Forming micro reflector printing process for micro light emitting diode display

Abstract

The present disclosure relates to shaped micro reflector printing processes for micro light emitting diode displays, shaped micro reflectors having integrated side-emitting micro light emitting diodes (micro LEDs), which may be separate or laminated into glass or laminated glass components (e.g., glass panels of vehicles). An exemplary display unit includes side-emitting micro light emitting diodes on a surface of a display substrate. The side-emitting micro light emitting diode is coated with a first reflective layer such that light is emitted from the uncoated sidewall. The display unit includes a shaped micro reflector coated with a second reflective layer on a display substrate. The shaped micro reflector includes a tapered sidewall positioned to redirect light from an uncoated sidewall of the side-emitting micro light emitting diode from an emission angle to a reflection angle via reflection opposite the second reflective layer. A second reflective layer is formed directly on opposite sidewalls and the bottommost surface of the shaped microreflector.

Description

TECHNICAL FIELD

[0001] The subject disclosure relates to display technology, and in particular, to a shaped micro-reflector printing process for side-emitting micro light emitting diode (micro-LED) displays. BACKGROUND

[0002] Light emitting diodes (LEDs) have revolutionized the field of display technology with their high efficiency and versatile capabilities. LEDs are semiconductor devices that emit light when an electric current is passed through them. LED displays can be single- or multi-color displays, and depending on the underlying architecture, typically utilize an active layer between two doped layers (e.g., an n-type semiconductor layer and a p-type semiconductor layer) and the application of a voltage between the two doped layers to generate light. The voltage causes electrons to be injected into the active layer, where they recombine to release photons. LEDs can be driven at relatively low voltages while emitting a low level of heat when compared to traditional incandescent light bulbs, providing a relatively high energy efficiency. LEDs can be fabricated in a range of display and screen types, such as, for example, in heads-up displays (HUDs), in-plane displays (e.g., in-plane communication devices laminated in or on a vehicle window to communicate with a user inside or outside of the vehicle), smart glass applications, and general device displays.

[0003] Early LED displays were somewhat simple devices configured to display a limited variety of static images, logos, symbols, and / or messages as needed, and were typically fabricated by arranging LEDs to feed light strips via collimating optics (i.e., collimators). Light from the light strips was mixed using a mixing area or homogenizing area and ultimately displayed in a display area. However, LED technology has rapidly evolved, and displays can now utilize dense arrays of micro-LEDs to drive complex multi-pixel displays.

[0004] Micro-LEDs are tiny individual light emitting diodes, typically less than 100 microns in size, that can be manufactured using advanced semiconductor manufacturing techniques. Micro-LED displays offer numerous advantages over previous generations of LED display systems, such as higher brightness, improved color accuracy, higher energy efficiency, and other enhanced performance characteristics. These attributes make micro-LED displays ideal for automotive applications where visibility, clarity, and power efficiency are highly desirable (e.g., in in-plane communication systems for vehicles). SUMMARY

[0005] In one exemplary embodiment, a method may include forming a cartridge by forming a release layer on a substrate, forming shaped micro-reflectors on the release layer, the shaped micro-reflectors having tapered sidewalls, and forming a reflective layer over the shaped micro-reflectors and the release layer. The method may include bonding the cartridge to a display substrate using a bonding layer positioned between the reflective layer and the display substrate. The method may include removing the release layer of the cartridge, thereby separating the substrate from the display substrate.

[0006] In some embodiments, the release layer includes at least one of an ultraviolet (UV) curable material and a thermally curable material.

[0007] In some embodiments, the reflective layer is conformally deposited on the shaped micro-reflectors and the release layer. In some embodiments, the reflective layer is conformally deposited to a thickness between 5 nanometers and 3 microns.

[0008] In some embodiments, the cassette is flipped before being bonded to the display substrate.

[0009] In some embodiments, removing the release layer comprises at least one of exposing the release layer to UV radiation and exposing the release layer to thermal energy.

[0010] In another exemplary embodiment, a display unit includes a side-emitting micro-LED on a surface of a display substrate. The side-emitting micro-LED is coated with a first reflective layer so that light is emitted from an uncoated sidewall. The display unit includes a shaped micro-reflector coated with a second reflective layer. The shaped micro-reflector is adjacent to the side-emitting micro-LED and includes a tapered sidewall positioned to redirect light from the uncoated sidewall of the side-emitting micro-LED from an emission angle to a reflection angle via reflection against the second reflective layer.

[0011] In some embodiments, the tapered sidewalls have a taper between -90 degrees and 90 degrees measured relative to the surface of the display substrate, where a taper of zero degrees is normal to the surface of the display substrate.

[0012] In some embodiments, the shaped micro-reflectors have a taper of approximately 30 degrees to 60 degrees.

[0013] In some embodiments, the topmost surfaces of the shaped micro-reflectors are not coated with the second reflective layer.

[0014] In some embodiments, the uncoated sidewalls of the side-emitting micro LEDs directly face the tapered sidewalls of the shaped micro-reflectors.

[0015] In some embodiments, the tracker is formed on a display substrate. In some embodiments, the shaped micro-reflectors and the second reflective layer are formed on the tracker.

[0016] In yet another example embodiment, a method can include forming a side-emitting micro light emitting diode on a surface of a display substrate. The side-emitting micro light emitting diode is coated with a first reflective layer such that light is emitted from an uncoated sidewall. The method includes forming a shaped micro reflector coated with a second reflective layer on the display substrate. The shaped micro reflector is adjacent to the side-emitting micro light emitting diode and includes a tapered sidewall positioned to redirect light from the uncoated sidewall of the side-emitting micro light emitting diode from an emission angle to a reflection angle via reflection off of the second reflective layer.

[0017] In some embodiments, the tapered sidewall has a taper between -90 degrees and 90 degrees measured relative to the surface of the display substrate, where zero degrees taper is orthogonal to the surface of the display substrate.

[0018] In some embodiments, the shaped micro reflector has a taper of about 30 degrees to 60 degrees.

[0019] In some embodiments, a topmost surface of the shaped micro reflector is uncoated with the second reflective layer.

[0020] In some embodiments, the uncoated sidewall of the side-emitting micro light emitting diode directly faces the tapered sidewall of the shaped micro reflector.

[0021] In some embodiments, a tracker is formed on the display substrate. In some embodiments, the shaped micro reflector and the second reflective layer are formed on the tracker.

[0022] The above features and advantages of the present disclosure, and other features and advantages, are readily apparent from the following detailed description, when taken in connection with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0023] Other features, aspects, and details of the present disclosure are described in the detailed description that follows in connection with the accompanying drawings, in which:

[0024] Figure 1 is a vehicle configured in accordance with one or more embodiments;

[0025] Figure 2A is a cross-sectional view of a display unit of a display in accordance with one or more embodiments;

[0026] Figure 2B is a cross-sectional view of a portion of a side-emitting micro LED of Figure 2A

[0027] Figure 3A ​is a cross-sectional view of a cell during a process for manufacturing a display unit according to one or more embodiments;

[0028] Figure 3B is a cross-sectional view of a cell during a process for manufacturing a display unit according to one or more embodiments; Figure 3A

[0029] Figure 3C is a cross-sectional view of a display unit during a process for manufacturing a display unit according to one or more embodiments;

[0030] Figure 3D is a cross-sectional view of a plurality of display units during a process for manufacturing a display according to one or more embodiments;

[0031] Figure 4 is a top view of a display unit of a display according to one or more embodiments;

[0032] Figure 5 is a computer system according to one or more embodiments;

[0033] Figure 6 is a flowchart according to one or more embodiments; and

[0034] Figure 7 is a flowchart according to one or more embodiments. DETAILED DESCRIPTION

[0035] The following description is merely exemplary in nature and is not intended to limit the present disclosure, its application, or uses. It should be understood that throughout the drawings, corresponding reference numerals indicate like or corresponding parts and features. As used herein, the term module refers to processing circuitry, which can include an Application Specific Integrated Circuit (ASIC), an electronic circuit, a processor (shared, dedicated, or group) and memory that execute one or more software or firmware programs, a combinational logic circuit, and / or other suitable components that provide the described functionality.

[0036] Micro Light Emitting Diodes (micro-LEDs) have largely replaced earlier generations of LEDs for display applications. The conventional way of driving micro-LEDs in a display system is to use a Thin Film Transistor (TFT) backplane mounted on an underlying substrate. The TFT backplane acts as a switching element that controls the current flowing through each individual LED pixel in the display. Thus, in order to integrate working micro-LEDs into a glass lamination assembly of a vehicle (e.g., a front windshield, a passenger window, etc.), the TFT backplane must be laminated alongside the micro-LEDs between the inner and outer glass layers of the glass lamination assembly.

[0037] ​However, there are some challenges in integrating micro-LED based displays in a range of applications. For example, in automotive lighting systems such as tail lamps and center high mount stop lamps (CHMSL), the underlying lighting system, housing, and / or optical system is typically placed in the body of the vehicle. As a result, micro-LED based lighting systems require some space to package the lighting module (micro-LEDs, TFT backplane, etc.), thereby increasing the weight and slightly increasing the difficulty of the lamination assembly process. Complicating the matter further, micro-LEDs naturally direct a large portion of their emitted light in a direction orthogonal to the major surface of the underlying substrate (the substrate on which the micro-LEDs are placed). In applications such as head-up displays (HUDs), the direction of the emitted light is not necessarily aligned with the intended viewing direction, such as being horizontally aligned with the eyes of the driver and / or passengers. As a result, a large amount of emitted light is wasted.

[0038] The present disclosure introduces a way of fabricating shaped micro-reflectors on micro-LED displays. The shaped micro-reflectors can be positioned adjacent to side-emitting micro-LEDs to redirect the emitted light from the LEDs to any desired reflection angle, thereby increasing the relative proportion of emitted light that is actually observed (i.e., emitted along the viewing angle). Micro-LED displays with shaped micro-reflectors and side-emitting micro-LEDs configured in this way can operate at lower driving voltages while achieving the same observable brightness due to the increased proportion of emitted light that is redirected along a useful path. Furthermore, by laminating the combination of side-emitting micro-LEDs and micro- reflector arrays into the glass layer used for the vehicle window, the conventional external lighting module package can be removed, thereby reducing the weight of the vehicle.

[0039] According to example embodiments, a vehicle in Figure 1100. The vehicle 100 is shown in the form of a car having a body 102. The body 102 includes a passenger compartment 104, in which a steering wheel, front seats, and rear passenger seats (not shown separately) are arranged. The body 102 also includes a plurality of glass or glass laminate assemblies, such as a laminated glass panel 106. For ease of illustration and discussion only, emphasis is placed on a specific laminated glass panel 106 (here, the front passenger window). It should be understood that any aspect of the present disclosure can be applied to any glass and glass laminate assembly in the vehicle 100, including, for example, a front windshield (e.g., HUD application), any driver and passenger door windows (front and rear), rear glass panel, sunroof / roof window, etc. In short, the position, size, arrangement, etc. of the laminated glass panel 106 are not meant to be particularly limited, and all such configurations are within the intended scope of the present disclosure. As will be described in detail herein, the laminated glass panel 106 includes a display 108. The display 108 (also referred to as a lighting profile controllable micro-LED panel) includes one or more side-emitting micro-LEDs integrated with one or more shaped micro-reflectors. The side-emitting micro-LEDs, shaped micro-reflectors, and methods of manufacturing the same are discussed in more detail below. In some embodiments, a portion 110 of the display 108 is concealed within the vehicle body 102 (as shown).

[0040] Figure 2A A display (eg, Figure 1 108) is a cross-sectional view of a display unit 200. Figure 2A As shown, the display unit 200 includes a display substrate 202, a shaped micro-reflector 204 coated with a reflective layer 206, a bonding layer 208 between the reflective layer 206 and the display substrate 202, and a side-emitting micro-LED 210 adjacent to the shaped micro-reflector 204 and on the display substrate 202. Although only a single display unit 200 is shown for ease of illustration and discussion, it should be understood that the display may include any number of display units 200 (see FIG. Figure 3D ).

[0041] The display substrate 202 can be made of a range of suitable materials and will vary depending on the needs of the respective application (e.g., desired structural, thermal, and optical properties, etc.). In some embodiments, for example, the display substrate 202 is a glass substrate. In some embodiments, the display substrate is made of glass, polycarbonate (PC) materials, acrylic materials (such as polymethyl methacrylate (PMMA)), thermoplastics (such as thermoplastic polyurethane (TPU)), glass-ceramic materials (such as soda-lime-silica glass-ceramic, aluminosilicate glass-ceramic, lithium aluminosilicate glass-ceramic, spinel glass-ceramic, and β-quartz glass-ceramic), and combinations thereof.

[0042] The shaped micro-reflectors 204 can comprise polymer materials such as PC and PMMA, but other polymers are also within the contemplated scope of the present disclosure. In some embodiments, the shaped micro-reflectors 204 are formed to have tapered sidewalls 212 having any desired taper. As will be discussed in further detail herein, the taper of the shaped micro-reflectors 204 redirects the emission angle A of light from the side-emitting micro-LEDs 210 to a reflection angle B via reflection against the reflective layer 206. Thus, by varying the taper of the shaped micro-reflectors 204, the reflection angle B can be adjusted as desired. In some embodiments, the taper is between -90 degrees and 90 degrees measured relative to the surface of the display substrate 202, where zero degrees of taper is normal to the surface of the display substrate 202. In some embodiments, the taper is between -45 degrees and 45 degrees. In some embodiments, the taper is between -30 degrees and 30 degrees. In some embodiments, the shaped micro-reflectors 204 have a positive taper (e.g., an acute angle) between 0 degrees and 90 degrees. In some embodiments, the shaped micro-reflectors 204 have a positive taper between 0 and 60 degrees. In some embodiments, the shaped micro-reflectors 204 have a taper between 0 and -90 degrees (e.g., an obtuse angle, or so-called negative taper relative to a direction normal to the underlying surface). In some embodiments, the shaped micro-reflectors 204 have a positive taper between 0 and -60 degrees. For example, Figure 2A As shown, the shaped micro-reflectors 204 have a taper of approximately -15 degrees.

[0043] like Figure 2A As shown, the shaped micro-reflectors 204 can be coated with a reflective layer 206. In some embodiments, the reflective layer 206 is coated along three surfaces (e.g., opposing sidewalls and a bottommost surface in contact with the bonding layer 208), while the topmost surface 214 of the shaped micro-reflectors 204 is exposed (as shown). In some embodiments, the reflective layer 206 is conformally formed on the shaped micro-reflectors 204, thereby having the same tapered shape as the shaped micro-reflectors 204. As used herein, the term "conformal" (e.g., conformal layer, conformally formed layer, etc.) means that the thickness of the corresponding layer is substantially the same on all surfaces on which the corresponding layer is formed or deposited, or that the thickness varies by less than 15% of the nominal thickness of the corresponding layer.

[0044] In some embodiments, the reflective layer 206 comprises a metallic material such as silver, gold, or copper, although other metals and conductive non-metals are also within the contemplation of the present disclosure. In some embodiments, the reflective layer 206 comprises a dielectric stack having one or more dielectric layers (not separately shown). The dielectric layers may include, for example, silicon dioxide (SiO2), silicon nitride (Si3N4), polyimide, benzocyclobutene (BCB), spin-on glass (SOG), aluminum oxide (Al2O3), hafnium oxide (HfO2), and combinations thereof, although other dielectrics are also within the contemplation of the present disclosure.

[0045] In some embodiments, a bonding layer 208 is positioned between the reflective layer 206 and the display substrate 202. In this manner, the reflective layer 206 and the shaped micro-reflectors 204 are bonded to the display substrate 202 via the bonding layer 208. Although not intended to be particularly limiting, the bonding layer 208 can be made of a plastic interlayer material, such as a polyvinyl butyral (PVB) film.

[0046] In some embodiments, the side-emitting micro-LEDs 210 are electrically coupled to the display substrate 202. In some embodiments, the side-emitting micro-LEDs 210 are electrically coupled to the display substrate 202 via the display substrate 202 (see FIG. Figure 4 ) powers the side-emitting micro-LEDs 210 with the drive current received from the LED. In some embodiments, the side-emitting micro-LEDs 210 comprise a single LED element. In some embodiments, the side-emitting micro-LEDs 210 comprise multiple micro-LED elements, such as a red micro-LED element, a green micro-LED element, and / or a blue micro-LED element (not separately shown). The side-emitting micro-LEDs 210 can be formed from a range of suitable materials, such as semiconductor materials (e.g., silicon, gallium nitride, indium gallium nitride, etc.), and sapphire, depending on the desired emission color of the corresponding micro-LED. For example, gallium nitride (GaN) is used for blue LEDs, indium gallium nitride (InGaN) is used for green LEDs, and aluminum gallium indium phosphide (AlGaInP) is used for red LEDs.

[0047] In some embodiments, the side-emitting micro-LEDs 210 are coated so that the side-emitting micro-LEDs 210 emit directional light A (also referred to as emitted light) from the sidewalls 216 of the side-emitting micro-LEDs 210 directly toward the reflective layer 206 on the shaped micro-reflectors 204. Figure 2B The coating layers of the side-emitting micro-LEDs 210 are discussed in more detail.

[0048] Figure 2B Description of the invention according to one or more embodiments Figure 2A A cross-sectional view of portion C of a side-emitting micro-LED 210. Figure 2BAs shown, in some embodiments, the side-emitting micro-LED 210 includes several stacked multiple quantum well (MQW) layers 218 between the p-doped layer 220 and the n-doped layer 222. The side-emitting micro-LED 210 is shown as having four MQW layers 218, but any number of MQW layers is within the contemplation of the present disclosure.

[0049] The MQW layers 218 can include alternating layers of semiconductor material that define a series of quantum wells and barriers. The quantum well material can include, for example, indium gallium nitride (InGaN), aluminum gallium indium phosphide (AlGaInP), gallium indium phosphide (GaInP), gallium arsenide phosphide (GaAsP), gallium indium arsenide phosphide (GaInAsP), gallium arsenide (GaAs), indium gallium arsenide (InGaAs), and aluminum gallium arsenide (AlGaAs). The barrier material can include, for example, gallium nitride (GaN), aluminum gallium nitride (AlGaN), aluminum gallium indium phosphide (AlGaInP), aluminum indium phosphide (AlInP), gallium indium phosphide (GaInP), AlGaAs, and aluminum arsenide (AlAs).

[0050] The p-doped layer 220 can include, for example, magnesium (Mg), zinc (Zn), carbon (C), and / or beryllium (Be), although other materials are within the contemplation of the present disclosure. The n-doped layer 222 can include, for example, silicon (Si), germanium (Ge), and / or tellurium (Te), although other materials are within the contemplation of the present disclosure.

[0051] In some embodiments, the side-emitting micro-LED 210 includes an optical layer 224 in contact with both the p-doped layer 220 and the n-doped layer 222. In some embodiments, the optical layer 224 is a conformal layer (as shown) in further contact with the MQW layers 218. Materials for the optical layer 224 can include, for example, distributed Bragg reflector (DBR) layers such as alternating layers of semiconductor and / or dielectric materials having different indices of refraction, including GaN / AlGaN, GaAs / AlGaAs, and SiO2 / TiO2, transparent conductive oxides (TCOs) such as indium tin oxide (ITO), zinc oxide (ZnO), and aluminum-doped zinc oxide (AZO).

[0052] In some embodiments, the side-emitting micro-LED 210 includes a dielectric layer 226 between the optical layer 224 and the reflective layer 228. The dielectric layer 226 can include, for example, silicon dioxide, silicon nitride, polyimide, benzocyclobutene, spin-on glass, aluminum oxide, hafnium oxide, and combinations thereof, but other dielectrics are also within the contemplated scope of the present disclosure. Materials for the reflective layer 228 can include, for example, DBR layers, such as alternating layers of semiconductor and / or dielectric materials with different refractive indices, including GaN / AlGaN, GaAs / AlGaAs, and SiO2 / TiO2, transparent conductive oxides, such as indium tin oxide (ITO), zinc oxide (ZnO), and aluminum-doped zinc oxide (AZO), dielectric mirror (DL) layers, such as alternating layers of dielectric materials with different refractive indices, including SiO2 / Si3N4, SiO2 / TiO2, and SiO2 / HfO2, anti-reflective coating layers, such as SiO2, Si3N4, TiO2, and MgF2, and combinations thereof. Reflective layer 228 is observed to be positioned to expose sidewalls 216, thereby allowing light emitted from side-emitting micro LEDs 210 to be directed only from sidewalls 216 (light contacting other surfaces of side-emitting micro LEDs 210 is directed back to sidewalls 216 due to internal reflection from reflective layer 228).

[0053] Figure 3A A method for manufacturing a display unit (eg, Figure 2A 200) during the process of the cartridge 300. Figure 3A As shown, the box 300 includes a substrate 302. Although not intended to be particularly limited, the substrate 302 can include, for example, glass, sapphire, semiconductor materials, dielectrics, and combinations thereof. In some embodiments, the substrate 302 is a glass substrate.

[0054] In some embodiments, a release layer 304 is formed on the substrate 302. In some embodiments, the release layer 304 is an ultraviolet (UV) and / or heat-curable material such that exposure to UV light and / or heat energy (e.g., a laser) causes the release layer 304 to separate from the substrate 302. In some embodiments, the release layer 304 is made of a material that is selected such that upon receiving UV radiation and / or heat energy exposure, the bond strength between the release layer 304 and the substrate 302 is reduced such that removal of the release layer 304 is relatively easier than before the UV radiation and / or heat energy exposure. Exemplary materials can include, for example, photoresists (such as PMMA), polymeric release layers (such as polyvinyl alcohol (PVA), polyacrylic acid (PAA), and polystyrene (PS) layers), sacrificial oxide layers (such as silicon dioxide and aluminum oxide), metal release layers (such as aluminum, titanium, and chromium), organic light-transmitting layers (such as polydimethylsiloxane (PDMS)), and laser release layers (such as polymer films with light-absorbing dyes and / or nanoparticles), or combinations thereof.

[0055] In some embodiments, shaped microreflectors 204 (referenced Figure 2A ) are formed on the release layer 304. In some embodiments, the shaped microreflectors 204 are formed using a laser etching process, although other techniques such as chemical vapor deposition (CVD) and electroplating are also within the contemplation of the present disclosure.

[0056] In some embodiments, a reflective layer 206 (referenced Figure 2A ) is formed on the shaped microreflectors 204. In some embodiments, the reflective layer 206 is conformally deposited on the shaped microreflectors 204 and the release layer 304 using, for example, CVD, plasma-enhanced CVD (PECVD), ultrahigh vacuum CVD (UHVCVD), rapid thermal CVD (RTCVD), metal-organic CVD (MOCVD), low-pressure CVD (LPCVD), limited reaction processing CVD (LRPCVD), atomic layer deposition (ALD), physical vapor deposition (PVD), chemical solution deposition, molecular beam epitaxy (MBE), or other similar processes in combination with a wet or dry etching process. In some embodiments, the reflective layer 206 is deposited to a thickness of between 5 nanometers and 3 micrometers, although other thicknesses are within the contemplation of the present disclosure. It is observed that, due to the reflective layer 206 being formed on the release layer 304, the topmost surface 214 (see Figure 2A ) of the shaped microreflectors 204 is not coated with the reflective layer 206. The exposed topmost surface 214 serves as a physical signature of the manufacturing process described herein. It is observed that, in this intermediate configuration (box front flip, referenced Figure 3B ), the topmost surface 214 is the bottommost surface of the shaped microreflectors 204.

[0057] Figure 3BA method for manufacturing a display unit (eg, Figure 2A During the process of display unit 200) Figure 3A A cross-sectional view of the box 300. Figure 3B As shown, the box 300 is flipped over and bonded to the display substrate 202 (see Figure 2A In some embodiments, the reflective layer 206 is bonded to the display substrate 202 via a bonding layer 208. The bonding layer 208 can be formed on the reflective layer 206, the display substrate 202, or both. In some embodiments, the reflective layer 206 and the display substrate 202 can be pressed together to provide the bonding layer 208.

[0058] Figure 3C A method for manufacturing a display unit (eg, Figure 2A A cross-sectional view of a display unit during the process of manufacturing a display unit 200 of FIG. Figure 3C As shown, the release layer 304 and substrate 302 of the box 300 can be removed (see Figure 3B ) to define the display unit 200. In some embodiments, the release layer 304 and / or the substrate 302 are exposed to UV light and / or thermal energy for release, as previously discussed. In some embodiments, the removal of the release layer 304 also results in the removal of a portion 306 of the reflective layer 206 (as shown).

[0059] Figure 3D A method for manufacturing a display (eg, Figure 1 A cross-sectional view of a plurality of display units 200 during a process of manufacturing a display 108 of FIG. Figure 3D As shown, the steps of Figure 3A 、 3B and 3C to provide a display 108 having any number of display units 200. For convenience only, the display 108 is shown in FIG. Figure 3D 1. As shown in FIG. 1, the display 108 is shown as having three display units 200, and it should be understood that the display 108 may include any number of display units 200 as desired, and all such configurations are within the contemplated scope of the present disclosure.

[0060] Although not shown separately, the display unit 200 may be incorporated into a display (e.g., Figure 1108 (shown in FIG. 10 ). In some embodiments, one or more display elements 200 are laminated between an outer glass layer (also referred to as an outer glass ply) and an inner glass layer (also referred to as an inner glass ply) of a laminated panel (not separately shown). In some embodiments, display substrate 202 is one or both of the outer glass layer and the inner glass layer. A laminated glass panel may include one or more additional layers above and / or below the outer glass layer and / or the inner glass layer. For example, a laminated glass panel may include one or more layers for anti-reflection, solar comfort, auto-tinting, and / or general appearance.

[0061] Figure 4 A display (eg, Figure 1 108) is shown in FIG. The display unit 400 can be used with respect to Figure 3A to 3D The display unit 200 discussed above is formed in a similar manner, except that the display unit 400 can include one or more side-emitting micro-LEDs 210 coupled to one or more trackers 402 (trackers can also be referred to as backplanes) on the display substrate 202. In some embodiments, the shaped micro-reflectors 204 and reflective layer 206 are formed on the trackers 402, thereby allowing the display unit 400 to maintain transparency for applications such as in-plane displays in or on glass where transparency is required or desired. Notably, positioning the shaped micro-reflectors 204 and reflective layer 206 on the trackers 402 reduces the light transmittance drop from the opaque reflector structure (shaped micro-reflectors 204 and reflective layer 206).

[0062] As shown, ten side-emitting micro-LEDs 210 are coupled to the tracker 402 in a 2×5 configuration, but any number of side-emitting micro-LEDs 210 may be coupled to the tracker 402 in any desired configuration, and all such configurations are within the contemplated scope of the present invention. In some embodiments, the tracker 402 is communicatively coupled to a controller 404 via electrical connections 406 (wires, drive circuitry, bus lines, etc.).

[0063] In some embodiments, the controller 404 is configured to individually direct the trackers 402 to selectively activate their respective side-emitting micro-LEDs 210, thereby producing a desired image or pattern. In some embodiments, for example, the controller 404 and / or the trackers 402 can control a respective one of the side-emitting micro-LEDs 210 by selectively delivering a driving voltage to the respective side-emitting micro-LEDs 210. Although not intended to be particularly limiting, in some embodiments, the controller 220 can comprise, for example, an electronic control unit (ECU) of the vehicle 100.

[0064] Figure 5 Aspects of an embodiment of a computer system 500 that can perform various aspects of the embodiments described herein are shown. In some embodiments, the computer system 500 can be incorporated within or in combination with a display (e.g., display 108 of FIG. 1), a driver circuit (e.g., driver circuit 402 of FIG. 1), and / or a controller (e.g., controller 404 of FIG. 1). The computer system 500 includes at least one processing device 502, which generally includes one or more processors for performing a variety of functions (e.g., controlling drive voltages to one or more of the side-emitting micro-LEDs 210 of the display 108). More specifically, the computer system 500 can include logic necessary to direct voltages necessary to activate or deactivate (turn on or off) individual micro-LEDs 210 or any subset of micro-LEDs 210 of the display 108. Figure 1 Figure 4 Figure 4 The components of the computer system 500 include the processing device 502 (such as one or more processors or processing units), a system memory 504, and a bus 506 that couples various system components including the system memory 504 to the processing device 502. The system memory 504 can include various computer system readable media. Such media can be any available media that is accessible by the processing device 502, and includes both volatile and non-volatile media, and removable and non-removable media.

[0065] For example, the system memory 504 includes a non-volatile memory 508, such as a hard disk drive, and can also include a volatile memory 510, such as random access memory (RAM) and / or a cache memory. The computer system 500 can further include other removable / non-removable, volatile / non-volatile computer system storage media.

[0066] For example, the system memory 504 includes a non-volatile memory 508, such as a hard disk drive, and can also include a volatile memory 510, such as random access memory (RAM) and / or a cache memory. The computer system 500 can further include other removable / non-removable, volatile / non-volatile computer system storage media.

[0067] ​​The system memory 504 can include at least one program product having a set (e.g., at least one) of program modules configured to carry out the functions of embodiments described herein. For example, the system memory 504 stores various program modules that generally carry out the functions and / or methodologies of embodiments described herein. One or more modules 512, 514 can be included to perform functions related to control of the display 108, such as determining a target image based on vehicle, environmental, preprogrammed, or external data and directing the display 108 (via, e.g., the controller 404) to drive one or more of the side-emitting micro-LEDs 210 to produce the target image. The computer system 500 is not limited in this regard, as other modules might be included depending on the desired functionality of the respective display. As used herein, the term “module” refers to processing circuitry, which can include an Application Specific Integrated Circuit (ASIC), an electronic circuit, a processor (shared, dedicated, or group) and memory that execute one or more software or firmware programs, a combinational logic circuit, and / or other suitable components that provide the described functionality. For example, a module can be configured via software, hardware, and / or firmware to cause a display (the display 108) to display an image, such as, for example, a vehicle status or a driver and / or passenger communication.

[0068] The processing device 502 can also be configured to communicate with one or more external devices 516, such as a keyboard, a pointing device, and / or any device (e.g., a network card, a modem, a vehicle ECU, etc.) that enables the processing device 502 to communicate with one or more other computing devices. Such communication can occur via Input / Output (I / O) interfaces 518 and 520.

[0069] The processing device 502 can also communicate with one or more networks 522 such as a Local Area Network (LAN), a General Wide Area Network (WAN), bus networks, and / or public networks (e.g., the Internet) via a network adapter 524. In some embodiments, the network adapter 524 is or includes an optical network adapter for communicating over an optical network. It should be appreciated that although not shown, other hardware and / or software components could be used in conjunction with the computer system 500. Examples include, but are not limited to, microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, and data archive storage systems, etc. In some embodiments, the computer system 500 and / or the processing device 502 can receive information from one or more microsensors (e.g., the sensor unit 302), analyze the information, and send the information (raw, pre-processed, and / or post-processed) to one or more LEDs (e.g., the micro-LEDs 210) and / or any other components of the vehicle 100.

[0070] Reference is now made to Figure 6A flowchart 600 of a shaped micro-reflector printing process for a side-emitting micro light emitting diode (micro-LED) display, in accordance with embodiments, is generally shown. Reference is made to FIG. 1. Figure 1 to Figure 5 The flowchart 600 is described, and the flowchart 600 can include additional steps not depicted in Figure 6 Although depicted in a particular order, the blocks depicted in Figure 6 may be rearranged, subdivided, and / or combined.

[0071] At block 602, the method includes forming a cartridge. In some embodiments, forming a cartridge includes forming a release layer on a substrate, forming a shaped micro-reflector on the release layer, the shaped micro-reflector having a tapered sidewall, and forming a reflective layer over the shaped micro-reflector and the release layer.

[0072] At block 604, the method includes bonding the cartridge to a display substrate using a bonding layer positioned between the reflective layer and the display substrate. In some embodiments, the cartridge is flipped prior to being bonded to the display substrate.

[0073] At block 606, the method includes removing the release layer of the cartridge, thereby separating the substrate from the display substrate. In some embodiments, removing the release layer includes at least one of exposing the release layer to UV radiation and exposing the release layer to thermal energy.

[0074] In some embodiments, the release layer includes at least one of an ultraviolet (UV) curable material and a thermal curable material.

[0075] In some embodiments, the reflective layer is conformally deposited on the shaped micro-reflector and the release layer. In some embodiments, the reflective layer is conformally deposited to a thickness of between 5 nanometers and 3 micrometers.

[0076] Reference is now made to Figure 7 A flowchart 700 of a shaped micro-reflector printing process for a side-emitting micro light emitting diode (micro-LED) display, in accordance with embodiments, is generally shown. Reference is made to FIG. 1. Figure 1 to Figure 5 The flowchart 700 is described, and the flowchart 700 can include additional steps not depicted in Figure 7 Although depicted in a particular order, the blocks depicted in Figure 7 may be rearranged, subdivided, and / or combined.

[0077] At block 702, the method includes forming a side-emitting micro light emitting diode on a surface of a display substrate. In some embodiments, the side-emitting micro light emitting diode is coated with a first reflective layer such that light is emitted from an uncoated sidewall.

[0078] At block 704, the method includes forming a shaped micro-reflector coated with a second reflective layer on a display substrate. In some embodiments, the shaped micro-reflector is adjacent to a side-emitting micro-light emitting diode. In some embodiments, the shaped micro-reflector includes a tapered sidewall positioned to redirect light from an uncoated sidewall of the side-emitting micro-light emitting diode from an emission angle to a reflection angle via reflection opposite the second reflective layer. In some embodiments, the second reflective layer is formed directly on opposing sidewalls and a bottommost surface of the shaped micro-reflector.

[0079] In some embodiments, the tapered sidewall includes a taper between -90 degrees and 90 degrees measured with respect to a surface of the display substrate, where zero degrees taper is orthogonal to the surface of the display substrate.

[0080] In some embodiments, the shaped micro-reflector includes a taper of 30 degrees to 60 degrees.

[0081] In some embodiments, a topmost surface opposite the bottommost surface of the shaped micro-reflector is uncoated with the second reflective layer.

[0082] In some embodiments, the uncoated sidewall of the side-emitting micro-light emitting diode directly faces the tapered sidewall of the shaped micro-reflector.

[0083] In some embodiments, a tracker is formed on the display substrate. In some embodiments, the shaped micro-reflector and the second reflective layer are formed on the tracker.

[0084] The terms “a” and “an” do not denote a limitation of quantity, but rather denote the presence of at least one of the referenced items. The term “or” means “and / or” unless clearly indicated otherwise. References to “aspects” throughout the specification mean that a particular element (e.g., feature, structure, step, or characteristic) described in connection with the aspect is included in at least one aspect described herein, and can or can not be included in other aspects. Additionally, it should be understood that described elements can be combined in any suitable manner in the various aspects.

[0085] When an element such as a layer, film, region, or substrate is referred to as being “on” another element, it can be directly on the other element or intervening elements can also be present. In contrast, when an element is referred to as being “directly on” another element, there are no intervening elements present.

[0086] Unless otherwise indicated herein, all test standards are the most recent standard in effect as of the filing date of this application, or, if priority is claimed, the filing date of the earliest priority application in which the test standard appears.

[0087] Unless otherwise defined, technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs.

[0088] While the foregoing disclosure has been described in reference to exemplary embodiments, it will be understood by those skilled in the art that various changes can be made and equivalents can be substituted for elements thereof without departing from the scope of the disclosure. In addition, many modifications can be made to adapt a particular situation or material to the teachings of the disclosure without departing from the central scope thereof. Therefore, it is intended that the disclosure not be limited to the particular embodiments disclosed, but will include all embodiments falling within the scope of the disclosure.

Claims

1. A method comprising: forming a cell, wherein forming the cell comprises: forming a release layer on a substrate; forming a shaped micro-reflector on the release layer, the shaped micro-reflector comprising a tapered sidewall; and forming a reflective layer on the shaped micro-reflector and the release layer; bonding the cell to a display substrate using a bonding layer positioned between the reflective layer and the display substrate; and removing the release layer of the cell, thereby separating the substrate from the display substrate.

2. The method of claim 1, wherein the release layer comprises at least one of an ultraviolet (UV) curable material and a heat curable material.

3. The method of claim 1, wherein the reflective layer is conformally deposited on the shaped micro-reflector and the release layer.

4. The method of claim 2, wherein the reflective layer is conformally deposited to a thickness of between 5 nanometers and 3 micrometers.

5. The method of claim 1, wherein the cell is flipped prior to being bonded to the display substrate.

6. The method of claim 1, wherein removing the release layer comprises at least one of exposing the release layer to UV radiation and exposing the release layer to thermal energy.

7. The method of claim 1, further comprising forming a side-emitting micro-LED on a surface of a display substrate, the side-emitting micro-LED being coated such that light is emitted from uncoated sidewalls.

8. A display unit comprising: a side-emitting micro-LED on a surface of a display substrate, the side-emitting micro-LED being coated with a first reflective layer such that light is emitted from uncoated sidewalls; and a shaped micro-reflector on the display substrate, the shaped micro-reflector being coated with a second reflective layer, the shaped micro-reflector being adjacent to the side-emitting micro-LED, the shaped micro-reflector comprising a tapered sidewall positioned to redirect light from the uncoated sidewalls of the side-emitting micro-LED from an emission angle to a reflection angle via reflection opposite the second reflective layer, the second reflective layer being formed directly on opposing sidewalls and a bottommost surface of the shaped micro-reflector.

9. The display unit of claim 8, wherein the tapered sidewall comprises a taper of between -90 degrees and 90 degrees measured with respect to the surface of the display substrate, wherein a zero degree taper is orthogonal to the surface of the display substrate.

10. The display unit of claim 9, wherein the shaped micro-reflector comprises a taper of 30 degrees to 60 degrees.

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