Electronic device and manufacturing method thereof

Abstract

The invention discloses electronic equipment and a manufacturing method thereof, and belongs to the technical field of display. The electronic equipment comprises a frame body, a display panel, a first colloid part, a welding part and a plurality of first functional film layers. The first colloid part and the frame body in the electronic equipment can be welded through the welding part, and the welding part can be a part of the first colloid part. According to the electronic equipment, after one part of the first colloid part is subjected to welding treatment, one part of the first colloid part can be converted into the welding part, so that the first colloid part and the frame body in the electronic equipment can be connected more firmly, and the reliability of the electronic equipment can be further improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to an electronic device and a manufacturing method thereof. BACKGROUND

[0002] With the development of display technology, the demand and application range of electronic devices are continuously expanding. Common electronic devices include mobile phones, televisions, tablet computers, notebook computers and displays, etc.

[0003] An electronic device usually includes a display module and a frame (also commonly referred to as a middle frame). The frame can protect the display module from the side.

[0004] However, after the electronic device falls or is impacted, the display module and the frame are prone to separation, so that the display panel in the display module is prone to damage after the display module is pulled out of the frame, thereby resulting in low reliability of the electronic device. SUMMARY

[0005] Embodiments of the present application provide an electronic device and a manufacturing method thereof. The technical solution can solve the problem of low reliability of the electronic device, and is as follows:

[0006] In one aspect, an electronic device is provided, comprising:

[0007] a frame, and a display panel, a first adhesive portion and a plurality of first functional film layers located in the frame;

[0008] The display panel includes a first panel portion and a second panel portion arranged opposite to each other, and a panel bending portion for connecting the first panel portion and the second panel portion, the first panel portion having a display area;

[0009] The plurality of first functional film layers are stacked between the first panel portion and the second panel portion;

[0010] The first adhesive portion is located on a side of the panel bending portion away from the plurality of first functional film layers, and the first adhesive portion covers at least the side of the panel bending portion away from the plurality of first functional film layers;

[0011] The first adhesive portion and the frame are welded by a welding portion, and the welding portion is a part of the first adhesive portion.

[0012] Optionally, the frame includes a ring-shaped side plate and a bottom plate fixedly connected with the ring-shaped side plate, the ring-shaped side plate and the bottom plate are used to enclose an installation space, and at least part of the display panel, the first adhesive portion and the plurality of first functional film layers are located in the installation space.

[0013] The welding part includes a first welding part for welding the first gel part and the bottom plate.

[0014] Optionally, the first gel part has a plurality of first protruding parts arranged in an array on the side facing the bottom plate, and the plurality of first protruding parts are used to form a plurality of first welding parts corresponding to the plurality of first protruding parts after the welding process.

[0015] Optionally, at least part of the plurality of first welding parts are connected.

[0016] Optionally, the bottom plate has a plurality of openings corresponding to the plurality of first welding parts, and each of the first welding parts is used to pass through the corresponding opening and is welded to the side of the bottom plate away from the first gel part.

[0017] Optionally, the side of the bottom plate away from the first gel part also has a plurality of accommodation grooves, the plurality of accommodation grooves are in communication with the plurality of openings one by one, and the plurality of accommodation grooves correspond to the plurality of first welding parts one by one, and at least part of each of the first welding parts is fixed in the corresponding accommodation groove.

[0018] Optionally, the accommodation groove has a first opening in communication with the opening at one end facing the first welding part, and has a second opening at one end away from the first welding part.

[0019] Wherein, the opening area of the first opening is smaller than the opening area of the second opening.

[0020] Optionally, the side of the first gel part facing the bottom plate also has a plurality of connecting parts, the plurality of connecting parts correspond to the plurality of first welding parts one by one, and the plurality of connecting parts correspond to the plurality of openings one by one, and at least part of each of the connecting parts is located in the corresponding opening.

[0021] Optionally, the side of the first gel part facing the bottom plate also has a plurality of annular avoidance grooves corresponding to the plurality of connecting parts one by one, part of each of the connecting parts is located in the corresponding annular avoidance groove, and another part of each of the connecting parts is located in the corresponding opening.

[0022] Optionally, the welding part includes a second welding part for welding the first gel part and the annular side plate.

[0023] Optionally, the first gel part has a plurality of second protruding parts arranged in an array on the side facing the side plate, and the plurality of second protruding parts are used to form a plurality of second welding parts corresponding to the plurality of second protruding parts after the welding process.

[0024] Optionally, the first glue part has a first inclined surface on a side facing the side plate, and the annular side plate has a second inclined surface on a side facing the first glue part, the second inclined surface being parallel to the first inclined surface.

[0025] The plurality of second welding parts are located between the first inclined surface and the second inclined surface.

[0026] In another aspect, a manufacturing method of an electronic device is provided, the method comprising:

[0027] A plurality of first functional film layers are formed between a first panel part and a second panel part in a display panel, the display panel comprising: the first panel part and the second panel part arranged oppositely, and a panel bending part for connecting the first panel part and the second panel part, the first panel part having a display area;

[0028] A first glue part is formed on a side of the panel bending part facing away from the plurality of first functional film layers, the first glue part covering at least the side of the panel bending part facing away from the plurality of first functional film layers;

[0029] The display panel, the plurality of first functional film layers, and the first glue part are assembled in a frame;

[0030] A portion of the first glue part is subjected to a welding process to form a welding part for welding the first glue part and the frame.

[0031] Optionally, the frame comprises an annular side plate and a bottom plate fixedly connected to the annular side plate, and the first glue part has a plurality of first protruding parts arranged in an array on a side facing the bottom plate;

[0032] The portion of the first glue part is subjected to the welding process to form the welding part for welding the first glue part and the frame, comprising:

[0033] The plurality of first protruding parts are subjected to the welding process to form a plurality of first welding parts corresponding to the plurality of first protruding parts one by one, the first welding parts being used for welding the first glue part and the bottom plate.

[0034] Optionally, the frame comprises an annular side plate and a bottom plate fixedly connected to the annular side plate, and the first glue part has a plurality of first protruding parts arranged in an array on a side facing the bottom plate, and the bottom plate has a plurality of openings corresponding to the plurality of first protruding parts one by one.

[0035] The portion of the first glue part is subjected to the welding process to form the welding part for welding the first glue part and the frame, comprising:

[0036] After the plurality of first protrusions extend through the plurality of openings respectively, portions of the plurality of first protrusions extending from the corresponding openings are welded to form a plurality of first welding portions corresponding one-to-one to the plurality of first protrusions, each of the first welding portions being used for welding to a side of the bottom plate facing away from the first colloid portion.

[0037] Optionally, the frame includes: an annular side plate, and a bottom plate fixedly connected to the annular side plate; the first colloid portion has a plurality of first protrusions arranged in an array on a side facing the bottom plate; the bottom plate has a plurality of openings corresponding one-to-one to the plurality of first protrusions, and a plurality of receiving grooves corresponding one-to-one to the plurality of openings, wherein the openings are closer to the first colloid portion than to the receiving grooves;

[0038] Performing welding processing on a portion of the first colloid part to form a welding portion for welding the first colloid part and the frame, comprising:

[0039] After the plurality of first protrusions extend into the plurality of receiving grooves through the plurality of openings respectively, portions of the plurality of first protrusions distributed in the corresponding receiving grooves are welded to form a plurality of first welding portions corresponding one-to-one to the plurality of first protrusions, each of the first welding portions being used to weld to a side of the bottom plate facing away from the first colloid portion in the corresponding receiving groove.

[0040] Optionally, the frame includes: an annular side plate, and a bottom plate fixedly connected to the annular side plate; the first colloid portion has a plurality of first protrusions arranged in an array on a side facing the bottom plate, and the first colloid portion has a plurality of second protrusions arranged in an array on a side facing the side plate;

[0041] Performing welding processing on a portion of the first colloid part to form a welding portion for welding the first colloid part and the frame, comprising:

[0042] The plurality of first protrusions and the plurality of second protrusions are welded to form a plurality of first welding portions corresponding one-to-one to the plurality of first protrusions, and a plurality of second welding portions corresponding one-to-one to the plurality of second protrusions, wherein the first welding portions are used to weld the first colloid portion and the bottom plate, and the second welding portions are used to weld the first colloid portion and the annular side plate.

[0043] The beneficial effects of the technical solutions provided in the embodiments of the present application include at least:

[0044] An electronic device includes a frame, a display panel, a first gel part, a welding part, and a plurality of first functional film layers. The first gel part in the electronic device and the frame can be welded through the welding part, and the welding part can be part of the first gel part. Here, after part of the first gel part is subjected to a welding process, the part of the first gel part can be converted into the welding part to ensure that the first gel part in the electronic device and the frame can be more firmly connected, thereby improving the reliability of the electronic device. BRIEF DESCRIPTION OF DRAWINGS

[0045] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0046] Figure 1 is a structural schematic diagram of an electronic device provided by an embodiment of the present application;

[0047] Figure 2 is a structural schematic diagram of another electronic device provided by an embodiment of the present application;

[0048] Figure 3 is a structural schematic diagram of still another electronic device provided by an embodiment of the present application;

[0049] Figure 4 is a structural schematic diagram of a display module provided by an embodiment of the present application;

[0050] Figure 5 is a bottom view of a first gel part provided by an embodiment of the present application;

[0051] Figure 6 is a structural schematic diagram of an electronic device obtained after a display module and a frame are assembled, as shown in Figure 4

[0052] Figure 7 is a schematic diagram of a display module and a frame after assembly, provided by an embodiment of the present application;

[0053] Figure 8 is a structural schematic diagram of an electronic device composed of a display module and a frame after assembly, as shown in Figure 7

[0054] Figure 9 is another schematic diagram of a display module and a frame after assembly, provided by an embodiment of the present application;

[0055] Figure 10 is a structural schematic diagram of an electronic device composed of a display module and a frame after assembly, as shown in Figure 9 ​​A structural schematic diagram of an electronic device obtained after the display module and the frame body are assembled.

[0056] Figure 11 A structural schematic diagram of another display module provided by an embodiment of the present application.

[0057] Figure 12 A structural schematic diagram of an electronic device obtained after the display module and the frame body are assembled. Figure 11

[0058] A structural schematic diagram of another electronic device provided by an embodiment of the present application. Figure 13

[0059] A flowchart of a manufacturing method of an electronic device provided by an embodiment of the present application. Figure 14 DETAILED DESCRIPTION

[0060] To make the purpose, technical solutions and advantages of the present application clearer, the embodiments of the present application will be further described in detail below with reference to the drawings.

[0061] An electronic device provided by an embodiment of the present application can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, an advertising machine, a display screen, a digital photo frame, a vehicle-mounted terminal, etc. Figure 1 Figure 1 A structural schematic diagram of an electronic device provided by an embodiment of the present application. The electronic device 000 can include a frame body 100, a display panel 200, a first gel part 300, a welding part 400 and a plurality of first functional film layers 500.

[0062] The display panel 200 in the electronic device 000 can be located in the frame body 100. The display panel 200 in the electronic device 000 can include a first panel part 201 and a second panel part 202 arranged oppositely, and a panel bending part 203 for connecting the first panel part 201 and the second panel part 202. That is, the panel bending part 203 can be located between the first panel part 201 and the second panel part 202, one side of the panel bending part 203 can be connected with the first panel part 201, and the other side of the panel bending part 203 can be connected with the second panel part 202. Here, the first panel part 201 in the display panel 200 in the electronic device 000 can have a display area.

[0063] The plurality of first functional film layers 500 in the electronic device 000 can be arranged in layers between the first panel part 201 and the second panel part 202 in the display panel 200.

[0064] ​​The first gel body 300 in the electronic device 000 can be located on the side of the panel bending portion 203 in the display panel 200 away from the plurality of first functional film layers 500, and the first gel body 300 can cover at least the side of the panel bending portion 203 away from the plurality of first functional film layers 500. The panel bending portion 203 can be encapsulated and protected from the side of the panel bending portion 203 away from the first gel body 300 by the first gel body 300, so that dust and moisture in the external environment are less likely to enter the panel bending portion 203 in the display panel 200, further improving the reliability of the electronic device 000.

[0065] In the present application, the first gel body 300 in the electronic device 000 and the frame 100 can be welded by the welding portion 400, wherein the welding portion 400 can be a part of the first gel body 300. Here, after a part of the first gel body 300 is subjected to welding treatment, the part of the first gel body 300 can be converted into the welding portion 400. In this case, the welding effect between the first gel body 300 in the electronic device 000 and the frame 100 can be ensured to be good, so that the first gel body 300 in the electronic device 000 can be more firmly connected with the frame 100. In this way, even after the electronic device 000 falls or is subjected to impact force, the first gel body 300 can be ensured to be less likely to separate from the frame 100, so that the probability of collision between the display panel 200 and the frame 100 in the electronic device 000 can be ensured to be low, thereby improving the reliability of the electronic device 000.

[0066] In summary, the electronic device provided by the embodiments of the present application includes a frame, a display panel, a first gel body, a welding portion, and a plurality of first functional film layers. The first gel body in the electronic device and the frame can be welded by the welding portion, and the welding portion can be a part of the first gel body. Here, after a part of the first gel body is subjected to welding treatment, the part of the first gel body can be converted into the welding portion. In this case, the welding effect between the first gel body in the electronic device and the frame can be ensured to be better, so that the first gel body in the electronic device can be more firmly connected with the frame. In this way, even after the electronic device falls or is subjected to impact force, the first gel body can be ensured to be less likely to separate from the frame, so that the probability of collision between the display panel and the frame in the electronic device can be ensured to be low, thereby improving the reliability of the electronic device.

[0067] In the embodiments of the present application, please refer to Figure 2 , Figure 2 is a structural schematic diagram of another electronic device provided by the embodiments of the present application. The electronic device 000 can further include a protective cover plate 800 and a plurality of second functional film layers 600 located between the protective cover plate 800 and the first panel portion 201.

[0068] The protective cover plate 800 in the electronic device 000 can have a protruding portion 800a protruding from a side of the first panel portion 201 toward the panel bending portion 203, and the protruding portion 800a in the protective cover plate 800 can cover the panel bending portion 203. In this way, the panel bending portion 203 can be protected from the front by the protruding portion 800a in the protective cover plate 800, so that the protruding portion 800a in the protective cover plate 800 can bear the impact force after the front of the panel bending portion 203 is impacted, so as to reduce the probability of the panel bending portion 203 being broken.

[0069] The protruding portion 800a in the protective cover plate 800 can be attached to the first adhesive portion 300. In this way, if the front of the panel bending portion 203 is impacted, the first adhesive portion 300 can buffer the impact force because the protruding portion 800a in the protective cover plate 800 is attached to the first adhesive portion 300, thereby further strengthening the protection of the panel bending portion 203.

[0070] The side of the plurality of second functional film layers 600 in the electronic device 000 can be attached to the first adhesive portion 300. In this way, the plurality of second functional film layers 600 can be protected from the side by the first adhesive portion 300, so as to prevent the plurality of second functional film layers 600 from being damaged.

[0071] Here, at least part of the side of the second panel portion 202 away from the first panel portion 201 in the display panel 200 can also be attached to the first adhesive portion 300. In this way, the second panel portion 202 can be protected by the first adhesive portion 300, so as to prevent the second panel portion 202 from being damaged.

[0072] In the present application, as shown in Figure 2 The electronic device 000 can further include a second adhesive portion 700. The side of the plurality of first functional film layers 500 toward the panel bending portion 203 and the panel bending portion 203 can be used to enclose a containing space, and the second adhesive portion 700 can be located in the containing space. In this way, the strength of the panel bending portion 203 in the display panel 200 can be strengthened by the second adhesive portion 700 located in the containing space, so that the second adhesive portion 700 can protect the panel bending portion 203, so as to prevent the panel bending portion 203 from being damaged.

[0073] In this case, the panel bending portion 203 in the display panel 200 can be protected through the cooperation of the first gel portion 300 and the second gel portion 700. In this way, even after the electronic device 000 falls or is subjected to an impact force, the probability of the panel bending portion 203 colliding with the frame can be reduced through the first gel portion 300, and the panel bending portion 203 can be prevented from deforming toward the direction of the plurality of first functional film layers 500 through the second gel portion 700. In this way, the panel bending portion 203 in the display module 000 can be prevented from being damaged, and the probability of the display panel 200 exhibiting a poor display can be reduced.

[0074] In the embodiments of the present application, please refer to Figure 3 , Figure 3 is another structural schematic diagram of an electronic device provided by the embodiments of the present application. The frame 100 in the electronic device 000 can include a ring-shaped side plate 101 and a bottom plate 102 fixedly connected to the ring-shaped side plate 101. Here, the bottom plate 102 can be distributed within the area enclosed by the ring-shaped side plate 102, and the bottom plate 102 can be fixedly connected to the inner wall of the area enclosed by the ring-shaped side plate 102. In this way, the ring-shaped side plate 101 and the bottom plate 102 can be used to enclose a mounting space, and at least part of the display panel 200, the first gel portion 300, and the plurality of first functional film layers 500 in the electronic device 000 can be located in the mounting space. In addition, at least part of the second gel portion 700, the protective cover plate 800, and the plurality of second functional film layers 600 in the electronic device 000 can also be located in the mounting space. It should be noted that the part in the electronic device 000 located in the mounting space can be generally referred to as a display module. That is, the display module can include the structures such as the display panel 200, the first gel portion 300, the second gel portion 700, the protective cover plate 800, the plurality of first functional film layers 500, and the plurality of second functional film layers 600 in the above embodiments.

[0075] Among them, the welding portion 400 in the electronic device 000 can include a first welding portion 401 for welding the first gel portion 300 and the bottom plate 102. Here, the first welding portion 401 in the welding portion 400 can be part of the first gel portion 300, and after part of the first gel portion 300 is subjected to a welding process, part of the first gel portion 300 can be converted into the welding portion 400. For example, part of the first gel portion 300 can melt after being subjected to a welding process, and part of the first gel portion 300 can be connected together to form the first welding portion 401. In this way, the first gel portion 300 and the bottom plate 102 in the frame 100 can be welded together through the first welding portion 401. In this way, the connection effect between the first gel portion 300 in the electronic device 000 and the bottom plate 102 in the frame 100 can be better.

[0076] In the embodiments of the present application, refer to Figure 4 and Figure 5 , Figure 4 is a structural schematic diagram of a display module provided by the embodiments of the present application, Figure 5 is a bottom view of a first gel part provided by the embodiments of the present application. The side of the first gel part 300 in the display module facing the bottom plate 102 in the frame 100 can have a plurality of first protruding parts 301 arranged in an array. Wherein, in the direction perpendicular to the bending axis of the panel bending part 203, the distance d1 between two adjacent first protruding parts 301 can be in the range of 10-15 mm.

[0077] In the present application, the plurality of first protruding parts 301 can be used to form a plurality of first welding parts 401 corresponding to the plurality of first protruding parts 301 after welding. Wherein, at least part of the plurality of first welding parts 401 can be connected. In this way, the first gel part 300 and the frame 100 can be stably connected together through the at least partially connected first welding parts 401. For example, as shown in Figure 6 , Figure 6 is a structural schematic diagram of an electronic device obtained after the display module and the frame are assembled, as shown in Figure 4 , among the plurality of first welding parts 401 of the plurality of first protruding parts 301 of the first gel part 300 after welding, two adjacent first welding parts 401 distributed in the direction perpendicular to the bending axis of the panel bending part 203 can be connected, while two adjacent first welding parts 401 distributed in the direction parallel to the bending axis of the panel bending part 203 can be connected or separated, which is not limited by the embodiments of the present application.

[0078] It should be noted that, as Figure 4As shown, the width value W1 of the plurality of first protruding portions 301 in the first gel portion 300 and the height value H1 of the plurality of first protruding portions 301 in the first gel portion 300 can be related to the width value L1 of the first gel portion 300. For example, the width value L1 of the first gel portion 300 can be in a range of 1.2 mm to 2.6 mm, in the case that the number of the first protruding portions 301 is one, the width value W1 of the first protruding portion 301 can be in a range of L1 / 8 to L1 / 4, and the height value H1 of the first protruding portion 301 can be in a range of L1 / 8 to L1 / 2; in the case that the number of the first protruding portions 301 is two or more, the width value W1 of the first protruding portion 301 can be reduced by 40% to 60% accordingly, and the height value H1 of the first protruding portion 301 can be reduced by 40% to 60% accordingly. Here, the angle α1 of the first protruding portion 301 can be 45 degrees, 60 degrees, 90 degrees, or 120 degrees, which is not limited in the embodiments of the present application.

[0079] In the present application, please refer to Figure 6 , the plurality of first protruding portions 301 of the first gel portion 300 in the display module can be converted into a plurality of first welding portions 401 corresponding to the plurality of first protruding portions 301 after welding, and each first welding portion 401 can be welded with the bottom plate 102 in the frame 100. For example, the plurality of first protruding portions 301 can be melted after welding, and the plurality of first protruding portions 301 after melting can be tightly welded with the bottom plate 102 in the frame 100, so as to ensure that the first gel portion 300 and the bottom plate 102 in the frame 100 can be firmly welded together through the plurality of first welding portions 401.

[0080] In the embodiments of the present application, first, as shown in Figure 4 , a display module including the display panel 200, the plurality of first functional film layers 500, and the first gel portion 300 can be formed. Then, the formed display module can be assembled in the frame 100 through an assembly process, and the plurality of first protruding portions 301 in the first gel portion 300 can be abutted with the bottom plate 102 in the frame 100. Then, as shown in Figure 6 , the plurality of first protruding portions 301 in the first gel portion 300 can be welded to form the first welding portion 401 for welding the first gel portion 300 and the frame 100, so as to obtain the electronic device 000 provided by the embodiments of the present application.

[0081] In the embodiments of the present application, please refer to Figure 7 and Figure 8 , Figure 7 is a schematic view of a display module and a frame after assembly provided by the embodiments of the present application, Figure 8 isFigure 7 The structure schematic diagram of the electronic device composed of the display module and the frame body after assembly is shown. The bottom plate 102 in the frame body 100 can have a plurality of openings K1 corresponding to a plurality of first welding portions 401, and each first welding portion 401 can be used for welding through the corresponding opening K1 and the side of the bottom plate 102 in the frame body 100 away from the first gel body 300.

[0082] Here, the plurality of openings K1 provided on the bottom plate 102 can also correspond to the plurality of first protruding portions 301 provided on the first gel body 300. After the assembly of the display module and the frame body 100, each first protruding portion 301 provided on the first gel body 300 can protrude from the corresponding opening K1 on the bottom plate 102, and then the part of each first protruding portion 301 protruding from the corresponding opening K1 is subjected to a welding process and is melted, and the part of the first protruding portion 301 protruding from the corresponding opening K1 is melted to form the first welding portion 401, and the first welding portion 401 can be tightly welded to the side of the bottom plate 102 away from the first gel body 300. In this way, the structure of the first welding portion 401 used for welding the bottom plate 102 and the first gel body 300 is similar to the mortise and tenon structure, and the first welding portion 401 can more firmly weld the first gel body 300 and the bottom plate 102 in the frame body 100 together.

[0083] Optionally, please refer to Figure 9 and Figure 10 , Figure 9 is another schematic diagram of the display module and the frame body after assembly provided by the embodiment of the present application, Figure 10 is Figure 9 The structure schematic diagram of the electronic device composed of the display module and the frame body after assembly is shown. The side of the bottom plate 102 in the frame body 100 away from the first gel body 300 can also have a plurality of accommodating grooves U1, the plurality of accommodating grooves U1 can be in communication with the plurality of openings K1 in one-to-one correspondence, and the plurality of accommodating grooves U1 can correspond to the plurality of first welding portions 401, and at least part of each first welding portion 401 can be fixed in the corresponding accommodating groove U1.

[0084] Here, after the assembly of the display module and the frame body 100, each first protruding portion 301 provided on the first gel body 300 can protrude from the corresponding opening K1 on the bottom plate 102, and then the part of each first protruding portion 301 protruding from the corresponding opening K1 is subjected to a welding process and is melted, and the part of the first protruding portion 301 protruding from the corresponding opening K1 is melted to form the first welding portion 401, and at least part of the first welding portion 401 can be fixed in the corresponding accommodating groove U1. In this way, the first welding portion 401 can firmly weld the first gel body 300 and the bottom plate 102 in the frame body 100 together.

[0085] In the present application, as shown in Figure 9 and Figure 10 , the accommodating groove U1 of the bottom plate 102 in the frame body 100 has a first opening communicating with the opening K1 at one end thereof facing the first welding portion 401, and has a second opening at the other end thereof away from the first welding portion 401. Among them, the opening area of the first opening can be smaller than the opening area of the second opening. In this way, the first welding portion 401 can be fixed in the accommodating groove U1 as much as possible, so that the welding area of the first welding portion 401 and the accommodating groove U1 is larger, and thus the firmness of the welding between the first gel portion 300 and the bottom plate 102 in the frame body 100 through the first welding portion 401 can be ensured.

[0086] In the embodiments of the present application, as shown in Figure 8 and Figure 10 , the electronic device 000 can further include a functional element 900 and a protective cover 1000.

[0087] The functional element 900 in the electronic device 000 can be located on the side of the bottom plate 102 in the frame body 100 away from the first gel portion 300. Among them, the functional element 1200 can include a battery and / or a sound, etc.

[0088] The protective cover 1000 in the electronic device 000 can be located on the side of the functional element 900 in the electronic device 000 away from the bottom plate 102 in the frame body 100, and can be connected with the frame body 100. Among them, the functional element 900 in the electronic device 000 can be protected by the protective cover 1000 in the electronic device 000.

[0089] In the embodiments of the present application, as shown in Figure 10 , in the case that the bottom plate 102 has the accommodating groove U1, the first welding portion 401 can be located entirely in the accommodating groove U1, and the first welding portion 401 can not protrude from the side of the bottom plate 102 away from the first gel portion 300. In this way, there is no need to reserve an additional larger space for accommodating the first welding portion 401 between the bottom plate 102 and the protective cover 1000, and thus the space utilization rate between the bottom plate 102 and the protective cover 1000 can be improved, so that a functional element 900 with a larger volume can be accommodated between the bottom plate 102 and the protective cover 1000.

[0090] In the embodiments of the present application, please refer to Figure 8 and Figure 10 , the first gel portion 300 in the electronic device 000 also has a plurality of connecting portions 302 on the side thereof facing the bottom plate 102 in the frame body 100. Here, the part of the first protruding portion 301 protruding from the corresponding opening K1 can form the first welding portion 401 after melting, and the part of the first protruding portion 301 not protruding from the corresponding opening K1 is the connecting portion 302.

[0091] The plurality of connecting portions 302 in the first gel portion 300 can be connected one-to-one with the plurality of first welding portions 401, and the plurality of connecting portions 302 can be one-to-one corresponding to the plurality of openings K1 in the bottom plate 102 in the frame 100. At least part of each connecting portion 302 can be located in the corresponding opening K1. That is, at least part of the connecting portion 302 can be firmly bonded with the inner wall of the corresponding opening K1 in the bottom plate 102 in the frame 100. In this way, the firmness of the connection between the first gel portion 300 and the bottom plate 102 in the frame 100 can be further ensured.

[0092] In the present application, please refer to Figure 7 , Figure 8 , Figure 9 and Figure 10 , the first gel portion 300 in the electronic device 000 has a plurality of annular avoidance grooves U2 corresponding to the plurality of connecting portions 302 on the side facing the bottom plate 102 in the frame 100. Part of each connecting portion 302 can be located in the corresponding annular avoidance groove U2, and another part of each connecting portion 302 can be located in the corresponding opening K1 in the bottom plate 102 in the frame 100. Here, the size of the annular avoidance groove U2 can be larger than the size of the connecting portion 302, and the center line of the annular avoidance groove U2 can coincide with the center line of the connecting portion 302.

[0093] In this case, during the welding process of the part of the first protruding portion 301 extending out of the corresponding opening K1, even if the connecting portion 302 of the first protruding portion 301 located in the opening K1 is partially melted, it can also be ensured that the melted part can flow into the avoidance groove U2, so that the melted connecting portion 302 will not affect the normal assembly of the display module and the frame 100.

[0094] In the embodiments of the present application, please refer to Figure 11 and Figure 12 , Figure 11 is another structural schematic diagram of a display module provided by the embodiments of the present application, Figure 12 is a structural schematic diagram of an electronic device obtained after the display module and the frame shown in Figure 11 are assembled.

[0095] The welding portion 400 in the electronic device 000 can include a second welding portion 402 for welding the first glue portion 300 and the annular side plate 101 in the frame 100. Here, the second welding portion 402 in the welding portion 400 can be a part of the first glue portion 300, and after the part of the first glue portion 300 is subjected to a welding process, the part of the first glue portion 300 can be converted into the second welding portion 402. For example, after the part of the first glue portion 300 is subjected to a welding process, the part of the first glue portion 300 can melt, and the melted part of the first glue portion 300 can be tightly welded with the annular side plate 101 in the frame 100, so as to ensure that the first glue portion 300 and the annular side plate 101 in the frame 100 can be firmly welded together through the second welding portion 402.

[0096] In the present application, as shown in Figure 11 the first glue portion 300 in the electronic device 000 can have a plurality of second protruding portions 303 arranged in an array towards one side of the annular side plate 101 in the frame 100. Among them, the plurality of second protruding portions 303 can be used to form a plurality of second welding portions 402 corresponding to the plurality of second protruding portions 303 one by one after a welding process is performed, and each second welding portion 402 can be welded with the annular side plate 101 in the frame 100. For example, after the plurality of second protruding portions 303 are subjected to a welding process, the plurality of second protruding portions 303 can melt, and the melted plurality of second protruding portions 303 can be tightly welded with the annular side plate 101 in the frame 100, so as to ensure that the first glue portion 300 and the annular side plate 101 in the frame 100 can be firmly welded together through the plurality of second welding portions 402. Here, the width T1 of the first glue portion 300 can be in a range of 1 millimeter to 2 millimeters, and the included angle α2 between the first glue portion 300 and the direction parallel to the bending axis of the panel bending portion 203 can be in a range of 10 degrees to 45 degrees.

[0097] In the present application, first, as shown in Figure 11 a display module including the display panel 200, the plurality of first functional film layers 500, and the first glue portion 300 can be formed. Then, the formed display module can be assembled in the frame 100 through an assembly process, and the plurality of first protruding portions 301 in the first glue portion 300 can be abutted together with the bottom plate 102 in the frame 100, and the plurality of second protruding portions 303 in the first glue portion 300 can be abutted together with the annular side plate 101 in the frame 100. Then, as shown in Figure 12As shown, the plurality of first protrusions 301 and the plurality of second protrusions 303 in the first colloid part 300 can be subjected to a welding process to form the first welding part 401 for welding the first colloid part 300 and the bottom plate 102 in the frame 100, and the second welding part 402 for welding the first colloid part 300 and the annular side plate 101 in the frame 100, so that the electronic device 000 provided in the embodiment of the present application can be obtained.

[0098] In the embodiment of the present application, please refer to Figure 12 , the first colloid part 300 in the electronic device 000 faces the first inclined surface S1 on one side of the annular side plate 101 in the frame 100, and the annular side plate 101 in the frame 100 can include a second inclined surface S2 arranged in parallel with the first inclined surface S1 on the side facing the first colloid part 300. Among them, the plurality of second welding parts 402 can be located between the first inclined surface S1 and the second inclined surface S2.

[0099] In this case, since the plurality of second welding parts 402 can be located between the first inclined surface S1 and the second inclined surface S2, during the preparation of the electronic device 000, if an external force is applied to the electronic device 000 in the first direction A1, the first colloid part 300 and the annular side plate 101 in the frame 100 will be subjected to the extrusion component force of the external force in the direction perpendicular to the first inclined surface S1. In this way, the first colloid part 300 and the annular side plate 101 in the frame 100 can be more firmly welded together.

[0100] It should be noted that the welding process of a part of the first colloid part 300 in the above embodiment refers to ultrasonic welding of a part of the first colloid part 300.

[0101] In the embodiment of the present application, please refer to Figure 13 , Figure 13 is another structure schematic diagram of an electronic device provided in the embodiment of the present application, and the plurality of first functional film layers 500 in the electronic device 000 can include a first support layer 501, a mesh adhesive layer 502, a foam layer 503, a copper foil 504, a first adhesive layer 505, a reinforcing layer 506 and a second support layer 507.

[0102] Among them, the first support layer 501 in the electronic device 000 can be bonded to the back surface of the first panel part 201 (that is, the surface opposite to the front surface of the first panel part 201). The first support layer 501 in the electronic device 000 can be used to support the first panel part 201.

[0103] The grid adhesive layer 502 in the electronic device 000 can be located on the side of the first support layer 501 facing away from the first panel portion 201, and one side of the grid adhesive layer 502 can be bonded to the side of the first support layer 501 facing away from the first panel portion 201. Here, the side of the grid adhesive layer 502 facing away from the first support layer 501 can be bonded to the side of the foam layer 503 facing toward the first panel portion 201.

[0104] The side of the foam layer 503 in the electronic device 000 facing away from the first panel portion 201 can be bonded to the copper foil 504. The side of the copper foil 504 in the electronic device 000 facing away from the first panel portion 201 can be bonded to the first adhesive layer 505. The side of the copper foil 504 facing away from the first panel portion 201 can be bonded to the side of the reinforcing layer 506 facing toward the first panel portion 201 through the first adhesive layer 505. The side of the reinforcing layer 506 facing away from the first panel portion 201 can be bonded to one side of the second support layer 507, and the other side of the second support layer 507 can be bonded to the side of the second panel portion 202 facing toward the first panel portion 201.

[0105] In this application, please refer to Figure 12 The plurality of second functional film layers 600 in the electronic device 000 can include an optical adhesive layer 601 and a circular polarizer 602. The circular polarizer 602 in the electronic device 000 can be bonded to the side of the first panel portion 201 facing toward the protective cover plate 800, and the circular polarizer 602 can reduce the reflectivity of the first panel portion 201 to ambient light, so as to ensure that the display effect of the display area in the first panel portion 201 is good.

[0106] The optical adhesive layer 601 in the electronic device 000 is located between the circular polarizer 602 and the protective cover plate 800, and the optical adhesive layer 601 can be used to bond the protective cover plate 800 and the circular polarizer 602, and the optical adhesive layer 601 is usually made of transparent glue (for example, acrylic glue). In this way, the light emitted by the first panel portion 201 in the display panel 200 can be emitted after passing through the optical adhesive layer 601 and the protective cover plate 800. In addition, the optical adhesive layer 601 also has good buffering performance, so that after the front of the electronic device 000 is impacted, the buffering of the optical adhesive layer 601 can reduce the probability of the protective cover plate 800 being broken.

[0107] In the embodiments of the present application, as shown in Figure 13 The electronic device 000 can further include a protective adhesive layer 1100, a conductive adhesive layer 1200, a flexible circuit board 1300, and a driving chip 1400.

[0108] The protective adhesive layer 1100 in the electronic device 000 can be located on the side of the panel bending portion 203 in the display panel 200 away from the plurality of first functional film layers 500. The protective adhesive layer 1100 in the electronic device 000 can strengthen the strength of the panel bending portion 203 in the display panel 200 to prevent the panel bending portion 203 from being damaged.

[0109] The conductive adhesive layer 1200 in the display module 000 can be located on the side of the copper foil 504 away from the first panel portion 201. The conductive adhesive layer 1200 can be used to prevent static electricity and avoid display abnormalities of the display panel 200 caused by static electricity.

[0110] The flexible circuit board 1300 and the driving chip 1400 in the display module 000 are both bonded to the second panel portion 202, and the flexible circuit board 1300 and the driving chip 1400 are both located on the side of the second panel portion 202 away from the first panel portion 201. It should be noted that the panel bending portion 203 and the second panel portion 202 in the display panel 200 both have signal traces integrated therein. After the flexible circuit board 1300 and the driving chip 1400 are bonded to the second panel portion 202 in the display panel 200, the flexible circuit board 1300 and the driving chip 1400 can be electrically connected to the signal traces, and the signal traces can also be electrically connected to the sub-pixels in the first panel portion 201. In this way, the flexible circuit board 1300 and the driving chip 1400 can send driving signals to the sub-pixels in the first panel portion 201 through the signal traces, so that the sub-pixels in the first panel portion 201 can emit light outward, and thus the first panel portion 201 can display corresponding images.

[0111] In summary, the electronic device provided by the embodiments of the present application includes a frame, a display panel, a first adhesive portion, a welding portion, and a plurality of first functional film layers. The first adhesive portion in the electronic device can be welded to the frame through the welding portion, and the welding portion can be part of the first adhesive portion. Here, part of the first adhesive portion can be converted into the welding portion after being subjected to a welding process. That is, the first adhesive portion and the frame can be welded together through the welding portion. In this case, the connection between the first adhesive portion and the frame in the electronic device can be better, so that the first adhesive portion in the electronic device can be more firmly connected to the frame. In this way, even after the electronic device falls or is subjected to an impact force, the first adhesive portion can be prevented from being separated from the frame, so that the probability of collision between the display panel and the frame in the electronic device can be low, and thus the reliability of the electronic device can be improved.

[0112] The embodiments of the present application also provide a manufacturing method of an electronic device. Please refer to Figure 14 , Figure 14is a flow chart of a manufacturing method of an electronic device provided in the embodiments of the present application. The manufacturing method of the electronic device can be used to manufacture the electronic device shown in Figure 6 、 Figure 8 、 Figure 10 or Figure 12 . The manufacturing method of the electronic device can include:

[0113] Step S101, forming a plurality of first functional film layers arranged in a stack between a first panel portion and a second panel portion in a display panel. The display panel includes the first panel portion and the second panel portion arranged oppositely, and a panel bending portion for connecting the first panel portion and the second panel portion, and the first panel portion has a display area.

[0114] Step S102, forming a first gel portion on a side of the panel bending portion away from the plurality of first functional film layers. The first gel portion covers at least the side of the panel bending portion away from the plurality of first functional film layers.

[0115] In the present application, a low-injection pressure over-molding process can be used to form the first gel portion 300. For example, a lower pressure can be used to inject a packaging material into a mold and form the first gel portion 300 in the embodiments of the present application.

[0116] Step S103, assembling the display panel, the plurality of first functional film layers and the first gel portion in a frame.

[0117] Step S104, performing a welding process on a portion of the first gel portion to form a welding portion for welding the first gel portion and the frame.

[0118] It should be noted that the first gel portion can have different forms of protruding portions, and the forms of the first gel portion after being welded to the frame are different for different forms of protruding portions. Therefore, the embodiments of the present application will be described illustratively by taking four optional implementation manners as examples.

[0119] In a first optional implementation manner, the first gel portion in the electronic device has a plurality of first protruding portions arranged in an array on a side of the first gel portion facing a bottom plate in the frame, that is, the form of the first gel portion can refer to the part shown in Figure 4 . The step S104 of performing a welding process on a portion of the first gel portion to form a welding portion for welding the first gel portion and the frame can include:

[0120] The plurality of first protrusions are subjected to a welding process to form a plurality of first welding portions corresponding to the plurality of first protrusions. Here, each first welding portion can be used to weld the first gel body portion and the bottom plate.

[0121] For example, after the welding process, the plurality of first protrusions can be melted, and the plurality of first protrusions after melting can be tightly welded to the bottom plate in the frame body to ensure that the first gel body portion and the bottom plate in the frame body can be firmly welded together through the plurality of first welding portions. Here, after the first gel body portion and the bottom plate in the frame body are welded, the welded form can be referred to the content shown in the above Figure 6 .

[0122] In a second optional implementation, the first gel body portion of the electronic device has a plurality of first protrusions arranged in an array on the side facing the bottom plate in the frame body, and the bottom plate has a plurality of openings corresponding to the plurality of first protrusions. That is, the form of the first gel body portion and the bottom plate can be referred to the content shown in the above Figure 7 , and the step S104 of subjecting a part of the first gel body portion to a welding process to form a welding portion for welding the first gel body portion and the frame body can include:

[0123] After the plurality of first protrusions respectively extend through the plurality of openings, the parts of the plurality of first protrusions extending from the corresponding openings are subjected to a welding process to form a plurality of first welding portions corresponding to the plurality of first protrusions. Here, each first welding portion is used to weld the side of the bottom plate away from the first gel body portion.

[0124] For example, first, the plurality of first protrusions provided on the first gel body portion can extend from the corresponding openings in the bottom plate; then, the parts of the plurality of first protrusions extending from the corresponding openings can be subjected to a welding process and melted, and the parts of the plurality of first protrusions extending from the corresponding openings after melting can form first welding portions, which can be tightly welded to the side of the bottom plate away from the first gel body portion. In this way, the first welding portion for welding the bottom plate and the first gel body portion has a structure similar to a mortise-tenon structure, and the first welding portion can more firmly weld the first gel body portion and the bottom plate in the frame body together. Here, after the first gel body portion and the bottom plate in the frame body are welded, the welded form can be referred to the content shown in the above Figure 8 .

[0125] In a third optional implementation, the first gel body portion of the electronic device has a plurality of first protrusions arranged in an array on the side facing the bottom plate in the frame body, and the bottom plate has a plurality of openings corresponding to the plurality of first protrusions and a plurality of accommodation grooves corresponding to the plurality of openings. That is, the form of the first gel body portion and the bottom plate can be referred to the content shown in the above Figure 9In the illustrated part, the step S104 of performing the welding process on a portion of the first gel member to form the welding portion for welding the first gel member and the frame can include:

[0126] After the plurality of first protruding portions respectively extend into the plurality of accommodating grooves through the plurality of openings, a welding process is performed on portions of the plurality of first protruding portions distributed in the corresponding accommodating grooves to form a plurality of first welding portions corresponding to the plurality of first protruding portions one-to-one, and each first welding portion is used to weld the bottom plate away from the first gel member in the corresponding accommodating groove.

[0127] For example, first, the plurality of first protruding portions provided on the first gel member can extend from the corresponding openings on the bottom plate; then, after the portions of the plurality of first protruding portions extending from the corresponding openings are melted by the welding process, the portions of the plurality of first protruding portions extending from the corresponding openings can form the first welding portions, and at least a portion of the first welding portions can be fixed in the corresponding accommodating grooves. In this way, the first welding portions can firmly weld the first gel member and the bottom plate in the frame together. Here, after the first gel member and the bottom plate in the frame are welded, the welded form can be referred to the part shown in the above Figure 10 content.

[0128] In a fourth optional implementation, the first gel member in the electronic device has a plurality of first protruding portions arranged in an array on the side facing the bottom plate in the frame, and the first gel member in the electronic device has a plurality of second protruding portions arranged in an array on the side facing the side plate in the frame, that is, the form of the first gel member can be referred to the part shown in the above Figure 11 In the illustrated part, the step S104 of performing the welding process on a portion of the first gel member to form the welding portion for welding the first gel member and the frame can include:

[0129] The plurality of first protruding portions and the plurality of second protruding portions are welded to form a plurality of first welding portions corresponding to the plurality of first protruding portions one-to-one, and a plurality of second welding portions corresponding to the plurality of second protruding portions one-to-one. Here, the first welding portions are used to weld the first gel member and the bottom plate, and the second welding portions are used to weld the first gel member and the annular side plate.

[0130] For example, the plurality of first protrusions are melted after the welding process, and the melted plurality of first protrusions are tightly welded with the bottom plate in the frame body to ensure that the first gel body and the bottom plate in the frame body are firmly welded together through the plurality of first welding portions. Similarly, the plurality of second protrusions are melted after the welding process, and the melted plurality of second protrusions are tightly welded with the annular side plate in the frame body to ensure that the first gel body and the annular side plate in the frame body are firmly welded together through the plurality of second welding portions. Here, after the first gel body is welded with the bottom plate in the frame body and the annular side plate in the frame body, the welded form can be referred to the content shown in the foregoing Figure 12

[0131] It should be noted that the design principle of the internal components in the electronic device in the above embodiment can refer to the corresponding content in the foregoing structure embodiment of the electronic device, which will not be described here.

[0132] In summary, the manufacturing method of the electronic device provided in the embodiments of the present application can weld the first gel body in the electronic device and the frame body through the welding portion, and the welding portion can be part of the first gel body. Here, after part of the first gel body is subjected to a welding process, part of the first gel body can be converted into a welding portion. That is, the first gel body and the frame body can be welded together through the welding portion. In this case, the connection effect between the first gel body and the frame body in the electronic device can be better, so that the first gel body in the electronic device can be more firmly connected with the frame body. In this way, even after the electronic device falls or is subjected to an impact force, the first gel body can be prevented from being separated from the frame body, so that the probability of collision between the display panel and the frame body in the electronic device can be low, thereby improving the reliability of the electronic device.

[0133] In the present application, the terms "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance. The term "plurality" refers to two or more, unless otherwise explicitly limited.

[0134] The above description is only optional embodiments of the present application and does not limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.​

Claims

1. An electronic device, comprising: The application relates to a display panel and a frame thereof. The display panel comprises a first panel part and a second panel part arranged oppositely, and a panel bending part for connecting the first panel part and the second panel part, wherein the first panel part has a display area. The first functional film layers are arranged in a stack between the first panel part and the second panel part. The first adhesive part is arranged on a side of the panel bending part away from the first functional film layers, and covers at least the side of the panel bending part away from the first functional film layers. The first adhesive part and the frame are welded by a welding part, and the welding part is a part of the first adhesive part. The frame comprises a ring-shaped side plate and a bottom plate fixedly connected with the ring-shaped side plate, and the ring-shaped side plate and the bottom plate are used for enclosing an installation space, wherein at least part of the display panel, the first adhesive part and the first functional film layers are arranged in the installation space.

2. The electronic device of claim 1, wherein, The welding part comprises a first welding part for welding the first adhesive part and the bottom plate. The side of the first adhesive part facing the bottom plate has a plurality of first protrusions arranged in an array, and the plurality of first protrusions are used for forming a plurality of first welding parts corresponding to the plurality of first protrusions after welding.

3. The electronic device of claim 2, wherein, At least part of the plurality of first welding parts are arranged in connection.

4. The electronic device of claim 3, wherein, The bottom plate has a plurality of openings corresponding to the plurality of first welding parts, and each first welding part is arranged to pass through a corresponding opening and is welded to a side of the bottom plate away from the first adhesive part.

5. The electronic device of claim 3, wherein, The side of the bottom plate away from the first adhesive part also has a plurality of accommodation grooves, the plurality of accommodation grooves are in communication with the plurality of openings in a one-to-one correspondence, and the plurality of accommodation grooves correspond to the plurality of first welding parts in a one-to-one correspondence, and at least part of each first welding part is fixed in a corresponding accommodation groove.

6. The electronic device of claim 5, wherein, The end of the accommodation groove facing the first welding part has a first opening in communication with the opening, and the end of the accommodation groove away from the first welding part has a second opening.

7. The electronic device of claim 6, wherein, The opening area of the first opening is smaller than the opening area of the second opening. The side of the first adhesive part facing the bottom plate also has a plurality of connecting parts, the plurality of connecting parts correspond to the plurality of first welding parts in a one-to-one correspondence, and the plurality of connecting parts correspond to the plurality of openings in a one-to-one correspondence, and at least part of each connecting part is arranged in a corresponding opening.

8. The electronic device of any of claims 5 to 7, wherein, The side of the first adhesive part facing the bottom plate also has a plurality of ring-shaped avoiding grooves corresponding to the plurality of connecting parts in a one-to-one correspondence, part of each connecting part is arranged in a corresponding ring-shaped avoiding groove, and another part of each connecting part is arranged in a corresponding opening.

9. The electronic device of claim 8, wherein, The welding part comprises a second welding part for welding the first adhesive part and the ring-shaped side plate.

10. The electronic device of any of claims 2 to 7, wherein, ​ 11. The electronic device of claim 10, wherein, The first colloid part has a plurality of second protruding parts arranged in an array towards one side of the side plate, and the plurality of second protruding parts are used to form a plurality of second welding parts corresponding to the plurality of second protruding parts after welding.

12. The electronic device of claim 11, wherein, The first colloid part has a first inclined surface towards one side of the side plate, and the side plate has a second inclined surface arranged in parallel with the first inclined surface towards one side of the first colloid part. The plurality of second welding parts are located between the first inclined surface and the second inclined surface.

13. A method of manufacturing an electronic device, characterized by: The method comprises: forming a plurality of first functional film layers arranged in a stack between a first panel part and a second panel part in a display panel, the display panel comprising: the first panel part and the second panel part arranged oppositely, and a panel bending part for connecting the first panel part and the second panel part, the first panel part having a display area; forming a first colloid part on a side of the panel bending part away from the plurality of first functional film layers, the first colloid part covering at least the side of the panel bending part away from the plurality of first functional film layers; assembling the display panel, the plurality of first functional film layers and the first colloid part in a frame; welding a part of the first colloid part to form a welding part for welding the first colloid part and the frame.

14. The method of claim 13, wherein, The frame comprises: a ring-shaped side plate, and a bottom plate fixedly connected with the ring-shaped side plate; the first colloid part has a plurality of first protruding parts arranged in an array towards one side of the bottom plate; welding a part of the first colloid part to form a welding part for welding the first colloid part and the frame, comprising: welding the plurality of first protruding parts to form a plurality of first welding parts corresponding to the plurality of first protruding parts, the first welding parts being used to weld the first colloid part and the bottom plate.

15. The method of claim 13, wherein, The frame comprises: a ring-shaped side plate, and a bottom plate fixedly connected with the ring-shaped side plate; the first colloid part has a plurality of first protruding parts arranged in an array towards one side of the bottom plate; the bottom plate has a plurality of openings corresponding to the plurality of first protruding parts; welding a part of the first colloid part to form a welding part for welding the first colloid part and the frame, comprising: after the plurality of first protruding parts respectively extend through the plurality of openings, welding the parts of the plurality of first protruding parts extending from the corresponding openings to form a plurality of first welding parts corresponding to the plurality of first protruding parts, each of the first welding parts being used to weld a side of the bottom plate away from the first colloid part.

16. The method of claim 13, wherein, The frame comprises: a ring-shaped side plate, and a bottom plate fixedly connected with the ring-shaped side plate; the first colloid part has a plurality of first protruding parts arranged in an array towards one side of the bottom plate; the bottom plate has a plurality of openings corresponding to the plurality of first protruding parts, and a plurality of accommodation grooves in communication with the plurality of openings one by one, the openings being closer to the first colloid part than the accommodation grooves; Performing welding processing on a portion of the first colloid part to form a welding portion for welding the first colloid part and the frame, comprising: After the plurality of first protrusions extend into the plurality of receiving grooves through the plurality of openings respectively, portions of the plurality of first protrusions distributed in the corresponding receiving grooves are welded to form a plurality of first welding portions corresponding one-to-one to the plurality of first protrusions, each of the first welding portions being used to weld to a side of the bottom plate facing away from the first colloid portion in the corresponding receiving groove.

17. The method of claim 13, wherein, The frame includes: an annular side plate, and a bottom plate fixedly connected to the annular side plate; the first colloid portion has a plurality of first protrusions arranged in an array on a side facing the bottom plate, and the first colloid portion has a plurality of second protrusions arranged in an array on a side facing the side plate; Performing welding processing on a portion of the first colloid part to form a welding portion for welding the first colloid part and the frame, comprising: The plurality of first protrusions and the plurality of second protrusions are welded to form a plurality of first welding portions corresponding one-to-one to the plurality of first protrusions, and a plurality of second welding portions corresponding one-to-one to the plurality of second protrusions, wherein the first welding portions are used to weld the first colloid portion and the bottom plate, and the second welding portions are used to weld the first colloid portion and the annular side plate.

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