Injection mold, manufacturing method of sensor and sensor

Abstract

The invention provides an injection mold, a manufacturing method of a sensor and the sensor, and relates to the technical field of molds. According to the injection mold provided by the invention, the to-be-injection-molded component is positioned in the first cavity through insertion of the positioning part, and compared with a positioning form of directly clamping the to-be-injection-molded component to position the to-be-injection-molded component in the prior art, the positioning form of inserting the positioning part into the to-be-injection-molded component has the advantages that the positioning efficiency is greatly improved; and the outer surface of the to-be-injection-molded component cannot be greatly shielded, so that the situation that the outer surface of the to-be-injection-molded component cannot be effectively coated is avoided. Similarly, compared with a positioning mode of firstly clamping the to-be-injection-molded component, then removing the clamping component and then performing injection molding in the related technology, the injection mold provided by the invention has the advantages that the clamping component does not need to be removed after the to-be-injection-molded component is positioned, and the injection molding efficiency is improved under the condition of ensuring that the outer surface of the to-be-injection-molded component is effectively coated. And the complexity of injection molding process operation is reduced.

Description

Technical Field

[0001] This application relates to the field of mold technology, and in particular to a method for manufacturing an injection mold and a sensor. Background Technology

[0002] In injection molding technology, it is necessary to encapsulate the parts to be molded, such as the circuit board of a sensor. In related technologies, after injection molding, an injection-molded shell is formed around the parts, and the position of the parts within the injection-molded shell is difficult to determine. Summary of the Invention

[0003] The inventors discovered that in the related technologies, the injection-molded parts are positioned by clamping. However, during the process from placing the injection-molded parts to clamping them, the parts are prone to shifting, resulting in low positioning accuracy and making it difficult to determine the position of the injection-molded parts within the injection-molded shell.

[0004] In view of the above, in a first aspect, this application provides an injection mold, comprising:

[0005] An upper mold and a lower mold, wherein the upper mold and the lower mold define a first cavity for accommodating a component to be injection molded;

[0006] A positioning part is located in the first cavity and is connected to at least one of the upper mold and the lower mold. The positioning part is at least partially used to insert the component to be injection molded.

[0007] In this application, the positioning part is at least partially used to insert the component to be injection molded, thereby positioning the component to be injection molded in the first cavity and reducing the displacement of the component to be injection molded during the injection process.

[0008] Preferably, the positioning part is disposed on the upper mold, the positioning part has a positioning surface facing the lower mold, the positioning surface is spaced apart from the upper mold, the positioning surface is at least partially located between the upper mold and the component to be injection molded, and the positioning surface is used to contact the component to be injection molded;

[0009] Alternatively, the positioning part is disposed on the lower mold, the positioning part has a positioning surface facing the upper mold, the positioning surface is spaced apart from the lower mold, the positioning surface is at least partially located between the lower mold and the component to be injection molded, and the positioning surface is used to contact the component to be injection molded;

[0010] The number of the positioning parts is multiple and / or the cross-section of the positioning parts is a non-circular shape.

[0011] Preferably, the positioning part is disposed on the upper mold, and the upper mold and the lower mold further define a second cavity for accommodating the component to be injection molded. When the component to be injection molded is accommodated in the second cavity, the component to be injection molded can be spaced apart from the lower mold, and the upper mold can be sealed with the component to be injection molded. The component to be injection molded has electronic components. The first cavity has a groove on the surface of the lower mold, and the groove can accommodate the electronic components. When the component to be injection molded is accommodated in the first cavity, the lower mold is used to seal with the component to be injection molded, and the upper mold can be spaced apart from the component to be injection molded.

[0012] Alternatively, the positioning part can be disposed in the lower mold, and the component to be injection molded can be spaced apart from both the upper mold and the lower mold when it is housed in the first cavity.

[0013] Preferably, the number of the positioning parts is at least two, and the line connecting two of the at least two positioning parts is inclined relative to the side line direction of the first cavity.

[0014] Preferably, the first cavity has a first wire harness receiving cavity, the cavity wall of the first wire harness receiving cavity being spaced apart from the component to be injection molded; wherein, the upper mold and the lower mold further define a second cavity for receiving the component to be injection molded, the second cavity having a second wire harness receiving cavity.

[0015] Preferably, the upper mold and the lower mold further define a second cavity for receiving the component to be injection molded;

[0016] The injection mold further includes a first venting portion and a second venting portion, wherein the first venting portion has a first recessed portion disposed on the upper mold facing the lower mold side, and the first recessed portion communicates with the first cavity; the second venting portion has a second recessed portion disposed on the lower mold facing the upper mold side, and the second recessed portion communicates with the second cavity; or

[0017] The injection mold further includes a third venting portion and a fourth venting portion. The third venting portion has a third recessed portion disposed on the lower mold facing the upper mold side, and the third recessed portion communicates with the first cavity. The fourth venting portion has a fourth recessed portion disposed on the lower mold facing the upper mold side, and the fourth recessed portion communicates with the second cavity.

[0018] Preferably, the upper mold and the lower mold further define a second cavity for receiving the component to be injection molded, the component having a main body portion;

[0019] The injection mold further includes a first injection channel, which has a first opening and a second opening;

[0020] Within the first cavity, a first space exists between the upper mold and the lower mold and the component to be injection molded, and the first opening faces the first space.

[0021] Within the second cavity, a second space exists between the upper mold and the lower mold and the component to be injection molded, and the second opening opens toward the second space.

[0022] Preferably, the first injection runner is defined by the upper mold and the lower mold, and the first injection runner includes a first runner portion located in the upper mold and a second runner portion located in the lower mold, wherein the first runner portion and the second runner portion are in communication.

[0023] The first flow channel portion has the first opening, and the second flow channel portion has the second opening.

[0024] Secondly, this application provides a method for manufacturing a sensor, comprising the following steps: providing a component to be injection molded and an injection mold, wherein the injection mold includes an upper mold, a positioning part and a lower mold, and a first cavity is defined by the upper mold and the lower mold;

[0025] The component to be injection molded is placed into the first cavity, and the positioning part is at least partially inserted into the component to be injection molded, and the component to be injection molded is used as an insert for injection molding.

[0026] The positioning part is located in the first cavity and is connected to at least one of the upper mold and the lower mold.

[0027] Preferably, the positioning part is connected to the upper mold, and the upper mold and the lower mold define a second cavity;

[0028] The component to be injection molded is placed into the first cavity, the positioning part is at least partially inserted into the component to be injection molded, the lower mold is sealed with the component to be injection molded, and the first shell is formed by injection molding with the component to be injection molded as an insert.

[0029] The first housing and the component to be injection molded are placed into the second cavity, and the first housing is sealed with the upper mold to form the second housing by injection molding; wherein the first housing and the second housing are an integral part.

[0030] Thirdly, this application provides a sensor, the sensor including a circuit board, the circuit board having a through hole, the through hole being disposed through the circuit board;

[0031] The sensor also includes a housing, which includes a first housing and a second housing covering the outside of the circuit board. The housing includes a filling portion, which is at least partially located in the through hole. The first housing, the filling portion and the second housing are integral parts.

[0032] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0033] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0034] Figure 1 A schematic diagram showing a three-dimensional view of an injection mold provided according to an embodiment of this application is provided.

[0035] Figure 2 A schematic diagram of a cross-sectional view of the connection between the upper and lower molds of an injection mold provided according to an embodiment of this application is shown.

[0036] Figure 3 It shows Figure 2 A schematic diagram of the enlarged view at point A in the middle.

[0037] Figure 4 A schematic diagram showing an injection mold with some components omitted according to an embodiment of this application is shown.

[0038] Figure 5 A schematic diagram showing an exploded view of an injection mold with some parts omitted according to an embodiment of this application is provided.

[0039] Figure 6 A schematic diagram showing an injection mold with some components omitted according to an embodiment of this application is shown.

[0040] Figure 7 Show Figure 6 A schematic diagram of the enlarged view at point B in the middle.

[0041] Figure 8 A schematic diagram showing a three-dimensional view of a sensor provided according to an embodiment of this application is shown.

[0042] Figure 9 Another schematic diagram of a three-dimensional view of a sensor provided according to an embodiment of this application is shown.

[0043] Figure 10A schematic diagram of a portion of the structure of a sensor provided according to an embodiment of this application is shown.

[0044] Figure label:

[0045] 100 - Injection mold;

[0046] 10-Upper mold; 11-Limiting component; 12-First venting part; 121-First recessed part; 13-Groove; 20-Lower mold; 21-Second venting part; 212-Second recessed part;

[0047] 210 - First cavity; 211 - First wire harness receiving cavity; 220 - Positioning part; 221 - Positioning surface; 230 - Second cavity; 231 - Main body receiving part; 232 - Second wire harness receiving cavity;

[0048] 300 - First injection runner; 310 - First runner section; 311 - Second extension groove section; 320 - First opening; 330 - Second runner section; 331 - First extension groove section; 340 - Second opening;

[0049] 400 - Second injection runner; 410 - Connection position;

[0050] 700 - Component to be injection molded; 710 - Main body; 720 - Wiring harness;

[0051] 800 - Sensor; 810 - Circuit board; 820 - Through hole; 830 - Housing; 831 - First housing; 832 - Second housing; 833 - Filling part. Detailed Implementation

[0052] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0053] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0054] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0055] Furthermore, the technical solutions of the various embodiments can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0056] According to an embodiment of this application, an injection mold 100 is provided, which will be described below in conjunction with... Figures 1 to 7 The structure and working principle of injection mold 100 are described in detail.

[0057] Prior to this application, related technologies primarily employed two positioning methods for injection-molded parts. One method involved directly clamping the part in the mold during mold closing. In this method, to ensure reliable positioning, a significant portion of the part needed to be clamped, which would be exposed during injection molding as it wouldn't be covered by plastic. The other method involved using additional positioning structures, such as positioning posts inserted into the mold and abutting against the part from both sides. In this method, the positioning posts needed to be removed from the mold during the latter part of the injection molding process before plastic was filled into the space previously occupied by the positioning posts. However, this resulted in a cumbersome injection molding process.

[0058] Therefore, current related technologies struggle to strike a balance between addressing the exposed portion of the injection-molded part and the complexity of the process. Either the former approach results in a larger exposed portion of the part, while the latter leads to a cumbersome process in order to completely cover the part. Thus, there is still room for improvement in injection molds in related technologies. This application proposes an injection mold as described in the embodiments.

[0059] According to an embodiment of this application, an injection mold 100 includes an upper mold 10, a lower mold 20, and a positioning part 220. The upper mold 10 and the lower mold 20 are in contact with each other, and a first cavity 210 is defined by the upper mold 10 and the lower mold 20. The first cavity 210 is used to accommodate a component 700 to be injection molded. In an embodiment, the positioning part 220 is located within the first cavity 210, and the positioning part 220 is connected to at least one of the upper mold 10 and the lower mold 20. The positioning part 220 is used to insert the component 700 to be injection molded, so as to position the component 700 to be injection molded within the first cavity 210.

[0060] Thus, according to the injection mold 100 provided in this application embodiment, the component 700 to be injection molded is positioned in the first cavity 210 by the insertion of the positioning part 220. This positioning method, where the positioning part 220 is inserted into the component 700, compared to the positioning method in related technologies that directly clamps the component 700 to be injection molded, does not significantly obstruct the outer surface of the component 700, thereby avoiding the situation where the outer surface of the component 700 cannot be effectively covered. Similarly, compared to the positioning method in related technologies that first clamps the component 700 to be injection molded, then removes the clamping parts before injection molding, the injection mold 100 provided in this application embodiment eliminates the need to remove the clamping parts after positioning the component 700, thus reducing the complexity of the injection molding process while ensuring that the outer surface of the component 700 is effectively covered.

[0061] like Figure 1 As shown, in an embodiment, when injection molding is performed using injection mold 100, the upper mold 10 and the lower mold 20 can be spaced apart in the vertical direction, that is, the upper mold 10 can be located above the lower mold 20, and the two can be connected together by a guide rod commonly used in molds such as those in related technologies.

[0062] In an embodiment, the first cavity 210 defined by the upper mold 10 and the lower mold 20 may be jointly defined, for example, by the lower surface of the upper mold 10 and the upper surface of the lower mold 20. As an example, at least one of the upper mold 10 and the lower mold 20 has a recess for forming a portion of the first cavity 210; for example, the upper mold 10 may have a recess while the lower mold 20 does not, or the upper mold 10 may not have a recess while the lower mold 20 does. Figure 2 As shown, in this embodiment, as an example, both the upper mold 10 and the lower mold 20 may have recessed portions. When the upper mold 10 and the lower mold 20 are connected, the two recessed portions merge together to form the first cavity 210.

[0063] In this embodiment, the component 700 to be injection molded should be understood as a component that has not yet completed the injection molding operation but is yet to be injection molded or is yet to be further injection molded. For example... Figure 4As shown, as an example, the injection-molded component 700 may have a main body 710 and a wiring harness 720. The main body 710 may have a circuit board and electrical components integrated on the circuit board. The wiring harness 720 may be electrically connected to the circuit board and extend horizontally or substantially horizontally outward from the connection position between the wiring harness 720 and the circuit board.

[0064] In embodiments, the positioning portion 220 may be, for example, a protrusion protruding from at least one of the upper mold 10 and the lower mold 20. As an example, the positioning portion 220 may be provided on the upper mold 10 and protrude toward the lower mold 20; alternatively, in other examples, the positioning portion 220 may be provided on the lower mold 20 and protrude toward the upper mold 10. Furthermore, alternatively, both the upper mold 10 and the lower mold 20 may have positioning portions 220, with the positioning portion 220 on the upper mold 10 protruding toward the lower mold 20, and a second positioning portion 220 on the lower mold 20 protruding toward the upper mold 10.

[0065] In this embodiment, "the positioning part 220 is used to insert into the component 700 to be injection molded" should be understood to include the following meaning: the component 700 to be injection molded has a positioning part located within the component 700 to accommodate the positioning part 220, the inner side of which defines a positioning space, and at least a portion of the positioning part 220 is inserted into the positioning space. In this embodiment, it should be noted that "insertion" is intended to indicate that at least a portion of the positioning part 220 is located within the component 700 to be injection molded, and is not intended to limit the fit between at least a portion of the positioning part 220 and the component 700 to be injection molded to be an interference fit.

[0066] In an embodiment, the positioning portion of the component 700 to be injection molded can be, for example, a defect structure. Here, the defect structure can be, for example, a groove, a through hole, or a notch structure formed on a circuit board. The form of the positioning portion 220 associated with these structures will be described in the following description.

[0067] As an example, the component 700 to be injection molded may have the groove described above, which may be formed, for example, on a circuit board. Correspondingly, the positioning part 220 may be, for example, a columnar structure, which can be inserted into the groove and contact the inner wall of the groove.

[0068] Alternatively, the injection-molded component 700 may have the above-described through-hole, which may also be formed, for example, on a circuit board, meaning that the through-hole penetrates the circuit board. The positioning portion 220 may still be, for example, a columnar structure, which can be inserted into the through-hole and contact the inner wall of the through-hole.

[0069] Alternatively, the notch structure can be a through-circuit structure or a non-through-circuit structure. The notch structure can be located at the edge of the circuit board and extend outward from the edge of the circuit board to form an open notch at the edge of the circuit board. Similarly, the positioning part 220 can still be, for example, a columnar structure that can be inserted into the notch structure and contact the inner wall of the notch structure.

[0070] In embodiments, the positioning portion 220 can be inserted into the defect structure in different ways. Specifically, in one example, the positioning portion 220 can be fully inserted into the defect structure (e.g., fully inserted into a groove, through-hole, or notch structure); in other words, the positioning portion 220 can be completely located within the positioning space defined by the defect structure. In this example, since the positioning portion 220 is completely accommodated by the positioning space, the injection-molded component 700 can substantially conform to the mold in which the positioning portion 220 is located.

[0071] For example, when the positioning part 220 is provided on the lower mold 20, since the positioning part 220 is completely contained by the positioning space, the lower surface of the component 700 to be injection molded can fit against the upper side of the lower mold 20. In this case, during the injection molding process, the upper side of the component 700 to be injection molded can be injection molded first, and after the upper side is injection molded, the lower side of the component 700 to be injection molded can be injection molded (during this process, any missing structures that were not filled when the upper side was injection molded can be filled). That is, in this example, the component 700 to be injection molded can be subjected to a two-stage injection molding operation. In this example, the two-stage injection molding operation of the component 700 to be injection molded can be performed by transferring the component 700 to be injection molded into another cavity different from the first cavity 210 (e.g., the second cavity 230 mentioned later), which will be explained in the following description.

[0072] Alternatively, in another example, the positioning part 220 may be partially inserted into a defective structure (e.g., fully inserted into a groove, through-hole, or notch structure). For example, part of the positioning part 220 may be exposed between the mold containing the positioning part 220 and the component 700 to be injection molded. That is, this partial insertion of the positioning part 220 creates a space for the flow of the injection medium between the mold containing the positioning part 220 and the component 700 to be injection molded, thereby enabling injection molding of the side of the component 700 to be injection molded facing the mold containing the positioning part 220 using this space.

[0073] Similar to the example above, even if injection molding can be performed on one side of the mold facing the positioning part 220, the other side of the component to be injection molded can be selected to be injection molded in another molding process, i.e., two molding processes as described above. However, in this example, the component to be injection molded can also be directly injection molded as a whole within the same cavity, such as the first cavity 210.

[0074] As an example, the positioning part 220 can be interference-fitted with the defect structure to prevent the positioning part 220 from being further inserted into the defect structure, thereby exposing a portion of the positioning part 220 outside the defect structure, that is, exposed between the mold containing the positioning part 220 and the component to be injection molded 700. Alternatively, when the defect structure is formed as a groove, the end of the positioning part 220 can also abut against the bottom of the groove, thus preventing it from further entering the groove. That is, the length of the positioning part 220 is greater than the depth of the groove, so that a portion of the positioning part 220 is exposed outside the groove.

[0075] In both of the above methods of exposing the positioning part 220 outside the defect structure, when the side of the injection molding component 700 where the positioning part 220 is located is injection molded until the injection molding is completed, the defect structure will separate from the positioning part 220. At this time, the defect structure will not be filled by the injection medium due to its previous engagement with the positioning part 220. However, even so, the exposed area of ​​the defect structure is very small and can be ignored.

[0076] As an alternative, the structure of the positioning part 220 itself can be used to expose a portion of the positioning part 220 outside the defective structure. Combined with Figure 6 and Figure 7 , Figure 6 A schematic diagram of the lower surface of the upper mold 10 is shown in particular. Figure 7 It shows Figure 6 The diagram shows an enlarged view of the positioning part 220. In this example, the positioning part 220 can have a stepped structure, meaning that the positioning part 220 has a larger portion with a larger cross-sectional area (i.e., the area of ​​a cross section, where the cross section refers to the cross section obtained by cutting the positioning part 220 with a plane perpendicular to its extending direction, which can be, for example, vertical) and another portion with a smaller cross-sectional area. The larger portion can be connected to the corresponding mold. That is, in the example where the positioning part 220 is connected to the upper mold 10, the larger portion can be connected to the upper mold 10, while the smaller portion can have the end of the positioning part 220.

[0077] Continue to see Figure 6 and Figure 7A smaller portion and a larger portion form a stepped surface. As an example, both portions can be cylindrical, and the stepped surface can be, for example, an annular surface. In this example, the stepped surface abuts against the injection-molded component 700, thereby forming a gap with the length of the larger portion between the mold (here, for example, the upper mold 10) where the positioning part 220 is located and the injection-molded component 700. This gap is used to accommodate the injection medium.

[0078] Similar to the previously described example, after injection molding on the side where the positioning portion 220 of the component 700 is located, the defect structure, which was not filled by the injection medium due to its previous engagement with the positioning portion 220, will still be exposed. However, the exposed area is very small and can be ignored. Furthermore, this exposure can also be filled by a second injection molding in the secondary molding process. Specifically, the defect structure can be a through hole, and the length of the smaller portion of the positioning portion 220 can be greater than the length of the through hole. This portion of the positioning portion 220 penetrates the through hole, so that after the first molding is completed, the defect structure, as a through hole, can still connect both sides of the component 700.

[0079] Therefore, in the second injection molding, the injection medium can flow from the side of the component 700 that has not yet been injection molded into the through hole, and further flow through the through hole to the exposed portion of the side of the component 700 that has been injection molded. This exposed portion has a circular outer contour due to the space occupied by the stepped surface, and because it is connected to the through hole, it can be filled by the injection medium, so that it is no longer exposed after the second injection molding is completed.

[0080] Furthermore, as mentioned above, both the upper mold 10 and the lower mold 20 may be provided with positioning portions 220; however, the specific structure of the positioning portions 220 may differ. For example, a stepped positioning portion 220 may be provided on the first of the upper mold 10 and the lower mold 20 to provide space for the flow of injection molding medium through the stepped surface of the positioning portion 220, and a through hole that mates with the positioning portion 220 may be provided on the component 700 to be injection molded. Alternatively, a columnar positioning portion 220 may be provided on the second of the upper mold 10 and the lower mold 20, such that one side of the component 700 to be injection molded fits against the mold containing the positioning portion 220, thereby allowing the other side of the component 700 to be injection molded to be injection molded first during injection molding.

[0081] As an example, the aforementioned first part can be, for example, the upper mold 10, and the aforementioned second part can be, for example, the lower mold 20. That is, the columnar positioning part 220 can be provided in the lower mold 20, and the stepped positioning part 220 can be provided in the upper mold 10. Correspondingly, the injection-molded component 700 can be provided with through holes corresponding to the columnar positioning part 220 and through holes corresponding to the stepped positioning part 220, respectively. In the first injection molding, the stepped surface of the stepped positioning part 220 forms a space for injection molding between the upper mold 10 and the upper side of the injection-molded component 700 in the manner described above. Therefore, in this injection molding, due to the penetration of the columnar positioning part 220 and the stepped positioning part 220, the through holes corresponding to the columnar positioning part 220 are not filled with the injection medium or are not completely filled with the injection medium, and the through holes corresponding to the stepped positioning part 220 are not filled with the injection medium.

[0082] Based on this, in the second injection molding process, the lower side of the component 700 to be injection molded is injection molded. The lower openings of the two through holes allow the injection medium to flow in, thereby filling the through holes corresponding to the columnar positioning parts 220, and filling the through holes corresponding to the stepped positioning parts 220 and the annular un-injected area formed by the stepped positioning parts 220. In this way, during the second injection molding process, both the exposed portions left by the positioning parts 220 on the first component and the exposed portions left by the positioning parts 220 on the second component can be filled.

[0083] However, in a specific example, taking into account both the reliability of positioning the injection molded component 700 and the ease of manufacturing the injection mold 100, the stepped positioning part 220 as described above can be provided only on one of the upper mold 10 and the lower mold 20.

[0084] In one embodiment, the positioning part 220 may be connected to the mold on which it is mounted. In another embodiment, the positioning part 220 may be connected to the mold by means of welding, bonding, or some detachable connection. The detachable connection methods mentioned herein include, but are not limited to, threaded connections (e.g., external threads on the positioning part 220 and internal threaded holes on the mold), insertion connections (e.g., insertion holes on the mold), and snap-fit ​​connections (e.g., snap-fit ​​holes on the mold with snap-fit ​​protrusions extending into the hole, or corresponding recessed or protruding snap-fit ​​structures on the outside of the positioning part 220). Alternatively, the positioning part 220 may be integrally formed with the mold on which it is mounted.

[0085] In the embodiments, as mentioned in some of the technical features described above, the positioning part 220 can penetrate through the component to be injection molded 700. In this case, after the first injection molding is completed, it can still ensure that the two sides of the component to be injection molded 700 are connected, so as to facilitate the filling of the exposed part on the first injection molding side of the component to be injection molded 700 in the second injection molding.

[0086] Furthermore, in an embodiment where the positioning part 220 penetrates the component 700 to be injection molded, a hole for the positioning part 220 to be inserted can be further provided on the mold to which the positioning part 220 is facing, so that the positioning part 220 can also be connected to the mold to which it is facing, so that the positioning part 220 also has the function of positioning the upper mold 10 and the lower mold 20.

[0087] Furthermore, in the embodiments, the number of positioning portions 220 can be multiple and / or the cross-section of the positioning portions 220 is a non-circular shape. Specifically, in the example where the cross-section of the positioning portion 220 is circular, to prevent the injection-molded component 700 from twisting around the positioning portion 220 in the plane, the number of positioning portions 220 can be multiple, for example... Figure 7 The two shown are not included. In addition, there can be three, four, five, or even more.

[0088] In the example where the cross-section of the positioning part 220 is a non-circular shape, due to the characteristics of the non-circular shape, the injection molded component cannot twist around the positioning part 220 in a plane. Therefore, the number of positioning parts 220 can be one. However, to improve the positioning reliability of the positioning part 220, multiple positioning parts 220 can be provided, such as two, three, four, or even more positioning parts 220, based on the positioning part 220 with a non-circular cross-section. Here, as an example, the non-circular shape can be, for example, an ellipse, a polygon (e.g., a triangle, a rectangle, or a pentagon).

[0089] According to the injection mold 100 provided in the embodiments of this application, the number of positioning portions 220 is at least two, and the line connecting two of the at least two positioning portions 220 is inclined relative to the side line direction of the first cavity 210. Here, the first cavity may be, for example, generally rectangular in shape, and the line connecting the two positioning portions 220 may be inclined relative to both the long side and the wide side of the rectangle. In the embodiments, as an example, the number of positioning portions 220 may be two.

[0090] According to the injection mold 100 provided in the embodiments of this application, a second cavity 230 for accommodating a component 700 to be injection molded is further defined by an upper mold 10 and a lower mold 20. The component 700 to be injection molded may have a main body portion 710 and a wiring harness portion 720 connected to each other as described above. In an embodiment, the component 700 to be injection molded has electronic components, that is, electronic components are provided on the main body portion 710. The first cavity 210 has a groove 13 on the surface of the lower mold 20, which can accommodate the electronic components. When the component 700 to be injection molded is accommodated in the first cavity 210, the lower mold 20 is used for a sealing fit with the component 700 to be injection molded, and the upper mold 10 can be spaced apart from the component 700 to be injection molded. In this example, plastic is first filled between the upper mold 10 and the component 700 to be injection molded to complete the first injection molding, and then the second injection molding of the lower surface of the component to be injection molded can be completed in the second cavity 230.

[0091] Furthermore, in this embodiment, the positioning part can be disposed in the lower mold, and when the component to be injection molded is accommodated in the first cavity, it can be spaced apart from both the upper and lower molds. This allows the upper and lower surfaces of the component to be injection molded to be covered in a single injection molding process to complete the injection molding. For example, the positioning part abuts against the lower surface of the component to be injection molded, thereby supporting the component. At the same time, the distance between the upper mold and the upper surface of the component to be injection molded is configured such that the aforementioned two intervals between the component to be injection molded and the upper and lower molds appear.

[0092] In an embodiment, the positioning part 220 may be disposed on the first of the upper mold 10 and the lower mold 20. The positioning part 220 has a positioning surface 221 facing the second of the upper mold 10 and the lower mold 20. The positioning surface 221 may be disposed at a distance from the first mold. The positioning surface 221 may be used to abut against the main body part 710 to form a first space between the main body part 710 and the first mold.

[0093] In one embodiment, the inner wall of the second cavity 230 can be configured to hold the component 700 to be injection molded, thereby forming a second space between the main body 710 and the second component. The first and second spaces can be filled with an injection molding medium to respectively cover the side of the main body 710 facing the first component and the side of the main body 710 facing the second component.

[0094] Thus, according to the injection mold 100 provided in the embodiments of this application, as mentioned above, the positioning surface 221 of the positioning part 220 forms a first space between the upper mold 10 and the lower mold 20 and the component 700 to be injection molded. Here, the positioning surface 221 can be, for example, the stepped surface mentioned above, and the first space can be, for example, the gap between the component 700 to be injection molded and the aforementioned first space for the flow of injection medium.

[0095] In the embodiments, the first space and the second space can be used to perform the first molding and the second molding in the two molding processes described above, respectively. Unlike the way the first space is obtained in the first cavity 210, in the second cavity 230, the second cavity 230 clamps the component 700 to be injection molded, thereby creating a gap between the component 700 to be injection molded and the second of the upper mold 10 and the lower mold 20 for the flow of the injection medium, i.e., the second space.

[0096] According to the injection mold 100 provided in the embodiments of this application, the first cavity 210 may include a first wire harness receiving cavity 211, which can be used to receive the wire harness portion 720. The inner side of the first wire harness receiving cavity 211 may be spaced apart from the outer side of the wire harness portion 720 for filling with injection medium.

[0097] In an embodiment, the second cavity 230 includes a main body receiving portion 231 and a second wire harness receiving cavity 232. The second wire harness receiving cavity 232 can hold the injection molding medium covering the outside of the wire harness portion 720, so that a second space is formed between the main body portion 710 and the second.

[0098] like Figure 4 As shown, the main body 710 may have a circuit board in a cuboid or substantially cuboid shape, and electronic components may be integrated on the circuit board. Therefore, the main body receiving portion 231, adapted to the main body 710, may be a cuboid or substantially cuboid cavity, and the first wire harness receiving cavity 211 and the second wire harness receiving cavity 232 may, for example, be formed as strip-shaped cavities. Furthermore, although not mentioned in the above description, the first cavity 210 may also include a cuboid or substantially cuboid cavity for receiving the main body 710.

[0099] In this embodiment, during the first injection molding process, the injection medium is injected into the first space, thereby covering the side of the main body 710 of the component 700 facing either the upper mold 10 or the lower mold 20 with the injection medium. Since the inner side of the first wire harness receiving cavity 211 is spaced apart from the outer side of the wire harness portion 720 to be filled with the injection medium, the injection medium directly and completely covers the outer side of the aforementioned portion of the wire harness portion 720 of the component 700 during the first injection molding.

[0100] Therefore, in this embodiment, after the first injection-molded component 700 is transferred to the second cavity 230, the injection medium covering the outside of the wire harness portion 720 can be clamped by the second wire harness receiving cavity 232. That is, the mold can be opened after the first injection molding is completed, and then the partially injection-molded component 700 can be transferred to the second cavity, because the injection medium covering the outside of the wire harness portion 720 has solidified at this time, thus forming a "handle"-shaped structure that can be clamped. In this way, the main body portion 710 of the component 700 can be suspended in the main body receiving portion 231, and the side of the main body portion 710 of the component 700 facing the second of the upper mold 10 and the lower mold 20 has the second space between it and the second mold. Using this second space, the injection medium can be injected inward to complete the second injection molding.

[0101] In an embodiment, the first of the upper mold 10 and the lower mold 20 may have a defining member 11 (e.g., detachable from the main structure of the first (here the first may be, for example, the upper mold 10)) that can be removed from the main structure of the first (e.g., detachable from the main structure of the upper mold 10). Figure 4 As shown, the limiting member 11 may have a strip groove to cooperate with the strip groove on the second of the upper mold 10 and the lower mold 20 to form a first wire harness receiving cavity 211.

[0102] In the embodiments, as an example, the first of the upper mold 10 and the lower mold 20 can be, for example, the upper mold 10, and the second of the upper mold 10 and the lower mold 20 can be, for example, the lower mold 20. That is, the first space is located on the upper side of the component to be injection molded 700, that is, there is a first space between the upper side of the component to be injection molded 700 and the side of the first cavity 210 facing the component to be injection molded 700 (i.e., the top side of the first cavity 210), the upper side of the main body 710 of the component to be injection molded 700 is covered in the first injection molding, the second space is located on the lower side of the component to be injection molded 700, that is, there is a second space between the lower side of the component to be injection molded 700 and the side of the second cavity 230 facing the component to be injection molded 700 (i.e., the bottom side of the second cavity 230), the lower side of the main body 710 of the component to be injection molded 700 is covered in the second injection molding.

[0103] Alternatively, in an example not shown, the first of the upper mold 10 and the lower mold 20 may be, for example, the lower mold 20, and the second of the upper mold 10 and the lower mold 20 may be, for example, the upper mold 10. That is, the first space is located on the lower side of the component 700 to be injection molded, and the lower side of the main body 710 of the component 700 to be injection molded is covered in the first injection molding, and the second space is located on the upper side of the component 700 to be injection molded, and the upper side of the main body 710 of the component 700 to be injection molded is covered in the second injection molding.

[0104] Alternatively, the second cavity 230 can employ other clamping methods to suspend the main body 710 of the component 700 to be injection molded within the second cavity 230. Specifically, the main body receiving portion 231 can clamp the injection medium covering the outside of the main body 710, thereby forming a second space between the main body 710 and the second cavity. That is, in the second injection molding, the cured injection medium already obtained in the first injection molding and covering one side of the main body 710 can be used as the clamping object, which means that there is a certain interference relationship between this part of the cured injection medium and the main body receiving portion 231 of the second cavity 230.

[0105] Using this interference fit, the component 700 to be injection molded, which has not yet undergone a second injection molding, can be pressed into the main body receiving portion 231 and into a recess formed, for example, on the first of the upper mold 10 and the lower mold 20, for defining a part of the second cavity 230. This separates the main body portion 710 of the component 700 from the second of the upper mold 10 and the lower mold 20, forming a second space for the flow of the injection medium.

[0106] Furthermore, as an example, the injection medium can be, for example, a thermoplastic, and the injection molding process used can be, for example, a low-pressure injection molding process.

[0107] According to the injection mold 100 provided in the embodiments of this application, such as Figure 3 As shown, the injection mold 100 may further include a first injection channel 300 for the flow of injection medium. The first injection channel 300 may have a first opening 320 communicating with the first cavity 210 and a second opening 340 communicating with the second cavity 230. In an embodiment, within the first cavity 210, the first space may exist between the upper mold 10 and the lower mold 20 and the main body 710, and the first opening 320 may open toward the first space to inject the injection medium into the first space. Within the second cavity 230, the second space may exist between the upper mold 10 and the lower mold 20 and the main body 710, and the second opening 340 opens toward the second space to inject the injection medium into the second space.

[0108] See still Figure 3 and combined Figure 4In this embodiment, the first injection channel 300 may be disposed between the first cavity 210 and the second cavity 230. For example, the first cavity 210 and the second cavity 230 may be spaced apart in a first horizontal direction, and the first injection channel 300 may extend along the first horizontal direction. In this embodiment, the first injection channel 300 has two ends, with the first end facing the first cavity 210 and the second end facing the second cavity 230. The first opening 320 mentioned above may be disposed at the first end of the first injection channel 300, and the second opening 340 may be disposed at the second end of the second injection channel 400.

[0109] In the embodiments, the first injection channel 300 may be formed directly on the upper mold 10, or directly on the lower mold 20, or it may be formed by the structures on the upper mold 10 and the lower mold 20 in a manner similar to the formation of the first cavity 210 and the second cavity 230, which will be described in detail in the following description.

[0110] According to the injection mold 100 provided in the embodiments of this application, as an example, the first injection channel 300 is defined by the structures respectively present on the upper mold 10 and the lower mold 20 in a manner similar to the formation of the first cavity 210 and the second cavity 230. The structure used to define the injection channel can be a groove or a plane.

[0111] According to the embodiments of this application, the injection mold 100 may further include a second injection runner 400. In the embodiments, the second injection runner 400 may intersect with the first injection runner 300 at a communication position 410 to communicate with each other.

[0112] According to the injection mold 100 provided in the embodiments of this application, as mentioned above, the first injection runner 300 may be defined by the upper mold 10 and the lower mold 20. The first injection runner 300 may include a first runner portion 310 located in the upper mold 10 and the lower mold 20, and a second runner portion 330 located in the upper mold 10 and the lower mold 20. In the embodiments, the first injection runner 300 may be formed jointly by the first runner portion 310 and the second runner portion 330. Furthermore, in the embodiments, the first opening 320 may be formed in the first runner portion 310, and the second opening 340 may be formed in the second runner portion 330.

[0113] As an example, the first runner portion 310 may only have a recessed portion from the connecting position 410 mentioned above to the first cavity 210, and the second runner portion 330 may only have a recessed portion from the aforementioned connecting position 410 to the second cavity 230. These two recessed portions are respectively used to introduce the injection medium at the connecting position 410 into the first cavity 210 and the second cavity 230. Correspondingly, the structure on the other mold opposite to the recessed portion of the first runner portion 310 can be a plane. For example, when the first runner portion 310 is provided on the upper mold 10, the position on the lower mold 20 opposite to the first runner portion 310 can be a plane. Similarly, the structure on the other mold opposite to the recessed portion of the second runner portion 330 can be a plane. For example, when the second runner portion 330 is provided on the upper mold 10, the position on the upper mold 10 opposite to the first runner portion 310 can be a plane.

[0114] However, it is not limited to this. The structure on another mold opposite to the grooved portion of the first flow channel 310 can also be a groove, and the structure on another mold opposite to the grooved portion of the second flow channel 330 can also be a groove, which will be explained in detail in the following description.

[0115] According to the injection mold 100 provided in the embodiments of this application, the second runner portion 330 may have a first extension groove portion 331 extending from the communication position 410 to the first cavity 210, the first extension groove portion 331 ending before the first opening 320. Here, the first extension groove portion 331 may be, for example, the groove mentioned above, which together with the first runner portion 310 forms a portion of the first injection runner 300. Specifically, the groove may have the same width as the first runner portion 310, which is a groove, and correspond to each other in position, so as to form a portion of the first injection runner 300 after the upper mold 10 and the lower mold 20 are closed.

[0116] Combination Figure 3 In this embodiment, the first extension groove 331 terminates before the first opening 320. That is, although the injection medium flows along the first extension groove 331 from the communication position 410 to the first cavity 210, the first extension groove 331 terminates before the first opening 320 and does not flow towards the side of the component 700 facing away from the first space. In other words, the injection medium flowing through the first extension groove 331 eventually flows to the first opening 320 after reaching its end near the first cavity 210, and is then injected into the first space through the first opening 320. Thus, this arrangement of the first extension groove 331 avoids undesirable injection results and increases the flow area of ​​the injection medium supplied to the first space.

[0117] Similarly, the first runner section 310 may have a second extension groove 311 extending from the communication position 410 to the second cavity 230, the second extension groove 311 ending before the second opening 340. Here, the specific form of the second extension groove 311 may be the same as that of the first extension groove 331, that is, the second extension groove 311 may also be a groove with a width equal to that of the second runner section 330 and a corresponding position, so that after the upper mold 10 and the lower mold 20 are closed, the second runner section 330 and the second extension groove 311 can together form a part of the first injection runner 300.

[0118] In this way, since the second extension groove 311 can adopt a cut-off configuration similar to the first extension groove 331, the injection medium flowing through the second extension groove 311 will not flow to the side of the component 700 to be injection molded that is away from the second space. Thus, on the one hand, it will not lead to undesirable injection results, and on the other hand, it can increase the flow area of ​​the injection medium supplied to the second space.

[0119] According to the injection mold 100 provided in the embodiments of this application, in the embodiments, taking the orientation in the accompanying drawings as an example, and in conjunction with... Figure 3 The first flow channel portion 310 and the first extension groove portion 331 together form the left part of the first injection channel 300 on the left side of the connecting position 410, and the second flow channel portion 330 and the second extension groove portion 311 together form the right part of the second injection channel 400 on the right side of the connecting position 410.

[0120] Based on the above description, as an example, the left portion of the first injection channel 300 is essentially formed by upper and lower parts. Figure 3 In the example, the upper part is the first flow channel 310, and the lower part is the first extension groove 331.

[0121] Furthermore, in the embodiments, the injection mold 100 provided according to the embodiments of this application may also include a first venting portion 12 (see...). Figure 5 ) and second exhaust section 21 (see Figure 4 The first venting section 12 can connect the first cavity 210 and the external environment where the injection mold 100 is located, and the second venting section 21 can connect the second cavity 230 and the external environment where the injection mold 100 is located. The first venting section 12 and the second venting section 21 can be used to vent air outward during two injection molding processes, thereby balancing the pressure in the first cavity 210 and the second cavity 230.

[0122] In an embodiment, as an example, the first venting portion 12 and the second venting portion 21 may both be defined by the upper mold 10 and the lower mold 20. Taking the first venting portion 12 as an example, the first venting portion 12 may be formed by a groove (e.g., a first recess 121) provided in the upper mold 10 that communicates with the first cavity 210 and a corresponding plane on the lower mold 20. The second venting portion 21 may be formed by a groove (e.g., a second recess 212) provided in the lower mold 20 that communicates with the second cavity 230 and a corresponding plane on the upper mold 10.

[0123] This is because, in this embodiment, the first cavity 210 is first injection molded on the upper side of the main body 710 of the component 700 to be injection molded. Therefore, the aforementioned first space is located between the main body 710 of the component 700 to be injection molded and the upper mold 10. Setting the groove of the first vent 12 in the upper mold 10 is more conducive to the groove directly communicating with the first space. Similarly, the groove of the second vent 21 is set in the same way, and will not be described again here.

[0124] Furthermore, in an example not shown, the injection mold may include a third vent and a fourth vent. The third vent may have a third recess disposed on the lower mold facing the upper mold side, and the third recess may communicate with the first cavity. Correspondingly, the fourth vent may have a fourth recess disposed on the lower mold facing the upper mold side, and the fourth recess may communicate with the second cavity.

[0125] In this embodiment, the upper mold 10 and lower mold 20 may be formed of a metallic material, such as corrosion-resistant 45Cr steel. The first cavity 210 and the second cavity 230, which form the substantial injection cavities, may be coated with Teflon (i.e., polytetrafluoroethylene) to facilitate demolding. Furthermore, in this embodiment, the grooves and holes, etc., formed on the upper mold 10 and lower mold 20 as described above, can all be obtained through machining.

[0126] According to a second aspect of the embodiments of this application, an injection molding method is provided, and the execution steps of the injection molding method will be described in detail below.

[0127] The sensor manufacturing method provided in the embodiments of this application includes the following steps.

[0128] A component to be injection molded 700 and an injection mold 100 are provided, wherein the injection mold 100 includes an upper mold 10, a positioning part 220 and a lower mold 20, and a first cavity 210 is defined by the upper mold 10 and the lower mold 20.

[0129] In an embodiment, the component to be injection molded 700 may, for example, have a conductive substrate, electronic components, and a wire harness 720. The electronic components may be disposed on the conductive substrate, and a conductive pattern may be pre-formed on the conductive substrate. By connecting multiple electronic components, these multiple electronic components connected on the conductive pattern together form a circuit with the conductive pattern.

[0130] In this embodiment, the conductive substrate can be a printed circuit board (PCB), on which electronic components can be mounted. Furthermore, and not limited to this, the conductive substrate can also be other substrates on which conductive patterns can be pre-formed by printing or etching.

[0131] In the embodiment, the injection molding operation of the component 700 to be injection molded is performed in the injection mold 100 mentioned above, so as to cover the outer side of the component 700 to be injection molded with the upper shell portion 830. Specifically, the component 700 to be injection molded is injected in the first cavity 210 defined after the upper mold 10 and the lower mold 20 are closed.

[0132] Based on the above description, the sensor manufacturing method includes placing the above-mentioned injection-molded component 700 into the first cavity 210, inserting the above-mentioned positioning part 220 at least partially into the injection-molded component 700, and performing injection molding with the injection-molded component 700 as an insert.

[0133] The component 700 to be injection molded here may have a defect structure, which allows the positioning part 220 to be inserted, thereby positioning the component 700 to be injection molded in the first cavity 210. The specific form of the defect structure can be referred to in the description of the injection mold 100 provided in the first aspect of the embodiments of this application, and will not be repeated here.

[0134] In this embodiment, the positioning part 220 is located in the first cavity 210 and is connected to at least one of the upper mold 10 and the lower mold 20. That is, the positioning part 220 is inserted into the injection molded component 700 within the first cavity 210 to position the injection molded component 700 within the first cavity 210. As an example, the positioning part 220 may be connected only to the upper mold 10, only to the lower mold 20, or to both the upper mold 10 and the lower mold 20.

[0135] Furthermore, in the embodiments, when the component 700 to be injection molded is positioned in the first cavity 210, it can be injection molded in the first cavity 210 until it is completely covered, or it can be partially covered in the first cavity 210. An example of partial coverage will be described in the following description.

[0136] Furthermore, in the embodiments, the injection mold 100 can be the injection mold 100 provided in the first aspect of the embodiments of this application to perform the above-described sensor manufacturing method.

[0137] According to the sensor manufacturing method provided in the second aspect of the embodiments of this application, the positioning part 220 can be connected to the upper mold 10, and the upper mold 10 and the lower mold 20 can further define a second cavity 230. In a further example, an injection molding operation can be performed once in the first cavity 210 and once in the second cavity 230 to complete the encapsulation of the component 700 to be injection molded.

[0138] Specifically, the component to be injection molded 700 can be placed into the first cavity 210, and the positioning part 220 can be inserted into the component to be injection molded 700 at least partially. The lower mold 20 is sealed with the component to be injection molded 700, so that the upper part of the component to be injection molded 700 and the upper mold 10 form a plastic-filled space. Thus, the first shell 831 can be formed by injection molding with the component to be injection molded 700 as an insert. Here, the first shell 831 covers the upper side of the component to be injection molded.

[0139] Then, based on this, the first housing 831 and the component 700 to be injection molded can be placed into the second cavity 230. The first housing 831 is sealed with the upper mold 10, so that the space below the component 700 and the lower mold 20 is filled with plastic. This allows the second housing 832 to be injection molded below the component 700. In the embodiment, the first housing 831 and the second housing 832 are joined together after the second housing 832 is injection molded, thus forming a single piece that covers the component 700 to be injection molded. In the embodiment, the injection mold used for the two injection operations can still be the injection mold 100 provided in the first aspect of the implementation of this application described above.

[0140] According to a third aspect of the embodiments of this application, a sensor 800 is provided. The sensor 800 includes a circuit board 810, the circuit board having a through hole 820 that penetrates the circuit board 810. In an embodiment, the sensor 800 further includes a housing portion 830, the housing portion 830 including a first housing 831 and a second housing 832 covering the outside of the circuit board 810, the housing portion 830 including a filling portion 833, the filling portion 833 being at least partially located in the through hole 820, and the first housing 831, the filling portion 833 and the second housing 832 being an integral piece.

[0141] Thus, according to the sensor 800 provided in the third aspect of the present application, the circuit board 810 of the sensor 800 has a through hole 820 for insertion and positioning. Therefore, during the injection molding process of the sensor 800 to form a shell, the positioning part 220 that can be inserted into the through hole 820 can be used to position the structure to be injection molded (i.e., to obtain the sensor 800 by injection molding the structure to be injection molded). The specific forms of the "positioning part 220" and the "through hole 820" can be referred to the description of the positioning part 220 and the defect structure in the injection mold provided in the first aspect of the present application.

[0142] Furthermore, in the embodiment, the first housing 831 and the second housing 832 together form the shell portion 830 covering the circuit board 810. In actual injection molding, the first housing 831 and the second housing 832 can be injection molded into the first cavity 210 and the second cavity 230 of the injection mold 100 provided in the first aspect of the present application, respectively. Because it is a two-stage injection molding process, the first housing 831 and the second housing 832 are joined together at a joint position to form an integral part. Therefore, as an example, in the embodiment, it can also be manufactured by the sensor manufacturing method provided in the second aspect of the present application.

[0143] In the embodiments, the injection-molded component 700 mentioned above includes the circuit board 810. In fact, the circuit board 810 can be an embodiment of the conductive substrate mentioned above. Similarly, the through hole 820 penetrating the circuit board 810 can also be an embodiment of the defect structure formed on the conductive substrate mentioned above.

[0144] like Figures 8 to 10 As shown, a sensor 800 according to a third aspect of an embodiment of this application is illustrated. The structure of the sensor 800 is actually already shown. Figures 4 to 6 As shown in the diagram, this example uses a circuit board 810 of sensor 800 with two through holes 820. Figure 9 Two filling portions 833 are schematically shown in the diagram. Figures 8 to 10 In the example, both filling portions 833 completely fill the corresponding through holes 820.

[0145] In this embodiment, the first housing 831 is formed by the circuit board 810 during the first injection molding process in the first cavity 210. The first housing 831 can be, for example, a housing covering the upper side of the circuit board 810. Similarly, the second housing 832 can be, for example, a housing covering the lower side of the circuit board 810. In this embodiment, the filling portion 833 can be formed during two injection molding processes. The filling portion 833 substantially fills at least a portion of the through hole 820. In other words, the filling portion 833 can completely fill the through hole 820, or the filling portion 833 can fill a portion of the through hole 820. Specifically, the filling portion 833 completely fills the through hole 820 so that the through hole 820 is not exposed. This can be referred to as the case where the "deficient structure" mentioned above is no longer exposed. Similarly, the filling portion 833 filling a portion of the through hole 820 can be referred to as the case where the "deficient structure" mentioned above is exposed.

[0146] The above are merely preferred embodiments of this application and do not limit the scope of protection of this application. Any equivalent structural transformations made based on the innovative concept of this application and the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included within the scope of protection of this application.

Claims

1. An injection mold (100), characterized in that, include: An upper mold (10) and a lower mold (20) are provided, wherein a first cavity (210) is defined by the upper mold (10) and the lower mold (20), the first cavity (210) being used to accommodate the component (700) to be injection molded; A positioning part (220) is located inside the first cavity (210). The positioning part (220) is connected to at least one of the upper mold (10) and the lower mold (20). The positioning part (220) is at least partially used to insert the component to be injection molded (700).

2. The injection mold (100) according to claim 1, characterized in that, The positioning part (220) is disposed on the upper mold (10), the positioning part (220) has a positioning surface (221) facing the lower mold (20), the positioning surface (221) is spaced apart from the upper mold (10), the positioning surface (221) is at least partially located between the upper mold (10) and the component to be injection molded (700), and the positioning surface (221) is used to contact the component to be injection molded (700); Alternatively, the positioning part (220) is disposed on the lower mold (20), the positioning part (220) has a positioning surface (221) facing the upper mold (10), the positioning surface (221) is spaced apart from the lower mold (20), the positioning surface (221) is at least partially located between the lower mold (20) and the component to be injection molded (700), and the positioning surface (221) is used to contact the component to be injection molded (700); The number of the positioning parts (220) is multiple and / or the cross-section of the positioning parts (220) is a non-circular shape.

3. The injection mold (100) according to claim 1, characterized in that, The positioning part (220) is disposed on the upper mold (10). The upper mold (10) and the lower mold (20) further define a second cavity (230) for accommodating the component to be injection molded (700). When the component to be injection molded (700) is accommodated in the second cavity (230), the component to be injection molded (700) can be spaced apart from the lower mold (20) and can be sealed with the upper mold (10) to the component to be injection molded (700). The component to be injection molded (700) has electronic components. The first cavity (210) has a groove (13) on the surface of the lower mold (20). The groove (13) can accommodate the electronic components. When the component to be injection molded (700) is accommodated in the first cavity (210), the lower mold (20) is used to seal with the component to be injection molded (700), and the upper mold (10) can be spaced apart from the component to be injection molded (700). Alternatively, the positioning part (220) is disposed on the lower mold (20), and when the component to be injection molded (700) is accommodated in the first cavity (210), it can be spaced apart from both the upper mold (10) and the lower mold (20).

4. The injection mold (100) according to claim 2, characterized in that, The number of the positioning parts (220) is at least two, and the line connecting two of the at least two positioning parts (220) is inclined relative to the side line direction of the first cavity (210).

5. The injection mold (100) according to claim 2, characterized in that, The first cavity (210) has a first wire harness receiving cavity (211), the cavity wall of the first wire harness receiving cavity (211) being spaced apart from the component to be injection molded (700); wherein, the upper mold (10) and the lower mold (20) further define a second cavity (230) for receiving the component to be injection molded (700), the second cavity (230) having a second wire harness receiving cavity (232).

6. The injection mold (100) according to claim 2, characterized in that, The upper mold (10) and the lower mold (20) further define a second cavity (230) for receiving the component to be injection molded (700); The injection mold (100) further includes a first venting portion (12) and a second venting portion (21), wherein the first venting portion (12) has a first recessed portion (121) disposed on the upper mold (10) facing the lower mold (20), and the first recessed portion (121) communicates with the first cavity (210); the second venting portion (21) has a second recessed portion (212) disposed on the lower mold (20) facing the upper mold (10), and the second recessed portion (212) communicates with the second cavity (230); or The injection mold (100) further includes a third venting portion and a fourth venting portion. The third venting portion has a third recessed portion disposed on the lower mold (20) facing the upper mold (10) and the third recessed portion communicates with the first cavity (210). The fourth venting portion has a fourth recessed portion disposed on the lower mold (20) facing the upper mold (10) and the fourth recessed portion communicates with the second cavity (230).

7. The injection mold (100) according to claim 1, characterized in that, The upper mold (10) and the lower mold (20) further define a second cavity (230) for receiving the component to be injection molded (700), the component to be injection molded (700) having a main body portion (710); The injection mold (100) further includes a first injection runner (300), which has a first opening (320) and a second opening (340); Within the first cavity (210), a first space exists between the upper mold (10) and the lower mold (20) and the component to be injection molded (700), and the first opening (320) is open toward the first space; Within the second cavity (230), a second space exists between the upper mold (10) and the lower mold (20) and the component to be injection molded (700), and the second opening (340) is open toward the second space; the first injection runner (300) is defined by the upper mold (10) and the lower mold (20), and the first injection runner (300) includes a first runner portion (310) located in the upper mold (10) and a second runner portion (330) located in the lower mold (20), and the first runner portion (310) communicates with the second runner portion (330); The first flow channel portion (310) has the first opening (320), and the second flow channel portion (330) has the second opening (340).

8. A method for manufacturing a sensor, characterized in that, Includes the following steps: Provided is a component to be injection molded (700) and an injection mold (100), wherein the injection mold (100) includes an upper mold (10), a positioning part (220) and a lower mold (20), and a first cavity (210) is defined by the upper mold (10) and the lower mold (20); The component to be injection molded (700) is placed into the first cavity (210), and the positioning part (220) is at least partially inserted into the component to be injection molded (700), and the component to be injection molded (700) is used as an insert for injection molding; The positioning part (220) is located in the first cavity (210), and the positioning part (220) is connected to at least one of the upper mold (10) and the lower mold (20).

9. The method for manufacturing a sensor according to claim 8, characterized in that, The positioning part (220) is connected to the upper mold (10), and the upper mold (10) and the lower mold (20) define a second cavity (230); The component to be injection molded (700) is placed into the first cavity (210), the positioning part (220) is at least partially inserted into the component to be injection molded (700), the lower mold (20) is sealed with the component to be injection molded (700), and the first shell is formed by injection molding with the component to be injection molded (700) as an insert; The first housing and the component to be injection molded (700) are placed into the second cavity, and the first housing is sealed and fitted with the upper mold (10) to form the second housing by injection molding; wherein the first housing and the second housing are an integral part.

10. A sensor, characterized in that, The sensor (800) includes a circuit board (810) having a through hole (820) through the circuit board (810); The sensor (800) further includes a housing (830), which includes a first housing (831) and a second housing (832) covering the outside of the circuit board (810). The housing (830) includes a filling portion (833), which is at least partially located in the through hole (820). The first housing (831), the filling portion (833), and the second housing (832) are an integral piece.

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