Resin composition, display device, and electronic device

Abstract

The invention relates to a resin composition, a display device and an electronic device. The resin composition includes: a first monomer having one polymerizable unsaturated group in one molecule; an oligomer derived from a second monomer comprising two or more polymerizable unsaturated groups in one molecule, and the oligomer having a weight average molecular weight in the range of about 5,000 to about 40,000; a photopolymerization initiator; and a fluorine-containing surface modifier having a weight ratio in the range of about 0.01% to about 5% with respect to the total weight of the first monomer and the oligomer, in which the resin composition has a surface free energy in the range of about 20 mJ / m2 to about 35 mJ / m2 before being cured.

Description

[0001] Cross Reference to Related Applications

[0002] This application claims priority to and all the benefits of Korean Patent Application No. 10-2024-0054404, filed on April 24, 2024, the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0003] Embodiments of the present disclosure herein relate to a resin composition and a display device, and more particularly, to a resin composition and a display device including an adhesive member formed of the resin composition. BACKGROUND

[0004] Various display devices for multimedia devices such as televisions, mobile phones, tablet computers, navigation systems, and game consoles are being developed. Recently, display devices that provide a flexible display member with a bend so as to be able to be folded, bent, or rolled to improve user convenience and display devices including a stepped portion according to an application of an electronic module having various functions or a printed layer introduced in consideration of design, etc. are being developed. SUMMARY

[0005] A resin composition for adhesion for forming an adhesive member applied to a display device having various shapes is required to have high coating properties with respect to various forms of members of the display device.

[0006] Embodiments of the present disclosure provide a resin composition having high applicability and controlling a surface free energy of a droplet to have a sufficient thickness at an edge portion.

[0007] Embodiments of the present disclosure also provide a display device having improved reliability by allowing an adhesive member to sufficiently cover a stepped portion and fix the stepped portion and the adhesive member not to be lifted even at an end portion of the stepped portion.

[0008] Embodiments of the present disclosure provide a resin composition including a first monomer having one polymerizable unsaturated group in one molecule; an oligomer derived from a second monomer including two or more polymerizable unsaturated groups in one molecule and having a weight average molecular weight in a range of about 5,000 to about 40,000; a photopolymerization initiator; and a surface modifier having a weight ratio in a range of about 0.01% to about 5% with respect to a total weight of the first monomer and the oligomer and including fluorine, wherein the resin composition has a surface free energy in a range of about 20 millijoules per square meter (mJ / m 2 ) to about 35 mJ / m 2 before being cured.

[0009] In an embodiment, the surface modifier can include hexafluoropropylene.

[0010] In an embodiment, the first monomer can be a monofunctional (meth)acrylate monomer, and the oligomer can be a urethane (meth)acrylate.

[0011] In an embodiment, the resin composition can include two or more types of monofunctional (meth)acrylate monomers different from each other as the first monomer, and can include two or more types of urethane (meth)acrylates having different weight average molecular weights from each other as the oligomer.

[0012] In an embodiment, the first monomer can include at least one selected from the group consisting of 2-ethylhexyl acrylate, 4-hydroxybutyl acrylate, 2-ethylhexyl diglycol acrylate, and tetrahydrofurfuryl acrylate.

[0013] In an embodiment, the resin composition can have a glass transition temperature in the range of about -60°C to about -20°C after being photocured.

[0014] In an embodiment, the surface free energy can include a dispersion component and a dipole component, and when the difference in the dipole component between a substrate on which the resin composition is applied and the resin composition is about 30 mJ / m 2 or more, a droplet contact angle can be about 10 degrees or more at about 2 seconds after the resin composition is provided on the substrate.

[0015] In an embodiment, the resin composition can be provided on a substrate by an inkjet printing method or a dot coating method.

[0016] In an embodiment of the present invention, a display device includes a display module, a window module disposed on the display module, and an adhesive member disposed between the display module and the window module and formed of a resin composition, wherein the resin composition includes a first monomer having one polymerizable unsaturated group in one molecule, an oligomer derived from a second monomer including two or more polymerizable unsaturated groups in one molecule and having a weight average molecular weight in the range of about 5,000 to about 40,000, a photopolymerization initiator, and a surface modifier having a weight ratio in the range of about 0.01% to about 5% with respect to the total weight of the first monomer and the oligomer and containing fluorine, wherein the resin composition has a first surface free energy in the range of about 20 mJ / m 2 to about 35 mJ / m 2 before being cured.

[0017] In an embodiment, the surface modifier can include hexafluoropropene.

[0018] In an embodiment, the first monomer can include at least one selected from 2- ethylhexyl acrylate, 4-hydroxybutyl acrylate, 2-ethylhexyl diglycol acrylate, and tetrahydrofurfuryl acrylate, and the oligomer can include urethane (meth)acrylate.

[0019] In an embodiment, the adhesive member can have a glass transition temperature in a range of about -60°C to about -20°C.

[0020] In an embodiment, the adhesive member can have a storage modulus in a range of about 0.05 mega pascal (MPa) to about 0.2 MPa at a temperature of about -20°C.

[0021] In an embodiment, the adhesive member can have an adhesive strength of about 300 grams force per 25 millimeters (300 gf / 25 mm) or more with respect to a glass substrate at a temperature of about 25°C.

[0022] In an embodiment, the window module can include a window and a pattern layer disposed on a surface of the window, wherein the adhesive member can cover a step structure between the pattern layer and the window.

[0023] In an embodiment, a lower surface of the window module adjacent to the adhesive member can have a second surface free energy, an upper surface of the display module adjacent to the adhesive member can have a third surface free energy, wherein the first surface free energy, the second surface free energy, and the third surface free energy can each include a dispersion component and a dipole component, and a difference in the dipole component between the first surface free energy and the second surface free energy and a difference in the dipole component between the first surface free energy and the third surface free energy can each be about 20 mJ / m 2 or more.

[0024] In an embodiment, the lower surface of the window module can include glass, and the upper surface of the display module can include polyethylene terephthalate (PET) or triacetyl cellulose (TAC).

[0025] In an embodiment of the present disclosure, an electronic device includes an electronic module; a display module disposed on the electronic module and including an active area, an electronic module area overlapping the electronic module and defined in the active area, and a peripheral area disposed on at least one side of the active area; a window module disposed on the display module and including a transmissive area corresponding to the active area, a sensing area corresponding to the electronic module area, and a bezel area corresponding to the peripheral area; and an adhesive member disposed between the display module and the window module and formed by a photocurable resin composition, wherein the resin composition includes a first monomer having one polymerizable unsaturated group in one molecule; an oligomer derived from a second monomer including two or more polymerizable unsaturated groups in one molecule and having a weight average molecular weight in a range of about 5,000 to about 40,000; a photopolymerization initiator; and a surface modifier having a weight ratio in a range of about 0.01% to about 5% with respect to a total weight of the first monomer and the oligomer and including fluorine, wherein the resin composition has a surface free energy in a range of about 20 mJ / m 2 to about 35 mJ / m 2 before being cured.

[0026] In an embodiment, the window module can include a window and a pattern layer disposed on a lower surface of the window, wherein the pattern layer can include an outer pattern layer corresponding to the peripheral area and a hole pattern layer overlapping at least a portion of the electronic module area, and the adhesive member can be directly disposed on the pattern layer while covering a step structure between the pattern layer and the window.

[0027] In an embodiment, the surface modifier can include hexafluoropropene. BRIEF DESCRIPTION OF DRAWINGS

[0028] Embodiments of the present disclosure will become more fully understood from the detailed description and accompanying drawings, wherein:

[0029] Figure 1 is a perspective view of a display device according to an embodiment of the present disclosure;

[0030] Figure 2 is an exploded perspective view of a display device according to an embodiment of the present disclosure;

[0031] Figure 3 is a cross-sectional view of a display device according to an embodiment of the present disclosure;

[0032] Figure 4 is a cross-sectional view of a display device according to an embodiment of the present disclosure;

[0033] Figure 5A FIG. 1 is a view exemplarily showing a process of providing a resin composition according to an embodiment of the present disclosure;

[0034] Figure 5B FIG. 2 is a view showing an enlarged partial region coated with the resin composition;

[0035] Figure 6A FIG. 3 is a view exemplarily showing a step (or a step structure) after an adhesive member according to an embodiment of the present disclosure is laminated;

[0036] Figure 6B FIG. 4 is a view showing an enlarged partial region in which the adhesive member according to an embodiment of the present disclosure is laminated;

[0037] Figure 7A FIG. 5 is a view schematically showing an application characteristic of a conventional resin composition;

[0038] Figure 7B FIG. 6 is a view schematically showing an application characteristic of a resin composition according to an embodiment of the present disclosure;

[0039] Figure 8A FIG. 7 is a graph schematically showing an application characteristic of a conventional resin composition after being cured;

[0040] Figure 8B FIG. 8 is a graph schematically showing an application characteristic of a resin composition according to an embodiment of the present disclosure after being cured;

[0041] Figure 9A FIG. 9 is a view schematically showing a lamination characteristic of an adhesive member formed using a conventional resin composition; and

[0042] Figure 9B FIG. 10 is a view schematically showing a lamination characteristic of an adhesive member formed using a resin composition according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0043] The present application now will be described more fully hereinafter with reference to the accompanying drawings, in which various embodiments are shown. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the application to those skilled in the art.

[0044] It will be understood that when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements can be present therebetween. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present.

[0045] In the present disclosure, when an element (or a region, layer, part, etc.) is referred to as being “on” another element, “connected to” or “coupled to” another element, it means that the element can be directly present on the other element / directly connected to / directly coupled to the other element, or a third element can be present in between the element and the other element.

[0046] The same reference numbers are used in different drawings to represent the same or similar elements. In addition, in the drawings, the thickness, proportions, and dimensions of elements are exaggerated for the sake of effective description of technical content.

[0047] It will be understood that, although the terms “first,” “second,” “third,” etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, “a first element,” “a first component,” “a first region,” “a first layer,” or “a first section” discussed below could be named a second element, a second component, a second region, a second layer, or a second section without departing from the teachings herein.

[0048] For ease of description, spatial relative terms such as “below,” “under,” “lower,” “above,” “upper” and the like, can be used herein for describing the relationship between one element or feature and another element (s) or feature (s) as shown in the drawings. It will be understood that the spatial relative terms are intended to encompass different orientations of the device in use or operation, in addition to the orientation depicted in the drawings. For example, if the device in the drawings is turned over, an element described as “below” or “under” other elements or features would then be oriented “above” the other elements or features. Therefore, the term “below” can encompass both the above and below orientations. The device can be oriented in other ways (rotated 90 degrees, or at other orientations), and the spatial relative terms used herein interpreted accordingly.

[0049] The phrasing "one," "an," and "the" as used herein does not exclude multiple possibilities. For example, a compound can be administered "one" or more times. The phrasing "at least one" will be understood to allow a single element to be present or one or more elements to be present. The phrasing "or" as used herein is to be understood as inclusive or meaning at least one of the listed possibilities so that, for example, "A or B" means "A or B or both." As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. It will be further understood that the terms "comprises" and / or "comprising," or "includes" and / or "including" when used in this specification, specify the presence of stated features, regions, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, regions, integers, steps, operations, elements, components, and / or groups thereof.

[0050] The term "about" or "approximately," as used herein when used in connection with a measurement and error associated with the measurement (i.e., the limitations of the measurement system), includes the stated value and means within the acceptable range of deviations for the particular value as determined by one of ordinary skill in the art. For example, "about" can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0051] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present disclosure and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0052] Embodiments are described herein with reference to cross-sectional illustrations that are schematic illustrations of embodiments as idealized examples. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are to be expected. Thus, embodiments described herein are not to be construed as limited to the precise shapes illustrated herein but are to include deviations in shapes that result from, for example, manufacturing. For example, a region illustrated or described as flat can often have rough and / or nonlinear features. Moreover, an illustrated sharp corner can often be rounded. Thus, the regions illustrated in the figures are schematic and their shapes are not intended to illustrate the precise shape of a region and are not intended to limit the scope of the present claims.

[0053] Hereinafter, a resin composition according to an embodiment of the present disclosure and a display device according to an embodiment of the present disclosure will be described with reference to the accompanying drawings.

[0054] Figure 1 is a perspective view of a display device according to an embodiment of the present disclosure. Figure 2 is an exploded perspective view of a display device according to an embodiment of the present disclosure.

[0055] Referring to Figure 1 and Figure 2 Embodiments of the display device DD can be devices activated by electrical signals. In the present disclosure, the display device can be referred to as an electronic device, or the display device can be included in an electronic device activated by electrical signals. For example, the display device or the electronic device can be a mobile phone, a tablet computer, a car navigation system, a game machine, or a wearable device, but embodiments of the present disclosure are not limited thereto. In the present disclosure, the display device or the electronic device can be referred to as a mobile phone as an example. Figure 1 In, an embodiment in which the electronic device or the display device DD is a mobile phone is taken as an example.

[0056] The display device DD according to an embodiment can provide an image IM to a user through a display surface FS. The display surface FS can display the image IM through an active area AA. Further, the display device DD according to an embodiment can sense an external input applied from the outside. The external input can include various forms of input provided from the outside of the display device DD.

[0057] The active area AA can include a flat surface on a plane defined by a first direction axis DR1 and a second direction axis DR2. The active area AA can also include a curved surface bent from at least one side of the plane defined by the first direction axis DR1 and the second direction axis DR2. As Figure 1As illustrated in FIGS. 1, 2, and 3, the display device DD according to the embodiment can include two curved surfaces bent from both sides of a plane defined by the first direction axis DR1 and the second direction axis DR2, respectively. However, the shape of the active area AA is not limited thereto. In another embodiment, for example, the active area AA can include only the above-described plane, or the active area AA can further include four curved surfaces bent from at least two sides (for example, four sides) of the plane, respectively. Further, a display surface in a shape other than a flat surface can be included even in a central portion of the active area AA rather than on one side of the plane.

[0058] Referring to Figure 1 and Figure 2 , the display device DD according to the embodiment can include an active area AA and a peripheral area NAA adjacent to the active area AA. The peripheral area NAA is an area that blocks a light signal, and can be an area disposed outside the active area AA and surrounding the active area AA. However, embodiments of the present application are not limited thereto, and the peripheral area NAA can be disposed on at least one side of the active area AA. Further, unlike the shape illustrated in FIGS. 1, 2, and 3, the display device DD according to the embodiment of the present application can include an active area AA having various shapes, and the shape of the active area AA can be defined according to the disposition of a peripheral area NAA adjacent thereto. Figure 1

[0059] The active area AA can be a portion corresponding to an active area DP-AA of a display module DM to be described later, and the peripheral area NAA can be a portion corresponding to a peripheral area DP-NAA of the display module DM. The active area AA can be referred to as a display area, and the peripheral area NAA can be referred to as a non-display area.

[0060] In Figure 1 and the following drawings, first to third direction axes DR1 to DR3 are illustrated, and the directions indicated by the first to third direction axes DR1, DR2, and DR3 described in the present specification are relative concepts and can be converted into different directions. Further, the directions indicated by the first to third direction axes DR1, DR2, and DR3 can be described as first to third directions DR1, DR2, and DR3, and can be denoted by the same reference numerals.

[0061] In the present specification, the first direction axis DR1 and the second direction axis DR2 are perpendicular to each other, and the third direction axis DR3 can be a normal direction with respect to a plane defined by the first direction axis DR1 and the second direction axis DR2. In the present specification, a front surface (or an upper surface, an upper portion, or an upper side) and a rear surface (or a lower surface, a lower portion, or a lower side) of a member constituting the display device DD can be defined with respect to the third direction axis DR3. ​

[0062] In an embodiment, an electronic module area EMA can be defined in the active area AA of the display device DD. The electronic module area EMA of the display device DD can be a portion corresponding to the electronic module area DP-EMA of the display module DM. Figure 1 Lee et al. show an embodiment in which a single electronic module area EMA is defined, but the number of electronic module areas EMA is not limited thereto. The electronic module area EMA can be a portion of the active area AA. In an embodiment, the display device DD can also display an image in the electronic module area EMA. When the electronic module EM disposed in the electronic module area EMA is disabled, the electronic module area EMA can display an image as a portion of the display surface FS.

[0063] Various electronic modules EM can be disposed in the electronic module area EMA. The electronic module EM can receive an external input transmitted through the electronic module area EMA, or can provide an output through the electronic module area EMA. For example, in an embodiment, the electronic module EM can include at least one of a camera, a speaker, a light detection sensor, and a heat detection sensor. The electronic module area EMA can detect an external input received through the display surface FS, or can provide a sound signal such as a voice to the outside. The electronic module EM can include a plurality of components, but is not limited to any one embodiment.

[0064] In an embodiment of the disclosure, the shape of the display device DD is not limited to Figure 1 the shape shown in Lee et al., and the display device DD can have flexibility that is deformed according to an operation such as folding, bending, or curling. For example, the display device according to an embodiment is not limited to a case in which the display surface FS is almost planar, and can include a portion having at least one curved surface as a main display surface, or can include a folding area in which the display surface is folded with respect to at least one folding axis.

[0065] The display device DD according to the embodiment can include a display module DM, a window module WM disposed in an upper portion of the display module DM, and an adhesive member AM disposed between the display module DM and the window module WM. The adhesive member AM can be formed of a resin composition according to the embodiment, which will be described later. In the embodiment, the adhesive member AM can be formed by providing the resin composition according to the embodiment, which will be described later, and then curing the resin composition. The adhesive member AM formed of the resin composition according to the embodiment can be disposed to sufficiently cover a curved surface (bending structure) and a step (step structure), etc. of each surface of the adjacent display module DM and the adjacent window module WM. Further, since the adhesive member AM is disposed with a sufficient thickness up to a portion adjacent to an edge region of the display module DM and the window module WM in accordance with the surface free energy and the adhesive properties of the resin composition according to the embodiment, the adhesive member AM according to the embodiment can exhibit high or improved adhesive properties.

[0066] In the embodiment, the display device DD can include an electronic module EM disposed in a lower portion of the display module DM. Further, the display device DD according to the embodiment can include a housing HU accommodating the display module DM, the electronic module EM, etc. The housing HU can be coupled to the window module WM.

[0067] Further, the display device DD according to the embodiment can further include a lower module SP disposed on a lower side of the display module DM and a lower adhesive member AM-B disposed between the display module DM and the lower module SP.

[0068] In the display device DD according to the embodiment, the window module WM can be disposed in an upper portion of the display module DM and cover the entire upper surface of the display module DM. The window module WM can have a shape corresponding to a shape of the display module DM.

[0069] The window module WM can include a transmissive area TA and a bezel area BZA. A front surface of the window module WM including the transmissive area TA and the bezel area BZA corresponds to a display surface FS of the display device DD. A user can intuitively recognize an image IM provided through the front surface of the window module WM corresponding to the display surface FS of the display device DD.

[0070] The transmissive area TA of the window module WM can be an optically transparent area. The transmissive area TA can correspond to the active area AA of the display module DM. The bezel area BZA can be an area having a relatively low light transmittance compared to the transmissive area TA. The bezel area BZA can have a predetermined color. The bezel area BZA is adjacent to the transmissive area TA and can surround the transmissive area TA. The bezel area BZA can define the shape of the transmissive area TA. However, the present embodiment is not limited to the illustrated shape, and the bezel area BZA can be disposed adjacent to only one side of the transmissive area TA, or a portion of the bezel area BZA can be omitted. In an embodiment, the bezel area BZA corresponds to the peripheral area DP-NAA of the display module DM, and can define the peripheral area NAA of the display device DD. The bezel area BZA can be an area in which a material having a predetermined color is provided by deposition, coating, or printing.

[0071] In an embodiment, the window module WM can include a sensing area SA. The sensing area SA can be an area overlapping the electronic module EM. The sensing area SA can be an area overlapping the electronic module area DP-EMA of the display module DM. Further, the sensing area SA can be an area corresponding to the electronic module area EMA of the display device DD. The display device DD can receive an external signal for the electronic module EM through the sensing area SA of the window module WM, or can provide a signal output from the electronic module EM to the outside. In an embodiment, the sensing area SA can be defined in the transmissive area TA.

[0072] The display module DM included in the display device DD according to an embodiment can be a component configured to generate an image IM and detect an input applied from the outside. The display module DM according to an embodiment can include a display panel and an input sensor, etc. Further, the display module DM according to an embodiment can further include an optical layer, etc.

[0073] For example, the display module DM according to an embodiment can include an organic light emitting display panel, an inorganic light emitting display panel, a quantum dot display panel, a micro light emitting diode (LED) display panel, or a nano LED display panel, etc. as the display panel. Further, if the display module DM according to an embodiment includes an input sensor, the input sensor can be disposed on the display panel.

[0074] In an embodiment, the display device DD can include an optical layer disposed adjacent to the upper surface of the display module DM. The optical layer can be a reflection reduction layer that reduces reflection of external light incident from the outside of the display module DM. For example, the display device DD according to an embodiment can include a polarizing plate or a color filter layer as the optical layer.

[0075] Reference Figure 2The display device DD according to the embodiment can further include a lower module SP. The lower module SP is disposed on a lower side of the display module DM, and the lower module SP can include at least one of a support plate, a buffer layer, a shielding layer, a filling layer, and an interlayer bonding layer. The lower module SP can support the display module DM, or can effectively prevent deformation of the display module DM caused by external impact or force.

[0076] In an embodiment, the lower module SP can have a through-hole HH defined therein. The through-hole HH can correspond to the electronic module area EMA of the display device DD. The through-hole HH can overlap the electronic module EM. At least a portion of the electronic module EM can be inserted into the through-hole HH. In an embodiment in which the lower module SP is provided in a form in which a plurality of members are stacked, the through-hole HH can be defined only in some of the members of the lower module SP.

[0077] The display device DD according to the embodiment can further include a lower adhesive member AM-B. Referring to Figure 2 In an embodiment, the lower adhesive member AM-B can be disposed between the lower module SP and the display module DM. An adhesive partial through-hole AM-HH can be defined in the lower adhesive member AM-B. The adhesive partial through-hole AM-HH can be disposed to overlap the electronic module EM. The adhesive partial through-hole AM-HH can be defined to overlap the through-hole HH of the lower module SP.

[0078] The lower adhesive member AM-B can be formed of a resin composition according to an embodiment, which will be described later. The lower adhesive member AM-B can be formed by providing a resin composition according to an embodiment, which will be described later, and then curing the resin composition. The lower adhesive member AM-B formed of the resin composition according to the embodiment can sufficiently cover a curved surface and a step, etc. of each surface of the adjacent display module DM and the adjacent window module WM, and can be provided with a sufficient thickness up to an edge of the through-hole HH. The lower adhesive member AM-B according to the embodiment can exhibit improved adhesive properties by being provided with a sufficient thickness up to an outer edge area of the display module DM and the lower module SP, an edge portion of the through-hole HH, and a step portion, depending on surface free energy and adhesive properties of the resin composition according to the embodiment.

[0079] Figure 3 and Figure 4 Each is a cross-sectional view of a display device according to an embodiment of the disclosure. Figure 3 is a cross-sectional view taken along line I-I' of Figure 2 , and Figure 4 is a cross-sectional view taken along line II-II' of Figure 2 . In Figure 3 and Figure 4 , the housing HU in Figure 2 is omitted.

[0080] Referring to Figure 3 and Figure 4 , the window module WM according to the embodiment can include a window WP and a pattern layer (a pattern layer BM or BM-E) disposed on one surface of the window WP. In an embodiment, although not shown, the window module WM can further include at least one functional layer provided on the window WP. For example, in an embodiment, the functional layer can be a hard coat layer or an anti-fingerprint layer, etc., but the present embodiment is not limited thereto.

[0081] In an embodiment, the window WP can include an optically transparent insulating material. The window WP can be a glass substrate or a plastic substrate. For example, in an embodiment, the window WP can be a tempered glass substrate. Further, the window WP can be thin enough to enable a folding operation.

[0082] The window WP can be an ultra-thin glass (UTG) substrate. Further, the window WP can be formed of a polymer resin having flexibility. For example, in an embodiment, the window WP can include or be formed of polyimide, polyacrylate, polymethyl methacrylate, polycarbonate, polyethylene naphthalate, polyvinylidene chloride, polyvinylidene fluoride, polystyrene, ethylene-vinyl alcohol copolymer, or a combination thereof. However, the embodiment is not limited thereto, and any conventional type of window known in the art for use as a cover window can be used without limitation.

[0083] In an embodiment, the pattern layer BM or BM-E can be disposed on a lower surface of the window WP. The pattern layer BM or BM-E can be a layer formed by including a pigment or a dye. For example, in an embodiment, the pattern layer BM or BM-E can be an ink-printed layer.

[0084] Referring to Figure 3 and Figure 4 , in the display device DD according to the embodiment, the window module WM can include an outer pattern layer BM as the pattern layer BM. In an embodiment in which the display device DD includes an electronic module area EMA (see Figure 1 ), the window module WM can further include a hole pattern layer BM-E as the pattern layer BM.

[0085] Referring to Figure 3 , the outer pattern layer BM can correspond to the peripheral area NAA. The outer pattern layer BM can overlap the peripheral area DP-NAA (see Figure 2 ) of the display module DM, and can be disposed in an edge area of the window WP. That is, a bezel area BZA (see Figure 2 ) of the window module WM can be a portion in which the outer pattern layer BM is disposed.

[0086] Referring to Figure 4 , the hole pattern layer BM-E can be provided corresponding to a portion of the electronic module area EMA. The electronic module area EMA can include a sensing portion SA-O overlapping the through hole HH defined in the electronic module EM and the lower module SP, and a peripheral portion SA-NO surrounding the sensing portion SA-O. The peripheral portion SA-NO can be a portion surrounding the sensing portion SA-O overlapping the through hole HH defined in the lower module SP. The peripheral portion SA-NO can be a portion in which the hole pattern layer BM-E is provided. With the hole pattern layer BM-E provided corresponding to the peripheral portion SA-NO surrounding the sensing portion SA-O, light leakage in the electronic module EM can be blocked, and the lower structure of the electronic module EM, etc. can be covered.

[0087] Referring to Figure 3 and Figure 4 , the display device DD according to the embodiment can include an adhesive member AM provided directly between the display module DM and the window module WM and formed of the resin composition according to the embodiment. Further, the display device DD according to the embodiment can further include a lower adhesive member AM-B provided between the lower module SP and the display module DM and formed of the resin composition according to the embodiment.

[0088] Referring to Figure 3 and Figure 4 , in the window module WM according to the embodiment, a step (or step structure) STP or STP-E can exist between the pattern layer BM or BM-E and a portion of the window WP in which the pattern layer BM or BM-E is not provided. The adhesive member AM and the lower adhesive member AM-B can be formed of the resin composition according to the embodiment, and the adhesive member AM can be attached to the window WP without being lifted in the step STP or STP-E portion. In other words, the adhesive member AM can be provided directly on the pattern layer BM or BM-E while covering the step structure STP or STP-E between the pattern layer BM or BM-E and the window WP.

[0089] In the embodiment, referring to Figure 3 , an edge portion ED-AM of the adhesive member AM can be provided to overlap an edge portion of the display module DM and the window module WM. The adhesive member AM can include a ramp region in the edge portion ED-AM of the outer periphery, the ramp region being a portion having a gradually decreasing thickness different from the central portion. In the ramp region, the thickness of the adhesive member AM can not be uniform, or the thickness of the adhesive member AM can decrease toward the outer periphery.

[0090] Since the adhesive member AM according to the embodiment is formed by providing the resin composition according to the embodiment, the portion occupied by the slope area is reduced or minimized, and therefore, even in the peripheral edge portion ED-AM, the lifting phenomenon at the interface between the adhesive member AM and the adjacent member is basically reduced or minimized, so that high or improved bonding characteristics can be exhibited.

[0091] In the examples, reference Figure 4 In the lower adhesive member AM-B, an adhesive portion through-hole AM-HH may be defined that overlaps with the through-hole HH defined in the lower module SP. The adhesive portion through-hole AM-HH may be defined by an inner edge portion ED-AMB of the lower adhesive member AM-B. The inner edge portion ED-AMB may overlap with an edge of the lower module SP.

[0092] The lower adhesive member AM-B may include a slope region in an area adjacent to the inner edge portion ED-AMB, the slope region being a portion having a gradually decreasing thickness different from the active area AA excluding the electronic module area EMA. In the slope region, the thickness of the lower adhesive member AM-B may be inconsistent, or the thickness of the lower adhesive member AM-B may decrease toward the periphery.

[0093] because Figure 4 The lower adhesive member AM-B according to the embodiment shown in is formed by providing a resin composition according to the embodiment, so that the area occupied by the slope area is reduced or minimized, and therefore, even in the area corresponding to the peripheral part SA-NO, the lifting phenomenon at the interface between the lower adhesive member AM-B and the adjacent member is reduced or minimized, so that high or improved bonding properties can be exhibited.

[0094] The resin composition according to an embodiment may include a first monomer, an oligomer formed by polymerizing a second monomer different from the first monomer, a photopolymerization initiator, and a surface modifier.

[0095] In the resin composition according to the embodiment, the first monomer may have one polymerizable unsaturated group in one molecule. In the embodiment, the first monomer is a monofunctional monomer, and for example, the first monomer may be a monofunctional (meth)acrylate monomer.

[0096] The first monomer may include at least one selected from the group consisting of 2-ethylhexyl acrylate, 4-hydroxybutyl acrylate, 2-ethylhexyl diglycol acrylate, and tetrahydrofurfuryl acrylate.

[0097] The resin composition according to the embodiments can include two or more types of monofunctional monomers different from each other as the first monomer. For example, the resin composition according to the embodiments can include two or more types of monomers selected from 2-ethylhexyl acrylate, 4-hydroxybutyl acrylate, 2-ethylhexyl diethylene glycol acrylate, and tetrahydrofurfuryl acrylate as the first monomer. Specifically, the resin composition according to the embodiments can include all of 2-ethylhexyl acrylate, 4-hydroxybutyl acrylate, 2-ethylhexyl diethylene glycol acrylate, and tetrahydrofurfuryl acrylate as the first monomer.

[0098] In the resin composition according to the embodiments, the oligomer is derived from a second monomer including two or more polymerizable unsaturated groups in one molecule, and the oligomer can have a weight average molecular weight in the range of about 5,000 to about 40,000. In embodiments, the oligomer can be a urethane (meth)acrylate.

[0099] The resin composition according to the embodiments can include two or more types of urethane (meth)acrylates different from each other as the oligomer, each having a weight average molecular weight in the range of about 5,000 to about 40,000. For example, the resin composition according to the embodiments can include two or more types of urethane (meth)acrylates having weight average molecular weights different from each other as the oligomer.

[0100] The resin composition according to the embodiments can include a photopolymerization initiator. In embodiments, the photopolymerization initiator can be a radical polymerization initiator. The resin composition according to the embodiments can include one type of photopolymerization initiator, or two or more types of photopolymerization initiators different from each other. In embodiments in which the resin composition includes a plurality of photopolymerization initiators, the different photopolymerization initiators can be activated by ultraviolet light having central wavelengths different from each other.

[0101] For example, the resin composition according to the embodiments can include phenyl bis(2,4,6-trimethylbenzoyl) phosphine oxide and phenyl (2,4,6-trimethylbenzoyl) phosphinic acid ethyl ester as the photopolymerization initiator.

[0102] For example, the resin composition according to the embodiment can include a known photoinitiator as a photopolymerization initiator. For example, in the embodiment, the photopolymerization initiator can be at least one selected from 2,2-dimethoxy-1,2-diphenyl-ethan-1-one, 1-hydroxy-cyclohexyl-phenyl ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methyl-1-propanone, and 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]-phenyl}-2-methylpropan-1-one.

[0103] Further, the photopolymerization initiator can be at least one selected from 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-1-butanone, 2-dimethylamino-2-(4-methyl-benzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, [1-(4-phenylthiobenzoyl)heptylimino]benzoate, [1-[9-ethyl-6-(2-methylbenzoyl)carbazol-3-yl]ethylideneamino]acetate, and bis(2,4-cyclopentadienyl)bis[2,6-difluoro-3-(1-pyrrolyl)phenyl]titanium(IV).

[0104] The resin composition according to the embodiment can include a surface modifier including fluorine. In the embodiment, the surface modifier can be included to have a weight ratio in a range of about 0.01% to about 5% with respect to the total weight of the first monomer and the oligomer.

[0105] In the resin composition according to the embodiment, if the content of the surface modifier is greater than about 5% with respect to the total weight of the first monomer and the oligomer, the adhesion of the adhesive member formed of the resin composition can be decreased due to an excessive content of the fluorine component. Further, in the resin composition according to the embodiment, if the content of the surface modifier is less than about 0.01% with respect to the total weight of the first monomer and the oligomer, when the resin composition is applied, the spreadability can be increased, thereby increasing the ramp region, such that a region in which the thickness is not uniform in the adhesive member after curing can increase.

[0106] In the resin composition according to the embodiment, the surface modifier can include hexafluoropropylene. The resin composition according to the embodiment includes hexafluoropropylene, and can include two or more types of surface modifiers different from each other.

[0107] The resin composition includes: a first monomer; an oligomer having a weight average molecular weight in a range of about 5,000 to about 40,000; a photopolymerization initiator; and a surface modifier having a weight ratio in a range of about 0.01% to about 5% with respect to a total weight of the first monomer and the oligomer and including fluorine, and before being cured, the resin composition can have a surface free energy in a range of about 20 millijoules per square meter (mJ / m 2 ) to about 35 mJ / m 2 .

[0108] Since the resin composition according to the embodiment has a surface free energy in a range of about 20 mJ / m 2 to about 35 mJ / m 2 , the fluidity of a liquid drop is controlled in application (coating), thereby minimizing a ramp area that occurs when an edge portion of the liquid drop spreads to an application surface, so that sufficient wettability with respect to the application surface to cover a stepped portion or the like can be exhibited.

[0109] Further, since the resin composition has the above-described surface free energy characteristic, an adhesive member formed after the resin composition is cured also has a minimized ramp area, and is attached to a target surface without lifting even in a stepped portion, and thus, the adhesive member can exhibit improved or high adhesive properties.

[0110] The surface free energy of the resin composition according to the embodiment can include a dispersion component and a dipole component. In the embodiment, in which a difference in the dipole component of the components of the surface free energy between a base substrate to which the resin composition is applied and the resin composition is about 30 mJ / m 2 or more, a liquid drop contact angle at about 2 seconds after the resin composition is provided on the base substrate can be about 10 degrees or more.

[0111] That is, the resin composition according to the embodiment has a controlled surface free energy to have a predetermined or greater liquid drop contact angle when applied on a base substrate, and thus is limited in fluidity, so that an application area of the resin composition can be easily controlled.

[0112] In the embodiment, the resin composition can have a first surface free energy including a dispersion component and a dipole component, and a base substrate to which the resin composition is applied can have a second surface free energy including a dispersion component and a dipole component. A difference in the dipole component between the first surface free energy and the second surface free energy can be about 20 mJ / m 2 or more.

[0113] For example, in Figure 3 and Figure 4In the embodiment of the display device DD shown in the middle, the lower surface of the window module WM adjacent to the adhesive member AM has a second surface free energy, the upper surface of the display module DM adjacent to the adhesive member AM has a third surface free energy, and the second surface free energy and the third surface free energy can each include a dispersion component and a dipole component. Specifically, the lower surface of the window module WM can include glass, and the upper surface of the display module DM can include polyethylene terephthalate (PET) or triacetyl cellulose (TAC).

[0114] In an embodiment, the difference between the dipole component of the first surface free energy of the resin composition according to the embodiment provided to form the adhesive member AM and the dipole component of the second surface free energy of the window module WM can be about 20 mJ / m 2 or more. Also, the difference between the dipole component of the first surface free energy of the resin composition according to the embodiment provided to form the adhesive member AM and the dipole component of the third surface free energy of the display module DM can be about 20 mJ / m 2 or more. Thus, in the embodiment in which the resin composition according to the embodiment is used as the adhesive member AM of the display device DD, the resin composition can exhibit improved or high application properties with respect to the window module WM and the display module DM, which are adjacent members.

[0115] The resin composition according to the embodiment can exhibit a property having a glass transition temperature (Tg) in the range of about -60°C to about -20°C after photocuring. The laminate formed after photocuring of the resin composition can be used as an adhesive member, and has a property having a glass transition temperature (Tg) in the range of about -60°C to about -20°C, and thus can be soft even in a cured state to sufficiently cover a region having a step.

[0116] The resin composition according to the embodiment can have a low-temperature storage modulus in the range of about 0.05 mega pascal (MPa) to about 0.2 MPa after photocuring. In the present specification, the low-temperature storage modulus can be a value at -20°C.

[0117] The resin composition according to the embodiment can have a peel strength of 300 grams force per 25 millimeters (300 gf / 25 mm) or more at room temperature after photocuring. For example, the adhesive member formed by photocuring the resin composition according to the embodiment can exhibit an adhesive strength of about 300 gf / 25 mm or more with respect to a glass substrate at a temperature of about 25°C.

[0118] Hereinafter, the resin composition and the method for measuring and analyzing the droplet contact angle, the surface free energy, the glass transition temperature, the storage modulus, and the peeling strength, etc. corresponding to the physical properties of the resin composition after photocuring will be described in more detail with reference to the following examples.

[0119] Figure 5A is a view exemplarily showing a process of providing the resin composition according to an embodiment of the disclosure. Figure 5B is a view showing an enlarged partial region to which the resin composition is coated. Figure 5B is an enlarged view of the XX region of Figure 5A . Figure 6A Figure 6B is a view showing an enlarged partial region in which the adhesive member according to an embodiment of the disclosure is laminated. Figure 6B is an enlarged view of the YY region of Figure 6A .

[0120] Referring to Figure 5A and Figure 5B , the resin composition P-RS according to an embodiment can be applied to one surface of the base substrate in a liquid state having fluidity. Although Figure 5A shows an embodiment in which the display module DM is the base substrate to which the resin composition P-RS is provided, the embodiment is not limited thereto, and in another embodiment, the resin composition P-RS can be provided in a liquid form on one surface of the window module WM (see Figure 3 ), and then a photocuring process can be performed.

[0121] The resin composition P-RS according to an embodiment can be provided through an inkjet printing method or a dot coating method. The resin composition P-RS according to an embodiment can be controlled to have an appropriate viscosity to allow the resin composition P-RS to be easily discharged from an inkjet printing apparatus or a dot coating apparatus, and to control the amount of the resin composition P-RS discharged.

[0122] The resin composition P-RS is provided through an inkjet printing method or a dot coating method, and in this case, the resin composition P-RS can have properties easy to be applied to members of various shapes included in the display device DD (see Figure 2 ).

[0123] Although Figure 5A shows an embodiment in which the resin composition P-RS is provided on the base substrate by using a nozzle NZ, the configuration of supplying the resin composition P-RS is not limited thereto.

[0124] ​The resin composition P-RS is provided on the upper surface US-DM of the display module DM, and at this time, the upper surface US-DM of the outer edge of the display module DM can be partially exposed. That is, the edge ED-RS of the applied resin composition P-RS can be positioned further inward than the edge ED-DM of the display module DM.

[0125] During the application of the resin composition P-RS, the droplet contact angle θ IN may be about 10° or more. The droplet contact angle θ IN corresponds to the droplet contact angle at 2 seconds after the resin composition P-RS is provided on the base substrate. The edge ED-RS of the resin composition P-RS according to the embodiment can maintain a droplet state without flowing to the edge ED-DM of the display module DM while having a droplet contact angle θ IN .

[0126] Referring Figure 5A to Figure 6A and Figure 6B , after the resin composition P-RS is applied, ultraviolet light can be provided to the resin composition P-RS. Accordingly, the resin composition P-RS can be photocured and formed as the adhesive member AM.

[0127] Providing ultraviolet light to the resin composition P-RS can be performed by providing the resin composition P-RS on the upper surface US-DM of the display module DM and then directly irradiating ultraviolet light onto the resin composition P-RS. Alternatively, providing ultraviolet light to the resin composition P-RS can be performed by providing the resin composition P-RS on the display module DM, disposing the window module WM on the applied resin composition P-RS, and then irradiating ultraviolet light through the upper surface of the window WP.

[0128] In another embodiment, the resin composition P-RS can be applied on the lower surface of the window WP, and ultraviolet light is directly irradiated onto the resin composition P-RS applied on the lower surface of the window WP. In such an embodiment, the resin composition P-RS cured by the irradiation of the ultraviolet light can be bonded to the display module DM.

[0129] If the resin composition P-RS is photocured before the window module WM is disposed, ultraviolet light can be provided to form the adhesive member AM and then the window module WM is disposed, and thereafter, pressure PR can be provided on the window module WM to laminate the display module DM and the window module WM with the adhesive member AM interposed therebetween.

[0130] In an embodiment in which the window module WM is provided and then the ultraviolet light is irradiated through the upper surface of the window WP to form the adhesive member AM, a pressure PR can be provided on the window module WM to allow the adhesive member AM to laminate the display module DM and the window module WM while having a uniform thickness.

[0131] Compared to the edge ED-RS before the ultraviolet light is irradiated on the applied resin composition P-RS (see Figure 5B ), the edge line EDL-AM of the adhesive member AM can be moved toward the outer circumference after the lamination. Referring to Figure 6B , the adhesive member AM can be provided to sufficiently cover one surface (e.g., the upper surface US-DM) of the display module DM after the lamination. Figure 5B That is, in an embodiment, the edge line EDL-AM of the adhesive member AM can overlap the edge ED-DM of the display module DM. However, the present embodiment is not limited thereto, and even after the formation of the adhesive member AM, a portion of the upper surface US-DM (see Figure 5B ) of the display module DM can be exposed.

[0132] As shown in Figure 5B , if the droplet contact angle θ IN is about 10° or more at the edge ED-RS portion after the application of the resin composition P-RS according to the embodiment, the adhesive member AM (see Figure 6B ) formed of the resin composition P-RS according to the embodiment can have a reduced ramp length W SLP (see Figure 6B ) of the ramp region having a non-uniform thickness in the edge portion. Accordingly, in the display device according to the embodiment including the adhesive member AM formed of the resin composition P-RS according to the embodiment, the ramp region is reduced or minimized in the portion adjacent to the edge, so that the lifting phenomenon at the interface between the adhesive member AM and the adjacent member can be minimized. Accordingly, in an embodiment in which the display device includes the adhesive member AM formed of the resin composition P-RS according to the embodiment of the present disclosure, the display device can exhibit improved reliability characteristics.

[0133] Figure 7A is a view schematically showing an application characteristic of a conventional resin composition, and Figure 7B is a view schematically showing an application characteristic of a resin composition according to an embodiment of the present disclosure. Figure 8A is a graph schematically showing an application characteristic of a conventional resin composition after being cured, and Figure 8B is a graph schematically showing an application characteristic of a resin composition according to an embodiment of the present disclosure after being cured. Furthermore, Figure 9Ais a view schematically showing a lamination property of an adhesive member formed using a conventional resin composition, and Figure 9B is a view schematically showing a lamination property of an adhesive member formed using a resin composition according to an embodiment of the present disclosure.

[0134] Figure 8A shows Figure 7A a thickness distribution after curing of a conventional resin composition P-RS', and Figure 9A is an image showing a region around an edge boundary after laminating an adhesive member having Figure 8A a thickness distribution to a display module. Figure 8B shows Figure 7B a thickness distribution after curing of a resin composition P-RS according to an embodiment of the present disclosure, and Figure 9B is an image showing a region around an edge boundary after laminating an adhesive member having Figure 8B a thickness distribution to a display module.

[0135] Referring to Figure 7A and Figure 7B , if the resin composition P-RS or P-RS' is provided on the same substrate SUB, a droplet contact angle θ IN-C of the conventional resin composition P-RS' can be less than a droplet contact angle θ IN of the resin composition P-RS according to an embodiment. IN The droplet contact angle θ IN of the resin composition P-RS according to an embodiment can be about 10° or more. When compared with the resin composition P-RS according to an embodiment, the conventional resin composition P-RS' generally does not include a surface modifier. That is, the resin composition P-RS according to an embodiment includes a surface modifier including fluorine in addition to a monofunctional monomer and an oligomer, and thus, has a surface free energy lower than that of the conventional resin composition P-RS', and thus, has a relatively large droplet contact angle θ SLP The flowability can be limited when the resin composition P-RS is applied.

[0136] In Figure 8A and Figure 8B , a slope region is characterized as a region in which the thickness of the adhesive member gradually decreases after curing. Figure 8A shows a slope length W SLP ' of a slope region in a thickness profile of an adhesive member formed by the conventional resin composition P-RS' (see Figure 7A ), and Figure 8B shows a slope length W SLP ' of a slope region in a thickness profile of an adhesive member formed by the resin composition P-RS according to an embodiment of the present disclosure (see Figure 7Ba slope length W of a slope region in a thickness profile of the adhesive member formed SLP .

[0137] Referring to Figure 8A and Figure 8B , it can be seen that a slope length W of a slope region in a thickness profile of the adhesive member formed by the resin composition P-RS according to the embodiment SLP is shorter than a slope length W of a slope region in a thickness profile of the adhesive member formed by the conventional resin composition P-RS'. SLP That is, as the flowability of the resin composition P-RS according to the embodiment becomes lower than the flowability of the conventional resin composition P-RS', it can be seen that the slope region of the adhesive member formed by them, respectively, is also reduced.

[0138] Figure 9A and Figure 9B each show an image of confirming a slope length W SLP or W SLP ' of a slope region after laminating the adhesive member. In Figure 9A and Figure 9B , "ED-DM" is an edge portion of a display module (e.g., the display module DM of Figure 6B ) which can correspond to an edge portion of a slope region of the adhesive member. Further, Figure 9A "SSL-AM'" corresponds to a starting portion of a slope region of the adhesive member formed by the conventional resin composition P-RS', and Figure 9B "SSL-AM" corresponds to a starting portion of a slope region of the adhesive member formed by the resin composition P-RS according to the embodiment.

[0139] Referring to Figure 9A and Figure 9B , it can be seen that even after laminating the adhesive member, a slope length W SLP of a slope region of the adhesive member formed by the resin composition P-RS according to the embodiment SLP is shorter than a slope length W SLP of a slope region of the adhesive member formed by the conventional resin composition P-RS'. Thus, when members of a display device are laminated by means of the adhesive member, the display device including the adhesive member formed by the resin composition according to the embodiment can exhibit improved bonding characteristics among a plurality of components due to the reduction of the slope length W SLP of the slope region.

[0140] Hereinafter, the resin composition according to the embodiment of the present application and the adhesive member formed by the resin composition will be described in detail with reference to Examples and Comparative Examples. Further, the Examples shown below are for illustrative purposes only to facilitate the understanding of the embodiments of the present application, and thus, the scope of the present application is not limited thereto.

[0141] [Examples]

[0142] Table 1 shows compounds, components, and contents of the resin compositions of Example 1 to Example 6 and Comparative Example 1 to Comparative Example 3. Hereinafter, for the sake of simplicity of description, without indicating a specific example or a specific comparative example, Example 1 to Example 6 can be simply referred to as Examples, and Comparative Example 1 to Comparative Example 3 can be simply referred to as Comparative Examples.

[0143] The resin compositions of Example 1 to Example 6 each include a first monomer, an oligomer, a photopolymerization initiator, and a surface modifier. The Examples include 2-EHA, 4-HBA, EHDG-AT, and THF-A as the first monomer, and UF-C501, UF-C052, and UN6304 (all of which are urethane acrylates) as the oligomer. In addition, Omnirad 819 and TPO-L are used as the photopolymerization initiator. Three types of surface modifier are used, and Example 1 to Example 6 include one selected from FTX-218, FT-602A, and FT-681 as the surface modifier. FTX-218, FT-602A, and FT-681 as the surface modifier all correspond to hexafluoropropene-based compounds.

[0144] The resin composition of Comparative Example 1 differs from the resin compositions of the Examples in that Comparative Example 1 does not include a surface modifier. The resin composition of Comparative Example 2 differs from the resin compositions of the Examples in that Comparative Example 2 does not include 2-EHA as the first monomer, further includes ACMO, and does not include a surface modifier. The resin composition of Comparative Example 3 differs from the resin compositions of the Examples in that Comparative Example 3 additionally includes HEAA as the first monomer.

[0145] Example 1 and Example 2 are the same in terms of components of the resin composition, but are different in terms of the base substrate to which the resin composition is applied. Example 2 differs from Example 1 in that TAC is used as the base substrate. Example 3 differs from Example 1 in terms of the content of the surface modifier, and Example 4 to Example 6 differ from Example 1 in terms of the type and content of the surface modifier.

[0146] Among the base substrates, PET is polyethylene terephthalate, and TAC is triacetyl cellulose.

[0147] [Table 1]

[0148]

[0149]

[0150] The compounds used in Table 1 above are as follows.

[0151] <First monomer>

[0152] 2-EHA: 2-ethylhexyl acrylate (product of Toagosei Co., Ltd.)

[0153] 4-HBA: 4-hydroxybutyl acrylate (product of Osaka Organic Chemical Industry Ltd.)

[0154] EHDG-AT: 2-ethylhexyl-diglycol acrylate (product of Kyoeisha Chemical Co., Ltd.)

[0155] THF-A: tetrahydrofurfuryl acrylate (product of Kyoeisha Chemical Co., Ltd.)

[0156] ACMO: acryloyl morpholine (product of KJ Chemicals Co. Ltd.)

[0157] HEAA: N-hydroxyethyl acrylamide (product of KJ Chemicals Co. Ltd.)

[0158] <Low polymer>

[0159] UF-C051: urethane acrylate (weight average molecular weight 35000, product of Kyoeisha Chemical Co., Ltd.)

[0160] UF-C052: urethane acrylate (weight average molecular weight 10000, product of Kyoeisha Chemical Co., Ltd.)

[0161] UN6304: urethane acrylate low polymer (weight average molecular weight 10000, product of Negami Chemical Industrial Co., Ltd.)

[0162] <Photopolymerization initiator>

[0163] Omnirad 819: phenyl bis(2,4,6-trimethylbenzoyl) phosphine oxide (product of IGM Resin Co.)

[0164] TPO-L: phenyl(2,4,6-trimethylbenzoyl) phosphinic acid ethyl ester (product of Sartomer Co.)

[0165] <Surface modifier>

[0166] FTX-218: Hexafluoropropene compound (product of Neos Co.)

[0167] FT-602A: Hexafluoropropene compound (product of Neos Co.)

[0168] FT-681: Hexafluoropropene compound (product of Neos Co.)

[0169] The above FTX-218, FT-602A, and FT-681 are all hexafluoropropene compounds, and there are only some differences in molecular weight and functional groups.

[0170] In Table 2 below, the properties of the resin compositions and the physical properties of the adhesive members formed from the cured resin compositions are evaluated and shown. The method for evaluating each property is as follows.

[0171] <Measurement of Contact Angle of Resin Composition>

[0172] The resin compositions of the examples and comparative examples were deposited on a substrate substrate presented in a drop amount of 2 microliters (μL), and the contact angle was measured by the drop method after 2 seconds (drop contact angle). The contact angle was measured using a contact angle meter DMo-601 manufactured by Kyowa Interface Science Co., Ltd.

[0173] <Measurement of Surface Free Energy of Resin Composition>

[0174] The surface free energy γ LTot of a liquid was measured by the vertical drop method using a 5-microliter drop in a contact angle meter for contact angle measurement. ds Then, a 2-microliter drop amount of the resin composition was deposited on a polypropylene plate in which the dispersion component γ pL of the surface free energy is 0, and the contact angle θ was measured as the contact angle after 10 seconds by the drop method. The measured contact angle θ was substituted into the following theoretical equation 1 to derive the dipole component γ LTot of the resin composition. At the same time, the surface free energy γ dS of a liquid was measured using the surface tension value of the liquid.

[0175] [Equation 1 of Wu]

[0176] γ dS γ dL / (γ dS +γ dL )+γ pS γ pL / (γ pS +γ pL )=γ LTot (1+cosθ) / 4

[0177] Each term in the above equation 1 is defined as follows.

[0178] γ dS : dispersive component of a solid

[0179] γ dL : dispersive component of a liquid

[0180] γ pS : dipole component of a solid

[0181] γ pL : dipole component of a liquid

[0182] γ LTot : surface free energy of a liquid

[0183] Measurement of surface free energy of a substrate

[0184] The above contact angle measuring instrument is used to measure the surface free energy of the substrate used. The surface free energy is evaluated by measuring the contact angle θ of each of ion exchanged water and iodomethane with respect to each substrate. The measured value of the contact angle θ of each of ion exchanged water and iodomethane with respect to each substrate, and the dispersive component γ dL and the dipole component γ pL of each of ion exchanged water and iodomethane are substituted into the above [Wu's equation 1] to obtain the surface free energy γ of each substrate.

[0185] The dispersive component γ dL , the dipole component γ pL and the surface free energy γ L of each of ion exchanged water and iodomethane are as follows, respectively.

[0186] γ dL of ion exchanged water: 22.1 (mJ / m 2 )

[0187] γ pL of ion exchanged water: 50.7 (mJ / m 2 )

[0188] γ L of ion exchanged water: 72.8 (mJ / m 2 )

[0189] γ dL of iodomethane: 44.1 (mJ / m 2 )

[0190] γ pL of iodomethane: 6.7 (mJ / m 2 )

[0191] Surface free energy γ, dispersion component γ L : 50.8 (mJ / m 2 )

[0192] The surface free energy γ, dispersion component γ d and dipole component γ p of each of the substrates are obtained by introducing the above-mentioned surface free energy component of each of ion-exchanged water and methyl iodide into the theoretical formula 1 as follows.

[0193] Surface free energy γ of polyethylene terephthalate (PET): 30.2 (mJ / m d ) 2

[0194] Surface free energy γ of polyethylene terephthalate (PET): 36.5 (mJ / m p ) 2

[0195] Surface free energy γ of polyethylene terephthalate (PET): 66.7 (mJ / m 2 )

[0196] Surface free energy γ of triacetyl cellulose (TAC): 29.7 (mJ / m d ) 2

[0197] Surface free energy γ of triacetyl cellulose (TAC): 29.4 (mJ / m p ) 2

[0198] Surface free energy γ of triacetyl cellulose (TAC): 59.1 (mJ / m 2 )

[0199] The surface free energy γ, dispersion component γ d and dipole component γ p of glass are obtained by introducing the above-mentioned surface free energy component of each of ion-exchanged water and methyl iodide into the theoretical formula 1 as follows. Here, the surface free energy γ, dispersion component γ d and dipole component γ p of glass correspond to the surface free energy, dispersion component and dipole component of the window WP (see Figure 3 ).

[0200] Surface free energy γ of glass: 26.3 (mJ / m d ) 2

[0201] Surface free energy γ of glass: 45.6 (mJ / m p ) 2

[0202] Surface free energy γ of glass: 71.9 (mJ / m 2 )​​​​​​

[0203] <Calculation of Δp with Basis>

[0204] The Δp value with a substrate represents the difference in the dipole component of the surface free energy between the resin composition and the base substrate on which the resin composition is provided. Δp corresponds to the surface free energy γ of the above-mentioned resin composition. LTot The dipole component γ pL The dipole component γ of the surface free energy γ of the substrate obtained by the above method p The difference between.

[0205] <Measurement of Glass Transition Temperature and Storage Modulus>

[0206] The glass transition temperature and the storage modulus were measured using test pieces obtained by curing the resin compositions of Examples and Comparative Examples.

[0207] On a slide glass (Matsunami Glass, slide glass S1112), a demolding-treated PET film (Panac Co., Ltd., NP1000A) and a silicone rubber sheet having a hole with a diameter of 8 mm (Tigers Polymer Co., Ltd.) were stacked in sequence. 28 μL of each of the resin composition of the example and the resin composition of the comparative example was dropped into the hole portion of the silicone rubber sheet. Ultraviolet light was irradiated onto each of the dropped resin composition of the example and the resin composition of the comparative example using an ultraviolet light emitting diode (UVLED) lamp having peaks at 405 nm and 365 nm, respectively, wherein the amount of light provided was 1200 mJ / cm 2 and 800mJ / cm 2 On the resin composition of the example and the resin composition of the comparative example irradiated with ultraviolet light, a demolding-treated PET film (Vanack Co., Ltd., NP1000A) and a slide glass (Matsunami Glass Industries, Ltd., slide glass S1112) were stacked in sequence. After the irradiation of ultraviolet light, ultraviolet light was irradiated on one side of the stacked slide glass using a UVLED lamp having a peak at 395 nm to cure the resin composition of the example and the resin composition of the comparative example, wherein the amount of light provided was 4000 mJ / cm 2 Thus, a measurement specimen having a diameter of 8 mm and a thickness of 500 μm was obtained. The glass transition temperature (Tg) after curing and the storage modulus at -20°C of the resin composition as the prepared measurement specimen were measured using a dynamic viscoelasticity measuring instrument (Anton Parr, MCR302).

[0208] The glass transition temperature (Tg) and storage modulus were measured at a frequency of 1 Hz and at a temperature increasing at a rate of 2°C / min from -70°C to 80°C.

[0209] <Measurement of peel strength>

[0210] On a soda-lime glass (Central Glass Co., Ltd.) of 26 mm x 76 mm, the resin composition of each of the examples and comparative examples was applied using an inkjet printing device. The thickness to which the resin composition was applied was set to 50 μm. On the soda-lime glass on which the curable liquid resin composition was applied, ultraviolet light was irradiated using a UV LED lamp having peaks at 365 nm and 395 nm, respectively, with a cumulative light amount of 1200 mJ / cm 2 and 800 mJ / cm 2 , respectively. A PET film (Toyobo Co., Ltd., A3460, 50 μm) cut to 20 mm x 150 mm was joined to the soda-lime glass on which the ultraviolet light was irradiated with a joining pressure of 0.15 MPa. After the joining, on one side of the PET film, ultraviolet light was irradiated using a UV LED lamp having a peak at 395 nm with a cumulative light amount of 4000 mJ / cm 2 to cure the resin composition, thereby obtaining a test piece.

[0211] The peel strength of the obtained test piece was measured using a universal testing machine (Instron Co., Model 5965) at a speed of 300 mm / min with a peel angle of 180°. By measuring the peel strength three times, an average value of the peel strength of about 50 mm was obtained, and then the obtained value was multiplied by 1.25 to evaluate the peel strength.

[0212] <Inkjet application evaluation>

[0213] After the PET film having an adhesive layer was joined on a glass plate, the resin composition of each of the examples and comparative examples was applied from the edge of the PET film inwardly by 70 μm at a nozzle temperature of 30°C by using an inkjet printer manufactured by Microjet Co. Then, the applied resin composition was irradiated with ultraviolet light to observe the appearance of the film after curing.

[0214] A thin film glass was joined on the film obtained after curing using a hand roller, and the presence or absence of voids was observed with the naked eye. In Table 2 below, the case where the voids were not visible was marked with "O", and the case where the voids were observed was marked with "X".

[0215] The film glass was joined by using a hand roller on the film obtained after curing and the slope length was measured by using DSX1000 manufactured by Olympus Co. The slope length was evaluated by measuring the distance from the edge of the PET film to the interface of the film glass joined using the hand roller. The distance to the interface of the film glass corresponds to the distance from the edge of the PET film to the edge where the adhesive member is disposed. In Table 2 below, " " corresponds to the case where the slope length is in the range of 0 μm to 50 μm, "O" corresponds to the case where the slope length is in the range of 50 μm to 100 μm, " " corresponds to the case where the slope length is in the range of 100 μm to 150 μm, and "X" corresponds to the case where the slope length is greater than 150 μm.

[0216] [Table 2]

[0217]

[0218] Referring to the evaluation results of the examples and comparative examples in Table 2, the resin composition of the examples exhibited improved application characteristics without voids. Further, in terms of the slope length, the slope of the examples was shorter than that of the comparative examples, so that it could be confirmed that the slope region was reduced. Compared to the examples, Comparative Example 1 did not include the surface modifier in the resin composition, so that the droplet contact angle was less than 10°, and thus, in the inkjet application evaluation, the slope of Comparative Example 1 was longer than that of the examples. Compared to the examples, Comparative Example 3 included a different type of monomer in the resin composition, and thus, voids were observed during the inkjet application evaluation, and the slope of Comparative Example 3 was also longer than that of the examples. In the case of Comparative Example 2, no sample for evaluation was prepared, so that the glass transition temperature, storage modulus, and peeling strength were not measured. The resin composition according to the embodiments includes a monomer having one polymerizable unsaturated group in one molecule, an oligomer having a weight average molecular weight in the range of about 5,000 to about 40,000, and a surface modifier including fluorine, and thus, the resin composition exhibits improved application characteristics with respect to a substrate to be applied to, and has limited flowability at the edge portion, and thus, the resin composition can have a reduced slope region.

[0219] Further, the display device according to the embodiments includes the adhesive member formed of the resin composition according to the embodiments, and thus, the display device can exhibit improved joining characteristics (adhesion characteristics) even in the stepped portion of the member adjacent to the adhesive member, and by allowing the edge of the member to be joined to a sufficient thickness due to the reduction of the slope region, the display device can exhibit high reliability characteristics.

[0220] The resin composition according to the embodiment includes a monofunctional monomer, an oligomer, and a fluorine-containing surface modifier, so that the resin composition can exhibit improved application characteristics, in addition to limiting the flowability of the applied droplets, and thus, covering the step portion, and as a result, the edge portion of the substrate to be applied.

[0221] The display device according to the embodiment includes an adhesive member formed of a resin composition including a monofunctional monomer, an oligomer, and a fluorine-containing surface modifier, so that the engagement between the module and the member of the display device is maintained without lifting, and thus, the display device can exhibit improved or high reliability characteristics.

[0222] The present application should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the application to those skilled in the art.

[0223] While the application has been particularly shown and described with reference to embodiments thereof, it will be understood by those skilled in the art that various changes in form and details can be made therein without departing from the spirit or scope of the application as defined by the appended claims.

Claims

1. A resin composition, wherein, The resin composition comprises: A first monomer having one polymerizable unsaturated group in one molecule; an oligomer derived from a second monomer containing two or more polymerizable unsaturated groups in one molecule, the oligomer having a weight average molecular weight within the range of 5,000 to 40,000; a photopolymerization initiator; and a surface modifier having a weight ratio ranging from 0.01% to 5% relative to the total weight of the first monomer and the oligomer and containing fluorine, wherein the resin composition has a surface free energy in the range of 20 mJ / m 2 to 35 mJ / m 2 before being cured.

2. The resin composition according to claim 1, wherein, The surface modifier includes hexafluoropropylene.

3. The resin composition according to claim 1, wherein, The first monomer is a monofunctional (meth)acrylate monomer, and the oligomer is a urethane (meth)acrylate.

4. The resin composition according to claim 1, wherein Two or more types of monofunctional (meth)acrylate monomers different from each other are included in the resin composition as the first monomer, and Two or more types of urethane (meth)acrylates having weight average molecular weights different from each other are included in the resin composition as the oligomer.

5. The resin composition according to claim 1, wherein, The first monomer includes at least one selected from 2-ethylhexyl acrylate, 4-hydroxybutyl acrylate, 2-ethylhexyl diglycol acrylate, and tetrahydrofurfuryl acrylate.

6. The resin composition according to claim 1, wherein, The resin composition has a glass transition temperature in the range of -60°C to -20°C after being photocured.

7. The resin composition according to claim 1, wherein The surface free energy includes a dispersion component and a dipole component, and when the difference between the dipole component of the base substrate to which the resin composition is applied and the resin composition is 30 mJ / m 2 or more, A droplet contact angle is 10 degrees or greater 2 seconds after providing the resin composition on the base substrate.

8. The resin composition according to claim 1, wherein, The resin composition is provided on the base substrate by an inkjet printing method or a dot coating method.

9. A display device, wherein, The display device includes: Display module; a window module, disposed on the display module; and an adhesive member disposed between the display module and the window module and formed of a resin composition, Wherein, the resin composition comprises: A first monomer having one polymerizable unsaturated group in one molecule; an oligomer derived from a second monomer containing two or more polymerizable unsaturated groups in one molecule, the oligomer having a weight average molecular weight within the range of 5,000 to 40,000; a photopolymerization initiator; and a surface modifier having a weight ratio ranging from 0.01% to 5% relative to the total weight of the first monomer and the oligomer and containing fluorine, wherein the resin composition has a first surface free energy in the range of 20 mJ / m 2 to 35 mJ / m 2 before being cured.

10. The display device of claim 9, wherein, The surface modifier includes hexafluoropropylene.

11. The display device according to claim 9, wherein The first monomer comprises at least one selected from 2-ethylhexyl acrylate, 4-hydroxybutyl acrylate, 2-ethylhexyl diglycol acrylate and tetrahydrofurfuryl acrylate, and The oligomer includes urethane (meth)acrylate.

12. The display device of claim 9, wherein, The adhesive member has a glass transition temperature in the range of -60°C to -20°C.

13. The display device of claim 9, wherein, The adhesive member has a storage modulus in the range of 0.05 MPa to 0.2 MPa at a temperature of -20°C.

14. The display device of claim 9, wherein, The adhesive member has an adhesive strength of 300 gf / 25 mm or more with respect to a glass substrate at a temperature of 25℃.

15. The display device of claim 9, wherein, The window module includes a window and a pattern layer disposed on a surface of the window, wherein the adhesive member covers a stepped structure between the pattern layer and the window. 16.The display device of claim 9, wherein, a lower surface of the window module adjacent to the adhesive member has a second surface free energy, an upper surface of the display module adjacent to the adhesive member has a third surface free energy, wherein, the first surface free energy, the second surface free energy, and the third surface free energy each include a dispersion component and a dipole component, and The difference in the dipole component between the first surface free energy and the second surface free energy and the difference in the dipole component between the first surface free energy and the third surface free energy are each 20 mJ / m 2 or larger.

17. The display device of claim 16, wherein, the lower surface of the window module includes glass, and the upper surface of the display module includes polyethylene terephthalate or triacetyl cellulose.

18. An electronic device, wherein, The electronic device includes: an electronic module; a display module disposed on the electronic module and including an active area, an electronic module area overlapping the electronic module and defined in the active area, and a peripheral area disposed on at least one side of the active area; a window module disposed on the display module and including a transmissive area corresponding to the active area, a sensing area corresponding to the electronic module area, and a bezel area corresponding to the peripheral area; and an adhesive member disposed between the display module and the window module and formed of a photocurable resin composition, wherein the resin composition includes: a first monomer having one polymerizable unsaturated group in one molecule; an oligomer derived from a second monomer including two or more polymerizable unsaturated groups in one molecule, and having a weight average molecular weight in a range of 5,000 to 40,000; a photopolymerization initiator; and a surface modifier having a weight ratio in a range of 0.01% to 5% with respect to a total weight of the first monomer and the oligomer and including fluorine, wherein the resin composition has a surface free energy in the range of 20 mJ / m 2 to 35 mJ / m 2 before being cured. 19.The electronic device of claim 18, wherein, the window module includes a window and a pattern layer disposed on a lower surface of the window, wherein, the pattern layer includes an outer pattern layer corresponding to the peripheral area and a hole pattern layer overlapping at least a portion of the electronic module area, and the adhesive member is directly disposed on the pattern layer while covering a stepped structure between the pattern layer and the window. 20.The electronic device of claim 18, wherein, The surface modifier includes hexafluoropropene. The surface modifier includes hexafluoropropene.

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