High-temperature alloy product and large-layer-thickness selective laser melting preparation method thereof

Abstract

The invention discloses a high-temperature alloy product and a large-layer-thickness selective laser melting preparation method thereof.The method comprises the steps that a low-defect laser melting process window is obtained by integrating incomplete fusion defects and keyhole pore forming process intervals, GH4169 high-temperature alloy powder is laid on a forming substrate, and the GH4169 high-temperature alloy powder is formed; after laser melting process parameters, laser remelting process parameters and remelting times are set, selective laser melting and laser remelting are sequentially carried out layer by layer, and a high-temperature alloy product is obtained; wherein the thickness of a forming layer in the laser melting process is 0.08-0.1 mm, and the laser melting process parameters are selected from the low-defect laser melting process window determined in the step 1. According to the method, the instability influence of the keyhole pore influence on the molten pool is considered, the incomplete fusion criterion is corrected, the low-defect process window is obtained, a large number of trial and error tests do not need to be carried out blindly, and the preparation cost is greatly reduced.

Description

Technical Field

[0001] This invention belongs to the field of high-temperature alloy additive manufacturing technology, and particularly relates to a high-temperature alloy product and its large-layer thickness selective laser melting preparation method. Background Technology

[0002] GH4169 is a precipitation-strengthened nickel-based superalloy with excellent microstructure stability and high-temperature performance at 650℃, widely used in aerospace, shipbuilding, and chemical industries. Selective laser melting (SLM) can fabricate complex-shaped GH4169 alloy components; however, limited by the laser process window for alloy forming, the forming time is long when fabricating taller components, placing higher demands on equipment and process stability. Under single-laser conditions and a standard layer thickness of 30μm, fabricating a 50mm tall component typically requires more than 25 hours, significantly limiting the fabrication efficiency of GH4169 alloy components. Increasing the layer thickness can significantly reduce the forming time; when the layer thickness increases from 30μm to 60μm, the forming time can be reduced by about half. However, increased layer thickness weakens the interlayer bonding and increases the tendency for unfused porosity, thus affecting the alloy's density and mechanical properties. To ensure good interlayer bonding at large layer thicknesses, it is usually necessary to increase the laser energy input to enlarge the molten pool size, improve the bonding ability between molten pools, and eliminate unfused defects. However, excessive energy input can cause the molten pool to switch to keyhole mode, in which pores are easily formed during the solidification process. Therefore, determining the optimal printing process window for GH4169 alloy is a technical problem that urgently needs to be solved.

[0003] In summary, it is necessary to improve the existing additive manufacturing method for GH4169 high-temperature alloy. Summary of the Invention

[0004] The main objective of this invention is to provide a high-temperature alloy product and a method for preparing it by selective laser melting with large layer thickness. This method is specifically designed for GH4169 high-temperature alloy. By optimizing the large layer thickness process and supplementing it with a specific remelting process, it achieves efficient and high-performance preparation of GH4169 high-temperature alloy products.

[0005] Therefore, the present invention provides a method for preparing high-temperature alloy products with large layer thickness by selective laser melting, comprising the following steps: Step 1: Based on the non-fusion criterion (H / W) 2 +(L / D) 2 ≤1, the dense parameter range of GH4169 high-temperature alloy was calculated. Considering that in the actual forming process, due to metal solidification shrinkage, the top surface of the deposited layer will be relatively lower than the powder bed, the molten pool is unstable and keyhole porosity is easily generated. The keyhole number Ke=ηP / [(T1-T0)πρC p(αvr 3 ) 0.5 The instability of the keyhole-type molten pool was calculated. For GH4169 high-temperature alloy, when Ke > 26.5, the molten pool stability is poor, and keyhole porosity is easily formed. Therefore, considering the formation process range of incomplete fusion defects and keyhole porosity, a low-defect laser melting process window is obtained; where H is the scanning interval, W is the molten pool width, L is the layer thickness, D is the molten pool depth, η is the laser absorptivity, P is the laser power, T1 is the liquidus temperature, T0 is the initial temperature, ρ is the density, and C is the liquidus temperature. p ρ is the specific heat capacity, α is the thermal diffusivity, v is the scanning speed, and r is the spot radius.

[0006] Step 2: Lay GH4169 high-temperature alloy powder on the forming substrate, set the laser melting process parameters, laser remelting process parameters and remelting times, and then perform selective laser melting and laser remelting layer by layer to obtain the high-temperature alloy product; wherein, the forming layer thickness is 0.08-0.1mm during the laser melting process; wherein, the laser melting process parameters are selected from the low-defect laser melting process window determined in Step 1.

[0007] Specifically, the selective laser melting process parameters are: laser power of 350-400W, scanning speed of 900-1000mm / s, and scanning spacing of 0.08-0.12mm.

[0008] Specifically, the laser melting process parameters are: laser power 400W, scanning speed 1000mm / s, scanning spacing 0.1mm, and layer thickness 0.09mm.

[0009] Specifically, the laser remelting process parameters are: laser power of 350-400W, scanning speed of 1800-2000mm / s, scanning spacing of 0.08-0.1mm, and layer thickness of 0.08-0.1mm.

[0010] Specifically, the laser remelting process parameters are: laser power 400W, scanning speed 2000mm / s, scanning spacing 0.1mm, and layer thickness 0.09mm.

[0011] Specifically, before performing the selective laser melting, the process also includes a step of preheating the formed substrate at a temperature of 80°C.

[0012] Specifically, the GH4169 high-temperature alloy has the following composition by mass: Al: 0.45, Co: 0.24, Cr: 18.1, Fe: 17.8, Mo: 3.08, Nb: 4.99, Ti: 0.92, C: 0.035, Ni: balance.

[0013] In another aspect, the present invention provides a high-temperature alloy product prepared by the above-described preparation method.

[0014] This invention is based on the non-fusion criterion (H / W). 2 +(L / D) 2 ≤1, the dense parameter range of the alloy is calculated, and considering that in the actual forming process, due to the solidification shrinkage of the metal, the top surface of the deposited layer will be relatively lower than the powder bed, the molten pool is unstable, and keyhole porosity is easily generated, the keyhole number Ke=ηP / [(T1-T0)πρC p (αvr 3 ) 0.5 The instability of the keyhole-type molten pool can be calculated. For GH4169 high-temperature alloy, when Ke > 26.5, the molten pool stability is poor, and keyhole porosity is easily formed. Therefore, by considering the formation process range of incomplete fusion defects and keyhole porosity, a low-defect process window can be obtained. Then, printing parameters are selected within the low-defect process window range to prepare high-performance high-temperature alloy products. This invention, while considering the influence of keyhole porosity, modifies the incomplete fusion criterion to obtain a low-defect process window, eliminating the need for blindly conducting a large number of trial and error experiments, and significantly reducing the preparation cost.

[0015] Based on a defined low-defect process window, this invention discovers that when the laser power is between 350-400W and the scanning speed is between 900-1000mm / s, and when combined with a special laser remelting process, it is possible to achieve efficient preparation of high-temperature alloys with large layer thicknesses. The resulting high-temperature alloy products have a density of up to 99.6%, a room temperature tensile yield strength of 1310MPa, a tensile strength of 1470MPa, and an elongation of 16.0%. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the defect formation mechanism and process window for different layer thicknesses. Figure 2 This is a microstructure diagram of the alloy prepared in Example 1; Figure 3 This is a microstructure diagram of the alloy prepared in Example 2; Figure 4 This is a microstructure diagram of the alloy prepared in Example 3; Figure 5 This is a microstructure diagram of the alloy prepared in Comparative Example 1; Figure 6 This is a microstructure diagram of the alloy prepared in Comparative Example 2; Figure 7 This is a microstructure diagram of the alloy prepared in Comparative Example 3. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] A method for preparing high-temperature alloy products with large layer thickness by selective laser melting includes the following steps: Step 1: Based on the non-fusion criterion (H / W) 2 +(L / D) 2 ≤1 (green area) represents the calculated range of the alloy's compactness parameter. However, considering that during actual forming, due to metal solidification shrinkage, the top surface of the deposited layer will be relatively lower than the powder bed, the criterion needs to be modified. That is, when 1 < (H / W) 2 +(L / D) 2 When the value is ≤1.1 (yellow area), due to fluctuations in the molten pool depth and the surface of the formed layer, incomplete fusion defects may form within this range, creating a transition zone for the defects. When (H / W) 2 +(L / D) 2 When the value is greater than 1.1 (gray area), incomplete fusion defects are easily formed due to the mismatch between the molten pool size and process parameters. Furthermore, regarding keyhole porosity, the keyhole number Ke = ηP / [(T1-T0)πρC] is used. p (αvr 3 ) 0.5 The instability of the keyhole-type molten pool can be calculated. For IN718 alloy, when Ke > 26.5 (shaded area), the molten pool stability is poor, and keyhole porosity is easily formed. Therefore, considering the formation process range of incomplete fusion defects and keyhole porosity, the following can be obtained: Figure 1 The low-defect process window is defined in the formula, where H is the scanning interval, W is the molten pool width, L is the layer thickness, D is the molten pool depth, η is the laser absorptivity, P is the laser power, T1 is the liquidus temperature, T0 is the initial temperature, ρ is the density, and C is the density. p ρ is the specific heat capacity, α is the thermal diffusivity, v is the scanning speed, and r is the spot radius.

[0020] Step 2: GH4169 high-temperature alloy powder is laid on the forming substrate. After setting the laser melting process parameters, laser remelting process parameters and remelting times, selective laser melting and laser remelting are performed layer by layer to obtain high-temperature alloy products. The forming layer thickness is 0.08-0.1 mm during the laser melting process. The laser melting process parameters are selected from the low-defect laser melting process window determined in Step 1.

[0021] The forming efficiency of selective laser melting is η = νht, where v is the scanning speed, h is the scanning interval, and t is the layer thickness. For GH4169 alloy, the commonly used layer thickness is 30-40 μm. Therefore, when the layer thickness is increased to 90 μm, the forming efficiency can be improved by about 2-3 times, which is extremely beneficial for the efficient fabrication of high-temperature alloy parts. Simultaneously, for components of the same height, increasing the layer thickness reduces the number of slices, thus reducing the number of thermal cycles during forming. This results in fewer expansion-contraction cycles in the heat-affected zone, thereby reducing the accumulation of thermal stress within the alloy. Low thermal stress accumulation reduces the deformation degree of easily deformable structures such as thin walls during forming, which is beneficial for improving the dimensional accuracy of the components. Furthermore, low thermal stress accumulation indicates lower deformation energy storage within the alloy. The lower the deformation energy storage within the alloy, the more difficult recrystallization is, requiring a higher recrystallization temperature. For GH4169 alloy, the low deformation energy storage caused by increased layer thickness is beneficial for reducing the degree of recrystallization during high-temperature solution treatment. GH4169 alloys prepared by SLM exhibit fine grains, with an average grain size typically ranging from 15 to 20 μm. These fine grains enhance the material's strength and toughness. GH4169 alloys prepared with conventional layer thicknesses usually possess relatively high deformation energy, leading to recrystallization during high-temperature solution treatment, resulting in grain growth and reduced mechanical properties. However, forming with larger layer thicknesses and lower deformation energy reduces the recrystallization tendency, inhibiting grain recrystallization and grain growth. After heat treatment, the fine grain characteristics of the printed state can be preserved, which is beneficial for improving the alloy's mechanical properties.

[0022] However, increasing layer thickness requires a corresponding increase in the molten pool depth to ensure good interlayer bonding. To maintain forming efficiency, reducing scanning speed is generally undesirable; therefore, increasing laser power is used to increase the molten pool depth. However, excessively high laser power can cause the molten pool to transform into a keyhole mode. In keyhole mode, the molten pool is narrow and deep, and the flow of liquid metal within the pool is quite vigorous under high energy input. This makes it easy for pores to form in the keyhole due to liquid phase flow, and the narrow and deep molten pool morphology makes it difficult for gas deep within to escape in time, thus forming voids after the molten pool solidifies. This is detrimental to high-density forming. Therefore, for large-layer-thickness forming, it is necessary to balance the relationship between molten pool depth and keyhole depth (see Appendix). Figure 1When the energy input is low (low laser power, high scanning speed), the molten pool size cannot fully overlap, easily leading to incomplete fusion defects (gray area). As the energy input increases, the molten pool size increases, and incomplete fusion defects gradually decrease until they are eliminated (yellow area). In this region, the tendency for incomplete fusion defects to form decreases, but due to fluctuations in the molten pool shape, incomplete fusion defects may still form. When the energy input is further increased (green area), a larger molten pool size can effectively eliminate incomplete fusion defects. The corresponding optimal process window range is a laser power of 350-400W, a scanning speed of 900-1000mm / s, and a scanning interval of 0.08-0.12mm.

[0023] However, due to the high energy input within this parameter range, the molten pool is in keyhole mode. Under high energy input, the molten pool is unstable, increasing the tendency for porosity formation. Therefore, further analysis of keyhole stability is needed to obtain relatively stable keyholes and reduce the porosity formation tendency. Based on keyhole number calculations, when the process parameters are in the shaded area, the molten pool stability is poor, and porosity is easily formed. Unshaded areas can achieve relatively high keyhole stability, thereby reducing porosity formation. Considering both incomplete fusion defects and porosity formation within the process range, the following can be obtained: Figure 1 The process window for the formation of low defects.

[0024] Further research by the inventors revealed that defects still exist within this process window. This is because, for thick-layer forming, the insufficient depth of the molten pool makes it difficult to fully penetrate multiple forming layers, thus preventing the elimination of defects formed at the bottom of the molten pool. To address this, after obtaining intermediate products from selective laser melting, the inventors subjected these intermediate products to a special laser remelting process (laser power 350-400W, scanning speed 1800-2000mm / s, scanning interval 0.08-0.1mm, layer thickness 0.08-0.1mm) to eliminate defects formed in the current layer. During laser remelting, the laser power remained the same as during selective laser melting, but a higher scanning speed was used. This promoted the transformation of the molten pool morphology from a keyhole model to a conduction mode, resulting in a more stable molten pool structure, facilitating defect elimination and surface smoothing. Furthermore, the high scanning speed resulted in a high cooling rate, promoting the refinement of the solidification structure. The smaller grain size improved the mechanical properties of the alloy. Under optimal remelting parameters (laser power 400W, scanning speed 2000mm / s, scanning spacing 0.1mm), the alloy density can be increased to 99.6% after layer-by-layer remelting, the room temperature tensile yield strength is 1310MPa, the tensile strength is 1470MPa, and the elongation is 16.0%.

[0025] Further research by the inventors revealed that the remelting scanning speed should not be too high. When the speed exceeds the limits of this invention, the remelting scanning speed is too fast, the molten pool depth is insufficient, and the porosity in the alloy cannot be effectively eliminated, resulting in the remelting process being unable to further improve the alloy density. On the other hand, an excessively low remelting scanning speed will cause increased molten pool disturbance due to energy input, resulting in poor surface smoothness of the formed layer, affecting the stability of the next molten pool, and thus increasing the probability of defect formation.

[0026] This invention is based on the non-fusion criterion (H / W). 2 +(L / D) 2 ≤1, the dense parameter range of the alloy is calculated, and considering that in the actual forming process, due to the solidification shrinkage of the metal, the top surface of the deposited layer will be relatively lower than the powder bed, the molten pool is unstable, and keyhole porosity is easily generated, the keyhole number Ke=ηP / [(T1-T0)πρC p (αvr 3 ) 0.5 The instability of the keyhole-type molten pool can be calculated. For GH4169 high-temperature alloy, when Ke > 26.5, the molten pool stability is poor, and keyhole porosity is easily formed. Therefore, by considering the formation process range of incomplete fusion defects and keyhole porosity, a low-defect process window can be obtained. Then, printing parameters are selected within the low-defect process window range to prepare high-performance high-temperature alloy products. This invention, while considering the influence of keyhole porosity, modifies the incomplete fusion criterion to obtain a low-defect process window, eliminating the need for blindly conducting a large number of trial and error experiments, and significantly reducing the preparation cost. Example

[0027] GH4169 alloy was prepared using selective laser melting (SLM). The GH4169 high-temperature alloy, by mass, has the following composition: Al: 0.45%, Co: 0.24%, Cr: 18.1%, Fe: 17.8%, Mo: 3.08%, Nb: 4.99%, Ti: 0.92%, C: 0.035%, Ni: balance. Before SLM, the substrate was preheated to 80℃, with a laser power of 400W, a scanning speed of 1000mm / s, a scanning spacing of 0.1mm, and a layer thickness of 0.09mm. The prepared alloy had a density of 99.43%, a room temperature tensile yield strength of 1290MPa, a tensile strength of 1440MPa, and an elongation of 17.2%. Furthermore, after heat treatment, the grain morphology of the alloy was similar to that of the printed state, and fine blocky precipitates formed along the grain boundaries, which is beneficial to improving the mechanical properties of the alloy after heat treatment. See attached Figure 2 . Example

[0028] GH4169 alloy was prepared using selective laser melting (SLM). The laser power was 350 W, the scanning speed was 1000 mm / s, the scanning interval was 0.1 mm, and the layer thickness was 0.09 mm. The prepared alloy had a density of 99.26%, a room temperature tensile yield strength of 1288 MPa, a tensile strength of 1445 MPa, and an elongation of 11.5%. Due to the relatively low laser power, a small number of incomplete fusion defects were present, but relatively good mechanical properties were still maintained. (See attached image.) Figure 3 . Example

[0029] GH4169 alloy was prepared using selective laser melting (SLM) with a laser power of 400 W, a scanning speed of 1000 mm / s, a scanning interval of 0.1 mm, and a layer thickness of 0.09 mm. Simultaneously, layer-by-layer remelting was performed with the following parameters: laser power 400 W, scanning speed 2000 mm / s, and scanning interval of 0.1 mm. The prepared alloy had a density of 99.61%, a room temperature tensile yield strength of 1310 MPa, a tensile strength of 1470 MPa, and an elongation of 16.0%. Layer-by-layer remelting improved the alloy density, reduced defect content and size, and slightly increased the room temperature tensile strength. (See attached figure.) Figure 4 .

[0030] Comparative Example 1 GH4169 alloy was prepared using selective laser melting (SLM) with a laser power of 300 W, a scanning speed of 1000 mm / s, a scanning interval of 0.1 mm, and a layer thickness of 0.09 mm. The prepared alloy had a density of 98.91% and a room temperature tensile elongation of only 6%. This is mainly due to the relatively low laser power, which resulted in insufficient bonding between the molten pools, forming relatively more porosity. This caused the alloy to fracture prematurely during stretching, resulting in low elongation. (See attached figure.) Figure 5 .

[0031] Comparative Example 2 GH4169 alloy was prepared using selective laser melting (SLM). The laser power was 350 W, the scanning speed was 1100 mm / s, the scanning interval was 0.1 mm, and the layer thickness was 0.09 mm. The prepared alloy had a density of 98.88% and a room temperature tensile elongation of approximately 5%. Large incomplete fusion defects were also observed within the alloy. This was attributed to the excessively high scanning speed, resulting in low laser energy input and insufficient overlap between adjacent molten pools. (See attached image). Figure 6 .

[0032] Comparative Example 3 Unlike Example 3, the remelting parameters were a laser power of 400W, a scanning speed of 2500mm / s, and a scanning spacing of 0.1mm; all other process parameters were the same as in Example 3. The prepared alloy had a density of 99.27% ​​and a room temperature tensile elongation of approximately 16.1% (see Appendix). Figure 7 Because the remelting scanning speed is too fast and the molten pool depth is insufficient, the porosity in the alloy cannot be effectively eliminated, thus preventing the remelting process from further improving the alloy density.

[0033] Comparative Example 4 Unlike Example 3, the remelting parameters were 400W laser power, 1500 mm / s scanning speed, and 0.1 mm scanning spacing, while all other process parameters remained the same as in Example 3. The prepared alloy had a density of 99.02% and a room temperature tensile elongation of approximately 13.2%. Due to the relatively low remelting scanning speed, the relatively high energy input caused increased molten pool disturbance, resulting in poorer surface smoothness of the formed layer. This affected the stability of the next molten pool and, conversely, increased the probability of defect formation.

[0034] This invention improves the forming efficiency of GH4169 alloy by 2-3 times compared to the conventional 30-40μm layer thickness by forming a 90μm layer thickness, while ensuring mechanical properties comparable to those of conventional layer thickness samples, thus achieving efficient and high-performance additive manufacturing of GH4169 alloy.

[0035] Furthermore, unless otherwise stated, the terms used to indicate positional relationships or shapes in any of the technical solutions disclosed in this invention include states or shapes that are similar to, analogous to, or close to those states or shapes. Any component provided by this invention can be assembled from multiple individual components or can be a single component manufactured using a one-piece molding process.

[0036] The above embodiments are merely illustrative examples to clearly illustrate the present invention and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all embodiments here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A method for preparing high-temperature alloy products with large-layer selective laser melting, characterized in that, Includes the following steps: Step 1: Based on the non-fusion criterion (H / W) 2 +(L / D) 2 ≤1, the dense parameter range of GH4169 high-temperature alloy was calculated. Considering that in the actual forming process, due to metal solidification shrinkage, the top surface of the deposited layer will be relatively lower than the powder bed, the molten pool is unstable and keyhole porosity is easily generated. The keyhole number Ke=ηP / [(T1-T0)πρC p (αvr 3 ) 0.5 The instability of the keyhole-type molten pool was calculated. For GH4169 high-temperature alloy, when Ke > 26.5, the molten pool stability is poor, and keyhole porosity is easily formed. Considering the formation process range of incomplete fusion defects and keyhole porosity, a low-defect laser melting process window was obtained; where H is the scanning interval, W is the molten pool width, L is the layer thickness, D is the molten pool depth, η is the laser absorptivity, P is the laser power, T1 is the liquidus temperature, T0 is the initial temperature, ρ is the density, and C is the liquidus temperature. p ρ is the specific heat capacity, α is the thermal diffusivity, v is the scanning speed, and r is the spot radius; Step 2: Lay GH4169 high-temperature alloy powder on the forming substrate, set the laser melting process parameters, laser remelting process parameters and remelting times, and then perform selective laser melting and laser remelting layer by layer to obtain the high-temperature alloy product; wherein, the forming layer thickness is 0.08-0.1mm during the laser melting process; wherein, the laser melting process parameters are selected from the low-defect laser melting process window determined in Step 1.

2. The method for preparing high-temperature alloy products with large layer thickness by selective laser melting according to claim 1, characterized in that: The selective laser melting process parameters are: laser power of 350-400W, scanning speed of 900-1000mm / s, and scanning interval of 0.08-0.12mm.

3. The method for preparing high-temperature alloy products with large layer thickness by selective laser melting according to claim 2, characterized in that: The laser melting process parameters are: laser power 400W, scanning speed 1000mm / s, scanning spacing 0.1mm, and layer thickness 0.09mm.

4. The method for preparing high-temperature alloy products with large layer thickness by selective laser melting according to claim 2 or 3, characterized in that: The laser remelting process parameters are as follows: laser power of 350-400W, scanning speed of 1800-2000mm / s, scanning spacing of 0.08-0.1mm, and layer thickness of 0.08-0.1mm.

5. The method for preparing high-temperature alloy products with large layer thickness by selective laser melting according to claim 4, characterized in that: The laser remelting process parameters are: laser power 400W, scanning speed 2000mm / s, scanning spacing 0.1mm, and layer thickness 0.09mm.

6. The method for preparing high-temperature alloy products with large layer thickness by selective laser melting according to claim 4, characterized in that: Before performing the selective laser melting, the process also includes a step of preheating the formed substrate at a temperature of 80°C.

7. The method for preparing high-temperature alloy products with large layer thickness by selective laser melting according to claim 1, characterized in that: The GH4169 high-temperature alloy has the following composition by mass: Al: 0.45, Co: 0.24, Cr: 18.1, Fe: 17.8, Mo: 3.08, Nb: 4.99, Ti: 0.92, C: 0.035, Ni: balance.

8. A high-temperature alloy product, characterized in that: The high-temperature alloy product is prepared by selective laser melting of large layer thickness according to any one of claims 1-7.

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