 102, angle shaft; 103, Z-shaped sleeve pipe; 104, angle drive machine; 105, angle shaft pipe; 106, limiting point glue ring; 107, telescopic ring; 108, adsorption ring electromagnet; 109, adsorption ring magnet; 201, cleaning concave cylindrical box; 202, horizontal rotating disc; 203, lifting cleaning hydraulic push rod; 204, cleaning drive machine; 205, cleaning sleeve cylindrical pipe; 206, cleaning concave cylindrical pipe; 207, cleaning convex cylindrical rod; 208, cleaning ultrasonic vibrator; 209, high-pressure inflation pump; 210, high-pressure hydraulic push rod; 211, high-pressure lifting plate; 212, high-pressure nozzle; 213, high-pressure drainage pipe; 301, cooling box; 302, heating box; 303, electric heater; 304, cooler; 305, radiator; 306, extrusion hydraulic push rod; 307, extrusion hydraulic plate; 308, three-way valve. DETAILED DESCRIPTION

[0025] The application will be described in detail below with reference to the drawings, embodiments

[0026] Please refer to Figures 1-6 , the dispensing device for electronic component production still faces multiple technical challenges and process bottlenecks while improving manufacturing efficiency and precision. The small inner diameter of the glue nozzle, the high dispensing pressure, or the unsuitable viscosity of the glue causes thin lines to form on the top of the glue point, pollutes the pads and causes virtual welding, needle hole impurities remain, glue mixing precipitates or bubbles are not processed, resulting in reduced glue output or even glue breakage, threatening the bonding reliability of components, long-term use causes pipeline blockage and nozzle wear, the distance between the needle and the working surface needs to be frequently calibrated to avoid glue trailing, dispensing pressure fluctuations directly affect glue consistency, high-viscosity glue is prone to stringing, low-viscosity glue is prone to spreading, and process parameters need to be adjusted for different glues;

[0027] The application discloses a dispensing device for electronic component production, which comprises a processing support 2, a processing table 1, a vertical-horizontal screw module 3, two pairs of lifting hydraulic push rods 4, a concave lifting support block 101, an angle driving machine 104, a Z-shaped sleeve pipe 103 and a stretching ring 107.The experimental data show that the system can control the glue temperature fluctuation range within ±1℃, effectively avoiding abnormal curing of glue caused by high temperature or viscosity increase caused by low temperature. The pressure regulating assembly adjusts the drainage pressure of the glue. The pressure regulating assembly adjusts the drainage pressure in real time according to the viscosity of the glue (1-100 Pa·s). The pressure-flow double closed loop control technology is adopted to ensure the stability of the glue output. At the same time, the angle shaft 102 pipe is telescopic, so that the spraying on the angle shaft 102 pipe is contracted to the inside of the Z-shaped sleeve pipe 103, so as to achieve the effect of temperature control. The magnetic poles of the adsorbing circular ring electromagnet 108 and the adsorbing circular ring magnet 109 interact with each other. The magnetic adsorption or repulsion is realized by changing the current direction, and the position of the telescopic circular ring 107 in the Z-shaped sleeve pipe 103 is accurately adjusted. The design makes the glue outlet diameter dynamically adjustable, which meets the dispensing needs of components of different sizes. The minimum glue point diameter can reach 0.3mm. The cleaning and replacement assembly integrates a high-pressure gas nozzle and a solvent cleaning module, which can automatically remove the glue nozzle residues in the dispensing gap. The glue is conveyed to the angle shaft 102 pipe through the dispensing drainage glue pipe after being pressurized by the pressure regulating assembly from the raw material box 5; the temperature control structure is started at the same time, and the cooling gas (0℃) or heating medium (such as 40℃ conductive oil) circulates between the Z-shaped sleeve glue pipe and the Z-shaped sleeve pipe 103, so as to maintain the stability of the glue temperature; the system can accurately control the temperature at 25±0.5℃, ensuring the consistency of the curing rate; the glue is conveyed to the angle shaft 102 pipe through the dispensing drainage glue pipe after being pressurized by the pressure regulating assembly from the raw material box 5; the temperature control structure is started at the same time, and the cooling gas (0℃) or heating medium (such as 40℃ conductive oil) circulates between the Z-shaped sleeve glue pipe and the Z-shaped sleeve pipe 103, so as to maintain the stability of the glue temperature; the system can accurately control the temperature at 25±0.5℃, ensuring the consistency of the curing rate.

[0028] Further, the angle shaft 102 pipe on the nozzle is guided to the horizontal rotating disc 202 by the longitudinal and transverse screw module 3, the lifting cleaning hydraulic push rod 203 inside the cleaning set cylindrical pipe 205 is retracted and extended, driving the cleaning concave cylindrical pipe 206 on the lifting cleaning hydraulic push rod 203 to stably lift along the inside of the cleaning set cylindrical pipe 205, at the same time, the cleaning drive machine 204 inside the cleaning concave cylindrical pipe 206 is operated, driving the cleaning convex cylindrical rod 207 on the driving end of the cleaning drive machine 204 to make the cleaning convex cylindrical rod 207 stably horizontally rotate along the inside of the cleaning concave cylindrical pipe 206, the horizontal rotating disc 202 is rotated by the cleaning convex cylindrical rod 207, so that the multiple nozzles on the horizontal rotating disc 202 are lifted, the nozzles are lowered into the cleaning liquid inside the cleaning concave cylindrical box 201, the horizontal rotating disc 202 can carry multiple nozzles, each nozzle is sequentially immersed in the cleaning liquid by rotation, batch cleaning is realized, the ultrasonic vibrator generates high-frequency vibration (such as 28 kHz), accelerates the dissolution and peeling of the cleaning liquid to the glue residue, the cleaning time is shortened to within 30 seconds, the cleaning ultrasonic vibrator 208 generates high-frequency vibration waves, which are transmitted to the cleaning liquid, forming micro bubbles and instantaneously breaking, generating impact force to peel off the stubborn glue on the inner wall of the nozzle, after cleaning immersion, after cleaning is completed, the lifting cleaning hydraulic push rod 203 lifts the cleaning concave cylindrical pipe 206, so that the nozzle is separated from the cleaning liquid, the lifting of the horizontal rotating disc 202 is stable, a pair of high-pressure hydraulic push rods 210 drive the high-pressure lifting plate 211 on the high-pressure hydraulic push rods 210 to stably lift, the high-pressure air charging pump 209 charges the high-pressure drainage pipe 213, the high-pressure drainage pipe 213 and the high-pressure nozzle 212 cooperate to clean the glue nozzle, through the preset program, the assembly can automatically complete the whole process of nozzle immersion, rotation, lifting, high-pressure air blowing, without manual intervention, the high-pressure air charging pump 209 delivers high-pressure gas (such as 0.6 MPa) to the high-pressure nozzle 212 through the high-pressure drainage pipe 213, to clean the inside of the nozzle, realize rapid drying;

[0029] Further, as the core component of glue supply and pressure regulation, directly connected to the raw material tank 5, the reciprocating motion of the plunger realizes the suction and discharge of glue. The bidirectional plunger pump can realize forward and reverse motion, which can not only increase the glue output through forward pressure, but also prevent glue dripping through reverse suction. For example, at the moment of dispensing, the pump body can quickly suck back for 0.1 seconds to eliminate glue nozzle residual stringing, and at the same time, through temperature control, it can quickly drain. The pressure sensor collects real-time glue pressure data, and the pressure transmitter converts it into a 4-20mA standard signal, which is fed back to the control system. When the pressure deviation exceeds the set threshold (such as ±0.02MPa), the system automatically adjusts the plunger pump speed to form a closed-loop control; test data shows that this mechanism reduces the pressure fluctuation range to within ±0.01MPa, and the flow sensor monitors the glue flow change. When a decrease in flow is detected (such as due to an increase in glue viscosity), the control system can simultaneously increase the plunger pump output pressure to ensure constant glue output per unit time. Through the built-in algorithm, the component can automatically match the rheological properties of different glues; glue is sucked into the bidirectional plunger pump cavity from the raw material tank 5, and the plunger is driven forward by the servo motor to pressurize and deliver the glue to the pressure transmitter. The pressure transmitter converts the pressure signal into an electrical signal, which is processed by the control system to adjust the plunger pump speed in real time to maintain the set pressure value. After the glue enters the dispensing drainage hose, the pressure sensor and flow sensor monitor the data simultaneously. When the viscosity of the glue changes, causing the flow to fluctuate, the control system calculates the pressure compensation amount through the PID algorithm. When the flow sensor detects a 10% decrease in flow, the control system increases the plunger pump pressure by 15% within 50ms to restore the flow to the set value. At the end of dispensing, the control system sends a reverse pulse signal to the bidirectional plunger pump, and the plunger quickly sucks back for 0.1 seconds to form a negative pressure at the glue nozzle, preventing glue dripping. The back suction pressure and time parameters can be automatically adjusted according to the viscosity of the glue;

[0030] Further, the medium inside the cooling box 301 is cooled by the cooler 304, the absorbed heat is dissipated by the radiator 305, the medium inside the heating box 302 is heated by the electric heater 303, a pair of extrusion hydraulic push rods 306 are extended and retracted to drive a pair of extrusion hydraulic plates 307 thereon, the Z-shaped sleeving rubber pipe and the Z-shaped sleeving pipe 103 are cooled or heated through the mutual operation of the pair of extrusion hydraulic plates 307, the cooling system and the heating system can be independently operated, a wide temperature range of-20℃ to 80℃ is supported, the process requirements of different glues (such as low-temperature curing glue and high-temperature heat-conducting glue) are met, the medium temperature is monitored in real time by the temperature sensor, the power of the cooler 304 or the output of the electric heater 303 is automatically adjusted by the PID algorithm, the temperature fluctuation range is controlled within ±1℃, the extrusion hydraulic push rod 306 drives the extrusion hydraulic plate 307 at a frequency of 0.5Hz, and the medium is circulated at high speed (the flow rate reaches 2L / min) between the cooling box 301 / heating box 302 and the Z-shaped sleeving rubber pipe, so that the heat response time is shortened to within 30 seconds.

[0031] In summary, the electronic components are automatically transported to the processing table 1 by the transport mechanical arm, the horizontal and vertical precise positioning is realized through the four-axis linkage of the dispensing structure driven by the vertical and horizontal screw modules 3, when dispensing, the two-way plunger pump of the pressure adjustment assembly adjusts the glue viscosity through the pressure-flow double closed loop control, the glue is pressurized and delivered to the angle shaft 102 pipe, at the same time, the temperature control structure is started, the medium temperature is adjusted by the cooler 304 or the electric heater 303, the extrusion hydraulic push rod 306 drives the medium to circulate at high speed between the double-layer sleeving pipes, and the glue temperature is maintained stable, the angle driving machine 104 drives the Z-shaped sleeving pipe 103 to rotate, the position of the telescopic ring 107 is adjusted by the electromagnetic adsorption, the glue point diameter and position are controlled, and the micron-level dispensing precision is realized, after the dispensing is completed, the cleaning and replacement assembly is started, the lifting cleaning hydraulic push rod 203 immerses the nozzle into the cleaning liquid, the ultrasonic vibrator peels off the residual glue, and the high-pressure air blowing completes the drying, the control system automatically matches the best working mode according to the glue characteristics and process parameters, and efficient and stable production is ensured.

[0032] The above technical solution only embodies the preferred technical solution of the technical solution of the present application, and some changes made by the person skilled in the art to some parts of the present application also embody the principle of the present application and are within the protection scope of the present application.

Claims

1. A dispensing apparatus for electronic component production, comprising: The processing table, the processing support, the carrying mechanical arm, the vertical and horizontal screw module, two pairs of lifting hydraulic push rods, the raw material box, the glue dispensing structure and the temperature control structure are characterized in that the processing support is installed on the processing table, the carrying mechanical arm, the vertical and horizontal screw module and the raw material box are installed on the processing support, two pairs of the lifting hydraulic push rods are installed on the moving end of the vertical and horizontal screw module, the glue dispensing structure is connected to the raw material box and the pushing end of two pairs of the lifting hydraulic push rods, and the temperature control structure is installed on the glue dispensing structure. The concave lifting support block is installed on the pushing end of two pairs of the lifting hydraulic push rods, one pair of the angle shafts is inserted into the concave lifting support block through bearings, the Z-shaped sleeving pipe is installed on one pair of the angle shafts, the angle driving machine is connected to the angle shafts, one pair of the limiting glue dispensing rings is installed on the inner side of the Z-shaped sleeving pipe, the telescopic ring is installed on the angle shaft pipe and movably inserted between one pair of the limiting glue dispensing rings, one pair of the adsorbing ring electromagnets is respectively installed on one pair of the limiting glue dispensing rings, the adsorbing ring magnet is installed on the telescopic ring, the cleaning and replacing assembly is installed on the processing table, the pressure adjusting assembly is connected to the raw material box, the glue dispensing drainage pipe is connected to the pressure adjusting assembly and the angle shaft pipe, and the Z-shaped sleeving glue pipe is sleeved on the glue dispensing drainage pipe.

2. The glue dispensing device for electronic component production according to claim 1, wherein The cleaning and replacing assembly comprises a cleaning concave cylindrical box, a horizontal rotating disc, a lifting cleaning hydraulic push rod, a cleaning driving machine, a cleaning sleeving cylindrical pipe, a cleaning concave cylindrical pipe, a cleaning convex cylindrical rod, a cleaning ultrasonic vibrator, a high-pressure air pump, a pair of high-pressure hydraulic push rods, a high-pressure lifting plate, a high-pressure spray head and a high-pressure drainage pipe. The cleaning concave cylindrical box is installed on the processing table, the cleaning sleeving cylindrical pipe is installed on the inner side of the cleaning concave cylindrical box, the lifting cleaning hydraulic push rod is installed on the inner side of the cleaning sleeving cylindrical pipe, the cleaning concave cylindrical pipe is installed on the pushing end of the lifting hydraulic push rod and movably inserted into the inner side of the cleaning sleeving cylindrical pipe, the cleaning driving machine is installed on the inner side of the cleaning concave cylindrical pipe, the cleaning convex cylindrical rod is movably inserted into the inner side of the cleaning concave cylindrical pipe and connected to the driving end of the cleaning driving machine, the cleaning ultrasonic vibrator is installed on the inner side of the cleaning concave cylindrical box, a pair of the high-pressure hydraulic push rods is installed on the processing support, the high-pressure lifting plate is installed on the pushing end of the pair of the high-pressure hydraulic push rods, the high-pressure drainage pipe is inserted into the high-pressure lifting plate, the high-pressure air pump is installed on the high-pressure lifting plate and connected to the high-pressure drainage pipe, and the high-pressure spray head is installed on the high-pressure drainage pipe.

3. The dispensing device for electronic component production according to claim 2, characterized in that: The pressure adjusting assembly comprises a bidirectional plunger pump, a pressure transmitter, a pressure sensor and a flow sensor. The bidirectional plunger pump is connected to the raw material box, the pressure transmitter is connected to the bidirectional plunger pump and the glue injection and drainage tube, and the pressure sensor and the flow sensor are installed inside the glue injection and drainage tube.

4. The glue dispensing device for electronic component production according to claim 3, wherein The temperature control structure comprises a cooling box, a heating box, an electric heater, a cooler, a radiator, a pair of extrusion hydraulic push rods, a pair of extrusion hydraulic plates, a pair of three-way valves, two pairs of control shunt valves and two pairs of glue injection and drainage tubes. The cooling box and the heating box are installed on the processing table, the electric heater is installed on the heating box, the cooler is installed inside the cooling box, the radiator is installed outside the cooling box, a pair of the extrusion hydraulic push rods are respectively installed inside the heating box and the cooling box, a pair of the extrusion hydraulic plates are respectively installed on the pushing ends of a pair of the extrusion hydraulic push rods, and a pair of the three-way valves are respectively installed on the cooling box and the heating box.

5. The point glue device for electronic component production according to claim 4, wherein A plurality of scanning cameras are arranged on the processing support.

6. The glue dispensing device for electronic component production according to claim 5, wherein Sealing bearings are arranged between the cleaning cylindrical pipe, the cleaning concave cylindrical pipe and the cleaning convex cylindrical rod.

7. The point glue device for electronic component production according to claim 6, wherein A lifting lead screw module is arranged on the processing support, and the scanning cameras are installed on the lifting lead screw module.

8. The glue dispensing device for electronic component production according to claim 7, wherein A component detector is arranged on the cleaning concave cylindrical box.

9. The point glue device for electronic component production according to claim 8, wherein A supplementary liquid tank and a supplementary valve are arranged on the cleaning concave cylindrical box.

10. The point glue device for electronic component production according to claim 9, wherein A temperature sensor is arranged on the Z-shaped sleeve pipe.

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