AR glasses FPC circuit board implantation positioning structure

Abstract

The invention belongs to the technical field of circuit board implantation, in particular to an AR glasses FPC circuit board implantation positioning structure, and provides the following scheme that the AR glasses FPC circuit board implantation positioning structure specifically comprises a lower mold base, one of a first injection upper mold base and a second injection upper mold base is fixedly mounted at the top of the lower mold base, and core mold cavities are formed between the first injection upper mold base and the lower mold base or between the second injection upper mold base and the lower mold base; and a core mold mechanism is fixedly mounted in the core mold cavity. In the transfer and secondary injection process of the mold, the phenomenon that the circuit board is separated from the middle positioning mechanism is effectively avoided, the two ends of the circuit board sequentially penetrate through the preset holes and are inserted into the end positioning mechanisms, the two ends of the circuit board are positioned and fixed through the end positioning mechanisms, protection is provided during secondary injection molding, and the service life of the circuit board is prolonged. Therefore, the comprehensive positioning and fixing effect of the circuit board in the first injection molding shell is achieved, and the risks of deviation and breakage caused by the fact that the middle area of the circuit board is pushed by plastic melt in the second injection molding process are effectively avoided.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of circuit board implantation, in particular to an AR glasses FPC circuit board implantation positioning structure. BACKGROUND

[0002] The AR glasses can realize many functions and can be regarded as a micro mobile phone, can track the eye line track to determine the state of the user, and can start the corresponding function.

[0003] The shell of the AR glasses is mainly made by injection molding, the lower shell of the AR glasses is made by one-shot injection molding, then the FPC circuit board is implanted into the lower shell, and the upper shell is made on the lower shell by two-shot injection molding, the two-shot molding operation of the upper part of the AR glasses shell is completed, and the operation of implanting the FPC circuit board into the AR glasses shell is completed, so that the production efficiency of the AR glasses can be improved, the installation cost of the FPC circuit board can be reduced, and the stability between the FPC circuit board and the AR glasses shell can be improved, but the FPC circuit board implanted into the AR glasses shell is light in quality and thin in thickness, and in order to connect the electronic elements at both ends, the middle part of the AR glasses FPC circuit board is long, slender and soft, when two-shot molding, the FPC circuit board is easily deviated under the pressure impact of the plastic, so that the FPC circuit board is extruded out of the AR glasses shell.

[0004] Therefore, the application provides an AR glasses FPC circuit board implantation positioning structure to solve the above technical problems in the prior art. SUMMARY

[0005] Based on the technical problems in the background art, the application provides an AR glasses FPC circuit board implantation positioning structure.

[0006] The AR glasses FPC circuit board implantation positioning structure provided by the application comprises a lower mold base, one of a one-shot upper mold base or a two-shot upper mold base is fixedly installed at the top of the lower mold base, a core mold cavity is arranged between the one-shot upper mold base or the two-shot upper mold base and the lower mold base, a core mold mechanism is fixedly installed in the core mold cavity, a one-shot molding cavity is arranged between the lower mold base, the core mold mechanism and the one-shot upper mold base, the one-shot molding cavity is used for one-shot injection molding of a one-shot molded shell, a circuit board is embedded at the top of the one-shot molded shell, preset holes matched with the end portions of the circuit board are arranged at both ends of the one-shot molded shell, a two-shot molding cavity is arranged between the lower mold base, the core mold mechanism, the one-shot molded shell and the two-shot upper mold base, the two-shot molding cavity is used for two-shot injection molding of a two-shot molded shell, two middle positioning mechanisms matched with the middle part of the circuit board are arranged at the top of the one-shot molded shell, end positioning mechanisms are fixedly installed in the installation grooves in the lower mold base.

[0007] Preferably in the present application, the top of the one-shot upper mold base is provided with a one-shot injection nozzle, the bottom of the one-shot upper mold base is provided with a punch matched with a one-shot molding cavity, and the surface of the punch is provided with two columnar mold holes matched with the middle positioning mechanism.

[0008] Preferably in the present application, the middle positioning mechanism comprises positioning pins in the shape of circular truncated cones, the middle positions of the positioning pins are provided with sealing rings, the top positions of the positioning pins are provided with two layers of elastic rings in the shape of umbrellas, the elastic rings are embedded inside the columnar mold holes, and the two layers of elastic rings are provided with positioning grooves matched with the circuit board.

[0009] Preferably in the present application, the top of the two-shot upper mold base is provided with a two-shot injection nozzle, and the bottom of the two-shot upper mold base is provided with a two-shot concave mold matched with a one-shot molded shell.

[0010] Preferably in the present application, the end positioning mechanism comprises positioning mold bases in the shape of cylinders, and the inside of the positioning mold bases is installed with columnar mold cores matched with the preset holes, and the top of the columnar mold cores is provided with protection holes matched with the ends of the circuit board.

[0011] Preferably in the present application, the bottom of the one-shot upper mold base is provided with one-shot columnar punches on both sides, and the bottom end of the one-shot columnar punch is embedded into the inside of the positioning mold base and matched with the columnar mold core.

[0012] Preferably in the present application, the end positioning mechanism further comprises a glue sealing press plate inserted into the inside of the preset hole, and a positioning float needle inserted above the glue sealing press plate, and the bottom end of the glue sealing press plate is provided with a tongue depressor extending into the protection hole.

[0013] Preferably in the present application, the bottom of the two-shot upper mold base is provided with two two-shot columnar punches, and the middle of the two-shot columnar punch is provided with a positioning concave hole matched with the positioning float needle and the glue sealing press plate.

[0014] Preferably in the present application, the positioning mold base and the columnar mold core are provided with glue injection runners, and the two-shot columnar punch and the preset hole are provided with a glue injection cavity.

[0015] Preferably in the present application, the core mold mechanism comprises two core mold plates spliced with each other, and the two ends of the core mold plate are respectively fixed between the lower mold base, the one-shot upper mold base, the lower mold base, and the two-shot upper mold base through spring press rods.

[0016] Compared with the prior art, the present application provides an AR glasses FPC circuit board implantation positioning structure, which has the following beneficial effects: The middle positioning mechanism is independently designed, the end of the elastic ring is inserted into the columnar mold hole when the middle positioning mechanism is in a shooting state, the one-shot molded shell is processed and formed, the middle positioning mechanism is implanted in the one-shot molded shell after the one-shot molded shell is taken off, the pre-processed circuit board is implanted in the groove in the one-shot molded shell, the two positioning holes are sequentially embedded in the positioning groove formed by the two layers of umbrella-shaped structure elastic rings, the positioning and fixing of the middle position of the circuit board are completed, the phenomenon that the circuit board is separated from the middle positioning mechanism is effectively avoided during the transfer and two-shot process of the mold, the two ends of the circuit board sequentially pass through the preset hole and are inserted into the end positioning mechanism, the two ends of the circuit board are positioned and fixed through the end positioning mechanism, protection is provided during the two-shot injection molding, and then the overall positioning and fixing effect of the circuit board in the one-shot molded shell is achieved, the risk that the middle area of the circuit board is pushed by the plastic melt and deviated or broken during the two-shot injection molding process is effectively avoided. After the circuit board is fixed in the one-shot molded shell through the middle positioning mechanism and the end positioning mechanism, the two-shot upper mold base is fixed on the lower mold base, at this time, the two ends of the circuit board pass through the preset hole and are inserted into the protection hole, at this time, the end of the circuit board is pressed into the protection hole by using the glue pressing plate, and the protection hole is sealed, so that damage to the joint part of the two ends of the circuit board during the two-shot injection molding is avoided, and the position of the two ends of the circuit board is effectively limited to avoid deviation of the circuit board during the two-shot injection. During the two-shot injection, the end of the circuit board is fixed by using the glue pressing plate, the area of the circuit board exposed in the preset hole is exposed in the glue injection cavity, the glue is injected from the glue injection channel, the glue injection cavity is filled with glue, and then the connection between the circuit board and the preset hole is sealed with glue, so that the end of the circuit board is fixed on the one-shot molded shell, the lower space of the preset hole is sealed with glue, the end of the circuit board is kept in a bent state, and it is ensured that the circuit board will not be displaced, deformed or damaged due to the impact of the plastic melt during the injection molding. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 A lower mold base structure diagram of an AR glasses FPC circuit board implantation positioning structure is provided for the present application. Figure 2 A one-shot upper mold base structure diagram of an AR glasses FPC circuit board implantation positioning structure is provided for the present application. Figure 3 A one-shot upper mold base internal structure diagram of an AR glasses FPC circuit board implantation positioning structure is provided for the present application. Figure 4 A columnar mold hole distribution structure diagram of an AR glasses FPC circuit board implantation positioning structure is provided for the present application. Figure 5A core mold mechanism structure schematic diagram of an AR glasses FPC circuit board implantation positioning structure is provided for the present application; Figure 6 A two-shot upper mold base structure schematic diagram of an AR glasses FPC circuit board implantation positioning structure is provided for the present application; Figure 7 A two-shot upper mold base structure schematic diagram of an AR glasses FPC circuit board implantation positioning structure is provided for the present application; Figure 8 A two-shot upper mold base structure schematic diagram of an AR glasses FPC circuit board implantation positioning structure is provided for the present application; Figure 9 A middle positioning mechanism distribution structure schematic diagram of an AR glasses FPC circuit board implantation positioning structure is provided for the present application; Figure 10 A middle positioning mechanism structure schematic diagram of an AR glasses FPC circuit board implantation positioning structure is provided for the present application; Figure 11 A middle positioning mechanism structure schematic diagram of an AR glasses FPC circuit board implantation positioning structure is provided for the present application; Figure 12 A middle positioning mechanism structure schematic diagram of an AR glasses FPC circuit board implantation positioning structure is provided for the present application; Figure 13 A middle positioning mechanism structure schematic diagram of an AR glasses FPC circuit board implantation positioning structure is provided for the present application;

[0018] In the figure: 1 lower mold base, 2 two-shot upper mold base, 21 two-shot injection nozzle, 22 male mold, 23 two-shot cylindrical male mold, 24 cylindrical mold hole, 3 two-shot upper mold base, 31 two-shot injection nozzle, 32 two-shot female mold, 33 two-shot cylindrical male mold, 34 positioning concave hole, 4 one-shot molding shell, 5 middle positioning mechanism, 51 positioning bolt, 52 sealing ring, 53 elastic ring, 54 positioning groove, 6 circuit board, 7 end positioning mechanism, 71 positioning mold base, 72 cylindrical mold core, 73 glue sealing press plate, 74 positioning floating needle, 8 two-shot molding shell, 9 preset hole, 10 core mold mechanism, 11 spring press rod. DETAILED DESCRIPTION

[0019] The embodiments of the present application are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation of the present application.

[0020] REFERENCE Figures 1-13The utility model provides an AR glasses FPC circuit board implantation positioning structure, including lower mould base 1, the top of lower mould base 1 is fixedly installed one shot upper mould base 2 or two shot upper mould base 3, one shot upper mould base 2 or two shot upper mould base 3 and lower mould base 1 between all be provided with core mould cavity, and the inside fixed mounting of core mould cavity has core mould mechanism 10, lower mould base 1, core mould mechanism 10 and one shot upper mould base 2 between are provided with one shot forming mould cavity, one shot forming mould cavity is used to one shot injection moulding one shot forming shell 4, and the top of one shot forming shell 4 is embedded with circuit board 6, and both ends of one shot forming shell 4 are provided with the preset hole 9 matched with the end of circuit board 6, and lower mould base 1, core mould mechanism 10, one shot forming shell 4 and two shot upper mould base 3 between are provided with two shot forming mould cavity, and two shot forming mould cavity is used to two shot injection moulding two shot forming shell 8, and the top of one shot forming shell 4 is provided with two middle positioning mechanism 5 matched with the middle position of circuit board 6, and the inside both ends of lower mould base 1 are provided with installation slot, and the inside fixed mounting of installation slot has end positioning mechanism 7.

[0021] As further scheme in the utility model, the top of one shot upper mould base 2 is provided with one shot injection nozzle 21, the bottom of one shot upper mould base 2 is provided with the punch 22 matched with one shot forming mould cavity, and the surface of punch 22 is provided with two columnar die holes 24 matched with middle positioning mechanism 5, in the utility model, lower mould base 1, core mould mechanism 10 and one shot upper mould base 2 between are provided with one shot forming mould cavity, one shot forming mould cavity is used to one shot injection moulding one shot forming shell 4, and part of molten plastics enters into columnar die hole 24, can form two upward protruding middle positioning mechanism 5 in the upper surface of one shot forming shell 4, and the middle area of circuit board 6 is provided with two positioning perforations, and two positioning perforations are in turn embedded in the outside position of middle positioning mechanism 5, provide effective positioning support for the middle area of circuit board 6, avoid the phenomenon that circuit board 6 appears to deviate when two shot injection.

[0022] As a further scheme of the present application, the middle positioning mechanism 5 comprises a positioning pin 51 in a circular truncated cone structure, a sealing ring 52 is arranged at the middle position of the positioning pin 51, and two layers of elastic rings 53 in an umbrella structure are arranged at the top position of the positioning pin 51, the elastic rings 53 are embedded in the inside of the columnar mold hole 24, and a positioning groove 54 cooperating with the circuit board 6 is arranged between the two layers of elastic rings 53, in the present application, the middle positioning mechanism 5 is independently designed, when the middle positioning mechanism 5 is inserted into the columnar mold hole 24, the end of the elastic ring 53, after the one-shot forming shell 4 is processed and formed, the middle positioning mechanism 5 is implanted into the one-shot forming shell 4, after the one-shot upper mold base 2 is removed, the pretreated circuit board 6 is implanted into the groove in the one-shot forming shell 4, and the two positioning holes are sequentially embedded in the positioning groove 54 formed by the two layers of elastic rings 53 in an umbrella structure, the positioning and fixing of the middle position of the circuit board 6 are completed, in the process of transferring and two-shot injection molding, the phenomenon that the circuit board 6 is separated from the middle positioning mechanism 5 is effectively avoided, the two ends of the circuit board 6 sequentially pass through the preset hole 9 and are inserted into the end positioning mechanism 7, the two ends of the circuit board 6 are positioned and fixed by the end positioning mechanism 7, protection is provided during two-shot injection molding, and then the overall positioning and fixing effect of the circuit board 6 in the one-shot forming shell 4 is completed, and the risk that the middle area of the circuit board 6 is pushed and squeezed by the plastic melt during two-shot injection molding is effectively avoided.

[0023] As a further scheme of the present application, the top of the two-shot upper mold base 3 is provided with a two-shot injection nozzle 31, and the bottom of the two-shot upper mold base 3 is provided with a two-shot concave die 32 cooperating with the one-shot forming shell 4, in the present application, after the circuit board 6 is fixed in the one-shot forming shell 4 by the middle positioning mechanism 5 and the end positioning mechanism 7, the two-shot upper mold base 3 is fixed on the lower mold base 1, and is injection molded into the two-shot concave die 32 through the two-shot injection nozzle 31, to form a two-shot forming shell 8 fused with the one-shot forming shell 4, and the circuit board 6 is covered between the one-shot forming shell 4 and the two-shot forming shell 8, so that the processing operation of the AR glasses shell is completed, and damage to the implanted FPC circuit board is avoided.

[0024] As a further scheme of the present application, the end positioning mechanism 7 comprises a positioning mold base 71 in a cylindrical structure, a columnar mold core 72 adapted to the preset hole 9 is installed in the inside of the positioning mold base 71, and a protection hole cooperating with the end of the circuit board 6 is arranged at the top of the columnar mold core 72, in the present application, the columnar mold core 72 is inserted into the inside of the positioning mold base 71 during one-shot injection molding, to injection mold the preset hole 9 structure connected to the one-shot forming shell 4, and when one-shot injection molding is completed, the preset hole 9 fixedly connecting the end of the circuit board 6 is formed on both sides of the one-shot forming shell 4.

[0025] As a further scheme of the present application, the bottom of the first upper mold base 2 is provided with a first columnar convex mold 23, and the bottom end of the first columnar convex mold 23 is embedded into the inside of the positioning mold base 71 and cooperates with the columnar mold core 72, in the present application, after the first upper mold base 2 is fixed with the lower mold base 1, the first columnar convex mold 23 is inserted into the positioning mold base 71 and cooperates with the columnar mold core 72 to form an annular mold cavity of the preset hole 9, and the protection hole is blocked to avoid the plastic entering.

[0026] As a further scheme of the present application, the end positioning mechanism 7 further comprises a glue sealing plate 73 inserted into the inside of the preset hole 9, and a positioning float needle 74 inserted above the glue sealing plate 73, the bottom end of the glue sealing plate 73 is provided with a tongue pressing plate extending into the inside of the protection hole, in the present application, after the circuit board 6 is fixed in the first molding shell 4 by the middle positioning mechanism 5 and the end positioning mechanism 7, and the second upper mold base 3 is fixed on the lower mold base 1, the two ends of the circuit board 6 are inserted into the inside of the protection hole through the preset hole 9, at this time, the end of the circuit board 6 is pressed into the protection hole by the glue sealing plate 73, and the protection hole is blocked to avoid damage to the joint part of the two ends of the circuit board 6 during the second injection molding, and the position of the two ends of the circuit board 6 is effectively limited to avoid the circuit board 6 from deviating during the second injection.

[0027] As a further scheme of the present application, the bottom of the second upper mold base 3 is provided with two second columnar convex molds 33, and the middle part of the second columnar convex mold 33 is provided with a positioning recess hole 34 cooperating with the positioning float needle 74 and the glue sealing plate 73, in the present application, after the second upper mold base 3 is fixed on the lower mold base 1, the positioning float needle 74 and the glue sealing plate 73 are limited and fixed by the second columnar convex mold 33, the stability of the glue sealing plate 73 is enhanced, and the deviation during the second injection molding is avoided, so that the molten plastic does not enter the protection hole to pollute the joint of the circuit board 6.

[0028] As a further scheme of the present application, the positioning mold base 71 and the columnar mold core 72 are provided with a glue injection flow channel, and the second columnar convex mold 33 and the preset hole 9 are provided with a glue injection mold cavity, in the present application, after the circuit board 6 is fixed in the first molding shell 4 by the middle positioning mechanism 5 and the end positioning mechanism 7, and the second upper mold base 3 is fixed on the lower mold base 1, the end of the circuit board 6 is fixed by the glue sealing plate 73, the area of the circuit board 6 exposed in the inside of the preset hole 9 is exposed in the glue injection mold cavity, the glue is injected from the glue injection flow channel, the glue injection mold cavity is filled with glue, and then the circuit board 6 and the connection part of the preset hole 9 are glued, so that the end of the circuit board 6 is fixed on the first molding shell 4, the lower space of the preset hole 9 is closed by the glue, the end of the circuit board 6 is kept in a bent state, and it is ensured that the circuit board 6 will not be displaced, deformed or damaged due to the impact of the plastic melt during the injection molding.

[0029] As a further scheme of the present application, the core mold mechanism 10 comprises two core mold plates spliced with each other, and the two ends of the core mold plates are fixed between the lower mold base 1, the first upper mold base 2 or the lower mold base 1, the second upper mold base 3 through the spring pressing rods 11. In the present application, the core mold plates are fixed through the spring pressing rods 11. In the production process, the core mold plates are combined to form the orbital mold of the AR glasses. Each core mold plate can be independently designed, manufactured and replaced. By replacing the corresponding module, the AR glasses shell processing of various models and styles can be formed without the need to redesign and manufacture the entire mold, thereby greatly improving the versatility and flexibility of the mold.

[0030] In use, the middle positioning mechanism 5 is inserted into the columnar mold hole 24 at the first injection. After the first injection shell 4 is processed and formed, the middle positioning mechanism 5 is implanted in the first injection shell 4. After the first upper mold base 2 is removed, the pre-processed circuit board 6 is implanted in the groove in the first injection shell 4. The two positioning holes are sequentially embedded in the positioning groove 54 formed by the two layers of umbrella-shaped elastic rings 53. The positioning and fixing of the middle position of the circuit board 6 are completed. During the transfer and second injection process of the mold, the phenomenon of separation of the circuit board 6 from the middle positioning mechanism 5 is effectively avoided. The two ends of the circuit board 6 sequentially pass through the preset holes 9 and are inserted into the end positioning mechanism 7. The two ends of the circuit board 6 are positioned and fixed by the end positioning mechanism 7, and protection is provided during the second injection molding, thereby completing the overall positioning and fixing effect of the circuit board 6 inside the first injection shell 4. The risk of displacement and fracture of the middle region of the circuit board 6 caused by the plastic melt during the second injection molding process is effectively avoided. After the circuit board 6 is fixed inside the first injection shell 4 by the middle positioning mechanism 5 and the end positioning mechanism 7, the second upper mold base 3 is fixed on the lower mold base 1. At this time, the two ends of the circuit board 6 are inserted into the protection holes. At this time, the end of the circuit board 6 is pressed into the protection hole by the sealing glue pressing plate 73, and the protection hole is sealed to avoid damage to the joint parts of the two ends of the circuit board 6 during the second injection molding, and effectively limit the position of the two ends of the circuit board 6 to avoid the displacement of the circuit board 6 during the second injection.

[0031] The above is only the preferred embodiment of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered within the protection scope of the present application.

Claims

1. An AR glasses FPC circuit board implant positioning structure, comprising a lower die seat (1), one of a single-shot upper die seat (2) or a double-shot upper die seat (3) is fixedly installed on the top of the lower die seat (1), characterized in that, The core cavity is internally and fixedly installed with a core mechanism (10), the lower mold base (1), the core mechanism (10) and the one-shot upper mold base (2) are provided with a one-shot forming cavity, and the one-shot forming cavity is used for one-shot injection molding of a one-shot forming shell (4).

2. The AR glasses FPC circuit board implant positioning structure according to claim 1, wherein, The top of the one-shot upper mold base (2) is provided with a one-shot injection nozzle (21), and the bottom of the one-shot upper mold base (2) is provided with a punch (22) matched with the one-shot forming cavity, and the surface of the punch (22) is provided with two columnar mold holes (24) matched with the middle positioning mechanism (5).

3. The AR glasses FPC circuit board implant positioning structure according to claim 2, wherein, The middle positioning mechanism (5) comprises a positioning bolt (51) in a circular table structure, and the middle position of the positioning bolt (51) is provided with a sealing ring (52), and the top position of the positioning bolt (51) is provided with two elastic rings (53) in an umbrella structure, which are embedded in the columnar mold hole (24), and the two elastic rings (53) are provided with a positioning groove (54) matched with the circuit board (6) between them.

4. The AR glasses FPC circuit board implant positioning structure according to claim 3, characterized in that, The top of the two-shot upper mold base (3) is provided with a two-shot injection nozzle (31), and the bottom of the two-shot upper mold base (3) is provided with a two-shot recessed die (32) matched with the one-shot forming shell (4).

5. The AR glasses FPC circuit board implant positioning structure according to claim 4, wherein, The end positioning mechanism (7) comprises a positioning mold base (71) in a cylindrical structure, and the inside of the positioning mold base (71) is installed with a columnar mold core (72) matched with the preset hole (9), and the top of the columnar mold core (72) is provided with a protection hole matched with the end of the circuit board (6).

6. The AR glasses FPC circuit board implant positioning structure according to claim 5, wherein, The bottom of the one-shot upper mold base (2) is provided with a one-shot columnar punch (23) on both sides, and the bottom end of the one-shot columnar punch (23) is embedded into the inside of the positioning mold base (71) and matched with the columnar mold core (72).

7. The AR glasses FPC circuit board implant positioning structure according to claim 5, wherein, The end positioning mechanism (7) further comprises a glue sealing pressing plate (73) inserted into the inside of the preset hole (9), and a positioning float needle (74) inserted above the glue sealing pressing plate (73), and the bottom end of the glue sealing pressing plate (73) is provided with a tongue pressing extending into the protection hole.

8. The AR glasses FPC circuit board implant positioning structure according to claim 7, characterized in that, The bottom of the two-shot upper mold base (3) is provided with two two-shot columnar punches (33), and the middle of the two-shot columnar punch (33) is provided with a positioning recess (34) matched with the positioning float needle (74) and the glue sealing pressing plate (73).

9. The AR glasses FPC circuit board implant positioning structure according to claim 8, wherein, The positioning die seat (71) and the columnar die core (72) are provided with glue injection runner, and the two-shot columnar punch (33) and the preset hole (9) are provided with glue injection cavity.

10. The AR glasses FPC circuit board implant positioning structure according to claim 1, wherein, The core mold mechanism (10) comprises two core mold plates which are spliced with each other, and the two ends of the core mold plates are fixed between the lower die seat (1), the one-shot upper die seat (2) or the lower die seat (1), the two-shot upper die seat (3) through the spring pressing rods (11) respectively.

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