Environmental control bracket general assembly system with temperature control function

Abstract

The invention belongs to the technical field of equipment heat dissipation, and particularly relates to an environment control bracket general assembly system with a temperature control function, which comprises a bracket and a case arranged on the bracket, the bracket is provided with a bracket air inlet facing the case, and the bracket air inlet is connected with an environment control system through a pipeline; the case comprises a case shell, a cold plate structure is arranged in the case shell, the cold plate structure comprises a cold plate shell and a PCB arranged in the cold plate shell, the PCB is provided with a functional chip, a heat dissipation path structure of the functional chip is provided with a metal block I, the metal block I is in heat conduction connection with the heat dissipation path structure, the metal block I is in contact with a piezoelectric ceramic I or a pressure sensor I, and the piezoelectric ceramic I or the pressure sensor I is in heat conduction connection with the functional chip. The piezoelectric ceramic I or the pressure sensor I is electrically connected with the temperature control module, and the temperature control module is electrically connected with the environment control system. Through the system, the environmental control flow is automatically adjusted in real time, the heat dissipation reliability is improved, and the debugging workload can be reduced.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of equipment heat dissipation, and particularly relates to a temperature control function-equipped environment control bracket assembly system. BACKGROUND

[0002] As Figure 1a shown is a traditional cooling bracket assembly structure, which mainly comprises a case, a bracket and the like, Figure 1a An exploded view thereof is shown in Figure 1b The bracket bottom has an air inlet, as shown in Figure 1c When the cold plate in the case on the bracket works, the devices on the PCB board in the cold plate generate heat, which is transferred to the cold plate shell, and then from the cold plate shell to the case shell, the case is placed on the bracket, the air inlet of the bracket provides cooling air, the cooling air enters the air duct and passes through the surface of the case shell, so that the heat dissipation of the devices on the PCB board is conducted to the surface of the case shell and then taken away by the cooling air of the air inlet of the bracket.

[0003] The bracket assembly structure shown in Figure 1 has a large workload in flow distribution debugging, the environment control system provides cooling air for multiple bracket assembly structures, the heat dissipation of the cold plate is a certain value in design, and in flow distribution debugging, the actual heat dissipation of the cold plate in work needs to be distributed. The actual heat dissipation of the cold plate in work has three conditions: higher than the design value, equal to the design value and lower than the design value, so there are three states of corresponding flow regulation: increasing air cooling quality, maintaining air cooling quality unchanged and reducing air cooling quality. When multiple bracket assembly structures work at the same time, when the number of bracket assembly structures is N, there are theoretically N 3 work conditions for regulation, and the debugging workload is large. SUMMARY

[0004] In order to improve the reliability of heat dissipation of devices in the cold plate and reduce the debugging workload of the equipment, the application provides a temperature control function-equipped environment control bracket assembly system.

[0005] The purpose of the application is realized by adopting the following technical scheme. According to the temperature control function-equipped environment control bracket assembly system provided by the application, the system comprises a bracket, a case arranged on the bracket, a bracket air inlet arranged on the bracket and facing the case, and a pipeline connecting the bracket air inlet and an environment control system; the case comprises a case shell, a cold plate structure arranged in the case shell, the cold plate structure comprises a cold plate shell and a PCB board arranged in the cold plate shell, a functional chip is arranged on the PCB board, a metal block I is arranged on a heat dissipation path structure of the functional chip, the metal block I is in thermal conductive connection with the heat dissipation path structure, the metal block I is in contact with a piezoelectric ceramic I or a pressure sensor I, the piezoelectric ceramic I or the pressure sensor I is in electrical connection with a temperature control module, and the temperature control module is in electrical connection with the environment control system.

[0006] Compared with the prior art, the application has the advantages that:

[0007] The application provides a temperature control function of the environmental control bracket assembly system, the functional chip generates heat, the metal block is deformed, and then the piezoelectric ceramic or the pressure sensor generates an electric signal, the electric signal is transmitted to the environmental control system through the temperature control module, the environmental control system can automatically adjust the flow according to the temperature of the functional chip, and the traditional temperature sensor is no longer relied on, the installation and arrangement of the temperature sensor are solved, the metal block, the piezoelectric ceramic or the pressure sensor have simple structures, and the reliability can be improved, and miniaturized design is realized. Through the system, the environmental control flow is automatically adjusted in real time, the heat dissipation reliability is improved, and the debugging workload can be reduced.

[0008] Further, the heat insulation block is further arranged on the heat dissipation path structure and is in heat insulation connection between the heat dissipation path structure, the piezoelectric ceramic II or the pressure sensor II is in contact with the heat insulation block, the piezoelectric ceramic II or the pressure sensor II is electrically connected with the temperature control module, the metal block I and the heat insulation block are arranged in groups, the distance between the metal block I and the heat insulation block in the same group on the heat dissipation path structure is close, so that the metal block I, the heat insulation block and the corresponding piezoelectric ceramic or pressure sensor have equal or similar deformation under vibration conditions.

[0009] Compared with the prior art, the application has the advantages that:

[0010] When the system works under vibration conditions, the relative displacement between the metal block I and the piezoelectric ceramic I 151 or the pressure sensor is caused by vibration, and then the contact pressure is affected, the electric signal transmitted by the piezoelectric ceramic or the pressure sensor corresponding to the metal block I is inaccurate, after the heat insulation block is arranged, the heat insulation block only deforms due to vibration, after the electric signal of the piezoelectric ceramic or the pressure sensor corresponding to the heat insulation block is transmitted to the temperature control module, the temperature control module processes the electric signals of the two piezoelectric ceramics or pressure sensors, calculates the electric signal caused by temperature deformation, offsets the electric signal caused by vibration conditions, corrects the error electric signal caused by vibration conditions, and makes the temperature control more accurate.

[0011] Further, the system has a dynamic compensation function, the initial contact deformation between the metal block I and the piezoelectric ceramic I or the pressure sensor I and between the heat insulation block and the piezoelectric ceramic II or the pressure sensor II in a static and initial temperature state is set as Δx0, the deformation makes the corresponding piezoelectric ceramic or pressure sensor generate a voltage V0; the functional chip generates heat, the deformation amount of the metal block I is Δx1, the actual deformation amount of the metal block I caused by temperature is Δx1-Δx0, the voltage generated by the piezoelectric ceramic I or the pressure sensor I when Δx1 deforms is V1, the temperature control module receives the voltage V0 and the voltage V1 and calculates an environmental control voltage in a static state.

[0012] When the system vibrates, the deformation amount of the metal block I and the corresponding piezoelectric ceramic or pressure sensor due to vibration is set as Δx2, the total deformation amount of the metal block I and the corresponding piezoelectric ceramic I or pressure sensor I is Δx1±Δx2, the voltage corresponding to the piezoelectric ceramic I or the pressure sensor I is V3, the total deformation amount of the heat insulation block and the corresponding piezoelectric ceramic II or pressure sensor II is Δx0±Δx2, and the voltage corresponding to the piezoelectric ceramic II or the pressure sensor is V4; the difference between the deformation amounts of the metal block I and the heat insulation block is (Δx1±Δx2)-(Δx0±Δx2)=Δx1-Δx0, and the difference between the voltage V3 and the voltage V4 remains unchanged, so that the voltage output by the temperature control module remains unchanged to realize the dynamic compensation function.

[0013] Further, the heat dissipation path structure comprises a functional chip and a cold plate shell connected in sequence in heat conduction, the inner wall of the cold plate shell is provided with a metal block I and a heat insulation block, and the piezoelectric ceramic I or the pressure sensor I, the piezoelectric ceramic II or the pressure sensor II and the temperature control module are integrally arranged on the PCB board.

[0014] Further, the inner wall of the cold plate shell is provided with a heat dissipation boss, and the functional chip is connected in heat conduction with the heat dissipation boss through a heat conduction adhesive pad.

[0015] Further, the metal block I and the heat insulation block are arranged on the heat dissipation boss.

[0016] Further, the PCB board is provided with a module connector, the module connector extends out of the cold plate shell, a back plate assembly is arranged in the case shell, a back plate connector is arranged on the back plate assembly and is inserted into the module connector, a case connector is arranged on the case shell and is electrically connected with the back plate assembly, and the case connector (5) is electrically connected with the environmental control system through a cable.

[0017] Further, the case is an open case, the outer wall of the cold plate shell is provided with heat dissipation teeth, the case shell is provided with a case air inlet and a case air outlet which are in communication with the air inlet of the bracket, and an air duct is formed between the inner wall of the case shell and the cold plate structure and between adjacent cold plate structures, and the two ends of the air duct are in communication with the case air inlet and the case air outlet respectively.

[0018] Further, the case is a closed case, the cold plate shell is connected in heat conduction with the case shell, and the outer wall of the case shell is provided with heat dissipation teeth.

[0019] Further, the heat dissipation path structure comprises the functional chip, the cold plate shell and the case shell connected in sequence in heat conduction, the case shell outer wall is provided with the temperature control device, the temperature control device comprises the temperature control device shell connected with the case shell in heat conduction, the inner wall of the temperature control device shell is provided with the metal block I and the heat insulation block, the metal block I is connected with the temperature control device shell in heat conduction, the heat insulation block is connected with the temperature control device shell in heat insulation, and the temperature control device shell is provided with the piezoelectric ceramic I or the pressure sensor I, the piezoelectric ceramic II or the pressure sensor II and the temperature control module.

[0020] The above description is only a summary of the technical scheme of the present application, in order to more clearly understand the technical means of the present application, the following preferred embodiments are described in detail in combination with the drawings, and the purpose, characteristics and advantages of the present application are more obvious and easy to understand. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1a It is a schematic diagram of the bracket assembly structure in the prior art;

[0022] Figure 1b It is an exploded view of Figure 1a ;

[0023] Figure 1c It is a schematic diagram of the bracket in Figure 1a ;

[0024] Figure 2 It is an assembly schematic diagram of the cold plate structure in the environmental control bracket assembly system with temperature control function embodiment of the present application;

[0025] Figure 3 It is an exploded schematic diagram of Figure 2 ;

[0026] Figure 4 It is a partial sectional view of Figure 2 ;

[0027] Figure 5 It is a structural schematic diagram of the PCB assembly in Figure 3 ;

[0028] Figure 6 It is a three-dimensional schematic diagram of the cold plate cover I in Figure 3 ;

[0029] Figure 7 It is a partial enlarged schematic diagram of the metal block and the piezoelectric ceramic in Figure 4 ;

[0030] Figure 8 It is a principle schematic diagram of the temperature control module in the environmental control bracket assembly system with temperature control function embodiment of the present application;

[0031] Figure 9The topological structure diagram of the temperature control module in an embodiment of the environmental control bracket assembly system with temperature control function is shown in the figure.

[0032] Figure 10 The schematic diagram of another setting form of the metal block and the piezoelectric ceramic in an embodiment of the environmental control bracket assembly system with temperature control function is shown in the figure.

[0033] Figure 11 The schematic diagram of the heat transfer structure in an embodiment of the environmental control bracket assembly system with temperature control function is shown in the figure.

[0034] Figure 12 The schematic diagram of the vibration of the structure shown in the figure. Figure 11

[0035] Figure 13 The sectional view of the temperature control device in another embodiment of the environmental control bracket assembly system with temperature control function is shown in the figure.

[0036] Reference signs:

[0037] 1-bracket, 2-bracket air inlet, 3-chassis, 4-chassis shell, 5-chassis connector, 6-back plate assembly, 7-cold plate structure, 8-PCB board, 9-module connector, 10-function chip, 11-cold plate cover I, 111-radiating teeth, 12-cold plate cover II, 13-handle, 14-screw, 151-piezoelectric ceramic I, 152-piezoelectric ceramic II, 16-radiating boss, 171-metal block I, 172-metal block II, 18-heat-conducting rubber pad, 19-temperature control device shell, 20-temperature control PCB board, 21-temperature control module. DETAILED DESCRIPTION

[0038] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0039] An embodiment of the environmental control bracket assembly system with temperature control function includes a bracket 1 and a chassis 3, the chassis 3 is placed on the bracket 1, the chassis 3 includes a chassis shell 4, a cold plate structure 7 is arranged in the chassis shell 4, and the cold plate structure 7 is as shown in the figure. Figures 2 to 7

[0040] The cold plate structure 7 includes a cold plate cover I 11 and a cold plate cover II 12 which are butted against each other, and the cold plate cover I 11 and the cold plate cover II 12 form a cold plate shell. In this embodiment, the cold plate cover I 11 and the cold plate cover II 12 are fixed by screws 14. ​​

[0041] The cavity formed between the cold plate cover I 11 and the cold plate cover II 12 is provided with the PCB 8, and the rear end of the PCB 8 is provided with a module connector 9 which extends out of the cold plate shell and is inserted into a backboard connector on the backboard assembly 6 in the cabinet shell 4. In the embodiment, the module connector 9 is an LRM connector or a VPX connector.

[0042] The front end of the cold plate shell is provided with a handle 13 for assisting the insertion or extraction of the cold plate structure 7 into or out of the cabinet.

[0043] The outer side wall of the cold plate cover I 11 is provided with a plurality of heat dissipation teeth 111 for increasing the heat dissipation area.

[0044] The side of the PCB 8 facing the cold plate cover I 11 is provided with a plurality of functional chips 10 which are devices that need to be cooled and generate heat during the operation of the cold plate structure.

[0045] The PCB 8, the connector 9 and the functional chip 10 form a PCB assembly.

[0046] The functional chip 10 is bonded with a heat-conducting rubber pad 18. The side wall of the cold plate cover I 11 is provided with a heat dissipation boss 16 corresponding to the position of the functional chip 10, and the heat-conducting rubber pad 18 is tightly attached to the heat dissipation boss 16. The heat generated by the functional chip 10 is transmitted to the cold plate cover I 11 through the heat-conducting rubber pad 18 and the heat dissipation boss 16, realizing the heat-conducting connection between the functional chip 10 and the cold plate structure shell. In the embodiment, the heat dissipation boss 16 is integrally arranged with the cold plate cover I 11.

[0047] The inner wall of the cold plate cover I 11 is provided with a metal block I 171 and a metal block II 172, and the distance between the metal block I 171 and the metal block II 172 is small, as shown in Figure 10 The metal block II 172 and the cold plate cover I 11 are provided with a heat insulation plate to avoid the heat of the cold plate cover I 11 being transmitted to the metal block II 172. The PCB is provided with a piezoelectric ceramic I 151 and a piezoelectric ceramic II 152 corresponding to the positions of the metal block I 171 and the metal block II 172. The metal block I 171 is in contact with the piezoelectric ceramic I 151, and the metal block II 172 is in contact with the piezoelectric ceramic II 152.

[0048] In the embodiment, in order to reduce the volume of the metal block I 171 and the metal block II 172, the metal block I 171 and the metal block II 172 are arranged on one of the heat dissipation bosses 16, as shown in Figure 4 Figure 7

[0049] ​​The heat on the cold plate cover I 11 is conducted to the metal block I 171, and the metal block I 171 can extrude the corresponding piezoelectric ceramic I after being heated and expanded, so that the piezoelectric ceramic I generates an electric signal.

[0050] The heat emitted by the functional chip 10 passes through the heat-conducting rubber pad 18, the heat-dissipating boss 16, the cold plate cover I 11, the metal block I 171 and the piezoelectric ceramic I 151 in turn, forming a heat transfer structure.

[0051] A temperature control module is arranged on the PCB 8, and the temperature control module includes a storage module, a control logic circuit, a power supply and an amplification circuit, as shown in Figure 9 The piezoelectric ceramic is electrically connected to the temperature control module through the PCB, and can transmit the electric signal generated by the piezoelectric ceramic to the temperature control module.

[0052] The power supply provides appropriate voltage (current) for the components such as the amplification circuit, the storage module and the control logic circuit.

[0053] The amplification circuit appropriately amplifies the input piezoelectric ceramic electric signal and provides an upper limit to avoid damage to the components of the ring control system due to excessive voltage (current).

[0054] The storage module mainly stores the corresponding relationship and operation rules of parameters such as the power of the functional chip, the expansion amount of the metal block, the piezoelectric ceramic voltage (current) and the temperature.

[0055] The control logic circuit mainly controls the amplification multiple of the amplification circuit and outputs signals for controlling the ring control voltage and the priority when multiple piezoelectric ceramics work at the same time according to the data of the storage module.

[0056] The electric signal generated by the piezoelectric ceramic (including the piezoelectric ceramic I and the piezoelectric ceramic II) is input into the temperature control module, and the appropriate ring control voltage is output after being processed by the temperature control module. The ring control voltage is transmitted to the ring control system through the PCB 8, the module connector 9, the back plate connector, the back plate assembly 6, the case connector 5 and the cable, controls the flow distribution of the ring control system to the ring control bracket assembly system, makes the flow change with the power of the functional chip 10, realizes the real-time adjustment of the flow distribution of the ring control system, and further adjusts the temperature of the functional chip 10, as shown in Figure 8

[0057] The heat consumption of the functional chip 10 on the PCB 8 is set as W, and the corresponding temperature of the cold plate shell is t. The relationship between t and W can be expressed as

[0058] t = f (W) (0.1)

[0059] When the temperature of the cold plate shell is t, the expansion amount Δx of the metal block I (the expansion amount, deformation amount or displacement amount mentioned in the present application are the expansion amount, deformation amount or displacement amount generated by the metal block and the piezoelectric ceramic in the direction of interaction) can be expressed as​

[0060] Δx=f(t) (0.2)

[0061] When the expansion of the piezoelectric ceramic I in the metal block I is Δx, the change in voltage (current) ΔV can be expressed as

[0062] ΔV=f(Δx) (0.3)

[0063] When the voltage (current) changes by ΔV, the control voltage V of the environmental control system after adjustment by the temperature control module is

[0064] v=f(Δv) (0.4)

[0065] The expressions of the environmental control system control voltage V and environmental control flow Q are:

[0066] Q=f(V) (0.5)

[0067] By combining equations 1.1 to 1.5, we can obtain the relationship between the heat consumption of the functional chip 10 and the environmental control flow rate.

[0068] When the bracket assembly system is used under vibration conditions, the structures and components in the cold plate structure 7 may be deformed. The deformation caused by vibration and temperature may distort the electrical signal generated by the piezoelectric ceramics.

[0069] Ideally, the electrical signal output by the piezoelectric ceramic I is positively correlated with the temperature, that is, the higher the temperature, the greater the expansion of the metal block I, and the greater the electrical signal (voltage or current) generated by the piezoelectric ceramic I. Figure 11 、 Figure 12 As shown, under vibration conditions, the temperature-induced expansion of metal block I 171 is Δx1, and the vibration-induced deformation (i.e., displacement) of PCB board 8 and piezoelectric ceramics I 151 and II 152 on PCB board 8 at corresponding locations of metal blocks I and II is Δx2. When the deformation directions of Δx1 and Δx2 are the same and Δx2 > Δx1, the contact between piezoelectric ceramic I 151 and metal block I 171 is loosened, and the pressure on piezoelectric ceramic I 151 decreases or even disappears. When the deformation directions of Δx1 and Δx2 are the same and Δx2 < Δx1, although piezoelectric ceramic I 151 does not lose contact, the deformation of Δx2 partially offsets the deformation of Δx1, resulting in a reduction in the pressure on piezoelectric ceramic I 151. When the deformation directions of Δx1 and Δx2 are opposite, the contact pressure between piezoelectric ceramic I 151 and metal block I 171 increases, and the pressure on piezoelectric ceramic I 151 increases. The above situations will cause the electrical signal generated by the piezoelectric ceramic I 151 to be inaccurate (the electrical signal will be too large or too small under different vibration conditions under the same temperature conditions).

[0070] In the embodiment, two piezoelectric ceramics and two metal blocks are arranged, wherein the metal block I 171 is in thermal contact with the cold plate cover I 11, the heat of the cold plate cover I 11 can be transmitted to the metal block I 171, the metal block I 171 can automatically deform and expand with the change of temperature, and the output electric signal of the piezoelectric ceramic I 151 can change with the change of temperature; the heat insulation plate is arranged between the metal block II 172 and the cold plate cover I 11 to realize the heat insulation connection, so as to avoid the heat transmission to the metal block II 172, and further avoid the expansion deformation of the metal block II 172 due to the temperature change.

[0071] The initial contact deformation Δx0 between the metal block I 171 and the piezoelectric ceramic I 151 and between the metal block II 172 and the piezoelectric ceramic II 152 in the static and initial temperature state can be set to generate the voltage V0 of the corresponding piezoelectric ceramic. When the cold plate structure starts to work and the functional chip 10 starts to generate heat, the deformation amount of the metal block I 171 is Δx1, the metal block II 172 is insulated from the cold plate cover I 11 and will not deform due to temperature, and the deformation amount is still Δx0. The actual deformation amount of the metal block I 171 due to temperature is Δx1-Δx0, the voltage generated by the piezoelectric ceramic when Δx0 deforms is V0, and the voltage generated by the piezoelectric ceramic when Δx1 deforms is V1. The deformation amount and the voltage generated by the piezoelectric ceramic have a corresponding relationship, which can be stored in the storage module in advance. The temperature control module receives the voltages generated by the two piezoelectric ceramics and calculates the difference, which is the voltage value corresponding to the deformation amount due to temperature, and then converts the calculated voltage into the voltage required by the environmental control system and adjusts the flow of the corresponding carrier to cool the case and the cold plate structure.

[0072] When the cold plate structure is vibrated under the above temperature condition (i.e. the metal block I 171 expands by Δx1), the positions of the metal block I 171 and the metal block II 172 are close to each other, and the vibration deformation of the piezoelectric ceramics on the PCB at the corresponding positions is consistent or has a small difference, which can be uniformly set as Δx2. At this time, the total deformation of the metal block I 171 and the piezoelectric ceramics I 151 is Δx1±Δx2 (the sum of the deformation caused by temperature and the deformation caused by vibration), the piezoelectric ceramics I 151 correspondingly generates a voltage V3, and the total deformation of the metal block II 172 and the piezoelectric ceramics II 152 is Δx0±Δx2 (the deformation caused by vibration), the piezoelectric ceramics II 152 correspondingly generates a voltage V4. Because the difference between the deformations of the metal block I 171 and the metal block II 172 is (Δx1±Δx2)-(Δx0±Δx2)=Δx1-Δx0 (the deformation caused by vibration is removed), therefore, the temperature control module 15 receives the voltages generated by the two piezoelectric ceramics and calculates the difference, the difference between the voltage V3 and the voltage V4 remains unchanged compared with the difference when there is no vibration, which can make the output of the temperature control module remain unchanged and not be affected by vibration, and can improve the false signal output caused by the structural deformation factor, and then convert the voltage into the voltage required by the control system and adjust the flow of the corresponding carrier to dissipate heat from the case and the cold plate structure, thereby realizing the dynamic compensation function.

[0073] When the cold plate structure is working, the heat of the functional chip 10 is transmitted to the cold plate cover I 11 through the thermal conductive rubber pad 18, the temperature of the metal block I 171 rises to generate deformation, the deformation of the metal block I 171 acts on the piezoelectric ceramics I 151, the piezoelectric effect of the piezoelectric ceramics I 151 generates an electric signal (voltage or current), the electric signal is processed and amplified by the temperature control module to form a suitable control voltage, and the control voltage is transmitted to the control system through the PCB 8, the module connector 9, the back plate connector, the back plate assembly, the case connector and the cable, the control system controls the flow of the cooling air distributed by the carrier, further changes the temperature of the case and the cold plate structure, and realizes heat dissipation of the functional chip 10. The temperature control module corrects the electric signal generated by the piezoelectric ceramics I 151 under the vibration condition by receiving the electric signal generated by the piezoelectric ceramics II 152, and avoids the influence of vibration on the accuracy of the electric signal.

[0074] A plurality of cold plate structures 7 can be installed in the case shell 4, and a heat dissipation control module is arranged on the back plate assembly 6. The heat dissipation control module receives the electric signals output by the temperature control modules of the plurality of cold plate structures 7 and selects the largest electric signal (corresponding to the highest temperature) to send to the control system. The control system distributes the flow to the carrier 1 according to the largest electric signal, so as to ensure that the flow can meet the refrigeration demand.

[0075] The environmental control system can provide cooling air for multiple carriers 1, and the environmental control system is communicated with each carrier 1 through corresponding pipelines. The carrier 1 is a carrier in the prior art, which will not be described here. The bottom of the carrier 1 is provided with a carrier air inlet 2, and the pipeline is connected with the carrier air inlet 2. The valve is arranged on the pipeline between the environmental control system and the carrier 1. The environmental control system controls the opening degree of the valve according to the received environmental control voltage, and adjusts the speed of the cooling air supply as needed, so as to realize the adjustment of the cooling air flow supplied to the carrier 1 according to the temperature of the functional chip 10.

[0076] The case 3 is placed on the carrier 1, and the carrier air inlet 2 is located below the case 3. The case 3 can be a closed case, the cold plate shell of the cold plate structure 7 is in contact with the case shell 4 to realize heat transfer, and the outer wall of the case shell 4 is provided with cooling fins. The cooling air enters the carrier 1 from the carrier air inlet 2 and blows to the case shell 4, so as to realize the cooling of the case shell 4. The heat can be guided from the functional chip 10 to the cold plate shell and the case shell 4 to realize the cooling of the functional chip 10. In this case, the cooling fins can not be arranged on the cold plate shell 7. In the closed case, the functional chip 10 generates heat, and the heat passes through the heat dissipation path structure composed of the functional chip 10, the heat-conducting rubber pad 18, the heat dissipation boss 16, the cold plate shell and the case shell in turn. The cooling air carries away the heat through the case shell in the heat dissipation path structure.

[0077] The case 3 can also be an open case, and the case shell 4 is provided with a case air inlet and a case air outlet. The air ducts communicated with the case air inlet and the case air outlet are arranged between the case shell 4 and the cold plate structure 7 and between the cold plate structures 7. Cooling fins can be arranged on the outer wall of the cold plate shell. The case air inlet of the case shell 4 is docked with the carrier air inlet 2 on the carrier 1, and the cooling air can enter the case shell 4 and directly dissipate heat to the cold plate structure 7 when passing through the air duct, and then the hot air is discharged from the case air outlet of the case shell 4. When it is an open case, the cold plate shell does not need to be in thermal connection with the case shell 4. In the open case, since the cooling air can enter the case shell and directly dissipate heat to the cold plate shell, after the functional chip 10 generates heat, the heat can pass through the heat dissipation path structure composed of the functional chip 10, the heat-conducting rubber pad 18, the heat dissipation boss 16 and the cold plate shell in turn. In order to increase the heat dissipation area, the cold plate shell can also be in thermal connection with the case shell. The cooling air dissipates heat to the case shell at the same time, and the heat dissipation path structure is extended to the case shell.

[0078] The back plate assembly 6 is arranged in the rear end of the case shell 4, and the back plate assembly 6 is provided with a back plate connector. The module connector 9 on the cold plate structure 7 is inserted into the back plate connector, so that the cold plate structure 7 and the back plate assembly 6 are electrically connected. The rear end of the case shell 4 is provided with a case connector 5, and the case connector 5 realizes electrical connection between the inside and outside of the case. In the embodiment, the case connector is an S6 connector. The back plate assembly 6 and the case connector 5 can be electrically connected through a cable or a rigid-flex printed board. The case connector 5 is electrically connected to the environmental control system through a cable. Connectors can be arranged at both ends of the cable and are inserted into the connectors on the case connector and the flow regulating device in the environmental control system.

[0079] The application provides an environmental control bracket assembly system with a temperature control function. The system can automatically adjust the cooling air flow of the bracket 1 and the case 3 distributed by the environmental control system according to the temperature of the functional chip 10, does not depend on a traditional temperature sensor, solves the installation and arrangement problems of the temperature sensor, improves the reliability and miniaturization design of the system, effectively controls the temperature rise of the cold plate structure (a board card), and effectively improves the reliability of the heat dissipation of the electronic equipment and reduces the debugging workload of the equipment.

[0080] In other embodiments, improvements are made on the basis of the above-mentioned embodiments, such as Figure 13 As shown in the figure, in the embodiment, the cold plate structure 7 can not be provided with a metal block, a piezoelectric ceramic, and a temperature control module, and a temperature control device is arranged on the outer wall of the case shell. In the embodiment, the case is a closed case, and the cold plate shell is in thermal conductive connection with the case shell. The temperature control device includes a temperature control device shell 19, and the temperature control device shell 19 is attached to the case shell 4 to realize thermal conductive connection. In order to accurately measure the temperature of the case, the temperature control device is arranged at a position far from the air inlet 2 of the bracket 1 on the case shell 4. A metal block I 171 and a metal block II 172 (cross-sectional views are not shown) are arranged on the inner wall of the temperature control device shell 19, the metal block I 171 is in thermal conductive connection with the temperature control device shell 19, and a heat insulation plate is arranged between the metal block II 172 and the temperature control device shell 19. Figure 13 A temperature control PCB 20 is arranged in the temperature control device shell 19, and the temperature control PCB 20 is provided with a temperature control module 21, a piezoelectric ceramic I 151 in contact with the metal block I 171, and a piezoelectric ceramic II 152 in contact with the metal block II 172. Figure 13The cross-sectional view of the cold plate structure 7 is not shown). The heat of the functional chip 10 in the cold plate structure 7 is transmitted to the temperature control device shell 19 through the heat-conducting rubber pad 18, the heat dissipation boss 16, the cold plate shell, the case shell 4 in turn, so that the metal block I 171 expands and deforms, and the electric signal generated by the piezoelectric ceramic I 151 is processed by the temperature control module 21 and transmitted to the environmental control system. In this embodiment, the temperature control device can be directly connected with the flow regulating equipment of the environmental control system through a cable. In this embodiment, since the temperature control device needs to obtain the heat of the functional chip 10, it is necessary to expand the heat dissipation path structure to the case shell, that is, to form a heat dissipation path structure composed of the functional chip 10, the heat-conducting rubber pad 18, the heat dissipation boss 16, the cold plate shell, the case shell and the temperature control device shell. The temperature control device of this embodiment can improve the existing system, and directly set the temperature control device on the outer wall of the case and electrically connect with the environmental control system, so as to control the flow of cooling air and facilitate the modification of the existing system.

[0081] In other embodiments, the outer side wall of the cold plate cover II 12 is provided with heat dissipation teeth, or the outer side wall of the cold plate cover I 11 and the cold plate cover II 12 are both provided with heat dissipation teeth 111.

[0082] In other embodiments, in order to accurately measure the temperature of each functional chip 10, a metal block I 171 and a metal block II 172 (the metal block is close to the corresponding functional chip 10) can be arranged on each heat dissipation boss 16, and each metal block is correspondingly provided with a piezoelectric ceramic. The heat generated by the functional chip 10 is absorbed by the nearest metal block, and the expansion of the metal block causes the corresponding piezoelectric ceramic to generate an electric signal. Since the heat transfer path is short, the metal block can accurately deform according to the heat generated by the functional chip 10, and the piezoelectric ceramic can accurately generate an electric signal according to the heat generated by the functional chip 10. The electric signals generated by the piezoelectric ceramics on the same PCB are transmitted to the temperature control module on the PCB, and the temperature control module selects the highest value for processing and sends it to the environmental control system.

[0083] In other embodiments, the cold plate structure is provided with two or more groups of metal blocks (including the metal block I 171 and the metal block II 172) and piezoelectric ceramics (including the piezoelectric ceramic I 151 and the piezoelectric ceramic II 152), which are not limited to the number and position of the functional chip 10, and are used to monitor the temperature at multiple positions in the cold plate structure. The temperature control module on the PCB 8 outputs an electric signal corresponding to the maximum deformation (i.e. the highest temperature) to the environmental control system.

[0084] In other embodiments, the metal block II 172 can be replaced by a plastic block or other forms of heat-insulating blocks that are thermally insulated from the shell of the cold plate structure.

[0085] In other embodiments, the piezoelectric ceramic can be replaced by a pressure sensor, the metal block I 171 contacts the pressure sensor I, and the metal block II 172 contacts the pressure sensor II.

[0086] While embodiments of the application have been shown and described, it is to be understood that the application is not limited to these embodiments. Rather, it is the intention that modifications, changes, substitutions, and variations be made to the embodiments without departing from the spirit and scope of the application, which is defined solely by the claims and their equivalents.

Claims

1. An environmental control bracket assembly system with a temperature control function, comprising a bracket (1), a chassis (3) arranged on the bracket (1), a bracket air inlet (2) facing the chassis (3) being arranged on the bracket (1), and the bracket air inlet (2) being connected to the environmental control system via a pipeline; the chassis (3) comprising a chassis shell (4), a cold plate structure (7) being arranged in the chassis shell (4), the cold plate structure (7) comprising a cold plate shell and a PCB board (8) arranged in the cold plate shell, characterized in that: The functional chip (10) is arranged on the PCB (8), a metal block I (171) is arranged on a heat dissipation path structure of the functional chip (10), the metal block I (171) is in heat conduction connection with the heat dissipation path structure, the metal block I (171) is in contact with a piezoelectric ceramic I (151) or a pressure sensor I, the piezoelectric ceramic I (151) or the pressure sensor I is in electrical connection with a temperature control module, and the temperature control module is in electrical connection with an environmental control system.

2. The environmental control cradle assembly system with temperature control function according to claim 1, wherein: An insulating block is further arranged on the heat dissipation path structure and is in heat insulation connection with the heat dissipation path structure, the insulating block is in contact with a piezoelectric ceramic II (152) or a pressure sensor II, the piezoelectric ceramic II (152) or the pressure sensor II is in electrical connection with the temperature control module, the metal block I (171) and the insulating block are arranged in groups, the distance between the metal block I (171) and the insulating block in the same group on the heat dissipation path structure is close, so that the metal block I (171), the insulating block and the corresponding piezoelectric ceramic or pressure sensor have equal or similar deformation under vibration conditions.

3. The temperature-controlled environment cradle assembly system of claim 2, wherein: The system has a dynamic compensation function, the initial contact deformation between the metal block I (171) and the piezoelectric ceramic I (151) or the pressure sensor I and the initial contact deformation between the insulating block and the piezoelectric ceramic II (152) or the pressure sensor II in a static state and an initial temperature state are set as Δx0, the deformation causes the corresponding piezoelectric ceramic or pressure sensor to generate a voltage V0; the functional chip (10) generates heat, the deformation of the metal block I (171) is Δx1, the actual deformation of the metal block I (171) caused by temperature is Δx1-Δx0, the voltage generated by the piezoelectric ceramic I (171) or the pressure sensor I when Δx1 deforms is V1, the temperature control module receives the voltage V0 and the voltage V1 and calculates and outputs an environmental control voltage in a static state; When the system vibrates, the deformation of the piezoelectric ceramic or pressure sensor corresponding to the metal block I (171) and the insulating block due to vibration is set as Δx2, the total deformation of the metal block I (171) and the corresponding piezoelectric ceramic I or pressure sensor I is Δx1±Δx2, the voltage corresponding to the piezoelectric ceramic I (151) or the pressure sensor I is V3, the total deformation of the insulating block and the corresponding piezoelectric ceramic II or pressure sensor II is Δx0±Δx2, the voltage corresponding to the piezoelectric ceramic II (152) or the pressure sensor is V4; the difference between the deformations of the metal block I (171) and the insulating block is (Δx1±Δx2)-(Δx0±Δx2)=Δx1-Δx0, correspondingly, the difference between the voltage V3 and the voltage V4 remains unchanged, so that the voltage output by the temperature control module remains unchanged to realize the dynamic compensation function.

4. The temperature-controlled environment cradle assembly system of claim 2 or 3, wherein: The heat dissipation path structure comprises the functional chip (10), a cold plate shell arranged in sequence in heat conduction connection, the inner wall of the cold plate shell is provided with the metal block I (171) and the insulating block, and the piezoelectric ceramic I (151) or the pressure sensor I, the piezoelectric ceramic II (152) or the pressure sensor II and the temperature control module are integrally arranged on the PCB.

5. The temperature-controlled environment cradle assembly system of claim 4, wherein: The inner wall of the cold plate shell is provided with a heat dissipation boss (16), and the functional chip (10) is in heat conduction connection with the heat dissipation boss (16) through a heat conduction adhesive pad (18).

6. The environmental control bracket assembly system with temperature control function according to claim 5, characterized in that: The metal block I (171) and the heat insulation block are arranged on the heat dissipation boss (16).

7. The temperature-controlled environment system of claim 4, wherein: The PCB (8) is provided with a module connector (9) extending out of the cold plate shell, the cabinet shell (4) is provided with a back plate assembly (6), the back plate assembly (6) is provided with a back plate connector matched with the module connector (9), the cabinet shell (4) is provided with a cabinet connector (5) electrically connected with the back plate assembly (6), and the cabinet connector (5) is electrically connected with the environmental control system through a cable.

8. The temperature-controlled environment system of claim 4, wherein: The cabinet is an open cabinet, the outer wall of the cold plate shell is provided with heat dissipation teeth (111), the cabinet shell (4) is provided with a cabinet air inlet and a cabinet air outlet communicated with the bracket air inlet (2), and the air duct communicated with the cabinet air inlet and the cabinet air outlet at both ends is formed between the inner wall of the cabinet shell and the cold plate structure (7) and between adjacent cold plate structures (7).

9. The temperature-controlled environment system of claim 4, wherein: The cabinet is a closed cabinet, the cold plate shell is in heat conduction connection with the cabinet shell, and the outer wall of the cabinet shell is provided with heat dissipation teeth.

10. The temperature-controlled environment system of claim 2 or 3, wherein: The heat dissipation path structure comprises a functional chip (10), a cold plate shell and a cabinet shell (4) connected in sequence, the outer wall of the cabinet shell (4) is provided with a temperature control device, the temperature control device comprises a temperature control device shell (19) in heat conduction connection with the cabinet shell (4), the inner wall of the temperature control device shell (19) is provided with a metal block I (171) and a heat insulation block, the metal block I (171) is in heat conduction connection with the temperature control device shell (19), the heat insulation block is in heat insulation connection with the temperature control device shell (19), and the temperature control device shell (19) is provided with a piezoelectric ceramic I (151) or a pressure sensor I, a piezoelectric ceramic II (152) or a pressure sensor II and a temperature control module (21).

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