Laser focusing servo device

Abstract

The application relates to the technical field of semiconductor equipment, and provides a laser focusing servo device, which comprises a laser cutting device (1), a distance measuring assembly (2) and a controller (3). The laser cutting device (1) comprises a light source assembly (11) and a first focusing assembly (12). The light source assembly is configured to focus cutting laser on the surface of a to-be-cut object. The first focusing assembly is configured to adjust the position of a cutting laser focusing spot so that the position is maintained within a preset range of the surface of the to-be-cut object. The distance measuring assembly (2) is used for detecting the height of the surface of the to-be-cut object, which is located at a preset distance in front of the cutting laser focusing spot along a cutting direction, to the first focusing assembly in real time. The controller (3) is connected with the laser cutting device and the distance measuring assembly. The controller is configured to receive the detection result of the distance measuring assembly and control the first focusing assembly according to the detection result, so that the position of the cutting laser focusing spot is maintained within the preset range. The application can adjust the position of the spot in real time according to the state of the wafer surface.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor equipment, in particular to a laser focusing servo device. BACKGROUND

[0002] The present application relates to the technical field of wafer cutting processing, and in particular to the problem of focal point deviation caused by uneven surface of the object to be processed, such as wafer warping, ceramic substrate warping, metal plate thermal deformation, and composite material surface fluctuation, in the process of precision machining such as laser cutting, scribing, and punching.

[0003] In high-power laser processing, the distance between the focal point position and the surface of the object to be cut must be controlled within a certain range to ensure cutting quality, otherwise it will lead to cutting not being transparent or insufficient energy density, resulting in a decrease in the qualified rate of the object to be cut. SUMMARY

[0004] Based on the above, the present application provides a laser focusing servo device to solve at least one of the above technical problems.

[0005] The present application provides a laser focusing servo device, comprising:

[0006] The laser cutting device 1 comprises a light source assembly 11 and a first focusing assembly 12, the light source assembly 11 is configured to focus cutting laser on the surface of the object to be cut, and the first focusing assembly 12 is configured to adjust the position of the cutting laser focusing spot to maintain it within the preset range of the surface of the object to be cut;

[0007] The distance measuring assembly 2 is used to detect the height of the surface of the object to be cut to the first focusing assembly 12 at a preset distance in front of the cutting laser focusing spot along the cutting direction in real time;

[0008] The controller 3 is connected with the laser cutting device 1 and the distance measuring assembly 2, and is configured to receive the detection result of the distance measuring assembly 2 and control the first focusing assembly 12 according to the detection result, so that the position of the cutting laser focusing spot is maintained within the preset range.

[0009] In some embodiments, the preset distance L satisfies the following relationship: L=(T1+ T2)*V; wherein T1 is the time for the controller to receive the detection result and calculate according to the detection result, T2 is the execution time of the first focusing assembly for executing the focusing process, and V is the moving speed of the object to be cut.

[0010] In some embodiments, the light source assembly 11 comprises a laser 111, a beam expander 112, a prism 113, and a focusing mirror 114; the cutting laser emitted by the laser 111 is expanded by the beam expander 112, and then is emitted to the focusing mirror 114 through the prism 113; the focusing mirror 114 focuses the cutting laser in a preset range on the surface of the object to be cut; the first focusing assembly 12 is connected with the focusing mirror 114, and is used to adjust the position of the focusing mirror 114 to adjust the position of the laser spot.

[0011] In some embodiments, the distance measuring assembly 2 comprises a distance measuring sensor 21 configured to emit and receive distance measuring laser; and a rotating galvanometer 22 used to adjust the direction of the distance measuring laser to adjust the position of the distance measuring laser on the surface of the object to be cut.

[0012] In some embodiments, the distance measuring assembly 2 further comprises a dichroic mirror 23 arranged between the prism 113 and the focusing mirror 114, and used to transmit the cutting laser emitted by the laser 111 to the object to be cut, and reflect the distance measuring laser and the cutting laser in the same direction to the object to be cut.

[0013] In some embodiments, the preset range is ±0.05 mm from the surface of the object to be cut.

[0014] In some embodiments, the monitoring assembly 4 is further included, and is used to monitor the cutting state of the object to be cut; the monitoring assembly 4 comprises a camera 41 used to obtain a cutting image of the surface of the object to be cut; and a second focusing assembly 42 used to adjust the focal length of the camera 41 to make clear imaging.

[0015] In some embodiments, the light source assembly 11 further comprises a beam splitter 115 arranged on the light emitting side of the beam expander 112, and used to transmit the cutting laser emitted by the laser 111 to the object to be cut, and reflect the reflected light of the surface of the object to be cut to the camera 41.

[0016] In some embodiments, the calibration device is further included, and is used to calibrate the initial positions of the distance measuring assembly 2 and the first focusing assembly 12 before performing the cutting task.

[0017] In some embodiments, the motion platform 5 is further included, and is used to carry the object to be cut and move the object to be cut along a predetermined direction.

[0018] Compared with the prior art, the present application has the following beneficial effects:

[0019] The application provides a laser focusing servo device. In the execution of a laser cutting task, the measuring spot of a ranging sensor is aligned with the front position of a cutting laser spot, the height of the position to be cut is measured by the ranging sensor before cutting, the ranging sensor can timely feedback the height deviation of the surface of the object to be cut, and the focusing device is controlled to timely respond to the height deviation and adjust the focal length of the cutting laser, so that the focal point of the cutting laser always remains on the surface of the object to be cut during the laser cutting process, even when passing through uneven surfaces, thereby solving the technical problem of precise cutting under special conditions such as warping and special-shaped objects of the object to be cut. BRIEF DESCRIPTION OF DRAWINGS

[0020] The accompanying drawings, which are incorporated into and form part of the specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the application. It is apparent that the accompanying drawings in the following description are only some embodiments of the present application, and other drawings can be obtained from these drawings without creative labor for those skilled in the art. In the drawings:

[0021] Figure 1 is a relationship diagram of the laser focusing servo device shown in some embodiments of the present application;

[0022] Figure 2 is a structural diagram of the laser focusing servo device shown in some embodiments of the present application;

[0023] Figure 3 is a relationship structural diagram of the laser spot and the surface to be cut shown in some embodiments of the present application;

[0024] Figure 4 is a structural diagram of the laser focusing servo device shown in some embodiments of the present application;

[0025] Figure 5 is a structural diagram of the laser focusing servo device shown in some embodiments of the present application;

[0026] Figure 6 is a distance structural diagram of the laser spot and the ranging spot shown in some embodiments of the present application;

[0027] Figure 7 is a calibration principle diagram of the laser focusing servo device shown in some embodiments of the present application.

[0028] BRIEF DESCRIPTION OF DRAWINGS:

[0029] laser cutting device 1, light source assembly 11, laser 111, beam expander 112, prism 113, focusing mirror 114, beam splitter 115, first focusing assembly 12, distance measuring assembly 2, distance measuring sensor 21, rotating galvanometer 22, dichroic mirror 23, controller 3, monitoring assembly 4, camera 41, second focusing assembly 42, motion platform 5, object to be cut 51. DETAILED DESCRIPTION

[0030] In order to make the objects, technical solutions and advantages of the present application clearer, the following further describes the present application with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0031] The terms used in the embodiments of the present application are only for the purpose of describing particular embodiments and are not intended to limit the present application. The singular forms "a", "said" and "the" used in the embodiments of the present application and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise. "Plural" generally includes at least two.

[0032] It should be understood that the term "and / or" used herein is only to describe the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B can represent the three cases of A alone, A and B together, and B alone. In addition, the character " / " herein generally represents an "or" relationship between the front and rear associated objects.

[0033] It should be understood that although the terms first, second, third, etc. may be used in the embodiments of the present application to describe, these should not be limited to these terms. These terms are only used to distinguish. For example, without departing from the scope of the embodiments of the present application, the first can also be called the second, and similarly, the second can also be called the first.

[0034] It should also be noted that the terms "comprise", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that the product or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such product or device. Without more limitations, the element defined by the sentence "comprises one" does not exclude the presence of another identical element in the product or device comprising the element.

[0035] In the application process of laser cutting technology, after the object to be cut is fixed, the laser spot position is usually fixed, and then the surface of the object to be cut is continuously cut. For some uneven surfaces of the object to be cut, such as wafer warping, ceramic substrate warping, metal plate thermal deformation, and uneven surfaces of composite materials, it is difficult for the laser spot to focus on the surface of the object to be cut all the time, thereby causing the cutting laser energy to not be able to focus on the surface of the object to be cut all the time, and causing the problem of continuous cutting. Especially in the field of fine processing such as wafers, high-precision cutting is required, and if the cutting is not transparent, it will seriously affect the application of the product.

[0036] Therefore, the present application provides a laser focusing servo device, which comprises: a laser cutting device, comprising a light source assembly and a first focusing assembly, the light source assembly is configured to focus cutting laser on the surface of the object to be cut, and the first focusing assembly is configured to adjust the position of the cutting laser focusing spot to maintain it within a preset range of the surface of the object to be cut; a distance measuring assembly for real-time detection of the height of the surface of the object to be cut from the first focusing assembly at a preset distance in front of the cutting laser focusing spot along the cutting direction; a controller connected with the laser cutting device and the distance measuring assembly, configured to receive the detection result of the distance measuring assembly and control the first focusing assembly according to the detection result, so that the position of the cutting laser focusing spot is maintained within the preset range.

[0037] In the execution of the laser cutting task, the measurement spot of the distance measuring sensor is aligned with the position in front of the cutting laser spot, and the height of the cutting position is measured by the distance measuring sensor before cutting, so that the distance measuring sensor can timely feedback the height deviation of the surface of the object to be cut, and the focusing device can timely respond to the height deviation and adjust the cutting laser focal length, thereby ensuring that the cutting laser focal point always remains on the surface of the object to be cut during the laser cutting process. To solve the technical problem of accurate cutting in the case of warping, special shape and other special conditions of the object to be cut.

[0038] The optional embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0039] As Figures 1-2As shown, this application provides a laser focusing follow-up device, including a laser cutting device 1, a ranging component 2, and a controller 3. The laser cutting device 1 includes a light source component 11 and a first focusing component 12. The light source component 11 is used to emit a cutting laser and focus the cutting laser onto the surface of the object to be cut. The first focusing component 12 is configured to adjust the position of the focused spot of the cutting laser to maintain it within a preset range on the surface of the object to be cut. The ranging component 2 is used to detect in real time the height of the surface of the object to be cut from the first focusing component 12 at a preset distance in front of the focused spot of the cutting laser along the cutting direction. The controller 3 is connected to the laser cutting device 1 and the ranging component 2, and is configured to receive the detection result of the ranging component 2 and control the first focusing component 12 according to the detection result so that the position of the focused spot of the cutting laser is maintained within the preset range.

[0040] This embodiment does not limit the specific optical path structure and optical components of the laser cutting device 1. A suitable laser source with appropriate power and wavelength can be selected, and a suitable focusing optical path can be constructed based on factors such as the material and thickness of the object to be cut. Objects to be cut include, for example, wafers, ceramic substrates, metal plates, and composite materials. This application uses wafers, which have more demanding cutting conditions, as an example for illustration.

[0041] Optionally, such as Figure 2 As shown, the light source assembly 11 includes a laser 111, a beam expander 112, a prism 113, and a focusing lens 114. The laser 111 selects a continuous laser of appropriate wavelength and power as needed. The laser emitted by the laser 111 is expanded and / or shaped by the beam expander 112 to form a cutting laser. The cutting laser is then totally reflected by the prism 113 and directed towards the focusing lens 114, which focuses the cutting laser within a preset range on the surface of the object to be cut.

[0042] In some embodiments, the preset range is ±0.05 mm from the surface of the object to be cut. For example... Figure 3 As shown, +0.05 mm means the laser spot O is focused 0.05 mm above the surface of the object to be cut 51; -0.05 mm means the laser spot is focused 0.05 mm below the surface of the object to be cut. Due to various error factors, the focusing position of the laser spot O will have an error range. According to the actual cutting requirements, the laser spot focusing within ±0.05 mm of the surface of the object to be cut has basically no impact on the cutting. However, if it exceeds this range, the laser energy cannot be concentrated due to the large laser spot size, which will lead to incomplete cutting and affect the cutting efficiency. Therefore, this embodiment limits the preset range to ±0.05 mm from the surface of the object to be cut.

[0043] Optionally, the first focusing assembly 12 is connected to the focusing lens 114 and is used to adjust the position of the focusing lens 114 to adjust the position of the laser spot. Specifically, the first focusing assembly 12 includes a driving device such as a stepper motor or a micro motor, and a threaded part or a lead screw extending along the optical path direction. The focusing lens 114 is disposed on the threaded part or the lead screw, and the focusing lens 114 is driven by the driving device to move bidirectionally along the threaded part or the lead screw (i.e., the optical path axis direction) to adjust the focusing depth of the cutting laser spot.

[0044] In such Figure 2 In the illustrated embodiment, the ranging sensor 21 is tilted at a certain angle to align with the cutting light spot for distance measurement. This ranging method has a simple structure and flexible configuration, and can be arranged in a location with available space according to the actual position of the light source component 11. However, this setting method requires the emitted laser to be tilted and incident on the surface of the object to be measured. If the tilt angle is too large, most of the light will be reflected in other directions, resulting in a weak received light signal and unstable measurement accuracy.

[0045] Based on this, in some embodiments, such as Figure 4 As shown, the ranging component 2 includes: a ranging sensor 21 configured to emit and receive a ranging laser; a rotating galvanometer 22 for adjusting the direction of the ranging laser to adjust its position on the surface of the object to be cut; and a dichroic mirror 23 disposed between the prism 113 and the focusing lens 114, for transmitting the cutting laser emitted by the laser 111 to the object to be cut, and simultaneously reflecting the ranging laser and the cutting laser in approximately the same direction to the object to be cut. In this embodiment, since the ranging laser is directed toward the object to be cut in a roughly perpendicular direction, most of the reflected light is received, thereby improving the ranging accuracy of the ranging component. Furthermore, by rotating the rotating galvanometer 22, the position of the light entering the dichroic mirror 23 can be adjusted, such as... Figure 5 As shown, the positional relationship between the ranging laser and the cutting laser can be adjusted. When changing the cutting direction, the angle of the rotating galvanometer 22 can be adjusted to ensure that the ranging laser is always in front of the cutting laser, achieving the goal of detection before cutting. It can be understood that by adjusting the angle of the rotating galvanometer 22, the ranging laser can be positioned anywhere around the cutting laser. Therefore, regardless of the cutting direction, adjusting the angle of the rotating galvanometer 22 ensures that the ranging laser is always in front of the cutting laser, achieving the goal of detection before cutting.

[0046] The ranging sensor 21 uses frequency modulated continuous wave (FMCW) for ranging. FMCW can accurately measure distance by changing the frequency of light waves, and has the following outstanding advantages:

[0047] High-precision measurement capability: Based on the coherent reception principle, FMCW ranging can achieve sub-micron accurate distance measurement, with displacement accuracy up to nanometer level.

[0048] Adapting to different measurement distances: Whether it is close or far distance, FMCW technology can maintain high measurement accuracy and stability.

[0049] Adapting to different materials: The measurement is not affected by material color, environmental light, etc., and can effectively measure various materials.

[0050] The ranging sensor 21 adopts a laser coaxial transceiving measurement method. Compared with the traditional triangulation laser sensor, it has the following advantages:

[0051] Avoiding the area that cannot be measured due to dead angle: The laser coaxial transceiving method does not produce dead angle, supporting the measurement demand of narrow measurement space.

[0052] Miniaturized integrated design: Using integrated optical packaging technology, it realizes miniaturization, light weight and integrated design, and is convenient and flexible to use.

[0053] Multi-channel synchronous measurement and analysis: Support for synchronous measurement and analysis of multiple channels to improve the accuracy and reliability of measurement.

[0054] Ten-micron measurement spot: With a ten-micron measurement spot size, it is suitable for effective analysis and detection of microstructures.

[0055] Analog and digital signal dual output mode: Provides flexible output mode, compatible with different customer data acquisition needs.

[0056] Sensor secondary development support: Support for secondary development of sensors to provide users with more custom functions and application scenarios.

[0057] In some embodiments, the preset distance L satisfies the following relationship: L = (T1 + T2) * V; wherein T1 is the time for the controller to receive the detection result and perform calculation according to the detection result; T2 is the execution time of the first focusing assembly for executing the focusing process, and V is the moving speed of the object to be cut. For example, Figure 6As shown, the position of the cutting laser spot is set as position B, the position of the detection spot of the detection laser is set as position A in front of the cutting direction, the distance between position A and position B is L, the detection laser detects position A which is L away from the cutting position B in real time, when the height of position A is unchanged or within a preset range, the first focusing assembly 12 does not adjust the focal length of the focusing mirror 114, at this time it is assumed that the surface of the object to be cut is flat, without warping or concave-convex, and the cutting effect can be maintained by continuing to cut. When the height of the object to be measured detected by position A is inconsistent with the height during calibration, at this time, the controller receives the detection result and calculates according to the detection result, and gives the calculation result, for example, it needs to be adjusted by +0.1 mm, and this period of time is recorded as T1. The first focusing assembly responds to the control command of the controller and executes the instruction of focusing +0.1 mm, until the execution time of the adjustment +0.1 mm process is completed, which is recorded as T2. V is the moving speed of the object to be cut, that is, the advancing speed of the laser cutting, therefore, after passing through a distance of L=(T1+T2)*V, the original height changed position A is just cut by the laser, that is, the position B at this time. Because of the timely adjustment of the spot, the focused spot can still maintain the condition of being within the preset range on the surface of the object to be cut at this time, and precise cutting is achieved. In some embodiments, the cutting speed is 200 mm / s. Therefore, if the object to be cut moves too fast, the first focusing assembly 12 does not respond in time after the distance feedback, resulting in that the laser focal point has been cut to the measurement position, and the distance measurement fails. Therefore, the distance measurement should be in front of the laser focal point by a preset position, which is proportional to the moving speed of the object to be cut, the greater the cutting speed, the farther the distance measurement ahead of the laser focal point.

[0058] In some embodiments, the laser focusing servo device further comprises a monitoring assembly 4, which is used to monitor the cutting state of the object to be cut; the monitoring assembly 4 comprises: a camera 41 for obtaining the cutting image of the surface of the object to be cut; and a second focusing assembly 42 for adjusting the focal length of the camera 41 to make it clearly imaged. The cutting effect can be observed through the monitoring assembly 4, for example, whether there is a broken line during cutting, and the width change of the cutting track, whether there is edge collapse or slag accumulation, etc. can be detected in real time, so as to further assist in monitoring the laser cutting process and achieve the purpose of precise monitoring. In addition, since the camera 41 monitors the reflected light path of the cutting laser used, in order to make the camera 41 clearly imaged in real time after the first focusing assembly 12 is adjusted, the focal length of the second focusing assembly 42 needs to be adjusted at the same time.

[0059] In some embodiments, the light source assembly 11 further comprises a beam splitter 115, which is arranged on the light emitting side of the beam expander 112, and is used to transmit the cutting laser emitted by the laser 111 to the object to be cut, and at the same time reflect the reflected light of the surface of the object to be cut to the camera 41.

[0060] In some embodiments, the laser focus servo device further comprises a moving platform 5 for carrying the object to be cut 51 and moving the object to be cut in a predetermined direction. For example, a wafer is adsorbed by a wafer adsorption platform, and the wafer is controlled to move in XYZ direction.

[0061] In some embodiments, the laser focus servo device further comprises a calibration device for calibrating the initial positions of the ranging assembly 2 and the first focusing assembly 12 before performing the cutting task. The calibration device can be multiplexed with the moving platform 5 as described above, or can be separately provided. As shown in the figure, the calibration is performed by placing the object to be cut, such as a wafer (or a planar substrate such as ceramic), at an angle to the scribe line. Figure 7 As shown in the figure, the calibration is performed by placing the object to be cut, such as a wafer (or a planar substrate such as ceramic), at an angle to the scribe line. Figure 7 As shown in the figure, the wafer is inclined at an angle of 30°, the ranging assembly 2 and the laser cutting device 1 are turned on, and the cutting is performed at a speed of 200 mm / s. Since the wafer surface is not horizontal, the focal length of the cutting laser needs to be adjusted in real time according to the detection results of the ranging assembly. If the cutting path is not of equal width, it means that the focal point change has not followed, and the distance L between the ranging laser spot and the cutting laser spot needs to be adjusted until the cutting line is of equal width. At this time, the calibration is completed, and in subsequent cutting, the laser cutting device can respond to the ranging device in real time to perform equal-width cutting.

[0062] The prior art mainly solves the problem of optical system thermal drift, and lacks effective compensation means for random deformation of workpieces (such as wafer and ceramic substrate warping), resulting in inconsistent cutting path width or failure to cut through. The present application can dynamically collect cutting path displacement parameters, adjust the cutting laser focal point position in real time, and ensure that the cutting laser focal point is within the preset range of the surface to be cut, to achieve precise cutting.

[0063] After the focal point of the optical path changes, the coaxial imaging system cannot be adjusted in real time, resulting in blurred imaging and affecting processing accuracy. The present application aims to solve the problem of cutting caused by material surface warping by real-time monitoring and dynamic adjustment of the focal point of the optical path, dynamically compensating the displacement of the camera focal point, and ensuring that the camera image is clear and visible throughout the cutting process.

[0064] In the prior art, it is necessary to ensure the flatness of the surface of the wafer, ceramic and other objects to be cut to prevent defocusing from causing poor cutting effect. The present application does not need to consider the problem of inconsistent flatness of the surface of the object to be cut, and the cutting device can be automatically adjusted to improve the cutting effect.

[0065] Finally, it should be noted that: in the present specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts of each embodiment can be referred to each other.

[0066] The above examples are only used to illustrate the technical solutions of the present application, and are not intended to limit the present application; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that the technical solutions recorded in the foregoing examples can be modified, or some technical features can be replaced by equivalent features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A laser focusing follower device, characterized in that, include: A laser cutting device (1) includes a light source assembly (11) and a first focusing assembly (12). The light source assembly (11) is configured to focus a cutting laser onto the surface of the object to be cut, and the first focusing assembly (12) is configured to adjust the position of the focused spot of the cutting laser so that it is maintained within a preset range on the surface of the object to be cut. The ranging component (2) is used to detect in real time the height of the surface of the object to be cut from the first focusing component (12) at a preset distance in front of the cutting laser focusing spot along the cutting direction; The controller (3) is connected to the laser cutting device (1) and the ranging component (2), and is configured to receive the detection result of the ranging component (2) and control the first focusing component (12) according to the detection result so that the position of the cutting laser focused spot is maintained within the preset range; The preset distance L satisfies the following relationship: L=(T1+T2)*V; where T1 is the time for the controller to receive the detection result and perform calculations based on the detection result; T2 is the execution time of the focusing process performed by the first focusing component, and V is the moving speed of the object to be cut; the preset range is ±0.05mm from the surface of the object to be cut.

2. The laser focusing follower device as described in claim 1, characterized in that: The light source assembly (11) includes a laser (111), a beam expander (112), a prism (113), and a focusing lens (114); the cutting laser emitted by the laser (111) is expanded by the beam expander (112), and then passes through the prism (113) and is directed to the focusing lens (114), and the focusing lens (114) focuses the cutting laser within a preset range on the surface of the object to be cut; The first focusing component (12) is connected to the focusing lens (114) and is used to adjust the position of the focusing lens (114) to adjust the position of the laser spot.

3. The laser focusing follower device as described in claim 2, characterized in that: The ranging component (2) includes: A ranging sensor (21) is configured to emit and receive ranging lasers; A rotating galvanometer (22) is used to adjust the direction of the ranging laser to adjust the position of the ranging laser on the surface of the object to be cut.

4. The laser focusing follower device as described in claim 3, characterized in that: The ranging component (2) also includes: A dichroic mirror (23) is disposed between the prism (113) and the focusing mirror (114) to transmit the cutting laser emitted by the laser (111) to the object to be cut, and at the same time reflect the ranging laser and the cutting laser in the same direction to the object to be cut.

5. The laser focusing follower device as described in claim 2, characterized in that: It also includes a monitoring component (4) for monitoring the cutting state of the object to be cut; including: Camera (41) is used to obtain a cutting image of the surface of the object to be cut; The second focusing assembly (42) is used to adjust the focal length of the camera (41) to make it clear.

6. The laser focusing follower device as described in claim 5, characterized in that: The light source assembly (11) also includes: A beam splitter (115) is disposed on the light-emitting side of the beam expander (112) to allow the cutting laser emitted by the laser (111) to be transmitted to the object to be cut, while reflecting the reflected light from the surface of the object to be cut to the camera (41).

7. The laser focusing follower device as described in claim 1, characterized in that: Also includes: A calibration device is used to calibrate the initial positions of the ranging component (2) and the first focusing component (12) before performing the cutting task.

8. The laser focusing follower device as described in claim 1, characterized in that: Also includes: The motion platform (5) is used to carry the object to be cut and to move the object to be cut along a predetermined direction.

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