Driving backboard, manufacturing method thereof and display device

Abstract

The invention discloses a driving backboard, a manufacturing method thereof and a display device, the driving backboard comprises a substrate, a planarization layer and side wires, and the first surface and the second surface of the substrate are provided with wire layers and connecting terminals; the planarization layer is arranged on the side, away from the substrate, of the wiring layer, the planarization layer comprises a plurality of first sub-parts, the first sub-parts are arranged at intervals in the first direction, and the orthographic projection of the connecting terminal on the substrate covers the orthographic projection of at least part of the first sub-parts on the substrate; in the thickness direction of the planarization layer, the distance from the third surface of the first sub-part to the substrate is greater than the distance from the third surface of the other part of the planarization layer to the substrate; the side wires are electrically connected with the connecting terminals and extend to the side, away from the substrate, of the planarization layer. According to the scheme, the reliability of side wiring can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a driving backboard, a manufacturing method thereof and a display device. BACKGROUND

[0002] In recent years, in order to maximize the screen size, the prior art splices multiple display panels to form a large display device. In order to reduce the discontinuity of the display picture at the junction between adjacent display panels, it is necessary to minimize the frame width of each display panel as much as possible.

[0003] The existing narrow frame or frameless display panel is to manufacture the driving circuit on the back of the display panel, and then form a connecting line on the side wall of the display panel to conduct the display panel and the driving circuit. However, the prior art is prone to problems of metal wrap plating and side edge trace falling off in the preparation process. SUMMARY

[0004] The technical problem solved by the present application is to provide a driving backboard, which effectively reduces the damage probability of the connecting piece and the driving circuit board, and improves the reliability of the driving backboard.

[0005] To solve the above technical problems, one technical solution adopted by the present application is to provide a driving backboard, comprising a substrate, a planarization layer and a side edge trace, the substrate comprises a first surface and a second surface arranged oppositely, and a side surface connecting the first surface and the second surface; the first surface and the second surface are both provided with a trace layer and a plurality of connection terminals arranged along a first direction; the planarization layer comprises a plurality of first subparts, the plurality of first subparts are arranged along the first direction, and the orthographic projection of the connection terminal on the substrate covers at least part of the orthographic projection of the first subpart on the substrate; wherein the planarization layer comprises a third surface facing away from the substrate, and in the thickness direction of the planarization layer, the distance from the third surface of the first subpart to the substrate is greater than the distance from the third surface of other parts of the planarization layer to the substrate; the side edge trace is arranged on the side surface, both ends of the side edge trace are electrically connected with the connection terminals on the first surface and the second surface respectively, and the side edge trace extends to the side of the planarization layer facing away from the substrate.

[0006] Preferably, the planarization layer comprises a first flat part and a second flat part, the orthographic projection of the first flat part on the substrate covers the orthographic projection of the trace layer on the substrate, and the orthographic projection of the second flat part on the substrate is located outside the orthographic projection of the trace layer on the substrate; the second flat part comprises a plurality of first subparts, the first subpart is connected with the first flat part; the side edge trace extends to the side of the second flat part facing away from the substrate, and is arranged spaced apart from the first flat part.

[0007] Preferably, the first sub-part is made of the same material as the first flat part.

[0008] Preferably, the first sub-part is integrally formed with the first flat part.

[0009] Preferably, the first sub-part comprises an attaching surface facing away from the connecting terminal, the attaching surface comprising a guide edge facing the side surface, the guide edge having at least two intersecting tangent lines.

[0010] Preferably, the guide edges of the at least two first sub-parts are shaped differently.

[0011] Preferably, the orthographic projection of the first sub-part on the connecting terminal is a triangle or a semicircle.

[0012] The second flat part further comprises a second sub-part, the second sub-part being connected between two adjacent first sub-parts, wherein the third surface of the first sub-part is located on the side of the third surface of the second sub-part facing away from the substrate.

[0013] Preferably, the second sub-part is made of the same material as the first sub-part.

[0014] Preferably, the second sub-part is integrally formed with the first sub-part.

[0015] Preferably, the number of connecting terminals and side edge traces is multiple, and the connecting terminals and side edge traces are arranged in the first direction at intervals; the first sub-part is arranged one-to-one with the connecting terminal on the side of the first surface / the second surface, and the orthographic projection of the connecting terminal on the substrate covers part of the orthographic projection of the first sub-part on the substrate and extends beyond the orthographic projection of the first sub-part on the substrate.

[0016] Preferably, the third surface of the first sub-part is flush with the third surface of the first flat part.

[0017] Preferably, the thickness of the planarization layer ranges from 3-5 μm.

[0018] Preferably, the length of the first sub-part in the second direction ranges from 10-20 μm, wherein the second direction is parallel to the substrate and the second direction is perpendicular to the first direction.

[0019] Preferably, the second flat part protrudes from the first flat part by 10-20 μm.

[0020] To solve the above technical problems, another technical solution adopted by the present application is to provide a manufacturing method of a driving backboard, a wiring layer and a connection terminal are formed on a first surface and a second surface of a substrate opposite to each other; a planarization layer is formed on a side of the wiring layer away from the substrate, wherein the planarization layer comprises a plurality of first sub-parts, the plurality of first sub-parts are arranged at intervals along the first direction, and a projection of the connection terminal on the substrate covers at least part of a projection of the first sub-parts on the substrate; wherein the planarization layer comprises a third surface on a side away from the substrate, and in a thickness direction of the planarization layer, a distance from the third surface of the first sub-parts to the substrate is greater than a distance from the third surface of other parts of the planarization layer to the substrate; a protective film is attached on a side of the planarization layer away from the substrate, wherein the protective film covers part of the first sub-parts; a side edge coating film is formed on a side of the substrate, the side edge coating film extends to the protective film and covers the connection terminal, the first sub-parts, and at least part of the protective film; the protective film and part of the side edge coating film covering the protective film are removed; and the side edge coating film is etched to form a side edge wiring. Preferably, the step of forming the planarization layer on the side of the wiring layer away from the substrate comprises: forming an insulating film layer covering the wiring layer and the connection terminal; and patterning the insulating film layer to expose the connection terminal and form the planarization layer.

[0021] To solve the above technical problems, another technical solution adopted by the present application is to provide a display device comprising the driving backboard and a light emitting device in any of the embodiments, and the light emitting device is electrically connected with the wiring layer.

[0022] The present application has the following beneficial effects: Different from the prior art, the driving backboard provided by the present application is provided with a planarization layer on the wiring layer, the height of the first sub-parts protruding from the substrate is greater than the height of other parts of the planarization layer protruding from the substrate, so that when a protective film is attached on the planarization layer subsequently, the protective film is attached to the first sub-parts, but the protective film cannot be attached to other parts of the planarization layer, thereby reducing the adhesion between the protective film and the planarization layer, reducing the resistance of removing the protective film subsequently, and reducing the cracks or damage of the metal film layer formed on the protective film when the protective film is removed. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 is a structural schematic diagram of an embodiment of the driving backboard of the present application;

[0024] Figure 2 is a top view of an embodiment of the driving backboard of the present application;

[0025] Figure 3 is a top view of an embodiment of the driving backboard of the present application (with the side edge wiring hidden);

[0026] Figure 4 is a top view (with side edge traces hidden) of another embodiment of the driving backplane of the present application;

[0027] Figure 5 is a top view (with side edge traces hidden) of another embodiment of the driving backplane of the present application;

[0028] Figure 6 is a flow chart of an embodiment of the method for manufacturing the driving backplane of the present application;

[0029] Figures 7a-7g is a structural diagram of each step of the method for manufacturing the driving backplane of the present application. DETAILED DESCRIPTION

[0030] To make the objectives, technical solutions and effects of the present application clearer and more explicit, the present application is further described in detail below with reference to the accompanying drawings and embodiments. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work, fall within the scope of protection of the present application.

[0031] Referring to Figure 1 , Figure 2 and Figure 3 , Figure 1 is a structural diagram of an embodiment of the driving backplane of the present application, Figure 2 and Figure 3 are both top views of an embodiment of the driving backplane of the present application. Among them Figure 3 side edge traces are hidden. The driving backplane 10 includes a substrate 11, a planarization layer 14 and side edge traces 15. The driving backplane 10 includes a display area AA and a non-display area NA.

[0032] The substrate 11 includes a first surface 11a and a second surface 11b arranged opposite to each other, and a side surface 11c connecting the first surface 11a and the second surface 11b. The first surface 11a can be a light-emitting surface, and the second surface 11b can be a back light surface. The first surface 11a and the second surface 11b are both provided with a wiring layer 12 and a connection terminal 13. Optionally, a plurality of connection terminals can be arranged along the first direction. The wiring layer 12 includes a first wiring layer 121 and a second wiring layer 122. The first wiring layer 121 is located in a display area AA and is arranged on the first surface 11a. The second wiring layer 122 is arranged on the second surface 11b. Specifically, the first wiring layer 121 can be an array film layer, and the second wiring layer 122 can be a driving circuit layer. The connection terminal 13 is located in a non-display area NA. The connection terminal 13 on the first surface 11a is electrically connected to the first wiring layer 121. The connection terminal 13 on the second surface 11b is electrically connected to the second wiring layer 122. The connection terminals 13 on the two surfaces correspond one by one.

[0033] A planarization layer 14 is arranged on the side of the wiring layer 12 away from the substrate 11. The planarization layer 14 includes a plurality of first sub-parts 1421 arranged along the first direction X. The connection terminal 13 on the substrate 11 covers the projection of the first sub-part 1421 on the substrate 11 and extends beyond the projection of the first sub-part 1421 on the substrate 11. The planarization layer 14 includes a third surface 14a away from the substrate 11. In the thickness direction Z of the planarization layer 14, the distance h1 from the third surface 14a of the first sub-part 1421 to the first surface 11a of the substrate 11 is greater than the distance h2 from the third surface 14a of the other part of the planarization layer 14 to the first surface 11a of the substrate 11. The planarization layer 14 on the other side of the substrate 11 can also be arranged in the same manner. In this embodiment, the planarization layer 14 only includes a plurality of first sub-parts 1421 arranged along the first direction X. The other part of the planarization layer 14 is removed, and the thickness is zero. The projection of the first sub-part 1421 on the substrate 11 is located within the projection of the connection terminal 13 on the substrate 11. Specifically, the planarization layer 14 can be made of photoresist or other insulating materials.

[0034] A plurality of side edge wirings 15 are arranged along the first direction X on the side surface 11c. The two ends of the side edge wiring 15 are electrically connected to the connection terminal 13 on the first surface 11a and the second surface 11b, respectively, and extend to the side of the planarization layer 14 away from the substrate 11. Optionally, in this embodiment, the side edge wiring 15 corresponds to the connection terminal 13 on the first surface 11a one by one, and corresponds to the connection terminal 13 on the second surface 11b one by one. The projection of the connection terminal 13 on the substrate 11 covers the projection of the corresponding first sub-part 1421 on the substrate 11 and extends beyond the projection of the corresponding first sub-part 1421 on the substrate 11.

[0035] The driving backboard 10 of the present application is provided with a planarization layer 14 on the wiring layer 12, the height of the first sub-part 1421 protruding from the substrate 11 is greater than the height of other parts of the planarization layer 14 protruding from the substrate 11, so that when the protective film is attached on the planarization layer 14 subsequently, the protective film is attached with the first sub-part 1421, but the protective film cannot be attached with other parts of the planarization layer 14, thereby reducing the adhesion between the protective film and the planarization layer 14, reducing the resistance of tearing off the protective film subsequently, and reducing the crack or damage of the metal film layer formed on the protective film when tearing off the protective film.

[0036] Optionally, the planarization layer 14 includes a first flat part 141 and a second flat part 142, the orthographic projection of the first flat part 141 on the substrate 11 covers the orthographic projection of the wiring layer 12 on the substrate 11, and the orthographic projection of the second flat part 142 on the substrate 11 is located outside the orthographic projection of the wiring layer 12 on the substrate 11. The first flat part 141 covers the wiring layer 12, and the first flat part 141 can also cover part of the connection terminal 13 close to the wiring layer 12. The second flat part 142 includes a plurality of first sub-parts 1421, and each first sub-part 1421 is connected with the first flat part 141. The side edge wiring 15 extends to one side of the second flat part 142 away from the substrate 11, and the side edge wiring 15 is arranged in a spaced manner with the first flat part 141. The first flat part 141 protects the wiring layer 12, avoiding the metal of the side edge wiring 15 invading the display area AA when the side edge wiring 15 is formed subsequently. At the same time, since the side edge wiring 15 formed subsequently is arranged in a spaced manner with the first flat part 141, the adhesion between the side edge wiring 15 and the planarization layer 14 is reduced, thereby reducing the resistance caused by the separation of the side edge wiring 15 and the planarization layer 14 when tearing off the protective film subsequently, reducing the crack or damage of the side edge wiring 15, and ensuring the reliability of the connection between the side edge wiring 15 and the connection terminal 13.

[0037] Optionally, the first sub-part 1421 is made of the same material as the first flat part 141, and the first sub-part 1421 is integrally formed with the first flat part 141. Specifically, the planarization layer 14 can be provided with an insulating layer in an integral layer, and then the insulating material on one side close to the connection terminal 13 is removed to form the first sub-part 1421 and the first flat part 141 connected in an integral manner.

[0038] Optionally, continuing to refer to Figure 1 and Figure 3The third surface 14a of the first sub-portion 1421 is an attaching surface 142a, and the attaching surface 142a includes a guide edge L facing the side surface 11c, and the guide edge L has at least two intersecting tangent lines. Since the second flat portion 142 is attached to the protective film through the attaching surface 142a of the first sub-portion 1421, when the protective film is removed, the guide edge L, as the edge of the attaching surface 142a, exerts a force on the protective film. When the guide edge L has at least two different tangent lines, the extension direction of the guide edge L changes at least once, so that the force exerted by the guide edge L of each first sub-portion 1421 on the protective film changes at least once when the protective film is removed, thereby avoiding the situation that the side edge trace 15 is always subjected to the same direction force from the protective film when the protective film is removed, and further reducing the probability of the side edge trace 15 being cracked in this direction and being damaged. Of course, in other embodiments, the guide edge L can also be a straight line.

[0039] The guide edge L can have various shapes, and specifically, can be a broken line shape as shown in Figure 3 , or can be a circular arc shape as shown in Figure 4 , or the like. Figure 4 FIG. 8 is a top view of another embodiment of the driving backboard of the present application, in which the side edge trace is hidden. It should be noted that the present application only limits the edge shape of the attaching surface 142a of the first sub-portion 1421, and the edge shape of the first sub-portion 1421 close to the substrate 11 is not specifically limited. In order to facilitate preparation, the edge shape of the first sub-portion 1421 can be consistent along the thickness direction Z, so that the orthographic projection of the first sub-portion 1421 on the connecting terminal 13 is a triangle or a semicircle, or the like.

[0040] Optionally, in order to further improve the irregularity of the guide edge L, the shapes of the guide edges L of at least two first sub-portions 1421 can be different. For example, along the first direction X, the shapes of the guide edges L of the plurality of first sub-portions 1421 are alternating broken lines and arc lines, or the shapes of the guide edges L of each first sub-portion 1421 are different. Since the removal direction of the protective film is usually along the first direction X or the opposite direction, the direction of the force received by the protective film and the side edge trace 15 changes constantly during the removal of the protective film, further reducing the probability of the side edge trace 15 being cracked.

[0041] Optionally, referring to Figure 5 , Figure 5is a top view of another embodiment of the driving backplane of the present application, in which the side edge traces are hidden. In other embodiments, the second flat portion 142 further comprises a second sub-portion 1422 connected between two adjacent first sub-portions 1421, wherein the third surface 14a of the first sub-portion 1421 protrudes from the substrate 11 by a height greater than the third surface 14a of the second sub-portion 1422 protrudes from the substrate 11. Optionally, the second sub-portion 1422 is made of the same material as the first sub-portion 1421, and the second sub-portion 1422 is integrally formed with the first sub-portion 1421. The second flat portion 142 can be formed by removing part of the insulating layer, and when the second flat portion 142 is not completely removed in the thickness direction Z, the remaining part forms the second sub-portion 1422 with a relatively small thickness, and the side of the second sub-portion 1422 away from the substrate 11 is not attached to the protective film, thereby reducing the adhesion between the second flat portion 142 and the protective film, and the second sub-portion 1422 does not exert force on the protective film.

[0042] Optionally, the third surface 14a of the first sub-portion 1421 is flush with the third surface 14a of the first flat portion 141. This allows the subsequent protective film to be attached flat on the planarization layer 14. Specifically, the thickness of the planarization layer 14 ranges from 3-5 μm. The length of the first sub-portion 1421 in the second direction Y ranges from 10-20 μm, wherein the second direction Y is parallel to the substrate 11 and the second direction Y is perpendicular to the first direction X.

[0043] Referring to Figure 6 , Figure 6 is a flowchart of an embodiment of the method for manufacturing the driving backplane of the present application. The method comprises the following steps:

[0044] Step S110: Referring to Figure 7a , the trace layer 12 and the connection terminal 13 are formed on the first surface 11a and the second surface 11b of the substrate 11 opposite to each other. Optionally, the connection terminal 13 can be provided in multiple along the first direction.

[0045] Step S120: Referring to Figure 7b and Figure 3 , the planarization layer 14 is formed on the side of the trace layer 12 away from the substrate 11, wherein the planarization layer 14 comprises a plurality of first sub-portions 1421, and the plurality of first sub-portions 1421 are provided in multiple along the first direction X, and the orthographic projection of the connection terminal 13 on the substrate 11 covers at least part of the orthographic projection of the first sub-portion 1421 on the substrate 11; wherein in the thickness direction Z of the planarization layer 14, the distance h1 from the third surface 14a of the first sub-portion 1421 to the first surface 11a of the substrate 11 is greater than the distance h2 from the third surface 14a of the other part of the planarization layer 14 to the first surface 11a of the substrate 11.

[0046] Optionally, step S120 can specifically include:

[0047] Referring to Figure 7c , an insulating film layer 140 is formed to cover the trace layer 12 and the connection terminals 13. Specifically, a photoresist layer can be formed to cover the trace layer 12 and the connection terminals 13.

[0048] The insulating film layer 140 is patterned to expose the connection terminals and form a planarization layer 14. Specifically, part of the insulating film layer 140 (e.g. Figure 7c the right part of the dashed line in FIG. 1C) can be removed by exposure to form the first and second flat portions 141 and 142 in one piece. In other embodiments, the first and second flat portions 141 and 142 can also be provided separately.

[0049] Step S130: Referring to Figure 7d and Figure 7e , Figure 7e is Figure 7d the cross-sectional view of A-A in FIG. 1C. The protective film 20 is attached to the side of the planarization layer 14 away from the substrate 11, wherein the protective film 20 covers the first flat portion 141 and part of the second flat portion 142 close to the first flat portion 141. Specifically, a protective film layer can be formed to cover the planarization layer 14 first, and then part of the protective film layer is removed along the cutting line C, which is also the tearing line of the subsequent protective film 20, to expose part of the connection terminals 13 and part of the end of the second flat portion 142 to the edge of the protective film 20.

[0050] Step S140: Referring to Figure 7f , a side edge coating 150 is formed on the side surface 11c of the substrate 11, the side edge coating 150 extends to the protective film 20 and covers the connection terminals 13, the second flat portion 142 and at least part of the protective film 20, wherein the side edge coating 150 is spaced apart from the first flat portion 141. The side edge coating 150 can be formed by sputtering a metal film layer on the surface of the panel to form a whole layer.

[0051] Step S150: The protective film 20 and part of the side edge coating 150 covering the protective film 20 are torn off to form a panel as shown in Figure 7gThe structure is shown. Since the protective film 20 is only attached to the first sub portion 1421, other portions between the first sub portion 1421 cannot be attached, thereby reducing the adhesion of the side of the protective film 20 close to the cutting line C to the second flat portion 142, reducing the resistance of tearing off the protective film 20, and reducing the crack or damage of the side edge coating film 150 when tearing off the protective film 20; at the same time, since the side edge coating film 150 formed subsequently is arranged apart from the first flat portion 141, the adhesion between the side edge coating film 150 and the planarization layer 14 is reduced, thereby reducing the resistance caused by the separation of the side edge coating film 150 and the planarization layer 14 when tearing off the protective film 20, reducing the crack or damage of the side edge coating film 150, and ensuring the reliability of the connection of the side edge coating film 150 and the connecting terminal 13.

[0052] Step S160: etching the side edge coating film 150 to form the side edge trace 15, and the side edge trace 15 can be arranged multiple in the first direction X. Formed as shown in the structure. Figure 2

[0053] The application also provides a display device, which comprises the driving backboard 10 and the light emitting device in any of the above embodiments, and the light emitting device is electrically connected with the trace layer 12. The display device can be a spliced display panel or the like.

[0054] The above is only the embodiment of the application, and does not limit the patent scope of the application. Any equivalent structure or equivalent process transformation in the content of the specification and drawings, or direct or indirect application in other related technical fields, is also included in the patent protection scope of the application.​

Claims

1. A drive backplane, characterized by, The drive backboard comprises: a substrate comprising a first surface and a second surface arranged oppositely, and a side surface connecting the first surface and the second surface; the first surface and the second surface are provided with a wiring layer and a connecting terminal; a planarization layer provided on a side of the wiring layer away from the substrate, the planarization layer comprises a plurality of first sub-parts, the plurality of first sub-parts are arranged at intervals along the first direction, and a projection of the connecting terminal on the substrate covers at least a projection of the first sub-parts on the substrate; wherein the planarization layer comprises a third surface on a side away from the substrate, and in a thickness direction of the planarization layer, a distance from the third surface of the first sub-parts to the substrate is greater than a distance from the third surface of other parts of the planarization layer to the substrate; a side edge wiring provided on the side surface, two ends of the side edge wiring are respectively electrically connected with the connecting terminal on the first surface and the second surface, and the side edge wiring extends to a side of the planarization layer away from the substrate.

2. The drive backboard according to claim 1, wherein: the planarization layer comprises a first flat part and a second flat part, a projection of the first flat part on the substrate covers a projection of the wiring layer on the substrate, and a projection of the second flat part on the substrate is located outside the projection of the wiring layer on the substrate; the second flat part comprises a plurality of the first sub-parts, and the first sub-parts are connected with the first flat part; the side edge wiring extends to a side of the second flat part away from the substrate, and is arranged at intervals with the first flat part; preferably, the first sub-parts and the first flat part are made of the same material; preferably, the first sub-parts and the first flat part are integrally formed.

3. The drive backboard according to claim 1, wherein: the number of the connecting terminals and the side edge wiring is plural, and the connecting terminals and the side edge wiring are arranged at intervals along the first direction; the first sub-parts are arranged one by one with the connecting terminals on one side of the first surface / second surface, a projection of the connecting terminal on the substrate covers a projection of the first sub-parts on the substrate and extends beyond the projection of the first sub-parts on the substrate.

4. The drive backboard according to claim 1, wherein: the first sub-parts comprise an adhering surface on a side away from the connecting terminal, the adhering surface comprises a guide edge facing the side surface, and the guide edge has at least two intersecting tangent lines; preferably, the guide edges of at least two first sub-parts are different in shape; preferably, a projection of the first sub-parts on the connecting terminal is triangular or semicircular.

5. The drive backplane of claim 1, wherein, the second flat part further comprises: a second sub-part connected between two adjacent first sub-parts, wherein the third surface of the first sub-parts is located on a side of the third surface of the second sub-part away from the substrate; preferably, the second sub-part and the first sub-part are made of the same material; preferably, the second sub-part and the first sub-part are integrally formed.

6. The drive backplane of claim 1, wherein: the third surface of the first sub-section is flush with the third surface of the first flat section; preferably, the planarization layer has a thickness in the range of 3-5 pm.

7. The drive backplane of claim 1, wherein: the first sub-section has a length in the second direction in the range of 10-20 pm, wherein the second direction is parallel to the substrate and the second direction is perpendicular to the first direction.

8. A method for manufacturing a drive backplane, comprising: forming a trace layer and a connection terminal on a first surface and a second surface of a substrate opposite to each other; forming a planarization layer on a side of the trace layer facing away from the substrate, wherein the planarization layer comprises a plurality of first sub-sections, the plurality of first sub-sections are spaced apart along the first direction, and a footprint of the connection terminal on the substrate covers at least a part of a footprint of the first sub-sections on the substrate; wherein the planarization layer comprises a third surface on a side facing away from the substrate, and in a thickness direction of the planarization layer, the third surface of the first sub-sections is farther away from the substrate than the third surface of other parts of the planarization layer; attaching a protective film on a side of the planarization layer facing away from the substrate, wherein the protective film covers a part of the first sub-sections; forming a side edge coating on a side of the substrate, the side edge coating extends to the protective film and covers the connection terminal, the first sub-sections, and at least a part of the protective film; removing the protective film and the part of the side edge coating covering the protective film; etching the side edge coating to form a side edge trace.

9. The method of manufacturing according to claim 8, wherein, the step of forming the planarization layer on the side of the trace layer facing away from the substrate comprises: forming an insulating film layer covering the trace layer and the connection terminal; patterning the insulating film layer to expose the connection terminal and form the planarization layer.

10. A display device, characterized by comprising: comprising: the drive backplane of any one of claims 1-7; a light emitting device electrically connected to the trace layer.

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